Nokia 6233 Rm 145 6234 123 Service Manual 34 V1

User Manual: Phone Nokia 6233 RM-145 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Amendment Record Sheet
Copyright
Warnings and cautions
For your safety
Care and maintenance
ESD protection
Battery information
Company Policy
Nokia 6233; Nokia 6234 Service Manual Structure
1 General information
2 Parts and layouts
3 Service Software Instructions
4 Service Tools and Service Concepts
- Service tools
  - CA-31D
  - CA-35S
  - CA-53
  - CU-4
  - FLS-4S
  - FPS-10
  - FS-31
  - JBT-9
  - JXS-1
  - MJ-91
  - PCS-1
  - PKD-1
  - RJ-104
  - RJ-108
  - RJ-114
  - RJ-57
  - RJ-93
  - SA-103
  - SPS-1
  - SRT-6
  - SS-45
  - SS-46
  - SS-51
  - SS-62
  - ST-37
  - ST-40
  - ST-41
  - ST-44
  - SX-4
  - XCS-4
  - XRF-1
- Service concepts
5 Disassembly and reassembly instructions
- Disassembly instructions
- Reassembly instructions
6 BB Troubleshooting and Manual Tuning Guide
7 RF troubleshooting
8 System Module
9 Schematics
- Schematics
Glossary

Service Manual

RM-123; RM-145 (Nokia 6233; Nokia 6234)

Mobile Terminal

Part No: 9249152 (Issue 1)

Nokia Customer Care

COMPANY CONFIDENTIAL

Amendment Record Sheet

Amendment No Date Inserted By Comments

Original issue 04/2006 J Bryman

RM-123; RM-145

Nokia Customer Care Amendment Record Sheet

Page ii COMPANY CONFIDENTIAL Issue 1

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form

without the prior written permission of Nokia is prohibited.

Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of

their respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and

improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,

consequential or indirect damages howsoever caused.

The contents of this document are provided "as is". Except as required by applicable law, no warranties of

any kind, either express or implied, including, but not limited to, the implied warranties of merchantability

and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this

document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

RM-123; RM-145

Issue 1 COMPANY CONFIDENTIAL Page iii

Warnings and cautions

Warnings

• IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED

WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT

CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/

MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

•THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,

FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE

WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE

MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY

ALSO BE SUBJECT TO INTERFERENCE.

• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

• Servicing and alignment must be undertaken by qualified personnel only.

• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

• Use only approved components as specified in the parts list.

• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and

alignment.

• Ensure all cables and wires are repositioned correctly.

•Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the

measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb

nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise

GSM or WCDMA PA may be damaged.

RM-123; RM-145

Nokia Customer Care Warnings and cautions

Page iv COMPANY CONFIDENTIAL Issue 1

For your safety

QUALIFIED SERVICE

Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES

Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES

When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect

incompatible products.

RM-123; RM-145

For your safety Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page v

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below

will help you to fulfil any warranty obligations and to enjoy this product for many years.

• Keep the phone and all its parts and accessories out of the reach of small children.

•Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that

will corrode electronic circuits.

• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

•Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage

batteries, and warp or melt certain plastics.

• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form

inside, which may damage electronic circuit boards.

• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or

attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

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Nokia Customer Care Care and maintenance

Page vi COMPANY CONFIDENTIAL Issue 1

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing

the phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be

replaced without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside

any ESD Protected Area (EPA).

Every repair action involving opening the product or handling the product components must be done under

ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

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ESD protection Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page vii

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the

operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers

approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to

a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged

battery will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge.

For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the

product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory

available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose.

Never use any charger or battery which is damaged.

Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or

pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example

when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery

or the connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce

the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°

F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.

Batteries' performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire!

Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

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Nokia Customer Care Battery information

Page viii COMPANY CONFIDENTIAL Issue 1

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service

bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If

any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/e-

mail.

Please state:

• Title of the Document + Issue Number/Date of publication

• Latest Amendment Number (if applicable)

• Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION

Nokia Mobile Phones Business Group

Nokia Customer Care

PO Box 86

FIN-24101 SALO

Finland

E-mail: Service.Manuals@nokia.com

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Company Policy Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page ix

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Nokia Customer Care Company Policy

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Page x COMPANY CONFIDENTIAL Issue 1

Nokia 6233; Nokia 6234 Service Manual Structure

1 General information

2 Parts and layouts

3 Service Software Instructions

4 Service Tools and Service Concepts

5 Disassembly and reassembly instructions

6 BB Troubleshooting and Manual Tuning Guide

7 RF troubleshooting

8 System Module

9 Schematics

Glossary

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Nokia 6233; Nokia 6234 Service Manual Structure Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page xi

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Nokia Customer Care Nokia 6233; Nokia 6234 Service Manual Structure

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Page xii COMPANY CONFIDENTIAL Issue 1

1 — General information

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 –1

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Nokia Customer Care General information

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Page 1 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

Product selection....................................................................................................................................................1–5

Phone features........................................................................................................................................................1–6

Software and User interface features...................................................................................................................1–6

Accessories..............................................................................................................................................................1–9

Technical specifications.......................................................................................................................................1–10

General specifications.....................................................................................................................................1–10

Main RF characteristics for triple GSM band and WCDMA band phones (Europe).....................................1–11

Battery endurance...........................................................................................................................................1–11

Environmental conditions..............................................................................................................................1–12

List of Tables

Table 1 Battery and chargers................................................................................................................................1–9

Table 2 Car accessories..........................................................................................................................................1–9

Table 3 Audio..........................................................................................................................................................1–9

Table 4 Connectivity.............................................................................................................................................1–10

Table 5 Imaging and lifestyle..............................................................................................................................1–10

Table 6 Messaging................................................................................................................................................1–10

Table 7 Music........................................................................................................................................................1–10

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Issue 1 COMPANY CONFIDENTIAL Page 1 –3

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Page 1 –4 COMPANY CONFIDENTIAL Issue 1

Product selection

RM-123 (Nokia 6234) and RM-145 (Nokia 6233) are both WCDMA/GSM dual mode phones, supporting WCDMA

2100 (UMTS) and EGSM900/1800/1900 bands.

RM-123 is a special Vodafone customised model. Even though the appearance is different, they both use the

same PWB and offer the same features.

Key Features:

• Stereo speakers and 3D sound effects

• Up to 70 MB total memory for storing pictures, messages, etc.

• 2-megapixel camera with 8x digital zoom and landscape mode

• Stereo FM radio supporting visual radio

• Music player

• Enhanced Java email client

• Video, MP3, eACC+, and polyphonic ringing tones

• FM visual stereo radio with integrated 3D stereo speakers

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General information Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 –5

Phone features

Display and keypad features

• 262 K colour QVGA 240 x 320 pixels display

• Active TFT display

• Side volume keys with zoom functionality

• Dedicated camera key

Hardware features

• 2-megapixel camera landscape mode and 8x digital zoom

• PopPortTM™

• 2 mm charger plug interface

• Bluetooth

• USB

• FM radio

• MP3 player

• Internal vibrator

• Plug-in SIM (1.8 V and 3.0 V)

• Real time clock

RF features

• WCDMA 2100

• GSM/EDGE 900/1800/1900

• EDGE*: Class 10

• GPRS: Class 10

• HSCSD

Software and User interface features

Software features

• ISA OS 8.0s Platform

• Nokia Series 40 User interface (UI): Java MIDP 2.0

UI features

Integrated digital camera • 2-megapixel camera with 8x smooth, digital zoom and dedicated key

• Landscape support mode

• Full screen viewfinder

• Print images directly from the phone over a Bluetooth connection or

using an MMC (depending on the printer)

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Nokia Customer Care General information

Page 1 –6 COMPANY CONFIDENTIAL Issue 1

Multimedia • Integrated video player for download and playback or for streaming:

3GPP, H.263 video, MPEG-4, and AMR

• Add video and music to your caller ID

• Interactive 3D games with multi-player support

• Music player supports MP3, MP4, eAAC+ and AAC music files

• Use pre-loaded polyphonic midi ring tones, MP3, eAAC+, and message

alerts

• OTA download of ringing tones, themes, wallpapers

• Download/upload images and video clips

• Kodak Photo services for high-quality, easy printing

• Stereo FM Radio

• Video Sharing

• 3GPP streaming for mobile access to the latest sports, weather,

entertainment, and news information

Messaging • Common inbox (MMS, SMS, e-mail)

• Full MMS 1.2 functionality for sending and receiving messages including

video, photos, and music

• Improved Java email client with easy settings and spam filter

• Email: supports SMTP, POP3, and IMAP4 protocols

• Text messaging: supports concatenated SMS and picture messaging

• Presence: includes Wireless Village and Dynamic phonebook; know

someone's status before you call

Memory functions • Up to 70MB total memory (6MB internal + 64MB memory card)

• Supports up to 2GB of expandable, microSD memory

• Back up important files such as presentations and documents, or just

store images on your personal mobile storage device

Games • Nokia World Cup, 3D Street Racer, and 3D Snake

• Download new Java games

Applications • Enhanced Java email client with easy settings and spam filter

• Data synchronization

• Visual Radio

• Wireless presenter

• Notepad and voice memo recorder

• Translator

• World Clock II

• Converter II

• Java MIDP 2.0 with Bluetooth API makes downloading new applications

easy

• Active standby mode

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General information Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 –7

Connectivity • Transfer images, video clips, audio files, and other files

• Bluetooth wireless technology: wide range of profiles and APIs for

seamless connectivity

• Infrared

• USB port

•Easy remote or local synchronization with a PC or other compatible device

• OMA DRM 1.0 protects copyrighted material

•Push to talk over cellular (PoC) lets you use your phone like a walkie-talkie

Browsing • WAP 2.0, XHTML browser over HTTP/TCP/IP stack HSCSD

• HSCSD, CSD for browsing and as data modem

• 3GPP video streaming

Data transfer • EDGE Class 10 (4+1, 3+2): speed up to 236.8 kbps

• GPRS (General Packet Radio Service) class 10 (4+1, 3+2)

• HSCSD (High-Speed Circuit-Switched Data) transfer up to 43.2 kbps in

HSCSD networks

• DRM 1.0 for secure content downloading

• Speech codec support for FR, EFR, AMR

• TCP/IP

Call management • Speed dialing: up to 9 names

• Last-number redial from dialed calls list (Dial key brings up the dialed

calls list)

• Automatic redial (max 10 attempts)

• Automatic answer (works with headset or car kit only)

• Call waiting, call hold, call divert, call timer

• Automatic and manual network selection

• Caller identification with image

• Closed User Group

• Fixed Dialing Number, allows calls only to predefined numbers

• Conference call (up to 5 participants)

• Vibrating alert

Voice features • Nokia Push to Talk with dedicated key

• Two effect speakers (each 15mm x 11mm)

• 3D effect sound

• Nokia Express Audio Messaging

• 16 voice commands

• Integrated Handsfree speakers

• Voice dialing, 25 presets

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Nokia Customer Care General information

Page 1 –8 COMPANY CONFIDENTIAL Issue 1

Accessories

Table 1 Battery and chargers

Type Name

Note: This phone is charged through the smaller Nokia standard interface (2.0 mm plug). The 3.5 mm

standard charger can be used together with the CA-44 charger adapter.

AC-3 Compact charger

AC-4 Travel performance charger

BP-6M-S Battery 1100 mAh Li-Ion

CA-44 Charger adapter (from 3.5 mm -> 2 mm)

Table 2 Car accessories

Type Name

BHF-3 Headrest handsfree

CA-55 Converter

CARK-91 Advanced HF car kit

CK-1W Wireless car kit

CK-7W Advanced Car Kit

CK-10 Car kit

CR-56 Mobile holder

DC-4 Mobile charger

HF-3 Plug-in car handsfree

HF-6W Wireless plug-in handsfree

N616 Car kit

Nokia universal holder

Table 3 Audio

Type Name

HDA-10 Phone adapter

HDB-4 Boom headset

HDS-3 Stereo headset

HDW-3 Wireless headset

HS-3 Stereo headset: fashion

HS-4W Wireless boom headset

HS-5 Headset

HS-6 Display headset

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General information Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 –9

Type Name

HS-11W Wireless headset

HS-21W Wireless clip-on headset

HS-23 Stereo headset

HS-26W Wireless headset

HS-31 Fashion stereo headset

HS-36W Wireless headset

LPS-4 Loopset

MD-1 Music stand

Table 4 Connectivity

Type Name

CA-53 USB cable

Table 5 Imaging and lifestyle

Type Name

PT-6 Remote camera

Table 6 Messaging

Type Name

SU-1B Digital pen

Table 7 Music

Type Name

MD-1 Music stand

Technical specifications

General specifications

Unit Dimension (mm) Weight (g) Volume (cc)

RM-123 Transceiver

with BP-6M-S 1100 mAh

Li-Ion battery pack

108x46.5x17.5 100 76

RM-145 Transceiver

with BP-6M-S 1100 mAh

Li-Ion battery pack

108x46.5x18 110 81

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Nokia Customer Care General information

Page 1 –10 COMPANY CONFIDENTIAL Issue 1

Main RF characteristics for triple GSM band and WCDMA band phones (Europe)

Parameter Unit

Cellular system GSM/EGSM900,GSM1800/1900

WCDMA2100

Rx frequency band EGSM900: 925 - 935 MHz

GSM900: 935 - 960 MHz

GSM1800: 1805 - 1880 MHz

GSM1900: 1930 - 1990 MHz

WCDMA: 2110- 2170 MHz

Tx frequency band EGSM900: 880 - 890 MHz

GSM900: 890 - 915 MHz

GSM1800: 1710 - 1785 MHz

GSM1900: 1850 - 1910 MHz

WCDMA: 1920 - 1980 MHz

Output power GSM900: +5 … +32.5 dBm

GSM1800: +0 … +30 dBm

GSM1900: +0 ... +30 dBm

WCDMA2100: 0 ...+24 dBm

Number of RF channels GSM900: 125

GSM1800: 375

GSM1900: 300

WCDMA2100: 8

Channel spacing GSM 200 KHz

WCDMA 4.8 MHz

Number of Tx power levels GSM900: 15

GSM1800: 16

GSM1900: 16

WCDMA2100: 12

Battery endurance

Battery Talk time Standby time

BP-6M-S 1100 mAh Li-ion GSM: up to 4 hours

WCDMA: up to 3.1 hours

Up to 340 hours

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General information Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 1 –11

Note: Variation in operation times will occur depending on SIM card, network settings and usage.

Talk time is increased by up to 30% if half rate is active, and reduced by 5% if enhanced full rate is

active.

Environmental conditions

Environmental

condition Ambient temperature Notes

Normal operation 15 oC ... +55 oCSpecifications fulfilled

Reduced performance 55 oC ... +70 oCOperational only for short periods

Intermittent or no

operation -40 oC ... -15 oC and +70 oC ... +85oCOperation not guaranteed but an

attempt to operate will not damage

the phone

No operation or

storage <-40 oC and >+85 oCNo storage. An attempt to operate

may cause permanent damage

Charging allowed -15 oC ... +55 oC

Long term storage

conditions 0 oC ... +85 oC

Humidity and water

resistance

Relative humidity range is 5 to 95%.

Condensed or dripping water may

cause intermittent malfunctions.

Protection against dripping water

has to be implemented in (enclosure)

mechanics.

Continuous dampness will cause

permanent damage to the module.

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Nokia Customer Care General information

Page 1 –12 COMPANY CONFIDENTIAL Issue 1

2 — Parts and layouts

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –1

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Table of Contents

Exploded view.........................................................................................................................................................2–5

Mechanical parts list...............................................................................................................................................2–6

Swap units...............................................................................................................................................................2–8

Component parts list..............................................................................................................................................2–9

Component layouts..............................................................................................................................................2–21

List of Tables

Table 8 RM-123 Mechanical parts list...................................................................................................................2–6

Table 9 RM-145 Mechanical parts list...................................................................................................................2–7

Table 10 RM-123 Swap units.................................................................................................................................2–8

Table 11 RM-145 Swap units.................................................................................................................................2–9

Table 12 ..................................................................................................................................................................2–9

List of Figures

Figure 1 Main board layout, bottom side (1rra_08a)........................................................................................2–21

Figure 2 Main board layout, top side (1rra_08a)...............................................................................................2–21

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Exploded view

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Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –5

Mechanical parts list

Table 8 RM-123 Mechanical parts list

Item Qty Description

* = Not available as spare part

A1 A-cover assy

I001* 1 A-cover (A1)

I002* 1 A-cover window gasket

I003* 1 Power key

I004 1 Keymat

I009 1 LCD module

I005 1 Screw 1.8 x 9.6 TP 6IP

A2 Cover plate assembly

I006* 1 UI flex incl connector (A2)

I007* 1 EL-foil (a2)

I008* 1 Domesheet assembly (A2)

A3 C-cover assembly

I010* 1 C-cover (A3)

I011 1 Microphone Clapton

I012 1 C-cover plate grounding clip

A4 Light swap engine module

assembly

I013* 1 Light swap engine module

I014 1 Type label (Level 3/4 only)

I015 1 BBA lid (A4)

I016 1 WCDMA lid

I017 1 RF lid

I018 1 Camera module

A5 D-cover assembly

I019* 1 D-cover painted

I020 1 DC jack

I021 1 Earpiece

I022 1 Earpiece adhesive

I023* 1 IR window

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Nokia Customer Care Parts and layouts

Page 2 –6 COMPANY CONFIDENTIAL Issue 1

Item Qty Description

I024* 1 IHF pogo pin

I025* 1 IHF speaker left

I026* 1 IHF speaker right

I028* 1 SIM lid

I029* 1 Camera key

I030* 1 POC key

I031 1 Volume key

I032* 1 BT antenna

I033* 1 GSM antenna

I034* 1 WCDMA antenna

I035 1 Screw 1.8 x 10 TP 6IP

I040 1 B-cover

Table 9 RM-145 Mechanical parts list

Item Qty Description

* = Not available as spare part

A1 A-cover assy

I001* 1 A-cover (A1)

I002* 1 A-cover window gasket

I004 1 Keymat

I009 1 LCD module

I005 1 Screw 1.8 x 9.6 TP 6IP

A2 Cover plate assembly

I006* 1 UI flex incl connector (A2)

I007* 1 EL-foil (a2)

I008* 1 Domesheet assembly (A2)

A3 C-cover assembly

I010* 1 C-cover (A3)

I011 1 Microphone Clapton

I012 1 C-cover plate grounding clip

A4 Light swap engine module

assembly

I013* 1 Light swap engine module

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Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –7

Item Qty Description

I014 1 Type label (Level 3/4 only)

I015 1 BBA lid (A4)

I016 1 WCDMA lid

I017 1 RF lid

I018 1 Camera module

A5 D-cover assembly

I019* 1 D-cover painted

I020 1 DC jack

I021 1 Earpiece

I022 1 Earpiece adhesive

I023* 1 IR window

I024* 1 IHF pogo pin

I025* 1 IHF speaker left

I026* 1 IHF speaker right

I028* 1 SIM lid

I029* 1 Camera key

I030* 1 POC key

I031* 1 Volume key

I032* 1 BT antenna

I033* 1 GSM antenna

I034* 1 WCDMA antenna

I035 1 Screw 1.8 x 10 TP 6IP

I036 1 Battery cover

I037 1 Camera bezel

A6 Top cover assembly

I038* 1 Top cover

I039* 1 Power key

Swap units

Table 10 RM-123 Swap units

Swap units for RM-123

RM-123 SWAP SOFT BLACK LATIN EURO-C

RM-123 SWAP SOFT BLACK LATIN EURO-C ZA

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Swap units for RM-123

RM-123 SWAP SOFT BLACK LATIN EURO-C FR

RM-123 SWAP SOFT BLACK LATIN EURO-D

RM-123 SWAP SOFT BLACK GREEK EURO-H

RM-123 SWAP SOFT BLACK ARABIC EURO-G

Table 11 RM-145 Swap units

Swap units for RM-145

RM-145 SWAP SILVER ALLOY CYRIL RUSSIA

RM-145 SWAP SILVER ALLOY CYRIL UKRAINE

RM-145 SWAP SILVER ALLOY EU-C TURKEY

RM-145 SWAP SILVER ALLOY LATIN EU-C FRA

RM-145 SWAP SILVER ALLOY LATIN EU-C ZA

RM-145 SWAP CLASSIC BLACK CYRIL UKRAINE

RM-145 SWAP CLASSIC BLACK CYRIL RUS

RM-145 SWAP SILVER ALLOY LATIN EURO-C

RM-145 SWAP CLASSIC BLACK LATIN TURKEY

RM-145 SWAP CLASSIC BLACK LATIN EU-C FRA

RM-145 SWAP CLASSIC BLACK LATIN EU-C ZA

RM-145 SWAP CLASSIC BLACK LATIN EURO-C

Component parts list

Table 12

Item ref Side Object Name Type

A1000 T BB SHIELD ASSEMBLY Shield Assembly

A 1001 T SIM SUPPORT SHIELD CuNi 18Zn20 F610 Shield

A 1050 B GE SHIELD Shield

A 7000 T RF SHIELD ASSEMBLY Shield Assembly

A 7001 T WCDMA SHIELD ASSEMBLY Shield Assembly

B 2200 T CRYSTAL 32.768KHZ +/-30PPM 12.5PF Crystal

C 1000 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 1001 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 1002 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 1008 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 1009 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 1010 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

RM-123; RM-145

Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –9

Item ref Side Object Name Type

C1052 B CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 1053 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 1054 B CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 1055 B CHIPCAP X5R 1U K 6V3 0402 Ceramic Capacitor

C 1056 B CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 1060 T CHIPCAP X5R 220N K 6.3V 0402 Ceramic Capacitor

C 1061 B CHIPCAP X5R 220N K 6.3V 0402 Ceramic Capacitor

C 1062 B CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 1063 B CHIPCAP X5R 4U7 K 6V3 0805 Ceramic Capacitor

C 1064 B CHIPCAP X5R 4U7 K 6V3 0805 Ceramic Capacitor

C 1065 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 1066 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 1069 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 1070 B CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 1071 B CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 1072 B CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 2000 B CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 2001 B CHIPCAP X5R 470N K 25V 0603 Ceramic Capacitor

C 2002 B CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2003 B CHIPCAP FEEDTHRU 100N M 25V 0805 Ceramic Capacitor

C 2004 B CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 2005 B CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2006 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2007 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2008 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2009 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2010 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2011 B CHIPCAP NP0 10P J 50V 0402 Ceramic Capacitor

C 2012 B CHIPCAP NP0 10P J 50V 0402 Ceramic Capacitor

C 2013 B CHIPCAP NP0 10P J 50V 0402 Ceramic Capacitor

C 2014 B CHIPCAP NP0 10P J 50V 0402 Ceramic Capacitor

C 2015 B CHIPCAP NP0 270P J 50V 0402 Ceramic Capacitor

C 2016 B CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2020 B CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2021 B CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

RM-123; RM-145

Nokia Customer Care Parts and layouts

Page 2 –10 COMPANY CONFIDENTIAL Issue 1

Item ref Side Object Name Type

C2071 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 2100 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2101 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2102 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 2106 T CHIPCAP NP0 22P J 50V 0402 Ceramic Capacitor

C 2107 T CHIPCAP NP0 22P J 50V 0402 Ceramic Capacitor

C 2108 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2109 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2110 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2111 T CHIPCAP NP0 22P J 50V 0402 Ceramic Capacitor

C 2112 T CHIPCAP NP0 22P J 50V 0402 Ceramic Capacitor

C 2117 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2118 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2119 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2120 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 2124 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2127 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2132 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2200 T CHIPCAP X5R 1U K 6V3 0402 Ceramic Capacitor

C 2201 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2202 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2203 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2204 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2205 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2206 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2207 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2208 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 2209 T CHIPCAP NP0 22P J 50V 0402 Ceramic Capacitor

C 2210 T CHIPCAP X5R 1U K 16V 0603 Ceramic Capacitor

C 2211 T CHIPCAP X5R 4U7 K 10V 0805 Ceramic Capacitor

C 2212 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2215 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2217 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2220 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2221 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

RM-123; RM-145

Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –11

Item ref Side Object Name Type

C2222 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2223 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2224 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2225 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2226 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2230 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2231 T CHIPCAP X5R 10U M 6V3 0805 Ceramic Capacitor

C 2236 T CHIPCAP X7R 1N0 K 50V 0402 Ceramic Capacitor

C 2300 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2301 T CHIPCAP X5R 22U M 6V3 0805 Ceramic Capacitor

C 2302 T CHIPCAP X5R 22U M 6V3 0805 Ceramic Capacitor

C 2303 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2304 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2307 T CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2309 T CHIPCAP X5R 22U M 6V3 0805 Ceramic Capacitor

C 2313 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2405 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2406 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2412 B CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405 Ceramic Capacitor

C 2414 B CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 2415 B CHIPCAP NP0 56P J 50V 0402 Ceramic Capacitor

C 2416 B CHIPCAP X7R 6N8 K 25V 0402 Ceramic Capacitor

C 2418 B CHIPCAP X5R 1U K 6V3 0402 Ceramic Capacitor

C 2420 B CHIPCAP NP0 1N0 K 200V 1206 Ceramic Capacitor

C 2500 B CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 2501 B CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 2502 B CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 2503 B CHIPCAP X5R 1U K 25V 0603 Ceramic Capacitor

C 2581 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2600 T CHIPCAP X5R 4U7 K 10V 0805 Ceramic Capacitor

C 2601 T CHIPCAP NP0 22P J 50V 0402 Ceramic Capacitor

C 2602 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2603 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2700 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2701 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

RM-123; RM-145

Nokia Customer Care Parts and layouts

Page 2 –12 COMPANY CONFIDENTIAL Issue 1

Item ref Side Object Name Type

C2800 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2801 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2802 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2803 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2804 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2805 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2806 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2807 T CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 2808 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2809 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2810 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2811 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2812 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2813 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2814 T CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 2815 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 2819 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 3000 T CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 3001 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3002 T CHIPCAP X5R 220N K 6.3V 0402 Ceramic Capacitor

C 3003 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3004 T CHIPCAP X5R 220N K 6.3V 0402 Ceramic Capacitor

C 3005 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3006 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3007 T CHIPCAP X5R 220N K 6.3V 0402 Ceramic Capacitor

C 3008 T CHIPCAP X5R 220N K 6.3V 0402 Ceramic Capacitor

C 3009 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3010 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3100 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 3200 B CHIPCAP X5R 100N K 10V 0402 Ceramic Capacitor

C 3201 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 3202 B CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 3203 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 3221 T CHIPCAP NP0 27P J 50V 0402 Ceramic Capacitor

C 6000 B CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

RM-123; RM-145

Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –13

Item ref Side Object Name Type

C6001 B CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 6002 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 6003 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 6004 B CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 6005 B CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 6010 B CHIPCAP NP0 4P7 C 50V 0402 Ceramic Capacitor

C 6011 B CHIPCAP NP0 5P6 C 50V 0402 Ceramic Capacitor

C 6050 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 6051 B CHIPCAP X5R 1U K 6V3 0603 Ceramic Capacitor

C 6052 B CHIPCAP NP0 15P J 50V 0402 Ceramic Capacitor

C 7500 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7501 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7502 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7503 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7504 T CHIPCAP X7R 3N9 J 50V 0402 Ceramic Capacitor

C 7505 T CHIPCAP X7R 10N K 16V 0402 Ceramic Capacitor

C 7506 T CHIPCAP NP0 47P J 50V 0402 Ceramic Capacitor

C 7507 T CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 7508 T CHIPCAP NP0 10P J 50V 0402 Ceramic Capacitor

C 7509 T CHIPCAP X5R 100N M 16V 0402 Ceramic Capacitor

C 7510 T CHIPCAP NP0 470P J 6V3 0402 Ceramic Capacitor

C 7511 T CHIPCAP X7R 33N K 10V 0402 Ceramic Capacitor

C 7512 T CHIPCAP NP0 2N2 G 16V 0603 Ceramic Capacitor

C 7514 T CHIPCAP NP0 2P2 C 50V 0402 Ceramic Capacitor

C 7515 T CHIPCAP NP0 2P7 C 50V 0402 Ceramic Capacitor

C 7516 T CHIPCAP NP0 0P5 C 50V 0402 Ceramic Capacitor

C 7521 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7541 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7542 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7543 T CHIPCAP X5R 4U7 K 6.3V 0603 Ceramic Capacitor

C 7544 T CHIPCAP X7R 22N K 16V 0402 Ceramic Capacitor

C 7545 T CHIPCAP NP0 10P J 50V 0402 Ceramic Capacitor

C 7547 T CHIPCAP NP0 2P7 C 50V 0402 Ceramic Capacitor

C 7597 T CHIPTCAP 150U M 10V 6X3.2X1.5 Electrolytic Capacitor

D 3000 T SDRAM 8MX16 1.8V/1.8V FBGA60 PBFREE Memory IC

RM-123; RM-145

Nokia Customer Care Parts and layouts

Page 2 –14 COMPANY CONFIDENTIAL Issue 1

Item ref Side Object Name Type

D6000 B BTHFM1.0 ES4 Module Hybrid

F 2000 B SM FUSE F 2.0A 32V 0603 Fuse And Protector

G 2200 T RTC BACKUP CAPAC 311 SIZE FOR 2.6V 4UAH Battery And Battery Cell

L 1000 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 1001 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 1050 B INDUCT WW 2.2UH 1A2 310 case size Fixed Inductor

L 1051 B FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 1067 B INDUCT WW 2.2UH 1A2 310 case size Fixed Inductor

L 2002 B CHIP BEAD ARRAY 2X1000R 0405 EMC Component

L 2003 B CHIP BEAD ARRAY 2X1000R 0405 EMC Component

L 2004 B CHIP BEAD ARRAY 2X1000R 0405 EMC Component

L 2006 B CHIP COIL 68NH J Q12/100MHZ 0603 Fixed Inductor

L 2100 B CHIP BEAD ARRAY 2X1000R 0405 EMC Component

L 2101 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2102 T CHIP COIL 30nH J Q65/500MHz 0805 Fixed Inductor

L 2103 T CHIP COIL 30nH J Q65/500MHz 0805 Fixed Inductor

L 2104 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2105 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2107 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2108 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2109 T CHIP COIL 30nH J Q65/500MHz 0805 Fixed Inductor

L 2110 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2111 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 2112 T CHIP COIL 30nH J Q65/500MHz 0805 Fixed Inductor

L 2120 T CHIP BEAD ARRAY 2X1000R 0405 EMC Component

L 2202 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2203 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 2204 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 2205 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2206 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 2301 T FERR.BEAD 220R/100M 2A 0R05 0603 EMC Component

L 2302 T INDUCT WW 10U 0A65 0R35 4X4X1.2 Fixed Inductor

L 2303 T FERR.BEAD 0R03 42R/100MHZ 3A 0805 EMC Component

L 2304 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 2400 B FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

RM-123; RM-145

Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –15

Item ref Side Object Name Type

L2401 B FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 2412 B COIL 0.47MH 50MA 3.3X3.4X1.4MM Fixed Inductor

L 2500 B FERR.BEAD 0R03 42R/100MHZ 3A 0805 EMC Component

L 2501 B CHOKE 22U M 0R7 0.35A 3.0X3.0X1.5 Fixed Inductor

L 3200 B FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 7500 T FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

L 7501 T CHIP COIL 10N J Q30/800MHZ 0402 Fixed Inductor

L 7502 T CHIP COIL 10N J Q30/800MHZ 0402 Fixed Inductor

L 7520 T FERRITE BEAD 0R01 28R/100MHZ 0603 EMC Component

L 7540 T CHOKE 3U3 1.2A 0R096 3X3X1.5 Fixed Inductor

L 7542 T CHIP COIL 2N2 +-0N1 Q40/1GHZ 0402 Fixed Inductor

L 7543 T CHIP COIL 3N9 +-0N3 Q28/800M 0402 Fixed Inductor

M 2100 T SMD VIBRA MOTOR 1.3V 90MA 9000RPM Vibrator

N 1050 B DC/DC CONV TPS62311YZD 1.5V CSP8 Power Management IC

N 1051 B OMAP DM290 GoldenEye nFBGA Processor IC

N 1060 T VREG 2.85/150MA(LP3987-2.85)USMD5 Analog IC

N 2000 B TI Analog Switch TS5A3159DCKR Interface And Controller IC

N 2001 B TI Analog Switch TS5A3159DCKR Interface And Controller IC

N 2101 T AF AMP TPA2012D2 77DB/217HZ WCSP16 Analog IC

N 2413 B EL DRIVER D381B 2-7V MSOP-10 Power Management IC

N 2500 B

WHITE LED DRIVER 4LEDS 500mW 8bump

USMD8 Power Management IC

N 2600 T IRDA 1.15Mbps 2.2mm RoHS Infrared

N 3200 B VREG & LEVELSHIFT(LP3928)USMD16 Other IC

N 6050 B VREG & LEVELSHIFT(LP3928)USMD16 Other IC

N 7500 T RF SYSTEM MODULE PIHI2.22 9.0 x 9.0 x 1 Hybrid

N 7520 T

PW AMP PF89001 EGSM850/900/DCS/PCS

Cut12 Power Amplifier

N 7540 T PW AMP QCPM-8883 K4-06 WCDMA 2100 Power Amplifier

N 7541 T DC CONV LM3202TLX NOPB revB µSMD8 Power Management IC

R 1000 T CHIPRES 0W06 33R J 0402 Fixed Resistor

R 1001 T CHIPRES 0W06 100R J 0402 Fixed Resistor

R 1051 B CHIPRES 0W06 100R J 0402 Fixed Resistor

R 1052 B CHIPRES 0W06 100R J 0402 Fixed Resistor

R 1065 B CHIPRES 0W06 33R J 0402 Fixed Resistor

RM-123; RM-145

Nokia Customer Care Parts and layouts

Page 2 –16 COMPANY CONFIDENTIAL Issue 1

Item ref Side Object Name Type

R1072 B CHIPRES 0W06 10K J 0402 Fixed Resistor

R 1078 B CHIPRES 0W06 33R J 0402 Fixed Resistor

R 1080 B CHIPRES 0W06 10K J 0402 Fixed Resistor

R 2000 B ASIP MIC W/ESD RES+CAP+ZDI BGA11 Integrated Discretes

R 2001 B CHIPRES 0W06 10K J 0402 Fixed Resistor

R 2002 B CHIPRES 0W06 220R J 0402 Fixed Resistor

R 2003 B VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2004 B CHIPRES 0W06 33K J 0402 Fixed Resistor

R 2005 B RES NETWORK 0W06 2X22R J 0404 Resistor Network

R 2006 B RES NETWORK 0W06 2X22R J 0404 Resistor Network

R 2009 B VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2010 B VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2011 B ASIP SILIC USB OTG / ESD BGA11 Integrated Discretes

R 2012 B RES NETWORK 0W06 220K/120K J 0404 Resistor Network

R 2013 B CHIPRES 0W06 100R J 0402 Fixed Resistor

R 2015 B CHIPRES 0W06 10R J 0402 Fixed Resistor

R 2016 B CHIP VARISTOR VWM14V VC50V 0402 Variable Resistor

R 2017 T CHIPRES 0W06 4K7 J 0402 Fixed Resistor

R 2018 T CHIPRES JUMPER 0R0 0402 Fixed Resistor

R 2022 B CHIP VARISTOR VWM14V VC50V 0402 Variable Resistor

R 2023 T CHIPRES JUMPER 0R0 0403 Fixed Resistor

R 2069 T CHIPRES JUMPER 0R0 0404 Fixed Resistor

R 2070 T NTC RES 0W1 47K J B 4050+-3% 0402 Variable Resistor

R 2071 T CHIP VARISTOR VWM15V VC50V 0402 Variable Resistor

R 2100 T ASIP MIC W/ESD RES+CAP+ZDI BGA11 Integrated Discretes

R 2101 T CHIPRES 0W06 220R J 0402 Fixed Resistor

R 2102 T CHIPRES 0W06 33K J 0402 Fixed Resistor

R 2103 B VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2104 T RES NETWORK 0W06 2X10R J 0404 Resistor Network

R 2117 T VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2118 T VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2119 T VAR.ARRAY 2X16V 824-915MHZ 0405 Variable Resistor

R 2121 T CHIPRES JUMPER 0R0 0405 Fixed Resistor

R 2124 T CHIPRES JUMPER 0R0 0406 Fixed Resistor

R 2200 T CHIPRES 0W06 100K J 0402 Fixed Resistor

RM-123; RM-145

Parts and layouts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 2 –17

Item ref Side Object Name Type

R2201 T CHIPRES 0W06 120K J 0402 Fixed Resistor

R 2203 T CHIPRES 0W06 2M2 J 0402 Fixed Resistor

R 2206 T CHIPRES 0W06 470R J 0402 Fixed Resistor

R 2223 T CHIPRES 0W06 220R J 0402 Fixed Resistor

R 2400 B CHIPRES 0W06 100K J 0402 Fixed Resistor

R 2412 B CHIPRES JUMPER 0R0 0407 Fixed Resistor

R 2415 B CHIPRES 0W06 120K J 0402 Fixed Resistor

R 2500 B CHIPRES 0W06 10K J 0402 Fixed Resistor

R 2501 B CHIPRES 0W06 33R J 0402 Fixed Resistor

R 2580 T CHIPRES 0W06 10K J 0402 Fixed Resistor

R 2600 T CHIPRES 0W125 4R7 J 0805 Fixed Resistor

R 2700 T ASIP SIM INTERFACE **low cap** BGA8 Integrated Discretes

R 2800 T CHIPRES 0W06 100K J 0402 Fixed Resistor

R 3000 T CHIPRES 0W06 4K7 J 0402 Fixed Resistor

R 3200 B ASIP MMC FILTER *** PB-FREE *** Integrated Discretes

R 3205 B CHIPRES 0W06 680R J 0402 Fixed Resistor

R 3221 T CHIPRES 0W06 100R J 0402 Fixed Resistor

R 6010 B CHIPRES 0W06 10K J 0402 Fixed Resistor

R 6011 B CHIPRES 0W06 8K2 J 0402 Fixed Resistor

R 6020 B CHIPRES JUMPER 0R0 0408 Fixed Resistor

R 6050 T CHIPRES JUMPER 0R0 0409 Fixed Resistor

R 7500 T CHIPRES 0W06 22K J 0402 Fixed Resistor

R 7501 T CHIPRES 0W06 4K7 J 0402 Fixed Resistor

R 7503 T CHIPRES 0W06 1K0 F 200PPM 0402 Fixed Resistor

R 7504 T CHIPRES 0W06 8K2 F 0402 Fixed Resistor

R 7505 T CHIPRES 0W06 5R6 J 0402 Fixed Resistor

R 7520 T CHIPRES 0W06 27K F 0402 Fixed Resistor

R 7522 T CHIPRES JUMPER 0R0 0410 Fixed Resistor

R 7540 T CHIPRES 0W06 47K F 200PPM 0402 Fixed Resistor

R 7541 T CHIPRES 0W06 1K2 F 250PPM 0402 Fixed Resistor

R 7542 T CHIPRES JUMPER 0R0 0411 Fixed Resistor

R 7543 T CHIPRES 0W06 10K J 0402 Fixed Resistor

R 7544 T CHIPRES 0W06 10R J 0402 Fixed Resistor

S 2580 T SM SW TACT SPST 12V SIDE KEY 2.2N Switch And Knob

S 2596 T SM SW TACT SPST 12V SIDE KEY 2.2N Switch And Knob

RM-123; RM-145

Nokia Customer Care Parts and layouts

Page 2 –18 COMPANY CONFIDENTIAL Issue 1

Item ref Side Object Name Type

S2597 T SM SW TACT SPST 12V SIDE KEY 2.2N Switch And Knob

S 2598 T SM SW TACT SPST 12V SIDE KEY 2.2N Switch And Knob

S 2599 T SM SW TACT SPST 12V SIDE KEY 2.2N Switch And Knob

T 7500 T TRANSF BALUN 2134 +/- 30MHZ 0805 Balun

T 7501 T TRANSF BALUN 3800 +/- 550MHZ 0805 Balun

V 2000 B ASIP TVS BGA4 Integrated Discretes

V 2412 B DI FAST 1SS400 75V 0A1 4NS SOD523 Diode

V 2413 B DI ZEN 100V 6% 0W2 SOD323 Diode

V 2414 B DI ZEN 100V 6% 0W2 SOD323 Diode

X 1000 T SM CAMERA MOD SKT 2X8F Socket

X 2000 T CONN SYST SM 14POL System Connector

X 2070 T SM BATTERY CONN 3POL SPR 12V 2A Battery Connector

X 2400 B SM CONN 2X12F P0.4 30V.3A PWB/PWB Board To Board Connector

X 2411 B C-SPRING EL FOIL SUS301 Spring

X 2412 B C-SPRING EL FOIL SUS301 Spring

X 2580 B SM CONN 2X12F P0.5 PWB/PWB Multipole Connector

X 2700 T SM SIM CONN 6POL P2.54 H1.8 Multipole Connector

X 3200 T CONN SMC TRANSFLASH MMC Smartcard Connector

X 8000 T SM CONN RF JACK 50R 2W 6GHZ Coaxial Connector

X 8001 T C-SPRING ANTENNA ( active ) Spring

X 8002 T C-SPRING ANTENNA Spring

X 8003 T SM CONN RF JACK 50R 2W 6GHZ Coaxial Connector

X 8004 T C-SPRING ANTENNA ( active ) Spring

X 8005 T C-SPRING ANTENNA Spring

X 8006 T C-SPRING ANTENNA Spring

X 8007 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8008 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8009 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8010 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8011 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8012 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8013 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8014 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8015 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8016 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

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Item ref Side Object Name Type

X8017 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8018 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8019 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8020 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8021 B C-SPRING FOR DISPLAY CAN GROUNDING Spring

X 8023 B

C-SPRING GROUNDING C-COVER PLATE

SUS301 Spring

Z 2000 B FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

Z 2001 B FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

Z 2005 B FERRITE BEAD 0.6R 600R/100MZ 0402 EMC Component

Z 2403 B ASIP 10-CH ESD EMI FILTER BGA25 Integrated Discretes

Z 2404 B ASIP 10-CH ESD EMI FILTER BGA25 Integrated Discretes

Z 2580 B ASIP 10-CH ESD EMI FILTER BGA25 Integrated Discretes

Z 2581 B ASIP 10-CH ESD EMI FILTER BGA25 Integrated Discretes

Z 2597 T ASIP EMI/ESD FILTER BGA6 Integrated Discretes

Z 2598 T ASIP EMI/ESD FILTER BGA6 Integrated Discretes

Z 2599 T ASIP EMI/ESD FILTER BGA6 Integrated Discretes

Z 2600 T ASIP EMI/ESD FILTER BGA6 Integrated Discretes

Z 7520 T CER FILT LFL181699TC1 2400-2483MHz 1.6 Ceramic Filter

Z 7540 T

DUPL SAW 1920-1980/2110-2170MHZ

3.8x3.8 Duplexer

CHIPRES 0W06 180K J 0402 Fixed Resistor

CHIPCAP NP0 1P2 C 50V 0402 Ceramic Capacitor

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Component layouts

Figure 1 Main board layout, bottom side (1rra_08a)

Figure 2 Main board layout, top side (1rra_08a)

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3 — Service Software

Instructions

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 3 –1

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Nokia Customer Care Service Software Instructions

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Page 3 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

Phoenix installation steps in brief........................................................................................................................3–5

Installing Phoenix...................................................................................................................................................3–6

Updating Phoenix installation..............................................................................................................................3–8

Uninstalling Phoenix..............................................................................................................................................3–9

Repairing Phoenix installation...........................................................................................................................3–11

Phone data package overview............................................................................................................................3–11

Installing phone data package...........................................................................................................................3–12

Uninstalling phone data package.......................................................................................................................3–15

Configuring users in Phoenix..............................................................................................................................3–17

Managing connections in Phoenix......................................................................................................................3–17

Installing flash support files for FPS-8 and FPS-10...........................................................................................3–19

Updating FPS-8 and FPS-10 flash prommer software.......................................................................................3–22

Activating FPS-8....................................................................................................................................................3–23

Deactivating FPS-8................................................................................................................................................3–24

List of Figures

Figure 3 Dongle not found.....................................................................................................................................3–6

Figure 4 Disclaimer text.........................................................................................................................................3–7

Figure 5 InstallShield Wizard Complete...............................................................................................................3–8

Figure 6 Installation interrupted..........................................................................................................................3–9

Figure 7 Remove program...................................................................................................................................3–10

Figure 8 Finish uninstallation.............................................................................................................................3–10

Figure 9 Repair program.....................................................................................................................................3–11

Figure 10 Data package setup information.......................................................................................................3–13

Figure 11 Data package destination folder.......................................................................................................3–14

Figure 12 InstallShield Wizard Complete...........................................................................................................3–15

Figure 13 Uninstalling phone data package......................................................................................................3–16

Figure 14 Finishing data package uninstallation..............................................................................................3–16

Figure 15 Phoenix login.......................................................................................................................................3–17

Figure 16 New user configured..........................................................................................................................3–17

Figure 17 Select mode: Manual...........................................................................................................................3–18

Figure 18 Connections list...................................................................................................................................3–19

Figure 19 Connection information.....................................................................................................................3–19

Figure 20 Product support module information (example from RM-1)..........................................................3–19

Figure 21 Flash update welcome dialog............................................................................................................3–20

Figure 22 Flash installation interrupted............................................................................................................3–20

Figure 23 Flash destination folder......................................................................................................................3–21

Figure 24 Finish flash update..............................................................................................................................3–22

Figure 25 Flash directory window......................................................................................................................3–22

Figure 26 Prommer software update finished..................................................................................................3–23

Figure 27 Prommer Maintenance window........................................................................................................3–23

Figure 28 Box activation......................................................................................................................................3–24

Figure 29 Deactivation warning.........................................................................................................................3–24

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Phoenix

installation steps in brief

Prerequisites

Recommended hardware requirements:

• Computer processor: Pentium 700 MHz or higher

• RAM 256 MB

• Disk space 100-300 MB

Supported operating systems:

•

Windows 2000

Service Pack 3 or higher

•

Windows XP

Service Pack 1 or higher

Context

Phoenix

is a service software for reprogramming, testing and tuning phones.

Phoenix

installation contains:

• Service software support for all phone models included in the package

• Flash update package files for programming devices

• All needed drivers for:

• PKD-1 (DK2) dongle

• DKU-2 USB cable

Note: Separate installation packages for flash update files and drivers are also available, but it is

not necessary to use them unless there are updates between

Phoenix

service software releases. If

separate update packages are used, they should be used after

Phoenix

and data packages have been

installed.

The phone model specific data package includes all changing product specific data:

• Product software binary files

• Files for type label printing

• Validation file for the faultlog repair data reporting system

• All product specific configuration files for

Phoenix

software components

Note:

Phoenix

and phone data packages should only be used as complete installation packages.

Uninstallation should be made from the

Windows

Control Panel.

To use

Phoenix

, you need to:

Steps

1. Connect a PKD-1 (DK2) dongle to the computer parallel port.

2. Install

Phoenix

3. Install the phone-specific data package.

4. Configure users.

5. Manage connection settings (depends on the tools you are using).

If you use FPS-8: • Update FPS-8 software

• Activate FPS-8

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If you use FPS-10: • Update FPS-10 software

Note: There is no need to activate FPS-10.

•Activate SX-4 smart card, if you need tuning and

testing functions.

Note: When FPS-10 is used only for

product software updates, SX-4 smart

card is not needed.

Results

Phoenix

is ready to be used with FPS-8 or FPS-10 flash prommers and other service tools.

Installing

Phoenix

Prerequisites

• Check that a dongle is attached to the parallel port of your computer.

• Download the

Phoenix

installation package (for example,

phoenix_service_sw_2004_39_x_xx.exe

) to your

computer (in

C:\TEMP

, for instance).

• Close all other programs.

• Depending on your operating system, administrator rights may be required to install

Phoenix

• If uninstalling or rebooting is needed at any point, you will be prompted by the InstallShield program.

Context

At some point during the installation procedure, you may get the following message:

Figure 3 Dongle not found

This may be a result of a defective or too old PKD-1 dongle.

Check the COM/parallel ports used. After correcting the problem, you can restart the installation.

For more detailed information, please refer to

Phoenix

Help files.

Tip: Each feature in

Phoenix

has its own Help function, which can be activated while running the

program. Press the F1 key or the feature’s Help button to activate a Help file.

Steps

1. To start the installation, run the application file (for example,

phoenix_service_sw_2004_39_x_xx.exe

2. In the

Welcome

dialogue, click Next.

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3. Read the disclaimer text carefully and click Yes.

Figure 4 Disclaimer text

4. Choose the destination folder.

The default folder

C:\ProgramFiles\Nokia\Phoenix

is recommended.

5. To continue, click Next.

To choose another location, click Browse (not recommended).

6. Wait for the components to be copied.

The progress of the installation is shown in the

Setup Status

window.

7. Wait for the drivers to be installed and updated.

The process may take several minutes to complete.

If the operating system does not require rebooting, the PC components are registered right away.

If the operating system requires restarting your computer, the Install Shield Wizard will notifies about it.

Select Yes... to reboot the PC immediately or No... to reboot the PC manually afterwards.

After the reboot, all components are registered.

Note:

Phoenix

does not work, if the components have not been registered.

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8. To end the installation, click Finish.

Figure 5 InstallShield Wizard Complete

Next actions

After the installation,

Phoenix

can be used after:

• installing phone model specific data package for

Phoenix

• configuring users and connections

FPS-8 and FPS-10 flash prommers can be used after updating their flash update package files.

Updating

Phoenix

installation

Context

• If you already have the

Phoenix

service software installed on your computer, you need to update the

software when new versions are released.

• To update

Phoenix

, you need to follow the same steps as when installing it for the first time.

•When you are updating, for example, from version a14_2004_16_4_47 to a15_2004_24_7_55, the update

will take place automatically without uninstallation.

•Always use the latest available versions of both

Phoenix

and the phone-specific data package. Instructions

can be found in the phone model specific Technical Bulletins and phone data package

readme.txt

files

(shown during installation).

• If you try to update

Phoenix

with the same version you already have (for example, a15_2004_24_7_55

to a15_2004_24_7_55), you are asked if you want to uninstall the existing version. In this case you can

choose between a total uninstallation or a repair installation in a similar way when choosing to uninstall

the application from the

Windows

Control Panel.

• If you try to install an older version (for example, downgrade from a15_2004_24_7_55 to

a14_2004_16_4_47), installation will be interrupted.

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Figure 6 Installation interrupted

• Always follow the instructions on the screen.

Steps

1. Download the installation package to your computer hard disk.

2. Close all other programs.

3. Run the application file (for example,

phoenix_service_sw_2004_39_x_xx.exe

Results

A new

Phoenix

version is installed and driver versions are checked and updated.

Uninstalling

Phoenix

Context

You can uninstall

Phoenix

service software manually from the

Windows

Control Panel.

Steps

1. Open the Windows Control Panel, and choose Add/Remove Programs.

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2. To uninstall

Phoenix

, choose Phoenix Service Software→Change/Remove→Remove .

Figure 7 Remove program

The progress of the uninstallation is shown.

3. If the operating system does not require rebooting, click Finish to complete.

Figure 8 Finish uninstallation

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If the operating system requires rebooting, InstallShield Wizard will notify you. Select Yes... to reboot the

PC immediately and No... to reboot the PC manually afterwards.

Repairing

Phoenix

installation

Context

If you experience any problems with the service software or suspect that files have been lost, use the repair

function before completely reinstalling

Phoenix

Note: The original installation package (for example,

phoenix_service_sw_a15_2004_24_7_55.exe

)

must be found on your PC when you run the repair setup.

Steps

1. Open Windows Control Panel→Add/Remove Programs .

2. Choose Phoenix Service Software→Change/Remove .

3. In the following view, select Repair.

Figure 9 Repair program

Phoenix

reinstalls components and registers them.

The procedure is the same as when updating

Phoenix

4. To complete the repair, click Finish.

Phone data package overview

Each product has its own data package (DP). The product data package contains all product-specific data files

to make the Phoenix service software and tools usable with a certain phone model.

The phone data package contains the following:

• Product software binary files

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• Files for type label printing

• Validation file for the fault log repair data reporting system

• All product-specific configuration files for Phoenix software components

Data files are stored in C:\Program Files\Nokia\Phoenix (default).

Installing phone data package

Prerequisites

•A phone-specific data package contains all data required for the

Phoenix

service software and service tools

to be used with a certain phone model.

• Check that a dongle is attached to the parallel port of your computer.

• Install

Phoenix

service software.

•Download the installation package (for example,

XX-XX_dp_EA_v_1_0.exe

) to your computer (for example,

in C:\TEMP).

• Close all other programs.

(XX-XX = type designator of the product)

If you already have

Phoenix

installed on your computer, you will need to update it when a new version is

released.

Note: Often

Phoenix

and the phone-specific data package come in pairs, meaning that a certain

version of

Phoenix

can only be used with a certain version of a data package. Always use the latest

available versions of both. Instructions can be found in phone-specific Technical Bulletins and

readme.txt

files of data packages.

Steps

1. To start the installation, run the application file (for example,

XX-XX_dp_EA_ v_1_0.exe

Wait for the installation files to be extracted.

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2. Click Next.

3. In the following view you can see the contents of the data package. Read the text carefully. There is

information about the

Phoenix

version required with this data package.

Figure 10 Data package setup information

4. To continue, click Next.

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5. Choose the destination folder, and click Next to continue.

Figure 11 Data package destination folder

The InstallShield Wizard checks where

Phoenix

is installed, and the directory is shown.

6. To start copying the files, click Next.

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Phone model specific files are installed. Please wait.

7. To complete the installation, click Finish.

Figure 12 InstallShield Wizard Complete

Next actions

Phoenix

can be used for flashing phones and printing type labels after:

• Configuring users

• Managing connections

FPS-8 and FPS-10 can be used after updating their flash update package files.

Uninstalling phone data package

Context

There is no need to uninstall an older version of a data package, unless instructions to do so are given in

the

readme.txt

file of the data package and bulletins related to the release.

Please read all related documents carefully.

Steps

1. Locate the data package installation file (e.g.

XX-XX_dp_EA_v_1_0.exe

) from your computer.

2. To start the uninstallation procedure, double-click the data package installation file.

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3. To uninstall the data package, click OK or to interrupt the uninstallation, click Cancel.

Figure 13 Uninstalling phone data package

4. When the data package is uninstalled, click Finish.

Figure 14 Finishing data package uninstallation

Alternative steps

• You can also uninstall the data package manually from

Control Panel→Add/Remove Programs→xx-xx* Phone Data Package . (*= type designator of the

phone).

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Configuring users in

Phoenix

Steps

1. Start

Phoenix

service software, and log in.

Figure 15 Phoenix login

If the user ID is already configured, select s/he from the

User name

drop-down list, and click OK.

2. To add a new user, or to edit existing ones, click Maintain.

3. To add a new user, click New.

4. Type in the name and initials of the user, and click OK.

The user is added to the user name list.

5. Select the desired user from the

User name

drop-down list, and click OK.

Figure 16 New user configured

Managing connections in

Phoenix

Context

With the Manage Connections feature you can edit and delete existing connections or create new ones.

Note: After choosing the desired connection, and connecting the phone to a PC for the first time,

allow the PC to install the USB device drivers first. Please note that this may take some time to

complete.

If there are problems after the driver installation, check that the USB connection is active from

the Windows Control Panel. If the problem persists, contact the local PC support.

Steps

1. Start

Phoenix

, and log in.

2. Choose File→Manage Connections... .

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3. To add a new connection, click Add.

4. Select Manual mode, and click Next to continue.

If you want to create the connection using the Connection Wizard, connect the tools and a phone to your

PC. The wizard will automatically try to configure the correct connection.

Figure 17 Select mode: Manual

i For an FPS-10 flash prommer with a USB Connection, choose the following connection settings:

• Media: FPS-10 USB

• DEVICE_INDEX: 0

• SERIAL_NUM: See Serial No from the label attached to the bottom of FPS-10

• ACTIVE_MEDIA: USB

ii For an FPS-10 flash prommer with a LAN connection, choose the following connection settings:

• Media: FPS-10 TCP/IP

• NET_SERV_NAME: Click Scan.... Choose your own FPS-10 device based on the correct MAC address.

See Serial No from the label attached to the bottom of your FPS-10.

• PORT_NUM: Use the default value, and click Next.

• PROTOCOL_FAMILY: Use the default value, and click Next.

• SOCKET TYPE: Use the default value, and click Next.

• TX_BUFFER_SIZE: Use the default value, and click Next.

• RX_BUFFER_SIZE: Use the default value, and click Next.

iii For an FPS-8 flash prommer, choose the following connection settings:

• Media: FPS-8

• PORT_NUM: COM Port where FPS-8 is connected

• COMBOX_DEF_MEDIA: FBUS

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iv For a plain USB connection, choose the following connection settings:

Note: First connect the DKU-2 USB cable between the PC USB port and phone.

• Media: USB

5. To complete the configuration, click Finish.

6. Click the connection you want to activate. Use the up/down arrows located on the right hand side to move

it on top of the list, then click Apply.

Figure 18 Connections list

The connection is activated, and it can be used after closing the

Manage Connection

window.

The connection information is shown at the right hand bottom corner of the screen.

Figure 19 Connection information

7. To use the connection, connect the phone to your PC with correct service tools. Make sure the phone is

switched on, and then choose File→Scan Product .

Results

The product support module information appears in the status bar:

Figure 20 Product support module information (example from RM-1)

Installing flash support files for FPS-8 and FPS-10

Prerequisites

• Install

Phoenix

service software.

• Install phone model specific data package for

Phoenix

• If you want to update the flash support files, they are delivered in the same installation package with

Phoenix

or newer

Phoenix

packages beginning from December 2004.

In case you want to update the MCU files, install the latest data package (see Technical Bulletins for

information on the latest one).

Normally, it is enough to install

Phoenix

and the phone-specific data package because the installation

always includes the latest flash update package files for FPS-8 and FPS-10.

• A separate installation package for flash support files is available. The files can be updated according to

these instructions, if updates appear between

Phoenix

data package releases.

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Context

If you are not using a separate installation package, you can skip this section and continue with "Updating

FPS-8 and FPS-10 flash prommer software" (page 3–22) after installing a new phone data package.

Steps

1. To begin the installation, double-click the flash update file (for example,

flash_update_03_183_0014.exe

Figure 21 Flash update welcome dialog

If the same version of the flash update package already exists, and you want to reinstall it, the previous

package is first uninstalled.

Restart installation again after the uninstallation.

2. If you try to downgrade the existing version to older ones, the setup will be aborted. If there is a need to

downgrade the version, uninstall newer files manually from the Windows Control Panel, and then rerun

the installation.

Figure 22 Flash installation interrupted

If an older version exists on your PC and it needs to be updated, click Next to continue installation.

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3. It is recommended to install the files to the default destination folder

C:\Program Files\Nokia\Phoenix

To continue, click Next.

Figure 23 Flash destination folder

When installing the flash update files for the first time, you may choose another location by selecting

Browse (not recommended).

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4. To complete the installation procedure, click Finish .

Figure 24 Finish flash update

Next actions

FPS-8 and FPS-10 flash prommers must be updated using

Phoenix

Updating FPS-8 and FPS-10 flash prommer software

Steps

1. Start

Phoenix

service software, and log in.

2. Choose the correct connection for your flash prommer: File→Manage Connections...

3. Choose Flashing→Prommer maintenance .

4. To update the FPS-8/FPS-10 software, click Update, and select the appropriate file

fps8upd.ini

(for FPS-8)

fpsxupd.ini

(for FPS-10) from

C:\Program Files\Nokia\Phoenix\Flash

Figure 25 Flash directory window

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Tip: All files can be loaded separately to the prommer used. To do this, click the right mouse button

in the

Flash Box Files

pane and select the file type(s) to be loaded.

5. Click OK.

Figure 26 Prommer software update finished

6. To close the

Prommer Maintenance

window, click Close.

Figure 27

Prommer Maintenance

window

Activating FPS-8

Context

Before FPS-8 can be successfully used for phone programming, it must first be activated.

First fill in the

FPS-8 activation request

sheet in the FPS-8 sales package, and follow the instructions given.

When activation file is received (for example,

00000.in

), copy it to the

C:\ProgramFiles\Nokia\Phoenix

\BoxActivation

directory on your computer (this directory is created when

Phoenix

is installed).

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Steps

1. Start

Phoenix

service software.

2. Choose Flashing→Prommer Maintenance .

3. In the

Prommer Maintenance

window, click Activate.

4. To find the activation file, click Browse.

5. To activate the prommer, select the activation file and click Open.

Figure 28 Box activation

6. To complete the activation, restart FPS-8.

Deactivating FPS-8

Context

If there is, for example, a need to send the FPS-8 box for repair, it must be deactivated first.

Steps

1. Start

Phoenix

service software.

2. Choose Flashing→Prommer Maintenance .

3. In the

Prommer Maintenance

window, click Deactivate.

4. To confirm the deactivation, click Yes.

Figure 29 Deactivation warning

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The box is deactivated.

5. To complete the deactivation, restart FPS-8.

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4 — Service Tools and Service

Concepts

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 4 –1

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Table of Contents

Service tools............................................................................................................................................................4–5

CA-31D................................................................................................................................................................4–5

CA-35S.................................................................................................................................................................4–5

CA-53...................................................................................................................................................................4–5

CU-4.....................................................................................................................................................................4–6

FLS-4S..................................................................................................................................................................4–7

FPS-10.................................................................................................................................................................4–7

FS-31...................................................................................................................................................................4–7

JBT-9....................................................................................................................................................................4–7

JXS-1....................................................................................................................................................................4–8

MJ-91...................................................................................................................................................................4–8

PCS-1...................................................................................................................................................................4–8

PKD-1..................................................................................................................................................................4–8

RJ-104.................................................................................................................................................................4–9

RJ-108.................................................................................................................................................................4–9

RJ-114.................................................................................................................................................................4–9

RJ-57...................................................................................................................................................................4–9

RJ-93...................................................................................................................................................................4–9

SA-103..............................................................................................................................................................4–10

SPS-1.................................................................................................................................................................4–10

SRT-6.................................................................................................................................................................4–10

SS-45.................................................................................................................................................................4–11

SS-46.................................................................................................................................................................4–11

SS-51.................................................................................................................................................................4–11

SS-62.................................................................................................................................................................4–11

ST-37.................................................................................................................................................................4–11

ST-40.................................................................................................................................................................4–12

ST-41.................................................................................................................................................................4–12

ST-44.................................................................................................................................................................4–12

SX-4...................................................................................................................................................................4–12

XCS-4.................................................................................................................................................................4–12

XRF-1.................................................................................................................................................................4–13

Service concepts...................................................................................................................................................4–13

Flash concept with FPS-10..............................................................................................................................4–13

Module jig concept..........................................................................................................................................4–14

POS (Point of Sale) flash concept...................................................................................................................4–15

RF testing and BB testing...............................................................................................................................4–16

CU-4 flash concept with FPS-10......................................................................................................................4–17

Service concept for RF/BB testing and tuning..............................................................................................4–18

LAN connection flash concept........................................................................................................................4–19

List of Figures

Figure 30 Basic flash concept with FPS-10.........................................................................................................4–13

Figure 31 Module jig service concept.................................................................................................................4–14

Figure 32 POS flash concept................................................................................................................................4–15

Figure 33 RF testing and BB testing...................................................................................................................4–16

Figure 34 CU-4 flash concept with FPS-10..........................................................................................................4–17

Figure 35 Service concept for RF/BB testing and tuning..................................................................................4–18

Figure 36 LAN connection flash concept............................................................................................................4–19

RM-123; RM-145

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Nokia Customer Care Service Tools and Service Concepts

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Page 4 –4 COMPANY CONFIDENTIAL Issue 1

Service tools

The table below gives a short overview of service tools that can be used for testing, error analysis and repair

of product RM-123; RM-145, refer to various concepts.

CA-31D USB cable

The CA-31D USB cable is used to connect FPS-10 or FPS-11 to a PC. It is

included in the FPS-10 and FPS-11 sales packages.

CA-35S Power cable

CA-35S is a power cable for connecting, for example, the FPS-10 flash

prommer to the Point-Of-Sales (POS) flash adapter.

CA-53 USB connectivity

cable

USB to system connector cable.

RM-123; RM-145

Service Tools and Service Concepts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 4 –5

CU-4 Control unit

CU-4 is a general service tool used with a module jig and/or a flash

adapter. It requires an external 12 V power supply.

The unit has the following features:

• software controlled via USB

• EM calibration function

• Forwards FBUS/Flashbus traffic to/from terminal

• Forwards USB traffic to/from terminal

• software controlled BSI values

• regulated VBATT voltage

• 2 x USB2.0 connector (Hub)

• FBUS and USB connections supported

When using CU-4, note the special order of connecting cables and

other service equipment:

Instructions

1 Connect a service tool (jig, flash adapter) to CU-4.

2 Connect CU-4 to your PC with a USB cable.

3 Connect supply voltage (12 V)

4 Connect an FBUS cable (if necessary).

5 Start Phoenix service software.

Note: Phoenix enables CU-4 regulators via USB when it is

started.

Reconnecting the power supply requires a Phoenix restart.

RM-123; RM-145

Nokia Customer Care Service Tools and Service Concepts

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FLS-4S Flash device

FLS-4S is a dongle and flash device incorporated into one package,

developed specifically for POS use.

FPS-10 Flash prommer

FPS-10 interfaces with:

• PC

• Control unit

• Flash adapter

• Smart card

FPS-10 flash prommer features:

• Flash functionality for BB5 and DCT-4 terminals

• Smart Card reader for SX-2 or SX-4

• USB traffic forwarding

• USB to FBUS/Flashbus conversion

• LAN to FBUS/Flashbus and USB conversion

• Vusb output switchable by PC command

FPS-10 sales package includes:

• FPS-10 prommer

• Power Supply with 5 country specific cords

• USB cable

FS-31 Flash adapter

• FS-31 is equipped with a clip interlock system

• provides standardised interface towards Control Unit

• provides RF connection using coupler

• multiplexing between USB and FBUS media, controlled by VUSB

JBT-9 Bluetooth test and

interface box (sales

package)

The JBT-9 test box is a generic service device used to perform

Bluetooth bit error rate (BER) testing, and establishing cordless FBUS

connection via Bluetooth. An ACP-8x charger is needed for BER testing

and an AXS-4 cable in case of cordless interface usage testing .

Sales package includes:

• JBT-9 test box

• Installation and warranty information

RM-123; RM-145

Service Tools and Service Concepts Nokia Customer Care

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JXS-1 RF shield box

Because the WCDMA network disturbs the RX side testing of the WCDMA

phone and the Tx signal of the WCDMA phone can severely disturb the

WCDMA network, a shield box is needed in all testing, tuning and fault

finding which requires WCDMA RF signal.

The shield box is not an active device, it contains only passive filtering

components for RF attenuation.

MJ-91 Module jig

MJ-91 is meant for component level troubleshooting.

The jig includes an RF interface for GSM, WCDMA and Bluetooth. In

addition, it has the following features:

• Provides mechanical interface with the engine module

• Provides galvanic connection to all needed test pads in module

• Multiplexing between USB and FBUS media, controlled by Vusb

• MMC interface

• Duplicated SIM connector

• Connector for control unit

•Access for Pop-PortTM system connector

Note: Be careful when closing the jig, not to harm the display

with the screws on the jig!

PCS-1 Power cable

The PCS-1 power cable (DC) is used with a docking station, a module

jig or a control unit to supply a controlled operating voltage.

PKD-1 SW security device

SW security device is a piece of hardware enabling the use of the

service software when connected to the parallel (LPT) port of the PC.

Without the device, it is not possible to use the service software.

Printer or any such device can be connected to the PC through the

device if needed.

RM-123; RM-145

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RJ-104 BTHFM rework jig

RJ-104 is a rework jig used when servicing the BTHFM module. It is

used together with rework stencil ST-37.

RJ-108 Soldering jig

RJ-108 is a soldering jig used for soldering and as a rework jig for the

engine module.

RJ-114 Rework jig

RJ-114 is a rework jig used with ST-41.

RJ-57 Rework jig

RJ-57 is a rework jig used with ST-22.

RJ-93 Rework jig

RJ-93 is used as a rework jig for the engine module.

This stencil takes the front end module (FEM) or power amplifier (PA)

module for spreading the soldering paste to the component. Must be

used together with the ST-40 stencil.

RM-123; RM-145

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SA-103 RF coupler

SA-103 is an RF coupler for WCDMA and GSM RF testing. It is used

together with the product-specific flash adapter.

The following table shows attenuations from the antenna pads of the

mobile terminal to the SMA connectors of SA-103:

•Frequency Att. (dB)

GSM900 TX 2,7 dB +/- 0,5 dB

GSM900 RX 2,6 dB +/- 0,7 dB

GSM1800 TX 8,2 dB +/- 2,0 dB

GSM1800 RX 5,3 dB +/- 0,4 dB

GSM1900 TX 5,1 dB +/- 0,1dB

GSM1900 RX 5,2 dB +/- 0,6 dB

WCDMA2100 TX 10,0 dB +/- 0,9dB

WCDMA2100 RX 6,8 dB +/- 0,4 dB

SPS-1 Soldering Paste

Spreader

SRT-6 Opening tool

SRT-6 is used to open phone covers and B-to-B connectors.

RM-123; RM-145

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SS-45 Front camera

removal tool

The front camera removal tool SS-45 is used to remove/attach the

front camera module from/to the socket.

SS-46 Interface adapter

SS-46 acts as an interface adapter between the flash adapter and

FPS-10.

SS-51 Front camera

removal tool

The front camera removal tool SS-51 is used to remove/attach a front

camera module from/to the camera socket of the phone PWB.

SS-62 Generic flash adapter

base for BB5

• generic base for flash adapters and couplers

• SS-62 equipped with a clip interlock system

• provides standardised interface towards Control Unit

• provides RF connection using galvanic connector or coupler

• multiplexing between USB and FBUS media, controlled by VUSB

ST-37 BTHFM rework stencil

ST-37 stencil is used with RJ-104 BTHFM rework jig.

RM-123; RM-145

Service Tools and Service Concepts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 4 –11

ST-40 PA rework stencil

This stencil is to be used together with RJ-93 and covering FEM module.

ST-41 Rework stencil

ST-41 is a rework stencil used with rework jig RJ-114.

ST-44 Rework stencil

ST-44 is a rework stencil used with rework jig RJ-57.

SX-4 Smart card

SX-4 is a BB5 security device used to protect critical features in tuning

and testing.

SX-4 is also needed together with FPS-10 when DCT-4 phones are

flashed.

XCS-4 Modular cable

XCS-4 is a shielded (one specially shielded conductor) modular cable

for flashing and service purposes.

RM-123; RM-145

Nokia Customer Care Service Tools and Service Concepts

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XRF-1 RF cable

The RF cable is used to connect, for example, a module repair jig to

the RF measurement equipment.

SMA to N-Connector ca. 610mm.

Attenuation for:

• GSM850/900: 0.3+-0.1 dB

• GSM1800/1900: 0.5+-0.1 dB

• WLAN: 0.6+-0.1dB

Service concepts

Flash concept with FPS-10

Figure 30 Basic flash concept with FPS-10

Note: FPS-8 concept can also be used for flashing.

Item Type Description

1 FS-31 Flash adapter

RM-123; RM-145

Service Tools and Service Concepts Nokia Customer Care

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Item Type Description

2 SS-46 Interface adapter

3 CA-35S Power cable

4 XCS-4 Modular cable

5 FPS-10 Flash prommer box

6 Standard USB cable

7 PKD-1 SW security device

Module jig concept

Module jig concept is meant for BB / RF testing + tuning and for flashing purposes.

Figure 31 Module jig service concept

Item Type Description

1 MJ-91 Module jig

2 CU-4 Control unit

3 FPS-10 Flash prommer box

4 SX-4 Smart card

5 XCS-4 Modular cable

6 PCS-1 DC power cable

RM-123; RM-145

Nokia Customer Care Service Tools and Service Concepts

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Item Type Description

7 Standard USB cable

8 Standard USB cable

9 GPIB control cable

10 XRS-6 RF cable

11 PKD-1 SW security device

12 RF shield box

Note: Item 12 not shown in the picture.

POS (Point of Sale) flash concept

Figure 32 POS flash concept

Item Type Description

1 CA-53 USB connectivity cable

2 FLS-4S POS flash device

RM-123; RM-145

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RF testing and BB testing

Figure 33 RF testing and BB testing

Item Type Description

1 SS-62

SA-103

Flash adapter base

Flash adapter

2 CU-4 Control unit

3 SA-103 RF coupler

4 PCS-1 Power cable

5 Standard USB cable

6 Standard USB cable + smart card reader

7 SX-4 Smart card

8 GPIB control cable

9 XRS-6 RF cable

10 PKD-1 SW security device

11 RF shield box

Note: Item 11 is not shown in the figure.

RM-123; RM-145

Nokia Customer Care Service Tools and Service Concepts

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CU-4 flash concept with FPS-10

Figure 34 CU-4 flash concept with FPS-10

Note: FPS-8 concept can also be used for flashing.

Item Type Description

1 SS-62

FS-31

Flash adapter base

Flash adapter

2 CU-4 Control unit

3 XCS-4 Modular cable

4 PCS-1 Power cable

5 FPS-10 Flash prommer box

6 Standard USB cable

7 Standard USB cable

8 PKD-1 SW security device

RM-123; RM-145

Service Tools and Service Concepts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 4 –17

Service concept for RF/BB testing and tuning

Figure 35 Service concept for RF/BB testing and tuning

Item Type Description

1 MJ-91 Module jig

2 CU-4 Control unit

3 Standard USB cable

4 PCS-1 DC power cable

5 Standard USB cable + smart card reader

6 SX-4 Smart card

7 XRS-6 RF cable

8 GPIB control cable

9 PKD-1 SW security device

10 RF shield box

Note: Item 10 not shown in the picture.

RM-123; RM-145

Nokia Customer Care Service Tools and Service Concepts

Page 4 –18 COMPANY CONFIDENTIAL Issue 1

LAN connection flash concept

Figure 36 LAN connection flash concept

Item Type Description

1 SS-62

FS-31

Flash adapter base

Flash adapter

2 SS-46 Interface adapter

3 CA-35S Power cable

4 XCS-4 Modular cable

5 FPS-10 Flash prommer box

6 LAN cable

7 LAN cable

8 PKD-1 SW security device

RM-123; RM-145

Service Tools and Service Concepts Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 4 –19

RM-123; RM-145

Nokia Customer Care Service Tools and Service Concepts

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Page 4 –20 COMPANY CONFIDENTIAL Issue 1

5 — Disassembly and

reassembly instructions

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 5 –1

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Nokia Customer Care Disassembly and reassembly instructions

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Page 5 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

Disassembly instructions.......................................................................................................................................5–5

Reassembly instructions......................................................................................................................................5–16

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Issue 1 COMPANY CONFIDENTIAL Page 5 –3

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Nokia Customer Care Disassembly and reassembly instructions

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Page 5 –4 COMPANY CONFIDENTIAL Issue 1

Disassembly instructions

Steps

1. You will need these tools:

2. Protect the window with a protective film.

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Issue 1 COMPANY CONFIDENTIAL Page 5 –5

3. Open the battery cover and ensure that a battery is inserted..

4. Undo the Torx Plus size 6 screws in the shown order.

Note: For assembly, use the reverse order and a torque of 15 Ncm.

5. Discard the screws and always use new ones because of the locking compound.

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6. This picture shows the position of the holding clips on the left side unit.

7. This picture shows the position of the holding clips on the right side of the unit.

8. Bring the SRT-6 exactly to the position over the (invisible) clips.

Note: A little sliding motion could be needed (like a 'credit card') when releasing the snaps. Do not

damage the edges of the A-cover.

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9. Stick the SRT-6 between the covers and release the four clips.

10. Remove the A-cover and protect the inner window with a protective film.

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11. Protect the LCD module with a protective film.

12. Press out the keymat.

13. Stick the SRT-6 into between the top cover and the camera bezel and release the top cover.

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14. Now, remove the top cover.

15. To release the camera bezel, stick the closed tweezers between the camera bezel and the D-cover.

16. Now, remove the camera bezel.

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17. Unlock the four clips of the C-cover plate assy and loosen it.

18. Flip over the C-cover plate assy and pay attention to the flex foil.

19. Carefully open the flex connector with the SRT-6.

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20. Now, also open the flex connector of the LCD module.

21. Open the Torx Plus size 6 screws in the shown order.

Note: For assembly, use the reverse order and a torque of 17 Ncm.

22. Take off the C-cover assy with the LCD module.

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23. Release the LCD module from the C-cover assy by pushing the edges outwards first. Mind the grounding

clips.

24. Remove the microphone clapton with the dental pick.

25. Use the SRT-6 as an aid to lift out the engine module from the D-cover assy.

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26. Use the soldering jig RJ-108 as a support when working on the camera module. This prevents damaging

or soiling the underneath spring contacts.

27. Take the SS-45 and fit it between the camera module and the shielding.

28. Press the tool and pull out the camera module.

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Nokia Customer Care Disassembly and reassembly instructions

Page 5 –14 COMPANY CONFIDENTIAL Issue 1

29. Remove the DC-jack with a DC-plug.

30. Carefully remove the earpiece with a dental tool. Always use a new adhesive tape when replacing

the earpiece.

31. The disassembly procedure is now finished.

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Reassembly instructions

Steps

1. Follow the disassembly instructions

in reversed order

Note: Pay special attention to step 21 and step 4!

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Page 5 –16 COMPANY CONFIDENTIAL Issue 1

6 — BB Troubleshooting and

Manual Tuning Guide

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 6 –1

RM-123; RM-145

Nokia Customer Care BB Troubleshooting and Manual Tuning Guide

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Table of Contents

Troubleshooting overview....................................................................................................................................6–5

Power and charging troubleshooting..................................................................................................................6–6

Dead or jammed device troubleshooting.......................................................................................................6–6

General power checking...................................................................................................................................6–8

Golden eye troubleshooting.............................................................................................................................6–9

Charging troubleshooting..............................................................................................................................6–10

Interface troubleshooting...................................................................................................................................6–11

Flash programming fault troubleshooting...................................................................................................6–11

CMT SDRAM memory troubleshooting...........................................................................................................6–13

CMT NOR flash fault troubleshooting............................................................................................................6–14

SD card troubleshooting.................................................................................................................................6–15

USB interface troubleshooting.......................................................................................................................6–17

SIM card troubleshooting...............................................................................................................................6–19

User interface troubleshooting...........................................................................................................................6–21

Power key troubleshooting............................................................................................................................6–21

Key troubleshooting.......................................................................................................................................6–21

Display module troubleshooting...................................................................................................................6–22

General instructions for display troubleshooting...................................................................................6–22

Display troubleshooting............................................................................................................................6–25

Display and top keyboard backlight troubleshooting............................................................................6–26

Main keyboard backlight troubleshooting..............................................................................................6–26

Camera module troubleshooting........................................................................................................................6–27

Introduction to camera troubleshooting.....................................................................................................6–27

Taking and evaluating test pictures..............................................................................................................6–27

Camera hardware failure message troubleshooting...................................................................................6–28

Camera baseband HW troubleshooting........................................................................................................6–29

Camera viewfinder troubleshooting.............................................................................................................6–30

Bad camera image quality troubleshooting.................................................................................................6–31

Audio troubleshooting.........................................................................................................................................6–32

Audio troubleshooting test instructions......................................................................................................6–32

Internal earpiece troubleshooting................................................................................................................6–36

Internal microphone troubleshooting..........................................................................................................6–37

IHF troubleshooting........................................................................................................................................6–38

External microphone troubleshooting..........................................................................................................6–39

External earpiece troubleshooting................................................................................................................6–40

Vibra troubleshooting....................................................................................................................................6–41

Baseband manual tuning guide.........................................................................................................................6–41

Certificate restoring for BB5.0 products.......................................................................................................6–41

Energy management calibration...................................................................................................................6–47

List of Tables

Table 13 Display module troubleshooting cases..............................................................................................6–23

Table 14 Pixel defects..........................................................................................................................................6–23

Table 15 Calibration value limits........................................................................................................................6–47

List of Figures

Figure 37 Flashing pic 1. Take single trig measurement for the rise of the BSI signal.................................6–12

Figure 38 Flashing pic 2. Take single trig measurement for the rise of the BSI signal.................................6–13

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Figure 39 NOR CLK from J3004............................................................................................................................6–14

Figure 40 SD card initialization from pin J3206................................................................................................6–16

Figure 41 USB 1: D-TXD (PopPort TM pin 6) and D+RXD (PopPort TM pin 7) voltage levels when USB is

connected...................................................................................................................................................6–18

Figure 42 SIM interface signals...........................................................................................................................6–19

Figure 43 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is

connected...................................................................................................................................................6–34

Figure 44 Differential output waveform of the Ext_in_IHF_out out loop measurement when speaker is

connected...................................................................................................................................................6–34

Figure 45 Single-ended output waveform of the HP_in_Ext_out loop when microphone is connected....

6–35

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Troubleshooting overview

For practical reasons, troubleshooting is divided into two sections;

• Baseband troubleshooting, including camera

• RF troubleshooting, including FM radio and Bluetooth

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Power and charging troubleshooting

Dead or jammed device troubleshooting

Troubleshooting flow

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General power checking

Voltages

Check the following voltages:

Signal

Rename Regulator Sleep Idle Nominal

voltage Main user Notes

VIO RETU ON ON 1.82 Memory, I/Os,

IrDA, Display

VBACK RETU ON ON 2.5 Back-up

battery

VSIM1 RETU ON ON 1.8/3.0 SIM card

VSIM2 RETU OFF OFF 3.0 Keyboard

backlight

EL-foil driver

VDRAM RETU ON ON 1.82 SDRAM

VAUX RETU OFF OFF 2.5 IrDA IrDA active

VANA RETU ON ON 2.5 Audio, some

pull-ups

VR1 RETU OFF ON 2.5 Crystal

oscillators

VRFC RETU OFF ON 1.8 RAP3G

converters

VRCP1 RETU 4.5 To RF parts RF active

VRCP2 RETU 4.5 To RF parts RF active

VREF RETU ON ON 1.35 RF reference

VCORE TAHVO ON ON 1.4 RAP3G digital

VOUT TAHVO OFF OFF 2.5 Accessory

connected

VCAM_2V8 LP3987ITLX-2.

85/N1060

OFF OFF 2.85 Camera Camera ON

VCAM_1V8 LM3671TLX-1.

82/N1080

OFF OFF 1.8 Camera Camera ON

VCAM_1V5 TPS62311YZD

R/N1050

OFF OFF 1.5 Camera Camera ON

2V8_FM_LCD LP3985ITLX-2.

85/N6050

ON ON 2.85 FM, LCD, Hall

sensor

VMMC LP3928TLX-18

28/N3200

OFF OFF 3.0 MCC card

LCD_LED_OUT 4w_LED_DRIVE

OFF OFF LCD Backlight

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Page 6 –8 COMPANY CONFIDENTIAL Issue 1

Golden eye troubleshooting

Context

Golden eye is placed under a non removable shield and cannot be replaced.

Please swap the board.

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Charging troubleshooting

Troubleshooting flow

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Interface troubleshooting

Flash programming fault troubleshooting

Part 1

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Part 2

Figure 37 Flashing pic 1. Take single trig measurement for the rise of the BSI signal.

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Figure 38 Flashing pic 2. Take single trig measurement for the rise of the BSI signal.

CMT SDRAM memory troubleshooting

Troubleshooting flow

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CMT NOR flash fault troubleshooting

Troubleshooting flow

Figure 39 NOR CLK from J3004

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SD card troubleshooting

Troubleshooting flow

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Take single trig measurement on the rising edge of the DAT signal.

Figure 40 SD card initialization from pin J3206

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USB interface troubleshooting

Troubleshooting flow

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Figure 41 USB 1: D-TXD (PopPort TM™ pin 6) and D+RXD (PopPort TM™ pin 7) voltage levels when USB is connected.

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SIM card troubleshooting

Troubleshooting flow

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SIM CLK frequency = 3.2MHz (Take single triggered measurement in boot on the VSIM1 line).

Figure 42 SIM interface signals

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User interface troubleshooting

Power key troubleshooting

Troubleshooting flow

Key troubleshooting

Context

There are two possible failure modes in the keyboard module:

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BB Troubleshooting and Manual Tuning Guide Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 6 –21

•One or more keys are stuck, so that the key does not react when a keydome or a side key is pressed. This

kind of failure is caused by mechanical reasons (dirt, rust, mechanical damage, etc.)

•Malfunction of several keys at the same time; this happens when one or more rows or columns in the key

matrix are failing (shortcut or open connection).

If the failure mode is not clear, start with the Keyboard test in Phoenix.

Troubleshooting flow

Display module troubleshooting

General instructions for display troubleshooting

Context

• The display is in a normal mode when the phone is in active use.

• Display is in a partial idle mode when the phone is in the screen saver mode.

• The operating modes of the display can be controlled with the help of

Phoenix

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Table 13 Display module troubleshooting cases

Display blank There is no image on the display. The display looks

the same when the phone is on as it does when the

phone is off. The backlight can be on in some cases.

Image on the display not correct Image on the display can be corrupted or a part of

the image can be missing. If a part of the image is

missing, change the display module. If the image is

otherwise corrupted, follow the appropriate

troubleshooting diagram.

Backlight dim or not working at all Backlight LED components are inside the display

module. Backlight failure can also be in the

connector or in the backlight power source in the

main engine of the phone.

This means that in case the display is working

(image OK), the backlight is faulty.

Visual defects (pixel) Pixel defects can be checked by controlling the

display with Phoenix. Use both colours, black and

white, on a full screen.

The display may have some random pixel defects

that are acceptable for this type of display. The

criteria when pixel defects are regarded as a display

failure, resulting in a replacement of the display, are

presented the following table.

Table 14 Pixel defects

Item White dot defect Black dot

defect Total

1Defect

counts

R G B White

Dot

Total

1 1

1 1 1 1

2 Combine

d defect

counts

Not allowed.

Two single dot defects that are within 5 mm of each other should

be interpreted as combined dot defect.

Steps

1. Verify with a working display that the fault is not on the display module itself.

The display module cannot be repaired.

2. Check that the cellular engine is working normally.

i To check the functionality, connect the phone to a docking station.

ii Start

Phoenix

service software.

iii Read the phone information to check that also the application engine is functioning normally (you

should be able to read the APE ID).

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3. Proceed to the display troubleshooting flowcharts.

Use the Display Test tool in

Phoenix

to find the detailed fault mode.

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Display troubleshooting

Troubleshooting flow

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Display and top keyboard backlight troubleshooting

Context

The device has one LED driver that provides current for both display and keyboard backlights.

Troubleshooting flow

Main keyboard backlight troubleshooting

Context

The device has one LED driver that provides current for the main keyboard backlights.

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Troubleshooting flow

Camera module troubleshooting

Introduction to camera troubleshooting

Bad conditions often cause bad pictures. Therefore, the camera operation has to be checked in constant

conditions or by using a second, known-to-be-good Nokia device as reference. Image quality is hard to

measure quantitatively, and the difference between a good and a bad picture can be small. Some training

or experience may be needed to detect what is actually wrong.

When checking for possible errors in camera functionality, knowing what error is suspected significantly

helps the testing by narrowing down the amount of test cases. The following types of image quality problems

are common:

• Dust (black spots)

• Lack of sharpness

• Bit errors

Taking and evaluating test pictures

When

taking

a test picture, remember the following:

• Avoid bright fluorescent light, 50/60Hz electrical network or high artificial illumination levels

• If the phone is hot, let it rest for a while before taking the picture

• Make sure the optical system is clean

• Use highest possible resolution

• Make sure the light is suffiecient (bright office lightning)

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• Do not take the picture towards light source

• Be as still as possible when taking the picture

• Distance should be at least 40cm, 1-2m is recommended

When

evaluating

a test picture, remember the following:

• The center of the picture is sharper than the edges

• The image may be blurred, though it does not show in the viewfinder

• Analyse the picture from your PC monitor, full colour setting is recommended

• If possible, compare with a picture of the same motive taken with a similar Nokia device

Camera hardware failure message troubleshooting

Context

If you get a hardware failure message when using the camera, follow the next troubleshooting flowchart.

Troubleshooting flow

Note: Make sure that the phone has the latest software before continuing.

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Camera baseband HW troubleshooting

Troubleshooting flow

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Camera viewfinder troubleshooting

Troubleshooting flow

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Bad camera image quality troubleshooting

Troubleshooting flow

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Audio troubleshooting

Audio troubleshooting test instructions

Differential external earpiece and internal earpiece outputs can be measured either with a single-ended or

a differential probe.

When measuring with a single-ended probe each output is measured against the ground.

Internal handsfree output is measured using a current probe, if a special low-pass filter designed for

measuring a digital amplifier is not available. Note also that when using a current probe, the input signal

frequency must be set to 2kHz.

The input signal for each loop test can be either single-ended or differential.

Required equipment

The following equipment is needed for the tests:

• Oscilloscope

• Function generator (sine waveform)

• 'Active speaker' or 'speaker and power amplifier'

• Sound level meter

• Current probe (Internal handsfree DPMA output measurement)

• Phoenix service software

• Battery voltage 3.7V

Test procedure

Audio can be tested using the Phoenix audio routings option. Three different audio loop paths can be

activated:

• External microphone to Internal earpiece

• External microphone to Internal handsfree speaker

• Internal microphone to External earpiece

Each audio loop sets routing from the specified input to the specified output enabling a quick in-out test.

Loop path gains are fixed and they cannot be changed using Phoenix. Correct pins and signals for each test

are presented in the following table.

Phoenix audio loop tests and test results

The results presented in the table apply when no accessory is connected and battery voltage is set to 3.7V.

Earpiece, internal microphone and speaker are in place during measurement. Applying a headset accessory

during measurement causes a significant drop in measured quantities.

The gain values presented in the table apply for a differential output vs. single-ended/differential input.

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Loop test Input

terminal Output

terminal Path

gain [dB]

(fixed)

Input

voltage

[mVp-p]

Differential

output

voltage

[mVp-p]

Output

DC level

[V]

Output

current

[mA]

External Mic to

External Earpiece

XMICP and

GND

HSEAR R P,

HSEAR R N

and GND

-2.9 1000 720 1.2 NA

HSEAR P,

HSEAR N

and GND

XMICN and

GND

HSEAR R P,

HSEAR R N

and GND

HSEAR P,

HSEAR N

and GND

External Mic to

Internal Earpiece

XMICP and

GND

EarP and

GND

-4.5 1000 600 1.2 NA

EarN and

GND

XMICN and

GND

EarP and

GND

EarN and

GND

External Mic to

Internal

handsfree

XMICP and

GND

B2102 pads -5 1000 560 0 25mA

(calc.)

XMICN and

GND

B2102 pads

Internal Mic to

External Earpiece

B2100

(OUT/GND)

HSEAR R P,

HSEAR R N

and GND

22.7 100 1360 1.2 NA

HSEAR P,

HSEAR N

and GND

HSEAR R P,

HSEAR R N

and GND

HSEAR P,

HSEAR N

and GND

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Measurement data

Figure 43 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is connected.

If a special low-pass filter designed for measuring digital amplifiers is unavailable, the measurement must be performed with a

current probe and the input signal frequency must be 2kHz.

Figure 44 Differential output waveform of the Ext_in_IHF_out out loop measurement when speaker is connected.

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Figure 45 Single-ended output waveform of the HP_in_Ext_out loop when microphone is connected.

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Internal earpiece troubleshooting

Troubleshooting flow

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Internal microphone troubleshooting

Troubleshooting flow

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IHF troubleshooting

Troubleshooting flow

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External microphone troubleshooting

Troubleshooting flow

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External earpiece troubleshooting

Troubleshooting flow

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Vibra troubleshooting

Troubleshooting flow

Baseband manual tuning guide

Certificate restoring for BB5.0 products

Context

This procedure is performed when the device certificate is corrupted for some reason.

All tunings (RF & Baseband, UI) must be done after performing the certificate restoring procedure.

The procedure for certificate restoring is the following:

• Flash the phone with the latest available software using FPS-8 or FPS-10.

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Note: USB flashing does not work for a dead BB5.0 phone.

• Create a request file.

• Send the file to Nokia by e-mail. Use the following addresses depending on your location:

• APAC: sydney.service@nokia.com

• CHINA: repair.ams@nokia.com

• E&A: salo.repair@nokia.com

• AMERICAS: fls1.usa@nokia.com

• When you receive a reply from Nokia, carry out certificate restoring.

• Tune the phone completely.

Note: SX-4 smart card is needed.

• If the phone resets after certificate restoring, reflash the phone again.

Required equipment and setup:

•

Phoenix

service software v 2004.39.7.70 or newer.

• The latest phone model specific

Phoenix

data package.

• PKD-1 dongle

• SX-4 smart card (Enables BB5.0 testing and tuning features)

• External smart card reader

Note: The smart card reader is only needed when FPS-8 is used. FPS-10 has an integrated smart card

reader.

• Activated FPS-8 flash prommer OR FPS-10 flash prommer

• Flash update package 03.18.004 or newer for FPS-8 or FPS-10 flash prommers

• CU-4 control unit

• USB cable from PC USB Port to CU-4 control unit

• Phone model specific adapter for CU-4 control unit

• PCS-1 cable to power CU-4 from external power supply

• XCS-4 modular cable between flash prommer and CU-4

Note: CU-4 must be supplied with +12 V from an external power supply in all steps of certificate

restoring.

Steps

1. Program the phone software.

i Start

Phoenix

and login. Make sure the connection has been managed correctly for FPS-8 or FPS-10.

ii Update the phone MCU software to the latest available version.

If the new flash is empty and the phone cannot communicate with

Phoenix

, reflash the phone.

iii Choose the product manually from File→Open Product , and click OK.

Wait for the phone type designator (e.g. “RM-1” ) to be displayed in the status bar.

iv Go to Flashing→SW Update and wait until

Phoenix

reads the product data as shown in the following

picture.

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Product is automatically set according to the phone support module which was opened manually,

but the flash files cannot be found because the correct data cannot be read from the phone

automatically.

Code must be chosen manually, it determines the correct flash files to be used. Please choose the

correct product code (can be seen in the phone type label) from the dropdown list.

Flash Type must be set to Phone as Manufactured.

v To continue, click Start.

Progress bars and messages on the screen show actions during phone programming, please wait.

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Programming is completed when

Flashing Completed

message is displayed.

The product type designator and MCU SW version are displayed in the status bar.

vi Close the

SW Update

window and then choose File→Close Product .

2. Create a

Request

file.

For this procedure, you must supply +12 V to CU-4 from an external power supply.

i To connect the phone with

Phoenix

, choose File→Scan Product .

ii Choose Tools→Certificate Restore .

iii To choose a location for the request file, click Browse.

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iv Name the file so that you can easily identify it, and click Open.

The name of the file and its location are shown.

v To create the

Request

file, click Start.

vi When the file for certificate restore has been created, send it to Nokia as an e-mail attachment.

3. Restore certificate.

For this procedure, you must supply +12 V to CU-4 from an external power supply.

i Save the reply file sent by Nokia to your computer.

ii Start

Phoenix

service software.

iii Choose File→Scan Product .

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iv From the Tools menu, choose Certificate Restore and select Process a response file in the

Action

pane.

v To choose the location where response file is saved, click Browse.

vi Click Open.

The name of the file and the path where it is located are shown.

vii To write the file to phone, click Start.

Next actions

After a successful rewrite, you must retune the phone completely by using

Phoenix

tuning functions.

Important: Perform all tunings: RF, BB, and UI.

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Energy management calibration

Prerequisites

Energy Management (EM) calibration is performed to calibrate the setting (gain and offset) of AD converters

in several channels (that is, battery voltage, BSI, battery current) to get an accurate AD conversion result.

Hardware setup:

• An external power supply is needed.

• Supply 12V DC from an external power supply to CU-4 to power up the phone.

• The phone must be connected to a CU-4 control unit with a product-specific flash adapter.

Steps

1. Place the phone to the docking station adapter (CU-4 is connected to the adapter).

2. Start

Phoenix

service software.

3. Choose File→ Scan Product.

4. Choose Tuning→Energy Management Calibration.

5. To show the current values in the phone memory, click Read, and check that communication between

the phone and CU-4 works.

6. Check that the CU-4 used check box is checked.

7. Select the item(s) to be calibrated.

Note: ADC calibration has to be performed before other item(s). However, if all calibrations are

selected at the same time, there is no need to perform the ADC calibration first.

8. Click Calibrate.

The calibration of the selected item(s) is carried out automatically.

The candidates for the new calibration values are shown in the

Calculated values

column. If the new

calibration values seem to be acceptable (please refer to the following "Calibration value limits" table),

click Write to store the new calibration values to the phone permanent memory.

Table 15 Calibration value limits

Parameter Min. Max.

ADC Offset -20 20

ADC Gain 12000 14000

BSI Gain 1100 1300

VBAT Offset 2400 2650

VBAT Gain 19000 23000

VCHAR Gain N/A N/A

IBAT (ICal) Gain 7750 12250

9. Click Read, and confirm that the new calibration values are stored in the phone memory correctly. If the

values are not stored to the phone memory, click Write and/or repeat the procedure again.

10. To end the procedure, close the

Energy Management Calibration

window.

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Page 6 –48 COMPANY CONFIDENTIAL Issue 1

7 — RF troubleshooting

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 7 –1

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Page 7 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

General RF troubleshooting...................................................................................................................................7–5

General RF troubleshooting.............................................................................................................................7–5

RF key components...........................................................................................................................................7–6

Auto tuning for BB5.0............................................................................................................................................7–6

GSM Receivers.........................................................................................................................................................7–7

GSM RX Troubleshooting...................................................................................................................................7–7

GSM Transmitters....................................................................................................................................................7–8

GSM900/1800/1900 TX Troubleshooting........................................................................................................7–8

WCDMA Receiver...................................................................................................................................................7–10

WCDMA RX Troubleshooting...........................................................................................................................7–10

WCDMA Transmitter.............................................................................................................................................7–11

WCDMA TX Troubleshooting...........................................................................................................................7–11

Synthesizer troubleshooting ..............................................................................................................................7–12

PIHI (N7500) Troubleshooting.......................................................................................................................7–12

Synthesizer Troubleshooting.........................................................................................................................7–13

Bluetooth and FM radio.......................................................................................................................................7–15

Bluetooth troubleshooting............................................................................................................................7–15

FM radio troubleshooting...............................................................................................................................7–16

List of Figures

Figure 46 Auto tuning concept with CMU200......................................................................................................7–7

Figure 47 GSM900/1800/1900 RX test points......................................................................................................7–8

Figure 48 GSM900/1800/1900 TX test points......................................................................................................7–9

Figure 49 WCDMA RX test points.........................................................................................................................7–11

Figure 50 WCDMA TX test points.........................................................................................................................7–12

Figure 51 PIHI (N7500) test points.....................................................................................................................7–13

Figure 52 Synthesizer test points.......................................................................................................................7–14

Figure 53 Troubleshooting diagram: Bluetooth...............................................................................................7–15

Figure 54 Troubleshooting diagram: FM radio.................................................................................................7–16

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General RF troubleshooting

Most RF semiconductors are static discharge sensitive

Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or

"LF".

• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for

example HP54006A. (Note that when measuring with the 500 ohm probe the signal will be around 20 dB

attenuated. The values in the following will have these 20 dB subtracted and represent the real value seen

on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration

when calibrating the test system.

•LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe

used in the following is 10 Mohm/8pF passive probe. If using another probe then bear in mind that the

voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when

measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when

realigning the phone.

So ESD protection must be applied during repair (ground straps and ESD soldering irons). RF IC N7500 and

Frond end module (N7520) are moisture sensitive so parts must be pre-baked prior to soldering. Apart from

key-components described in this document there are a lot of discrete components (resistors, inductors and

capacitors) for which troubleshooting is done by checking if soldering of the component is done properly

and checking if the component is missing from PWB. Capacitors can be checked for short-circuiting and

resistors for value by means of an ohmmeter, but be aware in-circuit measurements should be evaluated

carefully. In the following both the name EGSM and GSM 900 will be used for the lower band and both PCN

and GSM 1800 will be used for the upper band.

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RF key components

Auto tuning for BB5.0

This phone can be tuned automatically.

Autotune is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and

measurements of RX and TX. The results are displayed and logged in a result file, if initiated.

Hardware set up

Hardware requirements for auto tuning:

• PC (Windows 2000/XP) with GPIB card

• Power supply

• Product specific module jig

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• Cables: XRF-1 (RF cable), USB cable, GBIP cable and DAU-9S

• Signal analyser (TX), signal generator (RX) and RF-splitter

one device including all.

Figure 46 Auto tuning concept with CMU200

Phoenix preparations

Install the phone specific data package, for example

RM-123/145_dp_1.78_sw_sh3.26.exe

. This defines phone

specific settings..

Auto tuning procedure

1 Make sure the phone (in the jig) is connected to the equipment. Else, some menus will not be shown in

Phoenix.

2 To go to autotune, select

Tuning (Alt-U)

Auto-Tune (Alt-A)

from the menu.

3 Start autotuning, clicking the

Tune

button.

GSM Receivers

GSM RX Troubleshooting

Preparations

Make the following settings:

Setting GSM900 GSM1800 GSM1900

Phoenix RF Control

Phoenix channel

Continues RX and AGC gain step 14

37 700 661

Signal generator to

antenna connector

942.46771 MHz

(67.71kHz offset) at

-60dBm

1842.86771MHz

(67.71kHz offset) at

-60dBm

1960.06771MHz

(67.71kHz offset) at

-60dBm

Spectrum analyzer

Centre frequency

RBW=500kHz, VBW=500kHz, span=20kHz

942MHz 1840MHz 1960MHz

Check the following

Check the levels in the steps below.

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NO. Signal Name Test point GSM900 GSM1800 GSM1900

1RXIP (out) J7515 124mVpp,

730mVDC

106mVpp,

760mVDC

100mVpp,

780mVDC

2 RXQP (OUT) J7517 124mVpp,

730mVDC

106mVpp,

690mVDC

100mVpp,

690mVDC

3 VC1_TXFEM J7530 0V 0V 0V

4 VC2_TXFEM J7531 0V 2.7VDC 2.7VDC

5 VC3_TXFEM J7532 0V 0V 2.7VDC

1 Measure RXIP

and RXQP

2 Measure front end module control signal voltages

3, 4 and 5

Figure 47 GSM900/1800/1900 RX test points

GSM Transmitters

GSM900/1800/1900 TX Troubleshooting

Preparations

Make the following settings:

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Setting GSM900 GSM1800 GSM1900

Phoenix RF Control

Phoenix Tx Power level

Operational mode = Burst

Tx data type = Random

10 5 5

Check the following

Check the voltages in the steps below.

NO. Signal Name Test point GSM900 GSM1800 GSM1900

1V_Det_GSM J7533 730mVDC 660mVDC 690mVDC

2 PA_supply-VBAT C7521 3.8VDC 3.8VDC 3.8VDC

3 RF level-ANT_GSM Conn. 23dBm 20dBm 20dBm

4 Sw cont-VC1_TXFEM J7530 2.75VDC 2.75VDC 2.75VDC

5 Sw con-VC2_TXFEM J7531 0V 2.75VDC 2.75VDC

6 Sw con-VC3_TXFEM J7532 2.75VDC 2.75VDC 2.75VDC

7 Tx-1 R7522 897.4MHz/-28.7

dBm

- -

Figure 48 GSM900/1800/1900 TX test points

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WCDMA Receiver

WCDMA RX Troubleshooting

Preparations

Set Phoenix to RF local mode WCDMA RX.

Equipment/Settinig Unit

Phoenix

WCDMA FDD

RF channel 2140MHz ~10700

Frequency offset +0.000kHz

Output channel power -60dBm

P-sch~ -2dB

S-sch~ -2dB

P-cc pch~ -2dB

DPDch~ -7dB

AGCMod* Algorithm

Channel* 10700

BB AGC* 0dB

Spectrum analyzer*

Span ~ 20MHz

Centre frequency 2140MHz

VBW 500kHz

RBW 500kHz

Output channel power -30dB

RF AH ~ 30dB

Check the following

Check the levels in the steps below.

NO. Signal Name Test point Check

1PXIP (out) J7515 720mVpp single ended

2 RXQP (OUT) J7517 720mVpp single ended

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Figure 49 WCDMA RX test points

WCDMA Transmitter

WCDMA TX Troubleshooting

Preparations

Set Phoenix to RF local mode WCDMA TX (Channel 9737, 0 dBm output).

Check the following

Check the levels in the steps below.

NO. Signal Name Test point Check

1WTXDET C7544 115mVDC

2 VBAT C7542 3.82VDC

3 PA supply - Vreg C7543 ~1.3 VDC @ 0dBm

4 RF level - ANT_WCDMA X8003 0dBm on antenna

6 WDET C7545 2.75 VDC

7 DAC101 R7541 300 mVDC

8 DAC201 J7538 1.5 VDC

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Figure 50 WCDMA TX test points

Synthesizer troubleshooting

PIHI (N7500) Troubleshooting

Preparations

Set Phoenix to RF local mode RX burst.

Check the following

Check the voltages in the steps below.

NO. Signal Name Test point Check GSM900

Suppliers

1 VBATRF (in) L7500 3.8VDC

2 VR1_RX (out) C7503 2.8VDC

3 VR1_TX (out) C7502 2.8VDC

4 VR2_TX (out) C7501 2.8VDC

5 VREFRF01 (in)

VB_EXT

R7501 1.36VDC

6 VCP1 (in) C2221 4.76VDC

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Figure 51 PIHI (N7500) test points

Synthesizer Troubleshooting

Preparations

Set Phoenix to RF local mode RX continuous.

Check the following

Check the levels in the steps below.

NO. Signal Name Test point Check

VCTCXO

1 VXO (in) C7504 2.4VDC

2 OSCIN G7500 85mVpp at 38.4MHz

3 AFC (in) R7500 1.2VDC

VCO

4 VVCO_EXT R7505 2.72VDC

5 VCO Output T7501 -17dBm at 3769.6MHz

6 VCO Control C7510 2.7VDC

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Figure 52 Synthesizer test points

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Bluetooth and FM radio

Bluetooth troubleshooting

Troubleshooting flow

Figure 53 Troubleshooting diagram: Bluetooth

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FM radio troubleshooting

Troubleshooting flow

Figure 54 Troubleshooting diagram: FM radio

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8 — System Module

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 8 –1

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Page 8 –2 COMPANY CONFIDENTIAL Issue 1

Table of Contents

Introduction............................................................................................................................................................8–5

Block diagram....................................................................................................................................................8–5

Energy management..............................................................................................................................................8–7

Battery and interface........................................................................................................................................8–7

Normal and extreme voltages.........................................................................................................................8–7

Power key and system power-up....................................................................................................................8–8

Modes of operation...........................................................................................................................................8–8

Power distribution............................................................................................................................................8–9

Clocking scheme................................................................................................................................................8–9

USB, SIM, MMC.......................................................................................................................................................8–10

USB....................................................................................................................................................................8–10

SIM interface....................................................................................................................................................8–10

µSD card interface...........................................................................................................................................8–11

Camera...................................................................................................................................................................8–11

Camera.............................................................................................................................................................8–11

User interface........................................................................................................................................................8–12

Display interface..............................................................................................................................................8–12

Keyboard and side keys..................................................................................................................................8–12

Backlight and illumination.............................................................................................................................8–13

Audio concept.......................................................................................................................................................8–14

Audio hardware architecture.........................................................................................................................8–14

Internal microphone.......................................................................................................................................8–15

External microphone.......................................................................................................................................8–16

Internal earpiece.............................................................................................................................................8–16

Internal speaker..............................................................................................................................................8–17

External earpiece.............................................................................................................................................8–17

Vibra circuitry..................................................................................................................................................8–18

Pop-portTM connector....................................................................................................................................8–18

Bluetooth and FM radio.......................................................................................................................................8–19

Bluetooth.........................................................................................................................................................8–19

FM radio............................................................................................................................................................8–20

RF description.......................................................................................................................................................8–21

Introduction to receiver functionality...........................................................................................................8–21

WCDMA receiver functionality........................................................................................................................8–21

GSM receiver functionality..............................................................................................................................8–21

Introduction to transmitter functionality.....................................................................................................8–21

WCDMA transmitter functionality..................................................................................................................8–21

GSM transmitter functionality........................................................................................................................8–22

Frequency synthesizers..................................................................................................................................8–23

Regulators........................................................................................................................................................8–23

List of Tables

Table 16 Nominal voltages....................................................................................................................................8–7

Table 17 Pop-PortTMpin and signal table..........................................................................................................8–18

List of Figures

Figure 55 Block diagram........................................................................................................................................8–6

Figure 56 Battery pin order...................................................................................................................................8–7

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Figure 57 Power regulator diagram.....................................................................................................................8–9

Figure 58 Clocking scheme..................................................................................................................................8–10

Figure 59 SIM interface........................................................................................................................................8–11

Figure 60 LCD module..........................................................................................................................................8–12

Figure 61 Audio block diagram...........................................................................................................................8–15

Figure 62 Internal microphone circuitry............................................................................................................8–16

Figure 63 External microphone circuitry (Pop-Port connects to the right side)............................................8–16

Figure 64 Internal earpiece circuitry..................................................................................................................8–16

Figure 65 Internal speaker circuitry...................................................................................................................8–17

Figure 66 External earpiece circuitry (system connector connected on the right).......................................8–17

Figure 67 Vibra circuitry......................................................................................................................................8–18

Figure 68 System connector pin layout.............................................................................................................8–18

Figure 69 Bluetooth interface.............................................................................................................................8–20

Figure 70 FM interface.........................................................................................................................................8–20

Figure 71 GSM transmitter...................................................................................................................................8–22

Figure 72 RF supply connections from the BB mixed mode ASIC....................................................................8–24

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Introduction

Block diagram

RAP3G is the main digital baseband ASIC in the phone. It contains functionality for both WCDMA and GSM EDGA

and the Golden Eye is used as a co-processor.

Retu is mainly the audio ASIC in the phone and Tahvo is basically the energy management controller for the

phone.

Bluetooth and stereo FM Radio is integrated in one single ASIC.

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Figure 55 Block diagram

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Energy management

Battery and interface

The phone i powered by a 3-pole BP-6M S-pack 1100 mAh battery. The three poles are named VBAT, BSI and

GND where the BSI line is used to recognize the battery capacity. This is done by means of an internal battery

pull down resistor.

Figure 56 Battery pin order

Battery temperature is estimated by measuring separate battery temperature NTC via the BTEMP line, which

is located on the main PWB, at a place where the phone temperature is most stabile.

The connection from the charger connector to the charger is established via a charger adaptor type CA-44.

For service purposes, the device SW can be forced into local mode by using pull down resistors connected to

the BSI line.

Normal and extreme voltages

Energy management is mainly carried out in the two Application Specific Integrated Circuits (ASICs) RETU and

TAHVO. These two circuits contains a number of regulators. In addition there are some external regulators

too.

In the table below normal and extreme voltages are shown when a BP-6M S-pack battery is used.

Table 16 Nominal voltages

Voltage Voltage [V] Condition

General Conditions

Nominal voltage 3.9

Lower extreme voltage 3.215

Higher extreme voltage

4.23(fast charging)

HW Shutdown Voltages

Vmstr+ 2.1 ± 0.1 Off to on

Vmstr- 1.9 ± 0.1 On to off

SW Shutdown Voltages

Sw shutdown 3.1 In call

Sw shutdown 3.2 In idle

Min Operating Voltage

Vcoff+ 2.9 ± 0.1 Off to on

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Voltage Voltage [V] Condition

Vcoff- 2.6 ± 0.1 On to off

Power key and system power-up

When the battery is placed in the phone the power key circuits are energized. When the power key is pressed,

the system boots up (if an adequate battery voltage is present).

Power down can be initiated by pressing the power key again (the system is powered down with the aid of

SW). The power key is connected to RETU ASIC via PWRONX signal.

Different power-up conditions

Power up can be caused by the following reasons:

• Power key is pressed

• Charger is connected

• RTC alarm occurs

• MBUS wake-up

After that:

• RETU activates sleep clock and VANA, VDRAM, VIO and VR1 regulators.

• Voltage appearing at RETU’s RSTX pin is used for enabling TAHVO ASIC.

• TAHVO enables VCORE regulator and its internal RC-oscillator (600kHz).

• VCTCXO regulator is set ON and RF clock (main system clock) is started to produce.

• RETU will release PURX ~ 16ms after power up is enabled (the RF clock is then stable enough).

• Synchronizing clock (2.4MHz) for TAHVO is started to be produced. After PURX is released and two rising

edges of 2.4MHz synchronous clock have been detected in SMPSClk input TAHVO is starting to use that

instead of 600kHz internal RC-oscillator.

• HW start-up procedure has been finalized and the system is up and running. Now it is possible for SW to

switch ON other needed regulators.

Modes of operation

Mode Description

NO_SUPPLY (dead) mode means that the main battery is not present or its voltage is too low (below

RETU master reset threshold) and that the back-up battery voltage is too low.

BACK_UP The main battery is not present or its voltage is too low but back-up battery voltage is

adequate and the 32kHz oscillator is running (RTC is on).

PWR_OFF In this mode (warm), the main battery is present and its voltage is over RETU master

reset threshold. All regulators are disabled, PurX is on low state, the RTC is on and the

oscillator is on. PWR_OFF (cold) mode is almost the same as PWR_OFF (warm), but the

RTC and the oscillator are off.

RESET RESET mode is a synonym for start-up sequence. RESET mode uses 32kHz clock to count

the REST mode delay (typically 16ms).

SLEEP SLEEP mode is entered only from PWR_ON mode with the aid of SW when the system’s

activity is low.

FLASHING FLASHING mode is for SW downloading.

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Power distribution

The power distribution is shown in the diagram below. Current consumption is measured via the Current

Gauge Resistor and the battery voltage is stabilized by means of a capacitor. The tables below specifies the

voltages.

Figure 57 Power regulator diagram

Clocking scheme

In BB5.0, two main clocks are provided to the system: 38.4MHz RF clock produced by VCTCXO in RF section

and 32.768kHz sleep clock produced by RETU with an external crystal.

32k Sleep Clock is always powered on after startup. Sleep clock is used by RAP3G and OMAP for low-power

operation.

SMPS Clk is 2.4MHz clock line from RAP3G to TAHVO. In deep sleep mode, when VCTCXO is off, this signal is

set to '0'-state.

BT Clk is 38.4MHz signal from HINKU ASIC to BT module.

CLK600 is 600KHz signal from TAHVO to APE VCORE SMPS. The clock source is internal RC oscillator in TAHVO

(during the power-up sequence) or RAP3G SMPS Clk.

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Figure 58 Clocking scheme

USB, SIM, MMC

USB

USB (Universal Serial Bus) provides a wired connectivity between a USB host PC and peripheral devices.

USB is a differential serial bus for USB devices. USB controller supports USB specification revision 2.0 with full

speed USB (12 Mbps). The device is connected to the USB host through the system connector. The USB bus is

hot plugged capable, which means that USB devices may be plugged in/out at any time.

SIM interface

The device has one SIM (Subscriber Identification Module) interface. It is only accessible if battery is removed.

The SIM interface consists of an internal interface between RAP and EM ASIC (N2200), and of an external

interface between N2200 and SIM contacts.

The SIM IF is shown in the following figure:

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Figure 59 SIM interface

The EM ASIC handles the detection of the SIM card. The detection method is based in the BSI line. Because of

the location of the SIM card, removing the battery causes a quick power down of the SIM IF.

The EM ASIC SIM1 interface supports both 1.8 V and 3.0 V SIM cards. The SIM interface voltage is first 1.8 V

when the SIM card is inserted, and if the card does not response to the ATR a 3 V interface voltage is used.

µSD card interface

The µSD card is connected to the engine by an external level shifter and ESD protection filter. Supplied

voltages:

• VMMC: 2.85 V (from level shifter)

• VIO: 1.8 V (from Retu)

The card removal is detected by a push detect switch.

Camera

The camera uses a 2.0 megapixel camera module with a sensor resolution of 1600 x 1200.

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User interface

Display interface

Display module mechanical concept

Figure 60 LCD module

Display features:

• 262 k colours

• Partial display function Power saving by pausing display process on part of the screen.

• Built-in RAM capacity 176rows×208lines×16bit = 585,728 bits

The display has two different operating modes:

1 Normal mode, Full screen, 262k colours

2 Normal Partial mode, 262k colours but only part of the display is active

The interconnection between the LCD module and the Nokia engine is implemented with a 24-pin board-to-

board connector.

The display module does not require any tuning in service.

Keyboard and side keys

The side keys are placed on the main PWB. The numerical keys and the navigation keys are included in the

UI flex on top of the phone.

The numerical keys and the side keys are included in the 4x4 scan matrix. The navigation keys are individually

routed.

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Backlight and illumination

There is backlight illuminating the display.

Behind the keypad there is an electroluminescent (EL) foil, giving the keys a blue lamaninate. The EL foil

backlight the keys with blue light for numeric soft keys and green/red for Send/End keys.

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Audio concept

Audio hardware architecture

The functional core of the audio hardware is built around two ASICs: RAPGSM engine ASIC and the mixed-

signal ASIC Retu.

Retu provides an interface for the transducers and the accessory connector. Integrated hands free stereo

speakers are driven by a D-class audio amplifier.

There are four audio transducers:

• Dynamic earpiece

• Two dynamic speakers

• Microphone module

In addition to the audio transducers, Retu also provides an output for the dynamic vibra component.

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Figure 61 Audio block diagram

Internal microphone

Internal microphone is used for HandPortable (HP) and Internal HandsFree (IHF) call modes.

An analogue electret microphone is connected to N2200 Mic1P and Mic1N inputs via asymmetric electrical

connection.

The microphone is biased by N2200 MicB1 bias voltage output.

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Figure 62 Internal microphone circuitry

External microphone

Galvanic accessories are connected to the system connector.

The accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated

phone accessories.

External microphone circuitry is biased by N2200 MicB2 bias voltage output. The circuitry provides a

symmetrical connection for the microphone from the system connector connections, XMICN and XMICP, to

N2200 inputs, Mic2P and Mic2N.

Figure 63 External microphone circuitry (Pop-Port™ connects to the right side)

Internal earpiece

The internal earpiece is used in the HandPortable (HP) call mode. A dynamic 8 mm earpiece capsule is

connected to N2200 differential outputs EarP and EarN.

Figure 64 Internal earpiece circuitry

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Internal speaker

The internal speaker is used in Internal HandsFree (IHF) call mode.

A dynamic 16 mm speaker is connected to N2200 outputs HFSpP and HFSpN.

The IHF amplifier integrated in N2200 is a Digital Pulse Modulated Amplifier (DPMA).

Figure 65 Internal speaker circuitry

External earpiece

All galvanic accessories are connected to the system connector.

The accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated

phone accessories.

Figure 66 External earpiece circuitry (system connector connected on the right)

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Vibra circuitry

The vibra circuitry is used for the vibra-alarm function.

The vibra motor is connected to the EM ASIC (N2200) VibraP and VibraN Pulse Width Modulated (PWM) outputs.

Figure 67 Vibra circuitry

Pop-portTM connector

Pop-PortTM connector provides a fully differential 4–wire stereo line-level output connection and fully

differential 2-wire mono line-level or microphone level input connection.

The handsfree driver in Retu is meant for the headset.

The output is driven in a fully differential mode. In the fully differential mode, the handsfree pin is the

negative output and the HFCM pin is the positive output. The gain of the handsfree driver in the differential

mode is 6 dB.

The earpiece and headset signals are multiplexed so that the outputs cannot be used simultaneously.

Figure 68 System connector pin layout

Table 17 Pop-PortTMpin and signal table

Pin #/ Signal

name Signal

description Spectral range Voltage/

Current levels Max or

nominal serial

impedance

Notes

1/ Charge V Charge DC 0-9V/ 0.85A

2/ GND Charge GND - 0.85A 100mΩ (PWB+

conn.)

3/ ACI ACI 1kbits/s Digital 0 / 47Ω Insertion &

removal

detection

2.5-2.78V

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Pin #/ Signal

name Signal

description Spectral range Voltage/

Current levels Max or

nominal serial

impedance

Notes

4/ Vout DC out DC 2.78V 70 mA 100mΩ (PWB+

conn.)

200mW

2.5V 90mA

5/USB Vbus USB power 4.375-5.25VDC 115.2kbit

6/Fbus_RX/USB

D+

Data

connection

115.2kbit

7/Fbus_TX/USB

D+

Data

connection

115.2kbit

8/Data GND USB Ground 115.2kbit

9 / XMIC N Audio in 300-8k 1Vpp &

2.5-2.78VDC

10 / XMIC P Audio in 300-8k 1Vpp &

2.5-2.78VDC

11 / XEAR N Audio out 20-20k 1Vpp 10Ω

12 / XEAR P Audio out 20-20k 1Vpp 10Ω

13 / XEAR R N Audio out 20-20k 1Vpp 10Ω Not conn. in

mono

14 / XEAR R P Audio out 20-20k 1Vpp 10Ω Not conn. in

mono

Bluetooth and FM radio

Bluetooth

Bluetooth provides a fully digital link for communication between a master unit (the phone) and one or more

slave units (e.g. a wireless headset). Data and control interface for a low power RF module is provided by the

module.

The Bluetooth is physically integrated with the FM radio into one single module. From a functional point of

view they, however, have nothing in common.

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Figure 69 Bluetooth interface

The Bluetooth has a separate built in antenna and is powered by VBAT and the regulated voltage VIO. For

audio applications the Bluetooth has a PCM data bus. In addition a UART (universal asynchronous receiver/

transmitter) is used for data communication and controls.

FM radio

The FM radio is physically integrated with the Bluetooth into one single module. From a functional point of

view they, however, have nothing in common.

Figure 70 FM interface

The FM radio is an integrated circuit, controlled by MCU software through a serial bus interface. The wires of

the headset are used as poles of the antenna, and no other antenna is needed for FM radio reception.

In addition to the Bluetooth unit the FM radio is provided with LDO (low drop out) voltage 2V8_FM_LCD.

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The radio has an automatic band search function, which can search for a strong write/read signal from a

certain frequency. When this is found, data is transmitted to the radio. When the signal strength is low, the

RETU can read data, which is available until the signal is strong again.

RF description

Introduction to receiver functionality

Receiver functions are implemented in an RF ASIC.

The receiver is a linear direct conversion receiver consisting of separate front ends (LNA (Low Noise Amplifier)

and demodulator) for each supported system. After the demodulators, the signal paths are combined to one

common BB path.

WCDMA receiver functionality

In the WCDMA mode, the received signal is fed from the antenna to a duplex filter. After the duplex filter the

signal goes via a balun to an LNA (Low Noise Amplifier) residing in N7500. From the LNA, the signal goes

trough a band pass filter.

After filtering, the signal goes to the down conversion mixer, which converts the signal to baseband I and Q

signals. At the BB frequency the signal is amplified, and fed to a low pass filter. The Rx channel filter must be

calibrated with an automatic routine whenever the Rx ASIC IC is changed to a phone.

In the WCDMA mode, the corner frequency of the filter is set to approximately 2.1 MHz. The filter is followed

by an AGC (Automatic Gain Control) amplifier with an adjustable gain. The signal is further amplified before

it is fed to balanced analogue IQ output pins. The analogue output pins are accompanied by reference voltage

output, which sets the DC level for the AD converter in the BB ASIC RAP.

The last stage of the RF Rx chain is an output buffer which feeds the signal and a reference voltage (VREFCM)

to the BB ASIC.

GSM receiver functionality

As GSM Rx branches are functionally identical, the following description is applicable to all of them.

The received signal goes from the GSM antenna to the antenna switch module.

The antenna switch module is followed by integrated LNAs residing in the Rx ASIC.

The LNAs are followed by demodulators which downconvert the signal to baseband I and Q signals.

After the down conversion mixer, the Rx chain is similar to the WCDMA Rx. The channel select filter is set to

115 kHz in the GSM mode.

Introduction to transmitter functionality

Transmitter functions are implemented in an RF ASIC. The ASIC contains a BB frequency low pass filter, which

is tunable according to the signal bandwidth of the system in use.

In addition, the ASIC contains separate RF paths comprising a final frequency IQ modulator and VGA amplifiers.

WCDMA transmitter functionality

In the transmitter side, an analogue I/Q modulated signal is received from digital baseband into an RF ASIC

and fed through a low pass filter. After the filter the signal is fed to the IQ modulator, which converts the

signal to final Tx frequency. There are two separate I/Q modulators: one for WCDMA and another for GSM

signals. The signal then exits the RF ASIC via a balanced line. Next, the signal is band pass filtered by a SAW

filter before it is fed to the WCDMA PA module. After the PA, the transmitted WCDMA signal is fed through an

isolator and a duplex filter to the antenna.

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WCDMA power control

WCDMA Tx power control is accomplished by the two VGA amplifier stages in the Tx ASIC.

The VGAs have a common temperature compensation circuit and one voltage mode analogue input for gain

control (TXC).

Another function of the detector voltage is to steer the DC/DC converter, which is providing a variable supply

voltage for the WCDMA PA.

WCDMA PA module

The WCDMA PA is housed in a separate module having:

• a variable supply voltage input for the amplifier stages (Vcc11),

• a battery supply voltage for the bias circuits (Vcc12),

• and two bias current inputs.

Bias currents are generated by 5-bit DA converters in the RF ASIC.

If a different manufacturer's PA is changed to the phone, this setting must be set again.

PA DC/DC converter

The control of the DC/DC converter is fed back from the power detector circuit.

GSM transmitter functionality

An RF ASIC receives an analogue IQ modulated signal from digital BB, which is first low pass filtered with

filter corner frequency set to approximately 200 kHz. After the filter, the signal is routed to the GSM modulator.

The amplifier gives 40 dB of power control dynamic range.

After the VGA stage the signal exits the RF ASIC. In case of GSM1800/1900 the signal goes via a balun to the

GSM PA module. In case of GSM900, the PA module is preceded by a SAW filter. After the filter, the signal is

fed to the GSM front end module (FEM). Finally, the signal is routed via FEM to the antenna.

Figure 71 GSM transmitter

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GSM power control

A closed control loop comprise an integrated power detector (in PA module) and an error amplifier. The error

amplifier resides in N7500, and it controls the transmitter power of GSM.

GSM PA module

A single GSM/EDGE PA module contains two separate amplifier chains, one for GSM900 and another for

GSM1800/1900. Both amplifiers have a battery supply connection and two bias current inputs.

Frequency synthesizers

RF has separate synthesizers for Rx and Tx. Both synthesizers consist of:

• PLL (Phase-Locked Loop)

• loop filter

• VCO (Voltage Controlled Oscillator)

• balun

The VCO frequencies are locked by PLLs into a reference oscillator, VCTCXO (Voltage Controlled Temperature

Compensated Crystal Oscillator).

The PLLs are located in RF ASICs and controlled via RFBus.

Reference oscillators

A 38.4MHz VCTCXO is used as a reference oscillator for the frequency synthesizers.

Regulators

RF ASIC contain integrated regulators to supply regulated voltages for their internal circuitry and other RF

parts. Rx VCO supply is got via a switch from an RF ASIC VR1 regulator. VCO can be switched on and off by

controlling the switch via RFBus.

Supply voltage for the VCTCXO is provided by a BB mixed mode ASIC. The same supply is used for reference

clock input buffers, output buffers and for the digital control blocks of both RF ASICs.

Other supplies, like 4.7 V supply for PLL charge pumps and bias reference (VREFRF01) are also provided by

the BB mixed mode ASIC.

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Figure 72 RF supply connections from the BB mixed mode ASIC

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9 — Schematics

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page 9 –1

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Table of Contents

Schematics..............................................................................................................................................................9–4

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Schematics

System connector

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RETU, SIM, Audio

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TAHVO and LED/EL driver

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RAPGSM, Memory, µSD

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FM radio, Bluetooth

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Camera

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RF part

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Signal overview

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Component finder

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Glossary

Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page Glossary–1

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A/D-converter Analog-to-digital converter

ACI Accessory Control Interface

ADC Analog-to-digital converter

ADSP Application DPS (expected to run high level tasks)

AGC Automatic gain control (maintains volume)

ALS Ambient light sensor

AMSL After Market Service Leader

ARM Advanced RISC Machines

ARPU Average revenue per user (per month or per year)

ASIC Application Specific Integrated Circuit

ASIP Application Specific Interface Protector

B2B Board to board, connector between PWB and UI board

BB Baseband

BC02 Bluetooth module made by CSR

BIQUAD Bi-quadratic ,type of filter function)

BSI Battery Size Indicator

BT Bluetooth

CBus MCU controlled serial bus connected to UPP_WD2,UEME and Zocus

CCP Compact Camera Port

CDSP Cellular DSP (expected to run at low levels)

CLDC Connected limited device configuration

CMOS Complimentary metal-oxide semiconductor circuit (low power consumption)

COF Chip on Foil

COG Chip on Glass

CPU Central Processing Unit

CSR cambridge silicon radio

CSTN Color Super Twisted Nematic

CTSI Clock Timing Sleep and interrupt block of Tiku

CW Continuous wave

D/A-converter Digital-to-analouge converter

DAC Digital-to-analouge converter

DBI Digital Battery Interface

DBus DSP controlled serial bus connected between UPP_WD2 and Helgo

DCT-4 Digital Core Technology

DMA Direct memory access

DP Data Package

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DPLL Digital Phase Locked Loop

DSP Digital Signal Processor

DtoS Differential to Single ended

EDGE Enhanced data rates for global/GSM evaluation

EGSM Extended GSM

EM Energy management

EMC Electromagnetic compability

EMI Electromagnetic interference

ESD Electrostatic discharge

FCI Functional cover interface

FPS Flash Programming Tool

FR Full rate

FSTN Film compensated super twisted nematic

GND Ground, conductive mass

GPIB General-purpose interface bus

GPRS General Packet Radio Service

GSM Group Special Mobile/Global System for Mobile communication

HF Hands free

HFCM Handsfree Common

HS Handset

HSCSD High speed circuit switched data (data transmission connection faster than GSM)

HW Hardware

I/O Input/Output

IBAT Battery current

IC Integrated circuit

ICHAR Charger current

IF Interface

IHF Integrated hands free

IMEI International Mobile Equipment Identity

IR Infrared

IrDA Infrared Data Associasion

ISA Intelligent software architecture

JPEG/JPG Joint Photographic Experts Group

LCD Liquid Crystal Display

LDO Low Drop Out

LED Light-emitting diode

RM-123; RM-145

Nokia Customer Care Glossary

Page Glossary–4 COMPANY CONFIDENTIAL Issue 1

LPRF Low Power Radio Frequency

MCU Micro Controller Unit (microprocessor)

MCU Multiport control unit

MIC, mic Microphone

MIDP Mobile Information Device Profile

MIN Mobile identification number

MIPS Million instructions per second

MMC Multimedia card

MMS Multimedia messaging service

NTC Negative temperature coefficient, temperature sensitive resistor used as a

temperature sensor

OMA Object management architechture

OMAP Operations, maintenance, and administartion part

Opamp Operational Amplifier

PA Power amplifier

PDA Pocket Data Application

PDA Personal digital assistant

PDRAM Program/Data RAM (on chip in Tiku)

Phoenix Software tool of DCT4.x

PIM Personal Information Management

PLL Phase locked loop

PM (Phone) Permanent memory

PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX Power-up reset

PWB Printed Wiring Board

PWM Pulse width modulation

RC-filter Resistance-Capacitance filter

RF Radio Frequency

RF PopPort TM Reduced function PopPortTM interface

RFBUS Serial control Bus For RF

RSK Right Soft Key

RS-MMC Reduced size Multi Media Card

RSSI Receiving signal strength indicator

RST Reset Switch

RTC Real Time Clock (provides date and time)

RX Radio Receiver

RM-123; RM-145

Glossary Nokia Customer Care

Issue 1 COMPANY CONFIDENTIAL Page Glossary–5

SARAM Single Access RAM

SAW filter Surface Acoustic Wave filter

SDRAM Synchronous Dynamic Random Access Memory

SID Security ID

SIM Subscriber Identity Module

SMPS Switched Mode Power Supply

SNR Signal-to-noice ratio

SPR Standard Product requirements

SRAM Static random access memory

STI Serial Trace Interface

SW Software

SWIM Subscriber/Wallet Identification Module

TCXO Temperature controlled Oscillator

Tiku Finnish for Chip, Successor of the UPP, Official Tiku3G

TX Radio Transmitter

UART Universal asynchronous receiver/transmitter

UEME Universal Energy Management chip (Enhanced version)

UEMEK See UEME

UI User Interface

UPP Universal Phone Processor

UPP_WD2 Communicator version of DCT4 system ASIC

USB Universal Serial Bus

VBAT Battery voltage

VCHAR Charger voltage

VCO Voltage controlled oscillator

VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO Voltage Controlled Crystal Oscillator

Vp-p Peak-to-peak voltage

VSIM SIM voltage

WAP Wireless application protocol

WD Watchdog

XHTML Extensible hypertext markup language

Zocus Current sensor, (used to monitor the current flow to and from the battery)

RM-123; RM-145

Nokia Customer Care Glossary

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Nokia 6233 Rm 145 6234 123 Service Manual 34 V1

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