Nokia 6260 Rm 25 Service Manual

User Manual: Smartphone Nokia 6260 RM-25 - Service manuals and Schematics, Disassembly / Assembly. Free.

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Service Manual RM-25
Nokia 6260 Service Manual Structure
1 General information
2 Parts and layouts
3 Phoenix service software
4 Service tools
- List of Service Tools
5 Disassembly and reassembly instructions
- Disassembly instructions lower block (see the video clips on care point also)
- Disassembly instructions upper block (see the video clips on care point also)
6 Baseband troubleshooting
7 RF troubleshooting
8 Camera module troubleshooting
9 System module
10 Schematics
Glossary

Service Manual

RM-25 (Nokia 6260)

Mobile Terminal

Part No: (9235618 (Issue 2))

Nokia Customer Care

Company Confidential

Amendment Record Sheet

Amendment No Date Inserted By Comments

Original issue 08/2004 MHa, TSa MODE Service Information Pilot

Project

Issue 2 02/2005 J Bryman 01 General information:Variants

(product and modules) corrected

02 Parts and layouts: Exploded view

corrected, lists and layouts updated,

SWAP units added

04 Service tools and concepts:

Prommers FPS-10&11 added, RJ-24

and ST-5 added.

06 Baseband: Tuning baseband

updated

07 RF troubleshooting: Baseband

and digital IQs, RF key components, RX

Calibration, Tuning TX power level,

Test points main board updated.

10 Schematics: 1fsa_11 schematics

added

RM-25

Nokia Customer Care Amendment Record Sheet

Page ii Company Confidential 9235618 (Issue 2)

Introduction to Issue 2

This is the updated issue of the RM-25 service manual. The parts of the manual that have been changed are

presented on the Amendment record sheet. However, some major hardware updates worth mentioning are:

• Latest build is 1fsa_11a

• UEMEK is used instead of UEME (though the name has not been updated in this manual)

• Helgo 85G is used instead of Helgo 86LB

For the latest version of the parts lists, please refer to the Service bulletins.

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Introduction to Issue 2 Nokia Customer Care

9235618 (Issue 2) Company Confidential Page iii

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form without

the prior written permission of Nokia is prohibited.

Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia

Corporation. Other product and company names mentioned herein may be trademarks or tradenames of their

respective owners.

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and

improvements to any of the products described in this document without prior notice.

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,

consequential or indirect damages howsoever caused.

The contents of this document are provided “as is”. Except as required by applicable law, no warranties of any

kind, either express or implied, including, but not limited to, the implied warranties of merchantability and

fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this document.

Nokia reserves the right to revise this document or withdraw it at any time without prior notice.

The availability of particular products may vary by region.

IMPORTANT

This document is intended for use by qualified service personnel only.

RM-25

Nokia Customer Care Copyright

Page iv Company Confidential 9235618 (Issue 2)

Warnings and cautions

Warnings

•IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH

ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT

CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/

MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

• THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES, FOR

EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE WITH

THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE

MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO

BE SUBJECT TO INTERFERENCE.

• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions

• Servicing and alignment must be undertaken by qualified personnel only.

• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.

• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.

• Use only approved components as specified in the parts list.

• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and alignment.

Ensure all cables and wires are repositioned correctly.

Use only approved components as specified in the parts list.

• Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the

measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb

nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.

• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise GSM

or WCDMA PA may be damaged.

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Warnings and cautions Nokia Customer Care

9235618 (Issue 2) Company Confidential Page v

For your safety

QUALIFIED SERVICE

Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES

Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES

When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect

incompatible products.

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Nokia Customer Care For your safety

Page vi Company Confidential 9235618 (Issue 2)

Care and maintenance

This product is of superior design and craftsmanship and should be treated with care. The suggestions below

will help you to fulfil any warranty obligations and to enjoy this product for many years.

• Keep the phone and all its parts and accessories out of the reach of small children.

• Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that

will corrode electronic circuits.

• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.

• Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage

batteries, and warp or melt certain plastics.

• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form

inside, which may damage electronic circuit boards.

• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.

• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.

• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.

• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or

attachments could damage the phone and may violate regulations governing radio devices.

All of the above suggestions apply equally to the product, battery, charger or any accessory.

RM-25

Care and maintenance Nokia Customer Care

9235618 (Issue 2) Company Confidential Page vii

ESD protection

Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing the

phone.

Any product of which the covers are removed must be handled with ESD protection. The SIM card can be replaced

without ESD protection if the product is otherwise ready for use.

To replace the covers ESD protection must be applied.

All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity

discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside any

ESD Protected Area (EPA).

Every repair action involving opening the product or handling the product components must be done under

ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.

For more information and local requirements about ESD protection and ESD Protected Area, contact your local

Nokia After Market Services representative.

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Nokia Customer Care ESD protection

Page viii Company Confidential 9235618 (Issue 2)

Battery information

Note: A new battery's full performance is achieved only after two or three complete charge and

discharge cycles!

The battery can be charged and discharged hundreds of times but it will eventually wear out. When the

operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.

Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers

approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to a

charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged battery

will discharge itself over time.

Temperature extremes can affect the ability of your battery to charge.

For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the

product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory

available for the product). Do not attempt to discharge the battery by any other means.

Use the battery only for its intended purpose.

Never use any charger or battery which is damaged.

Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or pen)

causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example when

you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery or the

connecting object.

Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce the

capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°F). A

phone with a hot or cold battery may temporarily not work, even when the battery is fully charged. Batteries'

performance is particularly limited in temperatures well below freezing.

Do not dispose of batteries in a fire!

Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

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Battery information Nokia Customer Care

9235618 (Issue 2) Company Confidential Page ix

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service

bulletins.

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any

errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing.

Please state:

• Title of the Document + Issue Number/Date of publication

• Latest Amendment Number (if applicable)

• Page(s) and/or Figure(s) in error

Please send to:

NOKIA CORPORATION

Nokia Mobile Phones Business Group

Nokia Customer Care

PO Box 86

FIN-24101 SALO

Finland

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Nokia Customer Care Company Policy

Page x Company Confidential 9235618 (Issue 2)

Nokia 6260 Service Manual Structure

1 General information

2 Parts and layouts

3 Phoenix service software

4 Service tools

5 Disassembly and reassembly instructions

6 Baseband troubleshooting

7 RF troubleshooting

8 Camera module troubleshooting

9 System module

10 Schematics

Glossary

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Nokia 6260 Service Manual Structure Nokia Customer Care

9235618 (Issue 2) Company Confidential Page xi

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Page xii Company Confidential 9235618 (Issue 2)

1 — General information

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Page 1–2 Company Confidential 9235618 (Issue 2)

Table of Contents

Product selection............................................................................................................................................................................1–5

Display and keypad features......................................................................................................................................................1–5

Features.............................................................................................................................................................................................1–5

Hardware features...................................................................................................................................................................1–5

Software features.....................................................................................................................................................................1–6

UI features..................................................................................................................................................................................1–6

Variants (product and modules)...............................................................................................................................................1–7

Mobile enhancements..................................................................................................................................................................1–8

Technical specifications.............................................................................................................................................................1–10

General specifications..........................................................................................................................................................1–10

Main RF characteristics for triple-band phones (Europe)..........................................................................................1–10

Battery endurance.................................................................................................................................................................1–10

Environmental conditions...................................................................................................................................................1–11

List of Tables

Table 1 Imaging...............................................................................................................................................................................1–6

Table 2 Messaging...........................................................................................................................................................................1–6

Table 3 Personal Information Management (PIM)................................................................................................................1–6

Table 4 Synchronization................................................................................................................................................................1–7

Table 5 Phone...................................................................................................................................................................................1–7

Table 6 Games..................................................................................................................................................................................1–7

Table 7 Java.......................................................................................................................................................................................1–7

Table 8 Browser...............................................................................................................................................................................1–7

Table 9 Personalization.................................................................................................................................................................1–7

Table 10 Location Based Services..............................................................................................................................................1–7

Table 11 M-Commerce...................................................................................................................................................................1–7

List of Figures

Figure 1 RM-25.................................................................................................................................................................................1–5

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Product selection

The RM-25 is a triple band transceiver unit designed for the GSM900 (including EGSM), GSM1800 and GSM1900

networks.

Figure 1 RM-25

Display and keypad features

• Large high resolution TFT color display (176x208 pixels) with 65,536 colors.

• 4-way navigation key, 3 selection keys, Application key, Edit key and Clear key.

• State-of-the-art ribless numeric keymat, ITU layout.

• Three side keys: Vol Up, Vol Down and PoC (Push To Talk).

• The PoC key is also the camera capture key

Features

Hardware features

• Three side keys: Vol up, Vol down and PoC (Push To Talk)

• Tri-band GSM E900/1800/1900

• Internal antenna

• Speech codecs: HR, FR, EFR, AMR

• HSCSD: Multiclass 6.

• GPRS: Multislot Class 6, 1+1, 2+2, 2+1, 3+1, class B. Max DL=43.2kbps UL=28.8kbps

• VGA Camera

• 5 MByte internal user memory

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General information Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 1–5

• Memory card slot for additional user memory (1.8V/3V Reduced Size MMC)

•Bluetooth and USB through PopPortTM connector

• Internal vibrator

• Integrated handsfree speaker

• Plug-in SIM (1.8 and 3.0 V)

• Real time clock

• FM Radio

• IrDA

Software features

• Symbian OS 7.0s Platform

• Nokia Series 60 UI : C++ and Java SDKs

UI features

Table 1 Imaging

Capture • Camera with 2 modes (Standard/Night) and x2 Digital Zoom

• Video Recorder supporting QCIF(176x144) and subQCIF(128x96) sizes

Share • Sending via Bluetooth, USB, MMS, e-mail, IrDA

• Media Player

Organize • Media Gallery

• Uploader

Table 2 Messaging

Messaging • Multimedia Messaging with Presentations

• Concatenated SMS (MO/MT)

• Picture Messaging

• E-mail (SMTP, IMAP4, POP3)

• Instant Messaging (Wireless Village)

• T9 predictive text input

Table 3 Personal Information Management (PIM)

PIM • Contacts with thumbnail images

• Presence Enhanced Contact

• Calendar

• To-do list

• Notes

• Voice Recorder

• Calculator

• Clock

• Converter

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Page 1–6 Company Confidential 9235618 (Issue 2)

Table 4 Synchronization

Local (using PC Suite) • Data: Calendar, Contacts

• PC Applications: Microsoft Outlook (97, 98, 2000, 2002), Lotus Organizer

(5.0, 6.0), Lotus Notes (5.0/5.02/6.0)

Remote (with SyncML

server)

Data: Calendar, Contacts

Table 5 Phone

Phone • GSM phase 2+ features

• Voice dialling

• Voice commands

• CPHS spec. (version 4.2)

Table 6 Games

Games None

Table 7 Java

Midp 2.0 • Mobile Media API (JSR 135)

• Bluetooth API (JSR 82)

• Wireless Messaging API (JSR 120)

Table 8 Browser

Browser WAP 2.0 HTML and xHTML browser

Table 9 Personalization

Personalization • Themes

• SP-MIDI, True Tones

Table 10 Location Based Services

Location Based Services Cell broadcast

Table 11 M-Commerce

M-Commerce Mobile Wallet 2.0

Variants (product and modules)

Name Material code/module type Module code

Basic Transceiver, EMEA, silver 0516711

Basic Transceiver, EMEA, black 0518060

Basic Transceiver, Chinese, silver 0518059

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General information Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 1–7

Name Material code/module type Module code

Basic Transceiver, Chinese, black 0518061

UI flex assy 0264017

A2 Cover Assembly, silver 0266026

A2 Cover Assembly, black 0266239

B1 Cover Assembly, silver 0266027

B1 Cover Assembly, black 0266241

RM-25 Mechanical sub-assembly,

silver 0267016

RM-25 Mechanical sub-assembly,

black 0267030

Assembled PWB 0202282 1FS-A

SW Module (basic SW), English 8459669

SW Module (basic SW), Chinese 8459671

Top UI PWB 0202408 1fs-f

Mobile enhancements

Power Type Product code

Battery 760 mAh Li-Ion BL-4C 0670386

Retractable charger AC-1 027xxxx (variants)

Charger ACP-7 0675144

Charger ACP-8 0675195

Charger ACP-9 0675149

Charger ACP-12 0675294

Mobile charger LCH-8 0675231

Mobile charger LCH-9 0675120

Mobile charger LCH-12 0675328

Car accessories Type Product code

Headrest handsfree BHF-1 0694102

Headrest handsfree BHF-3 0694158

Wireless car kit CK-1W 0080774

Wireless car kit CARK112 0085112

Car kit CARK126 008xxxx (variants)

Universal car kit CK-7 008xxxx (variants)

Mobile charger LCH-12 0675328

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Audio Type Product code

Boom Headset HDB-4 0694094

Fashion stereo headset HS-3 0694156

Stereo headset (APAC) HDS-3 0694153 (APAC)

Activity headset HS-8 06941xx (variants)

Headset HS-5 0694121

Retractable headset HS-10 0694126 (EMEA) / 0694125 (APAC)

Inductive loopset LPS-4 0630443

Wireless headset HDW-2 0274141

Wireless clip-on headset HS-3W 0694135

Wireless boom headset HS-4W 0694160

Data accessories Type Product code

Connectivity Cable DKU-2 0730238

Reduced size MMC 4346053

Imaging and lifestyle

accessories

Type Product code

Image viewer SU-2 0263167

Image viewer SU-5 0710003

Image frame SU-4 0710001

Image frame SU-7 0710002

Image Album RX-15 00808xx (variants)

Medallion I RX-3 0630702

Medallion II RX-4 0710008

Kaleidoscope I RX-11 0710009

Messaging accessories Type Product code

Nokia digital pen SU-1B 0710000

Wireless keyboard SU-8 0xxxxxx (variants, codes not ready

before manual deadline)

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General information Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 1–9

Technical specifications

General specifications

Unit Dimension (mm) Weight (g) Volume (cc)

Transceiver with BL-4C

760mAh Li-Ion battery

pack

102x493x21/23 125 109

Main RF characteristics for triple-band phones (Europe)

Parameter Unit

Cellular system GSM/EGSM900,GSM1800/1900

Rx frequency band EGSM900: 925 - 935 MHz

GSM900: 935 - 960MHz

GSM1800: 1805 - 1880 MHz

GSM1900: 1930 - 1990 MHz

Tx frequency band EGSM900: 880 - 890MHz

GSM900: 890 - 915MHz

GSM1800: 1710 - 1785 MHz

GSM1900: 1850 - 1910 MHz

Output power GSM900: +5 … +33dBm/3.2mW … 2W

GSM1800: +0 … +30dBm/1.0mW … 1W

GSM1900: +0 … +30dBm/1.0mW … 1W

Number of RF channels GSM900: 125

GSM1800: 375

GSM1900: 300

Channel spacing 200KHz

Number of Tx power levels GSM900: 15

GSM1800: 16

GSM1900: 16

Battery endurance

Nokia measurements of operation times in GSM900/1800

Talk time

Battery: BL-4C 760mAh Up to 2-4 hours

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Page 1–10 Company Confidential 9235618 (Issue 2)

Standby time

Battery: BL-4C 760mAh Up to 100-150 hours

Note: Variation in operation times will occur depending on SIM card, network settings and usage. Talk

time is increased by up to 30% if half rate is active and reduced by 5% if enhanced full rate is active.

Environmental conditions

Environmental

condition

Ambient temperature Notes

Normal operation 15 oC ... +55 oCSpecifications fulfilled

Reduced performance 55 oC ... +70 oCOperational only for short periods

Intermittent or no

operation

-40 oC ... -15 oC and +70 oC ... +85oCOperation not guaranteed but an

attempt to operate will not damage

the phone

No operation or

storage

<-40 oC and >+85 oCNo storage. An attempt to operate

may cause permanent damage

Charging allowed -15 oC ... +55 oC

Long term storage

conditions

0 oC ... +85 oC

Humidity and water

resistance

Relative humidity range is 5 to 95%.

Condensed or dripping water may

cause intermittent malfunctions.

Protection against dripping water has

to be implemented in (enclosure)

mechanics.

Continuous dampness will cause

permanent damage to the module.

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2 — Parts and layouts

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Table of Contents

Exploded view.................................................................................................................................................................................2–5

Mechanical parts.............................................................................................................................................................................2–6

Swap units........................................................................................................................................................................................2–9

Component parts.........................................................................................................................................................................2–10

Component layouts.....................................................................................................................................................................2–33

List of Tables

Table 12 List of all mechanical parts.........................................................................................................................................2–6

Table 13 Mechanical spare parts list.........................................................................................................................................2–7

Table 14 SWAP units.......................................................................................................................................................................2–9

Table 15 Component parts list for build 1fsa_09a..............................................................................................................2–10

Table 16 Component parts for 1fsa_11a................................................................................................................................2–18

List of Figures

Figure 2 Exploded view of RM-25...............................................................................................................................................2–5

Figure 3 Component layout for 1fsa_09a, bottom.............................................................................................................2–33

Figure 4 Component layout for 1fsa_11a, bottom.............................................................................................................2–34

Figure 5 Component layout for 1fsa_09a, top.....................................................................................................................2–34

Figure 6 Component layout for 1fsa_11a, top.....................................................................................................................2–35

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Exploded view

Figure 2 Exploded view of RM-25

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Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–5

Mechanical parts

Table 12 List of all mechanical parts

* = Not available as spare part

ITEM/CIRCUIT REF. QTY PART NAME

1A2 COVER ASSY

I001* 1 A2 COVER

I002* 1 POWER KEY

I003 1 FUNCTION KEY MAT

I004 2 SCREW 1.8X5

I005 1 LCD SHIELD

I006 1 EARPIECE

I007 1 LCD MODULE

MECHANICAL SUB ASSY

I008 4 SCREW 1.0X4

I009* 1 DOMESHEET

I010* 1 UI MODULE

I011* 1 IHF SPEAKER GASKET

I012* 1 IHF SPEAKER

I013* 1 IHF SPEAKER ADHESIVE

I014* 1 MAGNET

I015* 1 IHF BOX

I016* 1 B2 COVER

I101* 1 HINGE FLEX

I102* 1 HINGE COVER 1

I103* 1 HINGE

I104* 1 HINGE COVER 2

I105* 1 HINGE CAP LEFT

I106* 1 HINGE CAP RIGHT

I201* 1 A1 COVER

I202 1 MICROPHONE

1 FRAME ASSY (I0203 - I204)

I203* 1 CAMERA WINDOW

I204* 1 FRAME

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ITEM/CIRCUIT REF. QTY PART NAME

I205 1 SIDE KEY

I301* 1 POWER SWITCH

I206 1 KEYMAT

I207 1 PANEL

1 UI FLEX ASSY

I208* 1 DOMESHEET

I209* 1 UI FLEX

I210 1 SHIELD

CAMERA MODULE ASSY

I211* 1 VGA CAMERA

I212* 1 CAMERA FLEX

I213* 1 ENGINE MODULE

I214 1 TYPE LABEL

1 B1 COVER ASSY

I215 1 DC JACK

I216* 1 ANTENNA

I217 1 VIBRA

I218* 1 BATTERY RELEASE

I219* 1 B1 COVER

I220 6 SCREW 1.8X7

1 Battery LID ASSY

I221* 1 Battery LID

I222* 1 Battery PAD

Table 13 Mechanical spare parts list

Refs Description

A300 HELGO SHIELD ASSY DMC06934 R1024 x x x x

A400 PA SHIELD ASSY DMC06935 R1024 x x x x

I003 FUNC KEYMAT HARD TOP SILVER x x x x

I003 FUNC KEYMAT HARD BLACK x x x x

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Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–7

Refs Description

I004 Screw 1.8x5.0 DIN8015 FH FeZn black x x x x

I005 LCD Shield x x x x

I006 EARPIECE 105+-3DB 32R D8.1X2.25 x x x x

I007 LCD MOD 176X208 AM 64KCO GDAF6007 Halti2 x x x x

I202 MIC+BOOT ASSY -42+-3DB D7.7X3MM x x x x

I205 Sidekey Hard Top Silver x x x x

I205 Sidekey Hard Top Black P2103 x x x x

I206 NUM KEYMAT HARD TOP LATIN SILVER x x x

I206 NUM KEYMAT HARD TOP LATIN BLACK x x x

I206 NUM KEYMAT HARD TOP ARABIC SILVER x

I206 NUM KEYMAT HARD TOP ARABIC BLACK x

I206 NUM KEYMAT HARD TOP GREEK SILVER x

I206 NUM KEYMAT HARD TOP GREEK BLACK x

I206 NUM KEYMAT HARD TOP RUSSIA SILVER x

I206 NUM KEYMAT HARD TOP RUSSIA BLACK x

I206 NUM KEYMAT HARD TOP HEBREW SILVER x

I206 NUM KEYMAT HARD TOP HEBREW BLACK x

I206 NUM KEYMAT HARD TOP BoPo SILVER x

I206 NUM KEYMAT HARD TOP BoPo BLACK x

I206 NUM KEYMAT HARD TOP STROKE SILVER x x

I206 NUM KEYMAT HARD TOP STROKE BLACK x x

I207 Panel painted Silver P2103 x x x x

I207 Panel painted Black P2103 x x x x

I210 BB Shield DNS09299 P2103 x x x x

I214 BLANK LABEL 32.5X50.5 BRADY x x x x

I215 DC-Jack Low Profile P2103 x x x x

I217 VIBRA ASSY 1.0V 80MA 9000RPM x x x x

I220 Screw 1.8x7.0 DIN8015 FH FeZn black x x x x

UI flex assy 040-000388 P2103 x x x x

Frame Service Assembly P2103 x x x x

A2 cover assembly Silver Sand P2103 x x x x

B1 cover assembly Silver Sand x x x x

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Refs Description

A2 cover assembly Black Coffee x x x x

B1 cover assembly Black Coffee x x x x

RM-25 Mech sub-assembly Silver SandP2103 x x x x

RM-25 Mech sub-assembly Black CoffeP2103 x x x x

Camera Service Assembly x x x x

Battery lid assy Silver Sand P2103 x x x x

Battery lid assy Black Coffee P2103 x x x x

HELGO LID DMD11312 R1024 x x x x

PA LID DMD11314 R1024 x x x x

Swap units

Table 14 SWAP units

SWAP units

N6260 RM-25 SWAP ENGINE E&A BLACK

N6260 RM-25 SWAP ENGINE E&A SILVER

N6260 RM-25 SWAP ENGINE FRANCE BLACK

N6260 RM-25 SWAP ENGINE FRANCE SILVER

N6260 RM-25 SWAP ENGINE RUSSIA BLACK

N6260 RM-25 SWAP ENGINE RUSSIA SILVER

N6260 RM-25 SWAP ENGINE S-AFRICA BLACK

N6260 RM-25 SWAP ENGINE S-AFRICA SILVER

N6260 RM-25 SWAP ENGINE TURKEY BLACK

N6260 RM-25 SWAP ENGINE TURKEY SILVER

N6260 RM-25 SWAP ENGINE UKRAINA BLACK

N6260 RM-25 SWAP ENGINE UKRAINA SILVER

N6260 RM-25 SWAP ENGINE E&A BLACK

N6260 RM-25 SWAP ENGINE E&A SILVER

N6260 RM-25 SWAP ENGINE FRANCE BLACK

N6260 RM-25 SWAP ENGINE FRANCE SILVER

N6260 RM-25 SWAP ENGINE RUSSIA BLACK

N6260 RM-25 SWAP ENGINE RUSSIA SILVER

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–9

SWAP units

N6260 RM-25 SWAP ENGINE S-AFRICA BLACK

N6260 RM-25 SWAP ENGINE S-AFRICA SILVER

Component parts

Note: For the latest Component parts list, please refer to the Service bulletin.

Table 15 Component parts list for build 1fsa_09a

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

Earpiece EARPIECE 105+-3DB 32R D8.1X2.25

Shield Assembly UI flex assy 040-000388 P2103

Shield LCD Shield 040-000237 P2103

Cover Assembly B1 cover assembly Black Coffee P2103

X816 Board To Board

Connector

SM CONN B2B 2X8 F P0.4, camera connector on

main PWB

R313,

R371,

R642,

R861

Fixed Resistor CHIPRES 0W06 18K J 0402

C659,

C662,

C664,

C671,

C673,

C698,

C862

Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402

Cover Assembly A2 cover assembly Black Coffee

Cover Assembly A2 cover assembly Silver Sand P2103

Plate Panel painted Silver P2103

Cover Battery lid assy Black Coffee P2103

Label And Sticker BLANK LABEL 30.0X22.0 DMD07217

Cover Battery lid assy Silver Sand P2103

Cover B2 bezel printed Black 040-002071 P2103

Tape And Foil And

Film

UI adhesive 040-000074 P2103

Tape And Foil And

Film

B2 bezel adhesive DMD12641 P2103

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Nokia Customer Care Parts and layouts

Page 2–10 Company Confidential 9235618 (Issue 2)

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

Gasket And Seal IHF net 040-000076 P2103

Frame B2 bezel printed Silver 040-002071 P2103

Speaker SPEAKER IHF 77.3DB 7R D16X4.40

Tape And Foil And

Film

IHF speaker adhesive 040-001415 P2103

Gasket And Seal IHF gasket with net 040-000071 P2103

Dome Sheet Top UI domesheet 040-0000176 P2103

Vibrator VIBRA ASSY 1.0V 80MA 9000RPM

Cover Assembly B1 cover assembly Silver Sand P2103

Service Device SA-38 RF COUPLER

Service Device RJ-33 SOLDERING JIG

Service Device MJ-30 MODULE JIG P2103

Service Device DA-25 DOCKING ADAPTER P2103

Service Device SF-27 FLASH ADAPTER

After Sales Kit SK-8 LGA COMPONENT REWORK KIT

After Sales Kit SK-9 PA COMPONENT REWORK KIT

Service Device SS-34 OPENING TOOL

Production Device SK-5 LGA COMPONENT REWORK KIT

Service Device RJ-46 REWORK JIG HDJ12

Service Device ST-15 REWORK STENCIL

Cover Panel painted Black P2103

Keymat And Key NUM KEYMAT HARD TOP LATIN BLACK

Keymat And Key NUM KEYMAT HARD TOP ARABIC SILVER

Keymat And Key NUM KEYMAT HARD TOP LATIN SILVER

Keymat And Key NUM KEYMAT HARD TOP ARABIC BLACK

Keymat And Key NUM KEYMAT HARD TOP GREEK SILVER

Keymat And Key NUM KEYMAT HARD TOP GREEK BLACK

Keymat And Key NUM KEYMAT HARD TOP RUSS SILVER

Keymat And Key NUM KEYMAT HARD TOP RUSSIA BLACK

Keymat And Key NUM KEYMAT HARD TOP HEBREW SILVER

Keymat And Key NUM KEYMAT HARD TOP HEBREW BLACK

Keymat And Key NUM KEYMAT HARD TOP BoPo SILVER

Keymat And Key NUM KEYMAT HARD TOP BoPo BLACK

Keymat And Key NUM KEYMAT HARD TOP STROKE SILVER

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–11

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

Keymat And Key NUM KEYMAT HARD TOP STROKE BLACK

Keymat And Key FUNC KEYMAT HARD TOP SILVER

Keymat And Key FUNC KEYMAT HARD BLACK

Display LCD MOD 176X208 AM 64KCO GDAF6007

D460 Combo Memory NOR 128M + 128M 1.8/1.8V FGBA44 PBFREE

Shield BB Shield DNS09299 P2103

Other Assembly RM-25 Mech sub-assembly Black CoffeP2103

Other Assembly RM-25 Mech sub-assembly Silver SandP2103

G502 Battery And

Battery Cell

CELL CAPACITOR 0.015MAH 3V3

Screw Screw 1.8x7.0 DIN8015 FH FeZn black, B1 cover

screws

Screw Screw 1.8x5.0 DIN8015 FH FeZn black, A2 cover

screws

Screw Screw 1.0x4.0, Top UI board screws

Electronic

Assembly

1FS-F TOP-UI

Speaker SPEAKER HF 69+-2DB 8R D16X4.36

Gasket And Seal IHF speaker gasket P2103

Fixed Resistor CHIPRES 0W06 22R J 0402

Ceramic Capacitor CHIPCAP X5R 1U0 K 25V T 1.0 1206

R873,

R402,

R492,

R864,

R871

Fixed Resistor CHIPRES 0W06 100R J 0402

R315 Integrated

Discretes

ASIP MMC-INTERFACE ESD FILT BGA11

R644,

R675

Fixed Resistor CHIPRES 0W06 27K J 0402

R513,

R514

Fixed Resistor CHIPRES 0W06 15K J 0402

V402 Diode SCH DIODE 30V 200MA VF 0V5 SOD523

R806 Resistor Network RES NETWORK 0W06 2X100R J 0404

LED LED WHITE 90-345MCD 10MA 90DEG

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Nokia Customer Care Parts and layouts

Page 2–12 Company Confidential 9235618 (Issue 2)

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

C406,

C407,

C501

Ceramic Capacitor CHIPCAP NP0 3P3 C 50V 0402

A300 Shield Assembly HELGO SHIELD ASSY DMC06934 R1024 F7 TOP

A400 Shield Assembly PA SHIELD ASSY DMC06935 R1024 F3 TOP

B250 Crystal CRYSTAL 32.768KHZ+-20PPM 12.5PF I8 TOP

B440 Crystal CER.RESON 6MHZ+0.11%-0.09% 4.5X2.0 Q8 TOP

C132 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 P2 BOTTOM

C133 Electrolytic

Capacitor

CHIPTCAP 100U M 10V 6.0X3.2X1.5

TOP

C134 Ceramic Capacitor CHIPCAP X7R 10N K 50V 0603 S5 BOTTOM

C135 Ceramic Capacitor CHIPCAP NP0 27P J 50V 0402 T5 BOTTOM

C138 Ceramic Capacitor CHIPCAP X7R 10N K 16V 0402 L7 TOP

C190 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 H4 TOP

C191 Ceramic Capacitor CHIPCAP NP0 2P2 C 50V 0402 I3 TOP

C193 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 K2 TOP

C199 Ceramic Capacitor CHIPCAP X5R 2U2 K 6V3 0603 TOP

C200 Ceramic Capacitor CHIPCAP X7R 330P J 50V 0402 I3 TOP

C222 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 I5 TOP

C231 Ceramic Capacitor CHIPCAP NP0 47P J 50V 0402 P5 TOP

C241 Ceramic Capacitor CHIPCAP X5R 100N K 10V 0402 L9 TOP

C253 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 I7 TOP

C260 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 J8 TOP

C270 Ceramic Capacitor CHIPCAP NP0 270P J 50V 0402 L8 TOP

C315 Ceramic Capacitor CHIPCAP X5R 2U2 K 10V 0805 D3 BOTTOM

C405 Ceramic Capacitor CHIPCAP X5R 4U7 K 6V3 0805 P3 TOP

C444 Ceramic Capacitor CHIPCAP X5R 1U K 16V 0603 R8 TOP

C460 Ceramic Capacitor CHIPCAP X7R 100N K 16V 0603 Q9 TOP

C463 Ceramic Capacitor CHIPCAP X5R 470N K 10V 0603 P7 TOP

C502 Ceramic Capacitor CHIPCAP NP0 180P J 25V 0402 D7 TOP

C503 Ceramic Capacitor CHIPCAP NP0 2N7 J 25V 0805 D7 TOP

C505 Ceramic Capacitor CHIPCAP NP0 2N2 J 16V 0603 G8 TOP

C510 Ceramic Capacitor CHIPCAP NP0 56P J 50V 0402 F8 TOP

C511 Ceramic Capacitor CHIPCAP NP0 1P2 C 50V 0402 F7 TOP

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Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–13

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

C512 Ceramic Capacitor CHIPCAP NP0 18P J 50V 0402 F8 TOP

C523 Ceramic Capacitor CHIP ARRAY NP0 4X470P J 16V 0612 E5 TOP

C528 Ceramic Capacitor CHIPCAP NP0 82P J 50V 0402 G6 TOP

C617 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 T7 BOTTOM

C620 Ceramic Capacitor CHIPCAP X7R 560P J 50V 0402 Q2 TOP

C621 Ceramic Capacitor CHIPCAP NP0 68P J 50V 0402 Q3 TOP

C657 Ceramic Capacitor CHIPCAP X7R 10N J 16V 0402 M4 TOP

C658 Ceramic Capacitor CHIPCAP X7R 47N K 10V 0402 M4 TOP

C663 Other Capacitor CHIP ARRAY X5R 2X47N K 10V 0405 O4 TOP

C665 Other Capacitor CHIP ARRAY X5R 2X33N M 10V 0405 O3 TOP

C670 Ceramic Capacitor CHIPCAP X7R 4N7 K 25V 0402 M4 TOP

C701 Ceramic Capacitor CHIPCAP X7R 1N0 J 50V 0402 G3 TOP

C937 Fixed Resistor CHIPRES 0W06 33K J 0402 TOP

D190 Mixed Signal ASIC TJA4 BLUETOOTH DEVICE J4 TOP

D191 Logic IC 1XINV 1.8-5.5V SC70-5 J3 TOP

D400 Power

Management IC

DC/DC CONV 350MA(TK11851)SOP8

TOP

D440 Interface IC KAEDE V1.0 ISP1182 HVQFN32 Q9 TOP

D461 DRAM Memory SDRAM 8MX16 1.8V/1.8V WBGA60 PBFREE P6 TOP

D462 FLASH Memory FLASH 4MX16 1.8/1.8V FBGA44 PBFREE M9 TOP

F130 Fuse And

Protector

SM FUSE F 1.5A 32V ROHS-FREE 0603

BOTTOM

G500 VCO VCO 3296-3980MHZ 4-BAND Matsushita D6 TOP

G501 VCTCXO VCTCXO 26MHZ+-3PPM 2.7V 1.3MA GSM E8 TOP

L131 EMC Component FERR.BEAD 240R/100M 0.4A 0R3 0402 S5 BOTTOM

L190 Fixed Inductor CHIP COIL 22N J Q28/800MHZ 0402 I4 TOP

L191 Fixed Inductor CHIP COIL 2N7 +-0N3 Q29/800M 0402 I4 TOP

L222 EMC Component FERRITE BEAD 0R5 600R/100MHZ 0603 I5 TOP

L230 Fixed Inductor CHOKE 10uH M 0.53A 0R48 4.8x4.8x1.2 Q5 TOP

L401 Fixed Inductor CHOKE 22U M 0.33A 1R5 3.3X3.3X1.3 P4 TOP

L441 Fixed Inductor CHIP COIL 56N J Q21/800MHZ 0402 T6 BOTTOM

L500 Fixed Inductor CHIP COIL 5N6 +-0N3 Q7/100M 0402 F8 TOP

L502 Fixed Inductor CHIP COIL 3N3 +-0N1 Q30/1GHZ 0402 F8 TOP

L504 Fixed Inductor CHIP COIL 3N9 +-0N1 Q28/1GHZ 0402 F7 TOP

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Nokia Customer Care Parts and layouts

Page 2–14 Company Confidential 9235618 (Issue 2)

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

L622 Fixed Inductor CHIP COIL 68NH J Q12/100MHZ 0603 S7 BOTTOM

L656 Fixed Inductor CHIP COIL 33N G Q40/250MHZ 0603 M3 TOP

L658 Fixed Inductor CHIP COIL 120N G Q32/150MHZ 0603 N4 TOP

L677 EMC Component CHIP BEAD ARRAY 2X1000R 0405 T6 BOTTOM

L700 EMC Component FERR.BEAD 0R03 42R/100MHZ 3A 0805 G4 TOP

L702 Fixed Inductor CHIP COIL 33N J Q23/800MHZ 0402 G7 TOP

L800 Fixed Inductor CHIP COIL 3N3 +-0N3 Q28/800M 0402 D3 TOP

L802 Fixed Inductor CHIP COIL 4N7 +-0N1 Q29/1GHZ 0402 F6 TOP

L804 Fixed Inductor CHIP COIL 18N J Q29/800MHZ 0402 F6 TOP

L807 Fixed Inductor CHIP COIL 8N2 J Q28/800MHZ 0402 G6 TOP

N130 Power

Management IC

CURRNT SENS LM3820 USMD10 PB-FREE

BOTTOM

N230 Power

Management IC

DC/DC 1.8V/1.5V(LM2608-1.8)USMD10

TOP

N233 Power

Management IC

REG+MAS9161B2GB06 2.8V 80MA TSOT5

TOP

N500 RF ASIC HELGO85G PBFREE TFBGA88 F7 TOP

N656 Other IC FM RECEIVER(TEA5767HN) LQFP40 N3 TOP

N661 Other IC VREG & LEVELSHIFT(LP3928)USMD16 L5 TOP

N662 Analog IC AF AMP 0.4W LM4890/NCP2890 PBFREE Q3 TOP

N700 Power Amplifier PW AMP RF9250E4.1 Micro GSM/EDGE F3 TOP

N750 Infrared IRDA CIM-50M5A **** RESERVED **** P10 BOTTOM

R130 Fixed Resistor CHIPRES 0W06 2K2 J 0402 Q2 BOTTOM

R132 Variable Resistor NTC RES 0W1 47K J B 4050+-3% 0402 K10 BOTTOM

R133 Fixed Resistor CHIPRES 0W06 100K J 0402 L7 TOP

R192 Fixed Resistor CHIPRES 0W06 2K7 J 0402 I3 TOP

R193 Fixed Resistor CHIPRES 0W06 10K J 0402 J3 TOP

R194 Fixed Resistor CHIPRES 0W06 2R2 J 0402 I3 TOP

R253 Fixed Resistor CHIPRES 0W06 100K F 200PPM 0402 L8 TOP

R257 Fixed Resistor CHIPRES 0W06 220R J 0402 L7 TOP

R259 Fixed Resistor CHIPRES 0W25 0R22 J 0805 I6 TOP

R260 Fixed Resistor CHIPRES 0W06 27K F 0402 K6 TOP

R261 Integrated

Discretes

ASIP 4XESD *** PB-FREE *** BGA5

L10

BOTTOM

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–15

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

R265 Fixed Resistor CHIPRES JUMPER 0R0 0603 K8 TOP

R270 Fixed Resistor CHIPRES 0W06 4K7 J 0402 I8 TOP

R310 Integrated

Discretes

ASIP SIM INTERFACE ** PB-FREE **

BOTTOM

R315 Integrated

Discretes

ASIP MMC FILTER *** PB-FREE ***

BOTTOM

R403 Variable Resistor CHIP VARISTOR VWM15V VC50V 0402 S2 TOP

R420 Fixed Resistor CHIPRES 0W06 3K9 J 0402 M5 TOP

R422 Fixed Resistor CHIPRES 0W06 100R F 200PPM 0402 M8 TOP

R446 Fixed Resistor CHIPRES 0W06 33R J 0402 T5 BOTTOM

R448 Fixed Resistor CHIPRES 0W06 68R J 0402 R8 TOP

R451 Integrated

Discretes

ASIP USB2 FILTER BGA10 PBFREE

BOTTOM

R452 Fixed Resistor CHIPRES 0W06 220K J 0402 R9 TOP

R491 Fixed Resistor CHIPRES 0W06 680R J 0402 O5 TOP

R501 Fixed Resistor CHIPRES 0W06 5K6 J 0402 D7 TOP

R502 Fixed Resistor CHIPRES 0W06 6K8 F 0402 D7 TOP

R503 Resistor Network RES NETWORK 0W04 2DB ATT 0404 D7 TOP

R506 Fixed Resistor CHIPRES 0W06 22K J 0402 G8 TOP

R512 Fixed Resistor CHIPRES 0W06 5K6 F 0402 E6 TOP

R515 Resistor Network RES NETWORK 0W06 4X5K6 J 0804 E7 TOP

R516 Fixed Resistor CHIPRES 0W06 10R J 0402 F8 TOP

R602 Fixed Resistor CHIPRES 0W06 1K0 J 0402 K9 TOP

R604 Fixed Resistor CHIPRES 0W06 470R J 0402 J9 TOP

R634 Resistor Network RES NETWORK 0W06 2X10R J 0404 S7 BOTTOM

R635 Integrated

Discretes

ASIP MIC W/ESD RES+CAP+ZDI BGA11

BOTTOM

R645 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 T4 TOP

R650 Resistor Network RES NETWORK 0W06 2X220R J 0404 T4 TOP

R651 Resistor Network RES NETWORK 0W03 4X22R J 0804 L10 BOTTOM

R656 Fixed Resistor CHIPRES 0W06 12R J 0402 M2 TOP

R658 Fixed Resistor CHIPRES 0W06 47R J 0402 M3 TOP

R662 Fixed Resistor CHIPRES 0W06 5R6 J 0402 N4 TOP

R667 Fixed Resistor CHIPRES 0W06 18K F 100PPM 0603 N4 TOP

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Nokia Customer Care Parts and layouts

Page 2–16 Company Confidential 9235618 (Issue 2)

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

R693 Fixed Resistor CHIPRES 0W06 1M0 J 0402 J3 TOP

R717 Resistor Network RES NETWORK 0W04 1DB ATT 0404 G3 TOP

R750 Fixed Resistor CHIPRES 0W5 4R7 J 200PPM 1210 O10 BOTTOM

R800 Fixed Resistor CHIPRES 0W06 3K3 J 0402 D4 TOP

R802 Fixed Resistor CHIPRES 0W06 560R J 0402 E4 TOP

R862 Ceramic Capacitor CHIPCAP X7R 33N K 10V 0402 TOP

S001 Switch And Knob MMC Switch E2 BOTTOM

T500 Balun TRANSF BALUN 3290-3980MHZ D7 TOP

T700 Balun TRANSF BALUN 1800+-100MHZ 2X1.25 G7 TOP

T800 Transformer TRANSF BALUN 1.9GHZ+-100MHZ2X1.25 G5 TOP

V130 Diode TVS DI 1PMT16AT3 16V 175W PWRMITE T4 BOTTOM

V400 Integrated

Discretes

ASIP EMI/ESD FILTER BGA6

TOP

V800 Bipolar Transistor

BJT

TR BGA428 LNA1.8GHZ 19.5DB SOT363

TOP

V801 Bipolar Transistor

BJT

TR 2SC5658QRS N 50V 0A1 0W15 VMT3

TOP

X131 Battery Connector SM BATTERY CONN 3POLE SPR S4 BOTTOM

X132 System Connector SM SYSTEM CONNECTOR 14POL U6 BOTTOM

X400 Board To Board

Connector

SM CONN 2X11 SPR 50V 0.5A PCB/PCB

TOP

X816 Fixed Resistor CHIPRES JUMPER 0R0 0201 S7 TOP

X817 Board To Board

Connector

SM CONN B2B 2X25 M P0.4

TOP

X820 Other Customized

Connector

SIM/MMC combo reader P2103

BOTTOM

X822 Coaxial Connector SM CONN RF JACK 50R 2W 6GHZ E2 TOP

X823 Other Customized

Connector

SM CONN VIBRA SPACER PAD 2.8X1.8

BOTTOM

X825 Spring UI SPRING T2 TOP

Z191 Ceramic Filter CER FILT 2441+-41.75MHZ 2.7X2.2 I3 TOP

Z192 Balun TRANSF BALUN 2400+/-100MHZ I4 TOP

Z401 Integrated

Discretes

ASIP 10-CH ESD EMI FILTER BGA25

TOP

Z700 SAW Filter SAW FILT 897.5+-17.5MHZ/3DB 2X1.6 G7 TOP

Z800 Antenna Switch DIPL+3SW824-960/1710-1990MHZ5.4*4 E3 TOP

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–17

Refs Type Object Name

PWB

Position,

X/Y

Assy Side

Z801 SAW Filter SAW FILT 1960+-30MHZ/3.5DB 2X1.6 D3 TOP

Z802 SAW Filter SAW FILT 1842.5+-37.5MHZ 2X1.6 F5 TOP

Z803 SAW Filter SAW FILT 942.5+-17.5MHZ/3DB 2X1.6 F5 TOP

Table 16 Component parts for 1fsa_11a

Ref Type Name Side XY E

A300 Shield Assembly HELGO SHIELD ASSY DMC06934 R1024 T F7 x x x x

A400 Shield Assembly PA SHIELD ASSY DMC06935 R1024 T F3 x x x x

B250 Crystal CRYSTAL 32.768KHZ+-20PPM 12.5PF T I8 x x x x

B440 Crystal CER.RESON 6MHZ+0.11%-0.09% 4.5X2.0 T Q8 x x x x

C1 Ceramic Capacitor CHIPCAP X7R 10N K 16V 0402 x x x x

C100 Ceramic Capacitor CHIPCAP X7R 33N K 10V 0402 x x x x

C101 Ceramic Capacitor CHIPCAP X7R 33N K 10V 0402 x x x x

C102 Ceramic Capacitor CHIPCAP X7R 33N K 10V 0402 x x x x

C103 Ceramic Capacitor CHIPCAP X7R 33N K 10V 0402 x x x x

C132 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 B P2 x x x x

C133 Electrolytic Capacitor CHIPTCAP 100U M 10V 6.0X3.2X1.5 T L3 x x x x

C134 Ceramic Capacitor CHIPCAP X7R 10N K 50V 0603 B S5 x x x x

C135 Ceramic Capacitor CHIPCAP NP0 27P J 50V 0402 B T5 x x x x

C190 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T H4 x x x x

C191 Ceramic Capacitor CHIPCAP NP0 2P2 C 50V 0402 T I3 x x x x

C192 Ceramic Capacitor CHIPCAP NP0 2P2 C 50V 0402 T I4 x x x x

C193 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T K2 x x x x

C194 Ceramic Capacitor CHIPCAP NP0 2P2 C 50V 0402 T J3 x x x x

C197 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T I4 x x x x

C199 Ceramic Capacitor CHIPCAP X5R 2U2 K 6V3 0603 T K4 x x x x

C200 Ceramic Capacitor CHIPCAP X7R 330P J 50V 0402 T I3 x x x x

C203 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K3 x x x x

C220 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I5 x x x x

C221 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I5 x x x x

C222 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 T I5 x x x x

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Nokia Customer Care Parts and layouts

Page 2–18 Company Confidential 9235618 (Issue 2)

Ref Type Name Side XY E

C230 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 T P4 x x x x

C231 Ceramic Capacitor CHIPCAP NP0 47P J 50V 0402 T P5 x x x x

C232 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 T P5 x x x x

C233 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 T P5 x x x x

C239 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T O5 x x x x

C240 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T O4 x x x x

C250 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I6 x x x x

C251 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J6 x x x x

C252 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T L8 x x x x

C253 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 T I7 x x x x

C254 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 T I8 x x x x

C255 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T H8 x x x x

C256 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I7 x x x x

C257 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I8 x x x x

C259 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J9 x x x x

C260 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T J8 x x x x

C261 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T K9 x x x x

C262 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T K9 x x x x

C263 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T I8 x x x x

C264 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T J9 x x x x

C265 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T J9 x x x x

C270 Ceramic Capacitor CHIPCAP NP0 270P J 50V 0402 T L8 x x x x

C272 Ceramic Capacitor CHIPCAP X7R 1N0 K 50V 0402 T H8 x x x x

C273 Ceramic Capacitor CHIPCAP X7R 1N0 K 50V 0402 T H8 x x x x

C274 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I6 x x x x

C276 Ceramic Capacitor CHIPCAP X7R 1N0 K 50V 0402 T I6 x x x x

C278 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I7 x x x x

C279 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T I6 x x x x

C280 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T H6 x x x x

C281 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J5 x x x x

C282 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K8 x x x x

C284 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T L8 x x x x

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–19

Ref Type Name Side XY E

C287 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K5 x x x x

C288 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K5 x x x x

C289 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K6 x x x x

C290 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K5 x x x x

C291 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T L5 x x x x

C294 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J5 x x x x

C295 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J6 x x x x

C296 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J6 x x x x

C297 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K6 x x x x

C298 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K5 x x x x

C299 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K5 x x x x

C3 Ceramic Capacitor CHIPCAP X5R 100N K 10V 0402 x x x x

C300 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T J5 x x x x

C301 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K6 x x x x

C302 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T K5 x x x x

C314 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 B E3 x x x x

C315 Ceramic Capacitor CHIPCAP X5R 2U2 K 10V 0805 B D3 x x x x

C340 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T Q2 x x x x

C341 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T Q2 x x x x

C354 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T T2 x x x x

C355 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T S2 x x x x

C356 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T T2 x x x x

C4 Ceramic Capacitor CHIPCAP X5R 100N K 10V 0402 x x x x

C404 Ceramic Capacitor CHIPCAP NP0 47P J 50V 0402 T P2 x x x x

C405 Ceramic Capacitor CHIPCAP X5R 4U7 K 6V3 0805 T P3 x x x x

C406 Ceramic Capacitor CHIPCAP X5R 1U0 K 25V T 1.0 1206 T O3 x x x x

C407 Ceramic Capacitor CHIPCAP X5R 1U0 K 25V T 1.0 1206 T O2 x x x x

C444 Ceramic Capacitor CHIPCAP X5R 1U K 16V 0603 T R8 x x x x

C445 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 B T5 x x x x

C446 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 B T5 x x x x

C447 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 B T5 x x x x

C450 CHIPCAP NP0 12P J 50V 0402 T Q7 x x x x

RM-25

Nokia Customer Care Parts and layouts

Page 2–20 Company Confidential 9235618 (Issue 2)

Ref Type Name Side XY E

C451 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T U2 x x x x

C460 Ceramic Capacitor CHIPCAP X7R 100N K 16V 0603 T Q9 x x x x

C463 Ceramic Capacitor CHIPCAP X5R 470N K 10V 0603 T P7 x x x x

C464 Ceramic Capacitor CHIPCAP X7R 10N K 50V 0603 T P7 x x x x

C465 Ceramic Capacitor CHIPCAP X5R 470N K 10V 0603 T Q7 x x x x

C466 Ceramic Capacitor CHIPCAP X7R 10N K 50V 0603 T Q7 x x x x

C470 Ceramic Capacitor CHIPCAP X7R 100N K 16V 0603 T Q9 x x x x

C490 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T L6 x x x x

C491 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 T O5 x x x x

C500 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T D6 x x x x

C501 Ceramic Capacitor CHIPCAP NP0 3P3 C 50V 0402 T D6 x x x x

C502 Ceramic Capacitor CHIPCAP NP0 180P J 25V 0402 T D7 x x x x

C503 Ceramic Capacitor CHIPCAP NP0 2N7 J 25V 0805 T D7 x x x x

C504 Ceramic Capacitor CHIPCAP NP0 270P J 50V 0402 T D7 x x x x

C505 Ceramic Capacitor CHIPCAP NP0 2N2 J 16V 0603 T G8 x x x x

C506 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T G8 x x x x

C510 Ceramic Capacitor CHIPCAP NP0 56P J 50V 0402 T F8 x x x x

C511 Ceramic Capacitor CHIPCAP NP0 1P2 C 50V 0402 T F7 x x x x

C512 Ceramic Capacitor CHIPCAP NP0 18P J 50V 0402 T F8 x x x x

C516 Ceramic Capacitor CHIPCAP NP0 27P J 50V 0402 T F8 x x x x

C518 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 T E6 x x x x

C520 Ceramic Capacitor CHIPCAP NP0 56P J 50V 0402 T G6 x x x x

C523 Ceramic Capacitor CHIP ARRAY NP0 4X470P J 16V 0612 T E5 x x x x

C525 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T E7 x x x x

C528 Ceramic Capacitor CHIPCAP NP0 82P J 50V 0402 T G6 x x x x

C529 Ceramic Capacitor CHIPCAP NP0 47P J 50V 0402 T E7 x x x x

C530 Ceramic Capacitor CHIPCAP NP0 47P J 50V 0402 T E7 x x x x

C531 Ceramic Capacitor CHIPCAP NP0 18P J 50V 0402 T G6 x x x x

C532 Ceramic Capacitor CHIPCAP NP0 27P J 50V 0402 T G6 x x x x

C600 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T L9 x x x x

C605 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 T J9 x x x x

C608 Ceramic Capacitor CHIPCAP X7R 1N0 K 50V 0402 T K9 x x x x

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–21

Ref Type Name Side XY E

C609 Ceramic Capacitor CHIPCAP X7R 1N0 K 50V 0402 T K9 x x x x

C611 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 B T7 x x x x

C612 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 B T7 x x x x

C613 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 B T7 x x x x

C614 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 B T7 x x x x

C617 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 B T7 x x x x

C620 Ceramic Capacitor CHIPCAP X7R 560P J 50V 0402 T Q2 x x x x

C621 Ceramic Capacitor CHIPCAP NP0 68P J 50V 0402 T Q3 x x x x

C622 Ceramic Capacitor CHIPCAP X5R 470N K 10V 0603 T Q2 x x x x

C625 Ceramic Capacitor CHIPCAP X7R 560P J 50V 0402 T Q3 x x x x

C629 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 B S6 x x x x

C630 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 B T6 x x x x

C632 Ceramic Capacitor CHIPCAP X5R 10U M 6V3 0805 T J9 x x x x

C638 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 B T6 x x x x

C639 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 B T6 x x x x

C657 Ceramic Capacitor CHIPCAP X7R 10N J 16V 0402 T M4 x x x x

C658 Ceramic Capacitor CHIPCAP X7R 47N K 10V 0402 T M4 x x x x

C659 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 T M2 x x x x

C661 Ceramic Capacitor CHIPCAP X7R 1N0 K 50V 0402 T O2 x x x x

C662 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 T M3 x x x x

C663 Other Capacitor CHIP ARRAY X5R 2X47N K 10V 0405 T O4 x x x x

C664 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 T N2 x x x x

C665 Other Capacitor CHIP ARRAY X5R 2X33N M 10V 0405 T O3 x x x x

C666 Ceramic Capacitor CHIPCAP X7R 47N K 10V 0402 T O4 x x x x

C667 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T N4 x x x x

C670 Ceramic Capacitor CHIPCAP X7R 4N7 K 25V 0402 T M4 x x x x

C671 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 T N4 x x x x

C672 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T N4 x x x x

C673 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 T O2 x x x x

C674 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T N2 x x x x

C678 Ceramic Capacitor CHIPCAP NP0 27P J 50V 0402 T N4 x x x x

C679 Ceramic Capacitor CHIPCAP NP0 47P J 50V 0402 T M4 x x x x

RM-25

Nokia Customer Care Parts and layouts

Page 2–22 Company Confidential 9235618 (Issue 2)

Ref Type Name Side XY E

C693 Ceramic Capacitor CHIPCAP X7R 3N3 J 50V 0402 B T7 x x x x

C696 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 B E5 x x x x

C698 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 T Q3 x x x x

C701 Ceramic Capacitor CHIPCAP X7R 1N0 J 50V 0402 T G3 x x x x

C702 Ceramic Capacitor CHIPCAP X7R 1N0 J 50V 0402 T F3 x x x x

C705 Ceramic Capacitor CHIPCAP X5R 4U7 K 6V3 0805 T G3 x x x x

C706 Ceramic Capacitor CHIPCAP NP0 27P J 50V 0402 T G4 x x x x

C707 Ceramic Capacitor CHIPCAP NP0 1P2 C 50V 0402 T G3 x x x x

C709 Ceramic Capacitor CHIPCAP X7R 1N0 J 50V 0402 T G4 x x x x

C710 Ceramic Capacitor CHIPCAP X7R 1N0 J 50V 0402 T F4 x x x x

C713 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T G7 x x x x

C714 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T G7 x x x x

C750 Ceramic Capacitor CHIPCAP X5R 4U7 K 6V3 0805 B O10 x x x x

C751 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 B Q10 x x x x

C800 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T D4 x x x x

C801 Ceramic Capacitor CHIPCAP NP0 2P2 C 50V 0402 T D3 x x x x

C803 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T D4 x x x x

C804 Ceramic Capacitor CHIPCAP NP0 1P2 C 50V 0402 T E4 x x x x

C805 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T G6 x x x x

C806 Ceramic Capacitor CHIPCAP NP0 15P J 50V 0402 T G6 x x x x

C862 Ceramic Capacitor CHIPCAP X7R 22N K 16V 0402 x x x x

C863 Ceramic Capacitor CHIPCAP NP0 100P J 50V 0402 T Q2 x x x x

C905 Ceramic Capacitor CHIPCAP NP0 10P J 50V 0402 T M7 x x x x

C933 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T T4 x x x x

C934 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T U4 x x x x

C935 Ceramic Capacitor CHIPCAP NP0 22P J 50V 0402 T Q9 x x x x

C936 Ceramic Capacitor CHIPCAP NP0 270P J 50V 0402 B S5 x x x x

C940 Ceramic Capacitor CHIPCAP X5R 1U K 6V3 0603 T L7 x x x x

D190 Mixed Signal ASIC TJA4 BLUETOOTH DEVICE T J4 x x x x

D191 Logic IC 1XINV 1.8-5.5V SC70-5 T J3 x x x x

D400

Power Management

IC DC/DC CONV 350MA(TK11851)SOP8 T P3 x x x x

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–23

Ref Type Name Side XY E

D440 Interface IC KAEDE V1.0 ISP1182 HVQFN32 T Q9 x x x x

D460 Combo Memory NOR 128M + 128M 1.8/1.8V FGBA44 PBFREE T O9 x x x x

D460 NOR 128M + 128M 1.8/1.8V FGBA44 PBFREE T O9 x x x x

D461 DRAM Memory SDRAM 8MX16 1.8V/1.8V FBGA60 PBFREE T P6 x x x x

D462 FLASH Memory FLASH 4MX16 1.8/1.8V FBGA44 PBFREE T M9 x x x x

D462 FLASH 4MX16 1.8/1.8V VFBGA44 PBFREE T M9 x x x x

F130 Fuse And Protector SM FUSE F 1.5A 32V ROHS-FREE 0603 B T4 x x x x

G500 VCO VCO 3296-3980MHZ 4-BAND Matsushita T D6 x x x x

G501 VCTCXO VCTCXO 26MHZ+-3PPM 2.7V 1.3MA GSM T E8 x x x x

G502

Battery And Battery

Cell CELL CAPACITOR 0.015MAH 3V3 B T8 x x x x

I003 Keymat And Key FUNC KEYMAT HARD BLACK x x x x

I003 Keymat And Key FUNC KEYMAT HARD TOP SILVER x x x x

I004 Screw Screw 1.8x5.0 DIN8015 FH FeZn black x x x x

I005 Shield LCD Shield x x x x

I006 Earpiece EARPIECE 105+-3DB 32R D8.1X2.25 x x x x

I007 Display

LCD MOD 176X208 AM 64KCO GDAF6007

Halti2 x x x x

I202 Microphone Assembly MIC+BOOT ASSY -42+-3DB D7.7X3MM x x x x

I205 Keymat And Key Sidekey Hard Top Black P2103 x x x x

I205 Keymat And Key Sidekey Hard Top Silver x x x x

I206 Keymat And Key NUM KEYMAT HARD TOP LATIN BLACK x x x

I206 Keymat And Key NUM KEYMAT HARD TOP STROKE BLACK x x

I206 Keymat And Key NUM KEYMAT HARD TOP STROKE SILVER x x

I206 Keymat And Key NUM KEYMAT HARD TOP BoPo BLACK x

I206 Keymat And Key NUM KEYMAT HARD TOP BoPo SILVER x

I206 Keymat And Key NUM KEYMAT HARD TOP HEBREW BLACK x

I206 Keymat And Key NUM KEYMAT HARD TOP HEBREW SILVER x

I206 Keymat And Key NUM KEYMAT HARD TOP RUSSIA BLACK x

I206 Keymat And Key NUM KEYMAT HARD TOP RUSSIA SILVER x

I206 Keymat And Key NUM KEYMAT HARD TOP GREEK BLACK x

I206 Keymat And Key NUM KEYMAT HARD TOP GREEK SILVER x

RM-25

Nokia Customer Care Parts and layouts

Page 2–24 Company Confidential 9235618 (Issue 2)

Ref Type Name Side XY E

I206 Keymat And Key NUM KEYMAT HARD TOP ARABIC SILVER x

I206 Keymat And Key NUM KEYMAT HARD TOP ARABIC BLACK x

I206 Keymat And Key NUM KEYMAT HARD TOP LATIN SILVER x x x

I207 Plate Panel painted Black P2103 x x x x

I207 Plate Panel painted Silver P2103 x x x x

I210 Shield BB Shield DNS09299 P2103 x x x x

I214 Label And Sticker BLANK LABEL 32.5X50.5 BRADY x x x x

I215 Charger Connector DC-Jack Low Profile P2103 x x x x

I217 Vibrator VIBRA ASSY 1.0V 80MA 9000RPM x x x x

I220 Screw Screw 1.8x7.0 DIN8015 FH FeZn black x x x x

L130 EMC Component FERR.BEAD 0R03 42R/100MHZ 3A 0805 B T4 x x x x

L131 EMC Component FERR.BEAD 240R/100M 0.4A 0R3 0402 B S5 x x x x

L133 EMC Component FERR.BEAD 240R/100M 0.4A 0R3 0402 B S5 x x x x

L190 Fixed Inductor CHIP COIL 22N J Q28/800MHZ 0402 T I4 x x x x

L191 Fixed Inductor CHIP COIL 2N7 +-0N3 Q29/800M 0402 T I4 x x x x

L192 Fixed Inductor CHIP COIL 2N7 +-0N3 Q29/800M 0402 T I4 x x x x

L193 Fixed Inductor CHIP COIL 22N J Q28/800MHZ 0402 T I3 x x x x

L194 Fixed Inductor CHIP COIL 22N J Q28/800MHZ 0402 T I3 x x x x

L222 EMC Component FERRITE BEAD 0R5 600R/100MHZ 0603 T I5 x x x x

L230 Fixed Inductor CHOKE 10uH M 0.53A 0R48 4.8x4.8x1.2 T Q5 x x x x

L400 EMC Component FERRITE BEAD 0R5 600R/100MHZ 0603 T P3 x x x x

L401 Fixed Inductor CHOKE 22U M 0.33A 1R5 3.3X3.3X1.3 T P4 x x x x

L440 EMC Component FERR.BEAD 240R/100M 0.4A 0R3 0402 B T5 x x x x

L441 Fixed Inductor CHIP COIL 56N J Q21/800MHZ 0402 B T6 x x x x

L442 Fixed Inductor CHIP COIL 56N J Q21/800MHZ 0402 B T5 x x x x

L500 Fixed Inductor CHIP COIL 5N6 +-0N3 Q7/100M 0402 T F8 x x x x

L501 Fixed Inductor CHIP COIL 5N6 +-0N3 Q7/100M 0402 T F8 x x x x

L502 Fixed Inductor CHIP COIL 3N3 +-0N1 Q30/1GHZ 0402 T F8 x x x x

L503 Fixed Inductor CHIP COIL 3N3 +-0N1 Q30/1GHZ 0402 T F8 x x x x

L504 Fixed Inductor CHIP COIL 3N9 +-0N1 Q28/1GHZ 0402 T F7 x x x x

L622 Fixed Inductor CHIP COIL 68NH J Q12/100MHZ 0603 B S7 x x x x

L656 Fixed Inductor CHIP COIL 33N G Q40/250MHZ 0603 T M3 x x x x

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–25

Ref Type Name Side XY E

L657 Fixed Inductor CHIP COIL 33N G Q40/250MHZ 0603 T M3 x x x x

L658 Fixed Inductor CHIP COIL 120N J Q16/100MHZ 0603 T N4 x x x x

L677 EMC Component CHIP BEAD ARRAY 2X1000R 0405 B T6 x x x x

L678 EMC Component CHIP BEAD ARRAY 2X1000R 0405 B T7 x x x x

L679 EMC Component CHIP BEAD ARRAY 2X1000R 0405 B T6 x x x x

L700 EMC Component FERR.BEAD 0R03 42R/100MHZ 3A 0805 T G4 x x x x

L702 Fixed Inductor CHIP COIL 33N J Q23/800MHZ 0402 T G7 x x x x

L800 Fixed Inductor CHIP COIL 3N3 +-0N3 Q28/800M 0402 T D3 x x x x

L801 Fixed Inductor CHIP COIL 3N3 +-0N3 Q28/800M 0402 T E4 x x x x

L802 Fixed Inductor CHIP COIL 4N7 +-0N1 Q29/1GHZ 0402 T F6 x x x x

L803 Fixed Inductor CHIP COIL 4N7 +-0N1 Q29/1GHZ 0402 T F6 x x x x

L804 Fixed Inductor CHIP COIL 18N J Q29/800MHZ 0402 T F6 x x x x

L805 Fixed Inductor CHIP COIL 18N J Q29/800MHZ 0402 T F6 x x x x

L807 Fixed Inductor CHIP COIL 8N2 J Q28/800MHZ 0402 T G6 x x x x

L825 Fixed Inductor CHIP COIL 33N G Q40/250MHZ 0603 T S2 x x x x

L836 EMC Component CHIP BEAD ARRAY 2X1000R 0405 T T2 x x x x

N100 Magnetic Sensor HALL IC SWITCH SH248CSP VCC x x x x

N101 Magnetic Sensor HALL IC SWITCH SH248CSP VCC x x x x

N130

Power Management

IC CURRNT SENS LM3820 USMD10 PB-FREE B P2 x x x x

N230

Power Management

IC DC/DC 1.8V/1.5V(LM2608-1.8)USMD10 T P4 x x x x

N233

Power Management

IC REG+MAS9161B2GB06 2.8V 80MA TSOT5 T O4 x x x x

N310 Other IC VREG & LEVELSHIFT(LP3928)USMD16 B D3 x x x x

N500 RF ASIC HELGO86 LB T F7 x x x x

N656 Other IC FM RECEIVER(TEA5767HN) LQFP40 T N3 x x x x

N661 Other IC VREG & LEVELSHIFT(LP3928)USMD16 T L5 x x x x

N662 Analog IC AF AMP 0.4W LM4890/NCP2890 PBFREE T Q3 x x x x

N700 Power Amplifier PW AMP RF9250E4.1 Micro GSM/EDGE T F3 x x x x

N750 Infrared IRDA CIM-50M5A **** RESERVED **** B P10 x x x x

R1 Fixed Resistor CHIPRES 0W06 10K J 0402 x x x x

R105 Variable Resistor CHIP VARISTOR VWM15V VC50V 0402 x x x x

RM-25

Nokia Customer Care Parts and layouts

Page 2–26 Company Confidential 9235618 (Issue 2)

Ref Type Name Side XY E

R106 Variable Resistor CHIP VARISTOR VWM15V VC50V 0402 x x x x

R130 Fixed Resistor CHIPRES 0W06 2K2 J 0402 B Q2 x x x x

R131 Fixed Resistor CHIPRES 0W06 2K2 J 0402 B Q2 x x x x

R132 Variable Resistor NTC RES 0W1 47K J B 4050+-3% 0402 B K10 x x x x

R133 Fixed Resistor CHIPRES 0W06 100K J 0402 T L7 x x x x

R134 Fixed Resistor CHIPRES 0W06 100K J 0402 B S5 x x x x

R192 Fixed Resistor CHIPRES 0W06 2K7 J 0402 T I3 x x x x

R194 Fixed Resistor CHIPRES 0W06 2R2 J 0402 T I3 x x x x

R200 Fixed Resistor CHIPRES JUMPER 0R0 0402 T K3 x x x x

R252 Fixed Resistor CHIPRES 0W06 100K J 0402 T L8 x x x x

R253 Fixed Resistor CHIPRES 0W06 100K F 200PPM 0402 T L8 x x x x

R254 Fixed Resistor CHIPRES 0W06 100K F 200PPM 0402 T I8 x x x x

R255 Variable Resistor NTC RES 0W1 47K J B 4050+-3% 0402 T H8 x x x x

R257 Fixed Resistor CHIPRES 0W06 220R J 0402 T L7 x x x x

R259 Fixed Resistor CHIPRES 0W25 0R22 J 0805 T I6 x x x x

R260 Fixed Resistor CHIPRES 0W06 27K F 0402 T K6 x x x x

R261 Integrated Discretes ASIP 4XESD *** PB-FREE *** BGA5 B L10 x x x x

R265 Fixed Resistor CHIPRES JUMPER 0R0 0603 T K8 x x x x

R270 Fixed Resistor CHIPRES 0W06 4K7 J 0402 T I8 x x x x

R310 Integrated Discretes ASIP SIM INTERFACE ** PB-FREE ** B E4 x x x x

R313 Fixed Resistor CHIPRES 0W06 18K J 0402 B E4 x x x x

R315 Integrated Discretes ASIP MMC FILTER *** PB-FREE *** B E5 x x x x

R371 Fixed Resistor CHIPRES 0W06 18K J 0402 T M7 x x x x

R402 Fixed Resistor CHIPRES 0W06 100R J 0402 T T2 x x x x

R419 Fixed Resistor CHIPRES 0W06 100K J 0402 T Q3 x x x x

R420 Fixed Resistor CHIPRES 0W06 3K9 J 0402 T M5 x x x x

R421 Fixed Resistor CHIPRES 0W06 3K9 J 0402 T M5 x x x x

R422 Fixed Resistor CHIPRES 0W06 100R F 200PPM 0402 T M8 x x x x

R423 Fixed Resistor CHIPRES 0W06 100R F 200PPM 0402 T M8 x x x x

R426 Fixed Resistor CHIPRES 0W06 2K7 J 0402 T M7 x x x x

R436 Fixed Resistor CHIPRES JUMPER 0R0 0402 T R7 x x x x

R440 Fixed Resistor CHIPRES JUMPER 0R0 0402 T R8 x x x x

RM-25

Parts and layouts Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 2–27

Ref Type Name Side XY E

R442 Fixed Resistor CHIPRES JUMPER 0R0 0402 T P9 x x x x

R446 Fixed Resistor CHIPRES 0W06 33R J 0402 B T5 x x x x

R447 Fixed Resistor CHIPRES 0W06 68R J 0402 T R8 x x x x

R448 Fixed Resistor CHIPRES 0W06 68R J 0402 T R8 x x x x

R451 Integrated Discretes ASIP USB2 FILTER BGA10 PBFREE B S5 x x x x

R452 Fixed Resistor CHIPRES 0W06 220K J 0402 T R9 x x x x

R465 Fixed Resistor CHIPRES 0W06 4K7 J 0402 T N5 x x x x

R470 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L8 x x x x

R471 Fixed Resistor CHIPRES JUMPER 0R0 0402 T P9 x x x x

R491 Fixed Resistor CHIPRES 0W06 680R J 0402 T O5 x x x x

R492 Fixed Resistor CHIPRES 0W06 100R J 0402 T O5 x x x x

R500 Fixed Inductor CHIP COIL 3N3 +-0N1 Q30/1GHZ 0402 T D6 x x x x

R501 Fixed Resistor CHIPRES 0W06 5K6 J 0402 T D7 x x x x

R502 Fixed Resistor CHIPRES 0W06 6K8 F 0402 T D7 x x x x

R503 Resistor Network RES NETWORK 0W04 2DB ATT 0404 T D7 x x x x

R504 Fixed Resistor CHIPRES 0W06 4K7 J 0402 T G8 x x x x

R505 Fixed Resistor CHIPRES 0W06 4K7 J 0402 T G8 x x x x

R506 Fixed Resistor CHIPRES 0W06 22K J 0402 T G8 x x x x

R511 Fixed Resistor CHIPRES 0W06 4K7 J 0402 T E5 x x x x

R512 Fixed Resistor CHIPRES 0W06 5K6 F 0402 T E6 x x x x

R513 Fixed Resistor CHIPRES 0W06 15K J 0402 T D8 x x x x

R514 Fixed Resistor CHIPRES 0W06 15K J 0402 T G6 x x x x

R515 Resistor Network RES NETWORK 0W06 4X5K6 J 0804 T E7 x x x x

R516 Fixed Resistor CHIPRES 0W06 10R J 0402 T F8 x x x x

R519 Fixed Resistor CHIPRES JUMPER 0R0 0402 T F8 x x x x

R600 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L9 x x x x

R601 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L9 x x x x

R602 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T K9 x x x x

R603 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T K9 x x x x

R604 Fixed Resistor CHIPRES 0W06 470R J 0402 T J9 x x x x

R605 Fixed Resistor CHIPRES 0W06 2K2 J 0402 T K9 x x x x

R606 Fixed Resistor CHIPRES 0W06 2K2 J 0402 T K9 x x x x

RM-25

Nokia Customer Care Parts and layouts

Page 2–28 Company Confidential 9235618 (Issue 2)

Ref Type Name Side XY E

R607 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T K9 x x x x

R608 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T J9 x x x x

R627 Fixed Resistor CHIPRES JUMPER 0R0 0402 B S6 x x x x

R628 Fixed Resistor CHIPRES 0W06 470R J 0402 T I8 x x x x

R629 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T J9 x x x x

R630 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T J9 x x x x

R631 Fixed Resistor CHIPRES 0W06 100K J 0402 T I9 x x x x

R634 Resistor Network RES NETWORK 0W06 2X10R J 0404 B S7 x x x x

R635 Integrated Discretes ASIP MIC W/ESD RES+CAP+ZDI BGA11 B S6 x x x x

R640 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T K3 x x x x

R642 Fixed Resistor CHIPRES 0W06 18K J 0402 T Q3 x x x x

R644 Fixed Resistor CHIPRES 0W06 27K J 0402 T R3 x x x x

R645 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 T T4 x x x x

R646 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 T T2 x x x x

R648 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 B S7 x x x x

R649 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 B S6 x x x x

R650 Resistor Network RES NETWORK 0W06 2X220R J 0404 T T4 x x x x

R651 Resistor Network RES NETWORK 0W03 4X22R J 0804 B L10 x x x x

R652 Fixed Resistor CHIPRES 0W06 220R J 0402 B K10 x x x x

R653 Resistor Network RES NETWORK 0W06 2X10R J 0404 B S6 x x x x

R654 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 T S2 x x x x

R655 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 T T5 x x x x

R656 Fixed Resistor CHIPRES 0W06 12R J 0402 T M2 x x x x

R657 Fixed Resistor CHIPRES 0W06 33K J 0402 T M3 x x x x

R658 Fixed Resistor CHIPRES 0W06 47R J 0402 T M3 x x x x

R660 Fixed Resistor CHIPRES 0W06 100K J 0402 T M4 x x x x

R662 Fixed Resistor CHIPRES 0W06 5R6 J 0402 T N4 x x x x

R664 Fixed Resistor CHIPRES 0W06 220K J 0402 T N2 x x x x

R665 Fixed Resistor CHIPRES 0W06 100K J 0402 T N2 x x x x

R667 Fixed Resistor CHIPRES 0W06 18K F 100PPM 0603 T N4 x x x x

R669 Fixed Resistor CHIPRES 0W06 33K J 0402 T N2 x x x x

R671 Fixed Resistor CHIPRES 0W06 100K J 0402 T O5 x x x x

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Ref Type Name Side XY E

R672 Fixed Resistor CHIPRES 0W06 100K J 0402 T O4 x x x x

R673 Fixed Resistor CHIPRES 0W06 100K J 0402 T N5 x x x x

R675 Fixed Resistor CHIPRES 0W06 27K J 0402 T Q3 x x x x

R676 Fixed Resistor CHIPRES 0W06 100K J 0402 T N5 x x x x

R677 Fixed Resistor CHIPRES 0W06 100K J 0402 T O5 x x x x

R689 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L4 x x x x

R690 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L4 x x x x

R691 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L4 x x x x

R692 Fixed Resistor CHIPRES JUMPER 0R0 0402 T L4 x x x x

R693 Fixed Resistor CHIPRES 0W06 1M0 J 0402 T J3 x x x x

R695 Fixed Resistor CHIPRES JUMPER 0R0 0402 T K5 x x x x

R697 Resistor Network RES NETWORK 0W06 2X10R J 0404 T S2 x x x x

R701 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T F3 x x x x

R702 Fixed Resistor CHIPRES 0W06 4K7 J 0402 T F4 x x x x

R703 Fixed Resistor CHIPRES JUMPER 0R0 0402 T F4 x x x x

R711 Fixed Resistor CHIPRES JUMPER 0R0 0402 T G7 x x x x

R712 Fixed Resistor CHIPRES JUMPER 0R0 0402 T G7 x x x x

R713 Fixed Resistor CHIPRES 0W06 33R J 0402 T G3 x x x x

R715 Fixed Resistor CHIPRES 0W06 33R J 0402 T G3 x x x x

R717 Resistor Network RES NETWORK 0W04 1DB ATT 0404 T G3 x x x x

R718 Resistor Network RES NETWORK 0W04 1DB ATT 0404 T G4 x x x x

R750 Fixed Resistor CHIPRES 0W5 4R7 J 200PPM 1210 B O10 x x x x

R800 Fixed Resistor CHIPRES 0W06 3K3 J 0402 T D4 x x x x

R801 Fixed Resistor CHIPRES 0W06 10R J 0402 T E4 x x x x

R802 Fixed Resistor CHIPRES 0W06 560R J 0402 T E4 x x x x

R803 Fixed Resistor CHIPRES JUMPER 0R0 0402 T R7 x x x x

R804 Fixed Resistor CHIPRES 0W06 1K0 J 0402 T P4 x x x x

R806 Resistor Network RES NETWORK 0W06 2X100R J 0404 T T5 x x x x

R807 Fixed Resistor CHIPRES 0W06 1M0 J 0402 T Q6 x x x x

R808 Fixed Resistor CHIPRES 0W06 100K J 0402 T Q6 x x x x

R809 Variable Resistor VAR.ARRAY 2X16V 824-915MHZ 0405 T U5 x x x x

R859 Fixed Resistor CHIPRES 0W06 33K J 0402 T J9 x x x x

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Ref Type Name Side XY E

R861 Fixed Resistor CHIPRES 0W06 18K J 0402 T Q3 x x x x

R864 Fixed Resistor CHIPRES 0W06 47R J 0402 T Q4 x x x x

R865 Fixed Resistor CHIPRES 0W06 220R J 0402 T Q4 x x x x

R866 Fixed Resistor CHIPRES 0W06 100K J 0402 B E3 x x x x

R867 Fixed Resistor CHIPRES JUMPER 0R0 0603 T I6 x x x x

R870 Fixed Resistor CHIPRES 0W06 220R J 0402 B K10 x x x x

R871 Fixed Resistor CHIPRES 0W06 100R J 0402 B S5 x x x x

R872 Fixed Resistor CHIPRES 0W06 470R J 0402 T J9 x x x x

R873 Fixed Resistor CHIPRES 0W06 22R J 0402 T T5 x x x x

R937 Fixed Resistor CHIPRES 0W06 33K J 0402 T K9 x x x x

S001 Switch And Knob MMC Switch B E2 x x x x

T500 Balun TRANSF BALUN 3290-3980MHZ T D7 x x x x

T700 Balun TRANSF BALUN 1800+-100MHZ 2X1.25 T G7 x x x x

T800 Transformer TRANSF BALUN 1.9GHZ+-100MHZ2X1.25 T G5 x x x x

V100 LED LED WHITE 90-345MCD 10MA 90DEG ? ? x x x

V101 LED LED WHITE 90-345MCD 10MA 90DEG ? ? x x x

V130 Diode TVS DI 1PMT16AT3 16V 175W PWRMITE B T4 x x x x

V400 Integrated Discretes ASIP EMI/ESD FILTER BGA6 T T2 x x x x

V402 Diode SCH DIODE 30V 200MA VF 0V5 SOD523 T P3 x x x x

V656 Diode CAP.DI BB202 CT 2.5 FM 0R8 SOD523 T M4 x x x x

V657 Diode CAP.DI BB202 CT 2.5 FM 0R8 SOD523 T M4 x x x x

V800 Bipolar Transistor BJT TR BGA428 LNA1.8GHZ 19.5DB SOT363 T D4 x x x x

V801 Bipolar Transistor BJT TR 2SC5658QRS N 50V 0A1 0W15 VMT3 T Q4 x x x x

X131 Battery Connector SM BATTERY CONN 3POLE SPR B S4 x x x x

X132 System Connector SM SYSTEM CONNECTOR 14POL B U6 x x x x

X400

Board To Board

Connector SM CONN 2X11 SPR 50V 0.5A PCB/PCB T S5 x x x x

X816

Board To Board

Connector SM CONN B2B 2X8 F P0.4 T S7 x x x x

X817

Board To Board

Connector SM CONN B2B 2X25 M P0.4 T T3 x x x x

X820

Other Customized

Connector SIM/MMC combo reader P2103 B F6 x x x x

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Ref Type Name Side XY E

X822 Coaxial Connector SM CONN RF JACK 50R 2W 6GHZ T E2 x x x x

X823

Other Customized

Connector SM CONN VIBRA SPACER PAD 2.8X1.8 B C2 x x x x

X825 Spring UI SPRING T T2 x x x x

Z191 Ceramic Filter CER FILT 2441+-41.75MHZ 2.7X2.2 T I3 x x x x

Z192 Balun TRANSF BALUN 2400+/-100MHZ T I4 x x x x

Z200 EMC Component FERRITE BEAD 0R5 600R/100MHZ 0603 T I5 x x x x

Z221 EMC Component FERRITE BEAD 0R5 600R/100MHZ 0603 T I5 x x x x

Z401 Integrated Discretes ASIP 10-CH ESD EMI FILTER BGA25 T Q3 x x x x

Z402 Integrated Discretes ASIP 10-CH ESD EMI FILTER BGA25 T Q4 x x x x

Z700 SAW Filter SAW FILT 897.5+-17.5MHZ/3DB 2X1.6 T G7 x x x x

Z800 Antenna Switch DIPL+3SW824-960/1710-1990MHZ5.4*4 T E3 x x x x

Z801 SAW Filter SAW FILT 1960+-30MHZ/3.5DB 2X1.6 T D3 x x x x

Z802 SAW Filter SAW FILT 1842.5+-37.5MHZ 2X1.6 T F5 x x x x

Z803 SAW Filter SAW FILT 942.5+-17.5MHZ/3DB 2X1.6 T F5 x x x x

Z814 Integrated Discretes ASIP 10-CH ESD EMI FILTER BGA25 T Q6 x x x x

After Sales Kit N6260 RM-25 SWAP ENGINE E&A BLACK x

Shield PA LID DMD11314 R1024 x x x x

Shield HELGO LID DMD11312 R1024 x x x x

Other Assembly Camera Service Assembly x x x x

Other Assembly

RM-25 Mech sub-assembly Black

CoffeP2103 x x x x

Cover Assembly B1 cover assembly Black Coffee x x x x

Cover Assembly B1 cover assembly Silver Sand x x x x

Cover Battery lid assy Black Coffee P2103 x x x x

Cover Battery lid assy Silver Sand P2103 x x x x

Shield Assembly UI flex assy 040-000388 P2103 x x x x

Frame And Chassis

Assembly Frame Service Assembly P2103 x x x x

Cover Assembly A2 cover assembly Silver Sand P2103 x x x x

Cover Assembly A2 cover assembly Black Coffee x x x x

Other Assembly

RM-25 Mech sub-assembly Silver

SandP2103 x x x x

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Ref Type Name Side XY E

32MB DV-RS-Multi Media Card x

Component layouts

Note: See also A3 size layouts in Schematics chapter.

Component layout, bottom

Figure 3 Component layout for 1fsa_09a, bottom

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Figure 4 Component layout for 1fsa_11a, bottom

Component layout, top

Figure 5 Component layout for 1fsa_09a, top

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Figure 6 Component layout for 1fsa_11a, top

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Page 2–36 Company Confidential 9235618 (Issue 2)

3 — Phoenix service software

Nokia Customer Care

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Page 3–2 Company Confidential 9235618 (Issue 2)

Table of Contents

Service software installation......................................................................................................................................................3–5

Phoenix installation steps in brief......................................................................................................................................3–5

Installing Phoenix....................................................................................................................................................................3–5

Phoenix update installation...............................................................................................................................................3–11

Uninstalling Phoenix.............................................................................................................................................................3–12

Repairing Phoenix installation..........................................................................................................................................3–13

Phoenix service software data package overview......................................................................................................3–14

Installing Phoenix data package......................................................................................................................................3–14

Uninstalling Phoenix data package.................................................................................................................................3–18

Service software instructions..................................................................................................................................................3–19

Configuring users in Phoenix.............................................................................................................................................3–19

Managing connections in Phoenix...................................................................................................................................3–20

Installing Flash support files for FPS-8* and FLS-4*...................................................................................................3–23

Updating FPS-8 Flash prommer software......................................................................................................................3–26

Activating FPS-8......................................................................................................................................................................3–28

Deactivating FPS-8.................................................................................................................................................................3–29

Updating JBV-1 docking station software......................................................................................................................3–30

Service software concepts........................................................................................................................................................3–35

Flash concept...........................................................................................................................................................................3–35

POS flash concept...................................................................................................................................................................3–36

JBV-1 flash concept................................................................................................................................................................3–36

Module jig flash concept......................................................................................................................................................3–37

Module jig service concept.................................................................................................................................................3–38

JBV-1 service concept............................................................................................................................................................3–39

List of Figures

Figure 7 Dongle not found...........................................................................................................................................................3–6

Figure 8 Preparing setup..............................................................................................................................................................3–6

Figure 9 Welcome dialogue.........................................................................................................................................................3–7

Figure 10 Disclaimer text..............................................................................................................................................................3–7

Figure 11 Destination folder........................................................................................................................................................3–8

Figure 12 Installation status 1....................................................................................................................................................3–8

Figure 13 Installation status 2....................................................................................................................................................3–9

Figure 14 Registering components 1........................................................................................................................................3–9

Figure 15 Restart computer.......................................................................................................................................................3–10

Figure 16 Registering components 2.....................................................................................................................................3–10

Figure 17 Finish installation......................................................................................................................................................3–11

Figure 18 Installation interrupted...........................................................................................................................................3–12

Figure 19 Remove program.......................................................................................................................................................3–12

Figure 20 Finish uninstallation.................................................................................................................................................3–13

Figure 21 Repair program..........................................................................................................................................................3–14

Figure 22 Extracting files............................................................................................................................................................3–15

Figure 23 Continue data package installation.....................................................................................................................3–15

Figure 24 Data package setup information..........................................................................................................................3–16

Figure 25 Data package destination folder..........................................................................................................................3–16

Figure 26 Start copying files......................................................................................................................................................3–17

Figure 27 Data package installation status..........................................................................................................................3–17

Figure 28 Finish data package installation..........................................................................................................................3–18

Figure 29 Uninstalling Phoenix data package.....................................................................................................................3–18

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Figure 30 Finishing data package uninstallation...............................................................................................................3–19

Figure 31 Login..............................................................................................................................................................................3–19

Figure 32 Login, user configured.............................................................................................................................................3–20

Figure 33 Phoenix icon...............................................................................................................................................................3–20

Figure 34 Manage connections................................................................................................................................................3–20

Figure 35 Connections list..........................................................................................................................................................3–21

Figure 36 Select mode: Manual................................................................................................................................................3–21

Figure 37 FLS virtual port icon..................................................................................................................................................3–21

Figure 38 Connections list..........................................................................................................................................................3–22

Figure 39 Connection information..........................................................................................................................................3–22

Figure 40 Scan product...............................................................................................................................................................3–22

Figure 41 Product support module information................................................................................................................3–23

Figure 42 Flash update welcome dialog...............................................................................................................................3–23

Figure 43 Uninstall flash update package.............................................................................................................................3–24

Figure 44 Flash installation interrupted................................................................................................................................3–24

Figure 45 Continue flash update..............................................................................................................................................3–24

Figure 46 Flash destination folder..........................................................................................................................................3–25

Figure 47 Flash installation status..........................................................................................................................................3–25

Figure 48 Finish flash update....................................................................................................................................................3–26

Figure 49 Phoenix icon...............................................................................................................................................................3–26

Figure 50 FPS-8 maintenance...................................................................................................................................................3–26

Figure 51 Prommer SW update................................................................................................................................................3–27

Figure 52 Prommer SW update done.....................................................................................................................................3–27

Figure 53 FPS-8 info window....................................................................................................................................................3–28

Figure 54 Flash directory window...........................................................................................................................................3–28

Figure 55 Prommer maintenance...........................................................................................................................................3–29

Figure 56 Box activation.............................................................................................................................................................3–29

Figure 57 Deactivation warning..............................................................................................................................................3–30

Figure 58 Extracting JBV-1 update files.................................................................................................................................3–31

Figure 59 JBV-1 update information.......................................................................................................................................3–31

Figure 60 JBV-1 update destination folder...........................................................................................................................3–31

Figure 61 Select installation: Full.............................................................................................................................................3–32

Figure 62 Select program folder..............................................................................................................................................3–32

Figure 63 Finish JBV-1 update installation...........................................................................................................................3–33

Figure 64 Checking JBV-1 SW version.....................................................................................................................................3–33

Figure 65 JBV-1 update directory window...........................................................................................................................3–34

Figure 66 JBV-1 SW update done.............................................................................................................................................3–34

Figure 67 JBV-1 SW status..........................................................................................................................................................3–34

Figure 68 Flash concept..............................................................................................................................................................3–35

Figure 69 POS flash concept......................................................................................................................................................3–36

Figure 70 JBV-1 flash concept...................................................................................................................................................3–36

Figure 71 Module jig flash concept.........................................................................................................................................3–37

Figure 72 Module jig service concept.....................................................................................................................................3–38

Figure 73 JBV-1 service concept...............................................................................................................................................3–39

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Service software installation

Phoenix installation steps in brief

Phoenix is the DCT-4 generation service software for reprogramming, testing and tuning the phone.

To install Phoenix, you need to:

• Connect a DK2 Dongle or FLS-4S POS Flash Device

• Install the Phoenix Service SW

• Install the Data Package for Phoenix

• Configure users

• Manage connection settings (depends on the tools you are using)

Phoenix is now ready for FLS-4S Point Of Sales Flash Device use.

If you use FPS-8:

• Update FPS-8 SW

• Activate FPS-8

• Update JBV-1 Docking Station SW (only when needed)

Phoenix is now ready to be used with FPS-8 flash prommer and other tools as well.

The Phoenix Service Software installation contains:

• Service software support for all phone models included in the package

• Flash update package files for FPS-8* and FLS-4S programming devices

• All needed drivers for:

• DK2 dongle

• FLS-4S point of sales flash device

• USB devices

Note: Separate installation packages for flash update files and drivers are also available, but it is not

necessary to use them unless updates appear between Phoenix Service SW releases. If separate update

packages are used, they should be used after Phoenix and data packages have been installed.

Supported operating systems

• Windows 2000 and XP.

Hardware requirements for using Phoenix

• Minimum: Processor 300 MHz, RAM memory 64 MB, disk space 100 MB.

• Recommended for Windows 2000: Processor 700 MHz, RAM memory 256 MB, disk space 150 MB.

Installing Phoenix

Before you begin

• Check that a Dongle is attached to the parallel port of your computer.

• Download the installation package (for example, phoenix_service_sw_a15_2004_24_7_55.exe) to your

computer (in C:\TEMP, for instance).

• Close all other programs.

• Run the application file (for example, phoenix_service_sw_a15_2004_24_7_55.exe) and follow the instructions

on the screen.

• Administrator rights may be required to be able to install Phoenix depending on the operating system.

• If uninstalling or rebooting is needed at any point, you will be prompted by the Install Shield program.

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Context

If at any point during installation you get this message, Dongle is not found and installation cannot continue:

Figure 7 Dongle not found

Possible reasons may be defective or too old PKD-1 Dongle (five digit serial number Dongle when used with

FPS-8 Prommer) or that the FLS-4S POS Flash Dongle is defective or power to it is not supplied by external charger.

Check the COM/parallel ports used first! After correcting the problem Installation can be restarted.

For more detailed information, please refer to Phoenix Help files. Each feature in Phoenix has its own Help

function, which can be activated while running the program. Press the F1 key or the feature’s Help button to

activate a Help file.

Steps

1. Run the phoenix_service_sw_a15_2004_24_7_55.exe to start installation.

Figure 8 Preparing setup

Install Shield will prepare.

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2. Click Next in Welcome dialog to continue.

Figure 9 Welcome dialogue

3. Read the disclaimer carefully.

Figure 10 Disclaimer text

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4. Choose destination folder. The default folder C:\ProgramFiles\Nokia\Phoenix is recommended.

Figure 11 Destination folder

Click Next to continue. You may choose another location by selecting Browse (not recommended).

5. Wait for the components to be copied.

Figure 12 Installation status 1

Progress of the setup is shown in the Setup Status window.

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6. Wait for the drivers to be installed and updated.

Figure 13 Installation status 2

The process may take several minutes to complete.

If the operating system does not require rebooting (Windows 2000, XP) the PC components are registered

right away.

Figure 14 Registering components 1

If the operating system used requires restarting your computer (Windows 98, SE, ME) the Install Shield Wizard

will tell you about it. Select Yes... to reboot the PC immediately and No... to reboot the PC manually afterwards.

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Figure 15 Restart computer

After the reboot, components are registered and Phoenix is ready for use.

Note: Phoenix does not work, if components have not been registered.

Figure 16 Registering components 2

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7. Click Finish to end installation.

Figure 17 Finish installation

Phoenix is now ready for use.

Next action

After the installation, Phoenix service software can be used after:

• installing phone model specific data package for Phoenix, and

• configuring users and connections.

FLS-4S can be used right away.

FPS-8* can be used after updating its Flash Update Package files.

Phoenix update installation

If you already have the Phoenix Service SW installed on your computer, sooner or later there will be need to

update it when new versions are released.

Always use the latest available versions of both the Phoenix Service SW and the phone-specific Data Package.

Instructions can be found in phone model specific Technical Bulletins and Phone Data Package readme.txt files

(shown during installation).

To update the Phoenix you need to take exactly the same steps as when installing it for the first time:

• Download the installation package to your computer hard disk.

• Close all other programs.

• Run the application file (for example, phoenix_service_sw_a15_2004_24_7_55.exe).

• New version of Phoenix will be installed.

• Driver versions will be checked and updated.

When you update the Phoenix from old to new version (for example, a14_2004_16_4_47 to a15_2004_24_7_55),

the update will take place automatically without uninstallation.

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If you try to update the Phoenix with the same version that you already have (for example, a15_2004_24_7_55

to a15_2004_24_7_55) you are asked if you want to uninstall the version of Phoenix you have on your PC. In this

case you can choose between total uninstallation and repair just like when you choose to uninstall Phoenix

service software from the Windows Control panel.

If you try to install an older version (for example, downgrade from a15_2004_24_7_55 to a14_2004_16_4_47),

installation will be interrupted.

Figure 18 Installation interrupted

Always follow the instructions on the screen.

Uninstalling Phoenix

Context

You can uninstall Phoenix service software manually from the Windows Control Panel.

Steps

1. Open the Windows Control Panel and choose Add/Remove Programs.

2. To uninstall Phoenix, choose Phoenix Service Software -> Change/Remove -> Remove.

Figure 19 Remove program

The progress of the uninstallation is shown.

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3. If the operating system does not require rebooting, click Finish to complete.

Figure 20 Finish uninstallation

If the operating system requires rebooting, InstallShield Wizard will notify you. Select Yes... to reboot the PC

immediately and No... to reboot the PC manually afterwards.

Repairing Phoenix installation

Context

If you experience any problems with the service software or suspect that files have been lost, you can use the

repair function before completely reinstalling Phoenix.

Note: The original installation package (for example, phoenix_service_sw_a15_2004_24_7_55.exe) must

be found on your PC when you run the repair setup.

Steps

1. Open Windows Control Panel -> Add/Remove Programs.

2. Select Phoenix Service Software -> Change/Remove.

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3. In the following view, select Repair.

Figure 21 Repair program

Phoenix will now reinstall components and register them.

The procedure is the same as when updating Phoenix.

4. To complete the repair, click Finish.

Phoenix service software data package overview

Each product has its own data package (DP). The product data package contains all product-specific data files

to make the Phoenix service software and tools usable with a certain phone model.

The data package contains the following:

• Product software Binary files

• Files for type label printing

• Validation file for the Faultlog repair data reporting system

• All product-specific configuration files for Phoenix software components

Data files are stored under C:\Program Files\Nokia\Phoenix (default).

Installing Phoenix data package

Before you begin

• Product data package contains all product-specific data to make the Phoenix Service Software and tools

usable with a certain phone model.

• Check that the dongle is attached to the parallel port of your computer.

• Install Phoenix Service SW.

• Download the installation package (for example, RM-25_dp_EA_v_1_0.exe) to your computer (for example, in

C:\TEMP).

• Close all other programs.

• Run the application file (for example, RM-25_dp_EA_ v_1_0.exe) and follow the instructions on the screen.

If you already have the Phoenix Service SW installed on your computer, you will need to update it when a new

version is released.

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Note: Very often the Phoenix Service SW and the phone-specific data package for Phoenix come in

pairs, meaning that a certain version of Phoenix can only be used with a certain version of the data

package. Always use the latest available versions of both. Instructions can be found in phone model

specific Technical Bulletins and readme.txt files of the data packages.

Steps

1. To start installation, run the application file (for example, RM-25_dp_EA_ v_1_0.exe).

2. Click Next, and wait for the installation files to be extracted.

Figure 22 Extracting files

3. Click Next to continue.

Figure 23 Continue data package installation

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In this view you can see the contents of the data package. Read the text carefully. There should be information

about the Phoenix version required with this data package.

Click Next to continue.

Figure 24 Data package setup information

4. Confirm location and click Next to continue.

Figure 25 Data package destination folder

The install shield checks where the Phoenix application is installed and the directory is shown.

Click Next to continue.

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5. Click Next to start copying the files.

Figure 26 Start copying files

Phone model specific files will be installed. Please wait.

Figure 27 Data package installation status

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6. Click Finish to complete the installation.

Figure 28 Finish data package installation

You now have all phone model specific files installed in your Phoenix Service SW.

Next action

Phoenix can be used, for example, for flashing phones and printing type labels after:

• configuring users, and

• managing connections.

FLS-4S can be used right away.

FPS-8* can be used after updating Flash Update Package files.

Uninstalling Phoenix data package

Context

If you try to install the same version of the Phoenix data package that you already have, you are asked if you

want to uninstall the existing version.

There is no need to uninstall the older version of a data package, unless instructions to do so are given in

the readme.txt file of the data package and bulletins related to the release.

Please read all related documents carefully.

Steps

1. To uninstall the data package, click OK Cancel to interrupt the uninstallation.

Figure 29 Uninstalling Phoenix data package

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2. Once the previously installed data package is uninstalled, click Finish.

Figure 30 Finishing data package uninstallation

Alternative steps

• You can also uninstall the data package manually from Windows Control Panel -> Add/Remove

Programs -> xx-xx * Phone Data Package. (*= type designator of the phone)

Next action

Run the installation package again to continue installation from the beginning.

Service software instructions

Configuring users in Phoenix

Steps

1. Start Phoenix Service SW and log in.

Figure 31 Login

If the user ID is already configured, choose it from the dropdown list and click OK.

To add a new user or edit existing ones, click Maintain.

2. To add information for a new user, click New.

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3. Type in the name and initials of the user and click OK.

A new user is now created.

4. Click OK.

You are now able to login with the user name created.

5. Click OK.

Figure 32 Login, user configured

Managing connections in Phoenix

Steps

1. Start Phoenix Service SW and log in.

Figure 33 Phoenix icon

2. Choose File -> Manage Connections.

Figure 34 Manage connections

Existing connections can be selected, edited, deleted, and new ones created by using this dialog.

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Figure 35 Connections list

3. Click Add to add a new connection, and select if you want to create it manually or by using the Connection

Wizard.

In the following dialogs you will be asked to select settings for the connection. If you use the Wizard, connect

the tools and a phone to your PC and the wizard will automatically try to configure the correct connection.

4. Select Manual mode, and click Next to continue.

Figure 36 Select mode: Manual

i For FLS-4S POS Flash Device, choose the following connection settings:

• Media: FBUS

• COM Port: Virtual COM Port used by FLS-4

Note: ALWAYS check this. Go to Windows -> Control Panel -> FLS Virtual Port -> Configuration.

Figure 37 FLS virtual port icon

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ii For FPS-8 Flash Prommer, choose the following connection settings:

• Media: FPS-8

• Port Num: COM Port where FPS-8 is connected

• COMBOX_DEF_MEDIA: FBUS

5. Click Finish to complete the configuration.

6. Activate the connection you want to use by clicking it, use up/down arrows to move it on top of the list, and

click Apply.

Figure 38 Connections list

The connection is now selected and can be used after closing the Manage Connections window.

Selected connection will be shown on the right hand bottom corner of the screen.

Figure 39 Connection information

7. To use the selected connection, connect the phone to Phoenix with correct service tools, make sure that it

is switched on and select Scan Product.

Figure 40 Scan product

When a product is found, Phoenix will load product support. Name of the loaded product support module

and its version information will be shown on the bottom of the screen.

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Figure 41 Product support module information

Installing Flash support files for FPS-8* and FLS-4*

Before you begin

Note: Only separate installation package.

• Install Phoenix Service SW.

• Install phone model specific data package for Phoenix.

• The flash support files are delivered in the same installation package with Phoenix data packages or newer

Phoenix packages beginning from September 2003.

• Normally it is enough to install Phoenix and the phone-specific data package because the Phoenix installation

always includes the latest flash update package files for FLS-4S/FPS-8*.

• A separate installation package for flash support files is available, and the files can be updated according to

this instruction if updates appear between Phoenix/data package releases.

Context

If you are not using a separate installation package, you can skip this section and continue with FPS-8 Flash

prommer SW update (Page 3–26) after installing a new phone data package.

Steps

1. Start by double clicking flash_update_03_13_001.exe to begin installation.

Figure 42 Flash update welcome dialog

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2. If the same version of Flash Update package already exists, and you want to reinstall it, the previous package

is first uninstalled. Restart installation again after that.

Figure 43 Uninstall flash update package

If you try to downgrade the existing version to older ones, the setup will be aborted. If you really want to

downgrade, uninstall newer files manually from Control Panel and then rerun the installation again.

Figure 44 Flash installation interrupted

If an older version exists on your PC and it needs to be updated, click Next to continue installation.

Figure 45 Continue flash update

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3. It is highly recommended to install the files to the default destination folder C:\Program Files\Nokia

\Phoenix. Click Next to continue.

Figure 46 Flash destination folder

When installing the flash update files for the first time you may choose another location by selecting

Browse. However, this is not recommended.

Installation will continue.

Figure 47 Flash installation status

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4. Choose Finish to complete the installation procedure.

Figure 48 Finish flash update

Next action

FLS-4 can be used right after the Flash Update Package is installed.

FPS-8* flash prommer must be updated using Phoenix!

Updating FPS-8 Flash prommer software

Steps

1. Start Phoenix Service Software and log in, manage connection correctly for the FPS-8* flash prommer.

Figure 49 Phoenix icon

2. Choose Flashing -> FPS-8 maintenance.

Figure 50 FPS-8 maintenance

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3. When the new FPS-8 flash update package is installed to computer you will be asked to update the files to

your FPS-8 Prommer. Select Yes to update files.

Figure 51 Prommer SW update

4. Wait until you are notified that update has been successful; the procedure will take a couple of minutes.

Click OK to close the FPS-8 Maintenance window.

Figure 52 Prommer SW update done

View after successful prommer software update:

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Figure 53 FPS-8 info window

Alternative steps

• FPS-8 SW can also be updated by pressing Update button and selecting appropriate fps8upd.ini file in C:

\Program Files\Nokia\Phoenix\Flash.

Figure 54 Flash directory window

• All files can be loaded separately to FPS-8. To do this, just press the right mouse button in the Flash box

files window and select the file type to be loaded.

More information can be found in Phoenix Help.

Activating FPS-8

Context

Before FPS-8 can be successfully used for phone programming, it must first be activated.

First fill in the FPS-8 activation request sheet in the FPS-8 sales package and follow the instructions given.

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When activation file is received (for example, 00000.in), copy it to the C:\ProgramFiles\Nokia\Phoenix

\BoxActivation directory on your computer (this directory is created when Phoenix is installed).

Steps

1. Start Phoenix Service Software.

2. Choose Maintenance -> Prommer Maintenance.

Figure 55 Prommer maintenance

3. In the Prommer Maintenance window, click Activate.

4. To find the activation file if you saved it to some other directory on your PC, click Browse.

5. To activate the prommer, select the activation file and click Open.

Figure 56 Box activation

6. To complete the activation, restart FPS-8.

Deactivating FPS-8

Context

If there is, for example, a need to send the FPS-8 box for repair, it must be deactivated first.

Steps

1. Start Phoenix Service Software.

2. Choose Maintenance -> Prommer Maintenance.

3. In the Prommer Maintenance window, click Deactivate.

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4. To confirm the deactivation, click Yes.

Figure 57 Deactivation warning

The box is deactivated.

5. To complete the deactivation, restart FPS-8.

Updating JBV-1 docking station software

Before you begin

The JBV-1 docking station contains software (firmware) which can be updated. You need the following

equipment to update the software:

• PC with USB connection

• operating system supporting USB (Not Win 95 or NT)

• USB Cable (can be purchased from shops or suppliers providing PC hardware and accessories)

• JBV-1 docking station

• external power supply (11-16V)

Before installation:

• Download Jbv1_18_update.zip file to your computer (in C:\TEMP for example) from your download web site.

• Close all other programs.

• Follow instructions on the screen.

Context

The JBV-1 docking station is a common tool for all DCT-4 generation products. In order to make the JBV-1 usable

with different phone models, a phone-specific docking station adapter is used.

Steps

1. Run Jbv1_18_update.zip file and start software installation by double clicking Setup.exe.

Note: DO NOT CONNECT THE USB CABLE/JBV-1 TO YOUR COMPUTER YET!

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Figure 58 Extracting JBV-1 update files

Files needed for JBV-1 package setup program will be extracted.

2. Read the instructions in the dialog box and click Next to continue.

Figure 59 JBV-1 update information

3. Accept the suggested destination folder for installing the JBV-1 SW Package, and click Next to continue.

Figure 60 JBV-1 update destination folder

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4. Select Full installation and click Next to continue.

Figure 61 Select installation: Full

5. A program folder is created and the software files are installed there. Click Next to continue.

Figure 62 Select program folder

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6. Click Finish to complete the installation.

Figure 63 Finish JBV-1 update installation

7. Connect the USB cable/JBV-1 to your computer. Connect power to JBV-1 (11-16V DC) from an external power

supply, then connect the USB Cable between the JBV-1 USB connector and the PC.

8. Install or update the JBV-1 USB drivers which are delivered with the JBV-1 SW installation package.

The drivers can be found in C:\Program Files\Nokia\ JBV-1 Firmware Update\JBV-1USB driver

•If there is no previously installed JBV-1 Firmware update package installed on your computer, Windows

will detect connected USB cable and detect drivers for new HW. You will be prompted about this, please

follow the instructions and allow Windows to search and install the best drivers available.

• If there is a previously installed JBV-1 Firmware update package (v.17 or older) on your computer, please

update the JBV-1 USB driver. Please see the readme.txt file in C:\Program Files\Nokia\JBV-1 Firmware

Update\JBV-1USB driver folder for instructions on how to update the JBV-1 USB Driver.

After you have installed or updated the JBV-1 USB driver, the actual JBV-1 SW update can begin.

9. Go to folder C:\Program Files\Nokia\JBV-1 Firmware Update\JBV-1 Firmware Update and start JBV-1 Update

SW by double clicking fwup.exe.

JBV-1 Firmware update starts and shows current status of the connected JBV-1. If firmware version read

from your JBV-1 is not the latest one available (v.17 or older), it needs to be updated to version 18 by

clicking Update Firmware.

10. Choose Refresh Status to check the SW version.

Figure 64 Checking JBV-1 SW version

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11. Choose file JBV1v18.CDE and click Open to update your JBV-1 to a new version (v.18).

Figure 65 JBV-1 update directory window

Wait until you hear a "click" from the JBV-1.

The older SW file JBV1v17.CDE is visible in this view only if the previous JBV-1 SW package has been installed

on your computer.

12. Click OK to see the current JBV-1 status (after a successful update).

Figure 66 JBV-1 SW update done

Figure 67 JBV-1 SW status

You have now updated the software of your JBV-1 docking station and it is ready for use.

Next action

If you have several docking stations you need to update, disconnect the power and USB cables from the previous

one and connect them to the next docking station. First, click Refresh Status to see the current SW version and

then Update Firmware to update the software.

After you have updated all docking stations, close the JBV-1 Firmware Update dialog box.

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Service software concepts

Flash concept

Figure 68 Flash concept

Item Description Type Code

1Point of Sales flash

loading adapter

SF-27 0780375

2 Power cable FLC-2 0730185

3 Modular cable XCS-4 0730178

4 Flash prommer box sales

pack

FPS-8 0080321

5 Printer cable AXP-8, included in FPS-8

sales pack

Not available as spare

part

6 D9 – D9 cable AXS-4, included in FPS-8

sales pack

0730090

7 Software protection key PKD-1 0750018

8 AC Charger ACF-8, included in FPS-8

sales pack

0680032

9 SRAM Module (3 pcs

needed inside FPS-8)

SF12 0080346 (Code includes

one SRAM module)

Note: More than 32MB SRAM required in FPS-8.

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POS flash concept

Figure 69 POS flash concept

Item Description Type Code

1Point of Sales flash

loading adapter

SF-27 0780375

2 Service cable XCS-1 0730218

3a FLS-4S sales pack for

EMEA

FLS-4S 0080541

3b FLS-4S sales pack for

APAC

FLS-4S 0080542

JBV-1 flash concept

Figure 70 JBV-1 flash concept

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Item Description Type Code

1Docking station adapter DA-25 0780373

2 Docking station JBV-1 0770298

3 Power cable PCS-1 0730012

4 Modular cable XCS-4 0730178

5 Flash prommer box sales

pack

FPS-8 0080321

6 Printer cable AXP-8, included in FPS-8

sales pack

Not available as spare

part

7 D9 – D9 cable AXS-4, included in FPS-8

sales pack

0730090

8 Software protection key PKD-1 0750018

9 AC Charger ACF-8, included in FPS-8

sales pack

0680032

10 SRAM Module (3 pcs

needed inside FPS-8)

SF12 0080346 (Code includes

one SRAM module)

Note: More than 32MB SRAM required in FPS-8.

Module jig flash concept

Flashing with MJ-30 is recommended in local mode.

The following equipment is required for RM-25 AMS SW update when the system module is placed in the module

jig MJ-30 and connected through an FPS-8 set-up:

Figure 71 Module jig flash concept

Item Description Type Code

1Module jig MJ-30 0780376

2 Power cable PCS-1 0730012

3 Modular cable XCS-4 0730178

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Item Description Type Code

4Flash prommer box sales

pack

FPS-8 0080321

5 Printer cable AXP-8, included in FPS-8

sales pack

Not available as spare

part

6 D9 – D9 cable AXS-4, included in FPS-8

sales pack

0730090

7 Software protection key PKD-1 0750018

8 AC Charger ACF-8, included in FPS-8

sales pack

0680032

9 SRAM Module (3 pcs

needed inside FPS-8)

SF12 0080346 (Code includes

one SRAM module)

Note: More than 32MB SRAM required in FPS-8.

Module jig service concept

This concept is for troubleshooting and RF calibration.

MJ-30 is intended for use with an external power supply.

MJ-30 input voltage: normal +6V, maximum +12V.

Ensure that the jumper is set open for voltage regulation before the external power supply is connected.

When FPS-8 is used as the power supply (4V), the jumper should be set close to bypass regulator.

EM calibrations including Zocus are only done with JBV-1. Module jig MJ-30 does not support Zocus calibration

in RM-25.

Figure 72 Module jig service concept

Item Description Type Code

1Module jig MJ-30 0780376

2 RF cable XRF-1 0730085

3 Power cable PCS-1 0730012

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Item Description Type Code

4MBUS cable DAU-9S 0730108

5 Software protection key PKD-1 0750018

6 External DC power supply

JBV-1 service concept

This concept is for BB and RF calibration.

EM calibration including Zocus should be carried out in JBV-1 and DA-25.

Power to JBV-1 should be supplied from an external DC power supply, NOT FPS-8.

JBV-1 input voltage: normal +12V, maximum +16V.

A-cover and RF antenna module need to be removed from the phone when SA-38 is attached.

Figure 73 JBV-1 service concept

Item Description Type Code

1Docking station adapter DA-25 0780373

2 Docking station JBV-1 0770298

3 RF coupler SA-38 0780405

4 RF cable XRF-1 0730085

5 Power cable PCS-1 0730012

6 DC cable SCB-3 0730114

7 MBUS cable DAU-9S 0730108

8 Software protection key PKD-1 0750018

9 External DC power supply

10 Soldering jig for uBGA

components

RJ-33 0780406

11 LGA rework kit for Kaede SK-8 0274550

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Item Description Type Code

12 LGA rework kit for

microPA

SK-9 0274819

13 Flex opening tool SS-34 0780396

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4 — Service tools

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Page 4–2 Company Confidential 9235618 (Issue 2)

Table of Contents

ACF-8....................................................................................................................................................................................................4–5

AXP-8...................................................................................................................................................................................................4–5

AXS-4...................................................................................................................................................................................................4–5

CA-5S....................................................................................................................................................................................................4–6

DA-25...................................................................................................................................................................................................4–6

DAU-9S................................................................................................................................................................................................4–6

FLC-2....................................................................................................................................................................................................4–6

FLS-4S..................................................................................................................................................................................................4–7

FPS-10.................................................................................................................................................................................................4–7

FPS-11.................................................................................................................................................................................................4–7

FPS-8....................................................................................................................................................................................................4–8

Fuse and protector..........................................................................................................................................................................4–8

JBT-9....................................................................................................................................................................................................4–8

JBV-1....................................................................................................................................................................................................4–8

MJ-30...................................................................................................................................................................................................4–9

PCS-1.................................................................................................................................................................................................4–10

PKD-1.................................................................................................................................................................................................4–10

RJ-24..................................................................................................................................................................................................4–10

RJ-33..................................................................................................................................................................................................4–10

RJ-46..................................................................................................................................................................................................4–10

SA-38.................................................................................................................................................................................................4–11

SF-12.................................................................................................................................................................................................4–12

SF-27.................................................................................................................................................................................................4–12

SK-8...................................................................................................................................................................................................4–13

SK-9...................................................................................................................................................................................................4–14

Spare part for SF-27.....................................................................................................................................................................4–14

Spare part module (LCD-UIB PWB)...........................................................................................................................................4–14

Spare part for SF-27.....................................................................................................................................................................4–14

Spare part module (KeyPad-UIB PWB)...................................................................................................................................4–14

SPS-1.................................................................................................................................................................................................4–15

SRT-6.................................................................................................................................................................................................4–15

SS-34.................................................................................................................................................................................................4–15

ST-15.................................................................................................................................................................................................4–15

ST-5....................................................................................................................................................................................................4–16

Test pins...........................................................................................................................................................................................4–16

Test pins (RF pogo).......................................................................................................................................................................4–16

Test pins (SC-0-J-3.2-DG) for DA-25 (10pcs/bag).................................................................................................................4–16

XCS-1.................................................................................................................................................................................................4–16

XCS-4.................................................................................................................................................................................................4–16

XRF-1.................................................................................................................................................................................................4–17

List of Tables

Table 17 Display test pin list........................................................................................................................................................4–9

Table 18 Upper keypad signals...................................................................................................................................................4–9

Table 19 Lower keypad signals...................................................................................................................................................4–9

Table 20 TX (db)............................................................................................................................................................................4–11

Table 21 RX (db)............................................................................................................................................................................4–11

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Page 4–4 Company Confidential 9235618 (Issue 2)

List of Service Tools

The table below gives a short overview of service tools that can be used for testing, error analysis and repair

of product , refer to various concepts.

ACF-8 Universal power

supply

0680032

ACF-8 universal power supply is used to power FPS-8. ACF-8 has 6V DC

and 2.1A output.

AXP-8 Parallel bi-directional

printer cable

0730298

This cable is used to connect the PC to a flash prommer.

The cable is part of the FPS-8 sales package.

AXS-4 Service cable 0730090

The AXS-4 D9-D9 service cable is used to connect two 9 pin D connectors

for example between PC and FPS-8.

The cable length is 2 meters.

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CA-5S DC cable 0730283

The DC cable CA-5S is used to connect JBV-1 to the phone charger jack

for ADC/VCHAR/ICHAR calibration

Note: Old SCB-3 can be used as well.

DA-25 Docking station

adapter

0780373

The DA-25 docking station adapter makes signal connections to the

phone. JBV-1 and DA-25 are used as one unit.

DAU-9S MBUS cable 0730108

The MBUS cable DAU-9S has a modular connector and is used, for

example, between the PC's serial port and module jigs, flash adapters or

docking station adapters.

FLC-2 DC cable 0730185

FLC-2 is used with a flash adapter to supply a controlled operating

voltage.

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FLS-4S Flash device FLS-4S sales pack –

Europe/

Africa:0080541,

APAC:0080542,

Americas:0080543

FLS-4S is a dongle and flash device incorporated into one package,

developed specifically for POS use.

FPS-10 Flash prommer 0086189

FPS-10 interfaces with:

• PC

• Control unit

• Flash adapter

• Smart card

FPS-10 flash prommer features:

• Provides flash functionality for BB5 terminals

• Smart Card reader for SX-2 or SX-4

• Forwards USB traffic through it

• Provides USB to FBUS/Flashbus conversion

• Provides LAN to FBUS/Flashbus and USB conversion

• Vusb output switchable by PC command

FPS-10 sales package includes:

• FPS-10 prommer (0770503)

• Power Supply with 5 country specific cords (0675525)

• USB cable (0730322)

FPS-11 Parallel flash

prommer

0770758

FPS-11 interfaces with:

• PC

• Control unit

• Flash adapter

• Smart card

FPS-11 flash prommer features:

• Can flash up to 8 phones at a time, controlled by one PC

• Communication method between PC and FPS-11 is single USB2.0

• No need for external power for powering up phones

• Smart Card reader for SX-2 and SX-4

• Updates software

• Future feature: will support all DCT-4 protocols and models

FPS-11 sales package includes:

• FPS-11

• Power Supply for FPS-11

• EUR, UK, USA Power cords

• USB2.0 cable

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FPS-8 FLASH prommer 0080321

The flash prommer FPS-8 is used for example with flash adapters,

docking station adapters and flash/docking stations. Power is supplied

to FPS-8 from the universal power supply, ACF-8.

The sales pack includes:

• FPS-8 flash prommer (0750123)

• FPS-8 activation sheet (9359289)

• ACF-8 universal power supply (0680032)

• AXS-4 service cable (D9-D9) (0730090)

• Printer cable (0730029)

Fuse and protector 0770622

JBT-9 Bluetooth test and

interface box (sales

pack)

0081490

The JBT-9 testbox is a generic device to perform Bluetooth bit error rate

testing and doing cordless FBUS connection via Bluetooth. An ACP-8x

charger is needed for BER testing and AXS-4 cable in case of cordless

testing interface usage.

• JBT-9 testbox (0770336)

• Installation and warranty information (9360613)

JBV-1 Docking station 0770298

The JBV-1 docking station has been designed for calibration and

software update use.

The docking station is used together with the DA-25 docking station

adapter.

JBV-1 main electric functions are:

• adjustable VBAT calibration voltage, current measurement limit

voltage “VCHAR”, current measurement calibration current “ICHAR”

• adjustable ADC calibration voltage via BSI signal

• BSI calibration resistor

• signals from FBUS to the phone via parallel jig

• control via FBUS or USB

• Flash OK/FAIL indication

In calibration mode JBV-1 is powered by external power supply 11-16V

DC. In flashing, power for the phone can be taken from FPS-8 or external

power supply 11-16V DC.

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MJ-30 Module jig 0780376

The MJ-30 module jig is used for testing the following modules:

• User interface

• Baseband and RF on system module

Note: The nominal supply voltage for MJ-25 is +6.0 V. The

supply voltage must not exceed +12.0 V (min. 5.0 V).

Supply the power to jig only when the jumper is open =

regulated.

•Table 17 Display test pin list

Pin Signal

name

Pin Signal

name

Pin Signal

name

1GND 9 VDDI 17

2 WRX 10 VDD 18 D7

3 11 19 D6

4 D0 12 LED IN 20 D5

5 D1 13 LED OUT 21 D4

6 D2 14 22

7 D3 15 CSX 23 RDX

8 16 D/CX 24 RESX

•Table 18 Upper keypad signals

Pin Signal

name

Pin Signal

name

Pin Signal

name

7ROW2 17 Key LED - 22 Rocker3

8 ROW0 18 ROW1 23 Rocker2

9 COL1 19 COL0 24 Rocker1

11 GND 20 Rocker5

15 Key LED + 21 Rocker4

•Table 19 Lower keypad signals

Pin Signal

name

Pin Signal

name

Pin Signal

name

5COL2 9 ROW3 17 COL5

6 COL4 13 ROW2 18 COL3

7 LED

SUPPLY

14 COL0 19 ROW4

8 LED

SUPPLY

15 ROW5 20 GND

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PCS-1 Power cable 0730012

The PCS-1 power cable (DC) is used with a docking station, a module jig

or a control unit to supply a controlled operating voltage.

PKD-1 SW security device 0750018

SW security device is a piece of hardware enabling the use of the service

software when connected to the parallel (LPT) port of the PC.

Without the device, it is not possible to use the service software.

Printer or any such device can be connected to the PC through the device

if needed.

RJ-24 Rework jig 0770688

RJ-24 is a soldering jig used for soldering and as a rework jig for the

engine module.

RJ-33 Soldering jig 0780406

The soldering jig RJ-33 is used for soldering and as a rework jig for system

module. It is made of lead-free rework compatible material.

RJ-46 Antenna switch

rework jig

0780374

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SA-38 RF Coupler 0780405

SA-38 RF Coupler is used for Go/No-Go test after changing components

in the RF part of the phone.

The SA-38 is mounted on the docking station adapter, after which the

phone can be placed in the docking station adapter.

RF attenuations:

•Table 20 TX (db)

Band Channel New coupler

900 955 (-8.5 +/- 0.5)

39 (-8,9 +/- 0,5)

124 (-10,0 +/- 0,5)

1800 512 (-8,3 +/- 1,1)

690 (7,3 +/- 1,3)

885 (-7,5 +/- 0,8)

1900 535* (-8,1 +/- 1,3)

711* (-8,2 +/- 1,2)

810* (-8,4 +/- 1,3)

Table 21 RX (db)

Band Channel New coupler

900 955 (-13,2 +/- 0,2)

39 (-11,7 +/- 0,7)

124 (-13,0 +/- 0,8)

1800 512 (-12,1 +/- 0,6)

690 (-12,3 +/- 0,3)

885 (-12,5 +/- 0,5)

1900 535* (-15,4 +/- 2,3)

711* (-16,3 +/- 1,8)

810* (-17,5 +/- 1,2)

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SF-12 SRAM Module for FPS-8 0080346

SF-27 POS (point of sales)

flash adapter

0780375

The POS flash adapter SF-27 is used in the place of phone’s normal

battery during service to supply a controlled operating voltage and to

connect to flash pads.

Instructions

1 Open the locking slide.

2 Insert the adapter to the phone from the battery connector side.

3 Lock the adapter with DC jack.

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SK-8 LGA rework kit for

Kaede

0274550

SK-8 is used to print solder paste on Kaede USB component (NMP code:

4342163) when the component is reworked.

SK-8 consists of ST-9 (NMP code: 0770727) Stencil and RJ-29 (NMP code:

0770728) rework jig.

Due to the large mechanical tolerance of the component, the following

procedure is necessary:

Instructions

1 Put the component into the rework jig. The component should be

placed in the best fit location which is determined by placing the

component in the largest location first, and if this is too large, re-

position it to the next location. This should be carried out until the

best fit location is found.

2 Once the best fit location has been found, leave the component there

and put the stencil on top of the jig and the component.

3 Put soldering paste on the component properly.

4 Remove the stencil and the component from the jig.

5 Start the soldering process.

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SK-9 LGA rework kit for

MicroPA

0274819

SK-9 is used to print solder paste on MicroPA component (NMP code:

4355641) when the component is reworked.

SK-9 consists of ST-13 (NMP code: 0770848) stencil and RJ-21 (NMP code:

0770849) rework jig.

Due to the large mechanical tolerance of the component, the following

procedure is necessary:

Instructions

1 Put the component into the rework jig. The component should be

placed in the best fit location which is determined by placing the

component in the largest location first, and if this is too large, re-

position it to the next location. This should be carried out until the

best fit location is found.

2 Once the best fit location has been found, leave the component there

and put the stencil on top of the jig and the component.

3 Put soldering paste on the component properly.

4 Remove the stencil and the component from the jig.

5 Start the soldering process.

Spare part for SF-27 Test pin module 0780357

Spare part module

(LCD-UIB PWB)

0780356

Spare part for SF-27 Test pins 0770754

Soldering required

Spare part module

(KeyPad-UIB PWB)

0780355

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SPS-1 Soldering Paste

Spreader

0770381

SRT-6 Opening tool 0770431

SS-34 Flex opening tool 0780396

ST-15 Antenna switch

rework stencil

0780412

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ST-5 Antenna switch

rework stencil

0770691

Test pins 0770879

Test pins (RF pogo) 077876

Test pins (SC-0-J-3.2-

DG) for DA-25 (10pcs/

bag)

0770617

XCS-1 Service cable 0730218

The XCS-1 service cable is used to connect FLS-4S to the POS flash adapter

for supplying a controlled operating voltage and data connection.

XCS-4 Modular cable 0730178

XCS-4 is a shielded (one specially shielded conductor) modular cable for

flashing and service purposes.

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XRF-1 RF cable 0730085

The RF cable is used to connect, for example, a module repair jig to the

RF measurement equipment.

SMA to N-Connector ca. 610mm.

Attenuation for:

• GSM850/900: 0.3+-0.1 dB

• GSM1800/1900: 0.5+-0.1 dB

• WLAN: 0.6+-0.1dB

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5 — Disassembly and

reassembly instructions

Nokia Customer Care

9235618 (Issue 2) Company Confidential Page 5–1

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Table of Contents

Disassembly instructions lower block (see the video clips on care point also).........................................................5–5

Disassembly instructions upper block (see the video clips on care point also).........................................................5–8

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Disassembly instructions lower block (see the video clips on care point also)

Steps

1. Protect the window with a film to avoid dust and scratches.

2. Remove the battery cover.

3. Always remove the battery before continuing disassembly.

4. Unscrew the six Torx Plus® size 6 screws.

Note: For assembly, the reverse order and a Torx Plus® driver with a torque of 20 Ncm has to be used.

5. Remove the B1 cover and place it upside down on the table like shown in the picture.

6. Remove the vibra motor with tweezers.

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7. Remove the DC jack with a charger plug.

8. For disassembling the frame, move the right side slightly up and to the right.

9. Move the left side of the frame up and to the left.

10. Now remove the frame.

11. Disassemble the side key with, for example, SRT-6 tool.

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12. Use the B1 cover as a support for engine module to avoid damaging the hinge flex.

13. Now remove the engine module. First lift up the left side (near SIM, MMC connector) with SRT-6 and then…

14. …the right side nearby the camera module. Be careful with the camera module.

15. The engine module is connected to the lower block via hinge flex connector. Be careful when placing the

engine module on the B1 cover.

16. Open the camera connector by using the SS-34 tool and remove the camera module.

17. Open the hinge flex connector by using the SS-34 and take away the B1 cover with engine module.

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18. Remove the microphone with tweezers. Be careful not to damage the spring contacts.

19. Remove the UI flex assy by using tweezers like shown in the picture.

20. Finally, disassemble the keymat by pressing it slightly from the inside to the outside.

Disassembly instructions upper block (see the video clips on care point also)

Steps

1. Remove the battery before disassembling the upper block.

2. Open the phone and turn around the upper block 180 degrees.

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3. Protect the window with a film to avoid dust and scratches.

4. Remove the function keymat.

5. Unscrew the two Torx Plus® size 6 screws. For assembly, a Torx Plus® driver with a torque of 15Ncm has

to be used.

6. Open the A2 cover at one side first and then…

7. …at the other side. Remove the A2 cover.

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8. Use tweezers to remove the LCD shield. Start at one side and then…

9. …on the other side.

10. Now remove the LCD shield with the SRT-6 tool.

11. Protect the LCD with a film to avoid dust and scratches.

12. Remove the earpiece with tweezers.

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13. To open the LCD connector, hold the flex foil down with the Torx driver and lever up the LCD connector

with a slotted screwdriver carefully. Be careful not to damage the flex foil, connector or surrounding

components.

14. Lever up the right corner of the LCD with SRT-6.

15. Remove the LCD like shown in the picture.

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6 — Baseband troubleshooting

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Table of Contents

Troubleshooting baseband.........................................................................................................................................................6–5

Troubleshooting dead or jammed phone..............................................................................................................................6–6

BB self test tools.............................................................................................................................................................................6–7

Troubleshooting flash programming......................................................................................................................................6–7

General power troubleshooting.............................................................................................................................................6–10

Baseband serial interface troubleshooting ........................................................................................................................6–11

CBUS interface.........................................................................................................................................................................6–11

FBUS interface.........................................................................................................................................................................6–13

MBUS interface........................................................................................................................................................................6–14

Troubleshooting charger interface........................................................................................................................................6–15

Energy management calibration............................................................................................................................................6–17

Baseband troubleshooting tips...............................................................................................................................................6–17

Backup battery troubleshooting.............................................................................................................................................6–18

Troubleshooting USB interface...............................................................................................................................................6–19

SIM card fault................................................................................................................................................................................6–20

“Insert SIM Card” in device display although card is inserted.......................................................................................6–22

Troubleshooting keypad interface.........................................................................................................................................6–24

Troubleshooting the display....................................................................................................................................................6–25

Troubleshooting display and keyboard backlight............................................................................................................6–26

Troubleshooting MMC interface..............................................................................................................................................6–27

Audio troubleshooting...............................................................................................................................................................6–29

Troubleshooting internal microphone...........................................................................................................................6–29

Troubleshooting external microphone..........................................................................................................................6–30

Troubleshooting internal earpiece..................................................................................................................................6–31

Troubleshooting external earpiece..................................................................................................................................6–32

Troubleshooting IHF.............................................................................................................................................................6–33

Troubleshooting accessory detection...................................................................................................................................6–35

Troubleshooting IrDA.................................................................................................................................................................6–37

Troubleshooting FM radio.........................................................................................................................................................6–38

Tuning baseband.........................................................................................................................................................................6–39

Testing and tuning BB after component replacement....................................................................................................6–41

List of Tables

Table 22 Maximum tolerances.................................................................................................................................................6–18

Table 23 Calibration value limits.............................................................................................................................................6–41

List of Figures

Figure 74 Main troubleshooting diagram...............................................................................................................................6–5

Figure 75 Dead or jammed phone troubleshooting............................................................................................................6–6

Figure 76 BB self tests....................................................................................................................................................................6–7

Figure 77 Flash programming troubleshooting, part 1......................................................................................................6–8

Figure 78 Flash programming troubleshooting, part 2......................................................................................................6–9

Figure 79 General power troubleshooting...........................................................................................................................6–10

Figure 80 CBusClk test point......................................................................................................................................................6–11

Figure 81 CBUS test points.........................................................................................................................................................6–12

Figure 82 CBUS waveform..........................................................................................................................................................6–13

Figure 83 Flash interface layout (FBUS/MBUS test pads layout)....................................................................................6–14

Figure 84 "Not charging" on display......................................................................................................................................6–15

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Figure 85 No charging.................................................................................................................................................................6–16

Figure 86 ADC reading window in Phoenix..........................................................................................................................6–18

Figure 87 USB interface troubleshooting..............................................................................................................................6–19

Figure 88 UPP_WD2 and UEME SIM connections (simplified)..........................................................................................6–20

Figure 89 SIM power up waveform.........................................................................................................................................6–21

Figure 90 SIM answer to reset waveform.............................................................................................................................6–22

Figure 91 “Insert SIM Card” in device display although card is inserted....................................................................6–23

Figure 92 Troubleshooting keypad interface......................................................................................................................6–24

Figure 93 Display troubleshooting..........................................................................................................................................6–25

Figure 94 Troubleshooting display and keyboard backlight..........................................................................................6–26

Figure 95 Troubleshooting MMC interface............................................................................................................................6–28

Figure 96 Troubleshooting internal microphone...............................................................................................................6–29

Figure 97 Troubleshooting external microphone..............................................................................................................6–30

Figure 98 Troubleshooting internal earpiece......................................................................................................................6–31

Figure 99 Troubleshooting external earpiece.....................................................................................................................6–32

Figure 100 Troubleshooting IHF..............................................................................................................................................6–33

Figure 101 Troubleshooting IHF (continued)......................................................................................................................6–34

Figure 102 Troubleshooting accessory detection..............................................................................................................6–35

Figure 103 Troubleshooting accessory detection (continued)......................................................................................6–36

Figure 104 Troubleshooting IrDA............................................................................................................................................6–37

Figure 105 Troubleshooting FM radio....................................................................................................................................6–39

Figure 106 EM calibration window.........................................................................................................................................6–40

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Troubleshooting baseband

Context

This section is intended to be a guide for localising and repairing electrical faults.

The fault repairing is divided into troubleshooting paths. The following diagram describes the different

baseband troubleshooting paths to be followed in fault situations.

Figure 74 Main troubleshooting diagram

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Troubleshooting dead or jammed phone

Figure 75 Dead or jammed phone troubleshooting

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BB self test tools

Self test functions are executed when the phone is powered on, and if one or more self test functions fail, the

message “Self test failed. Contact Service.” is displayed. However, in this kind of situation the software is able

to run and thus the watchdog of UEME can be served.

The MCU selftest case can be split into two categories: the ones that are executed during power up and the ones

that are executed only with a PC connected.

These tests and the items included are as follows:

Figure 76 BB self tests

Troubleshooting flash programming

Context

Note: The Phoenix error message C101 Boot timeout in the flowchart refers to a message that is shown

when there are problems in the phone flash programming when using FPS-8.

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Figure 77 Flash programming troubleshooting, part 1

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Figure 78 Flash programming troubleshooting, part 2

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General power troubleshooting

Figure 79 General power troubleshooting

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Baseband serial interface troubleshooting

CBUS interface

CBUS is a three-wire serial interface between the main baseband components.

The bus consists of data, clock and bus_enable signals. The bus is connected between UPP_WD2, UEME and ZOCUS.

UPP_WD2 takes care of controlling the traffic on the bus.

If the interface is faulty from the UPP_WD2’s end, the phone does not boot properly as powering configurations

do not work.

Traffic on the bus can be monitored at the following test point and pins.

• R640 (test point J193 side)

• CBusEN1X J378 Pad

• CBusDA J377 Pad

The pads and pins are shown in the figures below.

CBUS test points

Figure 80 CBusClk test point

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Figure 81 CBUS test points

The CBUS traffic is shown in the figure below (read command to ZOCUS, LM3820, N130).

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Figure 82 CBUS waveform

CBusCLk is connected to Ch1, CBusDa to CH2 and CBusEnx to Ch3.

If you are able to get the phone to boot up and can reach Phoenix BB self test feature, it is possible to test the

functionality of each component attached to CBus. Use:

• ST_UEM_CBUS_IF_TEST to test the UEME CBus interface

• ST_ZOCUS_CBUS_IF_TEST to test the ZOCUS CBus interface.

If an error is found in testing any of the above components, you should replace or re-solder the failed component.

FBUS interface

FBUS is a two-wire Rx and Tx interface between UPP_WD2 and flash/test interface. The bus goes through UEME,

which adjusts the voltage levels to suit UPP_WD2.

The interface voltage level on the phone flash/test pad pattern is 2.7V and on the UPP_WD2 end it is 1.8V.

The functionality of this interface should not affect the device boot into NORMAL, LOCAL or TEST modes.

Phoenix tests can be performed through the MBUS interface in the case of a failure in the FBUS interface. Flashing

is not possible if there is a problem in the FBUS interface. Fbus signals located in the flashing test pads and the

pad layout is shown in the figure below.

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Figure 83 Flash interface layout (FBUS/MBUS test pads layout)

MBUS interface

MBUS is a two-wire RX and TX interface between UPP_WD2 and UEME. From UEME the interface continues to

flash/test interface as one-wire interface. UEME adjusts the voltage levels.

The interface voltage level on the phone flash/test pad pattern is 2.78V and on the UPP_WD2 end it is 1.8V.

MBUS traffic between UPP_WD2 and UEME can be tested with Phoenix (ST_MBUS_RX_TX_LOOP_TEST).

Flashing is not possible if there is a problem in MBUS. For the location of the MBUS signal in the test pads and

the pad layout, see figure Flash interface layout (Page 6–14).

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Troubleshooting charger interface

Figure 84 "Not charging" on display

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Figure 85 No charging

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Energy management calibration

EM calibrations should be carried out with a JBV-1 docking station attached to a DA-25 docking station adapter.

Power to JBV-1 should be supplied from an external DC power supply. JBV-1 input voltages: nominal + 12 VDC,

maximum +16VDC.

On the JBV-1, A/D converter, BSI, BTEMP, battery voltage (VBAT), charger voltage (VCHAR), charger current (ICHAR)

and battery current (IBAT) are calibrated.

For detailed information and instructions, see energy management calibration instructions (Page 6–39).

Baseband troubleshooting tips

ADC-offset over limits

Inspect the BSI line and its components. Note that the BSI resistance line of the battery is connected to the AD

input of the UEME labelled LS (not the BSI input). If these are OK, change PWB.

BSI gain over limits

Inspect the BSI line and its components. Note that the BSI resistance line of the battery is connected to the AD

input of the UEME labelled LS (not the BSI input). If these are OK, change PWB.

Vbatt offset and gain

Inspect Vbatt lines and its components.

VCHAR over limits

Inspect components that are connected to VCHAR line: filtering capacitors C134, C135, TVS V130, L130 and fuse

F130. If those are OK, change PWB.

ICHAR over limits

Inspect components that are connected to VCHAR line: filtering capacitors C134, C135, TVS V130, L130 and fuse

F130. If those are OK, change the current sense resistor R259 first. If calibration is still not successful, change PWB.

Calibration can be checked using the ADC reading. Known voltages, currents and resistances are fed to and read

by the ADC reading. The read values can then be compared with the known values.

ADC reading

Divided and scaled battery voltage, battery current, charger voltage, charger current and BSI values can be read

by this tool. Read values a few times until you can be sure that results are accurate.

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Figure 86 ADC reading window in Phoenix

Table 22 Maximum tolerances

Reading Check point Tolerance

Vbatt SCAL 4.2V ±25mV

Vchar 8.4V ±40mV

lchar 500mA ±20mV

BSI 75k (BL-4C) ±1.3kohm

Btemp 273K (47k) +5K

Backup battery troubleshooting

A symptom of a backup battery fault is that Real Time Clock loses the correct time during short battery removal.

The same symptom can also be seen when the backup battery is empty. About 30 minutes is needed to fully

charge the backup battery in the device.

Note: The backup battery is only charged at the same time as the main battery or when the device is

in the LOCAL or TEST mode.

Always check the backup battery visually for any leakage or any other visual defect.

Check that the backup battery is correctly mounted in the device before closing the cover.

Check with Phoenix that the backup battery is OK.

Measure the voltage of the backup battery.

• Normal operation when the voltage is > 2.0V.

• Fully charged when the voltage is about 3.2V.

Enable the backup battery charging (start to charge the main battery or boot the device to LOCAL or TEST mode).

Measure the voltage of the backup battery during charging, it should rise if it is not 3.2V yet.

When the voltage is over 2.0V for certain, check the backup battery with Phoenix.

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Troubleshooting USB interface

Figure 87 USB interface troubleshooting

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SIM card fault

The whole SIM interface is located in two chips: UPP_WD2 and UEME. UEME contains the SIM interface logic level

shifting. UPP_WD2 provides SIMClk through UEME to the SIM. The SIM interface supports both 3V and 1.8V SIMs.

There is an EMIF component (3 lines EMI filter) between the SIM card and the UEME which isn’t shown in the

figure below.

Figure 88 UPP_WD2 and UEME SIM connections (simplified)

The SIM power up/down sequence is generated in the UEME. This means that the UEME generates the RST signal

to the SIM. The card detection is taken from the BSI signal, which detects the removal of the battery. A comparator

inside the UEME monitors the BSI signal from the SimCardDet input. The threshold voltage is calculated from

the battery size specifications.

First, the SW attempts to power up the SIM with 1.8V. If this does not succeed, power up is repeated with VSIM

switched to 3V.

The data communication between the card and the phone is asynchronous half duplex. The clock supplied to

the card is in GSM system 1.083MHz or 3.25MHz. The data baud rate is SIM card clock frequency divided by 372

(by default), 64, 32, or 16.

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Figure 89 SIM power up waveform

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Figure 90 SIM answer to reset waveform

“Insert SIM Card” in device display although card is inserted

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Figure 91 “Insert SIM Card” in device display although card is inserted

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Troubleshooting keypad interface

Figure 92 Troubleshooting keypad interface

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Troubleshooting the display

Figure 93 Display troubleshooting

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Troubleshooting display and keyboard backlight

Figure 94 Troubleshooting display and keyboard backlight

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Troubleshooting MMC interface

Context

Use a known working MMC to save the photo test. Target devices to replace are N310 Lester, R315 ASIP and

X820 MMC connector. The MMC card itself might be broken, and it should be checked as well.

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Figure 95 Troubleshooting MMC interface

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Audio troubleshooting

Troubleshooting internal microphone

Figure 96 Troubleshooting internal microphone

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Troubleshooting external microphone

Figure 97 Troubleshooting external microphone

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Troubleshooting internal earpiece

Before you begin

Check that holes in earpiece are not coated or covered.

Figure 98 Troubleshooting internal earpiece

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Troubleshooting external earpiece

Figure 99 Troubleshooting external earpiece

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Troubleshooting IHF

Figure 100 Troubleshooting IHF

See also the following flow chart.

Figure 103 Troubleshooting accessory detection (continued)

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Troubleshooting IrDA

Figure 104 Troubleshooting IrDA

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Troubleshooting FM radio

Before you begin

In Phoenix: choose Testing -> FM radio -> Power on.

For FM signal:

• Use FM signal received by headset,

• use FM signal generator: Frequency = 100MHz, frequency deviation = 67.5kHz, modulation frequency = 1kHz,

R = L, pilot tone on and RF level = -67dBm.

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Figure 105 Troubleshooting FM radio

Tuning baseband

Before you begin

EM (Energy Management) calibration is performed to calibrate the setting (gain and offset) of AD converters in

several channels (that is, battery voltage, BSI, charger voltage, charger current) to get an accurate AD conversion

result.

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HW setup:

• An external power supply is needed.

• The RM-25 phone must be connected to JBV-1 (docking station) with DA-25 (docking station adapter).

a Connect SCB-3 (DC-DC cable) between JBV-1 and charger connector of phone for charger channel

calibration.

b Supply 11-16V DC from an external power supply to JBV-1 to power up phone.

Phoenix SW setup:

• Start Phoenix service software.

• Select FBUS connection.

• Choose: Main -> Product -> RM-25.

• Choose: Tuning -> Energy Management Calibration.

Figure 106 EM calibration window

Steps

1. Select “Read from phone” to show the current values in the phone memory, and then check that the

communication with the phone works.

2. Select “JBV-1 used” check box.

3. Select the item(s) you try to calibrate.

Note: ADC has to be calibrated before other item(s). If the ADC value is correct or you calibrate ADC and

other items at the same time, that’s OK.

4. Select “Calibrate”.

Calibration is carried out automatically regarding the calibration item(s) that you selected.

5. The candidate of the new calibration values is shown in the “calculated” field. If the new calibration values

seem to be reasonable (please refer to the calibration value limit table), select Write to PM to store the new

calibration value in the phone permanent memory.

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Table 23 Calibration value limits

Parameter Min. Max.

ADC Gain 26500 28500

ADC Offset -50 50

BSI Gain 600 1100

VBAT Gain 10000 11000

VBAT Offset 2300 2900

VCHAR Gain 58000 62000

ICHAR Gain 3500 4400

ICHAR Offset -80 +80

IBAT Gain 50 160

6. Select “Read from phone” and confirm that the new calibration values are stored in the phone memory

correctly. If not, please try to store by selecting “Write to PM” again.

7. Close the Energy Management Calibration window.

Testing and tuning BB after component replacement

Context

The replacement of certain components which influences the energy management in the phone should be

followed by a calibration.

Steps

1. Calibrate R133, the UEME - D250, the ZOCUS - N130 and R259.

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7 — RF troubleshooting

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Table of Contents

Introduction to RF troubleshooting.........................................................................................................................................7–5

RF key component placement....................................................................................................................................................7–5

Receiver.............................................................................................................................................................................................7–8

Receiver troubleshooting......................................................................................................................................................7–8

Measuring Rx/IQ signals using RSSI....................................................................................................................................7–9

Measuring RX performance using SNR measurement...............................................................................................7–10

Measuring Rx module manually using oscilloscope and spectrum analyzer (EGSM900)................................7–10

Measuring Rx module manually using oscilloscope and spectrum analyzer (GSM1800)...............................7–13

Measuring Rx module manually using oscilloscope and spectrum analyzer (GSM1900)...............................7–14

RM-25 measurement points in the receiver..................................................................................................................7–17

Calibrating RX Channel Select Filter.................................................................................................................................7–18

Calibrating RX..........................................................................................................................................................................7–19

Transmitter....................................................................................................................................................................................7–22

Introduction to RM-25 transmitter troubleshooting..................................................................................................7–22

Preparing for transmitter troubleshooting...................................................................................................................7–23

Troubleshooting TX-BB interface and control signals................................................................................................7–25

Troubleshooting RF side of transmitter.........................................................................................................................7–27

Introduction to transmitter tuning..................................................................................................................................7–28

Tuning TX/IQ............................................................................................................................................................................7–28

Tuning TX power level..........................................................................................................................................................7–32

Introduction to synthesizer troubleshooting...............................................................................................................7–40

Preparing for synthesizer troubleshooting...................................................................................................................7–42

Measuring the synthesizer manually using spectrum analyzer ............................................................................7–44

Bluetooth........................................................................................................................................................................................7–45

Bluetooth component placement....................................................................................................................................7–45

Bluetooth settings for Phoenix.........................................................................................................................................7–45

Troubleshooting Bluetooth................................................................................................................................................7–47

List of Tables

Table 24 RF retuning after changing a component.............................................................................................................7–6

Table 25 RX calibration settings..............................................................................................................................................7–20

Table 26 Spectrum analyzer settings.....................................................................................................................................7–28

Table 27 RF Control window settings.....................................................................................................................................7–30

Table 28 Spectrum analyzer settings for Tx power level tuning...................................................................................7–33

Table 29 Spectrum analyzer settings for Tx level tuning.................................................................................................7–34

List of Figures

Figure 107 RF key component placement...............................................................................................................................7–6

Figure 108 RF key components (left)........................................................................................................................................7–7

Figure 109 RF key components (right).....................................................................................................................................7–7

Figure 110 Receiver signal paths...............................................................................................................................................7–8

Figure 111 Troubleshooting flowchart for EGSM900.........................................................................................................7–12

Figure 112 Probed Rx I/Q signals J730, J731........................................................................................................................7–13

Figure 113 Troubleshooting flowchart for EGSM1800......................................................................................................7–14

Figure 114 Troubleshooting flowchart for EGSM1900......................................................................................................7–16

Figure 115 Measurement points at RX frontend - part 1.................................................................................................7–17

Figure 116 Measurement points at RX frontend - part 2.................................................................................................7–18

Figure 117 Measurement points at baseband and digital IQs.......................................................................................7–18

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Figure 118 RX Channel Select Filter Calibration...................................................................................................................7–19

Figure 119 RX calibration (Example)......................................................................................................................................7–20

Figure 120 RX calibration with band EGSM900 (Example)...............................................................................................7–21

Figure 121 RX calibration values (Example).........................................................................................................................7–21

Figure 122 TX RF block diagram...............................................................................................................................................7–22

Figure 123 Upper and lower shielding cans.........................................................................................................................7–23

Figure 124 Preparing for transmitter troubleshooting....................................................................................................7–24

Figure 125 TX-BB interface troubleshooting and control signals.................................................................................7–25

Figure 126 Oscilloscope screen shots.....................................................................................................................................7–26

Figure 127 RF side of transmitter troubleshooting...........................................................................................................7–27

Figure 128 Oscilloscope screen shots (RF)............................................................................................................................7–28

Figure 129 RF controls.................................................................................................................................................................7–29

Figure 130 Tx IQ tuning..............................................................................................................................................................7–29

Figure 131 Phoenix set-up (Tx IQ Tuning windows).........................................................................................................7–30

Figure 132 Spectrum analyzer screen shot when performing IQ tuning, part 1......................................................7–31

Figure 133 Spectrum analyzer screen shot when performing IQ tuning, part 2......................................................7–32

Figure 134 Phoenix menu select (Tx Power Level Tuning menu).................................................................................7–33

Figure 135 Phoenix Power Level Tuning menu..................................................................................................................7–34

Figure 136 Phoenix screen shot (Tx Power Level Tuning)...............................................................................................7–35

Figure 137 Spectrum analyzer screen shot during power level tuning......................................................................7–36

Figure 138 Testpoints of the main board 1fsa_09a, top part.........................................................................................7–37

Figure 139 Testpoints of the main board 1fsa_11a, top part.........................................................................................7–38

Figure 140 Testpoints of the main board, bottom part...................................................................................................7–39

Figure 141 Synthesizer block diagram..................................................................................................................................7–40

Figure 142 Rf key component...................................................................................................................................................7–41

Figure 143 Synthesizer key components without shielding frames............................................................................7–42

Figure 144 Preparation for troubleshooting using Phoenix RF control setup..........................................................7–43

Figure 145 Troubleshooting chart for synthesizer............................................................................................................7–44

Figure 146 Bluetooth component placement.....................................................................................................................7–45

Figure 147 Phoenix settings for Bluetooth troubleshooting..........................................................................................7–46

Figure 148 Bluetooth troubleshooting..................................................................................................................................7–47

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Introduction to RF troubleshooting

This document describes RF troubleshooting and tuning. In general, two types of measurements have to be

done during troubleshooting and repair of phones:

• RF measurements shall be done with a spectrum analyzer, either connected directly to the RF connector of

the RF adapter board SA-38, or used together with a high-frequency probe to measure RF signals at points

along the TX or RX chain.

• LF (Low-Frequency) and DC measurements shall be done either with a multimeter, or with an oscilloscope

together with a 10:1 probe.

All tuning must be done with Phoenix Service Software _a15_2004_7_55.exe, or later.

Always make sure that the measurement set-up has been calibrated when measuring RF parameters at the RF

connector. Remember to include the correct losses in the module repair jig and the connecting cable when

realigning the phone.

Most RF semiconductors are static discharge sensitive. ESD protection must be taken into account during repair

(ground straps and ESD soldering irons).

RF calibration done via Phoenix software is temperature sensitive because of calibration of 26MHz reference

oscillator (VCXO). According to the Helgo specification, the ambient temperature has to be in the range of 22 to

38C.

Note: In this text the following terms are used interchangeably:

• GSM900 = EGSM900 = EGSM

• GSM1800 = DCS band = PCN band

• GSM1900 = PCS band

The first step of fault-finding should always be a visual inspection. Carefully inspect the RF area using a

microscope and look for solder bridges, missing components, short circuits, components that have partially

come off and other anomalies. Capacitors can be checked to see that they are not short-circuited, and inductors

that they are not open circuits. Also check that power supply lines are not short-circuited, i.e. not 0Ω to ground.

Instruments needed for troubleshooting (minimum requirement):

• oscilloscope

• multimeter

• spectrum analyzer (SA)

Note: Always use an attenuator at the spectrum analyzer input to ensure that the SA will not become

damaged by excessive input power from the phone. Check the spectrum analyzer for maximum

allowable input power.

For example, when transmitting in the EGSM band at max power level, the output power will be around

+33dBm. By using a 10dB attenuator the actual input to the SA will then be +23dBm. Also adjust the

internal attenuator so that the transmitted signal is reduced to less than around -10dBm in order to

avoid saturation of SA input stage.

• power supply that can deliver at least 2Adc

• Nokia MJ-30 module jig (also called test jig)

• RF adapter SA-38

• PC with Phoenix installed

• PKD-1 deskey dongle for Phoenix

RF key component placement

The following figure shows the key components of the RF section:

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Figure 107 RF key component placement

• Adjust the RX chain after repairing or changing the parts marked RX.

• Adjust the TX chain after repair or changing the parts marked TX.

• The numbering refers to the RF-overview and non-RF-overview pictures.

Table 24 RF retuning after changing a component

1N500 Helgo RF ASIC RX TX

2 G500 VCO RX TX

3 G501 VCTCXO RX

4 Z800 RX/TX Switch RX TX

5 N700 PA TX

6 V800 LNA1900 RX

7 Z803 RX SAW 900 RX

8 Z802 RX SAW 1800 RX

9 Z801 RX SAW 1900 RX

10 T800 RX Balun 1900 RX

11 Z700 TX SAW 900 TX

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12 T700 TX Balun 1800/

1900

Figure 108 RF key components (left)

Figure 109 RF key components (right)

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Receiver

Receiver troubleshooting

Figure 110 Receiver signal paths

Each receiver path is a direct conversion linear receiver. From the antenna, the received RF signal is fed to a

front end module where a diplexer first divides the signal to two separate paths according to the band of

operation: either lower, EGSM900 or upper, GSM1800/1900 path.

At each of the paths follows a pin-diode switch, which is used to select either a receive- or transmit mode. At

the upper band in the receive mode either GSM1800 or 1900 path is further selected by another pin-diode

switch. The selections are controlled by Helgo, which obtains the mode/band and timing information through

the RFBus.

After the switches an external bandpass filter follows each receiver paths. Thereafter, the signal is fed to the

LNA's. EGSM900 and GSM1800 LNA's are integrated in Helgo, while the GSM1900 LNA is a discrete component

placed between SAW filter and balun. In GSM1900, the amplified signal is fed to a pre-gain stage of the mixer.

EGSM900 and GSM1800 LNA's are connected directly to the pregain stages. The pregain stages as well as all the

following receiver blocks are integrated in Helgo. The LNA's have three gain levels. The first one is the maximum

gain, the second one is about 30 dB below the maximum, and the last one is the off state.

After the pregain stages there are demodulator mixers at each signal path to convert the RF signal directly down

to baseband I and Q signals. Local oscillator signals for the mixers are generated by an external VCO. The

frequency is divided by two in GSM1800 and GSM1900 and by four in EGSM900. Those frequency dividers are

integrated in Helgo and in addition to the division they also provide accurate phase shifting by 90 degrees

which is needed for the demodulator mixers.

The demodulator output signals are all differential. After the demodulators there are amplifiers called DtoS

(differential to single ended) which convert the differential signals to single ended. Before that, they combine

the signals from the three demodulators to a single path which means that from the output of the demodulators

to the baseband interface are just two signal paths (I and Q), which are common to all the frequency bands of

operation. In addition, the DtoS amplifiers perform the first part of the channel filtering and AGC (automatic

gain control). They have two gain stages, the first one with a constant gain of 12 dB and -3 dB bandwidth of

85 kHz and the second one with a switchable gain of ±6 dB. The filters in the DtoS blocks are active RC filters.

The rest of the analog channel filtering is provided by blocks called BIQUAD which include modified Sallen-Key

biquad filters.

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After the DtoS and BIQUAD blocks, there is another AGC-amplifier which provides a gain control range of 42 dB

in 6 dB steps. The correlation between the gain steps and the absolute received power levels is found by a

calibration routine in the production for each assembled phone.

In addition to the AGC steps, the last AGC stage also performs the real time DC offset compensation, which is

needed in a direct conversion receiver to cancel out the effect of the local oscillator leakage. DC offset

compensation is performed during an operation called DCN1. DCN1 is carried out by charging capacitors at the

input of the last AGC stages to a voltage, which causes a zero DC offset. To improve the accuracy a DC level

alignment possibility has been added to Helgo.

After the last AGC stages the single ended and filtered I- and Q-signals are fed to the RX ADCs. The maximum

peak-to-peak voltage swing for the ADCs is 1.45 V.

Measuring Rx/IQ signals using RSSI

Context

Steps

1. Start Phoenix service software.

2. Establish a connection to the phone.

From the File menu, choose "Open Product".

From the list, select RM-25.

3. From the Testing menu, choose RF Controls.

4. In the RF Controls window:

• Select Band: GSM900/GSM1800/GSM1900.

• Set Active unit to Rx.

• Set Operation mode to Burst.

• Set Rx/Tx channel in the following way: EGSM900: 37, GSM1800: 700 and GSM1900:661.

5. From the Testing menu, choose RSSI Reading.

The setup now looks like this:

6. Apply a signal frequency of:

• EGSM900: 942.4677MHz (channel 37 + 67.7KHz offset)

• GSM1800: 1842.8677MHz (channel 700 + 67.7KHz offset)

• GSM1900: 1960.0677MHz (channel 661 + 67.7 KHz)

7. In RSSI reading, click Read now.

Results

The resulting RSSI level should be -80dBm in each band.

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Measuring RX performance using SNR measurement

Context

Note: This measurement also provides an indication of the conducted sensitivity.

Steps

1. Start Phoenix Service Software

2. Establish connection to the phone.

From the File menu, choose "Open Product".

From the list, select RM-25.

3. From the Testing menu, choose RF Controls.

4. In the RF Controls window:

i Select Band: GSM900/GSM1800/GSM1900

ii Set Active unit to RX.

iii Set Operation mode to Burst

iv Set Rx/Tx channel in the following way: EGSM900: 37, GSM1800: 700 and GSM1900: 661

5. From the testing menu (T) select SNR measurement (M). Then select Both.

6. Choose respective band, EGSM900, GSM1800 or GSM1900.

Press Start.

7. Follow the instructions for Signal generator set-up in the pop-up window.

Press OK.

Results

Read the SNR result. SNR should be > 18dB.

Check the sensitivity value.

The set-up should now look like this (the pop-up window also included in the picture for reference):

Measuring Rx module manually using oscilloscope and spectrum analyzer (EGSM900)

Context

Spectrum analyzer level values depend on the probe type and should be validated using a known good sample.

The levels that are given here are measured using a high frequency probe.

Measuring with an oscilloscope at test points RXI (J730) or RXQ (J731) ) and RXID (J261) or RXQD (J262) is

recommended only if RSSI reading does not provide enough information.

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Steps

1. Start Phoenix Service software.

2. Establish connection to the phone.

From the File menu, choose Open Product.

From the list, choose RM-25.

3. From the Testing menu, choose RF Controls.

4. In the RF Controls window:

i Select Band EGSM900.

ii Set Active unit to RX.

iii Set Operation mode to Continuous.

iv Set RX/TX channel to 37.

v Set AGC to 12.

Set the frequency and level of the signal generator to 942.4677MHz and -60dBm.

Note: Because DC compensation does not work during continuous mode, DC offset level at RXI and

RXQ will gradually shift from the optimized level.

To have the most reliable result, it is highly advisable to set the operation mode from burst to

continuous just before measuring values and complete measurement within no longer than 30

seconds.

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Figure 111 Troubleshooting flowchart for EGSM900

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Figure 112 Probed Rx I/Q signals J730, J731

• Signal amplitude: 180 ~ 600mVpp

• DC offset: 1.2 ~ 1.4V

• Frequency: approximately 67KHz

Measuring Rx module manually using oscilloscope and spectrum analyzer (GSM1800)

Context

Spectrum analyzer level values depend on the probe type and should be validated using a known good sample.

The levels that are given here are measured using a high frequency probe.

Measuring with an oscilloscope at test points RXI (730) or RXQ (J731) ) and RXID (J261) or RXQD (J262) is

recommended only if RSSI reading does not provide enough information.

Steps

1. Start Phoenix Service software.

2. Establish connection to the phone.

From the File menu, choose Open Product.

From the list, choose RM-25.

3. From the Testing menu, choose RF Controls.

4. In the RF Controls window:

i Select Band GSM1800.

ii Set Active unit to Rx.

iii Set Operation mode to Continuous.

iv Set RX/TX channel to 700.

v Set AGC to 12.

The frequency or level of signal generator is 1842.8677MHz, -60dBm.

Note: Because DC compensation does not work during continuous mode, DC offset level at RXI and

RXQ will gradually shift from the optimized level.

To have the most reliable result, it is highly advisable to set the operation mode from burst to

continuous just before measuring values and complete measurement within no longer than 30

seconds.

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Figure 113 Troubleshooting flowchart for EGSM1800

Measuring Rx module manually using oscilloscope and spectrum analyzer (GSM1900)

Context

Spectrum analyzer level values depend on the probe type and should be validated using a known good sample.

The levels that are given here are measured using a high frequency probe.

Measuring with an oscilloscope at test points RXI (J827) or RXQ (J828) ) and RXID (J261) or RXQD (J262) is

recommended only if RSSI reading does not provide enough information.

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Steps

1. Start Phoenix Service software.

2. Establish connection to the phone.

From the File menu, choose Open Product.

From the list, choose RM-25.

3. From the Testing menu, choose RF Controls.

4. In the RF Controls window:

i Select Band GSM1900.

ii Set Active unit to Rx.

iii Set Operation mode to Continuous.

iv Set RX/TX channel to 661.

v Set AGC to 12.

The frequency or level of signal generator is 1960.0677MHz, -60dBm.

Note: Because DC compensation does not work during continuous mode, DC offset level at RXI and

RXQ will gradually shift from the optimized level.

To have the most reliable result, it is highly advisable to set the operation mode from burst to

continuous just before measuring values and complete measurement within no longer than 30

seconds.

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Figure 114 Troubleshooting flowchart for EGSM1900

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RM-25 measurement points in the receiver

Figure 115 Measurement points at RX frontend - part 1

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Figure 116 Measurement points at RX frontend - part 2

Figure 117 Measurement points at baseband and digital IQs

Calibrating RX Channel Select Filter

Context

This calibration is for the baseband filter inside Helgo ASIC. The calibration is done by internally measuring a

prototype filter. For this reason, the calibration is done only once, not separately for 3 bands.

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This tuning doesn’t require RF input from an external signal generator.

Steps

1. Select Tuning -> RX Channel Select Filter Calibration

Figure 118 RX Channel Select Filter Calibration

i Check Save to Phone

ii Press Tune

iii Press Stop to store the data to the phone

Results

RX channel select filter calibration is finished.

Calibrating RX

Context

RX calibration is used to determine gain at different gain settings for front-end and the Helgo ASIC and it needs

to be done in all three bands.

RX calibration requires an external signal generator.

Steps

1. Select Tuning -> RX calibration

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Figure 119 RX calibration (Example)

i Make sure you have made the following settings:

Table 25 RX calibration settings

Band Calibration mode 1st Manual [dbm] 2nd Manual [dbm]

GSM 900 Automatic -50 -85

GSM 1800/1900 Automatic -50 -85

ii Check Load from phone and Save to phone.

iii Press Start

Initial data will be loaded from the phone and calibration starts.

The following banner pops up:

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Figure 120 RX calibration with band EGSM900 (Example)

iv Follow the instructions in the pop–up window and set frequency and level of the signal generator.

v Press OK

vi Press “Save & Continue”

Figure 121 RX calibration values (Example)

Results

Calibration data will be stored to the phone.

Next action

Continue to next band.

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Transmitter

Introduction to RM-25 transmitter troubleshooting

A simple block diagram of the TX part of the phone is shown in the following figure. The voice or data signals

to be transmitted come from the UEME IC in the BB (baseband) area, and go to the Helgo IC, where they are up-

converted to RF. The TX signals going from UEME to Helgo are called the IQ-signals, and consist of two balanced

signals {TXIN, TXIP} and {TXQN, TXQP}, i.e. a total of four signal lines. In addition to the IQ signals, there are also

control signals going between BB and RF.

Figure 122 TX RF block diagram

The following picture shows the two shielding cans where the TX circuitry is located (the lids have been

removed). The upper shielding can contains BB-RF interface circuitry, the Helgo RF system IC, a SAW filter for

the GSM/EGSM band, and a balun for the DCS/PCS band. The lower shielding can contains the power amplifier

(PA) and the antenna switch module (ASM).

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Figure 123 Upper and lower shielding cans

Preparing for transmitter troubleshooting

Steps

1. Place the phone (mechanics removed) on module jig.

2. Connect the module jig to PC via a DAU-9P cable.

3. Connect the module jig to a power supply (4.2V).

4. Connect the RF output to a spectrum analyzer or another measurement instrument. Use a 10dB attenuator

at the input to spectrum analyzer to avoid damaging it.

5. Make sure the dongle is connected and start Phoenix.

6. In Phoenix, choose: File -> Open Product -> RM-25 Product Menu.

7. Select Testing -> RF Controls.

8. In the toolbar: set Operating Mode to Local.

9. Select Band: GSM900, GSM1800 or GSM1900.

10. Set Operation Mode to Burst.

11. Set Active Unit to Tx.

12. Set Tx Data Type to All 1.

13. Set Rx/Tx Channel to 37 for GSM900, 700 for GSM1800, or 661 for GSM1900.

14. Set Tx PA Mode to Free.

15. Set Tx Power Level to 5 for GSM900, otherwise to 0.

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Results

Phoenix should now look like this:

Figure 124 Preparing for transmitter troubleshooting

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Troubleshooting TX-BB interface and control signals

Figure 125 TX-BB interface troubleshooting and control signals

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Figure 126 Oscilloscope screen shots

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Troubleshooting RF side of transmitter

Figure 127 RF side of transmitter troubleshooting

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Figure 128 Oscilloscope screen shots (RF)

Introduction to transmitter tuning

In the transmitter, there are two kinds of tunings that can be done: IQ tuning and power level tuning. In general,

different repairs require different tunings. In order to decide which tuning is necessary after a repair, it is

important to understand the functionality of the repaired circuit. In general, it is recommended that if any TX

component is changed, both these tunings be done. All tunings are done in local mode using Phoenix to control

the phone.

As the RM-25 doesn’t support the EDGE feature, you don’t need to consider operating/tuning the phones in EDGE

mode although Phoenix sometimes has a control selection box to enable EDGE.

Tuning TX/IQ

Context

The tuning must be carried out in all three bands. In addition to Phoenix, a spectrum analyzer (SA) is needed.

Steps

1. Connect the spectrum analyzer (SA) to the RF connector of the module jig. The settings of the SA will depend

on the band to be tuned. The following table summarizes the settings for each of the three bands.

Table 26 Spectrum analyzer settings

GSM900 GSM1800 GSM1900

Center frequency 897.4MHz 1747.8MHz 1880MHz

Frequency span 300kHz 300kHz 300kHz

Resolution Bandwidth 3kHz 3kHz 3kHz

Video Bandwidth 3kHz 3kHz 3kHz

Sweep Time 3 sec 3 sec 3 sec

Trace Type Clear/Write Clear/Write Clear/Write

Detector Type Max Peak Max Peak Max Peak

Reference Level 35dBm 35dBm 35dBm

Marker 1 897.33229 MHz 1747.73229 MHz 1879.93229 MHz

Marker 2 897.4MHz 1747.8MHz 1880MHz

Marker 3 897.46771MHz 1747.86771MHz 1880.06771MHz

2. Open the following two windows in Phoenix:

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i select Testing -> RF Controls

Figure 129 RF controls

ii select Tuning -> TX IQ Tuning.

Figure 130 Tx IQ tuning

After opening the two windows, Phoenix should look like this:

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Figure 131 Phoenix set-up (Tx IQ Tuning windows)

3. Select correct settings for the band you are tuning. The following table summarises the settings of the RF

control window for IQ tuning of the three bands.

Table 27 RF Control window settings

Band TX Data Type TX Power Level RX/TX Channel

GSM900 All 1 5 37

GSM1800 All 1 0 700

GSM1900 All 1 0 661

4. Start IQ tuning by pressing Start button in the TX IQ Tuning window.

The purpose of this tuning is to reduce the frequency components at marker 2 (carrier leakage) and marker

3 (+67kHz/upper sideband) as much as possible.

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Figure 132 Spectrum analyzer screen shot when performing IQ tuning, part 1

5. Adjust the ‘TXI DC Offset’ and the ‘TXQ DC Offset’ buttons in the TX IQ Tuning window so that the carrier level

(marker 2) reaches a minimum.

After this adjustment is done, the carrier (marker 2) should be at least 40dB below the lower side band

(marker 1).

6. Use the ‘Amplitude difference’ and the ‘Phase difference’ buttons in the TX IQ Tuning window to adjust the

upper side band (marker 3) to a minimum.

Now, marker 3 should also be at least 40dB below marker 1.

At this point, the spectrum analyzer screen should look similar to that of the figure below.

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Figure 133 Spectrum analyzer screen shot when performing IQ tuning, part 2

7. After reducing the amplitude of the frequency components at marker 2 and 3 to a minimum, press Save &

Continue.

The EGSM tuning has now been completed.

Next action

Now, using the spectrum analyzer settings listed in Table “Spectrum analyzer settings” and the RF control

settings listed in Table “RF Control window settings”, follow exactly the same procedure to perform IQ tuning

in the GSM1800 and GSM1900 bands.

Tuning TX power level

Context

This tuning is done separately in all three bands, and requires a spectrum analyzer to measure the burst power

of the GSM RF signal. When measuring the RF output (burst) power on a spectrum analyzer, use the settings

found in the following table:

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Table 28 Spectrum analyzer settings for Tx power level tuning

GSM900 GSM1800 GSM1900

Center frequency 897.4MHz 1747.8MHz 1880MHz

Frequency span Zero-span Zero-span Zero-span

Resolution Bandwidth 1MHz 1MHz 1MHz

Video Bandwidth 1MHz 1MHz 1MHz

Sweep Time 1ms 1ms 1ms

Trigger Type Video Video Video

Video trigger level Target pwr – 10dB Target pwr – 10dB Target pwr – 10dB

Trace Type Clear/Write Clear/Write Clear/Write

Detector Type Max Peak Max Peak Max Peak

Reference Level Target power level +

10dB

Target power level +

10dB

Target power level +

10dB

Internal Attenuation Target power level +

10dB

Target power level +

10dB

Target power level +

10dB

Steps

1. In Phoenix, select Tuning -> TX Power Level Tuning.

Figure 134 Phoenix menu select (Tx Power Level Tuning menu)

Phoenix should now look similar to the figure below.

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Figure 135 Phoenix Power Level Tuning menu

2. Select data source and band, then press Start. It is recommended to have saved data from a known good

phone to the PC.

3. Connect the module jig RF output to the measurement instrument. The power must be tuned in only high

TX PA mode in all bands of GSM900, GSM1800 and GSM1900.

4. For each band, tune the power by adjusting the coefficient in the Tx Power Level Tuning window in Phoenix

until the target level is reached (measured on the spectrum analyzer). Remember to take into account the

external power loss, that is, the loss of the cable and the external attenuator at the spectrum analyzer input.

The coefficient must be tuned for the base level and other power levels (PL) marked with bold letters in

Phoenix (GSM900: PL19 / 15 / 5, GSM1800/1900: PL15, 11, 0). The target power levels are specified as listed

in the following table:

Table 29 Spectrum analyzer settings for Tx level tuning

GSM900 GSM1800 GSM1900

PL 5 32.5 dBm PL 0 29.5 dBm PL 0 29.5 dBm

PL 15 13.0 dBm PL 11 8.0 dBm PL 11 8. 0dBm

PL 19 5.0 dBm PL 15 0.0 dBm PL 15 0.0 dBm

Base PL -30.0 dBm Base PL -30.0 dBm Base PL -30.0 dBm

5. When the tuning for the levels marked with bold letters has been completed, press Calculate coefficients to

calculate the other power levels with non-bold letters.

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6. When the coefficient calculation has been successfully done, press Save & Continue to save the new tuning

values into the phone memory.

The following figure shows the power level tuning at the GSM900 band.

Figure 136 Phoenix screen shot (Tx Power Level Tuning)

The figure below shows one example from the spectrum analyzer screen during measuring the Tx power

level.

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Figure 137 Spectrum analyzer screen shot during power level tuning

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Figure 138 Testpoints of the main board 1fsa_09a, top part

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Figure 139 Testpoints of the main board 1fsa_11a, top part

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Figure 140 Testpoints of the main board, bottom part

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Introduction to synthesizer troubleshooting

Figure 141 Synthesizer block diagram

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The VCO frequency is locked by a PLL (phase locked loop) into a stable frequency source given by a VCTCXO, which

is running at 26 MHz. The frequency of the VCTCXO is in turn locked into the frequency of the base station with

the help of an AFC (automatic frequency control) voltage, which is generated in UEME by an 11-bit D/A (digital-

to-analog) converter.

The PLL is capable of tuning frequency range for GSM bands 900/1800/1900. It is integrated in Helgo and

controlled through the RFBus. The PLL consists of a 64/65 (P/P+1) prescaler, N- and A-divider, reference divider,

phase detector and a charge pump for the external loop filter.

The 4 GHz oscillator signal, generated by the VCO, is fed through a 180 degrees balanced phase shifter to the

prescaler and the output of the prescaler is fed to the N- and A-divider, which produces the input to the phase

detector. The phase detector compares this signal to the reference signal, which is divided by the reference

divider from the VCTCXO frequency.

The frequency of the reference signal is 400 kHz. The output of the phase detector is connected to the charge

pump, which charges or discharges the integrator capacitor in the loop filter depending on the phase of the

measured frequency compared to the reference frequency.

The integrator output voltage is finally connected to the control input of the VCO. The VCO operates at the

channel frequency multiplied by two in GSM1800/1900 and by four in EGSM900.

The required frequency dividers for modulator and demodulator mixers are integrated in Helgo.

Loop filter filters out the comparison pulses of the phase detector and generates a DC control voltage to the

VCO. The loop filter determines the step response of the PLL (settling time) and contributes to the stability of

the loop.

Other filter components are for sideband rejection.

The dividers are controlled via the RFBus. RFBusData is for the data, RFBusClk is a serial clock for the bus and

RFBusEna1X is a latch enable, which stores the new data into the dividers.

Figure 142 Rf key component

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Figure 143 Synthesizer key components without shielding frames

Assumption

• No soldering or component failure for simple SMD components such as resistors, inductors and capacitors

• Failure in one particular operating GSM channel, whether Tx or Rx, in which the synthesizer is the cause of

the failure, causes failure in all other GSM channels in Tx/Rx.

Preparing for synthesizer troubleshooting

Steps

1. Place the phone (mechanics removed) on module jig.

2. Connect the module jig to the PC via a DAU-9P cable.

3. Connect the module jig to a power supply (4.2V).

4. Connect the RF output to a spectrum analyzer or another measurement instrument.

5. Use a 10dB attenuator at the input to spectrum analyzer to avoid damage.

6. Make sure the dongle is connected and start Phoenix.

7. In Phoenix, select File -> Open Product -> RM-25 (Nokia 6260) Product Menu.

8. Select Testing -> RF Controls.

9. In the toolbar: set Operating Mode -> Local.

10. Select Band -> GSM 1800.

11. Set Operation Mode -> Continuous.

12. Set Active Unit -> Rx.

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13. Set Rx/Tx Channel -> 700.

Figure 144 Preparation for troubleshooting using Phoenix RF control setup

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Measuring the synthesizer manually using spectrum analyzer

Figure 145 Troubleshooting chart for synthesizer

Spectrum analyzer level values depend on the probe type and should be validated using a known good sample.

The levels that are given here are measured using a high frequency probe. Spectrum analyzer should be at least

capable of measuring signal upto 4.5 GHz.

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Bluetooth

Bluetooth component placement

Figure 146 Bluetooth component placement

Note: This component placement is taken from a B3 prototype and is subject to change in the future.

Bluetooth settings for Phoenix

Steps

1. Start Phoenix service software.

2. From the File menu, choose Open Product, and then choose the correct type designator from the Product list.

3. Connect the phone to a docking station in the local mode.

4. From the Testing menu, choose Bluetooth LOCALS.

5. Locate JBT-9’s serial number (12 digits) found in the type label on the back of JBT-9.

6. In the Bluetooth LOCALS window, write the 12-digit serial number on the "Counterpart BT Device Address"

line.

This needs to be done only once provided that JBT-9 is not changed.

7. Place the JBT-9 box near (within 10 cm) the BT antenna and click Run BER Test.

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Results

Figure 147 Phoenix settings for Bluetooth troubleshooting

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Troubleshooting Bluetooth

Figure 148 Bluetooth troubleshooting

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8 — Camera module

troubleshooting

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Table of Contents

Introduction to camera module troubleshooting...............................................................................................................8–5

The effect of image taking conditions on image quality..................................................................................................8–6

Image quality analysis ..............................................................................................................................................................8–10

Testing for dust in camera module..................................................................................................................................8–10

Testing camera image sharpness.....................................................................................................................................8–11

Image bit errors.....................................................................................................................................................................8–12

Camera troubleshooting flowcharts......................................................................................................................................8–13

Camera hardware troubleshooting.................................................................................................................................8–13

Camera hardware failure troubleshooting....................................................................................................................8–15

Bad image quality troubleshooting.................................................................................................................................8–16

List of Figures

Figure 149 Sharpness of the picture is worse on the edges than in the center.........................................................8–6

Figure 150 Blurring caused by shaking hands. Geometrical barrel distortion in the background.......................8–7

Figure 151 Near objects get skewed when taking images from a moving vehicle...................................................8–7

Figure 152 Noisy image taken in +70 degrees Celsius........................................................................................................8–8

Figure 153 Image taken against light......................................................................................................................................8–8

Figure 154 Flicker in an image; object illuminated by strong fluorescent light.........................................................8–9

Figure 155 A lens reflection effect caused by sunshine......................................................................................................8–9

Figure 156 Good image taken indoors..................................................................................................................................8–10

Figure 157 Good image taken outdoors...............................................................................................................................8–10

Figure 158 Effects of dust on optical path............................................................................................................................8–11

Figure 159 Bit errors caused by JPEG compression............................................................................................................8–13

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Introduction to camera module troubleshooting

Background, tools and terminology

Faults or complaints in camera operation can be roughly categorised into three subgroups:

1 Camera is not functional at all; no image can be taken.

2 Images can be taken but there is nothing recognizable in them.

3 Images can be taken and they are recognizable but for some reason the quality of images is seriously

degraded.

Image quality is very hard to measure quantitatively, and even comparative measurements are difficult

(comparing two images) to do, if the difference is small. Especially if the user is not satisfied with his/her device's

image quality, and tells, for example, that the images are not sharp, it is fairly difficult to accurately test the

device and get an exact figure which would tell whether the device is functioning properly.

Often subjective evaluation has to be used for finding out if a certain property of the camera is acceptable or

not. Some training or experience of a correctly operating reference device may be needed in order to detect

what actually is wrong.

It is easy for the user to take bad images in bad conditions. Therefore the camera operation has to be checked

always in constant conditions (lighting, temperature) or by using a second, known-to-be good device as

reference.

When checking for possible errors in camera functionality, knowing what error is suspected significantly helps

the testing by narrowing down the amount of test cases. The following types of image quality problems may

be expected to appear:

• Dust (black spots)

• Lack of sharpness

• Bit errors

Terms

Dynamic range Camera's ability to capture details in dark and bright areas of the scene

simultaneously.

Exposure time Camera modules use silicon sensor to collect light and for forming an image.

The imaging process roughly corresponds to traditional film photography,

in which exposure time means the time during which the film is exposed to

light coming through optics. Increasing the time will allow for more light

hitting the film and thus results in brighter image. The operation principle

is exactly the same with silicon sensor, but the shutter functionality is

handled electronically i.e. there is no mechanical moving parts like in film

cameras.

Flicker Phenomenon, which is caused by pulsating in scene lighting, typically

appearing as wide horizontal stripes in an image.

Noise Variation of response between pixels with same level of input illumination.

Resolution Usually the amount of pixels in the camera sensor; for example, RM-1 has a

1280 x 960 pixel sensor resolution. In some occasions the term resolution is

used for describing the sharpness of the images.

Sensitivity Camera module's sensitivity to light. In equivalent illumination conditions,

a less sensitive camera needs a longer exposure time to gather enough light

in forming a good image. Analogous to ISO speed in photographic film.

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Sharpness Good quality images are 'sharp' or 'crisp', meaning that image details are

well visible in the picture. However, certain issues, such as non-idealities in

optics, cause image blurring, making objects in picture to appear 'soft'. Each

camera type typically has its own level of performance.

The effect of image taking conditions on image quality

There are some factors, which may cause poor image quality, if not taken into account by the end user when

shooting images, and thus may result in complaints. The items listed are normal to camera operation and are

not a reason for changing the camera module.

Distance to target

The lens in the module is specified to operate satisfactorily from 40 cm to infinite distance of scene objects. In

practice, the operation is such that close objects may be noticed to get more blurred when distance to them is

shorter than 40 cm. The lack of sharpness is first visible in full resolution images. If observing just the viewfinder,

even very close objects may seem to appear sharp.

Sharpness of picture edges

The lens performance degrades in image edges, and generally the image is sharpest in the center part.

Particularly this applies to distant objects (> 1 meter).

See the following figure.

Figure 149 Sharpness of the picture is worse on the edges than in the center

Geometrical distortion

The camera lens causes some amount of so called barrel distortion in images.

In practice, this appears as bending of straight objects on the edges of an image. See figure Blurring caused by

shaking hands (Page 8–7) (wall in the background).

The amount of light available

In dim conditions camera runs out of sensitivity. The exposure time is long (especially in the night mode) and

the risk of getting shaken (= blurred) images increases. In addition, image noise level grows. The maximum

exposure time in the night mode is ¼ seconds. Therefore, images need to be taken with extreme care and by

supporting the phone when the amount of light reflected from the target is low. Because of the longer exposure

time and larger gain value, noise level increases in low light conditions. Sometimes blurring may even occur in

daytime, if the image is taken very carelessly. See the figure below for an example.

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Figure 150 Blurring caused by shaking hands. Geometrical barrel distortion in the background.

Movement in bright light

If an image is taken of moving objects or if the device is used in a moving vehicle, object 'skewing' or 'tilting'

may occur. This phenomenon is fundamental to most CMOS camera types, and usually cannot be avoided. The

movement of camera or object sometimes cause blurring indoors or in dim lighting conditions because of long

exposure time.

Figure 151 Near objects get skewed when taking images from a moving vehicle

Temperature

High temperatures inside the mobile phone cause more noise to appear in images. For example, in +70 degrees

(Celsius), the noise level may be very high, and it further grows if the conditions are dim. If the phone processor

has been heavily loaded for a long time before taking an image, the phone might have considerably higher

temperature inside than in the surrounding environment. This is also normal to camera operation; do not

change the camera module.

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Figure 152 Noisy image taken in +70 degrees Celsius

Phone display

If the display contrast is set too dark, the image quality degrades: the images may be very dark depending on

the setting. If the display contrast is set too bright, image contrast appears bad and "faint". This problem is

solved by setting the display contrast correctly.

Basic rules of photography (especially shooting against light)

Because of dynamic range limitations, taking images against bright light might cause either saturated image

or the actual target appear too dark. In practice, this means that when taking an image indoors and having, for

example, a window behind the object, the result is usually poor.

Figure 153 Image taken against light

Flicker

In some occasions a bright fluorescent light may cause flicker in the viewfinder and captured image. This

phenomenon may also be a result, if images are taken indoors under the mismatch of 50/60 Hz electricity

network frequency. The electricity frequency used is automatically detected by the camera module. In some

very few countries, both 50 and 60 Hz networks are present and thus probability for the phenomenon increases.

Flickering occurs also under high artificial illumination level.

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Figure 154 Flicker in an image; object illuminated by strong fluorescent light

Bright light outside of image view

Especially the sun can cause clearly visible lens glare phenomenon and poor contrast in images. This happens

because of undesired reflections inside the camera optics. Generally this kind of reflections are common in all

optical systems.

Figure 155 A lens reflection effect caused by sunshine

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Examples of good quality images

Figure 156 Good image taken indoors

Figure 157 Good image taken outdoors

Image quality analysis

Testing for dust in camera module

Context

For detecting these kinds of problems, take an image of a uniform white surface and analyse it in full resolution.

A good quality PC monitor is preferred for analysis. Search carefully, since finding these defects is not always

easy. Figure "Effects of dust on optical path" is an example image containing easily detectable dust problems.

When taking a white image, use uniformly lightened white paper or white wall. One possibility is to use uniform

light but in this case make sure that the camera image is not flickering when taking the test image. In case

flickering happens, try to reduce illumination level. Use JPEG image format for analysing, and set the image

quality parameter to ‘High Quality’.

Black spots in an image are caused by dirt particles trapped inside the optical system. Clearly visible and sharp

edged black dots in an image are typically dust particles on the image sensor. These spots are searched for in

the manufacturing phase, but it is possible that the camera body cavity contains a particle, which may move

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onto the image sensor active surface, for example, when the phone is dropped. Thus it is also possible that the

problem will disappear before the phone is brought to service. The camera should be replaced if the problem

is present when the service technician analyses the phone.

If a dust particle is lying on the infrared filter surface on either side, they are hard to locate because they are

out of focus, and appear in the image as large, grayish and fading-edge 'blobs'. Sometimes they are invisible

to the eye, and thus the user probably does not notice them at all. However, it is possible that a larger particle

disturbs the user, causing need for service.

Figure 158 Effects of dust on optical path

If large dust particles get trapped on top of the lens surface in the cavity between camera window and lens,

they will cause image blurring and poor contrast. The dust gasket between the window and lens should prevent

any particles from getting into the cavity after the manufacturing phase.

If dust particles are found on the sensor, this is classified as a manufacturing error of the module and the camera

should be replaced. Any particles inside the cavity between the protection window and lens have most probably

been trapped there in the assembly phase at a Nokia factory. Unauthorized disassembling of the product can

also be the root of the problem. However, in most cases it should be possible to remove the particle(s) by using

clean compressed air. Never wipe the lens surface before trying compressed air; the possibility of damaging

the lens is substantial. Always check the image sharpness after removing dust.

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