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S TA N D A R D S
GUIDELINES
ARTWORK
VISUAL TOOLS
DESIGN > PRINTED CIRCUIT BOARDS > ELECTRONICS ASSEMBLY > TEST

IPC

CATALOG

2007 – 2008

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Best regards,

Denny McGuirk
President, IPC

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IPC is a United States-based trade association dedicated to furthering the competitive excellence and financial success of its members worldwide, who are participants in the electronic
interconnect industry.
In pursuit of these objectives, IPC will devote resources to management improvement and
technology enhancement programs, the creation of relevant standards, protection of the
environment and pertinent government relations.

The Rig h t F orm at f or Yo u !

HOW THIS CATALOG IS ORGANIZED

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IPC Certification Programs  .   .   .   .   .   .   .   .   .   .   .   .  2

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Electronics Assembly  .   .   .   .   .   .   .   .   .   .   .   .   .   .  4
Printed Circuit Boards  .   .   .   .   .   .   .   .   .   .   .   .   .   . 16

u pdat e d f o r l e ad f r e e

Pb

This symbol denotes that the document has been updated for or is
applicable to lead free. See page 35 for additional lead free publications.

Design   .   .   .   .   .   .   .   .   .   .   .   .   .   .   .   .   .   .   . 26

Li cense s – GO GLOBA L WI T H I PC S TA N DA R DS
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Management, Market Research  .  .  .  .  .  .  .  .  .  . 31
and Roadmaps

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Environmental Compliance  .   .   .   .   .   .   .   .   .   .   .   . 34
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Multimedia Training Resources  .   .   .   .   .   .   .   .   .   . 38

20% of company's sites accessing the documents must be IPC members.

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Call IPC Membership Records staff at 847-597-2809 for more information and
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ip c c e rti f i c ati o n pr o g ra m s
Trainin g and C e rtif i catio n Pr o gram s for I ndi vid uals
Focus on Job Function

Focus on Specifications

Earn the credential that gives you the edge

Get industry developed, industry approved and industry traceable training for your managers, engi-

over other professionals in today's competitive job

neers, and work force. Based on IPC standards these programs lead to individual certification–an important

market. Developed by experts in the field, the pro-

credential to assure customers of your dedication to quality. Each of the five programs follow a two-tier

grams provide comprehensive training that will help

“train-the-trainer” concept. First, companies send an instructor candidate to an authorized IPC training center.

you do your job better and increase your marketabil-

Upon successful completion of the course, the candidate becomes a certified instructor and is provided with

ity. Insure your future success with IPC certification

the materials needed to train and certify users. Training at the application specialist (operator/inspector/man-

programs.

agement) level is modular in all programs. This enables users to control costs by providing training only on

IPC EMS Program Manager Training
and Certification
Four-part training and testing program provides
comprehensive, multi-focused education on business
topics such as operations, finance and contracts as
well as program and time management and leadership training.

the topics related to an individual's assigned tasks. Programs are offered through IPC authorized certification

Certified Interconnect designer (C.I.D.)
Comprehensive training and testing program to
assess a designer's knowledge of how to transform
a schematic into a reliable rigid PCB design that
can be easily manufactured, assembled and tested.
The certification test is based on several critical
IPC documents that link design principles to the end
use of the printed circuit assembly. Designers may
purchase study materials and prepare on their own
or enroll in a comprehensive two-day IPC Designer
Certification Preparation workshop.

centers throughout the world. For more information, go to www.ipc.org/certification.
IPC/WHMA-A-620 TRAINING AND
CERTIFICATION
Industry standard program for requirements and
acceptance of cable and wire harness assemblies.
Updated to support Revision A of the standard.
Future course updates will include optional hands-on
training. Training support is not available for superseded versions. LEAD FREE NOW INCLUDED.
Some topics are:
• Crimp, IDC and soldered terminations

• Wire and terminal assembly requirements
• Through hole technology requirements
• Surface mount technology requirements

• Connectorization
• Molding, potting and marking
• Securing and shielding

Advanced Certified Interconnect
Designer (C.I.D.+)
With the industry changing at an ever-faster pace,
continuing education becomes necessary to maintain
a designer's effectiveness – and marketability. That's
why the Advanced PCB Designers Preparation Workshop and Examination was introduced. The Advanced
Module covers 40 key objectives beyond the C.I.D.
Participants who successfully complete the exam are
awarded the C.I.D.+ designation.

IPC-7711 & IPC-7721 REWORK AND REPAIR
TRAINING AND CERTIFICATION
Industry standard program for rework, repair and
modification of electronic assemblies. All modules
include hands-on training. Some topics are:

IPC-A-600G Training and certification
Industry standard program for quality assurance/
visual acceptance of unpopulated printed circuit
boards. Training support is not available for superseded versions. Some topics are:
• Solder resist coverage
• Conductor width and spacing
• Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
• Flexible, rigid-flex, and metal core printed boards

• Through hole and SMT
• Conductor and laminate repair

Certification for Companies/Facilities
certification for Rohs lead free electronics assembly process capability
Certification program that audits an electronics assembly facility. The audit involves a careful review
of a facility’s processes and procedures to determine whether, if followed and applied precisely and consistently, the facility is capable of producing product to meet the lead free requirements of the RoHS Directive.
Because it involves inspection of procedures and processes in place at the time of the audit, certification cannot ensure, or be used to represent, that the facility’s products will be RoHS lead free compliant.
However, the certification audit is an excellent way to validate RoHS lead free electronics assembly process
capabilities to customers and suppliers.



IPC J-STD-001D Training and
Certification
Industry standard program for hand and machine
soldering process and material requirements. Some
training modules include hands-on training. In addition to the latest program covering lead free criteria
in Rev D, IPC will continue to support Rev C training
as users transition to newer versions. LEAD FREE
NOW INCLUDED. Some topics are:

IPC-A-610D TRAINING AND CERTIFICATION
Industry standard program for quality assurance/visual acceptance of electronic assemblies based on
the world’s most widely used electronics assembly
acceptability standard. In addition to the latest
program covering lead free criteria in Rev D, IPC will
continue to support Rev C training as users transition
to newer versions. Some topics are:

www.ipc.org/certification

• Soldering criteria, including lead free connections
• Soldered requirements for connecting to terminals, through hole and SMT
• Criteria for component damage, laminate conditions, cleaning and coating

g e n e ra l
IPC-T-50G

WHY YOU R COM PANY S HOUL D BE AN IP C MEMBE R

Terms and Definitions for Interconnecting
and Packaging Electronic Circuits

IPC is a global trade association dedicated to the competitive

Provides descriptions and illustrations of electronics
interconnect industry terminology to help users
and their customers break down language barriers.
Revision G contains more than 500 new or revised
terms, including new terminology for ball grid array
and chip scale packaging, via protection, lead free
solders, assembly processes, base materials and
high speed/high frequency boards. Includes commonly used industry acronyms and an index of terms
by technology types for easy searching. 135 pages.
Released December 2003.
HARD COPY CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00
KIT**
IPC members: $60.00
Nonmembers: $120.00

IPC-9591

Performance Parameters (Mechanical,
Electrical, Environmental and Quality/
Reliability) for Air Moving Devices
Standardizes the performance parameters for air
moving devices. The phrase "air moving device" (or
"air mover") refers to equipment such as fans, blowers and other forced air movement technologies.
These air moving devices are used in the electronics
industry for the cooling of heat-producing components, and range from small devices mounted
directly to hot components such as microprocessor
air moving devices, to larger devices used to force air
through a chassis containing many heat dissipating
components. Specification sets requirements for
design, manufacture, and test application of air moving devices. The term "end user" as used in the document refers to the OEM or design/materials entity
responsible for specifying the function and reliability
of an air moving device in a final product application.
19 pages. Released April 2006.

excellence and financial success of its 2,400 member companies which represent all facets of the electronics interconnect
industry, including design, printed circuit board manufacturing
and electronics assembly. IPC is the leading industry source for
industry standards, training, market research and public policy
advocacy — supporting the needs of an estimated $3.4 trillion
global electronics industry.
ACCESS INFORMATION • REDUCE OPERATING COSTS • MARKET YOUR BUSINESS
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• Help shape the future of the electronics interconnect industry by participating in standards
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• Network with leading industry executives and share valuable knowledge and market information
by joining IPC's Executive Market and Technology Forum.
• Enjoy priority service on technical questions from our technical staff.
• Promote your company’s products and services through links from the IPC website.
• Get special member pricing on workshops and educational conferences held throughout the year.
• E nhance your visibility in the industry through the IPC membership directory, published twice each
year.
• Receive discounted pricing to exhibit in our annual trade show and conference for the printed circuit
board and electronics manufacturing industry.
• Use the IPC logo to highlight your company’s involvement and commitment to excellence.
• Utilize cost reduction services through vendor partnership programs.
• Promote your PCB or EMS by listing products & services in the Products and Services Index (PSI).

Test Methods Manual
Contains more than 150 industry-approved test
techniques and procedures for chemical, mechanical, electrical, and environmental tests on all forms
of printed boards and connectors. A comprehensive
collection of methodologies referenced in IPC standards and specifications, the IPC-TM-650 is updated
regularly as test methods are revised or developed.

The OEM Critical Components committee is working on
standards for lithium ion battery manufacture and power
conversion. Check www.ipc.org/online in mid-2007 for
availability. Contact TonyHilvers@ipc.org to participate in the
To be notified of revisions or new test methods, sign up
committee.
for IPC’s FREE New Releases Notification Service. Go to:
Hard Copy CD or Download
www.ipc.org/NewReleaseSignUp.

IPC members: $25.00
Nonmembers: $50.00

$30.00
$55.00

P rocee din gs

IPC-TM-650

IPC sells proceedings of its most popular and successful technical conferences and symposiums.
Proceedings cover everything from comprehensive,
multi-topic events to sessions on specific technologies and interests. Library of proceedings includes
presentations from APEX, Expo and the Designers
Summit; IPCWorks and more. Looking for a particular
topic? Do an advanced search by topic at the online
store and find relevant proceedings with ease.
To find all available Proceedings, go to the online store.

HARD COPY CD
IPC members: $220.00
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Nonmembers: $440.00
$445.00

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E l e c tr o ni c s A ss e m b l y
Acce pta b il ity
IPC J-STD-001D

Requirements for Soldered Electrical and
Electronic Assemblies
ANSI Approved. Lead
free acceptance criteria
and pictures now
included! Reformatted to find acceptance criteria
easier! J-STD-001D is world-recognized as the sole
industry-consensus standard covering soldering
materials and processes. In addition to lead free
manufacturing support, this revision has criteria for
materials, methods and verification for producing
quality soldered interconnections and assemblies that
is easier to understand. The requirements for all three
classes of construction are included. Color illustrations are provided for clarity. This standard fully
complements IPC-A-610D. 60 pages. Released
February 2005.

Pb

		
J-STD-001D		
J-STD-001DSP		
J-STD-001DSW		

Language
English
Spanish
Swedish

(More language translations in development. Please
check the online store for the most updated list.)
Hard Copy CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00
Revisions B and C available. Contact Customer Service at
847-597-2862.

IPC-HDBK-001

Handbook and Guide to Supplement
J-STD-001 (Includes J-STD-001 B-C-D
Comparisons)
Provides J-STD-001 change history
and cross reference support for
Revisions B, C and D. Offers explanatory and tutorial information to help with the
implementation of the requirements of J-STD-001.
Provides a better understanding of the process
considerations needed when producing acceptable
soldered hardware. Includes Amendments 1 and 2.
188 pages. Released October 2005.
Hard Copy CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

ta ble of co nt ents

IPC-A-610D

Acceptability of Electronic Assemblies
ANSI Approved.
IPC-A-610D is the
most widely used
electronics assembly standard in the world. A must
for all quality assurance and assembly departments, this standard illustrates industry-accepted
workmanship criteria for electronics assemblies
through color photographs and illustrations. Topics
include lead free, component orientation and
soldering criteria for through hole, SMT and discrete
wiring assemblies, mechanical assembly, cleaning,
marking, coating, and laminate requirements.
Revision D has more than 730 new and updated
illustrations of acceptability criteria and has been
critically reviewed for clarity and accuracy.
Synchronizes to the requirements expressed in other
industry consensus documents and is used with the
material and process standard IPC J-STD-001. 400
pages. Released February 2005.

Acceptability  .   .   .   .   .   .   .   .   .  4

Pb

		
A-610D		
A-610D-CH		
A-610D-DE		
A-610D-DK		
A-610D-FI		
A-610D-FR		
A-610D-IT		
A-610D-PL 		
A-610D-SP 		
A-610D-SW 		
A-610D-VN		

Language
English
Chinese
German
Danish
Finnish
French
Italian
Polish
Spanish
Swedish
Vietnamese

(More language translations in development. Please
check the online store for the most current list.)
Hard Copy CD or Download
IPC members: $50.00
$55.00
Nonmembers: $100.00
$105.00
KIT**
IPC members: $75.00
Nonmembers: $145.00
Revisions B and C available. Contact Customer Service at
847-597-2862.

IPC-A-610D illustrations are available as a
complete set, individually or by chapter. They
are available for unlimited use for in-house
company training. See page 39 for more
information.

Advanced  .   .   .   .   .   .   .   .   .   .

Cleaning  .   .   .   .   .   .   .   .   .   .   .  6
Components   .   .   .   .   .   .   .   .   .

7

Training and Reference Guides  .  .  . 8
General  .  .  .  .  .  .  .  .  .  .  . 9
Materials   .   .   .   .   .   .   .   .   .   . 10
Process Support  .   .   .   .   .   .   .   . 12
Rework/Repair  .   .   .   .   .   .   .   . 14
Solderability  .  .  .  .  .  .  .  .  . 14
Optoelectronics  .   .   .   .   .   .   .   . 15
IPC-HDBK-610

IPC-HDBK-610 with Amendment 1
Handbook and guide to supplement IPC-A-610 providing change history and cross reference support for
Revisions B, C and D. Offers explanatory and tutorial
information to help understand the requirements of
IPC-A-610. 166 pages. Released October 2005.
Hard Copy CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00
IPC-EA-100-K

Electronic Assembly Reference Set
Your complete source for the most important
electronic assembly documents in both hard
and electronic copies: IPC J-STD-001, IPCHDBK-001, IPC-A-610 and IPC-HDBK-610. Handy, "atyour-fingertips" reference set includes high resolution
color pictures in IPC-A-610, IPC J-STD-001 and black
and white pictures in the handbooks. To facilitate
electronic searching of requirements, single-user
(print screen only) PDF copies of all four documents on
CD are included.

Pb

KIT**
IPC members: $220.00
Nonmembers: $440.00
Save 40% by purchasing as a set.

For certification information, go to www.ipc.org/certification
**Kit includes CD and hard copy.



5

www.ipc.org/onlinestore

IPC/WHMA-A-620A

Requirements and Acceptance for Cable
and Wire Harness Assemblies
ANSI Approved. Revision A, with improved
readability and usability, is now available
for the only industry-consensus standard for
Requirements and Acceptance of Cable and Wire
Harness Assemblies. IPC and the Wire Harness
Manufacturers Association (WHMA) developed this
significant update, adding lead free acceptance
criteria, a new chapter devoted to electrical and
mechanical testing, and enhanced criteria for
molding and splicing. Contains 599 color pictures
and illustrations. 19 chapters include: criteria for
wire prep, soldering to terminals, crimping of
stamped and formed contacts and machined
contacts, insulation displacement connectors,
ultrasonic welding, splicing, connectors, molding,
marking, coax/twinax cables, wrapping/lacing,
shielding, assembly and wire-wrap terminations.
368 pages. Released July 2006.

Pb

HARD COPY CD or Download
IPC members: $50.00
Nonmembers: $100.00

$55.00
$105.00

KIT**
IPC members: $75.00
Nonmembers: $150.00

A dvanc e d

IPC/EIA J-STD-028

Guidelines for Chip-on-Board Technology
Implementation

Performance Standard for Construction of
Flip Chip and Chip Scale Bumps

ANSI Approved. Discusses chip types, board selection, design issues and thermal transfer methods
for Chip-on-Board (COB) applications. Details wire
bonding, TAB and flip chip designs and provides
information on mounting materials, including
adhesives, wires and various mechanical bonding
techniques. 37 pages. Released November 1990.

Establishes construction detail requirements for
bumps and other terminal structures used for Flip
Chip Scale carriers. The specific standards for
different terminations are appropriately matched
to a particular interconnection process and include
diverse terminations such as solder bumps, columns,
non-melting stand-offs and conductive polymer
deposits. The document articulates a set of designations and expectations for product performance for
the manufacturer and the user of flip chip or chip
scale devices. Recommendations are provided to
implement the best commercial practices and evolving process improvements. Developed by IPC and
EIA. 36 pages. Released August 1999.

HARD COPY CD or Download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

IPC/EIA J-STD-026

Semiconductor Design Standard for Flip
Chip Applications
Addresses semiconductor flip chip design requirements. Provides information for using standard
semiconductor substrates, materials, assembly and
test methods with established fabrication, bumping,
test and handling practices. Electrical, thermal and
mechanical chip design parameters and methodologies are covered in the standard, as well as the
reliability aspects associated with these conditions and processes. The information applies to all
new designs as well as modifications of non flip
chip designs. Developed by IPC and EIA. 40 pages.
Released August 1999.
Hard COPY CD or download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

IPC J-STD-012

Implementation of Flip Chip and Chip
Scale Technology
ANSI Approved. Describes the implementation of
flip chip and related chip scale semiconductor packaging technologies. The areas discussed include
design considerations, assembly processes, technology choices, application and reliability data. Chip
packaging variations include flip chip, HDI, micro
BGA, micro SMT and SLICC. Also provides general
information on implementing flip chip and chip scale
technologies for creating multichip modules, I/C
cards, memory cards and very dense surface mount
assemblies. Developed by IPC, EIA, MCNC and
Sematech. 113 pages. Released January 1996.
HARD COPY CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

IPC-SM-784

IPC J-STD-027

Mechanical Outline Standard for Flip Chip
and Chip Size Configurations
Establishes mechanical outline requirements for
devices supplied in flip chip or Chip Size Package
(CSP) formats, including die surface, die terminals,
and interconnection balls/bumps/lands to the next
level. 13 pages. Released February 2003.

Hard COPY CD or download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

IPC J-STD-013

Implementation of Ball Grid Array and
Other High Density Technology
ANSI Approved. Establishes the requirements and
interactions necessary for printed board assembly
processes for interconnecting high performance/
high pin count IC packages. Includes information
on design principles, material selection, board
fabrication, assembly technology, testing strategy
and reliability expectations based on end-user
environments. Developed by IPC, EIA, MCNC and
Sematech. 96 pages. Released July 1996.
Hard COPY CD or download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00
KIT**
IPC members: $60.00
Nonmembers: $120.00

HARD COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Print restrictions apply for single-user
CD and download formats.

For certification information, go to www.ipc.org/certification
**Kit includes CD and hard copy.

www.ipc.org/onlinestore

Prices are subject to change –
check the online store.



E l e c tr o ni c s A ss e m b l y
IPC-7095A

IPC-MC-790

IPC-TP-1113

Design and Assembly Process
Implementation for BGAs

Guidelines for Multichip Module
Technology Utilization

Circuit Board Ionic Cleanliness
Measurement: What Does It Tell Us?

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball
Grid Array (FBGA) technology presents some unique
challenges for design, assembly, inspection and
repair personnel. Revision A of this document delivers
useful and practical information to anyone currently
using BGAs or considering a conversion to area array
packaging formats. In addition to providing guidelines
for BGA inspection and repair, IPC-7095A addresses
reliability issues and the use of lead free joint criteria
associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify
some of the characteristics that the industry is
experiencing in the implementation of BGA assembly
processes. The effect of BGA and FBGA on current
technology and component types is also discussed.
118 pages. Released October 2004.

Provides information on multichip module technology,
including parametric data, design and manufacturing
information and a proposed categorization of various approaches to multichip interconnect substrate
technologies based on dielectric family. 120 pages.
Released August 1992.

Discusses ionic cleanliness measurement, testing
methods and cleanliness standards in relation to product reliability. Includes a brief discussion of no-clean
fluxes. Written by Dr. Jack Brous. 8 pages. Released
1994.

Hard Copy CD or Download 
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

Hard COPY CD or download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

C l e aning
IPC-M-108

Cleaning Guides and Handbooks Manual*
Convenient set of nine documents includes the latest
editions of IPC cleaning guides and handbooks. Helps
manufacturing engineers make decisions on cleaning
products and processes and provides guidance for
troubleshooting.
Hard COPY CD or download
IPC members: $90.00
$95.00
Nonmembers: $180.00
$185.00
Save more than 55% by purchasing documents together.

IPC-5701

Users Guide for Cleanliness of
Unpopulated Printed Boards
Tackling PCB cleanliness is a tough job. Residues
on printed circuit boards are directly related to the
IPC/EIA J-STD-032
reliability of the produced hardware and can result in
Performance Standard for Ball Grid
serious failures if not known or monitored. But how
Array Balls
do you measure "cleanliness"? How clean is "clean"?
This standard, developed jointly by IPC and the
IPC-5701 provides guidance on how these issues
Electronic Industries Association (EIA), establishes the should be approached and specified in purchasing
construction detail requirements for balls and other
documents, addressing levels of cleanliness, common
terminal structures on Ball Grid Array (BGA) packages. locations for testing, and information on sample sizes.
It also establishes a set of designations and expecta- 6 pages. Released July 2003.
tions for product performance. A wide variety of
Hard COPY CD or download
terminal structures are recognized for a broad range
IPC members: $15.00
$20.00
of applications — from highest reliability computer,
Nonmembers: $30.00
$35.00
space and military applications to disposable commodity applications. 10 pages. Released June 2002.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

IPC-8497-1

Cleaning Methods and Contamination
Assessment for Optical Assembly

IPC-WP-008

Setting Up Ion Chromatography Capability
Ion chromatography has been recognized as a method
for which the data output is ion specific and very
precise in the quantification of ionic residues. This
paper provides practical considerations that should
be addressed when contemplating the setup of an ion
chromatography lab, including the core components
of an ion chromatograph system such as carrier solutions, pumps, injection valves and detectors. Covers
support equipment, chemical considerations, consumables, waste streams and overall operating costs. 12
pages. Released December 2005.
Hard COPY CD or download
IPC Members: $15.00
$20.00 (for CD)
Nonmembers: $30.00
$35.00
KIT**
IPC Members: $25.00
Nonmembers: $50.00

IPC-CH-65A

Guidelines for Cleaning of Printed Boards
and Assemblies
ANSI Approved. A road map for current and emerging
cleaning issues in the electronics industry, this handbook includes descriptions and discussion of various
cleaning methods. Explains the relationship between
materials, processes and contaminants in fabrication
and assembly operations. Also addresses cleanliness
assessment and process control in relation to cleanliness. 56 pages. Revised August 1999.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

For more information, go to page 15.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.



oad
wnl
e Do mbers
e
r
F
Me
for

www.ipc.org/onlinestore

IPC-SC-60A

IPC-TR-476A

IPC-9201

Post Solder Solvent Cleaning Handbook

Electrochemical Migration: Electrically
Induced Failures in Printed Circuit
Assemblies

Surface Insulation Resistance Handbook

ANSI Approved. Addresses the use of solvent
cleaning technology in automated and manual
soldering operations. Serves as a selection guide
for cleaning solvents and equipment by discussing
properties of solvents, residues, considerations on
process control and environmental issues. 40 pages.
Released August 1999.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Provides information on an IPC program designed
to identify/evaluate electromigration on PCBs.
Discusses the theory of electrochemical migration
and the test procedures needed to assess the susceptibility. Includes the results of a literature review
survey. 14 pages. Revised 1997.
Hard COPY ONLY
IPC members: $30.00
Nonmembers: $60.00

IPC-SA-61A

Post Solder Semi-Aqueous
Cleaning Handbook

IPC-TR-582

Cleaning & Cleanliness Test Program for
Phase 3 — Low Solids, Fluxes and Pastes
Processed in Ambient Air

Covers aspects of semi-aqueous cleaning such as
chemicals, manufacturing residues, equipment and
processes, process control, environmental considerations and safety. Enhancements in this revision
include a separate discussion of water-soluble and
water-insoluble cleaning agents and expanded
process and quality control. 32 pages. Released
June 2002.

Details the test procedures, test results and team
conclusions for the IPC Cleaning and Cleanliness
Testing Program, Phase 3, Low Solids Flux in Ambient Air. This effort has been part of a multi-stage
program to investigate material and process
alternatives to the use of chlorofluorocarbons (CFCs)
in electronics manufacturing. This Phase 3 effort
has been dedicated to characterizing the cleanliness
aspects of low solids fluxes, sometimes referred to
as "no-clean" fluxes. 163 pages. Released November
1994.

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-AC-62A

Aqueous Post Solder Cleaning Handbook
ANSI Approved. Describes manufacturing residues,
types and properties of aqueous cleaning agents,
aqueous cleaning processes and equipment, process and quality control, environmental controls and
considerations, worker safety, cleanliness determination, measurement and cost. 75 pages. Revised
January 1996.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

Hard COPY only
IPC members: $25.00		
Nonmembers: $50.00

IPC-TR-583

An In-Depth Look At Ionic
Cleanliness Testing
Report provides quantified results to help users
determine what variables most influence ionic
cleanliness test results. Includes how solvent
temperature influences the final cleanliness results,
criticality of a 75% isopropyl to 25% water ratio,
value of spraying the solvent, etc. Original research
was a cooperative effort between the EMPF and
IPC, released as EMPF-RR-0013 in 1993. 229 pages.
Released July 2002.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.
**Kit includes CD and hard copy.

www.ipc.org/onlinestore

Covers the terminology, theories, test procedures
and test vehicles of surface insulation resistance
(SIR) or temperature-humidity (TH) testing. Discussions on failure modes and troubleshooting are also
included. 65 pages. Released July 1990.
Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

IPC-TP-104-K

Cleaning & Cleanliness Test Program,
Phase 3, Water Soluble Fluxes,
Parts 1 & 2
Combined for ease of use, these two technical
papers present the results of the IPC Cleaning and
Cleanliness Test Program, Phase 3; Parts 1 and 2.
The Phase 3 program was designed as a test for
evaluating manufacturing materials and processes
as alternatives to current manufacturing practices
that require the use of CFCs. 122 pages. Originally
released in October 1992, these reports are still
current in 2006.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Com po nents
IPC-M-109

Component Handling Manual*

Pb

Set includes the latest editions of eight IPC
standards and guidelines related to the
classification and use of moisture
sensitivity components, including how to package,
handle, store and test them, so that all components
will be compatible with the assembly process.
Hard COPY CD or download
IPC members: $85.00
$90.00
Nonmembers: $170.00
$175.00
Save more than 60% by purchasing documents together.

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.



E l e c tr o ni c s A ss e m b l y
IPC/JEDEC J-STD-020C

IPC/JEDEC J-STD-035

Moisture/Reflow Sensitivity Classification
for Nonhermetic Solid State Surface
Mount Devices

Acoustic Microscopy for Non-Hermetic
Encapsulated Electronic Components
This test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic components. Provides users with
an acoustic microscopy process flow for detecting
defects non-destructively in plastic packages while
achieving reproducibility. Developed by IPC and
JEDEC. 16 pages. Released April 1999.

IPC-DRM-SMT-D

Surface Mount Solder Joint Evaluation
Training and Reference Guide
Help your workforce understand and apply
the surface mount acceptance criteria from
IPC standards. DRM-SMT-D contains 3-D
color illustrations for Chip component, Gull Wing and
J-Lead solder joints. Drawings clearly show the
minimum acceptable condition for each type of
component misalignment and the minimum solder
connections. All three classes of product are colorcoded to make it convenient to use as a reference
guide. Manual also contains high quality color
photographs of the major solder defects and
conditions, with the appropriate specification/
paragraph reference to IPC-A-610D and J-STD-001D.
38 pages.

Pb

Test method to establish a classification level
of nonhermetic solid state surface mount
devices that are sensitive to moisture-induced
stress during assembly. Revision includes test
classification parameters for components that will be
processed at higher temperatures for lead free
assembly or rework. These devices can be properly
packaged, stored, and handled using IPC/JEDEC
J-STD-033 to avoid subsequent thermal/mechanical
damage during solder reflow attachment and/or repair
operation. Revision D is being developed (projected
early 2007 release) to incorporate lessons learned from
the increased user base of lead free assemblers.
Developed by IPC and JEDEC. 12 pages. Released
July 2004.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Revision D coming soon – check the online store.

dard, its small size makes it easy to use. However, in

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

some cases the text and illustrations were modified

Hard Copy Only
IPC members: $15.00
Nonmembers: $30.00

to help with interpretation of the criteria. They should

Quantity pricing available – check the online store

Pb

KIT**
IPC members: $40.00

Nonmembers: $80.00

IPC J-STD-033B

Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount
Devices
Provides Surface Mount Device (SMD)
manufacturers and users with standardized
methods for handling, packing, shipping and
use of moisture/reflow sensitive SMDs. These
methods help avoid damage from moisture absorption
and exposure to solder reflow temperatures that can
result in yield and reliability degradation. By using
these procedures, safe and damage-free reflow can
be achieved with the dry packing process, providing a
minimum shelf life of 12 months from the seal date
when using sealed dry bags. Developed by IPC and
JEDEC. 17 pages. Released October 2005.

Pb

Hard Copy CD or Download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

training and reference gu id es
IPC's Guides are directly referenced to industry-consensus standards. Because each Guide is focused on
a narrow range of technology covered by an IPC stan-

not be used as standards.
IPC-DRM-PTH-D
IPC-DRM-18G

Component Identification Training &
Reference Guide
Assembly operators can have a convenient component
identification resource at their workstations - with
the Component Identification Training and Reference
Guide (formally known as “Desk Reference Manual”).
This comprehensive reference and training aid contains
color photographs, computer graphics, schematic
symbols and full descriptions of more than 40 of the
most commonly used through hole and surface mount
components, interconnections and hardware used
in electronic assembly today. Includes a terminology
section with quick facts on polarity, orientation, lead
styles and Component Reference Designators (CRDs).
The band reading section has easy-to-use color code
charts and other component value data. 65 pages.

Through-Hole Solder Joint Evaluation
Training and Reference Guide
Includes computer-generated 3-D graphics,
as well as close-up photography, to help
users understand IPC standards A-610D and
J-STD-001D. Provides illustrations of component,
barrel and solder-side coverage per requirements in
the standards. Covers solder fillet, contact angle,
wetting, vertical fill, land coverage and numerous
defect conditions for Class 1, 2 and 3 solder joints.
Also includes a Terminology section. 30 pages.

Pb

Hard Copy Only
IPC members: $15.00
Nonmembers: $30.00
Quantity pricing available – check the online store

Hard COPY only
IPC Members: $30.00
Nonmembers: $60.00
Quantity pricing available – check the online store

**Kit includes CD and hard copy.



www.ipc.org/onlinestore

G e n era l

IPC-DRM-56

Wire Preparation & Crimping Desk
Reference Manual

IPC-M-103

Explains the most important stamped and formed
crimp criteria from the industry standard on wire
harness acceptability, IPC/WHMA-A-620. Easyto-understand graphics and simple instructions
help ensure that your company’s products meet the
required industry standards. Covers wire types,
gauges, insulation stripping and contact types,
IPC product categories and acceptance criteria,
wire preparation, strand and insulation damage,
conductor deformations, open and closed barrel
crimp definitions and criteria, crimp deformations,
cut-off tabs, punctures, insulation support crimps,
inspection windows, bellmouth, conductor crimp
requirements, conductor brush, closed barrel crimps,
insulation damage and a glossary of related wire
prep/crimping terminology. 30 pages.
Revision A coming soon – check the online store.

Hard Copy Only
IPC members: $15.00
Nonmembers: $30.00

IPC has taken the most requested documentation
for surface mounting and packaged all 26 documents into one convenient set. Includes standards
to support working with moisture-sensitive components, as well as all IPC adhesive documents.
Hard COPY CD or download
IPC members: $330.00
Nonmembers: $660.00

Save more than 50% by purchasing documents together.

IPC-M-104

Standards for Printed Board
Assembly Manual*
Conveniently packaged set contains 14 of the most
widely used documents on printed board assembly.

IPC-TA-724

Introduction to Electronics Assembly
Desk Reference Manual
Learning resource for new hires, operators, sales,
purchasing, human resources, administrative
personnel, students or anyone interested in understanding the basic processes for both through hole
and surface mount assembly. Explains electronics
assembly to the uninitiated in easy-to-understand
language and includes more than 70 color photographs and graphic drawings to clearly illustrate
assembly technologies. Key terms are defined in a
glossary to help simplify the industry lexicon. Also
explains how electronics assembly fits into the electronics industry. Each section includes references
for additional training and industry specifications
that provides further information. 31 pages.

Guidelines for Accelerated Reliability
Testing of Surface Mount Attachments
Used when evaluating and extrapolating the results
of these tests toward actual use environments of
electronic assemblies. 50 pages. Released November 1992.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

$335.00
$665.00

Save at least 45% by purchasing documents together.

IPC-DRM-53

Quantity pricing available – check the online store

Standards for Surface Mount
Assemblies Manual*

Hard COPY CD or download
IPC members: $165.00
$170.00
Nonmembers: $330.00
$335.00

Quantity pricing available – check the online store

Hard COPY only
IPC members: $12.00		
Nonmembers: $24.00

IPC-SM-785

Technology Assessment Series on
Clean Rooms
Best compendium available today for information
and technical articles on cleanrooms. All articles are
reprinted in their entirety with credit to the original
author (when given). Released April 1998.
Hard COPY only
IPC members: $70.00
Nonmembers: $140.00

IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting
Examines key issues in advanced packaging
techniques. Provides information on types of parts
available, techniques and processes necessary for
their proper use, possible advantages/disadvantages or problems, how to start implementation and
additional resources. 138 pages. Released March
1988.
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

www.ipc.org/onlinestore

IPC-9701A

Performance Test Methods and Qualification Requirements for Surface Mount
Solder Attachments
Provides specific test methods to evaluate
the performance and reliability of surface
mount solder attachments of electronic
assemblies. Establishes levels of performance and
reliability of the solder attachments of surface
mount devices to rigid, flexible and rigid-flex circuit
structures. When used with IPC-SM-785, it provides
an understanding of the physics of SMT solder joint
failure and an approximate means of relating
performance tests results to the reliability of solder
attachments in their use environments. Revision A
includes Appendix B which provides recommended
changes to the thermal cycling profiles given in the
document when utilizing lead free solder joints. 24
pages. Released February 2006.

Pb

Hard Copy CD or Download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC/JEDEC-9702

Monotonic Bend Characterization of
Board-Level Interconnects
Characterizes the fracture strength of a
component’s board-level interconnect.
Provides a common methodology for
measuring fracture resistance to flexural loading
that may occur during conventional non-cyclic board
assembly and test operations. Applicable to surface
mount components attached to printed boards using
conventional solder reflow technologies. Document
supplements existing standards which address
mechanical shock or impact during shipping, handling
or field operation. 17 pages. Released June 2004.

Pb

Hard COPY CD or download
IPC Members: $15.00
$20.00
Nonmembers: $30.00
$35.00



E l e c tr o ni c s A ss e m b l y
IPC-9704

IPC/JEDEC Printed Wiring Board Strain
Gage Test Guideline
Strain gage testing of board assemblies
allows for objective analysis of the strain and
strain rate levels that a surface mount
package is subjected to during assembly, test and
operation. Characterization of worst-case board
assembly strain is critical due to the susceptibility of
component solder joints to strain-induced failures.
This document describes specific guidelines for strain
gage testing in the manufacturing process, including
board assembly, test, system integration and board
shipping, and provides coverage of test setup and
equipment requirements, strain measurement
techniques and test report formats. Contains 20 color
photographs and illustrations depicting instrumented
boards and gage placement. 22 pages. Released
June 2005.

Pb

Hard Copy CD or Download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-7525

IPC-TR-581

Stencil Design Guidelines

IPC Phase III Controlled Atmosphere
Soldering Study

Provides guidelines for the design and fabrication of
stencils for solder paste and surface mount adhesive.
This is the first industry consensus document for stencil design. Stencil design for surface-mount technology, as well as mixed technology with through hole or
flip chip components is discussed, including overprint,
two-print and step stencil designs. A sample order
form and a user inspection checklist are also included
for stencil design. Revision A with expanded coverage
of stencils used with lead free paste is projected for
release by the end of 2006. 14 pages. Released May
2000.
Revision A coming soon ­– check the online store.

Hard Copy CD or Download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-T-50G

Terms and Definitions for Interconnecting
and Packaging Electronic Circuits

IPC-PD-335
Contains a general introduction of electronic
packaging followed by system integration, electronic
equipment subsystems, subsystem intraconnection,
subassembly, discrete component, active and passive
device interconnections, package components and
unpackaged devices. A must for anyone involved in
electronic packaging. 470 pages. Released
December 1989.
Hard COPY only
IPC members: $195.00
Nonmembers: $390.00

Hard COPY only
IPC members: $20.00
Nonmembers: $40.00

Mat eria ls
IPC J-STD-004A

For more information, go to page 3.

Electronic Packaging Handbook

The IPC Phase 3 Controlled Atmosphere Soldering
Study evaluated the use of nitrogen as an inerting
blanket with two low residue fluxes in a no-clean
mode. Additionally, two resin fluxes using ambient
atmosphere cleaned with methyl chloroform solvent
served as controls. IPC-B-24 served as the test vehicle. The test format evaluated flux materials in different configurations of clean vs. no-clean processing
with the test combs both soldered and not soldered.
90 pages. Released August 1994.

IPC-TM 650

Test Methods Manual
For more information, go to page 3.

IPC-QL 653A

Certification of Facilities that Inspect/Test
Printed Boards, Components and Materials
For more information, go to page 25.

IPC-9191

General Guidelines for Implementation of
Statistical Process Control
For more information, go to page 24.

Requirements for Soldering Fluxes
ANSI Approved. Revision A
covers requirements for
qualification and classification
of rosin, resin, organic and inorganic fluxes according
to the activity level and halide content of the fluxes.
Includes solder fluxes, flux-containing materials and
low residue fluxes for no-clean processes. Updated
test methods are available through free download at
the online store. Supersedes QQ-S-571 and
MIL-F-14256. 16 pages. Released January 2004.

Pb

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00
KIT**
IPC members: $40.00
Nonmembers: $80.00

IPC/EIA J-STD-005

Requirements for Soldering Pastes —
Includes Amendment 1

Print restrictions apply for single-user
CD and download formats.

ANSI Approved. Lists
requirements for qualification
and characterization of solder
paste. Test methods and criteria for metal content,
viscosity, slump, solder ball, tack and wetting of solder
pastes are included. Supersedes QQ-S-571. Developed
by IPC and EIA. 47 pages. Released January 1995.

Prices are subject to change –
check the online store.

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

Pb

**Kit includes CD and hard copy.

10

www.ipc.org/onlinestore

IPC-HDBK-005

IPC J-STD-030

Guide to Solder Paste Assessment
Companion to the solder paste standard
J-STD-005 and considered a guide to help
assess the applicability of a solder paste for
its use in surface mount technology (SMT)
processes. Suggests test methods that can help with
designing and testing solder pastes. Intended for use
by both vendors and users of solder paste. Written
as a guide to assess the applicability of a solder
paste for a specific process, given the tremendous
number of permutations of different materials,
atmospheres and process variables currently
available. 50 pages. Released January 2006.

Pb

Hard Copy CD or Download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

IPC J-STD-006B	

Requirements for Electronic Grade Solder
Alloys and Fluxed and Non-Fluxed Solid
Solders for Electronic Soldering
Applications

One of a set of three joint industry standards that
prescribe the requirements and test methods
for soldering materials for use in the electronics
industry. Also see IPC/EIA J-STD-004 and IPC/EIA
J-STD-005. 27 pages. Released January 2006.

Provides users of underfill material with
guidance in selecting and evaluating
underfill material. Underfill material is used
to increase reliability of electronic devices by two
methods: alleviate CTE mismatch (between the
electronic package and the assembly substrate)
and/or increase mechanical strength. Materials
used in underfill applications should neither
adversely affect device reliability (e.g. ionic
impurities and alpha emitters) nor degrade electrical
performance. When correctly selected and applied,
underfill material should increase the life of the
assembled solder joints. Three types of currently
available underfill materials addressed in this
document are: capillary flow underfill, no-flow/
fluxing underfill and removable/reworkable
underfill. 33 pages. Released September 2005.

Pb

Hard Copy CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

Prescribes the nomenclature, requirements
and test methods for electronic grade solder
alloys; fluxed and non-fluxed bar, ribbon,
and powder solders; electronic soldering applications; and ''special'' electronic grade solders. This is
a quality control standard and is not intended to
relate directly to the material's performance in the
manufacturing process. Solders for applications
other than electronics should be procured using
ASTM B-32.

Pb

Guideline for Selection and Application of
Underfill Material for Flip Chip and Other
Micropackages

IPC-SM-817

General Requirements for Dielectric
Surface Mounting Adhesives
Covers requirements for dielectric adhesives.
Includes test methods to ensure components adhere
to the board and survive soldering processes. 22
pages. Released November 1989.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Hard Copy CD or Download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-WP-006

Round Robin Testing & Analysis: LeadFree Alloys–Tin, Silver, & Copper
Summarizes a round robin test program on
the assembly properties of three lead free
solder alloys. Melt characterization, wetting
balance responses and solder spread tests were
performed by IPC-SPVC members on the three tinsilver-copper alloys in the following percentages
respectively: 96.5/3.0/0.5; 95.5/3.8/0.7; and 95.5/
4.0/0.5. Includes examples of statistical analysis,
data analysis of the tests, data tables of testing
participants and a reproduction of IPC test methods
used. 19 pages. Released August 2003.

Pb

Hard COPY
IPC members: $20.00
Nonmembers: $30.00

oad

wnl

e Do

Fre

IPC-CA-821

General Requirements for Thermally
Conductive Adhesives
Covers requirements and test methods for thermally conductive dielectric adhesives used to bond
components in place. Permanent, removable and
self-shimming adhesives are addressed. 18 pages.
Released January 1995.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-3406

Guidelines for Electrically Conductive
Surface Mount Adhesives
IPC-3406 offers guidelines for selecting electrically conductive adhesives for use in electronics
manufacturing as solder alternatives. The process
discussion attempts to stay within the bounds of
the existing solder assembly infrastructure. Major
types of adhesives, isotropic (conducting equally
in all directions) and anisotropic (unidirectional
conductivity) are covered. Polymer adhesives, thermosets and thermoplastics are described. 15 pages.
Released July 1996.
Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

www.ipc.org/onlinestore

11

E l e c tr o ni c s A ss e m b l y
IPC-3408

IPC-SM-840C

General Requirements for Anisotropically
Conductive Adhesive Films

Qualification and Performance of Permanent Assembly & Joining Handbook
Solder Mask — Includes Amendment 1
Contains descriptions of proven techniques for

Covers requirements and test methods for anisotropically conductive adhesive films used to bond and
electrically connect components. Applications include:
flexible PCB-to-glass, flexible PCB-to-rigid PCB, flip
chip-to-glass, flip chip-to-flexible PCB, flip chip-to-rigid
PCB, and fine pitch SMD. The adhesive film may be
supplied pre-attached to a flexible circuit or other
product. 25 pages. Released November 1996.

ANSI Approved. Covers requirements for the
qualification and quality conformance of liquid and
dry film solder mask. Streamlines solder mask classes
into two classifications: H (high reliability) and T
(telecommunications). Integrates Bellcore/Telcordia
requirements (class T) and provides minimum voltage
breakdown, defines mask formulation latitude, adds
new mask chemistries and more. 18 pages. Amendment 1, released June 2000.

assembly and soldering. Individual articles were
developed by industry experts and reviewed by a
standing committee. Sections include: terms and definitions; specification references and synopsis; design;
printed circuit boards; component/lead types; joining
materials; component mounting; solderability; joining
techniques and packaging; cleaning and coating; and
quality assurance and testing. 336 pages. Released
April 1997.

Revision D coming soon – check the online store.

Hard COPY only
IPC members: $220.00
Nonmembers: $440.00

Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-CC-830B

KIT**
IPC members: $35.00
Nonmembers: $70.00

Qualification and Performance of
Electrical Insulating Compound for Printed
Wiring Assemblies
Industry standard for qualification and quality conformance of conformal coating. Shows how to obtain
maximum information with minimum test redundancy.
Includes requirements and evaluations of material
properties using standardized test vehicles. Revision B
updates include sample reports to document qualification, retention and conformance inspection. 18 pages.
Released August 2002.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC ELEC-MICRO

Handbook of Lead-Free Solder Technology
for Microelectronic Assemblies Reference
Book
For more information, go to page 35.

Pr o c ess Su ppo rt
IPC J-STD-001D

Requirements for Soldered Electrical and
Electronic Assemblies.
For more information, go to page 4.

IPC-HDBK-830

Guidelines for Design, Selection and
Application of Conformal Coatings

IPC-TP-1114

Compilation of the conformal coating industry's
practical experience. Assists designers and users of
conformal coatings in making informed choices. Users
will better understand the properties of the various
coatings, the results to be achieved and how to verify
goals have been met. Use document as a supplement
in conjunction with the industry standard for qualification and quality conformance of conformal coating,
IPC-CC-830B. 88 pages. Released October 2002.
Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

The Layman's Guide to Qualifying a Process
to J-STD-001
Originally developed for J-STD-001B, it is applicable
to current assembly standards. Electronics manufacturers are faced with the difficult task of proving
that a candidate manufacturing process can produce
acceptable hardware, either to the customer of the
product or for internal quality control. Users have to
determine many of the process qualification steps
on their own. Document leads you through the task
of qualifying a candidate process to J-STD-001. 13
pages. Released January 1998.

IPC-AJ-820

IPC-7530

Guidelines for Temperature Profiling
for Mass Soldering (Reflow & Wave)
Processes
During mass soldering, it is important that all solder
joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of the solder alloy
and the base metals to be soldered. Metallurgical
bonding requires that both surfaces to be soldered,
as well as the solder, reach this minimum soldering
temperature for a sufficient time to allow the wetting
of the solder surfaces. Document provides guidelines
for the construction of appropriate profiling test vehicles and various techniques and methodologies for
temperature profiling. 18 pages. Released May 2001.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-9701A

Performance Test Methods and
Qualification Requirements for Surface
Mount Solder Attachments
For more information, go to page 9.

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

**Kit includes CD and hard copy.

12

www.ipc.org/onlinestore

IPC-TP-1090

IPC-CM-770E

IPC-9261

The Layman's Guide to Qualifying
New Fluxes

Component Mounting Guidelines for
Printed Boards

In-Process DPMO and Estimated Yield
for PWAs

Easily understood test document gives you practical guidance and technical pointers on how to
demonstrate a new process capable of producing
reliable hardware. Written by Doug Pauls for MILSTD-2000A or MT-0002, but applicable to current
assembly standards. 18 pages. Released July 1996.

Provides effective guidelines in the preparation and
attachment of components for printed circuit board
assembly and reviews pertinent design criteria,
impacts and issues. Contains techniques for assembly (both manual and machines including SMT,
BGA and flip chip) and consideration of, and impact
upon, subsequent soldering, cleaning, and coating
processes. 150 pages. Revised January 2004.

ANSI Approved. Defines consistent methodologies
for computation of in-process defects per million
opportunities (DPMO) metrics for any evaluation
stage in the assembly process. Intended for use in
measuring in-process assembly steps rather than
end-product determination. A guide to defect categorization is provided that can serve as a base for
summarizing and reporting in-process defects when
used with IPC-J-STD-001C and IPC-A-610C. Also
used to develop process step estimated yield–the
expected percentage of assemblies with no defects
for a particular process step or combined process
steps, based on historical defect rates. 14 pages.
Released March 2002.

Hard COPY only
IPC members: $25.00
Nonmembers: $50.00

Hard COPY CD or DOWNLOAD
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

IPC-TP-1115

KIT**
IPC members: $55.00
Nonmembers: $110.00

Selection and Implementation Strategy
for a Low-Residue No-Clean Process
Provides direction to electronics manufacturers
interested in adopting low residue, (LR) no-clean
assembly technology. Addresses concerns of transitioning from operations with post solder cleaning
and no-clean using standard residue-level (SR)
materials. Includes 13 technical papers and presentation materials from the IPC No-Clean Conference.
120 pages. Released December 1998.

IPC-7912A

End-Item DPMO for Printed Circuit Board
Assemblies

Hard COPY only
IPC members: $25.00		
Nonmembers: $50.00

IPC-S-816

SMT Process Guideline and Checklist
Why waste time looking for answers? This handy,
easy-to-use troubleshooting guide lists all types
of processing problems and solutions for surface
mount assembly. Covers bridging, skips, misalignment, placement and more. 38 pages. Released July
1993.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

ANSI Approved. Finally–an end to the confusion when calculating defect opportunities for
benchmarking! First revision to the industry's first
consensus document on calculating benchmark
indices for defects and quality. Provides consistent
methodologies for DPMO Index, Component DPMO,
Placement DPMO, Termination DPMO, and Overall
Manufacturing Index (OMI). This document is for
end-of-process benchmarking. Revision A provides
support for unpopulated terminations and has much
clearer examples than those in the original document. 12 pages. Released January 2004.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00
Purchase both IPC-7912A and IPC-9261 together and save!
(See IPC-DPMO-202)

IPC-PE-740A

Troubleshooting for Printed Board
Manufacture and Assembly
For more information, see page 16.

Revision A coming soon – check the online store.

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-DPMO-202

IPC-7912/9261 End Item and In-Process
DPMO Set
Both of the industry's standards for computing
DPMO bundled together at a reduced cost.
Save 30%.
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

IPC ELEC-SOLDER

Modern Solder Technology for
Competitive Electronics Manufacturing
Reference Book
Details the most current soldering techniques along
with the fundamental principles involved in each
process and clearly relates these principles to today's
practical applications found in many manufacturing
environments. Ideal for material and process troubleshooting and includes solder data tables for quick
reference. Highlights include market driving forces,
wetting and solderability, no-clean and water-clean
manufacturing, fine pitch, flip chip, IC lead coating
and BGA technology. Written by Dr. Jennie S. Hwang.
622 pages. Published by McGraw Hill, 1996.
Hard COPY only
IPC members: $100.00
Nonmembers: $100.00

**Kit includes CD and hard copy.

www.ipc.org/onlinestore

13

E l e c tr o ni c s A ss e m b l y
IPC-9850-K

Surface Mount Placement Equipment
Characterization — KIT
ANSI Approved. Developed to standardize the
parameters, measurement procedures and methodologies used for the specification, evaluation and continuing verification of assembly equipment characterization
parameters. Establishes the procedures to characterize and document machine placement capability of
surface mount assembly equipment while maintaining
a placement accuracy to placement speed relationship.
Kit includes a printed copy of the standard and a CD
with the support spreadsheet, forms and drawing files
(Gerber format) necessary to make the test materials
(not read-only). 60 pages. Released July 2002.
Revision A coming soon – check the online store.

Kit**
IPC members: $40.00
Nonmembers: $80.00

IPC-9850-TM-KW, IPC-9850-TM-K

Test Materials Kit for Surface Mount
Placement Equipment Standardization
Kit includes materials needed to perform the SMT
placement equipment characterization tests to IPC9850. The CMM Measurement Verification Panel,
placement verification panels and glass slugs include
NIST certification documentation as required by
the Standard. Glass slug components are available
with or without white background, depending on
which is required for your equipment. When ordering
specify 9850-TM-KW for components WITH white
backgrounds, 9850-TM-K for components WITHOUT
white backgrounds. Test kit includes:
• Four IPC-9850  . Placement Accuracy Verification
Panels
• One IPC-9850 . . CMM Measurement Verification
Panel
• 150 IPC-9850  . . QFP-100 Glass Components
• 130 IPC-9850  . . QFP-208 Glass Components
• 150 IPC-9850  . . BGA-228 Glass Components
• NIST Traceable Measurement Certificate
• Custom Storage Case
Technology Information Corporation certifies that the
IPC-9850 Kit meets the highly demanding specifications of IPC-9850. For pricing information, contact IPC
Customer Service at 847-597-2862.

R e wor k/Re pair

IPC/EIA J-STD-003A

Solderability Tests for Printed Boards

Offers industry-recommended test methods, defect
definitions and illustrations for suppliers and users
Rework and Repair Guide
to assess the solderability of printed board surface
Everything you need to know for repair and rework
conductors, lands and plated-through holes. Notes a
of electronic assemblies and printed circuit boards!
significant change in the type of flux required to be
IPC-7711A, Rework of Electronic Assemblies, and
used for solderability testing. Test methods covered
IPC-7721A, Repair and Modification of Printed Boards
and Electronic Assemblies, now include additional sup- include edge dip, rotary dip, solder float, wave solder,
and wetting balance. Produced by IPC and EIA. 26
port for BGAs and flex-print repair and all previously
pages. Released February 2003.
released document updates. IPC-7711A contains proIPC/EIA J-STD-003B coming soon –
cedural requirements, tools, materials and methods to
check the online store.
be used in removing and replacing conformal coatings,
Hard COPY CD or download
surface mount and through hole components. IPC$25.00
7721A details procedures for repairing, modifying and IPC members: $20.00
Nonmembers: $40.00
$45.00
reworking boards and assemblies. This guide with
color illustrations is provided in a three ring binder for
easy updating. Future updates can be downloaded
free from the online store. Supersedes IPC-7711, IPCIPC-TR-585
7721 and IPC-R-700. 300+ pages. Released October
Time, Temperature and Humidity Stress of
2003.
Final Board Finish Solderability
IPC-7711/21A

Pb

Hard COPY CD or download   
IPC members: $125.00
$130.00
Nonmembers: $250.00
$255.00
KIT**
IPC members: $180.00
Nonmembers: $360.00

S o ld e rabi lity
IPC/EIA/JEDEC J-STD-002B

Solderability Tests for Component Leads,
Terminations, Lugs, Terminals and Wires
ANSI Approved. Provides tools to
assess solderability of electronic
component leads, terminations, solid
wire, stranded wire, lugs and tabs. Notes a significant
change in the type of flux required to be used for
solderability testing. The standard contains test
method choices, defect definitions, acceptance
criteria and illustrations for both suppliers and users.
Produced by IPC. 34 pages. Released February 2003.

Pb

IPC/EIA/JEDEC J-STD-002C coming soon –
check the online store.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers $40.00
$45.00

Details the investigations into identifying
stress tests that distinguish between robust
and nonrobust surface finishes. A robust
finish will pass a test for solderability whereas a
nonrobust finish will fail. The stress tests identified do
not necessarily duplicate real world environment
(fabrication of the bare printed board through
assembly), but they must correlate to solderability
performance. The Sequential Electrochemical
Reduction Analysis (SERA) was used extensively to
evaluate the solderability performance of the finishes
after stress exposure. 54 pages. Released May 2006.

Pb

Download Only
IPC Members $40.00
Nonmembers $80.00

IPC-TR-461

Solderability Evaluation of Thick
and Thin Fused Coatings
Identifies and evaluates the effects of thick and
thin fused coatings on the solderability of PCBs.
29 pages. Released March 1979.
Hard COPY only
IPC members: $30.00
Nonmembers: $60.00

Note: The Standard is shown above.

For certification information, go to www.ipc.org/certification
**Kit includes CD and hard copy.

14

www.ipc.org/onlinestore

IPC-TR-462

IPC-TR-465-3

Solderability Evaluation of Printed
Boards with Protective Coatings Over
Long-Term Storage

Evaluation of Steam Aging on Alternative
Finishes, Phase 11A

Provides conclusions and recommendations for the
effectiveness of different protective coatings and
coating application methods. PCB solderability in
typical storage conditions after various time periods
as well as the correlation of time and storage conditions to thickness and coating characteristics are
addressed. 63 pages. Released October 1987.
Hard COPY only
IPC members: $30.00
Nonmembers: $60.00

Reviews the results of a 2-year study to determine
the effect of steam aging exposure on components.
A variety of solderable finishes were used. A small
production simulation utilized preconditioned and
as-received samples and tested a total of 2,000
joints. 15 pages. Released July 1996.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-TR-466

Technical Report: Wetting Balance
Standard Weight Comparison Test

IPC-TR-464

Accelerated Aging for
Solderability Evaluations

Discusses the results of a program to study the precision of weight measurements taken on the wetting balance and to correlate weight measurements
between all test users and equipment manufacturers. 16 pages. Released April 1995.

Developed to meet the growing need for a standard
method of evaluating the solderability retention capability of printed boards during inventory storage.
32 pages. Revised April 1984. Includes seven page
addendum, released December 1987.

Hard COPY only
IPC members: $20.00
Nonmembers: $40.00

Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

SMC-WP-001

Soldering Capability White Paper Report

IPC-TR-465-1

Round Robin Test on Steam Ager
Temperature Control Stability
Provides test data from 7 companies using 13 different models of steam agers. Program intent was
to evaluate the variability of steam aging equipment
and develop a test procedure to quantify variability so
that it may be controlled. 20 pages. Released 1993.
Hard COPY only
IPC members: $20.00
Nonmembers: $40.00

Five different industry perspectives provide analysis
of concerns in the electronic packaging industry
about solderability problems. Covers design for
the soldering process, solderable PCBs, solderable
components and soldering process. Developed by
Foster Gray, PC Interconnects. 35 pages. Released
August 1991.
Free Download

Optoelec tro ni c s
IPC-0040

Optoelectronics Assembly and
Packaging Technology
Addresses implementation of optical and optoelectronic packaging technologies. Areas discussed
include: technology choices, design considerations,
material properties, component mounting and interconnecting structures, assembly processes, testing,
application, rework, and reliability of completed
optoelectronic products. Optoelectronic packaging
technologies include active and passive components
and discrete fiber cable, their characteristics, and
the manner in which these parts become an integral
part of the functioning module, board or subassembly. 161 pages. Released May 2003.
Hard COPY CD or download
IPC members: $60.00
$65.00
Nonmembers: $120.00
$125.00

IPC-8413-1

Specification for Process Carriers Used
to Handle Optical Fibers in Manufacturing
Defines standard practices for handling various
kinds of optical fiber and the specifications and
guidelines to be used in the design of carriers for
these fibers in component manufacturing. Identified
in the overarching IPC-0040, Optoelectronic Assembly and Packaging Technology. Does not define
a particular carrier design, but does define enough
parameters to facilitate the use of fiber carriers in
optoelectronic component manufacturing, particularly in automated or semi-automated processes.
15 pages. Released April 2003.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

SMC-WP-005

PCB Surface Finishes

IPC-TR-465-2

The Effect of Steam Aging Time and Temperature on Solderability Test Results
Details the results of a two-year study to determine
the effect of steam aging exposure on components.
Concludes that 98°C for eight hours is the optimal
condition for industry specifications for both component leads and printed boards. 51 pages. Released
July 1996.

Seven PCB fabrication experts present their findings
on surface finishes available for printed boards and
the needs of surface mount assembly. Topics range
from surface finish technology drivers and fine pitch
packaging for components to direct chip attach and
solder paste applications. Developed by Foster Gray,
PC Interconnects. 46 pages. Released August 1997.
Free Download

Hard COPY only
IPC members: $25.00
Nonmembers: $50.00

www.ipc.org/onlinestore

IPC-8497-1

Cleaning Methods and Contamination
Assessment for Optical Assembly
Describes the methods for inspecting and cleaning
all optical interfaces so that interconnectivity integrity of the optical signal is maintained. Information
focuses on techniques and methods to accomplish
maximum quality of the interface and contamination
prevention. 38 pages. Released January 2006.
Hard Copy CD or Download.
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

15

P rint e d Cir c u it B o ards
G e nera l
IPC-M-105

Rigid Printed Board Manual*
The latest standards addressing the dimensioning,
tolerancing, qualifying and performance aspects of
rigid printed boards. Provides an in-depth focus on
solderability testing, polymer thick film printed boards,
land pattern and high speed circuitry design. An invaluable tool for anyone contemplating the design and
performance characteristics of rigid printed boards.
30 documents are included.
Hard COPY CD or download
IPC members: $305.00
$310.00
Nonmembers: $610.00
$615.00
Save more than 59% by purchasing documents together.

Documentation Requirements for
Printed Boards
ANSI Approved. Establishes the general requirements
for documentation necessary to fully describe end
product printed boards, regardless of raw material,
special fabrication requirements, layer count or end
product usage. Includes master drawing requirements,
board definition and artwork/phototooling. 94 pages.
Revised May 1995.
Hard COPY CD or download

$30.00
$55.00

IPC-D-326A

Information Requirements for Manufacturing Printed Circuit Boards and Other
Electronic Assemblies
Covers the information requirements for the procurement of material, box build, assembly, system
integration, inspection, test, burn-in, delivery and/or
distribution of electronic assemblies. 5 pages. Released January 2004.
Hard COPY CD or DOWNLOAD
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-6011

Troubleshooting for Printed Board
Manufacture and Assembly

Generic Performance Specification for
Printed Boards

Useful for day-to-day problem solving. Contains case
histories of problems and corrective action in the
design, manufacture, assembly and testing of printed
circuit products. Sections reflect today's manufacturing challenges. Addressing documentation, phototooling, raw materials, mechanical operations, holepreparation, plated-through hole, cleaning procedures,
imaging, electroplating, etching, innerlayer fabrication
lamination, soldering, metallic protective coatings,
non metallic protective coatings, component preparation and assembly, inspection and test, rework and
repair, and an assembly chapter that includes soldering, cleaning and post soldering processes. 388 pages.
Released December 1997.

Establishes the general requirements and responsibilities for suppliers and users of printed boards. As
the foundation of the IPC-6010 Qualification and Performance Series, it describes mandatory quality and
reliability assurance requirements. Use with IPC-6012
through IPC-6018. 15 pages. Released July 1996.

Hard COPY CD or download
IPC members: $105.00
$110.00
Nonmembers: $210.00
$215.00

IPC-D-325A

IPC members: $25.00
Nonmembers: $50.00

IPC-PE-740A

Ac c eptabi lity
IPC-6010 SERIES

IPC-6010 Qualification and
Performance Series
IPC's qualification and performance specification
standards for every type of printed circuit board. The
series is built around IPC-6011, the base document
which includes all generic requirements for printed
boards, regardless of substrate. Along with IPC-6011,
use the appropriate sectional standard: IPC-6012B,
IPC-6013A, IPC-6015, IPC-6016, and IPC-6018A.
Includes updated surface plating/coating criteria, new
conductor thickness minimums for internal and
external conductors, expanded coverage of annular
ring and breakout conditions, and flexible circuit
requirements including laminate integrity, coverlayer
coverage and squeeze-out.
Hard COPY CD or download
IPC members: $110.00
$115.00
Nonmembers: $220.00
$225.00
KIT**
IPC members: $160.00

Nonmembers: $320.00
Save more than 25% by purchasing documents together.

Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

IPC-6012B

Qualification and Performance
Specification for Rigid Printed Boards
Covers qualification and performance of rigid printed
boards, including single-sided, double-sided, multilayer with or without blind/buried vias and metal core
boards. Addresses final finish and surface plating
coating requirements, conductor tolerances, holes/
vias as well as electrical, mechanical and environmental requirements. Revision B provides requirements
for surface finishes including nickel under gold for
wire bonding and electroless nickel/immersion gold.
Includes requirements for hole size and pattern accuracy, annular ring and breakout detection, defects
within BGA pads, minimum internal and external
conductor thickness, plating voids and thermal stress
testing. For use with IPC-6011. 43 pages. Released
August 2004.
		
IPC-6012B		
IPC-6012B-IT		

Language
English
Italian

Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00
KIT**
IPC members: $45.00

Nonmembers: $90.00
IPC-6013A

Qualification and Performance
Specification for Flexible Printed
Boards – Includes Amendment 2
For more information, go to page 21.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.
**Kit includes CD and hard copy.

16

www.ipc.org/onlinestore

IPC-6015

IPC-A-600G

Qualification & Performance
Specification for Organic Multichip
Module Mounting and Interconnecting
Structures

Acceptability of Printed Boards

Establishes the specific requirements for organic
mounting structures used to interconnect chip components which, in combination, form the completed
functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes
the quality and reliability assurance requirements
that must be met for their acquisition. For use with
IPC-6011. 25 pages. Released February 1998.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-6016

Qualification and Performance
Specification for High Density
Interconnect (HDI) Layers or Boards.
For more information, go to page 19.

IPC-6018A

Microwave End Product Board Inspection
and Test
For more information, go to page 21.

The definitive illustrated guide to printed circuit
board acceptability! This full color document
provides photographs and illustrations of the
target, acceptable and nonconforming conditions that are either internally or externally
observable on finished printed boards. Make sure
your operators, inspectors, and engineers have the
most current industry consensus information. Revision G provides coverage on topics such as lifted
lands, surface roughness of wire bond pads and
smear removal. Also covers measling of printed
boards, foreign inclusions, annular ring requirements, layer-to-layer spacing and internal and
external conductor thicknesss, as well as coverlayer coverage, adhesive squeeze-out and laminate
integrity for both flex and rigid-flex boards. With
more than 300 illustrations and photographs,
the document sychronizes to the requirements
expressed in IPC-6012B and IPC-6013A. 126 pages.
Released September 2004.
		
IPC-A-600G		
IPC-A-600G-CH
IPC-A-600G-IT		

Language
English
Chinese
Italian

Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00
KIT**
IPC members: $70.00
Nonmembers: $140.00

ta ble of co nt ents
General  .   .   .   .   .   .   .   .   .   .   .  16
Acceptability  .   .   .   .   .   .   .   .   .  16
Fabrication  .   .   .   .   .   .   .   .   .   .  18
High density/fine pitch  .  .  .  .  .  . 19
High speed/high frequency  .   .   .   .  20
Flexible circuits  .   .   .   .   .   .   .   .  21
Materials/general  .  .  .  .  .  .  .

22

Materials/laminate  .   .   .   .   .   .   .  22
Materials/foils   .   .   .   .   .   .   .   .   . 22
Materials/reinforcements  .   .   .   .   . 23
Quality and test  .  .  .  .  .  .  .  .  . 24

IPC-HM-860

Specification for Multilayer
Hybrid Circuits
Covers the qualification and performance requirements of multilayer circuits used in hybrid
packaging. These circuits consist of three or more
layers of conductor patterns separated from each
other by insulating materials and interconnected
by a continuous metallic interlayer connection. The
substrate may include passive elements. 66 pages.
Released January 1987.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-QE-605A

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.
**Kit includes CD and hard copy.

Printed Board Quality Evaluation
Handbook

IPC-TF-870

Contains a variety of photographic illustrations of
anomalies and characteristics of printed boards for
identification of anomalies that are sometimes seen
during inspection and evaluation processes. The
handbook has been divided into 14 distinct sections
covering topics such as solder resist, plated-through
holes, conductor characteristics and surface plating
to aid the user in determining specific accept/nonconforming criteria for various anomalies. 52 pages.
Released February 1999.

Covers the materials, qualification, certification and
performance requirements for multilayer polymer
thick film (PTF) printed, extrusion deposited, or
otherwise applied conductor, insulator and through
hole technology. May also be used for procurement of single- and double-sided boards. 59 pages.
Released November 1989.

Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

Qualification and Performance of Polymer
Thick Film Printed Boards

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

KIT**
IPC members: $55.00
Nonmembers: $110.00

www.ipc.org/onlinestore

17

P rint e d Cir c u it B o ards
IPC-ML-960

IPC-TR-579

Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards

Round Robin Reliability Evaluation of Small Specification for Electroless Nickel/ImDiameter Plated-Through Holes in PCBs
mersion Gold (ENIG) Plating for Printed
Approximately 200,000 plated-through holes, (PTH)
Circuit Boards

ANSI Approved. Covers qualification and performance requirements of rigid mass laminated panels
for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages. Released
July 1994.

covering primarily electroplated but also electroless
ANSI Approved. Provides guidance on
technology, were exposed to several different thermal
Electroless Nickel/Immersion Gold (ENIG).
cycles. A number of PTH diameters, board construcEstablishes requirements for the use of ENIG
tions and plating thicknesses were evaluated. 80
as a surface finish for printed circuit boards. Contains
pages. Released September 1988.
full color photographs. Includes requirements for ENIG
deposit thicknesses based on performance criteria.
Hard COPY CD or download
Invaluable resource for use by suppliers, board
IPC members: $30.00
$35.00
fabricators, electronics manufacturing services (EMS)
Nonmembers: $60.00
$65.00
and original equipment manufacturers (OEMs).
Appendix includes a copy of the highly sought after
Fa b ri cati o n
technical paper, "Standard Developments Efforts of
IPC-4761
Electroless Nickel Immersion Gold" by George Milad
Design Guide for Protection of Printed
and Gerard O'Brien. 29 pages. Released October 2002.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-TR-481

Results of Multilayer Tests Program
Round Robin
This report, a round robin test program, was designed
to collect and evaluate data on multilayer boards and
the effects of materials and processing on MLB reliability. 86 pages. Released April 1981.
Hard COPY only
IPC members: $30.00
Nonmembers: $60.00

IPC-TR-551

Pb

Board Via Structures

Sole industry guideline providing PCB designers,
manufacturers and users with detailed information
on all existing methods for protecting vias on printed
boards, including all types of via tenting, plugging,
filling and capping. Production issues, long term reliability concerns and material specification and selection are provided to aid in evaluating the benefits and
concerns for employing each type of via protection. 16
pages. Released July 2006.

Hard Copy CD or Download 
Quality Assessment of Printed Boards Used
IPC members: $30.00
$35.00
for Mounting and Interconnecting
Nonmembers: $60.00
$65.00
Electronic Components
Test report with a compendium of technical methods
KIT**
and techniques used for evaluating the quality aspects IPC members: $50.00
of present and future interconnection products and
Nonmembers: $100.00
electronic assemblies. Addresses base materials,
conductor physical requirements, internal planes,
construction, registration, plated-through holes, component mounting areas, cleaning evaluation, solder
mask, and printed board electrical requirements. 104
pages. Released July 1993.
Hard COPY only
IPC members: $30.00
Nonmembers: $60.00

IPC-4552

Hard COPY CD or download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

IPC-4553

Specification for Immersion Silver Plating
for Printed Circuit Boards

Pb

ANSI Approved. Establishes metrics for
immersion silver (IAg) deposit thickness based
on performance criteria and illustrates the
requirements using color photographs and illustrations
for clarity. Second document in a series of specifications (the first being IPC-4552) that sets the requirements for printed circuit board surface finishes that
are alternates to eutectic tin lead. Intended for use by
suppliers, printed circuit manufacturers, electronics
manufacturing services (EMS) providers and original
equipment manufacturers (OEM). Appendices include
a well-written explanatory paper by Gerard O'Brien
and George Milad, entitled "Standard Developments
Efforts of Immersion Silver" as well as an excellent
tutorial, entitled "X-Ray Fluorescence (XRF) Spectroscopy" by Frank Ferrandino that provides information
on this analytical equipment's use as a plating
thickness control mechanism. 29 pages. Released
June 2005.
Hard Copy CD or Download
IPC members: $40.00
$45.00
Nonmembers: $80.00
$85.00

IPC-4554

Specification for Immersion Tin Plating for
Printed Circuit Boards
**Kit includes CD and hard copy.

18

This document is coming soon – check the online store.

www.ipc.org/onlinestore

IPC-TR-585

Time, Temperature and Humidity Stress of
Final Board Finish Solderability
For more information, go to page 14.

IPC-DR-572

Drilling Guidelines for Printed Boards
Provides guidelines for drilling quality holes in a
wide range of printed board materials. 11 pages.
Released April 1988.
Revision A coming soon – check the online store.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Hig h D ensity /Fin e Pit ch
IPC-HDI-1

High Density Interconnect Microvia
Technology Compendium*
The collection is complete. From materials to design
and manufacture, IPC-HDI-1 compiles the standards,
specifications and guidelines your company needs
to produce high density interconnect (HDI) and
microvia boards. This comprehensive resource
comes with multiple documents, including three
joint IPC/Japan Printed Circuit Association (JPCA)
documents.
Hard COPY CD or download
IPC members: $140.00
$145.00
Nonmembers: $280.00
$285.00
Save at least 50% by purchasing documents together.

IPC-IT-95080

Improvements/Alternatives to Mechanical Drilling of PCB Vias
Defines and characterizes alternatives to mechanical drilling of small holes and discusses advances in
mechanical drilling technology. 76 pages. Released
August 1995.
Hard COPY only
IPC members: $150.00
Nonmembers: $300.00

IPC-SM-839

Pre- & Post-Solder Mask Application
Cleaning Guidelines
Covers all aspects of cleaning related to solder
mask application, including board preparation,
in-process control and maintenance of cleanliness
during pre-assembly processes. 22 pages. Released
April 1990.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-6016

Qualification & Performance Specification for High Density Interconnect (HDI)
Layers or Boards
ANSI Approved. Establishes the specific electrical,
mechanical and environmental requirements for
organic HDI layers with microvia technology. The
acceptance criteria of the HDI layers are organized
into specification sheets that reflect typical end-use
applications, such as cellular phones, avionics,
automotive and personal computers. Key concepts
include: HDI conductive surface requirements,
microvia integrity, HDI electrical properties and
end use application slash sheets. For use with IPC6011/6012. 55 pages. Released May 1999.
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

IPC/JPCA-4104

Specification for High Density Interconnect (HDI) and Microvia Materials
ANSI Approved. Covers the various conductive
and dielectric materials that can be used for the
fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the
qualification and conformance requirements for
such materials as photoimageable dielectric dry
films and liquids, epoxy blends and coated foils.
IPC/JPCA-4104 also includes six new test methods
developed specifically for the testing of HDI and
microvia materials. 92 pages. Released May 1999.
Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

IPC-2226

Sectional Design Standard for High
Density Interconnect (HDI) Printed Boards

IPC/JPCA-6801

IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/
High Density Interconnect (HDI) Printed
Circuit Boards
Recognizing Japan's leadership in microvia substrate production, the IPC HDI Committee chose
to adopt JPCA-BU01 as IPC/JPCA-6801 to ensure
global consistency in the terminology, requirements
and test methods for HDI and microvia applications.
Lists terms specific to HDI and test methods for
CTE for materials and HDI PCBs, peel strength and
thermal shock. Includes design criteria table and
background information for the development of a
standard for HDI PCBs. 32 pages. Released January
2000.
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

For more information, go to page 27.

IPC-SM-840C

Qualification and Performance of
Permanent Solder Mask — Includes
Amendment 1
For more information, go to page 12.

Print restrictions apply for single-user
CD and download formats.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

www.ipc.org/onlinestore

Prices are subject to change –
check the online store.

19

P rint e d Cir c u it B o ards
IPC-DD-135

IPC-IT-30101

Qualification Testing for Deposited Organic High Density PCB Microvia Evaluation,
Interlayer Dielectric Materials for
Phase 1, Round 3
Multichip Modules
Third in a series, evaluates 16 microvia fabricators that
Includes qualification and requirements for deposited
organic interlayer dielectric materials for MCM-D
applications. Enables a vendor to evaluate dielectric
materials and express properties in a uniform format.
Provides guidelines for reporting history of specimen
processing. 42 pages. Released August 1995.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

represent 18 different technologies, the most extensive
evaluation to date. Details the suitability of microvia
technology in high speed/high frequency applications
using data to explain the electrical performance of
microvias. 83 pages. Released March 2000.
Hard COPY only
IPC members: $950.00
Nonmembers: $1900.00

IPC-IT-98123
IPC-IT-96060

High Density PCB Microvia Evaluation
(October Project) Phase 1, Round 1

Microvia Manufacturing Technology Cost
Analysis Report

First in a series covering the evaluation of several
microvia technologies. Addresses basic microvia
technology with the intent of educating PCB fabricators and suppliers so that they can make informed
and appropriate investments in resources. Includes
IT-96061, Microvia Manufacturing Technology Cost
Analysis. 76 pages. Released June 1996.

Cost analysis of microvias conducted by IBIS Associates. Aids PCB manufacturers during the purchasing
process, to help suppliers improve their working
relationships with PCB manufacturers and to help
OEMs with new product design issues. Provides a
comparison of classic through hole technology to
the same design in microvia technology. 67 pages.
Released December 1998.

Hard COPY only
IPC members: $150.00
Nonmembers: $300.00

Hard COPY only
IPC members: $150.00
Nonmembers: $300.00

IPC-IT-97071

IPC-2141A

High Density PCB Microvia Evaluation,
Phase 1, Round 2
Second in a series covering the evaluation of several
microvia technologies. Includes a complete analysis
of different microvia manufacturing technologies and
their compared reliability. 11 pages. Released July
1997.
Hard COPY only
IPC members: $250.00
Nonmembers: $500.00

Hig h Speed /Hi gh f reque ncy
Design Guide for High-Speed Controlled
Impedance Circuit Boards
Controlled impedance is the maintenance of some
specified tolerance in the characteristic impedance
of an interconnect line (transmission line) that is used
to connect different devices on a circuit. Controlled
impedance is often a design consideration for highspeed digital or high-frequency analog circuits. Guide
is intended to be used by circuit designers, packaging
engineers, printed board fabricators, and procurement personnel. Revision A includes expanded data
for logic families, updated equations for unbalanced
lines, new equations for balanced line configurations,
and detailed comparisons between capacitive lines
and transmission lines, including propagation within
transmission lines. 53 pages. Released March 2004.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

**Kit includes CD and hard copy.

20

KIT**
IPC members: $47.00
Nonmembers: $95.00

IPC-2251

Design Guide for the Packaging of High
Speed Electronic Circuits
Addresses the major factors influencing the design of
high-speed circuitry. Considerations include electrical
noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes
IPC-D-317A. Key improvements include updated
impedance models for embedded microstrip, centered
stripline and dual stripline geometries, expanded EMI
layout practices, signal integrity design constraints,
enhanced graphics and updated terms and definitions.
99 pages. Released December 2003.
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

IPC-2252

Design Guide for RF/Microwave
Circuit Boards
Provides RF and microwave circuit design engineers,
printed circuit board engineers, packaging engineers
and drafters with information necessary to design
practical, functional and cost effective microwave
circuit boards in the frequency range of 100 MHz to
30 GHz. Guide also applies to operations in the region
where distributed circuits are used instead of conventional lumped circuit elements. 30 pages. Released
June 2002.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-4103

Specification for Base Materials for High
Speed/High Frequency Applications
ANSI Approved. Covers the requirements for high
speed/high frequency laminate or bonding layers to be
used primarily for the fabrication of rigid or multilayer
printed boards for high speed/high frequency electrical and electronic circuits. Supercedes IPC-L-125A.
Improvements include updated bonding layer testing
parameters, inspection lot requirements, revised
visual acceptance criteria and new specification
sheets for hydrocarbon and polyester resin systems.
40 pages. Released January 2002.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

www.ipc.org/onlinestore

IPC-6018A

IPC-4203

Microwave End Product Board Inspection
and Test

Adhesive Coated Dielectric Films for
Use as Cover Sheets for Flexible Printed
Circuitry and Flexible Adhesive Bonding
Films

Establishes requirements for qualification and performance of high frequency (microwave) printed circuit boards. Covers both end product inspection and
test of microwave boards for microstrip, stripline,
mixed dielectric and multilayer stripline applications. Enhancements over previous version include
updated tables for surface finish requirements and
annular ring, as well as revised requirements for microsectioned test specimen and production boards.
34 pages. Released January 2002.

ANSI Approved. Establishes the
requirements for adhesive coated
dielectric film materials used in the
cover sheets and flexible adhesive bonding films of
fabricated flexible printed circuitry and flexible flat
cable. Provides comprehensive data that will help
users more easily determine both material
capability and compatibility. Includes adhesivecoated flexible dielectric film material specification
sheets which are identified by material type. Closely
aligned with IPC-4202 and IPC-4204. Supersedes
IPC-FC-232C with Amendment 1 and all former
revisions of IPC-FC-232 and IPC-FC-233. 45 pages.
Released May 2002.

Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

Flexib l e Circ u its
IPC-M-102

Flexible Circuits Compendium*
Comprehensive compendium of IPC's documentation
for flexible circuits. Includes 15 documents.
Hard COPY CD or download
IPC members: $165.00
$170.00
Nonmembers: $330.00
$335.00

Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

IPC-4204

Flexible Metal-Clad Dielectrics for Use in
Fabrication of Flexible Printed Circuitry

Save more than 60% by purchasing documents together.

IPC-2223A

Sectional Design Standard for Flexible
Printed Boards
For more information, see page 26.
IPC-4202

Flexible Base Dielectrics for Use in
Flexible Printed Circuitry
ANSI Approved. Establishes the
requirements for flexible base
dielectric materials that are used in
the fabrication of flexible printed circuitry and
flexible flat cable. Provides comprehensive data that
will help users more easily determine both material
capability and compatibility. Includes flexible base
dielectric material specification sheets which are
identified by material type. Closely aligned with
IPC-4203 and IPC-4204. Supersedes IPC-FC-231C
with Amendment 1 and all former revisions of
IPC-FC-231. 32 pages. Released May 2002.

ANSI Approved. Establishes the
requirements for metal-clad
dielectric film materials used in
flexible printed circuitry fabrication and flexible flat
cable. Provides comprehensive data that will more
easily help users determine both material capability
and compatibility. Includes the metal-clad dielectric
film material specification sheets which are
identified by material type. Closely aligned with
IPC-4202 and IPC-4203. Supersedes IPC-FC-241C
and all former revisions of IPC-FC-241. 57 pages.
Released May 2002.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

IPC-6013A

Qualification and Performance Specification for Flexible Printed Boards – Includes
Amendment 2
Covers qualification and performance requirements
for flexible printed boards designed to IPC-2221
and IPC-2223. The flexible printed board may be
single-sided, double-sided, multilayer or rigid-flex
multilayer. All of these constructions may include
stiffeners, plated-through holes and blind/buried
vias. Revision A with Amendment 2 incorporates
updated requirements for surface plating, microsection evaluations and acceptance testing frequency.
Supersedes IPC-6013A with Amendment 1. For use
with IPC-6011. 40 pages. Released April 2006.
Hard Copy CD or Download 
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

IPC/JPCA-6202

IPC/JPCA Performance Guide Manual for
Single-and Double-Sided Flexible Printed
Wiring Boards
Covers the requirements and considerations for
single- and double-sided flexible printed boards.
IPC/JPCA-6202 includes more than 30 figures on accept/reject criteria for flexible printed boards and an
appendix on the handling of polyimide-based flexible
printed boards. Also included are all seven Japanese
Industrial Standards (JIS) test methods referenced
in IPC/JPCA-6202. 96 pages. Released February 1999.
Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

IPC-FA-251

Guidelines for Assembly of Single- and
Double-Sided Flex Circuits
ANSI Approved. Describes the type of materials
and processes that may be used to accomplish
proper electronic assembly. 30 pages. Released
February 1992.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00
*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

www.ipc.org/onlinestore

21

P rint e d Cir c u it B o ards
IPC-FC-234

IPC-4821

PSA Assembly Guidelines for Single- &
Double-Sided Flexible Printed Circuits

Specification for Embedded Passive
Device Capacitor Materials for Rigid and
Multilayer Printed Boards

Suggests guidelines for the use of pressure sensitive
adhesives (PSAs) in single- or double-sided flexible
printed circuits, membrane switches and component
attachments. Provides information on adhesive types
and the materials and processes recommended for
their proper use in assembly. 30 pages. Released
December 1997.

Describes materials that can be used for the fabrication of embedded passive capacitor devices within
the finished printed circuit board substrate. For this
document, embedded passive devices and the phrase
embedded passives are considered to be equivalent.
Provides information on general designations and
associated characteristics of embedded passive
device (EPD) capacitor materials. Use document as a
qualification and conformance standard for these materials. Contains material designation, conformance
(requirements), qualification (characterization) and
quality assurance specifications. Covers requirements
for dielectric, conductive, and insulating materials that
are used with materials for the manufacture of printed
circuit boards containing embedded passive capacitor
functionality. 34 pages. Released May 2006.

Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

Material s/ Ge n e ra l
IPC-M-107

Standards for Printed Board
Materials Manual*
With all the different recipes available for the
manufacture of laminate for PCBs, it is important to
stay current on available materials. Manual set of 18
documents contains the requirements for the various
reinforcements, foils, laminates and prepregs.

Hard Copy CD or Download
IPC Members: $40.00
$45.00
Nonmembers: $80.00
$85.00

Hard COPY CD or download
IPC members: $165.00
$170.00
Nonmembers: $330.00
$335.00

Kit**
IPC Members: $60.00
Nonmembers: $120.00

Save more than 60% by purchasing documents in a set.

Mat e rials /Lam inat e
IPC-4101B

IPC-MI-660

Specification for Base Materials for Rigid
and Multilayer Printed Boards

Incoming Inspection of Raw
Materials Manual
Contains background information, applicable specification references and industry-approved test methods
for inspection and evaluation of incoming raw materials. Material categories include laminates, multilayer
board materials, various interconnection substrates,
resists and other coatings, processing chemicals,
artwork, registration tools, accessories, soldering
materials, tooling accessories and other materials.
150 pages. Released February 1984.
Hard COPY only
IPC members: $60.00		
Nonmembers: $120.00

Covers the requirements for base materials
(laminate and prepreg) to be used primarily for
rigid or multilayer printed boards for electrical
and electronic circuits. Contains more than 50
separate specification sheets and uses search terms
to help find similar groups of materials from these
sheets. Provides user with information and data on
printed circuit board materials that can better
withstand the newer assembly operations employing
higher thermal exposures, including assembly
practices that utilize the commonly encountered lead
free solders. 112 pages. Released June 2006.

Pb

Hard Copy CD or Download
IPC Members: $45.00
$50.00
Nonmembers: $90.00
$95.00
Kit**
IPC Members: $70.00
Nonmembers: $140.00

IPC-4121

Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board
Applications
ANSI Approved. A "must have" for those responsible
for purchasing laminate materials for their company.
Provides industry-approved guidelines for selecting
core constructions for multilayer printed circuit boards
(PCBs). Contains sheets that categorize the different core constructions by laminate type and nominal
thickness. The constructions are rated for characteristics such as dielectric constant (DK), dimensional
stability (DS), flatness, smoothness and drillability.
Supersedes IPC-CC-110A. 12 pages. January 2000.
Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

Mat eria ls/ Fo i ls
IPC-4562

Metal Foil for Printed Wiring Applications
ANSI Approved. Covers the nomenclature and requirements for metal
foils used in laminate and PCB
fabrication. Includes specification sheets to assist
buyers and suppliers in understanding and using
consistent purchasing and quality criteria for metal
foils. Supersedes IPC-MF-150F. Amendment 1 is
available as a free download at the online store. 27
pages. Released May 2000.
Revision A coming soon – check the online store.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-CF-148A

Resin Coated Metal for Printed Boards
ANSI Approved. Establishes the requirements for
metal foils coated with a resin or composite of resins
on one side to be used for the fabrication of PCBs.
Includes a series of specification sheets that outline
engineering and performance data for resin-coated
metal foil, indicating foil material type and resin type.
76 pages. Released September 1998.
IPC-4563, Resin Coated Metal for Printed Boards Guidelines
coming soon – check the online store.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.
**Kit includes CD and hard copy.

22

www.ipc.org/onlinestore

IPC-CF-152B

IPC-4130

IPC-SG-141

Composite Metallic Materials
Specification for Printed Circuit Boards

Specification & Characterization
Methods for Nonwoven "E" Glass Mat

Specification for Finished Fabric Woven
from "S" Glass for Printed Boards

Details the requirements for copper/invar/copper
(CIC), copper/molybdenum/copper (CMC) and threelayer composites for use in electronic applications. Includes specification sheets that outline
engineering and performance data for each type
of composite metallic materials. 39 pages. Revised
March 1997.

ANSI Approved. Determines the nomenclature,
definitions and requirements for materials made
from nonwoven "E" glass fibers. Includes specification sheets for selecting and purchasing these
materials. 14 pages. Released September 1998.

Covers the classification and requirements for finished fabrics woven from "S" glass, electrical grade
glass fiber yarns intended as a reinforcing material
in laminated plastics for electrical and electronic
use. 12 pages. Released February 1992.

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-4110

IPC-A-142

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Specification and Characterization
Methods for Nonwoven Cellulose Based
Paper for Printed Boards

IPC-TR-485

Results of Copper Foil Rupture Strength
Test Round Robin Study
Evaluation of rupture strength testing as a means
for determining the mechanical properties of
electrodeposited and rolled copper foil. 27 pages.
Released March 1985.

ANSI Approved. Determines the nomenclature and
chemical and physical requirements of paper made
from cellulose fibers for PCB fabrication. Includes
specification sheets for selecting and purchasing
these materials. 11 pages. Released August 1998.

Hard COPY only
IPC members: $20.00
Nonmembers: $40.00

Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Material s/ R einf or c e m ents

IPC-4411A

IPC-4412A

Specification and Characterization
Methods for Nonwoven Para-Aramid
Reinforcement

Specification for Finished Fabric Woven
from "E" Glass for Printed Boards
Exhaustively covers the classification and requirements for finished fabrics woven from "E" glass
fiber yarns. These yarns are formed from filaments of electrical-grade glass and are intended
as reinforcing materials in laminated plastics for
electrical and electronic uses. The fabrics covered by this specification are all of a plain-weave
construction. Includes two extensive tables of
finished fabric glass styles, one in SI units and the
other in US units. Supersedes IPC-4412, IPC-EG-140
with Amendments 1 & 2 and IPC-EG-140. 19 pages.
Released January 2006.

Covers the nomenclature and requirements for reinforcement made from nonwoven para-aramid fibers
which are primarily used in PCBs for HDI and high
speed/high frequency applications. Includes specification sheets, that can be used when selecting and
purchasing nonwoven para-aramid reinforcement.
Incorporates 14 new specification sheets. Due to a
test method correction, all specification sheets have
been updated. 22 pages. Released November 2003.

Hard Copy CD or Download                                             
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

Specification for Finished Fabric Woven
from Aramid for Printed Boards
Covers finished fabrics woven from aramid yarns
that are intended as reinforcing material in
laminated plastics for electrical and electronic use.
All fabrics covered by this specification are plain
weave. 9 pages. Released June 1990.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-QF-143

Specification for Finished Fabric Woven
from Quartz (Pure Fused Silica) for
Printed Boards
ANSI Approved. Covers classification and requirements for finished fabrics woven from quartz fiber
yarns that are intended as a reinforcing material in
laminated plastics for electrical and electronic use.
13 pages. Released February 1992.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

www.ipc.org/onlinestore

23

P rint e d Cir c u it B o ards
Qual ity and T est
IPC-9691

User Guide for the IPC-TM-650, Method
2.6.25, Conductive Anodic Filament (CAF)
Resistance Test (Electrochemical
Migration Testing)

IPC-9151A

Many printed circuit board buyers have developed
internal processes to evaluate the capabilities of their
printed circuit board manufacturers/IMS companies.
Drafted to provide guidance regarding how the IPCManufacturers often receive multiple requests from
TM-650, Method 2.6.25, Conductive Anodic Filament multiple customers to manufacture test panels as
(CAF) Resistance Test can best be used for evaluating part of qualification procedures. The PCQR2 program
the effects of mechanical stress, laminate material
provides an industry standard for the design of these
fracturing, ionic contamination, moisture content prior benchmark process capability test panels. Data resultto press lamination, and other material processing
ing from this process provides database subscribers
characteristics on conductive anodic filament (CAF)
with the ability to review detailed results from indigrowth. CAF test method provides a proven standard vidual manufacturers and to compare the capabilities
for determining the risk of temperature/humidity/bias of multiple fabricators across the industry. IPC-9151A
(THB) failure within rather than on the surface of print- describes the process for evaluating the manufacturing
ed circuit boards (PCBs), typically filament formation
capability of key attributes specified in the design and
along the boundary between the resin and laminate
acceptability standards controlled by IPC. More inforreinforcement. 22 pages. Released June 2005.
mation is available at www.pcbquality.com. 7 pages.
Released May 2003. Free Download
Hard Copy CD or Download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00
IPC-9191
IPC-2524

General Guidelines for Implementation of
Statistical Process Control (SPC)

ANSI Approved. Outlines the SPC philosophy, implementation strategies, tools and techniques used for
Describes a PCB fabrication data quality rating system relating process control and capability to final product
requirements. Reflects the principles of statistical
used by fabricators to evaluate incoming data package integrity. Includes information on conformance to process control (SPC) represented by ISO/DIS 11462-1,
both fabricator and customer design rules and can be Guidelines for Implementation of Statistical Process
Control (SPC) – Part 1: Elements of SPC. Supersedes
used by printed board designers as an output quality
IPC-PC-90. 43 pages. Released November 1999.
check. 16 pages. Released February 1999.
Free Download
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

PWB Fabrication Data Quality Rating
System

IPC-9194

Printed Board Process, Capability, Quality
Implementation of Statistical Process
and Relative Reliability (PCQR 2) Benchmark
Control (SPC) Applied to Printed Board
Test Standard and Database
Assembly Manufacture Guideline
Intended to aid in interpretation of the requirements
in IPC-9191, General Guidelines for Implementation
of Statistical Process Control, specifically for printed
board assembly (PBA) manufacture. Promotes process
thinking and control of process inputs, in-process
parameters and process outputs, including product
parameters. Organizes various aspects of process
control in the Plan, Do, Check and Act (PDCA) cycle.
Establishes practical guidelines for the implementation of SPC in the electronics manufacturing operations for continually improving processes and reducing
waste. Should be used in tandem with IPC-9191; the
standards are cross-referenced to each other in the
Appendices of IPC-9194. 36 pages. Released
September 2004.
Hard Copy CD or Download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-9199

Statistical Process Control (SPC)
Quality Rating
Used as a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of
IPC-9191. Valuable to customers and suppliers of any
size and for any commodity. Can be used to perform
an assessment of the use of SPC at both organizational and process levels. The questions on the evaluation
form provided are based on the guidelines for SPC
implementation given in IPC-9191. Includes instructions to obtain Microsoft Word™ Template format
of sections 4 through 6 for electronically recording
information gained during the audit process. 41 pages.
Released September 2002.
Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

24

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IPC-9252

IPC-MS-810

IPC-TR-483

Guidelines and Requirements for
Electrical Testing of Unpopulated
Printed Boards

Guidelines for High Volume Microsection

Dimensional Stability Testing of Thin
Laminates–Report on Phases 1 and 2
International Round Robin Test Programs

Defines different levels of appropriate testing and
assists in the selection of the test analyzer, test
parameters, test data and fixturing required to
perform electrical test(s) on unpopulated boards and
inner layers. Supersedes IPC-ET-652A. 20 pages.
Released February 2001.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

IT-97061

PCB Hole to Land Misregistration: Causes
and Reliability
Discusses the root causes of misregistration,
recommendations for proper constructions and
the need for an intact annular ring with the overall
intent of aiding in the manufacture of reliable, high
density PCB products. Project critically examined
registration requirements, primarily through a reliability test program, literature searches and surveys
of manufacturers. 11 pages. Released June 1997.
Hard COPY only
IPC members: $150.00		
Nonmembers: $300.00

Discusses the many variables and problems associated with the process, from sample removal to
micro-etch, and the variables common to high volume microsection. Process variables and problems
are organized to ease research of a specific issue or
overview the variables of a process area. 31 pages.
Released October 1993.

Provides test results of project to define a test procedure to evaluate thin laminate material (phase 1)
and expand that project by adding a thermal stress
cycle to the existing IPC Test Method 2.4.39 (phase
2). 74 pages. Revised March 1991.

Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

Hard COPY only
IPC members: $30.00
Nonmembers: $60.00

IPC-QL-653A

IPC-TR-486

Certification of Facilities that Inspect/
Test Printed Boards, Components &
Materials
Establishes the certification requirements for facilities that inspect/test printed boards, components
and materials. Provides a minimum standardized
basis for evaluating or auditing a technically oriented inspection/testing facility. 15 pages. Revised
November 1997.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Report on Round Robin Study to Correlate
IST & Microsectioning Evaluations for
Detecting the Presence of Inner-Layer
Separation
Provides full detail of the round robin study charged
with assessing the use of Interconnect Stress Test
(IST) for incoming inspection in lieu of Thermal
Stress in the detection of innerlayer separations
in plated-through holes. Includes background on
the Post Separation Task Group, test results, round
robin test plan, conclusions and test methods used.
51 pages. Released July 2001.
Hard COPY CD or download
IPC members: $50.00
$55.00
Nonmembers: $100.00
$105.00

IT-98103

Reliability of Misregistered and Landless
Innerlayer Interconnects in Thick Panels
Explains interconnect configuration, design and
manufacturing relationships and their influence on
interconnect reliability. Effort is a continuation of
the "PCB Hole-to-Land Misregistration: Causes and
Reliability" study that intact annular ring requirements may be too conservative. Study expands
on that conclusion by incorporating more board
variables and test considerations. Results indicate
that hole size, glass transition temperature and foil
thickness influence reliability while interconnect
configuration and conductor width have less impact.
180 pages. Released October 1998.
Hard COPY only
IPC members: $150.00		
Nonmembers: $300.00

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

www.ipc.org/onlinestore

25

D e si g n
G e nera l
IPC-M-106

IPC-2221A

IPC-2223A

Generic Standard on Printed Board Design

Sectional Design Standard for Flexible
Printed Boards

Considered the foundation design standard for all
Technology Reference for Design Manual*
documents in the IPC-2220 series. Establishes the
Provides an excellent compilation of standards essengeneric requirements for the design of printed boards
tial to the library of any designer considering physical
and other forms of component mounting or intercondesign principles, customer reliability requirements
necting structures, whether single-sided, double-sided
and surface mount and high-speed logic design. Set of
or multilayer. Revision A includes new criteria for
28 documents brings sharp focus on aspects of printed
surface plating, internal and external foil thicknesses,
board technology such as high density interconnects,
component placement and hole tolerances.
flexible printed board design, controlled impedance,
usage of phototooling to improve artwork quality, and Expanded coverage is provided for material properties, dimensioning and tolerancing rules and via strucDesign for Reliability (DFR) procedures.
tures, as well as updated coupon designs for quality
Hard COPY CD or download
assurance. 112 pages. Released May 2003.
IPC members: $275.00
$280.00
Hard COPY CD or download
Nonmembers: $550.00
$555.00
IPC members: $30.00
$35.00
Save more than 55% by purchasing the manual.
Nonmembers: $60.00
$65.00

Requ ire m ents
IPC-2220

Design Standards Series
Put IPC's design library at your fingertips! The
IPC-2220 Design Standards Series includes all IPC
current design standards in the IPC-2220 family. The
series is built around IPC-2221A, Generic Standard on
Printed Board Design, the base document that covers
all generic requirements for printed board design,
regardless of materials. The designer can choose
the appropriate sectional standard for a technology.
Contains IPC-2221-2226.
Hard COPY CD or download
IPC members: $80.00
$85.00
Nonmembers: $160.00
$165.00
KIT**
IPC members: $115.00
Nonmembers: $230.00
Save more than 40% by purchasing the series.

KIT**
IPC members: $45.00
Nonmembers: $90.00

IPC-2222

Sectional Standard on Rigid Organic
Printed Boards
Used in conjunction with IPC-2221A, IPC-2222
establishes the design requirements of rigid organic
printed boards and other component mounting and
interconnecting structures. Applies to single-sided,
double-sided or multilayered boards. Key concepts
include: rigid laminate properties, designer/end user
materials section map, scoring parameters and lead to
hole relationships. IPC-2221A and IPC-2222 supersede
IPC-D-275. 35 pages. Released February 1998.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00
KIT*
IPC members: $35.00
Nonmembers: $70.00

are you a designer?
Join IPC’s Designers Council for
• Special member price on design-related workshops, certifications, standards and courses
• Access to IPC Designers Council e-mail forums
• $50 coupon toward design-related IPC documents, videos, CDs
• Networking and education in local chapters.

Used in conjunction with IPC-2221A, IPC-2223A establishes the requirements for the design of single-sided,
double-sided, multilayer, or rigid-flex flexible circuits.
Revision A includes updated design rules for panel
sizes, hole spacing, bend radii, shielding, palletization,
nonfunctional lands, coverlayer access/spacing and
conductor edge spacing. 24 pages. Released June
2004.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

IPC-2224

Sectional Standard on Design of PCB for
PC Cards
Used in conjunction with IPC-2221A, IPC-2224 establishes the design requirements of printed boards for
PC card form factors. Key concepts include bow and
twist constraints, heat dissipation considerations
and component placement requirements. 26 pages.
Released January 1998.
Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

IPC-2225

Sectional Design Standard for Organic
Multichip Modules (MCM-L) and
MCM-L Assemblies
ANSI Approved. Used in conjunction with IPC-2221A,
IPC-2225 establishes the requirements and considerations (thermal, electrical, electromechanical and
mechanical) for the design of single chip module
(SCM-L), multichip module (MCM) and MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia
material properties and relationships with Design for
Manufacturability (DFM) and Design for the Environment (DFE). 44 pages. Released May 1998.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Go to http://dc.ipc.org for more information.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.
**Kit includes CD and hard copy.

26

www.ipc.org/onlinestore

IPC-2226

IPC-D-859

Sectional Design Standard for High
Density Interconnect (HDI) Printed Boards

Design Standard for Thick Film Multilayer
Hybrid Circuits

Used in conjunction with IPC-2221A, this standard
establishes requirements and considerations for the
design of high density interconnect (HDI) printed
boards and its forms of component mounting and
interconnecting structures. Provides recommendations for signal, power, ground and mixed distribution layers, dielectric separation, via formation
and metallization requirements and other design
features that are necessary for HDI-advanced IC
interconnection substrates. Trade-off analyses
required to match the mounting structure to the
selected chip set also included. 49 pages. Released
April 2003.

ANSI Approved. Covers the requirements and
considerations for the design of multilayer hybrid
circuits based on industry manufacturing capabilities. 80 pages. Released December 1989.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

IPC-1902

IPC/IEC Grid Systems for Printed Circuits
An international standard adopted by IPC that
ensures compatibility between printed circuits and
the components to be mounted on them at grid
intersections. Includes discussion of the need to
develop specialized modular grids so as to permit
flexibility in future designs. 6 pages. Released in
December 1998.
Hard COPY CD or download
IPC members: $15.00
$20.00
Nonmembers: $30.00
$35.00

IPC-7351

Generic Requirements for Surface Mount
Land Pattern and Design Standard
The successor to IPC-SM-782A, this
standard covers land pattern design for all
types of passive and active components,
including resistors, capacitors, MELFs, SSOPs,
TSSOPs, QFPs, BGAs, QFNs and SONs. Provides
many new features, such as intelligent land pattern
naming convention, zero component rotations for
CAD systems, and a set of three separate land
pattern geometries for each component that allows
the user to select a land pattern based on desired
component density. Also includes updates to
existing sections addressing land pattern guidelines
for wave or reflow soldering, via location guidelines,
fiducials and courtyard boundaries. IPC-7351
includes both the standard and an IPC-7351 land
pattern viewer on CD-ROM. Replaces IPC-SM-782A.
92 pages. Released February 2005.
Revision A coming soon – please check the online store.

Hard Copy CD or Download
IPC members: $50.00
$55.00
Nonmembers: $100.00
$105.00

General  .  .  .  .  .  .  .  .  .  .  . 26
Requirements  .   .   .   .   .   .   .   .   . 26
Guidelines  .   .   .   .   .   .   .   .   .   . 27
Certification  .   .   .   .   .   .   .   .   . 28
Data Transfer  .   .   .   .   .   .   .   .  28
IPC-2615

Hard COPY CD or download
IPC members: $35.00
$40.00
Nonmembers: $70.00
$75.00

Pb

ta ble of co nt ents

G uide l in es
IPC/JPCA-2315

Design Guide for High Density
Interconnects & Microvias
Provides an easy to follow tutorial on the selection
of HDI and microvia design rules and structures. Addresses various considerations when designing an
HDI printed circuit board, including design examples
and processes, selection of materials, general
descriptions, and various microvia technologies.
Offers designers and manufacturers one source for
reliable design and manufacturability information
for commonly produced HDI boards. Includes more
than 30 full color illustrations. Published jointly with
the Japan Printed Circuit Association. 33 pages.
Released June 2000.
Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00

Printed Board Dimensions and Tolerances
The definitive standard on printed board dimensioning and tolerancing. Consistent with other
IPC printed board standards such as IPC-6012 and
IPC-2221. Includes fundamental dimensioning and
tolerancing rules; positional, profile, orientation and
form tolerances; and detailed geometric symbology. Invaluable to the PCB designer, this document
will help manufacturers and board purchasers
achieve the most manufacturable board designs.
Supersedes IPC-D-300G for fundamental dimensioning and tolerancing rules. 66 pages. Released July
2000.
Hard COPY CD or download
IPC members: $30.00
$35.00
Nonmembers: $60.00
$65.00

IPC-A-311

Process Controls for Phototool Generation and Use
Covers the information and data to be collected
during the generation and use of phototools to
improve artwork quality, thereby improving yields
downstream. Helps establish and maintain ISO 9000
certification and statistical process control (SPC)
by facilitating troubleshooting, standardizing the
process for both experienced and inexperienced operators and by identifying process improvements for
the ultimate elimination of inspection and touchup
of artwork. 6 pages. Released March 1996.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

www.ipc.org/onlinestore

27

D e si g n
IPC-D-279

IPC-D-422

Design Guidelines for Reliable Surface
Mount Technology Printed Board
Assemblies

Design Guide for Press Fit Rigid Printed
Board Backplanes

Establishes design concepts, guidelines and procedures for reliable printed circuit assemblies. Focuses
on SMT or mixed technology PWAs, specifically
addressing the interconnect structure and the solder
joint itself. Discusses substrates, components, attachment materials, coatings and assembly processes and
testing considerations. Contains detailed appendices
covering: solder attachments, plated-through via
structures, insulation resistance, thermal considerations, environmental stresses, coefficient of thermal
expansion, electrostatic discharge, solvents, testability, corrosion, aerospace and high altitude concerns.
137 pages. Released July 1996.
Hard COPY CD or download
IPC members: $45.00
$50.00
Nonmembers: $90.00
$95.00
KIT**
IPC members: $70.00
Nonmembers: $140.00

IPC-D-310C

Guidelines for Phototool Generation and
Measurement Techniques

Contains backplane design information from the fabrication and assembly perspective. Includes sections
on design and documentation, fabrication, assembly,
repair, and inspection. 17 pages. Revised September
1982.
Hard COPY CD or download
IPC members: $20.00
$25.00
Nonmembers: $40.00
$45.00

C e rti fi cati o n
IPC-PWBADV-SG02 (Hard Copy)
IPC-PWBADV-CD (CD)

PCB Advanced Designer Certification
Study Guide
Establishes the criteria and provides all necessary
information to prepare designers for the IPC Advanced
PCB Designer Certification Exam. Covers all ten sections of the exam: layout, electrical considerations,
material, component requirements, assembly requirements, board fabrication, physical board characteristics, documentation, inspection and reliability. Follows
the same approach used in the IPC Advanced PCB
Designer Certification Preparation Workshop. May
be used as a self-study guide. 293 pages. Released
January 2002.

ANSI Approved. Provides manufacturing and design
Hard COPY CD
considerations, input data requirements, test coupons, IPC members: $75.00
$185.00
process control, tape and preform artwork, cut and
Nonmembers: $150.00
$285.00
strip artwork, vector photoplotting, rasterplotting,
direct imaging, measurement and quality assurance.
68 pages. Revised June 1991.
IPC-PWB-CRT-SG01 (Hard Copy)
IPC-PWB-CERTCD01 (CD)
Hard COPY CD or download
IPC members: $30.00
Nonmembers: $60.00

$35.00
$65.00

PCB Designer Certification Study Guide

Prepares designers for the IPC PCB Designer Certification Exam. Covers design considerations, layout
principles, component and assembly issues, printed
board characteristics, documentation and dimensionIPC-D-322
ing. Addresses each of the ten sections of the exam,
Guidelines for Selecting Printed Wiring
including electrical considerations, material properBoard Sizes Using Standard Panel Sizes
ANSI Approved. Defines guidelines for choosing sizes ties, board fabrication, testing technology and reliability. Follows the same approach used in the IPC PCB
of printed circuit boards using standard fabrication
Designer Certification Preparation Workshop. May be
panel sizes. 4 pages. Reaffirmed September 1991.
used as a self-study document. 174 pages.
Hard COPY CD OR DOWNLOAD
Hard COPY CD
IPC members: $20.00
$25.00
IPC
members:
$35.00
$125.00
Nonmembers: $40.00
$45.00
Nonmembers: $70.00
$225.00

Data Trans fer
IPC-2501

Definition for Web-Based Exchange of
XML Data
ANSI Approved. Establishes the governing semantics
and an XML based syntax for shop floor communication between electronic assembly equipment
and associated software applications. Outlines the
communication architecture and supporting XML
messages. Describes a messaging interface that is
based upon an architecture whereby a single logical
middleware server (the Message Broker) exchanges
messages among clients in a domain. 32 pages.
Released July 2003.
Hard COPY
IPC members: $35.00
Nonmembers: $70.00

oad

wnl

Do
ree

F

IPC-2531

Standard Recipe File Format (SRFF)
Specification
Outlines the requirements that an SRFF file must
meet. Describes the file format, outlines the file
sections and indicates how data should be represented through objects. Objects can either be vendor
independent (generic objects defined in this document) or vendor specific (objects created by a vendor).
Includes error codes that should be used to report
specific information about improperly constructed
files. General guidelines for producing an SRFF file and
vendor specific objects are also included. 125 pages.
Published March 1999.
Hard COPY
IPC members: $35.00
Nonmembers: $70.00

oad

wnl

e Do

Fre

Learn more about Designer Certification
at http://dc.ipc.org

**Kit includes CD and hard copy.

28

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IPC-2541

IPC-2547

IPC-2578

Generic Requirements for Electronics
Manufacturing Shop Floor Equipment
Communication (CAMX)

Sectional Requirements for Shop Floor
Equipment Communication Messages
(CAMX) for Printed Circuit Board Test

ANSI Approved. Defines an XML encoding schema
to facilitate plug-and-play characteristics in a
factory's shop-floor information system. Describes
the generic event message content and should be
used together with the IPC-2540 series sectional
documents, which define the set of messages and
key attributes of specific classes of equipment used
in the electronics manufacturing area. 175 pages.
Released October 2001.

ANSI Approved. Describes event message content
and an XML encoding scheme, which enables a
detailed definition of messages in the domain of
electronics inspection, test and repair/rework (i.e.
product and process quality). These messages are
to be encoded at a level appropriate to facilitate
interoperability in the factory shop floor equipment
and information system integration process. Should
be used with the generic document, IPC-2541. 52
pages. Released January 2002.

Sectional Requirements for Supply
Chain Communication of Bill of Material
and Product Design Configuration Data
— Product Data eXchange

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

oad

wnl

e Do

Fre

Hard COPY
IPC members: $35.00
Nonmembers: $70.00		

IPC-2546

Sectional Requirements for Shop-Floor
Equipment Communication Messages
(CAMX) for Printed Circuit Board
Assembly – with Amendments 1 & 2
ANSI Approved. Describes the event message
content specific to assembly equipment. The types
of processes covered by IPC-2546 include material
movement systems like conveyors and buffers,
manual placement, automated screen printing,
automated adhesive dispensing, automated surface
mount placement, automated plated-through hole
placement, forced convection and infrared reflow
ovens, and wave soldering. Amendment 1 provides
the requirements for screen printing equipment.
108 pages. Released January 2003. Amendment 2
covers the Dispensing Equipment, Reflow Equipment, and Final Assembly and Packaging sections of
IPC-2546 and is a supplement to the standard. 131
pages. Released January 2005.
Hard Copy
IPC members: $35.00
Nonmembers: $70.00

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ANSI Approved. Provides an XML encoding scheme
for use by electronics manufacturing supply chain
partners to exchange sufficient product data to enable distributed manufacturing. Information includes
bills of material (BOM), approved manufacturer lists
(AML), approved supplier lists (ASL), change history
and engineering change orders, and a high-level
description of the components listed on a bill of
material. 34 pages. Released November 2001.
Hard COPY
IPC members: $35.00
Nonmembers: $70.00

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IPC-2571

IPC-2511A

Generic Requirements for Electronics
Manufacturing Supply Chain Communication—Product Data eXchange (PDX)

Generic Requirements for Implementation
of Product Manufacturing Description
Data & Transfer Methodology

ANSI Approved. Defines an XML encoding schema
which enables a total product definition to be
described at a level appropriate to facilitate supply
chain interactions. The schema is defined for bill of
materials (BOM), approved manufacturer list (AML),
changes (engineering, manufacturing, product) and
references to documents describing geometric and
other definition characteristics. 43 pages. Released
November 2001.

Revision A of IPC-2511 (GenCAM 1.5) identifies the
generic requirements for implementation of product
manufacturing description data and transfer using
BNF code. Helps users transfer design requirements and manufacturing expectations from
computer-aided design systems to computer-aided
manufacturing systems for printed board fabrication, assembly and test. Establishes the rules and
protocol of describing data for electronic transfer in
a neutral format. GenCAM® is a user-friendly standardized format documented in a series of seven
major sectional standards identified as IPC-2510.
All seven documents, numbered IPC-2512A through
IPC-2518A, were released in November 2000. For
more information go to the online store. 199 pages.
Released January 2000.

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

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IPC-2576

Sectional Requirements for Electronics
Manufacturing Supply Chain Communication of As-Built Product Data — Product
Data eXchange
ANSI Approved. Covers the sectional requirements
for product genealogy or as-built manufacturing
information. Facilitates the exchange of manufacturing information between supply chain partners
to support warranty tracking, product excursion
containment and product quality functions. 9 pages.
Released November 2001.
Hard COPY
IPC members: $35.00
Nonmembers: $70.00

oad

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

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Print restrictions apply for single-user
CD and download formats.

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www.ipc.org/onlinestore

Prices are subject to change –
check the online store.

29

D e si g n
IPC-2511B

IPC-2514A

IPC-2518A

Generic Requirements for Implementation Sectional Requirements for
of Product Manufacturing Description Data Implementation of Printed Board
& Transfer XML Schema Methodology
Fabrication Data Description

Sectional Requirements for Implementation
of Parts List Product Manufacturing Data
Description

ANSI Approved. Specifies the XML schema that represents the data file format used to describe printed
board and printed board assembly products with
details sufficient for tooling, manufacturing, assembly,
inspection and testing requirements. Format may be
used for transmitting information between a printed
board designer and a manufacturing or assembly facility. Data is most useful when the manufacturing cycle
includes computer-aided processes and numerical
control machines. 182 pages. Released January 2002.

Defines the sectional requirements for implementation of printed board fabrication data description.
IPC-2511 is a mandatory part of this standard. It is
part of the GenCAM® Series. 23 pages. Released
November 2000.

Defines the sectional requirements for implementation of parts list product data description. IPC-2511
is a mandatory part of this standard. It is part of the
GenCAM® Series. 18 pages. Released November
2000.

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

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IPC-D-356B

Sectional Requirements for Implementation of Bare-Board Product Testing Data
Description

Bare Substrate Electrical Test Data Format

Defines the sectional requirements for implementation of bare board product electrical testing data
Sectional Requirements for Implementation description. IPC-2511 is a mandatory part of this
of Administrative Methods for Manufactur- standard. It is part of the GenCAM® Series. 20 pages.
ing Data Description
Released November 2000.
Sectional requirement for implementation of adminisHard COPY
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tration information related to ordering and specifying IPC members: $35.00
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printed boards, printed board assemblies, fixtures
Nonmembers: $70.00
and components. IPC-2511 is a mandatory part of this
standard. It is part of the GenCAM® Series. 18 pages.
Released November 2000.
IPC-2516A
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Defines the sectional requirements for implementation of drawing methods for manufacturing data
description. IPC-2511 is a mandatory part of this
standard. It is part of the GenCAM® Series. 26 pages.
Released November 2000.
Hard COPY
IPC members: $35.00
Nonmembers: $70.00

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Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

30

Describes a data format for transmitting bare board
electrical test information in digital form including
data suitable for computer-aided repair. When used as
a netlist input to test data processing, the receiver of
IPC-D-356B data will determine test point assignments
and positioning. Enhancements to Revision B include
updates to the concept of testable areas to account
for SMD pads and unusually shaped pads, updating of
complex records for representing all inter-layer connections in nets, a simple polygon description format
that improves graphical representation of the bare
board, and new methods for identifying endpoints and
midpoints. 61 pages. Released October 2002.

Hard COPY CD or download
Sectional Requirements for Implementation
IPC members: $30.00
$35.00
of Assembled Board Product ManufacturNonmembers: $60.00
$65.00
ing Data Description

Defines the sectional requirements for implementation of assembled board product manufacturing data
IPC-2513A
description. IPC-2511 is a mandatory part of this
Sectional Requirements for Implementastandard. It is part of the GenCAM® Series. 19 pages.
tion of Drawing Methods for Manufacturing Released November 2000.

Data Description

F

IPC-2515A

IPC-2512A

Hard COPY
IPC members: $35.00
Nonmembers: $70.00

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Hard COPY
IPC members: $35.00
Nonmembers: $70.00

IPC-2581

Generic Requirements for Printed Board
Assembly Products Manufacturing
Description Data and Transfer Methodology

ANSI Approved. Specifies the XML schema used to
describe printed board and printed board assembly
products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. The
format is a convergence of the Valor Computerized
IPC-2517A
®
Sectional Requirements for Implementation Systems ODB++ and IPC-2511B GenCAM format
of Assembly In-Circuit Test Data Description structure in XML schema. Format may be used for
transmitting information between a printed board
Defines the sectional requirements for implementadesigner and a manufacturing or assembly facility.
tion of assembly in-circuit test data description.
The data is most useful when the manufacturing cycle
IPC-2511 is a mandatory part of this standard. It is
includes computer-aided processes and numerical
part of the GenCAM® Series. 24 pages. Released
control machines. 161 pages. Released March 2004.
November 2000.
Hard COPY
Hard COPY
ad
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IPC
members:
$35.00
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IPC members: $35.00
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Nonmembers: $70.00
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Nonmembers: $70.00
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Mana g e m e nt, Mar k e t
R e s e ar c h and R o ad m aps
table o f c ont ents

IPC-1730A

Laminator Qualification Profile

General  .  .  .  .  .  .  .  .  .  .  . 31
EMTF Studies  .   .   .   .   .   .   .   .  32
Wage and Compensation Studies  .  33

G e nera l
IPC-1710A

OEM Standard for Printed Board
Manufacturers' Qualification
Profile (MQP)
Sets the standard for assessing PWB manufacturer
capabilities and allows PCB manufacturers to more
readily satisfy customer requirements. Eases auditing processes and reduces the frequency of audits,
thereby decreasing paperwork and enhancing manufacturer effectiveness. Revision A consists of a
single, easy to use electronic file (Microsoft WordTM
template) providing the capability of electronically
consolidating and organizing data. This process
improves the system of updating and transferring
information between manufacturers and customers.
49 pages. Released July 2004. Free Download
Available only as a download.

IPC-1720A

Assembly Qualification Profile
Categorizes electronic assembly manufacturer
capabilities and supplies the OEM customer with
detailed, substantive information. Simplifies auditing processes and reduces the frequency of audits,
thereby decreasing paperwork and improving
efficiency. Includes company and site description,
site capability snap shot, equipment profile (pre-site
audit), technology profile specifics, quality profile,
manufacturing. Revision A consists of a single, easy
to use electronic file (Microsoft WordTM template)
providing the capability of electronically consolidating and organizing data. 56 pages. Released July
2004. Free Download

Categorizes a laminate manufacturer's capabilities,
which furnishes customer access to detailed information. Simplifies auditing processes and reduces
the frequency of audits, decreasing paperwork and
improving efficiency for single or multiple sites
or locations. Includes a description, approval and
certification profile and a quality profile. Supplemented by a Microsoft WordTM template file, which
enables entering, storing and updating the various
sections electronically and submitting the data to
customers with ease. 22 pages. Released June
2000. Free Download
Available only as a download.

IPC-1731

Strategic Raw Materials Supplier Qualification Profile
ANSI Approved. Suppliers of raw materials for
laminate manufacturing now have an industry-approved questionnaire to supply current and potential
customers with a self-assessment of their facilities.
Gives suppliers of raw materials the opportunity to
create a profile of their manufacturing facility that
will be consistent with those developed by other
industry suppliers. Using the Microsoft WordTM template enables easy file creation and maintenance
and results in an electronic file that can be easily
forwarded to customers. 36 pages. Published June
2000. Free Download
Available only as a download.

Available only as a download.

ROADMAP-05

2004-2005 The International Technology
Roadmap for Electronic Interconnections
Provides vision and direction for product development, process development and services required to
satisfy the current and future needs of companies
that are building electronic and optoelectronic
equipment in the U.S. Presents findings and recommendations based on OEM requirements and an
updated cost model that considers circuit density
(for board fabrication) and assembly complexity (for
assembly manufacture). Encompasses the supply
chain infrastructure needed for single-chip and
multichip packaging, printed board issues, assembly
considerations, optoelectronics and related management/environmental key pressure points. Each
chapter contains specific recommendations addressing current, near-term, mid-term and long-term
requirements, proposed actions and opportunities.
A valuable resource for companies throughout the
global electronic equipment manufacturing industry.
Can be used for business, technology, and strategic
planning for the short and long term. 613 pages.
Released October 2005.
CD
IPC members: $125.00
Nonmembers: $250.00

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for

IPC-SKILL-201

IPC Skill Standards for Printed Circuit
Board Manufacturing
Industry-consensus PCB skill standards provide
conditions of performance, statements of work,
performance criteria, assessment and credentialing
approaches for more than 40 critical areas of PCB
manufacturing. Document helps human resource
personnel and managers make intelligent hiring,
promotion and training decisions. Includes the complete IPC-T-50 Terms and Definitions, as well as job
descriptions. PCB skill standards are an essential
ingredient in a company's workforce improvement
plan. 185 pages. Released May 1999.
Hard COPY only
IPC members: $75.00		
Nonmembers: $150.00

www.ipc.org/onlinestore

31

Mana g e m e nt , Mar k e t
R e s e ar c h and R o ad m aps
IPC-EMTF-06F

EXECUTIVE MARKET
TECHNOLOGY FORUM
About IPC's Executive Market &
Technology Forum (EMTF)
Executive Forum membership is open to all IPC
members. It provides access to extensive market
research studies and industry reports specifically
designed for the electronics interconnect industry.
Executive Forum conferences held worldwide, bring
together top management people from across the
supply chain, creating unique opportunities for networking and shaping the future of the industry. For

Technology Trends in Printed Circuit
Boards for the Year 2005

Survey-based study presents data and analysis on
trends in the North American flexible circuit industry,
including growth estimates and sales history, number
of fabricators, global footprint of U.S.-based fabricators, trends in materials, sales by product type, production mix (high-volume vs. quick-turn vs. prototype),
trends in line width and spacing, revenue trends
from value-added services, industry end-markets
by product type, and U.S. imports and exports. The
five participating companies represent 27% of North
American flexible circuit sales. 31 pages. Released
July 2006.

Survey-based study presents data and analysis on
trends in rigid PCB conductor width and spacing,
metallic finishes, solder mask usage, multilayer production, laminate thickness and temperature, surface
mounting, fine-pitch technology, and other leadingedge technologies. Survey sample of 22 companies
represents about 29% of the rigid PCB industry and
approximately 65% of the laminate industry in North
America. 27 pages. Released September 2005.

information about joining the Executive Forum, go
to www.ipc.org/ExecForum2006 or contact Sharon

Executive Forum members:
IPC members:		
Nonmembers:		

Starr at 1-847-597-2817 or SharonStarr@ipc.org.

IPC-EMTF-06T

2005-2006 Industry Analysis and Forecast
for Flexible Circuits in North America

Download only
Free
$250.00
$500.00

IPC-EMTF-06R

2005-2006 Industry Analysis and Forecast
Consensus estimates of PCB production value and
for Rigid PCBs and Laminates in North
laminate area consumption by product type and coun- America
try, from a panel of the world’s leading industry analysts, including analysis on regional trends and flexible
circuits. Published exclusively for members of IPC’s
Executive Market & Technology Forum. IPC members
can obtain this report by joining the Executive Forum.
Go to www.ipc.org/ExecForum2006 for membership
information and application form. 36 pages. Released
July 2006.
Executive Forum members:

Free Download

Survey-based study presents data and analysis on
trends in the North American rigid PCB industry,
including industry growth forecast, industry end-markets served, sales history by product type, trends in
high-density multilayer boards, production mix trends
(high-volume vs. quick-turn vs. prototype), new vs.
existing business growth, number and average value
of PCBs and panels produced, panel size, and U.S.
imports and exports. Laminate sales, trade data and
application trends are also covered. Survey sample
of 23 companies represents approximately 33% of
the rigid PCB industry and about 65% of the laminate
industry in North America. 47 pages. Released July
2006.
Executive Forum members:
IPC members:		
Nonmembers:		

IPC-EMTF-06E

Survey-based study presents data and analysis on
the global electronics assembly and EMS industry,
examining trends in sources of industry revenue,
number of facilities, revenue trends based on services
offered and markets served, manufacturing technology, capital investment, spending on equipment and
materials, and market size including forecasts. 49
pages. Released September 2006.
Executive Forum members:
IPC members:		
Nonmembers:		

Download only
Free
$375.00
$750.00

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

32

Download only
Free
$250.00
$500.00

2005-2006 Industry Analysis and Forecast
for the Worldwide Electronics Manufacturing Services (EMS) Industry

IPC-EMTF-05W

World PCB Production and Laminate
Market Report for the Year 2005

Executive Forum members:
IPC members:		
Nonmembers:		

www.ipc.org/onlinestore

Download only
Free
$375.00
$750.00

IPC-EMTF-06MED

IPC-EMTF-06HSP

Medical Electronics Market Opportunities for Interconnect Manufacturers

Worldwide High Speed Electronics
Technology and Market Trends for the
Years 2006-2016

Commissioned study reveals emerging developments in the worldwide medical electronics marketplace and technology. Explains the challenges and
potential opportunities for component and materials
suppliers, PCB fabricators, and product assemblers,
as well as market drivers and regulatory requirements. Includes market and technology forecasts
for suppliers to the medical electronics industry
covering the near term (3-5 years) and long term
(5-10 years). Implications of this growing market for
laminate materials, PCB fabrication, components
and component packaging, connector technology,
assembly and test, and system level requirements
are explored. Conducted by Prismark Partners for
IPC’s Executive Forum. Expected publication date:
September 2006.
Single-user download
Executive Forum members: Free
IPC members:		
$2,000.00
Nonmembers:		
$4,000.00
Global license download
IPC members:		
$2,500.00
Nonmembers:		
$5,000.00

In-depth commissioned study explains market trends
driving high-speed electronic system architectures
(from 2 Gbps to +40Gbps) and expectations for the
technology requirements both in the near future (3-5
years), and the long term (5-10 years). Key systems
studied are servers, switches, routers and telecom
infrastructure equipment, including the impact
of their evolution on PCB design and fabrication,
inspection, low-loss laminates, connectors, board
assembly, board test and IC packaging. Emerging
challenges and opportunities are identified for all
segments in the supply chain. Technology roadmaps
are included, along with forecasts of market demand
for the key systems, high-speed PCBs and low loss
laminates. Conducted by BPA Consulting. Expected
publication date: September 2006.
Single-user download
Executive Forum members: Free
IPC members:		
$2,000.00
Nonmembers:		
$4,000.00
Global license download
IPC members:		
$2,500.00
Nonmembers:		
$5,000.00

Wage and Compensation Studies
IPC-WAGEE-04

IPC Wage Rate & Salary Report for the
EMS Industry 2004-2005
Results of IPC's wage and salary survey for
independent electronic assembly / electronics
manufacturing services (EMS) companies in North
America for 2004, including some 2005 estimates.
Presents aggregate data on 30 positions and the
related job descriptions. Wage and salary data are
shown by regions and by company size. Includes
aggregate data on the 28 company respondents'
personnel and compensation policies, benefits, and
sales compensation structure. 34 pages. Released
December 2005.
Survey participants:
IPC members:		
Nonmembers:		

IPC-WAGEP-04

IPC Wage Rate & Salary Report for the
PCB Industry 2004-2005
Results of IPC's wage and salary survey for independent printed circuit board (PCB) manufacturers
in North America for 2004, including some 2005
estimates. Presents aggregate data on 41 positions
and the related job descriptions. Historical and current wage and salary data are shown by regions and
by company size. Includes aggregate data on the 15
respondents' personnel and compensation policies,
benefits, and sales compensation structure. 36
pages. Released December 2005.
Survey participants:
IPC members:		
Nonmembers:		

Download only
Free
$250.00
$500.00

IPC-EXCOMP-06

IPC Executive Compensation Study for the
PCB and EMS Industries 2005-2006
Results of IPC’s executive compensation survey for
North American EMS and PCB companies for 2005
and 2006, reported by industry segment, region and
company size. Examines base salaries, bonuses and
other forms of compensation and benefits. Includes
historical trend data and covers 12 key executive
positions. Expected publication date: October 2006.
Survey participants:
IPC members:		
Nonmembers:		

Download only
Free
$495.00
$990.00

Download only
Free
$250.00
$500.00

www.ipc.org/onlinestore

33

E N V I R O N ME N TA L COM P L I A N CE
MATER I AL S DECL A R AT ION
IPC-1065

Environment, Health and Safety

IPC-1752

Materials Declaration Management

Establishes the requirements for exchanging
materials and substances data between
Aids printed circuit board (PCB) manufacturers
suppliers and their customers for electrical and
and users in completing materials declaraelectronic equipment (EEE). Applies to products,
tions that follow the format and guidance of
components, subparts and materials that are supplied
the Joint Industry Material Composition Declaration
to EEE manufacturers for incorporation into their
Guide. The handbook includes information on what a
manufacturer should do when a materials declaration products. Covers materials and substances that may
be present in the supplied product or subpart.
request is received, a list of chemical substances
Available only as a Zip file. The file contains IPC-1751,
likely to be found in a PCB, simplified sample
calculations for a materials declaration of a PCB, and Generic Requirements for Declaration Process
Management; IPC-1752, XML Schema; IPC-1752-1, PDF
guidelines for determining the composition of an
Form for General and Class I Materials Declarations;
electronic product using analytical techniques.
IPC 1752-2, PDF Form for Class II Materials Declarations;
Appendices include a table of chemical lists and
laboratory analysis methods, detailed calculation of a and IPC-1752-3, Users Guide for Materials Declaration
Forms. Free Download
materials declaration of a PCB, uncertainty of
calculated data values, a list of analytical laboratories, a list of relevant documents, and analytical
E3TOOL-CD
techniques for substances removed from the final
E3 Survival Toolkit
version of the joint industry guide. 72 pages. Released
Find out how to minimize the burdens
January 2005.
associated with reporting and better
HARD COPY CD OR DOWNLOAD
understand what will be required of your
IPC members: $30.00
$35.00
company in order to comply with the European Union's
Nonmembers: $60.00
$65.00
WEEE and RoHS Directives. The toolkit includes an
interactive CD-ROM and diagnosis tools to assess a
company's compliance status considering product line,
markets, sales levels, supply chain management and
IPC-1066
materials used. Based on input, a compliance
Marking, Symbols and Labels for
assessment report is generated that summarizes
Identification of Lead-Free and Other
actions to consider. Created by eco3, an environmenReportable Materials in Lead-Free
tal consultancy based in the U.K.
Assemblies, Components and Devices

Material Declaration Handbook

Pb

Pb

Pb

Establishes the requirements for a distinctive
symbol and labels to be used to identify
materials that are lead free and capable of
providing Pb-free second level interconnects, and to
indicate certain types of Pb-free materials and the
maximum allowable soldering temperature. 20 pages.
Published December 2004.

Single
User CD
IPC members: $99.00
Nonmembers: $149.00

IPC/JEDEC J-STD-609 coming soon – check the online store.

ERA RoHS Directive Supplier Audit Form
Package

Pb

HARD COPY only
IPC members: $15.00
Free Download
Nonmembers: $30.00

New Certification for RoHS
Lead Free Electronics Assembly
Process Capability Program.
For more information see page 2.

34

Global
License CD
$450.00
$600.00

ROHSAUDIT-CD

To ensure more accurate information from
suppliers, the U.K. research and consulting
firm ERA developed a Supplier RoHS Audit
Form to help companies collect information from
suppliers, in addition to or in lieu of an audit visit. In
addition to information gathering, the form asks
probing questions that test supplier understanding of
the requirements. Package includes a license to make
copies for distribution to suppliers.

Pb

IPC-1331

Voluntary Safety Standard for Electrically
Heated Process Equipment
Establishes minimum requirements for design, installation, operation and maintenance of electrically
heated process equipment to minimize electrical hazards and prevent fires in combustible tanks, tank liners
and drying equipment. Available as download only.
11 pages. Published March 2000. Free Download

IPC-ENVIRONMENT

Environmental Best Practices Guide Book
Details the industry's environmental success in reducing its environmental impact. From recommendations
to minimize copper wastewater discharges to detailed
steps on adopting environmental management systems, it presents detailed steps to prevent pollution
and minimize generation of waste. Published by the
British PCB Association (PCIF). 108 pages. Published
1999.
Hard COPY only
IPC members: $75.00
Nonmembers: $150.00

­I PC-WP/TR-584

IPC White Paper and Technical Report on
Halogen-Free Materials Used for Printed
Circuit Boards and Assemblies
This combination IPC white paper and technical report
summarizes both the IPC position as well as significant data on the subject of “halogen-free” materials
for the electronics industry. Developed in three years
by a team representing every level of the electronics
supply chain. Reviewed and accepted by the IPC’s
Technical Activities Executive Committee (TAEC) and
is applicable to materials for interconnecting electronics reflecting the state of technology as of December
1, 2002. 29 pages. Released April 2003.
Hard COPY CD or download
IPC members: $25.00
$30.00
Nonmembers: $50.00
$55.00

Pricing at various license levels is available – check the
online store.

www.ipc.org/onlinestore

Print restrictions apply for single-user
CD and download formats.
Prices are subject to change –
check the online store.

L e ad f r e e
IPC standards that have been updated for or
are applicable to lead free are included in the
various sections of this catalog with this symbol:

Pb

. The following items are additional

tools for your use.

text b o o ks
ELEC-ELEC

Implementing Lead-Free Electronics
Provides timely information on the choices and
tradeoffs facing manufacturers seeking the most efficient and cost-effective ways of converting to lead
free manufacturing. The book is laid out as a quick
guide, providing successful examples in conjunction
with the basic principles of the implementation and
production of lead free electronics on a global basis.
Written by Dr. Jennie S. Hwang; McGraw-Hill. 466
pages. Released 2005.
Hard Copy only
IPC members: $100.00
Nonmembers: $125.00

ELEC-06

Lead-Free Electronics

ELEC-RELIA

Lead-Free Solder Interconnect Reliability
Provides the most up-to-date information and statistics available on the reliability of lead free solder
interconnects. Addresses fundamental research
and practical considerations. Ideal resource for
practitioners in the electronics industry who need
to understand the reliability of solder interconnects
for design, testing, quality assurance, and failure
analysis. Will also benefit industry and academic
researchers, educators, and students. Published by
ASM International and edited by Dr. Dongkai Shangguan. 292 pages. Released May 2006.
Hard Copy only
IPC members $150.00
Nonmembers $175.00

Offers guidance on the design and use of lead free
electronics as well as technical and legislative
perspectives. Addresses all the complex challenges
confronting the electronics industry. Includes the
most recent data on cyclic thermomechanical
deformation properties of lead free SnAgCu alloys
and a comparison of the properties of standard
Sn-Pb versus lead free alloys, using the energy
partitioning approach. Written by leading experts in
the field and carefully edited to ensure a consistent
approach. Edited by Sanka Ganesan and Michael
Pecht; John Wiley & Sons, Inc. 766 pages. Released
April 2006.
Hard Copy only
IPC members: $100.00
Nonmembers: $150.00

Additional reference books and more
details are available at the online store.

TE S T REPO RT
SPVC2005-CD

Round Robin Testing and Analysis of Lead
Free Solder Pastes with Alloys of Tin,
Silver and Copper
Result of a three-year one million dollar investment
to determine which solder alloy to recommend.
Report includes 18 appendices with nearly 100
megabytes of data and research charts. Data supports recommendation of 96.5/3.0/0.5 tin/silver/
copper (SAC305) as the alloy of choice for lead free
applications. 50 pages. Published 2005.

ELEC-MICRO

Handbook of Lead-Free Solder Technology
for Microelectronic Assemblies
Complete walk-through of the conversion from
standard tin lead to lead free solder microelectronic
assemblies for low-end and high-end applications.
Analyzes the health risks associated with lead;
estimates the environmental benefits of using lead
free substitutes in microelectronics; summarizes

new regulations, legislation, and marketplace trends
affecting the industry; and outlines changes and
challenges on the materials, equipment, and process levels for manufacture of lead free microelectronics. Written by more than 45 researchers and
practitioners. Edited by Karl J. Puttlitz and Kathleen
A. Stalter; Marcel Dekker, Inc. 1,026 pages.
Published 2004.
Hard Copy only
IPC members: $175.00
Nonmembers: $220.00

Single
User CD
IPC members: $ 99.00
Nonmembers: $199.00

Global
License CD
$499.00
$799.00

www.ipc.org/onlinestore

MORE RES OU RCES
Additional resources such as desk reference guides,
posters, and computer-based training are available
at http://leadfree.ipc.org. The following standards have been updated for lead free and released.
Many others are underway.
• IPC-J-STD-001D: Requirements for Soldered
Electrical & Electronic Assemblies
• IPC-J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and
Wires
• IPC-J-STD-003B: Solderability Tests for Printed
Boards
• IPC-J-STD-004A: Requirements for Soldering
Fluxes
• IPC-HDBK-005: Guide to Solder Paste Assessment
• IPC-J-STD-005: Requirements for Soldering
Pastes
• IPC-WP-006: Round Robin Testing & Analysis:
Lead-Free Alloys–Tin, Silver, & Copper
• IPC-J-STD-006B: Requirements for Electronic
Grade Solder Alloys and Fluxed and Non-Fluxed
Solid Solders
• IPC/JEDEC J-STD-020C: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices
• J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip and Other
Micropackages
• IPC/JEDEC J-STD-033B: Handling, Packing,
Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices
• IPC-TR-585: Time, Temperature and Humidity
Stress of Final Board Finish Solderability
• IPC-A-610D: Acceptability of Electronic
Assemblies
• IPC/WHMA-A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies
• IPC-4101B: Specification for Base Materials for
Rigid and Multilayer Printed Boards
• IPC-4552: Specification for Electroless Nickel/
Immersion Gold (ENIG) Plating for Printed Circuit
Boards
• IPC-4553: Specification for Immersion Silver
Plating for Printed Circuit Boards
• IPC-7351: Generic Requirements for Surface
Mount Land Pattern and Design Standard
• IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder
Attachments
• IPC/JEDEC-9702: Monotonic Bend Characterization of Board-Level Interconnects
• IPC-9704: IPC/JEDEC Printed Wiring Board Strain
Gage Test Guideline

35

A rt w o r k f o r T e st C o u p o ns
IPC-9251

IPC-A-25

IPC-A-40

Test Vehicles for Evaluating Fine
Line Capability

Multipurpose 1 & 2 Sided Test Pattern

Solder Mask Artwork

Referenced in IPC-CC-830 and IPC-SM-840C. Primarily
for surface insulation resistance testing. The film
format (3pcs. 30 x 46 cm scale 2:1) contains the solder
mask layer pattern, but does not include the drill file.
IPC-SM-840C, Qualification and Performance of Permanent Solder Mask, is included. Includes a hardcopy of
the Master Drawing IPC-B25/55110.

Solder Mask Layer for use with IPC-A-41, IPC-A-42,
IPC-A-43 & IPC-A-44. (1pc. 30 x 46 cm 1:1). Available
in film only.

Test patterns for evaluating fine line capabilities;
were developed by CAT, Inc. and Du Pont and are
made available with their permission through IPC.
Free Download

IPC-A-20/21-GKIT

Standard Pitch Stencil Pattern for Slump

A-25-G-KIT (Gerber Format)
IPC members: $40.00
Nonmembers: $80.00

Files contain patterns for developing solder paste
stencils by laser or chemical etching. Land widths
A-25-D-KIT (IPC-D-350-Format)
of 0.4 mm, 0.63 mm and 1.25 mm are provided with
IPC
members:
$40.00
varying pitch to evaluate solder paste slump. Includes
Nonmembers:
$80.00
J-STD-005, Requirements for Soldering Pastes.
IPC-A-20/21-G KIT (Gerber Format)
IPC members: $75.00		
Nonmembers: $150.00

IPC-A-25A

Multipurpose 1 Sided Test Pattern

Artwork for standard test boards as referenced in
IPC-CC-830 and IPC-SM-840C. Used primarily for
IPC-A-22
surface insulation resistance testing and solder mask
UL Recognition Test Pattern
testing. IPC-SM-840C, Qualification and Performance
Recognition vehicle for UL-796 (base materials) and
of Permanent Solder Mask, is included. The A revision
UL-746 (printed wiring boards). Tests for conductor
combines IPC-A-24 and IPC-A-25 comb patterns on a
width plating quality-PTH, flammability, etc. (1 pc. 41 x
single-sided board. Revised February 1996.
57 cm 1:1.). Includes IPC-A-22 Sample Preparation and
A-25A-G-KIT (Gerber Format)
Instruction Booklet in hardcopy only.
IPC members: $65.00
A-22-G-KIT (Gerber Format)
Nonmembers: $130.00
IPC members: $30.00		
A-25A-D-KIT (IPC-D-350 Format)
Nonmembers: $60.00
IPC members: $65.00
A-22-D-KIT (IPC-D-350 Format)
Nonmembers: $130.00
IPC members: $30.00
Nonmembers: $60.00

A-40-F-KIT (Film Format)
IPC members: $27.00
Nonmembers: $54.00
IPC-A-41

Single Sided Artwork
Artwork required for certification to either
MIL-P-50884, MIL-P-55110, also IPC-6011, IPC-6012,
IPC-6013, and IPC-MC-324D. Includes Universal Drilling and Profile Master Drawing IPC-100001 Revision A
(March 1989) and Master Drawing #100041 Revision A
(March 1989). Both Master Drawings in hardcopy only.
(1 artwork image piece. 30 x 46 cm 1:1).
A-41-F-KIT (Film Format)
IPC members: $35.00
Nonmembers: $70.00
A-41-D-KIT (IPC-D-350 Format)
IPC members: $55.00
Nonmembers: $110.00

IPC-A-36
IPC-A-24

Cleaning Alternatives Artwork

Double-sided (with plated-through holes) board evaluates cleaning alternatives to chlorofluorocarbons.
Single-sided (4 up) pattern evaluates the interaction
Contains four quadrants utilizing both surface mount
of solder flux and paste residues. Board was used in
patterns and vias, each with 68 I/O chip carrier sites
the Phase 3 portion of the test program that evaluates
and 10 SIR test points. (6 pcs. 28 x 36 cm 1:1). A hard
alternative technologies to eliminate CFCs in assembly
copy aperture file is included. Go to the IPC web site
operations. Contains four comb patterns with 0.4 mm
for a listing of board vendors manufacturing the IPClines and 0.5 mm spaces. A stencil pattern is provided
B-36 board.
(2 pcs 30 x 45 cm 1:1) No components are provided.
A-36-G (Gerber Format)
Includes Master Drawing IPC-100024, Aperture List
IPC members: $90.00
and IPC-B-24 test board design criteria in hardcopy
only. For prefabricated boards go to www.ipc.org and Nonmembers: $180.00

Surface Insulation Resistance

click on “Technical Resources” for a listing of board
vendors carrying the IPC-B-24 board.
A-24-G-KIT (Gerber Format)
IPC members: $40.00
Nonmembers: $80.00

36

A-36-D (IPC-D-350 Format)
IPC members: $175.00
Nonmembers: $350.00

www.ipc.org/onlinestore

IPC-A-42

IPC-A-44

IPC-A-50

Double Sided Artwork

Mass Lamination Artwork

Artwork required for certification to either
MIL-P-50884, MIL-P-55110, also IPC-6011,
IPC-6012, IPC-6013, and IPC-MC-324D. Includes
Universal Drilling and Profile Master Drawing
IPC-100001 Revision A (March 1989) and Master
Drawing 100042 Revision A (March 1989). Both
Master Drawings in hardcopy only. (1 artwork image
piece. 30 x 46 cm 1:1).

Artwork required for certification of four layer,
mass laminated boards to either MIL-P-50884,
MIL-P-55110, also IPC-6011, IPC-6012, IPC-6013, and
IPC-MC-324. Includes Universal Drilling and Profile
Master Drawing IPC-100001 Revision A (March
1989) and Master Drawing # 100044 Revision A
(March 1989). Both Master Drawings in hardcopy
only. (4 pcs. 30 x 46 cm 1:1).

Surface Insulation Resistance Phoenix
Board — Gerber Format

A-42-G-KIT (Gerber Format)
IPC members: $30.00
Nonmembers: $60.00
A-42-D-KIT (IPC-D-350 Format)
IPC members: $30.00
Nonmembers: $60.00

A-44-F-KIT (Film Format)
IPC members: $110.00
Nonmembers: $220.00
A-44-D-KIT (IPC-D-350 Format)    
IPC members: $165.00
Nonmembers: $330.00

IPC-A-43

IPC-A-47

Ten-Layer Multi Artwork
Artwork required for certification of four layer,
mass laminated boards to either MIL-P-50884,
MIL-P-55110, also IPC-6011, IPC-6012, IPC-6013, and
IPC-MC-324. Includes Universal Drilling and Profile
Master Drawing IPC-100001 Revision A (March
1989) and Master Drawing # 100043 Revision A
(March 1989). Both Master Drawings in hardcopy
only. (4 pcs. 30 x 46 cm 1:1).
A-43-G-KIT (Gerber Format)
IPC members: $150.00
Nonmembers: $300.00
A-43-D-KIT (IPC-D-350 Format)
IPC members: $150.00
Nonmembers: $300.00

Composite Test Pattern Ten-Layer
Phototool
Artwork for assessing manufacturer capabilities per IPC-6012. Features test specimen
A,B,D,E,F,L,G,H,M,N,R and S per IPC-2221. Hardcopy
Master Drawings IPC-100103 for Type 3 (without
blind or buried vias) boards and universal hole and
profile drawing IPC-100002 included.
A-47-G-KIT (Gerber Format)
IPC members: $150.00
Nonmembers: $300.00

The Phoenix test board is used as an alternate to
IPC-B-24 for evaluating the interaction of solder flux
and solder paste residues. Useful for IPC/Belcore
correlation studies.
A-50 (Gerber Format)
IPC members: $40.00
Nonmembers: $80.00

IPC-A-52-G

Cleanliness and Residue Evaluation
Test Board
Designed to give the manufacturing process professional a tool to help assess the impact of cleanliness and residues on bare boards and finished
assemblies, as well as the impact of changing
manufacturing parameters on cleanliness. Artwork
package provides PDF master drawings and Gerber
files necessary for fabricating the test board which
contains coupons applicable for surface insulation
resistance (SIR) testing, ion chromatography (IC),
and solder mask adhesion. Released April 2006.
A-52-G (Gerber Format)
IPC Members $50.00
Nonmembers $100.00

A-47-D-KIT (IPC-D-350 Format)
IPC members: $150.00
Nonmembers: $300.00

www.ipc.org/onlinestore

37

MUL T I ME D I A T R A I N I N G
R E S OU R CE S
IPC has been producing industry-approved, commercialfree training media for more than 25 years...covering

C D - ROM /I nt erac ti ve T rainin g &
E l e c tro ni c Referen ce

electronics assembly acceptance standards, hand solder- Designed for self-paced learning with the convenience
ing, lead free, repair & rework, ESD control, component
of automated testing and score-keeping... our ComputerBased Training (CBT) programs cover such topics as
ID, wire harness, and circuit board fabrication.
Hand Soldering, ESD Control and SPC. The Component
For the online catalog of our DVDs, Interactive
ID/Electronic Reference (ER-18) and IPC-A-610 Electronic
CD-ROMs, online video resources, training and
Workmanship Standards (EWS-610) programs allow the
reference guides, wall posters and image archives
user to edit or add their own technical contents (and text
go to http://training.ipc.org.
in any language supported by Windows) and images.
All our CD-ROM based programs can be licensed two
ways–for unlimited use on a single computer (StandDVD–D ig ita l Vide o
IPC's line of video training programs have been upgraded Alone License) or unlimited use over a computer network
(Site License).
to the DVD-R format. With the added advantages of
random-access menu control, high-resolution digital
video, optional subtitles for the hearing-impaired (Sec.
508C compliant) and special dual-language editions (e.g.
Spanish/English, Chinese/English), these products work
well in group or individual training sessions. All training
support materials (such as Leader's Guides, Exams and
Student Certificates of Completion) are available for free
download.

OVT– Onl in e Vide o Training
IPC delivers video training right to your desktop! Our
Online Video Training (OVT) program gives you the tools
to provide instant access to our award-winning training.
Ideal for distance-learning programs, these digitized
training videos can be mounted and downloaded or
played directly from any server–across your network, or
across the world via your intranet! Licenses are available for single locations, or for international distribution.
Coming soon – automated online testing.

Translations–Spanish & Chinese
Many of our critical topics are available on special duallanguage DVDs. Languages include Spanish, Chinese,
French, Vietnamese and Russian, with more titles and
languages being added continuously. (Each dual-language DVD comes with the original English language as
an optional audio track.)

DRM–Desk Reference Manuals/
Training & Reference Guides
Handy and portable spiral-bound reference guides on
surface mount & through hole solder joint acceptability,
component identification, wire prep/crimp acceptability
and basic electronics assembly.

I mage Re sou rce s
Select digital clip art on CD-ROM from a wide variety of
close-up defect photography and computer-generated
graphics. Clip art sets from the IPC-A-610D, as well as a
lead free solder joint image library are available. Create
your own learning tools using IPC's graphic resources—
for unrestricted in-house use. ­

Wa l l Po ste rs
Make a "big" impression with these 20" x 28" surface
mount and through hole solder joint evaluation posters.
They contain the critical acceptance criteria from IPC-A610D and IPC J-STD-001D for solder connections and are
laminated with corner eyelets for easy display.

Sign up for a FREE demo DVD that
includes reviews of all IPC multimedia
training resources at
http://training.ipc.org
You'll also find these reviews available
for immediate download online.
For technical questions, please contact staff at the
IPC production office at 505-758-7937 or e-mail
service@ipcvideo.org.

38

http://training.ipc.org

I m a g e s and P o st e rs
c d- / dvd -bas ed i mage res ou r ces

P-SMT2-D

Surface Mount Solder Joint Evaluation
Wall Posters (Set of 3) – Class 2
What better way to demonstrate to your employees
that "inspection is everyone's job," than our surface
mount evaluation wall posters! Utilizing the graphics and Class 2 acceptability criteria from the
IPC-A-610D, these 20 x 28-inch hanging posters
serve as a constant reminder that quality is job
number one. A set of three laminated surface mount
evaluation/inspection posters for Class 2 comes
with eyelets for easy hanging. One poster each for
Chip, Gull and J-Lead (three-poster set).

IPC-A-610D Illustrations
Illustrations from IPC-A-610D are available as a complete set, individually, or by chapter. They are available
for unlimited use for in-house company training.
DVD-LFL

Lead Free Solder Joint Image Library
For description and pricing, check the online store.

IPC members: $100.00
Nonmembers: $150.00

P-SMT3-D

Surface Mount Solder Joint Evaluation
Wall Posters (Set of 3) – Class 3
Class 3 version of IPC-SMT2-D
IPC members: $100.00
Nonmembers: $150.00

P-PTH2-D

Through-Hole Solder Joint Evaluation
Wall Poster – Class 2
Full-color, 20 x 28-inch laminated wall poster visually defines minimum/maximum Class 2 through
hole solder joint acceptability requirements from the
IPC-A-610D in high-quality, 3-D graphics. This poster
depicts complex through hole solder joint requirements so clearly, that all operators and inspectors
can easily understand and apply this important
criteria. Bring technically accurate, industry-consensus acceptability standards to your training room or
inspection area. With eyelets for easy hanging. One
poster, for Class 2.
IPC members: $50.00
Nonmembers: $75.00

P-PTH3-D

Through-Hole Solder Joint Evaluation
Wall Poster – Class 3
Class 3 version of IPC-PTH2-D
IPC members: $50.00
Nonmembers: $75.00

Quantity pricing available on the posters – check the
online store

www.ipc.org/onlinestore

39

nume ric produc t inde x / pric e l ist
IPC
Member	Nonmember	 Page
Price	price
IPC-HDBK-001 . . . . . . . 40.00  . . . . . . 80.00 . . . . . . . .  4
IPC J-STD-001D . . . . . 40.00  . . . . . . 80.00 . . . . . . . .  4
IPC J-STD-001DSP . . .  40.00  . . . . . . 40.00 . . . . . . . .  4
IPC J-STD-001DSW . .  40.00  . . . . . . 40.00 . . . . . . . .  4
SMC-WP-001 . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  15
IPC/EIA J-STD-002B . .  20.00  . . . . . . 40.00 . . . . . . .  14
IPC/EIA J-STD-003A . . 20.00  . . . . . . 40.00  . . . . . .  14
IPC-J-STD-004A  . . . . 25.00  . . . . . . 50.00 . . . . . . .  10
IPC-0040 . . . . . . . . . . . 60.00  . . . . . 120.00 . . . . . . .  15
IPC-HDBK-005  . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  11
IPC/EIA J-STD-005 . . .  25.00  . . . . . . 50.00 . . . . . . .  10
SMC-WP-005 . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  15
IPC-WP-006  . . . . . . . .  20.00  . . . . . . 30.00 . . . . . . .  11
IPC J-STD-006B . . . . .  25.00  . . . . . . 50.00  . . . . . .  11
IPC-WP-008  . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  6
IPC-PWB-CERTCD01 125.00  . . . . . 225.00 . . . . . . .  28
IPC-PWB-CRT-SG01 . . 35.00  . . . . . . 70.00 . . . . . . .  28
IPC-PWBADV-SG02 . . 75.00  . . . . . 150.00 . . . . . . .  28
IPC-WAGEE-04 . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
IPC-WAGEP-04 . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
EMTF-05W . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
IPC-ROADMAP-05  . . . 125.00* . . . . . 250.00* . . . . . .  31
IPC-ELEC-06 . . . . . . .  100.00  . . . . . 150.00 . . . . . . .  35
IPC-EX-COMP-06 . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
IPC-EMTF-06-HSP  . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
IPC-EMTF-06-MED . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
IPC-EMTF-06E . . . . . . . . . . (1)  . . . . . . . . . (1) . . . . . . .  32
IPC-EMTF-06F . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
IPC-EMTF-06R  . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
IPC-EMTF-06T . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
IPC J-STD-012  . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  5
IPC J-STD-013  . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  5
IPC/JEDEC J-STD-020C 25.00  . . . . . . 50.00 . . . . . . . .  8
IPC/EIA J-STD-026 . . .  40.00  . . . . . . 80.00 . . . . . . . .  5
IPC J-STD-027  . . . . . .  20.00  . . . . . . 40.00 . . . . . . . .  5
IPC/EIA J-STD-028 . . .  40.00  . . . . . . 80.00 . . . . . . . .  5
IPC-J-STD-030 . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  11
IPC/EIA J-STD-032 . . .  20.00  . . . . . . 40.00 . . . . . . . .  6
IPC/JEDEC J-STD-033B 25.00  . . . . . . 50.00 . . . . . . . .  8
IPC/JEDEC J-STD-035 20.00  . . . . . . 40.00 . . . . . . . .  8
IPC-HDI-1  . . . . . . . . .  140.00  . . . . . 280.00 . . . . . . .  19
IPC-PTH2-D . . . . . . . . .  50.00  . . . . . . 75.00 . . . . . . .  39
IPC-P-SMT2-D . . . . . .  100.00  . . . . . 150.00 . . . . . . .  39
E3TOOL-CD . . . . . . . . .  99.00  . . . . . 149.00 . . . . . . .  34
IPC-PTH3-D . . . . . . . . .  50.00  . . . . . . 75.00 . . . . . . .  39
IPC-P-SMT3-D  . . . . .  100.00  . . . . . 150.00 . . . . . . .  39
IPC-DRM-18G  . . . . . . .  30.00  . . . . . . 60.00 . . . . . . . .  8
IPC-A-20/21-G-KIT . . .  75.00  . . . . . 150.00 . . . . . . .  36
IPC-A-22-D-KIT . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  36
IPC-A-22-G-KIT . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  36
IPC-A-24-G-KIT . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  36
IPC-A-25-D-KIT . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  36

IPC
Member	Nonmember	 Page
Price	price
IPC-A-25-G-KIT . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  36
IPC-A-25A-D-KIT . . . . .  65.00  . . . . . 130.00 . . . . . . .  36
IPC-A-25A-G-KIT . . . . .  65.00  . . . . . 130.00 . . . . . . .  36
IPC-A-36-G . . . . . . . . .  90.00  . . . . . 180.00 . . . . . . .  36
IPC-A-36-D . . . . . . . . . 175.00  . . . . . 350.00 . . . . . . .  36
IPC-A-40-F-KIT . . . . . . . 27.00  . . . . . . 54.00 . . . . . . .  36
IPC-A-41-D-KIT . . . . . .  55.00  . . . . .  110.00 . . . . . . .  36
IPC-A-41-F-KIT  . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  36
IPC-A-42-D-KIT . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  37
IPC-A-42-G-KIT . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  37
IPC-A-43-D-KIT . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
IPC-A-43-G-KIT . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
IPC-A-44-D-KIT . . . . .  165.00  . . . . . 330.00 . . . . . . .  37
IPC-A-44-F-KIT . . . . . . 110.00  . . . . . 220.00 . . . . . . .  37
IPC-A-47-D-KIT . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
IPC-A-47-G-KIT . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
IPC-A-50 . . . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  37
IPC-T-50G  . . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . . .  3
IPC-A-52G . . . . . . . . . .  50.00  . . . . . 100.00 . . . . . . .  37
IPC-DRM-53 . . . . . . . .  12.00  . . . . . . 24.00 . . . . . . . .  9
IPC-DRM-56 . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . . .  9
IPC-SC-60A . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . . .  7
IPC-SA-61A . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . . .  7
IPC-AC-62A . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . . .  7
IPC-CH-65A . . . . . . . . . 30.00  . . . . . . 60.00  . . . . . . .  6
IPC-EA-100-K  . . . . . . 220.00  . . . .  440.00 . . . . . . . .  4
IPC-M-102  . . . . . . . . 165.00  . . . . . 330.00 . . . . . . .  21
IPC-M-103  . . . . . . . . 330.00  . . . .  660.00 . . . . . . . .  9
IPC-M-104 . . . . . . . . . 165.00  . . . . . 330.00 . . . . . . . .  9
IPC-TP-104-K . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . . .  7
IPC-M-105 . . . . . . . . . 305.00  . . . . . 610.00 . . . . . . .  16
IPC-M-106 . . . . . . . . . 275.00  . . . . . 550.00 . . . . . . .  26
IPC-M-107 . . . . . . . . . 165.00  . . . . . 330.00 . . . . . . .  22
IPC-M-108 . . . . . . . . . . 90.00  . . . . . 180.00 . . . . . . . .  6
IPC-M-109 . . . . . . . . . . 85.00  . . . . . 170.00 . . . . . . . .  7
IPC-DD-135  . . . . . . . . 25.00  . . . . . . 50.00  . . . . . .  20
IPC-SG-141  . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
IPC-A-142  . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
IPC-QF-143  . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
IPC-CF-148A . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  22
IPC-CF-152B  . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
IPC-SKILL-201 . . . . . . .  75.00  . . . . . 150.00 . . . . . . .  31
IPC-DPMO-202 . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  13
IPC-FC-234  . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . .  22
IPC-FA-251  . . . . . . . . . 30.00  . . . . . . 60.00  . . . . . .  21
IPC-D-279 . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  28
IPC-D-310C  . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  28
IPC-A-311  . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  27
IPC-D-322 . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  28
IPC-D-325A . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  16
IPC-D-326A . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . .  16
IPC-PD-335 . . . . . . . .  195.00  . . . .  390.00 . . . . . . .  10

FD - Free Download

* - CD price

Product id	

40

(1) - See page for pricing

Product id	

IPC
Member	Nonmember	 Page
Price	price
IPC-D-356B . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  30
IPC-D-422 . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  28
IPC-TR-461  . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  14
IPC-TR-462 . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  15
IPC-TR-464 . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  15
IPC-TR-465-1 . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  15
IPC-TR-465-2 . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  15
IPC-TR-465-3  . . . . . . .  25.00  . . . . . . 50.00 . . . . . . .  15
IPC-TR-466 . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  15
IPC-TR-476A . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . . .  7
IPC-TR-481  . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  18
IPC-TR-483  . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  25
IPC-TR-485  . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  23
IPC-TR-486  . . . . . . . . .  50.00  . . . . . 100.00 . . . . . . .  25
IPC-TR-551  . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  18
IPC-DR-572 . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  19
IPC-TR-579  . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  18
IPC-TR-581  . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  10
IPC-TR-582  . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . . .  7
IPC-TR-583 . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . . .  7
IPC-WP/TR-584  . . . . .  25.00  . . . . . . 50.00 . . . . . . .  34
IPC-TR-585 . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  14
IPC-A-600G . . . . . . . . .  45.00  . . . . . . 90.00 . . . . . . .  17
IPC-A-600G-CH . . . . . . 45.00  . . . . . . 90.00 . . . . . . .  17
IPC-A-600G-IT  . . . . . .  45.00  . . . . . . 90.00 . . . . . . .  17
IPC-QE-605A . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  17
IPC-HDBK-610 . . . . . . .  40.00  . . . . . . 80.00 . . . . . . . .  4
IPC-A-610D . . . . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-CH . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-DE . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-DK . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-FI . . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-FR . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-IT . . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-PL . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-SP . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-SW . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC-A-610D-VN . . . . . .  50.00  . . . . . 100.00 . . . . . . . .  4
IPC/WHMA-A-620A . .  50.00  . . . . . 100.00 . . . . . . . .  5
IPC-TM-650 . . . . . . . .  220.00  . . . .  440.00 . . . . . . . .  3
IPC-QL-653A . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  25
IPC-MI-660 . . . . . . . . .  60.00  . . . . . 120.00 . . . . . . .  22
IPC-TA-724 . . . . . . . . . .  70.00  . . . . . 140.00 . . . . . . . .  9
IPC-PE-740A  . . . . . . .  105.00  . . . . . 210.00 . . . . . . .  16
IPC-CM-770E  . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  13
IPC-SM-780 . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . . .  9
IPC-SM-784 . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . . .  5
IPC-SM-785 . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . . .  9
IPC-MC-790 . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . . .  6
IPC-MS-810 . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  25
IPC-S-816  . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  13
IPC-SM-817 . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  11
Product id	

www.ipc.org/onlinestore

IPC
Member	Nonmember	 Page
Price	price
IPC-AJ-820 . . . . . . . .  220.00  . . . .  440.00 . . . . . . .  12
IPC-CA-821  . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  11
IPC-HDBK-830  . . . . . .  45.00  . . . . . . 90.00 . . . . . . .  12
IPC-CC-830B . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  12
IPC-SM-839  . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  19
IPC-SM-840C . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  12
IPC-D-859 . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  27
IPC-HM-860 . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  17
IPC-TF-870 . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  17
IPC-ML-960 . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  18
IPC-1065 . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  34
IPC-1066 . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . .  34
IPC-TP-1090 . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  13
IPC-TP-1113 . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  6
IPC-TP-1114 . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  12
IPC-TP-1115 . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  13
IPC-1331  . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  34
IPC-1710A . . . . . . . . . . . .  FD  . . . . . . . .  FD . . . . . . .  31
IPC-1720A . . . . . . . . . . . . . FD  . . . . . . . .  FD . . . . . . .  31
IPC-1730A . . . . . . . . . . . .  FD  . . . . . . . .  FD . . . . . . .  31
IPC-1731  . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  31
IPC-1752  . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  34
IPC-1902 . . . . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . .  27
SPVC2005-CD . . . . . . .  99.00  . . . . . 199.00 . . . . . . .  35
IPC-2141A . . . . . . . . . . 30.00  . . . . . . 60.00  . . . . . .  20
IPC-2220 . . . . . . . . . . . 80.00  . . . . . 160.00 . . . . . . .  26
IPC-2221A . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  26
IPC-2222 . . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  26
IPC-2223A . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  26
IPC-2224 . . . . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . .  26
IPC-2225 . . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  26
IPC-2226 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  27
IPC-2251 . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  20
IPC-2252 . . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  20
IPC/JPCA-2315 . . . . . . 45.00  . . . . . . 90.00 . . . . . . .  27
IPC-2501 . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  28
IPC-2511A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
IPC-2511B  . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2512A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2513A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2514A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2515A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2516A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2517A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2518A . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2524 . . . . . . . . . . . . .  FD  . . . . . . . . . FD . . . . . . .  24
IPC-2531 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  28
IPC-2541 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
IPC-2546 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
IPC-2547 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
IPC-2571 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
IPC-2576 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
Product id	

FD - Free Download

IPC
Member	Nonmember	 Page
Price	price
IPC-2578 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  29
IPC-2581 . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  30
IPC-2615  . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  27
IPC-3406 . . . . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . .  11
IPC-3408 . . . . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . .  12
IPC-4101B . . . . . . . . . . 45.00  . . . . . . 90.00 . . . . . . .  22
IPC-4103 . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  20
IPC/JPCA-4104 . . . . . 45.00  . . . . . . 90.00 . . . . . . .  19
IPC-4110  . . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  23
IPC-4121  . . . . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . .  22
IPC-4130 . . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  23
IPC-4202 . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  21
IPC-4203 . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  21
IPC-4204 . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  21
IPC-4411A . . . . . . . . . . 45.00  . . . . . . 90.00  . . . . . .  23
IPC-4412A . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  23
IPC-4552 . . . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . .  18
IPC-4553 . . . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  18
IPC-4562 . . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  22
IPC-4761 . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  18
IPC-4821 . . . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  22
IPC-5701 . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  6
IPC-6010-SERIES  . . .  110.00  . . . . . 220.00 . . . . . . .  16
IPC-6011 . . . . . . . . . . .  15.00  . . . . . . 30.00 . . . . . . .  16
IPC-6012B  . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  16
IPC-6012B-IT . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  16
IPC-6013A . . . . . . . . . . 45.00  . . . . . . 90.00 . . . . . . .  21
IPC-6015 . . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  17
IPC-6016 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  19
IPC-6018A . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  21
IPC/JPCA-6202 . . . . . . 45.00  . . . . . . 90.00 . . . . . . .  21
IPC/JPCA-6801 . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  19
IPC-7095A . . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . . .  6
IPC-7351  . . . . . . . . . . .  50.00  . . . . . 100.00 . . . . . . .  27
IPC-7525 . . . . . . . . . . . 20.00  . . . . . . 40.00 . . . . . . .  10
IPC-7530 . . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  12
IPC-7711/21A . . . . . . .  125.00  . . . . . 250.00 . . . . . . .  14
IPC-7912A . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  13
IPC-8413-1 . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  15
IPC-8497-1 . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  15
IPC-9151A . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  24
IPC-9191 . . . . . . . . . . . 35.00  . . . . . . 70.00  . . . . . .  24
IPC-9194 . . . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . .  24
IPC-9199 . . . . . . . . . . . 35.00  . . . . . . 70.00 . . . . . . .  24
IPC-9201 . . . . . . . . . . . 45.00  . . . . . . 90.00 . . . . . . . .  7
IPC-9251 . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  36
IPC-9252  . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  25
IPC-9261 . . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . .  13
IPC-9591 . . . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . . .  3
IPC-9691 . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  24
IPC-9701A . . . . . . . . . . 25.00  . . . . . . 50.00 . . . . . . . .  9
IPC/JEDEC-9702 . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  9
Product id	

IPC
Member	Nonmember	 Page
Price	price
IPC/JEDEC-9704 . . . . .  20.00  . . . . . . 40.00 . . . . . . .  10
IPC-9850-K . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . .  14
IPC-9850-TM-K . . . . . . . . Call  . . . . . . . . Call . . . . . . .  14
IPC-9850-TM-KW . . . . . . Call  . . . . . . . . Call . . . . . . .  14
IT-30101  . . . . . . . . . . 950.00  . . . 1,900.00 . . . . . . .  20
IT-95080 . . . . . . . . . . 150.00  . . . .  300.00 . . . . . . .  19
IT-96060 . . . . . . . . . . 150.00  . . . .  300.00 . . . . . . .  20
IT-97061  . . . . . . . . . . 150.00  . . . .  300.00 . . . . . . .  25
IT-97071  . . . . . . . . . . 250.00  . . . .  500.00 . . . . . . .  20
IT-98103  . . . . . . . . . . 150.00  . . . .  300.00 . . . . . . .  25
IT-98123  . . . . . . . . . . 150.00  . . . .  300.00  . . . . . .  20
ELEC-ELEC . . . . . . . . .  100.00  . . . . . 125.00 . . . . . . .  35
ELEC-RELIA . . . . . . . .  150.00  . . . . . 175.00 . . . . . . .  35
ELEC-MICRO . . . . . . . . 175.00  . . . . . 220.00 . . . . . . .  35
ELEC-SOLDER . . . . . .  100.00  . . . . . 100.00 . . . . . . .  13
IPC-ENVIRONMENT . . 75.00  . . . . . 150.00 . . . . . . .  34
IPC-PWBADV-CD . . .  185.00  . . . . . 285.00 . . . . . . .  28
IPC-DRM-SMT-D  . . . .  15.00  . . . . . . 30.00 . . . . . . . .  8
IPC-DRM-PTH-D . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  8
RoHS-AUDIT-CD . . . . . . CALL  . . . . . . . CALL . . . . . . .  34
Product id	

(1) - See page for pricing

www.ipc.org/onlinestore

Prices are subject to change –
check the online store.

41

a l p h a / n u m e ri c pri c e l ist
IPC
Member	Nonmember	 Page
Price	price
0040  . . . . . . . . . . . . . .  60.00  . . . . . 120.00 . . . . . . .  15
1065  . . . . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  34
1066  . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . .  34
1331 . . . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  34
1710A  . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  31
1720A  . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  31
1730A  . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  31
1731 . . . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  31
1752 . . . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  34
1902  . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . .  27
2141A . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  20
2220  . . . . . . . . . . . . . .  80.00  . . . . . 160.00  . . . . . .  26
2221A  . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  26
2222  . . . . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  26
2223A . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  26
2224 . . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . .  26
2225  . . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  26
2226  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  27
2251 . . . . . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  20
2252  . . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  20
2315 . . . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  27
2501  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  28
2511A . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  29
2511B . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2512A  . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2513A  . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2514A  . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2515A  . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2516A  . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2517A . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2518A  . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  30
2524 . . . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  24
2531 . . . . . . . . . . . . . . . 35.00  . . . . . . 70.00  . . . . . .  28
2541 . . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  29
2546  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  29
2547  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  29
2571 . . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  29
2576 . . . . . . . . . . . . . . . 35.00  . . . . . . 70.00  . . . . . .  29
2578  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  29
2581  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  30
2615 . . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  27
3406  . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . .  11
3408  . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . .  12
4101B . . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  22
4103 . . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  20
4104 . . . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  19
4110 . . . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
4121 . . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . .  22
4130 . . . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
4202  . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  21
4203  . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  21
4204  . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  21
Product id	

FD - Free Download

42

IPC
Member	Nonmember	 Page
Price	price
4411A . . . . . . . . . . . . . . 45.00  . . . . . . 90.00  . . . . . .  23
4412A  . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  23
4552  . . . . . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . .  18
4553  . . . . . . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  18
4562  . . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  22
4761 . . . . . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  18
4821  . . . . . . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  22
5701 . . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  6
6010 SERIES . . . . . . . . 110.00  . . . . . 220.00 . . . . . . .  16
6011 . . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . .  16
6012B  . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  16
6012B-IT . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  16
6013-A . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  21
6015 . . . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  17
6016 . . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  19
6018A  . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  21
6202  . . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  21
6801  . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  19
7095A . . . . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  6
7351 . . . . . . . . . . . . . . .  50.00  . . . . . 100.00 . . . . . . .  27
7525 . . . . . . . . . . . . . . . 20.00  . . . . . . 40.00  . . . . . .  10
7530  . . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  12
7711/21A . . . . . . . . . . . 125.00  . . . . . 250.00 . . . . . . .  14
7912A  . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  13
8413-1 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  15
8497-1 . . . . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  15
9151A . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  24
9191 . . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  24
9194 . . . . . . . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . .  24
9199 . . . . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  24
9201  . . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . . .  7
9251 . . . . . . . . . . . . . . . . . . FD  . . . . . . . . . FD . . . . . . .  36
9252  . . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  25
9261  . . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  13
9591  . . . . . . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . . .  3
9691  . . . . . . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  24
9701A  . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  9
9702  . . . . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  9
9704  . . . . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  10
9850-K  . . . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . .  14
9850-TM-K . . . . . . . . . . . Call  . . . . . . . . Call . . . . . . .  14
9850-TM-KW . . . . . . . . . Call  . . . . . . . . Call . . . . . . .  14
A-20/21-GKIT  . . . . . . .  75.00  . . . . . 150.00 . . . . . . .  36
A-22-D-KIT  . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  36
A-22-G-KIT  . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  36
A-24-G-KIT  . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  36
A-25-D-KIT . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  36
A-25-G-KIT . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  36
A-25A-D-KIT . . . . . . . .  65.00  . . . . . 130.00 . . . . . . .  36
A-25A-G-KIT . . . . . . . .  65.00  . . . . . 130.00 . . . . . . .  36
A-36-D . . . . . . . . . . . . 175.00  . . . . . 350.00 . . . . . . .  36
A-36-G  . . . . . . . . . . . .  90.00  . . . . . 180.00 . . . . . . .  36
Product id	

IPC
Member	Nonmember	 Page
Price	price
A-40-F-KIT  . . . . . . . . . . 27.00  . . . . . . 54.00 . . . . . . .  36
A-41-D-KIT  . . . . . . . . .  55.00  . . . . .  110.00 . . . . . . .  36
A-41-F-KIT . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  36
A-42-D-KIT . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  37
A-42-G-KIT . . . . . . . . .  30.00  . . . . . . 60.00 . . . . . . .  37
A-43-D-KIT . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
A-43-G-KIT . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
A-44-D-KIT . . . . . . . .  165.00  . . . . . 330.00 . . . . . . .  37
A-44-F-KIT  . . . . . . . . . 110.00  . . . . . 220.00 . . . . . . .  37
A-47-D-KIT . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
A-47-G-KIT  . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  37
A-50 . . . . . . . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . .  37
A-52G  . . . . . . . . . . . . .  50.00  . . . . . 100.00 . . . . . . .  37
A-142 . . . . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  23
A-311 . . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  27
A-600G . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  17
A-600G-CH . . . . . . . . .  45.00  . . . . . . 90.00 . . . . . . .  17
A-600G-IT . . . . . . . . . .  45.00  . . . . . . 90.00 . . . . . . .  17
A-610D  . . . . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-CH . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-DE . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-DK . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-FI . . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-FR  . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-IT . . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-PL . . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-SP  . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-SW . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-610D-VN . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  4
A-620A . . . . . . . . . . . .  50.00  . . . . . 100.00  . . . . . . .  5
AC-62A . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  7
AJ-820  . . . . . . . . . . .  220.00  . . . . . 440.00  . . . . . .  12
CA-821  . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  11
CC-830B . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  12
CF-148A . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  22
CF-152B . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
CH-65A . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . . .  6
CM-770E . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  13
D-279 . . . . . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  28
D-310C  . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  28
D-322 . . . . . . . . . . . . . . 20.00  . . . . . . 40.00  . . . . . .  28
D-325A . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  16
D-326A . . . . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . .  16
D-356B  . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  30
D-422  . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  28
D-859  . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  27
DD-135  . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  20
DPMO-202  . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  13
DR-572  . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  19
DRM-18G  . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . . .  8
DRM-53 . . . . . . . . . . . . 12.00  . . . . . . 24.00  . . . . . . .  9
DRM-56  . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  9
Product id	

(1) - See page for pricing

www.ipc.org/onlinestore

IPC
Member	Nonmember	 Page
Price	price
DRM-PTH-D . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  8
DRM-SMT-D . . . . . . . . . 15.00  . . . . . . 30.00  . . . . . . .  8
E3TOOL-CD . . . . . . . . .  99.00  . . . . . 149.00 . . . . . . .  34
EA-100K  . . . . . . . . . .  220.00  . . . . . 440.00 . . . . . . . .  4
ELEC-06 . . . . . . . . . . .  100.00  . . . . . 150.00 . . . . . . .  35
ELEC-ELEC . . . . . . . . .  100.00  . . . . . 125.00 . . . . . . .  35
ELEC-MICRO . . . . . . . . 175.00  . . . . . 220.00 . . . . . . .  35
ELEC-RELIA . . . . . . . .  150.00  . . . . . 175.00 . . . . . . .  35
ELEC-SOLDER . . . . . .  100.00  . . . . . 100.00 . . . . . . .  13
EMTF-05W . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
EMTF-06E . . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
EMTF-06F . . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
EMTF-06R . . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
EMTF-06T . . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  32
EMTF-06HSP  . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
EMTF-06MED . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
ENVIRONMENT  . . . . .  75.00  . . . . . 150.00 . . . . . . .  34
EXCOMP-06  . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
FA-251 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  21
FC-234 . . . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . .  22
HDBK-001 . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  4
HDBK-005 . . . . . . . . . .  35.00  . . . . . . 70.00 . . . . . . .  11
HDBK-610 . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  4
HDBK-830 . . . . . . . . . .  45.00  . . . . . . 90.00  . . . . . .  12
HDI-1 . . . . . . . . . . . . .  140.00  . . . . . 280.00  . . . . . .  19
HM-860 . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  17
IT-30101  . . . . . . . . . .  950.00  . . . . 1900.00 . . . . . . .  20
IT-95080 . . . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  19
IT-96060 . . . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  20
IT-97061  . . . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  25
IT-97071  . . . . . . . . . .  250.00  . . . . . 500.00 . . . . . . .  20
IT-98103  . . . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  25
IT-98123  . . . . . . . . . .  150.00  . . . . . 300.00 . . . . . . .  20
J-STD-001D  . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  4
J-STD-001DSP . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  4
J-STD-001DSW  . . . . .  40.00  . . . . . . 80.00  . . . . . . .  4
J-STD-002B  . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  14
J-STD-003A . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  14
J-STD-004A . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  10
J-STD-005  . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  10
J-STD-006B . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  11
J-STD-012 . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  5
J-STD-013 . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  5
J-STD-020C  . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  8
J-STD-026 . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  5
J-STD-027 . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . . .  5
J-STD-028 . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  5
J-STD-030  . . . . . . . . .  40.00  . . . . . . 80.00 . . . . . . .  11
J-STD-032 . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . . .  6
J-STD-033B  . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  8
J-STD-035 . . . . . . . . . . 20.00  . . . . . . 40.00  . . . . . . .  8
M-102 . . . . . . . . . . . .  165.00  . . . . . 330.00  . . . . . .  21
Product id	

FD - Free Download

IPC
Member	Nonmember	 Page
Price	price
M-103 . . . . . . . . . . . .  330.00  . . . . . 660.00  . . . . . . .  9
M-104 . . . . . . . . . . . .  165.00  . . . . . 330.00  . . . . . . .  9
M-105 . . . . . . . . . . . .  305.00  . . . . . 610.00  . . . . . .  16
M-106 . . . . . . . . . . . .  275.00  . . . . . 550.00  . . . . . .  26
M-107 . . . . . . . . . . . .  165.00  . . . . . 330.00  . . . . . .  22
M-108 . . . . . . . . . . . . .  90.00  . . . . . 180.00  . . . . . . .  6
M-109 . . . . . . . . . . . . .  85.00  . . . . . 170.00  . . . . . . .  7
MC-790 . . . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  6
MI-660  . . . . . . . . . . . .  60.00  . . . . . 120.00 . . . . . . .  22
ML-960 . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  18
MS-810 . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  25
P-PTH2-D . . . . . . . . . . .  50.00  . . . . . . 75.00  . . . . . .  39
P-PTH3-D  . . . . . . . . . .  50.00  . . . . . . 75.00  . . . . . .  39
P-SMT2-D . . . . . . . . .  100.00  . . . . . 150.00  . . . . . .  39
P-SMT3-D . . . . . . . . .  100.00  . . . . . 150.00  . . . . . .  39
PD-335  . . . . . . . . . . .  195.00  . . . . . 390.00  . . . . . .  10
PE-740A . . . . . . . . . . .  105.00  . . . . . 210.00  . . . . . .  16
PWB-CERTCD01 . . . . . 125.00  . . . . . 225.00  . . . . . .  28
PWB-CRT-SG01  . . . . .  35.00  . . . . . . 70.00  . . . . . .  28
PWBADV-CD . . . . . . .  185.00  . . . . . 285.00  . . . . . .  28
PWBADV-SG02 . . . . . .  75.00  . . . . . 150.00  . . . . . .  28
QE-605A . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . .  17
QF-143 . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
QL-653A  . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  25
ROADMAP-05 . . . . . . . 125.00  . . . . . 250.00 . . . . . . .  31
RoHSAUDIT-CD . . . . . . . CALL  . . . . . . . CALL . . . . . . .  34
S-816 . . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  13
SA-61A . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  7
SC-60A . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . . .  7
SG-141 . . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
SKILL-201  . . . . . . . . . .  75.00  . . . . . 150.00 . . . . . . .  31
SM-780 . . . . . . . . . . . .  35.00  . . . . . . 70.00  . . . . . . .  9
SM-784 . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . . .  5
SM-785 . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  9
SM-817 . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  11
SM-839 . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  19
SM-840C . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  12
SMC-WP-001 . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  15
SMC-WP-005 . . . . . . . . . . FD  . . . . . . . . . FD  . . . . . .  15
SPVC2005-CD . . . . . . .  99.00  . . . . . 199.00 . . . . . . .  35
T-50G . . . . . . . . . . . . . .  40.00  . . . . . . 80.00  . . . . . . .  3
TA-724 . . . . . . . . . . . . .  70.00  . . . . . 140.00  . . . . . . .  9
TF-870 . . . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  17
TM-650 . . . . . . . . . . .  220.00  . . . . . 440.00  . . . . . . .  3
TP-104-K . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . . .  7
TP-1090 . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  13
TP-1113  . . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  6
TP-1114  . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  12
TP-1115  . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  13
TR-461 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  14
TR-462 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  15
TR-464 . . . . . . . . . . . . . 30.00  . . . . . . 60.00  . . . . . .  15
Product id	

IPC
Member	Nonmember	 Page
Price	price
TR-465-1 . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  15
TR-465-2 . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  15
TR-465-3 . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . .  15
TR-466  . . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  15
TR-476A  . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . . .  7
TR-481 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  18
TR-483 . . . . . . . . . . . . . 30.00  . . . . . . 60.00 . . . . . . .  25
TR-485  . . . . . . . . . . . .  20.00  . . . . . . 40.00  . . . . . .  23
TR-486  . . . . . . . . . . . .  50.00  . . . . . 100.00  . . . . . .  25
TR-551 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  18
TR-579 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . .  18
TR-581 . . . . . . . . . . . . .  20.00  . . . . . . 40.00 . . . . . . .  10
TR-582 . . . . . . . . . . . . .  25.00  . . . . . . 50.00  . . . . . . .  7
TR-583 . . . . . . . . . . . . .  30.00  . . . . . . 60.00  . . . . . . .  7
TR-585 . . . . . . . . . . . . . 40.00  . . . . . . 80.00 . . . . . . .  14
WAGEE-04  . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
WAGEP-04  . . . . . . . . . . . .  (1)  . . . . . . . . . (1) . . . . . . .  33
WP-006 . . . . . . . . . . . .  20.00  . . . . . . 30.00 . . . . . . .  11
WP-008 . . . . . . . . . . . . . 15.00  . . . . . . 30.00 . . . . . . . .  6
WP/TR-584 . . . . . . . . .  25.00  . . . . . . 50.00 . . . . . . .  34
Product id	

(1) - See page for pricing

www.ipc.org/onlinestore

Prices are subject to change –
check the online store.

43

appl ic ation f or ip c me mbe rs h ip
Site Information:

Company Name
Street Address
City

State

Zip/Postal Code Country

Main Switchboard Phone No.

Main Fax

Name of Primary Contact
Title

Mail Stop

Phone

Fax

Company e-mail address

Website URL

E-mail

Please Check One:
c $1,000.00	Annual dues for Primary Site Membership (twelve months of IPC membership begins from the time the application and payment are received.)
c

$800.00	Annual dues for Additional Facility Membership: additional membership for a site within an organization where another site is considered to be the
primary IPC member.

c

$600.00

Annual dues for an independent PCB/PWA fabricator or independent EMS provider with annual sales of less than $1,000,000.

c

$250.00

Annual dues for Government Agency/not-for-profit organization

EMTF Membership
Please send me information about membership in the Executive Market Technology Forum (EMTF)

c

*Purchase orders are not accepted as payment toward your membership.
Payment Information:
Enclosed is our check for $_________________ (U.S. dollars)
Please bill my credit card: (check one)

c

MC

c

AMEX

c

Card No.

VISA

c

DINERS

Expiration date

Authorized Signature

Mail application with check or money order to:
IPC
3491 Eagle Way
Chicago, IL 60678-1349

type of company (check one)
c

Independent Printed Board Manufacturers

c

Independent Electronics Assembly EMSI Company

c

*Fax/Mail application with credit card payment to:
IPC
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL 60015
Tel: 847-615-7100
Fax: 847-615-7105
http://www.ipc.org
*Overnight deliveries to this address only.

OEM–Manufacturer of any end product using PCB/PCAs or Captive
Manufacturer of PCBs/PCAs

c

Industry Supplier

c

Government Agency/Academic Technical Liaison

IPC’s

o rd e r f o r m

Quantity Discounts
Resale
For Member and Nonmember companies:
Only authorized distributors may purchase IPC
materials for resale.
Standards/
Videotapes:
Proceedings
Distributors
20-99  . . . . 10%
5 or more . . . . . . . 10%
Visit the IPC online store for a list of IPC authorized
100 + . . . . 20%
10 or more . . . .  20%
international distributors.
Please note: Document quantity discounts are only
Shipping and Handling
available when multiple copies of the same item
For applicable shipping and handling charges,
are purchased.
please call customer service at 847-597-2862 or
Prices
e-mail orderipc@ipc.org.
Prices are subject to change or correction. Prices
Customer Carrier Account
charged will be based on the IPC online store. Prices
Orders shipped via company carrier account will
including shipping and handling are available by callincur a $10.00 handling charge.
ing 847-597-2862. Quotes are valid for 90 days.

Bi ll To (Available for IPC Members only)**

Returns
Items must be returned within 21 days of receipt.
Exceptions apply, so please contact IPC customer
service staff at 847-597-2862 to ensure proper
credit.
Only IPC members can use purchase orders. Nonmember
orders must be prepaid.
Orders received before 12:30 pm (Central Time) will be sent
to the warehouse on the same day.

Ship to

5 EASY WAYS TO ORDER

/

Name_______________________________________________

Name_______________________________________________

Title/MS_____________________________________________

Title/MS_____________________________________________

Company_____________________________________________

Company_____________________________________________

Address_ ____________________________________________

Address_ ____________________________________________

3491 Eagle Way

City/State/Zip_________________________________________

City/State/Zip_________________________________________

Chicago, IL 60678-1349

Country______________________________________________

Country______________________________________________

Phone_______________________________________________

Phone_______________________________________________

Fax_________________________________________________

Fax_________________________________________________

(please include any country and area codes)

(please include any country and area codes)

E-mail Address_ _______________________________________

E-mail Address_ _______________________________________

IP C Do c u m ents and T raining
Product #/Description

Price Each

IPC

)

Phone

847-597-2862
(payment by credit card only)

**In order for IPC members to receive member pricing, both “Bill To” and “Ship To” addresses must be the same member address.**

Quantity

Mail

Total

2)
Fax

847-615-7114

@

E-mail
orderipc@ipc.org
Customer Service representative will apply appropriate shipping and handling charges — just fill out quantities,

				
descriptions and prices and let us do the math for you. If prepaying by wire or by check, please call 847-597-2862 or
e-mail orderipc@ipc.org for exact freight charges.
				
				

IL Residents
add
7.75% tax
__________________________

Payme nt M et h od

Billing is available for IPC Members only. Nonmembers need to prepay. Contact Customer Service for shippng and
				
handling costs.
				
o Check enclosed
o B ill me (my P.O.# is)
				
Credit Card Purchase o AMEX o Visa o MC o Diners
Card #							
Cardholder’s Name				

Subtotal
__________________________

Exp Date

Phone

Signature

Fax: 847-615-7114 Mail: IPC, 3491 Eagle Way, Chicago, IL 60678-1349
This catalog lists current pricing. Prices are subject to change. Catalog items are not for resale without permission
from or agreement with IPC.

Shipping and
Handling

__________________________
Total
__________________________
o Sign me up to receive IPC e-mails on
relevant events and new releases. I
understand that I can opt-out at any
time.
o I do not wish to receive e-mails about
relevant IPC events and new releases.

8
Online
www.ipc.org/onlinestore
(payment by credit card only)

Tuesday – Thursday
February 20 – 22, 2007
February 19 – 21, 2008
Los Angeles Convention Center
Los Angeles, California
For more information
877-472-4724 (U.S./Canada)
847-597-2860 (International)
shows@ipc.org

3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015-1249

ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES ®

www.GoIPCShows.org

2007 – 2008



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Manifest Placed Resolution Unit : Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches, Inches
Manifest Reference Instance ID  : uuid:09147B34246B11DBBAFBC865B968F25E, uuid:0E25536709D211DBAE66B8D47B1F34F6, uuid:46772CA2305911DBA01AB1E1ED7A7E2B, uuid:FDA94D9823A111DB993EF613E579A8F5, uuid:C998055F2AC011DBA68FC4F2CD1031B0, uuid:09147B34246B11DBBAFBC865B968F25E, uuid:1D422A92336311DBB10CCE146E8C7DFB, uuid:46772CA2305911DBA01AB1E1ED7A7E2B, uuid:C998055F2AC011DBA68FC4F2CD1031B0, uuid:1E417F1C013711DBB9E1E7EF1ABD368B, uuid:1E417F1C013711DBB9E1E7EF1ABD368B, uuid:09147B38246B11DBBAFBC865B968F25E, uuid:1E417F1C013711DBB9E1E7EF1ABD368B, uuid:1E417F1E013711DBB9E1E7EF1ABD368B, uuid:1D422A92336311DBB10CCE146E8C7DFB, uuid:1E417F1C013711DBB9E1E7EF1ABD368B, uuid:C998055F2AC011DBA68FC4F2CD1031B0, uuid:0E25536709D211DBAE66B8D47B1F34F6, uuid:BF21E95B305511DB9F328520541E7DD2, uuid:6D336431305511DB9F328520541E7DD2, uuid:295B71771FB411DBA5CEE63D67B0BE56, uuid:1E417F1A013711DBB9E1E7EF1ABD368B, uuid:1E417F1A013711DBB9E1E7EF1ABD368B, uuid:0E25536709D211DBAE66B8D47B1F34F6, 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Create Date                     : 2006:09:05 13:50:01-05:00
Modify Date                     : 2009:05:11 11:39:23-05:00
Metadata Date                   : 2009:05:11 11:39:23-05:00
Creator Tool                    : Adobe InDesign CS2 (4.0.4)
Thumbnail Format                : JPEG
Thumbnail Width                 : 256
Thumbnail Height                : 256
Thumbnail Image                 : (Binary data 2172 bytes, use -b option to extract)
Format                          : application/pdf
Producer                        : Adobe PDF Library 7.0
Trapped                         : False
Has XFA                         : No
Page Count                      : 48
Creator                         : Adobe InDesign CS2 (4.0.4)
EXIF Metadata provided by EXIF.tools

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