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User Manual: Symbol Technologies Credit Card Machine P D T 8 1 0 0 S E R I E S

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STANDARDS

GUIDELINES

ARTWORK

VISUAL TOOLS

DESIGN > PRINTED CIRCUIT BOARDS > ELECTRONICS ASSEMBLY > TEST

IPC

CATALOG

2007 – 2008

W E L C O M E

IPC LOCATIONS

IPC

3000 Lakeside Drive, Suite 309 S

Bannockburn, IL 60015-1249

General Phone: 847-615-7100

Fax: 847-615-7105

Customer Service: 847-597-2862

Customer Service Fax: 847-615-7114

IPC Training/Video Office

P.O. Box 389

7200 Highway 518

Ranchos de Taos, NM 87557

Phone: 505-758-7937

Fax: 505-758-7938

E-mail: service@ipcvideo.org

IPC Government Relations/EHS office

1901 N. Moore Street

Arlington, VA 22209

Phone: 703-522-0225

Fax: 703-522-0548

IPC Global Technology Management

Consulting (Shanghai) Co. Ltd.

711 Yishan Rd.

Xuhui District

Shanghai 200233

PR of China

Phone: +86 21 5497 3435 / 3436

Fax: +86 21 5497 3437

E-mail: infoasia@ipc.org

IPC European Representative Office

Gurlitavagen 17

S-168 39 Bromma

Sweden

Phone: +46 8 26 10 07

Cell: +46 70 212 74 39

Fax: +46 8 26 48 29

E-mail: LarsWallin@ipc.org

MISSION STATEMENT

IPC is a United States-based trade association dedicated to furthering the competitive excel-

lence and financial success of its members worldwide, who are participants in the electronic

interconnect industry.

In pursuit of these objectives, IPC will devote resources to management improvement and

technology enhancement programs, the creation of relevant standards, protection of the

environment and pertinent government relations.

Dear Colleague,

Welcome to IPC’s 2007 – 2008 Publications Catalog. Today

more than ever, it’s important that your company stay on

top of what’s happening in the industry. From information

on new lead free legislation to materials declaration re-

sources, IPC has what you need to keep up with the trends

and requirements in PCB and electronics assembly.

We have added many new documents and standards

since the last printing of this catalog in 2004 — look for the notation.

Please take some time to review these pages carefully — I'm sure you'll find

timely and relevant information to improve your company’s operations.

Make sure your company has our standards that have been updated for lead

free.

We have introduced several new documents on lead free and have added

lead free icons

PbPb

to relevant documents. Let IPC help you today.

Kudos to IPC committee members.

As I do every year, I’d like to extend a special

thanks to our volunteer committee members. It is only through their work —

researching, reviewing, developing and updating — that we can offer these

valuable publications and standards. We can always use more volunteers, and I

hope you'll consider bringing your expertise to the table by joining a committee.

Best regards,

Denny McGuirk

President, IPC

Tuesday – Thursday

FEBRUARY 20 – 22, 2007

FEBRUARY 19 – 21, 2008

Los Angeles Convention Center

Los Angeles, California

FOR MORE INFORMATION

877-472-4724 (U.S./Canada)

847-597-2860 (International)

shows@ipc.org

www.GoIPCShows.org

1

TABLE OF CONTENTS

IPC Certification Programs . . . . . . . . . . . . 2

General . . . . . . . . . . . . . . . . . . . 3

Electronics Assembly . . . . . . . . . . . . . . 4

Printed Circuit Boards . . . . . . . . . . . . . .16

Design . . . . . . . . . . . . . . . . . . . 26

Management, Market Research . . . . . . . . . .31

and Roadmaps

Environmental Compliance . . . . . . . . . . . 34

Lead Free . . . . . . . . . . . . . . . . . 35

Artwork for Test Coupons . . . . . . . . . . . . 36

Multimedia Training Resources. . . . . . . . . . 38

Images and Posters . . . . . . . . . . . . . . 39

Product Index/Price List . . . . . . . . . . . . 40

Order Form . . . . . . . . . . . . inside back cover

5 EASY WAYS TO ORDER

See the inside back cover for more ordering information.

/

Mail

IPC

3491 Eagle Way

Chicago, IL 60678-1349

Phone

847-597-2862

(payment by

credit card only)

Fax

847-615-7114

E-mail

orderipc@ipc.org

Online

www.ipc.org/onlinestore

(payment by credit card only)

)) 2

)

2

)@@ 88

www.ipc.org/onlinestore

THE RIGHT FORMAT FOR YOU!

To meet your individual needs, IPC documents are available in a variety of

formats.

• Hard copy

• CD (print restrictions apply)

• Download (print restrictions apply)

• Kit (hard copy and CD)

• Site and global licenses (no print restrictions)

The electronic formats enable keyword search so it’s easier to find what you’re

looking for. Prices for CD or download are for single user licenses.

Single user CD or download allows one user to access the document from one

standalone computer. Printing is limited to one page at a time (a screen shot).

Placing a single-user license on any network is not permitted.

Documents that are offered as hard copy and in electronic format can also be

purchased as a “Kit”. Kit pricing is available by calling customer service at

847-597-2862 or visiting the online store.

UPDATED FOR LEAD FREE

PbPb

This symbol denotes that the document has been updated for or is

applicable to lead free. See page 35 for additional lead free publications.

LICENSES – GO GLOBAL WITH IPC STANDARDS

Put IPC resources at your fingertips with an annual global

license covering all IPC standards. You can now add all IPC

standards, guidelines and electronically available proceed-

ings onto your company's network – at multiple locations.

Companies who invest in the global license provide their

key employees with access to a wealth of information.

Benefits include:

• New and updated documents

• Unlimited downloading and printing

• Unlimited users

• Consistency across all operations

• Better quality and communication

20% of company's sites accessing the documents must be IPC members.

Call IPC Membership Records staff at 847-597-2809 for more information and

global license pricing.

SIGN UP TO BE NOTIFIED OF IPC'S

NEW RELEASES

Keep up to date! Join the New Releases listserv to receive immediate e-mail

notification about new and revised IPC documents. To subscribe to this free

service, send an e-mail to newreleases@ipc.org.

HOW THIS CATALOG IS ORGANIZED

Documents are grouped by the subjects in the Table of Contents. Many docu-

ments have related documents that cannot be listed due to space considerations.

For a complete listing of related documents, go to www.ipc/onlinestore.

There are two indices in the back of this catalog. The first is alphabetized by

product code, the second is in numerical order.

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2

I P C C E R T I F I C A T I O N P R O G R A M S

Focus on Job Function

Earn the credential that gives you the edge

over other professionals in today's competitive job

market. Developed by experts in the field, the pro-

grams provide comprehensive training that will help

you do your job better and increase your marketabil-

ity. Insure your future success with IPC certification

programs.

IPC EMS PROGRAM MANAGER TRAINING

AND CERTIFICATION

Four-part training and testing program provides

comprehensive, multi-focused education on business

topics such as operations, finance and contracts as

well as program and time management and leader-

ship training.

CERTIFIED INTERCONNECT DESIGNER (C.I.D.)

Comprehensive training and testing program to

assess a designer's knowledge of how to transform

a schematic into a reliable rigid PCB design that

can be easily manufactured, assembled and tested.

The certification test is based on several critical

IPC documents that link design principles to the end

use of the printed circuit assembly. Designers may

purchase study materials and prepare on their own

or enroll in a comprehensive two-day IPC Designer

Certification Preparation workshop.

ADVANCED CERTIFIED INTERCONNECT

DESIGNER (C.I.D.+)

With the industry changing at an ever-faster pace,

continuing education becomes necessary to maintain

a designer's effectiveness – and marketability. That's

why the Advanced PCB Designers Preparation Work-

shop and Examination was introduced. The Advanced

Module covers 40 key objectives beyond the C.I.D.

Participants who successfully complete the exam are

awarded the C.I.D.+ designation.

IPC/WHMA-A-620 TRAINING AND

CERTIFICATION

Industry standard program for requirements and

acceptance of cable and wire harness assemblies.

Updated to support Revision A of the standard.

Future course updates will include optional hands-on

training. Training support is not available for super-

seded versions. LEAD FREE NOW INCLUDED.

Some topics are:

• Crimp, IDC and soldered terminations

• Connectorization

• Molding, potting and marking

• Securing and shielding

IPC-7711 & IPC-7721 REWORK AND REPAIR

TRAINING AND CERTIFICATION

Industry standard program for rework, repair and

modification of electronic assemblies. All modules

include hands-on training. Some topics are:

• Through hole and SMT

• Conductor and laminate repair

IPC J-STD-001D TRAINING AND

CERTIFICATION

Industry standard program for hand and machine

soldering process and material requirements. Some

training modules include hands-on training. In addi-

tion to the latest program covering lead free criteria

in Rev D, IPC will continue to support Rev C training

as users transition to newer versions. LEAD FREE

NOW INCLUDED. Some topics are:

• Wire and terminal assembly requirements

• Through hole technology requirements

• Surface mount technology requirements

IPC-A-600G TRAINING AND CERTIFICATION

Industry standard program for quality assurance/

visual acceptance of unpopulated printed circuit

boards. Training support is not available for super-

seded versions. Some topics are:

• Solder resist coverage

• Conductor width and spacing

• Plated-through hole requirements for copper plat-

ing thickness, voids, nodules and cracks

• Flexible, rigid-flex, and metal core printed boards

IPC-A-610D TRAINING AND CERTIFICATION

Industry standard program for quality assurance/vi-

sual acceptance of electronic assemblies based on

the world’s most widely used electronics assembly

acceptability standard. In addition to the latest

program covering lead free criteria in Rev D, IPC will

continue to support Rev C training as users transition

to newer versions. Some topics are:

• Soldering criteria, including lead free connections

• Soldered requirements for connecting to termi-

nals, through hole and SMT

• Criteria for component damage, laminate condi-

tions, cleaning and coating

Focus on Specifications

Get industry developed, industry approved and industry traceable training for your managers, engi-

neers, and work force. Based on IPC standards these programs lead to individual certification–an important

credential to assure customers of your dedication to quality. Each of the five programs follow a two-tier

“train-the-trainer” concept. First, companies send an instructor candidate to an authorized IPC training center.

Upon successful completion of the course, the candidate becomes a certified instructor and is provided with

the materials needed to train and certify users. Training at the application specialist (operator/inspector/man-

agement) level is modular in all programs. This enables users to control costs by providing training only on

the topics related to an individual's assigned tasks. Programs are offered through IPC authorized certification

centers throughout the world. For more information, go to www.ipc.org/certification.

CERTIFICATION FOR COMPANIES/FACILITIES

CERTIFICATION FOR RoHS LEAD FREE ELECTRONICS ASSEMBLY PROCESS CAPABILITY

Certification program that audits an electronics assembly facility. The audit involves a careful review

of a facility’s processes and procedures to determine whether, if followed and applied precisely and consis-

tently, the facility is capable of producing product to meet the lead free requirements of the RoHS Directive.

Because it involves inspection of procedures and processes in place at the time of the audit, certifica-

tion cannot ensure, or be used to represent, that the facility’s products will be RoHS lead free compliant.

However, the certification audit is an excellent way to validate RoHS lead free electronics assembly process

capabilities to customers and suppliers.

TRAINING AND CERTIFICATION PROGRAMS FOR INDIVIDUALS

www.ipc.org/certification www.ipc.org/onlinestore

3

IPC-T-50G

Terms and Definitions for Interconnecting

and Packaging Electronic Circuits

Provides descriptions and illustrations of electronics

interconnect industry terminology to help users

and their customers break down language barriers.

Revision G contains more than 500 new or revised

terms, including new terminology for ball grid array

and chip scale packaging, via protection, lead free

solders, assembly processes, base materials and

high speed/high frequency boards. Includes com-

monly used industry acronyms and an index of terms

by technology types for easy searching. 135 pages.

Released December 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

KIT**

IPC members: $60.00

Nonmembers: $120.00

IPC-9591

Performance Parameters (Mechanical,

Electrical, Environmental and Quality/

Reliability) for Air Moving Devices

Standardizes the performance parameters for air

moving devices. The phrase "air moving device" (or

"air mover") refers to equipment such as fans, blow-

ers and other forced air movement technologies.

These air moving devices are used in the electronics

industry for the cooling of heat-producing com-

ponents, and range from small devices mounted

directly to hot components such as microprocessor

air moving devices, to larger devices used to force air

through a chassis containing many heat dissipating

components. Specification sets requirements for

design, manufacture, and test application of air mov-

ing devices. The term "end user" as used in the docu-

ment refers to the OEM or design/materials entity

responsible for specifying the function and reliability

of an air moving device in a final product application.

19 pages. Released April 2006.

The OEM Critical Components committee is working on

standards for lithium ion battery manufacture and power

conversion. Check www.ipc.org/online in mid-2007 for

availability. Contact TonyHilvers@ipc.org to participate in the

committee.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-TM-650

Test Methods Manual

Contains more than 150 industry-approved test

techniques and procedures for chemical, mechani-

cal, electrical, and environmental tests on all forms

of printed boards and connectors. A comprehensive

collection of methodologies referenced in IPC stan-

dards and specifications, the IPC-TM-650 is updated

regularly as test methods are revised or developed.

To be notified of revisions or new test methods, sign up

for IPC’s FREE New Releases Notification Service. Go to:

www.ipc.org/NewReleaseSignUp.

HARD COPY CD

IPC members: $220.00 $225.00

Nonmembers: $440.00 $445.00

PROCEEDINGS

IPC sells proceedings of its most popular and suc-

cessful technical conferences and symposiums.

Proceedings cover everything from comprehensive,

multi-topic events to sessions on specific technolo-

gies and interests. Library of proceedings includes

presentations from APEX, Expo and the Designers

Summit; IPCWorks and more. Looking for a particular

topic? Do an advanced search by topic at the online

store and find relevant proceedings with ease.

To find all available Proceedings, go to the online store.

G E N E R A L

WHY YOUR COMPANY SHOULD BE AN IPC MEMBER

IPC is a global trade association dedicated to the competitive

excellence and financial success of its 2,400 member compa-

nies which represent all facets of the electronics interconnect

industry, including design, printed circuit board manufacturing

and electronics assembly. IPC is the leading industry source for

industry standards, training, market research and public policy

advocacy — supporting the needs of an estimated $3.4 trillion

global electronics industry.

ACCESS INFORMATION • REDUCE OPERATING COSTS • MARKET YOUR BUSINESS

• Stay on top of what’s happening in the industry with a free

subscription to the IPC Review. This monthly magazine highlights standards

development, technical information and updates on association activities

and initiatives.

•

Keep up to date on new standards with one free copy as they are

published.

•

Save up to 50% on standards, training materials, and other IPC products

and services.

• Access research and the latest information 24/7 on the “members-only” area of the IPC website.

•

Participate in market surveys and receive timely reports on industry performance.

• Help shape the future of the electronics interconnect industry by participating in standards

development committee meetings and on PCB / EMS management councils.

• Network with leading industry executives and share valuable knowledge and market information

by joining IPC's Executive Market and Technology Forum.

•

Enjoy priority service on technical questions from our technical staff.

•

Promote your company’s products and services through links from the IPC website.

• Get special member pricing on workshops and educational conferences held throughout the year.

•

Enhance your visibility in the industry through the IPC membership directory, published twice each

year.

•

Receive discounted pricing to exhibit in our annual trade show and conference for the printed circuit

board and electronics manufacturing industry.

• Use the IPC logo to highlight your company’s involvement and commitment to excellence.

• Utilize cost reduction services through vendor partnership programs.

• Promote your PCB or EMS by listing products & services in the Products and Services Index (PSI).

www.ipc.org/certification www.ipc.org/onlinestore

4

E L E C T R O N I C S A S S E M B L Y

ACCEPTABILITY

IPC J-STD-001D

Requirements for Soldered Electrical and

Electronic Assemblies

PbPb

ANSI Approved. Lead

free acceptance criteria

and pictures now

included! Reformatted to find acceptance criteria

easier! J-STD-001D is world-recognized as the sole

industry-consensus standard covering soldering

materials and processes. In addition to lead free

manufacturing support, this revision has criteria for

materials, methods and verification for producing

quality soldered interconnections and assemblies that

is easier to understand. The requirements for all three

classes of construction are included. Color illustra-

tions are provided for clarity. This standard fully

complements IPC-A-610D. 60 pages. Released

February 2005.

Language

J-STD-001D English

J-STD-001DSP Spanish

J-STD-001DSW Swedish

(More language translations in development. Please

check the online store for the most updated list.)

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

Revisions B and C available. Contact Customer Service at

847-597-2862.

IPC-HDBK-001

Handbook and Guide to Supplement

J-STD-001 (Includes J-STD-001 B-C-D

Comparisons)

Provides J-STD-001 change history

and cross reference support for

Revisions B, C and D. Offers explana-

tory and tutorial information to help with the

implementation of the requirements of J-STD-001.

Provides a better understanding of the process

considerations needed when producing acceptable

soldered hardware. Includes Amendments 1 and 2.

188 pages. Released October 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC-A-610D

Acceptability of Electronic Assemblies

PbPb

ANSI Approved.

IPC-A-610D is the

most widely used

electronics assembly standard in the world. A must

for all quality assurance and assembly depart-

ments, this standard illustrates industry-accepted

workmanship criteria for electronics assemblies

through color photographs and illustrations. Topics

include lead free, component orientation and

soldering criteria for through hole, SMT and discrete

wiring assemblies, mechanical assembly, cleaning,

marking, coating, and laminate requirements.

Revision D has more than 730 new and updated

illustrations of acceptability criteria and has been

critically reviewed for clarity and accuracy.

Synchronizes to the requirements expressed in other

industry consensus documents and is used with the

material and process standard IPC J-STD-001. 400

pages. Released February 2005.

Language

A-610D English

A-610D-CH Chinese

A-610D-DE German

A-610D-DK Danish

A-610D-FI Finnish

A-610D-FR French

A-610D-IT Italian

A-610D-PL Polish

A-610D-SP Spanish

A-610D-SW Swedish

A-610D-VN Vietnamese

(More language translations in development. Please

check the online store for the most current list.)

HARD COPY CD OR DOWNLOAD

IPC members: $50.00 $55.00

Nonmembers: $100.00 $105.00

KIT**

IPC members: $75.00

Nonmembers: $145.00

Revisions B and C available. Contact Customer Service at

847-597-2862.

IPC-HDBK-610

IPC-HDBK-610 with Amendment 1

Handbook and guide to supplement IPC-A-610 provid-

ing change history and cross reference support for

Revisions B, C and D. Offers explanatory and tutorial

information to help understand the requirements of

IPC-A-610. 166 pages. Released October 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC-EA-100-K

Electronic Assembly Reference Set

PbPb

Your complete source for the most important

electronic assembly documents in both hard

and electronic copies: IPC J-STD-001, IPC-

HDBK-001, IPC-A-610 and IPC-HDBK-610. Handy, "at-

your-fingertips" reference set includes high resolution

color pictures in IPC-A-610, IPC J-STD-001 and black

and white pictures in the handbooks. To facilitate

electronic searching of requirements, single-user

(print screen only) PDF copies of all four documents on

CD are included.

KIT**

IPC members: $220.00

Nonmembers: $440.00

Save 40% by purchasing as a set.

TABLE OF CONTENTS

Acceptability . . . . . . . . . 4

Advanced. . . . . . . . . . . 5

Cleaning . . . . . . . . . . . 6

Components . . . . . . . . . . 7

Training and Reference Guides . . . 8

General . . . . . . . . . . . 9

Materials . . . . . . . . . . 10

Process Support . . . . . . . 12

Rework/Repair. . . . . . . . 14

Solderability . . . . . . . . 14

Optoelectronics . . . . . . . 15

IPC-A-610D illustrations are available as a

complete set, individually or by chapter. They

are available for unlimited use for in-house

company training. See page 39 for more

information.

For certification information, go to www.ipc.org/certification

**Kit includes CD and hard copy.

www.ipc.org/onlinestore

www.ipc.org/onlinestore 5

IPC/WHMA-A-620A

Requirements and Acceptance for Cable

and Wire Harness Assemblies

PbPb

ANSI Approved. Revision A, with improved

readability and usability, is now available

for the only industry-consensus standard for

Requirements and Acceptance of Cable and Wire

Harness Assemblies. IPC and the Wire Harness

Manufacturers Association (WHMA) developed this

significant update, adding lead free acceptance

criteria, a new chapter devoted to electrical and

mechanical testing, and enhanced criteria for

molding and splicing. Contains 599 color pictures

and illustrations. 19 chapters include: criteria for

wire prep, soldering to terminals, crimping of

stamped and formed contacts and machined

contacts, insulation displacement connectors,

ultrasonic welding, splicing, connectors, molding,

marking, coax/twinax cables, wrapping/lacing,

shielding, assembly and wire-wrap terminations.

368 pages. Released July 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $50.00 $55.00

Nonmembers: $100.00 $105.00

KIT**

IPC members: $75.00

Nonmembers: $150.00

ADVANCED

IPC J-STD-012

Implementation of Flip Chip and Chip

Scale Technology

ANSI Approved. Describes the implementation of

flip chip and related chip scale semiconductor pack-

aging technologies. The areas discussed include

design considerations, assembly processes, technol-

ogy choices, application and reliability data. Chip

packaging variations include flip chip, HDI, micro

BGA, micro SMT and SLICC. Also provides general

information on implementing flip chip and chip scale

technologies for creating multichip modules, I/C

cards, memory cards and very dense surface mount

assemblies. Developed by IPC, EIA, MCNC and

Sematech. 113 pages. Released January 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC-SM-784

Guidelines for Chip-on-Board Technology

Implementation

ANSI Approved. Discusses chip types, board selec-

tion, design issues and thermal transfer methods

for Chip-on-Board (COB) applications. Details wire

bonding, TAB and flip chip designs and provides

information on mounting materials, including

adhesives, wires and various mechanical bonding

techniques. 37 pages. Released November 1990.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC/EIA J-STD-026

Semiconductor Design Standard for Flip

Chip Applications

Addresses semiconductor flip chip design require-

ments. Provides information for using standard

semiconductor substrates, materials, assembly and

test methods with established fabrication, bumping,

test and handling practices. Electrical, thermal and

mechanical chip design parameters and methodolo-

gies are covered in the standard, as well as the

reliability aspects associated with these condi-

tions and processes. The information applies to all

new designs as well as modifications of non flip

chip designs. Developed by IPC and EIA. 40 pages.

Released August 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC J-STD-027

Mechanical Outline Standard for Flip Chip

and Chip Size Configurations

Establishes mechanical outline requirements for

devices supplied in flip chip or Chip Size Package

(CSP) formats, including die surface, die terminals,

and interconnection balls/bumps/lands to the next

level. 13 pages. Released February 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC/EIA J-STD-028

Performance Standard for Construction of

Flip Chip and Chip Scale Bumps

Establishes construction detail requirements for

bumps and other terminal structures used for Flip

Chip Scale carriers. The specific standards for

different terminations are appropriately matched

to a particular interconnection process and include

diverse terminations such as solder bumps, columns,

non-melting stand-offs and conductive polymer

deposits. The document articulates a set of designa-

tions and expectations for product performance for

the manufacturer and the user of flip chip or chip

scale devices. Recommendations are provided to

implement the best commercial practices and evolv-

ing process improvements. Developed by IPC and

EIA. 36 pages. Released August 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC J-STD-013

Implementation of Ball Grid Array and

Other High Density Technology

ANSI Approved. Establishes the requirements and

interactions necessary for printed board assembly

processes for interconnecting high performance/

high pin count IC packages. Includes information

on design principles, material selection, board

fabrication, assembly technology, testing strategy

and reliability expectations based on end-user

environments. Developed by IPC, EIA, MCNC and

Sematech. 96 pages. Released July 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

KIT**

IPC members: $60.00

Nonmembers: $120.00

www.ipc.org/onlinestore

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

For certification information, go to www.ipc.org/certification

**Kit includes CD and hard copy.

6

E L E C T R O N I C S A S S E M B L Y

IPC-7095A

Design and Assembly Process

Implementation for BGAs

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball

Grid Array (FBGA) technology presents some unique

challenges for design, assembly, inspection and

repair personnel. Revision A of this document delivers

useful and practical information to anyone currently

using BGAs or considering a conversion to area array

packaging formats. In addition to providing guidelines

for BGA inspection and repair, IPC-7095A addresses

reliability issues and the use of lead free joint criteria

associated with BGAs. There are many new photo-

graphs of X-ray or endoscope illustrations to identify

some of the characteristics that the industry is

experiencing in the implementation of BGA assembly

processes. The effect of BGA and FBGA on current

technology and component types is also discussed.

118 pages. Released October 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC/EIA J-STD-032

Performance Standard for Ball Grid

Array Balls

This standard, developed jointly by IPC and the

Electronic Industries Association (EIA), establishes the

construction detail requirements for balls and other

terminal structures on Ball Grid Array (BGA) packages.

It also establishes a set of designations and expecta-

tions for product performance. A wide variety of

terminal structures are recognized for a broad range

of applications — from highest reliability computer,

space and military applications to disposable com-

modity applications. 10 pages. Released June 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-MC-790

Guidelines for Multichip Module

Technology Utilization

Provides information on multichip module technology,

including parametric data, design and manufacturing

information and a proposed categorization of vari-

ous approaches to multichip interconnect substrate

technologies based on dielectric family. 120 pages.

Released August 1992.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

CLEANING

IPC-M-108

Cleaning Guides and Handbooks Manual*

Convenient set of nine documents includes the latest

editions of IPC cleaning guides and handbooks. Helps

manufacturing engineers make decisions on cleaning

products and processes and provides guidance for

troubleshooting.

HARD COPY CD OR DOWNLOAD

IPC members: $90.00 $95.00

Nonmembers: $180.00 $185.00

Save more than 55% by purchasing documents together.

IPC-5701

Users Guide for Cleanliness of

Unpopulated Printed Boards

Tackling PCB cleanliness is a tough job. Residues

on printed circuit boards are directly related to the

reliability of the produced hardware and can result in

serious failures if not known or monitored. But how

do you measure "cleanliness"? How clean is "clean"?

IPC-5701 provides guidance on how these issues

should be approached and specified in purchasing

documents, addressing levels of cleanliness, common

locations for testing, and information on sample sizes.

6 pages. Released July 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

IPC-8497-1

Cleaning Methods and Contamination

Assessment for Optical Assembly

For more information, go to page 15.

IPC-TP-1113

Circuit Board Ionic Cleanliness

Measurement: What Does It Tell Us?

Discusses ionic cleanliness measurement, testing

methods and cleanliness standards in relation to prod-

uct reliability. Includes a brief discussion of no-clean

fluxes. Written by Dr. Jack Brous. 8 pages. Released

1994.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

IPC-WP-008

Setting Up Ion Chromatography Capability

Ion chromatography has been recognized as a method

for which the data output is ion specific and very

precise in the quantification of ionic residues. This

paper provides practical considerations that should

be addressed when contemplating the setup of an ion

chromatography lab, including the core components

of an ion chromatograph system such as carrier solu-

tions, pumps, injection valves and detectors. Covers

support equipment, chemical considerations, consum-

ables, waste streams and overall operating costs. 12

pages. Released December 2005.

HARD COPY CD OR DOWNLOAD

IPC Members: $15.00 $20.00 (for CD)

Nonmembers: $30.00 $35.00

KIT**

IPC Members: $25.00

Nonmembers: $50.00

Free DownloaD

For MeMbers

IPC-CH-65A

Guidelines for Cleaning of Printed Boards

and Assemblies

ANSI Approved. A road map for current and emerging

cleaning issues in the electronics industry, this hand-

book includes descriptions and discussion of various

cleaning methods. Explains the relationship between

materials, processes and contaminants in fabrication

and assembly operations. Also addresses cleanliness

assessment and process control in relation to cleanli-

ness. 56 pages. Revised August 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

www.ipc.org/onlinestore

www.ipc.org/onlinestore 7

IPC-SC-60A

Post Solder Solvent Cleaning Handbook

ANSI Approved. Addresses the use of solvent

cleaning technology in automated and manual

soldering operations. Serves as a selection guide

for cleaning solvents and equipment by discussing

properties of solvents, residues, considerations on

process control and environmental issues. 40 pages.

Released August 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-SA-61A

Post Solder Semi-Aqueous

Cleaning Handbook

Covers aspects of semi-aqueous cleaning such as

chemicals, manufacturing residues, equipment and

processes, process control, environmental consid-

erations and safety. Enhancements in this revision

include a separate discussion of water-soluble and

water-insoluble cleaning agents and expanded

process and quality control. 32 pages. Released

June 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-AC-62A

Aqueous Post Solder Cleaning Handbook

ANSI Approved. Describes manufacturing residues,

types and properties of aqueous cleaning agents,

aqueous cleaning processes and equipment, pro-

cess and quality control, environmental controls and

considerations, worker safety, cleanliness determi-

nation, measurement and cost. 75 pages. Revised

January 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-TR-476A

Electrochemical Migration: Electrically

Induced Failures in Printed Circuit

Assemblies

Provides information on an IPC program designed

to identify/evaluate electromigration on PCBs.

Discusses the theory of electrochemical migration

and the test procedures needed to assess the sus-

ceptibility. Includes the results of a literature review

survey. 14 pages. Revised 1997.

HARD COPY ONLY

IPC members: $30.00

Nonmembers: $60.00

IPC-TR-582

Cleaning & Cleanliness Test Program for

Phase 3 — Low Solids, Fluxes and Pastes

Processed in Ambient Air

Details the test procedures, test results and team

conclusions for the IPC Cleaning and Cleanliness

Testing Program, Phase 3, Low Solids Flux in Ambi-

ent Air. This effort has been part of a multi-stage

program to investigate material and process

alternatives to the use of chlorofluorocarbons (CFCs)

in electronics manufacturing. This Phase 3 effort

has been dedicated to characterizing the cleanliness

aspects of low solids fluxes, sometimes referred to

as "no-clean" fluxes. 163 pages. Released November

1994.

HARD COPY ONLY

IPC members: $25.00

Nonmembers: $50.00

IPC-TR-583

An In-Depth Look At Ionic

Cleanliness Testing

Report provides quantified results to help users

determine what variables most influence ionic

cleanliness test results. Includes how solvent

temperature influences the final cleanliness results,

criticality of a 75% isopropyl to 25% water ratio,

value of spraying the solvent, etc. Original research

was a cooperative effort between the EMPF and

IPC, released as EMPF-RR-0013 in 1993. 229 pages.

Released July 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-9201

Surface Insulation Resistance Handbook

Covers the terminology, theories, test procedures

and test vehicles of surface insulation resistance

(SIR) or temperature-humidity (TH) testing. Discus-

sions on failure modes and troubleshooting are also

included. 65 pages. Released July 1990.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC-TP-104-K

Cleaning & Cleanliness Test Program,

Phase 3, Water Soluble Fluxes,

Parts 1 & 2

Combined for ease of use, these two technical

papers present the results of the IPC Cleaning and

Cleanliness Test Program, Phase 3; Parts 1 and 2.

The Phase 3 program was designed as a test for

evaluating manufacturing materials and processes

as alternatives to current manufacturing practices

that require the use of CFCs. 122 pages. Originally

released in October 1992, these reports are still

current in 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

COMPONENTS

IPC-M-109

Component Handling Manual*

PbPb

Set includes the latest editions of eight IPC

standards and guidelines related to the

classification and use of moisture

sensitivity components, including how to package,

handle, store and test them, so that all components

will be compatible with the assembly process.

HARD COPY CD OR DOWNLOAD

IPC members: $85.00 $90.00

Nonmembers: $170.00 $175.00

Save more than 60% by purchasing documents together.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

**Kit includes CD and hard copy.

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

www.ipc.org/onlinestore

8

E L E C T R O N I C S A S S E M B L Y

IPC/JEDEC J-STD-020C

Moisture/Reflow Sensitivity Classification

for Nonhermetic Solid State Surface

Mount Devices

PbPb

Test method to establish a classification level

of nonhermetic solid state surface mount

devices that are sensitive to moisture-induced

stress during assembly. Revision includes test

classification parameters for components that will be

processed at higher temperatures for lead free

assembly or rework. These devices can be properly

packaged, stored, and handled using IPC/JEDEC

J-STD-033 to avoid subsequent thermal/mechanical

damage during solder reflow attachment and/or repair

operation. Revision D is being developed (projected

early 2007 release) to incorporate lessons learned from

the increased user base of lead free assemblers.

Developed by IPC and JEDEC. 12 pages. Released

July 2004.

Revision D coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

KIT**

IPC members: $40.00

Nonmembers: $80.00

IPC J-STD-033B

Handling, Packing, Shipping and Use of

Moisture/Reflow Sensitive Surface Mount

Devices

PbPb

Provides Surface Mount Device (SMD)

manufacturers and users with standardized

methods for handling, packing, shipping and

use of moisture/reflow sensitive SMDs. These

methods help avoid damage from moisture absorption

and exposure to solder reflow temperatures that can

result in yield and reliability degradation. By using

these procedures, safe and damage-free reflow can

be achieved with the dry packing process, providing a

minimum shelf life of 12 months from the seal date

when using sealed dry bags. Developed by IPC and

JEDEC. 17 pages. Released October 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC/JEDEC J-STD-035

Acoustic Microscopy for Non-Hermetic

Encapsulated Electronic Components

This test method defines the procedures for perform-

ing acoustic microscopy on non-hermetic encapsu-

lated electronic components. Provides users with

an acoustic microscopy process flow for detecting

defects non-destructively in plastic packages while

achieving reproducibility. Developed by IPC and

JEDEC. 16 pages. Released April 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

TRAINING AND REFERENCE GUIDES

IPC's Guides are directly referenced to industry-con-

sensus standards. Because each Guide is focused on

a narrow range of technology covered by an IPC stan-

dard, its small size makes it easy to use. However, in

some cases the text and illustrations were modified

to help with interpretation of the criteria. They should

not be used as standards.

IPC-DRM-18G

Component Identification Training &

Reference Guide

Assembly operators can have a convenient component

identification resource at their workstations - with

the Component Identification Training and Reference

Guide (formally known as “Desk Reference Manual”).

This comprehensive reference and training aid contains

color photographs, computer graphics, schematic

symbols and full descriptions of more than 40 of the

most commonly used through hole and surface mount

components, interconnections and hardware used

in electronic assembly today. Includes a terminology

section with quick facts on polarity, orientation, lead

styles and Component Reference Designators (CRDs).

The band reading section has easy-to-use color code

charts and other component value data. 65 pages.

HARD COPY ONLY

IPC Members: $30.00

Nonmembers: $60.00

Quantity pricing available – check the online store

IPC-DRM-SMT-D

Surface Mount Solder Joint Evaluation

Training and Reference Guide

PbPb

Help your workforce understand and apply

the surface mount acceptance criteria from

IPC standards. DRM-SMT-D contains 3-D

color illustrations for Chip component, Gull Wing and

J-Lead solder joints. Drawings clearly show the

minimum acceptable condition for each type of

component misalignment and the minimum solder

connections. All three classes of product are color-

coded to make it convenient to use as a reference

guide. Manual also contains high quality color

photographs of the major solder defects and

conditions, with the appropriate specification/

paragraph reference to IPC-A-610D and J-STD-001D.

38 pages.

HARD COPY ONLY

IPC members: $15.00

Nonmembers: $30.00

Quantity pricing available – check the online store

IPC-DRM-PTH-D

Through-Hole Solder Joint Evaluation

Training and Reference Guide

PbPb

Includes computer-generated 3-D graphics,

as well as close-up photography, to help

users understand IPC standards A-610D and

J-STD-001D. Provides illustrations of component,

barrel and solder-side coverage per requirements in

the standards. Covers solder fillet, contact angle,

wetting, vertical fill, land coverage and numerous

defect conditions for Class 1, 2 and 3 solder joints.

Also includes a Terminology section. 30 pages.

HARD COPY ONLY

IPC members: $15.00

Nonmembers: $30.00

Quantity pricing available – check the online store

**Kit includes CD and hard copy.

www.ipc.org/onlinestore

www.ipc.org/onlinestore 9

IPC-DRM-56

Wire Preparation & Crimping Desk

Reference Manual

Explains the most important stamped and formed

crimp criteria from the industry standard on wire

harness acceptability, IPC/WHMA-A-620. Easy-

to-understand graphics and simple instructions

help ensure that your company’s products meet the

required industry standards. Covers wire types,

gauges, insulation stripping and contact types,

IPC product categories and acceptance criteria,

wire preparation, strand and insulation damage,

conductor deformations, open and closed barrel

crimp definitions and criteria, crimp deformations,

cut-off tabs, punctures, insulation support crimps,

inspection windows, bellmouth, conductor crimp

requirements, conductor brush, closed barrel crimps,

insulation damage and a glossary of related wire

prep/crimping terminology. 30 pages.

Revision A coming soon – check the online store.

HARD COPY ONLY

IPC members: $15.00

Nonmembers: $30.00

Quantity pricing available – check the online store

IPC-DRM-53

Introduction to Electronics Assembly

Desk Reference Manual

Learning resource for new hires, operators, sales,

purchasing, human resources, administrative

personnel, students or anyone interested in under-

standing the basic processes for both through hole

and surface mount assembly. Explains electronics

assembly to the uninitiated in easy-to-understand

language and includes more than 70 color photo-

graphs and graphic drawings to clearly illustrate

assembly technologies. Key terms are defined in a

glossary to help simplify the industry lexicon. Also

explains how electronics assembly fits into the elec-

tronics industry. Each section includes references

for additional training and industry specifications

that provides further information. 31 pages.

HARD COPY ONLY

IPC members: $12.00

Nonmembers: $24.00

Quantity pricing available – check the online store

GENERAL

IPC-M-103

Standards for Surface Mount

Assemblies Manual*

IPC has taken the most requested documentation

for surface mounting and packaged all 26 docu-

ments into one convenient set. Includes standards

to support working with moisture-sensitive compo-

nents, as well as all IPC adhesive documents.

HARD COPY CD OR DOWNLOAD

IPC members: $330.00 $335.00

Nonmembers: $660.00 $665.00

Save more than 50% by purchasing documents together.

IPC-M-104

Standards for Printed Board

Assembly Manual*

Conveniently packaged set contains 14 of the most

widely used documents on printed board assembly.

HARD COPY CD OR DOWNLOAD

IPC members: $165.00 $170.00

Nonmembers: $330.00 $335.00

Save at least 45% by purchasing documents together.

IPC-TA-724

Technology Assessment Series on

Clean Rooms

Best compendium available today for information

and technical articles on cleanrooms. All articles are

reprinted in their entirety with credit to the original

author (when given). Released April 1998.

HARD COPY ONLY

IPC members: $70.00

Nonmembers: $140.00

IPC-SM-780

Component Packaging and Interconnect-

ing with Emphasis on Surface Mounting

Examines key issues in advanced packaging

techniques. Provides information on types of parts

available, techniques and processes necessary for

their proper use, possible advantages/disadvan-

tages or problems, how to start implementation and

additional resources. 138 pages. Released March

1988.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC-SM-785

Guidelines for Accelerated Reliability

Testing of Surface Mount Attachments

Used when evaluating and extrapolating the results

of these tests toward actual use environments of

electronic assemblies. 50 pages. Released Novem-

ber 1992.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-9701A

Performance Test Methods and Qualifi-

cation Requirements for Surface Mount

Solder Attachments

PbPb

Provides specific test methods to evaluate

the performance and reliability of surface

mount solder attachments of electronic

assemblies. Establishes levels of performance and

reliability of the solder attachments of surface

mount devices to rigid, flexible and rigid-flex circuit

structures. When used with IPC-SM-785, it provides

an understanding of the physics of SMT solder joint

failure and an approximate means of relating

performance tests results to the reliability of solder

attachments in their use environments. Revision A

includes Appendix B which provides recommended

changes to the thermal cycling profiles given in the

document when utilizing lead free solder joints. 24

pages. Released February 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC/JEDEC-9702

Monotonic Bend Characterization of

Board-Level Interconnects

PbPb

Characterizes the fracture strength of a

component’s board-level interconnect.

Provides a common methodology for

measuring fracture resistance to flexural loading

that may occur during conventional non-cyclic board

assembly and test operations. Applicable to surface

mount components attached to printed boards using

conventional solder reflow technologies. Document

supplements existing standards which address

mechanical shock or impact during shipping, handling

or field operation. 17 pages. Released June 2004.

HARD COPY CD OR DOWNLOAD

IPC Members: $15.00 $20.00

Nonmembers: $30.00 $35.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

www.ipc.org/onlinestore

10

E L E C T R O N I C S A S S E M B L Y

IPC-9704

IPC/JEDEC Printed Wiring Board Strain

Gage Test Guideline

PbPb

Strain gage testing of board assemblies

allows for objective analysis of the strain and

strain rate levels that a surface mount

package is subjected to during assembly, test and

operation. Characterization of worst-case board

assembly strain is critical due to the susceptibility of

component solder joints to strain-induced failures.

This document describes specific guidelines for strain

gage testing in the manufacturing process, including

board assembly, test, system integration and board

shipping, and provides coverage of test setup and

equipment requirements, strain measurement

techniques and test report formats. Contains 20 color

photographs and illustrations depicting instrumented

boards and gage placement. 22 pages. Released

June 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-PD-335

Electronic Packaging Handbook

Contains a general introduction of electronic

packaging followed by system integration, electronic

equipment subsystems, subsystem intraconnection,

subassembly, discrete component, active and passive

device interconnections, package components and

unpackaged devices. A must for anyone involved in

electronic packaging. 470 pages. Released

December 1989.

HARD COPY ONLY

IPC members: $195.00

Nonmembers: $390.00

IPC-7525

Stencil Design Guidelines

Provides guidelines for the design and fabrication of

stencils for solder paste and surface mount adhesive.

This is the first industry consensus document for sten-

cil design. Stencil design for surface-mount technol-

ogy, as well as mixed technology with through hole or

flip chip components is discussed, including overprint,

two-print and step stencil designs. A sample order

form and a user inspection checklist are also included

for stencil design. Revision A with expanded coverage

of stencils used with lead free paste is projected for

release by the end of 2006. 14 pages. Released May

2000.

Revision A coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-T-50G

Terms and Definitions for Interconnecting

and Packaging Electronic Circuits

For more information, go to page 3.

IPC-TM 650

Test Methods Manual

For more information, go to page 3.

IPC-QL 653A

Certification of Facilities that Inspect/Test

Printed Boards, Components and Materials

For more information, go to page 25.

IPC-9191

General Guidelines for Implementation of

Statistical Process Control

For more information, go to page 24.

IPC-TR-581

IPC Phase III Controlled Atmosphere

Soldering Study

The IPC Phase 3 Controlled Atmosphere Soldering

Study evaluated the use of nitrogen as an inerting

blanket with two low residue fluxes in a no-clean

mode. Additionally, two resin fluxes using ambient

atmosphere cleaned with methyl chloroform solvent

served as controls. IPC-B-24 served as the test ve-

hicle. The test format evaluated flux materials in dif-

ferent configurations of clean vs. no-clean processing

with the test combs both soldered and not soldered.

90 pages. Released August 1994.

HARD COPY ONLY

IPC members: $20.00

Nonmembers: $40.00

MATERIALS

IPC J-STD-004A

Requirements for Soldering Fluxes

PbPb

ANSI Approved. Revision A

covers requirements for

qualification and classification

of rosin, resin, organic and inorganic fluxes according

to the activity level and halide content of the fluxes.

Includes solder fluxes, flux-containing materials and

low residue fluxes for no-clean processes. Updated

test methods are available through free download at

the online store. Supersedes QQ-S-571 and

MIL-F-14256. 16 pages. Released January 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

KIT**

IPC members: $40.00

Nonmembers: $80.00

IPC/EIA J-STD-005

Requirements for Soldering Pastes —

Includes Amendment 1

PbPb

ANSI Approved. Lists

requirements for qualification

and characterization of solder

paste. Test methods and criteria for metal content,

viscosity, slump, solder ball, tack and wetting of solder

pastes are included. Supersedes QQ-S-571. Developed

by IPC and EIA. 47 pages. Released January 1995.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

**Kit includes CD and hard copy.

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

www.ipc.org/onlinestore

www.ipc.org/onlinestore 11

IPC-HDBK-005

Guide to Solder Paste Assessment

PbPb

Companion to the solder paste standard

J-STD-005 and considered a guide to help

assess the applicability of a solder paste for

its use in surface mount technology (SMT)

processes. Suggests test methods that can help with

designing and testing solder pastes. Intended for use

by both vendors and users of solder paste. Written

as a guide to assess the applicability of a solder

paste for a specific process, given the tremendous

number of permutations of different materials,

atmospheres and process variables currently

available. 50 pages. Released January 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC J-STD-006B

Requirements for Electronic Grade Solder

Alloys and Fluxed and Non-Fluxed Solid

Solders for Electronic Soldering

Applications

PbPb

Prescribes the nomenclature, requirements

and test methods for electronic grade solder

alloys; fluxed and non-fluxed bar, ribbon,

and powder solders; electronic soldering applica-

tions; and ''special'' electronic grade solders. This is

a quality control standard and is not intended to

relate directly to the material's performance in the

manufacturing process. Solders for applications

other than electronics should be procured using

ASTM B-32.

One of a set of three joint industry standards that

prescribe the requirements and test methods

for soldering materials for use in the electronics

industry. Also see IPC/EIA J-STD-004 and IPC/EIA

J-STD-005. 27 pages. Released January 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC J-STD-030

Guideline for Selection and Application of

Underfill Material for Flip Chip and Other

Micropackages

PbPb

Provides users of underfill material with

guidance in selecting and evaluating

underfill material. Underfill material is used

to increase reliability of electronic devices by two

methods: alleviate CTE mismatch (between the

electronic package and the assembly substrate)

and/or increase mechanical strength. Materials

used in underfill applications should neither

adversely affect device reliability (e.g. ionic

impurities and alpha emitters) nor degrade electrical

performance. When correctly selected and applied,

underfill material should increase the life of the

assembled solder joints. Three types of currently

available underfill materials addressed in this

document are: capillary flow underfill, no-flow/

fluxing underfill and removable/reworkable

underfill. 33 pages. Released September 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC-SM-817

General Requirements for Dielectric

Surface Mounting Adhesives

Covers requirements for dielectric adhesives.

Includes test methods to ensure components adhere

to the board and survive soldering processes. 22

pages. Released November 1989.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-WP-006

Round Robin Testing & Analysis: Lead-

Free Alloys–Tin, Silver, & Copper

PbPb

Summarizes a round robin test program on

the assembly properties of three lead free

solder alloys. Melt characterization, wetting

balance responses and solder spread tests were

performed by IPC-SPVC members on the three tin-

silver-copper alloys in the following percentages

respectively: 96.5/3.0/0.5; 95.5/3.8/0.7; and 95.5/

4.0/0.5. Includes examples of statistical analysis,

data analysis of the tests, data tables of testing

participants and a reproduction of IPC test methods

used. 19 pages. Released August 2003.

HARD COPY

IPC members: $20.00

Nonmembers: $30.00

Free DownloaD

IPC-CA-821

General Requirements for Thermally

Conductive Adhesives

Covers requirements and test methods for ther-

mally conductive dielectric adhesives used to bond

components in place. Permanent, removable and

self-shimming adhesives are addressed. 18 pages.

Released January 1995.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-3406

Guidelines for Electrically Conductive

Surface Mount Adhesives

IPC-3406 offers guidelines for selecting electri-

cally conductive adhesives for use in electronics

manufacturing as solder alternatives. The process

discussion attempts to stay within the bounds of

the existing solder assembly infrastructure. Major

types of adhesives, isotropic (conducting equally

in all directions) and anisotropic (unidirectional

conductivity) are covered. Polymer adhesives, ther-

mosets and thermoplastics are described. 15 pages.

Released July 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

www.ipc.org/onlinestore

12

E L E C T R O N I C S A S S E M B L Y

IPC-3408

General Requirements for Anisotropically

Conductive Adhesive Films

Covers requirements and test methods for anisotropi-

cally conductive adhesive films used to bond and

electrically connect components. Applications include:

flexible PCB-to-glass, flexible PCB-to-rigid PCB, flip

chip-to-glass, flip chip-to-flexible PCB, flip chip-to-rigid

PCB, and fine pitch SMD. The adhesive film may be

supplied pre-attached to a flexible circuit or other

product. 25 pages. Released November 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

IPC-CC-830B

Qualification and Performance of

Electrical Insulating Compound for Printed

Wiring Assemblies

Industry standard for qualification and quality con-

formance of conformal coating. Shows how to obtain

maximum information with minimum test redundancy.

Includes requirements and evaluations of material

properties using standardized test vehicles. Revision B

updates include sample reports to document qualifica-

tion, retention and conformance inspection. 18 pages.

Released August 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-HDBK-830

Guidelines for Design, Selection and

Application of Conformal Coatings

Compilation of the conformal coating industry's

practical experience. Assists designers and users of

conformal coatings in making informed choices. Users

will better understand the properties of the various

coatings, the results to be achieved and how to verify

goals have been met. Use document as a supplement

in conjunction with the industry standard for qualifica-

tion and quality conformance of conformal coating,

IPC-CC-830B. 88 pages. Released October 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC-SM-840C

Qualification and Performance of Permanent

Solder Mask — Includes Amendment 1

ANSI Approved. Covers requirements for the

qualification and quality conformance of liquid and

dry film solder mask. Streamlines solder mask classes

into two classifications: H (high reliability) and T

(telecommunications). Integrates Bellcore/Telcordia

requirements (class T) and provides minimum voltage

breakdown, defines mask formulation latitude, adds

new mask chemistries and more. 18 pages. Amend-

ment 1, released June 2000.

Revision D coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

KIT**

IPC members: $35.00

Nonmembers: $70.00

IPC ELEC-MICRO

Handbook of Lead-Free Solder Technology

for Microelectronic Assemblies Reference

Book

For more information, go to page 35.

PROCESS SUPPORT

IPC J-STD-001D

Requirements for Soldered Electrical and

Electronic Assemblies.

For more information, go to page 4.

IPC-TP-1114

The Layman's Guide to Qualifying a Process

to J-STD-001

Originally developed for J-STD-001B, it is applicable

to current assembly standards. Electronics manu-

facturers are faced with the difficult task of proving

that a candidate manufacturing process can produce

acceptable hardware, either to the customer of the

product or for internal quality control. Users have to

determine many of the process qualification steps

on their own. Document leads you through the task

of qualifying a candidate process to J-STD-001. 13

pages. Released January 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-AJ-820

Assembly & Joining Handbook

Contains descriptions of proven techniques for

assembly and soldering. Individual articles were

developed by industry experts and reviewed by a

standing committee. Sections include: terms and defi-

nitions; specification references and synopsis; design;

printed circuit boards; component/lead types; joining

materials; component mounting; solderability; joining

techniques and packaging; cleaning and coating; and

quality assurance and testing. 336 pages. Released

April 1997.

HARD COPY ONLY

IPC members: $220.00

Nonmembers: $440.00

IPC-7530

Guidelines for Temperature Profiling

for Mass Soldering (Reflow & Wave)

Processes

During mass soldering, it is important that all solder

joints reach the minimum soldering (reflow) tempera-

ture to assure metallurgical bonding of the solder alloy

and the base metals to be soldered. Metallurgical

bonding requires that both surfaces to be soldered,

as well as the solder, reach this minimum soldering

temperature for a sufficient time to allow the wetting

of the solder surfaces. Document provides guidelines

for the construction of appropriate profiling test ve-

hicles and various techniques and methodologies for

temperature profiling. 18 pages. Released May 2001.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-9701A

Performance Test Methods and

Qualification Requirements for Surface

Mount Solder Attachments

For more information, go to page 9.

**Kit includes CD and hard copy.

www.ipc.org/onlinestore

www.ipc.org/onlinestore 13

IPC-TP-1090

The Layman's Guide to Qualifying

New Fluxes

Easily understood test document gives you practi-

cal guidance and technical pointers on how to

demonstrate a new process capable of producing

reliable hardware. Written by Doug Pauls for MIL-

STD-2000A or MT-0002, but applicable to current

assembly standards. 18 pages. Released July 1996.

HARD COPY ONLY

IPC members: $25.00

Nonmembers: $50.00

IPC-TP-1115

Selection and Implementation Strategy

for a Low-Residue No-Clean Process

Provides direction to electronics manufacturers

interested in adopting low residue, (LR) no-clean

assembly technology. Addresses concerns of tran-

sitioning from operations with post solder cleaning

and no-clean using standard residue-level (SR)

materials. Includes 13 technical papers and presen-

tation materials from the IPC No-Clean Conference.

120 pages. Released December 1998.

HARD COPY ONLY

IPC members: $25.00

Nonmembers: $50.00

IPC-S-816

SMT Process Guideline and Checklist

Why waste time looking for answers? This handy,

easy-to-use troubleshooting guide lists all types

of processing problems and solutions for surface

mount assembly. Covers bridging, skips, misalign-

ment, placement and more. 38 pages. Released July

1993.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-PE-740A

Troubleshooting for Printed Board

Manufacture and Assembly

For more information, see page 16.

IPC-CM-770E

Component Mounting Guidelines for

Printed Boards

Provides effective guidelines in the preparation and

attachment of components for printed circuit board

assembly and reviews pertinent design criteria,

impacts and issues. Contains techniques for as-

sembly (both manual and machines including SMT,

BGA and flip chip) and consideration of, and impact

upon, subsequent soldering, cleaning, and coating

processes. 150 pages. Revised January 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

KIT**

IPC members: $55.00

Nonmembers: $110.00

IPC-7912A

End-Item DPMO for Printed Circuit Board

Assemblies

ANSI Approved. Finally–an end to the confu-

sion when calculating defect opportunities for

benchmarking! First revision to the industry's first

consensus document on calculating benchmark

indices for defects and quality. Provides consistent

methodologies for DPMO Index, Component DPMO,

Placement DPMO, Termination DPMO, and Overall

Manufacturing Index (OMI). This document is for

end-of-process benchmarking. Revision A provides

support for unpopulated terminations and has much

clearer examples than those in the original docu-

ment. 12 pages. Released January 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

Purchase both IPC-7912A and IPC-9261 together and save!

(See IPC-DPMO-202)

IPC-9261

In-Process DPMO and Estimated Yield

for PWAs

ANSI Approved. Defines consistent methodologies

for computation of in-process defects per million

opportunities (DPMO) metrics for any evaluation

stage in the assembly process. Intended for use in

measuring in-process assembly steps rather than

end-product determination. A guide to defect cat-

egorization is provided that can serve as a base for

summarizing and reporting in-process defects when

used with IPC-J-STD-001C and IPC-A-610C. Also

used to develop process step estimated yield–the

expected percentage of assemblies with no defects

for a particular process step or combined process

steps, based on historical defect rates. 14 pages.

Released March 2002.

Revision A coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-DPMO-202

IPC-7912/9261 End Item and In-Process

DPMO Set

Both of the industry's standards for computing

DPMO bundled together at a reduced cost.

Save 30%.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC ELEC-SOLDER

Modern Solder Technology for

Competitive Electronics Manufacturing

Reference Book

Details the most current soldering techniques along

with the fundamental principles involved in each

process and clearly relates these principles to today's

practical applications found in many manufacturing

environments. Ideal for material and process trouble-

shooting and includes solder data tables for quick

reference. Highlights include market driving forces,

wetting and solderability, no-clean and water-clean

manufacturing, fine pitch, flip chip, IC lead coating

and BGA technology. Written by Dr. Jennie S. Hwang.

622 pages. Published by McGraw Hill, 1996.

HARD COPY ONLY

IPC members: $100.00

Nonmembers: $100.00

**Kit includes CD and hard copy.

www.ipc.org/onlinestore

14

E L E C T R O N I C S A S S E M B L Y

IPC-9850-K

Surface Mount Placement Equipment

Characterization — KIT

ANSI Approved. Developed to standardize the

parameters, measurement procedures and methodolo-

gies used for the specification, evaluation and continu-

ing verification of assembly equipment characterization

parameters. Establishes the procedures to character-

ize and document machine placement capability of

surface mount assembly equipment while maintaining

a placement accuracy to placement speed relationship.

Kit includes a printed copy of the standard and a CD

with the support spreadsheet, forms and drawing files

(Gerber format) necessary to make the test materials

(not read-only). 60 pages. Released July 2002.

Revision A coming soon – check the online store.

KIT**

IPC members: $40.00

Nonmembers: $80.00

IPC-9850-TM-KW, IPC-9850-TM-K

Test Materials Kit for Surface Mount

Placement Equipment Standardization

Kit includes materials needed to perform the SMT

placement equipment characterization tests to IPC-

9850. The CMM Measurement Verification Panel,

placement verification panels and glass slugs include

NIST certification documentation as required by

the Standard. Glass slug components are available

with or without white background, depending on

which is required for your equipment. When ordering

specify 9850-TM-KW for components WITH white

backgrounds, 9850-TM-K for components WITHOUT

white backgrounds. Test kit includes:

• Four IPC-9850 . Placement Accuracy Verification

Panels

• One IPC-9850. . CMM Measurement Verification

Panel

• 150 IPC-9850 . QFP-100 Glass Components

• 130 IPC-9850 . QFP-208 Glass Components

• 150 IPC-9850 . BGA-228 Glass Components

• NIST Traceable Measurement Certificate

• Custom Storage Case

Technology Information Corporation certifies that the

IPC-9850 Kit meets the highly demanding specifica-

tions of IPC-9850. For pricing information, contact IPC

Customer Service at 847-597-2862.

Note: The Standard is shown above.

REWORK/REPAIR

IPC-7711/21A

Rework and Repair Guide

Everything you need to know for repair and rework

of electronic assemblies and printed circuit boards!

IPC-7711A, Rework of Electronic Assemblies, and

IPC-7721A, Repair and Modification of Printed Boards

and Electronic Assemblies, now include additional sup-

port for BGAs and flex-print repair and all previously

released document updates. IPC-7711A contains pro-

cedural requirements, tools, materials and methods to

be used in removing and replacing conformal coatings,

surface mount and through hole components. IPC-

7721A details procedures for repairing, modifying and

reworking boards and assemblies. This guide with

color illustrations is provided in a three ring binder for

easy updating. Future updates can be downloaded

free from the online store. Supersedes IPC-7711, IPC-

7721 and IPC-R-700. 300+ pages. Released October

2003.

HARD COPY CD OR DOWNLOAD

IPC members: $125.00 $130.00

Nonmembers: $250.00 $255.00

KIT**

IPC members: $180.00

Nonmembers: $360.00

SOLDERABILITY

IPC/EIA/JEDEC J-STD-002B

Solderability Tests for Component Leads,

Terminations, Lugs, Terminals and Wires

ANSI Approved. Provides tools to

assess solderability of electronic

component leads, terminations, solid

wire, stranded wire, lugs and tabs. Notes a significant

change in the type of flux required to be used for

solderability testing. The standard contains test

method choices, defect definitions, acceptance

criteria and illustrations for both suppliers and users.

Produced by IPC. 34 pages. Released February 2003.

PbPb

IPC/EIA/JEDEC J-STD-002C coming soon –

check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers $40.00 $45.00

IPC/EIA J-STD-003A

Solderability Tests for Printed Boards

Offers industry-recommended test methods, defect

definitions and illustrations for suppliers and users

to assess the solderability of printed board surface

conductors, lands and plated-through holes. Notes a

significant change in the type of flux required to be

used for solderability testing. Test methods covered

include edge dip, rotary dip, solder float, wave solder,

and wetting balance. Produced by IPC and EIA. 26

pages. Released February 2003.

PbPb

IPC/EIA J-STD-003B coming soon –

check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-TR-585

Time, Temperature and Humidity Stress of

Final Board Finish Solderability

PbPb

Details the investigations into identifying

stress tests that distinguish between robust

and nonrobust surface finishes. A robust

finish will pass a test for solderability whereas a

nonrobust finish will fail. The stress tests identified do

not necessarily duplicate real world environment

(fabrication of the bare printed board through

assembly), but they must correlate to solderability

performance. The Sequential Electrochemical

Reduction Analysis (SERA) was used extensively to

evaluate the solderability performance of the finishes

after stress exposure. 54 pages. Released May 2006.

DOWNLOAD ONLY

IPC Members $40.00

Nonmembers $80.00

IPC-TR-461

Solderability Evaluation of Thick

and Thin Fused Coatings

Identifies and evaluates the effects of thick and

thin fused coatings on the solderability of PCBs.

29 pages. Released March 1979.

HARD COPY ONLY

IPC members: $30.00

Nonmembers: $60.00

For certification information, go to www.ipc.org/certification

**Kit includes CD and hard copy.

www.ipc.org/onlinestore

www.ipc.org/onlinestore 15

IPC-TR-462

Solderability Evaluation of Printed

Boards with Protective Coatings Over

Long-Term Storage

Provides conclusions and recommendations for the

effectiveness of different protective coatings and

coating application methods. PCB solderability in

typical storage conditions after various time periods

as well as the correlation of time and storage condi-

tions to thickness and coating characteristics are

addressed. 63 pages. Released October 1987.

HARD COPY ONLY

IPC members: $30.00

Nonmembers: $60.00

IPC-TR-464

Accelerated Aging for

Solderability Evaluations

Developed to meet the growing need for a standard

method of evaluating the solderability retention ca-

pability of printed boards during inventory storage.

32 pages. Revised April 1984. Includes seven page

addendum, released December 1987.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-TR-465-1

Round Robin Test on Steam Ager

Temperature Control Stability

Provides test data from 7 companies using 13 dif-

ferent models of steam agers. Program intent was

to evaluate the variability of steam aging equipment

and develop a test procedure to quantify variability so

that it may be controlled. 20 pages. Released 1993.

HARD COPY ONLY

IPC members: $20.00

Nonmembers: $40.00

IPC-TR-465-2

The Effect of Steam Aging Time and Tem-

perature on Solderability Test Results

Details the results of a two-year study to determine

the effect of steam aging exposure on components.

Concludes that 98°C for eight hours is the optimal

condition for industry specifications for both compo-

nent leads and printed boards. 51 pages. Released

July 1996.

HARD COPY ONLY

IPC members: $25.00

Nonmembers: $50.00

IPC-TR-465-3

Evaluation of Steam Aging on Alternative

Finishes, Phase 11A

Reviews the results of a 2-year study to determine

the effect of steam aging exposure on components.

A variety of solderable finishes were used. A small

production simulation utilized preconditioned and

as-received samples and tested a total of 2,000

joints. 15 pages. Released July 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-TR-466

Technical Report: Wetting Balance

Standard Weight Comparison Test

Discusses the results of a program to study the pre-

cision of weight measurements taken on the wet-

ting balance and to correlate weight measurements

between all test users and equipment manufactur-

ers. 16 pages. Released April 1995.

HARD COPY ONLY

IPC members: $20.00

Nonmembers: $40.00

SMC-WP-001

Soldering Capability White Paper Report

Five different industry perspectives provide analysis

of concerns in the electronic packaging industry

about solderability problems. Covers design for

the soldering process, solderable PCBs, solderable

components and soldering process. Developed by

Foster Gray, PC Interconnects. 35 pages. Released

August 1991.

Free DownloaD

SMC-WP-005

PCB Surface Finishes

Seven PCB fabrication experts present their findings

on surface finishes available for printed boards and

the needs of surface mount assembly. Topics range

from surface finish technology drivers and fine pitch

packaging for components to direct chip attach and

solder paste applications. Developed by Foster Gray,

PC Interconnects. 46 pages. Released August 1997.

Free DownloaD

OPTOELECTRONICS

IPC-0040

Optoelectronics Assembly and

Packaging Technology

Addresses implementation of optical and optoelec-

tronic packaging technologies. Areas discussed

include: technology choices, design considerations,

material properties, component mounting and inter-

connecting structures, assembly processes, testing,

application, rework, and reliability of completed

optoelectronic products. Optoelectronic packaging

technologies include active and passive components

and discrete fiber cable, their characteristics, and

the manner in which these parts become an integral

part of the functioning module, board or subassem-

bly. 161 pages. Released May 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $60.00 $65.00

Nonmembers: $120.00 $125.00

IPC-8413-1

Specification for Process Carriers Used

to Handle Optical Fibers in Manufacturing

Defines standard practices for handling various

kinds of optical fiber and the specifications and

guidelines to be used in the design of carriers for

these fibers in component manufacturing. Identified

in the overarching IPC-0040, Optoelectronic As-

sembly and Packaging Technology. Does not define

a particular carrier design, but does define enough

parameters to facilitate the use of fiber carriers in

optoelectronic component manufacturing, particu-

larly in automated or semi-automated processes.

15 pages. Released April 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-8497-1

Cleaning Methods and Contamination

Assessment for Optical Assembly

Describes the methods for inspecting and cleaning

all optical interfaces so that interconnectivity integ-

rity of the optical signal is maintained. Information

focuses on techniques and methods to accomplish

maximum quality of the interface and contamination

prevention. 38 pages. Released January 2006.

HARD COPY CD OR DOWNLOAD.

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

www.ipc.org/onlinestore

16

P R I N T E D C I R C U I T B O A R D S

www.ipc.org/onlinestore

GENERAL

IPC-M-105

Rigid Printed Board Manual*

The latest standards addressing the dimensioning,

tolerancing, qualifying and performance aspects of

rigid printed boards. Provides an in-depth focus on

solderability testing, polymer thick film printed boards,

land pattern and high speed circuitry design. An in-

valuable tool for anyone contemplating the design and

performance characteristics of rigid printed boards.

30 documents are included.

HARD COPY CD OR DOWNLOAD

IPC members: $305.00 $310.00

Nonmembers: $610.00 $615.00

Save more than 59% by purchasing documents together.

IPC-D-325A

Documentation Requirements for

Printed Boards

ANSI Approved. Establishes the general requirements

for documentation necessary to fully describe end

product printed boards, regardless of raw material,

special fabrication requirements, layer count or end

product usage. Includes master drawing requirements,

board definition and artwork/phototooling. 94 pages.

Revised May 1995.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-D-326A

Information Requirements for Manufac-

turing Printed Circuit Boards and Other

Electronic Assemblies

Covers the information requirements for the pro-

curement of material, box build, assembly, system

integration, inspection, test, burn-in, delivery and/or

distribution of electronic assemblies. 5 pages. Re-

leased January 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-PE-740A

Troubleshooting for Printed Board

Manufacture and Assembly

Useful for day-to-day problem solving. Contains case

histories of problems and corrective action in the

design, manufacture, assembly and testing of printed

circuit products. Sections reflect today's manufactur-

ing challenges. Addressing documentation, photo-

tooling, raw materials, mechanical operations, hole-

preparation, plated-through hole, cleaning procedures,

imaging, electroplating, etching, innerlayer fabrication

lamination, soldering, metallic protective coatings,

non metallic protective coatings, component prepara-

tion and assembly, inspection and test, rework and

repair, and an assembly chapter that includes solder-

ing, cleaning and post soldering processes. 388 pages.

Released December 1997.

HARD COPY CD OR DOWNLOAD

IPC members: $105.00 $110.00

Nonmembers: $210.00 $215.00

ACCEPTABILITY

IPC-6010 SERIES

IPC-6010 Qualification and

Performance Series

IPC's qualification and performance specification

standards for every type of printed circuit board. The

series is built around IPC-6011, the base document

which includes all generic requirements for printed

boards, regardless of substrate. Along with IPC-6011,

use the appropriate sectional standard: IPC-6012B,

IPC-6013A, IPC-6015, IPC-6016, and IPC-6018A.

Includes updated surface plating/coating criteria, new

conductor thickness minimums for internal and

external conductors, expanded coverage of annular

ring and breakout conditions, and flexible circuit

requirements including laminate integrity, coverlayer

coverage and squeeze-out.

HARD COPY CD OR DOWNLOAD

IPC members: $110.00 $115.00

Nonmembers: $220.00 $225.00

KIT**

IPC members: $160.00

Nonmembers: $320.00

Save more than 25% by purchasing documents together.

IPC-6011

Generic Performance Specification for

Printed Boards

Establishes the general requirements and responsi-

bilities for suppliers and users of printed boards. As

the foundation of the IPC-6010 Qualification and Per-

formance Series, it describes mandatory quality and

reliability assurance requirements. Use with IPC-6012

through IPC-6018. 15 pages. Released July 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

IPC-6012B

Qualification and Performance

Specification for Rigid Printed Boards

Covers qualification and performance of rigid printed

boards, including single-sided, double-sided, multi-

layer with or without blind/buried vias and metal core

boards. Addresses final finish and surface plating

coating requirements, conductor tolerances, holes/

vias as well as electrical, mechanical and environmen-

tal requirements. Revision B provides requirements

for surface finishes including nickel under gold for

wire bonding and electroless nickel/immersion gold.

Includes requirements for hole size and pattern ac-

curacy, annular ring and breakout detection, defects

within BGA pads, minimum internal and external

conductor thickness, plating voids and thermal stress

testing. For use with IPC-6011. 43 pages. Released

August 2004.

Language

IPC-6012B English

IPC-6012B-IT Italian

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

KIT**

IPC members: $45.00

Nonmembers: $90.00

IPC-6013A

Qualification and Performance

Specification for Flexible Printed

Boards – Includes Amendment 2

For more information, go to page 21.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

**Kit includes CD and hard copy.

17

www.ipc.org/onlinestore

IPC-6015

Qualification & Performance

Specification for Organic Multichip

Module Mounting and Interconnecting

Structures

Establishes the specific requirements for organic

mounting structures used to interconnect chip com-

ponents which, in combination, form the completed

functional organic single-chip module (SCM-L) or or-

ganic multichip module (MCM-L) assembly. Includes

the quality and reliability assurance requirements

that must be met for their acquisition. For use with

IPC-6011. 25 pages. Released February 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-6016

Qualification and Performance

Specification for High Density

Interconnect (HDI) Layers or Boards.

For more information, go to page 19.

IPC-6018A

Microwave End Product Board Inspection

and Test

For more information, go to page 21.

IPC-A-600G

Acceptability of Printed Boards

The definitive illustrated guide to printed circuit

board acceptability! This full color document

provides photographs and illustrations of the

target, acceptable and nonconforming condi-

tions that are either internally or externally

observable on finished printed boards. Make sure

your operators, inspectors, and engineers have the

most current industry consensus information. Revi-

sion G provides coverage on topics such as lifted

lands, surface roughness of wire bond pads and

smear removal. Also covers measling of printed

boards, foreign inclusions, annular ring require-

ments, layer-to-layer spacing and internal and

external conductor thicknesss, as well as cover-

layer coverage, adhesive squeeze-out and laminate

integrity for both flex and rigid-flex boards. With

more than 300 illustrations and photographs,

the document sychronizes to the requirements

expressed in IPC-6012B and IPC-6013A. 126 pages.

Released September 2004.

Language

IPC-A-600G English

IPC-A-600G-CH Chinese

IPC-A-600G-IT Italian

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

KIT**

IPC members: $70.00

Nonmembers: $140.00

IPC-QE-605A

Printed Board Quality Evaluation

Handbook

Contains a variety of photographic illustrations of

anomalies and characteristics of printed boards for

identification of anomalies that are sometimes seen

during inspection and evaluation processes. The

handbook has been divided into 14 distinct sections

covering topics such as solder resist, plated-through

holes, conductor characteristics and surface plating

to aid the user in determining specific accept/non-

conforming criteria for various anomalies. 52 pages.

Released February 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

KIT**

IPC members: $55.00

Nonmembers: $110.00

IPC-HM-860

Specification for Multilayer

Hybrid Circuits

Covers the qualification and performance re-

quirements of multilayer circuits used in hybrid

packaging. These circuits consist of three or more

layers of conductor patterns separated from each

other by insulating materials and interconnected

by a continuous metallic interlayer connection. The

substrate may include passive elements. 66 pages.

Released January 1987.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-TF-870

Qualification and Performance of Polymer

Thick Film Printed Boards

Covers the materials, qualification, certification and

performance requirements for multilayer polymer

thick film (PTF) printed, extrusion deposited, or

otherwise applied conductor, insulator and through

hole technology. May also be used for procure-

ment of single- and double-sided boards. 59 pages.

Released November 1989.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

TABLE OF CONTENTS

General . . . . . . . . . . . 16

Acceptability . . . . . . . . . 16

Fabrication . . . . . . . . . . 18

High density/fine pitch . . . . . . 19

High speed/high frequency . . . . 20

Flexible circuits . . . . . . . . 21

Materials/general . . . . . . . 22

Materials/laminate . . . . . . . 22

Materials/foils . . . . . . . . . 22

Materials/reinforcements. . . . . 23

Quality and test . . . . . . . . 24

**Kit includes CD and hard copy.

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

18

P R I N T E D C I R C U I T B O A R D S

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IPC-ML-960

Qualification and Performance Specifica-

tion for Mass Lamination Panels for Multi-

layer Printed Boards

ANSI Approved. Covers qualification and perfor-

mance requirements of rigid mass laminated panels

for use in multilayer printed boards. Testing proce-

dures and criteria are addressed. 21 pages. Released

July 1994.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-TR-481

Results of Multilayer Tests Program

Round Robin

This report, a round robin test program, was designed

to collect and evaluate data on multilayer boards and

the effects of materials and processing on MLB reli-

ability. 86 pages. Released April 1981.

HARD COPY ONLY

IPC members: $30.00

Nonmembers: $60.00

IPC-TR-551

Quality Assessment of Printed Boards Used

for Mounting and Interconnecting

Electronic Components

Test report with a compendium of technical methods

and techniques used for evaluating the quality aspects

of present and future interconnection products and

electronic assemblies. Addresses base materials,

conductor physical requirements, internal planes,

construction, registration, plated-through holes, com-

ponent mounting areas, cleaning evaluation, solder

mask, and printed board electrical requirements. 104

pages. Released July 1993.

HARD COPY ONLY

IPC members: $30.00

Nonmembers: $60.00

IPC-TR-579

Round Robin Reliability Evaluation of Small

Diameter Plated-Through Holes in PCBs

Approximately 200,000 plated-through holes, (PTH)

covering primarily electroplated but also electroless

technology, were exposed to several different thermal

cycles. A number of PTH diameters, board construc-

tions and plating thicknesses were evaluated. 80

pages. Released September 1988.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

FABRICATION

IPC-4761

Design Guide for Protection of Printed

Board Via Structures

Sole industry guideline providing PCB designers,

manufacturers and users with detailed information

on all existing methods for protecting vias on printed

boards, including all types of via tenting, plugging,

filling and capping. Production issues, long term reli-

ability concerns and material specification and selec-

tion are provided to aid in evaluating the benefits and

concerns for employing each type of via protection. 16

pages. Released July 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

KIT**

IPC members: $50.00

Nonmembers: $100.00

IPC-4552

Specification for Electroless Nickel/Im-

mersion Gold (ENIG) Plating for Printed

Circuit Boards

PbPb

ANSI Approved. Provides guidance on

Electroless Nickel/Immersion Gold (ENIG).

Establishes requirements for the use of ENIG

as a surface finish for printed circuit boards. Contains

full color photographs. Includes requirements for ENIG

deposit thicknesses based on performance criteria.

Invaluable resource for use by suppliers, board

fabricators, electronics manufacturing services (EMS)

and original equipment manufacturers (OEMs).

Appendix includes a copy of the highly sought after

technical paper, "Standard Developments Efforts of

Electroless Nickel Immersion Gold" by George Milad

and Gerard O'Brien. 29 pages. Released October 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC-4553

Specification for Immersion Silver Plating

for Printed Circuit Boards

PbPb

ANSI Approved. Establishes metrics for

immersion silver (IAg) deposit thickness based

on performance criteria and illustrates the

requirements using color photographs and illustrations

for clarity. Second document in a series of specifica-

tions (the first being IPC-4552) that sets the require-

ments for printed circuit board surface finishes that

are alternates to eutectic tin lead. Intended for use by

suppliers, printed circuit manufacturers, electronics

manufacturing services (EMS) providers and original

equipment manufacturers (OEM). Appendices include

a well-written explanatory paper by Gerard O'Brien

and George Milad, entitled "Standard Developments

Efforts of Immersion Silver" as well as an excellent

tutorial, entitled "X-Ray Fluorescence (XRF) Spectros-

copy" by Frank Ferrandino that provides information

on this analytical equipment's use as a plating

thickness control mechanism. 29 pages. Released

June 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $40.00 $45.00

Nonmembers: $80.00 $85.00

IPC-4554

Specification for Immersion Tin Plating for

Printed Circuit Boards

This document is coming soon – check the online store.

**Kit includes CD and hard copy.

19

www.ipc.org/onlinestore

IPC-TR-585

Time, Temperature and Humidity Stress of

Final Board Finish Solderability

For more information, go to page 14.

IPC-DR-572

Drilling Guidelines for Printed Boards

Provides guidelines for drilling quality holes in a

wide range of printed board materials. 11 pages.

Released April 1988.

Revision A coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-IT-95080

Improvements/Alternatives to Mechani-

cal Drilling of PCB Vias

Defines and characterizes alternatives to mechani-

cal drilling of small holes and discusses advances in

mechanical drilling technology. 76 pages. Released

August 1995.

HARD COPY ONLY

IPC members: $150.00

Nonmembers: $300.00

IPC-SM-839

Pre- & Post-Solder Mask Application

Cleaning Guidelines

Covers all aspects of cleaning related to solder

mask application, including board preparation,

in-process control and maintenance of cleanliness

during pre-assembly processes. 22 pages. Released

April 1990.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-SM-840C

Qualification and Performance of

Permanent Solder Mask — Includes

Amendment 1

For more information, go to page 12.

HIGH DENSITY/FINE PITCH

IPC-HDI-1

High Density Interconnect Microvia

Technology Compendium*

The collection is complete. From materials to design

and manufacture, IPC-HDI-1 compiles the standards,

specifications and guidelines your company needs

to produce high density interconnect (HDI) and

microvia boards. This comprehensive resource

comes with multiple documents, including three

joint IPC/Japan Printed Circuit Association (JPCA)

documents.

HARD COPY CD OR DOWNLOAD

IPC members: $140.00 $145.00

Nonmembers: $280.00 $285.00

Save at least 50% by purchasing documents together.

IPC/JPCA-4104

Specification for High Density Intercon-

nect (HDI) and Microvia Materials

ANSI Approved. Covers the various conductive

and dielectric materials that can be used for the

fabrication of HDI and microvias. The 23 specifica-

tion sheets included in IPC/JPCA-4104 cover the

qualification and conformance requirements for

such materials as photoimageable dielectric dry

films and liquids, epoxy blends and coated foils.

IPC/JPCA-4104 also includes six new test methods

developed specifically for the testing of HDI and

microvia materials. 92 pages. Released May 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC-2226

Sectional Design Standard for High

Density Interconnect (HDI) Printed Boards

For more information, go to page 27.

IPC-6016

Qualification & Performance Specifica-

tion for High Density Interconnect (HDI)

Layers or Boards

ANSI Approved. Establishes the specific electrical,

mechanical and environmental requirements for

organic HDI layers with microvia technology. The

acceptance criteria of the HDI layers are organized

into specification sheets that reflect typical end-use

applications, such as cellular phones, avionics,

automotive and personal computers. Key concepts

include: HDI conductive surface requirements,

microvia integrity, HDI electrical properties and

end use application slash sheets. For use with IPC-

6011/6012. 55 pages. Released May 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC/JPCA-6801

IPC/JPCA Terms & Definitions, Test Meth-

ods, and Design Examples for Build-Up/

High Density Interconnect (HDI) Printed

Circuit Boards

Recognizing Japan's leadership in microvia sub-

strate production, the IPC HDI Committee chose

to adopt JPCA-BU01 as IPC/JPCA-6801 to ensure

global consistency in the terminology, requirements

and test methods for HDI and microvia applications.

Lists terms specific to HDI and test methods for

CTE for materials and HDI PCBs, peel strength and

thermal shock. Includes design criteria table and

background information for the development of a

standard for HDI PCBs. 32 pages. Released January

2000.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

20

P R I N T E D C I R C U I T B O A R D S

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IPC-DD-135

Qualification Testing for Deposited Organic

Interlayer Dielectric Materials for

Multichip Modules

Includes qualification and requirements for deposited

organic interlayer dielectric materials for MCM-D

applications. Enables a vendor to evaluate dielectric

materials and express properties in a uniform format.

Provides guidelines for reporting history of specimen

processing. 42 pages. Released August 1995.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-IT-96060

High Density PCB Microvia Evaluation

(October Project) Phase 1, Round 1

First in a series covering the evaluation of several

microvia technologies. Addresses basic microvia

technology with the intent of educating PCB fabrica-

tors and suppliers so that they can make informed

and appropriate investments in resources. Includes

IT-96061, Microvia Manufacturing Technology Cost

Analysis. 76 pages. Released June 1996.

HARD COPY ONLY

IPC members: $150.00

Nonmembers: $300.00

IPC-IT-97071

High Density PCB Microvia Evaluation,

Phase 1, Round 2

Second in a series covering the evaluation of several

microvia technologies. Includes a complete analysis

of different microvia manufacturing technologies and

their compared reliability. 11 pages. Released July

1997.

HARD COPY ONLY

IPC members: $250.00

Nonmembers: $500.00

IPC-IT-30101

High Density PCB Microvia Evaluation,

Phase 1, Round 3

Third in a series, evaluates 16 microvia fabricators that

represent 18 different technologies, the most extensive

evaluation to date. Details the suitability of microvia

technology in high speed/high frequency applications

using data to explain the electrical performance of

microvias. 83 pages. Released March 2000.

HARD COPY ONLY

IPC members: $950.00

Nonmembers: $1900.00

IPC-IT-98123

Microvia Manufacturing Technology Cost

Analysis Report

Cost analysis of microvias conducted by IBIS Associ-

ates. Aids PCB manufacturers during the purchasing

process, to help suppliers improve their working

relationships with PCB manufacturers and to help

OEMs with new product design issues. Provides a

comparison of classic through hole technology to

the same design in microvia technology. 67 pages.

Released December 1998.

HARD COPY ONLY

IPC members: $150.00

Nonmembers: $300.00

HIGH SPEED/HIGH FREQUENCY

IPC-2141A

Design Guide for High-Speed Controlled

Impedance Circuit Boards

Controlled impedance is the maintenance of some

specified tolerance in the characteristic impedance

of an interconnect line (transmission line) that is used

to connect different devices on a circuit. Controlled

impedance is often a design consideration for high-

speed digital or high-frequency analog circuits. Guide

is intended to be used by circuit designers, packaging

engineers, printed board fabricators, and procure-

ment personnel. Revision A includes expanded data

for logic families, updated equations for unbalanced

lines, new equations for balanced line configurations,

and detailed comparisons between capacitive lines

and transmission lines, including propagation within

transmission lines. 53 pages. Released March 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

KIT**

IPC members: $47.00

Nonmembers: $95.00

IPC-2251

Design Guide for the Packaging of High

Speed Electronic Circuits

Addresses the major factors influencing the design of

high-speed circuitry. Considerations include electrical

noise, electromagnetic interference, signal propaga-

tion time, impedance, thermo-mechanical environ-

mental protection, and heat dissipation. Supersedes

IPC-D-317A. Key improvements include updated

impedance models for embedded microstrip, centered

stripline and dual stripline geometries, expanded EMI

layout practices, signal integrity design constraints,

enhanced graphics and updated terms and definitions.

99 pages. Released December 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC-2252

Design Guide for RF/Microwave

Circuit Boards

Provides RF and microwave circuit design engineers,

printed circuit board engineers, packaging engineers

and drafters with information necessary to design

practical, functional and cost effective microwave

circuit boards in the frequency range of 100 MHz to

30 GHz. Guide also applies to operations in the region

where distributed circuits are used instead of conven-

tional lumped circuit elements. 30 pages. Released

June 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-4103

Specification for Base Materials for High

Speed/High Frequency Applications

ANSI Approved. Covers the requirements for high

speed/high frequency laminate or bonding layers to be

used primarily for the fabrication of rigid or multilayer

printed boards for high speed/high frequency electri-

cal and electronic circuits. Supercedes IPC-L-125A.

Improvements include updated bonding layer testing

parameters, inspection lot requirements, revised

visual acceptance criteria and new specification

sheets for hydrocarbon and polyester resin systems.

40 pages. Released January 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

**Kit includes CD and hard copy.

21

www.ipc.org/onlinestore

IPC-6018A

Microwave End Product Board Inspection

and Test

Establishes requirements for qualification and per-

formance of high frequency (microwave) printed cir-

cuit boards. Covers both end product inspection and

test of microwave boards for microstrip, stripline,

mixed dielectric and multilayer stripline applica-

tions. Enhancements over previous version include

updated tables for surface finish requirements and

annular ring, as well as revised requirements for mi-

crosectioned test specimen and production boards.

34 pages. Released January 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

FLEXIBLE CIRCUITS

IPC-M-102

Flexible Circuits Compendium*

Comprehensive compendium of IPC's documentation

for flexible circuits. Includes 15 documents.

HARD COPY CD OR DOWNLOAD

IPC members: $165.00 $170.00

Nonmembers: $330.00 $335.00

Save more than 60% by purchasing documents together.

IPC-2223A

Sectional Design Standard for Flexible

Printed Boards

For more information, see page 26.

IPC-4202

Flexible Base Dielectrics for Use in

Flexible Printed Circuitry

ANSI Approved. Establishes the

requirements for flexible base

dielectric materials that are used in

the fabrication of flexible printed circuitry and

flexible flat cable. Provides comprehensive data that

will help users more easily determine both material

capability and compatibility. Includes flexible base

dielectric material specification sheets which are

identified by material type. Closely aligned with

IPC-4203 and IPC-4204. Supersedes IPC-FC-231C

with Amendment 1 and all former revisions of

IPC-FC-231. 32 pages. Released May 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-4203

Adhesive Coated Dielectric Films for

Use as Cover Sheets for Flexible Printed

Circuitry and Flexible Adhesive Bonding

Films

ANSI Approved. Establishes the

requirements for adhesive coated

dielectric film materials used in the

cover sheets and flexible adhesive bonding films of

fabricated flexible printed circuitry and flexible flat

cable. Provides comprehensive data that will help

users more easily determine both material

capability and compatibility. Includes adhesive-

coated flexible dielectric film material specification

sheets which are identified by material type. Closely

aligned with IPC-4202 and IPC-4204. Supersedes

IPC-FC-232C with Amendment 1 and all former

revisions of IPC-FC-232 and IPC-FC-233. 45 pages.

Released May 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-4204

Flexible Metal-Clad Dielectrics for Use in

Fabrication of Flexible Printed Circuitry

ANSI Approved. Establishes the

requirements for metal-clad

dielectric film materials used in

flexible printed circuitry fabrication and flexible flat

cable. Provides comprehensive data that will more

easily help users determine both material capability

and compatibility. Includes the metal-clad dielectric

film material specification sheets which are

identified by material type. Closely aligned with

IPC-4202 and IPC-4203. Supersedes IPC-FC-241C

and all former revisions of IPC-FC-241. 57 pages.

Released May 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-6013A

Qualification and Performance Specifica-

tion for Flexible Printed Boards – Includes

Amendment 2

Covers qualification and performance requirements

for flexible printed boards designed to IPC-2221

and IPC-2223. The flexible printed board may be

single-sided, double-sided, multilayer or rigid-flex

multilayer. All of these constructions may include

stiffeners, plated-through holes and blind/buried

vias. Revision A with Amendment 2 incorporates

updated requirements for surface plating, microsec-

tion evaluations and acceptance testing frequency.

Supersedes IPC-6013A with Amendment 1. For use

with IPC-6011. 40 pages. Released April 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC/JPCA-6202

IPC/JPCA Performance Guide Manual for

Single-and Double-Sided Flexible Printed

Wiring Boards

Covers the requirements and considerations for

single- and double-sided flexible printed boards.

IPC/JPCA-6202 includes more than 30 figures on ac-

cept/reject criteria for flexible printed boards and an

appendix on the handling of polyimide-based flexible

printed boards. Also included are all seven Japanese

Industrial Standards (JIS) test methods referenced

in IPC/JPCA-6202. 96 pages. Released February 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC-FA-251

Guidelines for Assembly of Single- and

Double-Sided Flex Circuits

ANSI Approved. Describes the type of materials

and processes that may be used to accomplish

proper electronic assembly. 30 pages. Released

February 1992.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

22

P R I N T E D C I R C U I T B O A R D S

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IPC-FC-234

PSA Assembly Guidelines for Single- &

Double-Sided Flexible Printed Circuits

Suggests guidelines for the use of pressure sensitive

adhesives (PSAs) in single- or double-sided flexible

printed circuits, membrane switches and component

attachments. Provides information on adhesive types

and the materials and processes recommended for

their proper use in assembly. 30 pages. Released

December 1997.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

MATERIALS/GENERAL

IPC-M-107

Standards for Printed Board

Materials Manual*

With all the different recipes available for the

manufacture of laminate for PCBs, it is important to

stay current on available materials. Manual set of 18

documents contains the requirements for the various

reinforcements, foils, laminates and prepregs.

HARD COPY CD OR DOWNLOAD

IPC members: $165.00 $170.00

Nonmembers: $330.00 $335.00

Save more than 60% by purchasing documents in a set.

IPC-MI-660

Incoming Inspection of Raw

Materials Manual

Contains background information, applicable specifi-

cation references and industry-approved test methods

for inspection and evaluation of incoming raw materi-

als. Material categories include laminates, multilayer

board materials, various interconnection substrates,

resists and other coatings, processing chemicals,

artwork, registration tools, accessories, soldering

materials, tooling accessories and other materials.

150 pages. Released February 1984.

HARD COPY ONLY

IPC members: $60.00

Nonmembers: $120.00

IPC-4821

Specification for Embedded Passive

Device Capacitor Materials for Rigid and

Multilayer Printed Boards

Describes materials that can be used for the fabrica-

tion of embedded passive capacitor devices within

the finished printed circuit board substrate. For this

document, embedded passive devices and the phrase

embedded passives are considered to be equivalent.

Provides information on general designations and

associated characteristics of embedded passive

device (EPD) capacitor materials. Use document as a

qualification and conformance standard for these ma-

terials. Contains material designation, conformance

(requirements), qualification (characterization) and

quality assurance specifications. Covers requirements

for dielectric, conductive, and insulating materials that

are used with materials for the manufacture of printed

circuit boards containing embedded passive capacitor

functionality. 34 pages. Released May 2006.

HARD COPY CD OR DOWNLOAD

IPC Members: $40.00 $45.00

Nonmembers: $80.00 $85.00

KIT**

IPC Members: $60.00

Nonmembers: $120.00

MATERIALS/LAMINATE

IPC-4101B

Specification for Base Materials for Rigid

and Multilayer Printed Boards

PbPb

Covers the requirements for base materials

(laminate and prepreg) to be used primarily for

rigid or multilayer printed boards for electrical

and electronic circuits. Contains more than 50

separate specification sheets and uses search terms

to help find similar groups of materials from these

sheets. Provides user with information and data on

printed circuit board materials that can better

withstand the newer assembly operations employing

higher thermal exposures, including assembly

practices that utilize the commonly encountered lead

free solders. 112 pages. Released June 2006.

HARD COPY CD OR DOWNLOAD

IPC Members: $45.00 $50.00

Nonmembers: $90.00 $95.00

KIT**

IPC Members: $70.00

Nonmembers: $140.00

IPC-4121

Guidelines for Selecting Core Construc-

tion for Multilayer Printed Wiring Board

Applications

ANSI Approved. A "must have" for those responsible

for purchasing laminate materials for their company.

Provides industry-approved guidelines for selecting

core constructions for multilayer printed circuit boards

(PCBs). Contains sheets that categorize the differ-

ent core constructions by laminate type and nominal

thickness. The constructions are rated for character-

istics such as dielectric constant (DK), dimensional

stability (DS), flatness, smoothness and drillability.

Supersedes IPC-CC-110A. 12 pages. January 2000.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

MATERIALS/FOILS

IPC-4562

Metal Foil for Printed Wiring Applications

ANSI Approved. Covers the nomen-

clature and requirements for metal

foils used in laminate and PCB

fabrication. Includes specification sheets to assist

buyers and suppliers in understanding and using

consistent purchasing and quality criteria for metal

foils. Supersedes IPC-MF-150F. Amendment 1 is

available as a free download at the online store. 27

pages. Released May 2000.

Revision A coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-CF-148A

Resin Coated Metal for Printed Boards

ANSI Approved. Establishes the requirements for

metal foils coated with a resin or composite of resins

on one side to be used for the fabrication of PCBs.

Includes a series of specification sheets that outline

engineering and performance data for resin-coated

metal foil, indicating foil material type and resin type.

76 pages. Released September 1998.

IPC-4563, Resin Coated Metal for Printed Boards Guidelines

coming soon – check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

**Kit includes CD and hard copy.

23

www.ipc.org/onlinestore

IPC-CF-152B

Composite Metallic Materials

Specification for Printed Circuit Boards

Details the requirements for copper/invar/copper

(CIC), copper/molybdenum/copper (CMC) and three-

layer composites for use in electronic applica-

tions. Includes specification sheets that outline

engineering and performance data for each type

of composite metallic materials. 39 pages. Revised

March 1997.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-TR-485

Results of Copper Foil Rupture Strength

Test Round Robin Study

Evaluation of rupture strength testing as a means

for determining the mechanical properties of

electrodeposited and rolled copper foil. 27 pages.

Released March 1985.

HARD COPY ONLY

IPC members: $20.00

Nonmembers: $40.00

MATERIALS/REINFORCEMENTS

IPC-4412A

Specification for Finished Fabric Woven

from "E" Glass for Printed Boards

Exhaustively covers the classification and require-

ments for finished fabrics woven from "E" glass

fiber yarns. These yarns are formed from fila-

ments of electrical-grade glass and are intended

as reinforcing materials in laminated plastics for

electrical and electronic uses. The fabrics cov-

ered by this specification are all of a plain-weave

construction. Includes two extensive tables of

finished fabric glass styles, one in SI units and the

other in US units. Supersedes IPC-4412, IPC-EG-140

with Amendments 1 & 2 and IPC-EG-140. 19 pages.

Released January 2006.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-4130

Specification & Characterization

Methods for Nonwoven "E" Glass Mat

ANSI Approved. Determines the nomenclature,

definitions and requirements for materials made

from nonwoven "E" glass fibers. Includes specifi-

cation sheets for selecting and purchasing these

materials. 14 pages. Released September 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-4110

Specification and Characterization

Methods for Nonwoven Cellulose Based

Paper for Printed Boards

ANSI Approved. Determines the nomenclature and

chemical and physical requirements of paper made

from cellulose fibers for PCB fabrication. Includes

specification sheets for selecting and purchasing

these materials. 11 pages. Released August 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-4411A

Specification and Characterization

Methods for Nonwoven Para-Aramid

Reinforcement

Covers the nomenclature and requirements for rein-

forcement made from nonwoven para-aramid fibers

which are primarily used in PCBs for HDI and high

speed/high frequency applications. Includes specifi-

cation sheets, that can be used when selecting and

purchasing nonwoven para-aramid reinforcement.

Incorporates 14 new specification sheets. Due to a

test method correction, all specification sheets have

been updated. 22 pages. Released November 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC-SG-141

Specification for Finished Fabric Woven

from "S" Glass for Printed Boards

Covers the classification and requirements for fin-

ished fabrics woven from "S" glass, electrical grade

glass fiber yarns intended as a reinforcing material

in laminated plastics for electrical and electronic

use. 12 pages. Released February 1992.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-A-142

Specification for Finished Fabric Woven

from Aramid for Printed Boards

Covers finished fabrics woven from aramid yarns

that are intended as reinforcing material in

laminated plastics for electrical and electronic use.

All fabrics covered by this specification are plain

weave. 9 pages. Released June 1990.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-QF-143

Specification for Finished Fabric Woven

from Quartz (Pure Fused Silica) for

Printed Boards

ANSI Approved. Covers classification and require-

ments for finished fabrics woven from quartz fiber

yarns that are intended as a reinforcing material in

laminated plastics for electrical and electronic use.

13 pages. Released February 1992.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

24

P R I N T E D C I R C U I T B O A R D S

www.ipc.org/onlinestore

QUALITY AND TEST

IPC-9691

User Guide for the IPC-TM-650, Method

2.6.25, Conductive Anodic Filament (CAF)

Resistance Test (Electrochemical

Migration Testing)

Drafted to provide guidance regarding how the IPC-

TM-650, Method 2.6.25, Conductive Anodic Filament

(CAF) Resistance Test can best be used for evaluating

the effects of mechanical stress, laminate material

fracturing, ionic contamination, moisture content prior

to press lamination, and other material processing

characteristics on conductive anodic filament (CAF)

growth. CAF test method provides a proven standard

for determining the risk of temperature/humidity/bias

(THB) failure within rather than on the surface of print-

ed circuit boards (PCBs), typically filament formation

along the boundary between the resin and laminate

reinforcement. 22 pages. Released June 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-2524

PWB Fabrication Data Quality Rating

System

Describes a PCB fabrication data quality rating system

used by fabricators to evaluate incoming data pack-

age integrity. Includes information on conformance to

both fabricator and customer design rules and can be

used by printed board designers as an output quality

check. 16 pages. Released February 1999.

Free DownloaD

IPC-9151A

Printed Board Process, Capability, Quality

and Relative Reliability (PCQR2) Benchmark

Test Standard and Database

Many printed circuit board buyers have developed

internal processes to evaluate the capabilities of their

printed circuit board manufacturers/IMS companies.

Manufacturers often receive multiple requests from

multiple customers to manufacture test panels as

part of qualification procedures. The PCQR2 program

provides an industry standard for the design of these

benchmark process capability test panels. Data result-

ing from this process provides database subscribers

with the ability to review detailed results from indi-

vidual manufacturers and to compare the capabilities

of multiple fabricators across the industry. IPC-9151A

describes the process for evaluating the manufacturing

capability of key attributes specified in the design and

acceptability standards controlled by IPC. More infor-

mation is available at www.pcbquality.com. 7 pages.

Released May 2003. Free DownloaD

IPC-9191

General Guidelines for Implementation of

Statistical Process Control (SPC)

ANSI Approved. Outlines the SPC philosophy, imple-

mentation strategies, tools and techniques used for

relating process control and capability to final product

requirements. Reflects the principles of statistical

process control (SPC) represented by ISO/DIS 11462-1,

Guidelines for Implementation of Statistical Process

Control (SPC) – Part 1: Elements of SPC. Supersedes

IPC-PC-90. 43 pages. Released November 1999.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC-9194

Implementation of Statistical Process

Control (SPC) Applied to Printed Board

Assembly Manufacture Guideline

Intended to aid in interpretation of the requirements

in IPC-9191, General Guidelines for Implementation

of Statistical Process Control, specifically for printed

board assembly (PBA) manufacture. Promotes process

thinking and control of process inputs, in-process

parameters and process outputs, including product

parameters. Organizes various aspects of process

control in the Plan, Do, Check and Act (PDCA) cycle.

Establishes practical guidelines for the implementa-

tion of SPC in the electronics manufacturing opera-

tions for continually improving processes and reducing

waste. Should be used in tandem with IPC-9191; the

standards are cross-referenced to each other in the

Appendices of IPC-9194. 36 pages. Released

September 2004.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-9199

Statistical Process Control (SPC)

Quality Rating

Used as a tool for a customer or supplier organiza-

tion's internal audit group to assess a statistical pro-

cess control (SPC) system against the requirements of

IPC-9191. Valuable to customers and suppliers of any

size and for any commodity. Can be used to perform

an assessment of the use of SPC at both organization-

al and process levels. The questions on the evaluation

form provided are based on the guidelines for SPC

implementation given in IPC-9191. Includes instruc-

tions to obtain Microsoft Word™ Template format

of sections 4 through 6 for electronically recording

information gained during the audit process. 41 pages.

Released September 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

25

www.ipc.org/onlinestore

IPC-9252

Guidelines and Requirements for

Electrical Testing of Unpopulated

Printed Boards

Defines different levels of appropriate testing and

assists in the selection of the test analyzer, test

parameters, test data and fixturing required to

perform electrical test(s) on unpopulated boards and

inner layers. Supersedes IPC-ET-652A. 20 pages.

Released February 2001.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IT-97061

PCB Hole to Land Misregistration: Causes

and Reliability

Discusses the root causes of misregistration,

recommendations for proper constructions and

the need for an intact annular ring with the overall

intent of aiding in the manufacture of reliable, high

density PCB products. Project critically examined

registration requirements, primarily through a reli-

ability test program, literature searches and surveys

of manufacturers. 11 pages. Released June 1997.

HARD COPY ONLY

IPC members: $150.00

Nonmembers: $300.00

IT-98103

Reliability of Misregistered and Landless

Innerlayer Interconnects in Thick Panels

Explains interconnect configuration, design and

manufacturing relationships and their influence on

interconnect reliability. Effort is a continuation of

the "PCB Hole-to-Land Misregistration: Causes and

Reliability" study that intact annular ring require-

ments may be too conservative. Study expands

on that conclusion by incorporating more board

variables and test considerations. Results indicate

that hole size, glass transition temperature and foil

thickness influence reliability while interconnect

configuration and conductor width have less impact.

180 pages. Released October 1998.

HARD COPY ONLY

IPC members: $150.00

Nonmembers: $300.00

IPC-MS-810

Guidelines for High Volume Microsection

Discusses the many variables and problems as-

sociated with the process, from sample removal to

micro-etch, and the variables common to high vol-

ume microsection. Process variables and problems

are organized to ease research of a specific issue or

overview the variables of a process area. 31 pages.

Released October 1993.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC-QL-653A

Certification of Facilities that Inspect/

Test Printed Boards, Components &

Materials

Establishes the certification requirements for facili-

ties that inspect/test printed boards, components

and materials. Provides a minimum standardized

basis for evaluating or auditing a technically ori-

ented inspection/testing facility. 15 pages. Revised

November 1997.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-TR-483

Dimensional Stability Testing of Thin

Laminates–Report on Phases 1 and 2

International Round Robin Test Programs

Provides test results of project to define a test pro-

cedure to evaluate thin laminate material (phase 1)

and expand that project by adding a thermal stress

cycle to the existing IPC Test Method 2.4.39 (phase

2). 74 pages. Revised March 1991.

HARD COPY ONLY

IPC members: $30.00

Nonmembers: $60.00

IPC-TR-486

Report on Round Robin Study to Correlate

IST & Microsectioning Evaluations for

Detecting the Presence of Inner-Layer

Separation

Provides full detail of the round robin study charged

with assessing the use of Interconnect Stress Test

(IST) for incoming inspection in lieu of Thermal

Stress in the detection of innerlayer separations

in plated-through holes. Includes background on

the Post Separation Task Group, test results, round

robin test plan, conclusions and test methods used.

51 pages. Released July 2001.

HARD COPY CD OR DOWNLOAD

IPC members: $50.00 $55.00

Nonmembers: $100.00 $105.00

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

26

D E S I G N

www.ipc.org/onlinestore

GENERAL

IPC-M-106

Technology Reference for Design Manual*

Provides an excellent compilation of standards essen-

tial to the library of any designer considering physical

design principles, customer reliability requirements

and surface mount and high-speed logic design. Set of

28 documents brings sharp focus on aspects of printed

board technology such as high density interconnects,

flexible printed board design, controlled impedance,

usage of phototooling to improve artwork quality, and

Design for Reliability (DFR) procedures.

HARD COPY CD OR DOWNLOAD

IPC members: $275.00 $280.00

Nonmembers: $550.00 $555.00

Save more than 55% by purchasing the manual.

REQUIREMENTS

IPC-2220

Design Standards Series

Put IPC's design library at your fingertips! The

IPC-2220 Design Standards Series includes all IPC

current design standards in the IPC-2220 family. The

series is built around IPC-2221A, Generic Standard on

Printed Board Design, the base document that covers

all generic requirements for printed board design,

regardless of materials. The designer can choose

the appropriate sectional standard for a technology.

Contains IPC-2221-2226.

HARD COPY CD OR DOWNLOAD

IPC members: $80.00 $85.00

Nonmembers: $160.00 $165.00

KIT**

IPC members: $115.00

Nonmembers: $230.00

Save more than 40% by purchasing the series.

IPC-2221A

Generic Standard on Printed Board Design

Considered the foundation design standard for all

documents in the IPC-2220 series. Establishes the

generic requirements for the design of printed boards

and other forms of component mounting or intercon-

necting structures, whether single-sided, double-sided

or multilayer. Revision A includes new criteria for

surface plating, internal and external foil thicknesses,

component placement and hole tolerances.

Expanded coverage is provided for material proper-

ties, dimensioning and tolerancing rules and via struc-

tures, as well as updated coupon designs for quality

assurance. 112 pages. Released May 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

KIT**

IPC members: $45.00

Nonmembers: $90.00

IPC-2222

Sectional Standard on Rigid Organic

Printed Boards

Used in conjunction with IPC-2221A, IPC-2222

establishes the design requirements of rigid organic

printed boards and other component mounting and

interconnecting structures. Applies to single-sided,

double-sided or multilayered boards. Key concepts

include: rigid laminate properties, designer/end user

materials section map, scoring parameters and lead to

hole relationships. IPC-2221A and IPC-2222 supersede

IPC-D-275. 35 pages. Released February 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

KIT*

IPC members: $35.00

Nonmembers: $70.00

IPC-2223A

Sectional Design Standard for Flexible

Printed Boards

Used in conjunction with IPC-2221A, IPC-2223A estab-

lishes the requirements for the design of single-sided,

double-sided, multilayer, or rigid-flex flexible circuits.

Revision A includes updated design rules for panel

sizes, hole spacing, bend radii, shielding, palletization,

nonfunctional lands, coverlayer access/spacing and

conductor edge spacing. 24 pages. Released June

2004.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

IPC-2224

Sectional Standard on Design of PCB for

PC Cards

Used in conjunction with IPC-2221A, IPC-2224 estab-

lishes the design requirements of printed boards for

PC card form factors. Key concepts include bow and

twist constraints, heat dissipation considerations

and component placement requirements. 26 pages.

Released January 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

IPC-2225

Sectional Design Standard for Organic

Multichip Modules (MCM-L) and

MCM-L Assemblies

ANSI Approved. Used in conjunction with IPC-2221A,

IPC-2225 establishes the requirements and consid-

erations (thermal, electrical, electromechanical and

mechanical) for the design of single chip module

(SCM-L), multichip module (MCM) and MCM-L as-

semblies. Key concepts include adhesive interconnec-

tion information, typical die attach materials, microvia

material properties and relationships with Design for

Manufacturability (DFM) and Design for the Environ-

ment (DFE). 44 pages. Released May 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

ARE YOU A DESIGNER?

Join IPC’s Designers Council for

• Special member price on design-related workshops, certifications, standards and courses

• Access to IPC Designers Council e-mail forums

• $50 coupon toward design-related IPC documents, videos, CDs

• Networking and education in local chapters.

Go to http://dc.ipc.org for more information.

*For a listing of included documents, visit the online store or contact customer service at 847-597-2862.

**Kit includes CD and hard copy.

27

www.ipc.org/onlinestore

IPC-2226

Sectional Design Standard for High

Density Interconnect (HDI) Printed Boards

Used in conjunction with IPC-2221A, this standard

establishes requirements and considerations for the

design of high density interconnect (HDI) printed

boards and its forms of component mounting and

interconnecting structures. Provides recommenda-

tions for signal, power, ground and mixed distribu-

tion layers, dielectric separation, via formation

and metallization requirements and other design

features that are necessary for HDI-advanced IC

interconnection substrates. Trade-off analyses

required to match the mounting structure to the

selected chip set also included. 49 pages. Released

April 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $35.00 $40.00

Nonmembers: $70.00 $75.00

IPC-7351

Generic Requirements for Surface Mount

Land Pattern and Design Standard

PbPb

The successor to IPC-SM-782A, this

standard covers land pattern design for all

types of passive and active components,

including resistors, capacitors, MELFs, SSOPs,

TSSOPs, QFPs, BGAs, QFNs and SONs. Provides

many new features, such as intelligent land pattern

naming convention, zero component rotations for

CAD systems, and a set of three separate land

pattern geometries for each component that allows

the user to select a land pattern based on desired

component density. Also includes updates to

existing sections addressing land pattern guidelines

for wave or reflow soldering, via location guidelines,

fiducials and courtyard boundaries. IPC-7351

includes both the standard and an IPC-7351 land

pattern viewer on CD-ROM. Replaces IPC-SM-782A.

92 pages. Released February 2005.

Revision A coming soon – please check the online store.

HARD COPY CD OR DOWNLOAD

IPC members: $50.00 $55.00

Nonmembers: $100.00 $105.00

IPC-D-859

Design Standard for Thick Film Multilayer

Hybrid Circuits

ANSI Approved. Covers the requirements and

considerations for the design of multilayer hybrid

circuits based on industry manufacturing capabili-

ties. 80 pages. Released December 1989.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-1902

IPC/IEC Grid Systems for Printed Circuits

An international standard adopted by IPC that

ensures compatibility between printed circuits and

the components to be mounted on them at grid

intersections. Includes discussion of the need to

develop specialized modular grids so as to permit

flexibility in future designs. 6 pages. Released in

December 1998.

HARD COPY CD OR DOWNLOAD

IPC members: $15.00 $20.00

Nonmembers: $30.00 $35.00

GUIDELINES

IPC/JPCA-2315

Design Guide for High Density

Interconnects & Microvias

Provides an easy to follow tutorial on the selection

of HDI and microvia design rules and structures. Ad-

dresses various considerations when designing an

HDI printed circuit board, including design examples

and processes, selection of materials, general

descriptions, and various microvia technologies.

Offers designers and manufacturers one source for

reliable design and manufacturability information

for commonly produced HDI boards. Includes more

than 30 full color illustrations. Published jointly with

the Japan Printed Circuit Association. 33 pages.

Released June 2000.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

IPC-2615

Printed Board Dimensions and Tolerances

The definitive standard on printed board dimen-

sioning and tolerancing. Consistent with other

IPC printed board standards such as IPC-6012 and

IPC-2221. Includes fundamental dimensioning and

tolerancing rules; positional, profile, orientation and

form tolerances; and detailed geometric symbol-

ogy. Invaluable to the PCB designer, this document

will help manufacturers and board purchasers

achieve the most manufacturable board designs.

Supersedes IPC-D-300G for fundamental dimension-

ing and tolerancing rules. 66 pages. Released July

2000.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-A-311

Process Controls for Phototool Genera-

tion and Use

Covers the information and data to be collected

during the generation and use of phototools to

improve artwork quality, thereby improving yields

downstream. Helps establish and maintain ISO 9000

certification and statistical process control (SPC)

by facilitating troubleshooting, standardizing the

process for both experienced and inexperienced op-

erators and by identifying process improvements for

the ultimate elimination of inspection and touchup

of artwork. 6 pages. Released March 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

TABLE OF CONTENTS

General . . . . . . . . . . 26

Requirements . . . . . . . . 26

Guidelines . . . . . . . . . 27

Certification. . . . . . . . . 28

Data Transfer . . . . . . . . 28

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

28

D E S I G N

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IPC-D-279

Design Guidelines for Reliable Surface

Mount Technology Printed Board

Assemblies

Establishes design concepts, guidelines and proce-

dures for reliable printed circuit assemblies. Focuses

on SMT or mixed technology PWAs, specifically

addressing the interconnect structure and the solder

joint itself. Discusses substrates, components, attach-

ment materials, coatings and assembly processes and

testing considerations. Contains detailed appendices

covering: solder attachments, plated-through via

structures, insulation resistance, thermal consider-

ations, environmental stresses, coefficient of thermal

expansion, electrostatic discharge, solvents, testabil-

ity, corrosion, aerospace and high altitude concerns.

137 pages. Released July 1996.

HARD COPY CD OR DOWNLOAD

IPC members: $45.00 $50.00

Nonmembers: $90.00 $95.00

KIT**

IPC members: $70.00

Nonmembers: $140.00

IPC-D-310C

Guidelines for Phototool Generation and

Measurement Techniques

ANSI Approved. Provides manufacturing and design

considerations, input data requirements, test coupons,

process control, tape and preform artwork, cut and

strip artwork, vector photoplotting, rasterplotting,

direct imaging, measurement and quality assurance.

68 pages. Revised June 1991.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-D-322

Guidelines for Selecting Printed Wiring

Board Sizes Using Standard Panel Sizes

ANSI Approved. Defines guidelines for choosing sizes

of printed circuit boards using standard fabrication

panel sizes. 4 pages. Reaffirmed September 1991.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

IPC-D-422

Design Guide for Press Fit Rigid Printed

Board Backplanes

Contains backplane design information from the fab-

rication and assembly perspective. Includes sections

on design and documentation, fabrication, assembly,

repair, and inspection. 17 pages. Revised September

1982.

HARD COPY CD OR DOWNLOAD

IPC members: $20.00 $25.00

Nonmembers: $40.00 $45.00

CERTIFICATION

IPC-PWBADV-SG02 (Hard Copy)

IPC-PWBADV-CD (CD)

PCB Advanced Designer Certification

Study Guide

Establishes the criteria and provides all necessary

information to prepare designers for the IPC Advanced

PCB Designer Certification Exam. Covers all ten sec-

tions of the exam: layout, electrical considerations,

material, component requirements, assembly require-

ments, board fabrication, physical board characteris-

tics, documentation, inspection and reliability. Follows

the same approach used in the IPC Advanced PCB

Designer Certification Preparation Workshop. May

be used as a self-study guide. 293 pages. Released

January 2002.

HARD COPY CD

IPC members: $75.00 $185.00

Nonmembers: $150.00 $285.00

IPC-PWB-CRT-SG01 (Hard Copy)

IPC-PWB-CERTCD01 (CD)

PCB Designer Certification Study Guide

Prepares designers for the IPC PCB Designer Certi-

fication Exam. Covers design considerations, layout

principles, component and assembly issues, printed

board characteristics, documentation and dimension-

ing. Addresses each of the ten sections of the exam,

including electrical considerations, material proper-

ties, board fabrication, testing technology and reliabil-

ity. Follows the same approach used in the IPC PCB

Designer Certification Preparation Workshop. May be

used as a self-study document. 174 pages.

HARD COPY CD

IPC members: $35.00 $125.00

Nonmembers: $70.00 $225.00

DATA TRANSFER

IPC-2501

Definition for Web-Based Exchange of

XML Data

ANSI Approved. Establishes the governing semantics

and an XML based syntax for shop floor commu-

nication between electronic assembly equipment

and associated software applications. Outlines the

communication architecture and supporting XML

messages. Describes a messaging interface that is

based upon an architecture whereby a single logical

middleware server (the Message Broker) exchanges

messages among clients in a domain. 32 pages.

Released July 2003.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2531

Standard Recipe File Format (SRFF)

Specification

Outlines the requirements that an SRFF file must

meet. Describes the file format, outlines the file

sections and indicates how data should be repre-

sented through objects. Objects can either be vendor

independent (generic objects defined in this docu-

ment) or vendor specific (objects created by a vendor).

Includes error codes that should be used to report

specific information about improperly constructed

files. General guidelines for producing an SRFF file and

vendor specific objects are also included. 125 pages.

Published March 1999.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

**Kit includes CD and hard copy.

Learn more about Designer Certification

at http://dc.ipc.org

29

www.ipc.org/onlinestore

IPC-2541

Generic Requirements for Electronics

Manufacturing Shop Floor Equipment

Communication (CAMX)

ANSI Approved. Defines an XML encoding schema

to facilitate plug-and-play characteristics in a

factory's shop-floor information system. Describes

the generic event message content and should be

used together with the IPC-2540 series sectional

documents, which define the set of messages and

key attributes of specific classes of equipment used

in the electronics manufacturing area. 175 pages.

Released October 2001.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2546

Sectional Requirements for Shop-Floor

Equipment Communication Messages

(CAMX) for Printed Circuit Board

Assembly – with Amendments 1 & 2

ANSI Approved. Describes the event message

content specific to assembly equipment. The types

of processes covered by IPC-2546 include material

movement systems like conveyors and buffers,

manual placement, automated screen printing,

automated adhesive dispensing, automated surface

mount placement, automated plated-through hole

placement, forced convection and infrared reflow

ovens, and wave soldering. Amendment 1 provides

the requirements for screen printing equipment.

108 pages. Released January 2003. Amendment 2

covers the Dispensing Equipment, Reflow Equip-

ment, and Final Assembly and Packaging sections of

IPC-2546 and is a supplement to the standard. 131

pages. Released January 2005.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2547

Sectional Requirements for Shop Floor

Equipment Communication Messages

(CAMX) for Printed Circuit Board Test

ANSI Approved. Describes event message content

and an XML encoding scheme, which enables a

detailed definition of messages in the domain of

electronics inspection, test and repair/rework (i.e.

product and process quality). These messages are

to be encoded at a level appropriate to facilitate

interoperability in the factory shop floor equipment

and information system integration process. Should

be used with the generic document, IPC-2541. 52

pages. Released January 2002.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2571

Generic Requirements for Electronics

Manufacturing Supply Chain Communica-

tion—Product Data eXchange (PDX)

ANSI Approved. Defines an XML encoding schema

which enables a total product definition to be

described at a level appropriate to facilitate supply

chain interactions. The schema is defined for bill of

materials (BOM), approved manufacturer list (AML),

changes (engineering, manufacturing, product) and

references to documents describing geometric and

other definition characteristics. 43 pages. Released

November 2001.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2576

Sectional Requirements for Electronics

Manufacturing Supply Chain Communica-

tion of As-Built Product Data — Product

Data eXchange

ANSI Approved. Covers the sectional requirements

for product genealogy or as-built manufacturing

information. Facilitates the exchange of manufac-

turing information between supply chain partners

to support warranty tracking, product excursion

containment and product quality functions. 9 pages.

Released November 2001.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2578

Sectional Requirements for Supply

Chain Communication of Bill of Material

and Product Design Configuration Data

— Product Data eXchange

ANSI Approved. Provides an XML encoding scheme

for use by electronics manufacturing supply chain

partners to exchange sufficient product data to en-

able distributed manufacturing. Information includes

bills of material (BOM), approved manufacturer lists

(AML), approved supplier lists (ASL), change history

and engineering change orders, and a high-level

description of the components listed on a bill of

material. 34 pages. Released November 2001.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2511A

Generic Requirements for Implementation

of Product Manufacturing Description

Data & Transfer Methodology

Revision A of IPC-2511 (GenCAM 1.5) identifies the

generic requirements for implementation of product

manufacturing description data and transfer using

BNF code. Helps users transfer design require-

ments and manufacturing expectations from

computer-aided design systems to computer-aided

manufacturing systems for printed board fabrica-

tion, assembly and test. Establishes the rules and

protocol of describing data for electronic transfer in

a neutral format. GenCAM® is a user-friendly stan-

dardized format documented in a series of seven

major sectional standards identified as IPC-2510.

All seven documents, numbered IPC-2512A through

IPC-2518A, were released in November 2000. For

more information go to the online store. 199 pages.

Released January 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

D E S I G N

30

IPC-2511B

Generic Requirements for Implementation

of Product Manufacturing Description Data

& Transfer XML Schema Methodology

ANSI Approved. Specifies the XML schema that rep-

resents the data file format used to describe printed

board and printed board assembly products with

details sufficient for tooling, manufacturing, assembly,

inspection and testing requirements. Format may be

used for transmitting information between a printed

board designer and a manufacturing or assembly facil-

ity. Data is most useful when the manufacturing cycle

includes computer-aided processes and numerical

control machines. 182 pages. Released January 2002.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2512A

Sectional Requirements for Implementation

of Administrative Methods for Manufactur-

ing Data Description

Sectional requirement for implementation of adminis-

tration information related to ordering and specifying

printed boards, printed board assemblies, fixtures

and components. IPC-2511 is a mandatory part of this

standard. It is part of the GenCAM® Series. 18 pages.

Released November 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2513A

Sectional Requirements for Implementa-

tion of Drawing Methods for Manufacturing

Data Description

Defines the sectional requirements for implementa-

tion of drawing methods for manufacturing data

description. IPC-2511 is a mandatory part of this

standard. It is part of the GenCAM® Series. 26 pages.

Released November 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2514A

Sectional Requirements for

Implementation of Printed Board

Fabrication Data Description

Defines the sectional requirements for implementa-

tion of printed board fabrication data description.

IPC-2511 is a mandatory part of this standard. It is

part of the GenCAM® Series. 23 pages. Released

November 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2515A

Sectional Requirements for Implementa-

tion of Bare-Board Product Testing Data

Description

Defines the sectional requirements for implementa-

tion of bare board product electrical testing data

description. IPC-2511 is a mandatory part of this

standard. It is part of the GenCAM® Series. 20 pages.

Released November 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2516A

Sectional Requirements for Implementation

of Assembled Board Product Manufactur-

ing Data Description

Defines the sectional requirements for implementa-

tion of assembled board product manufacturing data

description. IPC-2511 is a mandatory part of this

standard. It is part of the GenCAM® Series. 19 pages.

Released November 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2517A

Sectional Requirements for Implementation

of Assembly In-Circuit Test Data Description

Defines the sectional requirements for implementa-

tion of assembly in-circuit test data description.

IPC-2511 is a mandatory part of this standard. It is

part of the GenCAM® Series. 24 pages. Released

November 2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-2518A

Sectional Requirements for Implementation

of Parts List Product Manufacturing Data

Description

Defines the sectional requirements for implementa-

tion of parts list product data description. IPC-2511

is a mandatory part of this standard. It is part of the

GenCAM® Series. 18 pages. Released November

2000.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

IPC-D-356B

Bare Substrate Electrical Test Data Format

Describes a data format for transmitting bare board

electrical test information in digital form including

data suitable for computer-aided repair. When used as

a netlist input to test data processing, the receiver of

IPC-D-356B data will determine test point assignments

and positioning. Enhancements to Revision B include

updates to the concept of testable areas to account

for SMD pads and unusually shaped pads, updating of

complex records for representing all inter-layer con-

nections in nets, a simple polygon description format

that improves graphical representation of the bare

board, and new methods for identifying endpoints and

midpoints. 61 pages. Released October 2002.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-2581

Generic Requirements for Printed Board

Assembly Products Manufacturing

Description Data and Transfer Methodology

ANSI Approved. Specifies the XML schema used to

describe printed board and printed board assembly

products with details sufficient for tooling, manufac-

turing, assembly, and inspection requirements. The

format is a convergence of the Valor Computerized

Systems ODB++ and IPC-2511B GenCAM® format

structure in XML schema. Format may be used for

transmitting information between a printed board

designer and a manufacturing or assembly facility.

The data is most useful when the manufacturing cycle

includes computer-aided processes and numerical

control machines. 161 pages. Released March 2004.

HARD COPY

IPC members: $35.00

Nonmembers: $70.00

Free DownloaD

www.ipc.org/onlinestore www.ipc.org/onlinestore

D E S I G N

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

GENERAL

IPC-1710A

OEM Standard for Printed Board

Manufacturers' Qualification

Profile (MQP)

Sets the standard for assessing PWB manufacturer

capabilities and allows PCB manufacturers to more

readily satisfy customer requirements. Eases audit-

ing processes and reduces the frequency of audits,

thereby decreasing paperwork and enhancing man-

ufacturer effectiveness. Revision A consists of a

single, easy to use electronic file (Microsoft WordTM

template) providing the capability of electronically

consolidating and organizing data. This process

improves the system of updating and transferring

information between manufacturers and customers.

49 pages. Released July 2004. Free DownloaD

Available only as a download.

IPC-1720A

Assembly Qualification Profile

Categorizes electronic assembly manufacturer

capabilities and supplies the OEM customer with

detailed, substantive information. Simplifies audit-

ing processes and reduces the frequency of audits,

thereby decreasing paperwork and improving

efficiency. Includes company and site description,

site capability snap shot, equipment profile (pre-site

audit), technology profile specifics, quality profile,

manufacturing. Revision A consists of a single, easy

to use electronic file (Microsoft WordTM template)

providing the capability of electronically consolidat-

ing and organizing data. 56 pages. Released July

2004. Free DownloaD

Available only as a download.

IPC-1730A

Laminator Qualification Profile

Categorizes a laminate manufacturer's capabilities,

which furnishes customer access to detailed infor-

mation. Simplifies auditing processes and reduces

the frequency of audits, decreasing paperwork and

improving efficiency for single or multiple sites

or locations. Includes a description, approval and

certification profile and a quality profile. Supple-

mented by a Microsoft WordTM template file, which

enables entering, storing and updating the various

sections electronically and submitting the data to

customers with ease. 22 pages. Released June

2000. Free DownloaD

Available only as a download.

IPC-1731

Strategic Raw Materials Supplier Qualifi-

cation Profile

ANSI Approved. Suppliers of raw materials for

laminate manufacturing now have an industry-ap-

proved questionnaire to supply current and potential

customers with a self-assessment of their facilities.

Gives suppliers of raw materials the opportunity to

create a profile of their manufacturing facility that

will be consistent with those developed by other

industry suppliers. Using the Microsoft WordTM tem-

plate enables easy file creation and maintenance

and results in an electronic file that can be easily

forwarded to customers. 36 pages. Published June

2000. Free DownloaD

Available only as a download.

ROADMAP-05

2004-2005 The International Technology

Roadmap for Electronic Interconnections

Provides vision and direction for product develop-

ment, process development and services required to

satisfy the current and future needs of companies

that are building electronic and optoelectronic

equipment in the U.S. Presents findings and recom-

mendations based on OEM requirements and an

updated cost model that considers circuit density

(for board fabrication) and assembly complexity (for

assembly manufacture). Encompasses the supply

chain infrastructure needed for single-chip and

multichip packaging, printed board issues, assembly

considerations, optoelectronics and related man-

agement/environmental key pressure points. Each

chapter contains specific recommendations ad-

dressing current, near-term, mid-term and long-term

requirements, proposed actions and opportunities.

A valuable resource for companies throughout the

global electronic equipment manufacturing industry.

Can be used for business, technology, and strategic

planning for the short and long term. 613 pages.

Released October 2005.

CD

IPC members: $125.00

Nonmembers: $250.00

Free DownloaD

For MeMbers

IPC-SKILL-201

IPC Skill Standards for Printed Circuit

Board Manufacturing

Industry-consensus PCB skill standards provide

conditions of performance, statements of work,

performance criteria, assessment and credentialing

approaches for more than 40 critical areas of PCB

manufacturing. Document helps human resource

personnel and managers make intelligent hiring,

promotion and training decisions. Includes the com-

plete IPC-T-50 Terms and Definitions, as well as job

descriptions. PCB skill standards are an essential

ingredient in a company's workforce improvement

plan. 185 pages. Released May 1999.

HARD COPY ONLY

IPC members: $75.00

Nonmembers: $150.00

TABLE OF CONTENTS

General . . . . . . . . . . 31

EMTF Studies . . . . . . . . 32

Wage and Compensation Studies . 33

31

www.ipc.org/onlinestore

www.ipc.org/onlinestore www.ipc.org/onlinestore

M A N A G E M E N T, M A R K E T

R E S E A R C H A N D R O A D M A P S

32

M A N A G E M E N T , M A R K E T

R E S E A R C H A N D R O A D M A P S

www.ipc.org/onlinestore

EXECUTIVE MARKET

TECHNOLOGY FORUM

ABOUT IPC'S EXECUTIVE MARKET &

TECHNOLOGY FORUM (EMTF)

Executive Forum membership is open to all IPC

members. It provides access to extensive market

research studies and industry reports specifically

designed for the electronics interconnect industry.

Executive Forum conferences held worldwide, bring

together top management people from across the

supply chain, creating unique opportunities for net-

working and shaping the future of the industry. For

information about joining the Executive Forum, go

to www.ipc.org/ExecForum2006 or contact Sharon

Starr at 1-847-597-2817 or SharonStarr@ipc.org.

IPC-EMTF-05W

World PCB Production and Laminate

Market Report for the Year 2005

Consensus estimates of PCB production value and

laminate area consumption by product type and coun-

try, from a panel of the world’s leading industry ana-

lysts, including analysis on regional trends and flexible

circuits. Published exclusively for members of IPC’s

Executive Market & Technology Forum. IPC members

can obtain this report by joining the Executive Forum.

Go to www.ipc.org/ExecForum2006 for membership

information and application form. 36 pages. Released

July 2006.

Executive Forum members: Free DownloaD

IPC-EMTF-06F

2005-2006 Industry Analysis and Forecast

for Flexible Circuits in North America

Survey-based study presents data and analysis on

trends in the North American flexible circuit industry,

including growth estimates and sales history, number

of fabricators, global footprint of U.S.-based fabrica-

tors, trends in materials, sales by product type, pro-

duction mix (high-volume vs. quick-turn vs. prototype),

trends in line width and spacing, revenue trends

from value-added services, industry end-markets

by product type, and U.S. imports and exports. The

five participating companies represent 27% of North

American flexible circuit sales. 31 pages. Released

July 2006.

DOWNLOAD ONLY

Executive Forum members: Free

IPC members: $250.00

Nonmembers: $500.00

IPC-EMTF-06R

2005-2006 Industry Analysis and Forecast

for Rigid PCBs and Laminates in North

America

Survey-based study presents data and analysis on

trends in the North American rigid PCB industry,

including industry growth forecast, industry end-mar-

kets served, sales history by product type, trends in

high-density multilayer boards, production mix trends

(high-volume vs. quick-turn vs. prototype), new vs.

existing business growth, number and average value

of PCBs and panels produced, panel size, and U.S.

imports and exports. Laminate sales, trade data and

application trends are also covered. Survey sample

of 23 companies represents approximately 33% of

the rigid PCB industry and about 65% of the laminate

industry in North America. 47 pages. Released July

2006.

DOWNLOAD ONLY

Executive Forum members: Free

IPC members: $375.00

Nonmembers: $750.00

IPC-EMTF-06T

Technology Trends in Printed Circuit

Boards for the Year 2005

Survey-based study presents data and analysis on

trends in rigid PCB conductor width and spacing,

metallic finishes, solder mask usage, multilayer pro-

duction, laminate thickness and temperature, surface

mounting, fine-pitch technology, and other leading-

edge technologies. Survey sample of 22 companies

represents about 29% of the rigid PCB industry and

approximately 65% of the laminate industry in North

America. 27 pages. Released September 2005.

DOWNLOAD ONLY

Executive Forum members: Free

IPC members: $250.00

Nonmembers: $500.00

IPC-EMTF-06E

2005-2006 Industry Analysis and Forecast

for the Worldwide Electronics Manufactur-

ing Services (EMS) Industry

Survey-based study presents data and analysis on

the global electronics assembly and EMS industry,

examining trends in sources of industry revenue,

number of facilities, revenue trends based on services

offered and markets served, manufacturing technol-

ogy, capital investment, spending on equipment and

materials, and market size including forecasts. 49

pages. Released September 2006.

DOWNLOAD ONLY

Executive Forum members: Free

IPC members: $375.00

Nonmembers: $750.00

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

33

www.ipc.org/onlinestore

IPC-EMTF-06MED

Medical Electronics Market Opportuni-

ties for Interconnect Manufacturers

Commissioned study reveals emerging develop-

ments in the worldwide medical electronics market-

place and technology. Explains the challenges and

potential opportunities for component and materials

suppliers, PCB fabricators, and product assemblers,

as well as market drivers and regulatory require-

ments. Includes market and technology forecasts

for suppliers to the medical electronics industry

covering the near term (3-5 years) and long term

(5-10 years). Implications of this growing market for

laminate materials, PCB fabrication, components

and component packaging, connector technology,

assembly and test, and system level requirements

are explored. Conducted by Prismark Partners for

IPC’s Executive Forum. Expected publication date:

September 2006.

SINGLE-USER DOWNLOAD

Executive Forum members: Free

IPC members: $2,000.00

Nonmembers: $4,000.00

GLOBAL LICENSE DOWNLOAD

IPC members: $2,500.00

Nonmembers: $5,000.00

IPC-EMTF-06HSP

Worldwide High Speed Electronics

Technology and Market Trends for the

Years 2006-2016

In-depth commissioned study explains market trends

driving high-speed electronic system architectures

(from 2 Gbps to +40Gbps) and expectations for the

technology requirements both in the near future (3-5

years), and the long term (5-10 years). Key systems

studied are servers, switches, routers and telecom

infrastructure equipment, including the impact

of their evolution on PCB design and fabrication,

inspection, low-loss laminates, connectors, board

assembly, board test and IC packaging. Emerging

challenges and opportunities are identified for all

segments in the supply chain. Technology roadmaps

are included, along with forecasts of market demand

for the key systems, high-speed PCBs and low loss

laminates. Conducted by BPA Consulting. Expected

publication date: September 2006.

SINGLE-USER DOWNLOAD

Executive Forum members: Free

IPC members: $2,000.00

Nonmembers: $4,000.00

GLOBAL LICENSE DOWNLOAD

IPC members: $2,500.00

Nonmembers: $5,000.00

WAGE AND COMPENSATION STUDIES

IPC-WAGEE-04

IPC Wage Rate & Salary Report for the

EMS Industry 2004-2005

Results of IPC's wage and salary survey for

independent electronic assembly / electronics

manufacturing services (EMS) companies in North

America for 2004, including some 2005 estimates.

Presents aggregate data on 30 positions and the

related job descriptions. Wage and salary data are

shown by regions and by company size. Includes

aggregate data on the 28 company respondents'

personnel and compensation policies, benefits, and

sales compensation structure. 34 pages. Released

December 2005.

DOWNLOAD ONLY

Survey participants: Free

IPC members: $250.00

Nonmembers: $500.00

IPC-WAGEP-04

IPC Wage Rate & Salary Report for the

PCB Industry 2004-2005

Results of IPC's wage and salary survey for indepen-

dent printed circuit board (PCB) manufacturers

in North America for 2004, including some 2005

estimates. Presents aggregate data on 41 positions

and the related job descriptions. Historical and cur-

rent wage and salary data are shown by regions and

by company size. Includes aggregate data on the 15

respondents' personnel and compensation policies,

benefits, and sales compensation structure. 36

pages. Released December 2005.

DOWNLOAD ONLY

Survey participants: Free

IPC members: $250.00

Nonmembers: $500.00

IPC-EXCOMP-06

IPC Executive Compensation Study for the

PCB and EMS Industries 2005-2006

Results of IPC’s executive compensation survey for

North American EMS and PCB companies for 2005

and 2006, reported by industry segment, region and

company size. Examines base salaries, bonuses and

other forms of compensation and benefits. Includes

historical trend data and covers 12 key executive

positions. Expected publication date: October 2006.

DOWNLOAD ONLY

Survey participants: Free

IPC members: $495.00

Nonmembers: $990.00

34 www.ipc.org/onlinestore

E N V I R O N M E N TA L C O M P L I A N C E

E N V I R O N M E N TA L C O M P L I A N C E

NEW Certification for RoHS

Lead Free Electronics Assembly

Process Capability Program.

For more information see page 2.

MATERIALS DECLARATION

IPC-1065

Material Declaration Handbook

PbPb

Aids printed circuit board (PCB) manufacturers

and users in completing materials declara-

tions that follow the format and guidance of

the Joint Industry Material Composition Declaration

Guide. The handbook includes information on what a

manufacturer should do when a materials declaration

request is received, a list of chemical substances

likely to be found in a PCB, simplified sample

calculations for a materials declaration of a PCB, and

guidelines for determining the composition of an

electronic product using analytical techniques.

Appendices include a table of chemical lists and

laboratory analysis methods, detailed calculation of a

materials declaration of a PCB, uncertainty of

calculated data values, a list of analytical laborato-

ries, a list of relevant documents, and analytical

techniques for substances removed from the final

version of the joint industry guide. 72 pages. Released

January 2005.

HARD COPY CD OR DOWNLOAD

IPC members: $30.00 $35.00

Nonmembers: $60.00 $65.00

IPC-1066

Marking, Symbols and Labels for

Identification of Lead-Free and Other

Reportable Materials in Lead-Free

Assemblies, Components and Devices

PbPb

Establishes the requirements for a distinctive

symbol and labels to be used to identify

materials that are lead free and capable of

providing Pb-free second level interconnects, and to

indicate certain types of Pb-free materials and the

maximum allowable soldering temperature. 20 pages.

Published December 2004.

IPC/JEDEC J-STD-609 coming soon – check the online store.

HARD COPY ONLY

IPC members: $15.00

Nonmembers: $30.00 Free DownloaD

IPC-1752

Materials Declaration Management

PbPb

Establishes the requirements for exchanging

materials and substances data between

suppliers and their customers for electrical and

electronic equipment (EEE). Applies to products,

components, subparts and materials that are supplied

to EEE manufacturers for incorporation into their

products. Covers materials and substances that may

be present in the supplied product or subpart.

Available only as a Zip file. The file contains IPC-1751,

Generic Requirements for Declaration Process

Management; IPC-1752, XML Schema; IPC-1752-1, PDF

Form for General and Class I Materials Declarations;

IPC 1752-2, PDF Form for Class II Materials Declarations;

and IPC-1752-3, Users Guide for Materials Declaration

Forms. Free DownloaD

E3TOOL-CD

E3 Survival Toolkit

PbPb

Find out how to minimize the burdens

associated with reporting and better

understand what will be required of your

company in order to comply with the European Union's

WEEE and RoHS Directives. The toolkit includes an

interactive CD-ROM and diagnosis tools to assess a

company's compliance status considering product line,

markets, sales levels, supply chain management and

materials used. Based on input, a compliance

assessment report is generated that summarizes

actions to consider. Created by eco3, an environmen-

tal consultancy based in the U.K.

SINGLE GLOBAL

USER CD LICENSE CD

IPC members: $99.00 $450.00

Nonmembers: $149.00 $600.00

ROHSAUDIT-CD

ERA RoHS Directive Supplier Audit Form

Package

PbPb

To ensure more accurate information from

suppliers, the U.K. research and consulting

firm ERA developed a Supplier RoHS Audit

Form to help companies collect information from

suppliers, in addition to or in lieu of an audit visit. In

addition to information gathering, the form asks

probing questions that test supplier understanding of

the requirements. Package includes a license to make

copies for distribution to suppliers.

Pricing at various license levels is available – check the

online store.

ENVIRONMENT, HEALTH AND SAFETY

IPC-1331

Voluntary Safety Standard for Electrically

Heated Process Equipment

Establishes minimum requirements for design, instal-

lation, operation and maintenance of electrically

heated process equipment to minimize electrical haz-

ards and prevent fires in combustible tanks, tank liners

and drying equipment. Available as download only.

11 pages. Published March 2000. Free DownloaD

IPC-ENVIRONMENT

Environmental Best Practices Guide Book

Details the industry's environmental success in reduc-

ing its environmental impact. From recommendations

to minimize copper wastewater discharges to detailed

steps on adopting environmental management sys-

tems, it presents detailed steps to prevent pollution

and minimize generation of waste. Published by the

British PCB Association (PCIF). 108 pages. Published

1999.

HARD COPY ONLY

IPC members: $75.00

Nonmembers: $150.00

IPC-WP/TR-584

IPC White Paper and Technical Report on

Halogen-Free Materials Used for Printed

Circuit Boards and Assemblies

This combination IPC white paper and technical report

summarizes both the IPC position as well as signifi-

cant data on the subject of “halogen-free” materials

for the electronics industry. Developed in three years

by a team representing every level of the electronics

supply chain. Reviewed and accepted by the IPC’s

Technical Activities Executive Committee (TAEC) and

is applicable to materials for interconnecting electron-

ics reflecting the state of technology as of December

1, 2002. 29 pages. Released April 2003.

HARD COPY CD OR DOWNLOAD

IPC members: $25.00 $30.00

Nonmembers: $50.00 $55.00

Print restrictions apply for single-user

CD and download formats.

Prices are subject to change –

check the online store.

E N V I R O N M E N TA L C O M P L I A N C E

35

www.ipc.org/onlinestore

E N V I R O N M E N TA L C O M P L I A N C E L E A D F R E E

IPC standards that have been updated for or

are applicable to lead free are included in the

various sections of this catalog with this sym-

bol:

PbPb

. The following items are additional

tools for your use.

TEXT BOOKS

ELEC-ELEC

Implementing Lead-Free Electronics

Provides timely information on the choices and

tradeoffs facing manufacturers seeking the most ef-

ficient and cost-effective ways of converting to lead

free manufacturing. The book is laid out as a quick

guide, providing successful examples in conjunction

with the basic principles of the implementation and

production of lead free electronics on a global basis.

Written by Dr. Jennie S. Hwang; McGraw-Hill. 466

pages. Released 2005.

HARD COPY ONLY

IPC members: $100.00

Nonmembers: $125.00

ELEC-06

Lead-Free Electronics

Offers guidance on the design and use of lead free

electronics as well as technical and legislative

perspectives. Addresses all the complex challenges

confronting the electronics industry. Includes the

most recent data on cyclic thermomechanical

deformation properties of lead free SnAgCu alloys

and a comparison of the properties of standard

Sn-Pb versus lead free alloys, using the energy

partitioning approach. Written by leading experts in

the field and carefully edited to ensure a consistent

approach. Edited by Sanka Ganesan and Michael

Pecht; John Wiley & Sons, Inc. 766 pages. Released

April 2006.

HARD COPY ONLY

IPC members: $100.00

Nonmembers: $150.00

ELEC-MICRO

Handbook of Lead-Free Solder Technology

for Microelectronic Assemblies

Complete walk-through of the conversion from

standard tin lead to lead free solder microelectronic

assemblies for low-end and high-end applications.

Analyzes the health risks associated with lead;

estimates the environmental benefits of using lead

free substitutes in microelectronics; summarizes

new regulations, legislation, and marketplace trends

affecting the industry; and outlines changes and

challenges on the materials, equipment, and pro-

cess levels for manufacture of lead free microelec-

tronics. Written by more than 45 researchers and

practitioners. Edited by Karl J. Puttlitz and Kathleen

A. Stalter; Marcel Dekker, Inc. 1,026 pages.

Published 2004.

HARD COPY ONLY

IPC members: $175.00

Nonmembers: $220.00

ELEC-RELIA

Lead-Free Solder Interconnect Reliability

Provides the most up-to-date information and sta-

tistics available on the reliability of lead free solder

interconnects. Addresses fundamental research

and practical considerations. Ideal resource for

practitioners in the electronics industry who need

to understand the reliability of solder interconnects

for design, testing, quality assurance, and failure

analysis. Will also benefit industry and academic

researchers, educators, and students. Published by

ASM International and edited by Dr. Dongkai Shang-

guan. 292 pages. Released May 2006.

HARD COPY ONLY

IPC members $150.00

Nonmembers $175.00

ADDITIONAL REFERENCE BOOKS AND MORE

DETAILS ARE AVAILABLE AT THE ONLINE STORE.

TEST REPORT

SPVC2005-CD

Round Robin Testing and Analysis of Lead

Free Solder Pastes with Alloys of Tin,

Silver and Copper

Result of a three-year one million dollar investment

to determine which solder alloy to recommend.

Report includes 18 appendices with nearly 100

megabytes of data and research charts. Data sup-

ports recommendation of 96.5/3.0/0.5 tin/silver/

copper (SAC305) as the alloy of choice for lead free

applications. 50 pages. Published 2005.

SINGLE GLOBAL

USER CD LICENSE CD

IPC members: $ 99.00 $499.00

Nonmembers: $199.00 $799.00

MORE RESOURCES

Additional resources such as desk reference guides,

posters, and computer-based training are available

at http://leadfree.ipc.org. The following stan-

dards have been updated for lead free and released.

Many others are underway.

• IPC-J-STD-001D: Requirements for Soldered

Electrical & Electronic Assemblies

• IPC-J-STD-002C: Solderability Tests for Compo-

nent Leads, Terminations, Lugs, Terminals and

Wires

• IPC-J-STD-003B: Solderability Tests for Printed

Boards

• IPC-J-STD-004A: Requirements for Soldering

Fluxes

• IPC-HDBK-005: Guide to Solder Paste Assessment

• IPC-J-STD-005: Requirements for Soldering

Pastes

• IPC-WP-006: Round Robin Testing & Analysis:

Lead-Free Alloys–Tin, Silver, & Copper

• IPC-J-STD-006B: Requirements for Electronic

Grade Solder Alloys and Fluxed and Non-Fluxed

Solid Solders

• IPC/JEDEC J-STD-020C: IPC/JEDEC Moisture/Re-

flow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices

• J-STD-030: Guideline for Selection and Applica-

tion of Underfill Material for Flip Chip and Other

Micropackages

• IPC/JEDEC J-STD-033B: Handling, Packing,

Shipping and Use of Moisture/Reflow Sensitive

Surface Mount Devices

• IPC-TR-585: Time, Temperature and Humidity

Stress of Final Board Finish Solderability

• IPC-A-610D: Acceptability of Electronic

Assemblies

• IPC/WHMA-A-620A: Requirements and Accep-

tance for Cable and Wire Harness Assemblies

• IPC-4101B: Specification for Base Materials for

Rigid and Multilayer Printed Boards

• IPC-4552: Specification for Electroless Nickel/

Immersion Gold (ENIG) Plating for Printed Circuit

Boards

• IPC-4553: Specification for Immersion Silver

Plating for Printed Circuit Boards

• IPC-7351: Generic Requirements for Surface

Mount Land Pattern and Design Standard

• IPC-9701A: Performance Test Methods and Quali-

fication Requirements for Surface Mount Solder

Attachments

• IPC/JEDEC-9702: Monotonic Bend Characteriza-

tion of Board-Level Interconnects

• IPC-9704: IPC/JEDEC Printed Wiring Board Strain

Gage Test Guideline

36

A R T W O R K F O R T E S T C O U P O N S

www.ipc.org/onlinestore

IPC-9251

Test Vehicles for Evaluating Fine

Line Capability

Test patterns for evaluating fine line capabilities;

were developed by CAT, Inc. and Du Pont and are

made available with their permission through IPC.

Free DownloaD

IPC-A-20/21-GKIT

Standard Pitch Stencil Pattern for Slump

Files contain patterns for developing solder paste

stencils by laser or chemical etching. Land widths

of 0.4 mm, 0.63 mm and 1.25 mm are provided with

varying pitch to evaluate solder paste slump. Includes

J-STD-005, Requirements for Soldering Pastes.

IPC-A-20/21-G KIT (Gerber Format)

IPC members: $75.00

Nonmembers: $150.00

IPC-A-22

UL Recognition Test Pattern

Recognition vehicle for UL-796 (base materials) and

UL-746 (printed wiring boards). Tests for conductor

width plating quality-PTH, flammability, etc. (1 pc. 41 x

57 cm 1:1.). Includes IPC-A-22 Sample Preparation and

Instruction Booklet in hardcopy only.

A-22-G-KIT (Gerber Format)

IPC members: $30.00

Nonmembers: $60.00

A-22-D-KIT (IPC-D-350 Format)

IPC members: $30.00

Nonmembers: $60.00

IPC-A-24

Surface Insulation Resistance

Single-sided (4 up) pattern evaluates the interaction

of solder flux and paste residues. Board was used in

the Phase 3 portion of the test program that evaluates

alternative technologies to eliminate CFCs in assembly

operations. Contains four comb patterns with 0.4 mm

lines and 0.5 mm spaces. A stencil pattern is provided

(2 pcs 30 x 45 cm 1:1) No components are provided.

Includes Master Drawing IPC-100024, Aperture List

and IPC-B-24 test board design criteria in hardcopy

only. For prefabricated boards go to www.ipc.org and

click on “Technical Resources” for a listing of board

vendors carrying the IPC-B-24 board.

A-24-G-KIT (Gerber Format)

IPC members: $40.00

Nonmembers: $80.00

IPC-A-25

Multipurpose 1 & 2 Sided Test Pattern

Referenced in IPC-CC-830 and IPC-SM-840C. Primarily

for surface insulation resistance testing. The film

format (3pcs. 30 x 46 cm scale 2:1) contains the solder

mask layer pattern, but does not include the drill file.

IPC-SM-840C, Qualification and Performance of Perma-

nent Solder Mask, is included. Includes a hardcopy of

the Master Drawing IPC-B25/55110.

A-25-G-KIT (Gerber Format)

IPC members: $40.00

Nonmembers: $80.00

A-25-D-KIT (IPC-D-350-Format)

IPC members: $40.00

Nonmembers: $80.00

IPC-A-25A

Multipurpose 1 Sided Test Pattern

Artwork for standard test boards as referenced in

IPC-CC-830 and IPC-SM-840C. Used primarily for

surface insulation resistance testing and solder mask

testing. IPC-SM-840C, Qualification and Performance

of Permanent Solder Mask, is included. The A revision

combines IPC-A-24 and IPC-A-25 comb patterns on a

single-sided board. Revised February 1996.

A-25A-G-KIT (Gerber Format)

IPC members: $65.00

Nonmembers: $130.00

A-25A-D-KIT (IPC-D-350 Format)

IPC members: $65.00

Nonmembers: $130.00

IPC-A-36

Cleaning Alternatives Artwork

Double-sided (with plated-through holes) board evalu-

ates cleaning alternatives to chlorofluorocarbons.

Contains four quadrants utilizing both surface mount

patterns and vias, each with 68 I/O chip carrier sites

and 10 SIR test points. (6 pcs. 28 x 36 cm 1:1). A hard

copy aperture file is included. Go to the IPC web site

for a listing of board vendors manufacturing the IPC-

B-36 board.

A-36-G (Gerber Format)

IPC members: $90.00

Nonmembers: $180.00

A-36-D (IPC-D-350 Format)

IPC members: $175.00

Nonmembers: $350.00

IPC-A-40

Solder Mask Artwork

Solder Mask Layer for use with IPC-A-41, IPC-A-42,

IPC-A-43 & IPC-A-44. (1pc. 30 x 46 cm 1:1). Available

in film only.

A-40-F-KIT (Film Format)

IPC members: $27.00

Nonmembers: $54.00

IPC-A-41

Single Sided Artwork

Artwork required for certification to either

MIL-P-50884, MIL-P-55110, also IPC-6011, IPC-6012,

IPC-6013, and IPC-MC-324D. Includes Universal Drill-

ing and Profile Master Drawing IPC-100001 Revision A

(March 1989) and Master Drawing #100041 Revision A

(March 1989). Both Master Drawings in hardcopy only.

(1 artwork image piece. 30 x 46 cm 1:1).

A-41-F-KIT (Film Format)

IPC members: $35.00

Nonmembers: $70.00

A-41-D-KIT (IPC-D-350 Format)

IPC members: $55.00

Nonmembers: $110.00

37

www.ipc.org/onlinestore

IPC-A-42

Double Sided Artwork

Artwork required for certification to either

MIL-P-50884, MIL-P-55110, also IPC-6011,

IPC-6012, IPC-6013, and IPC-MC-324D. Includes

Universal Drilling and Profile Master Drawing

IPC-100001 Revision A (March 1989) and Master

Drawing 100042 Revision A (March 1989). Both

Master Drawings in hardcopy only. (1 artwork image

piece. 30 x 46 cm 1:1).

A-42-G-KIT (Gerber Format)

IPC members: $30.00

Nonmembers: $60.00

A-42-D-KIT (IPC-D-350 Format)

IPC members: $30.00

Nonmembers: $60.00

IPC-A-43

Ten-Layer Multi Artwork

Artwork required for certification of four layer,

mass laminated boards to either MIL-P-50884,

MIL-P-55110, also IPC-6011, IPC-6012, IPC-6013, and

IPC-MC-324. Includes Universal Drilling and Profile

Master Drawing IPC-100001 Revision A (March

1989) and Master Drawing # 100043 Revision A

(March 1989). Both Master Drawings in hardcopy

only. (4 pcs. 30 x 46 cm 1:1).

A-43-G-KIT (Gerber Format)

IPC members: $150.00

Nonmembers: $300.00

A-43-D-KIT (IPC-D-350 Format)

IPC members: $150.00

Nonmembers: $300.00

IPC-A-44

Mass Lamination Artwork

Artwork required for certification of four layer,

mass laminated boards to either MIL-P-50884,

MIL-P-55110, also IPC-6011, IPC-6012, IPC-6013, and

IPC-MC-324. Includes Universal Drilling and Profile

Master Drawing IPC-100001 Revision A (March

1989) and Master Drawing # 100044 Revision A

(March 1989). Both Master Drawings in hardcopy

only. (4 pcs. 30 x 46 cm 1:1).

A-44-F-KIT (Film Format)

IPC members: $110.00

Nonmembers: $220.00

A-44-D-KIT (IPC-D-350 Format)

IPC members: $165.00

Nonmembers: $330.00

IPC-A-47

Composite Test Pattern Ten-Layer

Phototool

Artwork for assessing manufacturer capa-

bilities per IPC-6012. Features test specimen

A,B,D,E,F,L,G,H,M,N,R and S per IPC-2221. Hardcopy

Master Drawings IPC-100103 for Type 3 (without

blind or buried vias) boards and universal hole and

profile drawing IPC-100002 included.

A-47-G-KIT (Gerber Format)

IPC members: $150.00

Nonmembers: $300.00

A-47-D-KIT (IPC-D-350 Format)

IPC members: $150.00

Nonmembers: $300.00

IPC-A-50

Surface Insulation Resistance Phoenix

Board — Gerber Format

The Phoenix test board is used as an alternate to

IPC-B-24 for evaluating the interaction of solder flux

and solder paste residues. Useful for IPC/Belcore

correlation studies.

A-50 (Gerber Format)

IPC members: $40.00

Nonmembers: $80.00

IPC-A-52-G

Cleanliness and Residue Evaluation

Test Board

Designed to give the manufacturing process profes-

sional a tool to help assess the impact of cleanli-

ness and residues on bare boards and finished

assemblies, as well as the impact of changing

manufacturing parameters on cleanliness. Artwork

package provides PDF master drawings and Gerber

files necessary for fabricating the test board which

contains coupons applicable for surface insulation

resistance (SIR) testing, ion chromatography (IC),

and solder mask adhesion. Released April 2006.

A-52-G (GERBER FORMAT)

IPC Members $50.00

Nonmembers $100.00

38

M U L T I M E D I A T R A I N I N G

R E S O U R C E S

http://training.ipc.org

IPC has been producing industry-approved, commercial-

free training media for more than 25 years...covering

electronics assembly acceptance standards, hand solder-

ing, lead free, repair & rework, ESD control, component

ID, wire harness, and circuit board fabrication.

For the online catalog of our DVDs, Interactive

CD-ROMs, online video resources, training and

reference guides, wall posters and image archives

go to http://training.ipc.org.

DVD–DIGITAL VIDEO

IPC's line of video training programs have been upgraded

to the DVD-R format. With the added advantages of

random-access menu control, high-resolution digital

video, optional subtitles for the hearing-impaired (Sec.

508C compliant) and special dual-language editions (e.g.

Spanish/English, Chinese/English), these products work

well in group or individual training sessions. All training

support materials (such as Leader's Guides, Exams and

Student Certificates of Completion) are available for free

download.

OVT–ONLINE VIDEO TRAINING

IPC delivers video training right to your desktop! Our

Online Video Training (OVT) program gives you the tools

to provide instant access to our award-winning training.

Ideal for distance-learning programs, these digitized

training videos can be mounted and downloaded or

played directly from any server–across your network, or

across the world via your intranet! Licenses are avail-

able for single locations, or for international distribution.

Coming soon – automated online testing.

TRANSLATIONS–SPANISH & CHINESE

Many of our critical topics are available on special dual-

language DVDs. Languages include Spanish, Chinese,

French, Vietnamese and Russian, with more titles and

languages being added continuously. (Each dual-lan-

guage DVD comes with the original English language as

an optional audio track.)

CD-ROM/INTERACTIVE TRAINING &

ELECTRONIC REFERENCE

Designed for self-paced learning with the convenience

of automated testing and score-keeping... our Computer-

Based Training (CBT) programs cover such topics as

Hand Soldering, ESD Control and SPC. The Component

ID/Electronic Reference (ER-18) and IPC-A-610 Electronic

Workmanship Standards (EWS-610) programs allow the

user to edit or add their own technical contents (and text

in any language supported by Windows) and images.

All our CD-ROM based programs can be licensed two

ways–for unlimited use on a single computer (Stand-

Alone License) or unlimited use over a computer network

(Site License).

DRM–DESK REFERENCE MANUALS/

TRAINING & REFERENCE GUIDES

Handy and portable spiral-bound reference guides on

surface mount & through hole solder joint acceptability,

component identification, wire prep/crimp acceptability

and basic electronics assembly.

IMAGE RESOURCES

Select digital clip art on CD-ROM from a wide variety of

close-up defect photography and computer-generated

graphics. Clip art sets from the IPC-A-610D, as well as a

lead free solder joint image library are available. Create

your own learning tools using IPC's graphic resources—

for unrestricted in-house use.

WALL POSTERS

Make a "big" impression with these 20" x 28" surface

mount and through hole solder joint evaluation posters.

They contain the critical acceptance criteria from IPC-A-

610D and IPC J-STD-001D for solder connections and are

laminated with corner eyelets for easy display.

Sign up for a FREE demo DVD that

includes reviews of all IPC multimedia

training resources at

http://training.ipc.org

You'll also find these reviews available

for immediate download online.

For technical questions, please contact staff at the

IPC production office at 505-758-7937 or e-mail

service@ipcvideo.org.

39

www.ipc.org/onlinestore

I M A G E S A N D P O S T E R S

P-SMT2-D

Surface Mount Solder Joint Evaluation

Wall Posters (Set of 3) – Class 2

What better way to demonstrate to your employees

that "inspection is everyone's job," than our surface

mount evaluation wall posters! Utilizing the graph-

ics and Class 2 acceptability criteria from the

IPC-A-610D, these 20 x 28-inch hanging posters

serve as a constant reminder that quality is job

number one. A set of three laminated surface mount

evaluation/inspection posters for Class 2 comes

with eyelets for easy hanging. One poster each for

Chip, Gull and J-Lead (three-poster set).

IPC members: $100.00

Nonmembers: $150.00

P-SMT3-D

Surface Mount Solder Joint Evaluation

Wall Posters (Set of 3) – Class 3

Class 3 version of IPC-SMT2-D

IPC members: $100.00

Nonmembers: $150.00

P-PTH2-D

Through-Hole Solder Joint Evaluation

Wall Poster – Class 2

Full-color, 20 x 28-inch laminated wall poster visu-

ally defines minimum/maximum Class 2 through

hole solder joint acceptability requirements from the

IPC-A-610D in high-quality, 3-D graphics. This poster

depicts complex through hole solder joint require-

ments so clearly, that all operators and inspectors

can easily understand and apply this important

criteria. Bring technically accurate, industry-consen-

sus acceptability standards to your training room or

inspection area. With eyelets for easy hanging. One

poster, for Class 2.

IPC members: $50.00

Nonmembers: $75.00

P-PTH3-D

Through-Hole Solder Joint Evaluation

Wall Poster – Class 3

Class 3 version of IPC-PTH2-D

IPC members: $50.00

Nonmembers: $75.00

Quantity pricing available on the posters – check the

online store

CD-/DVD-BASED IMAGE RESOURCES

IPC-A-610D ILLUSTRATIONS

Illustrations from IPC-A-610D are available as a complete set, individually, or by chapter. They are available

for unlimited use for in-house company training.

DVD-LFL

Lead Free Solder Joint Image Library

For description and pricing, check the online store.

40

NUMERIC PRODUC T INDE X / PRICE LIST

www.ipc.org/onlinestore www.ipc.org/onlinestore

NUMERIC PRODUC T INDE X / PRICE LIST

www.ipc.org/onlinestore www.ipc.org/onlinestore

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

IPC-HDBK-001 . . . . . . . 40.00 . . . . . 80.00 . . . . . . . . 4

IPC J-STD-001D. . . . . 40.00 . . . . . 80.00 . . . . . . . . 4

IPC J-STD-001DSP . . . 40.00 . . . . . . .40.00 . . . . . . . . 4

IPC J-STD-001DSW. . . 40.00 . . . . . . .40.00 . . . . . . . . 4

SMC-WP-001.......... FD.........FD .......15

IPC/EIA J-STD-002B . . 20.00 . . . . . 40.00 . . . . . . . 14

IPC/EIA J-STD-003A. . 20.00 . . . . . 40.00 . . . . . . . 14

IPC-J-STD-004A . . . 25.00 . . . . . 50.00 . . . . . . . 10

IPC-0040 . . . . . . . . . . 60.00 . . . . . 120.00 . . . . . . . 15

IPC-HDBK-005 . . . . . . . 35.00 . . . . . . .70.00 . . . . . . . 11

IPC/EIA J-STD-005 . . . 25.00 . . . . . 50.00 . . . . . . . 10

SMC-WP-005 ......... FD.........FD .......15

IPC-WP-006 . . . . . . . . . 20.00 . . . . . . .30.00 . . . . . . . 11

IPC J-STD-006B. . . . . . 25.00 . . . . . 50.00 . . . . . . . 11

IPC-WP-008 . . . . . . . . . 15.00 . . . . . . .30.00 . . . . . . . . 6

IPC-PWB-CERTCD01 125.00 . . . . . .225.00 . . . . . . . 28

IPC-PWB-CRT-SG01 . 35.00 . . . . . . 70.00 . . . . . . . 28

IPC-PWBADV-SG02. . 75.00 . . . . . 150.00 . . . . . . . 28

IPC-WAGEE-04. . . . . . . . . . (1) . . . . . . . . . (1) . . . . . . .33

IPC-WAGEP-04. . . . . . . . . . (1) . . . . . . . . . (1) . . . . . . . 33

EMTF-05W.............(1)......... (1) .......32

IPC-ROADMAP-05 . . . 125.00*. . . . . 250.00* . . . . . . 31

IPC-ELEC-06. . . . . . . . 100.00 . . . . . .150.00 . . . . . . .35

IPC-EX-COMP-06. . . . . . . . (1) . . . . . . . . . (1) . . . . . . .33

IPC-EMTF-06-HSP . . . . . . . (1) . . . . . . . . . (1) . . . . . . . 33

IPC-EMTF-06-MED . . . . . .(1) . . . . . . . . . (1) . . . . . . . 33

IPC-EMTF-06E . . . . . . . . . .(1) . . . . . . . . . (1) . . . . . . .32

IPC-EMTF-06F . . . . . . . . . .(1) . . . . . . . . . (1) . . . . . . . 32

IPC-EMTF-06R . . . . . . . . . . (1) . . . . . . . . . (1) . . . . . . . 32

IPC-EMTF-06T . . . . . . . . . .(1) . . . . . . . . . (1) . . . . . . .32

IPC J-STD-012 . . . . . . . 40.00 . . . . . 80.00 . . . . . . . . 5

IPC J-STD-013 . . . . . . . 40.00 . . . . . 80.00 . . . . . . . . 5

IPC/JEDEC J-STD-020C 25.00 . . . . . 50.00 . . . . . . . . 8

IPC/EIA J-STD-026 . . . 40.00 . . . . . 80.00 . . . . . . . . 5

IPC J-STD-027 . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . . 5

IPC/EIA J-STD-028 . . . 40.00 . . . . . 80.00 . . . . . . . . 5

IPC-J-STD-030. . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 11

IPC/EIA J-STD-032 . . . 20.00 . . . . . . 40.00 . . . . . . . . 6

IPC/JEDEC J-STD-033B 25.00 . . . . . 50.00 . . . . . . . . 8

IPC/JEDEC J-STD-035 20.00 . . . . . 40.00 . . . . . . . . 8

IPC-HDI-1 . . . . . . . . . . 140.00 . . . . 280.00 . . . . . . . 19

IPC-PTH2-D . . . . . . . . . 50.00 . . . . . 75.00 . . . . . . . 39

IPC-P-SMT2-D . . . . . . 100.00 . . . . . .150.00 . . . . . . .39

E3TOOL-CD. . . . . . . . . . 99.00 . . . . . .149.00 . . . . . . . 34

IPC-PTH3-D . . . . . . . . . 50.00 . . . . . . 75.00 . . . . . . .39

IPC-P-SMT3-D . . . . . . 100.00 . . . . 150.00 . . . . . . .39

IPC-DRM-18G . . . . . . . 30.00 . . . . . 60.00 . . . . . . . . 8

IPC-A-20/21-G-KIT. . . . 75.00 . . . . . .150.00 . . . . . . . 36

IPC-A-22-D-KIT . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 36

IPC-A-22-G-KIT . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 36

IPC-A-24-G-KIT . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 36

IPC-A-25-D-KIT . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 36

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

IPC-A-25-G-KIT . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 36

IPC-A-25A-D-KIT . . . . . 65.00 . . . . . .130.00 . . . . . . . 36

IPC-A-25A-G-KIT . . . . . 65.00 . . . . . .130.00 . . . . . . . 36

IPC-A-36-G. . . . . . . . . . 90.00 . . . . . .180.00 . . . . . . . 36

IPC-A-36-D. . . . . . . . . 175.00 . . . . . .350.00 . . . . . . . 36

IPC-A-40-F-KIT. . . . . . . 27.00 . . . . . . .54.00 . . . . . . . 36

IPC-A-41-D-KIT . . . . . . 55.00 . . . . . .110.00 . . . . . . .36

IPC-A-41-F-KIT . . . . . . . 35.00 . . . . . . .70.00 . . . . . . . 36

IPC-A-42-D-KIT . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 37

IPC-A-42-G-KIT . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 37

IPC-A-43-D-KIT . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

IPC-A-43-G-KIT . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

IPC-A-44-D-KIT . . . . . 165.00 . . . . . .330.00 . . . . . . . 37

IPC-A-44-F-KIT. . . . . . 110.00 . . . . . .220.00 . . . . . . . 37

IPC-A-47-D-KIT . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

IPC-A-47-G-KIT . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

IPC-A-50. . . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 37

IPC-T-50G. . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 3

IPC-A-52G . . . . . . . . . . 50.00 . . . . . .100.00 . . . . . . . 37

IPC-DRM-53. . . . . . . . . 12.00 . . . . . 24.00 . . . . . . . . 9

IPC-DRM-56. . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . . 9

IPC-SC-60A . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . . 7

IPC-SA-61A . . . . . . . . 25.00 . . . . . 50.00 . . . . . . . . 7

IPC-AC-62A . . . . . . . . 25.00 . . . . . 50.00 . . . . . . . . 7

IPC-CH-65A . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . . 6

IPC-EA-100-K. . . . . . 220.00 . . . . 440.00 . . . . . . . . 4

IPC-M-102 . . . . . . . . 165.00 . . . . 330.00 . . . . . . . 21

IPC-M-103 . . . . . . . . 330.00 . . . . 660.00 . . . . . . . . 9

IPC-M-104 . . . . . . . . 165.00 . . . . 330.00 . . . . . . . . 9

IPC-TP-104-K . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . . 7

IPC-M-105 . . . . . . . . 305.00 . . . . 610.00 . . . . . . . 16

IPC-M-106 . . . . . . . . 275.00 . . . . 550.00 . . . . . . . 26

IPC-M-107 . . . . . . . . 165.00 . . . . 330.00 . . . . . . .22

IPC-M-108 . . . . . . . . . 90.00 . . . . 180.00 . . . . . . . . 6

IPC-M-109 . . . . . . . . . 85.00 . . . . 170.00 . . . . . . . . 7

IPC-DD-135 . . . . . . . . 25.00 . . . . . 50.00 . . . . . . . 20

IPC-SG-141 . . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . .23

IPC-A-142 . . . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 23

IPC-QF-143 . . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 23

IPC-CF-148A. . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 22

IPC-CF-152B . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 23

IPC-SKILL-201. . . . . . . . 75.00 . . . . . .150.00 . . . . . . . 31

IPC-DPMO-202. . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 13

IPC-FC-234 . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 22

IPC-FA-251 . . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . 21

IPC-D-279. . . . . . . . . . . 45.00 . . . . . 90.00 . . . . . . . 28

IPC-D-310C . . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . 28

IPC-A-311 . . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 27

IPC-D-322. . . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 28

IPC-D-325A . . . . . . . . . 25.00 . . . . . 50.00 . . . . . . . 16

IPC-D-326A . . . . . . . . . 25.00 . . . . . . .50.00 . . . . . . . 16

IPC-PD-335. . . . . . . . . 195.00 . . . . 390.00 . . . . . . . 10

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

IPC-D-356B . . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . 30

IPC-D-422. . . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 28

IPC-TR-461 . . . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . 14

IPC-TR-462. . . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . 15

IPC-TR-464. . . . . . . . . . 30.00 . . . . . 60.00 . . . . . . . 15

IPC-TR-465-1 . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 15

IPC-TR-465-2 . . . . . . . . 25.00 . . . . . 50.00 . . . . . . . 15

IPC-TR-465-3 . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 15

IPC-TR-466. . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . . 15

IPC-TR-476A. . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . . 7

IPC-TR-481 . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 18

IPC-TR-483 . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 25

IPC-TR-485 . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 23

IPC-TR-486 . . . . . . . . . 50.00 . . . . . 100.00 . . . . . . . 25

IPC-TR-551 . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 18

IPC-DR-572 . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 19

IPC-TR-579 . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 18

IPC-TR-581 . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 10

IPC-TR-582 . . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . . 7

IPC-TR-583. . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . . 7

IPC-WP/TR-584 . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 34

IPC-TR-585. . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 14

IPC-A-600G . . . . . . . . . 45.00 . . . . . . 90.00 . . . . . . . 17

IPC-A-600G-CH . . . . . . 45.00 . . . . . . .90.00 . . . . . . . 17

IPC-A-600G-IT . . . . . . . 45.00 . . . . . . .90.00 . . . . . . . 17

IPC-QE-605A . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 17

IPC-HDBK-610 . . . . . . . 40.00 . . . . . . 80.00 . . . . . . . . 4

IPC-A-610D . . . . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-CH . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-DE . . . . . . 50.00 . . . . 100.00 . . . . . . . . 4

IPC-A-610D-DK . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-FI . . . . . . . 50.00 . . . . 100.00 . . . . . . . . 4

IPC-A-610D-FR. . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-IT . . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-PL. . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-SP. . . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-SW. . . . . . 50.00 . . . . . 100.00 . . . . . . . . 4

IPC-A-610D-VN . . . . . . 50.00 . . . . . .100.00 . . . . . . . . 4

IPC/WHMA-A-620A . . 50.00 . . . . . 100.00 . . . . . . . . 5

IPC-TM-650 . . . . . . . . 220.00 . . . . . 440.00 . . . . . . . . 3

IPC-QL-653A . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 25

IPC-MI-660 . . . . . . . . . 60.00 . . . . . 120.00 . . . . . . . 22

IPC-TA-724 . . . . . . . . . . 70.00 . . . . . 140.00 . . . . . . . . 9

IPC-PE-740A . . . . . . . . 105.00 . . . . . 210.00 . . . . . . . 16

IPC-CM-770E . . . . . . . . 35.00 . . . . . 70.00 . . . . . . . 13

IPC-SM-780 . . . . . . . . . 35.00 . . . . . 70.00 . . . . . . . . 9

IPC-SM-784 . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . . 5

IPC-SM-785 . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . . 9

IPC-MC-790 . . . . . . . . . 40.00 . . . . . 80.00 . . . . . . . . 6

IPC-MS-810 . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 25

IPC-S-816 . . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 13

IPC-SM-817 . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 11

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NUMERIC PRODUC T INDE X / PRICE LIST

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IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

IPC-AJ-820. . . . . . . . . 220.00 . . . . . 440.00 . . . . . . . 12

IPC-CA-821 . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 11

IPC-HDBK-830 . . . . . . . 45.00 . . . . . . 90.00 . . . . . . . 12

IPC-CC-830B . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 12

IPC-SM-839 . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 19

IPC-SM-840C. . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 12

IPC-D-859 . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 27

IPC-HM-860. . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 17

IPC-TF-870 . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 17

IPC-ML-960 . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 18

IPC-1065. . . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 34

IPC-1066. . . . . . . . . . . . 15.00 . . . . . . .30.00 . . . . . . .34

IPC-TP-1090 . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 13

IPC-TP-1113. . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . . 6

IPC-TP-1114. . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 12

IPC-TP-1115. . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 13

IPC-1331.............. FD.........FD .......34

IPC-1710A............. FD......... FD .......31

IPC-1720A............. FD......... FD .......31

IPC-1730A............. FD......... FD .......31

IPC-1731.............. FD.........FD .......31

IPC-1752.............. FD.........FD .......34

IPC-1902. . . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 27

SPVC2005-CD . . . . . . . 99.00 . . . . . .199.00 . . . . . . . 35

IPC-2141A. . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 20

IPC-2220. . . . . . . . . . . 80.00 . . . . 160.00 . . . . . . . 26

IPC-2221A . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 26

IPC-2222. . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 26

IPC-2223A . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 26

IPC-2224. . . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 26

IPC-2225. . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 26

IPC-2226. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 27

IPC-2251. . . . . . . . . . . . 35.00 . . . . . . .70.00 . . . . . . . 20

IPC-2252. . . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 20

IPC/JPCA-2315. . . . . . 45.00 . . . . . 90.00 . . . . . . . 27

IPC-2501. . . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 28

IPC-2511A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC-2511B . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 30

IPC-2512A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2513A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2514A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2515A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2516A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2517A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 30

IPC-2518A. . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2524.............. FD.........FD .......24

IPC-2531. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 28

IPC-2541. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC-2546. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC-2547. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC-2571. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC-2576. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

IPC-2578. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 29

IPC-2581. . . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . .30

IPC-2615. . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 27

IPC-3406 . . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 11

IPC-3408 . . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 12

IPC-4101B. . . . . . . . . . 45.00 . . . . . . 90.00 . . . . . . . 22

IPC-4103. . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 20

IPC/JPCA-4104 . . . . . 45.00 . . . . . . 90.00 . . . . . . . 19

IPC-4110 . . . . . . . . . . . 20.00 . . . . . 40.00 . . . . . . .23

IPC-4121. . . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 22

IPC-4130. . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 23

IPC-4202. . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 21

IPC-4203. . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 21

IPC-4204. . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 21

IPC-4411A. . . . . . . . . . 45.00 . . . . . 90.00 . . . . . . . 23

IPC-4412A . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 23

IPC-4552 . . . . . . . . . . 40.00 . . . . . . 80.00 . . . . . . . 18

IPC-4553 . . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 18

IPC-4562 . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 22

IPC-4761. . . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 18

IPC-4821. . . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 22

IPC-5701............15.00.......30.00 ........6

IPC-6010-SERIES . . . 110.00 . . . . . 220.00 . . . . . . . 16

IPC-6011. . . . . . . . . . . . 15.00 . . . . . . 30.00 . . . . . . . 16

IPC-6012B . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 16

IPC-6012B-IT . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 16

IPC-6013A . . . . . . . . . 45.00 . . . . . . 90.00 . . . . . . . 21

IPC-6015. . . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 17

IPC-6016. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 19

IPC-6018A . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 21

IPC/JPCA-6202 . . . . . 45.00 . . . . . . 90.00 . . . . . . . 21

IPC/JPCA-6801 . . . . . 35.00 . . . . . . 70.00 . . . . . . . 19

IPC-7095A . . . . . . . . . 40.00 . . . . . . 80.00 . . . . . . . . 6

IPC-7351. . . . . . . . . . . . 50.00 . . . . . .100.00 . . . . . . . 27

IPC-7525. . . . . . . . . . . 20.00 . . . . . . 40.00 . . . . . . . 10

IPC-7530. . . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 12

IPC-7711/21A . . . . . . . 125.00 . . . . . 250.00 . . . . . . . 14

IPC-7912A. . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 13

IPC-8413-1 . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 15

IPC-8497-1 . . . . . . . . . . 35.00 . . . . . . .70.00 . . . . . . . 15

IPC-9151A............. FD.........FD .......24

IPC-9191. . . . . . . . . . . 35.00 . . . . . 70.00 . . . . . . . 24

IPC-9194. . . . . . . . . . . . 25.00 . . . . . . .50.00 . . . . . . . 24

IPC-9199. . . . . . . . . . . 35.00 . . . . . . 70.00 . . . . . . . 24

IPC-9201. . . . . . . . . . . 45.00 . . . . . . 90.00 . . . . . . . . 7

IPC-9251.............. FD.........FD .......36

IPC-9252 . . . . . . . . . . 30.00 . . . . . . 60.00 . . . . . . . 25

IPC-9261. . . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . 13

IPC-9591............25.00.......50.00 ........3

IPC-9691. . . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 24

IPC-9701A . . . . . . . . . 25.00 . . . . . . 50.00 . . . . . . . . 9

IPC/JEDEC-9702 . . . . . 15.00 . . . . . . .30.00 . . . . . . . . 9

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

IPC/JEDEC-9704 . . . . . 20.00 . . . . . . .40.00 . . . . . . . 10

IPC-9850-K. . . . . . . . . 40.00 . . . . . . 80.00 . . . . . . . 14

IPC-9850-TM-K . . . . . . . Call . . . . . . . . Call . . . . . . . 14

IPC-9850-TM-KW . . . . . Call . . . . . . . . Call . . . . . . . 14

IT-30101 . . . . . . . . . . 950.00 . . 1,900.00 . . . . . . . 20

IT-95080. . . . . . . . . . 150.00 . . . . 300.00 . . . . . . . 19

IT-96060. . . . . . . . . . 150.00 . . . . 300.00 . . . . . . . 20

IT-97061 . . . . . . . . . . 150.00 . . . . 300.00 . . . . . . . 25

IT-97071 . . . . . . . . . . 250.00 . . . . 500.00 . . . . . . . 20

IT-98103 . . . . . . . . . . 150.00 . . . . 300.00 . . . . . . . 25

IT-98123 . . . . . . . . . . 150.00 . . . . 300.00 . . . . . . . 20

ELEC-ELEC . . . . . . . . . 100.00 . . . . . .125.00 . . . . . . . 35

ELEC-RELIA . . . . . . . . 150.00 . . . . . .175.00 . . . . . . . 35

ELEC-MICRO . . . . . . . 175.00 . . . . . .220.00 . . . . . . . 35

ELEC-SOLDER. . . . . . . 100.00 . . . . . .100.00 . . . . . . . 13

IPC-ENVIRONMENT . 75.00 . . . . . 150.00 . . . . . . . 34

IPC-PWBADV-CD. . . . 185.00 . . . . . 285.00 . . . . . . . 28

IPC-DRM-SMT-D . . . . . 15.00 . . . . . . 30.00 . . . . . . . . 8

IPC-DRM-PTH-D . . . . . 15.00 . . . . . . .30.00 . . . . . . . . 8

RoHS-AUDIT-CD . . . . . CALL . . . . . . CALL . . . . . . . 34

FD - Free Download (1) - See page for pricing

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IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

0040...............60.00......120.00 .......15

1065...............30.00.......60.00 .......34

1066...............15.00.......30.00 .......34

1331 ................. FD ........FD .......34

1710A................ FD.........FD .......31

1720A................ FD ........FD .......31

1730A................ FD ........FD .......31

1731 ................. FD ........FD .......31

1752 ................. FD.........FD .......34

1902...............15.00 ......30.00 .......27

2141A . . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 20

2220...............80.00 .....160.00 .......26

2221A..............30.00 ......60.00 .......26

2222...............20.00.......40.00 .......26

2223A..............25.00 ......50.00 .......26

2224 ...............15.00 ......30.00 .......26

2225...............20.00 ......40.00 .......26

2226...............35.00 ......70.00 .......27

2251 ...............35.00.......70.00 .......20

2252...............25.00 ......50.00 .......20

2315 ...............45.00 ......90.00 .......27

2501...............35.00.......70.00 .......28

2511A . . . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . .29

2511B . . . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 30

2512A..............35.00 ......70.00 .......30

2513A..............35.00 ......70.00 .......30

2514A..............35.00 ......70.00 .......30

2515A..............35.00 ......70.00 .......30

2516A..............35.00 ......70.00 .......30

2517A . . . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . .30

2518A..............35.00 ......70.00 .......30

2524 ................. FD ........FD .......24

2531 . . . . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 28

2541 ...............35.00 ......70.00 .......29

2546...............35.00 ......70.00 .......29

2547...............35.00 ......70.00 .......29

2571 ...............35.00 ......70.00 .......29

2576 . . . . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 29

2578...............35.00 ......70.00 .......29

2581...............35.00.......70.00 .......30

2615 ...............30.00 ......60.00 .......27

3406...............15.00 ......30.00 .......11

3408...............15.00 ......30.00 .......12

4101B . . . . . . . . . . . . . . 45.00 . . . . . .90.00 . . . . . . . 22

4103 ...............30.00 ......60.00 .......20

4104 ...............45.00 ......90.00 .......19

4110 ...............20.00 ......40.00 .......23

4121 ...............15.00 ......30.00 .......22

4130 ...............20.00 ......40.00 .......23

4202...............30.00 ......60.00 .......21

4203...............30.00 ......60.00 .......21

4204...............30.00 ......60.00 .......21

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

4411A . . . . . . . . . . . . . . 45.00 . . . . . .90.00 . . . . . . .23

4412A..............30.00 ......60.00 .......23

4552...............40.00 ......80.00 .......18

4553...............40.00.......80.00 .......18

4562...............20.00 ......40.00 .......22

4761 ...............30.00.......60.00 .......18

4821...............40.00.......80.00 .......22

5701 ...............15.00.......30.00 ........6

6010 SERIES. . . . . . . . 110.00 . . . . . .220.00 . . . . . . . 16

6011 ...............15.00 ......30.00 .......16

6012B..............30.00 ......60.00 .......16

6012B-IT. . . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 16

6013-A . . . . . . . . . . . . . 45.00 . . . . . .90.00 . . . . . . . 21

6015 ...............25.00 ......50.00 .......17

6016 ...............35.00 ......70.00 .......19

6018A..............25.00 ......50.00 .......21

6202...............45.00 ......90.00 .......21

6801...............35.00 ......70.00 .......19

7095A..............40.00 ......80.00 ........6

7351 ...............50.00......100.00 .......27

7525 . . . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 10

7530...............25.00 ......50.00 .......12

7711/21A . . . . . . . . . . 125.00 . . . . . .250.00 . . . . . . . 14

7912A..............25.00 ......50.00 .......13

8413-1. . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 15

8497-1 .............35.00.......70.00 .......15

9151A . . . . . . . . . . . . . . . . FD . . . . . . . . . FD . . . . . . . 24

9191 ...............35.00 ......70.00 .......24

9194 ...............25.00.......50.00 .......24

9199 ...............35.00 ......70.00 .......24

9201...............45.00 ......90.00 ........7

9251 ................. FD.........FD .......36

9252...............30.00 ......60.00 .......25

9261...............25.00 ......50.00 .......13

9591...............25.00.......50.00 ........3

9691...............30.00.......60.00 .......24

9701A..............25.00 ......50.00 ........9

9702...............15.00.......30.00 ........9

9704...............20.00.......40.00 .......10

9850-K . . . . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . 14

9850-TM-K. . . . . . . . . . . Call . . . . . . . . Call . . . . . . . 14

9850-TM-KW. . . . . . . . . Call . . . . . . . . Call . . . . . . . 14

A-20/21-GKIT . . . . . . . . 75.00 . . . . . .150.00 . . . . . . .36

A-22-D-KIT . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . .36

A-22-G-KIT . . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . .36

A-24-G-KIT . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . .36

A-25-D-KIT. . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . .36

A-25-G-KIT. . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . .36

A-25A-D-KIT . . . . . . . . 65.00 . . . . . .130.00 . . . . . . .36

A-25A-G-KIT . . . . . . . . 65.00 . . . . . .130.00 . . . . . . .36

A-36-D . . . . . . . . . . . . 175.00 . . . . . .350.00 . . . . . . .36

A-36-G . . . . . . . . . . . . . 90.00 . . . . . .180.00 . . . . . . .36

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

A-40-F-KIT . . . . . . . . . . 27.00 . . . . . . .54.00 . . . . . . . 36

A-41-D-KIT . . . . . . . . . . 55.00 . . . . . .110.00 . . . . . . . 36

A-41-F-KIT . . . . . . . . . . 35.00 . . . . . . .70.00 . . . . . . .36

A-42-D-KIT. . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 37

A-42-G-KIT. . . . . . . . . . 30.00 . . . . . . .60.00 . . . . . . . 37

A-43-D-KIT. . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

A-43-G-KIT. . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

A-44-D-KIT. . . . . . . . . 165.00 . . . . . .330.00 . . . . . . . 37

A-44-F-KIT . . . . . . . . . 110.00 . . . . . .220.00 . . . . . . . 37

A-47-D-KIT . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

A-47-G-KIT . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 37

A-50 . . . . . . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 37

A-52G..............50.00......100.00 .......37

A-142 ..............20.00.......40.00 .......23

A-311 . . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . .27

A-600G. . . . . . . . . . . . . 45.00 . . . . . .90.00 . . . . . . . 17

A-600G-CH . . . . . . . . . 45.00 . . . . . . .90.00 . . . . . . . 17

A-600G-IT . . . . . . . . . . 45.00 . . . . . . .90.00 . . . . . . . 17

A-610D . . . . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-CH. . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-DE. . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-DK. . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-FI. . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-FR . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-IT. . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-PL . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-SP . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-SW . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-610D-VN. . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 4

A-620A. . . . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . . 5

AC-62A.............25.00 ......50.00 ........7

AJ-820 . . . . . . . . . . . . 220.00 . . . . 440.00 . . . . . . . 12

CA-821 . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 11

CC-830B. . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 12

CF-148A . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 22

CF-152B . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 23

CH-65A.............30.00 ......60.00 ........6

CM-770E . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 13

D-279 . . . . . . . . . . . . . . 45.00 . . . . . .90.00 . . . . . . . 28

D-310C . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . .28

D-322 . . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 28

D-325A. . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 16

D-326A.............25.00.......50.00 .......16

D-356B . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . .30

D-422..............20.00 ......40.00 .......28

D-859..............20.00 ......40.00 .......27

DD-135 . . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 20

DPMO-202 . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 13

DR-572 . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 19

DRM-18G . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . . 8

DRM-53 . . . . . . . . . . . . 12.00 . . . . . .24.00 . . . . . . . . 9

DRM-56 ............15.00.......30.00 ........9

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IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

DRM-PTH-D. . . . . . . . . 15.00 . . . . . . .30.00 . . . . . . . . 8

DRM-SMT-D . . . . . . . . 15.00 . . . . . .30.00 . . . . . . . . 8

E3TOOL-CD. . . . . . . . . . 99.00 . . . . . .149.00 . . . . . . . 34

EA-100K . . . . . . . . . . . 220.00 . . . . . 440.00 . . . . . . . . 4

ELEC-06 . . . . . . . . . . . 100.00 . . . . . .150.00 . . . . . . .35

ELEC-ELEC . . . . . . . . . 100.00 . . . . . .125.00 . . . . . . . 35

ELEC-MICRO . . . . . . . 175.00 . . . . . .220.00 . . . . . . . 35

ELEC-RELIA . . . . . . . . 150.00 . . . . . .175.00 . . . . . . . 35

ELEC-SOLDER. . . . . . . 100.00 . . . . . .100.00 . . . . . . . 13

EMTF-05W.............(1)......... (1) .......32

EMTF-06E .............(1)......... (1) .......32

EMTF-06F..............(1)......... (1) .......32

EMTF-06R .............(1)......... (1) .......32

EMTF-06T .............(1)......... (1) .......32

EMTF-06HSP...........(1)......... (1) .......33

EMTF-06MED . . . . . . . . . . (1) . . . . . . . . . (1) . . . . . . .33

ENVIRONMENT . . . . . . 75.00 . . . . . .150.00 . . . . . . . 34

EXCOMP-06............(1)......... (1) .......33

FA-251 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 21

FC-234 . . . . . . . . . . . . . 15.00 . . . . . . .30.00 . . . . . . . 22

HDBK-001 . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 4

HDBK-005 . . . . . . . . . . 35.00 . . . . . . .70.00 . . . . . . . 11

HDBK-610. . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 4

HDBK-830 . . . . . . . . . . 45.00 . . . . . .90.00 . . . . . . . 12

HDI-1 . . . . . . . . . . . . . 140.00 . . . . .280.00 . . . . . . . 19

HM-860 . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 17

IT-30101 . . . . . . . . . . . 950.00 . . . . .1900.00 . . . . . . . 20

IT-95080. . . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 19

IT-96060. . . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 20

IT-97061 . . . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 25

IT-97071 . . . . . . . . . . . 250.00 . . . . . 500.00 . . . . . . . 20

IT-98103 . . . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 25

IT-98123 . . . . . . . . . . . 150.00 . . . . . 300.00 . . . . . . . 20

J-STD-001D . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 4

J-STD-001DSP. . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 4

J-STD-001DSW . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 4

J-STD-002B . . . . . . . . . 20.00 . . . . . . .40.00 . . . . . . . 14

J-STD-003A. . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 14

J-STD-004A. . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 10

J-STD-005 . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 10

J-STD-006B. . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 11

J-STD-012 . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 5

J-STD-013 . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 5

J-STD-020C . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . . 8

J-STD-026 . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 5

J-STD-027 . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . . 5

J-STD-028 . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 5

J-STD-030 . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 11

J-STD-032 . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . . 6

J-STD-033B . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . . 8

J-STD-035 . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . . 8

M-102. . . . . . . . . . . . . 165.00 . . . . .330.00 . . . . . . . 21

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

M-103. . . . . . . . . . . . . 330.00 . . . . 660.00 . . . . . . . . 9

M-104. . . . . . . . . . . . . 165.00 . . . . .330.00 . . . . . . . . 9

M-105. . . . . . . . . . . . . 305.00 . . . . .610.00 . . . . . . . 16

M-106. . . . . . . . . . . . . 275.00 . . . . .550.00 . . . . . . . 26

M-107. . . . . . . . . . . . . 165.00 . . . . .330.00 . . . . . . . 22

M-108..............90.00 .....180.00 ........6

M-109..............85.00 .....170.00 ........7

MC-790 . . . . . . . . . . . . 40.00 . . . . . .80.00 . . . . . . . . 6

MI-660 . . . . . . . . . . . . . 60.00 . . . . .120.00 . . . . . . . 22

ML-960. . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 18

MS-810 . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 25

P-PTH2-D . . . . . . . . . . . 50.00 . . . . . .75.00 . . . . . . . 39

P-PTH3-D . . . . . . . . . . . 50.00 . . . . . .75.00 . . . . . . . 39

P-SMT2-D . . . . . . . . . 100.00 . . . . .150.00 . . . . . . . 39

P-SMT3-D . . . . . . . . . 100.00 . . . . .150.00 . . . . . . . 39

PD-335 . . . . . . . . . . . . 195.00 . . . . 390.00 . . . . . . . 10

PE-740A . . . . . . . . . . . 105.00 . . . . .210.00 . . . . . . . 16

PWB-CERTCD01 . . . . 125.00 . . . . .225.00 . . . . . . . 28

PWB-CRT-SG01 . . . . . . 35.00 . . . . . .70.00 . . . . . . . 28

PWBADV-CD . . . . . . . 185.00 . . . . .285.00 . . . . . . .28

PWBADV-SG02 . . . . . . 75.00 . . . . .150.00 . . . . . . . 28

QE-605A. . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . 17

QF-143 . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 23

QL-653A . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 25

ROADMAP-05 . . . . . . 125.00 . . . . . .250.00 . . . . . . . 31

RoHSAUDIT-CD . . . . . . CALL . . . . . . . CALL . . . . . . . 34

S-816 . . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 13

SA-61A.............25.00 ......50.00 ........7

SC-60A.............20.00 ......40.00 ........7

SG-141 . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 23

SKILL-201 . . . . . . . . . . . 75.00 . . . . . .150.00 . . . . . . . 31

SM-780 . . . . . . . . . . . . 35.00 . . . . . .70.00 . . . . . . . . 9

SM-784 . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . . 5

SM-785 . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . . 9

SM-817 . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 11

SM-839 . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 19

SM-840C . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 12

SMC-WP-001. . . . . . . . . . FD . . . . . . . . FD . . . . . . . 15

SMC-WP-005 . . . . . . . . . FD . . . . . . . . FD . . . . . . . 15

SPVC2005-CD . . . . . . . 99.00 . . . . . .199.00 . . . . . . . 35

T-50G ..............40.00 ......80.00 ........3

TA-724 . . . . . . . . . . . . . 70.00 . . . . .140.00 . . . . . . . . 9

TF-870 . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 17

TM-650 . . . . . . . . . . . 220.00 . . . . 440.00 . . . . . . . . 3

TP-104-K. . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . . 7

TP-1090 . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 13

TP-1113.............15.00.......30.00 ........6

TP-1114 . . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 12

TP-1115. . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 13

TR-461 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 14

TR-462 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 15

TR-464 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 15

IPC

PRODUCT ID MEMBER NONMEMBER PAGE

PRICE PRICE

TR-465-1 . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 15

TR-465-2 . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 15

TR-465-3 . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . 15

TR-466.............20.00.......40.00 .......15

TR-476A . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . . 7

TR-481 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 18

TR-483 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 25

TR-485 . . . . . . . . . . . . . 20.00 . . . . . .40.00 . . . . . . . 23

TR-486 . . . . . . . . . . . . . 50.00 . . . . .100.00 . . . . . . . 25

TR-551 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 18

TR-579 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . 18

TR-581 .............20.00.......40.00 .......10

TR-582 . . . . . . . . . . . . . 25.00 . . . . . .50.00 . . . . . . . . 7

TR-583 . . . . . . . . . . . . . 30.00 . . . . . .60.00 . . . . . . . . 7

TR-585 . . . . . . . . . . . . . 40.00 . . . . . . .80.00 . . . . . . . 14

WAGEE-04.............(1)......... (1) .......33

WAGEP-04.............(1)......... (1) .......33

WP-006 . . . . . . . . . . . . 20.00 . . . . . . .30.00 . . . . . . . 11

WP-008 ............15.00.......30.00 ........6

WP/TR-584 . . . . . . . . . 25.00 . . . . . . .50.00 . . . . . . . 34

FD - Free Download (1) - See page for pricing

Prices are subject to change –

check the online store.

APPLICATION FOR IPC MEMBERS H I P

PLEASE CHECK ONE:

c $1,000.00 Annual dues for Primary Site Membership (twelve months of IPC membership begins from the time the application and payment are received.)

c $800.00 Annual dues for Additional Facility Membership: additional membership for a site within an organization where another site is considered to be the

primary IPC member.

c $600.00 Annual dues for an independent PCB/PWA fabricator or independent EMS provider with annual sales of less than $1,000,000.

c $250.00 Annual dues for Government Agency/not-for-profit organization

EMTF MEMBERSHIP

c Please send me information about membership in the Executive Market Technology Forum (EMTF)

*Purchase orders are not accepted as payment toward your membership.

MAIL APPLICATION WITH CHECK OR MONEY ORDER TO:

IPC

3491 Eagle Way

Chicago, IL 60678-1349

*FAX/MAIL APPLICATION WITH CREDIT CARD PAYMENT TO:

IPC

3000 Lakeside Drive, Suite 309 S

Bannockburn, IL 60015

Tel: 847-615-7100

Fax: 847-615-7105

http://www.ipc.org

*Overnight deliveries to this address only.

TYPE OF COMPANY (CHECK ONE)

c Independent Printed Board Manufacturers

c Independent Electronics Assembly EMSI Company

c OEM–Manufacturer of any end product using PCB/PCAs or Captive

Manufacturer of PCBs/PCAs

c Industry Supplier

c Government Agency/Academic Technical Liaison

PAYMENT INFORMATION:

Enclosed is our check for $ ________________ (U.S. dollars)

Please bill my credit card: (check one) c MC c AMEX c VISA c DINERS

Card No. Expiration date

Authorized Signature

SITE INFORMATION:

Company Name

Street Address

City State Zip/Postal Code Country

Main Switchboard Phone No. Main Fax

Name of Primary Contact

Title Mail Stop

Phone Fax E-mail

Company e-mail address Website URL

Quantity Discounts

For Member and Nonmember companies:

STANDARDS/ VIDEOTAPES:

PROCEEDINGS

20-99 ....10% 5 or more.......10%

100 + . . . 20% 10 or more . . . .20%

Please note: Document quantity discounts are only

available when multiple copies of the same item

are purchased.

Prices

Prices are subject to change or correction. Prices

charged will be based on the IPC online store. Prices

including shipping and handling are available by call-

ing 847-597-2862. Quotes are valid for 90 days.

Resale

Only authorized distributors may purchase IPC

materials for resale.

Distributors

Visit the IPC online store for a list of IPC authorized

international distributors.

Shipping and Handling

For applicable shipping and handling charges,

please call customer service at 847-597-2862 or

e-mail orderipc@ipc.org.

Customer Carrier Account

Orders shipped via company carrier account will

incur a $10.00 handling charge.

Returns

Items must be returned within 21 days of receipt.

Exceptions apply, so please contact IPC customer

service staff at 847-597-2862 to ensure proper

credit.

Only IPC members can use purchase orders. Nonmember

orders must be prepaid.

Orders received before 12:30 pm (Central Time) will be sent

to the warehouse on the same day.

5 EASY WAYS TO ORDER

/

Mail

IPC

3491 Eagle Way

Chicago, IL 60678-1349

Phone

847-597-2862

(payment by credit card only)

Fax

847-615-7114

E-mail

orderipc@ipc.org

Online

www.ipc.org/onlinestore

(payment by credit card only)

))

2

)

2

)

@@

88

BILL TO (Available for IPC Members only)**

Name ______________________________________________

Title/MS ____________________________________________

Company ____________________________________________

Address ____________________________________________

City/State/Zip ________________________________________

Country _____________________________________________

Phone ______________________________________________

Fax ________________________________________________

(please include any country and area codes)

E-mail Address _______________________________________

SHIP TO

Name ______________________________________________

Title/MS ____________________________________________

Company ____________________________________________

Address ____________________________________________

City/State/Zip ________________________________________

Country _____________________________________________

Phone ______________________________________________

Fax ________________________________________________

(please include any country and area codes)

E-mail Address _______________________________________

IPC DOCUMENTS AND TRAINING

Quantity Product #/Description Price Each Total

Subtotal

IL Residents

add 7.75% tax

Shipping and

Handling

Total

PAYMENT METHOD

Billing is available for IPC Members only. Nonmembers need to prepay. Contact Customer Service for shippng and

handling costs.

o Check enclosed o Bill me (my P.O.# is)

Credit Card Purchase o AMEX o Visa o MC o Diners

Card # Exp Date

Cardholder’s Name Phone

Signature

Fax: 847-615-7114 Mail: IPC, 3491 Eagle Way, Chicago, IL 60678-1349

This catalog lists current pricing. Prices are subject to change. Catalog items are not for resale without permission

from or agreement with IPC.

o Sign me up to receive IPC e-mails on

relevant events and new releases. I

understand that I can opt-out at any

time.

o I do not wish to receive e-mails about

relevant IPC events and new releases.

Customer Service representative will apply appropriate shipping and handling charges — just fill out quantities,

descriptions and prices and let us do the math for you. If prepaying by wire or by check, please call 847-597-2862 or

e-mail orderipc@ipc.org for exact freight charges.

**In order for IPC members to receive member pricing, both “Bill To” and “Ship To” addresses must be the same member address.**

O R D E R F O R M

IPC’s

__________________________

__________________________

__________________________

__________________________

2007 – 2008

3000 Lakeside Drive, Suite 309 S, Bannockburn, IL 60015-1249

ASSOCIATION CONNECTING

ELECTRONICS INDUSTRIES

®

Tuesday – Thursday

FEBRUARY 20 – 22, 2007

FEBRUARY 19 – 21, 2008

Los Angeles Convention Center

Los Angeles, California

FOR MORE INFORMATION

877-472-4724 (U.S./Canada)

847-597-2860 (International)

shows@ipc.org

www.GoIPCShows.org