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User Manual: Datasheets RT8856, RT8856GQW.

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®

RT8856
Multi-Phase PWM Controller for CPU Core Power Supply
General Description

Features

The RT8856 is a single/dual phase PWM controller with
two integrated MOSFET drivers. Moreover, it is compliant
with Intel IMVP6.5 Voltage Regulator Specification to fulfill
its mobile CPU Vcore power supply requirements. The
RT8856 adopts NAVPTM (Native AVP) which is Richtek's



1/2 Phase PWM Controller with 2 Integrated
MOSFET Drivers



proprietary topology derived from finite DC gain
compensator peak current mode, making it an easy setting
PWM controller that meets all Intel AVP (Active Voltage
Positioning) mobile CPU requirements.



IMVP6.5 Compatible Power Management States
(DPSRLVR, PSI, Extended Deeper Sleep Mode)
NAVP (Native AVP) Topology
7-bit DAC
0.8% DAC Accuracy
Fixed VBOOT (1.1V)
Differential Remote Voltage Sensing
Programmable Output Transition Slew Rate Control
Accurate Current and Thermal Balance
System Thermal Compensation AVP
Ringing Free Mode at Light Load Conditions
Fast Transient Response
Power Good
Clock Enable Output
Thermal Throttling
Current Monitor Output
Switching Frequency up to 1MHz Per Phase
OVP, UVP, NVP, OCP, OTP, UVLO
40-Lead WQFN Package
RoHS Compliant and Halogen Free

The output voltage of the RT8856 is set by 7-bit VID code.
The built-in high accuracy DAC converts the VID code
ranging from 0V to 1.5V with 12.5mV per step. The system
accuracy of the controller can reach 1.5%. The part
supports VID on-the-fly and mode change on-the-fly
functions that are fully compliant with IMVP6.5
specification. It operates in single phase, dual phase and
RFM. It can reach up to 90% efficiency in different modes
according to different loading conditions. The droop load
line can be easily programmed by setting the DC gain of
the error amplifier. With proper compensation, the load
transient can achieve optimized AVP performance. This
chip controls soft-start and output transition slew rate via
a capacitor. It supports both DCR and sense resistor
current sensing. The current mode NAVPTM topology with
high accuracy current sensing amplifier well balances the
RT8856's channel currents.
The RT8856 provides power good, clock enabling and
thermal throttling output signals for IMVP6.5 specification.
It also features complete fault protection functions
including over voltage, under voltage, negative voltage, over
current, thermal shutdown, and under voltage lockout.




















Ordering Information
RT8856
Package Type
QW : WQFN-40L 6X6 (W-Type)
(Exposed Pad-Option 1)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :


The RT8856 is available in a WQFN-40L 6x6 small foot
print package.

RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.



Suitable for use in SnPb or Pb-free soldering processes.

Applications





IMVP6.5 Core Supply
Multi-phase CPU Core Supply
AVP Step-Down Converter
Notebook/ Desktop Computer/ Servers

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

is a registered trademark of Richtek Technology Corporation.

www.richtek.com
1

RT8856
Pin Configurations

Marking Information

ISEN2_N
BOOT2

OCSET

ISEN2

TON

PGOOD

CLKEN
VCC

YMDNN : Date Code

VRTT
NTC

(TOP VIEW)

RT8856GQW : Product Number

RT8856
GQW
YMDNN

40 39 38 37 36 35 34 33 32 31

DPRSLPVR
VRON
FS
CM
CMSET
VID6
VID5
VID4
VID3
VID2

1

30

2

29

3

28
27

4
5

26

GND

6

25
24

7
8

23

41

22

9

21

10

UGATE2
PHASE2
PGND2
LGATE2
PVCC
LGATE1
PGND1
PHASE1
UGATE1
BOOT1

ISEN1

ISEN1_N

RGND
SOFT

FB
VSEN

PSI
COMP

VID0

VID1

11 12 13 14 15 16 17 18 19 20

WQFN-40L 6x6

Typical Application Circuit
VIN
7V to 24V

5V
R1

38

VCC
C3

VID2
VID3
VID4
R7

R8

Vccp

6

VID6

13

PSI
DPRSLPVR

1

VRON

2

R11

40

PWRGD

39

CLKEN

C12

R18

R15

C14
R20

R21

R22

PSI
DPRSLPVR
VRON

R24

C18

3
R25

UGATE2 30
29

LGATE2 27
PGND2 28

COMP

FS

TON

37

R5

D1

R6

C6

C5

C9

R9

C8

Q3

L2

R10

VOUT

Q4

R12

C7

VIN
7V to 21V

R13

D2

R14

C10
C11

C9
R16

R17

VIN

C13
33
ISEN2
32
ISEN2_N
SOFT 18
RGND 17
NTC 35
OCSET 34

GND
41 (Exposed pad)

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

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2

31

CLKEN

NTC1
CPU VCC SENSE

BOOT2

PHASE2

C15
14

Q2

R4

24

PGOOD

15 FB

R23

L1

R3

19
ISEN1
ISEN1_N 20

VID6

5 CMSET
16 VSEN

CPU VSS SENSE

VOUT

PGND1

C4
Q1

LGATE1 25

36
VRTT
4 CM

VRTT
CM

C2
R2

PHASE1 23

7 VID5

VID5

26

BOOT1 21
UGATE1 22

VID0
11 VID1
10
VID2
9
VID3
8 VID4

VID1

3.3V

PVCC

12

VID0

C1

RT8856
VCC

R19

C16

C17
CPU VSS SENSE
R26
R29

R27

R28

VCC

NTC2

is a registered trademark of Richtek Technology Corporation.

DS8856-04 August 2014

RT8856
Table 1. IMVP6.5 VID code table
VID6 VID5 VID4 VID3 VID2 VID1 VID0

Output

VID6 VID5 VID4 VID3 VID2 VID1 VID0

Output

0

0

0

0

0

0

0

1.5000V

0

1

0

0

0

0

1

1.0875V

0

0

0

0

0

0

1

1.4875V

0

1

0

0

0

1

0

1.0750V

0

0

0

0

0

1

0

1.4750V

0

1

0

0

0

1

1

1.0625V

0

0

0

0

0

1

1

1.4625V

0

1

0

0

1

0

0

1.0500V

0

0

0

0

1

0

0

1.4500V

0

1

0

0

1

0

1

1.0375V

0

0

0

0

1

0

1

1.4375V

0

1

0

0

1

1

0

1.0250V

0

0

0

0

1

1

0

1.4250V

0

1

0

0

1

1

1

1.0125V

0

0

0

0

1

1

1

1.4125V

0

1

0

1

0

0

0

1.0000V

0

0

0

1

0

0

0

1.4000V

0

1

0

1

0

0

1

0.9875V

0

0

0

1

0

0

1

1.3875V

0

1

0

1

0

1

0

0.9750V

0

0

0

1

0

1

0

1.3750V

0

1

0

1

0

1

1

0.9625V

0

0

0

1

0

1

1

1.3625V

0

1

0

1

1

0

0

0.9500V

0

0

0

1

1

0

0

1.3500V

0

1

0

1

1

0

1

0.9375V

0

0

0

1

1

0

1

1.3375V

0

1

0

1

1

1

0

0.9250V

0

0

0

1

1

1

0

1.3250V

0

1

0

1

1

1

1

0.9125V

0

0

0

1

1

1

1

1.3125V

0

1

1

0

0

0

0

0.9000V

0

0

1

0

0

0

0

1.3000V

0

1

1

0

0

0

1

0.8875V

0

0

1

0

0

0

1

1.2875V

0

1

1

0

0

1

0

0.8750V

0

0

1

0

0

1

0

1.2750V

0

1

1

0

0

1

1

0.8625V

0

0

1

0

0

1

1

1.2625V

0

1

1

0

1

0

0

0.8500V

0

0

1

0

1

0

0

1.2500V

0

1

1

0

1

0

1

0.8375V

0

0

1

0

1

0

1

1.2375V

0

1

1

0

1

1

0

0.8250V

0

0

1

0

1

1

0

1.2250V

0

1

1

0

1

1

1

0.8125V

0

0

1

0

1

1

1

1.2125V

0

1

1

1

0

0

0

0.8000V

0

0

1

1

0

0

0

1.2000V

0

1

1

1

0

0

1

0.7875V

0

0

1

1

0

0

1

1.1875V

0

1

1

1

0

1

0

0.7750V

0

0

1

1

0

1

0

1.1750V

0

1

1

1

0

1

1

0.7625V

0

0

1

1

0

1

1

1.1625V

0

1

1

1

1

0

0

0.7500V

0

0

1

1

1

0

0

1.1500V

0

1

1

1

1

0

1

0.7375V

0

0

1

1

1

0

1

1.1375V

0

1

1

1

1

1

0

0.7250V

0

0

1

1

1

1

0

1.1250V

0

1

1

1

1

1

1

0.7125V

0

0

1

1

1

1

1

1.1125V

1

0

0

0

0

0

0

0.7000V

0

1

0

0

0

0

0

1.1000V

1

0

0

0

0

0

1

0.6875V

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

is a registered trademark of Richtek Technology Corporation.

www.richtek.com
3

RT8856
VID6 VID5 VID4 VID3 VID2 VID1 VID0 Output

VID6 VID5 VID4 VID3 VID2 VID1 VID0

Output

1

0

0

0

0

1

0

0.6750V

1

1

0

0

0

0

1

0.2875V

1

0

0

0

0

1

1

0.6625V

1

1

0

0

0

1

0

0.2750V

1

0

0

0

1

0

0

0.6500V

1

1

0

0

0

1

1

0.2625V

1

0

0

0

1

0

1

0.6375V

1

1

0

0

1

0

0

0.2500V

1

0

0

0

1

1

0

0.6250V

1

1

0

0

1

0

1

0.2375V

1

0

0

0

1

1

1

0.6125V

1

1

0

0

1

1

0

0.2250V

1

0

0

1

0

0

0

0.6000V

1

1

0

0

1

1

1

0.2125V

1

0

0

1

0

0

1

0.5875V

1

1

0

1

0

0

0

0.2000V

1

0

0

1

0

1

0

0.5750V

1

1

0

1

0

0

1

0.1875V

1

0

0

1

0

1

1

0.5625V

1

1

0

1

0

1

0

0.1750V

1

0

0

1

1

0

0

0.5500V

1

1

0

1

0

1

1

0.1625V

1

0

0

1

1

0

1

0.5375V

1

1

0

1

1

0

0

0.1500V

1

0

0

1

1

1

0

0.5250V

1

1

0

1

1

0

1

0.1375V

1

0

0

1

1

1

1

0.5125V

1

1

0

1

1

1

0

0.1250V

1

0

1

0

0

0

0

0.5000V

1

1

0

1

1

1

1

0.1125V

1

0

1

0

0

0

1

0.4875V

1

1

1

0

0

0

0

0.1000V

1

0

1

0

0

1

0

0.4750V

1

1

1

0

0

0

1

0.0875V

1

0

1

0

0

1

1

0.4625V

1

1

1

0

0

1

0

0.0750V

1

0

1

0

1

0

0

0.4500V

1

1

1

0

0

1

1

0.0625V

1

0

1

0

1

0

1

0.4375V

1

1

1

0

1

0

0

0.0500V

1

0

1

0

1

1

0

0.4250V

1

1

1

0

1

0

1

0.0375V

1

0

1

0

1

1

1

0.4125V

1

1

1

0

1

1

0

0.0250V

1

0

1

1

0

0

0

0.4000V

1

1

1

0

1

1

1

0.0125V

1

0

1

1

0

0

1

0.3875V

1

1

1

1

0

0

0

0.0000V

1

0

1

1

0

1

0

0.3750V

1

1

1

1

0

0

1

0.0000V

1

0

1

1

0

1

1

0.3625V

1

1

1

1

0

1

0

0.0000V

1

0

1

1

1

0

0

0.3500V

1

1

1

1

0

1

1

0.0000V

1

0

1

1

1

0

1

0.3375V

1

1

1

1

1

0

0

0.0000V

1

0

1

1

1

1

0

0.3250V

1

1

1

1

1

0

1

0.0000V

1

0

1

1

1

1

1

0.3125V

1

1

1

1

1

1

0

0.0000V

1

1

0

0

0

0

0

0.3000V

1

1

1

1

1

1

1

0.0000V

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is a registered trademark of Richtek Technology Corporation.

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RT8856
Functional Pin Description
Pin No.

Pin Name

1

DPRSLPVR

2

VRON

Voltage Regulator Enabler.

3

FS

Frequency Setting. Connect this pin with a resistor to ground to set the operating
frequency.

4

CM

Current Monitor Output. This pin outputs a voltage proportional to the output
current.

5

CMSET

Pin Function
Deeper Sleep Mode Signal. Together with PSI, the combination of these two pins
indicates the power management states.

Current Monitor Output Gain Externally Setting. Connect this pin with one resistor
to VSEN while CM pin is connected to ground with another resistor. The current
monitor output gain can be set by the ratio of these two resistors.

6 to 12

VID[6:0]

Voltage ID. DAC voltage identification inputs for IMVP6.5.
The logic threshold is 30% of VCCP as the maximum value for low state and 70%
of VCCP as the minimum value for the high state. VCCP is 1.05V.
Power Status Indicator II. Together with DPRSLPVR, the combination of these two

13

PSI

14

COMP

Compensation. This pin is the output node of the error amplifier.

15

FB

Feedback. This is the negative input node of the error amplifier.

16

VSEN

17

RGND

pins indicates the power management states.

Positive Voltage Sensing Pin. This pin is the positive node of the differential
voltage sensing.
Return Ground. This pin is the negative node of the differential remote voltage
sensing.
Soft-Start. This pin provides soft-start function and slew rate control. The
capacitance of the slew rate control capacitor is restricted to be larger than 10nF.

18

SOFT

The feedback voltage of the converter follows the ramping voltage on the SOFT pin
during soft-start and other voltage transitions according to different modes of
operation and VID change.

19

ISEN1

Positive Input of Phase1 Current Sense.

20

ISEN1_N

Negative Input of Phase1 Current Sense.
Bootstrap Power Pin of Phase1. This pin powers the high side MOSFET drivers.

21

BOOT1

Connect this pin to the junction of the bootstrap capacitor with the cathode of the
bootstrap diode. Connect the anode of the bootstrap diode to the PVCC pin.

22

UGATE1

Upper Gate Drive of Phase1. This pin drives the gate of the high side MOSFETs.

23

PHASE1

24

PGND1

25

LGATE1

Lower Gate Drive of Phase1. This pin drives the gate of the low side MOSFETs.

26

PVCC

Driver Power.

27

LGATE2

Lower Gate Drive of Phase2. This pin drives the gate of the low side MOSFETs.

28

PGND2

Driver Ground of Phase2.

29

PHASE2

Return Node of Phase2 High Side Driver. Connect this pin to high side MOSFET
sources together with the low side MOSFET drains and the inductor.

Return Node of Phase1 High Side Driver. Connect this pin to high side MOSFET
sources together with the low side MOSFET drains and the inductor.
Driver Ground of Phase1.

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

is a registered trademark of Richtek Technology Corporation.

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5

RT8856
Pin No.
30

Pin Name
UGATE2

Pin Function
Upper Gate Drive of Phase2. This pin drives the gate of the high side
MOSFETs.
Bootstrap Power Pin of Phase2. This pin powers the high side MOSFET drivers.

31

BOOT2

Connect this pin to the junction of the bootstrap capacitor with the cathode of the
bootstrap diode. Connect the anode of the bootstrap diode to the PVCC pin.

32

ISEN2_N

33

ISEN2

Negative Input of Phase2 Current Sense.
Positive input of Phase2 Current Sense.
Over Current Protection Setting. Connect a resistive voltage divider from VCC to

34

OCSET

ground and connect the joint of the voltage divider to the OCSET pin. The
voltage, VOCSET, determines the over current threshold, ILIM.
Thermal Detection Input for VRTT Circuit. Connect this pin with a resistive

35

NTC

voltage divider from VCC using NTC on the top to set the thermal management
threshold level.

36

VRTT

37

TON

38

VCC

39

CLKEN

40

PGOOD

41 (Exposed Pad)

Voltage Regulator Thermal Throttling. This open-drain output pin indicates the
temperature exceeding the preset level when it is pulled low.
Connect this pin to VIN with one resistor. This resistor value sets the ripple size
in ringing free mode.
Chip Power.
Inverted Clock Enable. This open-drain pin is an output indicating the start of the

GND

PLL locking of the clock chip.
Power Good Indicator.
Ground. The exposed pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.

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is a registered trademark of Richtek Technology Corporation.

DS8856-04 August 2014

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

VSEN

COMP

-

-

+

-

+

-

+

PGOOD

ERROR
AMP

UVP Trip
Point

+

SOFT
START

MUX

OVP Trip
Point

NVP Trip
Point

CLKEN

FB

DAC

1.2V

-

+

VRTT

SOFT

RGND

VID0
VID1
VID2
VID3
VID4
VID5
VID6

GND

VCC

NTC

VCC

Offset Cancellation

+

-

+

-

PSI

Mode
Selection

DPRSLPVR

OTP

Power On Reset
&
Central Logic

VRON

+

OCP
Setting

OCSET

-

+

-

+

CM

PWMCP

PWMCP

Ringing
Free
Mode

FB

TON

ONE_PHASE

1/2

Driver
Logic
Control

OSC

FS

+
20
-

+
20
-

CM
CMSET

ISEN2_N
ISEN2

ISEN1

ISEN1_N

PGND2

LGATE2

PHASE2

UGATE2

PGND1
BOOT2

PHASE1
PVCC
LGATE1

UGATE1

BOOT1

RT8856

Function Block Diagram

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7

RT8856
Absolute Maximum Ratings






















(Note 1)

VCC to GND ------------------------------------------------------------------------------------------------ −0.3V to 6.5V
RGND, PGNDx to GND ---------------------------------------------------------------------------------- −0.3V to 0.3V
VIDx to GND ------------------------------------------------------------------------------------------------ −0.3V to (VCC + 0.3V)
PSI, VRON to GND --------------------------------------------------------------------------------------- −0.3V to (VCC + 0.3V)
PGOOD, CLKEN, VRTT to GND ----------------------------------------------------------------------- −0.3V to (VCC + 0.3V)
VSEN, FB, COMP, SOFT, FS, OCSET, CM, CMSET, NTC to GND --------------------------- −0.3V to (VCC + 0.3V)
ISENx, ISEN1_N, ISEN2_N to GND ----------------------------------------------------------------- −0.3V to (VCC + 0.3V)
PVCC to PGNDx ------------------------------------------------------------------------------------------ −0.3V to 6.5V
LGATEx to PGNDx --------------------------------------------------------------------------------------- −0.3V to (PVCC + 0.3V)
PHASEx to PGNDx -------------------------------------------------------------------------------------- −3V to 28V
BOOTx to PHASEx --------------------------------------------------------------------------------------- −0.3V to 6.5V
UGATEx to PHASEx ------------------------------------------------------------------------------------- −0.3V to (BOOTx − PHASEx)
PGOOD ------------------------------------------------------------------------------------------------------ −0.3V to (VCC + 0.3V)
Power Dissipation, PD @ TA = 25°C
WQFN−40L 6x6 -------------------------------------------------------------------------------------------- 2.941W
Package Thermal Resistance (Note 2)
WQFN-40L 6x6, θJA --------------------------------------------------------------------------------------- 34°C/W
WQFN-40L 6x6, θJC -------------------------------------------------------------------------------------- 6°C/W
Junction Temperature ------------------------------------------------------------------------------------- 150°C
Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------- 260°C
Storage Temperature Range ---------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Mode) ------------------------------------------------------------------------------ 2kV
MM (Machine Mode) -------------------------------------------------------------------------------------- 200V

Recommended Operating Conditions





(Note 4)

Supply Voltage, VCC -------------------------------------------------------------------------------------- 4.5V to 5.5V
Battery Voltage, VIN -------------------------------------------------------------------------------------- 7V to 24V
Junction Temperature Range ---------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ---------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VCC = 5V, TA = 25°C, unless otherwise specified)

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Supply Input
Supply Current

I VCC + IPVCC

RFS = 33k, VVRON = 3.3V,
Not Switching

--

--

10

mA

Shutdown Current

I CC + IPVCC

VVRON = 0V

--

--

5

A

Soft-Start/Slew Rate Control (based on 10nF CSS)
Soft-Start / Soft-Shutdown I SS1

VSOFT = 1.5V

16

20

24

A

Deeper Sleep Exit/VID
Change Slew Current

VSOFT = 1.5V

80

100

120

A

I SS2

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RT8856
Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

RFS = 33k, VDAC > 1.05

270

300

330

kHz

RFS = 5k to 50k

20

--

20

%

Frequency Range

Per phase

200

--

1000

kHz

Maximum Duty Cycle

Per phase

--

50

--

%

VFS

RFS = 33k, VDAC > 1.05

1

1.05

1.1

V

VFB

VDAC = 0.7500  1.5000
(No Load, Active Mode )
VDAC = 0.5000 0.7500

0.8

0

0.8

%VID

7.5

0

7.5

mV

1.089

1.1

1.111

V

RL = 47k

70

80

--

dB

CLOAD = 5pF
CLOAD = 10pF (Gain = 4,
RF = 47k, VOUT = 0.5V 3V)
RL = 47k

--

10

--

MHz

--

5

--

V/s

0.5

--

3.6

V

--

250

--

A

Oscillator
Frequency

Frequency

f OSC

Variation

FS pin Output Voltage
Reference and DAC
DC Accuracy
Boot Voltage

VBOOT

Error Amplifier
DC Gain
Gain-Bandwidth Product

GBW

Slew Rate

SR

Output Voltage Range

VCOMP

MAX Source/Sink Current IOUTEA

VCOMP = 2V

Current Sense Amplifier
Input Offset Voltage

VOSCS

1

--

1

mV

Impedance at Neg. Input

RISENx_N

1

--

--

M

Impedance at Pos. Input

RISENx

1

--

--

M

DC Gain

AI

--

10

--

V/V

Input Range

VISENx_IN

50

--

100

mV

RFM TON Setting
TON Pin Output Voltage

VTON

RTON = 80k, VTON = VDAC = 0.75V

5

0

5

%

DEM ON-Time Setting

tON

IRTON = 80A

--

350

--

ns

RTON Current Range

IRTON

25

--

280

A

4.1

4.3

4.5

V

--

200

--

mV

Protection
Under Voltage Lockout
Threshold
Under Voltage Lockout
Threshold Hysteresis
Absolute Over Voltage
Protection Threshold
Relative Over Voltage
Protection Threshold

VUVLO

Falling edge

VUVLO
VOVABS

(With respect to 1.5V, ±50mV)

1.45

1.5

1.55

V

VOV

(With respect to VVID, ±50mV)

150

200

250

mV

350

300

250

mV

100

--

--

mV

Under Voltage Protection
Threshold

VUV

Negative Voltage
Protection Threshold

VNV

Measured at VSEN with respect to
unloaded output voltage (UOV)
(for 0.8 < UOV < 1.5)
Measured at VSEN with respect to
GND

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RT8856
Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Current Limit Threshold Voltage
(Average)

VILIM

 (VISENx VISENx_N) / N,
VOCSET = 0.625V,
VILIMT(nom) = 25mV

23

25

27

mV

Current Limit Threshold Voltage
(per phase)

VILIM_PH

VILIMITPH / VILIMIT

--

150

--

%

Thermal Shutdown Threshold

TSD

--

160

--

°C

Thermal Shutdown Hysteresis

TSD

--

10

--

°C

Logic Inputs
VRON Input Threshold
Voltage

Logic-High VIH

With respect to 3.3V, 70%

2.31

--

--

Logic-Low

With respect to 3.3V, 30%

--

--

0.99

1

--

1

With respect to 1.1V, 70%

0.77

--

--

With respect to 1.1V, 30%

--

--

0.33

1

--

1

A

--

1

--

V

VIL

Leakage Current of VRON
DAC (VID0  VID6),
Logic-High VIH
PSI and DPRSLPVR
Input Threshold Voltage Logic-Low VIL
Leakage Current of DAC (VID0 
VID6), PSI and DPRSLPVR

V
A
V

Power Good
PGOOD Threshold

VTH_PGOOD

PGOOD Low Voltage

VPGOOD

I PGOOD = 4mA

--

--

0.4

V

PGOOD Delay

tPGOOD

CLKEN Low to PGOOD High

3

--

20

ms

VCLKEN

I CLKEN = 4mA

--

--

0.4

V

Thermal Throttling Threshold

VOT

Measure at NTC with respect
to VCC

--

80

--

%VDD

Thermal Throttling Threshold
Hysteresis

VOT_HY

At VCC = 5V

--

100

--

mV

VRTT Output Voltage

VVRTT

I VRTT = 40mA

--

--

0.4

V

0.855

0.9

0.945

V

--

--

1.15

V

Clock Enable
CLKEN Low Voltage
Thermal Throttling

Current Monitor
Current Monitor Maximum Output
Voltage in Operating Range

VDAC = 1V, VRCMSET = 90mV,
RCM = 50k, RCMSET = 10k

Current Monitor Maximum Output
Voltage
Gate Driver
UGATE Driver Source

RUGATEsr

VBOOTx  VPHASEx = 5V
VBOOTx VUGATEx = 1V

--

0.7

--



UGATE Driver Sink

RUGATEsk

VUGATE = 1V

--

0.6

--



LGATE Driver Source

RLGATEsr

VPVCC = 5V,
VPVCC  VLGATE = 1V

--

0.7

--



LGATE Driver Sink

RLGATEsk

VLGATE = 1V

--

0.3

--



UGATE Driver Source/Sink Current

IUGATE

VBOOT  VPHASE = 5V
VUGATE = 2.5V

--

3

--

A

LGATE Driver Source Current

ILGATEsr

VLGATE = 2.5V

--

3

--

A

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RT8856
Parameter
LGATE Driver Sink Current
Internal Boost Charging Switch
On-Resistance

Symbol

Test Conditions

Min

Typ

Max

Unit

ILGATEsk

VLGATE = 2.5V

--

5

--

A

RBOOT

PVCC to BOOTx

--

30

--



Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in natural convection at TA = 25°C on a high effective thermal conductivity four-layer test board of
JEDEC 51-7 thermal measurement standard. The measured case position of θJC is on the exposed pad of the
package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

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RT8856
Typical Operating Characteristics
CCM Efficiency vs. Load Current

CCM Efficiency vs. Load Current
100

100

90

90

VIN = 8V
VIN = 12V
VIN = 19V

70

VIN = 8V
VIN = 12V
VIN = 19V

80

Efficiency (%)

Efficiency (%)

80

60
50
40
30
20

70
60
50
40
30
20

VID = 1.15V, RFS = 33 kΩ,
DPRSLPVR = GND, PSI = High

10

VID = 0.9375V, RFS = 33 kΩ,
DPRSLPVR = GND, PSI = High

10

0

0
0

10

20

30

40

50

0

10

20

Load Current (A)

30

40

50

Load Current (A)

DEM Efficiency vs. Load Current

CCM VCC_SENSE vs. Load Current
1.16

95
90

1.14

VCC_SENSE (V)

Efficiency (%)

85

VIN = 8V
VIN = 12V
VIN = 19V

80
75
70
65

1.12

VIN = 8V
VIN = 12V
VIN = 19V

1.1
1.08

60
1.06

VID = 0.85V, RFS = 33 kΩ,
DPRSLPVR = GND, PSI = High

55

VID = 1.15V, RFS = 33 kΩ,
DPRSLPVR = GND, PSI = High

1.04

50
0

0.5

1

1.5

2

2.5

0

3

10

Load Current (A)

20

30

40

50

Load Current (A)

CCM VCC_SENSE vs. Load Current

VCM vs. Load Current
1.1

0.96

1.0
0.9
0.8

0.92

VCM (mV)

VCC_SENSE (V)

0.94

VIN = 8V
VIN = 12V
VIN = 19V

0.90
0.88

0.7
0.6

VIN = 8V
VIN = 12V
VIN = 19V

0.5
0.4
0.3
0.2

0.86

VID = 0.9375V, RFS = 33 kΩ,
DPRSLPVR = GND, PSI = High

0.0

0.84
0

10

20

30

40

Load Current (A)
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12

VID = 0.9375V, RFS = 33 kΩ,
DPRSLPVR = GND, PSI = High

0.1

50

0

10

20

30

40

50

Load Current (A)
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RT8856
Power On from VRON

Power Off from VRON

VIN = 12V, VID = 0.9375V

VIN = 12V, VID = 0.9375V

VCC SENSE
(500mV/Div)
PGOOD
(1V/Div)

VCC SENSE
(500mV/Div)
PGOOD
(1V/Div)

VRON
(5V/Div)
UGATE
(20V/Div)

VRON
(5V/Div)
UGATE
(2V/Div)

DPRSLPVR = GND, PSI = High, No Load

DPRSLPVR = GND, PSI = High, No Load

Time (1ms/Div)

Time (1ms/Div)

CCM VID Change Up

CCM VID Change Down

VIN = 12V, VID change from 0.85V to 0.9375V

VIN = 12V, VID change from 0.9375V to 0.85V

VCC SENSE
(100mV/Div)

VCC SENSE
(100mV/Div)

UGATE1
(20V/Div)

UGATE1
(20V/Div)

LGATE1
(1V/Div)
VID0
(2V/Div)

LGATE1
(5V/Div)
VID0
(2V/Div)

DPRSLPVR = GND, PSI = High, No Load

DPRSLPVR = GND, PSI = High, No Load

Time (20μs/Div)

Time (20μs/Div)

RFM VID Change Down

CCM Load Transient Response

VIN = 12V, VID change 0.9375V to 0.85V,
DPRSLPVR = High, No Load

VCC SENSE
(100mV/Div)

VIN = 12V, VID = 0.95V, ILOAD = 12A to 51A,
DPRSLPVR = GND, PSI = High

VCC SENSE
(50mV/Div)

UGATE1
(20V/Div)
UGATE1
(20V/Div)

LGATE1
(5V/Div)
VID0
(2V/Div)

LGATE1
(5V/Div)
Time (40μs/Div)

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Time (4μs/Div)

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RT8856
CCM Load Transient Response

Over Current Protection

VIN = 12V, VID = 0.95V, ILOAD = 51A to 12A,

VCC SENSE
(50mV/Div)
VCC SENSE
(500mV/Div)
PGOOD
(1V/Div)

UGATE1
(20V/Div)
LGATE1
(5V/Div)

DPRSLPVR = GND, PSI = High

I LOAD
(50A/Div)
LGATE1
(10V/Div)

Time (4μs/Div)

Time (10μs/Div)

Over Voltage Protection

Under Voltage Protection

VCC SENSE
(1V/Div)

VCC SENSE
(1V/Div)

PGOOD
(2V/Div)
UGATE1
(20V/Div)

PGOOD
(2V/Div)
UGATE1
(20V/Div)

LGATE1
(5V/Div)

VIN = 12V, VID = 0.9375V, DPRSLPVR = GND

Time (10μs/Div)

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VIN = 12V, VID = 0.9375V, DPRSLPVR = GND

LGATE1
(5V/Div)

VIN = 12V, VID = 0.9375V, DPRSLPVR = GND

Time (10μs/Div)

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RT8856
Application Information
The RT8856 is a 1/2-phase DC/DC controller and includes
embedded gate drivers for reduced system cost and board
area. The number of phases is not only user selectable,
but also dynamically changeable based on Intel's
IMVP6.5 control signals to optimize efficiency. Phase
currents are continuously sensed for loop control, droop
tuning, and over current protection. The internal 7-bit VID
DAC and a low offset differential amplifier allow the
controller to maintain high voltage regulating accuracy
to meet Intel's IMVP6.5 specification.
Design Tool
To reduce the efforts and errors caused by manual
calculations, a user friendly design tool is now available
on request.
This design tool calculates all necessary design
parameters by entering user's requirements. Please
contact Richtek's representatives for details.
Phase Selection and Operation Modes
The maximum number of operating phase is programmable
by setting ISEN2_N. After the initial turn-on of the RT8856,
an internal comparator checks the voltage at the ISEN2_N
pin. To set the RT8856 as a pure single phase PWM
controller, connect ISEN2_N to a voltage higher than (VCC
- 1V) at power on. The controller will then disable phase 2
(hold UGATE2 and LGATE2 low) and operate as a single
phase PWM controller.
The RT8856 also works in conjunction with Intel's IIMVP6.5
control signals, such as PSI and DPRSLPVR. Table 2
shows the control signal truth table for operation modes
of the RT8856.
For high current demand, the controller will operate with
both phases active. These two phase gate signals are
interleaved. This achieves minimal output voltage ripple
and best transient performance.
For reduced current demand, only one phase is active.
For 1-phase operation, the power stage can minimize
switching losses and maintain transient response
capability.
At lowest current levels, the controller enters single phase

Table 2. Control signal truth table for operation
modes

DPRSLPVR
0
0

PSI
1
0

1

1

1

0

Operation mode
Multi-phase CCM
Single-phase CCM
S Single-phase RFM,
slow C4E
Single-phase RFM,
slow C4E

Differential Remote Sense Setting
The RT8856 includes differential, remote sense inputs to
eliminate the effects of voltage drops along the PC board
traces, CPU internal power routes and socket contacts.
The CPU contains on-die sense pin voltages, VCC_SENSE
and VSS_SENSE. VSS_SENSE is connected to RGND pin. The
VCC_SENSE is connected to FB pin with a resistor to build
the negative input path of the error amplifier. Connect VSEN
to VCC_SENSE for CLKEN, PGOOD, OVP, and UVP sense.
The 7-bit VID DAC and the precision voltage reference are
referred to RGND for accurate remote sensing.
Current Sense Setting
The RT8856 continuously sense the output current of each
phase. Therefore, the controller can be less noise sensitive
and get more accurate current sharing between phases.
Low offset amplifiers are used for loop control and current
limit. The internal current sense amplifier gain (AI) is fixed
to be 10. The ISENx and ISENx_N denote the positive
and negative input of the current sense amplifier of each
phase, respectively. Users can either use a current-sense
resistor or the inductor's DCR for current sensing.
Using inductor's DCR allows higher efficiency as shown
in Figure 1. If
L  R C
X
X
DCR

(1)

then the current sense performance will be optimum. For
example, choosing L = 0.36μH with 1mΩ DCR and
CX = 100nF, yields RX :

RX 

0.36H
 3.6k
1.0m  100nF

(2)

Ringing-Free Mode (RFM) to achieve highest efficiency.
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15

RT8856
V OUT
L

DCR

PHASEx

CX

RX

+ VX -

ISENx
ISENx_N

C BYPASS

Figure 1. Lossless Inductor Sensing
Since the inductance tolerances are normally observed
to be 20%, the resistor, RX, has to be tuned on board by
examining the transient voltage. If the output voltage
transient has an initial dip below the minimum load line
requirement with a slow recovery, RX is chosen too small.
Vice versa, with a resistance too large, the output voltage
transient has only a small initial dip and the recovery is
too fast, thus causing a ring-back.
Using current sense resistor in series with the inductor
can have better accuracy, but the efficiency is a trade-off.
Considering the equivalent inductance (LESL) of the current
sense resistor, an RC filter is recommended. The RC filter
calculation method is similar to the above-mentioned
inductor DCR sensing method .
Loop Control

Similar to the peak current mode control with finite
compensator gain, the HS_FET on-time is determined by
both the internal clock and the PWM comparator which
compares the EA output with the output of current sense
amplifier. When load current increases, VCS increases,
the steady state COMP voltage also increases and makes
the VOUT decrease, hence achieving AVP. A near-DC offset
(VOFS) is added to the output EA to cancel the inherent
output offset of finite-gain peak current mode controller.
In RFM, HS_FET is turned on with constant TON when
VCS is lower than VCOMP2. Once the HS_FET is turned off,
LS_FET is turned on automatically. By Ringing-Free
Technique, the LS_FET allows only partial of negative
current when the inductor free-wheeling current reaches
negative. The switching frequency will be proportionately
reduced, thus the conduction and switching losses will
be greatly reduced.
Droop Setting (with Temperature Compensation)
It's very easy to achieve Active Voltage Positioning (AVP)
by properly setting the error amplifier gain with respect to
the native droop characteristics. The target is to have
Equation (3)
VOUT = VSOFT − ILOAD x RDROOP

(3)

TM

The RT8856 adopts Richtek's proprietary NAVP

topology.
NAVPTM is based on the finite-gain peak current mode
PWM topology. The output voltage, VOUT, will decrease
with increasing output load current. The control loop
consists of PWM modulator with power stage, current
sense amplifier and error amplifier as shown in Figure 2.
VIN

RT8856
S
Clock

UGATEx

PWM
Logic
R

HS_FET
RX

LGATEx

L

VOUT

CX

RC

LS_FET

+

CMP
COMP2

VCS

AI

+
-

+
-

EA
+
VDAC

VOFS

V OUT
A V2 > A V1

C2
R2

C1
R1

VCC_SENSE

FB

A V2

SOFT
RGND

A V1

CSOFT
VSS_SENSE

Figure 2. Simplified Schematic for Droop and Remote
Sense in CCM
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16

where AI is the internal current sense amplifier gain. RSENSE
is the current sense resistor. If there is no external sense
resistor, it is the DCR of the inductor. RDROOP is the
resistive slope value of the converter output and is the
desired static output impedance, e.g. −1.9mΩ or −3mΩ
for IMVP6.5 specification. Increasing AV can make load
line more shallow as shown in Figure 3.

C

ISENx
ISENx_N

COMP

then solving the switching condition VCOMP2 = VCS in
Figure 2 yields the desired error amplifier gain as
A  RSENSE
(4)
A V  R2  I
R1
RDROOP

0

Load Current

Figure 3. Error Amplifier Gain (AV) Influence on VOUT
Accuracy
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RT8856
Since the DCR of inductor is highly temperature dependent,
it affects the output accuracy at hot conditions.
Temperature compensation is recommended for the
lossless inductor DCR current sense method. Figure 4
shows a simple but effective way of compensating the
temperature variations of the sense resistor using an NTC
thermistor placed in the feedback path.
C2

RT8856

R2

COMP

C1

R1b

FB

+
-

EA
+
VDAC

R1a

VCC_SENSE

NTC
CSOFT
10nF

RGND

25

x (R1b + R1a // RNTC, 25)

where AV, 25 is the error amplifier gain at room temperature
and can be obtained from Equation (4). R1b can be obtained
by substituting Equation (9) to (5),
R1b 
RSENSE, HOT
 (R1a // RNTC, HOT )  (R1a // RNTC, HOT )
RSENSE, COLD

(5)

From Equation (4), Av can be obtained at any temperature
(T) as shown below :
R2
R1a // RNTC, T  R1b

(6)

The standard formula for the resistance of NTC thermistor
as a function of temperature compensation is given by :

  

1

 1 
298 
 T+273

(7)

where R25 is the thermistor's nominal resistance at room
temperature, β (beta) is the thermistor's material constant
in Kelvins, and T is the thermistor's actual temperature in
Celsius.
To calculate DCR value at different temperature, use the
equation below :
DCRT = DCR25 x [1 + 0.00393 x (T − 25)]

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

(10)

VSS_SENSE

A V, HOT
RSENSE, HOT

A V, COLD RSENSE, COLD



(9)

RSENSE, HOT 

1  R

SENSE, COLD 


Usually, R1a is set to equal RNTC (25°C). R1b is selected
to linearize the NTC's temperature characteristic. For a
given NTC, design is to get R1b and R2 and then C1 and
C2. According to Equation (4), to compensate the
temperature variations of the sense resistor, the error
amplifier gain (AV) should have the same temperature
coefficient with RSENSE. Hence,

RNTC, T  R25 e

R2 = AV,

SOFT

Figure 4. Loop Setting with Temperature Compensation

A V, T 

where the 0.00393 is the temperature coefficient of the
copper. For a given NTC thermistor, solving Equation (6)
at room temperature (25°C) yields

Loop Compensation
Optimized compensation of the RT8856 allows for best
possible load step response of the regulator's output. A
type-II compensator with one pole and one zero is
adequate for a proper compensation. Figure 4 shows the
compensation circuit. Prior design procedure shows how
to select the resistive feedback components for the error
amplifier gain. Next, the C1 and C2 must be calculated for
the compensation. The target is to achieve constant
resistive output impedance over the widest possible
frequency range.
The pole frequency of the compensator must be set to
compensate the output capacitor ESR zero :
1
2    C  RC

fP 

(11)

where C is the capacitance of output capacitor, and RC is
the ESR of output capacitor. C2 can be calculated as
follows :

C2 

C  RC
R2

(12)

The zero of compensator has to be placed at half of the
switching frequency to filter the switching related noise.
such that,
C1 

1

(13)

R1b  R1a // RNTC, 25     fSW

(8)

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17

RT8856
Frequency Setting

Power Up Sequence

High frequency operation optimizes the application for
smaller component size, but trads off efficiency due to
higher switching losses. This may be acceptable in ultraportable devices where the load currents are lower and
the controller is powered from a lower voltage supply. Low
frequency operation offers the best overall efficiency at
the expense of component size and board space.

With the controller's VCC voltage above the POR threshold
(typ. 4.3V), the power-up sequence begins when VRON
exceeds the 3.3V logic high threshold. Approximately
20μs later, SOFT and VCORE starts ramping up to boot
voltage (1.1V) with maximum phases. The slew rate during
power-up is 20μA/CSOFT. The RT8856 pulls CLKEN low
after VVSEN rises above 1V for 73μs. Right after CLKEN
goes low, SOFT and VCORE starts ramping to first DAC
value. After CLKEN goes low for approximate 4.7ms,
PGOOD is asserted HIGH. DPRSLPVR and PSI are valid
right after PGOOD is asserted. UVP is masked as long
as VSOFT is less than 1V.

Connect a resistor (RFS) between FS and ground to set
the switching frequency (fSW) per phase :
RFS (k ) 

300(kHz)  33(k )
fSW (kHz)

(14)

A resistor of 5kΩ to 50kΩ corresponds to switching
frequency of 1MHz to 200kHz, respectively.

VCC 4.3V

4.1V

POR
VRON

Soft-Start and Mode Change Slew Rates
VID

The RT8856 uses 2 slew rates for various modes of
operation. These two slew rates are internally determined
by commanding one of two bi-directional current sources
on to the SOFT pin (ISS). The 7-bit VID DAC and the
precision voltage reference are referred to RGND for
accurate remote sensing. Hence, connect a capacitor
(CSOFT) from SOFT pin to RGND for controlling the slew
rate as shown in Figure 4. The capacitance of capacitor is
restricted to be larger than 10nF. The voltage on SOFT
pin (VSOFT) is higher than the reference voltage of the error
amplifier at about 0.9V.
The first current of typically 20μA is used to charge or
discharge the CSOFT during soft-start, soft-shutdown. The
second current of typically 100μA is used during other
voltage transitions, including VID change and transitions
between operation modes.
The IMVP6.5 specification specifies the critical timing
associated with regulating the output voltage. The symbol,
SLEWRATE, as given in the IMVP6.5 specification will
determine the choice of the SOFT capacitor, CSOFT, by the
following equation :
CSOFT (nF) 

ISS (A)
SLEWRATE(mV / s)

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

www.richtek.com
18

(15)

XX
1V

1.1V

VCORE
PWM

x
x

Valid

0.2V

DPRSLPVR/PSI
Defined
Hi-Z

MAX Phases

MAX Phases

Pull Low

DPRSLPVR

XX

Valid

XX

PSI

XX

Valid

XX

CLKEN
PGOOD
73µs typ. 4.7ms typ.

Figure 5. Timing Diagram for Power-Up and Power-Down
Power Down
When VRON goes low, the RT8856 enters low-power
shutdown mode. PGOOD is pulled low immediately and
VSOFT ramps down with slew rate of 20μA/CSOFT. VVSEN
also ramps down following VSOFT with maximum phases.
After VVSEN falls below 200mV, the RT8856 turns off both
high side and low side MOSFETs. A discharging resistor
at VSEN will be enabled and the analog part will be turned
off.
Deeper Sleep Mode Transitions
After DPRSLPVR goes high, the RT8856 immediately
disables phase 2 (UGATE2 and LGATE2 forced low) and
enters 1-phase deeper sleep mode operation. If the VIDs
are set to a lower voltage setting, the output drops at a
rate determined by the load and the output capacitance.
The internal target VSOFT still ramps as before, and UVP,
OCP and OVP are masked for 73μs.
is a registered trademark of Richtek Technology Corporation.

DS8856-04 August 2014

RT8856
The RT8856 provides 2 slew rates for deeper sleep mode
entry/ exit. For standard deeper sleep exit, the RT8856
immediately activates all enabled phases and ramps the
output voltage to the DAC code provided by the processor
at the slew rate of 100μA/CSOFT. The RT8856 remains in
1-phase ringing free mode and ramps the output voltage
to the DAC code provided by the processor at the slew
rate of 20μA/CSOFT.

temperature compensation is recommended to protect
under all conditions. Figure 7 shows a typical OCP setting
with temperature compensation.
V CC
RT8856

R OC1a

NTC

R OC1b
OCSET

Current Limit Setting

R OC2

The RT8856 compares a programmable current limit set
point to the voltage from the current sense amplifier output
for Over Current Protection (OCP). The voltage applied to
OCSET pin defines the desired current limit threshold,
ILIM :
VOCSET = 25 x ILIM x RSENSE

(16)

Connect a resistive voltage divider from VCC to GND, with
the joint of the voltage divider connected to OCSET pin as
shown in Figure 6. For a given ROC2,
 VCC

ROC1  ROC2  
 1
V
 OCSET

RT8856

(17)
V CC

Figure 7. OCP Setting with Temperature Compensation
Usually, select R OC1a equal to thermistor's nominal
resistance at room temperature. Ideally, VOCSET should
have same temperature coefficient as RSENSE (Inductor
DCR) :
VOCSET, HOT
RSENSE, HOT

(18)
VOCSET, COLD RSENSE, COLD
According to the basic circuit calculation, VOCSET can be
obtained at any temperature :
ROC2
(19)
VOCSET, T 
ROC1a // RNTC, T  ROC1b  ROC2

R OC1

Re-write Equation (18) from (19), and get VOCSET at room
temperature

R OC2

ROC1a // RNTC, COLD  ROC1b  ROC2
RSENSE, HOT

ROC1a // RNTC, HOT  ROC1b  ROC2
RSENSE, COLD

OCSET

Figure 6. OCP Setting Without Temperature
Compensation

(20)
VOCSET, 25 

ROC2
ROC1a // RNTC, 25  ROC1b  ROC2

(21)

The OCP works in two stages :




Stage 1 : Average inductor current exceeds the current
limit threshold, ILIM, defined by VOCSET, but remains
smaller than 150% of ILIM If the over current condition
remains valid for 16 cycles, the OCP latches and the
system shuts down.
Stage 2 : Any inductor current exceeds 150% of ILIM
then OCP latches instantaneously.

Latched OCP forces driver high impedance with
UGATEx = 0 and LGATEx = 0. After latched OCP happens,
VVSEN will be monitored. When VVSEN falls below 200mV,
a discharging resistor at VSEN will be enabled.

Solving Equation (20) and (21) yields ROC1b and ROC2

ROC2 
  REQU, HOT  REQU, COLD  (1   )  REQU, 25
VCC
 (1   )
VOCSET, 25
ROC1b 
(  1)  ROC2    REQU, HOT  REQU, COLD
(1   )

DS8856-04 August 2014

(23)

where

RSENSE, HOT
DCR25  [1  0.00393  (THOT  25)]

RSENSE, COLD DCR25  [1  0.00393  (TCOLD  25)]
(24)

If inductor DCR is used as current sense component, then
Copyright © 2014 Richtek Technology Corporation. All rights reserved.

(22)

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19

RT8856
REQU, T = R1a // RNTC, T

(25)

Over Temperature Protection (OTP)

 ROC2 = 2.437kΩ, ROC1b = 7.113kΩ

Over Temperature Protection prevents the VR from
damage. OTP is considered to be the final protection stage
against overheating of the VR. The thermal throttling VRTT
should be set to assert prior to OTP to manage the VR
power. When this measure is insufficient to keep the die
temperature of the controller below the OTP threshold,
OTP will be asserted and latched. The die temperature of
the controller is monitored internally by a temperature
sensor. As a result of OTP triggering, a soft shutdown will
be launched and VVSEN will be monitored. When VVSEN is
less than 200mV, the driver remains in high impedance
state and the discharging resistor at VSEN pin will be
enabled. A reset can be executed by cycling VCC or
VRON.

Over Voltage Protection (OVP)

Thermal Throttling Control

The OVP circuit is triggered under two conditions :

Intel IMVP6.5 technology supports thermal throttling of
the processor to prevent catastrophic thermal damage.
The RT8856 includes a thermal monitoring circuit to detect
an exceeded user defined temperature on a VR point.
The thermal monitoring circuit senses the voltage change
across the NTC pin. Figure 8 shows the principle of setting
the temperature threshold. Connect an external resistive
voltage divider between Vcc and GND. This divider uses a
Negative Temperature Coefficient (NTC) thermistor and a
resistor. The joint of the voltage divider is connected to
the NTC pin in order to generate a voltage that is
proportional to the temperature. The RT8856 pulls VRTT
low if the voltage on the NTC pin is greater than 0.8 x VCC.
The internal VRTT comparator has a hysteresis of 100mV
to prevent high frequency VRTT oscillation when the
temperature is near the setting point. The minimum
assertion/de-assertion time for VRTT toggling is 1.5ms.

For example, the following design parameters are given :
DCR =1mΩ, VCC = 5V, IL, Ripple = 5A
ROC1a = RNTC, 25 = 10kΩ, βNTC = 2400
For −20°C to 100°C operation range, to set OCP trip current
ITRIP = 57A when operating with maximum phases :

ILIM  57A  5A  33.5A
2
VOCSET, 25  25  33.5A  1m  0.8375V
RNTC, −20 =41.89kΩ, RNTC, 100 = 1.98kΩ
RSENSE, −20 =0.82 mΩ, RSENSE, 100 =1.29mΩ



Condition 1 : When VVSEN exceeds 1.55V.



Condition 2 : When VVSEN exceeds VDAC by 200mV.

If either condition is valid, the RT8856 latches the
LGATEx =1 and UGATEx = 0 as crowbar to the output
voltage of VR. Turning on all LS_FETs can lead to very
large reverse inductor current and potentially result in
negative output voltage of VR. To prevent damage of the
CPU by negative voltage, the RT8856 turns off all LS_FETs
when VVSEN has fallen below −100mV.
Under Voltage Protection (UVP)
If VVSEN is less than VDAC by 300mV or more, a UVP fault
is latched and the RT8856 turns off both upper side and
lower side MOSFETs. VVSEN is monitored after UVP is
valid. When VVSEN falls below 200mV, a discharging
resistor at VSEN will be enabled.

RT8856

Negative Voltage Protection (NVP)
During shutdown or protection state, when VVSEN is lower
than −100mV, the controller will force LGATEx = 0 and
UGATEx = 0 for preventing negative voltage. Once VVSEN
recovers to be more than 0mV, NVP will be suspended
and LGATEx = 1 will be enabled again.

VRTT

V CC

R OC1b
+
CMP
-

NTC
R OC2

0.8 x V CC

Figure 8. Thermal Throttling Setting Principle
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20

is a registered trademark of Richtek Technology Corporation.

DS8856-04 August 2014

RT8856
Users can use the same NTC thermistor for both thermal
throttling and current limit setting as shown in Figure 9.
Just divide the ROC1b into RTTa and RTTb, and write the
VNTC equation at thermal throttling temperature TT°C :
RTTa + RTTb = ROC1b

(26)

ROC2  RTTb
 VCC
ROC2  ROC1b  ROC1a // RNTC, TTC
 0.8  VCC

(27)

Solving (26) and (27) for RTTa and RTTb as :
RTTb = 4 x (ROC1a // RNTC, TT°C )−ROC2

(28)

RTTa = ROC1b − RTTb

(29)

RT8856
VRTT

V CC

Inductor Selection
The switching frequency and ripple current determine the
inductor value as follows :
LMIN  N 

VOUT(MIN)  (1  DMIN )
fSW  IRipple

(31)

where N is the total number of phases. DMIN is the minimum
duty at highest input voltage VIN.
Higher inductance yields in less ripple current and hence
in higher efficiency. The flaw is the slower transient
response of the power stage to load transients. This might
increase the need for more output capacitors driving the
cost up. Find a low loss inductor having the lowest possible
DC resistance that fits in the allotted dimensions. The
core must be large enough not to saturate at the peak
inductor current.
Output Capacitor Selection

R OC1a

NTC

R OC1b
+
CMP
-

NTC
R OC2

0.8 x V CC

Figure 9. Using single NTC Thermistor for Thermal
Throttling and Current Limit Setting
Current Monitor
The current monitor allows the system to accurately
monitor the CPU's current dissipation and quickly predict
whether the system is about to overheat before the
significantly slower temperature sensor signals an over
temperature alert. The voltage output of CM pin is
proportional to the output current. This pin is connected
to ground with one resistor while CMSET pin is connected
to VVSEN with another resistor. By choosing the appropriate
ratio of these two resistors, current monitor gain can be
set and VCM will be 1V with maximum output current.
Maximum value of VCM is clamped at 1.15V.

VCM  ILOAD  RDROOP  2 
R

RCM
CMSET

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

(30)

Output capacitors are used to obtain high bandwidth for
the output voltage beyond the bandwidth of the converter
itself. Usually, the CPU manufacturer recommends a
capacitor configuration. Two different kinds of output
capacitors can be found, bulk capacitors closely located
to the inductors and ceramic output capacitors in close
proximity to the load. The latter ones are for mid frequency
decoupling with especially small ESR and ESL values
while the bulk capacitors have to provide enough stored
energy to overcome the low frequency bandwidth gap
between the regulator and the CPU.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.

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RT8856
For recommended operating condition specifications of
RT8856, the maximum junction temperature is 125°C and
TA is the ambient temperature. The junction to ambient
thermal resistance, θ JA , is layout dependent. For
WQFN-40L 6x6 packages, the thermal resistance, θJA, is
34°C/W on a standard JEDEC 51-7 four-layer thermal test
board. The maximum power dissipation at TA = 25°C can
be calculated by the following formula :
PD(MAX) = (125°C − 25°C) / (34°C/W) = 2.941W for
WQFN-40L 6x6 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. For RT8856 package, the derating curve
in Figure 10 allows the designer to see the effect of rising
ambient temperature on the maximum power dissipation.

Layout Considerations
Careful PC board layout is critical to achieve low switching
losses and clean, stable operation. The switching power
stage requires particular attention. If possible, mount all
of the power components on the top side of the board
with their ground terminals flush against one another.
Follow these guidelines for optimum PC board layout :


Keep the high current paths short, especially at the
ground terminals.



Keep the power traces and load connections short. This
is essential for high efficiency.



Connect slew rate control capacitor at SOFT pin to
RGND.



When trade offs in trace lengths must be made, it's
preferable to allow the inductor charging path to be made
longer than the discharging path.



Place the current sense component close to the
controller. ISENx and ISENx_N connections for current
limit and voltage positioning must be made using Kelvin
sense connections to guarantee the current sense
accuracy. PCB trace from the sense nodes should be
paralleled back to controller.



Route high speed switching nodes away from sensitive
analog areas (SOFT, COMP, FB, VSEN, ISENx,
ISENx_N, CM, CMSET, etc...)

Maximum Power Dissipation (W)1

3.2

Four Layers PCB
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
0

25

50

75

100

125

Ambient Temperature (°C)

Figure 10. Derating Curves for RT8856 Packages

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is a registered trademark of Richtek Technology Corporation.

DS8856-04 August 2014

RT8856
Outline Dimension

1

1

2

2

DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.

Symbol

Dimensions In Millimeters

Dimensions In Inches

Min.

Max.

Min.

Max.

A

0.700

0.800

0.028

0.031

A1

0.000

0.050

0.000

0.002

A3

0.175

0.250

0.007

0.010

b

0.180

0.300

0.007

0.012

D

5.950

6.050

0.234

0.238

Option1

4.000

4.750

0.157

0.187

Option2

3.470

3.570

0.137

0.141

5.950

6.050

0.234

0.238

Option1

4.000

4.750

0.157

0.187

Option2

2.570

2.670

0.101

0.105

D2
E
E2
e
L

0.500
0.350

0.020
0.450

0.014

0.018

W-Type 40L QFN 6x6 Package

Copyright © 2014 Richtek Technology Corporation. All rights reserved.

DS8856-04 August 2014

is a registered trademark of Richtek Technology Corporation.

www.richtek.com
23

RT8856

Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

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DS8856-04 August 2014

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