Samsung Bloomington Schematics. Www.s Manuals.com. R0.9 Schematics

User Manual: Motherboard Samsung Bloomington - Schematics. Free.

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8-1
3

4

SAMSUNG PROPRIETARY

1

2 2

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Table of Contents

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

Bloomington

C

B

Model Name
PCB Part No

: PINE TRAIL-M
:

Dev. Step
Revision
T.R. Date

: PV2
: 0.9
: 2009.11.09

CHECK

COVER
OPERATION BLOCK DIAGRAM
BOARD INFORMATION
POWER DIAGRAM / SEQUENCE
CLOCK DISTRIBUTION
CLOCK GENERATOR (CK-505M)
THERMAL MONITOR
PINEVIEW-M (N450/N470 CPU)
TIGERPOINT (NM10 CHIPSET)
SPI ROM & DEBUG PORT
DDR2 SODIMM
CRT CONN.
LCD(LVDS) CONN.
HD DECODER (BROADCOM BCM70015)
AUDIO CODEC (ALC269Q-GR)
AMP & WOOFER
HP & MIC & INT. MIC
LAN (10/100)
HDD CONNECTOR (SATA)
MINI-CARD (Wireless & HSDPA/WIBRO)
USB
BT & CAMERA & TSP
CARDBUS CONTROLLER (GL823)
MICOM (MEC1308)
KBD CONN & MICOM GLUE LOGIC
LED Logic
Free Fall Sensor
CPU VRM POWER (VCC_CORE)
CHIPSET POWER (P1.05V, P1.5V & P1.2V)
DDR2 POWER
P3.3V_AUX & P5V_AUX
CHARGER
GRAPHICS POWER (P0.89V)
SWITCHED POWER
POWER DISCHARGER
BLANK PAGE (TBD)
MOUNT HOLE
TEST POINTS

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: INTEL PINEVIEW-M
CPU
Chip Set : INTEL TIGERPOINT-M
Remarks :

DRAW

Page. 1
Page. 2
Page. 3
Page. 4~6
Page. 7
Page. 8
Page. 9
Page. 10~12
Page. 13~15
Page. 16
Page. 17
Page. 18
Page. 19
Page. 20
Page. 21
Page. 22
Page. 23
Page. 24
Page. 25
Page. 26
Page. 27
Page. 28
Page. 29
Page. 30
Page. 31
Page. 32
Page. 33
Page. 34
Page. 35
Page. 36
Page. 37
Page. 38
Page. 39
Page. 40
Page. 41
Page. 42
Page. 43
Page. 44~45

D

APPROVAL

C

B

A

A A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

D

3

2

1

OPERATION BLOCK DIAGRAM

D

CLOCK
GENERATOR
CK-505

G7923

CPU2_THERMDA/DC

CPU

LVDS

TFT_LCD
10.1"/10.2" WIDE

D

THERMAL
SENSOR

559 uFCBGA8 Type

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Pineview-M

667 MHz

DDR2-SODIMM
MAX 1 GB

200P

TSP (Ready)

P5

Bluetooth
Module

P0

C

USB (1):debug port

P2

USB (2)

P6

360 BGA PKG TYPE

SATA

HDD
2.5inch

USB2.0 [P7:0]

Page 17~20

High Definition Audio
B

ALC269Q

INT. MIC

4P

2P

R

SPKR

L

option

PCI_ EXP2

MINI CARD1

Wireless LAN

MINI CARD2

HSDPA/Wibro

B

SIMM Card

2P

(Slide S/W)

SPKR

3in1 B’d

WLAN+WiMax Combo (default)

HSDPA

RF OFF S/W

TPA6017

P3

PCI_ EXP [P4:1]

RTC
Batt.

Page 22~25

AMP

Multi-Card
GL823

PCI_ EXP1

HD Audio

Audio

MIC-IN

Camera

P4

Tigerpoint
NM10 Chipset

HP

USB (3):Chargeable USB

P7

ICH

C

SPI

LPC

MICOM
MEC1308
P/S2

SPI ROM

Power S/W

PCI_ EXP3
PCI_ EXP4

(Slide S/W)

LAN CONTROLLER
Marvell 88E8040

HD Decoder
Broadcom BCM70015

LAN
Transformer
DDR2
Memory

Lid S/W
A

A
Woofer

SAMSUNG
Space bar

KEYBOARD
4

3

ELECTRONICS

TOUCHPAD

2

1

8-2

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

Page 13~16

RJ45

CRT

P1

(N450/N470)

VGA

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-3
3

4

SAMSUNG PROPRIETARY

SCHEMATIC ANNOTATIONS AND BOARD INFORMATION
PCI Devices
Devices

IDSEL#

USB
Hub to PCI
LPC Bridge/IDE/AC97/SMBUS
Internal MAC

AD29(internal)
AD30(internal)
AD31(internal)
AD24(internal)

Programable

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

Devices

Address

ICH7M
CK-505M (Clock Generator)
SODIMM0
CPU Thermal Sensor

Master
1101 001X
1010 000X
0111 101X

ASSIGNED TO
USB PORT
3-IN-1
Wireless LAN
BLUETOOTH

B

PCI Express Assign
Port Number
1
2
3

ASSIGNED TO
Mini Card 1(Wireless LAN)
Mini Card 2 (HSDPA/Wibro)
LOM

Power Rail
PRTC_BAT
VDC
P1.05V(VCCP)
P3.3V_MICOM
P1.5V
P1.8V_AUX
P0.9V
P5V_AUX
P3.3V_AUX
P5V
P3.3V
CPU_CORE

Bus

D2h
A0h
7Ah

SMBUS Master
Clock, Unused Clock Output Disable
Thermal Sensor

Port Number
4
UHCI_2
5
6
UHCI_3 7

Descriptions
3.3V (can drop to 2.0V min. in G3 state) supply for the RTC well.
Primary DC system power supply (9 to 19V)
VTT for CPU, Calistoga & ICH7-M
3.3V always power rail(for Micom)
1.5V switched power rail (off in S3-S5)
1.8V power rail for DDR (off in S4-S5)
0.9V power rail for DDR (off in S4-S5)
5.0V power rail (off in S4-S5)
3.3V power rail (off in S4-S5)
5.0V switched power rail (off in S3-S5)
3.3V switched power rail (off in S3-S5)
Core voltage for Atom CPU

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Hex

USB PORT Assign
Port Number
0
UHCI_0
1
2
UHCI_1 3

D

Voltage Rails

Interrupts

REQ/GNT#

I2C / SMB Address
C

1

C

ASSIGNED TO
USB PORT
USB PORT
HSDPA
CAMERA

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

D

2

BOARD INFORMATION

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

2

3

1

POWER DIAGRAM
KBC3_PWRON

KBC3_SUSPWR
(CHP3_S4_STATE*)

D

(CHP3_SLPS3*)

AC Adapter
P1.05V

VDC

C

DIAMONDVILLE
CALISTOGA
ICH7-M

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P3.3V_MICOM

P1.8V_AUX

SODIMM (DDR III)
CALISTOGA

P0.9V

DDR II-Termination

P5.0V

P5V_AUX

VCCP3_PWRGD

ICH7-M
USB
CRT
MICOM

CPU_CORE

D

DIAMONDVILLE

C

HDD
M_PCI
FAN CIRCUIT
AUX DISPLAY

MICOM

P1.5V

CRESTLINE
ICH8-M

P3.3V

Thermal Sensor
ICH7-M
SPI
LCD
M_PCI

P2.5V

ICH7-M

P3.3V_AUX

ICH7-M LAN
MDC
BT

P5.0V_ALW

B

P1.2V_LAN

P12.0V_ALW

MICOM
SODIMM
PCMCIA
LEDs

B

LAN

P1.8V_LAN
P2.5V_LAN

Power On/Off Table by S-state
Rail
S0

S3

S4

S5

ON

ON

ON

ON

+V*LAN

ON

ON

+1.8V_AUX
+0.9V

ON

ON

+V*AUX

ON

ON

+V

ON

+V* (CORE)

ON

State
+V*A(LWS)

A

LAN

S5-S4

S3

S0
A

SAMSUNG
ELECTRONICS

4

3

2

1

8-4

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

Battery DC

Rev 0.1

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-5
4

3

SAMSUNG PROPRIETARY

2

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

1

POWER RAILS ANALYSIS

220V

Rev. 0.6 (060920)

Adapter

Battery

MICOM 3V ( TBD A )

1.05V
CPU CORE
1.05V (VCCP)
1.5V

3.3V
1.8V_AUX

2.2 A
2.5 A
0.13 A

Diamondville
( 2.5 W )

3.3V

3.72 A
0.14 A
0.78 A

Calistoga
GMCH
(4 W )

0.16 A

3.3V

3.3V

1.05V
1.5V
3.3V
3.3V_AUX
5V
5V_AUX
RTC_Battery
1.8V_AUX

1.8V_AUX
0.9V

B

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ITP

0.1 A (TBD)

0.95 A
1.6A
0.421 A
0.209 A (TBD)
0.001 A (TBD)
0.001 A (TBD)
0.006 A (TBD)

3.3V (LCD 3V)

P5.0V_LED (VDC INV)

0.08 A (TBD)
0.29 A (TBD)
0.15 A (TBD)

Thermal
Sensor

MICOM 3V
3.3V

0.08 A (TBD)
0.08 A (TBD)

0.1 A (TBD)

KBC
PWR LED

CLOCK

0.2 A (TBD)

KeyBoard

3.3V_AUX

0.01 A (TBD)

KBD LED

3.3V_AUX

3.3V

( 1.5 W )

3.3V

0.015 A (TBD)

3.3V
5V

0.06 A (TBD)
0.07 A (TBD)

HD Audio

0.22 A (TBD)

SATA HDD

C

0.6 A (TBD)

LAN

0.1 A (TBD)

SD Card

1.5 A (TBD)
0.5 A (TBD)
0.75A (TBD)

Mini Card X 2

SPI

1.5A

DDR-2

3.1 A (TBD)
1 A (TBD)

5V

3.3V
3.3V_AUX
1.5V

B

( ~ 5.0 W )

LCD

0.35 A
0.6 A

5V

5V

LAN (88E8057)

0.25 A (TBD)

ICH7-M

5V

P3.3V_AUX
P1.2V_LAN
P1.8V/2.5V_LAN

0.75 A (TBD)

MICOM 3V

1.05V (MCH CORE)
2.5V
1.5V

VDC INV ( TBD A )
PEX IO (TBD A)
VGA CORE (TBD A)
RTC_Battery

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

CPU CORE ( TBD A )
1.05V ( TBD A )
1.5V ( TBD A )
2.5V ( TBD A )
3.3V ( TBD A )
5.0V ( TBD A )
1.8V_AUX ( TBD A )
0.9V( TBD A )

C

D

5V

0.16 A (TBD)

1.5 A (TBD)

2 A (TBD)

0.2 A (TBD)

FAN

Audio AMP
USB (x 3)

Touch Pad

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

5.0V_AUX ( TBD A )

3.3V_AUX ( TBD A )

D

3

2

1

POWER SEQUENCE BLOCK DIAGRAM
CLOCK
CHIP

PAGE 18

1-0) PRTC_BAT
D
P5V_AUX & P3V_AUX

2-0) VDC

4-0) KBC3_SUSPWR

PAGE 39

C

3-0) KBC3_CHKPWRSW*

1-1) CHP3_RTCRST

15-0) KBC3_VRON

18-0) VRM3_CPU_PWRGD

16-0) VCCP_PWRGD

17-1) VCC_CORE

CPU VRM
SC454

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20-0) KBC3_CPUPWRGD_D
19-0) VRM3_CPU_PWRGD

LAN_RESET*

23-0) KBC3_CPURST*

24-0) A20M#/IGNNE#/INTR/NMI

24-0) A20M#/IGNNE#/INTR/NMI

21-0) CPU1_PWRGDCPU

21-0) CPU1_PWRGDCPU
15-2) VCCP

ICH7-M

12-0) KBC3_PWRBTN*
8-1) P3.3V_AUX
15-0) KBC3_PWRON

14-2) P1.5V

22-0) PLT3_RST*

RCIN*

12-1) CHP3_SLPS5*/S3*

25-0) INIT#

25-0) INIT#

VRMPWRGD

22-0) PLT3_RST*

KBC

D

CPU
26-0) CPU BIST
C

14-1) P3.3V

15-1) P2.5V

15-1) P2.5V

14-2) P1.5V

14-2) P1.5V

23-0) PLT3_RST*

15-0) KBC3_VRON

P1.5V_AUX & VCCP

Thermal
Monitor

PAGE 26

SC415

PAGE 9

4-0) KBC3_SUSPWR
4-1) P3.3V_LAN
B

P5V_AUX & P3V_AUX

TPS51120
(2)

8-3) P1.5V

14-3) P0.9V

15-2) VCCP

15-2) VCCP

GMCH

16-0) VCCP_PWRGD

PAGE 41

5-1)P5V_AUX

DDR2 POWER

2-1) P5.0V_ALW

SC486

PAGE 40

8-2) P1.8V_AUX

8-2) P1.8V_AUX

13-1) P0.9V

14-3) P0.9V

13-1) MEM_VREF

13-1) MEM_VREF

DDR2
Memory

B

PAGE 40

6-1) P5V_AUX

14-0) KBC3_PWRON

5-1) P3.3V_AUX

4-1) P3.3V_AUX

14-0) KBC3_PWRON

4-3) P1.2V_LAN

88E8057

BCP69-16
PAGE 28
GIGABIT TRANSFORMER

PAGE 27

4-2) P1.8V_P2.5V_LAN

LFE9261

SI3433

SI3433

14-1)P5V

22-0) PLT3_RST#
14-2) P3.3V
14-2) P1.5V

PAGE 44

MINI PCIE
Devices

14-2) P3.3V

AUDIO
AMP

14-1)P5V

PAGE 44

5-1) P3.3V_AUX

15-0) KBC3_PWRON
15-2) 1.5V_PWRGD

MIC5219

PAGE 44

15-1) P2.5V

14-2) P5.0V

HDD

PAGE 29

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-6

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

PAGE 44

PAGE 6

19-0) VRM3_CPU_PWRGD

TPS51120
Battery Mode
5-0) AUX5_PWRGD
(1)

4-2) P3.3_AUX

POWER
S/W

VDC
11.1V

18-0) VRM3_CPU_PWRGD

23-0) CPU1_CPURST*

2-1) MICOM_P3V

RTC
Battery

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-7
4

3

SAMSUNG PROPRIETARY

133 MHz

CK-505M
IDTCV179BNLG

CLOCK GENERATOR

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

CLK0_HCLK0
CLK0_HCLK0#

CPU

96 MHz

CLK0_HCLK1
CLK0_HCLK1#
CLK1_MCH3GPLL
CLK1_MCH3GPLL#
CLK1_DREFSSCLK
CLK1_DREFSSCLK#
CLK1_DREFCLK
CLK1_DREFCLK#

133 MHz

CLK1_PCIEICH
CLK1_PCIEICH#

133 MHz

133 MHz

B

CLK3_SMBCLK

D

CLK1_MCLK0/0#

SODIMM

CLK1_MCLK1/1#

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GMCH

100 MHz

CLK3_USB48
CLK1_SATA
CLK1_SATA#

100 MHz

CLK1_MINIPCIE
CLK1_MINIPCIE#

100 MHz

CLK1_MIN3PCIE
CLK1_MIN3PCIE#

533 MHz

HDA3_AUD_BCLK
12.288 MHz

33 MHz
CLK3_PCLKICH
14.318 MHz CLK3_ICH14

33 MHz

ICH

SMB3_CLK

AUDIO CODEC
C

RTC Clock
32.786KHz

RTC Clock
12 MHz

AU6371

MINI PCIE(WLAN)

MINI PCIE(HSDPA)

KBC5_TCLK

CLK3_PCLKMICOM

32.768KHz

A

1

CLOCK DISTRIBUTION

133 MHz

C

2

KBC

100 MHz
100 MHz

CLK1_PCIELOM
CLK1_PCIELOM#

33 MHz

CLK3_PCLKCB

CARDBUS
CONTROLLER

33 MHz

CLK3_PCLKMIN

MINIPCI

KBC3_SMCLK

B

TOUCHPAD
BATTERY

88E8057

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

D

1205-002574

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

55

CLK3_48MHZ_R

CRB : 22 ohm

CLK3_14MHZ_R

17
64
5

44
45

63

VRM3_CPU_PWRGD
CLK3_PCLKICH
CLK3_DBGLPC

R542

22.6

R538

22.6

R535

22.6

1%

CLK3_PCIF_R

14

1%

CLK3_PCI4_R

13

1%

CLK3_PCI2_R

11

12

CLK3_PCLKMICOM

10

8

7
6

SMB3_CLK_S
SMB3_DATA_S

50V

1%

1%

10K

10K

18
59
22
15
26
1
30
36
49

R540

R536

50V

50V
0.033nF

0.033nF

0.033nF

0.018nF
50V

C544

0.018nF

C538

C540

2

2801-004518

Y501
14.31818MHz

C541

50V

3
2

B

For EMI

SRC2

CLK REQ B

GMCH

SRC4

CLK REQ E

MINI CARD

SRC6

CLK REQ F

LOM3_CLKREQ#

SRC8

4

CPU1_MCH
CPU1_MCH#

CPUSTOP#
PCISTOP#

SRC11_CLKREQH#
SRC11#_CLKREQG#

CLKPWRGD_PWRDN#

SRC10
SRC10#

PCIF_5_ITP_EN

PCI_4_SEL_LCDCLK#

SRC9
SRC9#

PCI_3

SRC8_ITP
SRC8#_ITP#

PCI_2

PCI_1_CLKREQ_B#

SRC7_CLKREQF#
SRC7#_CLKREQE#

PCI_0_CLKREQ_A#

SRC6
SRC6#

SCL
SDA

SRC4
SRC4#

XTAL_IN
XTAL_OUT

VSS_48
VSS_CPU
VSS_IO
VSS_PCI
VSS_PLL3
VSS_REF
VSS_SRC1
VSS_SRC2
VSS_SRC3

SRC3_CLKREQC#
SRC3#_CLKREQD#
SRC2
SRC2#

LCDCLK_27M
LCDCLK#_27M_SS
SRC0_DOT96
SRC0#_DOT96#

10V

10V

4700nF-X5R

C513

C19

6.3V

100nF

C16

10V

100nF

100nF

C20

10V
100nF

C22

6.3V

100nF

C18

C512

100nF

46
62

61
60

40
39

R513
R514

HD_DEC

475
475

CLK0_HCLK1
CLK0_HCLK1#

1%
1%

41
42

CLK1_PCIELOM
CLK1_PCIELOM#

54
53

48
47
34
35

31
32

28
29

24
25

20
21

CHP3_HD_CLKREQ#
LOM3_CLKREQ#
CLK1_PCIEHD
CLK1_PCIEHD#

37
38

51
50

C

CLK0_HCLK0
CLK0_HCLK0#

58
57

CLK1_MINI3PCIE
CLK1_MINI3PCIE#

R511
R512

475
475

1%
1%

EXP3_CLKREQ#
MIN3_CLKREQ#
CLK1_MINIPCIE
CLK1_MINIPCIE#
CLK1_MCH3GPLL
CLK1_MCH3GPLL#
CLK1_PCIEICH
CLK1_PCIEICH#

B

CLK1_SATA
CLK1_SATA#

CLK1_DREFSSCLK
CLK1_DREFSSCLK#
CLK1_DREFCLK
CLK1_DREFCLK#

PEG_CLK/PEG_CLK#

SMT1
SMT2
SMT3

0-1005
0-1005
0-1005

CLK1_BSEL0
CLK1_BSEL1
CLK1_BSEL2

0

CPU1_BSEL0
CPU1_BSEL1
CPU1_BSEL2

27M & 27M_SS

nostuff
nostuff
nostuff

R530

Pin 24/25

CPU Freq.

CRB Test Option

CPU_SEL

all series 0 ohms (Stuff)

166 MHz

all series 0 ohms (No Stuff), BSEL2 : 0 ohm to GND

3

R532

DOT_96/DOT_96#
SRC_0/SRC_0#

CPU0
CPU0#

USB_FS_A
FSB_TESTMODE
REF_FS_C_TEST_SEL

4
16
9
23

P1.05V

R528

LOW
HIGH

VDD_SRC
VDD_CPU

NC

VDD_PLL3 VDD_SRC VDD_CPU

This part is 64pin QFN package.

R544

Pin 20/21

VDD_PCI

A

SAMSUNG
ELECTRONICS

nostuff

2

1

8-8

SATA

Place 14.318MHz within
500mils of CK-505

1K
1%
1K
1%
1K
1%

CLK REQ A

SEL_LCDCLK*

A

SRC PORT

VDD_REF
VDD_48
VDD_PCI
VDD_PLL3

VDD_IO
VDD_SRC_IO1
VDD_SRC_IO2
VDD_SRC_IO3
VDD_CPU_IO
VDD_PLL3_IO

1205-003159

DEVICE

C543

U501
IDTCV179BNLG

19
33
43
52
56
27

THERM_GND

1%

1%

33

1%

R534

1%

10K

1%
1%

10K

22.6
2.2K
1K
10K

R537

R541
R543
R529
R531

CHP3_CPUSTP#
CHP3_PCISTP#

VDD_48
10V

10V

10V

10000nF-X5R

6.3V

100nF

C517

C516

10V

6.3V

10000nF-X5R

100nF

C21

VDD_REF

65

CLK3_ICH14

CLK REQ

D

B502
BLM18PG181SN1

P3.3V

R539

CLK1_BSEL0
CLK1_BSEL1
CLK1_BSEL2

1

8. Block Diagram and Schematic

CLK3_USB48

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P3.3V

C542

nostuff
nostuff

C539

B503
BLM18PG181SN1

nostuff

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
For EMI

0.012nF
50V

C

VDD_IO

C519

10V

6.3V

10000nF-X5R

C514

C15

100nF

6.3V

10V

VDD_CPU_IO VDD_PLL3_IO

10000nF-X5R

C511

10V

100nF

266 MHz
333 MHz
200 MHz
400 MHz
133 MHz
100 MHz
166 MHz
RSVD

C17

0
1
0
1
0
1
0
1

10V

HOST CLK

100nF

0
0
1
1
0
0
1
1

VDD_SRC_IO

100nF

BSEL0 BSEL1 BSEL2

0
0
0
0
1
1
1
1

P1.5V

B504
BLM18PG181SN1

FSC

C515

D

FSB

C518

FSA

P3.3V

1

N220, N210, N150, NB30

2

3

4700nF-X5R

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-9
2

3

4

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

THERMAL SENSOR & FAN CONTROL

D

P5.0V

P3.3V_AUX

P3.3V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

C614

C615

100nF
10V

100nF
10V

R665

300K
1%

R666

249K
1%

R667

0

1%

10K

10K
1%

P3.3V_AUX

R664

C

R668

1
21
23

12
14

KBC3_PWRGD

24
22

FAN3_FDBACK#
FAN5_VDD

9
10
11

THM3_STP#
CPU3_THRMTRIP#
R663
R662
TRIP_SET 1500 : 95 dgree

nostuff
nostuff
nostuff
nostuff

2M
10M

Y503
0.032768MHz
1

4

2

3

1/16W

13

15

U507
G7923

SDA
SCL

VCCS
DVCC_1
DVCC_2

POWER_OK
RESET#

FG1
FAN1

THERM_SET
THERM#
THERMTRIP#

ALERT#
DXP1
SGND1

DXP2
SGND2
DXP3
SGND3

NC_1
NC_2
DGND
THERMAL

X2

CLK

18
20

KBC3_THERM_SMDATA
KBC3_THERM_SMCLK

16

THM3_ALERT#

3
2

2.2nF
50V

CPU2_THERMDC

10mil width and 10mil spacing.

7
6

3

C580

8
19
17
25

2.2nF
50V

1

Q512
MMBT3904

2

Line Width = 20 mil

Opposite side of CPU.

0251706300

P3.3V

R658

10K
1%

J13
HDR-4P-SMD

FAN5_VDD

SMBUS Address 7Ah

C617

0.02nF
50V

C

CPU2_THERMDA

C616

5
4

FAN3_FDBACK#

5
6

C613

10000nF-X5R
6.3V

B

1
2
3
4
MNT1
MNT2
3711-000922

Angle Type

B

P1.05V

R681

2K
1%

nostuff
nostuff

CPU1_THRMTRIP#

3

1

CPU3_THRMTRIP#

Q511
MMBT3904

2

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P3.3V_AUX

R659
R657
R660

49.9
1%

10000nF-X5R
6.3V

10K 1%
10K 1%
10K 1%

R679
C612

D

2

PINEVIEW(1/3)

N7
N6

EMI Request (10/30)

LCD1_ACLK
LCD1_ADATA0#

C

LCD1_ADATA1
LCD1_ADATA2#
LCD1_ADATA2

P3.3V

2.2K

nostuff nostuff

2.2K

LCD3_BKLTEN
LCD3_BRIT
LCD3_EDID_CLK
LCD3_EDID_DATA
LCD3_VDDEN

K2
J1
M4
L3

C812

0.01nF 0.5pF 50V

C813

U25
U26
R23
R24
N26
N27
R26
R27

0.01nF 0.5pF 50V

C811

0.01nF 0.5pF
50V

C810

0.01nF 0.5pF 50V

R632

R644 R643

REV=1.1

DMI_TXP_0
DMI_TXN_0
DMI_TXP_1
DMI_TXN_1

2.37K R22
1% J28
N22
N23
L27
L26
L23
K25
K23
K24
H26

EXP_ICOMPI
EXP_RCOMPO
EXP_RBIAS

EXP_CLKINN
EXP_CLKINP

RSVD_0
RSVD_1
RSVD_2
RSVD_3

RSVD_TP_3
RSVD_TP_4

RSVD_K3
RSVD_L2
RSVD_M2
RSVD_N2

RSVD_K2
RSVD_J1
RSVD_M4
RSVD_L3

LVD_A_CLKM
LVD_A_CLKP
LVD_A_DATAM_0
LVD_A_DATAP_0
LVD_A_DATAM_1
LVD_A_DATAP_1
LVD_A_DATAM_2
LVD_A_DATAP_2
LVD_IBG
LVD_VBG
LVD_VREFH
LVD_VREFL
LBKLT_EN
LBKLT_CTL
LCTLA_CLK
LCTLB_CLK
LDDC_CLK
LDDC_DATA
LVDD_EN

SMI_B
A20M_B
FERR_B
LINT00
LINT10
IGNNE_B
STPCLK_B

DPRSTP_B
DPSLP_B
INIT_B
PRDY_B
PREQ_B

THERMTRIP_B

GTLREF
VSS_154

G11
E15
G13
F13

B

B18
B20
C20
B21

P1.05V

R653
R119
R123
R120
R121
R645

CPU2_THERMDA
CPU2_THERMDC

near HDD connector

G2
G1
H3
J2

DMI1_RXP0
DMI1_RXN0
DMI1_RXP1
DMI1_RXN1

L10
L9
L8

nostuff

51
51
51
51
51
51

G5
D14
D13
B14
C14
C16
D30
E30

C30
D31

near FAN

RSVD_9
RSVD_6

BPM_1B_0
BPM_1B_1
BPM_1B_2
BPM_1B_3

BPM_2_0#_RSVD
BPM_2_1#_RSVD
BPM_2_2#_RSVD
BPM_2_3#_RSVD

RSVD_7
TDI
TDO
TCK
TMS
TRST_B

THRMDA_1
THRMDC_1

N11
P11

R654
750
1%

K3
L2
M2
N2

E7
H7
H6
F10
F11
E5
F8

CPU1_SMI#
CPU1_A20M#
CPU1_FERR#
CPU1_INTR
CPU1_NMI
CPU1_IGNNE#
CPU1_STPCLK#

G6
G10
G8
E11
F15

CPU1_DPRSTP#
CPU1_DPSLP#
CPU1_INIT#

E13

CPU1_THRMTRIP#

BCLKN
BCLKP

BSEL_0
BSEL_1
BSEL_2
VID_0
VID_1
VID_2
VID_3
VID_4
VID_5
VID_6

RSVD_10
RSVD_5
RSVD_8
RSVD_4

RSVD_TP_2
RSVD_TP_1
EXTBGREF

C18
W1

BA61-01090A

R127
51

nostuff

R646

51

P1.05V

R118

68

R122

1K
1%

A13
H27

C108

C109

L6
E17

nostuff

H10
J10

R124

0.22nF 1000nF-X5R
50V
6.3V

2K
1%

CLK0_HCLK0#
CLK0_HCLK0

K5
H5
K6

B

CPU1_BSEL0
CPU1_BSEL1
CPU1_BSEL2
CPU1_VID(6:0)

H30
H29
H28
G30
G29
F29
E29

nostuff

nostuff

nostuff

L7
D20
H13
D18
K9
D19
K7

R116

1K
1%

RSVD_C30
RSVD_D31

R647

1K
1%

R115

1K
1%

nostuff

R652

1K
1%

P1.05V
R651

M503
HEAD
DIA
LENGTH

A

976
1/10W

BA61-01090A

C594

1000nF-X5R
6.3V

4

C

P1.05V

CPU1_PWRGD

0223205900

M502
HEAD
DIA
LENGTH

R648

49.9
1%

P1.05V

PROCHOT_B
CPUPWRGOOD

CPU

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

LCD1_ADATA0
LCD1_ADATA1#

DMI_RXP_0
DMI_RXN_0
DMI_RXP_1
DMI_RXN_1

D

1/5

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R10
R9
N10
N9

LCD1_ACLK#

U5-1
PINEVIEW

ICH

CLK1_MCH3GPLL#
CLK1_MCH3GPLL

F3
F2
H4
G3

100nF 10V
100nF 10V
100nF 10V
100nF 10V

LVDS

DMI1_TXP0
DMI1_TXN0
DMI1_TXP1
DMI1_TXN1

C111
C110
C113
C112

DMI

D

A

1

3

N220, N210, N150, NB30

3

SAMSUNG

R650

ELECTRONICS

3.3K

Intel : 3.32K ohm

2

1

8-10

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-11
4

PINEVIEW(2/3)

ES1 : Pull-up to +SM

P1.8V_AUX

(WW10)

AD17
AC17
AB15
AB17

R673

10K

AB4
AK8

R671

nostuff

10K
1%

R672
AB11
AB13

100nF
10V

10K
1%

R688
C640
100nF
10V

VSS_153
RSVD_14

0

C641 P1.8V_AUX

R689

RSVD_AD17
RSVD_AC17
RSVD_AB15
RSVD_AB17

80.6
1%

R687

AL28
AJ26
AK28
AK29

RSVD_TP_13
RSVD_TP_14
DDR_VREF
DDR_RPU
DDR_RPD
RSVD_13

80.6
1%

DDR_A

A

10
10

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R134

1K
1%
1K
1%

R132

nostuff

R125

MEM1_ADQ(63:0)

AC4
AC1
AF4
AG2
AB2
AB3
AE2
AE3
AB6
AB7
AE5
AG5
AA5
AB5
AB9
AD6
AG8
AG7
AF10
AG11
AF7
AF8
AD11
AE10
AH1
AJ2
AK6
AJ7
AF3
AH2
AL5
AJ6
AE19
AG19
AF22
AD22
AG17
AF19
AE21
AD21
AE24
AG25
AD25
AD24
AC22
AG24
AD27
AE27
AG31
AG30
AD30
AD29
AJ30
AJ29
AE29
AD28
AA24
AB25
W24
W22
AB24
AB23
AA23
W27

nostuff

1K
1%

L11

CRT_DDC_CLK
CRT_DDC_DATA

DAC_IREF

DPL_REFCLKINP
DPL_REFCLKINN
DPL_REFSSCLKINP
DPL_REFSSCLKINN

RSVD_11

PM_EXTTS#_1_DPRSLPVR
PM_EXTTS#_0
PWROK
RSTINB

AA7
AA6
R5
R6

AA21
W21
T21
V21

RSVD_TP_11
RSVD_TP_10
RSVD_TP_5
RSVD_TP_6

HPL_CLKINN
HPL_CLKINP

N31
P30
P29
N30

L30
L31

P28R642

Y30
Y29
AA30
AA31

K29
J30
L5
AA3
W8
W9

CRT3_RED
CRT3_GREEN
CRT3_BLUE

P3.3V

CRT3_DDCCLK
CRT3_DDCDATA

665 1%

CLK1_DREFCLK
CLK1_DREFCLK#
CLK1_DREFSSCLK
CLK1_DREFSSCLK#

C

CHP3_DPRSLPVR
MCH3_EXTTS0#

KBC3_PWRGD
PLT3_RST#
CLK0_HCLK1#
CLK0_HCLK1

RSVD_TP_12
RSVD_TP_9
RSVD_TP_7
RSVD_TP_8

0223205900

B

CRT3_BLUE
CRT3_GREEN
CRT3_RED

A

SAMSUNG
ELECTRONICS

0223205900

4

10K
10K

MEM1_ADM(7:0)

AD4
AA9
AE8
AJ3
AD19
AJ27
AF30
AB26

CRT_RED
CRT_GREEN
CRT_BLUE
CRT_IRTN

R139
R138

DDR_A_DQ_0
DDR_A_DQ_1
DDR_A_DQ_2
DDR_A_DQ_3
DDR_A_DQ_4
DDR_A_DQ_5
DDR_A_DQ_6
DDR_A_DQ_7
DDR_A_DQ_8
DDR_A_DQ_9
DDR_A_DQ_10
DDR_A_DQ_11
DDR_A_DQ_12
DDR_A_DQ_13
DDR_A_DQ_14
DDR_A_DQ_15
DDR_A_DQ_16
DDR_A_DQ_17
DDR_A_DQ_18
DDR_A_DQ_19
DDR_A_DQ_20
DDR_A_DQ_21
DDR_A_DQ_22
DDR_A_DQ_23
DDR_A_DQ_24
DDR_A_DQ_25
DDR_A_DQ_26
DDR_A_DQ_27
DDR_A_DQ_28
DDR_A_DQ_29
DDR_A_DQ_30
DDR_A_DQ_31
DDR_A_DQ_32
DDR_A_DQ_33
DDR_A_DQ_34
DDR_A_DQ_35
DDR_A_DQ_36
DDR_A_DQ_37
DDR_A_DQ_38
DDR_A_DQ_39
DDR_A_DQ_40
DDR_A_DQ_41
DDR_A_DQ_42
DDR_A_DQ_43
DDR_A_DQ_44
DDR_A_DQ_45
DDR_A_DQ_46
DDR_A_DQ_47
DDR_A_DQ_48
DDR_A_DQ_49
DDR_A_DQ_50
DDR_A_DQ_51
DDR_A_DQ_52
DDR_A_DQ_53
DDR_A_DQ_54
DDR_A_DQ_55
DDR_A_DQ_56
DDR_A_DQ_57
DDR_A_DQ_58
DDR_A_DQ_59
DDR_A_DQ_60
DDR_A_DQ_61
DDR_A_DQ_62
DDR_A_DQ_63

1K
1%

VGA

DDR_A_DM_0
DDR_A_DM_1
DDR_A_DM_2
DDR_A_DM_3
DDR_A_DM_4
DDR_A_DM_5
DDR_A_DM_6
DDR_A_DM_7

R133

nostuff

CRT3_HSYNC
CRT3_VSYNC

3

2

1

N220, N210, N150, NB30

P1.8V_AUX

R137
R136

150
1%

B

DDR_A_CK_3
DDR_A_CKB_3
DDR_A_CK_4
DDR_A_CKB_4

M30
M29

0.012nF
50V

AC15
AD15
AF13
AG13

DDR_A_CK_0
DDR_A_CKB_0
DDR_A_CK_1
DDR_A_CKB_1

CRT_HSYNC
CRT_VSYNC

C583

AG15
AF15
AD13
AC13

CLK1_MCLK0
CLK1_MCLK0#
CLK1_MCLK1
CLK1_MCLK1#

DDR_A_ODT_0
DDR_A_ODT_1
DDR_A_ODT_2
DDR_A_ODT_3

3/5

XDP_RSVD_00
XDP_RSVD_01
XDP_RSVD_02
XDP_RSVD_03
XDP_RSVD_04
XDP_RSVD_05
XDP_RSVD_06
XDP_RSVD_07
XDP_RSVD_08
XDP_RSVD_09
XDP_RSVD_10
XDP_RSVD_11
XDP_RSVD_12
XDP_RSVD_13
XDP_RSVD_14
XDP_RSVD_15
XDP_RSVD_16
XDP_RSVD_17

R640

MEM1_ODT0
MEM1_ODT1

U5-3
PINEVIEW

0.012nF
50V

AK24
AH26
AH24
AK27

DDR_A_CKE_0
DDR_A_CKE_1
DDR_A_CKE_2
DDR_A_CKE_3

AD2
AD7
AD10
AK3
AG21
AG27
AF29
AA27

D12
A7
D6
C5
C7
C6
D8
B7
A9
D9
C8
B8
C10
D10
B11
B10
B12
C11

C582

MEM1_CKE0
MEM1_CKE1

MEM1_ADQS#(7:0)

MISC

AH10
AH9
AK10
AJ8

DDR_A_CSB_0
DDR_A_CSB_1
DDR_A_CSB_2
DDR_A_CSB_3

D

150
1%

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

AH22
AK25
AJ21
AJ25

MEM1_CS0#
MEM1_CS1#

C

DDR_A_BS_0
DDR_A_BS_1
DDR_A_BS_2

DDR_A_DQSB_0
DDR_A_DQSB_1
DDR_A_DQSB_2
DDR_A_DQSB_3
DDR_A_DQSB_4
DDR_A_DQSB_5
DDR_A_DQSB_6
DDR_A_DQSB_7

MEM1_ADQS(7:0)

AD3
AB8
AD8
AK5
AG22
AE26
AE30
AB27

R639

AJ20
AH20
AK11

MEM1_ABS0
MEM1_ABS1
MEM1_ABS2

DDR_A_WEB
DDR_A_CASB
DDR_A_RASB

2/5
DDR_A_DQS_0
DDR_A_DQS_1
DDR_A_DQS_2
DDR_A_DQS_3
DDR_A_DQS_4
DDR_A_DQS_5
DDR_A_DQS_6
DDR_A_DQS_7

150
1%

AK22
AJ22
AK21

MEM1_AWE#
MEM1_ACAS#
MEM1_ARAS#

DDR_A_MA_0
DDR_A_MA_1
DDR_A_MA_2
DDR_A_MA_3
DDR_A_MA_4
DDR_A_MA_5
DDR_A_MA_6
DDR_A_MA_7
DDR_A_MA_8
DDR_A_MA_9
DDR_A_MA_10
DDR_A_MA_11
DDR_A_MA_12
DDR_A_MA_13
DDR_A_MA_14

0.012nF
50V

AH19
AJ18
AK18
AK16
AJ14
AH14
AK14
AJ12
AH13
AK12
AK20
AH12
AJ11
AJ24
AJ10

C581

MEM1_AMA(0:14)

U5-2
PINEVIEW

R641

D

1

2

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

2

PINEVIEW(3/3)

C587
T13
T14
T16
T18
T19
V13
V19
W14
W16
W18
W19

C602

6.3V
22000nF-X5R
20%

C592

C622

6.3V
1000nF-X5R

C599

6.3V
1000nF-X5R

6.3V
1000nF-X5R

C
C645

C644

C642

C643

C646

6.3V
6.3V
6.3V
6.3V
6.3V
22000nF-X5R 20%
20%
20%
20%
22000nF-X5R 22000nF-X5R
20%
22000nF-X5R 22000nF-X5R

nostuff

AK13
AK19
AK9
AL11
AL16
AL21
AL25

VCCSM_0
VCCSM_1
VCCSM_2
VCCSM_3
VCCSM_4
VCCSM_5
VCCSM_6

C647

AK7
AL7

C624

100nF
10V

22000nF-X5R
20%
6.3V

+VCCA_VCCD
C627

C625

C626

0 ohm (WW12)
: Noise coupling
(Next : TBD)

6.3V
6.3V
6.3V
1000nF-X5R 22000nF-X5R
20% 4700nF-X5R

B
nostuff

100nF
10V

VCCA_DDR_0
VCCA_DDR_1
VCCA_DDR_2
VCCA_DDR_3
VCCA_DDR_4
VCCA_DDR_5
VCCA_DDR_6
VCCA_DDR_7
VCCA_DDR_8
VCCA_DDR_9
VCCA_DDR_10

AA10
AA11

nostuff

C621

VCCCK_DDR_0
VCCCK_DDR_1

U10
U5
U6
U7
U8
U9
V2
V3
V4
W10
W11

nostuff

P1.05V

DDR

P1.8V_AUX

C620

VCC

100nF
10V

VCCP_0
VCCP_1

1000nF-X5R
6.3V

1000nF-X5R
6.3V

P1.8V

BLM18PG181SN1
C584

P1.05V
6.3V
1000nF-X5R

1000nF-X5R
6.3V

P1.05V
C596

6.3V
1000nF-X5R

C623

6.3V
1000nF-X5R

VCCSFR_AB_DPL

T30

VCCACRTDAC

P3.3V
T31
J31
C3
B2
C2
A21

VCC_GIO
VCCRING_EAST
VCCRING_WEST_0
VCCRING_WEST_1
VCCRING_WEST_2
VCC_LGI_VID

P1.05V

VCCALVD
VCCDLVD

VCCA_DMI_0
VCCA_DMI_1
VCCA_DMI_2

RSVD_12
VCCSFR_DMIHMPLL
VCCP

C29
B29
Y2

C572

6.3V
1000nF-X7R

C591

6.3V
1000nF-X7R

6.3V
1000nF-X7R

D4

10nF
25V

CPU1_VCCSENSE
CPU1_VSSSENSE

P1.05V

+VCCPC6

P1.05V

B4
B3

C595
100nF
10V

BLM18PG181SN1
C618

T1
T2
T3

1000nF-X5R
6.3V

P1.05V

C601

P1.8V

6.3V
1000nF-X5R

C597

6.3V
1000nF-X5R

+VCC_RING

C628

P1.05V

C576

C619

+VCCA_DMI

P2 +VCCAPLL_DMI
AA1 +VCCSFR_DMIHMPLL
E2

P1.8V

B514

22000nF-X5R
20%
6.3V

V30
W31

0223205900

A

C588

nostuff

VCCD_HMPLL

AC31

B512

C585

VCCD_AB_DPL

V11

C120

6.3V
1000nF-X7R

C629

VCCSENSE
VSSSENSE
VCCA

P1.8V
C138

C586

P1.5V

VCCACK_DDR_0
VCCACK_DDR_1

AA19

CPU_CORE
A23
A25
A27
B23
B24
B25
B26
B27
C24
C26
D23
D24
D26
D28
E22
E24
E27
F21
F22
F25
G19
G21
G24
H17
H19
H22
H24
J17
J19
J21
J22
K15
K17
K21
L14
L16
L19
L21
N14
N16
N19
N21

VSS_0
VSS_1
VSS_2
RSVD_NCTF_0
RSVD_NCTF_1
RSVD_NCTF_2
RSVD_NCTF_3
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
RSVD_NCTF_4
VSS_47
VSS_48
RSVD_NCTF_5
RSVD_NCTF_6
VSS_49
RSVD_NCTF_7
RSVD_NCTF_8
VSS_50
VSS_51
RSVD_NCTF_9
VSS_52
RSVD_NCTF_10
RSVD_NCTF_11
RSVD_NCTF_12
VSS_53
VSS_54
VSS_55
VSS_56
VSS_57
RSVD_NCTF_13
RSVD_NCTF_14
VSS_58
VSS_59
RSVD_NCTF_15
VSS_60
VSS_61
VSS_62
VSS_63
RSVD_NCTF_16
VSS_64
RSVD_NCTF_17
VSS_65
VSS_66
VSS_67
VSS_68
VSS_69
VSS_70
VSS_71

g
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m
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S fid
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C

EXP/CRT/PLL

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P1.8V_AUX

LVDS

C590

6.3V
1000nF-X5R

VCCGFX_0
VCCGFX_1
VCCGFX_2
VCCGFX_3
VCCGFX_4
VCCGFX_5
VCCGFX_6
VCCGFX_7
VCCGFX_8
VCCGFX_9
VCCGFX_10

CPU

6.3V
1000nF-X5R

DMI

6.3V
1000nF-X5R

6.3V
1000nF-X5R

CFX/MCH

C589

C598

POWER

GFX_CORE

4/5
VCC_0
VCC_1
VCC_2
VCC_3
VCC_4
VCC_5
VCC_6
VCC_7
VCC_8
VCC_9
VCC_10
VCC_11
VCC_12
VCC_13
VCC_14
VCC_15
VCC_16
VCC_17
VCC_18
VCC_19
VCC_20
VCC_21
VCC_22
VCC_23
VCC_24
VCC_25
VCC_26
VCC_27
VCC_28
VCC_29
VCC_30
VCC_31
VCC_32
VCC_33
VCC_34
VCC_35
VCC_36
VCC_37
VCC_38
VCC_39
VCC_40
VCC_41

A11
A16
A19
A29
A3
A30
A4
AA13
AA14
AA16
AA18
AA2
AA22
AA25
AA26
AA29
AA8
AB19
AB21
AB28
AB29
AB30
AC10
AC11
AC19
AC2
AC21
AC28
AC30
AD26
AD5
AE1
AE11
AE13
AE15
AE17
AE22
AE31
AF11
AF17
AF21
AF24
AF28
AG10
AG3
AH18
AH23
AH28
AH4
AH6
AH8
AJ1
AJ16
AJ31
AK1
AK2
AK23
AK30
AK31
AL13
AL19
AL2
AL23
AL29
AL3
AL30
AL9
B13
B16
B19
B22
B30
B31
B5
B9
C1
C12
C21
C22
C25
C31
D22
E1
E10
E19
E21
E25
E8
F17
F19

6.3V
1000nF-X5R

C600

5/5
VSS_72
VSS_73
VSS_74
VSS_75
VSS_76
VSS_77
VSS_78
VSS_79
VSS_80
VSS_81
VSS_82
VSS_83
VSS_84
VSS_85
VSS_86
VSS_87
VSS_88
VSS_89
VSS_90
VSS_91
VSS_92
VSS_93
VSS_94
VSS_95
VSS_96
VSS_97
VSS_98
VSS_99
VSS_100
VSS_101
VSS_102
VSS_103
VSS_104
VSS_105
VSS_106
VSS_107
VSS_108
VSS_109
VSS_110
VSS_111
VSS_112
VSS_113
VSS_114
VSS_115
VSS_116
VSS_117
VSS_118
VSS_119
VSS_120
VSS_121
VSS_122
VSS_123
VSS_124
VSS_125
VSS_126
VSS_127
VSS_128
VSS_129
VSS_130
VSS_131
VSS_132
VSS_133
VSS_134
VSS_135
VSS_136
VSS_137
VSS_138
VSS_139
VSS_140
VSS_141
VSS_142
VSS_143
VSS_144
VSS_145
VSS_146
VSS_147
VSS_148
VSS_149
VSS_150
VSS_151

VSS_152

C

B

T29

A

SAMSUNG

nostuff

4

D

0223205900

22000nF-X5R
20%
6.3V

nostuff

1000nF-X5R
6.3V

F24
F28
F4
G15
G17
G22
G27
G31
H11
H15
H2
H21
H25
H8
J11
J13
J15
J4
K11
K13
K19
K26
K27
K28
K30
K4
K8
L1
L13
L18
L22
L24
L25
L29
M28
M3
N1
N13
N18
N24
N25
N28
N4
N5
N8
P13
P14
P16
P18
P19
P21
P3
P4
R25
R7
R8
T11
U22
U23
U24
U27
V14
V16
V18
V28
V29
W13
W2
W23
W25
W26
W28
W30
W4
W5
W6
W7
Y28
Y3
Y4

ELECTRONICS

3

2

1

8-12

U5-4
PINEVIEW

D

1

U5-5
PINEVIEW

N220, N210, N150, NB30

3

GND

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-13
4

C63
C62

100nF 10V
100nF 10V

24.9
1%

100nF
100nF

HD_DEC
HD_DEC

R100

PERN1
PERP1
PETN1
PETP1
PERN2
PERP2
PETN2
PETP2
PERN3
PERP3
PETN3
PETP3
PERN4
PERP4
PETN4
PETP4

H24
J22

10K

R573

10K
10K
10K
10K
10K
10K
10K
10K

R569
R574
R594
R79
R570
R592
R593
R596

10K
10K

R81
R597

CLK3_PCLKICH

P3.3V

nostuff

GPIO48/17-BIOS Flash Strap-0/1
x0-SPI, 0x-PCI, xx-LPC

R552

R808

10K

R80
R586

10K

10K
10K
10K
10K
10K
10K
10K
10K

R585
R568
R590
R76
R74
R589
R73
R75

B2
D7
B3
H10
E8
D6
H8
F8

10K
10K

R72
R77

D11
K9
M13

FFS3_INT

STRAP0#
RSVD_1
RSVD_2

0
0

R546
R545

0
0

USB3_MMCUSB3_MMC+
USB3_BLUETOOTHUSB3_BLUETOOTH+
USB3_P6USB3_P6+
USB3_CAMERAUSB3_CAMERA+

USB3_MINIPCIE1USB3_MINIPCIE1+
USB3_MINIPCIE2USB3_MINIPCIE2+

HSDPA
HSDPA

U506-2
TIGERPOINT
RSVD_3
RSVD_4
RSVD_5
RSVD_6
RSVD_7
RSVD_8
RSVD_9
RSVD_10
RSVD_11
RSVD_12
RSVD_13
RSVD_14
RSVD_15
RSVD_16
RSVD_17
RSVD_18

D4
C5
D3
D2
E5
E6
C2
C3

G2
G3

R587

AC17
AB13
AC13
AB15
Y14

PCI

2/5
SATA0RXN
SATA0RXP
SATA0TXN
SATA0TXP
SATA1RXN
SATA1RXP
SATA1TXN
SATA1TXP

1K

R588

AB16
AE24
AE23

R591

22.6
1%

P3.3V_AUX

1K

AA14
V14

F4

AD16
AB11
AB10

CLK3_USB48

R635

10K

AD23

AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31

C_BE0#
C_BE1#
C_BE2#
C_BE3#

B22
D18
C17
C18
B17
C19
B18
B19
D16
D15
A13
E14
H14
L14
J14
E10
C11
E12
B9
B13
L12
B8
A3
B5
A6
G12
H12
C8
D9
C7
C1
B1

SATA_CLKN
SATA_CLKP

RSVD_19
RSVD_20
RSVD_21
RSVD_22
RSVD_23

AE6
AD6
AC7
AD7
AE8
AD8
AD9
AC9

C574
C573
C575
C577

10nF
10nF
10nF
10nF

25V
25V
25V
25V

SAT1_HDD_RXN0
SAT1_HDD_RXP0
SAT1_HDD_TXN0
SAT1_HDD_TXP0

D

SATARBIAS#
SATARBIAS
SATALED#

AD4
AC4

AD11
AC11
AD25

R117

P3.3V
CLK1_SATA#
CLK1_SATA

R636

24.9 1%

10K

CHP3_SATALED#

RSVD_24
RSVD_25
RSVD_26

RSVD_27
RSVD_28

RSVD_29
RSVD_30
RSVD_31
GPIO36

Intel : DBG_Strap Set up

GPIO48_STRAP1#
GPIO17_STRAP2#
GPIO22
GPIO1

PIRQA#
PIRQB#
PIRQC#
PIRQD#
PIRQE#_GPIO2
PIRQF#_GPIO3
PIRQG#_GPIO4
PIRQH#_GPIO5

R28
R31

R12
AE20
AD17
AC15
AD18
Y12
AA10
AA12
Y10
AD15
W10
V12
AE21
AE18
AD19
U12

nostuff

REQ1#
REQ2#

G14
A2
C15
C9

NON_HSDPA
NON_HSDPA

SATA

DMI

CLK48

nostuff

1K
1K

USB3_P0USB3_P0+
USB3_TSPUSB3_TSP+
USB3_P2USB3_P2+

P3.3V

GNT1#
GNT2#

G16
A20

KBC3_RUNSCI#

P3.3V

USB

PAR
DEVSEL#
PCICLK
PCIRST#
IRDY#
PME#
SERR#
STOP#
PLOCK#
TRDY#
PERR#
FRAME#

A18
E16

P3.3V

USBRBIAS
USBRBIAS#

DMI_CLKN
DMI_CLKP

A5
B15
J12
A23
B7
C22
B11
F14
A8
A10
D10
A16

H7
H6
H3
H2
J2
J3
K6
K5
K1
K2
L2
L3
M6
M5
N1
N2

g
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S fid
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C

OC0#
OC1#
OC2#
OC3#
OC4#
OC5#_GPIO29
OC6#_GPIO30
OC7#_GPIO31

DMI_ZCOMP
DMI_IRCOMP

W23
W24

CLK1_PCIEICH#
CLK1_PCIEICH

B

K21
K22
J23
J24
M18
M19
K24
K25
L23
L24
L22
M21
P17
P18
10V
N25
10V
N24

1/5
USBP0N
USBP0P
USBP1N
USBP1P
USBP2N
USBP2P
USBP3N
USBP3P
USBP4N
USBP4P
USBP5N
USBP5P
USBP6N
USBP6P
USBP7N
USBP7P

A20GATE
A20M#
CPUSLP#
IGNNE#
INIT3_3V#
INIT#
INTR
FERR#
NMI
RCIN#
SERIRQ
SMI#
STPCLK#
THERMTRIP#

U16
Y20
Y21
Y18
AD21
AC25
AB24
Y22
T17
AC21
AA16
AA21
V18
AA20

KBC3_A20G
CPU1_A20M#

C

CPU1_IGNNE#
CPU1_INIT#
CPU1_INTR
CPU1_FERR#
CPU1_NMI
KBC3_RCIN#
CHP3_SERIRQ
CPU1_SMI#
CPU1_STPCLK#
CPU1_THRMTRIP#

0223215100

P3.3V
R95
R126

KBC3_A20G
KBC3_RCIN#

H16
M15
C13
L16

10K
10K

B

P1.05V

CPU1_FERR#
CPU1_THRMTRIP#

R98
R101

56 1%
56 1%

CPU1_DPRSTP#
CPU1_DPSLP#

R102
R97

56
56

P1.05V
1%
1%

nostuff
nostuff

0223215100

A16 SWAP OVERRIDE

A

A

R595
1K

nostuff

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

C91
C93

100nF 10V
100nF 10V

C92
C90

P1.5V

100nF 10V
100nF 10V

DMI0RXN
DMI0RXP
DMI0TXN
DMI0TXP
DMI1RXN
DMI1RXP
DMI1TXN
DMI1TXP
DMI2RXN
DMI2RXP
DMI2TXN
DMI2TXP
DMI3RXN
DMI3RXP
DMI3TXN
DMI3TXP

PCI-E

C

C67
C66

U506-1
TIGERPOINT

HOST

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

R23
R24
P21
P20
T21
T20
T24
T25
T19
T18
U23
U24
V21
V20
V24
V23

PEX1_MINIRXN1
PEX1_MINIRXP1
PEX1_MINITXN1
PEX1_MINITXP1
PEX1_MINIRXN2
PEX1_MINIRXP2
PEX1_MINITXN2
PEX1_MINITXP2
PEX1_LAN_RXN3
PEX1_LAN_RXP3
PEX1_LAN_TXN3
PEX1_LAN_TXP3
PEX1_HD_RXN4
PEX1_HD_RXP4
PEX1_HD_TXN4
PEX1_HD_TXP4

1

Tigerpoint (1/3)

DMI1_RXN0
DMI1_RXP0
DMI1_TXN0
DMI1_TXP0
DMI1_RXN1
DMI1_RXP1
DMI1_TXN1
DMI1_TXP1

D

2

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

2

Tigerpoint (2/3)

CHP3_RTCRST#
SMB3_ALERT#
SMB3_CLK
SMB3_DATA
SMB3_LINKALERT#
CHP3_SMLINK0
CHP3_SMLINK1
HST3_SPI_DO
HST3_SPI_DI
HST3_SPI_CS#
HST3_SPI_CLK

W4
V5
T5
E20
H18
E23
H21
F25
F24
R2
T1
M8
P9
R4

LPC

R96

T15
W16
W14
K18
H19
M17
A24
C23
P5
E24
AB20
Y16
AB19
R3
C24
D19
D20
F22
AC19
U14
AC1
AC23
AC24

10K

P3.3V_AUX

CHP3_RFOFF_BT#
KBC3_EXTSMI#

10 5%
10
10

R599

1K

ITP3_DBRRESET#
PLT3_RST_ORG#

1K
1M
1%

330K
5%

H20
E25
F21

R600

B25
AB23
AA18
F20

10K

P3.3V
MCH3_ICHSYNC#
CHP3_SERIRQ
PCI3_CLKRUN#

A

HDA3_AUD_SDO
HDA3_AUD_SYNC

R633
R516
R517

1K
10K
10K

R625
R624

1K
1K

CHP3_PCISTP#
CHP3_CPUSTP#

4

R504

10K

R506

10K

nostuff

R814
R629

C

10K
10K

R813

R129

nostuff

nostuff

nostuff

R815

R135

R131

10K

10K

10K

R128

10K

10K

Board ID Configuration

10K

SMB3_CLK_S

G

nostuff

SMB3_DATA_S

R30
R33

RTC Battery
BA39-00534A
BA39-00598A (New)
J502
HDR-2P-SMD
1
2
MNT1
MNT2

0
0

P3.3V

2

1

0

Arcadia

0

1

1

0

1

0

Kansas

0

0

1

Bloomington

0

0

0

Lincoln (TBD)

1

0

0

HSPA (TBD)

B

PRTC_BAT

D513
BAT54C

R751

3
4

1000nF-X5R

R750

20K
1%

Angle Type

For Internet activity

CHP3_RTCRST#

1K
1%

C720
1000nF-X5R R749
25V

nostuff
nostuff

Board ID

Model
Pontiac

C721

2.2K

3711-000541

P3.3V

100K
1%

CHP3_BOARDID2
CHP3_BOARDID1
CHP3_BOARDID0

P3.3V_AUX

R32

2.2K

RHU002N06
Q3

SMB3_DATA

CHP3_MFGMODE#
CHP3_DBGSTRP
R618

P3.3V

AUD3_SPKR

nostuff

1

10K
10K

10K
10K

DPRSTP : Daisy chain Layout rule
(From TPT to VRM to the processor)

S

R82

ITP3_DBRRESET#

SMB3_CLK

nostuff

PRTC_BAT

CPU1_DPRSTP#
CPU1_DPSLP#

R29

RHU002N06
Q2

KBC3_PWRGD
KBC3_RSMRST#

10K

2

R598
R68

KBC3_WAKESCI#
KBC3_EXTSMI#

nostuff
nostuff

D

10K
1K

R602
R614

nostuff

P3.3V_MICOM

3

10K
10K

R85
R575

G

R59
R60

nostuff

EMI request (10/30)

0-1005

P3.3V

P3.3V

1

CHP3_RI#
PEX3_WAKE#

10K

1M
1%

nostuff

CMOS
RESET
PLACE TO BOTTOM
ARROUND WIBRO DOOR

R509

475
1% nostuff

CHP3_COMMSTATUS#

R510

10K
1%
nostuff

1

S

2

D

3

G

D

0.1nF
50V

KBC3_PWRGD
KBC3_RSMRST#

CHP3_SLPS3#
CHP3_SLPS4#
CHP3_SLPS5#

S

SMB3_CLK
SMB3_DATA

R83

P3.3V_AUX

THM3_ALERT#
VRM3_CPU_PWRGD
MCH3_ICHSYNC#
KBC3_PWRBTN#
P3.3V_AUX
CHP3_RI#
CHP3_SUSSTAT#

2

SMB3_ALERT#

D

SMB3_LINKALERT#
CHP3_SMLINK0
CHP3_SMLINK1

C808

R754

100K
1%

CPU1_PWRGD

AB17
V16
AC18
E21
H23
G22
D22
G18
G23
C25 R601
T8
R630
U10
AC3
AD3 R631
J16

THRM#
VRMPWRGD
MCH_SYNC#
PWRBTN#
RI#
SUS_STAT#_LPCPD#
SUSCLK
RTCX1
RTCX2
SYS_RESET#
RTCRST#
PLTRSTB
WAKE#
INTRUDER#
SMBALERT#_GPIO11
SMBCLK
PWROK
SMBDATA
RSMRST#
INTVRMEN
SMLALERT#
SPKR
SMLINK0
SMLINK1
SLP_S3#
SPI_MISO
SLP_S4#
SPI_MOSI
SLP_S5#
SPI_CS#
BATLOW#
SPI_CLK
DPRSTP#
SPI_ARB
DPSLP#
RSVD_32

PLT3_RST#

-

500 ohm close to IMVP
move to IMVP (Next : TBD)

CHP3_DPRSLPVR
CHP3_PCISTP#
CHP3_CPUSTP#
CHP3_DBGSTRP

DMI AC Coupling mode
CHP3_COMMSTATUS#
CHP3_MFGMODE#
PCI3_CLKRUN#
CHP3_BOARDID2
CHP3_HD_LOW_PWR#
CHP3_BOARDID0
CHP3_BOARDID1

AB22

CPUPWRGD_GPIO49

4

SMT7

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
LAN_CLK
LANR_STSYNC
LAN_RST#
LAN_RXD0
LAN_RXD1
LAN_RXD2
LAN_TXD0
LAN_TXD1
LAN_TXD2

3

B

10K
10K
10K

3

0.15nF
50V

nostuff

U516
7SZ08

KBC3_WAKESCI#

nostuff
nostuff

0223215100

R84
R579
R578

2

C689

CHP3_RFOFF_WLAN#
CHP3_RFOFF_HSDPA#

R634
R505
R507

5
+

1

PLT3_RST_ORG#

1

4

0.032768MHz

0.007nF

2

Y502

C566

1

C

10M

P3.3V

3

R619

3

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

C569

T4
P7
B23
AA2
AD1
AC2
W3
T7
U4

EE_CS
EE_DIN
EE_DOUT
EE_SHCLK

P3.3V

2

U3
AE2
T6
V3

for EMI

0.007nF

R627
R626

AUDIO

HDA3_AUD_SDO
HDA3_AUD_SYNC
CLK3_ICH14

HDA_BIT_CLK
HDA_RST#
HDA_SDIN0
HDA_SDIN1
HDA_SDIN2
HDA_SDOUT
HDA_SYNC
CLKT4

EPROM
MISC

C565

0.022nF
50V

33 1% P6
33 1% U2
W2
V2
P8
33 1% AA1
33 1% Y1
AA3

LAN

HDA3_AUD_BCLK
HDA3_AUD_RST#
HDA3_AUD_SDI0

R616
R617

BM_BUSY#_GPIO0
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO12
GPIO13
GPIO14
GPIO15
DPRSLPVR
STP_PCI#
STP_CPU#
GPIO24
GPIO25
GPIO26
GPIO27
GPIO28
CLKRUN#
GPIO33
GPIO34
GPIO38
GPIO39

RTC

LPC3_LFRAME#

LDRQ1#_GPIO23
LAD0_FWH0
LAD1_FWH1
LAD2_FWH2
LAD3_FWH3
LDRQ0#
LFRAME#

3/5

SMB

AA5
V6
AA6
Y5
W8
Y8
Y4

LPC3_LAD(3:0)

U506-3
TIGERPOINT

SPI

D

1

N220, N210, N150, NB30

3

A

SAMSUNG

-50V

BSS84
Q503

ELECTRONICS

nostuff

TSP3_COMMSTATUS#

3

2

1

8-14

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-15
4

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

1

2

Tigerpoint (3/3)
5/5

P3.3V

1

U506-4
TIGERPOINT
VCC5REF
VCC5REF_SUS

C

VCCSATAPLL
VCCRTC
VCCDMIPLL
VCCUSBPLL

POWER

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

4/5

V_CPU_IO
VCC1_5_1
VCC1_5_2
VCC1_5_3
VCC1_5_4
VCC1_05_1
VCC1_05_2
VCC1_05_3
VCC1_05_4
VCC3_3_1
VCC3_3_2
VCC3_3_3
VCC3_3_4
VCC3_3_5
VCC3_3_6

B

VCCSUS3_3_1
VCCSUS3_3_2
VCCSUS3_3_3
VCCSUS3_3_4
0223215100

P5.0V_AUX

3

2

1

R78

100
1%

BAT54A
D9

2

R615

10

BAT54A
D505

C59

C567

1000nF-X5R
6.3V

F12
F5
Y6

Y25

R816

F6
W18
M9
M20
N22
AA8
J10
K17
P15
V10

F1
F18
K7
N4

0

C570

P1.5V

100nF
10V

Intel default : 0 ohm (option : bead)

C78

100nF
10V

R818

0

R817
C75

0

nostuff

P1.5V

10000nF-X5R
6.3V

C571
10nF
25V

PI recommend : keep these components

C89
10nF
25V

C87

4700nF-X5R
6.3V

2012

C82
6.3V
1000nF-X5R

Intel default : 0 ohm (option : bead)

nostuff

P1.5V

C81

C56

6.3V
1000nF-X5R

C88

100nF
10V

6.3V
10000nF-X5R

C86

100nF
10V

P1.05V

C84
F10
G10
H25
R10
T9
AD13

100nF
10V

PRTC_BAT

AE3

C85

6.3V
10000nF-X5R

C58
6.3V
1000nF-X5R

C83

6.3V
1000nF-X5R

6.3V
1000nF-X5R

P3.3V

C57

6.3V
1000nF-X5R

C80

C79

6.3V
1000nF-X5R

100nF
10V

C65

100nF
10V

C107

6.3V
1000nF-X5R

C64

6.3V
1000nF-X5R

P3.3V_AUX

nostuff

C76

100nF
10V

A1
A25
B6
B10
B16
B20
B24
E18
F16
G4
G8
H1
H4
H5
K4
K8
K11
K19
K20
L4
M7
M11
N3
N12
N13
N14
N23
P11
P13
P19
R14
R22
T2
T22
V1
V7
V8
V19
V22
V25
W12
W22
Y2
Y24
AB4
AB6
AB7
AB8
AC8
AD2
AD10
AD20
AD24
AE1
AE10
AE25

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V_AUX

P5.0V

3

VSS_0
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47
VSS_48
VSS_49
VSS_50
VSS_51
VSS_52
VSS_53
VSS_54
VSS_55

D

C60

6.3V
1000nF-X5R

C77

6.3V
1000nF-X5R

VSS_56
VSS_57
VSS_58

nostuff

C562

6.3V
10000nF-X5R

RSVD_33

C

B

G24
AE13
F2
AE16

0223215100

nostuff

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

U506-5
TIGERPOINT

D

1

2

3

D

C

10K

P3.3V_MICOM_SW

KBC3_SPI_CS#
KBC3_SPI_DI

1
2
3
4

U505
MX25L1605D
CE*
SO
WP*
VSS

VERIFY REAL MODE
DISABLE NMI
GET CPU TYPE
INIT. SYSTEM H/W
INIT. CHIPSET REG.
SET IN POST FLAG
INIT CPU.REG
CPU CACHE ON
INIT.CACHE TO POST
INIT. I/O VALUE
ENABLE THE L-BUS IDE
INIT. POWER MANAGER
LOAD ALTERNATE REG.
PCI BUS MASTER RESET

66
6A
6C
6E
70
72
74
76
7C
7E
80
82
84
86
88
8A
8C
9A
9C
9E
A0
A4
A8
AA
AC
AE
B0
B2
B4
B6
B7
BA
BE
C0
D0
D2
D4
D6
D8
DA
DC
89
90
91
92
94
96
98

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
VDD
HOLD*
SCK
SI

8
7
6
5

R577

1107-001709

C556
100nF
10V

KBC3_SPI_CLK
KBC3_SPI_DO

14
16
18
1A
1C
20
22
24
26
28
32
34
38
3A
3C
3D
42
44
46
47
48
49
4A
4C
50
52
54
56
58
5A
5C
60
62
64

WITH INITIAL POST VALUE
INIT. KEYBOARD CONTROLLER
CHECK CHECKSUM
8254 TIMER INIT.
8237 DMA CONTROLLER INIT.
RESET INTERRUP CONTROLLER
TEST DRAM REFRESH
TEST 8742 KEYBOARD CONTROLLER
SET ES SEGMENT REG. TO 4GB
ENABLE A20
AUTO SIZING DRAM
COMPUTE THE CPU SPEED
TESET CMOS RAM
SHADOW SYSTEM BIOS ROM
AUTO SIZING CACHE
CONFIGURE ADVANCED CHIPSET REG.
LOAD ALTER REG. WITH CMOS VALUE
INIT. INTERRUPT VECTOR
INIT. BIOS INTERRUPT
CHECK ROM COPYRIGHT NOTICE
INIT. I20 SUPPORT IF INSTALLED
CHECK VIDEO CONFIGURE AGAINST CMOS
INIT. PCI BUS AND DEVICE
INIT. ALL VIDEO BIOS ROM
SHADOW VIDEO BIOS ROM
DISPLAY CPU TYPE AND SPEED
TEST KEYBOARD
SET KEYCLICK IF ENABLED
ENABLE KEYBOARD
TEST FOR UNEXPECTED INTERRUPTS
DISPLAY " PRESS ...... SETUP"
TEST RAM GETWEEN 512K AND 640K
TEST EXTENDED MEMORY
TEST EXTENDED MEMORY ADDRESS LINE
JUMP TO USER PATCH 1

CONFIGURE ADVANCE CACHE REG.
DISPLAY EXTERNAL CACHE SIZE
DISPLAY SHADOW MESSAGE
DISPLAY NON-DISPOSABLE SEGMENT
DISPLAY ERROR MESSAGE
CHECK FOR CONFIGURATION ERROR
TEST REAL-TIME CLOCK
CHECK FOR KEYBOARD EERROR
SETUP HARDWARE INTERRUPT VECTOR
TEST COPROCESSER IF PRESENT
DISABLE ON-BOARD I/O PORT
DETECT AND INSTALL EXT.RS232C
DETECT AND INSTALL EXT.PARALLEL
RE-INIT. ON-BOARD I/O PORT
INIT. BIOS DATA ROM
INIT.EXTENDED BIOS DATA AREA
INIT. FDD CONTROLLER
SHADOW OPTION ROMS
SETUP POWER MANAGEMENT
ENABLE H/W INTERRUPT
SET TIME OF DAY
INIT. TYPEMATIC RATE
ERASE F2 PROMPT
SCAN FOR F2 KEY STROKE
ENTER SETUP
CLEAR IN POST FLAG
CHECK FOR ERRORS
POST DONE-PREPARE TO BOOT O/S
ONE BEEP
CHECK PASSWORD (OPTION)
ACPI INIT
DMI INIT
CLEAR SCREEN
TRY BOOT WITH INT19
INTERRUPT HANDLER ERROR
UNKNOWN INTERRUPT ERROR
PENDING INTERRUPT ERROR
SHUTDOWN 5
SHUTDOWN ERROR
EXTENDED BLOCK MOVE
SHUTDOWN 10
ENABLE NMI
INIT. HDD CONTROLLER
INIT. LOCAL BUS HDD CONTROLLER
JUMP TO USER PATCH 2
DISABLE A20 ADDRESS LINE
CLEAR HUGE ES SEGMENT REG.
SEARCH FOR OPTION ROMS

D

C

80H DECODER CONNECTOR

B

B

P3.3V
PORT1
HDR-10P-1R-SMD
1
2
3
4
5
6
7
8
9
10

PLT3_RST#
CLK3_DBGLPC
LPC3_LFRAME#
LPC3_LAD(3)
LPC3_LAD(2)
LPC3_LAD(1)
LPC3_LAD(0)

11 MNT1
12
MNT2

3711-000386

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-16

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

SPI_BIOS_ROM

02
03
04
06
08
09
0A
0B
0C
OE
0F
10
11
13

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-17
4

2

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

1

DDR SO-DIMM #0

D

D

MEM1_ADQ(63:0)

P1.8V_AUX

DDR2M1-2
DDR2-SODIMM-200P-STD

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14

C
MEM1_ABS2

107
106

MEM1_ABS0
MEM1_ABS1

110
115

MEM1_CS0#
MEM1_CS1#

30
32
164
166
79
80

CLK1_MCLK0
CLK1_MCLK0#
CLK1_MCLK1
CLK1_MCLK1#
MEM1_CKE0
MEM1_CKE1

113
108
109

MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#

R747

198
200
197
195

10K
1%

SMB3_CLK_S
SMB3_DATA_S

B

MEM1_ODT0
MEM1_ODT1
MEM1_ADM(7:0)

MEM1_ADQS(7:0)

MEM1_ADQS#(7:0)

A

102
101
100
99
98
97
94
92
93
91
105
90
89
116
86
84
85

114
119
0
1
2
3
4
5
6
7

10
26
52
67
130
147
170
185

0
1
2
3
4
5
6
7

13
31
51
70
131
148
169
188

0
1
2
3
4
5
6
7

11
29
49
68
129
146
167
186

1/2

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15
A16_BA2
BA0
BA1
S0*
S1*
CK0
CK0*
CK1
CK1*
CKE0
CKE1
CAS*
RAS*
WE*
SA0
SA1
SCL
SDA
ODT0
ODT1
DM0
DM1
DM2
DM3
DM4
DM5
DM6
DM7
DQS0
DQS1
DQS2
DQS3
DQS4
DQS5
DQS6
DQS7
DQS*0
DQS*1
DQS*2
DQS*3
DQS*4
DQS*5
DQS*6
DQS*7

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63

5
7
17
19
4
6
14
16
23
25
35
37
20
22
36
38
43
45
55
57
44
46
56
58
61
63
73
75
62
64
74
76
123
125
135
137
124
126
134
136
141
143
151
153
140
142
152
154
157
159
173
175
158
160
174
176
179
181
189
191
180
182
192
194

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
112
111
117
96
95
118
81
82
87
103
88
104

P3.3V

199

P1.8V_AUX

C759

C760

100nF
10V

R183

100nF
10V

nostuff

nostuff

10K
1%

MCH3_EXTTS0#

83
120
50
69
163

1

C171

C172

100nF
10V

R182

10K
1%

201

2200nF-X5R 202
10V

nostuff

47
133
183
77
12
48
184
78
71
72
121
122
196
193
8

VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57

VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12

VDDSPD
NC1
NC2
NC3
NC4
NCTEST

VREF

GND0
GND1

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15

18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162

C

3709-001573

B

Place near SO-DIMM0

P1.8V_AUX

EC503
220uF C725

C726

C722

C724

C723

C764

2200nF-X5R2200nF-X5R2200nF-X5R2200nF-X5R2200nF-X5R100nF
10V
10V
10V
10V
10V
10V

2.5V

nostuff

C761

100nF
10V

C762

100nF
10V

C763
100nF
10V

nostuff

nostuff

P1.8V_AUX
EC507
220uF

A

2.5V
AD

3709-001573

SAMSUNG

nostuff

for alternative material

4

3

ELECTRONICS

2

1

N220, N210, N150, NB30

DDR2M1-1
DDR2-SODIMM-200P-STD
MEM1_AMA(14:0)

2/2

2

3

1

CRT
D

D
VCC_CRT

P5.0V

D11
MMBD4148
3

1

C162

100nF
10V

U15
SN74AHCT1G125DCKR
2

CRT3_HSYNC

OE*
1

5
+
4
3

R169

40.2

1%

C

C161

U14
SN74AHCT1G125DCKR
2

CRT3_VSYNC

100nF
10V

5

OE*
1

R167

+
4
3

40.2 1%

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

CRT5_VSYNC

P5.0V

MMBD4148
D10

C

1
3

BLM18PG181SN1
B2

CRT5_DDCDATA
CRT5_DDCCLK
CRT5_HSYNC
CRT5_VSYNC

1
6
11
2
7
12
3
8
13
4
9
14
5
10
15
nostuff
nostuff
nostuff

1
2

PGB1010603NR
D3

1
2

PGB1010603NR
D2

150

1
2

PGB1010603NR
D1

1%

150

R41

1%

1%

150

R42

100nF
10V

J8
DSUB-15-3R-F

B
16
17

3701-001403

0.27nF

0.033nF

0.033nF

C31

C33

50V 50V 50V

0.27nF

50V

C51

CRT5_DDCCLK

50V 50V 50V

R22

C27

0.022nF
50V

0.022nF

82nH

0.022nF

82nH

L2

C32

D

RHU002N06
Q12

3

S

2.2K

L3

C30

VCC_CRT
R166

C28

0.022nF
50V

82nH

0.022nF

C11

0.022nF
50V

G

2.2K

CRT3_DDCCLK

CRT3_BLUE

P3.3V

1

P3.3V
R165

CRT3_GREEN

L1

C12

B

CRT3_RED

CRT5_DDCDATA

RHU002N06
Q13

D

2.2K

C72

CRT CONNECTOR

C29

G

R168

3

1

2.2K

CRT3_DDCDATA

VCC_CRT

S

R174

P3.3V

2

P3.3V

2

Intel SR : HSYNC/VSYNC - 33 pF

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-18

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

VCC_CRT

CRT5_HSYNC

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-19
4

2

3

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LCD_VDD3.3V

P3.3V

VDC_LED

D
P5.0V

P3.3V

C508 C534

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
100nF
10V

100nF
10V

KBC3_BKLTON

1

LCD3_BKLTEN

2

R523
100K
1%

1

USB3_CAMERAUSB3_CAMERA+

2

4
3

B501
EXC24CE900U

3710-002498

100K
1%

LCD3_BKLTON

4

U502
7SZ08

2.2K
2.2K

For EBL.
P3.3V_AUX

P5.0V_STB

LCD1_ADATA2
LCD1_ADATA2#
LCD1_ADATA0
LCD1_ADATA0#
LCD3_EDID_CLK
LCD3_EDID_DATA

31
32

-

R11

U1

51.1K

R5

10K
1%

D

3

S

2

G

1

R4

2

200K
1%

LCD3_VDDEN

LCD_VDD3.3V

Q502
SI2315BDS-T1
S

LCD1_ACLK
LCD1_ACLK#
LCD1_ADATA1
LCD1_ADATA1#

3

C2

1%

C

C505

330nF
10V

100nF

Q1
RHU002N06

100K
1%

VDC

2

3
D

C550

VDC_LED

100nF
25V

B
C531

C533

100nF
25V

1000nF-X5R
25V

R526

P3.3V

51.1K when VDC is source : R53 = 43.2Kohm
1%
when P5.0V is source : R53 = 0ohm

nostuff

R810

10K
1%

R525

10K

1%

D

3

S

2

G

1

Q504
RHU002N06

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

LCD_VDD3.3V

1

R522

150K
1%

S

Q506
SI2307BDS-T1-E3

B

G

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

C

LCD3_BKLTON

R3
R2

2
1
3
4
5
6
7
8
9
10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
MNT1
MNT2

R524

P3.3V

J5
SOCK-30P-2R-SMD-MNT
LCD3_BRIT

5
+

3

100nF
10V

D

C5

1

1000nF-X5R
6.3V

G

C3

B510
BLM18PG181SN1

D

HD_DEC

B527
BLM18PG181SN1

D

HD_DEC

HD_DEC

CHP3_HD_CLKREQ#
PLT3_RST#
CLK1_PCIEHD
CLK1_PCIEHD#
PEX1_HD_TXP4
PEX1_HD_TXN4
PEX1_HD_RXP4
PEX1_HD_RXN4

C786

C785
100nF
10V

P1.2V

4700nF-X5R
6.3V

B526
BLM18PG181SN1
C784

100nF
10V

HD_DEC

C783

4700nF-X5R
6.3V

P3.3V

HD_DEC

HD_DEC

P1.2VB525

C757

4.7K
1%

M8
M9

HD_DEC

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

C174

0.018nF
50V

HD_DEC

D8
B8

2

C175

0.018nF
P2.5V
50V

HD_DEC
HD_DEC

HD_DEC

C756

P3.3V
nostuff

R800

nostuff

R798

nostuff

R802

nostuff

R799

4.7K
1%
4.7K
1%
4.7K
1%

100nF
10V

B10
B9

P3.3V

H10
G9
G12
G11
H12
H11

nostuff

4.7K
1%

R801

4.7K
1%

R797

4.7K
1%

HD_DEC

HD_DEC

PCI config type

stuff

OTP values

R797

Default values

nostuff

R803

R797, R799, R800, R802

F11
F10
E12
E11
E9
D12
D11
D10
D9
C11
C10
B12

P3.3V

10

R798, R799, R800, R801, R802

R798, R801

A1
A9
D7
J7
J8
K8
H9
A8

P3.3V

C753

4700nF-X5R
6.3V

HD_DEC

C12
F9
F12

P2.5V

C9

P1.8V

A3
A5
A7
D1
F1
H1
K1
M3
M5
M7

P1.2V

E6
E7
F5
F8
G5
G8
H6
H7

HD_DEC

HD_DEC

HD_DEC

HD_DEC

HD_DEC

4700nF-X5R
6.3V

P1.2V
C667

100nF
10V

C704

100nF
10V

C750

100nF
10V

C702

100nF
10V

C705
100nF
10V

HD_DEC

C748

4700nF-X5R
6.3V

HD_DEC

4

COREPLL_VDD12
LOW_PWR_N
CLK_OBSV
CLK27_XTAL_P
CLK27_XTAL_N
BSC_S_SDA
BSC_S_SCL

EEPROM_CLK
EEPROM_DATA

NC_0
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7

HD_DEC

C752

100nF
10V

HD_DEC

C747

100nF
10V

DDR_A12
DDR_A11
DDR_A10
DDR_A09
DDR_A08
DDR_A07
DDR_A06
DDR_A05
DDR_A04
DDR_A03
DDR_A02
DDR_A01
DDR_A00

HD_DEC

C749

100nF
10V

REG_VDD33
REG_OUT_2P5

EJTAG_CE
EJTAG_TRST_N
EJTAG_TMS
EJTAG_TCK
EJTAG_TDI
EJTAG_TDO
GPIO_00
GPIO_01
GPIO_02
GPIO_03
GPIO_04
GPIO_05
GPIO_06
GPIO_07
GPIO_08
GPIO_09
GPIO_10
GPIO_11

4700nF-X5R
6.3V

HD_DEC

DDRV_0
DDRV_1
DDRV_2
DDRV_3
DDRV_4
DDRV_5
DDRV_6
DDRV_7
DDRV_8
DDRV_9

VDDC_0
VDDC_1
VDDC_2
VDDC_3
VDDC_4
VDDC_5
VDDC_6
VDDC_7

HD_DEC

3

DDR_DQ07
DDR_DQ06
DDR_DQ05
DDR_DQ04
DDR_DQ03
DDR_DQ02
DDR_DQ01
DDR_DQ00

DDR_ZQ
DDR_VREF

VDDO_OTP

100nF
10V

DDR_DQ15
DDR_DQ14
DDR_DQ13
DDR_DQ12
DDR_DQ11
DDR_DQ10
DDR_DQ09
DDR_DQ08

DDR_UDM
DDR_LDM

VDDO_0
VDDO_1
VDDO_2

C790

DDR_CKE

DDR_RESET#

DDR_UDQS_P
DDR_UDQS_N
DDR_LDQS_P
DDR_LDQS_N

0251320600

C751 C791

DDR_CLK_P
DDR_CLK_N

DDR_ODT

P3.3V

100nF
10V

DDR_BA2
DDR_BA1
DDR_BA0

DDR_RAS
DDR_CAS
DDR_WE

HD_DEC

P1.8V
C755

CLKREQ_N
PERST_N
PCIE_REFCLK_P
PCIE_REFCLK_N
PCIE_RD_P
PCIE_RD_N
PCIE_TD_P
PCIE_TD_N
PCIE_VDD12
PCIEPLL_VDD12
PCIE_PTEST_P
PCIE_PTEST_N

HD_DEC

HD_DEC

VSS_0
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24

HD_DEC

C789
100nF
10V

HD_DEC

HD_DEC

HD_DEC

HD_DEC

HD_DEC

P1.8V

U519
BCM70015

HDV1_DDR_A(0:12)

C3
C5
D6
B7
D2
B2
C2
C1
B3
E4
E2
B5
B6

C663

4700nF-X5R
6.3V

HDV1_DDR_DQ(0:15)

G8
G2
H7
H3
H1
H9
F1
F9
C8
C2
D7
D3
D1
D9
B1
B9

C703

C670

4700nF-X5R
6.3V

100nF
10V

U515
K4T51163QG-HCE7

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

100nF
10V

Y2
27MHz
1

10V
10V

L10
K10
M11
M12
K11
K12
J11
J12
L12
M10
J9
K9

A10
L8
C7
A12
A11

C754

CHP3_HD_LOW_PWR#
HD_DEC

100nF
100nF

HD_DEC
HD_DEC

BLM18PG181SN1
4700nF-X5R
6.3V

4.7K
1%

C787
C788

HD_DEC

R628

HD_DEC

C

R777

HD_DEC

HD_DEC

A

1

BCM70015

P3.3V

P1.2V

B

2

HDV1_DDR_B(0:2)

A6
A4
B4
J6
J5

F3

HDV1_DDR_CLK
HDV1_DDR_CLK#
HDV1_DDR_CKE

D5

F2
E1
A2

D3

L5
M2
K3
M6
L2
M4
L6
J2

HDV1_DDR_RAS
HDV1_DDR_CAS
HDV1_DDR_WE

G4
H3
L1
G2
H4
G1
H2
K5

HDV1_DDR_VREF

K7
J4

HDV1_DDR_UDM
HDV1_DDR_LDM
1%
HD_DEC
243
R778
HDV1_DDR_VREF

HDV1_DDR_LDM
HDV1_DDR_LDQS
HDV1_DDR_LDQS#
HDV1_DDR_RAS
HDV1_DDR_CAS
HDV1_DDR_WE
HDV1_DDR_CLK
HDV1_DDR_CLK#

K7
L7
K3
J8
K8
L8
J2
K2
K9

HDV1_DDR_CKE
HDV1_DDR_ODT

A3
E3
J3
N1
P9

A7
B2
B8
D2
D8
E7
F2
F8
H2
H8

C709

100nF
10V

B3
B7
A8

F3
F7
E8

HD_DEC

HDV1_DDR_UDQS
HDV1_DDR_UDQS#
HDV1_DDR_LDQS
HDV1_DDR_LDQS#

B1
B11
C4
C6
C8
E3
E5
E8
E10
F6
F7
G3
G6
G7
G10
H5
H8
J3
J10
K4
K6
L7
L9
L11
M1

C707

100nF
10V

L3
L4
J1
K2

D4
F4

HDV1_DDR_UDM
HDV1_DDR_UDQS
HDV1_DDR_UDQS#

HDV1_DDR_ODT
HDV1_DDR_DQ(0:15)

J7

HD_DEC

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15

UDM
UDQS
UDQS*

LDM
LDQS
LDQS*
RAS*
CAS*
WE*
CK
CK*
CS*
VREF
CKE
ODT

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5

VSSQ_1
VSSQ_2
VSSQ_3
VSSQ_4
VSSQ_5
VSSQ_6
VSSQ_7
VSSQ_8
VSSQ_9
VSSQ_10

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDDL

VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
VDDQ_10
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
NC
BA1
BA0
NC_1
NC_2
NC_3
NC_4
NC_5

C666

C665
100nF
10V

100nF
10V

C664

100nF
10V

C669
100nF
10V

C668

D

100nF
10V

P1.8V
A1
E1
J9
M9
R1
J1

N220, N210, N150, NB30

3

A9
C1
C3
C7
C9
E9
G1
G3
G7
G9

HDV1_DDR_A(0:12)

M8
M3
M7
N2
N8
N3
N7
P2
P8
P3
M2
P7
R2

C

HDV1_DDR_B(0:2)

L1
L3
L2
A2
E2
R3
R7
R8

B
need to change
DDR2 800 512Mb

VSSDL

1105-001931

HD_DEC

HDV1_DDR_CLK

R741

121
1%

HD_DEC

HDV1_DDR_CLK#

P1.8V

R710
4.7K
1%

HD_DEC

R709
4.7K
1%

HD_DEC

HD_DEC

C706

C708

4700nF-X5R
6.3V

A

HDV1_DDR_VREF

100nF
10V

SAMSUNG
ELECTRONICS

HD_DEC

HD_DEC

2

1

8-20

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-21
4

2

3

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

P5.0V_AUD

D508
BAV99LT1
70V

Codec Pin9 Setting

D

Pin9 : 1.5V

1

2

S/B without Low Voltage IO

D507
BAV99LT1

3

Pin9 : 3.3V

Do not make a test point in these nets

P3.3V

1

D511
BAV99LT1

1000nF-X5R 6.3V

1

3

15K
1%

C681

C674

10000nF-X5R
6.3V

R718

C680

R717

10K
1%

4.7nF
25V

4.7K
1%

nostuff

1

100K
1%

AUD3_PD#

nostuff

R714

KBC3_SPKMUTE#

2.2K

100nF
10V

22

HDA3_AUD_SDI0_R_MN

1000nF-X5R 6.3V AUD3_SPKR_C_MN

5
6
8
10
11

12

2
3

R713

2

KBC3_SPKMUTE#

R715

C679

3

D509
BAT54A
30V

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

C

C677

100nF
10V

P5.0V_AUD
B7

4

AUD3_PD#

C150

10000nF-X5R
100nF
6.3V
10V

AUD5_JDREF_R_MN

R161

20K 1%

R156
R157

1% 20K
1% 39.2K

AUD5_SENS_MIC#
AUD5_SENS_HP#
BLM18PG181SN1

C805

47
48
19

13
18

AUD5_SENS_A_MN

39
46
42
43

C149
100nF
10V

7

P4.75V_AUD

C152
100nF
10V

SHORT503
INSTPAR

B

25
38

C678

100nF
10V

26
37

U12
ALC269Q-GR
DVDD
DVDD_IO

SPK_OUT_RSPK_OUT_R+

SPK_OUT_LSPK_OUT_L+

SDATA_OUT
BCLK
SDATA_IN
SYNC
RESET#

HPOUT_L_I
HPOUT_R_I
CBN
CBP

BEEP

GPIO0_DMIC_DATA
GPIO1_DMIC_CLK
PD#

EAPD_SPDIF02
SPDIF01
JDREF

SENSE_A
SENSE_B

CPVEE

MIC1_R_B
MIC1_L_B

MIC1_VREFO_R
MIC1_VREFO_L
MIC2_R_F
MIC2_L_F

MIC2_VREFO

PVDD1
PVDD2

LINE1_R_C
LINE1_L_C

PVSS1
PVSS2

LINE2_R_E
LINE2_L_E

DVSS

AVDD1
AVDD2
AVSS1
AVSS2

MONO_OUT

VREF

CPVREF

THERMAL

44
45

SPK5_R_M_MN
SPK5_R_P_MN

41
40

SPK5_L_M_MN
SPK5_L_P_MN

B5
BLM18PG181SN1

P5.0V_AUD

C675

C676

34

C126

10000nF-X5R
6.3V

C127

100nF
10V

SHORT4

U11
G916-475T1UF
OUT
IN
GND
EN BYPASS

5
4

AUD5_CPVEE_MN

C153
C154

1nF
50V

for EMI

1000nF-X5R 6.3V
1000nF-X5R 6.3V

R159
R160

1K
1K

17 AUD5_MIC2_RIGHT_C_MN
16 AUD5_MIC2_LEFT_C_MN

15
14

SPK5_RSPK5_R+
SPK5_LSPK5_L+
nostuff

nostuff

nostuff

C714

C713
1nF
50V

R162
R499

C155
C156

1000nF-X5R 6.3V
1000nF-X5R 6.3V

C715

1nF
50V

1nF
50V

J17
HDR-4P-SMD

5
6

1
2
3
4
MNT1
MNT2
3711-000922

C

AUD5_MIC1_RIGHT
AUD5_MIC1_LEFT
4.7K
4.7K

1%
1%

AUD5_MIC1_VREFO_L
AUD5_MIC1_VREFO_R

AUD5_MIC2_INT

29

24
23

1
3

1%
1%

AUD5_MIC1_VREFO_R
AUD5_MIC1_VREFO_L

0-1005

AUD5_MIC2_VREF

nostuff

C165

10000nF-X5R
6.3V

20 G_AUD

G_AUD

ALC269Q_VB_GR

AUD5_WOOFER

27

SMT6

31

0-1005

C167

49

4700nF-X7R
6.3V

R743

0

1205-003769
3.9V

C166
100nF
10V

nostuff

B

ALC269Q_VB_GR

SHORT502

G_AUD

AUD5_MIC1_VREFO_L

G_AUD

C147

100nF
10V

1203-005579
6V

INSTPAR

2200nF-X5R10V

C716

2

2200nF-X5R10V

22 AUD5_MIC1_RIGHT_C_MN
21 AUD5_MIC1_LEFT_C_MN
30 SMT5
28

D512
BAV99LT1
70V

AUD5_HP_O_LEFT
AUD5_HP_O_RIGHT

35
36

1

3

P4.75V_AUD

nostuff

1
2
3

2

nostuff

32
33

INSTPAR

2nd Vendor : 1203-003344
(MIC5252-4.75BM5)

70V

B520
BLM18PG181SN1
B522
BLM18PG181SN1
B521
BLM18PG181SN1
B523
BLM18PG181SN1

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

HDA3_AUD_SDO
HDA3_AUD_BCLK
HDA3_AUD_SDI0
HDA3_AUD_SYNC
HDA3_AUD_RST#

G_AUD

P3.3V
HDA3_AUD_RST#

C151

1
9

G_AUD

AUD3_SPKR

75V

R716

3

D510
MMBD4148

D

70V

2

SHORT6

INSTPAR

SHORT5

INSTPAR

C146

RGND_SHORT

10000nF-X5R
6.3V

G_AUD

C148

1000nF-X5R
6.3V

SHORT3
INSTPAR

nostuff

G_AUD

G_AUD G_AUD

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

S/B with Low Voltage IO

1

2

D

D
P5.0V_AMP

P5.0V_AMP

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R145

nostuff

100K
1%

WOOFER

R146

C134 C130 C131

100K
1%

WOOFER

AUD5_WOOFER

R142

C129

1K
5%

100nF

WOOFER

10V

C135

SHORT50

C

100nF

17 RIN10V 7
RIN+
2
GAIN0
3
GAIN1

INSTPAR

C128

WOOFER

47nF
50V

R147
0

C133

100nF
10V

nostuff

C136

470nF
16V

P5.0V_AUD

47nF
50V

R148

1K

100nF
10V

WOOFER

PVDD2

G_AUD

10000nF-X5R
6.3V

WOOFER

WOOFER

18
ROUT+
14
ROUT-

SPK5_LFE_P
SPK5_LFE_M

5 LIN9
LIN+
10 BYPASS LOUT+ 4
8
LOUT1
GND1
19
11
GND2
SHDN*
13
12
GND3
NC
20 GND4
21

AUD3_PD#

C

THERM

1201-001991
5.5V

nostuff

WOOFER

WOOFER

G_AUD

C137

16
VDD
6
PVDD1
15

WOOFER

WOOFER

G_AUD

G_AUD

P5.0V_AMP

SHORT550

SPK5_LFE_M

SHORT551

B

C633

WOOFER

INSTPAR

C634

10000nF-X5R
6.3V

B3
BLM18PG181SN1

SPK5_LFE_P

C119

WOOFER

10000nF-X5R
6.3V

nostuff

G_AUD

J10
HDR-2P-SMD

B4
BLM18PG181SN1

INSTPAR

WOOFER

nostuff

1000nF-X7R
6.3V

C118

1000nF-X7R
6.3V

3
4

1
2
MNT1
MNT2

B

3711-000541
WOOFER

WOOFER

G_AUD

Only for PONTIAC model

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-22

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

WOOFER

100nF
10V

U8
TPA6017A2

N220, N210, N150, NB30

3

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-23
4

2

3

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

HEADPHONE

B517

4
3
6
2
1

AUD5_HP_LEFT_B_MN

BLM18PG181SN1

0.1nF 50V

56

5

BLM18PG181SN1
AUD5_HP_RIGHT_B_MN
B516

1nF

AUD5_HP_RIGHT_R_MN
AUD5_HP_LEFT_R_MN

C672

R712

AUD5_HP_O_LEFT

56

0.1nF 50V

R711

C671

D

C673

AUD5_SENS_HP#
AUD5_HP_O_RIGHT

D

G4
G3
G2
G1

JACK-PHONE-6P
J14

50V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
nostuff

R
L

nostuff
nostuff

3722-002903

G_AUD

C

G_AUD

50V

25V

BLM18PG181SN1

0.1nF

10nF

B519

C712

C168

AUD5_MIC1_LEFT

50V

25V

50V

25V

10nF

0.1nF

10nF

BLM18PG181SN1

0.1nF

AUD5_MIC1_RIGHT

C157
C632

B518

C710

AUD5_SENS_MIC#

C711

5
4
3
6
2
1

R
L
G4
G3
G2
G1

JACK-PHONE-6P
J16

G_AUD

3722-002903

nostuff
nostuff
nostuff

B

AUD5_MIC2_VREF

Internal MIC

R744
4.7K
1%

AUD5_MIC2_INT

R158

1K

B524

AUD5_MIC2_INT_J_MN

1%

AUD5_MIC2_INT_B_MN

BLM18PG181SN1

1
2

C717

MIC500
SOM4013SL-G443-C1033
MIC_SIG
GND

3003-001158

0.1nF
50V

G_AUD

B

C176

10nF

25V

G_AUD

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

MIC JACK

C

3

2

1

D

D

Marvell 88E8040(48pin, QFN,no LED)

10K

PLT3_RST#
PEX3_WAKE#
CLK1_PCIELOM
CLK1_PCIELOM#
PEX1_LAN_RXP3
PEX1_LAN_RXN3
PEX1_LAN_TXP3
PEX1_LAN_TXN3

C14
C13

R24

LOM3_CLKREQ#

10V
100nF
100nF
10V

P2.5V_LAN

4
5
42
43
PEX1_LAN_RXP4_C_MN37
PEX1_LAN_RXN4_C_MN38
41
40

0

R25

1% 32
4.7K 33

PERST#
WAKE#
REFCLKP
REFCLKN
PCIE_TXP
PCIE_TXN
PCIE_RXP
PCIE_RXN

CLKREQ#
PU_VDDO_TTL

LAN3_PU_VDDO_R_MN

RXP
RXN
TXP
TXN

LED_ACT#
LED_SPEED#
LED_LINK#

PD_12_25

28
31

P3.3V_AUX
C36

C38

100nF
10V

100nF
10V

7
30
46

P1.2V_LAN
C535

100nF
10V

C552 C537
100nF
10V

100nF
10V

C536

4700nF-X5R
10V

2
6
23
34
29

VDDO_TTL1
VDDO_TTL2
VDDO_TTL3

VDD1
VDD2
VDD3
VDD4
VDD5

C551

100nF
10V

C37

4700nF-X5R
10V

15
1
39

AVDDL

AVDD2.5_OUT
AVDDL25

LAN3_MDI1P
LAN3_MDI1N
LAN3_MDI0P
LAN3_MDI0N

VMAIN_AVLBL

XTALI

XTALO

TESTMODE

RESERVED1
RESERVED2
RESERVED3
RESERVED4
RESERVED5
THERMAL
RESERVED6
RESERVED7
RESERVED8
RESERVED9
RESERVED10

1
3
2
7
6
8

44
45
48

LT500
LFE8423

RD+
RX+
RDCT RXCT
RDRX-

TD+
TX+
TDCT TXCT
TDTX-

100nF
10V

P3.3V_AUX

10
11
9

LAN1_TXP_MN
LAN1_TXCT_MN
LAN1_TXN_MN

10
9

MNT2
MNT1
TRD1+
TRD1TRD2+
TRD3+
TRD3TRD2TRD4+
TRD4-

JACK-LAN-8P
J4

C504

36

8 R43

1nF
3KV

10K

B

LAN3_DISABLE#_R_MN

LAN3_XTALI_MN

10

LAN3_XTALO_MN

35

R564
12

2K 1%

LAN3_RSET_MN

18
19
20
21
22
49
24
25
26
27
47

LAN1_RXP_MN
LAN1_RXCT_MN
LAN1_RXN_MN

100nF
10V

9

11

16
14
15

3722-002841

1
2
LAN1_CABLE_TERMINATION2_MN 3
4
5
LAN1_CABLE_TERMINATION1_MN 6
7
8

C532 C507

3

P3.3V

VAUX_AVLBL

RSET

P2.5V_LAN

13
14
16
17

VPD_CLK
VPD_DATA

LOM_DISABLE#

B

C

U2
88E8040-A0-NNB2C000

1K
1K
1K
1K

R23

C

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V_AUX

R7
R10
R9
R8

Y1
25MHz
1

C34

0.01nF
0.5pF
50V

2

C35

0.01nF
0.5pF
50V

1205-003904
3.465V

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-24

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P3.3V

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-25
4

3

SAMSUNG PROPRIETARY

2

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SATA I/F CONN

D

D

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

C

JHDD1
HDR-12P-SMD

SAT1_HDD_TXP0
SAT1_HDD_TXN0

P5.0V

SAT1_HDD_RXN0
SAT1_HDD_RXP0
nostuff

C605

100nF
10V

C114

10000nF-X5R
6.3V

C115

C604

10000nF-X5R 100nF
10V
6.3V

C603
100nF
10V

1
2
3
4
5
6
7
8
9
10
11
12

3711-000556

B

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

SATA HDD CONN
C

3

WLAN, 5.2mm

C510

C23

C509

10000nF-X5R
6.3V

100nF

100nF

CLK1_MINIPCIE#
CLK1_MINIPCIE

17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

PEX1_MINIRXN1
PEX1_MINIRXP1

C

R812

nostuff
nostuff

R811

1%
100
1%
100

PEX1_MINITXN1
PEX1_MINITXP1

P3.3V_1
GND_1
P1.5V_1
SIM_VCC_C1
SIM_DATAIO_C7
SIM_CLK_C3
SIM_RESET_C2
SIM_VPP_C6

WAKE*
RSVD_1
RSVD_2
CLKREQ*
GND_2
REFCLKREFCLK+
GND_3
SIM_RSVD_C8
SIM_RSVD_C4
GND_5
PERN0
PERP0
GND_7
GND_8
PETN0
PETP0
GND_10
RSVD_11
RSVD_12
RSVD_13
RSVD_14
RSVD_15
RSVD_16
RSVD_17
RSVD_18

MNT1
MNT2

3709-001470

nostuff

M4
HEAD
DIA
LENGTH

BA61-01102A|screw-118-1_b

18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52

D

Pontiac only

PEM for Half length card
M3
HEAD
DIA
LENGTH

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

GND_4
W_DISABLE*
PERST*
P3.3V_AUX
GND_6
P1.5V_2
SMB_CLK
SMB_DATA
GND_9
USB_DUSB_D+
GND_11
LED_WWAN*
LED_WLAN*
LED_WPAN*
P1.5V_3
GND_12
P3.3V_2

Near to Mini card Connector

2
4
6
8
10
12
14
16

Top
Pin 1

Odd Pins : Top side
Even Pins : Bottom Side

R26

J6
MINICARD-52P

10K

1
3
5
7
9
11
13
15

MIN3_CLKREQ#

R27

BA61-01102A

WOOFER

CHP3_RFOFF_WLAN#
PLT3_RST#

220

USB3_MINIPCIE1USB3_MINIPCIE1+

for antenna sub-board hole

for antenna sub-board hole

M2
RMNT-30-45-1P

M1
RMNT-30-45-1P

C

Bottom

53
54

P3.3V

P3.3V

A

MNT1
MNT2
3709-001401

R739
R738

0
0

HSDPA
HSDPA

CHP3_RFOFF_HSDPA#
PLT3_RST#

SMB3_CLK_S
SMB3_DATA_S

USB3_MINIPCIE2USB3_MINIPCIE2+

SIM3_C4DET

HSDPA

HSDPA

50V

50V

HSDPA

J7
EDGE-SIM-8P-MNT

3709-001478

HSDPA

1

1
2

C44

0.01nF
0.5pF
50V

HSDPA

B

SIM3_C6VPP
SIM3_C7DATA

1

MNT1
MNT2

CD_U
CD_L

C5
C6
C7

nostuff
nostuff

2

C5
C6
C7

C1
C2
C3

2

0.01nF 0.5pF

18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52

nostuff
nostuff
nostuff

C4
C8

0.01nF 0.5pF

SIM3_C1VCC
SIM3_C7DATA
SIM3_C3CLK
SIM3_C2RST
SIM3_C6VPP

1

SIM3_C4DET

6.3V

HSDPA

1

10K

C69

GND_4
W_DISABLE*
PERST*
P3.3V_AUX
GND_6
P1.5V_2
SMB_CLK
SMB_DATA
GND_9
USB_DUSB_D+
GND_11
LED_WWAN*
LED_WLAN*
LED_WPAN*
P1.5V_3
GND_12
P3.3V_2

R740

2
4
6
8
10
12
14
16

C45

SIM_RSVD_C8
SIM_RSVD_C4
GND_5
PERN0
PERP0
GND_7
GND_8
PETN0
PETP0
GND_10
RSVD_11
RSVD_12
RSVD_13
RSVD_14
RSVD_15
RSVD_16
RSVD_17
RSVD_18

P3.3V_1
GND_1
P1.5V_1
SIM_VCC_C1
SIM_DATAIO_C7
SIM_CLK_C3
SIM_RESET_C2
SIM_VPP_C6

C1
C2
C3

1000nF-X5R 10%

17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

WAKE*
RSVD_1
RSVD_2
CLKREQ*
GND_2
REFCLKREFCLK+
GND_3

10K

1

1
3
5
7
9
11
13
15

J15
EDGE-MINIPCI-E-52P

SIM3_C1VCC
SIM3_C2RST
SIM3_C3CLK

2

10K

R67

HSDPA

P1.5V

Mini PCI Express Card
30.00 mm

50.95 mm

PEX1_MINITXN2
PEX1_MINITXP2

HSDPA

C47

PEX1_MINIRXN2
PEX1_MINIRXP2

P3.3V

nostuff

PGB1010603NR
D6
PGB1010603NR
D8

EXP3_CLKREQ#
CLK1_MINI3PCIE#
CLK1_MINI3PCIE

100nF

PGB1010603NR
D4

HSDPA

P3.3V

SIM CARD CONN.

C745

P3.3V

R776

B

100nF

2

P3.3V

P3.3V

C142

HSDPA

PGB1010603NR
D7
PGB1010603NR
D5

C701

10000nF-X5R
6.3V

2

HSDPA / WIBRO, 4.0mm

Top
Pin 1

48.05 mm

Odd Pins : Top side
Even Pins : Bottom Side

M504
HEAD
DIA
LENGTH

A

BA61-01090A

53
54

SAMSUNG

HSDPA

ELECTRONICS
HSDPA

For SIM card Sub Board

4

3

2

1

8-26

8. Block Diagram and Schematic

C4

100nF

50.95 mm

C520

10000nF-X5R
6.3V

R6

10K
1%

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

30.00 mm

nostuff

P3.3V

D

Mini PCI Express Card

P3.3V

P3.3V
P3.3V

P3.3V

1

48.05 mm

P3.3V

2

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-27
4

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

2

1

1 PORT USB CONNECTOR

10V

P5.0V_ALW

D

D
100nF

2

U7
TPS2062ADRBR
IN

8
5

KBC3_USBCHG#
KBC3_USBPWRON#

R144

0

3

R143

0

4

nostuff

1

GND

OC1#

OUT1

OC2#

OUT2

6

9

1205-003683

nostuff

7

EN1#
EN2# T_GND

Need 2A Routing
EC502
100uF C609

C610
100nF
10V

100nF
10V

6.3V
AD

C611

0.033nF
50V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
J12
JACK-USB-4P

USB3_P6USB3_P6+

MNT1
MNT2
MNT3
MNT4

3722-002002

100nF

C169

2
8
5

KBC3_USBPWRON#

3
4

C

P3.3V_MICOM

R175

P5.0V_ALW

200K
1%

10V

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

5
6
7
8

C

Chargeable USB

PWR
DD+
GND

USB3_P6USB3_P6+

U16
TPS2062ADRBR
IN

GND

OC1#
OC2#

OUT1
OUT2

1
7
6

EN1#
EN2# T_GND
1205-003683

9

Need 4A Routing

For EMI

KBC3_USBCHG

C163
100nF
10V

EC8
100uF

6.3V
AD

C145

100nF
10V

D

3

S

2

G

1

KBC3_USBCHG#

Q14
RHU002N06
60V

C164

0.033nF
50V

J9
JACK-USB-4P

B
USB3_P0USB3_P0+

B

PWR
DD+
GND

USB3_P0USB3_P0+

5
6
7
8

MNT1
MNT2
MNT3
MNT4

3722-002002

J11
JACK-USB-4P

USB3_P2USB3_P2+

PWR
DD+
GND

USB3_P2USB3_P2+

5
6
7
8

A

MNT1
MNT2
MNT3
MNT4

A

3722-002002

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

C132

1

2

D

D

USB I/F Devices
Bluetooth Interface
C
C141

100nF
10V

USB3_BLUETOOTHUSB3_BLUETOOTH+
7
8

1
2
3
4
5
6
MNT1
MNT2
3711-002049

B’d to B’d connector

C

100nF
10V

J2
SOCK-8P-1R-SMD

EXC24CE900U
B1

Camra I/F Circuit was moved to LVDS I/F Circuit Block.

USB3_TSPUSB3_TSP+

TSP3_COMMSTATUS#

B

P5.0V

C781

J501
HDR-6P-SMD

CHP3_RFOFF_BT#

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
2

3

1

4
9
10

1
2
3
4
5
6
7
8
MNT1
MNT2
3710-002160

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-28

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P3.3V

TSP(Only for Lincon Model)

CAMERA

N220, N210, N150, NB30

3

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-29
4

2

3

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MMC(GL823)

D

P3.3V

C730
100nF
10V

C729
100nF
10V

13
23

P3.3V

C727

10000nF-X5R
6.3V

C728
100nF
10V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

3
4

USB3_MMCUSB3_MMC+
R752

715
1%

5
1
2

P3.3V
SMT4

0-1005

15
21
22
24
25

VDD33_1
VDD33_2
AVDD33
DM
DP

RREF

IIC_SCL
IIC_SDA

TESTMOD1
TESTMOD2
TESTMOD3
GND

THERMAL

PMOSO
LED

SD_D0
SD_D1
SD_D2
SD_D3

SD_CMD
SD_CDZ
SD_WP

SD_CLK

NC

EXTRSTZ

14

C158

20

2200nF-X5R
10V

11
10
19
18

16
9
8

MCD3_SDDAT3
MCD3_SDCMD

MCD3_SDCMD
MCD3_SDCD#
MCD3_SDWP

1%

12

C766

17

0.022nF
50V

33

R780

40mil pattern
C

R163

49.9

1%

R173
R172
R164

49.9
49.9
49.9

1%
1%
1%

MCD3_SDCLK

MCD3_SDCLK

C767

MCD3_SDDAT0
MCD3_SDDAT1
MCD3_SDDAT2
MCD3_SDCD#
MCD3_SDWP

0.01nF
0.5pF
50V

nostuff

7

0250971700

C159

100nF
10V

MCD3_SDDAT0
MCD3_SDDAT1
MCD3_SDDAT2
MCD3_SDDAT3

1
2
3
4
5
6
7
8
9
10
11
12
13

10V
100nF

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

6

C

P3.3V_MCD

U517
GL823

JMULTI1
EDGE-SD-9P
CD_DAT3
CMD
VSS1
VDD
CLK
VSS2
DAT0
DAT1
DAT2
CARD_DETECT
WRITE_PROTECT
MNT1
MNT2
3709-001492

40 mil trace for medica card socket ground

B

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

10000nF-X5R
6.3V

P3.3V_MCD

C765

C731

D

MAIN BOARD (MICOM)

MICOM RESET

P3.3V_MICOM

P3.3V_AUX

KBC3_RST#

P3.3V
nostuff

1

C524 C26

100nF
10V

C525 C546 C68
100nF
10V

100nF
10V

C523

100nF
10V

2

LPC3_LFRAME#
PLT3_RST#
CLK3_PCLKMICOM
PCI3_CLKRUN#
CHP3_SERIRQ

B

46
48
50
51
52
53
54
55
57
59
76

KBC3_RUNSCI#
R66
SMT548
R63
SMT549
R576
SMT550
R580
SMT572

KBC3_SPI_CLK
KBC3_SPI_DI
KBC3_SPI_DO
KBC3_SPI_CS#

22
2
0-1005 94
22
127
0-1005 96
31
22
3
0-1005 95
22
128
0-1005 97
32
41
42
43
44
38

VRM3_CPU_PWRGD
CHP3_SLPS5#
CHP3_SLPS4#
CHP3_SUSSTAT#

70

R515
nostuff

A

1M
1%

71

Y500
0.032768MHz
1

4

2

3

C522

2

40
AVCC

49
VCC2

VCC0

IMCLK
IMDAT
KCLK
KDAT
EMCLK
EMDAT

GPIO20_PS2CLK
GPIO21_PS2DAT
32KHZ_OUT_GPIO22_WK_SE01
GPIO25
GPIO27_WK_SE05
GPIO28
GPIO29_BC_CLK
GPIO30_BC_DAT
GPIO31_BC_INT#
GPIO32
GPIO33
GPIO34
GPIO35
GPIO36
GPIO37_CIR_LED
GPIO38_CIR_IN
GPIO39

LAD0
LAD1
LAD2
LAD3
LFRAME#
LRESET#
PCI_CLK
CLKRUN#
SER_IRQ
NC_TEST_CLK
NEC_SCI
HSTCLK_GPIO41
HSTDATAIN_GPIO43 (MISO)
HSTDATAOUT_GPIO45 (MOSI)
HSTCS0#_GPIO44
HSTCS1#_GPIO42
FLCLK
FLDATAIN
FLDATAOUT
FLCS0#
FLCS1#
ADC3_GPIO23
ADC2_GPIO40
ADC1_GPIO46
ADC0_GPIO47
GPIO19
XTAL1
XTAL2

AB1A_DATA
AB1A_CLK
AB1B_DATA
AB1B_CLK

TEST_PIN
PWRGD
VCC1_RST#
GPIO10
NBAT_LED
NPWR_LED_8051TX
NFDD_LED_8051RX

C25
C521

0.022nF
50V

0.022nF
50V

107
79
80
60
85
86
87

KBC3_CHGEN
KBC3_PRECHG
KBC3_CHG4.2V
THM3_ALERT#

88
89
90
91
92
101
102

103
105
75
73
74
93
98
99
100
126
65
64
63
1
34
33
30

111
112
109
110

69
78
77
116
113
115
114

4700nF-X5R
6.3V

KBC3_TX
KBC3_RX

1

THM3_STP#
10kohm pull-up to P3.3V_AUX
should be at the thermal sensor side.

R705

100K
1%

KBC3_LED_POWER#

KBC3_PWRON_D

C

P3.3V_MICOM_SW

ADT3_SEL#
PEX3_WAKE#
CHP3_SLPS3#

R553

300K
1%

C545

KBC3_CHG3CELL
KBC3_VRON
KBC3_A20G

KBC3_BATDET#

100nF
10V

KBC3_CAPSLED#
KBC3_RFOFF_LED#
KBC3_PWRON
KBC3_USBCHG

KBC3_USBPWRON#

KBC3_RFOFF_SW#
KBC3_BKLTON
KBC3_RSMRST#
KBC3_PWRBTN#
KBC3_SPKMUTE#

P5.0V_STB

10K
1%

KBC3_LED_CHARGE#
KBC3_TX
KBC3_RX

P3.3V_MICOM_SW

KBC3_RST#

R86

R707
200K
1%

1
2
3
4

nostuff

D

3

S

2

G

1

C662
100nF

Q523
SI2315BDS-T1

B

nostuff

P3.3V_MICOM_SW

KBC3_SMDATA#
KBC3_SMCLK#

R64
R65

4.7K
4.7K

1%
1%

KBC3_TX
KBC3_RX
KBC3_LED_ACIN#
KBC3_LED_CHARGE#

R36
R35
R87
R39

10K
10K
10K
10K

1%
1%

R795
R796
R13
R16
R12
R14

10K
10K
10K
10K
10K
10K

KBC5_TCLK
KBC5_TDATA
KBC5_KCLK
KBC5_KDATA
KBC5_MCLK
KBC5_MDATA

TP22196

0

nostuff

Q524
RHU002N06

10K
1%

KBC3_PWRSW#

P3.3V_MICOM_SW

SHORT555

LID3_SWITCH#
PLT3_RST#

P3.3V
KBC3_SMDATA#
KBC3_SMCLK#
KBC3_THERM_SMDATA
KBC3_THERM_SMCLK R551

P3.3V_MICOM

P5.0V

MODE0
TX
RX
GND

1%
1%
1%
1%
1%
1%

A

SAMSUNG
ELECTRONICS

For Production

4

3

2

1

8-30

HST3_SPI_CLK
HST3_SPI_DO
HST3_SPI_DI
HST3_SPI_CS#

GPIO11_AB2A_DATA
GPIO12_AB2A_CLK
GPIO13_AB2B_DATA
GPIO14_AB2B_CLK
GPIO15_FAN_TACH1
GPIO16_FAN_TACH2
GPIO17_A20M

KBC3_LED_ACIN#
KBC3_CHG4.3V
KBC3_EXTSMI#
KBC3_RCIN#
KBC3_WAKESCI#

10K
1%

S

D

0
1
2
3

14
39
58
84
106
119

G

LPC3_LAD(0:3)

GPIO01
GPIO02
GPIO03
NRESET_OUT_GPIO06
GPIO07_PWM3
GPIO08_RXD
GPIO09_TXD

124
125
123
122
121
120
118

CAP

KBC5_TCLK
KBC5_TDATA
KBC5_KCLK
KBC5_KDATA
KBC5_MCLK
KBC5_MDATA

KSI0
KSI1
KSI2
KSI3
KSI4
KSI5
KSI6
KSI7

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
OUT0_SCI
OUT1
OUT7_NSMI
OUT8_KBRST
OUT9_PWM2
OUT10_PWM0
PWM1_OUT11

15

35
36
61
62
66
67

U503
MEC1308-NU

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7

29
28
27
26
25
24
23
22

KSO0
KSO1
KSO2
KSO3
KSO4
KSO5
KSO6
KSO7
KSO8
KSO9
KSO10
KSO11
KSO12_GPIO00_KBRST
KSO13_GPIO18
GPIO04_KSO14
BA09-00021A
GPIO05_KSO15
GPIO24_KSO16
GPIO26_KSO17

11
37
47
56
82
104
117

0
1
2
3
4
5
6
7

VCC1_1
VCC1_2
VCC1_3
VCC1_4
VCC1_5
VCC1_6

68

KBC3_SUSPWR
KBC3_PWRGD
KBC5_KSI(0:7)

21
20
19
18
17
16
13
12
10
9
8
7
6
5
81
83
4
108

AVSS
AGND

C

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

45
72

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

KBC5_KSO(0:15)

D

R706

Q521
BSS84

100nF
10V

3

100nF
10V

3

C6

100nF
10V

Q522
RHU002N06

D

D

S

G

2

nostuff

3

S

nostuff

D

1

P3.3V_MICOM_SW

1

2

N220, N210, N150, NB30

3

G

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-31
4

3

SAMSUNG PROPRIETARY

D

2

1

Micom Glue Logic

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Power Slide Switch

KEYBOARD

D

TOUCHPAD
P5.0V

P3.3V_MICOM
nostuff

B

C506

1000nF-X5R
6.3V

nostuff

C779

0.1nF
50V

7
8

C776

0.1nF
50V

C

3708-002402

nostuff

nostuff

P3.3V_MICOM

1

3

U500
A3212ELH/HED55XXU12
SUPPLY
OUTPUT
GND

2

1

T_R_BUTTON#

3

R508

2

20K
1%

LID3_SWITCH#

2

P5.0V

nostuff

1
2
3

10K

4
8 7 6 5

MNT1
MNT2
MNT3
MNT4

SW500
SSS-12LG-V-T/R

3

4

BAV99LT1
D515

B

1

T_L_BUTTON#

1

SW503
SW-TACT-4P

3404-001311

1

1009-001024
(To layout : Error ?)

nostuff

A

C780

0.1nF
50V

1009-001010

Only For Communication SKU
P3.3V

KBC3_RFOFF_SW#

1
3
8 7 6 5

P3.3V_MICOM

3

C782

0.1nF
50V

1
2
3
4
5
6
MNT1
MNT2

LID_SWITCH

3708-002166

2

T_R_BUTTON#
KBC5_TDATA
KBC5_TCLK

MNT1
MNT2
MNT3
MNT4

nostuff

RF ON/OFF Slide Switch

R170

J18
CONN-6P-FPC

T_L_BUTTON#

4

KBC3_PWRSW#

nostuff
nostuff
nostuff
nostuff
nostuff
nostuff
nostuff
nostuff

D12
BAV99LT1

2

3

2

P5.0V
3
2

nostuff

1

SW502
SW-TACT-4P
3
4
3404-001311

BAV99LT1
D514

HSDPA

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

1%
1%
1%
1%
1%
1%
1%
1%

26
27

10K
10K
10K
10K
10K
10K
10K
10K

P3.3V_MICOM

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

C173

100nF
10V

1

2

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
MNT1
MNT2

SW501
SSS-12LG-V-T/R

KBC5_KSI(0:7)

R20
R19
R18
R17
R15
R34
R37
R38

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

C

D13
BAV99LT1

J500
FPC-KBD-25P

KBC5_KSO(0:15)

2

1

LED SWITCH LOGIC

D

D
P3.3V

P3.3V_MICOM

LED504
LTST-C195KGJRKT

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
KBC3_LED_ACIN#

KBC3_LED_CHARGE#

LED501
LTST-C193TBKT-AC
1

R176

2

KBC3_CAPSLED#

1% 475

R180

R 2

1% 1K

R179

2

1 1%

P3.3V_AUX

1K

R181

C

LED505
LTST-C193TBKT-AC

1

CHP3_SATALED#

2

LED502
LTST-C193TBKT-AC

R177

1K
1%

R178

475
1%

R779

475

1

KBC3_RFOFF_LED#

2

LED503
LTST-C193TBKT-AC

1

LED500
LTST-C193TBKT-AC
2

1%

HSDPA

B

Only For Communication SKU

HSDPA

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-32

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

G 1

4

1K
1%

KBC3_LED_POWER#

C

3

N220, N210, N150, NB30

3

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-33
4

2

3

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

D

D

FREE FALL SENSOR

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V

C143

100nF
10V

P3.3V

C

SMB3_CLK_S

U10
LIS331DL

VDD_IO
NC_1
NC_2
SCL_SPC
GND_1

GND_3
GND_2
INT1
RESERVED_1
INT2

SDA_SDI_SDO
SDO
CS

1
2
3
4
5

GND_4
RESERVED_2
VDD

16
15
14

C

6
7
8

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

10000nF-X5R
6.3V

SMB3_DATA_S

B

13
12
11
10
9

FFS3_INT

P3.3V

1209-001876
3.6V

R155

10K

1%

R154

10K

1%

FFS
FFS
FFS
FFS
FFS

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

C144

2

3

1

CPU VRM (PineView-M)
D

D
P5.0V

VDC

C74

4700nF-X5R
25V

C802

4700nF-X5R
25V

C801

4700nF-X5R
25V

1203-006047
1.5V

BST

DRVL

PGND

CPU_CORE

G

PNS_CPUVR_TG_MN

2

21 PNS_CPUVR_PHASE_MN

Q5-2
AP4232BGM-HF

C561

R583

PNS_CPUVR_BST_RC_MN

23 PNS_CPUVR_BST_MN

19

nostuff

D2

100nF
25V

3.3

ANS_CPUVR_BG_MN

S

L6

1.5uH

D1 5

C52

6

D2

R92

10

1nF4
50V

18

1

S

G

3

R69
10

PNS_CPUVR_PHASE_RRC_MN

C55

1nF
50V

MS-RH7040-1R5
2703-000178
16mohm MAX

TH1
104KT1608T-1P
1

2

EC4
330uF

2V
AL

2402-001306
0.006ohm

C105

1nF
50V

C106
100nF
10V

nostuff

C

IMON

R584

1

10

R44

CPUVR_EN_MN

32

EN

CPUVR_LLINE_MN

2.4K

CPUVR_CSCOMP_RR_MN

R55
0

R54

CSREF

7

R566

14

CPUVR_CSREF_MN

C43

R57

1nF
50V

0

GPU

G_CPU

300K
1%

CPUVR_RAMP_MN

G_CPU

C555

G_CPU

R53

80.6K
1%

G_CPU

CPUVR_RPM_RR_MN

1nF
50V

R52

300K
1%

R58

CPUVR_IREF_MN

9

CPUVR_RPM_MN

10

CPUVR_RT_MN

11

R56

332K
1%

24.3K
1%

G_CPU

G_CPU

12

17

FB

RAMP
IREF

COMP

RPM
RT

AGND

FBRTN

5

CPUVR_FB_MN

C42

C41

0.047nF
50V

6

CPUVR_COMP_MN

4

CPUVR_COMP_RC_MN

R50

0.47nF
50V

CPUVR_COMP_RC_MN

30K
1%

R49

1K
1%

G_CPU

RT = 332Kohm
SWF = 350KHz

B

R565 R48
100
1%

C40

0.33nF
50V

100
1%

CPU1_VCCSENSE
C553

1nF
50V

33

1K
1%

13

CPUVR_ILIM_MN

R71

0

nostuff

nostuff

VDC

B

LLINE

8

R70

100K
1%

0

R45

R567

ILIM

R51

CPU1_VSSSENSE

G_CPU nostuff nostuff
nostuff

G_CPU

SHORT500

INSTPAR

A

A
G_CPU

SAMSUNG
ELECTRONICS

4

3

2

1

8-34

GCORE5_PWRGD

10

PWRGD

PAD_GND

KBC3_VRON

CPUVR_CSCOMP_MN

4.7nF
25V

CSCOMP

VRM3_CPU_PWRGD

16

CLKEN#

nostuff

3

CPUVR_CSFB_MN

1nF
50V

CPUVR_CLKEN#_MN

R47

10K
1%

15

C54

CSFB

C53

330K

P3.3V

CPUVR_RAMP_RRC_MN

8. Block Diagram and Schematic

VID0
VID1
VID2
VID3
VID4
VID5
VID6

C
2

SW

PVCC

22
22

8

6.3V
20%

31
30
29
28
27
26
25

CPU1_VID(0)
CPU1_VID(1)
CPU1_VID(2)
CPU1_VID(3)
CPU1_VID(4)
CPU1_VID(5)
CPU1_VID(6)

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

20

1nF
50V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
DRVH

D1 7

22000nF-X5R

G_CPU

Q5-1
AP4232BGM-HF

22000nF-X5R
6.3V
20%

1000nF-X5R
6.3V

4700nF-X5R
6.3V

C73

VCC

C807

C39

U3
ADP3211AMNR2G

C104

C554

24

22000nF-X5R
6.3V
20%

CPUVR_VCC_MN

C103

R46

5% 10

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-35
4

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

1

2

Chipset Power ( P1.5V & P1.05V & 1.2V )

D

D

VDC
FOR EMI
C71

C70

P5.0V_AUX

U504
APW7141QAITRG

C557

PVCC

4700nF-X5R
6.3V

R557

300ohm@TPS51117

BOOT

P1.05V_VCC_MN

4

C547

VCC

1000nF-X5R
6.3V
P5.0V_AUX

G_P1.05V

6

POK

nostuff

20K
1%

D502
MMBD4148
P1.05V_EN_RRRD_MN

75V

R559

3

P1.05V_EN_MN

1

P1.05V_OCSET_MN

30K
1%

C548

1

11

7

R581

100nF
10V

11.8K
1%

15

C558

R560

EN

14

100nF
25V

PHASE

PGND

VOUT

12

PNS_P1.05V_PHASE_MN

9

ANS_P1.05V_BG_MN

200K
1%

4

S

2

RdsOn : 32mohmMAX

S

6

Q4-2
AP4232BGM-HF

L5
2.2uH

3 7.6V

MS-RH7040S-L71
2703-001004

8

D2

R88
Q4-1
AP4232BGM-HF10

1 7.6V

C48

8

P1.05V (4A)

D2

R89
10

C94

100nF
10V

PNS_P1.05V_PHASE_RRC_MN

C46

1nF
50V

EC3
220uF
2.5V
AD

2409-001159
16mohm
CAN 4.5T

EC506
220uF
2.5V

2409-001187
nostuff

1nF
50V

C

3

R555
17.4K
1%

GND

FB

350KHz

G

G

OCSET

THERMAL

D1 5

R558

D1 7

5

1203-006049
5V

G_P1.05V

P1.05V_TON_MN

PNS_P1.05V_BST_MN

OCP : 5.4A@32mohm
OCP : 6.7A@26mohm

C526

C799

0.1nF
50V

100nF
10V

SHORT1

nostuff

nostuff

P1.05V_FB_MN

INSTPAR

SET : 1.055V

R556
47K
1%

R518

470K
1%

G_P1.05V

G_P1.05V G_P1.05V

G_P1.05V

G_P1.05V

Pontiac only

P1.8V_AUX P5.0V_AUX

B
P1.8V_AUX P5.0V_AUX
5

U508
APL5930KAI-TRG
VIN

VOUT_2

4

10000nF-X5R
6.3V

9
6

PAD_VIN VOUT_1

P1.5V_EN_RR_MN

R686

20K
1%

30K
1%

P1.5V_EN_MN

C639

100nF
10V

2

nostuff

P1.5V_FB_MN

R670

7

R685

1nF
50V

FB

1000nF-X5R
6.3V

10000nF-X5R
6.3V

C579

VCNTL

C638

KBC3_PWRON

3

8

470K
1%

POK
EN
1203-006056
3.3V

GND

1

U513
APL5930KAI-TRG
VIN

VOUT_2

P1.2V

R638

10000nF-X5R
6.3V

6

EC500
220uF

C631

1nF
50V

FB

7

HD_DEC

P1.2V_EN_MN

R727

P1.2V_FB_MN

43.2K
1%

R726

nostuff

R698

300K
1%

nostuff

POK

EN

GND

R677

10K
1%

HD_DEC

HD_DEC

R699
20K
1%

HD_DEC

1

1203-006056
3.3V

HD_DEC

VCCP5_PWRGD

43.2K
1%

8

nostuff

2

HD_DEC

KBC3_PWRON_D

C652

10000nF-X5R
6.3V

3

VCNTL

1000nF-X5R
6.3V

R669
20K
1%

PAD_VIN VOUT_1

C687

2.5V
AD
nostuff

17.4K
1%

9

B

4

C686

HD_DEC

C578

C637

5

P1.5V

C688

100nF
10V

HD_DEC

A

A

SAMSUNG

ELECTRONICS

COM-22C-015(1996.6.5) REV. 3

4

3

2

D:/Users/mobile54/mentor/bloomington/pv2/Bloomington_PV_MAIN

N220, N210, N150, NB30

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

VCCP5_PWRGD

13
2

PNS_P1.05V_BST_RC_MN

LGATE

R554

100K
1%

R561

UGATE
TON

PNS_P1.05V_TG_MN

2.2

10

KBC3_PWRON

4700nF-X5R
25V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
10

P5.0V_AUX

C

EC2

4700nF-X5R
25V

1nF
50V

3

2

1

DDR2 Power ( P1.8V_AUX )

D

D

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

VDC

C735

C

P5.0V_AUX

10

P5.0V_AUX

C734

U520
APW7141QAITRG
PVCC

4700nF-X5R
6.3V

R783

13
2

PNS_DDR2VR_TG_MN

14

PNS_DDR2VR_BST_MN

DDR2VR_TON_MN

BOOT

4

DDR2VR_VCC_MN

C770

D1 D2 D3 D4

100nF
25V

R757

200K
1%

PNS_DDR2VR_BST_RC_MN

VCC

1000nF-X5R
6.3V

PHASE

LGATE

G_DDR

12

9

Q531
AON6912L

G1

300KHz 1

DDR2VR_PGOOD_MN

nostuff

KBC3_SUSPWR
AUX5_PWRGD

B

1K
1%

R782

1K
1%

DDR2VR_EN_MN

DDR2VR_TRIP_MN

C769
1nF
50V

R758

10K
1%

6

1

11

7

R804
15K
1%

15

POK

EN

PGND

VOUT

S1_D2

PNS_DDR2VR_PHASE_MN

10

8

ANS_DDR2VR_BG_MN

10

nostuff

8

R784
20K
1%

OCP : 7.77A@19.3mohm

G_DDR

G_DDR

10

PNS_DDR2VR_PHASE_RC_MN

C690
1nF
50V

C140

100nF
10V

EC5
330uF
2.5V

2409-001195
16mohm
CAN 4.5T

nostuff
nostuff
nostuff

C800

R785

15K
1%

G_DDR

B

C771

0.1nF
50V

DDR2VR_FB_MN

1203-006049
5V

G_DDR

P1.8V_AUX (4A)

SET : 1.800V

3

5

R730

S1 S2 S3

1nF
50V

GND

FB

C

MS-RH1048S-L42
2703-001012

R731

G2

OCSET

THERMAL

EC505

4700nF-X5R
25V

L8
2.2uH

30V

5 6 7
C732

R781

4700nF-X5R
25V

2 3 4 9

C733

R756

2.2

10

300ohm@TPS51117

UGATE
TON

C692

100nF
25V

R786

300K
1%

100nF
10V

SHORT8

INSTPAR

nostuff

G_DDR

G_DDR

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

8-36

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

FOR EMI

8-37
4

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

2

1

P3.3V_AUX & P5.0V_ALW
VDC

VDC

300K
1%

9V@1.75V , 19V@3.7V

D

C699

C698

C697

KBC3_RST#

R793

R789

3.3

C700

4700nF-X5R4700nF-X5R 4700nF-X5R 100nF
25V
25V
25V
25V

C773
100nF
25V

9 4 3 2

VDC

R788

VDC

SYSVR_VIN_MN

16

PNS_SYSVR_TG_P5.0V_ALW_MN

21

D4 D3 D2 D1

R790

U518
RT8205AGQW
VIN

EN

680K
1%

13

C694

100K
1%

100nF
25V

1.19V ~ 1.7V

Q528-1
AP4232BGM-HF

nostuff

STUFF@TPS51125

P5.0V_ALW

PNS_SYSVR_PHASE_P5.0V_ALW_MN

10

10

PNS_SYSVR_PHASE_P5.0V_ALW_RC_MN

nostuff
nostuff
nostuff

PNS_SYSVR_BST_P5.0V_ALW_RC_MN
PNS_SYSVR_BST_P5.0V_ALW_MN
100nF

C744

G2

C696
1nF
50V

20

R770

R735

10

100nF
10V

6.3V

1

30V

R734

C661

0.018OHM
CAN 4.5T

G1

S1_D2

SIQ1048-3R9

EC7
220uF

PNS_SYSVR_TG_P3.3V_AUX_MN

D1 7

4700nF-X5R
25V

S3 S2 S1

25V

3.3

8

ANS_SYSVR_BG_P5.0V_ALW_MN

22

19

UGATE1

UGATE2

PHASE1

PHASE2

BOOT1

BOOT2

LGATE2

LGATE1

G_P3.3V

8

2

S

D2

P3.3V_AUX

1

11 PNS_SYSVR_PHASE_P3.3V_AUX_MN

R761

9

PNS_SYSVR_BST_P3.3V_AUX_MN

12 ANS_SYSVR_BG_P3.3V_AUX_MN

C772

D1 5

PNS_SYSVR_BST_P3.3V_AUX_RC_MN

100nF
25V

3.3

Q528-2
AP4232BGM-HF

7 6 5

D

C693

4700nF-X5R
25V

(4A)

G

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

Q529
AON6912L

L10
3.9uH

10

C691

6

R732

D2

10

G

4

S

3

R733

L9
2.2uH
MS-RH7040S-L71
2703-001004

10

C660
100nF
10V

PNS_SYSVR_PHASE_P3.3V_AUX_RC_MN

C739

C695

1nF
50V

EC6
220uF

6.3V

0.018OHM
CAN 4.5T

1nF
50V

RdsOn(Typ 15mohm / 19mohm)

C743

R759
100K
1%

SYSVR_ENTRIP2_RQQ_MN

Q535
RHU002N06
R787

KBC3_SUSPWR

1

3

3

S

2

100nF
10V

R805
60V

R760

470K
1%

150K
1%

R767

15K
1%

SYSVR_VFB1_P5.0V_ALW_MN

2
G_P3.3V

3

G

1

S

2

P5.0V_STB
CHARGEABLE USB

R794

3

30V

1

Q534
RHU002N06

D

3

G_P3.3V

SYSVR_ENTRIP1_RQQ_RD_MN

KBC3_SUSPWR

10K
1%

G

1

R774
470K
1%

G_P3.3V

60V
S

2

G_P3.3V

REF

NC

nostuff

Set : 3.356V

C

C738

100nF
10V

17.4K
1%

3

P5.0V_STB

G_P3.3V

VREG5

23

6

PGOOD

VREG3

C774

8

P2.0V_REF P3.3V_MICOM

ENTRIP2

R765
10

100K
1%

TONSEL

SYSVR_ENTRIP1_MN

1

PGND

22000nF-X5R
20%
6.3V

C775

10000nF-X5R
6.3V

C736

10000nF-X5R
6.3V

R764

10

nostuff

4

Ch1/Ch2 Fsw
P2.0V_REF : 300KHz/375KHz

ENTRIP1

1203-005735

P3.3V_MICOM

17

R771

G_P3.3V

0.1nF
50V

220nF
10V

15

SYSVR_ENTRIP1_RQQ_MN

D516
BAT54C

18

OCP Valley : 6A@17mohm
R775

KBC3_USBCHG

150K
1%

G_P3.3V

100K
1%

11.8K
1%

SYSVR_VFB2_P3.3V_AUX_MN

C740

C741G_P3.3V

SYSVR_ENTRIP2_MN

R769

60V

5

R763

R772

D

nostuff

FB2

P2.0V_REF

AUX5_PWRGD

10

FB1

P5.0V_STB

Q533
RHU002N06

R773

2

332K
1%

100K
1%

B

(Separate Routing)

G_P3.3V

OCP Valley : 5A@26mohm

G_P3.3V

(Vout Fix / Discharge / Switcher over)

R766

SYSVR_NC_MN

60V
S

0.1nF
50V

10K
1%

C737

10nF
16V

G_P3.3V G_P3.3V G_P3.3V

G

10KSYSVR_KBC3_ALWS_ON_RQ_MN 1
1%

D
G

D

C742

Q532
RHU002N06

7

R762

B

Ch1 / Ch2 Fsw
RT8205A : P2.0V_REF : 300KHz / 375KHz
TPS51125: P3.3V_MICOM: 300KHz / 375KHz

P2.0V_REF

PAD

P5.0V_STB

VOUT2

SKIPSEL

14

SYSVR_SKIPSEL_MN

(PWM Only)

R792

R791
0

10

P2.0V_REF : DEM Mode
GND : Fixed Mode

nostuff

G_P3.3V

G_P3.3V

SHORT7
INSTPAR

A

A

G_P3.3V

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

AUX5_PWRGD

VOUT1

Set : 5.090V
R768

25

C

2

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

24

nostuff

25V

1

2

CHGVR_CHLIM_MN
CHGVR_VADJ_MN

CHGVR_ACLIM_MN

CHGVR_ICM_MN

P2.39V_VREF

2

G

1

R620

Q510
RHU002N06

10K
1%

D

G_CHG

KBC3_CHG3CELL

12.594V@1.188V

P2.39V_VREF

60V

CHGVR_KBC3_CHGBIT0_RQ_MN

3

G

1

R621

10K
1%

R608

24.3K
1%

Q509
RHU002N06

60V
S

R603

2

R606
100K
1%

27.4K
1%

G_CHG
D

3

R637

10K
1%

A

G

1

S

1%

200K
1%

G_CHG

6.8nF
50V

C95

100nF
10V

G_CHG

G_CHG

C98

10nF
25V

23
24

VREF
EN

ICOMP
VCOMP

CELLS
GND

ACPRN
DCPRN

THERM

R611

14
15
16
12
11

PNS_CHGVR_BST_MN
PNS_CHGVR_TG_MN

1

D

3

CHGVR_BAT3_DETECT#_CBJ_MN

CHGVR_BAT3_SMCLK#_CBJ_MN

C8

C7

CHGVR_BAT3_SMDATA#_CBJ_MN

4700nF-X5R
25V
4700nF-X5R
25V nostuff

4700nF-X5R

C10

50V

4700nF-X5R

25V

1nF

C9

470K 1%

25V

50V

PNS_CHGVR_BST_RC_MN

BAT3_SMDATA#
B507
BLM18PG181SN1

B
BAT3_SMCLK#

C528

0.1nF
50V

CHGVR_EN_MN

P3.3V_MICOM

R105

29

CELLS
VDD

1203-005849
25V

10K
1%

1K
1%

Cells N/B
4

GND

3

Float

2

KBC3_CHGEN

C96

1nF
50V

C549

100nF
25V

G_CHG

nostuff

G_CHG G_CHG

G_CHG

P3.3V_MICOM

R521

100 1%

KBC3_BATDET#

BAT3_SMDATA#

R562

100 1%

KBC3_SMDATA#

R519

100 1%

BAT3_SMCLK#

ADT3_SEL#
(ACTIVE LOW)

SHORT2

BAT3_DETECT#

KBC3_SMCLK#

A

SAMSUNG

INSTPAR

ELECTRONICS

60V
S

BAT3_DETECT#

C529

50V

P2.39V_VREF

2
10

R103

Q508
RHU002N06

3711-007285

B508
BLM18PG181SN1

0.1nF

PNS_CHGVR_PHASE_MN

ANS_CHGVR_BG_MN

R111

G

0.1nF

100nF
25V

21 CHGVR_CSOP_MN
22 CHGVR_CSON_MN
6
1

J3
BATT-CONN-7P
B509
BLM18PG181SN1

C530

C564

3.3

20K
1%

CHGVR_KBC3_CHG4.3V_RQ_MN

10K

R610

100
1%

C97

CSOP
CSON

2

G_CHG

R582

R90

47K
1%

R106

3
4

CHLIM
VADJ
ACLIM
ICM

60V

Q507
RHU002N06

KBC3_CHG4.3V

CHGVR_VCOMP_MN

R91

150K
1%

7
9
8
5

BOOT
UGATE
PHASE
LGATE
PGND

VDDP
VDD

17

G_CHG

CHGVR_KBC3_CHG4.2V_RQ_MN

KBC3_CHG4.2V

CHGVR_ICOMP_MN

CHGVR_VCOMP_RC_MN

S

CHGVR_KBC3_CHGBIT1_RQ_MN

KBC3_PRECHG

13.05V@2.058V

CHGVR_ICM_RC_MN

G_CHG

3

13
26

Q6-2
AP4232BGM-HF

20 CHGVR_CSIN_MN

3

CHGVR_VDD_MN

47nF
50V

B505
HU-1M2012-121JT

7
6
5
4
3
2
1

2

CHGVR_VDDP_MN

BGATE

C101

1

5.1
1%

SGATE
DCIN
ACSET
DCSET

1nF
50V

D501
BAV99LT1

R623

CSIN

CSIP

22

C

ANS_CHGVR_VDC_CHG_BJ_MN

70V

25V

18
25
27
28

22

C560

2

CHGVR_ACSET_MN

U4
ISL6255AHRZ-T

R112

R114

PNS_CHGVR_PHASE_RC_MN

3

1000nF-X5R

R604

CHGVR_CHLIM_RQ_MN

3

1

19

CHGVR_DCSET_MN

C568

D

S

C798

10

1

1000nF-X5R

CHGVR_DCIN_MN

100K
1%

R613 R612

10

C527

3

C563

G_CHG

2.5A@1.024V
0.268A@0.107V

SIQ1048-R100

6

D2

1nF
50V

R110
27.4K
1%

R605

1

70V

10nF
25V

4

B506
HU-1M2012-121JT

0.02

1W
L4
1%
10uH
CHGVR_PHASE_RL_MN

G

CHGVR_CSIP_MN

To enhance
DMB performance (060310)

R40

D2

D1 5

D506
BAT54A

G_CHG

P2.39V_VREF

R609

8

70V

R108

15.15V@1.264V

C99

S

R520

D1 7

(1.26V)

20K
1%

R21

-50V

2

2

3

S

Pontiac/Kansas/Lincoln
(3711-006827)

Q6-1
AP4232BGM-HF

Q7
BSS84

D503
BAV99LT1

3

100nF
25V

300K
1%

300K
1%

G_CHG

R607

CHGVR_P3.3V_MICOM_RQ_MN

Q500
RHU002N06

S

25V

150K
1%

BGATE

G

C100

VDC

nostuff
R109

300K
1%

B

R1

10K
1%

60V

2

R104

200K
1%

0.033
1W
1%

Q501-1
AO4807L

D2

8

1 30V
S

D

G

VDC_ADPT

R107

-30V

25V

ADT3_SEL#

1

BGATE

30K
1%

3

2

G

4.3V
4.2V

1

43.2K
1%

100nF

4.35V

C559

1nF
50V

D

8
7
6
5

D1
D2
D3
D4

100nF

2

0
0

1
0

C117

25V

D

G_CHG

2
G_CHG

COM-22C-015(1996.6.5) REV. 3

4

G_CHG

3

2

1

D:/Users/mobile54/mentor/bloomington/pv2/Bloomington_PV_MAIN

8-38

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

0
C

C116

OPERATION

C49

4700nF-X5R
25V

30V

KBC3_CHG4.3V KBC3_CHG4.2V

C102

4700nF-X5R
25V

22

S1
S2
S3
G

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

EMI

100nF

1
2
3
4

1

1

2.56A

R500

P3.3V_MICOM

C50

R622

2.2

VDC_CHG

Q505
AP4435GM

D500
BAV99LT1

R502

KBC3_PRECHG KBC3_CHG3CELL OPERATION
1.37A
0.48A

R113

300K
1%

3722-002997

0

R501

1000nF-X5R

100K
1%

1
0

ANS_CHGVR_VDC_ADPT_RQ_MN

25V

CHGVR_DCJACK_RCQ_MN

0
0

D1 7
G

C503

D2

AO4807L
Q501-2

R503

100K
1%

VDC

CHGVR_SGATE_RRQ_MN

25V

100nF
25V

6

3 30V
S

C502

10nF

100nF
25V

C500

4
5
6
7

MNT1
MNT2
MNT3
MNT4

4

C501

2

GND_1

PNS_CHGVR_DCJACK_QB_MN

D1 5

1
3

POWER
GND_2

B500
HU-1M2012-121JT

PNS_CHGVR_DCJACK_MN

VDC_ADPT

G

D

1

CHARGER & POWER MANAGEMENT

VCHG=12.597V@2600Cell
VCHG=13.05V@2950Cell
ICHG=2.56A FOR 5200mAh & 4000mAh

J1
JACK-DC-POWER-3P-MNT

2

N220, N210, N150, NB30

3

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-39
2

3

4

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Graphic Core PWR ( 0.89V )

D

P5.0V_AUX
R152

1

IGFXVR_VDD_MN

8

U6
RT8015AGQW
VDD

100nF
10V

22000nF-X5R
20%
6.3V

COMP

6

PVDD_1

P5.0V_AUX

IGFXVR_SHDN_RT_MN

D

3

IGFXVR_SHDN_RT_RRQ_RRCQ_MN

1K
1%

G

S

C630

R690

330K

2

Set : 0.8944V

LX_2

GND

3

4

PNS_IGFXVR_PHASE_MN

5

2

PAD

PGND

MS-RH7040-1R5
2703-000178

G_GCORE

R694

300K
1%

R655 R656

0

0

G_GCORE

C606
100nF
10V

11

1203-005902
5V

nostuff

L7
1.5uH

GFX_CORE (3A)

nostuff

R693

150K
1%

IGFXVR_SHDN_RT_RRQ_MN

Q513
RHU002N06
60V

1

nostuff

LX_1

SHDN_RT

C650

0.1nF
50V

IGFXVR_FB_MN

C608

22000nF-X5R
20%
6.3V

nostuff

C607

22000nF-X5R
20%
6.3V

nostuff

EC501
220uF
2.5V
AD

C

nostuff

1nF
50V

1K
1%

nostuff

G_GCORE

G_GCORE

G_GCORE

SHORT501

INSTPAR

G_GCORE

P1.05V

P5.0V_AUX

B

6

C684

1000nF-X5R
6.3V

VCCP5_PWRGD

R725

1K
1%
nostuff

KBC3_PWRON_D

R724

1K
1%

P0.89V_EN_MN

1

C685

100nF
10V

nostuff

U512
APL5610ACI-TRG
VCC

DRV

Q517
AO6402AL

5

3

P0.89V_DRV_MN

4

POK

FB

10K
1%

3

P5.0V_AUX

2

R692
100K
1%

30V

6
5
2
1

10000nF-X5R
6.3V

GFX_CORE (0.893V)

C651

0.1nF
50V

nostuff

P0.89V_FB_MN

R695

GCORE5_PWRGD

S

D4
D3
D2
D1

EN

R697

4

G

B

C648

200K
1%

GND

R696

150K
1%

C649

10000nF-X5R
6.3V

EC504
220uF

2.5V
AD

nostuff

1203-006106
13V

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

10K
1%

R691

1

9

PVDD_2

R675

R674

R676

11.8K
1%

G_GCORE

FB

7

KBC3_PWRON_D

24.3K
1%

IGFXVR_COMP_RC_MN

G_GCORE

VCCP5_PWRGD

R140

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
C139

C122

C

C121

0.22nF
50V

10IGFXVR_COMP_MN

D

3

1

2

D

D

Load Switch Control (P5.0V)

KBC3_PWRON_RCQ1_MN

D

R745

Q530
RHU002N06

1

10K
1%

C718

1 2 5 6

4
S

20K
1%

2200nF-X5R
10V

D

470K
1%

R704

KBC3_PWRON

C809

EMI Request (10/30)

G

10K
1%

140-C4

S

VCCP5_PWRGD

KBC3_PWRON_D

0.1nF
50V

G

R682

10K
1%

1

3R720
10K

S

Q515
RHU002N06
2 60V

VDC

R141

C636

4700nF-X5R

6.3V

C635
100nF
10V

VDC_RCQZD_P12.0V_ALW_MN

30K
1%

C124
1nF

50V

3

1

3

S

2

1

100nF
10V

S

2

C653

4700nF-X5R
6.3V

KBC3_PWRON_RRQ3_RQQ_RCCQQ_MN

U514
RHU002N06

C655

10nF
25V

C

C656
2.2nF
50V

nostuff

B

2

R153

Q8
MMBT3904

10

nostuff

40V

C123

4700nF-X5R

25V

P5.0V_ALW

3

C654

P12.0V_ALW

C125

4700nF-X5R
25V

nostuff

ZD1
BZX84C12L

A

D

3

P12V_ALW

P5.0V_AUX

SWITCHVR_P5.0V_ALW_RRCQ_P5.0V_AUX_MN

1%

SWITCHVR_KBC3_SUSPWR_RCQ_P5.0V_AUX_MN

1

D

G

G

KBC3_PWRON_RRQ3_MN

1

D

KBC3_SUSPWR

10K
1%

10K
1%

G

4

nostuff

3
12V

10nF
16V

100K

1%
SWITCHVR_P5.0V_ALW_RRQ_P5.0V_AUX_MN

3

S

4

-20V

C682

R719

nostuff

R728

S

1 2 5 6

Q526
AO6409L

R729

Q527
RHU002N06

D1
D2
D3
D4

D1 D2 D3 D4

P5.0V_ALW

100K
1%

KBC3_PWRON_RRQ3_RQQ_MN

2

Sleep’n Charger
CHARGEABLE USB

B

C658

2200nF-X5R
10V

Q520
RHU002N06

KBC3_PWRON_RCQ2_MN

2

KBC3_PWRON_RCQ2_RRQ_RCQ_MN

3

Q518
AO6402AL
1
2
5
6

R700

R701

10V

KBC3_PWRON_RCQ2_RRQ_MN

40-A4

S

R702

P1.8V

A

P5.0V_AUX

R721

0

R722

0

SAMSUNG
ELECTRONICS

NON_CHGUSB
NON_CHGUSB

4

3

2

1

8-40

KBC3_PWRON

100K
1%

INSTPAR

KBC3_PWRON_RCQ1_RRQ_RCQ_MN

3

G

R703

SHORT505

R746

C659
100nF

G

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

C

3

INSTPAR

KBC3_PWRON_RCQ1_RRQ_MN

10K
1%

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
SHORT504

10V

100K
1%

Q519
AO6409L

SHORT506

INSTPAR

P1.8V_AUX

P3.3V

D1 D2 D3 D4

D1 D2 D3 D4

1 2 5 6

4
3

S

R723

P3.3V_AUX

G

C683
100nF

P12.0V_ALW

P5.0V_AUD

P5.0V

Q525
AO6409L

G

P5.0V_ALW

Load Switch Control (P1.8V)

Load Switch Control (P3.3V)

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-41
4

2

3

SAMSUNG PROPRIETARY

1

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

PWR Discharger

D

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R683

R151

100K
1%

C

R149

10

10

10

nostuff

nostuff

nostuff

P3.3V_RQ_MN

P5.0V_RQ_MN

P1.05V

R680

R150

10

KBC3_PWRON_RQ_RQQQQQ_MN

P1.5V

P1.5V_RQ_MN

P1.05V_RQ_MN

D

KBC3_PWRON

B

R684

3

KBC3_PWRON_RQ_MN

10K
1%

G

1

S

Q516
RHU002N06

D

G

1

2

3

S

2

Q11
RHU002N06

D

3

G

1

nostuff

S

D

Q10
RHU002N06

3

G

1

2

nostuff

S

2

Q514
RHU002N06

D

3

S

2

G

1

nostuff

Q9
RHU002N06

B

A

A

SAMSUNG
ELECTRONICS

4

3

2

1

N220, N210, N150, NB30

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P3.3V

P1.8V

P5.0V_STB

C

D

3

2

1

D

D

g
n
l
u
a
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KBC3_PWRON

1
2
3
4
5
6
7
8
9
10

TP23462
1
2
3
4
5
6
7
8
9
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C

B

A

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SAMSUNG
ELECTRONICS

4

3

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8-42

8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

P5.0V

P3.3V

P1.8V

P1.5V

N220, N210, N150, NB30

4

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

8-43
4

M/B
+
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KBD

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C796

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50V

C797

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C758

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(Bottom side)

MT11
MT4
MT13
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MT12
RMNT-25-70-1P RMNT-25-70-1P RMNT-25-70-1P RMNT-25-70-1P RMNT-25-70-1P

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BOTTOM SIDE EMI CLIP

PCB REVISION CONTROL ( ICT )
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8. Block Diagram and Schematic

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization -

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2

3

SAMSUNG PROPRIETARY

THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO’S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

www.s-manuals.com



---

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Title                           : Samsung Bloomington - Schematics. www.s-manuals.com.
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