Samsung SGH E250D Service Manual. Www.s Manuals.com. Manual R1.0

User Manual: Phone Samsung SGH-E250D - Service manuals and Schematics, Disassembly / Assembly. Free.

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GSM TELEPHONE
SGH-E250D

GSM TELEPHONE

CONTENTS
1.

Safety Precautions

2.

Specification

3.

Product Function

4.

Array course control

5.

Exploded View and Parts List

6.

MAIN Electrical Parts List

7.

Block Diagrams

8.

PCB Diagrams

9.

Flow Chart of Troubleshooting

10.

Reference data

11.

Disassembly and Assembly
Instructions

GSPN (Global Service Partner Network)
Country
North America
Latin America
CIS
Europe
China
Asia
Mideast & Africa

This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.

Web Site
service.samsungportal.com
latin.samsungportal.com
cis.samsungportal.com
europe.samsungportal.com
china.samsungportal.com
asia.samsungportal.com
mea.samsungportal.com

ⓒ

Samsung Electronics Co.,Ltd.
2007. 9. Rev.1.0

2. Specification
2-1. GSM General Specification
G SM 90 0
Ph ase 1

EG SM 9 00
Ph ase 2

DCS1800
Ph ase 1

PCS1900

Fr eq.
Band[MHz]
Uplin k/Down link

8 90~915
9 35~960

8 80~915
9 25~960

17 10~178 5
18 05~188 0

185 0~1910
193 0~1990

ARF CN ra nge

1~124

0~124 &
97 5~1023

5 12~885

51 2~810

T x/Rx spacing

45MHz

45MHz

95MHz

8 0MHz

Mo d. Bit r ate/
Bit Period

270 .833kb ps
3 .692u s

270 .833kb ps
3 .692u s

270 .833kb ps
3 .692u s

270 .833kb ps
3. 692us

Ti me Slo t
Pe rio d/Fr am e
Per iod

5 76.9u s
4. 615ms

5 76.9u s
4. 615ms

5 76.9u s
4. 615ms

57 6.9us
4.6 15ms

Modula tion

0 .3G M SK

0 .3G MSK

0 .3G M SK

0. 3G MSK

MS Power

33d Bm~5dBm

33d Bm~5dBm

30d Bm~0dBm

30d Bm~0dBm

Powe r Class

5pcl ~ 19pcl

5pcl ~ 19pcl

0pcl ~ 15pcl

0pcl ~ 15pcl

Se nsitivity

-10 2dBm

-10 2dBm

-10 0dBm

-100 dBm

TDMA Mu x

8

8

8

8

Cell Radiu s

35Km

35Km

2Km

-

2-1

Speclflcation

2-2. GSM Tx Power Class
TX Power
control level

GSM900

TX Power
control level

DCS1800

TX Power
control level

PCS1800

5

33±2 dBm

0

30±3 dBm

0

30±3 dBm

6

31±2 dBm

1

28±3 dBm

1

28±3 dBm

7

29±2 dBm

2

26±3 dBm

2

26±3 dBm

8

27±2 dBm

3

24±3 dBm

3

24±3 dBm

9

25±2 dBm

4

22±3 dBm

4

22±3 dBm

10

23±2 dBm

5

20±3 dBm

5

20±3 dBm

11

21±2 dBm

6

18±3 dBm

6

18±3 dBm

12

19±2 dBm

7

16±3 dBm

7

16±3 dBm

13

17±2 dBm

8

14±3 dBm

8

14±3 dBm

14

15±2 dBm

9

12±4 dBm

9

12±4 dBm

15

13±2 dBm

10

10±4 dBm

10

10±4 dBm

16

11±3 dBm

11

8±4dBm

11

8±4dBm

17

9±3dBm

12

6±4 dBm

12

6±4 dBm

18

7±3 dBm

13

4±4 dBm

13

4±4 dBm

19

5±3 dBm

14

2±5 dBm

14

2±5 dBm

15

0±5 dBm

15

0±5 dBm

2-2

5. Exploded View and Parts List
5-1. Cellular phone Exploded View

QFU01

QKP01

QME01

QKP02

QMW01

QBR04

QCA01
QSP01
QMO01
QLC01

QMI03
QME02

QMI01

QME11

QMP01

QAN02

QME03

QFR01

QFL01

QVO01
QCR03

QRE01
QCR03
QSC13

QBA01

QCW01
QCA05
QHI01

QCR17
QSC05

QRF01

QFR02

QIF01

QSC06
QBA00

QSD01

5-1

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Exploded View and Parts List

5-2. Cellular phone Parts List
Design LOC

Description

SEC CODE

QAN02

INTENNA-SGH E250

GH42-00985A

QBA00

ASSY CASE-BATTERY

GH98-03586E

QBA01

INNER BATTERY PACK-750MAH,BLK,

GH43-02483A

QBR04

ASSY BRACKET-KEYPAD

GH98-05531A

QCA01

CAMERA MODULE

GH59-03619A

QCA05

PMO-DECO MIRROR

GH72-34243A

QCR03

SCREW-MACHINE

6001-001811

QCR03

SCREW-MACHINE

6001-001811

QCR17

SCREW-MACHINE

6001-001460

QCW01

PCT-COVER WINDOW CAMERA

GH72-34247E

QFL01

ASSY CASE-SLIDE LOWER

GH98-02260E

QFR01

ASSY CASE-F/C+S/L

GH98-02261E

QFR02

ASSY CASE-FRONT

GH98-03548E

QFU01

ASSY CASE-SLIDE UPPER

GH98-02259E

QHI01

ASSY HINGE-PUSH ROD

GH98-03165A

QIF01

PMO-COVER IF

GH72-34244E

QKP01

ASSY KEYPAD-MAIN(EU/PNK)

GH98-02264E

QKP02

ASSY KEYPAD-SUB(EU/PNK)

GH98-02263E

QLC01

ELA ETC-E250LCD MODULE

GH96-02628B

QME01

KEY FPCB-MAIN KEY PBA

GH59-04760A

QME02

DOME SHEET-10KEY(SUB)

GH59-05007A

QME03

MEA-SLIDER FPCB KIT(E250D)

GH97-08172A

QME11

ASSY ETC-LCD SUB PBA

GH59-04854A

QMI01

MICROPHONE-ASSY

GH30-00309A

QMI03

RMO-RUBBER MIC

GH73-08308A

QMO01

MOTOR DC-SGHZV30

GH31-00177A

QMP01

PBA MAIN-SGHE250D

GH92-03956A

QMW01

ASSY COVER-WINDOW MAIN

GH98-02619E

QRE01

ASSY CASE-REAR

GH98-05532E

QRF01

MPR-TAPE RF SHEET

GH74-27453E

QSC05

RMO-RUBBER SCREW SLIDE L

GH73-08309E

QSC06

RMO-RUBBER SCREW SLIDE R

GH73-08310E

QSC13

RMO-RUBBER SCREW REAR

GH73-08311E

QSD01

PMO-COVER M SD

GH72-34245E

QSP01

SPEAKER

3001-002213

QVO01

ASSY KEY-VOLUME

GH98-03940E

5-2

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Exploded View and Parts List

Description

SEC CODE

ADAPTOR-SGHE690,SIL,EU,A_TYPE

GH44-01361B

EARPHONE-20P,EARPHONE,SIL,B-TY

GH59-03848B

LABEL(R)-WATER SOAK

GH68-09361A

RMO-RUBBER SIM

GH73-08686A

ICT SHIELD-COVER RF

GH70-02506A

MPR-INSU TAPE

GH74-27455A

MPR-INSU TAPE

GH74-27456A

MPR-TAPE LABEL

GH74-28874E

MPR-SPONGE

GH74-29496A

MPR-VINYL BOHO MAIN

GH74-30340A

MPR-VINYL BOHO SUB KEYPAD

GH74-31218A

TAPE-S-UPPER

GH74-34678A

MPR-ELEC TAPE

GH74-27495A

MPR-GASK TAPE

GH74-28782A

MPR-REMOVE TAPE LCD

GH74-13804A

MPR-TAPE

GH74-27509A

MPR-ELEC TAPE

GH74-27457A

TAPE GASK

GH74-18462A

PMO CASE-REAR

GH72-43214E

LABEL(R)-WATER SOAK

GH68-09361A

BAG PE

6902-000634

LABEL(P)-UNIT SEAL

GH68-00518B

LABEL(P)-OPEN MP3

GH68-11246A

LABEL(R)-MAIN(FRAN)

GH68-12733D

BOX-UNIT(EU)

GH69-04558A

CUSHION-CASE(EU)

GH69-04565A

MANUAL USERS-XEF FRENCH

GH68-12418A

5-3

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11. Disassembly and Assembly Instructions
11-1. Disassembly Instructions
1

1) Remove the RF Sheet,SCREW Cover of rear

2

2) Unscrew 5 screws

1) Be careful of body damage and scretch

1) Remove the volumn Key
2) Disassemble the connector

1) Be careful of body damage and scretch

2) Be careful of transforming the rear cover

3

1) Open the T-Flash, power cover

4

1) Separate board from the set

2) Lift main board
3) Detach the LCD Connector after slide down

1)

Be careful of damaging F-PCB

1) Be careful of damaging components

11-1

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Disassembly and Assembly Instructions

5

1) Remove the EMI tape

6

1) Detach the Volumn Key Fpcb
2) Disassemble key-can from the point of
the picture

1) Be careful of damaging FPCB detaching Volumn Key
Fpcb
2) Be careful of body damage and scretch

7

1) Disassemble the key-pad

8

1) Unscrew 2 screws

1) Be careful of body damage and scretch

11-2

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Disassembly and Assembly Instructions

9

1) Unscrew 4 screws

10

2) Disassemble the upper with a couple of

1) Match the hole of LOWER and FRONT
holding up the slide
2) Draw out the FPCB from the hole

thumbs pressing the point of picture

1) Be careful of body damage and scretch

11

1) Be careful of cutting wire
2) Be careful of body damage and scretch

1) Remove the tape covering FPCB Connector

12

2) Disassemble FPCB after lifting Connector

1) Disassemble Speaker, Motor
2) Remove the tape on the Camera Connector
3) Disassemble the Camera taking down the
top of the camera

1) Be careful of body damage and scretch

1) Be careful of body damage and scretch

2) Be careful of damaging F-PCB

2) Be careful of damaging camera F-PCB

11-3

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Disassembly and Assembly Instructions

13

15

1) Disassemble from upper after lifting

1) Disassemble Sub Key Pad

lightly the upside of the Sub PBA
2) Disassemble SPK, MOT, CAMERA

1) Be careful of body damage and scretch
2) Be careful of sticking between two sides tape and
LCD

11-4

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Disassembly and Assembly Instructions

11-2. Assembly Instructions

1

1) Joint the Sub Key Pad

2

1) Assemble Sub PBA inserting the bottom of
the board
2) Assemble CAMERA, SPK, MOT after
inserting camera FPCB

1) Be careful of damaging CAMERA FPCB

3

1) Insert FPCB(CON TO CON)

4

2) Attach conserving TAPE

1) Be careful of body damage and scretch
2) Be careful of damaging F-PCB

1) Match the hole pulling down lightly the
SLIDE ASSY like picture
2) Insert FPCB

1) Be careful of damaging F-PCB

11-5

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Disassembly and Assembly Instructions

7

1) Assemble SLIDE ASSY part

8

1) Screw down 4 screws

2) Assemble from the bottom side

1) Be careful of body damage and scretch

7

1) Be careful of body damage and scretch

1) Insert both screw caps in each

8

1) Assemble the key pad in FRONT

direction

1) Be careful of body damage and scretch

1) Check up the fitting between key pad and REAR

11-6

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Disassembly and Assembly Instructions

9

1) Assemble the key can

10

1) Attach the EMI tape

2) Check up the attaching FPCB in Volumn
Key side

1) Be careful of damaging F-PCB

11

1) Check up whether tape color is same with SET color
or not

1) Assemble the FPCB with main board

12

1) Open the T-Flash, Power Cover
2) Assemble the main board

1) Be careful of damaging BGA components

1) Be careful of body damage and scretch

11-7

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Disassembly and Assembly Instructions

13

1) Insert the Volumn Key

14

2) Assemble the Key Connector

1) Be careful of damaging BGA components

1) Screw down 5screws
2) Attach RF Sheet,SCREW Cover of rear

1) Be careful of body damage and scretch

11-8

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9. Flow Chart of Troubleshooting
9-1. Power On
' Power On ' does not work
Yes

No

Check the Battery Voltage

Change the Battery

is more than 3.4V

Yes

No
Check the PMU related to VINT

C420(VISA) = 2.7V?

Yes

No

Check the Clock at

Resolder OSC400

C416=32KHZ

Yes

No

C400(VDD_IO_LOW_1.8V) &
C405(VDD_IO_HIGH_2.9V) =
"H"?

Check the related circuit

Yes

No

L400(VDD_GSM_CORE_1.2V)

Check the VDD_GSM_CORE_1.2V
circuit

= 1.8V?

Yes

No

Check for the clock at C110

Check the clock generation circuit
(related to U106)

= 26MHz

Yes

Check the initial operation

Yes
END

9-1

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Flow Chart of Troubleshooting

9-2

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Flow Chart of Troubleshooting

9-2. Initial

Initial Failure
Yes

No

UCP200 pin C11 (RSTON) ="H"?

Check the circuit related to reset

Yes

No

UCP200 pin F1
(RSTEXTn) ="H"?

change UCP200

OK?

Yes
Check the 16bit data signal
& memory CE
Yes
END

9-3

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Flow Chart of Troubleshooting

9-4

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Flow Chart of Troubleshooting

9-3. Charging Part

Abnormal charging part
Yes

No

Check the U403 pin 38
> 4.9V

Check the circuit related to

V_EXT_CHARGE

Yes

No

U403 pin 34(AUX_ON)
= "L"?

Check the circuit related to

AUX_ON signal

Yes

No

Check the U403 pin 46

Resolder or replace U403

≒ 1.4V

Yes
END

9-5

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Flow Chart of Troubleshooting

9-6

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Flow Chart of Troubleshooting

9-4. Sim Part

Phone can't access SIM Card

Yes

No
SIM400 pin 4,5 = "H"?

Resolder or replace U403

Yes

After Power ON,

No

Check SIMCLK Signal on

Check the Clock

pin3 of SIM400 in a few second

Yes

No
After SIM card insert,
Replace PBA

SIM400 pin 2 = "H(SIMRST)"?

Yes

Check the SIM Card

Yes

END

9-7

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Flow Chart of Troubleshooting

9-8

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Flow Chart of Troubleshooting

9-5. Microphone Part

Microphone does not work

Yes
No
Check the connection

Resolder MIC

from MIC

Yes

Check the circuit

No
Resolder the C514, C520, R516, R519

from UCP200 to MIC

Yes

Check F500 PIN 8
= ' H' ?

No

Check the JACK_IN signal

Yes

Check the MIC

No

Replace the MIC

Yes
END

9-9

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Flow Chart of Troubleshooting

9-10

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Flow Chart of Troubleshooting

9-6. Speaker Part(Melody)

Speaker does not work
Yes
No
U500 pin 7 = 2.9V?

Resolder or replace U500

Yes

No

Check the Clock signal at
Pin 3 of U106 (26MHz)

Check the clock generation circuit
(related to U106 and U103)

Yes
No

U500 pin 15,17 ≒ 1.8V?

Resolder U500

(When U500 operate)

Yes
No

HDC600 pin 2,3 ≒ 1.8V?

Resolder HDC600

(When U500 operate)

Yes
No
Change the Speaker

Is Speaker working?

Yes

END

9-11

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Flow Chart of Troubleshooting

9-12

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Flow Chart of Troubleshooting

9-7. Key Data Input

Check Initial Operation

Yes

When one of the keys is

No
Check the Dome sheet & Key Pad

pushed,
is it displayed on LCD?

Yes

When one of the keys is

No
Replace the PBA

pushed,
KBIO signal is OK?

Yes

END

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Flow Chart of Troubleshooting

9-8. Receiver Part

Receiver does not work
Yes
No
Resolder UCP200 or Change PBA

Is Receiver working?

Yes
No
Replace the Receiver

Is Receiver working?

Yes
END

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Flow Chart of Troubleshooting

9-9. Back Light (for Color Main LCD)

Backlight does not work
Yes

No
Is LCD Contrast set on high

Set LCD Contrast on high level

level in the Menu?

Yes

No
Resolder HDC600 or change PBA

HDC600 PIN 23 = H ?

Yes

END

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Flow Chart of Troubleshooting

9-10. Key Back Light

Main Key LED does not work
Yes
No
Check the U401, U404 related to
"VDD_KEY"

U401, U404 pin6 = "H"?

Yes

U401, U404 pin3 = 3.3V ?

Change U401, U404

END

9-16

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Flow Chart of Troubleshooting

9-17

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Flow Chart of Troubleshooting

9-11. Camera part

"Camera" function does not work
Yes

No

Check the Camera

Reconnect the camera module

connector on LCD module

Yes
No
HDC600 Pin21 = H?

Resolder HDC600 or change PBA

Yes
No
C310 = 26MHz

Check U106(pin8) related to
26MHz and U603

Yes

Is there another problem?

Yes

Replace the camera
module

END

9-18

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Flow Chart of Troubleshooting

9-19

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Flow Chart of Troubleshooting

9-12. GSM Receiver

RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm

Yes
No

F100 Pin13
>= -65dBm

Resolder CN101, C103, L102

Yes
No

F100 1,2
>= -68dBm

No

Check F100
pin9,pin11 = L

Check ANT Switch
control circuit

Yes
Resolder F100

Yes
No
U106
pin 24 >= -70dBm
pin 25 >= -70dBm

Resolder C108, C109, L105

Yes

U106 pin 4,5,6,7
>= 0.2Vp-p

No

No
U106 pin 16,17,29
32,36>=2.8V

Yes

Check & Resolder
C117,C123,C126
RF26MHz, RF PSU Part

Yes
Resolder U106

Check UCP200

END

9-20

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Flow Chart of Troubleshooting

9-13. GSM Transmitter

TX ON (5Level)

Yes
No

F100 Pin13
>= 30dBm

Resolder CN101,C103,L102

Yes
No

F100 pin10
>= 30dBm

Check F100
pin11 = H (2.6V),
Pin9 = L

No
Check ANT Switch
control circuit

Yes

Yes

Change or Resolder F100
No

U103 pin12
>= 30dBm

Resolder or Change L101

Yes
No

U103 pin7
<= -4dBm

Check U103pin 2,3,
5,6,8+Vbatt
pin4,OK?

Yes
Resolder or Change U103

No

Check +VBAT or PAM
control signal

Yes
Yes
U106 pin 4,5,6,7
>= 0.2Vp-p

U106 pin 16,17,29,
32,36
>=2.8Vpin10>=1.8

No

Check
U106,C117,C126,L123

Yes
Yes
Check UCP200

END

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Resolder U106

Flow Chart of Troubleshooting

9-14. DCS Receiver

RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm

Yes
No

F100 Pin13
>= -65dBm

Resolder CN101,C103,L102

Yes
No

F100 3,4
>= -68dBm

Check F100
pin9,pin11 = L

No

Check ANT Switch
control circuit

Yes

Yes

Resolder F100

No
U106
pin 35 >= -70dBm
pin 36 >= -70dBm

Resolder C104,C122,L104

Yes

U106 pin 4,5,6,7
>= 0.2Vp-p

No

U106 pin
16,17,29,32,36>=2.8V
pin10>=1.8V

Yes

No

Check & Resolder
U102,C117,C123,C126
RF26MHz, RF PSU Part

Yes
Resolder U106

Check UCP200

END

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Flow Chart of Troubleshooting

9-15. DCS Transmitter

TX ON (5Level)

Yes
No

F100 Pin13
>= 25dBm

Resolder RFS100,C101

Yes
No

F100 pin8
>= 25dBm

Check F100
pin9= H (2.6V),
pin 11 = L

No
Check ANT Switch
control circuit

Yes

Yes

Change or Resolder F100
No

U103 pin18
>= 25dBm

Resolder or Change U103

Yes
No

U103 pin1
<= -4dBm

Check
U103pin2,3,5,6,8+
Vbatt pin4,OK?

No
Resolder or Change U103

Yes

Check +VBAT or PAM
control signal

Yes
No
U106 pin 4,5,6,7
>= 0.2Vp-p

U106 pin 16,17,29,
32,36
>=2.8Vpin10>=1.8

No

Check & Resolder
U106,C117,L123,C126

Yes
Yes
Check UCP200

END

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Resolder U106

Flow Chart of Troubleshooting

9-16. PCS Receiver

RX ON
RF input : CH center freq : +67.7kHz
Amp : -50dBm

Yes
No

F100 Pin13
>= -65dBm

Resolder CN101,C103,L102

Yes
No

F100 5,6
>= -68dBm

Check F100
pin10,pin12 = L

Yes

No

Check ANT Switch
control circuit

Yes
Resolder F100

No
U106
pin 20 >= -70dBm
pin 21 >= -70dBm

Resolder C112, C120, L105

Yes

U106 pin 4,5,6,7
>= 0.2Vp-p

No

U106 pin
16,17,29,32,36
>=2.8Vpin10>=1.8

Yes

No
Check & Resolder
U102,C117,C123,C126

Yes
Resolder U106

Check UCP200

END

9-24

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Flow Chart of Troubleshooting

9-17. PCS Transmitter

TX ON (5Level)

Yes
No

F100 Pin13
>= 25dBm

Resolder RFS100,C101

Yes
No

F100 pin8
>= 25dBm

Check F100
pin9= H (2.6V),
pin 11 = L

No
Check ANT Switch
control circuit

Yes

Yes

Change or Resolder F100
No

U103 pin18
>= 25dBm

Resolder or Change U103

Yes
No

U103 pin1
<= -4dBm

Check
U103pin2,3,5,6,8+
Vbatt pin4,OK?

No
Resolder or Change U103

Yes

Check +VBAT or PAM
control signal

Yes
No
U106 pin 4,5,6,7
>= 0.2Vp-p

U106 pin 16,17,29,
32,36
>=2.8Vpin10>=1.8

No

Check & Resolder
U106,C117,L123,C126

Yes
Yes
Check UCP200

END

9-25

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Resolder U106

Flow Chart of Troubleshooting

9-26

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

4. Array course control
Software Adjustments

Test Jig (GH80-03306A)

Test Cable (GH39-00499A)

Serial Cable(CSA LL64151-A)

Power Supply Cable

4-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

Software Downloading
4-1. Pre-requsite for Downloading
• Downloader Program(OneNAND Downloder V1.0 Lite For PNX5230.exe)
• E250 Mobile Phone
• Data Cable
• Binary file, TFS file
4-2. S/W Downloader Program
■ Load the binary download program by executing the
“OneNAND Downloder V1.0 Lite For PNX5230.exe”

1. Select the connected serial port and the rate of speed
2. Select the check box, the mode you want to download.
- if the binary file wanted, check only 'BIN'
- if the tfs file wanted, check only 'TFS'
- if all the files wanted, check 'BIN+TFS'

1

2

4-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Array course control

3. Select the file(s) what you want to download

4-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

VBUS

VBAT

+VCC_SYN

VDD_RX_TX

LD O
(R 1114D 331D )

V B A T 3.7V

RF
S /W

R F B lock

7-1. Base Band Block Diagram

V D D _U S B

VDD_IO_LOW

7. Block Diagrams

USBDM / USBDP

(P C F50611H N /
N 1)

PHONE
POW ER

U S B Filter
(PAC U S BU 3)

SIM
S ocket

S IM IO
S IM C LK

S IM R S T

7-1

(P N X 5230-1)

M o dem

V BAT

BT _IN T

VIB_EN

VBA T

LED _O N

VBA T

S D _C LK

C A M _E N

This Document can not be used without Samsung's authorization

VBAT

EAR2

EAR1

H FR _N

H F R _P

E A R M IC _N

E A R M IC _P

M IC_N

M IC _P

H all IC

TFLA S H

C

A ud io
APM

M

V D D _B T

S P K _P
SPK _N

C

E A R M IC

M IC

E arp h o n e

SP K

B lu etooth
(BG B 204-1)

E A R S P K _R
E A R S P K _C O M
E A R S P K _L

M OTO R

SU B

C

KEYPAD

(H E D 52A 1U 11)

M A IN

LD O
(B H 33PB 1W H F V)

D C L / FS C

LC D
(2.0'’Q Q V G A )

(LM 4946 S Q )

V D D _VIB

VDD _KEY

DU / DD

VB AT

LD O
(R 1114D 331D )

V _C AM 18
V _C AM 28

+V D D _IO _ H IG H

LD O
(X C 6401FF38)

KE Y _C O L((0:4)

KE Y _R O W ((0:4)

SLID E

(TC 7SH 04FU )

V D DIN_S
D TER
V ER

SD _D A TA / S D _C M D
SD _D ETEC T

LD O
(XC 6401F F20 )

M C LK / S _ R ST

C AM _D (0 :7) / VSY N C / H SYN C / P C LK

LC D _R S T

128M b

U tR A M

oneN AN D
256 M b

256M b

NOR

(K A P29V G 00M -D 444)

PHONE MEMORY

LD _D (0:15 ) / L_R S / LC D _C S / LC D _W R

+ V D D _IO _LO W

+ V D D _IO _H IG H

C S1n _R AM / O En / W En

H A (0:1) ,H A (18:22)

H A (2:17) / H D (0:15)

C S 4n_N A N D / O En / W E n

H A (0:1)

H A(2 :15) / H D (0 :15)

C S 0n_FLA SH / O E n / W En

H A (0:1),H A (18:23)

H A (2:17),H A (24) / H D (0:15)

R S TEX Tn

C LKBU R S T

+VD D _IO _ LO W

SAMSUNG Proprietary-Contents may change without notice

USBCN

USBDM / USBDP

A V D D _H F A

AVDD

+ V D D _G S M _C O R E

+ V D D _IO _H IG H

V D D _S D
S IM _V C C
VD D _IO _LO W

M IC _B IA S
V D D _S LE E P

R F _C LK

R X _TX _Q P / R X _TX _Q N
R F _D A TA / R F _E N

R X _T X _IP / R X _T X _IN

SIM_VCC

7-2. RF Block Diagram

Block Diagrams

This Document can not be used without Samsung's authorization

SAMSUNG Proprietary-Contents may change without notice

7-2

8. PCB Diagrams
- Top

8-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

PCB Diagrams

- Bottom

8-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

6. MAIN Electrical Parts List
Design LOC

Description

SEC Code

STATUS

ANT100
BAT400
BTC600
C100
C101
C102
C103
C104
C105
C106
C107
C108
C109
C110
C111
C112
C113
C114
C115
C116
C117
C118
C119
C120
C122
C123
C125
C126
C127
C128
C129
C130
C131
C132
C134
C135
C201
C202
C203
C204
C205
C206
C208
C209
C210
C211
C212
C213
C214
C215
C216
C221
C222

ANTENNA-CHIP
BATTERY-LI(2ND)
HEADER-BATTERY
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
INDUCTOR-SMD
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP

4202-001373
4302-001180
3711-006217
2203-006838
2203-005288
2203-006838
2203-006838
2203-005050
2203-000278
2203-000233
2203-000233
2203-005288
2203-005288
2203-000278
2203-006842
2703-001749
2203-000278
2203-000233
2203-000233
2203-000233
2203-000278
2203-005482
2203-000812
2203-005288
2203-005050
2203-002709
2203-000233
2203-002709
2203-005482
2203-000233
2203-000233
2203-006048
2203-006824
2203-001239
2203-005482
2203-002709
2203-005482
2203-000812
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-005482
2203-006562
2203-000254
2203-005482
2203-000812
2203-005482
2203-000425
2203-006208
2203-005482
2203-000425

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

6-1

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

Design LOC

Description

SEC Code

STATUS

C301
C302
C303
C304
C305
C306
C307
C308
C309
C310
C311
C312
C400
C401
C402
C403
C404
C405
C406
C407
C408
C409
C410
C411
C412
C413
C414
C415
C416
C417
C420
C421
C422
C424
C425
C426
C427
C428
C429
C430
C431
C432
C501
C502
C503
C504
C505
C506
C507
C508
C509
C511
C512

C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP

2203-006423
2203-006423
2203-006562
2203-006208
2203-006423
2203-006562
2203-005482
2203-006562
2203-005482
2203-000233
2203-000233
2203-005482
2203-006257
2203-006562
2203-006562
2203-006562
2203-006208
2203-006257
2203-006562
2203-006257
2203-006257
2203-006208
2203-006208
2203-006257
2203-005736
2203-006257
2203-006562
2203-006562
2203-000425
2203-000425
2203-006257
2203-006324
2203-006423
2203-006562
2203-006361
2203-006361
2203-006208
2203-005482
2203-006562
2203-006562
2203-006901
2203-006825
2203-000254
2203-005483
2203-006260
2203-006562
2203-006260
2203-006562
2203-005444
2203-000386
2203-005050
2203-005395
2203-005395

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

6-2

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

Design LOC

Description

SEC Code

STATUS

C513
C514
C515
C516
C517
C518
C519
C520
C521
C522
C531
C532
C533
C534
C535
C536
C537
C538
C539
C540
C541
C542
C543
C544
C545
C546
C547
C548
C549
C550
C551
C602
C603
C604
C605
C606
C612
C613
C614
C615
CD600
CN101
F100
F500
F602
F603
F604
HDC600
HEA300
IFC500
L100
L101
L102

C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
R-CHIP
CONNECTOR-CARD EDGE
CONNECTOR-COAXIAL
DUPLEXER-FEM
FILTER-EMI/ESD
FILTER-EMI/ESD
FILTER-EMI/ESD
FILTER-EMI/ESD
HEADER-BOARD TO BOARD
HEADER-BOARD TO BOARD
SOCKET-INTERFACE
R-CHIP
INDUCTOR-SMD
INDUCTOR-SMD

2203-005482
2203-005482
2203-000679
2203-000679
2203-000330
2203-000330
2203-005482
2203-005482
2203-005395
2203-005395
2203-005482
2203-000254
2203-006423
2203-006260
2203-006260
2203-006048
2203-000628
2203-000679
2203-002443
2203-000278
2203-000386
2203-000386
2203-003054
2203-000278
2203-005444
2203-000278
2203-005393
2203-001259
2203-005050
2203-005393
2203-000278
2203-002709
2203-006423
2203-000812
2203-000425
2203-006562
2203-005717
2203-005717
2203-006208
2007-000162
3709-001344
3705-001358
2911-000093
2901-001376
2901-001370
2901-001370
2901-001376
3711-005747
3711-005578
3710-002465
2007-000171
2703-002208
2703-002314

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

6-3

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

Design LOC

Description

SEC Code

STATUS

L103
L104
L105
L106
L107
L108
L110
L111
L400
L500
L501
L504
L505
L506
L507
L508
L509
OSC100
OSC400
R101
R103
R104
R105
R110
R201
R202
R204
R205
R206
R208
R209
R212
R213
R214
R215
R217
R218
R223
R228
R301
R302
R303
R304
R308
R309
R400
R401
R402
R403
R407
R408
R409
R411

INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
C-CER,CHIP
C-CER,CHIP
INDUCTOR-SMD
BEAD-SMD
INDUCTOR-SMD
BEAD-SMD
BEAD-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
CRYSTAL-SMD
CRYSTAL-SMD
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP

2703-002608
2703-002608
2703-001726
2703-002208
2203-005395
2203-002668
2703-001749
3301-001659
2703-003113
3301-001729
3301-001729
2703-001231
2703-001285
2703-001673
3301-001729
3301-001729
3301-001729
2801-004589
2801-004339
2007-000148
2007-000140
2007-000170
2007-007489
2007-000143
2007-000143
2007-000171
2007-000148
2007-000148
2007-002796
2007-000148
2007-000140
2007-000170
2007-000148
2007-000170
2007-001319
2007-001319
2007-000758
2007-000758
2007-000171
2007-000162
2007-008055
2007-007014
2007-000171
2007-001303
2007-007014
2007-007573
2007-008354
2007-001333
2007-001333
2007-009157
2007-007318
2007-008542
2007-008137

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SNA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

6-4

SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization

Main Electrical Parts List

Design LOC

Description

SEC Code

STATUS

R413
R415
R416
R418
R419
R501
R502
R503
R505
R506
R507
R508
R509
R511
R512
R513
R514
R516
R518
R519
R523
R524
R525
R529
R601
R602
R603
R604
R605
R606
R607
R608
R610
R611
R612
R613
SIM400
TA100
TA400
TA500
TA501
TA502
TA503
TA504
U101
U102
U103
U104
U106
U107
U202
U301
U302

R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
CONNECTOR-CARD EDGE
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
CRYSTAL-SMD
IC-TRANSCEIVER
IC-POWER AMP
ICT SHIELD-FRAME RF
IC-TRANSCEIVER
FILTER-LC
FILTER-EMI SMD
IC ASIC-SGHC420
IC-CMOS LOGIC

2007-007317
2007-007142
2007-000758
2007-007107
2007-007142
2007-001333
2007-007334
2007-001339
2007-007142
2007-000172
2007-002796
2007-002796
2007-000172
2007-001292
2007-001292
2007-007528
2007-001333
2007-007528
2007-007528
2007-007528
2007-000162
2007-003001
2007-000148
2007-001333
2007-008516
2007-007107
2007-000152
2007-008055
2007-009168
2007-008055
2007-009212
2007-000758
2007-000162
2007-000162
2007-000162
2007-007142
3709-001400
2404-001496
2404-001430
2404-001377
2404-001377
2404-001381
2404-001226
2404-001496
2801-004587
1205-002942
1201-002576
GH70-02505A
1205-003283
2909-001299
2901-001316
GH13-00057A
0801-002237

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

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Main Electrical Parts List

Design LOC

Description

SEC Code

STATUS

U401
U402
U403
U404
U405
U500
U501
U600
U601
U603
UCP200
UME301
VR600
ZD201
ZD301
ZD302
ZD401
ZD402
ZD500
ZD501
ZD502
ZD505
ZD506
ZD600
ZD601
ZD602
ZD603

IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POWER SUPERVISOR
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-AUDIO AMP
IC-DEMODULATOR
IC-CMOS LOGIC
IC-CMOS LOGIC
C-CER,CHIP
IC-COMM. CONTROLLER
IC-MCP
THERMISTOR-NTC
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-ZENER
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS

1203-003737
1203-003737
1203-004382
1203-003737
1203-003737
1201-002492
1204-002688
0801-003185
0801-002237
2203-000233
1205-003082
1108-000080
1404-001221
0406-001235
0406-001190
0406-001190
0403-001547
0406-001254
0406-001208
0406-001254
0406-001254
0406-001254
0406-001254
0406-001201
0406-001240
0406-001254
0406-001254

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.

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3. Product Function
Main Function
-SlimSlide Design Intenna
-VGA Camera
-Bluetooth V.2.0
-Stereo Bluetooth Headset
-Mobile Tracker & SOS Messaging
-Large 2.0" 65K Color TFT Display
-SMS/MMS/E-Mail
-WAP 2.0 / Java MIDP 2.0
-MP3, AAC, MP4, 3GPP Decoding
-Video Recording and Messaging
-GSM/GPRS Class 10
-Triple Band(GSM900/DCS,PCS)
-64 Poly
-Speaker Phone
-Voice Clarity

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Product Function

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10. Reference data
Reference Abbreviate
― AAC: Advanced Audio Coding.
― AVC : Advanced Video Coding.
― BER : Bit Error Rate
― BPSK: Binary Phase Shift Keying
― CA : Conditional Access
― CDM : Code Division Multiplexing
― C/I : Carrier to Interference
― DMB : Digital Multimedia Broadcasting
― EN : European Standard
― ES : Elementary Stream
― ETSI: European Telecommunications Standards Institute
― MPEG: Moving Picture Experts Group
― PN : Pseudo-random Noise
― PS : Pilot Symbol
― QPSK: Quadrature Phase Shift Keying
― RS : Reed-Solomon
― SI : Service Information
― TDM : Time Division Multiplexing
― TS : Transport Stream

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Reference data

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1. Safety Precautions
1-1. Repair Precaution
- Repair in Shield Box, during detailed tuning. Take specially care of tuning or test,
because specificity of cellular phone is sensitive for surrounding interference(RF noise).
- Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
- Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn
away.
- Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
- Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
- Take specially care of soldering, because Land of PCB is small and weak in heat.
- Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
- Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions

1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
- Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
- Use earthed soldering steel when you connect or disconnect ESD.
- Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by
static electricity.
- Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
- You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or a circuit board.

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www.s-manuals.com



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