Samsung SGH X495 Service Manual. Www.s Manuals.com. Manual
User Manual: Phone Samsung SGH-X495 - Service manuals and Schematics, Disassembly / Assembly. Free.
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GSM TELEPHONE SGH-X495 CONTENTS GSM TELEPHONE 1. Specification 2. Circuit Description 3. Exploded Views and Parts List 4. Electrical Parts List 5. Block Diagrams 6. PCB Diagrams 7. Flow Chart of Troubleshooting ⓒ Samsung Electronics Co.,Ltd. June. 2005 This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable Printed in Korea. International and/or domestic law. Code No.: GH68-07423A BASIC. 1. Specification 1-1. GSM General Specification GSM850 Pha s e 1 DCS 1 8 0 0 Pha s e 1 PC 1 9 0 0 Ph a se 1 F r eq . B a n d [M Hz ] Up l in k / Do w n li n k 8 2 4 ~8 4 9 8 6 9 ~8 9 4 1 7 1 0 ~1 7 8 5 1 8 0 5 ~1 8 8 0 1 8 5 0 ~1 9 1 0 1 9 3 0 ~1 9 9 0 A RF C N r a n g e 1 2 8 ~2 5 1 5 1 2 ~8 8 5 5 1 2 ~8 1 0 T x /R x s p ac in g 4 5 MH z 9 5 M Hz 8 0 M Hz Mo d . B i t r at e/ Bi t Pe r i o d 2 7 0 .8 3 3 k b p s 3 .6 9 2 u s 2 7 0 .8 3 3 k b p s 3 .6 9 2 u s 2 7 0 .8 3 3 k b p s 3 .6 9 2 u s Ti me Sl o t P er io d / F r am e P er i o d 5 7 6 .9 u s 4 . 6 1 5 ms 5 7 6 .9 u s 4 .6 1 5 m s 5 7 6 .9 u s 4 .6 1 5 ms Mo d u l a ti o n 0 . 3 GMS K 0 .3 GM SK 0 .3 G MS K M S P o we r 3 3 d Bm ~5 d B m 3 0 d Bm ~0 d B m 3 0 d B m~0 d B m Po w er C l as s 5 p cl ~ 1 9 p c l 0pcl ~ 15pcl 0pcl ~ 15pcl Se n si t iv i t y - 1 0 2 d Bm - 1 0 0 d Bm -100dBm TDM A M u x 8 8 8 C el l Ra d iu s 35Km 2 Km 2Km 1-1 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Specification 1-2. GSM TX power class TX Power control level GSM850 TX Power DCS1800 control level TX Power control level PCS1900 5 33±2 dBm 0 30±3 dBm 0 30±3 dBm 6 31±2 dBm 1 28±3 dBm 1 28±3 dBm 7 29±2 dBm 2 26±3 dBm 2 26±3 dBm 8 27±2 dBm 3 24±3 dBm 3 24±3 dBm 9 25±2 dBm 4 22±3 dBm 4 22±3 dBm 10 23±2 dBm 5 20±3 dBm 5 20±3 dBm 11 21±2 dBm 6 18±3 dBm 6 18±3 dBm 12 19±2 dBm 7 16±3 dBm 7 16±3 dBm 13 17±2 dBm 8 14±3 dBm 8 14±3 dBm 14 15±2 dBm 9 12±4 dBm 9 12±4 dBm 15 13±2 dBm 10 10±4 dBm 10 10±4 dBm 16 11±3 dBm 11 8±4dBm 11 8±4dBm 17 9±3dBm 12 6±4 dBm 12 6±4 dBm 18 7±3 dBm 13 4±4 dBm 13 4±4 dBm 19 5±3 dBm 14 2±5 dBm 14 2±5 dBm 15 0±5 dBm 15 0±5 dBm 1-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization 2. Circuit Description 2-1. SGH-X495 RF Circuit Description 2-1-1. RX PART - ASM(U100) → Switching Tx, Rx path for GSM850, DCS1800, PCS1900 by logic controlling. - ASM Control Logic (U100) → Truth Table VC1 VC2 VC3 Tx Mode (GSM850) H L L Tx Mode (DCS1800/1900) L H L Rx Mode (GSM850) L L L Rx Mode (DCS1800) L L L Rx Mode (PCS1900) L L H - FILTER To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band. - GSM FILTER (F101) → For filtering the frequency band between 869 and 894 MHz - DCS FILTER (F102) → For filtering the frequency band between 1805 and 1880 MHz. - PCS FILTER (F100) → For filtering the frequency band between 1930 and 1990 MHz. - VC-TCXO (OSC101) This module generates the 26MHz reference clock to drive the logic and RF. After division by two a reference clock of 13MHz is supplied to the other parts of the system through the pin CLKOUT. After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator. And then, the oscillator is controlled by serial data to select channel and use fast lock mode for GPRS high class operation. - Transceiver (U101) The receiver front-end which amplifies the GSM, DCS aerial signal, converts the chosen channel down to a low IF signal of 100 kHz. The first stages are symmetrical low noise amplifiers (LNAs). The LNAs are followed by an IQ down mixer. It consists of two mixers in parallel but driven by quadrature out of phase LO signals. The In phase (I) and Quadrature phase (Q) IF signals are low pass filtered to provide protection from high frequency offset interferes. The low IF I and Q signals are then fed into the channel filter. The front-end low IF I and Q outputs enter the integrated bandpass channel filter with provision for five 8 dB gain steps in front of the filter. 2-1-2. TX PART I and Q baseband signals are applied to the IQ modulator that shifts the modulation spectrum up to the transmit IF. It is designed for low harmonic distortion, low carrier leakage and high image rejection to keep the phase error as small as possible. 2-1 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Circuit Description The modulator is loaded at its IF output by an integrated low pass filter that suppress unwanted spurs prior to get into the phase detector. The clock drive is generated by division of the RFLO signal provided for the transmit offset mixer. Baseband IQ signal fed into offset PLL, this function is included inside of U101 chip. OSC100 chip generates modulator signal which power level is about 6.5dBm and fed into Power Amplifier(U102). The PA output power and power ramping are well controlled by Auto Power Control circuit. We use offset PLL below table. Modulation Spectrum 200kHz offset 30 kHz bandwidth GSM -35dBc DCS -35dBc 400kHz offset 30 kHz bandwidth GSM -66dBc DCS -65dBc 600kHz ~ 1.8MHz offset 30 kHz bandwidth GSM -75dBc DCS -68dBc 2-2. Baseband Circuit description of SGH-X495 2-2-1. PCF50601 - Power Management Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0VSIMs, while a selfresetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system complexity. I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor full control of the PCF50601 and enables system designers to maximize both standby and talk times. Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature). -Backlight Brightness Modulator The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET to modulate the intensity of a series of LED? s or to control a DC/DC converter that drives LCD backlight. This phone (SGH-X495) use PWM control to contrast the backlight brightness. - Clock Generator The Clock Generator (CG) generates all clocks for internal and external usage. The 32768 Hz crystal oscillator provides an accurate low clock frequency for the PCF50601 and other circuitry. 2-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Circuit Description 2-2-2. LCD Connector LCD is consisted of main LCD(color 65K UFB LCD) and sub LCD (B/W LCD). Chip select signals LCD_MAIN_CS and LCD_SUB_CS, can enable Each LCD. BACKLIGHT signal enables white LED of main LCD. "LCD_RESET" signal initiates the reset process of the LCD. 16-bit data lines(HD(0)~HD(15)) transfers data and commands to LCD. Data and commands use "HA(1)" signal. If this signal is low, inputs to LCD are commands. If it is high, inputs to LCD are data. The signal which informs the state of LCD is whether input or output, is required. But in this system, there is no input state from LCD. So only "HA(1)" signal is used to indicate write data or command to LCD. Power signals for LCD are "VBAT and "VDD3". "SPK_P" and "SPK_N" are used for audio speaker containing voice or melody. And "VDD_VIB" from PCF50601 enables the motor. 2-2-3. Key This is consisted of key interface pins among OM6359, KBIO(0:7). These signals compose the matrix. Result of matrix informs the key status to key interface in the OM6359. Power on/off key is separated from the matrix. So power on/off signal is connected with PCF50601 to enable PCF50601. Twelve key LEDs are use the "VDD_KEY" as supply voltage. "FLIP" informs the status of folder (open or closed) to the OM6359. This uses the hall effect IC, A321ELH-SAMSUNG. A magnet under main LCD enables A321ELH-SAMSUNG. 2-2-4. EMI ESD Filter This system uses the EMI ESD filter, EMIF09 to protect noise from IF CONNECTOR part. 2-2-5. IF connetor It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, TXD0, RXD0, RTS0, CTS0, JIG_REC, CHARGER_OK, RXD1, TXD1, AUX_MIC, AUX_SPK and GND. They connected to power supply IC, microprocessor and signal processor IC. 2-2-6. Battery Charge Management A complete constant-current/constant-voltage linear charger is used for single cell lithium-ion batteries. If TA connected to phone, "+DCVOLT" enable charger IC and supply current to battery. When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process. 2-2-7. Audio EARP_P and EARP_N from OM6359 are connected to the main speaker. MIC_P and MIC_N are connected to the main MIC. YMU788 is a synthesizer LSI for mobile phones. It is a LSI as an input/output device for sound sources, which is the mobile phones, such as MP3, AAC, etc, in addition to ringing-melodies. As a synthesis, YMU788 is equipped 32 voices with different tones. Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects. Since the play data of YMU788 are interpreted at anytime through FIFO, the length of the data(playing period) is not limited, so the device can flexibly support application such as incoming call melody music distribution service. 2-3 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Circuit Description The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones. For the purpose of enabling YMU788 to demonstrate its full capabilities, Yamaha purpose to use "SMAF:Synthetic music Mobile Application Format" as a data distribution format that is compatible with multimedia. Since the SMAF takes a structure that sets importance on the synchronization between sound and images, various contents can be written into it including incoming call melody with words that can be used for training karaoke, and commercial channel that combines texts, images and sounds, and others. The hardware sequencer of YMU788 directly interprets and plays blocks relevant to synthesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF. 2-2-8. Memory Signals in the OM6359 enable two memories. They use two volt supply voltage, VDD3 in the PCF50601 & VDD_1.9V with a LDO. This system uses Intel's memory, RD38F3050LOZTQ0. It is consisted of 128M bits flash NOR memory and 64M bits SRAM. It has 16 bit data line, HD[0~15] which is connected to OM6359. It has 26 bit address lines, HA[1~26]. NCSFLASH & NCSRAM signals are chip select. Writing process, HWR_N is low and it enables writing process to flash memory and SRAM. During reading process, HRD_N is low and it enables reading process to flash memory and SRAM. Reading or writing procedure is processed after HWR_N or HRD_N is enabled. 2-2-9. OM6359 OM6359 is consisted of ARM core and DSP core. It has 8x1Kword on-chip program/data RAM, 55 Kwords on-chip program ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted of KBS, JTAG, EMI and UART. ARM core is consisted of EMI, PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial Interface), ACC(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface. KBIO(0:7), address lines of DSP core and HD[0~15]. HA[1~26], address lines of ARM core and HD[0~15], data lines of ARM core are connected to memory, YMU788. NCSRAM, NCSFLASH in the ARM core are connected to each memory. HWR_N and HRD_N control the process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, PMU need the compatible process. KBIO[0~7] receive the status from key and RXD0/TXD0 are used for the communication using data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR). It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It receives 13MHz clock in CKI pin from external TCXO. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage. 2-2-10. TOH2600DGI4KRA(26MHz) This system uses the 26MHz TCXO, TOH2600DGI4KRA, SEM. AFC control signal from OM6359 controls frequency from 26MHz x-tal. The clock output frequency of UAA3536 is 13MHz. This clock is connected to OM6359, YMU788. 2-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization 3.Expl oded Vi ew and Parts Li st 3-1. Exploded View QFU01 QLC01 QSP01 QMO01 QFR01 QSC14 QVO01 QFL01 QKP01 QCR17 QSC01 QMP01 QMW02 QME01 QVK01 QMI01 QAN02 QRE01 QRF03 1 QCR1 QIF01 QRF01 QBA01 3-1 SAMSUNG Proprietary-Contents may change without notice Thi s Documentcan notbe used wi thoutSamsung' s authori zati on Expl oded vi ew and PartLi st 3-2. Parts List L o c a t io n N O . D e s c r ip t io n SEC CODE Q AN02 ㅤ INTENNA-SGHX495;IAPT0G DP4020HA,SGH-X GH42-00574A QBA01 ㅤ BATTERY-1000MAH,SIL,MAIN;BST471ASA,S GH43-01788A QCR11 ㅤ SCREW -MACHINE;PH,+ ,M1.7,L4,ZPC(BLK), 6001-001654 QCR17 ㅤ SCREW -MACHINE;CH,+ ,M1.7,L5,ZPC(BLK), 6001-001639 QFL01 ㅤ MEC-FO LDER LOW ER;SG H-X495,EU,-,-,-,- GH75-06454A QFR01 ㅤ MEC-FRONT COVER;SGH-X495,EU,-,-,-,-, GH75-06966B QFU01 ㅤ MEC-FO LDER UPPER;SGH-X495,T-MO BILE,- GH75-06471B Q KP01 ㅤ MEC-KEYPAD;SG H-X495,T-M OBILE,-,-,-,- GH75-06617A QLC01 ㅤ LCD-SGH-X497 MODULE;UG -12R168-C,SG H- GH07-00763A QME01 ㅤ UNIT-M ETAL DOME;SG H-X497,SSM 5017P850 GH59-02046A QMI01 ㅤ MICROPHO NE-ASSY-SGHX497;2,130~500uA, GH30-00198A QMO 01 ㅤ MO TOR DC-SG HZ130;DMJBRK20C,SGH-Z130, G H31-00154D QMP01 ㅤ PBA M AIN-SG HX495;SGH-X495,TMB,USA,PB GH92-02214A Q MW 02 ㅤ PCT-W INDO W M AIN ;SGH-X495,ACRYLIC SHE GH72-19918B QRF01 ㅤ MPR-RF SHEET;SGH-X495,PC SHEET 0.3T, GH74-14435C QSC01 ㅤ MPR-SCREW SHEET;SG H-X495,PC SHEET 0. GH74-13610B QSC14 ㅤ MPR-TAPE FRONT FPC;SG H-E330,3M 1352 GH74-08876A QSP01 ㅤ SPEAKER;0.5W ,8ohm ,89dB,800Hz,17X13m m 3001-001779 QVK01 ㅤ UNIT-VOLUM E KEY;SGH-X497,SSV5017P860 GH59-02053A QVO01 ㅤ MEC-VOLUME KEY;SG H-X495,T-M OBILE,-,- GH75-07274B QRE01 ㅤ MEC-REAR CO VER;SGH-X495,USA,-,-,-,-, GH75-06959B ㅤ Q RF03 PM O-EAR COVER;SG H-X495,PC W 91543+ELA GH72-23535B ㅤ QIF01 PM O-IF COVER;SGH-X495,PC G73797+ELAS GH72-23556B ㅤ Q MI03 RMO -RUBBER M IC REAR;SGH-X497,CR RUBB GH73-04847A 3-2 SAMSUNG Proprietary-Contents may change without notice Thi s Documentcan notbe used wi thoutSamsung' s authori zati on Expl oded vi ew and PartLi st D e s c r ip t io n SEC CODE BAG PE;LDPE,T0.05,W 120,L300,TRP,-,BAG PE;LDPE,T0.05,W 80,L140,TRP,-,-1BAG PP;PP,T0.05,W 140,L300,TRP,-,-1-P LCD-SGHX497 M AIN;UG-12R168-B,SGH-X49 LCD-SGHX497 SUB;UG-09B125-A,SGH-X497 ADAPTOR-SGHR225 TAD;TAD037JBE,SG H-R2 UNIT-AW B SIM CARD;SG H-X105,87444394, UNIT-EARPHONE;SG H-X475,AEP131SLE,-,E LABEL(R)-W ATER SOAK T_MOBILE;COMM ,-, LABEL(R)-T_MOBILE GUIDE;SGH-X475,-,M LABEL(R)-MAIN(TMB);SGH-X495,TMB,POLY MANUAL-USER;SG H-X495,TMB,ENG LISH,USA MANUAL-USER;SG H-X495,TMB,SPANISH,USA MANUAL-AG C GUIDE;SG H-X495,TM B,EN GLIS MANUAL-ACTIVATION CARD;SGH-X495,TMB, LABEL-DR;SGH-X495,-,PE,T1.5,45,11,SI LABEL-RF;SGH-X495,-,ART,T0.2,42,38,S LABEL(R)-UNIT IM EI(TM B);SG H-X495,TM B CUSHION-SGHX495(UNIT CLAM);SGH-X495, CUSHION-SGHX495(UP CLAM );SG H-X495,HI CUSHION-SGHX495(LOW CLAM);SGH-X495,H BOX(P)-SGHX495(IN/BOX_W ALL);SGH-X495 BOX(P)-SGHX495(CLAM_MASTER);SGH-X495 BOX(P)-SGHX495(PATTION );SG H-X495,SC3 PM O-BATT LOCKER;SGH-X495,PC K2261,BL PCT-W INDO W SUB;SGH-X495,ACRYIC SHEET PM O-STOPPER;SGH-X495,POLY URETHANE,W RMO -RUBBER TOP LCD A;SGH-X495,CR RUB RMO -RUBBER TOP LCD B;SGH-X495,CR RUB MPR-BOHO VIN YL SUB(S-R);SGH-X495,STA MPR-BOHO VIN YL REAR;SG H-S342i,3M 418 MPR-TAPE W INDOW SUB;SGH-X495,TESA #4 MPR-BOHO VIN YL IF;SGH-E720,#950,85X1 MPR-TAPE W INDOW MAIN;SGH-X495,3M 949 MPR-BOHO VIN YL MAIN;SGH-X495,3M 4187 MPR-BOHO VIN YL MAIN(S);SG H-X497,SP-1 MPR-BOHO VIN YL SUB;SGH-X495,ST-5555, MPR-TAPE EL;SPH-B1200,3M 851,5X3.5XT MPR-TAPE PBA EMI;SG H-X495,GOLD PU T0 MPR-BOHO VIN YL M/TMB(S);SG H-X495,STA MPR-SPONGE M OTOR;SGH-X495,SRS,D8XT0. MPR-SPONGE PBA;SGH-X495,SRS,38X64XT5 MPR-TAPE PBA A;SGH-X495,3M851,3X2XT0 MPR-BOHO VIN YL SUB;SGH-X495,ST-5555, AS-LCD PCB SVC;SG H-X497,LJ96-02137A, A/S-LCD FPCB SVC;SG H-X497,PO LYMIDE,2 PAA ETC-MAN UAL;SGH-X495,TMB,USA,MANU 6902-000296 6902-000297 6902-000377 GH07-00707A GH07-00708A GH44-00184G GH59-00943A GH59-01700A GH68-05914A GH68-06581A GH68-06971A GH68-06976A GH68-06977A GH68-06978A GH68-07399A GH68-07547A GH68-07548A GH68-07687A GH69-03058A GH69-03059A GH69-03060A GH69-03076B GH69-03130A GH69-03132A GH72-19954B GH72-19964A GH72-21517B GH73-04923A GH73-04924A GH74-03429B GH74-12905A GH74-13223A GH74-13606A GH74-13608A GH74-14431A GH74-14431B GH74-14432A GH74-14881A GH74-15484A GH74-15517B GH74-15610A GH74-15911A GH74-16066A GH74-17302A GH81-01219A GH81-01956A GH99-10352A 3-3 SAMSUNG Proprietary-Contents may change without notice Thi s Documentcan notbe used wi thoutSamsung' s authori zati on Expl oded vi ew and PartLi st 3-3. Test Jig (GH80-01909A) 3-3-1. RF Test Cable (GH39-00283A) 3-3-2. Test Cable (GH39-00217A) 3-3-3. Serial Cable 3-3-4. Power Supply Cable 3-3-5. DATA CABLE (GH39-00219A) 3-3-6. TA (GH44-00184G) 3-4 SAMSUNG Proprietary-Contents may change without notice Thi s Documentcan notbe used wi thoutSamsung' s authori zati on 4. Electrical Parts List Design LOC Description SEC CODE BAT300 BATTERY 4302-001180 C101 C-CERAMIC,CHIP 2203-000278 C102 C-CERAMIC,CHIP 2203-000812 C103 C-CERAMIC,CHIP 2203-000854 C104 C-CERAMIC,CHIP 2203-000854 C105 C-CERAMIC,CHIP 2203-000278 C106 C-CERAMIC,CHIP 2203-000278 C107 C-CERAMIC,CHIP 2203-000854 C108 C-CERAMIC,CHIP 2203-005057 C109 C-CERAMIC,CHIP 2203-005482 C110 C-CERAMIC,CHIP 2203-005057 C111 C-CERAMIC,CHIP 2203-005482 C112 C-CERAMIC,CHIP 2203-000233 C113 C-CERAMIC,CHIP 2203-000233 C114 C-CERAMIC,CHIP 2203-005482 C115 C-CERAMIC,CHIP 2203-005057 C116 C-CERAMIC,CHIP 2203-005138 C117 C-CERAMIC,CHIP 2203-001383 C118 C-CERAMIC,CHIP 2203-000359 C119 C-CERAMIC,CHIP 2203-000696 C120 C-CERAMIC,CHIP 2203-000836 C121 C-CERAMIC,CHIP 2203-001101 C122 C-CERAMIC,CHIP 2203-005482 C123 C-CERAMIC,CHIP 2203-005057 C124 C-CERAMIC,CHIP 2203-006053 C125 C-CERAMIC,CHIP 2203-000438 C126 C-CERAMIC,CHIP 2203-000233 C127 C-TA,CHIP 2404-001239 C128 C-CERAMIC,CHIP 2203-006141 C129 C-CERAMIC,CHIP 2203-000438 C130 C-CERAMIC,CHIP 2203-006190 C132 C-CERAMIC,CHIP 2203-005503 C133 C-CERAMIC,CHIP 2203-000311 C134 C-CERAMIC,CHIP 2203-000233 C135 C-CERAMIC,CHIP 2203-000254 C136 C-CERAMIC,CHIP 2203-001153 C137 C-CERAMIC,CHIP 2203-000550 4-1 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE C138 C-CERAMIC,CHIP 2203-006137 C139 C-CERAMIC,CHIP 2203-005482 C140 C-CERAMIC,CHIP 2203-000679 C141 C-CERAMIC,CHIP 2203-005482 C142 C-CERAMIC,CHIP 2203-005057 C143 C-CERAMIC,CHIP 2203-000233 C144 C-CERAMIC,CHIP 2203-000254 C145 C-CERAMIC,CHIP 2203-000438 C146 C-CERAMIC,CHIP 2203-000438 C147 C-CERAMIC,CHIP 2203-000438 C152 C-CERAMIC,CHIP 2203-000278 C153 C-CERAMIC,CHIP 2203-000278 C154 C-CERAMIC,CHIP 2203-000995 C155 C-CERAMIC,CHIP 2203-000995 C156 C-CERAMIC,CHIP 2203-000438 C157 C-CERAMIC,CHIP 2203-001239 C158 C-CERAMIC,CHIP 2203-001239 C200 C-CERAMIC,CHIP 2203-005061 C203 C-CERAMIC,CHIP 2203-005061 C204 C-CERAMIC,CHIP 2203-000254 C206 C-CERAMIC,CHIP 2203-005061 C207 C-CERAMIC,CHIP 2203-000254 C208 C-CERAMIC,CHIP 2203-000254 C210 C-CERAMIC,CHIP 2203-006423 C212 C-CERAMIC,CHIP 2203-005061 C213 C-CERAMIC,CHIP 2203-005482 C214 C-CERAMIC,CHIP 2203-000854 C215 C-CERAMIC,CHIP 2203-006423 C216 C-CERAMIC,CHIP 2203-000854 C218 C-CERAMIC,CHIP 2203-005061 C219 C-CERAMIC,CHIP 2203-005482 C220 C-CERAMIC,CHIP 2203-000254 C221 C-CERAMIC,CHIP 2203-006423 C222 C-CERAMIC,CHIP 2203-006423 C223 C-CERAMIC,CHIP 2203-005482 C224 C-CERAMIC,CHIP 2203-000438 C225 C-CERAMIC,CHIP 2203-005482 4-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE C300 C-CERAMIC,CHIP 2203-005482 C301 C-CERAMIC,CHIP 2203-006105 C302 C-CERAMIC,CHIP 2203-005482 C304 C-TA,CHIP 2404-001394 C305 C-CERAMIC,CHIP 2203-005482 C306 C-CERAMIC,CHIP 2203-005482 C307 C-TA,CHIP 2404-001374 C308 C-CERAMIC,CHIP 2203-006257 C309 C-CERAMIC,CHIP 2203-005482 C310 C-CERAMIC,CHIP 2203-006208 C311 C-TA,CHIP 2404-001225 C312 C-CERAMIC,CHIP 2203-005395 C313 C-CERAMIC,CHIP 2203-000386 C314 C-CERAMIC,CHIP 2203-005482 C315 C-CERAMIC,CHIP 2203-006257 C316 C-CERAMIC,CHIP 2203-000628 C317 C-CERAMIC,CHIP 2203-006562 C318 C-CERAMIC,CHIP 2203-000628 C319 C-CERAMIC,CHIP 2203-006562 C320 C-CERAMIC,CHIP 2203-006053 C321 C-CERAMIC,CHIP 2203-000885 C322 C-CERAMIC,CHIP 2203-006208 C323 C-CERAMIC,CHIP 2203-006324 C324 C-CERAMIC,CHIP 2203-000812 C325 C-CERAMIC,CHIP 2203-005065 C326 C-TA,CHIP 2404-001225 C327 C-TA,CHIP 2404-001225 C328 C-CERAMIC,CHIP 2203-005482 C329 C-CERAMIC,CHIP 2203-005482 C330 C-CERAMIC,CHIP 2203-005482 C332 C-CERAMIC,CHIP 2203-006257 C333 C-CERAMIC,CHIP 2203-006562 C334 C-CERAMIC,CHIP 2203-006208 C335 C-CERAMIC,CHIP 2203-006208 C336 C-CERAMIC,CHIP 2203-000679 C337 C-CERAMIC,CHIP 2203-006053 C338 C-CERAMIC,CHIP 2203-006208 4-3 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE C339 C-CERAMIC,CHIP 2203-006208 C340 C-CERAMIC,CHIP 2203-006053 C400 C-TA,CHIP 2404-001348 C401 C-CERAMIC,CHIP 2203-000995 C402 C-CERAMIC,CHIP 2203-005482 C403 C-CERAMIC,CHIP 2203-005061 C404 C-CERAMIC,CHIP 2203-006562 C406 C-CERAMIC,CHIP 2203-000278 C407 C-CERAMIC,CHIP 2203-000679 C408 C-CERAMIC,CHIP 2203-005482 C409 C-CERAMIC,CHIP 2203-005061 C410 C-CERAMIC,CHIP 2203-005736 C411 C-CERAMIC,CHIP 2203-000679 C412 C-CERAMIC,CHIP 2203-005482 C413 C-CERAMIC,CHIP 2203-000679 C415 C-CERAMIC,CHIP 2203-000489 C416 C-CERAMIC,CHIP 2203-000679 C418 C-CERAMIC,CHIP 2203-000278 C419 C-CERAMIC,CHIP 2203-006423 C420 C-CERAMIC,CHIP 2203-005736 C421 C-CERAMIC,CHIP 2203-000885 C422 C-CERAMIC,CHIP 2203-000254 C423 C-CERAMIC,CHIP 2203-001153 C424 C-CERAMIC,CHIP 2203-005483 C425 C-CERAMIC,CHIP 2203-005483 C426 C-CERAMIC,CHIP 2203-006562 C429 C-CERAMIC,CHIP 2203-000995 C430 C-CERAMIC,CHIP 2203-000995 C433 C-CERAMIC,CHIP 2203-006562 C435 C-CERAMIC,CHIP 2203-000995 C437 C-CERAMIC,CHIP 2203-006053 C438 C-CERAMIC,CHIP 2203-005482 C439 C-TA,CHIP 2404-001352 C501 C-CERAMIC,CHIP 2203-002443 C502 C-CERAMIC,CHIP 2203-005482 C503 C-CERAMIC,CHIP 2203-005482 C504 C-CERAMIC,CHIP 2203-000278 4-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE C505 C-CERAMIC,CHIP 2203-000679 C507 C-CERAMIC,CHIP 2203-000995 C508 C-CERAMIC,CHIP 2203-000278 C509 C-CERAMIC,CHIP 2203-000995 C510 C-CERAMIC,CHIP 2203-000995 C511 C-CERAMIC,CHIP 2203-000278 C513 C-CERAMIC,CHIP 2203-006562 C514 C-CERAMIC,CHIP 2203-006562 C515 C-CERAMIC,CHIP 2203-006562 CN300 CONNECTOR-CARD EDGE 3709-001355 CN502 CONNECTOR-SOCKET 3710-001611 CN503 CONNECTOR-HEADER 3711-005783 CON101 CONNECTOR-COAXIAL 3705-001358 EAR400 JACK-PHONE 3722-002067 F100 FILTER-SAW 2904-001571 F101 FILTER-SAW 2904-001580 F102 FILTER-SAW 2904-001570 HEA1 CONNECTOR-HEADER 3711-005728 L101 INDUCTOR-SMD 2703-002207 L102 INDUCTOR-SMD 2703-002199 L103 INDUCTOR-SMD 2703-002207 L104 INDUCTOR-SMD 2703-002203 L105 INDUCTOR-SMD 2703-002700 L106 INDUCTOR-SMD 2703-001726 L107 INDUCTOR-SMD 2703-002308 L108 INDUCTOR-SMD 2703-002700 L109 INDUCTOR-SMD 2703-002308 L110 INDUCTOR-SMD 2703-002308 L111 INDUCTOR-SMD 2703-002199 L112 INDUCTOR-SMD 2703-002368 L113 INDUCTOR-SMD 2703-002201 L114 INDUCTOR-SMD 2703-002368 L115 INDUCTOR-SMD 2703-002203 L116 INDUCTOR-SMD 2703-002368 L117 INDUCTOR-SMD 2703-001708 L300 CORE-FERRITE BEAD 3301-001105 L400 CORE-FERRITE BEAD 3301-001362 4-5 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE L401 CORE-FERRITE BEAD 3301-001362 L402 CORE-FERRITE BEAD 3301-001105 L403 CORE-FERRITE BEAD 3301-001105 L501 CORE-FERRITE BEAD 3301-001438 LED501 LED 0601-001790 LED502 LED 0601-001790 LED503 LED 0601-001790 LED504 LED 0601-001790 LED505 LED 0601-001790 LED506 LED 0601-001790 LED507 LED 0601-001790 LED508 LED 0601-001790 LED509 LED 0601-001790 LED510 LED 0601-001790 LED511 LED 0601-001790 LED512 LED 0601-001790 OSC100 OSCILLATOR-VCO 2806-001326 OSC101 OSCILLATOR-VCTCXO 2809-001281 Q100 TR-DIGITAL 0504-001151 R101 R-CHIP 2007-000162 R102 R-CHIP 2007-000162 R103 R-CHIP 2007-000162 R104 R-CHIP 2007-007148 R105 R-CHIP 2007-000141 R106 R-CHIP 2007-007528 R107 R-CHIP 2007-001288 R108 R-CHIP 2007-000171 R109 R-CHIP 2007-001329 R110 R-CHIP 2007-000144 R111 R-CHIP 2007-001308 R112 R-CHIP 2007-001308 R113 R-CHIP 2007-000566 R114 R-CHIP 2007-000148 R115 R-CHIP 2007-001288 R116 R-CHIP 2007-007311 R117 R-CHIP 2007-000566 R118 R-CHIP 2007-007699 4-6 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE R119 R-CHIP 2007-007699 R120 R-CHIP 2007-001308 R121 R-CHIP 2007-001308 R122 R-CHIP 2007-000171 R123 R-CHIP 2007-000171 R125 R-CHIP 2007-008672 R126 R-CHIP 2007-001308 R127 R-CHIP 2007-000142 R128 R-CHIP 2007-000148 R129 R-CHIP 2007-000138 R130 R-CHIP 2007-008213 R131 R-CHIP 2007-008213 R132 R-CHIP 2007-008213 R133 R-CHIP 2007-008213 R134 R-CHIP 2007-000140 R135 R-CHIP 2007-000140 R136 R-CHIP 2007-000171 R200 R-CHIP 2007-000174 R201 R-CHIP 2007-008055 R204 R-CHIP 2007-000162 R205 R-CHIP 2007-008055 R206 R-CHIP 2007-008055 R207 R-CHIP 2007-008055 R208 R-CHIP 2007-008052 R209 R-CHIP 2007-008516 R210 R-CHIP 2007-008055 R211 R-CHIP 2007-007107 R212 R-CHIP 2007-007142 R213 R-CHIP 2007-007001 R214 R-CHIP 2007-007142 R215 R-CHIP 2007-001284 R216 R-CHIP 2007-000148 R217 R-CHIP 2007-001284 R218 R-CHIP 2007-000162 R219 R-CHIP 2007-000162 R220 R-CHIP 2007-007107 R221 R-CHIP 2007-007001 4-7 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE R222 R-CHIP 2007-000171 R223 R-CHIP 2007-008588 R224 R-CHIP 2007-008588 R225 R-CHIP 2007-008542 R227 R-CHIP 2007-008542 R228 R-CHIP 2007-008542 R300 R-CHIP 2007-000157 R301 R-CHIP 2007-000148 R302 R-CHIP 2007-007573 R303 R-CHIP 2007-007334 R304 R-CHIP 2007-008117 R305 R-CHIP 2007-000151 R306 R-CHIP 2007-007100 R400 R-CHIP 2007-002796 R401 R-CHIP 2007-000140 R402 R-CHIP 2007-000148 R403 R-CHIP 2007-008054 R404 R-CHIP 2007-000140 R405 R-CHIP 2007-008542 R406 R-CHIP 2007-008055 R407 R-CHIP 2007-002796 R408 R-CHIP 2007-008055 R409 R-CHIP 2007-007334 R410 R-CHIP 2007-001313 R411 R-CHIP 2007-008542 R412 R-CHIP 2007-007334 R413 R-CHIP 2007-007589 R414 R-CHIP 2007-007138 R415 R-CHIP 2007-007981 R416 R-CHIP 2007-007529 R417 R-CHIP 2007-007489 R418 R-CHIP 2007-000138 R422 R-CHIP 2007-000138 R424 R-CHIP 2007-008542 R500 R-CHIP 2007-000162 R501 R-CHIP 2007-008055 R502 R-CHIP 2007-008531 4-8 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE R503 R-CHIP 2007-008531 R504 R-CHIP 2007-008531 R505 R-CHIP 2007-008531 R506 R-CHIP 2007-008531 R507 R-CHIP 2007-000162 R508 R-CHIP 2007-008531 R510 R-CHIP 2007-001301 R511 R-CHIP 2007-001301 R512 R-CHIP 2007-001301 R513 R-CHIP 2007-001301 R514 R-CHIP 2007-001301 R515 R-CHIP 2007-001301 R516 R-CHIP 2007-001301 R517 R-CHIP 2007-001301 R518 R-CHIP 2007-001301 R519 R-CHIP 2007-001301 R520 R-CHIP 2007-001301 R521 R-CHIP 2007-001301 R522 R-CHIP 2007-008055 R529 R-CHIP 2007-008055 R530 R-CHIP 2007-008055 R531 R-CHIP 2007-009084 R532 R-CHIP 2007-009084 R533 R-CHIP 2007-009084 R534 R-CHIP 2007-009084 R535 R-CHIP 2007-009084 R536 R-CHIP 2007-009084 R537 R-CHIP 2007-009084 R538 R-CHIP 2007-009084 R539 R-CHIP 2007-009084 R540 R-CHIP 2007-009084 R541 R-CHIP 2007-009084 R542 R-CHIP 2007-009084 R543 R-CHIP 2007-009084 R544 R-CHIP 2007-009084 R545 R-CHIP 2007-009084 R546 R-CHIP 2007-009084 4-9 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE R547 R-CHIP 2007-000162 SW500 IC 1009-001010 TH200 THERMISTOR 1404-001221 TH501 VARISTOR 1405-001093 TH502 VARISTOR 1405-001093 TH503 VARISTOR 1405-001093 U100 FILTER-DUPLEXER 2909-001246 U101 IC 1205-002327 U102 IC 1201-002075 U201 IC 1108-000019 U202 IC 1205-002607 U300 IC 1203-003109 U301 DIODE-TVS 0406-001200 U302 IC 1205-002350 U303 IC 1203-003808 U401 IC 1202-001036 U402 IC 1001-001306 U404 TR-DIGITAL 0504-001100 U406 IC 1204-002461 U407 IC 1001-001231 U408 IC 0801-002237 U501 FILTER-EMI SMD 2901-001325 U502 IC 0801-002882 U503 FILTER-EMI SMD 2901-001246 U504 FILTER-EMI SMD 2901-001325 U506 FILTER-EMI SMD 2901-001325 U507 FILTER-EMI SMD 2901-001325 U508 IC 0801-002882 U510 IC 1205-002747 U511 IC 1205-002747 U512 IC 1205-002747 V401 DIODE-TVS 0406-001201 V402 DIODE-TVS 0406-001201 V501 VARISTOR 1405-001121 V502 VARISTOR 1405-001121 V504 VARISTOR 1405-001121 V505 VARISTOR 1405-001121 4-10 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List Design LOC Description SEC CODE V506 VARISTOR 1405-001121 V507 VARISTOR 1405-001121 V509 VARISTOR 1405-001121 X300 CRYSTAL-UNIT 2801-004373 ZD300 DIODE-ZENER 0403-001427 ZD401 DIODE-TVS 0406-001201 ZD402 DIODE-TVS 0406-001197 ZD406 DIODE-TVS 0406-001201 ZD501 DIODE-ZENER 0403-001387 ZD502 DIODE-TVS 0406-001167 ZD503 DIODE-TVS 0406-001197 ZD504 DIODE-TVS 0406-001197 4-11 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Electrical Parts List 4-12 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization 5. Block Diagrams 5-1. RF Solution Block Diagram HITACHI METAL ANT S/W ESHS-C090T Imax = 8 mA Freq (MHz) Loss(typ.) 880 - 915 1.2 dB 925 - 960 0.8 dB 1710 -1910 1.5 dB 1805 -1880 1.2dB 1930 -1990 1.2dB Atten 2xfo : 43dB,26dB(GSM,DCS/PCS) 3xfo : 40dB,26dB(GSM,DCS/PCS) Pins IA,IB,QA and QB V QI : 1.25V typ . , 1.15V mi , 1.35Vmax n V mod : 0.5V pp EPCOS GSM RX SAW Filter B7845 (2.0X1.4) IL=1.4dB typ 1.5dB max Ripple=0.5dB typ 0.6dB max EPCOS DCS RX SAW Filter B7852 (2.0X1.4) IL=1.5dB typ 2.1dB max Ripple=0.5dB typ 1.0dB max (2.7V) DCS/PCS_TX_MODE_SW QUAD 100 kHz+fmod + Q OUT - Q OUT EPCOS PCS RX SAW Filter B7851 (2.0X1.4) IL=1.4dB typ 2.1dB max Ripple=0.5dB typ 1.0dB max Vc_GSM Vc_DCS Vc_PCS GSM_TX_MODE_SW + I OUT - I OUT VREG Vcc_RF_LO Inverter circuits DIV Vcc_SYN Vcc_RF_VCO ~ PCS_RX_MODE_SW GSM/DCS/PCS VCC_RX_TX Discrete 3 rd Order Loop Filter fc = ? kHz VREG FracN DIV Vcc_REF(2.4V typ.) f compRF =26MHz REFIN PFD CP FE_SW1 26MHz FE_SW2 I+ DIV QUAD OFFSET Mixer input power -16dBm max, -22dBm min 1:1/ 2 I- fmod Vcc_Tx_BURST (2.7V) f TXIF 60MHz ~ ~ CP VBAT Micro Devices Quadband PAM RF3146 (7 X 7) GSM: Pout = 34.2 dBm , E = 55% DCS: Pout= 32.0 dBm , E = 55% PCS: Pout= 32.0 dBm , E = 52% VOT1810F27KRA (6.0X5.0X1.7) GSM = 880 ~ 915MHz (Vt=0.5V ~ 3.0V ) Tuning Sensitivity = 55±11MHz/V DCS = 1710 ~ 1785MHz (Vt=0.5V ~ 3.0V ) Tuning Sensitivity = 115±23 MHz/V Pout= 6.5±3 dBm typ.,Ic <= 30mA Harmonics <= -10dBc PWR EN Philips Transceiver UAA3536 TX VCO DCS/PCS 3W BUS CTL REG DATA CLK EN Q- DCS/PCS S/W VAPC Q+ PFD GSM S/W GSM VC-TCXO VBat (3.6V typ 3.0V min) VCC_SYN (2.7V , 100mA ) VCC_RX_TX (2.7V ,100mA ) VCC_RF_VCO (2.7V , 100mA ) VCC_TX_BURST (2.7V , 100mA ) VCC_CP (4.0V , 25mA ) PON_TX PON_SYNT RF1_VDD RF2_VDD RF1_VDDS RF2_VDDS HV S PMU V_MODE AVDD(1.35V min 2.65V max , 100mA ) VDD1 (1.35V min 2.95V max , 150mA ) VDD2 (1.35V min 3.45V max , 150mA ) VDD3 (1.35V min 3.45V max , 100mA ) VDD4 (1.35V min 3.45V max , 150mA ) 5-1 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization RXON TXON SYNON FESWON Block Diagrams 5-2. Base Band Solution Block Diagram MIC BB INTERFACE Serial Data Interface RECEIVER SPEAKER VIBRATOR OM6359 Battery Type Battery Voltage I/O Interface Battery Temperature A/D Interface VCC_CP VCC_SYN MELODY IC (40 Poly) VCC_RX_TX RF INTERFACE VCC_RF_VCO SYSTEM CLOCK (13MHz) AFC VCC_TX_BURST VDD1 RAMP VDD2 VDD3 LCD VDD_VIB KEY_BOARD Li-Ion Battery (Standard) MIC_BIAS PMU VDD_KEY VDD_AMP Charging Circuit RTC_CLOCK (32.768KHz) AVDD SIM CARD AVDD_TEMP BL_VDD 5-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization 6. PCB Diagrams 6-1. PCB Top Diagram 6-1 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization PCB Diagrams 6-2. PCB Bottom Diagram 6-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization 7. Flow Chart of Troubleshooting 7-1. Power On ' Power On ' does not work Yes Check the Battery Voltage is more than 3.4V No Change the Battery Yes No Check the PMU related to V_ISUP C315(V_ISUP) = 2.7V? Yes Check the Clock at R306=32KHZ No Resolder X300 Yes No Check the VDD1 circuit C340 (VDD1) = "H"? Yes C339(VDD2) & C338(VDD3) = 2.85V? No Check the VDD2,VDD3 circuit Yes Check for the clock at C135 = 13MHz No Check the clock generation circuit (related to U101) Yes Check the initial operation Yes END 7-1 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting Power On VDD1_1V8 R301 VBAT C301 IT_PMU JIG_REC RECO1 JACK_IN 32K RSTON ONKEY_N CHARGER_OK CN300 C302 11 66 2 2 55 3 34 4 G G G G 10 9 8 7 C305 TP300 TP301 REF_ON C309 U301 1 K3 H3D9 A9 J2K1K2 E3 F2 SCL SDA 12C INTERFACE H8 K6 REFC REFGND ON-CHIP REFERENCE & MIC BIAS C310 C313 BLVDD_3V25 refgnd VBAT J6 C314 K4 J5 BAT300 bias currents internal clocks BLVDD_3V25 VBAT VCC_SYN_2V7 C320 PON_TX C316 VBAT BATTERY VOLTAGE MONITOR D3 CHRVBAT E2 CHRREG E1 CHRIV CHARGE CONTROL C318 SUPPLY & CONTROL VCC_CP_4V VBAT LINREG HVSVBAT HVSGND HVSSCP HVSSCN HVSOC HVSVDD HIGH VOLTAGE SUPPLY E8 RF1SWS F9 RF1VDDS E10 RF2SWS J10 RF2VDDS PON_SYNT VBAT BACKLIGHT G9 RFVBAT G10 RF1VDD F10 RF1SNS H10 RF2VDD H9 RF2SNS VCC_RF_VCO_2V7 R306 internal supply BLVBAT BLVDD BBMSW BBMGND (CHARGE SWITCH PUMP+ LINREG) C8 B9 C9 A10 B10 D8 C321 L300 H7 E4 F5 F4 G4 J3 G5 K5F6 G6G7G8F7 E6 E7 D7 C7D6 E5 D5 D4C4 F1 F3 E9 G3G2G1 H4 H2H1 J1 F8 B4A4 J8 J9 J7 K7 VIB HFA C325 VIBVBAT VIBVDD C330 C329 AVDDS HFAVBAT HFAVBAT HFAVDD HFAVDD C328 DVDD2 SEL3RB DVDD3VBAT DVDD3 DVDD3 DVDD3 DVDD4ON DVDD4VBAT DVDD4 DVDD4 AVDDVBAT AVDDVBAT AVDD AVDD AVDD C327 DVDD2VBAT DVDD2 DVDD2 C326 VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 C322 VPROG VCC_RX_TX_2V7 B7 A7 C5 A8 X300 CC7V-T1A K8 OSC32I K9 OSC32O 32KHz XTAL OSCILLATOR REAL-TIME CLOCK INTERNAL SUPPLY MODULE VBACK SIMIO SIMCLK CLOCK GENERATOR htmp VBAT H6 J4 ISUPA ISUPD VCC_TX_BURST_2V7 C341 PLL C315 BACKLIGHT 5 reference voltage V_ISUP_2V5 TEMP HIGH SENSOR NC 4 SIM VCC D1 CPRES B8 SIMIO SIMCLK C6 SIM calibration MICBIAS 6 CLOCK GND C2 VCC C3 CLK C1 RST D2 IO INTERFACE DVDD1 DVDD1VBAT DVDD1 SEL12RB R305 ON/OFF CONTROL control status data IO 21 C312 ovdd htmp SCL SDA C311 3 SIM CHARGE PUMP INTERRUPT GENERATOR MIC_BIAS_2V1 2 SIMVBAT SIMGND SIMSCP SIMSCN TM B2A2 B1A1 C10 INT SLPMOD U302 D10 AUXON ONKEY RSTO CLK32 REC2 REC1 REC3 H5 NC 2 NC 1 VDD_KEY_2V95 K10A5 B5A6 B6B3 A3 VBAT VDD_VIB_3V05 AVDD_2V65 AVDD_TEMP_2V65 VDD2_2V85 V_ISUP_2V5 VDD3_2V85 VDD1_1V8 VIB C332 C335 C337 C338 C339 C333 C336 C340 POWER MANAGERMENT UNIT(PMU IC) 7-2 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization C334 C323 C324 Flow Chart of Troubleshooting C339 7-3 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-2. Initial Initial Failure Yes No R204 (RSTON) ="H"? Check the circuit related to reset Yes No Is U201 Pin (memory CE) OK? Check the U201 Yes Check the circuit around LCD & U201 (Short or not solder) Yes END 7-4 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting Initial VDD1_1V8 VDD2_2V85 VDD2_2V85 VDD2_2V85 VDD3_2V85 VDD1_1V8 C203 C204 C206 C207 C200 C208 VDD1_1V8 VDD2_2V85 VDD3_2V85 R200 C216 P12 AVDD P11 CKI P13 CKI32I P14 CKI32O P4 VDDE3_A M6 VDDE3_B G2 VDDE3_F VDDE3_G L3 R204 P8 VDDE2_C C1 VDDE2_E D_REF_13M 32K RSTON VDDC_A VDDC_B VDDC_C VDDC_D F5 N13 M8 K6 VDDE1_A P9 VDDE1_B N12 VDDE1_C C8 VDDE1_D H11 C215 C213 C10 RESETN M10 RSTO_N H10 RST_N K14 AUXON HD(0:15) HA(1:26) VDD3_2V85 R219 R218 HD(0) HD(1) HD(2) HD(3) HD(4) HD(5) HD(6) HD(7) HD(8) HD(9) HD(10) HD(11) HD(12) HD(13) HD(14) HD(15) HA(1) HA(2) HA(3) HA(4) HA(5) HA(6) HA(7) HA(8) HA(9) HA(10) HA(11) HA(12) HA(13) HA(14) HA(15) HA(16) HA(17) HA(18) HA(19) HA(20) HA(21) HA(22) HA(23) HA(24) HA(25) HA(26) R227 HWR_N HRD_N H4 H3 H2 J3 E5 H1 B1 E4 F3 F2 F1 E1 D1 E3 E2 B2 M4 P3 L4 N3 K5 M3 P2 N2 M1 N1 L2 L1 M2 J2 J5 K3 J4 K4 K2 G4 P5 N6 L6 J7 J6 H6 L5 H5 C229 HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 HD8 HD9 HD10 HD11 HD12 HD13 HD14 HD15 HA1 HA2 HA3 HA4 HA5 HA6 HA7 HA8 HA9 HA10 HA11 HA12 HA13 HA14 HA15 HA16 HA17 HA18 HA19 HA20 HA21 HA22 HA23 HA24 HA25 HA26 HWR_N HRD_N U202 QP QN IP IN AUXADC1 AUXADC2 AUXADC3 AUXADC4 MCLK ADI AFS ACLK ADO BOEN BDIO BIEN BIOCLK GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 RF_EN_SYNT C219 H13 H14 J13 J14 F14 G14 E14 F13 AVDD_TEMP_2V65 AFC RAMP QRX_TX_P QRX_TX_N IRX_TX_P IRX_TX_N MES_BATT R225 R211 R214 D10 A8 B9 B8 A9 G11 E11 F10 F11 M13 M14 M11 E6 F4 VDD2_2V85 TDI TMS TCK TDO TRST_N J_SEL R226 7-5 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization R212 VF R215 E13 VSS_BB D11 VSS_D C13 VSS_REF A12 VSS_VB C11 VSS_VBOUT AVSS K7 VSS_A J1 VSS_B M7 VSS_C N10 VSS_E N14 VSS_F N11 VSS_G G13 VSS_H E8 VSS_I C3 VSS_K G1 VSS_M K1 VSS_N P1 VSS_O N5 VSS_P P10 TDI TMS TCK TDO TRST_N J_SEL SIMIO SIMCLK SIMERR PWM1 PWM0 RXD1 A4 TXD KBIO7 KBIO6 KBIO5 KBIO4 KBIO3 KBIO2 KBIO1 KBIO0 RF_BBI_DATA C2 SCK B3 SDA D2 A2 A3 D3 A1 B4 KBIO(0:7) L14 L12 L13 L11 J11 K13 J10 K11 RF_BBI_CLK A13 MICP B13 MICN B14 AUXMICP A14 AUXMICN D4 KBIO(7) KBIO(6) KBIO(5) KBIO(4) KBIO(3) KBIO(2) KBIO(1) KBIO(0) ANT_SW2 ANT_SW3 PON_SYNT PON_TX PON_RX B10 EARP A11 EARN A10 AUXSP B11 BUZ RXD1 TXD1 TP206 TP207 TXVCO_SW1 TXVCO_SW2 PAM_TX_EN ANT_SW1 E12 AUXDAC1 D13 AUXDAC2 D12 AUXDAC3 B5 CTS0_N A5 RXT0_N C5 TXD0 C4 RXD0 M12 K9 L8 M9 P7 L7 L9 N7 P6 N8 K8 LCD_RESET V_MODE REF_ON D5 A6 D6 B6 A7 C7 B7 C6 E7 K10 D7 H12 G12 E10 E9 D8 D9 J12 RFE_N0 K12 RFE_N2 C14 VREF CTS0 RTS0 TXD0 RXD0 AMP_EN A B CHG_ON TTY_MODE_SEL LCD_MAIN_EN M_RST M_INT END_OF_CHARGE CTS0 FLIP R228 N9 GPON2 L10 GPON1 G10 AUXST RFSIG0 RFSIG1 RFSIG2 RFSIG3 RFSIG4 RFSIG5 RFSIG6 RFSIG7 RFSIG8 RFSIG9 RFSIG10 RXON TXON CCLK CDO CDI CEN G3 CS_N3 M5 CS_N2 G5 CS_N1 N4 CS_N0 LCD_CS MELODY_CS NCSRAM NCSFLASH C214 F12 C9 D14 B12 C12 VDD1_1V8 VDD_BB VDD_D VDD_REF VDD_VB VDD_VBOUT VDD1_1V8 VDD1_1V8 AVDD_2V65 EARP_P EARP_N R217 AUXSP LINE_OUT MIC_P MIC_N VDD1_1V8 AUX_MIC_P AUX_MIC_N R220 R221 D_REF_13M TP208 TP209 TP210 TP211 DD FSC DCL DU BOEN BDIO BIEN BIOCLK VDD2_2V85 R224 R223 SCL SDA SIMIO SIMCLK IT_PMU TH200 Flow Chart of Troubleshooting 7-6 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-3. Charging Part Abnormal charging part Yes No Check the U300 pin 2 > 4.9V Check the the circuit related to +DCVOLT Yes No U300 pin 4 = "H"? Resolder or replace U300 Yes No U300 pin 5 = "L"? Check the circuit related to CHG_ON signal Yes No Check the C300 ≒ 4.2V Resolder or replace U300 Yes END 7-7 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting Charging VBAT VDD2_2V85 U300 R300 +DCVOLT_5V 1 VL _CHG 8 2 IN BATT 7 3 GND _ACOK 6 4 ISET _EN 5 C307 C308 R304 C306 UDZS8.2B G GG G 910 11 12 END_OF_CHARGE R302 MES_BATT R303 CHARGER_OK CHG_ON C304 C303 CHARGER IC 7-8 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization C300 Flow Chart of Troubleshooting 7-9 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-4. Sim Part Phone can't access SIM Card Yes No CN300 pin 1,5 = "H"? Check the sim charge pump Yes No After Power ON, Check SIMCLK Signal on CN300 pin3 in a few second Check the 32k OSC Yes No After SIM card insert, CN300 pin 2 = "H(SIM_RST)"? Replace PBA Yes Check the SIM Card Yes END 7-10 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-5. Microphone Part Microphone does not work Yes No Check the connection from MIC Resolder MIC Yes No Check the circuit from U202 to MIC Resolder the R400, R401, R404, R407, L400, L401, C408 and C412 Yes No Check the MIC Replace the MIC Yes END 7-11 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting Microphone MIC_BIAS_2V1 MICROPHONE R400 Close to MCP Close to microphone C400 V401 C406 R401 C405 MIC+ C411 M400 C407 C408 L400 MIC_P C414 L401 R402 C413 MIC_N C412 C416 R404 V402 C417 C418 VDD2_2V85 VDD2_2V85 R407 VDD2_2V85 R409 5 R412 JACK_IN 3 7 8 1 6 2 U401-2 EAR_SWITCH U401-1 4 R415 R416 7-12 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-6. Speaker Part(Melody) Speaker does not work Yes No U408 pin 5 = 1.9V? Resolder or replace U408 Yes No Check the Clock signal at E2(CLKI) of U406(13MHz) Check the clock generation circuit (related to OSC101 and U406) Yes No R405 & R411 Around U406 ≒ 1.8V? (When U406 operate) Resolder U406 Yes No HEA1 pin 24,26 ≒ 1.8V? Check the circuit related to "SPK_P/SPK_N" signal Yes No Is Speaker working? Change the Speaker Yes END 7-13 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting Speaker VBAT VDD2_2V85 VDD_1.9V U406 C1 E1 D7 J3 C8 R424 C439 C402 C401 C403 C404 HD(0) HD(1) HD(2) HD(3) HD(4) HD(5) HD(6) HD(7) H4 E7 G4 D3 J5 C2 B2 F1 E3 D4 E6 G5 G7 H5 J6 MELODY_CS M_INT HRD_N M_RST HWR_N VDD_1.9V VDD_1.9V U408 C420 R406 1 2 MEL_13M R408 3 NC C419 VCC GND HA(1) HA(2) 5 IN VIB OUT 4 R410 B5 C5 G8 E2 C422 R414 R413 B4 A3 A4 A2 C4 C6 H6 LINE_OUT C421 C423 R417 C426 AMP_IN G3 J2 H2 G2 H1 J1 F3 G1 F2 C424 AVDD DVDD DVDD DVDD SPVDD D0 D1 D2 D3 D4 D4 D5 D6 D7 AVSS DVSS DVSS DVSS SPVSS HPC HPOUTL HPOUTR HPVSS IOVDD1 IOVDD2 /CS,_SS LED0 /IRQ LED1 LED2 /RD,SI /RST LRCK /WR,SCK MTR PLLC TXOUT VREF RXIN A0 YMU788 RXIN A1 SDIN INDEX SPOUT1 MCLK SPOUT1 IFSEL SPOUT2 MTR SMODE SO TESTI0 BBL TESTI1 TESTI2 BBR TESTI3 BCLK CLKI NC EQ1 NC EQ2 EQ3 EXC EXTIN EXTOUT GPIO B3 B6 A6 A5 E8 H3 H8 H7 J7 F7 J8 D2 C3 A1 F8 This Document can not be used without Samsung's authorization R403 C415 R405 B7 A8 A7 D6 F6 G6 C7 1 2 MELODY IC SAMSUNG Proprietary-Contents may change without notice C409 C410 C425 7-14 VDD3_2V85 B1 D1 D8 J4 B8 AMP_P AMP_N R411 Flow Chart of Troubleshooting 7-15 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-7. Key Data Input Check Initial Operation Yes No When one of the keys is pushed, is it displayed on LCD? Check the Dome sheet & Key rubber Yes No When one of the keys is pushed, KBIO signal is OK? Replace the PBA Yes END 7-16 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-8. Receiver Part Receiver does not work Yes No Resolder or replace U402 U402 pin 3, 15 = 1.5V? Yes No Resolder or replace U402 pin 8, 12 = 1.5? U402 Yes No Resolder EAR400 EAR400 pin 5, 2 = short? Yes No Resolder HEA1 HEA1 pin 24, 26 = 1.5V? Yes No SPK +,- PAD Change LCD module = 1.5V? Yes No Check the soldering of the speaker wire Modify the speaker wire soldering Yes No Replace the Receiver Is Receiver working? Yes END 7-17 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-18 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-9. LCD Part (for Color Main ) LCD does not work Yes No Is LCD Contrast set on high level in the Menu? Set LCD Contrast on high level Yes No Check the U502 HEA1 pin 2 = 2.8V? Yes No HEA1 pin 19(HWR_N) 21(HA(1)) is OK? Check the U202 Yes Replace the LCD Module Yes END 7-19 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting TP212 7-20 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-10. Key Back Light Key Backlight does not work Yes No Check the PMU related to "VDD_KEY" C333 = "H"? Yes END 7-21 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-11. GSM Receiver RX ON RF input : CH center freq Amp : -50dBm Yes No U100 Pin7 >= -65dBm Resolder CN101, C102 Yes No U100 pin5 >= -65dBm Check U100 No pin2=L,pin4=L,pin8=L Check ANT Switch control circuit Yes Yes Resolder U100 No F101 pin1 >= -70dBm Resolder F101, C107, L115 Yes No U101 pin32 >= -70dBm pin33 >= -70dBm Resolder L112, L113, L114 Yes No U101 pin6, 7, 8, 9 >= 1V Check U101 pin10,22,28 >=2.7V pin20 >=4.0V Yes No Yes R130,R131,R132 ,R133 >= 1V Yes Check U202 END 7-22 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Check & Resolder RF PSU Part Check &Resolder U101, RF26MHz part, R104, R105 Flow Chart of Troubleshooting 7-23 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-12. GSM Transmitterv TX ON (5Level) Yes U100 Pin7 >= 20dBm Resolder CN101, C102 No Yes U100 Pin11 >= 20dBm Check U100 Yes pin2=L,pin4=H,pin8=L No No Change or Resolder U100 Check ANT Switch control circuit Yes U102 Pin6 >= 20dBm Resolder C119, L117 No Yes U102 Pin48 >= 3dBm Check U102 +VBATT(pin42,43) OK? Yes Resolder or change U102 or check PAM control signal No No Check +VBATT OSC100 pin1 >= 6Bm Yes Resolder R107, R111, R112 No U101 Pin6, 7, 8, 9 >= 500mV Yes Check U101 pin4 >= 4.0V pin22, 28 >= 2.7V Yes Check & Resolder RF PSU part No No Resolder U101 or check Txcpo(R129) Check U202 END 7-24 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-25 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-13. DCS Receiver RX ON RF input : CH center freq Amp : -50dBm Yes No U100 Pin7 >= -65dBm Resolder CN101, C102 Yes No U100 pin1 >= -65dBm Check U100 No pin2=L,pin4=L,pin8=L Check ANT Switch control circuit Yes Yes Resolder U100 No F102 pin1 >= -70dBm Resolder F102, C104, L111 Yes U101Pin38>=-70dBm Pin39>=-70dBm No Resolder L105, L106, L108 Yes U101 pin6, 7, 8, 9 >= 1V No Check U101 No pin22,28 >= 2.7V pin4 >= 4.0V Yes Yes R130,R131,R132 ,R133 >= 1V Yes Check U202 END 7-26 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Check & Resolder RF PSU Part Check & Resolder U101, RF26MHz part R104, R105 Flow Chart of Troubleshooting 7-27 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-14. DCS Transmitter TX ON (0Level) Yes U100 Pin7 >= 20dBm Resolder CN101, C102 No Yes U100 Pin9 >= 20dBm Check U100 Yes pin2=L,pin4=L,pin8=H No No Yes U102 Pin31 >= 20dBm Change or Resolder U100 Check ANT Switch control circuit Resolder C117, L116 No Yes U102 Pin37 >= 3dBm Check U102 +VBATT(pin42,43) OK? Yes Resolder or change U102 or check PAM control signal No No Check +VBATT Yes OSC100 pin2 >= 6Bm Resolder R115, R120, R121 No U101 Pin6, 7, 8, 9 >= 500mV Yes Check U101 pin4 >= 4.0V pin22, 28 >= 2.7V No Yes No Check U202 END 7-28 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Check & Resolder RF PSU part Resolder U101 or check Txcpo(R129) Flow Chart of Troubleshooting 7-29 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-15. PCS Receiver RX ON RF input : CH center freq Amp : -50dBm Yes U100 Pin7 >= -65dBm No Resolder CN101, C102 Yes U100 Pin3 >= -65dBm No Check U100 pin2=H,pin4=L,pin8=L Yes Yes F100 Pin1 >= -70dBm No No Change or Resolder U100 Check ANT Switch control circuit Resolder F100, C103, L104 Yes U101 Pin35,36 >= -70dBm No Resolder L101, L102, L103 Yes U101 Pin 6,7,8,9 >= 1V No Check U101 pin4 >= 4.0V pin22, 28 >= 2.7V Yes Check & Resolder RF PSU part Check & Resolder U101, RF 26MHz part, R104, R105 R130,R131,R132, R133 >= 1V Yes Check U202 END 7-30 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-31 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Flow Chart of Troubleshooting 7-16. PCS Transmitter TX ON (0Level) Yes U100 Pin7 >= 20dBm Resolder CN101, C102 No Yes U100 Pin9 >= 20dBm Check U100 Yes pin2=L,pin4=L,pin8=H No No Yes U102 Pin31 >= 20dBm Change or Resolder U100 Check ANT Switch control circuit Resolder C117, L116 No Yes U102 Pin37 >= 3dBm Check U102 +VBATT(pin42,43) OK? Yes No No Resolder or change U102 or check PAM control signal Check +VBATT Yes OSC100 pin2 >= 6Bm Resolder R115, R120, R121 No U101 Pin6, 7, 8, 9 >= 500mV Yes Check U101 pin4 >= 4.0V pin22, 28 >= 2.7V No Yes No Check U202 END 7-32 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization Check & Resolder RF PSU part Resolder U101 or check Txcpo(R129) Flow Chart of Troubleshooting 7-33 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization C131 VCC1GSM GND1GSM GND GND GND GND 7-34 SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization 12 11 NC NC BANDSEL TXENABLE VCC3DCS/PCS NC VRAMP VCC3GSM NC GSM850/900IN NC C143 C144 VCCOUT C147 13 14 15 16 17 18 19 20 21 22 23 24 NC C146 GND NC NC NC NC NC GND DCS/PCSOUT NC C145 DCS/PCSIN NC VBATT U102 VBATT 4 GND 5 GND 6 GSM850/900OUT 7 GND 8 NC VCC1 9 NC 1 NC 35 34 25 26 27 28 29 30 31 32 33 R134 R135 C152 C153 R126 C137 R124 R122 C136 R125 DCSIB C138 R129 R116 22K,1% 42 GND2 43 GND3 44 GND4 45 NC1 46 NC2 1 40 FESWON 2 3 45 28 27 26 U101 6 7 25 8 24 9 23 22 PCS_RX 41 11 12 13 14 15 16 17 18 19 20 C142 CLKOUT CAFCSUP CLKFDBX REFGND REFIN REFVCC DATA CLK EN RFCPVCC 21 C141 10 IFVCC 10 2 NC GND 0 TXRFI VCC2DCS/PCS R108 29 EXTRES VCC2GSM GND ANT_SW1 39 38 DCSIA 37 RFGND2 36 PCSIB PCSIA RFGND1 GSMIB GSMIA RFVCC 30 TXCPVCC NC R119 VCC1 BAND GND VCC2 GND GND GND 12 10 8 6 3 BAND 4 2 C125 1NF 50V 35 34 33 32 31 C116 1.8NF 50V TXCPO FESW2 GSMINTERGND R118 11 C124 1UF 10V VCC_TX_BURST_2V7 L113 FESW1 2 R121 7 1 OUT1 5 OUT2 9 CONTROL OSC100 L112 L114 L106 TXON RFLOVCC 3 R120 3 L108 L102 GNDTUNE 1 36 R115 R112 OUT 4 OUT 4 GG 2 5 1 IN OUT 5 3 L105 L103 SYNON NC R111 R107 GG 2 OUT F102 F101 B7845 IN 3 SYNVCC 53 GND 54 GND G 48 47 46 45 44 43 42 41 40 39 38 37 C117 1 _ECOS OUT OUT 4 GG 2 5 L101 RFCPO TXVCO_SW2 52 51 50 49 L117 L115 IN B7852 1 F100 RXON TXVCO_SW1 C133 R110 C126 C119 L116 C107 L111 L104 B7851 H RFVCOVCC C132 R109 C127 6 10 12 13 14 C104 C103 L L L RFTUNE RAMP VBAT U100 4 VC1 DCS_RX 1 8 VC2 GSM_RX 5 2 VC3 DCS|PCS_T 9 3 PCS_RX 11 GSM_TX G2G3G4G5G6 7 ANT C102 L PCS Rx L C140 C129 C120 R106 C101 Q100 R101 R128 C139 C121 R105 R104 PEMD10 1 6 C118 2 C128 C135 3 5 E1 PAM_TX_EN ANT_SW3 C106 G 3 100K A C105 C L107 L109 L110 4 KMS-512 L DCS Rx L C2 L119 L GSM Rx L H L DCS/PCS Tx B1 E2 L118 R136 CON101 4 B2 R102 ANT ANT1 L VC3 C1 FE_SW1 FE_SW2 PCS_RX ANT2 L VC2 H VC1 GSM 850/900 Tx R127 R123 OSC101 R130 R133 C158 R132 R131 C157 C134 C113 C112 4 VCC GND VCON 1 2 OUT 3 C156 C109 C108 R114 C155 C154 C122 C115 C110 R117 R113 C123 C114 C111 C130 VCC_CP_4V PON_TX IRX_TX_P IRX_TX_N QRX_TX_P QRX_TX_N VCC_SYN_2V7 D_REF_13M MEL_13M AFC RF_BBI_DATA RF_BBI_CLK RF_EN_SYNT VCC_CP_4V VCC_SYN_2V7 PON_RX PON_SYNT FE_SW1 FE_SW2 VCC_RF_VCO_2V7 VCC_RX_TX_2V7 ANT_SW2 VCC_RX_TX_2V7 Flow Chart of Troubleshooting Transmitter & Receiver QB GND1 QA IB IA NC VCCOUT NC NC NC www.s-manuals.com
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Page Mode : UseThumbs XMP Toolkit : Adobe XMP Core 4.0-c316 44.253921, Sun Oct 01 2006 17:14:39 Create Date : 2007:09:30 02:14:39+03:00 Modify Date : 2013:09:13 21:32:03+03:00 Metadata Date : 2013:09:13 21:32:03+03:00 Format : application/pdf Description : Creator : Title : Samsung SGH-X495 - Service Manual. www.s-manuals.com. Subject : Samsung SGH-X495 - Service Manual. www.s-manuals.com. Producer : iText 1.4.6 (by lowagie.com) Document ID : uuid:7c58b67b-610c-498a-bf4a-b870f8223985 Instance ID : uuid:9af78f7f-57f5-4492-953c-a038bc3d393b Page Count : 63 Page Layout : OneColumn Keywords : Samsung, SGH-X495, -, Service, Manual., www.s-manuals.com.EXIF Metadata provided by EXIF.tools