Samtec Micro Rugged Design Guide
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MICRO RUGGED APPLIC ATION DESIGN GUIDE MICRO RUGGED INTERCONNECT SOLUTIONS Rugged contact systems, micro power interconnects and rugged signal integrity create the foundation of Samtec’s micro rugged solutions for high cycle, high power and harsh environment applications. Samtec’s rugged products are offered in conjunction with full engineering support, online tools and a service attitude that is unmatched in the connector industry. SI RUGGED SIGNAL INTEGRITY HIGH SPEEDS TO 40 Gbps MP EDGE RATE® CONTACT DESIGN INCREASES WEAR LIFE MICRO POWER EXPERTISE IN SIGNAL INTEGRITY DESIGN & ANALYSIS 3 TO 30 AMPS CONFIGURABILITY OF POWER & SIGNAL SPACE-SAVING FORM FACTOR R RUGGED CONTACT SYSTEM Learn more at www.samtec.com 2 1,000+ MATING CYCLES TIGER EYE™ HEAT-TREATED BeCu CONTACTS REDUNDANT POINTS OF CONTACT FOR HIGH-RELIABILITY BOARD-TO-BOARD SYSTEMS 4-9 –– Edge Rate® system for rugged signal integrity performance –– Tiger Eye™ contact system for high-reliability in rugged applications –– 0.50 mm to 2.00 mm pitch –– Stack heights from 5 mm to 18 mm MICRO POWER SYSTEMS 10-11 –– 3 to 30 A per power blade –– Small form factor –– Micro power/signal combinations –– Variety of pitches DISCRETE WIRE ASSEMBLIES 12-13 –– Choice of pitch as low as 0.80 mm –– Rugged, high-performance Tiger Eye™ systems –– Individually shrouded contacts –– High power systems to 34.5 A per power blade SEALED I/O SYSTEMS 14 –– IP68 and IP67 rated for dust and water –– Variety of circular shell sizes with power, power/signal pin outs –– Rectangular designs for space savings –– Rugged latching Modified & Custom Solutions 15 Solutionator 16 Rugged Features 17 Power Integrity & Extended Life Product™ 18 Full System Signal Integrity 19 ® 3 SI R MP EDGE RATE CONTACT SYSTEMS ® OPTIMIZED FOR SI PERFORMANCE • INCREASED CONTACT WIPE • HIGH CYCLES ERM8/ERF8 SERIES 7 mm stack height Solder lock 10 mm stack height with latching 360° Shielding 14 mm stack height with latching 28 G b p s Right-angle & edge mount available 0.80 mm PITCH EDGE RATE® SYSTEM mating cable assemblies (ercd/erdp series) –– High-speed Edge Rate® contacts with 1.50 mm extended wipe –– Rugged metal latching for increased retention force –– 360º shielding option reduces EMI –– Cost-effective metal solder lock in development for a more secure connection to the board 4 7 9 10 12 13 14 15 available stack heights (mm) (actual size) 16 18 ? Samtec designs and builds all automation equipment in-house. MICRO POWER SYSTEM 10 mm stack height –– Use with Samtec’s Edge Rate® and other high-speed systems for power/signal applications –– 5 mm to 20 mm stack heights –– 2 to 5 power blades on a 2.00 mm pitch –– Allows for staging of power and signal/ground –– Modular interlocking, shielding and right-angle options in development UMPT/UMPS SERIES 7 mm stack height 15 A per power pin 2.00 mm pitch vs. 3.81 mm pitch (upx series) 4 pins powered 0.50 mm PITCH EDGE RATE® Q RATE® SLIM GROUND PLANE –– 1.00 mm contact wipe for a reliable connection –– 28 Gbps high-speed channel performance* –– Widely accepted industry standard integral power/ground plane –– Rugged friction locks and weld tabs available –– 0.80 mm pitch with 1.20 mm contact wipe –– Up to 40% PCB space savings vs. ERM8/ERF8 –– 31 Gbps high-speed channel performance* ERM5/ERF5 SERIES QRM8/QRF8 SERIES 7-12 mm stack heights Guide posts for blind mating 7-14 mm stack heights Slim 4.60 mm body saves 35% PCB space * High-speed channel performance figure based on Samtec reference channel. For full SI Performance data visit samtec.com or contact sig@samtec.com 5 R MP TIGER EYE CONTACT SYSTEMS ™ HIGH-RELIABILITY • MULTI-FINGER BeCu CONTACT • HIGH MATING CYCLES 6-12 mm stack heights SFM/TFM SERIES Screw down and retention latching options Surface mount or through-hole tails SFSS/SFSD SERIES MOLC/FOLC SERIES High-density four row design 1.27 mm PITCH TIGER EYE™ SYSTEM –– Tiger Eye™ is Samtec’s most rugged contact system rated to 1,000+ mating cycles –– Screw down, locking clip, friction latching and weld tab ruggedizing options –– Shrouded, polarized and keyed –– Discrete wire assemblies available in single or double row, 30 and 28 AWG PVC or Teflon® wire Dupont™ Teflon® is a registered trademark of the E.I. du Pont de Nemours and Company or its affiliates. 6 locking for increased unmating force (sfml series) mating idc cable assemblies (ffxd & ffxp series) ? Samtec stamps over 1 BILLION Tiger Eye™ contacts per year. 2.00 mm PITCH TIGER EYE™ SYSTEM –– Wide range of stack heights SMM/TMM SERIES –– Right-angle mating headers available –– Optional screw downs, weld tabs and locking clips –– Mating discrete wire and IDC cable systems Available in 30-24 AWG PVC or Teflon® S2M/T2M SERIES Surface mount or through-hole S2SD SERIES 0.80 mm PITCH TIGER EYE™ SYSTEM –– Micro pitch and slim body for space-savings –– 6 mm, 7 mm and 10 mm stack heights SESDT SERIES –– Locking clip, alignment pins and weld tab ruggedizing features Rugged latching system for harsh environments –– Discrete wire assembly with 32 AWG Teflon® wire SEMS/TEMS SERIES SEM/TEM SERIES Vertical and right-angle mating headers 7 SI R MP MICRO SYSTEMS HIGH-DENSITY • HIGH-RETENTION CONTACTS • SLIM ROW-TO-ROW DESIGNS HERMAPHRODITIC RAZOR BEAM™ INTERFACES LSHM SERIES –– High-retention, high-speed Razor Beam™ contacts –– 26 Gbps high-speed channel performance* –– 0.50 mm, 0.635 mm and 0.80 mm pitch 5 - 12 mm stack height flexibility –– EMI shielding available to limit signal degradation and optimize performance LSS SERIES LSEM SERIES FLOATING CONNECTORS ONE-PIECE INTERFACES –– Provides 0.50 mm contact float in the X and Y axes to compensate for misalignment –– Robust design and mechanical hold-downs for high-shock and vibration applications –– 5 mm and 7 mm stack heights –– Optional rugged weld tabs and locking clips –– Micro 0.50 mm pitch –– 1.00 mm, 1.27 mm and 2.54 mm pitch designs FSI SERIES FT5/FS5 SERIES SEI SERIES SIB SERIES Right-angle available for micro backplane applications Profiles from 1.65 mm to 10 mm SIR1 SERIES * High-speed channel performance figure based on Samtec reference channel. For full SI Performance data visit samtec.com or contact sig@samtec.com 8 SI R MP HIGH-SPEED EDGE CARD ? Lead times for custom products are often the same as for Samtec’s standard products. 16 TO 40 Gbps • CHOICE OF PITCH • EDGE RATE® CONTACTS 0.80 mm & 1.00 mm PITCH SYSTEMS 40 –– High-speed Edge Rate® contact system –– Vertical, right-angle and edge mount –– Power/signal combo to 60 A per power bank G b p s Rugged locking, latching and weld tab options –– Pass-through application HSEC8 SERIES HSEC8-PV SERIES misalignment mitigation (hsec1-dv series) 40 gbps with differential pair (hsec8-dp series) HSEC1-DV SERIES HIGH-DENSITY EDGE CARD SYSTEM MICRO EDGE CARD SYSTEMS –– Justification beam enables use of standard PCB tolerance –– 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm and 2.00 mm pitch –– 0.50 mm ultra-fine pitch with up to 200 total I/Os –– Optional rugged weld tabs, board locks and solder locks –– PCIe Gen 4 compliant –– Solutions for 1.60 mm (0.62") and 2.36 mm (.093") thick cards ® MECF SERIES MEC6 SERIES MEC5 SERIES 24 G b p s Spring ensures card and body are flush 36 G b p s MEC8 SERIES PCI-SIG® , PCI Express® and the PCIe® design marks are registered trademarks and/or service marks of PCI-SIG. 9 R MP POWER/SIGNAL SYSTEMS 3 TO 15 A PER BLADE • MICRO PITCH • DESIGN FLEXIBILITY AND CONFIGURABILITY MICRO POWER SYSTEMS –– 5 mm to 20 mm stack heights UMPT/UMPS SERIES 10 mm stack height Micro Power shown with Razor Beam™ (LSHM Series) –– Use with Samtec’s high-speed connector systems –– Design flexibility as a two-piece system for power/signal applications –– 2 to 5 power blades on a 2.00 mm pitch 5 mm stack height Micro Power shown with Razor Beam™ LP (ST4/SS4 Series) 2.00 mm pitch vs. 3.81 mm pitch (upx series) 15 A per power pin 4 pins powered SEARAY™ HIGH-DENSITY POWER/SIGNAL COMBO Q2™ POWER/SIGNAL COMBO –– Increased insertion depth for rugged applications –– Vertical and right-angle power modules for use with SEARAY™ and SEARAY™ 0.80 mm –– 0.635 mm pitch with integral power/ground plane –– 0.80 mm and 1.27 mm pitch open-pin-field arrays –– Eight total power pins at 4 A per pin (4 pins powered) –– Shielding, power pins, retention pins and RF options –– Edge Rate® contact system less prone to damage when “zippered” to unmate UBPT/UBPS SERIES 5A per power pin 4 pins powered 10 QMSS/QFSS SERIES 15 A ground plane R MP HIGH POWER SYSTEMS ? Custom designs make up almost 28% of Samtec’s business. See page 15 for more information. 20 TO 60 A PER BLADE • CHOICE OF PITCH • LOW PROFILE DESIGNS POWERSTRIP™ SYSTEM MPT/MPS SERIES –– 23.5 A/blade to 58.7 A/blade (1 blade powered) –– Power/signal combinations –– Hermaphroditic headers (MPPT/UPPT Series) –– “Hinging” for 90° mating radius, blind mating (FMPT/FMPS Series) –– Standard creepage and clearance dimensions available at samtec.com/power* UPT/UPS SERIES MPTC/MPSC SERIES EXTREME TEN60POWER™ EXTREME LPHPOWER™ –– Up to 60 A/blade (2 blades powered) –– Up to 30 A/blade (4 blades powered) –– High-density signals available in the same form factor –– High-density, double stacked power blades –– AC power, AC-DC combos and split power options –– 16, 20, 24 and 32 signal options –– Standard creepage and clearance dimensions available at samtec.com/power* –– Standard creepage and clearance dimensions available at samtec.com/power* ET60T/ET60S SERIES LPHT/LPHS SERIES 7.5 mm low profile design 3 or 5 signal rows * For flexible design solutions to fit specific applications, contact Samtec. 11 R MP MICRO DISCRETE WIRE CHOICE OF PITCH • 3 TO 35 A PER CONTACT • RUGGED LATCHING 1.00 mm PITCH SYSTEM 1.27 mm PITCH TIGER EYE™ SYSTEM –– 3.3 A/contact* –– 2.9 A/contact* –– 2 to 20 total pins, single or double row –– High-reliability, multi-finger BeCu Tiger Eye™ contacts –– Low profile down to 3.2 mm –– Rugged screw down and retention latch options –– Available with or without retention latch S1SS/S1SD SERIES SFSS/SFSD SERIES Single or double row MINI MATE® SYSTEM POWER MATE® SYSTEM –– 5.4 A/contact* –– 10.3 A/contact* –– .100" (2.54 mm) pitch with individually shrouded contacts –– .165" (4.19 mm) pitch with individually shrouded contacts –– Panel mount cable assembly accommodates panel thickness of 0.84 mm to 2.28 mm –– Standard creepage and clearance dimensions available at samtec.com/power** MMSS/MMSD SERIES IPBS/IPBT SERIES IPS1/IPT1 SERIES PMSS/PMSD SERIES Metal or plastic rugged latching system Single or double row assemblies * 1 contact/blade powered per row ** For flexible design solutions to fit specific applications, contact Samtec. 12 ? POWERSTRIP™ SYSTEM 36% of Samtec’s discrete wire sales are modified and custom products. See page 15 for more information. MICRO RUGGED IDC CABLE SYSTEMS –– 5.00 mm pitch for performance to 23.2 A/blade* and 6.35 mm pitch for 34.5 A/blade* performance –– 1.27 mm and 2.00 mm pitch systems with low 5.08 mm profile –– Power/signal combination –– Variety of options including rugged strain relief, polarization and daisy chains –– Standard creepage and clearance dimensions available at samtec.com/power** PESS SERIES Polarized guide posts and positive latching –– High-reliability Tiger Eye™ contacts TCSD/EHT SERIES FFMD/EHF SERIES Ejector headers with optional locking clips MPSS SERIES DISCRETE WIRE COMPONENTS DISCRETE WIRE TOOLING –– A broad selection of housings and contacts for build-it-yourself design and application flexibility –– Hand tools and quick-change semi-automatic crimp applicators available –– Rugged screw downs, plastic and metal latches –– Wide variety of additional application specific hardware and field service capabilities –– 32 to 10 AWG wire –– Visit samtec.com/discretewire or samtec.com/tooling * 1 contact/blade powered per row ** For flexible design solutions to fit specific applications, contact Samtec. 13 SI R ACCLIMATE SEALED I/O ™ IP67 & IP68 • BAYONET/PUSH-PULL CIRCULARS • SPACE-SAVING RECTANGULARS FLEXIBLE SEALED CIRCULAR SYSTEMS –– Metal or plastic, 12 mm, 16 mm & 22 mm shells ACP/ACR SERIES 16 mm size metal shell –– Flexible pin configuration, gender and panel interface termination –– Bayonet-style latching systems meet IP68 requirements –– Cost-effective crimp version available –– Mini push-pull latching system meets IP67 requirements for dust and waterproof sealing CCP/CCR SERIES MCP/MCR SERIES Crimp 12 mm shell Mini push-pull system kitted components for efficient field assembly ETHERNET AND USB SEALED SYSTEMS –– IP68 threaded circulars with rugged overmold design RCE/RPBE SERIES SCRUS/SCPU SERIES –– Space-saving rectangulars with positive latching for quick connect/disconnect –– IP67 sealed USB Type C port seals to panel without costly metal screws or dust caps SSU-C SERIES 25-45% panel area savings Meets USB 2.0 and base 3.1 standards USB or Ethernet (meets CAT3, CAT5 & CAT5e) 14 10 or 17 mm shell size for Ethernet, Mini USB and USB MODIFIED & CUSTOM SOLUTIONS WILLINGNESS, SUPPORT & EXPERTISE Customs and Modifications make up about 28% of Samtec’s total sales A substantial percentage of each Micro Rugged product segment is custom 23% Edge Rate® 20% Tiger Eye™ 21% Edge Card 32% Power 18% Discrete Wire 36% Sealed I/O 23% Express Modifications 92% do not require engineering or tooling charges Total Sales 5% Engineered Customs INDUSTRY LEADING CUSTOMER SERVICE FLEXIBLE IN-HOUSE MANUFACTURING SIGNAL INTEGRITY EXPERTISE FLEXIBLE CAPABILITIES –– Full engineering, design and prototype support –– Design, simulation and processing assistance –– Quotes and samples turned around in 24 hours –– Flexible, quick-turn manufacturing –– Dedicated Application Specific Product engineers and technicians –– Modified or custom options for board level connectors and cable assemblies including: contacts, bodies, stamping, plating, wiring, molding, ruggedizing features and much more Express Modification Standard PowerStrip™ cable with non-standard end 2 option Engineered Custom Multi-power staging, power/signal combo, header/socket combo, custom body Contact the Application Specific Products Group at asp@samtec.com for express modifications or customasp@samtec.com for engineered customs. 15 SOLUTIONATOR ® QUICKLY BUILD MATED SETS ONLINE –– Wide variety of search parameters and filters: creepage and clearance, pitch, stack height, etc. –– Easily sort results to find the right mated set –– Live chat with engineers for custom options –– Immediately download models and open Specs Kit www.samtec.com/solutionator 16 RUGGED FEATURES RUGGEDIZING OPTIONS JACK SCREWS Ideal for high normal force, zippering and other rugged applications POSITIVE LATCHING Manually activated latches increase unmating force by up to 200% BOARD LOCKS FRICTION LOCKS RETENTION PINS Metal or plastic friction locks increase retention/withdrawal force Increase unmating force by up to 50% Boards are mechanically locked together WELD TABS GUIDE POSTS SHIELDING SCREW DOWNS Easy and secure mating 360° shielding reduces EMI Secure mechanical attachment to the board BOARD STANDOFFS Significantly increase sheer resistance of connector to PCB TIGER BEAM™ EDGE RATE® Designed for Signal Integrity Precision machined standoffs for 5 mm to 25 mm board spacing CONTACT SYSTEMS TIGER EYE™ High-reliability TIGER CLAW™ BLADE & BEAM Dual Wipe Contact Mating/Alignment “Friendly” Best Cost High Mating Cycles Pass-through Applications Cost-effective Reliable Performance Superior Impedance Control Multi-finger Contact Ultra-low Profile Post & Beam Contact Reduced Broadside Coupling 17 POWER INTEGRITY ™ & E.L.P. POWER INTEGRITY SERVICES –– Standard power test data, including current carrying capacity, working voltage, voltage drop and resistance, creepage and clearance, is available for select power systems POWER INTEGRITY CERTIFIED –– Current Cycling Test Data, which demonstrates connector performance in realistic and common applications, is available for select series –– Power Integrity Guidelines are based on test data and proven design parameters, and are designed to help in connector selection and PCB design maximization –– Power Integrity Certified products undergo testing and additional requirements unique to Samtec. To be certified, products must pass Current Cycling Test EIA 365-55, have current carrying capacity, resistance and amps vs. number of contacts data available and Power Integrity Guidelines developed Clearance Creepage –– Visit samtec.com/powerintegrity for more information EXTENDED LIFE PRODUCT™ E.L.P.™ products are tested to rigorous standards, which evaluate 10 YEAR MFG contact resistance in simulated EXTENDED LIFE storage and field conditions. PRODUCT HIGH MATING CYCLES –– 10 year Mixed Flowing Gas (MFG) –– High Mating Cycles (250 to 2,500) PITCH 0.50 mm 0.635 mm 0.80 mm –– Certain plating and/or contact options will apply –– For complete details on Samtec’s E.L.P. program, a list of qualifying products and test results, please visit samtec.com/ELP or email the Customer Engineering Support Group at CES@samtec.com ™ 1.00 mm 1.27 mm 2.00 mm 2.54 mm TYPE CONTACT SERIES* Q Series Strip Blade & Beam QSH/QTH Basic Strip Blade & Beam BSH/BTH Q Series® Strip Blade & Beam QSS/QTS ® Basic Strip Blade & Beam Edge Rate® Strip Edge Rate ® Edge Card Edge Rate ® HSEC8 Q Rate Strip Edge Rate ® QRM8/QRF8 Q Series® Strip Blade & Beam Basic Strip Blade & Beam BSE/BTE Strip Tiger Eye™ SEM/TEM ® BSS/BTS ERF8/ERM8 QSE/QTE Strip Tiger Claw™ CLM/FTMH SEARAY ™ Array Edge Rate ® SEAF/SEAM Strip Tiger Eye™ SFM/TFM Strip Tiger Claw™ CLP/FTSH Strip Tiger Beam™ FLE/FTSH Strip Tiger Eye™ SMM/TMM Strip Tiger Claw™ CLT/TMMH Strip Tiger Claw™ SSM/TSM Strip Tiger Claw™ BCS/TSW * Tested socket/terminal combination shown. Other mating headers also available. Contact Samtec if header design you need is not shown. 18 FULL SYSTEM SIGNAL INTEGRITY Teraspeed® and Signal Integrity Group Engineers Help Optimize and Validate Your High-Performance System. Services are available at any level you require: from early stages of the design process including package design, materials selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz. package design & materials modeling simulation Bumpout / Ballout Optimization High Bandwidth Full-Wave Design Rules for Package & PCB Designs Custom & Commercial Software Validate Implementation and Signaling Requirements for Critical Channels Layout & Routing Ballout Transition Structures Material Recommendations Simulations via High-Performance Computing analysis testing validation Package, PCB and System-Level Power Integrity Post Design Simulation & Measurements Validation Platform Engineering Measurement of Test Structures for Signal Integrity / Power Integrity Optimization Connectors, Packages & Devices Package, PCB and System-Level Signal Integrity Material Characterization Characterization at Frequencies to 67 GHz 19 SUDDEN SERVICE® UNITED STATES • NORTHERN CALIFORNIA • SOUTHERN CALIFORNIA • SOUTH AMERICA • UNITED KINGDOM • GERMANY • FRANCE • ITALY • NORDIC/BALTIC BENELUX • ISRAEL • INDIA • AUSTRALIA / NEW ZEALAND • SINGAPORE • JAPAN • SHANGHAI • SHENZHEN • TAIWAN • HONG KONG • KOREA FEBRUARY 2017 1
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