Samtec Micro Rugged Design Guide
User Manual:
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Page Count: 20
- Samtec Micro Rugged Application Design Guide
- Micro Rugged Interconnect Solutions
- Table of Contents
- Edge Rate® Contact Systems
- Edge Rate® Contact Systems Cont.
- Tiger Eye™ Contact Systems
- Tiger Eye™ Contact Systems Cont.
- Micro Systems
- High-Speed Edge Card
- Power/Signal Systems
- High Power Systems
- Micro Discrete Wire
- Micro Discrete Wire Cont.
- AccliMate™ Sealed I/O
- Modified & Custom Solutions
- Solutionator®
- Rugged Features
- Power Integrity & E.L.P.™
- Full System Signal Integrity
- Samtec Locations
Learn more at
www.samtec.com
INTERCONNECT SOLUTIONS
MICRO RUGGED
RUGGED
SIGNAL INTEGRITY
HIGH SPEEDS TO 40 Gbps
EDGE RATE® CONTACT DESIGN
INCREASES WEAR LIFE
EXPERTISE IN SIGNAL
INTEGRITY DESIGN & ANALYSIS
MICRO POWER
RUGGED CONTACT SYSTEM
3 TO 30 AMPS
CONFIGURABILITY OF
POWER & SIGNAL
SPACE-SAVING FORM FACTOR
1,000+ MATING CYCLES
TIGER EYE™ HEAT-TREATED BeCu CONTACTS
REDUNDANT POINTS OF CONTACT FOR HIGH-RELIABILITY
Rugged contact systems, micro power interconnects and rugged signal integrity create the foundation of Samtec’s micro rugged
solutions for high cycle, high power and harsh environment applications. Samtec’s rugged products are offered in conjunction with
full engineering support, online tools and a service attitude that is unmatched in the connector industry.
SI
R
MP
2
MICRO RUGGED
Modied & Custom Solutions 15
Solutionator® 16
Rugged Features 17
Power Integrity & Extended Life Product™ 18
Full System Signal Integrity 19
DISCRETE WIRE ASSEMBLIES 12-13
SEALED I/O SYSTEMS 14
BOARD-TO-BOARD SYSTEMS 4-9
– Edge Rate® system for rugged signal integrity performance
– Tiger Eye™ contact system for high-reliability in rugged applications
– 0.50 mm to 2.00 mm pitch
– Stack heights from 5 mm to 18 mm
MICRO POWER SYSTEMS 10-11
– 3 to 30 A per power blade
– Small form factor
– Micro power/signal combinations
– Variety of pitches
– Choice of pitch as low as 0.80 mm
– Rugged, high-performance Tiger Eye™ systems
– Individually shrouded contacts
– High power systems to 34.5 A per power blade
– IP68 and IP67 rated for dust and water
– Variety of circular shell sizes with power, power/signal pin outs
– Rectangular designs for space savings
– Rugged latching
3
4
EDGE RATE®
CONTACT SYSTEMS
OPTIMIZED FOR SI PERFORMANCE • INCREASED CONTACT WIPE • HIGH CYCLES
0.80 mm PITCH EDGE RATE® SYSTEM
– High-speed Edge Rate® contacts with 1.50 mm extended wipe
– Rugged metal latching for increased retention force
– 360º shielding option reduces EMI
– Cost-effective metal solder lock in development for a more
secure connection to the board
mating cable assemblies
(ercd/erdp series)
7 mm
stack height
10 mm
stack height
with latching
14 mm
stack height
with latching
ERM8/ERF8 SERIES
Solder lock
360° Shielding
Right-angle
& edge mount
available
7
910 12 13 14 15 16 18
Gbps
28
available stack heights (mm)
(actual size)
SI R MP
5
Q RATE® SLIM GROUND PLANE
– Widely accepted industry standard
integral power/ground plane
– 0.80 mm pitch with 1.20 mm contact wipe
– 31 Gbps high-speed channel performance*
Slim 4.60 mm body saves 35% PCB space
* High-speed channel performance gure based on Samtec reference channel. For full SI Performance data visit samtec.com or contact sig@samtec.com
0.50 mm PITCH EDGE RATE®
– 1.00 mm contact wipe for a reliable connection
– 28 Gbps high-speed channel performance*
– Rugged friction locks and weld tabs available
– Up to 40% PCB space savings vs. ERM8/ERF8
7-12 mm
stack heights
QRM8/QRF8 SERIES
Guide posts
for blind mating
MICRO POWER SYSTEM
– Use with Samtec’s Edge Rate® and other high-speed
systems for power/signal applications
– 5 mm to 20 mm stack heights
– 2 to 5 power blades on a 2.00 mm pitch
– Allows for staging of power and signal/ground
– Modular interlocking, shielding and
right-angle options in development
ERM5/ERF5 SERIES
10 mm
stack height
per power pin
15 A
4 pins powered
7 mm
stack height
UMPT/UMPS SERIES
2.00 mm pitch vs.
3.81 mm pitch (upx series)
Samtec designs and
builds all automation
equipment in-house.
7-14 mm
stack heights
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6
TIGER EYE™
CONTACT SYSTEMS
HIGH-RELIABILITY • MULTI-FINGER BeCu CONTACT • HIGH MATING CYCLES
1.27 mm PITCH TIGER EYE™ SYSTEM
SFM/TFM SERIES
locking for increased
unmating force (sfml series)
mating idc cable assemblies
(ffxd & ffxp series)
Surface mount or
through-hole tails
SFSS/SFSD SERIES
Screw down and
retention latching
options
R MP
6-12 mm
stack heights
High-density
four row design
Dupont™ Teon® is a registered trademark of the
E.I. du Pont de Nemours and Company or its afliates.
MOLC/FOLC SERIES
–Tiger Eye™ is Samtec’s most rugged
contact system rated to 1,000+ mating cycles
– Screw down, locking clip, friction latching and
weld tab ruggedizing options
– Shrouded, polarized and keyed
– Discrete wire assemblies available in single or
double row, 30 and 28 AWG PVC or Teon® wire
7
– Micro pitch and slim body for space-savings
– 6 mm, 7 mm and 10 mm stack heights
– Locking clip, alignment pins and weld tab ruggedizing features
– Discrete wire assembly with 32 AWG Teon® wire
2.00 mm PITCH TIGER EYE™ SYSTEM
SEMS/TEMS SERIES
SEM/TEM SERIES
Vertical and right-angle
mating headers
S2M/T2M SERIES
SMM/TMM SERIES
Surface mount
or through-hole
S2SD SERIES
SESDT SERIES
Available in 30-24 AWG
PVC or Teflon®
Rugged latching system
for harsh environments
Samtec stamps over
1 BILLION Tiger Eye™
contacts per year.
0.80 mm PITCH TIGER EYE™ SYSTEM
?
– Wide range of stack heights
– Right-angle mating headers available
– Optional screw downs, weld tabs
and locking clips
– Mating discrete wire and IDC cable systems
8
MICRO
SYSTEMS
HIGH-DENSITY • HIGH-RETENTION CONTACTS • SLIM ROW-TO-ROW DESIGNS
FLOATING CONNECTORS
– Provides 0.50 mm contact oat in the X and Y axes
to compensate for misalignment
– 5 mm and 7 mm stack heights
– Micro 0.50 mm pitch
ONE-PIECE INTERFACES
– Robust design and mechanical hold-downs for high-shock
and vibration applications
– Optional rugged weld tabs and locking clips
– 1.00 mm, 1.27 mm and 2.54 mm pitch designs
FT5/FS5 SERIES
FSI SERIES
SIB SERIES
Profiles from
1.65 mm to 10 mm
Right-angle available
for micro backplane
applications
SEI SERIES
SIR1 SERIES
HERMAPHRODITIC RAZOR BEAM™ INTERFACES
– High-retention, high-speed Razor Beam™ contacts
– 26 Gbps high-speed channel performance*
– 0.50 mm, 0.635 mm and 0.80 mm pitch
– EMI shielding available to limit signal
degradation and optimize performance
SI R MP
5 - 12 mm stack
height flexibility
LSS SERIES
LSEM SERIES
LSHM SERIES
* High-speed channel performance gure based on Samtec reference channel. For full SI Performance data visit samtec.com or contact sig@samtec.com
9
HIGH-SPEED
EDGE CARD
16 TO 40 Gbps • CHOICE OF PITCH • EDGE RATE® CONTACTS
0.80 mm & 1.00 mm PITCH SYSTEMS
– High-speed Edge Rate® contact system
– Vertical, right-angle and edge mount
– Power/signal combo to 60 A per power bank
– Pass-through application
HSEC8 SERIES
Rugged locking,
latching and
weld tab options
misalignment mitigation
(hsec1-dv series)
40 gbps with
differential pair
(hsec8-dp series)
MICRO EDGE CARD SYSTEMS
– 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm and 2.00 mm pitch
– Optional rugged weld tabs, board locks and solder locks
– Solutions for 1.60 mm (0.62") and 2.36 mm (.093") thick cards
HIGH-DENSITY EDGE CARD SYSTEM
– Justification beam enables use of standard PCB tolerance
– 0.50 mm ultra-fine pitch with up to 200 total I/Os
– PCIe® Gen 4 compliant
SI R MP
Lead times for custom products
are often the same as for
Samtec’s standard products.
MEC5 SERIES
MEC6 SERIES
MEC8 SERIES
MECF SERIES
Spring ensures card
and body are flush
Gbps
40
HSEC1-DV SERIES
HSEC8-PV SERIES
Gbps
24
?
PCI-SIG® , PCI Express® and the PCIe® design marks are registered trademarks and/or service marks of PCI-SIG.
Gbps
36
10
POWER/SIGNAL
SYSTEMS
3 TO 15 A PER BLADE • MICRO PITCH • DESIGN FLEXIBILITY AND CONFIGURABILITY
Q2™ POWER/SIGNAL COMBO
– Increased insertion depth for rugged applications
– 0.635 mm pitch with integral power/ground plane
– Shielding, power pins, retention pins and RF options
– Eight total power pins at 4 A per pin (4 pins powered)
SEARAY™ HIGH-DENSITY
POWER/SIGNAL COMBO
– Vertical and right-angle power modules for use with SEARAY™
and SEARAY™ 0.80 mm
– 0.80 mm and 1.27 mm pitch open-pin-eld arrays
– Edge Rate® contact system less prone to damage when
“zippered” to unmate
QMSS/QFSS SERIES
MICRO POWER SYSTEMS
– 5 mm to 20 mm stack heights
– Use with Samtec’s high-speed connector systems
– Design exibility as a two-piece system for power/signal applications
– 2 to 5 power blades on a 2.00 mm pitch
5 mm stack height
Micro Power shown with
Razor Beam™ LP (ST4/SS4 Series)
10 mm stack height
Micro Power shown with
Razor Beam™ (LSHM Series)
per power pin
15 A
4 pins powered
UMPT/UMPS SERIES
UBPT/UBPS SERIES
per power pin
5 A
4 pins powered
ground plane
15 A
R MP
2.00 mm pitch vs.
3.81 mm pitch (upx series)
11
HIGH POWER
SYSTEMS
20 TO 60 A PER BLADE • CHOICE OF PITCH • LOW PROFILE DESIGNS
Q2™ POWER/SIGNAL COMBO
MICRO POWER SYSTEMS POWERSTRIP™ SYSTEM
EXTREME TEN60POWER™ EXTREME LPHPOWER™
– 23.5 A/blade to 58.7 A/blade (1 blade powered)
– Power/signal combinations
– Hermaphroditic headers (MPPT/UPPT Series)
– “Hinging” for 90° mating radius,
blind mating (FMPT/FMPS Series)
– Standard creepage and clearance dimensions
available at samtec.com/power*
UPT/UPS SERIES
MPT/MPS SERIES
MPTC/MPSC SERIES
3 or 5 signal rows
ET60T/ET60S SERIES LPHT/LPHS SERIES
– Up to 60 A/blade (2 blades powered)
– High-density signals available in the same form factor
– AC power, AC-DC combos and split power options
– Standard creepage and clearance dimensions
available at samtec.com/power*
– Up to 30 A/blade (4 blades powered)
– High-density, double stacked power blades
– 16, 20, 24 and 32 signal options
– Standard creepage and clearance dimensions
available at samtec.com/power*
R MP
Custom designs make up almost
28% of Samtec’s business. See
page 15 for more information.
7.5 mm
low profile design
* For exible design solutions to t specic applications, contact Samtec.
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12
MICRO
DISCRETE WIRE
– 5.4 A/contact*
– .100" (2.54 mm) pitch with individually shrouded contacts
– Panel mount cable assembly accommodates panel
thickness of 0.84 mm to 2.28 mm
MINI MATE® SYSTEM
IPBS/IPBT SERIES
Single or
double row
assemblies
MMSS/MMSD SERIES
IPS1/IPT1 SERIES
1.00 mm PITCH SYSTEM
– 3.3 A/contact*
– 2 to 20 total pins, single or double row
– Low prole down to 3.2 mm
– Available with or without retention latch
POWER MATE® SYSTEM
1.27 mm PITCH TIGER EYE™ SYSTEM
– 10.3 A/contact*
– .165" (4.19 mm) pitch with individually shrouded contacts
– Standard creepage and clearance dimensions
available at samtec.com/power**
– 2.9 A/contact*
– High-reliability, multi-nger BeCu Tiger Eye™ contacts
– Rugged screw down and retention latch options
PMSS/PMSD SERIES
Metal or plastic rugged
latching system
* 1 contact/blade powered per row ** For exible design solutions to t specic applications, contact Samtec.
R MP
CHOICE OF PITCH • 3 TO 35 A PER CONTACT • RUGGED LATCHING
S1SS/S1SD SERIES SFSS/SFSD SERIES
Single or
double row
13
DISCRETE WIRE TOOLING
– Hand tools and quick-change semi-automatic
crimp applicators available
– Wide variety of additional application specic
hardware and eld service capabilities
– Visit samtec.com/discretewire or samtec.com/tooling
DISCRETE WIRE COMPONENTS
– A broad selection of housings and contacts for
build-it-yourself design and application exibility
– Rugged screw downs, plastic and metal latches
– 32 to 10 AWG wire
POWERSTRIP™ SYSTEM
– 5.00 mm pitch for performance to 23.2 A/blade*
and 6.35 mm pitch for 34.5 A/blade* performance
– Power/signal combination
– Standard creepage and clearance dimensions
available at samtec.com/power**
1.27 mm PITCH TIGER EYE™ SYSTEM
– 10.3 A/contact*
– .165" (4.19 mm) pitch with individually shrouded contacts
– Standard creepage and clearance dimensions
available at samtec.com/power**
– 2.9 A/contact*
– High-reliability, multi-nger BeCu Tiger Eye™ contacts
– Rugged screw down and retention latch options
MPSS SERIES
PESS SERIES
Polarized guide
posts and
positive latching
* 1 contact/blade powered per row ** For exible design solutions to t specic applications, contact Samtec.
MICRO RUGGED IDC CABLE SYSTEMS
– 1.27 mm and 2.00 mm pitch systems with low 5.08 mm prole
– High-reliability Tiger Eye™ contacts
– Variety of options including rugged strain relief, polarization
and daisy chains
FFMD/EHF SERIES
TCSD/EHT SERIES
36% of Samtec’s discrete wire sales
are modied and custom products.
See page 15 for more information.
Ejector headers with
optional locking clips
?
14
ACCLIMATE™
SEALED I/O
IP67 & IP68 • BAYONET/PUSH-PULL CIRCULARS • SPACE-SAVING RECTANGULARS
– IP68 threaded circulars with rugged overmold design
– Space-saving rectangulars with positive latching
for quick connect/disconnect
– IP67 sealed USB Type C port seals to panel without
costly metal screws or dust caps
ETHERNET AND USB SEALED SYSTEMS SCRUS/SCPU SERIES
FLEXIBLE SEALED CIRCULAR SYSTEMS
– Metal or plastic, 12 mm, 16 mm & 22 mm shells
– Flexible pin conguration, gender and
panel interface termination
– Bayonet-style latching systems meet
IP68 requirements
– Cost-effective crimp version available
– Mini push-pull latching system
meets IP67 requirements for dust
and waterproof sealing
Meets USB 2.0 and
base 3.1 standards
kitted components for
efficient field assembly
25-45% panel area savings
16 mm size metal shell
Mini push-pull system
MCP/MCR SERIES
RCE/RPBE SERIES
SSU-C SERIES
10 or 17 mm shell
size for Ethernet,
Mini USB and USB
ACP/ACR SERIES
CCP/CCR SERIES
USB or Ethernet (meets
CAT3, CAT5 & CAT5e)
SI R
Crimp 12 mm shell
15
MODIFIED & CUSTOM
SOLUTIONS
– Full engineering, design and prototype support
– Design, simulation and processing assistance
– Quotes and samples turned around in 24 hours
– Flexible, quick-turn manufacturing
– Dedicated Application Specic Product
engineers and technicians
– Modied or custom options for board level
connectors and cable assemblies including:
contacts, bodies, stamping, plating, wiring,
molding, ruggedizing features and much more
FLEXIBLE CAPABILITIES
WILLINGNESS, SUPPORT & EXPERTISE
Engineered Custom
Multi-power staging, power/signal combo,
header/socket combo, custom body
Contact the Application Specic Products Group at asp@samtec.com for express modications
or customasp@samtec.com for engineered customs.
Express
Modifications
Engineered
Customs
23%
5%
Customs and Modications make up
about 28% of Samtec’s total sales
92% do not require
engineering or
tooling charges
A substantial percentage of each
Micro Rugged product segment is custom
Edge Rate®
Tiger Eye™
Edge Card
Power
Discrete Wire
Sealed I/O
20%
21%
32%
18%
36%
23%
Total Sales
INDUSTRY LEADING
CUSTOMER SERVICE
FLEXIBLE IN-HOUSE
MANUFACTURING SIGNAL INTEGRITY EXPERTISE
Express Modification
Standard PowerStrip™ cable
with non-standard end 2 option
–Wide variety of search parameters and filters: creepage and clearance, pitch, stack height, etc.
–Easily sort results to find the right mated set
–Live chat with engineers for custom options
–Immediately download models and open Specs Kit
SOLUTIONATOR®
www.samtec.com/solutionator
QUICKLY BUILD MATED SETS ONLINE
16
SOLUTIONATOR®
17
RUGGEDIZING OPTIONS
RUGGED
FEATURES
WELD TABS
Significantly increase
sheer resistance of
connector to PCB
SHIELDING
360° shielding reduces EMI
GUIDE POSTS
Easy and secure mating
BOARD STANDOFFS
Precision machined
standoffs for 5 mm to
25 mm board spacing
SCREW DOWNS
Secure mechanical
attachment to the board
BOARD LOCKS
Boards are mechanically
locked together
RETENTION PINS
Increase unmating force
by up to 50%
FRICTION LOCKS
Metal or plastic
friction locks increase
retention/withdrawal force
POSITIVE LATCHING
Manually activated latches
increase unmating force by
up to 200%
JACK SCREWS
Ideal for high normal force,
zippering and other rugged
applications
EDGE RATE®
Designed for Signal Integrity
Superior Impedance Control
Reduced Broadside Coupling
TIGER BEAM™
Best Cost
Reliable Performance
Post & Beam Contact
BLADE & BEAM
Mating/Alignment “Friendly”
Cost-effective
TIGER CLAW™
Dual Wipe Contact
Pass-through Applications
Ultra-low Profile
TIGER EYE™
High-reliability
High Mating Cycles
Multi-finger Contact
CONTACT SYSTEMS
POWER INTEGRITY
& E.L.P.™
EXTENDED LIFE PRODUCT™
– 10 year Mixed Flowing Gas (MFG)
– High Mating Cycles (250 to 2,500)
– Certain plating and/or contact options will apply
– For complete details on Samtec’s E.L.P.™ program,
a list of qualifying products and test results, please visit
samtec.com/ELP or email the Customer Engineering
Support Group at CES@samtec.com
E.L.P.™ products are tested to
rigorous standards, which evaluate
contact resistance in simulated
storage and eld conditions.
10 YEAR MFG
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
POWER INTEGRITY SERVICES
– Standard power test data, including current carrying capacity,
working voltage, voltage drop and resistance, creepage and
clearance, is available for select power systems
– Current Cycling Test Data, which demonstrates connector
performance in realistic and common applications, is
available for select series
– Power Integrity Guidelines are based on test data and
proven design parameters, and are designed to help in
connector selection and PCB design maximization
– Power Integrity Certied products undergo testing and
additional requirements unique to Samtec. To be certied,
products must pass Current Cycling Test EIA 365-55,
have current carrying capacity, resistance and amps vs.
number of contacts data available and Power Integrity
Guidelines developed
– Visit samtec.com/powerintegrity for more information
POWER INTEGRITY
CERTIFIED
PITCH TYPE CONTACT SERIES*
0.50 mm Q Series® Strip Blade & Beam QSH/QTH
Basic Strip Blade & Beam BSH/BTH
0.635 mm Q Series® Strip Blade & Beam QSS/QTS
Basic Strip Blade & Beam BSS/BTS
0.80 mm
Edge Rate® Strip Edge Rate®ERF8/ERM8
Edge Card Edge Rate®HSEC8
Q Rate® Strip Edge Rate®QRM8/QRF8
Q Series® Strip Blade & Beam QSE/QTE
Basic Strip Blade & Beam BSE/BTE
Strip Tiger Eye™SEM/TEM
1.00 mm Strip Tiger Claw™CLM/FTMH
1.27 mm
SEARAY™ Array Edge Rate®SEAF/SEAM
Strip Tiger Eye™SFM/TFM
Strip Tiger Claw™CLP/FTSH
Strip Tiger Beam™FLE/FTSH
2.00 mm Strip Tiger Eye™SMM/TMM
Strip Tiger Claw™CLT/TMMH
2.54 mm Strip Tiger Claw™SSM/TSM
Strip Tiger Claw™BCS/TSW
* Tested socket/terminal combination shown. Other mating headers also
available. Contact Samtec if header design you need is not shown.
18
Creepage
Clearance
POWER INTEGRITY
& E.L.P.™
19
FULL SYSTEM
SIGNAL INTEGRITY
Teraspeed® and Signal Integrity Group Engineers Help Optimize and Validate Your
High-Performance System. Services are available at any level you require: from early stages
of the design process including package design, materials selection and PCB routing, through
in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz.
Bumpout / Ballout Optimization
Layout & Routing
Ballout Transition Structures
Material Recommendations
package design & materials
Package, PCB and System-Level
Power Integrity
Package, PCB and System-Level
Signal Integrity
analysis
High Bandwidth Full-Wave
Custom & Commercial Software
modeling
Post Design Simulation & Measurements
Measurement of Test Structures for Signal
Integrity / Power Integrity Optimization
Material Characterization
testing
Design Rules for Package & PCB Designs
Validate Implementation and Signaling
Requirements for Critical Channels
Simulations via High-Performance Computing
simulation
Validation Platform Engineering
Connectors, Packages & Devices
Characterization at Frequencies to 67 GHz
validation
