Self Qual Results_PPF_phase 8 SSOP TEA5880TS Results Ppf Phase
User Manual: TEA5880TS
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IMO Backend Innovation Divisional Philips Semiconductors Philips Internal Report No.: RNR-83-05/RdH/RdH-2008 QTS Report Database No.: 050093 Self Qualification Results NiPdAu pre-plated leadframes, Green Molding Compound and Green Die-Attach for SSOP16/20/24/28 packages assembled at Subcontractor Amkor Technologies Philippines Author: Rob de Heus Sr. Project Leader Advanced Development IMO Backend Innovation Philips Semiconductors Nijmegen Building BY-1.052 Gerstweg 2, 6534 AE Nijmegen, the Netherlands Tel: +31-243534835 Tel: +31-243533085 Fax: +31-243533350 E-mail: rob.de.heus@philips.com Issue Date : February 1st, 2005 updated February 23rd IC Manufacturing Operations Philips Semiconductors Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Table of Contents 1. Introduction ..................................................................................................................................................3 2. Assembly Facilities .......................................................................................................................................4 3. Material details .............................................................................................................................................4 3.1 NiPdAu pre-plated leadframes................................................................................................................4 3.2 Molding Compounds ..............................................................................................................................5 3.3 Die Attach Glues ....................................................................................................................................6 4. Constructional Details of Test vehicles .......................................................................................................7 5. Reliability Test Program..............................................................................................................................8 5.1 Reliability Test Details ...........................................................................................................................8 5.2 Construction Analysis Tests Descriptions ..............................................................................................9 6. Self-qualification results.............................................................................................................................10 7. Conclusion ...................................................................................................................................................12 8. Implementation...........................................................................................................................................12 9. Document Revision Sheet...........................................................................................................................12 Date: 23 February 2005 Author: Rob de Heus Page: 2 Revision: 02 IC Manufacturing Operations Philips Semiconductors 1. Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Introduction The intention of the change to lead-free + green SSOP packages from Philips ( assembly at Amkor) has been announced in the Correction CPCN for Pb-free, issued in November 2004, CPCN # 200305025C. This self qualification report presents an overview of the qualification data completed to release the following packages in NiPdAu + Ablestik Ablebond 8290 die-attach + Sumitomo EMEG600 mold compound: • SSOP14(*)/16/20/24/28 assembled in Amkor Technologies Philippines (*) SSOP14 to be released by structural similarity In order to validate assembly quality and reliability, a self-qualification program has been performed for above mentioned packages. The results of this qualification demonstrate that Philips Semiconductors can achieve distinctive assembly quality with equal or better product quality and reliability when compared to the lead-tin plated versions of these products. With the introduction of above mentioned materials, these packages fully comply to the RoHS 2006 legislations and also fulfils the future legislation on banning of Halogenes and Antimony Oxides. Combination of the new die-attach glues and the new molding compounds improves the package quality, especially towards the higher reflow temperatures which are required for leadfree soldering. Note: results for the following packages are not yet available and will be reported later : SSOP16 SOT519 SSOP20 SOT724 SSOP24 SOT556 Date: 23 February 2005 Author: Rob de Heus Page: 3 Revision: 02 IC Manufacturing Operations Philips Semiconductors 2. Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Assembly Facilities AMKOR Technologies Philippines (ATP) AMKOR is one of Philips preferred subcontractors and is established in 1968. Amkor has grown to be a world-class leader in integrated circuit (IC) packaging, assembly and test services. AMKOR has assembly factories in Korea (ATK), Taiwan (ATT), China (ATC) and the Philippines (ATP). Package family portfolio of AMKOR/ANAM consists of amongst others DIP, SO, SSOP, PLCC, QFP, (LF)BGA and CSP. AMKOR is certified SAC level 1. 3. Material details 3.1 NiPdAu pre-plated leadframes main characteristics : • good solderability with SnPb and Pb free solders • good solder joint reliability • used in high volume • offered by major lead frame suppliers • whisker free NiPdAu pre-plated leadframes are chosen as alternative Pb-free solution and will be applied in SO, SSOP and TSSOP packages. Initially just for in-house assembly, later also at subcontractors delivering to Philips. Untill subcontractors can offer NiPdAu, their packages will be in matte Sn. In the long term roadmap, the part of NiPdAu might be increased to other families. Date: 23 February 2005 Author: Rob de Heus Page: 4 Revision: 02 IC Manufacturing Operations Philips Semiconductors 3.2 Document Number RNR-83-05/RdH/RdH-2008 Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Molding Compounds EMEG600 is a SiO2 filled epoxy moulding compounds designed for improved JEDEC moisturizing performance and HTSL performance. In Table 1 the properties of EMEG600 are compared to the reference materials MP8000 and KMC184. Table 1: Manufacturers Typical Properties of MP8000/KMC and G600 Molding Compound Properties Resin type Current Current Planned Production Production Change MP8000 KMC184 EMEG600 NITTO SHIN-ETSU SUMITOMO epoxy multi aromatic epoxy cresol cresol novalac novalac epoxy Hardener type phenol novalac phenol novalac multi aromatic Filler type (%) 75 81 86 Flame-retardant system brominated brominated none epoxy + epoxy + antimony oxide antimony oxide Antimony oxide yes yes no Tg (ºC) 140 160 135 Specific gravity 1.88 1.89 1.99 α1 (ppm/ºC) 16.1 13 10 α2 (ppm/ºC) 64.7 59 39 140 120 185 2 Flexural strength @RT (N/mm ) 2 Flexural modulus @RT (N/mm ) 12200 12300 24000 2 20 16/17 21@260ºC Flexural modulus @240ºC (N/mm ) 2 1000 1200 720@260ºC Dielectric Constant at 1MHz 3.8 3.9 4.0 Dissipation Factor at 1MHz 0.8 0.007 0.005 Volume Resistivity at 150ºC (Ωm) 7X10 3X10 > 1X10 Thermal Conductivity (W/mK) 0.75 0.63 0.92 UL94-V0 Flammability 1/8" 1/8" 1/8" Oxygen index 38 <35 53 Polymer mass (%) 22 25 11-15 Flexural strength @240ºC (N/mm ) Date: 23 February 2005 12 Author: Rob de Heus 12 12 Page: 5 Revision: 02 IC Manufacturing Operations Philips Semiconductors 3.3 Document Number RNR-83-05/RdH/RdH-2008 Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Die Attach Glues Ablebond 8290 is a silver filled die-attach glue, designed for improved JEDEC moisturizing performance. In Table 2 the properties of Ablebond 8290 is compared to the reference materials Ablebond 84-1LMISR4 and Ablebond 8390. Table 2: Manufacturers Typical Properties of Ablebond 84-LMISR4/8390 and Ablebond 8290. Die Attach Properties Adhesive Type Filler Viscosity @ 25°C Thixotropic Index Volume Resistivity Thermal Conductivity @ 121°C Glass Transition Temp Coefficient of Thermal Expansion - Below Tg - Above Tg Ionic Data - Chlorine - Sodium - Potassium Water Extract - Conductivity - pH Storage Life Date: 23 February 2005 Current Production Ablebond 84-1LMISR4 ABLESTIK Epoxy Silver 8,000 cps Current Production Ablebond 8390 ABLESTIK Epoxy Silver 9,800 cps Planned Change Ablebond 8290 ABLESTIK Epoxy Silver 9,000 cps 5.6 4.5 5.3 0.0001 Ω-cm 0.002 Ω-cm 0.008 Ω-cm 2.5 W/m°K 1.0 W/m°K 1.1 W/m°K 120°C 60°C 38°C 40 ppm/°C 150 ppm/°C 83 ppm/°C 165 ppm/°C 81 ppm/°C 181 ppm/°C < 5 ppm < 3 ppm < 1 ppm < 1 ppm < 3 ppm < 1 ppm < 19 ppm < 12 ppm < 1 ppm 13 µmhos/cm 6.0 70 µmhos/cm 7.4 100 µmhos/cm 1 year at –40°C 1 year at –40°C 1 year at –40°C Author: Rob de Heus Page: 6 Revision: 02 IC Manufacturing Operations Philips Semiconductors 4. Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Constructional Details of Test vehicles Lot Assy Site Package / Pin Outline Moulding compound Die-Attach Adhesive Pitch/ E or P Die Pad Size (mm) Die Size (mm) Vehicle name Subpack old Lot Assy Site Package / Pin Outline Moulding compound Die-Attach Adhesive Pitch/ E or P Die Pad Size (mm) Die Size (mm) Vehicle name Subpack old Date: 23 February 2005 ATP-2-01 ATP-2-02 ATP-3-01 ATP-3-02 ATP SSOP16 SOT338-1 G600 8290 0.65 / P 3.3 x 3.3 1.14 x 1.45 74LV4051DB ATP SSOP20 SOT339-1 G600 8290 0.65 / P 3.0 x 3.0 0.095 x 1.205 74HC574DB ATP SSOP24 SOT340-1 G600 8290 0.65 / P 3.9 x 5.9 2.77 x 4.76 TEA5880TS/N1 ATP SSOP24 SOT340-1 G600 8290 0.65 / P 3.9 x 5.9 2.77 x 4.76 TEA5880TS/N1 SOT338AA1 SOT339AA1 SOT340GA7 SOT340GA7 ATP-4-01 ATP-4-02 ATP SSOP28 SOT341-1 G600 8290 0.65 / P 3.5 x 3.5 1.69 x 1.88 TDA6502ATS/C1 ATP SSOP28 SOT341-1 G600 8290 0.65 / P 3.5 x 3.5 1.69 x 1.88 TDA6502ATS/C1 SOT341GA1 SOT341GA1 Author: Rob de Heus Page: 7 Revision: 02 IC Manufacturing Operations Philips Semiconductors 5. Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Reliability Test Program An extensive qualification program has been executed to demonstrate Amkor can assemble SSOP16/20/24/28 packages with a high quality and reliability, using NiPdAu leadframes, Sumitomo G600 molding compound and Ablestik 8290 die-attach glue. The reliability qualification test matrix can be found in Section 6. In this section the reliability tests are described in detail. These tests are stated in Philips Semiconductors’ General Quality Specification (SNW-FQ-611) and the Plastic Package Qualification Guideline (SNW-FA-04-07). AEC_Q100 is used as a guideline for specific automotive products. 5.1 Reliability Test Details Pcon – Preconditioning SMD Qualification samples for PPOT, HAST/THBS and TMCL undergo SMD reflow preconditioning before reliability test is performed. This preconditioning is performed in accordance with the latest revision of the IPC/JEDEC J-STD-020C specification, as described in Philips Semiconductors specification SNW-FQ-225A. SMD Packages are preconditioned to the appropriate MSL level using 260 ºC reflow temperature only. PPOT – Pressure Pot Test Pressure Pot Test – autoclave (121°C, 100%R.H., 96 hrs release time point), unbiased with Pcon. This test is particularly suitable to evaluate the moisture resistance of the package. HAST – Highly Accelerated Stress Test Highly Accelerated Stress Test (130°C/85% R.H., 96 hrs release time point), with electrical bias and Pcon. This test stresses both the electrical endurance of the design/process, as well as the resistance to moisture of the package. TMCL – Temperature Cycling Temperature Cycling (air to air –65°C ⇔ +150°C, 500 cyc release point) with Pcon. This test is aimed at the mechanical integrity of the whole product, under the severe circumstances of rapid changes in temperature. HTSL – High Temperature Storage Life High Temperature Storage Life (150°C, 1000 hrs release time point). This test evaluates the reliability of the product after long term storage Date: 23 February 2005 Author: Rob de Heus Page: 8 Revision: 02 IC Manufacturing Operations Philips Semiconductors 5.2 Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Construction Analysis Tests Descriptions In addition to the reliability evaluation, qualification lots will be subjected to Construction Analysis and Moisture Sensitivity Level assessment testing. Abbreviations used in the tables: • • • • • • • • • • Visual/Mechanical Inspection (V/M) Lead Finish Inspection (LFNH) Moisture Sensitivity Level Assessment X-Ray Inspection (X-RAY) SCAT Inspection (SCAT) Die Shear Testing (DISH) Bond Pull Testing (BPT) Bond Shear Testing (BST) Cross Section Inspection (CROSS) Solderability Inspection (SOLD) Date: 23 February 2005 Author: Rob de Heus SNW-FQ-612B Local document SNW-FQ-225B SNW-FQ-312 SNW-FQ-311 SNW-FQ-322 SNW-FQ-322 SNW-FQ-322 SNW-FQ-314 SNW-FQ-221 Page: 9 Revision: 02 IC Manufacturing Operations Philips Semiconductors 6. Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Self-qualification results. Table 3: “Wet” Reliability Stress Tests SSOP packages Lot PCON PPOT HAST Package No. Device 260 °C pcon 96 hrs 192 hrs pcon 96 hrs 192 hrs SSOP16 ATP-2-01 74LV4051DB L1 0/45 0/45 0/45 SSOP24 ATP-3-01 TEA5880TS/N1 L3 0/77 0/77 0/77 SSOP24 ATP-3-02 TEA5880TS/N1 L3 0/77 0/77 SSOP28 ATP-4-01 TDA6502ATS/C1 L2 0/77 0/77 0/77 SSOP28 ATP-4-02 TDA6502ATS/C1 L2 0/77 0/77 Reliability qualification requirements time points are shown in bold, additional time points are for engineering evaluation. Table 4: “Dry” Reliability Stress Tests SSOP packages Lot PCON TMCL HTSL Package No. Device 260 °C Pcon 200 cyc 500 cyc 1000 cyc 1000 hrs SSOP16 ATP-2-01 74LV4051DB L1 0/77 0/77 0/77 0/77 SSOP24 ATP-3-01 TEA5880TS/N1 L3 0/77 0/77 0/77 0/77 0/77 SSOP24 ATP-3-02 TEA5880TS/N1 L3 0/77 0/77 0/77 0/77 SSOP28 ATP-4-01 TDA6502ATS/C1 L2 0/77 0/77 0/77 SSOP28 ATP-4-02 TDA6502ATS/C1 L2 0/77 0/77 0/77 Reliability qualification requirements time points are shown in bold, additional time points are for engineering evaluation. Date: 23 February 2005 Author: Rob de Heus Page: 10 Revision: 02 IC Manufacturing Operations Philips Semiconductors Document Number RNR-83-05/RdH/RdH-2008 Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Table 5: Construction Analysis for SSOP packages Lot Package No. Device MSLA 260 °C SSOP16 ATP-2-01 74LV4051DB L1 SSOP24 ATP-3-01 TEA5880TS/N1 L3 SSOP24 ATP-3-02 TEA5880TS/N1 L3 SSOP28 ATP-4-01 TDA6502ATS/C1 L2 SSOP28 ATP-4-02 TDA6502ATS/C1 L2 V/M LFNH Construction Analysis Tests SOLD XRAY SCAT DISH BP/BS CROSS 0/3 0/3 0/3 0/3 - 0/3 0/3 0/3 0/3 - 0/3 0/3 0/3 0/3 - See note 0/15 0/15 0/15 0/15 - 0/3 0/3 0/3 0/3 - 0/44 0/44 0/44 0/44 - 0/8 0/8 0/8 0/8 - 0/8 0/8 0/8 0/8 - Note: 11 parts tested in SnPb solder after 8h steam age, 5 sec, 215 ºC 11 parts tested in SnPb solder after 16h dry-bake, 5 sec, 215 ºC 11 parts tested in SAC solder after 8h steam age, 3 sec, 245 ºC 11 parts tested in SAC solder after 16h dry-bake, 3 sec, 245 ºC RMA flux used for all tests. Date: 23 February 2005 Author: Rob de Heus Page: 11 Revision: 02 IC Manufacturing Operations Philips Semiconductors 7. Self Qualification Results: NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number RNR-83-05/RdH/RdH-2008 Conclusion An extensive qualification program has been executed to demonstrate that: • ATP can assemble SSOP16/20/28 packages using NiPdAu pre-plated leadframes & Ablestik 8290 die-attach & Sumitomo G600 mold compound, with a high quality and reliability, under leadfree (260ºC) soldering conditions. With the positive completion of the Qualification tests, the IC Manufacturing Operations of Philips Semiconductors announces the release of SSOP14/16/20/24/28 packages assembled in ATP using : • Sumitomo G600 moulding compound and • Ablestik 8290 die-attach glue and • NiPdAu pre-plated leadframes. via CPCN200305025S7 8. Implementation Deliveries will start from May 2005 onwards. Note: results for the following packages are not yet available and will be reported later : SSOP16 SOT519 SSOP20 SOT724 SSOP24 SOT556 9. Document Revision Sheet REVISION SHEET DATE yyyy/mm/dd 2005-02-01 2005-02-23 Date: 23 February 2005 REV DESCRIPTION 01 02 AUTHOR Self Qualification Results for NiPdAu pre-plated Rob de Heus leadframes + Ablestik 8290 die-attach + Sumitomo G600 mold compounds for SSOP14/16/20/28 packages in ATP. Minor update Rob de Heus Author: Rob de Heus Page: 12 Revision: 02
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