Self Qual Results_PPF_phase 8 SSOP TEA5880TS Results Ppf Phase
User Manual: TEA5880TS
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IMO Backend Innovation
Divisional Philips Semiconductors
Philips Internal Report No.: RNR-83-05/RdH/RdH-2008
QTS Report Database No.: 050093
Self Qualification Results
NiPdAu pre-plated leadframes, Green Molding Compound and Green Die-Attach
for
SSOP16/20/24/28 packages
assembled at Subcontractor Amkor Technologies Philippines
Author: Rob de Heus Tel: +31-243534835
Sr. Project Leader Advanced Development Tel: +31-243533085
IMO Backend Innovation Fax: +31-243533350
Philips Semiconductors Nijmegen E-mail: rob.de.heus@philips.com
Building BY-1.052
Gerstweg 2, 6534 AE Nijmegen, the Netherlands
Issue Date : February 1st, 2005 updated February 23rd
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
2
Revision: 02
Table of Contents
1. Introduction ..................................................................................................................................................3
2. Assembly Facilities .......................................................................................................................................4
3. Material details.............................................................................................................................................4
3.1 NiPdAu pre-plated leadframes................................................................................................................4
3.2 Molding Compounds ..............................................................................................................................5
3.3 Die Attach Glues ....................................................................................................................................6
4. Constructional Details of Test vehicles.......................................................................................................7
5. Reliability Test Program..............................................................................................................................8
5.1 Reliability Test Details ...........................................................................................................................8
5.2 Construction Analysis Tests Descriptions ..............................................................................................9
6. Self-qualification results.............................................................................................................................10
7. Conclusion...................................................................................................................................................12
8. Implementation...........................................................................................................................................12
9. Document Revision Sheet...........................................................................................................................12
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
3
Revision: 02
1. Introduction
The intention of the change to lead-free + green SSOP packages from Philips ( assembly at Amkor)
has been announced in the Correction CPCN for Pb-free, issued in November 2004, CPCN #
200305025C.
This self qualification report presents an overview of the qualification data completed to release the
following packages in NiPdAu + Ablestik Ablebond 8290 die-attach + Sumitomo EMEG600 mold
compound:
• SSOP14(*)/16/20/24/28 assembled in Amkor Technologies Philippines
(*) SSOP14 to be released by structural similarity
In order to validate assembly quality and reliability, a self-qualification program has been performed
for above mentioned packages.
The results of this qualification demonstrate that Philips Semiconductors can achieve distinctive
assembly quality with equal or better product quality and reliability when compared to the lead-tin
plated versions of these products.
With the introduction of above mentioned materials, these packages fully comply to the RoHS 2006
legislations and also fulfils the future legislation on banning of Halogenes and Antimony Oxides.
Combination of the new die-attach glues and the new molding compounds improves the package
quality, especially towards the higher reflow temperatures which are required for leadfree soldering.
Note: results for the following packages are not yet available and will be reported later :
SSOP16 SOT519
SSOP20 SOT724
SSOP24 SOT556
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
4
Revision: 02
2. Assembly Facilities
AMKOR Technologies Philippines (ATP)
AMKOR is one of Philips preferred subcontractors and is established in 1968. Amkor has grown to
be a world-class leader in integrated circuit (IC) packaging, assembly and test services. AMKOR
has assembly factories in Korea (ATK), Taiwan (ATT), China (ATC) and the Philippines (ATP).
Package family portfolio of AMKOR/ANAM consists of amongst others DIP, SO, SSOP, PLCC,
QFP, (LF)BGA and CSP. AMKOR is certified SAC level 1.
3. Material details
3.1 NiPdAu pre-plated leadframes
main characteristics :
• good solderability with SnPb and Pb free solders
• good solder joint reliability
• used in high volume
• offered by major lead frame suppliers
• whisker free
NiPdAu pre-plated leadframes are chosen as alternative Pb-free solution and will be applied in SO,
SSOP and TSSOP packages. Initially just for in-house assembly, later also at subcontractors
delivering to Philips.
Untill subcontractors can offer NiPdAu, their packages will be in matte Sn.
In the long term roadmap, the part of NiPdAu might be increased to other families.
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
5
Revision: 02
3.2 Molding Compounds
EMEG600 is a SiO2 filled epoxy moulding compounds designed for improved JEDEC moisturizing
performance and HTSL performance. In Table 1 the properties of EMEG600 are compared to the
reference materials MP8000 and KMC184.
Table 1: Manufacturers Typical Properties of MP8000/KMC and G600
Molding Compound Properties Current
Production
MP8000
NITTO
Current
Production
KMC184
SHIN-ETSU
Planned
Change
EMEG600
SUMITOMO
Resin type epoxy cresol
novalac
epoxy cresol
novalac
multi aromatic
epoxy
Hardener type phenol novalac phenol novalac multi aromatic
Filler type (%) 75 81 86
Flame-retardant system brominated
epoxy +
antimony oxide
brominated
epoxy +
antimony oxide
none
Antimony oxide yes yes no
Tg (ºC) 140 160 135
Specific gravity 1.88 1.89 1.99
α1 (ppm/ºC) 16.1 13 10
α2 (ppm/ºC) 64.7 59 39
Flexural strength @RT (N/mm2) 140 120 185
Flexural modulus @RT (N/mm2) 12200 12300 24000
Flexural strength @240ºC (N/mm2) 20 16/17 21@260ºC
Flexural modulus @240ºC (N/mm2)
1000 1200 720@260ºC
Dielectric Constant at 1MHz 3.8 3.9 4.0
Dissipation Factor at 1MHz 0.8 0.007 0.005
Volume Resistivity at 150ºC (Ωm) 7X1012 3X1012 > 1X1012
Thermal Conductivity (W/mK) 0.75 0.63 0.92
UL94-V0 Flammability 1/8" 1/8" 1/8"
Oxygen index 38 <35 53
Polymer mass (%) 22 25 11-15
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
6
Revision: 02
3.3 Die Attach Glues
Ablebond 8290 is a silver filled die-attach glue, designed for improved JEDEC moisturizing
performance. In Table 2 the properties of Ablebond 8290 is compared to the reference materials
Ablebond 84-1LMISR4 and Ablebond 8390.
Table 2: Manufacturers Typical Properties of Ablebond 84-LMISR4/8390 and Ablebond 8290.
Die Attach
Properties Current
Production
Ablebond
84-1LMISR4
ABLESTIK
Current
Production
Ablebond
8390
ABLESTIK
Planned
Change
Ablebond
8290
ABLESTIK
Adhesive Type Epoxy Epoxy Epoxy
Filler Silver Silver Silver
Viscosity @
25°C 8,000 cps 9,800 cps 9,000 cps
Thixotropic
Index 5.6 4.5 5.3
Volume
Resistivity 0.0001 Ω-cm 0.002 Ω-cm 0.008 Ω-cm
Thermal
Conductivity @
121°C
2.5 W/m°K
1.0 W/m°K
1.1 W/m°K
Glass
Transition
Temp
120°C 60°C 38°C
Coefficient of
Thermal
Expansion
- Below Tg
- Above Tg
40 ppm/°C
150 ppm/°C
83 ppm/°C
165 ppm/°C
81 ppm/°C
181 ppm/°C
Ionic Data
- Chlorine
- Sodium
- Potassium
< 5 ppm
< 3 ppm
< 1 ppm
< 1 ppm
< 3 ppm
< 1 ppm
< 19 ppm
< 12 ppm
< 1 ppm
Water Extract
- Conductivity
- pH
13 µmhos/cm
6.0
70 µmhos/cm
7.4
100
µmhos/cm
Storage Life 1 year at
–40°C 1 year at
–40°C 1 year at
–40°C
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
7
Revision: 02
4. Constructional Details of Test vehicles
Lot ATP-2-01 ATP-2-02 ATP-3-01 ATP-3-02
Assy Site ATP ATP ATP ATP
Package / Pin SSOP16 SSOP20 SSOP24 SSOP24
Outline SOT338-1 SOT339-1 SOT340-1 SOT340-1
Moulding compound G600 G600 G600 G600
Die-Attach Adhesive 8290 8290 8290 8290
Pitch/ E or P 0.65 / P 0.65 / P 0.65 / P 0.65 / P
Die Pad Size (mm) 3.3 x 3.3 3.0 x 3.0 3.9 x 5.9 3.9 x 5.9
Die Size (mm) 1.14 x 1.45 0.095 x 1.205 2.77 x 4.76 2.77 x 4.76
Vehicle name 74LV4051DB 74HC574DB TEA5880TS/N1 TEA5880TS/N1
Subpack old
SOT338AA1
SOT339AA1
SOT340GA7
SOT340GA7
Lot ATP-4-01 ATP-4-02
Assy Site ATP ATP
Package / Pin SSOP28 SSOP28
Outline SOT341-1 SOT341-1
Moulding compound G600 G600
Die-Attach Adhesive 8290 8290
Pitch/ E or P 0.65 / P 0.65 / P
Die Pad Size (mm) 3.5 x 3.5 3.5 x 3.5
Die Size (mm) 1.69 x 1.88 1.69 x 1.88
Vehicle name TDA6502ATS/C1 TDA6502ATS/C1
Subpack old
SOT341GA1
SOT341GA1
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
8
Revision: 02
5. Reliability Test Program
An extensive qualification program has been executed to demonstrate Amkor can assemble
SSOP16/20/24/28 packages with a high quality and reliability, using NiPdAu leadframes,
Sumitomo G600 molding compound and Ablestik 8290 die-attach glue.
The reliability qualification test matrix can be found in Section 6.
In this section the reliability tests are described in detail. These tests are stated in Philips
Semiconductors’ General Quality Specification (SNW-FQ-611) and the Plastic Package
Qualification Guideline (SNW-FA-04-07). AEC_Q100 is used as a guideline for specific
automotive products.
5.1 Reliability Test Details
Pcon – Preconditioning
SMD Qualification samples for PPOT, HAST/THBS and TMCL undergo SMD reflow
preconditioning before reliability test is performed. This preconditioning is performed in
accordance with the latest revision of the IPC/JEDEC J-STD-020C specification, as described in
Philips Semiconductors specification SNW-FQ-225A. SMD Packages are preconditioned to the
appropriate MSL level using 260 ºC reflow temperature only.
PPOT – Pressure Pot Test
Pressure Pot Test – autoclave (121°C, 100%R.H., 96 hrs release time point), unbiased with Pcon.
This test is particularly suitable to evaluate the moisture resistance of the package.
HAST – Highly Accelerated Stress Test
Highly Accelerated Stress Test (130°C/85% R.H., 96 hrs release time point), with electrical bias
and Pcon. This test stresses both the electrical endurance of the design/process, as well as the
resistance to moisture of the package.
TMCL – Temperature Cycling
Temperature Cycling (air to air –65°C ⇔ +150°C, 500 cyc release point) with Pcon. This test is
aimed at the mechanical integrity of the whole product, under the severe circumstances of rapid
changes in temperature.
HTSL – High Temperature Storage Life
High Temperature Storage Life (150°C, 1000 hrs release time point). This test evaluates the
reliability of the product after long term storage
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for
SSOP16/20/24/28 at ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
9
Revision: 02
5.2 Construction Analysis Tests Descriptions
In addition to the reliability evaluation, qualification lots will be subjected to Construction
Analysis and Moisture Sensitivity Level assessment testing. Abbreviations used in the tables:
• Visual/Mechanical Inspection (V/M) SNW-FQ-612B
• Lead Finish Inspection (LFNH) Local document
• Moisture Sensitivity Level Assessment SNW-FQ-225B
• X-Ray Inspection (X-RAY) SNW-FQ-312
• SCAT Inspection (SCAT) SNW-FQ-311
• Die Shear Testing (DISH) SNW-FQ-322
• Bond Pull Testing (BPT) SNW-FQ-322
• Bond Shear Testing (BST) SNW-FQ-322
• Cross Section Inspection (CROSS) SNW-FQ-314
• Solderability Inspection (SOLD) SNW-FQ-221
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
10
Revision: 02
6. Self-qualification results.
Table 3: “Wet” Reliability Stress Tests SSOP packages
Lot PCON PPOT HAST
Package No. Device 260 °C pcon 96 hrs 192 hrs pcon 96 hrs 192 hrs
SSOP16 ATP-2-01 74LV4051DB L1 - - - 0/45 0/45 0/45
SSOP24 ATP-3-01 TEA5880TS/N1 L3 0/77 0/77 0/77 - - -
SSOP24 ATP-3-02 TEA5880TS/N1 L3 0/77 0/77 - - - -
SSOP28 ATP-4-01 TDA6502ATS/C1 L2 0/77 0/77 0/77 - - -
SSOP28 ATP-4-02 TDA6502ATS/C1 L2 0/77 0/77 - - - -
Reliability qualification requirements time points are shown in bold, additional time points are for engineering evaluation.
Table 4: “Dry” Reliability Stress Tests SSOP packages
Lot PCON TMCL HTSL
Package No. Device 260 °C Pcon 200 cyc
500 cyc 1000 cyc
1000 hrs
SSOP16 ATP-2-01 74LV4051DB L1 0/77 0/77 0/77 - 0/77
SSOP24 ATP-3-01 TEA5880TS/N1 L3 0/77 0/77 0/77 0/77 0/77
SSOP24 ATP-3-02 TEA5880TS/N1 L3 0/77 0/77 0/77 - 0/77
SSOP28 ATP-4-01 TDA6502ATS/C1 L2 0/77 0/77 0/77 - -
SSOP28 ATP-4-02 TDA6502ATS/C1 L2 0/77 0/77 0/77 - -
Reliability qualification requirements time points are shown in bold, additional time points are for engineering evaluation.
IC Manufacturing Operations
Philips Semiconductors Self Qualification Results:
NiPdAu & green BoM for SSOP16/20/24/28 at ATP Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
11
Revision: 02
Table 5: Construction Analysis for SSOP packages
Lot Construction Analysis Tests
Package No. Device MSLA
260 °C
V/M LFNH SOLD
See note
XRAY SCAT DISH BP/BS CROSS
SSOP16 ATP-2-01 74LV4051DB L1 0/15 0/3 0/44 0/8 0/8 0/3 0/3 0/3
SSOP24 ATP-3-01 TEA5880TS/N1 L3 0/15 0/3 0/44 0/8 0/8 0/3 0/3 0/3
SSOP24 ATP-3-02 TEA5880TS/N1 L3 0/15 0/3 0/44 0/8 0/8 0/3 0/3 0/3
SSOP28 ATP-4-01 TDA6502ATS/C1 L2 0/15 0/3 0/44 0/8 0/8 0/3 0/3 0/3
SSOP28 ATP-4-02 TDA6502ATS/C1 L2 - - - - - - - -
Note:
11 parts tested in SnPb solder after 8h steam age, 5 sec, 215 ºC
11 parts tested in SnPb solder after 16h dry-bake, 5 sec, 215 ºC
11 parts tested in SAC solder after 8h steam age, 3 sec, 245 ºC
11 parts tested in SAC solder after 16h dry-bake, 3 sec, 245 ºC
RMA flux used for all tests.
IC Manufacturing
Operations
Philips Semiconductors
Self Qualification Results:
NiPdAu & green BoM for SSOP16/20/24/28 at
ATP
Document Number
RNR-83-05/RdH/RdH-2008
Date: 23 February 2005
Author:
Rob de Heus
Page:
12
Revision: 02
7. Conclusion
An extensive qualification program has been executed to demonstrate that:
• ATP can assemble SSOP16/20/28 packages using NiPdAu pre-plated leadframes & Ablestik
8290 die-attach & Sumitomo G600 mold compound, with a high quality and reliability, under
leadfree (260ºC) soldering conditions.
With the positive completion of the Qualification tests, the IC Manufacturing Operations of Philips
Semiconductors announces the release of SSOP14/16/20/24/28 packages assembled in ATP using :
• Sumitomo G600 moulding compound and
• Ablestik 8290 die-attach glue and
• NiPdAu pre-plated leadframes.
via CPCN200305025S7
8. Implementation
Deliveries will start from May 2005 onwards.
Note: results for the following packages are not yet available and will be reported later :
SSOP16 SOT519
SSOP20 SOT724
SSOP24 SOT556
9. Document Revision Sheet
REVISION SHEET
DATE
REV
DESCRIPTION
AUTHOR
yyyy/mm/dd
2005-02-01 01 Self Qualification Results for NiPdAu pre-plated
leadframes + Ablestik 8290 die-attach + Sumitomo
G600 mold compounds for SSOP14/16/20/28
packages in ATP.
Rob de Heus
2005-02-23 02 Minor update Rob de Heus
