Multi Standard CC2650 SensorTag Design Guide User
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Multi-Standard CC2650 SensorTag Design Guide
TI Designs
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TI Designs provide the foundation that you need
including methodology, testing and design files to
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Tool Folder Containing Design Files
C-CC2650STKSENSORTAG
http://www.ti.com/product
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http://www.ti.com/product
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http://www.ti.com/product
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http://www.ti.com/product
/hdc1000
http://www.ti.com/tool/cc2
650stk
http://www.ti.com/tool/ccs
tudio
Product Folder
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Tools Folder
Tools Folder
ASK Our E2E Experts
WEBENCH® Calculator Tools
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Offers Cloud Connectivity Out of Box
– Access and Control Your SensorTag From
Anywhere and Explore a Seamless Integration
With Mobile Applications and Web Pages
Through Javascript and MQTT
Supports Multi-Standard Wireless MCU
– Bluetooth® Smart
– ZigBee®
– IPv6 over low-power wireless personal area
networks (6LoWPAN)
Offers Low Power
Supports 10 Low-Power Sensors
– Ambient Light
– Infrared Temperature
– Ambient Temperature
– Accelerometer
– Gyroscope
– Magnetometer
– Pressure
– Humidity
– Microphone
– Magnetic Sensor
Based on the Extremely Low-Power and HighPerformance ARM® Cortex®-M3 CC2650 Wireless
MCU
Can Use DevPacks to Expand the Functionality of
the SensorTag to Fit Your Design Ideas
– The Emulator Debug DevPack With a Free
Code Composer Studio™ IDE License,
Provides a Complete Development System.
Featured Applications
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Handsets for Smart Phones
Home Automation
Sensor Nodes
Smart Watches
Weather Stations
Code Composer Studio, SimpleLink are trademarks of Texas Instruments.
Cortex is a registered trademark of ARM Limited.
ARM is a registered trademark of ARM Physical IP Inc.
iOS, iBeacon, Apple App Store are trademarks of Apple Inc.
Bluetooth is a registered trademark of Bluetooth SIG.
Android, Google Play are trademarks of Google Inc.
ZigBee is a registered trademark of Zigbee Alliance.
All other trademarks are the property of their respective owners.
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1
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Buzzer
Coin Cell/
2x AAA
2x Push
Buttons
DevPack
Interface
CC3200
(WiFi)
CC2650
(BLE/ZigBee)
LED
JTAG
Interface
PDM
Reed Relay
MK24
Microphone
SPK0833
I2C
Light Sensor
OPT3001
Altimeter
BMP280
9-axis Motion
MPU-9250
Humidity/Temp
HDC1000
IR Temp
Sensor
TMP007
An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other
important disclaimers and information.
2
Multi-Standard CC2650 SensorTag Design Guide
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System Description
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1
System Description
1.1
Multi-Standard CC2650 SensorTag
The SensorTag kit invites you to realize your cloud-connected product idea. The new SensorTag includes
10 low-power MEMS sensors in a small package and is expandable with DevPacks that make adding your
own sensors or actuators easy.
Connect to the cloud with Bluetooth Smart and get your sensor data online in three minutes. The
SensorTag is ready to use right out the box with an iOS™ and Android™ application and require no
programming experience to get started.
The SensorTag is based on the low-power and high-performance CC2650 wireless MCU, which offers
75% lower power consumption than previous Bluetooth Smart products. This rate of power consumption
lets the SensorTag use battery power and offers years of battery life from a single coin cell battery.
The Bluetooth Smart SensorTag includes iBeacon™ technology. This technology allows your phone to
launch applications and customize content based on SensorTag data and your physical location.
The SensorTag can be enabled with ZigBee / 6LoWPAN technology.
Visit www.ti.com/SensorTag for more information on SensorTag technology.
1.1.1
Block Diagram
Buzzer
Coin Cell/
2x AAA
2x Push
Buttons
DevPack
Interface
CC3200
(WiFi)
CC2650
(BLE/ZigBee)
LED
JTAG
Interface
PDM
Reed Relay
MK24
Microphone
SPK0833
I2C
Light Sensor
OPT3001
Altimeter
BMP280
9-axis Motion
MPU-9250
Humidity/Temp
HDC1000
IR Temp
Sensor
TMP007
Figure 1. Block Diagram
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Highlighted Products
2
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Highlighted Products
The design features the following devices:
• CC2650
• OPT3001
• TMP007
• HDC1000
For more information on these devices, see the product folders at www.TI.com.
2.1
CC2650 – Wireless MCU
The CC2650 device is a wireless MCU targeting Bluetooth Smart, ZigBee and 6LoWPAN, and ZigBee
RF4CE remote control applications.
The device is a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. The
ability to consume very low active RF and MCU currents and low-power mode currents provides excellent
battery life for the device. This ability also lets the device operate on small coin cell batteries and in
energy-harvesting applications.
Figure 2. CC2650 Functional Block Diagram
4
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Highlighted Products
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2.2
OPT30001 – Ambient Light Sensor
The OPT3001 sensor measures the intensity of visible light. The spectral response of the sensor closely
matches the photopic response of the human eye and includes infrared rejection.
VDD
VDD
OPT3001
Ambient
Light
Optical
Filter
SCL
ADC
I2C
Interface
SDA
INT
ADDR
GND
Figure 3. OPT3001 Functional Block Diagram
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Highlighted Products
2.3
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TMP007 – Infrared Thermopile Temperature Sensor
The TMP007 sensor is an IR thermopile sensor that measures the temperature of an object without direct
contact with it. The integrated thermopile absorbs the infrared energy from the object in the field of view of
the sensor. The device digitizes the thermopile voltage and then provides it and the die temperature as
inputs to the integrated math engine. The math engine then computes the temperature of the
corresponding object.
V+
IR
Thermopile
Sensor
EEPROM
Voltage
Reference
Gain
ALERT
ADR0
ADR1
SCL
SDA
I2C and
SMBus
Compatible
Digital
Interface
Digital
Control
and
Math Engine
16-Bit
ADC
Local
Temperature
TMP007
AGND
DGND
Figure 4. TMP007 Functional Block Diagram
2.4
HDC1000 – Humidity Sensor With Integrated Temperature Sensor
The HDC1000 sensor is a factory-calibrated digital humidity sensor with an integrated temperature sensor
that provide accurate measurements at very low power. The HDC1000 sensor measures humidity based
on a novel capacitive sensor and functions within thetemperature range of –40°C to 125°C. The innovative
WLCSP (wafer-level chip scale package) simplifies board design with an ultra compact package and the
sensing element on the bottom of the HDC1000 device protects against dirt, dust, and other contaminants.
3.3 V
RH
HDC1000
ADC
TEMPERATURE
3.3 V
3.3 V
VDD
Registers
+
Logic
I2C
SDA
SCL
DRDYn
ADR0
ADR1
MCU
VDD
2
IC
Peripheral
GPIO
OTP
Calibration Coefficients
GND
GND
Figure 5. HDC1000 Functional Block Diagram
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System Design Theory
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3
System Design Theory
The SensorTag is a complete development kit that requires no knowledge of embedded software to get
started testing with the kit. Connect the SensorTag to your smart phone using Bluetooth Smart; then use
your phone to connect to the cloud and access your latest workout data online in a matter of minutes.
iBeacon lets your phone launch applications and customize content based on SensorTag data and your
physical location.
Get started quickly using your applications, the supporting iOS and Android applications, or the SensorTag
to develop your own product using the low-power sensors.
3.1
Application and Web Development
Access data from your SensorTag through cloud providers or use JavaScript and jQuery examples to
access data directly. Use Android and iOS mobile applications as starting points for your own Internet of
Things (IoT) projects or write HTML5 platform-independent code based on the source code from sample
web application projects.
3.2
Embedded Software Development
The SensorTag offers open hardware and software reference design for low-power IoT nodes at a low
cost. The SensorTag with the Debug DevPack provide the most affordable platform for developing
hardware. Port the SensorTag application between radio standards to quickly evaluate which wireless
technology is right for your application.
3.3
Hardware Development
Use the SensorTag hardware as the development platform for your IoT project. The open hardware
demonstrates how to use 10 low-power sensors. The DevPack interface makes it easy to develop and test
your own sensors and actuators on the IoT cloud.
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Getting Started
4
Getting Started
4.1
Hardware
www.ti.com
The SensorTag kit includes everything needed to get started. Download the free SensorTag application
from the Apple App Store™ or Google Play™ and get started with your IoT development.
4.2
Firmware
4.2.1
The Bluetooth Low Energy Stack (BLE-STACK-2): includes download links for the SensorTag Bluetooth
Low Energy firmware.
4.2.2
SensorTag ZigBee Firmware
The ZigBee stack (Z-STACK-HOME) includes download links for the SensorTag ZigBee firmware.
4.2.3
SensorTag 6LowPAN Firmware
The Contiki stack includes download links for the SensorTag 6LowPAN firmware.
5
Test Setup
We measured the antenna radiation pattern in a 3-m long RF shielded room (an anechoic chamber). The
device under test (DUT) was set in transmit mode and rotated around to create a 360° antenna radiation
pattern. The measurement antenna was placed in the opposite side of the chamber. The DUT transmitted
a continuous wave (CW) at 2440 MHz and the antenna measured the wave with 15° steps in azimuth and
elevation. Figure 6, Figure 7, and Figure 8 show the test set up.
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Test Setup
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Figure 6. Antenna Radiation Pattern
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Test Setup
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Figure 7. DUT Mounted On Rotating Arm
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Test Setup
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Figure 8. Measurement Antenna
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Test Data
6
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Test Data
Figure 9. Theta = 0, Phi = 0
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Test Data
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Figure 10. Theta = 180, Phi = 0
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Test Data
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Figure 11. Theta = 90, Phi = 0
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Test Data
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Figure 12. Theta = 90, Phi = 180
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Test Data
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Figure 13. Theta = 90, Phi = 270
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Test Data
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Figure 14. Theta = 90, Phi = 90
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Design Files
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7
Design Files
7.1
Schematics
To download the schematics for each board, see the design files at SWRR134.
H1
K1
VDD
JTAG_TCK
JTAG_TMS
BUTTON1
BUTTON2
LED1
LED2
SDA
SCL
SDA HP
SCL HP
nRESET
MPU INT
REED
MIC PWR
AUDIO DI
BUZZER
TMP RDY
DP_ID
DP0
DP1
DP2
DP3
DP4/UART_RX
DP5/UART_TX
DP6/AUDIO DO
DP7/AUDIO CLK
DP8/SCLK/TDI
DP9/MISO
DP10/MOSI
DP11/CSN
DP12/AUDIO FS/TDO
MPU PWR
FLASH_CS
VDD
VDD
VDD
JTAG_TCK
JTAG_TMS
JTAG_TCK
JTAG_TMS
BUTTON1
BUTTON2
LED1
LED2
BUTTON1
BUTTON2
LED1
LED2
SDA
SCL
SDA HP
SCL HP
BUZZER
nRESET
BUZZER
nRESET
nRESET
MPU INT
REED
MIC PWR
AUDIO DI
BUZZER
TMP RDY
DP_ID
DP0
DP1
DP2
DP3
DP4/UART_RX
DP5/UART_TX
DP6/AUDIO DO
DP7/AUDIO CLK
DP8/SCLK/TDI
DP9/MISO
DP10/MOSI
DP11/CSN
DP12/AUDIO FS/TDO
MPU PWR
FLASH_CS
DP_ID
SCL
SDA
DP0
DP1
DP2
DP3
DP4/UART_RX
DP5/UART_TX
DP6/AUDIO DO
DP7/AUDIO CLK
DP8/SCLK/TDI
DP9/MISO
DP10/MOSI
DP11/CSN
DP12/AUDIO FS/TDO
FLASH_CS
DP_ID
SCL
SDA
DP0
DP1
DP2
DP3
DP4/UART_RX
DP5/UART_TX
DP6/AUDIO DO
DP7/AUDIO CLK
DP8/SCLK/TDI
DP9/MISO
DP10/MOSI
DP11/CSN
DP12/AUDIO FS/TDO
FLASH_CS
Peripheral and Power
N1
VDD
VDD
SCL
SDA
SCL
SDA
SCL HP
SDA HP
SCL HP
SDA HP
CC2650
MPU INT
REED
TMP RDY
MPU INT
REED
TMP RDY
MIC PWR
DP7/AUDIO CLK
AUDIO DI
DP12/AUDIO FS/TDO
MPU PWR
MIC PWR
DP7/AUDIO CLK
AUDIO DI
DP12/AUDIO FS/TDO
MPU PWR
Sensors
Figure 15. CC2650STK Schematics
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VDDS
FL1
VDD
2
VDDR
VDDS Decoupling Capacitors
Pin 22
Pin 13
1
Pin 34
Pin 44
DCDC_SW 1
L1
10uH
VDDR Decoupling Capacitors
Pin 45
2
Pin 48
BLM18HE152SN1
C2
100nF
C1
DNM
C3
100nF
C4
100nF
C6
100nF
C5
22uF
C7
10uF
VDDS
24
25
35
JTAG_TMS
JTAG_TCK
nRESET
DCDC_SW 33
C12
100nF
3
4
23
49
Y1
JTAG_TMSC
JTAG_TCKC
RESET_N
VDDS2
VDDS3
VDDS
VDDS_DCDC
VDDR
VDDR
DCDC_SW
X32K_Q1
X32K_Q2
DCOUPL
VSS
RF_P
RF_N
X24M_N
X24M_P
13
22
44
34
45
48
A1
4
ANT1
1pF
1
2
1
C33 15pF
3
ANT4
2
2nH
46
47
1
ANT5
2
2
1
2nH
2.4nH
Y2
24MHz
1
C17
DNM_0402
4
ANT2
DNM
ANT3
1pF
J1
MS-156HF
3
2.4GHz
ANT6
0.5pF
C13
1pF
3
2
2
2
1
0
L3
1
C16
1uF
Coaxial
switch
C11
C32 15pF
32.768kHz
C15
12pF
C31
DNM
L2
2.4nH
1
CC26xx-7x7
C14
12pF
C9
100nF
2
VDDS VDDR
U1A
R1
100k
C8
100nF
C18
DNM_0402
VDD
MPU PWR
U1B
R4
10k
R2
10k
R5
10k
R3
10k
BUTTON2
TMP RDY
AUDIO DI
REED
BUTTON1
SDA
SCL
MPU INT
SDA HP
SCL HP
LED1
DP7/AUDIO CLK
MPU PWR
MIC PWR
FLASH_CS
LED2
5
6
7
8
9
10
11
12
14
15
16
17
18
19
20
21
DIO_0
DIO_1
DIO_2
DIO_3
DIO_4
DIO_5
DIO_6
DIO_7
DIO_8
DIO_9
DIO_10
DIO_11
DIO_12
DIO_13
DIO_14
DIO_15
DIO_16
DIO_17
DIO_18
DIO_19
DIO_20
DIO_21
DIO_22
DIO_23
DIO_24
DIO_25
DIO_26
DIO_27
DIO_28
DIO_29
DIO_30
26
27
28
29
30
31
32
36
37
38
39
40
41
42
43
DP12/AUDIO FS/TDO
DP8/SCLK/TDI
DP9/MISO
DP10/MOSI
DP11/CSN
BUZZER
DP6/AUDIO DO
DP2
VDD
DP1
DP0
VDD
R6
DP3
200k
DP4/UART_RX
DP5/UART_TX
DP_ID
CC26xx-7x7
Figure 16. CC2650STK Schematics
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Design Files
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Battery interface
Buzzer
VDD
R26
0
BAT+
R12
0
VDD_BATT
+
1+
BZ1
HCS0503B
BAT-
3
+
+
2
1
-
2
BT1
BAT-HLD-001
3
1
3
-
R7
BUZZER
Q1
BC846B
10k
2
R8
5.1
SKIN Connector
J2
VDD
SCL
DP12/AUDIO FS/TDO
DP11/CSN
DP10/MOSI
DP9/MISO
DP8/SCLK/TDI
DP_ID
1
3
5
7
9
11
13
15
17
19
Debug / JTAG interface
R23
DNM
2
4
6
8
10
12
14
16
18
20
SDA
DP7/AUDIO CLK
DP6/AUDIO DO
DP5/UART_TX
DP4/UART_RX
DP3
DP2
DP1
DP0
U2
B2
A1
DevPack->VDD
C1
V+
IN
NO COM
NC GND
A2
C2
B1
VDD
R9
2Meg
TS5A3159AYZPR
LSS-110-01-F-DV-A-TR
POWER GOOD
P1
2
4
6
8
10
JTAG_TMS
JTAG_TCK
DP12/AUDIO FS/TDO
DP8/SCLK/TDI
nRESET
1
3
5
7
9
VDD
BB02-BS101-KA8-025B00
External storage
LEDs and Buttons
2
R16
2.2k
R10
680
CR1
LED1
VDD
1
LED2
2
R27
150
1
R18
10k
U10
DP10/MOSI
DP8/SCLK/TDI
FLASH_CS
LS L296-P2Q2-1
CR3
R17
10k
5
6
1
3
7
9
4
LPL296-J2L2-25
DI/IO0
CLK
nCS
nWP
nHOLD
VCC
DO/IO1
8
2
VDD
DP9/MISO
C28
100nF
EGP
GND
W25X20CLUXIG
R21
270
BUTTON1
2
SW1
1
MTA2-WNC
R22
270
BUTTON2
2
SW2
1
MTA2-WNC
Figure 17. CC2650STK Schematics
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Design Files
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Reed Relay
Infrared Thermopile Sensor
Pressure Sensor
VDD
SW3
1
VDD
2
R11
0
REED
VDD
MK24-A
U3
SDA
3
5
SCL
4
2
VDD
1
7
SDI VDD
SDO
VDDIO
SCK
CSB
8
C19
100nF
6
U4
SCL
SDA
VDD
C20
GND
GND
100nF
C1
B1
C21
100nF
BMP280
Humidity
B3
C3
A1
A2
SCL V+
SDA
nALERT
ADR0
ADR1
A3
R50
2.2k
C2
TMP RDY
DGND
AGND
TMP007
U9
SDA
A2
SCL
A1
SDA
VDD
SCL
nDRDY
ADR0
ADR1
B2
GND
DNC
B1
VDD
D2
C22
C1
D1
VDD
100nF
C2
HDC1000YPA
Digital Microphone
U6
VDD
R31
0
2
4
DP7/AUDIO CLK
3
Gyroscope and accelerometer
SELECT
CLOCK
DATA
5
MIC PWR
C23
1
100nF
GND
SPH0641LU4H
R32
0
AUDIO DI
MPU PWR
C25
100nF
U8
MPU INT
SDA HP
SCL HP
MPU PWR
12
24
23
22
11
21
7
9
19
20
18
25
INT
SDA/SDI
SCL/SCLK
nCS
FSYNC
AUX_DA
AUX_CL
AD0/SDO
RESV_19
RESV_20
GND
EGP
VDD
VDDIO
REGOUT
RESV_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_14
NC_15
NC_16
NC_17
13
8
Light Sensor
10
C27
100nF
1
C26
10nF
MPU PWR
2
3
4
5
6
14
15
16
17
MPU-9250
U7
SCL
4
nCLK
VDD
ADDR
DATA
1
VDD
C24
VDD
2
3
7
GND
EGP/GND
nINT
6
SDA
100nF
5
OPT3001
Figure 18. CC2650STK Schematics
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Design Files
7.2
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Bill of Materials
To download the bill of materials (BOM), see the design files at SWRR135.
Table 1. BOM
ITEM
NUMBER
PART
REFERENCE
QUANTITY
VALUE
DESCRIPTION
MPN
MANUFACTURER
1
A1
1
DNM
Mechanic, 2.4-GHz inverted F antenna, SMD
DN007
TI
2
ANT1, ANT4
2
2 nH
Inductor, Chip, 2 nH, –0.3 nH / +0.3 nH, 0.3 A,
–55°C / 125°C,
0402, SMD
LQG15HS2N0S02D
Murata
3
ANT2, C17, C18, C31
4
DNM
Capacitor, Ceramic, N/A value, –55°C / 125°C,
0402, SMD
CAPACITOR_0402_DNM_N/A_M
Manufacturer
Selection
4
ANT3, C11, C13
3
1 pF
Capacitor, Ceramic C0G / NP0, 1 pF,
50 V, –0.25 pF / 0.25 pF,
–55°C / 125 °C, 0402, SMD
GRM1555C1H1R0CA01D
Murata
5
ANT5, R12, R26
3
0
Resistor, Thick Film, 0, – 5% / 5%, 0.063 W,
50 V, –55°C / 155°C, 0402, SMD
RESISTOR_0402_0_
±5%_50V_0.063W_M_±200PPM
Manufacturer
Selection
6
ANT6
1
0.5 pF
Capacitor, Ceramic C0G / NP0, 0.5 pF, 50 V,
–0.1 pF / 0.1 pF,
–55°C / 125°C, 0402, SMD
GRM1555C1HR50BA01D
Murata
7
BAT+
1
DNM
Noncomponent, Battery + Pad, SMD
8
BAT–
1
DNM
Noncomponent, Battery – Pad, SMD
9
BT1
1
BAT-HLD-001
Battery,
BAT-HLD-001
Holder for CR2032 and CR2025 batteries, SMD
Linx
10
BZ1
1
HCS0503B
Acoustic, Buzzer, 3 V, –40°C / 85°C, SMD
HCS0503B
Changzhou
Tianyin
11
C1
1
DNM
Capacitor, Ceramic X5R, 2.2 µF, 10 V,
–20% / 20%, –55°C / 85°C, 0603, SMD
GRM188R61A225ME34D
Murata
12
C2, C3, C4, C6, C8, C9,
C12
7
100 nF
Capacitor, Ceramic X7R, 100 nF, 6.3 V,
–10% / 10%, –55°C / 125°C, 0402, SMD
GRM155R70J104KA01D
Murata
13
C5
1
22 µF
Capacitor, Ceramic X5R, 22 µF, 4 V,
–20% / 20%, –55°C / 85°C, 0603, SMD
GRM188R60G226MEA0D
Murata
14
C7
1
10 µF
Capacitor, Ceramic X5R, 10 µF, 6.3 V,
–20% / 20%, –55°C / 85°C, 0603, SMD
GRM188R60J106ME47D
Murata
15
C14, C15
2
12 pF
Capacitor, Ceramic C0G / NP0, 12 pF,
50 V, –5% / +5%, –55 DEGC / +125 DEGC,
0402, SMD
GRM1555C1H120JA01D
Murata
16
C16
1
1 µF
Capacitor, Ceramic X5R, 1 µF, 10 V,
–10% / 10%, –55°C / 85°C, 0402, SMD
GRM155R61A105KE15D
Murata
17
C19, C20, C21, C22, C23, 9
C24, C25, C27, C28
100 nF
Capacitor, Ceramic X5R, 100 nF, 10 V,
–10% / 10%, –55°C / 85°C, 0201, SMD
CAPACITOR_0201_100nF_
X5R_I_±10%_10V
Manufacturer
Selection
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Table 1. BOM (continued)
ITEM
NUMBER
PART
REFERENCE
QUANTITY
VALUE
18
C26
1
10 nF
19
C29
1
DNM
20
C32, C33
2
21
CR1
22
DESCRIPTION
MPN
MANUFACTURER
Capacitor, Ceramic X5R, 10 nF, 10 V,
–10% / 10%, –55°C / 125°C, 0201, SMD
GRM033R71A103KA01D
Murata
15 pF
Capacitor, Ceramic, 15 pF, 50 V,
–5% / 5%, –55°C / 125°C, 0201, SMD
GRM0332C1H150JA01D
Murata
1
LS L296-P2Q2-1
Opto, LED, Super Red Color, 630 nm,
1.8 V TO 2.3 V, 0.06 A, 0603, SMD
LS L296-P2Q2-1-Z
Osram
CR3
1
LPL296-J2L2-25
Opto, LED, Green Color, 562 nm,
0.02 A, 0.08 W, 0603, SMD
LP L296-J2L2-25
Osram
23
FIDU1, FIDU2, FIDU3,
FIDU4, FIDU5, FIDU6
6
DNM
Fiducial Mark, Round 1.27 mm
24
FL1
1
BLM18HE152SN1
Filter, EMI, 1500 @ 100 MHz,
–55°C / 125°C, 0603, SMD
BLM18HE152SN1D
Murata
25
J1
1
MS-156HF
Connector Coax RF, Straight, Female, SMD
MS-156HF
Hirose
26
J2
1
LSS-110-01-F-DV-A- Connector, Header, Hi-speed Socket, Female,
TR
Straight, 2 Rows,
20 Pins, Pitch 0.635 mm, SMD
LSS-110-01-F-DV-A-TR
Samtec
27
L1
1
10 µH
Inductor, Chip, 10 µH, –20% / 20%,
0.11 A, –40°C / 85°C, 0805, SMD
CKS2125100M-T
Taiyo Yuden
28
L2, L3
2
2.4 nH
Inductor, Chip, 2.4 nH, –0.3 nH / 0.3 nH,
0.3 A, –55°C / 125°C, 0402, SMD
LQG15HS2N4S02D
Murata
29
P1
1
BB02-BS101-KA8025B00
Connector, Header, Male, 2 Rows,
10 Pins, Pitch 1.27 mm, SMD
BB02-BS101-KA8-025B00
Gradconn
30
Q1
1
BC846B
Transistor, Bipolar NPN,
65 V, 0.1 A, 0.25 W, SOT –23, SMD
BC846B,215
NXP
31
R1
1
100 k
Resistor, Thick Film, 100 k, –5% / 5%,
0.063 W, 50 V, -55°C / 155°C, 0402, SMD
RESISTOR_0402_100k_
+/-5%_50V_0.063W_M_±200PPM
Manufacturer
Selection
32
R2, R3, R4, R5, R7, R17,
R18
7
10 k
Resistor, Thick Film, 10 K, –5% / 5%,
0.05 W, 30 V, –55°C / 125°C, 0201, SMD
RESISTOR_0201_10k_
±5%_30V_0.05W_M_±200ppm
Manufacturer
Selection
33
R6
1
200 k
Resistor, Thick Film, 200 K, –1% / 1%,
0.05 W, 30 V, –55°C / 125°C, 0201, SMD
CRCW0201200KFKED
Vishay Dale
34
R8
1
5.1
Resistor, Thick Film, 5R1, –5% / 5%,
0.05 W, 25 V, –55°C / 125°C, 0201, SMD
RMC1/205R1JPA
Kamaya
35
R9
1
2 MΩ
Resistor, Thick Film, 2M, –1% / 1%,
0.063 W, 50 V, –55°C / 155°C, 0402, SMD
RC0402FR-072ML
Yageo
36
R10
1
680
Resistor, Thick Film, 680, –5% / 5%,
0.063 W, 50 V, –55°C / 155°C, 0402, SMD
RESISTOR_0402_680_±5%_50V_
0.063W_M_±200PPM
Manufacturer
Selection
37
R11, R31, R32
3
0
Resistor, Thick Film, 0, –1% / 1%,
0.05 W, 30 V, –55°C / 155°C, 0201, SMD
RESISTOR_0201_0_±1%_30V_
0.05W_M_±100PPM
Manufacturer
Selection
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Design Files
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Table 1. BOM (continued)
ITEM
NUMBER
PART
REFERENCE
QUANTITY
VALUE
DESCRIPTION
MPN
MANUFACTURER
38
R16, R50
2
2.2 k
Resistor, Thick Film, 2K2, –5% / 5%,
0.05 W, 30 V, –55°C / 125°C, 0201, SMD
CRCW02012K20JNED
Vishay
39
R21, R22
2
270
Resistor, Thin Film, 270, –5% / +5%,
0.0625 W, 50 V, –55 DEGC / +125 DEGCC,
0402, SMD
RESISTOR_0402_270_±1%_50V_
0.063W_M_ ±200PPM
Manufacturer
Selection
40
R23
1
DNM
Resistor, Do Not Mount, 0402, SMD
DNM
Do Not Mount
41
R27
1
150
Resistor, Thick Film, 150, –5% / +5%,
RESISTOR_0402_150_±5%_50V_
0.063 W, 50 V, –55 DEGC / +155 DEGC, 0402, 0.063W_M_±200PPM
SMD
Manufacturer
Selection
42
SW1, SW2
2
MTA2-WNC
Switch, Tact Switch, Right Angle, 0.05 A @ 12
VDC, SMD
MTA2-WNC-V-T/R
Diptronics
43
SW3
1
MK24-A
Switch, Other, Reed Sensor,
SPST-NO, Pull-in: 23 AT to 50 AT,
0.3 A @ 60 V, 0.3 A, 60 V, SMD
MK24-A-3
Meder
44
U1
1
CC26xx-7x7
IC, Digital, TI Custom 26xx, QFN48, SMD
CC26xx_7x7_QFN48
TI
45
U2
1
TS5A3159AYZPR
IC, Analog, SPDT Switch Single-channel 2:1
Multiplexer / Demultiplexer,
4.5 V to 5.5 V, DSBGA6, SMD
TS5A3159AYZPR
TI
46
U3
1
BMP280
IC, Transducer Pressure, 300 hPa to 110 hPa,
1.71 V to 3.6 V, LGA8, SMD
BMP280
Bosch
47
U4
1
TMP007
IC, Transducer,
Infrared Thermopile Sensor,
2.5 V to 5.5 V, DSBGA8, SMD
TMP007AIYZFR
TI
48
U6
1
SPH0641LU4H
IC, Digital, Microphone with Multiple
Performance Mode,
1.62 V to 3.6 V, SMD
SPH0641LU4H
Knowles
49
U7
1
OPT3001
IC, Analog, OPT3001, SON6, SMD
OPT3001
TI
50
U8
1
MPU-9250
IC, Transducer, 3-AXIS Accelerometer, 3-AXIS
Gyroscope, 2.4 V to 3.6 V, QFN24, SMD
MPU-9250
Invensense
51
U9
1
HDC1000YPA
IC, Transducer, Low-power, High-accuracy
Digital Humidity Sensor with Integrated
Temperature Sensor,
2.7 V TO 5.5 V, DSBGA8, SMD
HDC1000YPAR
TI
52
U10
1
W25X40CLUXIG
IC, Memory, 4 M-bit of Serial Flash Memory,
2.3 V to 3.6 V, USON8, SMD
W25X40CLUXIG
Winbond
53
U11
1
DNM
54
Y1
1
32.768 kHz
Crystal, Resonator, 32.768 kHz,
–20 PPM / 20 PPM, –40°C / 85°C, SMD
FC-135 32.7680KA-AG0
Epson
24
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Table 1. BOM (continued)
ITEM
NUMBER
55
PART
REFERENCE
Y2
QUANTITY
1
VALUE
24 MHz
DESCRIPTION
Crystal, Crystal Oscillator,
24 MHz, –15 PPM / °C / 15 PPM / °C,
–40°C / 85°C, SMD
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MPN
TSX-3225 24.0000MF15X-AC3
MANUFACTURER
Epson
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Design Files
7.3
7.3.1
www.ti.com
PCB Layout Recommendations
Layout Considerations for CC2650 – Wireless MCU
Ensure the following layout considerations:
• Ensure that the layout of the RF components follows the reference designs.
• Ensure that RF components connected to the ground have multiple ground vias close to their ground
pads to minimize ground impedance.
• Ensure that an uninterrupted and solid ground plane exists under all the RF components (from the
antenna and to the ground vias in the exposed ground pad).
• Place the balun and/or RF filter as close to the CC2650 device as possible to ensure no traces are
under the RF path.
• Place the antenna matching components as close to the antenna as possible.
• Place the decoupling capacitors as close to their VDD pins as possible.
• Ensure that the ground return path from the decoupling capacitors to the EGP is as short and direct as
possible.
• Place the DCDC components (L1 and C7) close to the DCDC_SW pin.
• Ensure that the ground connection of the DCDC-capacitor is as short and direct as possible to avoid
ground-switching noise.
• Position the humidity and IR temperature sensors away from hot points on the board like the battery,
display, or microcontroller because they are dependent on temperature.
• Use the slots around the device to reduce the thermal mass for a quicker response to environmental
changes.
Figure 19. RF Layout Considerations
26
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Figure 20. DCDC Layout Considerations
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Design Files
7.3.2
www.ti.com
Layout Considerations for Humidity Sensor – HDC1000
Figure 21. HDC1000
28
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Figure 22. HDC1000
7.3.3
Layout Considerations for the IR Temperature Sensor – TMP007
For layout assembly considerations for the TMP007, see SBOU143.
7.3.4
Layout Prints
To download the layout prints for each board, see the design files at SWRC304
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Design Files
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Figure 23. Top Silkscreen
Figure 24. Top Solder Mask
30
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Figure 25. Top Layer
Figure 26. Layer 2
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Design Files
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Figure 27. Layer 3
Figure 28. Bottom Layer
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Figure 29. Bottom Solder Mask
Figure 30. Bottom Silkscreen
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Design Files
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Figure 31. Mechanical Dimensions and Drill Holes
34
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7.4
Cadence Allegro Project
Download the Allegro project files for the SensorTag at SWRC304.
Figure 32. SensorTag Allegro project
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Design Files
7.5
www.ti.com
Layout Guidelines
Figure 33. CC2650 SensorTag Layout Guidelines
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7.6
Gerber Files
To download the Gerber files, see the design files at SWRC304.
Figure 34. CC2650STK Mechanical Drawing
7.7
Assembly Drawings
To download the assembly drawings for each board, see the design files at SWRC304.
Figure 35. Assembly Drawing (Top)
7.8
Figure 36. Assembly Drawing 2 (Bottom Side Mirrored)
Software Files
For information regarding software, see Section 4.2.
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References
8
www.ti.com
References
1. TI Technical Reference Manual, CC26xx SimpleLink™ Wireless MCU, SWCU117
2. TI Application Note, SimpleLink™ Bluetooth Low Energy CC2640 Software Developer’s Guide,
SWRU393
3. TI Application Note, OPT3001: Ambient Light Sensor Application Guide, SBEA002
4. TI Application Note, TMP007 Layout and Assembly User Guide, SBOU143
5. TI Application Note, Humidity Sensor, SNAA216
38
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About the Author
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9
About the Author
ESPEN SLETTE is a systems application engineer at TI, where he develops reference design solutions
for wireless connectivity (that is, Wi-Fi, Bluetooth Smart, RF4CE, ZigBee / 6LoWPAN, and sub-1GHz).
Espen Slette has experience in application support for wireless products and RF design. Espen Slette
earned his Master of Science in Electrical Engineering (MSEE) from NTNU in Trondheim, Norway.
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