SPA17N80C3, SPP17N80C3 Datasheet. Www.s Manuals.com. Infineon

User Manual: Marking of electronic components, SMD Codes 17005E, 17006E, 17015E, 1714, 1714I, 17C, 17N80C3, 17T, 17s. Datasheets BAS125-07, BZT52-C17, BZX84C17-AU, LT1714CGN, LT1714IGN, MAX17005ETP, MAX17006ETP, MAX17015ETP, SPA17N80C3, SPP17N80C3, TK71517AS.

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SPP17N80C3
SPA17N80C3
Cool MOS™ Power Transistor
Feature
• New revolutionary high voltage technology

VDS

800

V

RDS(on)

0.29

Ω

ID

17

A

• Worldwide best RDS(on) in TO 220
• Ultra low gate charge

PG-TO220-3-31 PG-TO220

• Periodic avalanche rated
• Extreme dv/dt rated

1

• Ultra low effective capacitances

2

3

P-TO220-3-31

• Improved transconductance
• PG-TO-220-3-31: Fully isolated package (2500 VAC; 1 minute)

Type

Package

Ordering Code

Marking

SPP17N80C3

PG-TO220

Q67040-S4353

17N80C3

SPA17N80C3

PG-TO220-3-31 SP000216353

17N80C3

Maximum Ratings
Parameter

Symbol

Value
SPP

Continuous drain current

Unit
SPA

ID

A

TC = 25 °C

17

17 1)

TC = 100 °C

11

11 1)

51

51

Pulsed drain current, tp limited by Tjmax

ID puls

A

Avalanche energy, single pulse

EAS

670

670

EAR

0.5

0.5

Avalanche current, repetitive tAR limited by Tjmax

IAR

17

17

A

Gate source voltage

VGS

±20

±20

V

Gate source voltage AC (f >1Hz)

VGS

±30

±30

Power dissipation, TC = 25°C

Ptot

208

42

Operating and storage temperature

Tj , Tstg

mJ

ID=3.4A, VDD=50V

Avalanche energy, repetitive tAR limited by Tjmax2)
ID=17A, VDD=50V

Rev. 2.7

Page 1

-55...+150

W
°C

2011-09-27

SPP17N80C3
SPA17N80C3
Maximum Ratings
Parameter

Symbol

Drain Source voltage slope

dv/dt

Value

Unit

50

V/ns

Values

Unit

VDS = 640 V, ID = 17 A, Tj = 125 °C

Thermal Characteristics
Parameter

Symbol
min.

typ.

max.

Thermal resistance, junction - case

RthJC

-

-

0.6

Thermal resistance, junction - case, FullPAK

RthJC_FP

-

-

3.6

Thermal resistance, junction - ambient, leaded

RthJA

-

-

62

Thermal resistance, junction - ambient, FullPAK

RthJA_FP

-

-

80

SMD version, device on PCB:

RthJA

@ min. footprint

-

-

62

@ 6 cm 2 cooling area 3)

-

35

-

-

-

260

Soldering temperature, wavesoldering

Tsold

K/W

°C

1.6 mm (0.063 in.) from case for 10s 4)
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter

Symbol

Conditions

Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA
Drain-Source avalanche

V(BR)DS VGS=0V, ID=17A

Values

Unit

min.

typ.

max.

800

-

-

-

870

-

2.1

3

3.9

V

breakdown voltage
Gate threshold voltage

VGS(th)

ID=1000µA, VGS=VDS

Zero gate voltage drain current

I DSS

VDS=800V, V GS=0V,

Gate-source leakage current

I GSS

Drain-source on-state resistance RDS(on)

Gate input resistance

Rev. 2.7

RG

µA

Tj=25°C

-

0.5

25

Tj=150°C

-

-

250

VGS=20V, V DS=0V

-

-

100

Ω

VGS=10V, ID=11A
Tj=25°C

-

0.25

0.29

Tj=150°C

-

0.78

-

f=1MHz, open drain

-

0.7

-

Page 2

nA

2011-09-27

SPP17N80C3
SPA17N80C3
Electrical Characteristics
Parameter
Transconductance

Symbol
gfs

Conditions
VDS≥2*ID*R DS(on)max,

Values

Unit

min.

typ.

max.

-

15

-

S
pF

ID=11A

Input capacitance

Ciss

VGS=0V, VDS=25V,

-

2320

-

Output capacitance

Coss

f=1MHz

-

1250

-

Reverse transfer capacitance

Crss

-

60

-

-

59

-

-

124

-

Effective output capacitance,5) Co(er)

VGS=0V,

energy related

VDS=0V to 480V

Effective output capacitance,6) Co(tr)
time related
Turn-on delay time

td(on)

VDD=400V, VGS=0/10V,

-

25

-

Rise time

tr

ID=17A,

-

15

-

Turn-off delay time

td(off)

RG =4.7Ω, Tj =125°C

-

72

82

Fall time

tf

-

6

9

-

12

-

-

46

-

-

91

177

-

6

-

ns

Gate Charge Characteristics
Gate to source charge

Qgs

Gate to drain charge

Qgd

Gate charge total

Qg

VDD=640V, ID=17A

VDD=640V, ID=17A,

nC

VGS=0 to 10V

Gate plateau voltage

V(plateau) VDD=640V, ID=17A

V

1Limited only by maximum temperature
2Repetitve avalanche causes additional power losses that can be calculated as P =E *f.
AR
AV
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
4Soldering temperature for TO-263: 220°C, reflow
5C

o(er)

is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS.

6C

o(tr)

is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.

Rev. 2.7

Page 3

2011-09-27

SPP17N80C3
SPA17N80C3
Electrical Characteristics
Parameter

Symbol

Inverse diode continuous

IS

Conditions

Values

Unit

min.

typ.

max.

-

-

17

-

-

51

TC=25°C

A

forward current
Inverse diode direct current,

I SM

pulsed
Inverse diode forward voltage

VSD

VGS =0V, IF=IS

-

1

1.2

V

Reverse recovery time

t rr

VR =400V, IF =IS ,

-

550

-

ns

Reverse recovery charge

Q rr

diF/dt=100A/µs

-

15

-

µC

Peak reverse recovery current

I rrm

-

51

-

A

Peak rate of fall of reverse

dirr /dt

-

1200

-

A/µs

Tj=25°C

recovery current
Typical Transient Thermal Characteristics
Symbol

Value

Unit

SPP

SPA

Rth1

0.00812

0.00812

Rth2

0.016

Rth3

Symbol

Value

Unit

SPP

SPA

Cth1

0.0003562

0.0003562

0.016

Cth2

0.001337

0.001337

0.031

0.031

Cth3

0.001831

0.001831

Rth4

0.114

0.16

Cth4

0.005033

0.005033

Rth5

0.135

0.324

Cth5

0.012

0.008657

Rth6

0.059

2.522

Cth6

0.092

0.412

Tj

K/W

R th1

R th,n

T case

Ws/K

E xternal H eatsink

P tot (t)
C th1

C th2

C th,n
T am b

Rev. 2.7

Page 4

2011-09-27

SPP17N80C3
SPA17N80C3
1 Power dissipation

2 Power dissipation FullPAK

Ptot = f (TC)

Ptot = f (TC)

240

SPP17N80C3

45

W

W

200
35

160

Ptot

Ptot

180

140

30
25

120
20

100

15

80
60

10

40
5

20
0
0

20

40

60

80

100

120

°C

0
0

160

20

40

60

80

100

120

TC

3 Safe operating area

4 Safe operating area FullPAK

ID = f ( VDS )

ID = f (VDS)

parameter : D = 0 , TC=25°C

parameter: D = 0, TC = 25°C

10

2

°C 160
TC

10 2

10 1

10 1

ID

A

ID

A

10 0

10 -1

10 -2 0
10

Rev. 2.7

10 0

tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
DC

10

1

10 -1

10

2

10

V
VDS

3

Page 5

10 -2 0
10

tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
tp = 10 ms
DC

10

1

10

2

10
V
VDS

2011-09-27

3

SPP17N80C3
SPA17N80C3
5 Transient thermal impedance

6 Transient thermal impedance FullPAK

ZthJC = f (tp)

ZthJC = f (tp)

parameter: D = tp/T

parameter: D = tp/t

10 1

10 1

K/W

K/W
10 0

ZthJC

ZthJC

10 0

10 -1

D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
single pulse

10 -2

10 -3

10 -4 -7
10

10

-6

10

-5

10

-4

10

-3

s
tp

10 -1

D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
single pulse

10 -2

10 -3

10

10 -4 -7
-6
-5
-4
-3
-2
-1
10
10
10
10
10
10
10

-1

tp

7 Typ. output characteristic

8 Typ. output characteristic

ID = f (VDS); Tj =25°C

ID = f (VDS); Tj =150°C

parameter: tp = 10 µs, VGS

parameter: tp = 10 µs, VGS
35

70

A

20V
10V

60

20V
10V
8V
7V

A

55
25

45

6.5V
6V

ID

50

ID

1
s 10

8V

20

40
7V

35

5.5V

15

30
25

6V

5V

10

20
15

4.5V
5V

10

5

4V

5
0
0

Rev. 2.7

5

10

15

20

VDS

0
0

30

V

Page 6

5

10

15

20

VDS

30

V

2011-09-27

SPP17N80C3
SPA17N80C3
9 Typ. drain-source on resistance

10 Drain-source on-state resistance

RDS(on)=f(ID)

RDS(on) = f (Tj)

parameter: Tj=150°C, VGS

parameter : ID = 11 A, VGS = 10 V

1.5

1.6

Ω

SPP17N80C3

Ω

RDS(on)

RDS(on)

1.3
1.2
1.1

4V 4.5V 5V

5.5V

6V

6.5V

1

1.2

1

0.8

0.9

0.6

7V
8V
10V
20V

0.8
0.7

0.4

98%
typ

0.2

0.6
0.5
0

5

10

15

20

25

0
-60

35

A

-20

20

60

°C

100

ID

Tj

11 Typ. transfer characteristics

12 Typ. gate charge

ID = f ( VGS ); VDS≥ 2 x ID x RDS(on)max

VGS = f (Q Gate)
parameter: ID = 17 A pulsed

parameter: tp = 10 µs
65

16

A

50

12

VGS

45

ID

SPP17N80C3

V

25°C

55

180

40
35

150°C

0,2 VDS max
10

0,8 VDS max

8

30
25

6

20
4

15
10

2

5
0
0

Rev. 2.7

2

4

6

8

10

12

14

16

0
0

V 20
VGS

20

40

60

80

100

120

nC

160

QGate
Page 7

2011-09-27

SPP17N80C3
SPA17N80C3
13 Forward characteristics of body diode

14 Avalanche SOA

IF = f (VSD)

IAR = f (tAR)

parameter: Tj , tp = 10 µs

par.: Tj ≤ 150 °C

10 2

SPP17N80C3

18

A

A

14

IF

IAR

10 1

12
10
8

10 0

6
Tj = 25 °C typ

T j(START)=25°C

Tj = 150 °C typ

4

Tj = 25 °C (98%)
2

Tj = 150 °C (98%)
10 -1
0

0.4

0.8

1.2

1.6

2

2.4 V

T j(START)=125°C

0 -3
10

3

10

-2

10

-1

10

0

10

1

10

2

µs 10
tAR

VSD

15 Avalanche energy

16 Drain-source breakdown voltage

EAS = f (Tj)

V(BR)DSS = f (Tj)

4

par.: ID = 3.4 A, VDD = 50 V
700

980

600

940

550

920

V

V(BR)DSS

E AS

mJ

500
450
400

900
880
860

350

840

300

820

250

800

200

780

150
100

760

50

740

0
25

50

75

100

720
-60

150

°C
Tj

Rev. 2.7

SPP17N80C3

-20

20

60

100

°C

180

Tj
Page 8

2011-09-27

SPP17N80C3
SPA17N80C3
17 Avalanche power losses

18 Typ. capacitances

PAR = f (f )

C = f (VDS)

parameter: EAR =0.5mJ

parameter: VGS =0V, f=1 MHz
10 5

500

pF

W

10 4

400

C

PAR

Ciss

350
300

10 3

250
10 2

200

Coss

150
10 1

100

Crss

50
0 4
10

10

5

6

10

Hz
f

10 0
0

100

200

300

400

500

600

800
V
VDS

19 Typ. Coss stored energy
Eoss=f(VDS)
18

µJ

E oss

14
12
10
8
6
4
2
0
0

Rev. 2.7

100

200

300

400

500

600

800
V
VDS

Page 9

2011-09-27

SPP17N80C3
SPA17N80C3

Definition of diodes switching characteristics

Rev. 2.7

Page 10

2011­09-27

SPP17N80C3
SPA17N80C3
PG-TO220-3-1, PG-TO220-3-21

Rev. 2.7

Page 11

2011-09-27

SPP17N80C3
SPA17N80C3
PG-TO220-3-31 (FullPAK)

Rev. 2.7

Page 12

2011-09-27

SPP17N80C3
SPA17N80C3

Published by
Infineon Technologies AG
81726 Munich, Germany
© 2007 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.

Rev. 2.7

Page 13

2011-09-27

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