SPA17N80C3, SPP17N80C3 Datasheet. Www.s Manuals.com. Infineon
User Manual: Marking of electronic components, SMD Codes 17005E, 17006E, 17015E, 1714, 1714I, 17C, 17N80C3, 17T, 17s. Datasheets BAS125-07, BZT52-C17, BZX84C17-AU, LT1714CGN, LT1714IGN, MAX17005ETP, MAX17006ETP, MAX17015ETP, SPA17N80C3, SPP17N80C3, TK71517AS.
Open the PDF directly: View PDF
.
Page Count: 14

Rev. 2.7 Page 1 2011-09-27
SPP17N80C3
SPA17N80C3
Cool MOS™ Power Transistor VDS 800 V
RDS
(
on
)
0.29 Ω
ID17 A
Feature
• New revolutionary high voltage technology
• Worldwide best RDS
(
on
)
in TO 220
• Ultra low gate charge
• Periodic avalanche rated
• Extreme dv/dtrated
• Ultra low effective capacitances
• Improved transconductance
• PG-TO-220-3-31: Fully isolated package (2500 VAC; 1 minute)
PG-TO220-3-31 PG-TO220
P-TO220-3-31
123
Marking
17N80C3
17N80C3
Type Package Ordering Code
SPP17N80C3 PG-TO220 Q67040-S4353
SPA17N80C3 PG-TO220-3-31 SP000216353
Maximum Ratings
Parameter Symbol Value Unit
SPA
Continuous drain current
T
C = 25 °C
TC = 100 °C
ID
17
11
171)
111)
A
Pulsed drain current, t
p
limited by T
j
max ID
p
uls 51 51 A
Avalanche energy, single pulse
ID=3.4A, VDD=50V
EAS 670 670 mJ
Avalanche energy, repetitive tAR limited by Tjmax2)
ID=17A, VDD=50V
EAR 0.5 0.5
Avalanche current, repetitive t
A
R limited by T
j
max I
A
R17 17 A
Gate source voltage VGS ±20 ±20 V
Gate source voltage AC (f >1Hz) VGS ±30 ±30
Power dissipation, TC = 25°C Ptot 208 42 W
SPP
Operating and storage temperature T
j
,Tst
g
-55...+150 °C

Rev. 2.7 Page 2 2011-09-27
SPP17N80C3
SPA17N80C3
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope
VDS = 640 V, ID = 17 A, Tj = 125 °C
dv/dt50 V/ns
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 0.6 K/W
Thermal resistance, junction - case, FullPAK RthJC
_
FP - - 3.6
Thermal resistance, junction - ambient, leaded RthJA - - 62
Thermal resistance, junction - ambient, FullPAK RthJA
_
FP - - 80
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 3)
RthJA
-
-
-
35
62
-
Soldering temperature, wavesoldering
1.6 mm (0.063 in.) from case for 10s 4)
Tsold - - 260 °C
Electrical Characteristics, at T
j
=25°C unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 800 - - V
Drain-Source avalanche
breakdown voltage
V(BR)DS VGS=0V, ID=17A - 870 -
Gate threshold voltage VGS
(
th
)
ID=1000µA, VGS=VD
S
2.1 3 3.9
Zero gate voltage drain current IDSS VDS=800V, VGS=0V,
Tj=25°C
Tj=150°C
-
-
0.5
-
25
250
µA
Gate-source leakage current IGSS VGS=20V, VDS=0V - - 100 nA
Drain-source on-state resistance RDS(on) VGS=10V, ID=11A
Tj=25°C
Tj=150°C
-
-
0.25
0.78
0.29
-
Ω
Gate input resistance RGf=1MHz, open drain - 0.7 -

Rev. 2.7 Page 3 2011-09-27
SPP17N80C3
SPA17N80C3
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Transconductance gfs VDS≥2*ID*RDS(on)max,
ID=11A
- 15 - S
Input capacitance Ciss VGS=0V, VDS=25V,
f=1MHz
- 2320 - pF
Output capacitance Coss - 1250 -
Reverse transfer capacitance Crss - 60 -
Effective output capacitance,5)
energy related
Co(er) VGS=0V,
VDS=0V to 480V
- 59 -
Effective output capacitance,6)
time related
Co(tr) - 124 -
Turn-on delay time td(on) VDD=400V, VGS=0/10V,
ID=17A,
RG=4.7Ω,Tj=125°C
- 25 - ns
Rise time tr- 15 -
Turn-off delay time td(off) - 72 82
Fall time tf- 6 9
Gate Charge Characteristics
Gate to source charge Qgs VDD=640V, ID=17A - 12 - nC
Gate to drain charge Qgd - 46 -
Gate charge total QgVDD=640V, ID=17A,
VGS=0 to 10V
- 91 177
Gate plateau voltage V
(
plateau
)
VDD=640V, ID=17A - 6 - V
1Limited only by maximum temperature
2Repetitve avalanche causes additional power losses that can be calculated as PAV=EAR*f.
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
4Soldering temperature for TO-263: 220°C, reflow
5Co(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% VDSS.
6Co(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.

Rev. 2.7 Page 4 2011-09-27
SPP17N80C3
SPA17N80C3
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous
forward current
ISTC=25°C - - 17 A
Inverse diode direct current,
pulsed
ISM - - 51
Inverse diode forward voltage VSD VGS=0V, IF=IS- 1 1.2 V
Reverse recovery time trr VR=400V, IF=IS ,
diF/dt=100A/µs
- 550 - ns
Reverse recovery charge Qrr - 15 - µC
Peak reverse recovery current Irrm - 51 - A
Peak rate of fall of reverse
recovery current
dirr/dt Tj=25°C - 1200 - A/µs
Typical Transient Thermal Characteristics
Symbol Value Unit Symbol Value Unit
SPA SPA
Rth1 0.00812 0.00812 K/W Cth1 0.0003562 0.0003562 Ws/K
Rth2 0.016 0.016 Cth2 0.001337 0.001337
Rth3 0.031 0.031 Cth3 0.001831 0.001831
Rth4 0.114 0.16 Cth4 0.005033 0.005033
Rth5 0.135 0.324 Cth5 0.012 0.008657
Rth6 0.059 2.522 Cth6 0.092 0.412
SPP SPP
External Heatsink
TjTcase
Tamb
Cth1 Cth2
Rth1 Rth,n
Cth,n
Ptot (t)

Rev. 2.7 Page 5 2011-09-27
SPP17N80C3
SPA17N80C3
1 Power dissipation
Ptot = f(TC)
0 20 40 60 80 100 120 °C 160
TC
0
20
40
60
80
100
120
140
160
180
200
W
240 SPP17N80C3
Ptot
2 Power dissipation FullPAK
Ptot = f(TC)
0 20 40 60 80 100 120 °C 160
TC
0
5
10
15
20
25
30
35
W
45
Ptot
3 Safe operating area
ID= f ( VDS )
parameter : D = 0 , TC=25°C
10 010 110 210 3
V
VDS
-2
10
-1
10
0
10
1
10
2
10
A
ID
tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
DC
4 Safe operating area FullPAK
ID = f (VDS)
parameter: D = 0, TC = 25°C
10 010 110 210 3
V
VDS
-2
10
-1
10
0
10
1
10
2
10
A
ID
tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
tp = 1 ms
tp = 10 ms
DC

Rev. 2.7 Page 6 2011-09-27
SPP17N80C3
SPA17N80C3
5 Transient thermal impedance
ZthJC = f(tp)
parameter: D=tp/T
10 -7 10 -6 10 -5 10 -4 10 -3 10 -1
s
tp
-4
10
-3
10
-2
10
-1
10
0
10
1
10
K/W
ZthJC
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
single pulse
6 Transient thermal impedance FullPAK
ZthJC = f(tp)
parameter: D = tp/t
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1
s
tp
-4
10
-3
10
-2
10
-1
10
0
10
1
10
K/W
ZthJC
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
single pulse
7 Typ. output characteristic
ID = f (VDS); Tj=25°C
parameter: tp= 10 µs, VGS
0 5 10 15 20 VDS 30
V
0
5
10
15
20
25
30
35
40
45
50
55
60
A
70
ID
5V
6V
7V
8V
20V
10V
8 Typ. output characteristic
ID = f (VDS); Tj=150°C
parameter: tp= 10 µs, VGS
0 5 10 15 20 VDS 30
V
0
5
10
15
20
25
A
35
ID
4V
4.5V
5V
5.5V
6V
6.5V
20V
10V
8V
7V

Rev. 2.7 Page 7 2011-09-27
SPP17N80C3
SPA17N80C3
9 Typ. drain-source on resistance
RDS(on)=f(ID)
parameter: Tj=150°C, VGS
0 5 10 15 20 25 A 35
ID
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
Ω
1.5
RDS(on)
4V 4.5V 5V 5.5V 6V 6.5V
7V
8V
10V
20V
10 Drain-source on-state resistance
RDS(on) = f(Tj)
parameter : ID = 11 A, VGS = 10 V
-60 -20 20 60 100 °C 180
Tj
0
0.2
0.4
0.6
0.8
1
1.2
Ω
1.6 SPP17N80C3
RDS(on)
typ
98%
11 Typ. transfer characteristics
ID= f ( VGS ); VDS≥ 2 x ID x RDS(on)max
parameter: tp = 10 µs
0 2 4 6 8 10 12 14 16 V 20
VGS
0
5
10
15
20
25
30
35
40
45
50
55
A
65
ID
25°C
150°C
12 Typ. gate charge
VGS =f (QGate)
parameter: ID = 17 A pulsed
0 20 40 60 80 100 120 nC 160
QGate
0
2
4
6
8
10
12
V
16 SPP17N80C3
VGS
0,8 VDS max
DS max
V
0,2

Rev. 2.7 Page 8 2011-09-27
SPP17N80C3
SPA17N80C3
13 Forward characteristics of body diode
IF = f (VSD)
parameter: T
j
, tp= 10 µs
0 0.4 0.8 1.2 1.6 2 2.4 V3
VSD
-1
10
0
10
1
10
2
10
A
SPP17N80C3
IF
Tj = 25 °C typ
Tj = 25 °C (98%)
Tj = 150 °C typ
Tj = 150 °C (98%)
14 Avalanche SOA
IAR = f (tAR)
par.: Tj≤ 150 °C
10 -3 10 -2 10 -1 10 010 110 210 4
µs
tAR
0
2
4
6
8
10
12
14
A
18
IAR
Tj(START)=125°C
Tj(START)=25°C
15 Avalanche energy
EAS = f(Tj)
par.: ID = 3.4 A, VDD = 50 V
25 50 75 100 °C 150
Tj
0
50
100
150
200
250
300
350
400
450
500
550
600
mJ
700
EAS
16 Drain-source breakdown voltage
V(BR)DSS = f(Tj)
-60 -20 20 60 100 °C 180
Tj
720
740
760
780
800
820
840
860
880
900
920
940
V
980 SPP17N80C3
V(BR)DSS

Rev. 2.7 Page 9 2011-09-27
SPP17N80C3
SPA17N80C3
17 Avalanche power losses
PAR = f (f )
parameter: EAR=0.5mJ
10 410 510 6
Hz
f
0
50
100
150
200
250
300
350
400
W
500
PAR
18 Typ. capacitances
C = f(VDS)
parameter: VGS=0V, f=1 MHz
0 100 200 300 400 500 600 V 800
VDS
0
10
1
10
2
10
3
10
4
10
5
10
pF
C
Ciss
Coss
Crss
19 Typ. Coss stored energy
Eoss=f(VDS)
0 100 200 300 400 500 600 V 800
VDS
0
2
4
6
8
10
12
14
µJ
18
Eoss

Rev. 2.7 Page 10 201109-27
SPP17N80C3
SPA17N80C3
Definition of diodes switching characteristics

2011-09-27
Rev. 2.7 Page 11
SPP17N80C3
SPA17N80C3
PG-TO220-3-1, PG-TO220-3-21

2011-09-27
Rev. 2.7 Page 12
SPP17N80C3
SPA17N80C3
PG-TO220-3-31 (FullPAK)

Rev. 2.7 Page 13 2011-09-27
SPP17N80C3
SPA17N80C3
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2007 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
