TB6600HG Datasheet. Www.s Manuals.com. 20140130 Toshiba

User Manual: Datasheets TB6600, TB6600HG.

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TB6600HG
TOSHIBA BiCD Integrated Circuit

Silicon Monolithic

TB6600HG
PWM Chopper-Type bipolar
Stepping Motor Driver IC
The TB6600HG is a PWM chopper-type single-chip bipolar sinusoidal
micro-step stepping motor driver.
Forward and reverse rotation control is available with 2-phase,
1-2-phase, W1-2-phase, 2W1-2-phase, and 4W1-2-phase excitation
modes.
2-phase bipolar-type stepping motor can be driven by only clock signal
with low vibration and high efficiency.

TB6600HG

Features
•

Single-chip bipolar sinusoidal micro-step stepping motor driver

•

Ron (upper + lower) = 0.4 Ω (typ.)

•

Forward and reverse rotation control available

•

Selectable phase drive (1/1, 1/2, 1/4, 1/8, and 1/16 step)

•

Output withstand voltage: Vcc = 50 V

•

Output current: IOUT = 5.0 A (absolute maximum ratings, peak)

•

Packages: HZIP25-P-1.00F

•

Built-in input pull-down resistance: 100 kΩ (typ.),

•

Output monitor pins (ALERT): Maximum of IALERT = 1 mA

HZIP25-P-1.00F
Weight:
HZIP25-P-1.00F: 7.7g (typ.)

IOUT = 4.5 A (operating range, maximal value)

•

(only TQ terminal: 70ｋΩ(typ.))

Output monitor pins (MO): Maximum of IMO = 1 mA

•

Equipped with reset and enable pins

•

Stand by function

•

Single power supply

•

Built-in thermal shutdown (TSD) circuit

•

Built-in under voltage lock out (UVLO) circuit

•

Built-in over-current detection (ISD) circuit

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TB6600HG
Pin Functions
Pin No.

I/O

Symbol

Output

ALERT

TSD / ISD monitor pin

―

SGND

Signal ground

Input

Latch/Auto

Input

Vref

Voltage input for 100% current level

Input

Vcc

Power supply

Input

Excitation mode setting input pin

Input

Excitation mode setting input pin

Input

Excitation mode setting input pin

Output

OUT2B

―

NFB

Output

OUT1B

B channel output 1

―

PGNDB

Power ground

Output

OUT2A

A channel output 2

―

NFA

Output

OUT1A

Functional Description

Remark
Pull-up by external resistance

Torque (output current) setting input pin
Select a return type for TSD.

L: Latch, H: Automatic return

B channel output 2
B channel output current detection pin

A channel output current detection pin
A channel output 1

―

PGNDA

Power ground

Input

ENABLE

Enable signal input pin

H: Enable, L: All outputs off

Input

RESET

Reset signal input pin

L: Initial mode

Input

Vcc

Power supply

Input

CLK

CLK pulse input pin

Input

CW/CCW

―

OSC

Resistor connection pin for internal oscillation setting

Output

Vreg

Control side connection pin for power capacitor

Connecting capacitor to
SGND

Output

Electrical angle monitor pin

Pull-up by external resistance

Forward/reverse control pin

L: CW, H:CCW

Input pins
(M1, M2, M3,CLK, CW/CCW,
ENABLE, RESET, Latch/Auto)

Input pins
(TQ)

VDD

10kΩ

70kΩ

100kΩ

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Vref
M1
M3
N FB

15
17
19
21
23
25

OSC

CLK

RE SE T

PGNDA

N FA

PGNDB

ALE RT
SGND
Latch/Auto
Vcc
M2
OUT2B
OUT1B
OUT2A
OUT1A
E NABLE
Vcc
CW/CCW
Vreg

TB6600HG

Pin Assignment

（Top View）

2
4
6
8
10
12
14
16
18
20
22
24

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TB6600HG
Block Diagram

CW/CCW

Vreg

ALERT

Vcc

6, 20
OUT1A

Reg(5V)

16
Pre
-drive

H-Bridge
driver A
14
OUT2A

TSD / ISD / UVLO
15

Input
circuit
CLK

RESET

NFA

Current selector
circuit A

OUT1B
ENABLE

12
Pre

Latch/Auto

-drive

H-Bridge
driver B
10
OUT2B

OSC

OSC
Current selector
circuit B

Vref

1/3

NFB

100%/30%

SGND

PGNDA

PGNDB

Setting of Vref
Input
Voltage ratio
TQ
L

30%

100%

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TB6600HG
Description of Functions
1. Excitation Settings
The excitation mode can be selected from the following eight modes using the M1, M2 and M3 inputs. New
excitation mode starts from the initial mode when M1, M2, or M3 inputs are shifted during motor operation.
In this case, output current waveform may not continue.

Input
M1

Mode
(Excitation)
Standby mode
(Operation of the internal circuit is almost turned off.)

1/1 (2-phase excitation, full-step)
1/2A type (1-2 phase excitation A type)
( 0%, 71%, 100% )
1/2B type (1-2 phase excitation B type)

H
( 0%, 100% )

1/4 (W1-2 phase excitation)

1/8 (2W1-2 phase excitation)

1/16 (4W1-2 phase excitation)

Standby mode
(Operation of the internal circuit is almost turned off.)

Note: To change the exciting mode by changing M1, M2, and M3, make sure not to set M1 = M2 = M3 = L or M1 = M2 =
M3 = H.

Standby mode
The operation mode moves to the standby mode under the condition M1 = M2 = M3 = L or M1 = M2 = M3
= H.
The power consumption is minimized by turning off all the operations except protecting operation.
In standby mode, output terminal MO is HZ.
Standby mode is released by changing the state of M1=M2=M3=L and M1=M2=M3=H to other state.
Input signal is not accepted for about 200 μs after releasing the standby mode.

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2. Function
(1)To turn on the output, configure the ENABLE pin high. To turn off the output, configure the ENABLE
pin low.
(2) The output changes to the Initial mode shown in the table below when the ENABLE signal goes High
level and the RESET signal goes Low level. (In this mode, the status of the CLK and CW/CCW pins are
irrelevant.)
(3) As shown in the below figure of Example 1, when the ENABLE signal goes Low level, it sets an OFF on
the output. In this mode, the output changes to the initial mode when the RESET signal goes Low level.
Under this condition, the initial mode is output by setting the ENABLE signal High level. And the motor
operates from the initial mode by setting the RESET signal High level.

(Example 1)

（例1）

CLK
RESET
ENABLE
Internal
current set
内部電流設定

Output current(*)
出力電流(A相)
(phase A )

Z
(*: Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)

Input
Output mode
CLK

CW/CCW

RESET

ENABLE

CCW

Initial mode

Command of the standby has a higher priority
than ENABLE. Standby mode can be turned on
and off regardless of the state of ENABLE.
X:
Don’t Care

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TB6600HG
3. Initial Mode
When RESET is used, the phase currents are as follows.
Excitation Mode

Phase A Current

Phase B Current

1/1 (2-phase excitation, full-step)

100%

-100%

1/2A type (1-2 phase excitation A type) (0%, 71%, 100%)

100%

1/4 (W1-2 phase excitation)

100%

1/8 (2W1-2 phase excitation)

100%

1/16 (4W1-2 phase excitation)

100%

1/2B type (1-2 phase excitation B type) (0%, 100%)

current direction is defined as follows.
OUT1A → OUT2A: Forward direction
OUT1B → OUT2B: Forward direction

4. 100% current settings (Current value)
100% current value is determined by Vref inputted from external part and the external resistance for
detecting output current. Vref is doubled 1/3 inside IC.
Io (100%) = (1/3 × Vref) ÷ RNF
The average current is lower than the calculated value because this IC has the method of peak current
detection.
Pleas use the IC under the conditions as follows;
0.11Ω ≤ RNF ≤ 0.5Ω, 0.3V ≤ Vref ≤ 1.95V

OSC

Triangle wave is generated internally by CR oscillation by connecting external resistor to OSC terminal.
Rosc should be from 30kΩ to 120kΩ. The relation of Rosc and fchop is shown in below table and figure. The
values of fchop of the below table are design guarantee values. They are not tested for pre-shipment.
Rosc(kΩ)

fchop(kHz)
Min

Typ.

Max

120

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TB6600HG
6. Decay Mode
It takes approximately five OSCM cycles for charging-discharging a current in PWM mode. The 40% fast
decay mode is created by inducing decay during the last two cycles in Fast Decay mode.
The ratio 40% of the fast decay mode is always fixed.
The relation between the master clock frequency (fMCLK), the OSCM frequency (fOSCM) and the PWM
frequency (fchop) is shown as follows:
fOSCM = 1/20 ×fMCLK
fchop = 1/100 ×fMCLK
When Rosc=51kΩ, the master clock=4MHz, OSCM=200kHz, the frequency of PWM(fchop)=40kHz.

6-1.

Current Waveform and Mixed Decay Mode settings

The period of PWM operation is equal to five periods of OSCM.
The ratio 40% of the fast decay mode is always fixed.
The “NF” refers to the point at which the output current reaches its predefined current level.
MDT means the point of MDT (MIXED DECAY TIMMING) in the below diagram.

fchop
OSCM
Internal
Waveform

Predefined Current Level
NF
40%
fast
Decay
Mode

MDT
Charge mode → NF: Predefined current level → Slow mode →
MDT(Mixed decay timing) → Fast mode → Current monitoring →
(When predefined current level ＞ Output current) Charge mode

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TB6600HG
6-2. Effect of Decay Mode
•

Increasing the current (sine wave)
Predefined
Current Level

Slow

Slow
Fast

Fast
Charge

Predefined
Current Level

Slow

Slow
Fast

Charge

•

Charge
Fast

Charge

Decreasing the current (In case the current is decreased to the predefined value in a short time because
it decays quickly.)

Predefined
Current Level

Slow

Slow
Fast

Charge

Fast
Charge
Predefined
Current Level

Slow

Slow
Fast

Charge

Fast

Charge
Even if the output current rises above the predefined current at the RNF point, the
current control mode is briefly switched to Charge mode for current sensing.

•

Decreasing the current (In case it takes a long time to decrease the current to the predefined value
because the current decays slowly.)

Predefined
Current Level

Slow

Slow
Fast

Fast
Slow

Charge

Fast
Slow
Fast

Predefined
Current Level

Charge

Even if the output current rises above the predefined current at the RNF point, the
current control mode is briefly switched to Charge mode for current sensing.
During Mixed Decay and Fast Decay modes, if the predefined current level is less than the output current at
the RNF (current monitoring point), the Charge mode in the next chopping cycle will disappear (though the
current control mode is briefly switched to Charge mode in actual operations for current sensing) and the
current is controlled in Slow and Fast Decay modes (mode switching from Slow Decay mode to Fast Decay
mode at the MDT point).
Note: The above figures are rough illustration of the output current. In actual current waveforms, transient response
curves can be observed.

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TB6600HG
6-3.

Current Waveforms in Mixed Decay Mode

fchop

OSCM
Internal
waveform
Predefined Current Level
IOUT

Predefined
Current Level

40%
Fast
DECAY
MODE
MDT (MIXED DECAY TIMMING) points

•

When the NF points come after Mixed Decay Timing points
fchop

Switches to Fast mode after Charge mode
fchop
Predefined
Current Level

IOUT

NF
MDT (MIXED DECAY TIMMING) points

Predefined
Current Level

40%
Fast
DECAY
MODE
CLK signal input

•

When the output current value > predefined current level in Mixed Decay mode
fchop

Predefined
Current
Level

fchop

IOUT
NF
Predefined Current
Level
40%
Fast
DECAY
MODE

MDT (MIXED DECAY TIMMING) points

CLK signal input

Even if the output current rises above the predefined current at the
RNF point, the current control mode is briefly switched to Charge
mode for current sensing.

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TB6600HG
Output Stage Transistor Operation Mode
Vcc

Vcc

U1
ON

Note
OUT1

OFF

Note

Load OUT2

OUT1

OFF

Vcc

OFF

RNF
PGND

Charge Mode

RNF
PGND

Note
OUT1 Load OUT2

Load OUT2

RNF

PGND

Slow Mode

Fast Mode

Output Stage Transistor Operation Functions
CLK

CHARGE

OFF

SLOW

OFF

FAST

OFF

Note: The above chart shows an example of when the current flows as indicated by the arrows in the above figures.
If the current flows in the opposite direction, refer to the following chart:

CLK

CHARGE

OFF

SLOW

OFF

FAST

OFF

Upon transitions of above-mentioned functions, a dead time of about 300 ns (Design guarantee value) is inserted
respectively.

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TB6600HG
Thermal Shut-Down circuit (TSD)
(1) Automatic return
TSD = 160°C (typ.) (Note)
TSDhys = 70°C (typ.) (Note)

160°C (typ.) (Note)
Junction temperature (Chip temperature)
90°C (typ.) (Note)

Output state
Output on

Output off

Output on

H
ALERT output
L

Automatic return has a temperature hysteresis shown in the above figure.
In case of automatic return, the return timing is adjusted at charge start of fchop after the temperature falls to the
return temperature (90°C (typ.) in the above figure).
The return period after the temperature falls corresponds to one cycle to two cycles of fchop.
(2) Latch type
TSD = 160°C (typ.)
160°C (typ.)

(*)Output

current starts rising at the
timing of PWM frequency just after
ENABLE pin outputs high.

(Note)

(*)

(Note)

Junction temperature (Chip temperature)

Output state

ALERT output

Output on

Output off

Output on

H
L

H
ENABLE input
L

0.3ms or more when Rosc=51kΩ

The operation returns by programming the ENABLE as H → L → H shown in above figure or turning on power
supply and turning on UVLO function. In this time, term of L level of ENABLE should be 0.3ms or more.
To recover the operation, the junction temperature (the chip temperature) should be 90°C or less when ENABLE
input is switched from L to H level. Otherwise, the operation does not recover.
Note: Pre-shipment testing is not performed.

･State of internal IC when TSD circuit operates.
The states of the internal IC and outputs, while the shutdown circuit is operating, correspond to the state when
ENABLE is L.
The state after automatic return corresponds to the state when ENABLE is H. Please configure the Reset L to
rotate the motor from the initial state.

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TB6600HG
Latch/Auto is an input pin for determining the return method of TSD.

If Latch/Auto pin outputs low, TSD function returns by either of turning on power supply again or programming
the ENABLE as H → L → H.
If Latch/Auto pin outputs high, it returns automatically.
In standby mode, TSD function returns automatically regardless of the state of the Latch/Auto pin.
When power supply voltage Vcc is less than 8V, TSD function cannot operate regardless of the state of the
Latch/Auto pin.

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TB6600HG
ISD (Over current detection)
Current that flows through output power MOSFETs are monitored individually. If over-current is detected
in at least one of the eight output power MOSFETs, all output power MOSFETs are turned off then this
status is kept until ENABLE signal is input. In this time, term of L level of ENABLE should be 0.3ms or
more.
Masking term of 1μs or more (typ. when Rosc=51kΩ) (Note) should be provided in order to protect detection
error by noise. ISD does not work during the masking term.

Over current detection value

ISD=6.5 A

(Note)

(*)Output

current starts rising at the
timing of PWM frequency just after
ENABLE pin outputs high.

(*)

6.5A (typ.)
DMOS
Power transistor current
Dead band
1μs or more(typ.)

Output state

ALERT output

Output on

Output off

Output on

H
L

H
ENABLE input
L

0.3ms or more when Rosc=51kΩ

The operation returns by programming the ENABLE as H → L → H shown in above figure or turning
on power supply and turning on UVLO function.
Note: Pre-shipment testing is not performed.
･State of internal IC when ISD circuit operates.
The states of the internal IC and outputs, while the over current detection circuit is operating, correspond to the
state when ENABLE is L.
The state after automatic return corresponds to the state when ENABLE is H. Please configure the Reset L to
rotate the motor from the initial state.

Return method of ISD

ISD function returns by either of turning on power supply again or programming the ENABLE as H → L → H
regardless of the state of the Latch/Auto pin.
In standby mode, ISD function cannot operate.
When power supply voltage Vcc is less than 8V, ISD function cannot operate.

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TB6600HG
Under Voltage Lock Out (UVLO) circuit
Outputs are shutoff by operating at 5.5 V (Typ.) of Vcc or less.
It has a hysteresis of 0.5 V (Typ.) and returns to output when Vcc reaches 6.0 V (Typ.). The following values are
design guarantee values.
･State of internal IC when UVLO circuit operates.
The states of the internal IC and outputs correspond to the state in the ENABLE mode and the initial mode at
the same time.
After a return, it can start from the initial mode.
When Vcc falls to around 5.5 V and UVLO operates, output turns off.
It recovers automatically from the initial mode when both Vcc rise to around 6.0 V or more. The following
values are design guarantee values.

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TB6600HG
ALERT output
ALERT terminal outputs low in detecting either TSD or ISD.
ALERT terminal is connected to power supply externally via pull-up resistance.
VALERT = 0.5 V (max.) at 1 mA
TSD

ISD

Under TSD detection

Under ISD detection

Normal

Under ISD detection

Under TSD detection

Normal

ALERT

Low

Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.
It is recommended to gain 5 V by connecting the external pull-up resistance to Vreg pin.

MO output
MO turns on at the predetermined state and output low.
MO terminal is connected to power supply externally via pull-up resistance.
VMO = 0.5 V (max.) at 1 mA
State

Initial

Low

Not initial

Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.
It is recommended to gain 5 V by connecting the external pull-up resistance to Vreg pin.

(To pull-up resistance)
(To Vreg in the IC)

Voltage pull-up of MO and ALERT pins

･It is recommended to pull-up voltage to Vreg pin.
･In case of pull-up to except 5 V (for instance, 3.3 V etc.), it is recommended to use other power supply (ex. 3.3 V)
while Vcc output between the operation range. When Vcc decreases lower than the operation range and Vreg
decreases from 5 V to 0 V under the condition that other power supply is used to pull-up voltage, the current
continues to conduct from other power supply to the IC inside through the diode shown in the figure. Though this
phenomenon does not cause destruction and malfunction of the IC, please consider the set design not to continue
such a state for a long time.
･As for the pull-up resistance for MO and ALERT pins, please select large resistance enough for the conducting
current so as not to exceed the standard value of 1 mA.
Please use the resistance of 30 kΩ or more in case of applying 5 V, and 20 kΩ or more in case of applying 3.3 V.

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TB6600HG
Sequence and current level in each excitation mode
1/1-step Excitation Mode (M1: L, M2: L, M3: H, CW Mode)

CLK
MO
(%)
100

−100

(%)
100

−100
t0

1/1-step Excitation Mode (M1: L, M2: L, M3: H, CCW Mode)

CLK
MO
(%)
100

−100

(%)
100

−100
t0

It operates from the initial state after the excitation mode is switched.

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TB6600HG
1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CW Mode)

CLK
MO
(%)
100
71
IA

0
−71
−100

(%)
100
71
IB

0
−71
−100
t0

1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CCW Mode)

CLK
MO
(%)
100
71
IA

0
−71
−100

(%)
100
71
IB

0
−71
−100
t0

It operates from the initial state after the excitation mode is switched.

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TB6600HG
1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CW Mode)

CLK
MO
(%)
100

−100

(%)
100

−100
t0

1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CCW Mode)

CLK
MO
(%)
100

−100

(%)
100
71
IB

0
−71
−100
t0

It operates from the initial state after the excitation mode is switched.

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TB6600HG
1/4-step Excitation Mode (M1: H, M2: L, M3: L, CW Mode)

CLK
MO
(%)
100
92
71
38
IA

−38
−71
−92
−100
(%)
100
92
71
38
IB

−38
−71
−92
−100
t0

t10

t11

t12

t13

t14

t15

t16

t12

t13

t14

t15

t16

1/4-step Excitation Mode (M1: H, M2: L, M3: L, CCW Mode)
CLK
MO
(%)
100
92
71
38
IA

−38
−71
−92
−100
(%)
100
92
71
38
IB

−38
−71
−92
−100
t0

t10

t11

It operates from the initial state after the excitation mode is switched.

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TB6600HG
1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CW Mode)

CLK
MO
(%)
100
98
92
83
71
56
38
20
IA

0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20

IB
0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32

It operates from the initial state after the excitation mode is switched.

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1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CCW Mode)
CLK
MO
(%)
100
98
92
83
71
56
38
20
IA

0
−20
−38
−56
−71
−83
−92
−98
−100
(%)
100
98
92
83
71
56
38
20

0
−20
−38
−56
−71
−83
−92
−98
−100
t0 t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 t18 t19 t20 t21 t22 t23 t24 t25 t26 t27 t28 t29 t30 t31 t32

It operates from the initial state after the excitation mode is switched.

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TB6600HG
1/16-step Excitation Mode (M1: H, M2: H, M3: L, CW Mode)

CLK
MO
[%]
100
98
96
92
88
83
77
71
63

56
47
38

29
20
10

0
−10
−20
−29
−38
−47
−56
−63
−71
−77
−83
−88
−92
−96
−98
−100
t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64

It operates from the initial state after the excitation mode is switched.

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1/16-step Excitation Mode (M1: H, M2: H, M3: L, CCW Mode)

CLK
MO
[%]
100
98
96
92
88
83
77
71
63

56
47

38
29
20
10

It operates from the initial state after the excitation mode is switched.

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TB6600HG
Current level
2-phase, 1-2-phase, W1-2-phase, 2W1-2-phase, 4W1-2-phase excitation (unit: %)

Current level (1/16, 1/8, 1/4, 1/2, 1/1 )
1/16,
1/8, 1/4,
1/2, 1/1
θ16
θ15
θ14
θ13
θ12
θ11
θ10
θ9
θ8
θ7
θ6
θ5
θ4
θ3
θ2
θ1
θ0

Min.

Typ.

Max.

Unit

--95.5
94.1
91.7
88.4
84.2
79.1
73.3
66.7
59.4
51.6
43.1
34.3
25.0
15.5
5.8
---

100.0
99.5
98.1
95.7
92.4
88.2
83.1
77.3
70.7
63.4
55.6
47.1
38.3
29.0
19.5
9.8
0.0

--100.0
100.0
99.7
96.4
92.2
87.1
81.3
74.7
67.4
59.6
51.1
42.3
33.0
23.5
13.8
---

％

2014-01-30

TB6600HG
Absolute Maximum Ratings (Ta = 25°C)
Characteristic

Power supply voltage

Output current (per one phase)

Symbol

Rating

Unit

Vcc

5.0

IO
(PEAK)

Drain current (ALERT, MO)

I (ALERT)
I (MO)

Input voltage

VIN

Power dissipation

3.2 (Note 1)
W
40 (Note 2)

Operating temperature

Topr

-30 to 85

°C

Storage temperature

Tstg

-55 to 150

°C

Note 1:

Ta = 25°C, No heatsink

Note 2:

Ta = 25°C, with infinite heatsink.

The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by explosion
or combustion.
Please use the IC within the specified operating ranges.

Operating Range (Ta = −30~85°C)
Characteristic

Symbol

Test Condition

Min

Typ.

Max

Power supply voltage

Vcc

―

8.0

―

Output current

IOUT

―

4.5

VIN

―

5.5

Vref

―

0.3

―

1.95

Clock frequency in logical part

fCLK

―

200

kHz

Chopping frequency

fchop

kHz

Input voltage

Note:

See page 7.

Unit

Two Vcc terminals should be programmed the same voltage.
The maximum current of the operating range can not be necessarily conducted depending on various
conditions because output current is limited by the power dissipation PD.
Make sure to avoid using the IC in the condition that would cause the temperature to exceed Tj (avg.)
=107°C.
The power supply voltage of 42 V and the output current of 4.5 A are the maximum values of operating range.
Please design the circuit with enough derating within this range by considering the power supply variation, the
external resistance, and the electrical characteristics of the IC. In case of exceeding the power supply voltage
of 42 V and the output current of 4.5 A, the IC will not operate normally.

2014-01-30

TB6600HG
Electrical Characteristics (Ta = 25°C, Vcc = 24 V)
Characteristic

Symbol
High

VIN (H)

Input voltage
Low

VIN (L)

Input hysteresis voltage

M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, Latch/Auto, TQ

Input current

Min

Typ.

Max

2.0

―

5.5

-0.2

―

0.8

―

400

―

TQ,

―

105

VIN = 5.0 V

IIN (L)

M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, Latch/Auto, TQ
VIN = 0 V

―

Icc1

Output open,
RESET: H, ENABLE: H､
M1:L, M2:L, M3:H (1/1-step mode)
CLK:L

―

4.2

Icc2

Output open,
RESET: L, ENABLE: L
M1:L, M2:L, M3:H (1/1-step mode)
CLK:L

―

3.6

Vcc supply current

Unit

M1, M2, M3, CW/CCW, CLK,
RESET, ENABLE, Latch/Auto
VIN = 5.0 V

IIN (H)

Vref input
circuit

Test Condition

μA

Icc3

Standby mode (M1:L, M2:L, M3:L)

―

1.8

Current limit
voltage

VNF

Vref = 3.0 V(Note 1), TQ=H

0.9

1.0

1.1

Input current

IIN(Vref)

Vref = 3.0 V(Note 1)

―

μA

Divider ratio

Vref/VNF

Maximum current: 100%, TQ=H

―

CLK

2.2

―

μs

IOL = 1 mA

―

0.5

Minimum CLK pulse width

twCLKH
twCLKL

Output residual voltage

VOL MO
VOL ALERT

Internal constant voltage

Vreg

External capacitor = 0.1 μF
(in standby mode)

4.5

5.0

5.5

Chopping frequency

fchop

Rosc=51kΩ

kHz

Note 1: Though Vref of the test condition for pre-shipment is 3.0V, make sure to configure Vref within the operating
range which is written in page 26 in driving the motor.

Electrical Characteristics (Ta = 25°C, Vcc = 24 V)
Characteristic

Output ON resistor

Symbol

Test Condition

Ron U + Ron L

Output transistor switching characteristics

VNF = 0 V, Output: Open

tf
Output leakage
current

Upper side

IOUT = 4 A

ILH
Vcc = 50 V

Lower side

ILL

Min

Typ.

Max

Unit

―

0.4

0.6

―

500

―

μA

2014-01-30

TB6600HG
Timing Waveforms and Names

CLK

twCLKH

twCLKH
twCLKL

Figure 1 Timing Waveforms and Names

Vcc
90%

90%

OUT1A, OUT2A,
OUT1B, OUT2B
10%

10%

GND
tr

Figure 2 Timing Waveforms and Names

2014-01-30

TB6600HG
Power Dissipation
TB6600HG

– Ta

80
①

Power dissipation PD

(W)

Infinite heatsink
Rθj-c = 1°C/W
②
HEATSINK (RθHS = 3.5°C/W)
Rθj-c + RθHS = 4.5°C/W
③

IC only
Rθj-a = 39°C/W

①
40
②

③
0
0

100

Ambient temperature Ta

125

150

(°C)

2014-01-30

TB6600HG
1. How to Turn on the Power
In applying Vcc or shutdown, ENABLE should be Low.
See Example 1(ENABLE = High → RESET = High) and Example 2(RESET = High → ENABLE = High)
as follows. In example 1, a motor can start driving from the initial mode.
(1) CLK: Current step proceeds to the next mode with respect to every rising edge of CLK.
(2) ENABLE: It is in Hi-Z state in low level. It is output in high level.
RESET: It is in the initial mode (Phase A=100% and Phase B=0%) in low level.
①ENABLE=Low and RESET=Low: Hi-Z. Internal current setting is in initial mode.
②ENABLE=Low and RESET=High: Hi-Z. Internal current setting proceeds by internal counter.
③ENABLE=High and RESET=Low: Output in the initial mode (Phase A=100% and Phase B=0%).
④ENABLE=High and RESET=High: Output at the value which is determined by the internal counter.

(Example 1)

（例1）

CLK
RESET
ENABLE
Internal
current set
内部電流設定

Output current (*)
出力電流(A相)
(Phase A)

Z
(Example
（例2）2)

CLK
RESET
ENABLE

Internal current set

内部電流設定

Output current (*)
(Phase A)

出力電流(A相)
Z

(*：Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)

2014-01-30

TB6600HG
Application Circuit

0.1μF

Vreg

ALERT

47μF

fuse

24V

Vcc
OUT1A

Reg (5V)

Pre
M2

-drive

H-Bridge
driver A

OUT2A

MCU
CW/CCW

Control
logic

NFA

TSD/ISD/UVLO

0.2Ω
CLK
Current selector
circuit A

24V

RESET

Pre

ENABLE

-drive

H-Bridge
driver B

OUT1B

Latch/Auto

OUT2B

100%/
30%
1/3

NFB

Current selector
circuit B

Vref

0.2Ω
OSC

OSC
51kΩ
SGND

PGNDA

PGNDB

Note 1:

Capacitors for the power supply lines should be connected as close to the IC as possible.

Note 2:
Note 3:
Note 4:

Current detecting resistances (RNFA and RNFB) should be connected as close to the IC as possible.
Pay attention for wire layout of PCB not to allow GND line to have large common impedance.
External capacitor connecting to Vreg should be 0.1μF. Pay attention for the wire between this
capacitor and Vreg terminal and the wire between this capacitor and SGND not to be influenced by
noise.
The IC may not operate normally when large common impedance is existed in GND line or the IC is
easily influenced by noise. For example, if the IC operates continuously for a long time under the
circumstance of large current and high voltage, the number of clock signals inputted to CLK
terminal and that of steps of output current waveform may not proportional. And so, the IC may not
operate normally. To avoid this malfunction, make sure to conduct Note.1 to Note.4 and evaluate
the IC enough before using the IC.

Note 5:

2014-01-30

TB6600HG
Package Dimensions
Unit: mm

Note

Note：These dimensions are measured from the surface of the heat sink.

Weight: 7.7 g (typ.)

2014-01-30

TB6600HG
Notes on Contents
1. Block Diagrams

Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.

2. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.

3. Timing Charts

Timing charts may be simplified for explanatory purposes.

4. Application Circuits

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.

5. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the
wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse
capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON
or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause
injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.

2014-01-30

TB6600HG
Points to remember on handling of ICs
(1) Over current Detection Circuit
Over current detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the over current detection circuits operate against the over current, clear the over current
status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the over current detection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
(2) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause
the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease
in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.
To avoid this problem, take the effect of back-EMF into consideration in system design.
(5) Short-circuiting between outputs, air contamination faults, faults due to improper grounding, short-circuiting
between contiguous pins
Utmost care is necessary in the design of the power supply lines, GND lines, and output lines since the IC may
be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding,
or by short-circuiting between contiguous pins. They may destroy not only the IC but also peripheral parts and
may contribute to injuries for users. Over current may continue to flow in the IC because of this destruction
and cause smoke or ignition of the IC. Expect the volume of this over current and add an appropriate power
supply fuse in order to minimize the effects of the over current. Capacity of the fuse, fusing time, and the
inserting position in the circuit should be configured suitably.

2014-01-30

TB6600HG
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2014-01-30

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