Tiva C Series TM4C1294 Connected LaunchPad Evaluation Kit (Rev. C) Tm4c129 User's Guide
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Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Kit EK-TM4C1294XL User's Guide Literature Number: SPMU365C March 2014 – Revised October 2016 Contents 1 Board Overview ................................................................................................................... 4 1.1 1.2 1.3 1.4 1.5 1.6 2 2.2 2.3 Functional Description ...................................................................................................... 7 2.1.1 Microcontroller....................................................................................................... 7 2.1.2 Ethernet Connectivity............................................................................................... 8 2.1.3 USB Connectivity ................................................................................................... 8 2.1.4 Motion Control ....................................................................................................... 8 2.1.5 User Switches and LED's .......................................................................................... 8 2.1.6 BoosterPacks and Headers ....................................................................................... 9 Power Management........................................................................................................ 20 2.2.1 Power Supplies .................................................................................................... 20 2.2.2 Low Power Modes ................................................................................................ 21 2.2.3 Clocking ............................................................................................................ 21 2.2.4 Reset ................................................................................................................ 21 Debug Interface............................................................................................................. 21 2.3.1 In-Circuit Debug Interface (ICDI) ................................................................................ 21 2.3.2 External Debugger ................................................................................................ 22 2.3.3 Virtual COM Port .................................................................................................. 22 Software Development ........................................................................................................ 23 3.1 3.2 3.3 3.4 4 5 5 5 6 6 6 Hardware Description ........................................................................................................... 7 2.1 3 Kit Contents................................................................................................................... Using the Connected LaunchPad ......................................................................................... Features ....................................................................................................................... BoosterPacks ................................................................................................................. Energīa ........................................................................................................................ Specifications ................................................................................................................. Software Description ....................................................................................................... Source Code ................................................................................................................ Tool Options ................................................................................................................ Programming the Connected LaunchPad ............................................................................... 23 23 23 24 References, PCB Layout, and Bill of Materials ....................................................................... 25 4.1 4.2 4.3 References .................................................................................................................. 25 Component Locations ..................................................................................................... 26 Bill of Materials ............................................................................................................. 27 ......................................................................................................................... 30 Revision History .......................................................................................................................... 31 5 Schematic 2 Contents SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated www.ti.com List of Figures 1-1. Tiva C Series Connected LaunchPad Evaluation Board ............................................................... 4 2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram ........................................................ 7 2-2. Default Jumper Locations ................................................................................................. 20 4-1. Connected LaunchPad Dimensions and Component Locations ..................................................... 26 List of Tables 1-1. EK-TM4C1294XL Specifications ........................................................................................... 6 2-1. BoosterPack 1 GPIO and Signal Muxing ................................................................................. 9 2-2. BoosterPack 2 GPIO and Signal Muxing 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing .......................................... 16 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing ......................................... 17 4-1. Connected LaunchPad Bill of Materials ................................................................................. 27 ............................................................................... SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated List of Figures 12 3 Chapter 1 SPMU365C – March 2014 – Revised October 2016 Board Overview The Tiva™ C Series TM4C1294 Connected LaunchPad Evaluation Board (EK-TM4C1294XL) is a low-cost evaluation platform for ARM® Cortex™-M4F-based microcontrollers. The Connected LaunchPad design highlights the TM4C1294NCPDT microcontroller with its on-chip 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width modulation and a multitude of simultaneous serial connectivity. The Connected LaunchPad also features two user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion option and two independent BoosterPack XL expansion connectors. The pre-programmed quickstart application on the Connected LaunchPad also enables remote monitoring and control of the evaluation board from an internet browser anywhere in the world. The web interface is provided by 3rd party, Exosite. Each Connected LaunchPad is enabled on the Exosite platform allowing users to create and customize their own Internet-of-Things applications. Figure 1-1 shows a photo of the Connected LaunchPad with key features highlighted. Figure 1-1. Tiva C Series Connected LaunchPad Evaluation Board Tiva is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4 Board Overview SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Kit Contents www.ti.com 1.1 Kit Contents The Connected LaunchPad Evaluation Kit contains the following items: • Tiva™ C Series TM4C1294 Evaluation Board (EK-TM4C1294XL) • Retractable Ethernet cable • USB Micro-B plug to USB-A plug cable • README First document 1.2 Using the Connected LaunchPad The recommended steps for using the Connected LaunchPad Evaluation Kit are: 1. Follow the README First document included in the kit. The README First helps you get the Connected LaunchPad up and running in minutes. Within just a few minutes you can be controlling and monitoring the Connected LaunchPad through the internet using Exosite and the pre-programmed quickstart application. 2. Experiment with BoosterPacks. This evaluation kit conforms to the latest revision of the BoosterPack pinout standard. It has two independent BoosterPack connections to enable a multitude of expansion opportunities. 3. Take the first step towards developing your own applications. The Connected LaunchPad is supported by TivaWare for C Series. After installing TivaWare, look in the installation directory for examples\boards\ek-tm4c1294xl. You can find pre-configured example applications for this board as well as for this board with selected BoosterPacks. Alternately, use Energīa for a wiring frameworkbased cross-platform, fast-prototyping environment that works with this and other TI LaunchPads. See Chapter 3 of this document for more details about software development. TivaWare can be downloaded from the TI website at http://www.ti.com/tool/sw-tm4c. Energīa can be found at http://energia.nu. 4. Customize and integrate the hardware to suit your end application. This evaluation kit can be used as a reference for building your own custom circuits based on Tiva C microcontrollers or as a foundation for expansion with your custom BoosterPack or other circuit. This manual can serve as a starting point for this endeavor. 5. Get Trained. You can also download hours of written and video training materials on this and related LaunchPads. Visit the Tiva C Series LaunchPad Workshop Wiki for more information. 6. More Resources. See the TI MCU LaunchPad web page for more information and available BoosterPacks. (http://www.ti.com/tiva-c-launchpad) 1.3 Features Your Connected LaunchPad includes the following features: • Tiva TM4C1294NCPDTI microcontroller • Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY Motion Control PWM • USB 2.0 Micro A/B connector • 4 user LEDs • 2 user buttons • 1 independent hibernate wake switch • 1 independent microcontroller reset switch • Jumper for selecting power source: – ICDI USB – USB Device – BoosterPack • Preloaded Internet-of-Things Exosite quickstart application • I/O brought to board edge for breadboard expansion • Two independent BoosterPack XL standard connectors featuring stackable headers to maximize expansion through BoosterPack ecosystem SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Board Overview 5 BoosterPacks www.ti.com – For a complete list of BoosterPacks, see the TI MCU LaunchPad web page: http://www.ti.com/launchpad 1.4 BoosterPacks The Connected LaunchPad provides an easy and inexpensive way to develop applications with the TM4C1294NCPDTI microcontroller. BoosterPacks are add-on boards that follow a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the peripherals and potential applications that you can easily explore with the Connected LaunchPad. You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas Instruments even helps you promote your BoosterPack to other members of the community. TI offers a variety of avenues for you to reach potential customers with your solutions. 1.5 Energīa Energīa is an open-source electronics prototyping platform started in January of 2012 with the goal of bringing the Wiring and Arduino framework to the TI LaunchPad community. Energīa includes an integrated development environment (IDE) that is based on Processing. Together with Energīa, LaunchPads can be used to develop interactive objects, taking inputs from a variety of switches or sensors, and controlling a variety of lights, motors, and other physical outputs. LaunchPad projects can be stand-alone (only run on the target board, i.e. your LaunchPad), or they can communicate with software running on your computer (Host PC). Energīa projects are highly portable between supported LaunchPad platforms. Projects written for your Connected LaunchPad can be run on other LaunchPads with little or no modifications. More information is available at http://energia.nu. 1.6 Specifications Table 1-1 summarizes the specifications for the Connected LaunchPad. Table 1-1. EK-TM4C1294XL Specifications Parameter Board Supply Voltage Dimensions Break-out Power Output RoHS Status 6 Board Overview Value 4.75 VDC to 5.25 VDC from one of the following sources: • Debug USB U22 (ICDI) USB Micro-B cable connected to PC or other compatible power source. • Target USB (U7) USB Micro-B cable connected to PC or other compatible power source. • BoosterPack 1 (X8-4) • BoosterPack 2 (X6-4) • Breadboard expansion header (X11-2 or X11-97). See schematic symbol JP1 for power input selection. 4.9 in x 2.2 in x .425 in (12.45 cm x 5.59 cm x 10.8 mm) (L x W x H) • 5 VDC to BoosterPacks, current limited by TPS2052B. Nominal rating 1 Amp. Board input power supply limitations may also apply. • 3.3 VDC to BoosterPacks, limited by output of TPS73733 LDO. This 3.3-V plane is shared with on-board components. Total output power limit of TPS73733 is 1 Amp. Compliant SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Chapter 2 SPMU365C – March 2014 – Revised October 2016 Hardware Description The Connected LaunchPad includes a TM4C1294NCPDTI microcontroller with an integrated 10/100 Ethernet MAC and PHY. This advanced ARM® Cortex™ M4F MCU has a wide range of peripherals that are made available to users via the on-board accessories and the BoosterPack connectors. This chapter explains how those peripherals operate and interface to the microcontroller. Figure 2-1 provides a high-level block diagram of the Connected LaunchPad. Figure 2-1. Tiva Connected LaunchPad Evaluation Board Block Diagram 2.1 Functional Description 2.1.1 Microcontroller The TM4C1294NCPDTI is a 32-bit ARM Cortex-M4F based microcontroller with 1024-kB Flash memory, 256-kB SRAM, 6-kB EEPROM, and 120 MHz operation; integrated 10/100 Ethernet MAC and PHY; integrated USB 2.0 connectivity with external high-speed USB 3.0 PHY capability; a hibernation module, a multitude of serial connectivity and motion control PWM; as well as a wide range of other peripherals. See the TM4C1294NCPDTI microcontroller data sheet for more complete details. Most of the microcontroller’s signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder pads. An internal multiplexor allows different peripheral functions to be assigned to each of these GPIO pads. When adding external circuitry, consider the additional load on the evaluation board power rails. The TM4C1294NCPDTI microcontroller is factory-programmed with a quickstart demo program. The quickstart program resides in on-chip Flash memory and runs each time power is applied, unless the quickstart application has been replaced with a user program. The quickstart application automatically connects to http://ti.exosite.com when an internet connection is provided through the RJ45 Ethernet jack on the evaluation board. SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Hardware Description 7 Functional Description www.ti.com 2.1.2 Ethernet Connectivity The Connected LaunchPad is designed to connect directly to an Ethernet network using RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for both the uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable users to synchronize events over the network using the IEEE1588 precision time protocol. When configured for Ethernet operation, it is recommended that the user configure LED D3 and D4 to be controlled by the Ethernet MAC to indicate connection and transmit/receive status. 2.1.3 USB Connectivity The Connected LaunchPad is designed to be USB 2.0 ready. A TPS2052B load switch is connected to and controlled by the microcontroller USB peripheral, which manages power to the USB micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire Connected LaunchPad can be powered directly from the USB micro A/B connector. Use JP1 to select the desired power source. USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB external PHY control and data signals are provided on the breadboard expansion header X11. 2.1.4 Motion Control The Connected LaunchPad includes the Tiva C Series Motion Control PWM technology, featuring a PWM module capable of generating eight PWM outputs. The PWM module provides a great deal of flexibility and can generate simple PWM signals – for example, those required by a simple charge pump – as well as paired PWM signals with dead-band delays, such as those required by a half-H bridge driver. Three generator blocks can also generate the full six channels of gate controls required by a 3-phase inverter bridge. A quadrature encoder interface (QEI) is also available to provide motion control feedback. See the BoosterPacks and Headers section of this document for details about the availability of these signals on the BoosterPack interfaces. 2.1.5 User Switches and LED's Two user switches are provided for input and control of the TM4C1294NCPDTI software. The switches are connected to GPIO pins PJ0 and PJ1. A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset signal to the BoosterPack and Breadboard headers. The wake switch is one way to bring the device out of hibernate mode. Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller. A power LED is also provided to indicate that 3.3 volt power is present on the board. 8 Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Functional Description www.ti.com 2.1.6 BoosterPacks and Headers 2.1.6.1 BoosterPack 1 The Connected LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1, located around the ICDI portion of the board, is fully compliant with the BoosterPack standard with the single exception of GPIO pin PA6 (X8-16), which does not provide analog capability. PA6 is located near the bottom of the inner left BoosterPack XL header. I2C is provided in both the original BoosterPack standard configuration as well as the updated standard location. Use of I2C on the bottom left of the BoosterPack connections per the updated standard is highly encouraged whenever possible. Motion control advanced PWM connections are provided on the inner right connector for motion control applications. Table 2-1 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available on each pin. The TM4C1294NCPDTI GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’ and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins. Table 2-1. BoosterPack 1 GPIO and Signal Muxing Pin Standard Function A1 1 +3.3 volts A1 2 Analog PE4 123 AIN9 U1RI - - A1 3 UART RX PC4 25 C1- U7Rx - - A1 4 UART TX PC5 24 C1+ U7Tx - A1 5 GPIO PC6 23 C0+ U5Rx A1 6 Analog PE5 124 AIN8 - A1 7 SPI CLK PD3 4 AIN12 - A1 8 GPIO PC7 22 C0- U5Tx A1 9 I2C SCL PB2 91 - - A1 10 I2C SDA PB3 92 - - I2C0SDA B1 1 +5 volts B1 2 ground B1 3 Analog PE0 15 AIN3 U1RTS - - B1 4 Analog PE1 14 AIN2 U1DSR - B1 5 Analog PE2 13 AIN1 U1DCD B1 6 Analog PE3 12 AIN0 U1DTR B1 7 Analog PD7 128 AIN4 B1 8 Analog PA6 40 B1 9 A out PM4 74 B1 10 A out PM5 73 TMPR2 GPIO MCU Pin Digital Function (GPIOPCTL Bit Encoding) Header Analog 1 2 3 5 6 7 8 11 13 14 15 - - - - - - - SSI1XDAT0 - - - - - - - EPI0S7 - - - RTCCLK - - - - EPI0S6 - - - - - - - - - EPI0S5 - - - - - - - - - SSIXDAT1 I2C8SDA T1CCP1 - - - - - - - SSI2CLk - - - - - - - - - EPI0S4 I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27 T5CCP1 - - - - - - USB0CLK EPI0S28 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - U2CTS - T4CCP1 USB0PFLT - - NMI - - - SSI2XDAT2 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8 TMPR3 U0CTS - T4CCP0 - - - - - - - - U0DCD - T4CCP1 - - - - - - - - 3.3V 5V GND SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Hardware Description Copyright © 2014–2016, Texas Instruments Incorporated 9 Functional Description www.ti.com Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued) Header Pin Standard Function GPIO MCU Pin Analog C1 1 PWM PF1 43 C1 2 PWM PF2 44 C1 3 PWM PF3 C1 4 PWM C1 5 C1 6 C1 10 Digital Function (GPIOPCTL Bit Encoding) 1 2 3 5 6 7 8 11 13 14 15 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1 - - - - - M0PWM2 - - - - SSI3Fss TRD0 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11 Capture PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26 Capture PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33 7 GPIO PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16 C1 8 GPIO PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17 C1 9 GPIO PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18 C1 10 GPIO PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19 D1 1 ground D1 2 PWM PM3 75 - - - T3CCP1 - - - - - - - EPI0S12 D1 3 GPIO PH2 31 - U0DCD - - - - - - - - - EPI0S2 D1 4 GPIO PH3 32 - U0DSR - - - - - - - - - EPI0S3 D1 5 reset D1 6 SPI MOSI PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI2XDAT0 D1 7 SPI MISO PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI2XDAT1 D1 8 GPIO PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29 D1 9 GPIO PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30 D1 10 GPIO PP2 103 - U0DTR - - - - - - - - USB0NXT EPI0S29 GND RESET Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Functional Description www.ti.com SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Hardware Description Copyright © 2014–2016, Texas Instruments Incorporated 11 Functional Description 2.1.6.2 www.ti.com BoosterPack 2 The second BoosterPack XL interface is located near the middle of the board. This interface is fully compliant with the BoosterPack standard, and adds features not covered by the BoosterPack standard that enable operation with additional BoosterPacks. An additional analog signal is provided on the outer left header (X6-9). This signal can be used to monitor the touch panel on the popular Kentec EB-LM4F120-L35 BoosterPack. Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack 2 interface. The location of these signals is consistent with the CAN interface on the Tiva C Series TM4C123G LaunchPad and the Stellaris LM4F120 LaunchPad. In the default configuration, UART0 is used for the ICDI virtual UART and CAN is not present on the BoosterPack headers. In this configuration, the ROM serial bootloader can be used over the ICDI virtual UART. When the jumpers are configured for CAN on the BoosterPack, then UART2 must be used for the ICDI virtual UART. To comply with both the original and the new BoosterPack standard, I2C is provided on both sides of the BoosterPack connection. Use of I2C on the bottom left of the BoosterPack connection is highly encouraged where possible, to be in compliance with the new BoosterPack standard. To provide I2C capability on the right side of the connector, per the original standard, two zero-ohm resistors (R19 and R20) are used to combine the SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad and therefore removal of these zero-ohm resistors should not be required. Software should be certain that unused GPIO signals are configured as inputs. Table 2-2 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available at each pin. The TM4C1294NCPDT GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’ and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins. Table 2-2. BoosterPack 2 GPIO and Signal Muxing Header Pin 12 Standard Function GPIO MCU Analog Pin Digital Function (FPIOPCTL Bit Encoding) 1 2 3 5 7 8 11 13 14 - - - - - - SSI2Fss - - - - - - SSI3XDAT2 - - - - - - - SSI3XDAT3 T3CCP0 - - - - - - - SSI1XDAT2 T0CCP0 - - CANORx - - - - - - T3CCP1 - - - - - - - SSI1XDAT3 I2C9SDA T0CCP1 - - CAN0Tx - - - - EPI0S20 A2 1 A2 2 Analog PD2 3 AIN13 - I2C8SCL T1CCP0 C2o A2 3 UART RX PP0 118 C2+ U6Rx - - - A2 4 UART TX PP1 119 C2- U6Tx - - A2 5 GPIO (See JP4) PD4 125 AIN7 U2Rx - PA0 33 - U0Rx I2C9SCL 126 AIN6 U2Tx PA1 34 - U0Tx 6 15 3.3V A2 6 Analog (See JP5) PD5 A2 7 SPI CLK PQ0 5 - - - - - - - - - - SSI3Clk A2 8 GPIO PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 - A2 9 I2C SCL PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPIO0S35 A2 10 I2C SDA PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPIO0S34 B2 1 5V B2 2 GND B2 3 - - - - - SSI1Fss Analog PB4 121 AIN10 U0CTS I2C5SCL - - - Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Functional Description www.ti.com Table 2-2. BoosterPack 2 GPIO and Signal Muxing (continued) Header Pin Standard Function GPIO MCU Analog Pin Digital Function (FPIOPCTL Bit Encoding) 1 2 3 5 6 7 8 11 13 14 15 B2 4 Analog PB5 120 AIN11 U0RTS I2C5SDA - - - - - - - - SSI1Clk B2 5 Analog PK0 18 AIN16 U4Rx - - - - - - - - - EPI0S0 B2 6 Analog PK1 19 AIN17 U4Tx - - - - - - - - - EPI0S1 B2 7 Analog PK2 20 AIN18 U4RTS - - - - - - - - - EPI0S2 B2 8 Analog PK3 21 AIN19 u4CTS - - - - - - - - - EPI0S3 B2 9 A out PA4 37 - U3Rx I2C7SCL T2CCP0 - - - - - - - SSI0XDAT0 B2 10 A out PA5 38 - U3Tx I2C7SDA T2CCP1 - - - - - - - SSI0XDAT1 C2 1 PWM PG1 50 - - I2C1SDA - - M0PWM5 - - - - - EPI0S10 C2 2 PWM PK4 63 - - I2C3SCL - EN0LED0 M0PWM6 - - - - - EPI0S32 C2 3 PWM PK5 62 - - I2C3SDA - EN0LED2 M0PWM7 - - - - - EPI0S31 C2 4 PWM PM0 78 - - - T2CCP0 - - - - - - - EPI0S15 C2 5 Capture PM1 77 - - - T2CCP1 - - - - - - - EPI0S14 C2 6 Capture PM2 76 - - - T3CCP0 - - - - - - - EPI0S13 C2 7 GPIO PH0 29 - U0RTS - - - - - - - - - EPI0S0 C2 8 GPIO PH1 30 - U0CTS - - - - - - - - - EPI0S1 C2 9 GPIO PK6 61 - - I2C4SCL - EN0LED1 M0FAULT1 - - - - - EPI0S25 C2 10 GPIO PK7 60 - U0RI I2C4SDA - RTCCLK M0FAULT2 - - - - - EPI0S24 D2 1 D2 2 PWM PM7 71 TMPR0 U0RI - T5CCP1 - - - - - - - - D2 3 GPIO PP5 106 - U3CTS I2C2SDL - - - - - - - USB0D6 - D2 4 GPIO PA7 41 - U2Tx I2C6SDA T3CCP1 USB0PFLT - - - USB0EPEN SSI0XDAT3 - EPI0S9 D2 5 D2 6 D2 7 D2 GND RESET SPI MOSI PQ2 11 - - - - - - - - - - SSI3XDAT0 EPI0S22 I2C PA3 36 - U4Tx I2C8SDA T1CCP1 - - - - - - - SSI0Fss SPI MISO PQ3 27 - - - - - - - - - - SSI3XDAT1 EPI0S23 I2C PA2 35 - U4Rx I2C8SCL T1CCP0 - - - - - - - SSI0Clk 8 GPIO PP3 104 - U1CTS U0DCD - - - - - - - USB0DIR EPI0S30 D2 9 GPIO PQ1 6 - - - - - - - - - - SSI3Fss EPI0S21 D2 10 GPIO PM6 72 TMPR1 U0DSR - T5CCP0 - - - - - - - - SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Hardware Description Copyright © 2014–2016, Texas Instruments Incorporated 13 Functional Description 14 www.ti.com Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Functional Description www.ti.com 2.1.6.3 Breadboard Connection The breadboard adapter section of the board is a set of 98 holes on a 0.1 inch grid. Properly combined with a pair of right angle headers, the entire Connected LaunchPad can be plugged directly into a standard 300 mil (0.3 inch) wide solder-less breadboard. The right angle headers and breadboard are not provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-S-RA right angle pin headers and Twin industries TW-E40-1020 solder-less breadboard. Samtec TSW-149-09F-S-RE and TSW-149-09-F-S-RA may be substituted. A detailed explanation of how to install the headers is available on the TI LaunchPad Wiki or at http://users.ece.utexas.edu/~valvano/EE345L/Labs/Fall2011/LM3S1968soldering.pdf. Nearly all microcontroller signals are made available at the breadboard adapter holes (X11). These signals are grouped by function where possible. For example, all EPI signals are grouped on one side of the connector. Many of the analog signals are grouped near VREF, and UART, SSI and I2C signals are grouped by peripheral to make expansion and customization simpler. Table 2-3 and Table 2-4 show the GPIO pin and signal muxing for the X11 breadboard adapter pads. SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Hardware Description 15 Functional Description www.ti.com Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing Pin Port MCU PIN Analog Digital Function (GPIOPCTL Bit Encoding) 1 2 3 5 1 3 7 8 11 13 14 15 GND 5 PB4 121 AIN10 U0CTS I2C5SCL - - - - - - - - SSI1Fss 7 PB5 120 AIN11 U0RTS I2C5SDA - - - - - - - - SSI1Clk 9 PH0 29 - U0RTS - - - - - - - - - EPI0S0 11 PH1 30 - U0CTS - - - - - - - - - EPI0S1 13 PH2 31 - U0DCD - - - - - - - - - EPI0S2 15 PH3 32 - U0DSR - - - - - - - - - EPI0S3 17 PC7 22 C0- U5Tx - - - - - - - - - EPI0S4 19 PC6 23 C0+ U5Rx - - - - - - - - - EPI0S5 21 PC5 24 C1+ U7Tx - - - - RTCCLK - - - - EPI0S6 23 PC4 25 C1- U7Rx - - - - - - - - - EPI0S7 25 PA6 40 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8 27 PA7 41 - U2Tx I2C6SDA T3CCP1 USB0PFLT - - - USB0EPEN SSI0XDAT3 - EPI0S9 29 PG1 50 - - I2C1SDA - - M0PWM5 - - - - - EPI0S10 31 PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11 33 PM3 75 - - - T3CCP1 - - - - - - - EPI0S12 37 PM2 76 - - - T3CCP0 - - - - - - - EPI0S13 39 PM1 77 - - - T2CCP1 - - - - - - - EPI0S14 41 PM0 78 - - - T2CCP0 - - - - - - - EPI0S15 43 PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16 45 PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17 47 PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18 49 PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19 51 PQ0 5 - - - - - - - - - - SSI3Clk EPI0S20 53 PQ1 6 - - - - - - - - - - SSI3Fss EPI0S21 55 PQ2 11 - - - - - - - - - - SSI3XDAT0 EPI0S22 57 PQ3 27 - - - - - - - - - - SSI3XDAT1 EPI0S23 59 PK7 60 - U0RI I2C4SDA - - - - - - EPI0S24 35 GND 61 16 6 3V3 GND 63 PK6 61 - - I2C4SCL - EN0LED1 M0FAULT1 - - - - - EPI0S25 65 PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26 Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Functional Description www.ti.com Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing (continued) Pin Port MCU PIN Analog 67 PB2 91 - 69 PB3 92 - 71 PP2 103 73 PP3 75 77 Digital Function (GPIOPCTL Bit Encoding) 1 2 3 5 6 7 8 11 13 14 15 - I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27 - I2C0SDA T5CCP1 - - - - - - USB0CLK EPI0S28 - U0DTR - - - - - - - - USB0NXT EPI0S29 104 - U1CTS U0DCD - - - RTCCLK - - - USB0DIR EPI0S30 PK5 62 - - I2C3SDA - EN0LED2 M0PWM7 - - - - - EPI0S31 PK4 63 - - I2C3SCL - EN0LED0 M0PWM6 - - - - - EPI0S32 79 PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33 81 PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPI0S34 83 PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPI0S35 85 PN0 107 - U1RTS - - - - - - - - - - 87 PN1 108 - U1CTS - - - - - - - - - - 89 PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29 91 PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30 93 PQ4 102 - U1Rx - - - - - DIVSCLK - - - - 95 WAKE 97 5V Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing Pin Port MCU PIN Digital Function (GPIOPCTL Bit Encoding) Analog 1 2 3 5 2 5V 4 GND 6 7 8 11 13 14 15 6 PA2 35 - U4Rx I2C8SCL T1CCP0 - - - - - - - SSI0Clk 8 PA3 36 - U4Tx I2C8SDA T1CCP1 - - - - - - - SSI0Fss 10 PA4 37 - U3Rx I2C7SCL T2CCP0 - - - - - - - SSI0XDAT0 12 PA5 38 - U3Tx I2C7SDA T2CCP1 - - - - - - - SSI0XDAT1 14 PE0 15 AIN3 U1RTS - - - - - - - - - - 16 PE1 14 AIN2 U1DSR - - - - - - - - - - 18 PE2 13 AIN1 U1DCD - - - - - - - - - - 20 PE3 12 AIN0 U1DTR - - - - - - - - - - 22 PE4 123 AIN9 U1RI - - - - - - - - - SSI1XDAT0 24 PE5 124 AIN8 - - - - - - - - - - SSI1XDAT1 SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Hardware Description Copyright © 2014–2016, Texas Instruments Incorporated 17 Functional Description www.ti.com Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued) Pin Port MCU PIN Analog 26 PK0 18 28 PK1 19 30 PK2 32 PK3 Digital Function (GPIOPCTL Bit Encoding) 1 2 3 5 6 7 8 11 13 14 15 AIN16 U4Rx - - - - - - - - - EPI0S0 AIN17 U4Tx - - - - - - - - - EPI0S1 20 AIN18 U4RTS - - - - - - - - - EPI0S2 21 AIN19 U4CTS - - - - - - - - - EPI0S3 - - - - - - - SSI1XDAT3 34 VREF 36 GND 38 PD5 126 AIN6 U2Tx - T3CCP1 40 PD4 125 42 PD7 128 AIN7 U2Rx - T3CCP0 - - - - - - - SSI1XDAT2 AIN4 U2CTS - T4CCP1 USB0PFLT - - NMI - - - 44 PD6 SSI2XDAT2 127 AIN5 U2RTS - T4CCP0 USB0EPEN - - - - - - SSI2XDAT3 46 48 PD3 4 AIN12 - I2C8SDA T1CCP1 - - - - - - - SSI2Clk PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI2XDAT0 50 PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI2XDAT1 52 PD2 3 AIN13 - I2C8SCL T1CCP0 C2o - - - - - - SSI2Fss 54 PP0 118 C2+ U6Rx - - - - - - - - - SSI3XDAT2 56 PP1 119 C2- U6Tx - - - - - - - - - SSI3XDAT3 58 PB0 95 USB0ID U1Rx I2C5SCL T4CCP0 - - CAN1Rx - - - - - 60 PB1 96 USB0VBUS U1Tx I2C5SDA T4CCP1 - - CAN1Tx - - - - - 62 18 GND 64 PF4 46 - - - - EN0LED1 M0FAULT0 - - - - SSI3XDAT2 TRD3 66 PF0 42 - - - - EN0LED0 M0PWM0 - - - - SSI3XDAT1 TRD2 68 PF1 43 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1 70 PF2 44 - - - - - M0PWM2 - - - - SSI3Fss TRD0 72 PF3 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK 74 PA0 33 - U0Rx I2C9SCL T0CCP0 - - CAN0Rx - - - - - 76 PA1 34 - U0Tx I2C9SDA T0CCP1 - - CAN0Tx - - - - - 78 PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 - 80 PP5 106 - U3CTS I2C2SCL - - - - - - - USB0D6 - 82 PJ0 116 - U3Rx - - - - - - - - - 84 PJ1 117 - U3Tx - - - - - - - - - - 86 PM7 71 TMPR0 U0RI - T5CCP1 - - - - - - - - 88 PM6 72 TMPR1 U0DSR - T5CCP0 - - - - - - - - 90 PM5 73 TMPR2 U0DCD - T4CCP1 - - - - - - - - Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Functional Description www.ti.com Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued) Pin Port MCU PIN Analog 92 PM4 74 TMPR3 Digital Function (GPIOPCTL Bit Encoding) 1 2 3 5 U0CTS - T4CCP0 - 94 RESET 96 GND 98 3V3 6 7 8 11 13 14 15 - - - - - - - SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Hardware Description Copyright © 2014–2016, Texas Instruments Incorporated 19 Power Management 2.1.6.4 www.ti.com Other Headers and Jumpers JP1 is provided to select the power input source for the Connected LaunchPad. The top position is for BoosterPack power; this position also disconnects both USB voltages from the board’s primary 5-volt input. In the top position, the TPS2052B does not limit current so additional care should be exercised. The middle position draws power from the USB connector on the left side of the board near the Ethernet jack. The bottom position is the default, in which power is drawn from the ICDI (Debug) USB connection. JP2 separates the MCU 3.3-volt power domain from the rest of the 3.3-volt power on the board allowing an ammeter to be used to obtain more accurate measurements of microcontroller power consumption. JP3 isolates the output of the TPS73733 LDO from the board’s 3.3-V power domain. JP4 and JP5 are used to configure CAN signals to the BoosterPack 2 interface. In the default horizontal configuration, CAN is not present on the BoosterPack. UART2 goes to the BoosterPack and UART 0 goes to the ICDI virtual serial port to provide ROM serial bootloader capability. In the vertical CAN-enabled configuration, UART2 goes to the ICDI virtual serial port and CAN signals are available on the BoosterPack. The ROM serial bootloader is not available to the ICDI virtual serial port while the jumpers are in the CAN position. Figure 2-2 shows the default configuration and relative location of the jumpers on the board. Figure 2-2. Default Jumper Locations 2.2 Power Management 2.2.1 Power Supplies The Connected LaunchPad can be powered from three different input options: • On-board ICDI USB cable (Debug, Default) • Target USB cable • BoosterPack or Breadboard adapter connection The JP1 power-select jumper is used to select one of the power sources. In addition, the JP3 power jumper can be used to isolate the 3.3-volt output of the TPS73733 from the board’s 3.3-volt rail. A TPS2052B load switch is used to regulate and control power to the Target USB connector when the microcontroller is acting in USB host mode. This load switch also limits current to the BoosterPack and Breadboard adapter headers when the JP1 jumper is in the ICDI position. 20 Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Power Management www.ti.com 2.2.2 Low Power Modes The Connected LaunchPad demonstrates several low power microcontroller modes. In run mode, the microcontroller can be clocked from several sources such as the internal precision oscillator or an external crystal oscillator. Either of these sources can then optionally drive an internal PLL to increase the effective frequency of the system up to 120 MHz. In this way, the run mode clock speed can be used to manage run mode current consumption. The microcontroller also provides sleep and deep sleep modes and internal voltage adjustments to the flash and SRAM to further refine power consumption when the processor is not in use but peripherals must remain active. Each peripheral can be individually clock gated in these modes so that current consumption by unused peripherals is minimized. A wide variety of conditions from internal and external sources can trigger a return to run mode. The lowest power setting of the microcontroller is hibernation, which requires a small amount of supporting external circuitry available on the Connected LaunchPad. The Connected LaunchPad can achieve microcontroller current consumption modes under 2 micro-Amps using hibernate VDD3ON mode. Hibernation with VDD3ON mode is not supported on this board. The Connected LaunchPad can be woken from hibernate by several triggers including the dedicated wake button, the reset button, an internal RTC timer and a subset of the device GPIO pins. The hibernation module provides a small area of internal SRAM that can preserve data through a hibernate cycle. 2.2.3 Clocking The Connected LaunchPad uses a 25 MHz crystal (Y1) to drive the main TM4C1294NCPDTI internal clock circuit. Most software examples use the internal PLL to multiply this clock to higher frequencies up to 120 MHz for core and peripheral timing. The 25-MHz crystal is required when using the integrated Ethernet MAC and PHY. The Hibernation module is clocked from an external 32.768-KHz crystal (Y3). 2.2.4 Reset The RESET signal to the TM4C1294NCPDTI microcontroller connects to the RESET switch, BoosterPack connectors, Breadboard adapter and to the ICDI circuit for a debugger-controller reset. External reset is asserted (active low) under the following conditions: • Power-on reset (filtered by and R-C network) • RESET switch is held down. • By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be supported by all debuggers) • By an external circuit attached to the BoosterPack or Breadboard connectors. 2.3 Debug Interface 2.3.1 In-Circuit Debug Interface (ICDI) The Connected LaunchPad comes with an on-board ICDI. The ICDI allows for the programming and debugging of the TM4C1294NCPDTI using LM Flash Programmer and/or any of the supported tool chains. Note that ICDI only supports JTAG debugging at this time. It is possible to use other JTAG emulators instead of the on board ICDI, by connecting to U6. When the ICDI detects an external debug adapter connection on the JTAG connector U6 and disables the ICDI outputs to allow the external debug adapter to drive the debug circuit. For more information, see Section 2.3.2. Debug out of the ICDI is possible by removing resistors R6, R7, R8, R10, R11, R15, R16 and R40 from the Connected LaunchPad and use the ICDI to drive JTAG signals out on U6 for the purpose of programming or debugging other boards. To restore the connection to the on-board TM4C1294NCPDTI microcontroller, install jumpers from the odd to even pins of X1 or re-install the resistors. Removal of R40 disables the detection of an attached external debugger. R40 must be installed to use an external debug adapter to program or debug the Connected LaunchPad. SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Hardware Description 21 Debug Interface www.ti.com 2.3.2 External Debugger The connector U6 is provided for the attachment of an external debug adapter such as the IAR J-Link or Keil ULINK. This connector follows the ARM standard 10-pin JTAG pinout. This interface can use either JTAG or SWD if supported by the external debug adapter. 2.3.3 Virtual COM Port When plugged into a USB host, the ICDI enumerates as both a debugger and a virtual COM port. JP4 and JP5 control the selection of which UART from the TM4C1294NCPDTI is connected to the virtual COM port. In the default configuration, UART0 maps to the virtual COM port of the ICDI. In the CAN jumper configuration, UART2 maps to the virtual COM port of the ICDI. 22 Hardware Description SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Chapter 3 SPMU365C – March 2014 – Revised October 2016 Software Development This chapter provides general information on software development as well as instructions for flash memory programming. 3.1 Software Description The TivaWare software provides drivers for all of the peripheral devices supplied in the design. The Tiva C Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare. TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These applications demonstrate the capabilities of the TM4C1294NCPDTI microcontroller, as well as provide a starting point for the development of the final application for use on the Connected LaunchPad evaluation board. Example applications are also provided for the Connected LaunchPad when paired with selected BoosterPacks. 3.2 Source Code The complete source code including the source code installation instructions are provided at http://www.ti.com/tool/sw-tm4c. The source code and binary files are installed in the TivaWare software tree. 3.3 Tool Options The source code installation includes directories containing projects, makefiles, and binaries for the following tool-chains: • Keil ARM RealView® Microcontroller Development System • IAR Embedded Workbench for ARM • Sourcery Codebench • Generic GNU C Compiler • Texas Instruments' Code Composer Studio™ IDE Download evaluation versions of these tools from the Tools & Software section of www.ti.com/tiva. Due to code size restrictions, the evaluation tools may not build all example programs. A full license is necessary to re-build or debug all examples. For detailed information on using the tools, see the documentation included in the tool chain installation or visit the website of the tools supplier. SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Software Development 23 Programming the Connected LaunchPad 3.4 www.ti.com Programming the Connected LaunchPad The Connected LaunchPad software package includes pre-built binaries for each of the example applications. If you installed the TivaWare™ software to the default installation path of C:\ti\TivaWare_C_Series_, you can find the example applications in C:\ti\TivaWare_C_Series \examples\boards\ek-tm4c129xl. The on-board ICDI is used with the LM Flash Programmer tool to program applications on the Connected LaunchPad. Follow these steps to program example applications into the Connected LaunchPad evaulation board using the ICDI: 1. Install LM Flash Programmer on a PC running Microsoft Windows. 2. Place JP1 into the ICDI position on the Connected LaunchPad. 3. Connect the USB-A cable plug in to an available USB port on the PC and plug the Micro-B plug to the Debug USB port (U22) on the Connected LaunchPad. 4. Verify that LED D0 at the top of the board is illuminated. 5. Install Windows ICDI and Virtual COM Port drivers if prompted. Installation instructions can be found at http://www.ti.com/lit/pdf/spmu287. 6. Run the LM Flash Programmer application on the PC. 7. In the Configuration tap, use the Quick Set control to select “TM4C1294XL LaunchPad”. 8. Move to the Program tab and click the Browse button. Navigate to the example applications directory (the default location is C:\ti\TivaWare_C_Series_ \examples\boards\ek-tm4c1294xl\) 9. Each example application has its own directory. Navigate to the example directory that you want to load and then into the sub-directory for one of the supported tool chains which contains the binary (*.bin) file. Select the binary file and click Open. 10. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check Reset MCU After Program. The example program starts execution once the verify process is complete. 24 Software Development SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Chapter 4 SPMU365C – March 2014 – Revised October 2016 References, PCB Layout, and Bill of Materials 4.1 References In • • • • • • • • • addition to this document the following references are available for download at www.ti.com. TivaWare for C Series (http://www.ti.com/tool/sw-tm4c) TivaWare Peripheral Driver Library Users' Guide (literature number SPMU298) EK-TM4C1294XL Getting Started Guide (literature number SPMZ858) LM Flash Programmer Tool (http://www.ti.com/lmflashprogrammer) TPS73733 Low-Dropout Regulator with Reverse Current Protection (http://www.ti.com/product/tps79733) Texas Instruments Code Composer Studio website (http://www.ti.com/ccs) Tiva C Series TM4C1294NCPDT Microcontroller Data Sheet (http://www.ti.com/lit/gpn/tm4c1294ncpdt) Build Your Own BoosterPack information regarding the BoosterPack standard (http://www.ti.com/byob) ICDI Driver Installation Guide (literature number SPMU287) Additional Support: • Keil RealView MDK-ARM (http://www.keil.com/arm/mdk.asp) • IAR Embedded Workbench for ARM (http://iar.com/ewarm/) • Sourcery CodeBench development tools (http://www.mentor.com/embedded-software/sourcerytools/sourcery-codebench/overview) • Exosite (http://ti.exosite.com) SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback References, PCB Layout, and Bill of Materials Copyright © 2014–2016, Texas Instruments Incorporated 25 Component Locations 4.2 www.ti.com Component Locations Figure 4-1 is a dimensioned drawing of the Connected LaunchPad. This figure shows the location of selected features of the board as well as the component locations. Figure 4-1. Connected LaunchPad Dimensions and Component Locations 26 References, PCB Layout, and Bill of Materials SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Bill of Materials www.ti.com 4.3 Bill of Materials Table 4-1 is the Connected LaunchPad bill of materials list. Table 4-1. Connected LaunchPad Bill of Materials Item Ref Qty Description Mfg Part Number Kemet C1210C102MGRACTU 1 C1 1 Capacitor, 1000pF, 2kV, 20%, X7R, 1210 2 C3, C4, C5, C10, C11, C12, C13, C16, C17, C18, C19, C21, C22, C23, C24, C25, C26, C27, C28, C29, C30, C40, C41, C42, C43, C46 26 Capacitor, 0.1uF 16V, 10%,0402 X7R Taiyo Yuden EMK105B7104KV-F 3 C31 1 Capacitor, 4700pF, 2kV, 10%,X7R, 1812 AVX 1812GC472KAT1A 4 C32, C33 2 Capacitor, 3300pF, 50V, 10%, X7R, 0603 TDK C1608X7R1H332K 5 C6, C14 2 Capacitor, 1uF , X5R, 10V, Low ESR, 0402 Johanson Dielectrics Inc 100R07X105KV4T 6 C7, C15, C20 3 Capacitor, 2.2uF, 16V, 10%, 0603, X5R Murata GRM188R61C225KE15D 7 C8, C9, C44, C45, C47, C48 6 Capacitor, 12pF, 50V, 5%, 0402, COG Murata GRM1555C1H120JZ01D 8 D0, D1, D2, D3, D4 5 Green LED 0603 Everlight 19-217/G7C-AL1M2B/3T 7 Jumper, 0.100, Gold, Black, Open 3M 969102-0000-DA Kobiconn 151-8000-E FCI 67996-206HLF 3M 961102-6404-AR FCI 68001-102HLF Anyone 1x2-head 9 J1, J2, J3, J4, J5, J6, J7 10 JP1 1 Header, 2x3, 0.100, T-Hole, Vertical Unshrouded, 0.230 Mate, gold 11 JP2, JP3 2 Header, 1x2, 0.100, T-Hole, Vertical Unshrouded, 0.220 Mate 12 JP4, JP5 2 Header, 2x2, 0.100, T-Hole, Vertical Unshrouded, 0.230 Mate FCI 67997-104HLF 4UCON 00998 13 R1, R2, R3, R4, R5, R29, R35, R44 8 Resistor, 10k ohm, 1/10W, 5%, 0402 Thick Film Yageo RC0402FR-0710KL 14 R17, R26, R36 15 R18, R51 3 100k 5% 0402 resistor smd Rohm MCR01MRTJ104 2 Resistor 0402 100 ohm 5% Rohm MCR1MRTJ101 16 17 R23, R21, R22, R24 4 Resistor 49.9 ohm 0402. 1 % Rohm MCR01MRTF49R9 R25 1 Resistor 4.87k 1% 0402 smd Rohm MCR01MRTF4871 Panasonic ERJ-2GEJ562X 18 R28 1 Resistor, 5.6k ohm, 1/10W, 5%, 0402 19 R32, R43, R45, R46 4 resistor 75 ohm 0402 5% Rohm MCR01MRTJ750 Panasonic ERJ-3GEYJ105V Panasonic ERJ-2GEJ510X 20 R34, R52 2 Resistor, 1M OH, 1/10W, 5% 0603 SMD 21 R38 1 Resistor, 51 ohm, 1/10W, 5%, 0402 SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback References, PCB Layout, and Bill of Materials Copyright © 2014–2016, Texas Instruments Incorporated 27 Bill of Materials www.ti.com Table 4-1. Connected LaunchPad Bill of Materials (continued) Item 28 Ref Qty Description Mfg Part Number Rohm MCR01MRTF1004 22 R42 1 Resistor, 1M Ohm, 1/10W, 5%, 0402 23 R47 1 RES 1M OHM 5% 1206 TF Panasonic ERJ-8GEYJ105V Panasonic ERJ-3GEYJ202V 24 R49, R50 2 Resistor, 2.0k ohm, 1/10W, 5%, 0402 25 R6, R7, R8, R10, R11, R15, R16, R19, R20, R39, R40, R41 12 Resistor, 0 ohm, 1/10W, 5%, 0402 Panasonic ERJ-2GE0R00X 26 R9, R27, R30, R31, R33 5 Resistor, 330 ohm, 1/10W, 5%, 0402 Yageo RC0402FR-07330RL 27 RESET, USR_SW1, USR_SW2, WAKE 4 Switch, Tact 6mm SMT, 160gf Omron B3S-1000 28 U1 1 Tiva, MCU TM4C1294NCPDT 128 QFP with Ethernet MAC + PHY 29 U10 1 30 U13 31 Texas Instruments TM4C1294NCPDT Texas Instruments XM4C1294NCPDT Transformer, ethernet, 1 to 1. SOIC 16 Pulse Electronics HX1198FNL 1 Diode, 8 chan, +/-15KV, ESD Protection Array, SO-8 Semtech SLVU2.8-4.TBT U14 1 Connector, RJ45 NO MAG, shielded THRU HOLE TE Connectivity 1-406541-5 32 U2, U3 2 IC 4CH ESD SOLUTION W/CLAMP 6SON Texas Instruments TPD4S012DRYR 33 U20 1 Stellaris TIVA MCU TM4C123GH6PMI Texas Instruments TM4C123GH6PMI 34 U22 1 USB Micro B receptacle right angle with guides FCI 10118194-0001LF 35 U4 1 Fault protected power switch, dual channel, 8-SON Texas Instruments TPS2052BDRBR 36 U5 1 3.3V LDO TI TPS73733DRV fixed out 5V in Texas Instruments TPS73733DRV 37 U6 1 Header 2x5, 0.050, SM, Vertical Shrouded 38 U7 1 USB Micro AB receptacle. Right angle with through guides 39 X6, X7, X8, X9 4 Header, 2x10, T-Hole Vertical unshrouded stacking 40 Y1 1 41 Y2 42 Y3 Samtec SHF-105-01-S-D-SM Don Connex Electronics C44-10BSA1-G Hirose ZX62D-AB-5P8 Samtec SSW-110-23-S-D Major League Electronics SSHQ-110-D-08-F-LF Crystal 25 MHz 3.2 x 2.5 mm NDK nx3225ga-25.000m-std-crg-2 1 Crystal 16 MHz 3.2 x 2.5 mm 4 pin NDK NX3225GA-16.000M-STD-CRG-2 1 Crystal, 32.768 KHz Radial Can Citizen Finetech Miyota CMR200T-32.768KDZY-UT References, PCB Layout, and Bill of Materials SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Bill of Materials www.ti.com Table 4-1. Connected LaunchPad Bill of Materials (continued) Item Ref Qty Description Mfg Part Number PCB Do Not Populate List (Shown for information only) 43 C2 1 Capacitor, 0.1uF 16V, 10%, 0402 X7R Taiyo Yuden EMK105B7104KV-F McMaster 90077A112 44 H1, H4, H6 3 Screw, #4 x 0.625" Pan Head, Sheet Metal, Phillips/Slotted (for fan) 45 R12, R13, R14 3 Resistor, 5.6k ohm, 1/10W, 5%, 0402 Panasonic ERJ-2GEJ562X 46 R48 1 Resistor 0402 1% 52.3k Rohm TRR01MZPF5232 47 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13, TP14, TP15, TP16, TP17 17 Terminal, Test Point Miniature Loop, Red, T-Hole Keystone 5000 48 X1 1 Header, 2x7, 0.100, T-Hole, Vertical, Unshrouded, 0.230 Mate FCI 67997-114HLF 49 X11A 1 Valvano style bread board connect. Right Angle extended, 1 x 49 0.100 pitch. Samtec TSW-149-09-F-S-RE 50 X11B 1 valvano style breadboard header. Samtec TSW-149-08-F-S-RA SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback References, PCB Layout, and Bill of Materials Copyright © 2014–2016, Texas Instruments Incorporated 29 Chapter 5 SPMU365C – March 2014 – Revised October 2016 Schematic This section contains the complete schematics for the Tiva C Series TM4C1294 Connected LaunchPad. • Microcontroller, USB, Buttons, and LED's • BoosterPack connectors • Breadboard connector • Ethernet and Ethernet LED's • Power • In-Circuit Debug Interface 30 Schematic SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated 3 4 5 6 TP4 TARGET_VBUS/3.2C GPIO TP5 P1 P2 P3 P4 P5 TP14 USBD_N U1G$1 C D PE0 PE1 PE2 PE3 PE4 PE5 P$15 P$14 P$13 P$12 P$123 P$124 PG0 PG1 P$49 P$50 PJ0 PJ1 P$116 P$117 PK0 PK1 PK2 PK3 PK4 PK5 PK6 PK7 P$18 P$19 P$20 P$21 P$63 P$62 P$61 P$60 PM0 PM1 PM2 PM3 PM4 PM5 PM6 PM7 P$78 P$77 P$76 P$75 P$74 P$73 P$72 P$71 PP0 PP1 PP2 PP3 PP4 PP5 P$118 P$119 P$103 P$104 P$105 P$106 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PF0 PF1 PF2 PF3 PF4 PG0 PG1 PH0 PH1 PH2 PH3 PK0 PK1 PK2 PK3 PK4 PK5 PK6 PK7 PL0 PL1 PL2 PL3 PL4 PL5 PL6 PL7 PM0 PM1 PM2 PM3 PM4 PM5 PM6 PM7 PN0 PN1 PN2 PN3 PN4 PN5 PP0 PP1 PP2 PP3 PP4 PP5 TM4C1294NCPDT USBD_P PB2 PB3 PB4 PB5 TARGET_ID P$1 P$2 P$3 P$4 P$125 P$126 P$127 P$128 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 P$42 P$43 P$44 P$45 P$46 PF0 PF1 PF2 PF3 PF4 P$29 P$30 P$31 P$32 PH0 PH1 PH2 PH3 P$81 P$82 P$83 P$84 P$85 P$86 P$94 P$93 PL0 PL1 PL2 PL3 PL4 PL5 GND 3300pF U2 TPD4S012_DRY_6 USBD_N TARGET_ID R18 PB0/3.2C 100 1 2 3 D+ DID VBUS N.C. GND PN0 PN1 PN2 PN3 PN4 PN5 P$5 P$6 P$11 P$27 P$102 PQ0 PQ1 PQ2 PQ3 PQ4 GND 6 5 4 TARGET_VBUS/3.2C B USBD_P GND NOTE: TPD4S012 all protection circuits are identical. Connections chosen for simple routing. PN0/3.4D PN1/3.4D C USBD_P USBD_N P$107 P$108 P$109 P$110 P$111 P$112 A TP7 C32 PE0 PE1 PE2 PE3 PE4 PE5 PJ0 PJ1 TARGET_VBUS/3.2C PB0 D1 B PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 P$95 P$96 P$91 P$92 P$121 P$120 GND R33 GND TARGET_TCK/SWCLK/6.1A TARGET_TMS/SWDIO/6.1A TARGET_TDI/6.1E TARGET_TDO/SWO/6.1E TP6 PB0 PB1 PB2 PB3 PB4 PB5 330 PC4 PC5 PC6 PC7 P$100 P$99 P$98 P$97 P$25 P$24 P$23 P$22 TP17 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 D2 P$33 P$34 P$35 P$36 P$37 P$38 P$40 P$41 R27 TP16 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 330 A TP15 U7G$1 VBUS DM DP ID GND 1M convienence test points for ground 2 R52 1 GND See PF0 and PF4 for additional LED's used for Ethernet or user application USR_SW1 PQ0 PQ1 PQ2 PQ3 PQ4 PJ0/3.2D D SWITCH_TACTILE USR_SW2 PJ1/3.2D SWITCH_TACTILE GND E E 1 2 3 4 5 6 +5V X8-2 +3V3 A TSW-110-02-S-D X8-1 GND/1.6B C23 0.1uF GND X8-3 X8-5 X8-7 X8-9 X8-11 X8-13 X8-15 X8-17 X8-19 PE4 PC4 PC5 PC6 PE5 PD3 PC7 PB2 PB3 PE0 PE1 PE2 PE3 PD7 PA6 PM4 PM5 TSW-110-02-S-D X8-4 X8-6 X8-8 X8-10 X8-12 X8-14 X8-16 X8-18 X8-20 C24 0.1uF GND X9-1 X9-3 X9-5 X9-7 X9-9 X9-11 X9-13 X9-15 X9-17 X9-19 A X9-2 GND/1.6B PF1 PF2 PF3 PG0 PL4 PL5 PL0 PL1 PL2 PL3 PM3 PH2 PH3 X9-4 X9-6 X9-8 TARGET_RESET/3.2D PD1 PD0 PN2 PN3 PP2 X9-10 X9-12 X9-14 X9-16 X9-18 X9-20 BoosterPack 1 Interface B B C C +3V3 +5V TSW-110-02-S-D X6-1 GND/1.6B C25 0.1uF X6-9 X6-11 D GND X6-3 X6-5 X6-7 PD2 PP0 PP1 BP2_A2.5 BP2_A2.6 X6-13 X6-15 X6-17 X6-19 PQ0 PP4 PN5 PN4 PB4 PB5 PK0 PK1 PK2 PK3 PA4 PA5 X6-2 TSW-110-02-S-D PG1 X6-4 X7-1 PK4 X7-3 PK5 X6-6 X7-5 C26 PM0 X6-8 X7-7 PM1 X6-10 X7-9 0.1uF PM2 X6-12 X7-11 PH0 X6-14 X7-13 PH1 X6-16 X7-15 PK6 GND X6-18 X7-17 PK7 X6-20 X7-19 GND/1.6B X7-2 PM7 PP5 PA7 X7-4 X7-6 X7-8 JP4 and JP5 CAN and ICDI UART Selection: Populate Jumpers from 1-2 and 3-4 for Default Mode This enables ROM UART boot loader. UART 0 to ICDI Populate from 1-3 and 2-4 for controller area network on the boosterpack. UART2 is then availabe to ICDI. X7-10 TARGET_RESET/3.2D PA3 PQ2 PA2 PQ3 PP3 PQ1 PM6 0 X7-12 R19 0 X7-14 R20 X7-16 X7-18 X7-20 R19 and R20 can be populated to enable I2C on Right side of BP2 interface. This is for legacy support and the Sensor Hub BoosterPack. I2C and SSI are available on the corresponding BoosterPack 1 interface pins without modification to the board. JP4 TARGET_RXD/6.1D PD4/1.4B 1 3 2 4 PA0/3.2C BP2_A2.5 D PA6 and PA7 are also used by the onboard radio. Configure the radio to tri-state these GPIO before using them on the boosterpack interface. JP5 TARGET_TXD/6.1D PD5/1.4B 1 3 2 4 PA1/3.2C BP2_A2.6 BoosterPack 2 Interface E E 2 3 4 +5V This is the breadboard connection header. Samtec TSW-149-08-F-S-RA and TSW-149-09-F-S-RE can be used together to create a breadboard connector see the Users Manual for more information. C28 A 0.1uF 5 6 +3V3 1 C27 0.1uF A TSW-149-02-S-D GND PA2 PA3 PA4 PA5 PE0 PE1 PE2 PE3 PE4 PE5 PK0 PK1 PK2 PK3 B VREF+/5.5B GND/2.3C PD5 PD4 PD7 PD6 PD3 PD1 PD0 PD2 PP0 PP1 PB0 TARGET_VBUS/1.6B GND/2.3C PF4 PF0 PF1 PF2 PF3 PA0 PA1 PP4 PP5 PJ0 PJ1 PM7 PM6 PM5 PM4 D +3V3 C TARGET_RESET/2.4D GND/2.3C X11-1 X11-3 X11-5 X11-7 X11-9 X11-11 X11-13 X11-15 X11-17 X11-19 X11-21 X11-23 X11-25 X11-27 X11-29 X11-31 X11-33 X11-35 X11-37 X11-39 X11-41 X11-43 X11-45 X11-47 X11-49 X11-51 X11-53 X11-55 X11-57 X11-59 X11-61 X11-63 X11-65 X11-67 X11-69 X11-71 X11-73 X11-75 X11-77 X11-79 X11-81 X11-83 X11-85 X11-87 X11-89 X11-91 X11-93 X11-95 X11-97 GND PB4 PB5 PH0 PH1 PH2 PH3 PC7 PC6 PC5 PC4 PA6 PA7 PG1 PG0 PM3 GND/4.1A PM2 PM1 PM0 PL0 PL1 PL2 PL3 PQ0 PQ1 PQ2 PQ3 PK7 GND/4.1A PK6 PL4 PB2 PB3 PP2 PP3 PK5 PK4 PL5 PN4 PN5 PN0 PN1 PN2 PN3 PQ4 WAKE/5.5A C29 C30 0.1uF 0.1uF GND E X11-2 X11-4 X11-6 X11-8 X11-10 X11-12 X11-14 X11-16 X11-18 X11-20 X11-22 X11-24 X11-26 X11-28 X11-30 X11-32 X11-34 X11-36 X11-38 X11-40 X11-42 X11-44 X11-46 X11-48 X11-50 X11-52 X11-54 X11-56 X11-58 X11-60 X11-62 X11-64 X11-66 X11-68 X11-70 X11-72 X11-74 X11-76 X11-78 X11-80 X11-82 X11-84 X11-86 X11-88 X11-90 X11-92 X11-94 X11-96 X11-98 +5V B NOTE: PB0 and PB1 are used in some configurations with 5V signals especially in USB Host or OTG mode. Be aware the 5V may be present on these pins depending on system jumper configuration These pins are only 5V tolerant when configured for USB mode applications. C D GND E 1 2 4 5 6 R21 49.9 R23 C16 0.1uF R22 GND R24 49.9 0.1uF 49.9 49.4 C17 A 3 Place pull up resistors and C16-C17 near TM4C MCU. MCU_3V3/5.2A A GND Place C18 and C22 near pin 2 and pin 7 of U$10 U10 3 75 R43 C22 0.1uF EN0RXI_N/5.3B P$7 P$8 P$10 P$11 P$7 P$3 P$6 P$4 P$5 7 6 P$11 4 P$6 5 P$7 R46 P$6 EN0RXI_P/5.3B GND B P$2 U14 1 2 3 4 5 6 7 8 P$8 P$9 P$9 TX+ TXRX+ TERM1A TERM1B RXTERM2A TERM2B CHASSIS CHASSIS 9 10 P$10 75 C31 U10 May be populated with either HX1188FNL or HX1198FNL. HX1198FNL preferred for best Ethernet performance. 4700pF GND C C 330 R30 330 R31 GND D4 PF0/3.2C D3 PF4/3.2C D B 1M P$15 2 8 R47 P$14 P$14 P$8 1000pF P$3 P$1 C1 P$15 U13 1 P$2 75 C18 P$3 P$16 75 R32 0.1uF GND EN0TXO_N/5.3B P$2 P$16 P$1 R45 P$1 EN0TXO_P/5.3B D GND For Ethernet example Applications: LED4 is default configured as Ethernet Link OK LED3 is default configured as Ethernet TX/RX activity User may re-configure these pins / LED's for any application usage. E E 1 2 3 4 5 6 JP2 can be used to measure MCU current consumption with a multi-meter. +3V3 WAKE A MCU_3V3/4.1A 10k SWITCH_TACTILE Power Control Jumper: TARGET_RESET/3.2D 1) To power from Debug install jumper on pins 5 - 6 2) To power from Target USB install jumper on pins 3 - 4 RESET 3) To power from BoosterPack 5V install jumper on pins 1 - 2 This is also the off position if BoosterPack does not supply power When powered from BoosterPack TPS2052B does not provide current limit protection. C48 12pF CRYATL_32K_SMD P$2 GND 100 C46 P$88 P$89 P$4 R25 4.87k 1% GND P$10 P$17 P$48 P$55 P$58 P$80 P$114 P$1 Y1 12pF OSC0 NC2 VBUS C44 P$53 P$54 P$56 P$57 P$59 EN0RXI_N EN0RXI_P EN0TXO_N EN0TXO_P RBIAS P$2 GND 2 4 6 P$66 P$67 P$70 25Mhz 1 3 5 GND H4 MOUNT-HOLE3.2 C3 C45 XOSC0 XOSC1 HIB WAKE VBAT RESET VDDA VREFA+ OSC0 OSC1 VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD EN0RXIN EN0RXIP EN0TXON EN0TXOP RBIAS GNDA GND GND GND GND GND GND VDDC VDDC 12pF C R42 51 TP9 R49 P$3 JP1 H6 MOUNT-HOLE3.2 P$65 P$64 P$68 R38 and C3 Used to meet VBAT rise time requirements TP13 GND R41 0 R41 may be removed and precision reference applied to TP13 P$7 P$16 P$26 P$28 P$39 P$47 P$51 P$52 P$69 P$79 P$90 P$101 P$113 P$122 C41 C42 C43 0.1uF 0.1uF 0.1uF 0.1uF GND TP12 P$87 P$115 GND C4 C14 C15 0.1uF 1.0uF 2.2uF R35 5 R26 100k 7 8 For Host/OTG: PD6 configured as USB0EPEN peripheral function. R36 VBUS 100k *EN2 GND EPAD V V_2 V_3 V_4 V_5 V_6 6 5 TARGET_VBUS/3.2C PQ4/3.4D D USB Host mode does not supply power to devices when powered from a BoosterPack For Applications that do not use USB: Configure PD6 as input with internal pull-down enabled. Turns off power to TARGET_VBUS JP3 OUT2 *OC2 PQ4 configure as individual pin interrupt. Indicates power fault on the USB bus. USB0PFLT peipheral pin not available due to pin mux and use on BoosterPacks. D0 OMIT R48 C19 0.1uF GND GND Also provides power switching for USB host/OTG modes 2 330 NC 1 OUT1 *OC1 TPS2052B provides current limit for main 5V power. TP8 GND 2.2uF R9 NR/FB GND EPAD V E EN VIA 3 7 OUT VIA 4 IN V_2 0.1uF R17 100k C20 U5 TPS73733_DRV_6 2 1 +5V 4 1 9 +3V3 Primary 3.3V regulator Disconnect JP3 to power device from 3V3 BoosterPack PD6/3.2B IN *EN1 VIA VIA VIA VIA VIA VIA 10k +5V U4 TPS2052B_DRB_8 2 3 6 C GND VBUS TP3 B MCU_3V3/6.2A C40 H1 MOUNT-HOLE3.2 C21 0 R38 0.1uF P$8 P$9 GND D TP11 R39 1M U1G$2 0.1uF 2k A WAKE/3.3D GND When powered by BoosterPack, USB host mode does not supply power to connected devices TARGET_VBUS/3.2C DEBUG_VBUS/6.4A P$1 P$2 1 2 TP10 GND 12pF P$1 Y3 R51 NC4 OSC1 B R44 C47 SWITCH_TACTILE JP2 GND E 1 2 3 4 5 JTAG PULL-UPS 10k 5.6k 10k R28 R29 6 Use this for JTAG IN from external debugger. See X1 jumpers for information about debug out to an external target. R40 must be removed for debug out. R40 must be instaled for debug in. R1 10k +3V3 DEBUG_VBUS/5.1B MCU_3V3/5.6B TARGET_TCK/SWCLK/1.2A GND U6 TARGET_TMS/SWDIO/1.2B ICDI_TCK R4 10k ICDI_TMS EXTERNAL_DEBUG R5 EXTERNAL_DEBUG pull low to use external debugger to debug the target. Causes ICDI chip to tri-state the JTAG lines RTCK RESET VTREF TDO TRST OMIT TCK TMS TDI C ICDI_TCK ICDI_TMS ICDI_TDI 3 7 10 ICDI_TDO ICDI_RESET PE4 ETM_ENn Leave Open use GPIO Internal weak pullup. 1 6 PE5 LS_PRESENTn Leave Open use GPIO internal weak pullup ICDI_TDO 9 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PE0 PE1 PE2 PE3 PE4 PE5 PF0 PF1 PF2 PF3 PF4 4 P$38 P$41 P$40 8 P$34 P$35 P$36 2k U21 GND P$2 P$3 +3V3 C8 Jumpers to bridge from ICDI to Target portion of LaunchPad P$4 0.1uF U22G$1 DEBUG_ACTIVE RESET WAKE TARGET_TXD/2.5D OSC0 NC2 VBAT XOSC0 GNDX XOSC1 VDDA VDD0 VDD1 VDD2 VDD3 GNDA GND0 GND1 GND2 GND3 VDDC0 VDDC1 P$33 GND GND P$2 C10 P$11 P$26 P$42 P$54 C11 C12 C C13 0.1uF 0.1uF 0.1uF 0.1uF P$25 P$56 GND ICDI_VDDC C5 U3 TPD4S012_DRY_6 C9 C6 C7 VERSION RESISTOR TABLE: *use internal GPIO weak pullups. ALL OMITTED: Legacy mode. (Stellaris ICDI) ALL POPULATED: Everything enabled Version 0 populated: UART CTS/RTS and Analog inputs GND R13 VERSION_1 VCP_RXD ICDI_USBD_P ICDI_USBD_N GND 1 2 3 D+ DID VBUS N.C. GND 6 5 4 5.6k R14 DEBUG_VBUS/5.1B VERSION_2 5.6k R12 VCP_TXD R7 0 TARGET_TCK/SWCLK/1.2A VERSION_0 GND DEBUG_PC0/TCK/SWCLK R8 0 TARGET_TMS/SWDIO/1.2B DEBUG_PC1/TMS/SWDIO R10 0 TARGET_TDI/1.2B DEBUG_PC2/TDI R11 0 TARGET_TDO/SWO/1.2B DEBUG_PC3/TDO/SWO R15 0 TARGET_RESET/5.2A X1-14 X1-13 X1-12 X1-11 X1-10 X1-9 X1-8 X1-7 X1-6 X1-5 X1-4 X1-3 X1-2 X1-1 OMIT D OMIT OMIT 5.6k GND VCP_RXD VCP_TXD DEBUG_PC0/TCK/SWCLK DEBUG_PC1/TMS/SWDIO DEBUG_PC2/TDI DEBUG_PC3/TDO/SWO DEBUG_RESET_OUT TSW-107-02-S-D X1 omitted by default DEBUG_RESET_OUT R16 OMIT TARGET_TXD/2.5D TARGET_RXD/2.5D TARGET_TCK/SWCLK/1.2A TARGET_TMS/SWDIO/1.2B TARGET_TDI/1.2B TARGET_TDO/SWO/1.2B TARGET_RESET/5.2A B GND P$37 12pF R6 0 TARGET_RXD/2.5D HIB OSC1 OSC0 P$32 0.1uF 1.0uF 2.2uF 0 VBUS DM DP ID GND 3300pF GND GND P1 P2 P3 P4 P5 DEBUG_VBUS/5.1B DEBUG_PC1/TMS/SWDIO DEBUG_PC0/TCK/SWCLK TM4C123xH6PMI 16M Y2 GND P$1 10k C2 NC4 OSC1 R3 OMIT ICDI_RESET P$3 P$12 P$27 P$39 P$55 12pF E TP1 C33 2 A GND P$61 VERSION_0 P$62 P$63 P$64 P$43 ICDI_USBD_N P$44 ICDI_USBD_P P$53 DEBUG_PC3/TDO/SWO P$10 P$28 P$29 P$30 P$31 P$5 DEBUG_PC1/TMS/SWDIO DEBUG_PC0/TCK/SWCLK DEBUG_PC3/TDO/SWO DEBUG_PC2/TDI DEBUG_RESET_OUT JTAG_ARM_10PIN GND R50 D P$9 P$8 P$7 P$6 P$59 P$60 PC0/TCK PC1/TMS PC2/TDI PC3/TDO PC4 PC5 PC6 PC7 0 P2 P4 P6 P8 P10 VTARGET TMS TCK EXTDBG TDO GND TDI P$7 RESET GND1 +3V3 B 5 +3V3 NC GND P$52 P$51 P$50 P$49 P$16 P$15 P$14 P$13 PB0 U20 PB1 TM4C123GH6PMI PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 P1 P3 P5 P7 P9 R40 P$45 EXTERNAL_DEBUG P$46 P$47 VERSION_1 P$48 VERSION_2 P$58 P$57 P$1 P$4 1M 10k VCP_RXD VCP_TXD DEBUG_PC0/TCK/SWCLK DEBUG_PC1/TMS/SWDIO DEBUG_PC3/TDO/SWO DEBUG_PC2/TDI TP2 DEBUG_RESET_OUT +3V3 A P$17 P$18 P$19 P$20 P$21 P$22 P$23 P$24 R34 R2 To debug out from ICDI to off board MCU remove 0 ohm jumper resistors. To go back from debug out to debugging the target MCU install X1 and place jumpers on all pins. E Revision History www.ti.com Revision History Changes from B Revision (May 2015) to C Revision ...................................................................................................... Page • GLOBAL: Updated/Changed all instances of "UART4" to "UART2"................................................................ 4 SPMU365C – March 2014 – Revised October 2016 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated Revision History 31 STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. 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Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. 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Source Exif Data:
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