US6K4 Datasheet. Www.s Manuals.com. Rohm

User Manual: Marking of electronic components, SMD Codes K0, K0-***, K01, K02, K0355, K0389, K0390, K0391, K0392, K0393, K0394, K0395, K0396, K0397, K03B7, K03B8, K03B9, K04, K06, K0=***. Datasheets BST86, EM6K6, QS5K2, QS6K1, RJK0355DPA, RJK0389DPA, RJK0390DPA, RJK0391DPA, RJK0392DPA, RJK0393DPA, RJK0394DPA, RJK0395DPA, RJK0396DPA, RJK0397DPA, RJK03B7DPA, RJK03B8DPA, RJK03B9DPA, RT9818C-29GVL, RT9818C-29PVL, US6K1, US6K2, US6K4.

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US6K4
Transistors
Rev.A 1/3
1.8V Drive
Nch+Nch
MOSFET
US6K4
zStructure zDimensions (Unit : mm)
Silicon N-channel MOSFET
zFeatures
1) Two Nch MOSFETs are put in TUMT6 package.
2) High-speed switching, Low On-resistance.
3) 1.8V drive.
zApplications
Switching
zPackaging specifications zInner circuit
Package
Code
Taping
Basic ordering unit (pieces)
US6K4
TR
3000
Type
zAbsolute maximum ratings (Ta=25°C)
<It is the same ratings for the Tr1 and Tr2>
1
2
1
Parameter
VV
DSS
Symbol
VVGSS
AID
AIDP
AIS
AISP
W / TOTAL
PD
°CTch
°CTstg
Limits Unit
Drain-source voltage
Gate-source voltage
Drain current
Total power dissipation
Channel temperature
Range of storage temperature
Continuous
Pulsed
Continuous
Pulsed
1 Pw10µs, Duty cycle1%
2 Mounted on a ceramic board
Source current
(Body diode)
20
150
55 to +150
±10
±1.5
±3.0
0.6
2.4
1.0
W / ELEMENT0.7
zThermal resistance
Parameter
°C/W / TOTAL
Rth(ch-a)
Symbol Limits Unit
Channel to ambient 125
°C/W / ELEMENT179
Mounted on a ceramic board
TUMT6
Abbreviated symbol : K04
0.2Max.
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Drain
(4) Tr2 Source
(5) Tr2 Gate
(6) Tr1 Drain
1 ESD PROTECTION DIODE
2 BODY DIODE
22
1
1
(1)
(6)
(3)
(4)
(2)
(5)
US6K4
Transistors
Rev.A 2/3
zElectrical characteristics (Ta=25°C)
<It is the same characteristics for the Tr1 and Tr2>
Parameter Symbol
I
GSS
Y
fs
Min.
Typ. Max. Unit Conditions
V
(BR) DSS
I
DSS
V
GS (th)
R
DS (on)
C
iss
C
oss
C
rss
t
d (on)
t
r
t
d (off)
t
f
Q
g
Q
gs
Q
gd
Gate-source leakage
Drain-source breakdown voltage
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Total gate charge
Gate-source charge
Gate-drain charge
Pulsed
−±10 µAV
GS
=±10V, V
DS
=0V
V
DD
10V
V
GS
=
4.5V
20 −−VI
D
= 1mA, V
GS
=0V
−−1µAV
DS
= 20V, V
GS
=0V
0.3 1.0 V V
DS
= 10V, I
D
= 1mA
130 180 I
D
= 1.5A, V
GS
= 4.5V
170 240 m
m
m
I
D
= 1.5A, V
GS
= 2.5V
220 310 I
D
= 0.8A, V
GS
= 1.8V
1.6 −−SV
DS
= 10V, I
D
= 1.5A
110 pF V
DS
= 10V
18
15
pF V
GS
=0V
5
pF f=1MHz
5
ns
20
ns
3
ns
1.8
ns
0.3
2.5 nC
0.3
nC
I
D
=
1.5A
−−nC
V
DD
10V
I
D
= 1.0A
V
GS
= 4.5V
R
L
= 10
R
GS
=10
zBody diode characteristics (Source-drain) (Ta=25°C)
<It is the same characteristics for the Tr1 and Tr2>
V
SD
−−1.2 V I
S
= 0.6A, V
GS
=0VForward voltage
Parameter Symbol Min. Typ. Max. Unit Conditions
US6K4
Transistors
Rev.A 3/3
zElectrical characteristics curves
DRAIN-SOURCE VOLTAGE : V
DS
(V)
0.01
10
100
1000
0.1 1 10 100
CAPACITANCE : C (pF)
Fig.1 Typical Capacitance
vs. Drain-Source Voltage
Ta=25°C
f=1MHz
V
GS
=0V
Ciss
Coss
Crss
DRAIN CURRENT : I
D
(A)
0.01
1
10
100
1000
0.1 1 10
SWITCHING TIME : t (ns)
Fig.2 Switching Characteristics
Ta=25°C
VDD=10V
VGS=4.5V
RG=10
Pulsed
tf
td(on)
tr
td(off)
TOTAL GATE CHARGE : Qg (nC)
0.0
0
1
2
3
4
5
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
GATE-SOURCE VOLTAGE : V
GS
(V)
Fig.3 Dynamic Input Characteristics
Ta=25°C
V
DD
=10V
I
D
=1.5A
R
G
=10
Pulsed
GATE-SOURCE VOLTAGE : V
GS
(V)
0.001
0.0001
0.01
0.1
1
10
0.50.0 1.0 1.5 2.0
DRAIN CURRENT : I
D
(A)
Fig.4 Typical Transfer Characteristics
VDS=10V
Pulsed
Ta=125°C
75°C
25°C
25°C
GATE-SOURCE VOLTAGE : V
GS
(V)
01
0
300
250
200
150
100
50
350
400
450
500
23 10456789
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS(on)
(m)
Fig.5 Static Drain-Source
On-State Resistance vs.
Gate-source Voltage
Ta=25°C
Pulsed
I
D
=1.5A
I
D
=0.8A
SOURCE-DRAIN VOLTAGE : V
SD
(V)
0.0
0.01
0.1
1
10
0.5 1.0 1.5
SOURCE CURRENT : I
S
(A)
Fig.6 Source Current vs.
Source-Drain Voltage
V
GS
=0V
Pulsed
Ta=125°C
75°C
25°C
25°C
DRAIN CURRENT : I
D
(A)
0.01
0.1
10
100
1000
110
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS (on)
(m)
Fig.7 Static Drain-Source
On-State Resistance
vs. Drain Current ( Ι )
V
GS
=1.8V
Pulsed
Ta=125°C
25°C
75°C
25°C
DRAIN CURRENT : I
D
(A)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS (on)
(m)
Fig.8 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙ )
0.01
0.1
10
100
1000
110
V
GS
=2.5V
Pulsed
Ta=125°C
75°C
25°C
25°C
DRAIN CURRENT : I
D
(A)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
DS (on)
(m)
Fig.9 Static Drain-Source
On-State Resistance
vs. Drain Current ( ΙΙΙ )
0.01
0.1
10
100
1000
110
V
GS
=4.5V
Pulsed
Ta=125°C
75°C
25°C
25°C
zNotice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
Appendix1-Rev2.0
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Copyright © 2007 ROHM CO.,LTD.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level
of reliability and the malfunction of which would directly endanger human life (such as medical
instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers
and other safety devices), please be sure to consult with our sales representative in advance.
It is our top priority to supply products with the utmost quality and reliability. However, there is always a chance
of failure due to unexpected factors. Therefore, please take into account the derating characteristics and allow
for sufficient safety features, such as extra margin, anti-flammability, and fail-safe measures when designing in
order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM
cannot be held responsible for any damages arising from the use of the products under conditions out of the
range of the specifications or due to non-compliance with the NOTES specified in this catalog.
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Appendix
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