ESPRESSIF SYSTEMS ESP32SOLO1C WIFI &Bluetooth; Module User Manual

ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD WIFI &Bluetooth; Module

User Manual

CONFIDENTIALESP32-SOLO-1CDatasheetPrerelease version V0.1Espressif SystemsCopyright © 2018www.espressif.com
CONFIDENTIALAbout This DocumentThis document provides the specifications for the ESP32-SOLO-1C module.Revision HistoryFor revision history of this document, please refer to the last page.Documentation Change NotificationEspressif provides email notifications to keep customers updated on changes to technical documentation.Please subscribe at www.espressif.com/en/subscribe.CertificationDownload certificates for Espressif products from www.espressif.com/en/certificates.Disclaimer and Copyright NoticeInformation in this document, including URL references, is subject to change without notice. THIS DOCUMENTIS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OFMERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTYOTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.All liability, including liability for infringement of any proprietary rights, relating to use of information in thisdocument is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual propertyrights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetoothlogo is a registered trademark of Bluetooth SIG.All trade names, trademarks and registered trademarks mentioned in this document are property of theirrespective owners, and are hereby acknowledged.Copyright © 2018 Espressif Inc. All rights reserved.
Contents1 Overview 12 Pin Definitions 32.1 Pin Layout 32.2 Pin Description 32.3 Strapping Pins 43 Functional Description 63.1 CPU and Internal Memory 63.2 External Flash and SRAM 63.3 Crystal Oscillators 63.4 RTC and Low-Power Management 74 Peripherals and Sensors 89999115 Electrical Characteristics 5.1 Absolute Maximum Ratings5.2 Recommended Operating Conditions5.3 DC Characteristics (3.3 V, 25 °C)5.4 Reflow Profile12136 Physical Dimensions147 Recommended PCB Land Pattern1414158 Learning Resources 8.1 Must-Read Documents8.2 Must-Have ResourcesRevision History
CONFIDENTIALList of Tables135999101 ESP32-SOLO-1C Specifications2 Pin Definitions3 Strapping Pins4 Absolute Maximum Ratings5 Recommended Operating Conditions 6 DC Characteristics (3.3 V, 25 °C)
CONFIDENTIALList of Figures311121 ESP32-SOLO-1C Pin Layout (Top View) 2 Reflow Profile3 Physical Dimensions of ESP32-SOLO-1C 4 Recommended PCB Land Pattern 13
CONFIDENTIAL1. Overview1. OverviewESP32-SOLO-1C is a powerful, generic Wi-Fi+BT+BLE MCU module that targets a wide variety of applications,ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, musicstreaming and MP3 decoding.At the core of this module is the ESP32-D0WD chip. ESP32-D0WD is a member of the ESP32 family of chips, which features a single core and contains all the peripherals of its dual-core counterparts. Available in a 5x5 mm QFN, ESP32-S0WD offers great value for money, with its sustained performance when powering complex IoT applications.Note:* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the internetthrough a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcastlow energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable forbattery powered and wearable electronics applications. ESP32 supports a data rate of up to 150 Mbps, and 20dBm output power at the antenna to ensure the widest physical range. Several peripherals facilitate integrationwith other electronic devices. As such the chip does offer industry-leading specifications and ultra-highperformance for electronic integration, range, power consumption, and connectivity.The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in aswell. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can upgrade theirproducts even after their release at minimum cost and effort.Table 1provides the specifications of ESP32-SOLO-1C.Table 1: ESP32-SOLO-1C SpecificationsCategories Items SpecificationsWi-Fi Protocols802.11 b/g/n (802.11n up to 150 Mbps)A-MPDU and A-MSDU aggregation and 0.4 µs guardinterval supportFrequency range 2.4 GHz ~2.5 GHzBluetoothProtocols Bluetooth v4.2 BR/EDR and BLE specificationRadioNZIF receiver with –97 dBm sensitivityAFHAudio CVSD and SBCHardware Module interfaceSD card, UART, SPI, SDIO, I2C, LED PWM, MotorPWM, I2S, IR, pulse counter, GPIO, capacitive touchsensor, ADC, DACOn-chip sensor Hall sensorOn-board clock 40 MHz crystalOperating voltage/Power supply 2.7 V ~3.6 VOperating current Average: 80 mAEspressif Systems 1 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL1. OverviewCategories Items SpecificationsMinimum current delivered bypower supply 500 mARecommended operating tem-perature range –40 °C ~+85 °CPackage size (mm) (18.00±0.10) x (25.50±0.10) x (3.10±0.10)Espressif Systems 2 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL2. Pin Definitions2. Pin Definitions2.1 Pin LayoutKeepout ZoneGNDIO23IO22TXD0RXD0IO21NCIO19IO18IO5IO17IO16IO4IO0383736353433323130292827262524232221201918171615IO2IO15SD1SD0CLKCMDSD3SD2IO13GND1234567891011121314GND3V3ENSENSOR_VPSENSOR_VNIO34IO35IO32IO33IO25IO26IO27IO14IO1239 GNDFigure 1: ESP32-SOLO-1C Pin Layout (Top View)2.2 Pin DescriptionESP32-SOLO-1C has 38 pins. See pin definitions in Table 2.Table 2: Pin DefinitionsName No. Type FunctionGND 1 P Ground3V3 2 P Power supplyEN 3 I Module-enable signal. Active high.SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5IO32 8 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,TOUCH9, RTC_GPIO9IO33 9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,TOUCH8, RTC_GPIO8Espressif Systems 3 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL2. Pin DefinitionsName No. Type FunctionIO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DVIO14 13 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,SD_CLK, EMAC_TXD2IO12 14 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,SD_DATA2, EMAC_TXD3GND 15 P GroundIO13 16 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,SD_DATA3, EMAC_RX_ERSHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXDSWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXDSCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTSSCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTSSDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTSSDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTSIO15 23 I/O GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,SD_CMD, EMAC_RXD3IO2 24 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,SD_DATA0IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLKIO4 26 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,SD_DATA1, EMAC_TX_ERIO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUTIO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLKIO18 30 I/O GPIO18, VSPICLK, HS1_DATA7IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0NC 32 - -IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_ENRXD0 34 I/O GPIO3, U0RXD, CLK_OUT2TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1IO23 37 I/O GPIO23, VSPID, HS1_STROBEGND 38 P GroundNotice:* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connectedto the integrated SPI flash integrated on the module and are not recommended for other uses.2.3 Strapping PinsESP32 has five strapping pins, which can be seen in Chapter 6Schematics:Espressif Systems 4 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL2. Pin Definitions• MTDI• GPIO0• GPIO2• MTDO• GPIO5Software can read the values of these five bits from register ”GPIO_STRAPPING”.During the chip’s system reset (power-on-reset, RTC watchdog reset and brownout reset), the latches of thestrapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip ispowered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage ofVDD_SDIO and other initial system settings.Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if astrapping pin is unconnected or the connected external circuit is high-impedance, the internal weakpull-up/pull-down will determine the default input level of the strapping pins.To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the hostMCU’s GPIOs to control the voltage level of these pins when powering on ESP32.After reset, the strapping pins work as normal-function pins.Refer to Table 3for a detailed boot-mode configuration by strapping pins.Table 3: Strapping PinsVoltage of Internal LDO (VDD_SDIO)Pin Default 3.3 V 1.8 VMTDI Pull-down 0 1Booting ModePin Default SPI Boot Download BootGPIO0 Pull-up 1 0GPIO2 Pull-down Don’t-care 0Enabling/Disabling Debugging Log Print over U0TXD During BootingPin Default U0TXD Active U0TXD SilentMTDO Pull-up 1 0Timing of SDIO SlavePin Default Falling-edge InputFalling-edge OutputFalling-edge InputRising-edge OutputRising-edge InputFalling-edge OutputRising-edge InputRising-edge OutputMTDO Pull-up 0 0 1 1GPIO5 Pull-up 0 1 0 1Note:• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timingof SDIO Slave” after booting.• The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up.Espressif Systems 5 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL3. Functional Description3. Functional DescriptionThis chapter describes the modules and functions integrated in ESP32-SOLO-1C.3.1 CPU and Internal MemoryESP32-S0WD contains one low-power Xtensa®32-bit LX6 microprocessor. The internal memoryincludes:• 448 KB of ROM for booting and core functions.• 520 KB of on-chip SRAM for data and instructions.• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessedby the main CPU during RTC Boot from the Deep-sleep mode.• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processorduring the Deep-sleep mode.• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining768 bits are reserved for customer applications, including flash-encryption and chip-ID.3.2 External Flash and SRAMESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI intheESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES toprotect developers’ programs and data in flash.ESP32 can access the external QSPI flash and SRAM through high-speed caches.• The external flash can be mapped into CPU instruction memory space and read-only memory spacesimultaneously.–When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can bemapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will bereduced due to speculative reads by the CPU.–When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at atime. 8-bit, 16-bit and 32-bit reads are supported.• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.8-bit, 16-bit and 32-bit reads and writes are supported.ESP32-SOLO-1C integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto theCPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI flash isconnected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regularGPIOs.3.3 Crystal OscillatorsThe module uses a 40-MHz crystal oscillator.Espressif Systems 6 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL3. Functional Description3.4 RTC and Low-Power ManagementWith the use of advanced power-management technologies, ESP32 can switch between different powermodes.For details on ESP32’s power consumption in different power modes, please refer to section ”RTC andLow-Power Management” in ESP32 Datasheet.Espressif Systems 7 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL4. Peripherals and Sensors4. Peripherals and SensorsPlease refer to Section Peripherals and Sensors in ESP32 Datasheet.Note:External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected tothe module’s integrated SPI flash. For details, please see Section 6Schematics.Espressif Systems 8 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL5. Electrical Characteristics5. Electrical Characteristics5.1 Absolute Maximum RatingsStresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to thedevice. These are stress ratings only, and do not refer to the functional operation of the device.Table 4: Absolute Maximum RatingsSymbol Parameter Min Max UnitVDD33 Power supply voltage –0.3 3.6 VTstore Storage temperature –40 150 °CIO1Cumulative IO output current - 1,100 mA1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flashand/or PSRAM in the VDD_SDIO power domain were excluded from the test.2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.5.2 Recommended Operating ConditionsTable 5: Recommended Operating ConditionsSymbol Parameter Min Typical Max UnitVDD33 Power supply voltage 2.7 3.3 3.6 VIV DD Current delivered by external power supply 0.5 - - AT Operating temperature –40 - 85 °C5.3 DC Characteristics (3.3 V, 25 °C)Table 6: DC Characteristics (3.3 V, 25 °C)Symbol Parameter Min Typ Max UnitCIN Pin capacitance - 2 - pFVIH High-level input voltage 0.75×VDD1- VDD1+0.3 VVIL Low-level input voltage –0.3 - 0.25×VDD1VIIH High-level input current - - 50 nAIIL Low-level input current - - 50 nAVOH High-level output voltage 0.8×VDD1- - VVOL Low-level output voltage - - 0.1×VDD1VIOHHigh-level source current VDD3P3_CPU power domain 1,2- 40 - mA(VDD1= 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1,2- 40 - mAPAD_DRIVER = 3) VDD_SDIO power domain 1,3- 20 - mAIOLLow-level sink current(VDD1= 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3) - 28 - mARP U Pull-up resistor - 45 - kΩEspressif Systems 9 ESP32-SOLO-1C Datasheet V0.1
5. Electrical CharacteristicsSymbol Parameter Min Typ Max UnitRP D Pull-down resistor - 45 - kΩVIL_nRST Low-level input voltage of CHIP_PU to reset the chip - - 0.6 VNotes:1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular powerdomain of pins.2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reducedfrom around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.Espressif Systems 10 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL5. Electrical Characteristics5.4 Reflow Profile50 1500251 ~ 3℃/s0200250200-1 ~ -5℃/sCooling zone10021750100 250Reflow zone !217℃ 60 ~ 90sTemperature (℃)Preheating zone150 ~ 200℃60 ~ 120sRamp-up zonePeak Temp.235 ~ 250℃Soldering time> 30sTime (sec.)Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/sPreheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/sReflow zone — Temp.: >217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70sCooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/sSolder — Sn&Ag&Cu Lead-free solder (SAC305)Figure 2: Reflow ProfileEspressif Systems 11ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL6.Physical Dimensions6.Physical DimensionsPCB ThicknessModule Thickness3.10±0.100.80±0.101.27±0.101.50±0.1017.60±0.10Module WidthModule Length1.27±0.1011.43±0.1025.50±0.1018.00±0.10Unit: mm16.51±0.1011.43±0.103.28±0.101.27±0.1025.50±0.10ESP32-SOLO-1C DIMENSIONSTop View Side View Bottom ViewAntenna Area0.90±0.100.85±0.106.20±0.1015.80±0.101.50±0.100.45±0.100.90±0.1018.00±0.103.28±0.10∅0.50±0.106.40±0.109.20±0.102.20±0.102.20±0.10Figure 3: Physical Dimensions of ESP32-SOLO-1CEspressif Systems 12 ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL7.Recommended PCB Land Pattern7.Recommended PCB Land Pattern25.5181.27x13=16.511.27x9=11.432.785126.3177.492.785550.9115 2438Unit:mm6.514Figure4: Recommended PCB Land PatternEspressif Systems 13ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIAL8.Learning Resources8.Learning Resources8.1 Must-Read DocumentsThe following link provides documents related to ESP32.•ESP32 DatasheetThis document provides an introduction to the specifications of the ESP32 hardware, including overview,pin definitions, functional description, peripheral interface, electrical characteristics, etc.•ESP-IDF Programming GuideIt hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.•ESP32 Technical Reference ManualThe manual provides detailed information on how to use the ESP32 memory and peripherals.•ESP32 Hardware ResourcesThe zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and developmentboards.•ESP32 Hardware Design GuidelinesThe guidelines outline recommended design practices when developing standalone or add-on systemsbased on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and developmentboards.•ESP32 AT Instruction Set and ExamplesThis document introduces the ESP32 AT commands, explains how to use them, and provides examples ofseveral common AT commands.•Espressif Products Ordering Information8.2 Must-Have ResourcesHere are the ESP32-related must-have resources.•ESP32 BBSThis is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, shareknowledge, explore ideas, and help solve problems with fellow engineers.•ESP32 GitHubESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It isestablished to help developers get started with ESP32 and foster innovation and the growth of generalknowledge about the hardware and software surrounding ESP32 devices.•ESP32 ToolsThis is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32Certification and Test”.•ESP-IDFThis webpage links users to the official IoT development framework for ESP32.•ESP32 ResourcesThis webpage provides the links to all available ESP32 documents, SDK and tools. �����������Espressif Systems 14ESP32-SOLO-1C Datasheet V0.1
CONFIDENTIALRevision HistoryRevision HistoryDate Version Release notes2018.10 V0.1 Preliminary release.Espressif Systems 15ESP32-SOLO-1C Datasheet V0.1FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. FCC Label Instructions:The outside of final products that contains this module device must display a labelreferring to the enclosed module. This exterior label can use wording such as: “ContainsTransmitter Module FCC ID: 2AC7Z-ESP32SOLO1C”,or “Contains FCC ID: 2AC7Z-ESP32SOLO1C”, Any similar wording that expresses the same meaning may be used.

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