ESPRESSIF SYSTEMS ESP32SOLO1C WIFI &Bluetooth; Module User Manual
ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD WIFI &Bluetooth; Module
User Manual
| Download: |  |
| Mirror Download [FCC.gov] | |
| Document ID | 4099225 |
| Application ID | dV5i8MIdyzf1Va3kISawkg== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 29.48kB (368460 bits) |
| Date Submitted | 2018-12-07 00:00:00 |
| Date Available | 2018-12-07 00:00:00 |
| Creation Date | 2018-10-11 09:03:39 |
| Producing Software | XeTeX 0.99996 |
| Document Lastmod | 2018-12-07 17:49:50 |
| Document Title | User Manual |
| Document Creator | LaTeX with hyperref package |
ESP32-SOLO-1C CO NF ID EN TI AL Datasheet Prerelease version V0.1 Espressif Systems Copyright © 2018 www.espressif.com About This Document This document provides the specifications for the ESP32-SOLO-1C module. Revision History Documentation Change Notification TI AL For revision history of this document, please refer to the last page. Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification EN Download certificates for Espressif products from www.espressif.com/en/certificates. Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF ID MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property NF rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. CO Copyright © 2018 Espressif Inc. All rights reserved. Contents 1 Overview 2 Pin Definitions 2.1 Pin Layout 2.2 Pin Description 2.3 Strapping Pins 3 Functional Description 3.1 CPU and Internal Memory 3.2 External Flash and SRAM 3.3 Crystal Oscillators 3.4 RTC and Low-Power Management 4 Peripherals and Sensors 5 Electrical Characteristics 5.1 Absolute Maximum Ratings 5.2 Recommended Operating Conditions 5.3 DC Characteristics (3.3 V, 25 °C) 5.4 Reflow Profile 11 6 Physical Dimensions 12 7 Recommended PCB Land Pattern 13 8 Learning Resources 14 8.1 Must-Read Documents 8.2 Must-Have Resources 14 14 Revision History 15 List of Tables ESP32-SOLO-1C Specifications Pin Definitions Strapping Pins Absolute Maximum Ratings Recommended Operating Conditions DC Characteristics (3.3 V, 25 °C) CO NF ID EN TI AL 10 List of Figures ESP32-SOLO-1C Pin Layout (Top View) Reflow Profile 11 Physical Dimensions of ESP32-SOLO-1C 12 Recommended PCB Land Pattern 13 CO NF ID EN TI AL 1. Overview 1. Overview ESP32-SOLO-1C is a powerful, generic Wi-Fi+BT+BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. At the core of this module is the ESP32-D0WD chip. ESP32-D0WD is a member of the ESP32 family of chips, which features a single core and contains all the peripherals of its dual-core counterparts. Available in a 5x5 mm QFN, ESP32-S0WD offers great value for money, with its sustained performance when powering complex IoT TI AL applications. Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast EN low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. ESP32 supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. Several peripherals facilitate integration with other electronic devices. As such the chip does offer industry-leading specifications and ultra-high performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as ID well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that developers can upgrade their products even after their release at minimum cost and effort. Table 1 provides the specifications of ESP32-SOLO-1C. NF Table 1: ESP32-SOLO-1C Specifications Categories Protocols Bluetooth 802.11 b/g/n (802.11n up to 150 Mbps) A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support 2.4 GHz ~ 2.5 GHz Protocols Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with –97 dBm sensitivity Radio Audio Hardware Specifications Frequency range CO Wi-Fi Items Module interface AFH CVSD and SBC SD card, UART, SPI, SDIO, I2 C, LED PWM, Motor PWM, I2 S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC Espressif Systems On-chip sensor Hall sensor On-board clock 40 MHz crystal Operating voltage/Power supply 2.7 V ~ 3.6 V Operating current Average: 80 mA ESP32-SOLO-1C Datasheet V0.1 1. Overview Categories Items Specifications Minimum current delivered by power supply Recommended operating temperature range –40 °C ~ +85 °C (18.00±0.10) x (25.50±0.10) x (3.10±0.10) CO NF ID EN TI AL Package size (mm) 500 mA Espressif Systems ESP32-SOLO-1C Datasheet V0.1 2. Pin Definitions 2. Pin Definitions 2.1 Pin Layout GND 3V3 EN SENSOR_VP SENSOR_VN IO34 TI AL Keepout Zone 20 19 18 17 16 15 ID IO12 24 14 IO2 IO14 23 13 IO15 IO27 22 12 SD1 IO26 21 11 SD0 IO25 CLK 10 CMD IO33 SD3 IO32 SD2 IO13 IO35 GND 38 IO23 37 IO22 36 TXD0 35 RXD0 34 IO21 33 NC 32 IO19 31 EN 39 GND GND IO18 30 IO5 29 IO17 28 IO16 27 IO4 26 IO0 25 NF Figure 1: ESP32-SOLO-1C Pin Layout (Top View) 2.2 Pin Description ESP32-SOLO-1C has 38 pins. See pin definitions in Table 2. CO Table 2: Pin Definitions Name No. Type Function GND Ground 3V3 Power supply EN Module-enable signal. Active high. SENSOR_VP GPIO36, ADC1_CH0, RTC_GPIO0 SENSOR_VN GPIO39, ADC1_CH3, RTC_GPIO3 IO34 GPIO34, ADC1_CH6, RTC_GPIO4 IO35 GPIO35, ADC1_CH7, RTC_GPIO5 IO32 I/O IO33 I/O Espressif Systems GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 ESP32-SOLO-1C Datasheet V0.1 2. Pin Definitions Name No. Type Function IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 13 I/O IO12 14 I/O GND 15 IO13 16 I/O SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS IO15 23 I/O IO2 24 I/O IO0 25 I/O IO4 26 I/O IO16 27 I/O IO17 28 I/O IO5 29 I/O SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 TI AL Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER EN GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, ID SD_DATA1, EMAC_TX_ER GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK NF IO18 GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, 30 I/O GPIO18, VSPICLK, HS1_DATA7 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 32 33 I/O GPIO21, VSPIHD, EMAC_TX_EN 34 I/O GPIO3, U0RXD, CLK_OUT2 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 Ground IO19 NC IO21 RXD0 CO TXD0 Notice: * Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the integrated SPI flash integrated on the module and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: Espressif Systems ESP32-SOLO-1C Datasheet V0.1 2. Pin Definitions • MTDI • GPIO0 • GPIO2 • MTDO • GPIO5 Software can read the values of these five bits from register ”GPIO_STRAPPING”. During the chip’s system reset (power-on-reset, RTC watchdog reset and brownout reset), the latches of the TI AL strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host EN MCU’s GPIOs to control the voltage level of these pins when powering on ESP32. After reset, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration by strapping pins. Table 3: Strapping Pins Pin Default MTDI Pull-down ID Voltage of Internal LDO (VDD_SDIO) 3.3 V 1.8 V Booting Mode Default GPIO0 Pull-up GPIO2 Pull-down SPI Boot NF Pin Download Boot Don’t-care Enabling/Disabling Debugging Log Print over U0TXD During Booting Default U0TXD Active U0TXD Silent MTDO Pull-up CO Pin Pin Default MTDO GPIO5 Falling-edge Input Timing of SDIO Slave Falling-edge Input Rising-edge Input Rising-edge Input Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output Pull-up Pull-up Note: • Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO Slave” after booting. • The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when the module is powered up. Espressif Systems ESP32-SOLO-1C Datasheet V0.1 3. Functional Description 3. Functional Description This chapter describes the modules and functions integrated in ESP32-SOLO-1C. 3.1 CPU and Internal Memory ESP32-S0WD contains one low-power Xtensa® 32-bit LX6 microprocessor. The internal memory • 448 KB of ROM for booting and core functions. • 520 KB of on-chip SRAM for data and instructions. TI AL includes: • 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. • 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. • 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 3.2 External Flash and SRAM EN 768 bits are reserved for customer applications, including flash-encryption and chip-ID. ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in ID the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers’ programs and data in flash. NF ESP32 can access the external QSPI flash and SRAM through high-speed caches. • The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. – When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be CO reduced due to speculative reads by the CPU. – When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. • External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported. ESP32-SOLO-1C integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. The integrated SPI flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as regular GPIOs. 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Espressif Systems ESP32-SOLO-1C Datasheet V0.1 3. Functional Description 3.4 RTC and Low-Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and CO NF ID EN TI AL Low-Power Management” in ESP32 Datasheet. Espressif Systems ESP32-SOLO-1C Datasheet V0.1 4. Peripherals and Sensors 4. Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to CO NF ID EN TI AL the module’s integrated SPI flash. For details, please see Section 6 Schematics. Espressif Systems ESP32-SOLO-1C Datasheet V0.1 5. Electrical Characteristics 5. Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device. Table 4: Absolute Maximum Ratings Parameter Min VDD33 Power supply voltage –0.3 3.6 Tstore Storage temperature –40 150 °C Cumulative IO output current 1,100 mA IO Max Unit TI AL Symbol 1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. EN 2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. 5.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Parameter Min Typical Max Unit VDD33 Power supply voltage 2.7 3.3 3.6 IV DD Current delivered by external power supply 0.5 Operating temperature –40 85 °C NF ID Symbol 5.3 DC Characteristics (3.3 V, 25 °C) Table 6: DC Characteristics (3.3 V, 25 °C) Symbol CO CIN Parameter VIH Min Pin capacitance High-level input voltage 0.75×VDD Typ Max Unit pF VDD +0.3 VIL Low-level input voltage –0.3 0.25×VDD IIH High-level input current 50 nA IIL Low-level input current 50 nA VOH VOL High-level output voltage (VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) IOL RP U Espressif Systems 0.8×VDD Low-level output voltage High-level source current IOH 0.1×VDD VDD3P3_CPU power domain 1, 2 40 mA VDD3P3_RTC power domain 1, 2 40 mA 20 mA 28 mA 45 kΩ VDD_SDIO power domain Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3) Pull-up resistor 1, 3 ESP32-SOLO-1C Datasheet V0.1 5. Electrical Characteristics Symbol RP D VIL_nRST Parameter Min Typ Max Unit Pull-down resistor 45 kΩ Low-level input voltage of CHIP_PU to reset the chip 0.6 Notes: 1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. Espressif Systems 10 ESP32-SOLO-1C Datasheet V0.1 5. Electrical Characteristics Temperature (℃) 5.4 Reflow Profile Peak Temp. 235 ~ 250℃ 250 Preheating zone 150 ~ 200℃ 60 ~ 120s Cooling zone TI AL 217 200 Reflow zone !217℃ 60 ~ 90s -1 ~ -5℃/s Soldering time > 30s Ramp-up zone 1 ~ 3℃/s 100 EN 50 25 50 100 150 200 Time (sec.) 250 ID Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s Reflow zone — Temp.: >217℃ 7LPH 60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s Solder — Sn&Ag&Cu Lead-free solder (SAC305) CO NF Figure 2: Reflow Profile Espressif Systems 11 ESP32-SOLO-1C Datasheet V0.1 6. Physical Dimensions Physical Dimensions CO Espressif Systems 6. ESP32-SOLO-1C DIMENSIONS Unit: mm NF Module Width 18.00±0.10 6.20±0.10 Antenna Area 0.45±0.10 12 25.50±0.10 17.60±0.10 Module Length 1.27±0.10 1.50±0.10 0.80±0.10 0.85±0.10 PCB Thickness 0.90±0.10 2.20±0.10 25.50±0.10 2.20±0.10 16.51±0.10 6.40±0.10 9.20±0.10 1.27±0.10 15.80±0.10 1.50±0.10 1.27±0.10 11.43±0.10 Top View 3.28±0.10 Side View 3.28±0.10 11.43±0.10 TI Bottom View AL ESP32-SOLO-1C Datasheet V0.1 EN ∅0.50±0.10 Module Thickness ID 0.90±0.10 18.00±0.10 3.10±0.10 Figure 3: Physical Dimensions of ESP32-SOLO-1C 7. Recommended PCB Land Pattern 7. Recommended PCB Land Pattern Unit:mm 38 15 24 1.27x9=11.43 2.785 ID 2.785 6.51 EN 1.27x13=16.51 25.5 TI AL 0.9 6.3 7.49 18 17 CO NF Figure4: Recommended PCB Land Pattern Espressif Systems 13 ESP32-SOLO-1C Datasheet V0.1 8. Learning Resources 8. Learning Resources 8.1 Must-Read Documents The following link provides documents related to ESP32. • ESP32 Datasheet This document provides an introduction to the specifications of the ESP32 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP-IDF Programming Guide It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference. • ESP32 Technical Reference Manual The manual provides detailed information on how to use the ESP32 memory and peripherals. • ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. • ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development boards. • ESP32 AT Instruction Set and Examples This document introduces the ESP32 AT commands, explains how to use them, and provides examples of AL several common AT commands. • Espressif Products Ordering Information Must-Have Resources CO FI N DE NT 8.2 Here are the ESP32-related must-have resources. • ESP32 BBS This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. • ESP32 GitHub ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is established to help developers get started with ESP32 and foster innovation and the growth of general knowledge about the hardware and software surrounding ESP32 devices. • ESP32 Tools This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32 Certification and Test”. • ESP-IDF This webpage links users to the official IoT development framework for ESP32. • ESP32 Resources This webpage provides the links to all available ESP32 documents, SDK and tools. ����������� Espressif Systems 14 ESP32-SOLO-1C Datasheet V0.1 Revision History Revision History Date Version Release notes 2018.10 V0.1 Preliminary release. CO NF ID EN TI AL FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. FCC Label Instructions: The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID: 2AC7Z-ESP32SOLO1C”,or “Contains FCC ID: 2AC7ZESP32SOLO1C”, Any similar wording that expresses the same meaning may be used. Espressif Systems 15 ESP32-SOLO-1C Datasheet V0.1
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Create Date : 2018:10:11 09:03:39Z Creator : LaTeX with hyperref package Modify Date : 2018:12:07 17:49:50-08:00 Has XFA : No XMP Toolkit : Adobe XMP Core 5.2-c001 63.139439, 2010/09/27-13:37:26 Creator Tool : LaTeX with hyperref package Metadata Date : 2018:12:07 17:49:50-08:00 Producer : XeTeX 0.99996 Format : application/pdf Document ID : uuid:24a4a373-eafb-4228-95a9-ececf97a4c39 Instance ID : uuid:1cf30d36-a076-458d-9b0f-8d7d4eeda8f2 Page Mode : UseOutlines Page Count : 20EXIF Metadata provided by EXIF.tools