Ehong Technology ES101 BLE Module User Manual Datasheet

ShangHai Ehong Technology Co.,Ltd. BLE Module Datasheet

User Manual

Ehong ® Professional Bluetooth Solutions Provider page 1 of 14 Ehong Technology Co.,Ltd •Bluetooth® Radio- - Fully embedded Bluetooth® V4.2 single mode ARM® Cortex-M0 @ 32-bit •Support Profiles- BLE (Master and slave) - The generic attribute profile (GATT) •User Interface- Send AT command over UART - Firmware upgrade over the air (OTA) - Transmit data: 1Mbps transmission speed - I2C ,SPI interface ( Master )- Watchdog and RTC - 2 PWM modules •General I/O- 14 general purpose I/Os - 2 analog I/Os (10bit ADC) • Power dissipation- Standby power consumption of less than 1uA in hibernation mode (wakeable) •FCC/RED/IC/RoHs and Bluetooth® qualified•Single voltage supply: 1.8-- 3.6V typical•Small form factor: 7.0 x 7.0x 1.0mm•Operating temperature range: -40 °C to 105 °C Sept 17, 2018 EH-ES101 Low Energy SIP Module Data Sheet EH-2018090-DS Rev1.1
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 2 of 14 VERSION HISTORY Version Comment V1.1 Change the Pin GPIO to DIO in the schematic diagram Confidential and Proprietary – Ehong Technology Co.,Ltd NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: DCC@ehlink.com.cn Restricted Distribution: Not to be distributed to anyone who is not an employee of either Ehong Technology Co.,Ltd or its affiliated companies without the express approval of Ehong Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Ehong Technology Co.,Ltd. This Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Ehong Technologies. All other trademarks listed herein are owned by their respective owners. © 2016 Ehong Technology Co.,Ltd. All rights reserved.
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 3 of 14 1. Contents1. Description ......................................................................................................................................................... 42. Applications ....................................................................................................................................................... 43. EH-ES101 Product numbering ...................................................................................................................... 44. Pinout and Terminal Description .................................................................................................................. 54.1. Pin Configuration ......................................................................................................................................... 5 5. Physical Interfaces ........................................................................................................................................... 75.1. GPIO .............................................................................................................................................................. 7 5.2. ADC ............................................................................................................................................................... 7 5.3. PWM .............................................................................................................................................................. 8 5.4. UART ............................................................................................................................................................. 8 5.5. I2C Master .................................................................................................................................................... 8 5.6. SPI Master .................................................................................................................................................... 8 6. Electrical Characteristics ............................................................................................................................... 86.1. Recommended Operation Conditions ...................................................................................................... 8 6.2. Absolute Maximum Rating ......................................................................................................................... 9 6.3. Input/Output Terminal Characteristics ...................................................................................................... 9 6.4. Power Consumption .................................................................................................................................... 9 7. Reference Design ........................................................................................................................................... 108. Layout and Soldering Considerations ...................................................................................................... 118.1. EH-ES101 external view ........................................................................................................................... 11 8.2. PCB package outline drawing .................................................................................................................. 11 9. Tape and reel information ............................................................................................................................ 129.1. Tapa orientation ......................................................................................................................................... 12 9.2. Tape dimensions ....................................................................................................................................... 12 9.3. Reel information ......................................................................................................................................... 13 10. The tray information ...................................................................................................................................... 1311. Soldering Recommendations ...................................................................................................................... 1412. Contact Information ....................................................................................................................................... 14
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 4 of 14 1. DescriptionEH-ES101 series is a powerful, highly flexible, ultra-low power Bluetooth smart SIP module base on BlueNRG-1 SoC from ST. Embedded 2.4GHz transceiver; the EH-ES101module provides a complete RF solution allowing faster time-to-market with reduced development costs. The module offers all Bluetooth® low energy features: radio, stack, profiles and application space for customer application, so no external control processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module. The module is small in size and support the module of selecting the external antenna to facilitate the flexible development of the product.The module can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only less 1uA and will wake up in few hundred microseconds. After buying Bluetooth® module, we provide free technical support APP of iOS system or APP Android system. 2. ApplicationsSports and fitnessHealthcareHome entertainmentOffice and mobile accessoriesAutomotiveCommercialWatchesHuman interface devices3. EH-ES101 Product numberingEH-ES101 A. EH ------------- Company Name(Ehong) B. ES101 ------------ Module Name
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 5 of 14 4. Pinout and Terminal Description4.1. Pin Configuration Figure 1： Pinout of EH-ES101 Symbol Pin PAD Type Description DIO0 1 General purpose digit I/O See IO function map DIO1 2 General purpose digit I/O See IO function map DIO2 3 General purpose digit I/O See IO function map DIO3 4 General purpose digit I/O See IO function map DIO5 5 General purpose digit I/O See IO function map DIO6 6 General purpose digit I/O See IO function map DIO9 7 General purpose digit I/O See IO function map, also work as SWDCLK DIO10 8 General purpose digit I/O See IO function map, also work as SWDIO VDD1V2 9 1.2V digit core output Connect a capacitor DIO11 10 General purpose digit I/O See IO function map DIO12 11 General purpose digit I/O See IO function map SMPT2 12 SMPS output to external filter / VCC input Connect to VCC or an inductor SMPT1 13 SMPS output to external filter GND 14 Powered ground
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 6 of 14 RF 16 Use an internal antenna or connect to an external antenna. GND 17 Powered ground GND 18 Powered ground ADC2 19 ADC input 2 ANATEST1 20 Antenna test pin1 Used for indicate RF’s TX/RX event, also can user for extern antenna switch DIO8 21 General purpose digit I/O See IO function map DIO14/TEST0 22 General purpose digit I/O / Analog output See IO function map DIO7/BOOT 23 General purpose digit BOOT pin See IO function map, used for BOOT pin(vcc) for jump to bootloader when power on ADC1 24 ADC input 1 DIO4 25 General purpose digit I/O See IO function map RESET 26 System reset pin Active low level GND 27 Powered ground VBAT1 28 Powered VCC 1.8-3.6V Table 1：PIN Terminal Description Pin namea GPIO mode”000” Mode serial1”001” Mode serial0”100” Mode serial2”101” Type Signal Type Signal Type Signal Type Signal IO0 I/O GPIO 0 I UART_CTS I/O SPI_CLK - - IO1 I/O GPIO 1 O UART_RTS I/O SPI_CS1 I PDM_DATA IO2 I/O GPIO 2 O PWM0 O SPI_OUT O PDM_CLK IO3 I/O GPIO 3 O PWM1 I SPI_IN O - IO4 I/O GPIO 4 I UART_RXD I/O I2C2_CLK O PWM0 IO5 I/O GPIO 5 O UART_TXD I/O I2C2_DAT O PWM1 IO6 I/O GPIO 6 O UART_RTS I/O I2C2_CLK I PDM_DATA IO7 - - I UART_CTS I/O I2C2_DAT O PDM_CLK IO8 I/O GPIO 8 O UART_TXD I/O SPI_CLK I PDM_DATA IO9 I/O GPIO 9 I SWCLK I SPI_IN - - IO10 I/O GPIO 10 I SWDIO O SPI_OUT - - IO11 I/O GPIO 11 I UART_RXD I/O SPI_CS1 - - IO12 OD GPIO 12bI - I/O I2C2_DAT - - IO14 I/O GPIO 14 I/O I2C1_CLK I/O SPI_CLK O - Table 2：IO function MAP
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 7 of 14 5. Physical Interfaces5.1. GPIO 14 IOs are provided. Every IO can program for other function.All theGP IOs are in high impedance under reset. All the IOs are in high impedancein low power modes (sleep and standby). If pre-programmed as wake up sources,pins IO9, IO10 and IO11 are in input pull up.All the GIOs can programed for an interrupt source. Edge detection or leveldetection, and falling/rising or both.GIO0~GIO8 and GIO14 can program input pull down.GIO9~GIO11 can program input pull up.GIO12 can only be General Purpose Input pins (not output).When power for 3.3V, internal Pull resister is: Name Description Name Min Type Max Unit RPD Pull-down Value 53 84 144 KΩ RPU Pull-up Value 57 81 122 Table 3：Internal Pull for 3.3V When power for 1.8V, internal Pull resister is: Name Description Name Min Type Max Unit Digital input and output when 1.8V supply RPD Pull-down Value 117 202 363 KΩ RPU Pull-up Value 135 211 334 Table 4：Internal Pull for 1.8V Note: A. GIO7 can work as BOOT pin. when power on, if GIO7 is high level, CPU will jump to bootloader mode, and this time can update the firmware by UART. B. GIO9 and DIO10 can work as SWDCLK and SWDIO. If need debug or download also can use Jlink OB or ST-LINK. The IOs programmed to be wake up sources need an external drive according to the selected level sensitivity. If the wake up level is high level, a pull down drive should be used. If the wake up level is low level, a pull up drive should be used. If no external drive is applied, IO9, IO10 and IO11 are only sensitive to low level as they have an internal pull up (activated by default). IO12 do not have an internal pull and therefore require an external drive. 5.2. ADC 2 ADCs are provided. Main features are: . e pins ADC1 and ADC2.Internal temperature and battery level conversion.
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 8 of 14 5.3. PWM 2 PWMs can be driven by internal PWM module. 5.4. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the TTL protocol. When using low-power mode, TXD needs to pull up resistance, and the reference value is 4.7k. Main features are: Programmable baud rate can reach up to 921600bps. me of 5, 6, 7 or 8 bits of data. -parity bit generation and detection. 5.5. I2C Master The module can act as an I2C master when configured by software. Main features are: e and up to 100 Kb/s in standard mode. multi-master system with bus arbitration. 5.6. SPI Master The module can act as an SPI master (mode 0) when configured by software. Main features are: 6. Electrical Characteristics6.1. Recommended Operation Conditions Operating Condition Min Typical Max Unit Operating Temperature Range -30 -- +80 °C Battery (VDD_BAT) operation 1.8 3.3+3.6 V 2402-2 2480ADC Input range 0 - +1.2 V Frequency Range MHz
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 9 of 14 Table 5: Recommended Operation Conditions Table 6: Absolute Maximum Rating *In the absence of damage, the maximum 10% of product life is allowed for short term operation, butthe output regulation and other specifications will not be guaranteed in excess of 4.2V.* 6.2. Absolute Maximum Rating *Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but outputregulation and other specifications are not guaranteed in excess of 4.2V. 6.3. Input/Output Terminal Characteristics Input Voltage Levels Min Typical Max Unit VIL input logic level low -0.4 - 0.4 V VIH input logic level high 0.7 x VDD - VDD + 0.4 V Tr/Tf - - 25 ns Output Voltage Levels Min Typical Max Unit VOL output logic level low, lOL = 4.0mA - - 0.4 V VOH output logic level high, lOH = -4.0mA 0.75 x VDD - -- V Tr/Tf - - 5 ns Table 7: Digital I/O Characteristics Condition Class Max Rating Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 2 2000V (all pins) Machine Model Contact Discharge per JEDEC EIA/JESD22-A115 200V 200V (all pins) Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 III 500V (all pins) Table 8: ESD Protection 6.4. Power Consumption Current consumption is measured using a battery. (1)When the DC-DC converter is activated, the power consumption is as follows: Rating Min Max Unit Storage Temperature -40 +85 °C Battery (VBAT) operation* 1.8 3.6 V I/O supply voltage -0.4 +3.6 V Other Terminal Voltages except RF Vss-0.4 VBAT+0.4 V
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 10 of 14 Table 9: Current Consumption (2)The power consumption is as follows when the DC-DC converter is not used: 7. Reference DesignPattern describe Total typical current at 3.3V (average) Standby All functions are shut down. GPIO preprogramming is required to wake up. <700nA Sleep 32kHz on and 24KB RAM retain <2.1uA Model at full speed Open all functions 2.5mA-3.6mA RF TX active VDD=3.3V ~8.3mA peak RF RX active VDD=3.3V ~7.7mA peak pattern Discribe Total typical current at 3.3V (average) Standby All functions are shut down. GPIO preprogramming is required to wake up. <700nA Sleep 32kHz on and 24KB RAM retain <2.1uA Model at full speed Open all functions 2.5mA-3.6mA RF TX active VDD=3.3V ~15.3mA peak RF RX active VDD=3.3V ~14.5mA peak
EH-ES101 Figure 4:EH-ES101 package information (TOP VIEW) E hong ® Professional Bluetooth Solutions Provider page 11 of 14 Figure 2： Reference Design important Note: A. DC-DC transverter select; (1) When the DC-DC converter is not used, a 0 - o resistor is welded to the welding plate 1-3, otherwise it cannot work; (2) When the dc-dc converter is activated, a 10uH inductance is welded to the welding disc 1-2.This method can reduce peak power consumption, and the peak current can be reduced by about 45%. B. Pin23 BOOT pin can’t connect to VCC, or else will always goto boot mode; C. Pin9 VDD1V2 need connect a test pad. 8. Layout and Soldering Considerations8.1. EH-ES101 external view Figure 3： EH-ES101 External view 8.2. PCB package outline drawing
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 12 of 14 9. Tape and reel information EH-ES101 modules are supplied on the tape and reels. For tape and reel packing and labeling, see IC packing and labeling specification. 9.1. Tapa orientation Figure 5 shows the EH-ES101 module LGA packing tape orientation. User Direction of Feed Figure 5: EH-ES101 module tape orientation 9.2. Tape dimensions Figure 6 shows and Table10 lists the dimensions of the tape for the EH-ES101 module. Figure 6 ：EH-ES101 tape dimensions ITEM W A0 B0 K0 P F E D0 P0 P2 T DIM(mm) 16.0 7.3 7.3 1.5 12 7.5 1.75 1.5 4 2.0 0.3 Table 10: EH-ES101 module tape dimensions
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 13 of 14 9.3. Reel information Figure 7 ：EH-ES101 reel dimensions Item A B D E F G H I Unit:mm 330 16.4 100 2.0 21.5 13.2 2.6 10.75 Table 11: EH-ES101 module reel dimensions 10. The tray informationFigure 8 is the size of EH-ES101 pallet, and the number of chips in the tray is 26*10=260PCS.
EH-ES101 Ehong ® Professional Bluetooth Solutions Provider page 14 of 14 Figure 8: EH-ES101 pallet size. 11. Soldering Recommendations EH-ES101 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. SMT stencil making requirements If Bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≥ 0.25mm,so youchoose SMT stencil thickness 0.15mm.If Bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≤ 0.25mm,so youchoose SMT Ladder stencil Bluetooth module thickness 0.15mm other component thickness 0.13mm. Solder pad open via ratio Length 1:1.2, width 1:1.12. Contact InformationSales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Website: http://www.ehonglink.com Tel: 021-61263536Fax: 021-61263536Address: Suite501,No.3 building,No.439 Jinglian road,Minhang district,Shanghai,China FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body. FCC Label Instructions:The outside of final products that contains this module device must display a label referring to the enclosed module. This exterior label can use wording such as: “Contains Transmitter Module FCC ID: 2ACCRES101”,or “Contains FCC ID: 2ACCRES101”, Any similar wording that expresses the same meaning may be used

Navigation menu