Ehong Technology MC10 Bluetooth Module User Manual Datasheet

ShangHai Ehong Technology Co.,Ltd. Bluetooth Module Datasheet

User Manual

Shanghai Ehong Technologies Inc EH-MC10 Bluetooth® technology low energy module • Bluetooth® radio - Fully embedded Bluetooth® v4.0 single mode - TX power +6 dbm,-92.5dbm RX sensitivity - 128-bit encryption security - Range up to 100m - Integrated chip antenna or U.FL port - Multipoint capability(2devices at master) • Support profiles - BLE (Master and slave) - The generic attribute profile (GATT) - Health care, Sports and fitness, Proximity sensing profiles - Alerts and timer profiles • User interface - Send AT command over UART - Firmware upgrade over the air (OTA) - Transmit data: 300kbps transmission speed (UART) - I2C interface(Master ) - SPI - PWM(4 channel) • General I/O - 10 general purpose I/Os - 3 analogue I/O (10bit ADC) • FCC and Bluetooth® qualified • Single voltage supply: 3.3V typical • Small form factor: 17.70 x 11.95x 2.2mm • Operating temperature range: -30 °C to 80 °C Version 2.0 July 21 2014
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 1. Contents 1. Description .................................................................................................................................................. 3 2. Applications ................................................................................................................................................ 4 3. EH-MC10 Product numbering .................................................................................................................. 4 4. Electrical Characteristics ......................................................................................................................... 4 4.1. Recommended Operation Conditions ................................................................................................. 4 4.2. Absolute Maximum Rating ................................................................................................................... 5 4.3. Input/Output Terminal Characteristics ................................................................................................ 5 4.4. Power Consumption ............................................................................................................................. 6 5. Pinout and Terminal Description ............................................................................................................. 7 5.1. Pin Configuration .................................................................................................................................. 7 6. Physical Interfaces .................................................................................................................................... 9 6.1. Power Supply ........................................................................................................................................ 9 6.2. PIO......................................................................................................................................................... 9 6.3. AIO......................................................................................................................................................... 9 6.4. PWM ...................................................................................................................................................... 9 6.5. UART ................................................................................................................................................... 10 6.6. I2C Master........................................................................................................................................... 10 6.7. SPI Master .......................................................................................................................................... 10 6.8. SPI Debug ........................................................................................................................................... 11 7. Reference Design ..................................................................................................................................... 11 8. Layout and Soldering Considerations ................................................................................................. 11 8.1. Soldering Recommendations ............................................................................................................ 11 8.2. Layout Guidelines ............................................................................................................................... 12 9. Mechanical and PCB Footprint Characteristics ................................................................................. 13 10. Reflow Profile ........................................................................................................................................ 14 11. Contact Information ............................................................................................................................. 15
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 2. Table of Tables TABLE 1: RECOMMENDED OPERATION CONDITIONS ............................................................................................... 4 TABLE 2：ABSOLUTE MAXIMUM RATING ................................................................................................................ 5 TABLE 3: DIGITAL I/O CHARACTERISTICS ............................................................................................................... 5 TABLE 4: AIO CHARACTERISTICS ........................................................................................................................... 5 TABLE 5 ESD PROTECTION ................................................................................................................................... 6 TABLE 6: CURRENT CONSUMPTION ........................................................................................................................ 6 TABLE 7：PIN TERMINAL DESCRIPTION ................................................................................................................. 8 TABLE 8: POSSIBLE UART SETTINGS .................................................................................................................. 10 3. Table of Figures FIGURE 1： PINOUT OF EH-MC10 ........................................................................................................................ 7 - FIGURE 2： POWER SUPPLY PCB DESIGN .................................................................................................... 9 FIGURE 3： CONNECTION TO HOST DEVICE ........................................................................................................ 10 FIGURE 4： REFERENCE DESIGN......................................................................................................................... 11 FIGURE 5: CLEARANCE AREA OF ANTENNA ........................................................................................................... 12 FIGURE 6 ：PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT: MM, DEVIATION:0.02MM) ............... 13 FIGURE 7: RECOMMENDED REFLOW PROFILE ..................................................................................................... 14 1. Description EH-MC10 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories.
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd The module offers all Bluetooth® low energy features: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module. The module can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only 600nA and will wake up in few hundred microseconds. After buying Bluetooth® module, we provide free technical support APP of iOS system or APP Android system. 2. Applications  Sports and fitness  Healthcare  Home entertainment  Office and mobile accessories  Automotive  Commercial  Watches  Human interface devices 3. EH-MC10 Product numbering EH-MC10X A. EH ------------- Company Name(EHong) B. MC10 ------------ Module Name C. X ------------ A = Antenna B =U.FL 4. Electrical Characteristics 4.1. Recommended Operation Conditions Table 1: Recommended Operation Conditions Operating Condition Min Typical Max Unit Operating Temperature Range -30 -- +80 °C
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd Battery (VDD_BAT) operation 1.8 -- +3.6 V I/O Supply Voltage (VDD_PIO) 1.2 -- +3.6 V AIO input 0 - +1.3 V Frequency range 2402 2480 MHz Table 2：Absolute Maximum Rating 4.2. Absolute Maximum Rating * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.3. Input/Output Terminal Characteristics Table 3: Digital I/O Characteristics Input Voltage Levels Min Typical Max Unit VIL input logic level low -0.4 - 0.4 V VIH input logic level high 0.7 x VDD - VDD + 0.4 V Tr/Tf - - 25 ns Output Voltage Levels Min Typical Max Unit VOL output logic level low, lOL = 4.0mA - - 0.4 V VOH output logic level high, lOH = -4.0mA 0.75 x VDD - -- V Tr/Tf - - 5 ns Input and Tri-state Current Min Typical Max Unit With strong pull-up -150 -40 -10 μA With strong pull-down 10 40 150 μA With weak pull-up -5.0 -1.0 -0.33 μA With weak pull-down 0.33 +1.0 5.0 μA CI Input Capacitance 1.0 - 5.0 pF Table 4: AIO Characteristics Rating Min Max Unit Storage Temperature -40 +85 °C Battery (VBAT) operation* 1.8 3.6 V I/O supply voltage -0.4 +3.6 V Other Terminal Voltages except RF Vss-0.4 VBAT+0.4 V
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd Input Voltage Levels Min Typical Max Unit AIO 0 - 1.3 V Table 5 ESD Protection Condition Class Max Rating Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 2 2000V (all pins) Machine Model Contact Discharge per JEDEC EIA/JESD22-A115 200V 200V (all pins) Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 III 500V (all pins) 4.4. Power Consumption The current consumption are measured at the VBAT Table 6: Current Consumption Mode Description Total typical current at 3.3V (average) Dormant All functions are shutdown. To wake up toggle the WAKE pin <600nA Hibernate All functions are shutdown except for the sleep clock. The module can wake up on a timer on the sleep clock. <1.5uA Deep sleep VDD=3.3V 1ms wake up time <5uA Idea VDD=3.3V <1us wake up time 1mA RF RX /TX active (0dBm) VDD=3.3V VDD_PIO=3.3V ~16mA @3V peak
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 5. Pinout and Terminal Description 5.1. Pin Configuration Figure 1： Pinout of EH-MC10 Symbol Pin PAD Type Description GND 1 Ground Ground AIO2 2 Bidirectional analogue 10bit Analogue programmable I/O line AIO1 3 Bidirectional analogue 10bit Analogue programmable I/O line AIO0 4 Bidirectional analogue 10bit Analogue programmable I/O line UART_TX 5 CMOS output, tristate, with weak internal pull-up UART data output UART_RX 6 CMOS input with weak internal pull-down UART data input PIO3 7 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PWM or LED Controls PIO4 8 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PWM or LED Controls PIO5/SPI_CLK 9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug SPI_CLK select by SPI_PIO_SEL GND 10 Ground Ground
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd I2C_SDA 11 Bi-directional tristate with weak internal pull-up I2C data input/output or SPI serial flash data output(SF_OUT) I2C_SCL 12 Input with weak internal pull-up I2C clock or SPI serial flash clock output (SF_CLK) PIO2 13 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO6/SPI_CSB 14 Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug chip select, selected by SPI_PIO_SEL PIO7/SPI_MOSI 15 Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug SPI_MOSI, selected by SPI_PIO_SEL VCC_PIO 16 Powered PIO power supply PIO8/SPI_MISO 17 Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug SPI_MISO, selected by SPI_PIO_SEL PIO9 18 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PWM or LED Controls GND 19 Ground Ground PIO10 20 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PWM or LED Controls PIO11 21 Bi-directional with programmable strength internal pull-up/down Programmable input/output line SPI_PIO_S 22 Input with strong internal pull-down Selects SPI debug on (8:5) NP 23 NP NP VBAT 24 Power supply Button cell battery or DC 1.8V to 3.6V GND 25 Ground Ground NP 26 NP NP WAKE_UP 27 Input has no internal pull-up or pull-down use external pull-down Set high to wake the module from hibernate. Use an external pull-down for this pin. GND 28 Ground Ground Table 7：PIN Terminal Description
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 6. Physical Interfaces 6.1. Power Supply - The module power supply 3v coin cell batteries or DC 3.3v - Power supply pin connection capacitor to chip and pin as far as possible close - Capacitor decouples power to the chip - Capacitor prevents noise coupling back to power plane. - Figure 2： Power Supply PCB Design 6.2. PIO 10 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered from VDD_PIO. PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. Note: At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. 6.3. AIO 3 AIOs are provided. They can be connected to internal 10 bits ADC. Their functions depend on software. They can be used to read or output a voltage between 0V to 1.3V. Each of them can be used as a digital output with special firmware. 6.4. PWM 4 PIOs (PIO3, PIO4, PIO9, and PIO10) can be driven by internal PWM module. The PWM module also works while the module is sleep. So it can be used as a LED flasher. These functions are controlled by special firmware.
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 6.5. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Table 8: Possible UART Settings Figure 3： Connection To Host device 6.6. I2C Master The module can act as an I2C master when configured by software. Any two PIOs can be configured as I2C_SCL and I2C_SDA. 6.7. SPI Master The module can act as an SPI master (mode 0) when configured by software. Any four PIOs can be configured as SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock rate of the software SPI is around 470kHz. Parameter Possible Values Baud Rate Minimum 1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum 2M baud (≤1%Error) Flow Control RTS/CTS or None Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Byte 8
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 6.8. SPI Debug The SPI Debug interface is chosen when SPI_PIO_S is high. The interface is used to program and debug the module. So always place test points or header on PCB for this interface and SPI_PIO_SEL. 7. Reference Design Figure 4： Reference Design 8. Layout and Soldering Considerations 8.1. Soldering Recommendations EH-MC10 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Comply will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide.  Refer to technical documentations of particular solder paste for profile configurations  Avoid using more than one flow.  Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150um stencil thickness is recommended.  Aperture size of the stencil should be 1:1 with the pad size.  A low residue, “no clean” solder paste should be used due to low mounted height of the component. 8.2. Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 3. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna will detune the antenna to lower frequencies. Figure 5: Clearance area of antenna
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 9. Mechanical and PCB Footprint Characteristics Figure 6 ：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm)
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 10. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. 210 217 ℃ 250 A B C D 1 2 0 25 3 4 5 6 min E Figure 7: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 °C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 °C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150° to 210° for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 ° for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 °C. The soldering time should be 30 to 90 second when the temperature is above 217 °C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 °C.
Bluetooth Low Energy Module Shanghai Ehong Technologies Co., Ltd 11. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 61139798 Fax: +86 21 61263536 Street address: Rom501,No 3 building ,#439 jinglianRd ,Minghang district shanghai
FCC Statement: This equipment has been tested and found to comply with the limits for Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment to an outlet on a circuit different from that to which the receiver is connected. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modifications to this product will void the user’s authority to operate this equipment. RF Radiation Exposure Statement: 1.This Transmitter must not be co located or operating in conjunction with any other antenna or ‐transmitter. 2.This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. FCC Information to OEM integrator The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. 1.To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co located or operating in conjunction with any other antenna or transmitter, ‐except in accordance with FCC multi transmitter product procedures.‐ 2. Only those antennas with same type and lesser gain filed under this FCC ID number can be used with this device. 3. The regulatory label on the final system must include the statement: “Contains FCC ID: xxxx or using electronic labeling method as documented in KDB 784748. 4. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two ways authentication between module and the host system‐

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