Ehong Technology MC20 Bluetooth Module User Manual
ShangHai Ehong Technology Co.,Ltd. Bluetooth Module
User Manual
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| Document ID | 3401201 |
| Application ID | OoA3geaDijy2BtmcbLlbYQ== |
| Document Description | User Manual |
| Short Term Confidential | No |
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| Document Type | User Manual |
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| Filesize | 157.76kB (1971946 bits) |
| Date Submitted | 2017-05-24 00:00:00 |
| Date Available | 2017-05-24 00:00:00 |
| Creation Date | 2017-05-19 14:58:35 |
| Producing Software | Adobe Acrobat Pro 9.3.4 |
| Document Lastmod | 2017-05-19 15:01:21 |
| Document Title | User Manual |
| Document Creator | Adobe Acrobat Pro 9.3.4 |
EH-MC20 Bluetooth® technology low energy module • Bluetooth® radio Fully embedded Bluetooth® v4.2 single mode TX power +4 dbm,-92dbm RX sensitivity@1M 128-bit encryption security Range up to 50m Integrated on board PCB antenna Multipoint capability(master and slave at the same time) • Support profiles BLE (Master and slave) The generic attribute profile (GATT) Health care, Sports and fitness, Proximity sensing profiles Alerts and timer profiles • User interface - Send AT command over UART - Firmware upgrade over the air (OTA) - Transmit data: 300kbps transmission speed (UART) - I2C interface(Master ) USB PWM(6 channel) • General I/O 10 general purpose I/Os 7 analogue I/O (14bit ADC) • The price is cheap • Single voltage supply: 3.3V typical • Small form factor: 18.10 x 12.05x 2.2mm • Operating temperature range: -40 °C to 85 °C Version 1.0 Oct 23, 2016 Shanghai Ehong Technologies Inc Bluetooth Low Energy Module 1. Contents 1. Description ................................................................................................................................................................ 4 2. Applications .............................................................................................................................................................. 4 3. EH-MC20 Product numbering ............................................................................................................................. 4 4. Electrical Characteristics ..................................................................................................................................... 5 4.1. Recommended Operation Conditions .......................................................................................................... 5 4.2. Absolute Maximum Rating .............................................................................................................................. 5 4.3. Input/Output Terminal Characteristics .......................................................................................................... 5 4.4. Power Consumption ......................................................................................................................................... 6 5. Pinout and Terminal Description........................................................................................................................ 7 5.1. 6. Pin Configuration ............................................................................................................................................... 7 Physical Interfaces.................................................................................................................................................. 9 6.1. Power Supply ..................................................................................................................................................... 9 6.2. PIO ........................................................................................................................................................................ 9 6.3. AIO ...................................................................................................................................................................... 10 6.4. PWM................................................................................................................................................................... 10 6.5. UART.................................................................................................................................................................. 10 6.6. USB interface ................................................................................................................................................... 11 6.7. I2C Master ........................................................................................................................................................ 11 6.8. SPI Debug......................................................................................................................................................... 11 7. Reference Design .................................................................................................................................................. 12 8. Layout and Soldering Considerations ........................................................................................................... 13 8.1. Soldering Recommendations ....................................................................................................................... 13 8.2. Layout Guidelines............................................................................................................................................ 13 9. 10. Mechanical and PCB Footprint Characteristics.......................................................................................... 14 Packaging ............................................................................................................................................................ 15 Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 11. Reflow Profile ..................................................................................................................................................... 16 12. Contact Information ......................................................................................................................................... 17 2. Table of Tables TABLE 1: RECOMMENDED OPERATION C ONDITIONS ........................................................................................................ 5 TABLE 2：ABSOLUTE MAXIMUM RATING ........................................................................................................................... 5 TABLE 3: DIGITAL I/O CHARACTERISTICS .......................................................................................................................... 5 TABLE 4: AIO CHARACTERISTICS ....................................................................................................................................... 5 TABLE 6: CURRENT CONSUMPTION .................................................................................................................................... 6 TABLE 7：PIN TERMINAL DESCRIPTION ............................................................................................................................ 9 TABLE 8: POSSIBLE UART SETTINGS .............................................................................................................................. 10 3. Table of Figures FIGURE 1： PINOUT OF EH-MC20 .................................................................................................................................... 7 FIGURE 2： POWER SUPPLY PCB DESIGN....................................................................................................................... 9 FIGURE 3： CONNECTION TO HOST DEVICE ................................................................................................................... 10 FIGURE 4： REFERENCE D ESIGN ..................................................................................................................................... 12 FIGURE 5: CLEARANCE AREA OF ANTENNA ...................................................................................................................... 14 FIGURE 6 ：PHYSICAL DIMENSIONS AND R ECOMMENDED FOOTPRINT (UNIT : MM , DEVIATION:0.02MM) ................ 15 FIGURE 7: EH-MC20 PACKAGING（PALLET） .............................................................................................................. 16 FIGURE 8: RECOMMENDED REFLOW PROFILE................................................................................................................ 16 Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 1. Description EH-MC20 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth® low energy features: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect s e n s o r s , s i m p l e u s e r i n t e r f a c e s o r even displays directly to the module. The module internal integration 32bit MCU and 128KB flash, external interface is rich （AIO,PWM,UART,USB）, and the price is cheap. After buying Bluetooth® module, we provide free technical support APP of iOS system or APP Android system. 2. Applications Sports and fitness Healthcare Home entertainment Office and mobile accessories Automotive Commercial Watches Human interface devices 3. EH-MC20 Product numbering EH-MC20 A. EH ------------- B. MC20 ------------ Company Name(EHong) Module Name Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 4. Electrical Characteristics 4.1. Recommended Operation Conditions Table 1: Recommended Operation Conditions Operating Condition Min Typical Max Unit Operating Temperature Range -40 -- +85 °C Battery (VDD_BAT) operation 1.9 -- +3.6 I/O Supply Voltage (VDD_PIO) 1.9 -- +3.6 +1.9 2480 MHz AIO input Frequency range 2402 Table 2：Absolute Maximum Rating 4.2. Absolute Maximum Rating Rating Min Max Unit Storage Temperature -65 +150 °C Battery (VBAT) operation* -0.3 3.9 I/O supply voltage -0.3 +VDD+0 .3 4.3. Input/Output Terminal Characteristics Table 3: Digital I/O Characteristics Input Voltage Levels Min Typical Max Unit VIL input logic level low VSS 0.3VDD VIH input logic level high 0.7 x VDD VDD Output Voltage Levels Min Typical Max Unit VOL output logic level low, lOL = 4.0mA VSS 0.3VDD VDD-0.3 VOH output logic level high, lOH = -4.0mA VDD Table 4: AIO Characteristics Input Voltage Levels AIO Shanghai Ehong Technologies Co., Ltd Min Typical Max Unit 3.3 Bluetooth Low Energy Module 4.4. Power Consumption The current consumption are measured at the VBAT Table 5: Current Consumption Item Sym Min Typ Max Unit condition TX ITx 15 mA RX IRX 12 mA Continuous Tx Transmission 0db output power Continuous Tx reception Isusp 10 50 uA IO wakeup Suspend Current Isusp 12 52 uA Timer wakeup Deep sleep Current Ideep uA Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 5. Pinout and Terminal Description 5.1. Pin Configuration Figure 1： Pinout of EH-MC20 Symbol Pin PAD Type Description GND Ground Ground PWM0/ANA_E(0) Digital I/O Button cell battery or DC 1.8V to 3.6V Button cell battery or DC 1.8V to 3.6V PWM0/GPIO/ANA_E0 PWM1/ANA_E(1) Digital I/O PWM1/GPIO/ANA_E1 PWM0/ANA_A(0) Digital I/O PWM0/GPIO/ANA_A0 VDD_3V3 VDD_3V3 Shanghai Ehong Technologies Co., Ltd Power supply Power supply Bluetooth Low Energy Module NC NC NC NC NC NC NC NC NC GND 10 Ground Ground USB_DP USB_DM 11 12 Digital I/O Digital I/O 13 UART_TX Digital I/O 14 UART_RX UART_RTS UART_CTS Digital I/O 15 16 ANA_A(1) 17 PWM2/SW/AN A_B(0) 18 NC VDD_3V3 GND PWM2_N/ANA _B(1) UART_RTS UART_CTS 19 20 21 Digital I/O Digital I/O Digital I/O ANA_A1 Digital I/O PWM2/single wire slave/GPIO/ANA_B(0) NC Power Supply 24 Ground Digital I/O PWM2 inverting/GPIO/ANA_B1 Digital I/O Digital I/O 25 UART_TX Digital I/O 26 UART_RX DI/PWM5/ANA _B(6) Digital I/O 27 Shanghai Ehong Technologies Co., Ltd NC Button cell battery or DC 1.8V to 3.6V Ground 22 23 USB data positive/GPIO/ANA_E3 USB data Minus/GPIO/ANA_E3 UART_TX/PWM2/GPIO/A NA_C2 Optional 32KHz crystal output UART_TX/PWM3/GPIO/A NA_C3 Optional 32KHz crystal input UART_RTS/PWM3/GPIO/ ANA_C4 UART_RTS/PWM4/GPIO/ ANA_C4 Digital I/O UART_RTS/PWM3/GPIO/ ANA_C4 UART_RTS/PWM4/GPIO/ ANA_C4 UART_TX/PWM2/GPIO/A NA_C2 Optional 32KHz crystal output UART_TX/PWM3/GPIO/A NA_C3 Optional 32KHz crystal input I2C_SDA/PWM5/GPIO/AN A_B6 Bluetooth Low Energy Module 28 CK/PWM5/ANA_B( 7) Digital I/O I2C_CLK/PWM5 inverting/GPIO/ANA_B7 NC NC Ground Ground 29 NC 30 GND Table 6：PIN Terminal Description Note: A. UART_TX > PIN13 and PIN25 are the same PIN and feature. B. UART_RX>PIN14 and PIN26 are the same PIN and feature. C. UART_RTS>PIN15 and PIN23 are the same PIN and feature. D. UART_CTS>PIN16 and PIN24 are the same PIN and feature 6. Physical Interfaces 6.1. Power Supply The module power supply 3v coin cell batteries or DC 3.3v Power supply pin connection capacitor to chip and pin as far as possible close Capacitor decouples power to the chip Capacitor prevents noise coupling back to power plane. Figure 2： Power Supply PCB Design 6.2. PIO 14 PIOs are provided . They are powered from VDD.PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. Note: At reset all PIO lines are inputs with weak pull-downs. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6.3. AIO 14 AIOs are provided. They can be connected to internal 14 bits ADC. Their functions depend on software. 6.4. PWM 6 PIOs can be driven by internal PWM module. The PWM module also works while the module is sleep. So it can be used as a LED flasher. These functions are controlled by special firmware. 6.5. UART This is a standard UART interface for communicating with other serial devices and Support UART hardware flow control.The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Table 7: Possible UART Settings Parameter Baud Rate Possible Values Minimum Maximum Flow Control Parity Number of Stop Bits Bits per Byte 1200 baud (≤2%Error) 9600 baud (≤1%Error) 2M baud (≤1%Error) RTS/CTS None, Odd or Even 1 or 2 Figure 3： Connection To Host device Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6.6. USB interface USB interface compatible with USB 2.0 full speed mode, support 9 endpoints, support ISP (In-system programming) Via USB port. 6.7. I2C Master The module can act as an I2C master when configured by software. The module PIN27 and PIN28 two PIOs can be configured as I2C_SCL and I2C_SDA. 6.8. SPI Debug The module support single wire interface SWM(single wire master) and SWS(single wire slave) represent the master and slave device of the single wire communication system developed by Ehong. The maximum data rate can be up to 2Mbps. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 7. Reference Design Figure 4： Reference Design Note: Please keep pulling up the WAKE pin during sending data to the module. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 8. Layout and Soldering Considerations 8.1. Soldering Recommendations EH-MC20 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Comply will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. Refer to technical documentations of particular solder paste for profile configurations Avoid using more than one flow. Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150um stencil thickness is recommended. Aperture size of the stencil should be 1:1 with the pad size. A low residue, “no clean” solder paste should be used due to low mounted height of the component. 8.2. Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 3. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna will detune the antenna to lower frequencies. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module Figure 5: Clearance area of antenna 9. Mechanical and PCB Footprint Characteristics Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module Figure 6 ：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) 10. Packaging Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module Figure 7: EH-MC20 Packaging（Pallet） packaging for the pallet，one packaging quantity is 100 PCS。 11. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 25 min Figure 8: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. 12. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom1505, Blk 1st ,No.833 South Hong mei Rd ,Ming hang district shanghai Shanghai Ehong Technologies Co., Ltd FCC/IC Statements (OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. The final host device, into which this RF Module isintegrated" hasto be labelled with an auxilliary lable stating the FCC IDofthe RF Module,such as "Contains FCC ID:2ACCRMC20 "This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1)this devicemay not cause harmful interference, and (2)this devicemust accept any interference received, including interference thatmay cause undesired operation." "Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment." the Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. The final host device, into which this RF Module isintegrated" hasto be labelled with an auxilliary lable stating the IC ofthe RF Module,such as "Contains transmitter module IC:20625-EHMC20 This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help This transmitter/module must not be collocated or operating in conjunction with any other antenna or transmitter. Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements.
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