Ehong Technology MC30 Bluetooth Module User Manual Datasheet

ShangHai Ehong Technology Co.,Ltd. Bluetooth Module Datasheet

User Manual

Ehong ® Professional Bluetooth Solutions Provider Ehong Technology Co.,Ltd Feb 18 2017 • Bluetooth® Radio - Fully embedded Bluetooth® v4.2 single mode - TX power+1.5dBm, -93dbm RX sensitivity - 128-bit encryption security - Range up to 80m - Integrated chip antenna - Multipoint capability (2devices at master) - 32-bit ARM Cortex M0 CPU core • Support Profiles - BLE (Master and slave) the same - The generic attribute profile (GATT) - HID Health care, Sports and fitness, Proximity sensing - Alerts and timer profiles - HID （keyboards, remote） • User Interface - UART（CTS/RTS） - SPI master/Slave interface - Debug SPI interface for programming（SWD） - I²C master controller - Quadrature Decoder (QDEC) - Real Timer Counter (RTC) - 4 x LED PWMs - 10 bit Aux ADC - 256 KB internal flash • General I/O - 22 general purpose I/Os - 5 analogue I/O (10bit ADC) • Single voltage supply: 3.3V typical • Small form factor: 15.72 x 9.15x 2.2mm • Operating temperature range: -25 °C to 75 °C EH-MC30 Low Energy Module Data Sheet EH-20170218-DS Rev1.1
Ehong ® Professional Bluetooth Solutions Provider page 2 of 18 VERSION HISTORY Version Comment V1.0 Current consumption added V1.1 Certification information updated. Confidential and Proprietary – Ehong Technology Co.,Ltd NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: DCC@ehlink.com.cn. Restricted Distribution: Not to be distributed to anyone who is not an employee of either Ehong Technology Co.,Ltd or its affiliated companies without the express approval of Ehong Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Ehong Technology Co.,Ltd. This Bluetooth trademark is owned by the Bluetooth SIG Inc., USA and is licensed to Ehong Technologies. All other trademarks listed herein are owned by their respective owners. © 2016 Ehong Technology Co.,Ltd All rights reserved.
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 3 of 17 1. Contents 1. Description ......................................................................................................................................................... 5 2. Applications ....................................................................................................................................................... 5 3. EH-MC30 Product numbering ........................................................................................................................ 5 4. Electrical Characteristics ............................................................................................................................... 5 4.1 Recommended Operation Conditions .................................................................................................................. 5 4.2 Absolute Maximum Rating .................................................................................................................................. 6 4.4 Power Consumption............................................................................................................................................. 6 5. Pinout and Terminal Description .................................................................................................................. 7 5.1 Pin Configuration ................................................................................................................................................ 7 6. Physical Interfaces ........................................................................................................................................... 8 6.1. Power Supply ............................................................................................................................................... 8 6.2. PIO ................................................................................................................................................................ 9 6.3. AIO ................................................................................................................................................................ 9 6.4. PWMs ........................................................................................................................................................... 9 6.5. UART ............................................................................................................................................................ 9 6.6. I2C Master/ Slave ...................................................................................................................................... 10 6.7. SPI Master/Slave ...................................................................................................................................... 11 6.8. SPI Debug .................................................................................................................................................. 12 7. Reference Design ........................................................................................................................................... 13 8. Layout Guidelines .......................................................................................................................................... 13 9. Mechanical and PCB Footprint Characteristics ...................................................................................... 14 10. EH-MEVK-MC30 ............................................................................................................................................... 14 10.1. EH-MEVK-MC30-PCB........................................................................................................................... 14 10.2. EH-MEVK-MC30-SCH .......................................................................................................................... 15 11. Packing .............................................................................................................................................................. 16 12. Soldering Recommendations ...................................................................................................................... 16 13. Contact Information ....................................................................................................................................... 17
Ehong ® Professional Bluetooth Solutions Provider page 4 of 18 2. Table of Tables TABLE 1: RECOMMENDED OPERATION CONDITION ...................................................................................................... 5 TABLE 2: ABSOLUTE MAXIMUM RATING........................................................................................................................ 6 TABLE 3: ESD PROTECTION ......................................................................................................................................... 6 TABLE 4: CURRENT CONSUMPTION .............................................................................................................................. 6 TABLE 5: PIN TERMINAL DESCRIPTION ........................................................................................................................ 8 TABLE 6: POSSIBLE UART SETTINGS ........................................................................................................................ 10 3. Table of Figures FIGURE 1： PINOUT OF EH-MC30 .............................................................................................................................. 7 FIGURE 2： POWER SUPPLY PCB DESIGN ................................................................................................................. 9 FIGURE 3： CONNECTION TO HOST DEVICE .............................................................................................................. 10 FIGURE 4： WTI SPECIFICATIONS .............................................................................................................................. 10 FIGURE 5： SCL/SDA TIMING .................................................................................................................................... 11 FIGURE 6： TWI TIMING PARAMETERS....................................................................................................................... 11 FIGURE 7： SPI SPECIFICATIONS ............................................................................................................................... 11 FIGURE 8： SPI TIMING DIAGRAM, ONE BYTE TRANSMISSION, SPI MODE................................................................. 12 FIGURE 9： SPI TIMING PARAMETERS ....................................................................................................................... 12 FIGURE 10： REFERENCE DESIGN............................................................................................................................. 13 FIGURE 11： CLEARANCE AREA OF ANTENNA ........................................................................................................... 13 FIGURE 12： PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT: MM, DEVIATION:0.02MM) .............. 14 FIGURE 13： EH-MEVK-MC30-PCB ....................................................................................................................... 14 FIGURE 14： EH-MEVK-MC30-SCH ....................................................................................................................... 15 FIGURE 15： EH-MC30 PACKAGING（PALLET） .................................................................................................... 16
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 5 of 17 1. Description EH-MC30 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. The module offers all Bluetooth® low energy features V4.2: radio, stack, profiles and application space for customer applications, internal integration Cortex-M0 CPU so no external processor is needed. The module also provides flexible hardware interfaces to connect sensors, simple user interfaces or even displays directly to the module. The module can be powered directly with a standard 3.3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only 2.6uA and will wake up in few hundred microseconds. After buying Bluetooth® module, we provide free technical support APP of iOS or Android. 2. Applications  HID: keyboards, mice, touchpads, advanced remote controls with voice activation  Sports and fitness sensors: heart rate, runner/cycle speed and cadence  Health sensors: blood pressure, thermometer and glucose meters  Mobile accessories: watches, proximity tags, alert tags and camera controls  Smart home: heating/lighting control 3. EH-MC30 Product numbering EH-MC30Module nameEhong company 4. Electrical Characteristics 4.1 Recommended Operation Conditions Operating Condition Min Typical Max Unit Operating Temperature Range -25 +25 +75 °C Battery (VDD_BAT) operation 2.1 +3.0 +3.6 V I/O Supply Voltage (VDD_PIO) 1.8 +3.0 +3.6 V AIO input 0 - +3.6 V Frequency Range 2402 2480 MHz Table 1: Recommended Operation Condition with a standard 3V coin cell batteries or pair of AAA
Ehong ® Professional Bluetooth Solutions Provider page 6 of 18 4.2 Absolute Maximum Rating Table 2：Absolute Maximum Rating * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. Condition Class Max Rating Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 1C 4000V (all pins) Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 C1 750V (all pins) Table 3: ESD Protection 4.4 Power Consumption The current consumption are measured at the VBAT Mode Description Total typical current at 3.3V (average) TX at - 3V using on-chip DC-DC 6.3mA TX at 0dBm 3V using on-chip DC-DC 10.5mA 3V using on-chip DC-DC 11.8mA RX mode 3V using on-chip DC-DC 13 mA Sleep mode SYSTEM-OFF, no RAM retention 0.6uA Sleep mode SYSTEM-OFF, 8KB RAM retention 1.2uA Sleep mode SYSTEM-ON, All peripherals in idle mode 2.6uA Table 4: Current Consumption Rating Min Max Unit Storage Temperature -40 +125 °C Battery (VBAT) operation* -0.3 3.9 V I/O supply voltage -0.3 +VDD+0.3V V Other Terminal Voltages except RF Vss-0.4 VBAT+0.4 V 1.5dBmTX at + 1.5dBm
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 7 of 17 5. Pinout and Terminal Description 5.1 Pin Configuration Figure 1： Pinout of EH-MC30 Symbol Pin PAD Type Description GND 1 Ground Ground GND 2 Ground Ground GND 3 Ground Ground GND 4 Ground Ground GND 5 Ground Ground GND 6 Ground Ground GND 7 Ground Ground VBAT 8 Power supply Power supply 3.3V SWDCLK 9 Digital input Hardware debug and flash programming I/O. SWDIO 10 Digital IO System reset (active low). Hardware debug and flash programming I/O. P0.21 11 Digital IO General purpose I/O pin
Ehong ® Professional Bluetooth Solutions Provider page 8 of 18 P0.22 12 Digital IO General purpose I/O pin P0.23 13 Digital IO General purpose I/O pin. P0.24 14 Digital IO General purpose I/O pin P0.25 15 Digital IO General purpose I/O pin P0.29 16 Digital IO General purpose I/O pin VBAT 17 Power supply Power supply 3.3V GND 18 Ground Ground P0.30 19 Digital IO General purpose I/O pin P0.00 (AREF0) 20 Digital IO Analog input General purpose I/O pin ADC/LPCOMP reference input 0 P0.03 (AIN4) 21 Digital IO Analog input General purpose I/O pin ADC/LPCOMP reference input4 P0.04 (AIN5) 22 Digital IO Analog input General purpose I/O pin ADC/LPCOMP reference input5 P0.05 (AIN6) 23 Digital IO Analog input General purpose I/O pin ADC/LPCOMP reference input6 P0.06 (AIN7) 24 Digital IO Analog input General purpose I/O pin General purpose I/O pin ADC/LPCOMP reference input7 GND 25 Ground Ground P0.07 26 Digital IO General purpose I/O pin P0.08 27 Digital IO General purpose I/O pin P0.09 28 Digital IO General purpose I/O pin P0.10 29 Digital IO General purpose I/O pin P0.11 30 Digital IO General purpose I/O pin P0.12 31 Digital IO General purpose I/O pin P0.13 32 Digital IO General purpose I/O pin P0.14 33 Digital IO General purpose I/O pin P0.17 34 Digital IO General purpose I/O pin P0.18 35 Digital IO General purpose I/O pin GND 36 Ground Ground Table 5：PIN Terminal Description Note: The module UARTs and I2C can be mapped any PIOs. 6. Physical Interfaces 6.1. Power Supply - The module power supply 3v coin cell batteries or DC 3.3v - Power supply pin connection capacitor to chip and pin as far as possible close - Capacitor decouples power to the chip - Capacitor prevents noise coupling back to power plane. - Support power on reset
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 9 of 17 - Figure 2： Power Supply PCB Design 6.2. PIO The general purpose I/O is organized as one port with up to 19 I/Os (dependent on package) enabling access and control of up to 19 pins through one port. Each GPIO can be accessed individually with the following user configurable features:  Input/output direction  Output drive strength  Internal pull-up and pull-down resistors  Wake-up from high or low level triggers on all pins  Trigger interrupt on all pins  All pins can be used by the PPI task/event system. The maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels. All pins can be individually configured to carry serial interface or quadrature demodulator signals. 6.3. AIO The 10 bit incremental Analog to Digital Converter (ADC) enables sampling of up to 8 external signals through a front-end multiplexer. The ADC has configurable input, reference presaging, and sample resolution (8, 9, and 10 bit) 6.4. PWMs The module has 4 independently configurable PWM instances. 6.5. UART The module has 1 UART interface. The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial communication with built-in flow control (CTS, RTS) support in hardware up to 1Mbps baud. Parity checking is supported. The GPIOs used for each UART interface line can be chosen from any GPIO on the device and are independently configurable. This enables great flexibility in device pinout and efficient use of board space and signal routing.
Ehong ® Professional Bluetooth Solutions Provider page 10 of 18 Table 6: Possible UART Settings Figure 3： Connection To Host device 6.6. I2C Master/ Slave The module has 1 I²C master/slave general interface for communication with external peripherals and sensors. Symbol Description Note Min Typ. Max. Units Test Level I2W100K Run current for TWI at 100 kbps. 380 μA 1 I2W400K Run current for TWI at 400 kbps. 400 μA 1 f2W Bit rates for TWI. 100 400 kbps N/A tTWI,START Time from STARTRX/STARTTX task is given until start condition. Low power mode.1 Constant latency mode.1 3 1 4.4 μs 1 For more information on how to control the sub power modes, see the Series Reference Manual. Figure 4： WTI specifications Parameter Possible Values Baud Rate Minimum 1200 baud (≤2%Error) 9600 baud (≤1%Error) Maximum 2M baud (≤1%Error) Parity None, Odd or Even Number of Stop Bits 1 or 2 Bits per Byte 8
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 11 of 17 Figure 5： SCL/SDA timing Symbol Description Standard Fast Units Test level Min. Max. Min. Max. fSCL SCL clock frequency. 100 400 kHz 1 tHD_STA Hold time for START and repeated START condition. 5200 1300 ns 1 tSU_DAT Data setup time before positive edge on SCL 300 300 ns 1 tHD_DAT Data hold time after negative edge on SCL. 300 300 ns 1 tSU_STO Setup time from SCL goes high to STOP condition. 5200 1300 ns 1 tBUF Bus free time between STOP and START conditions. 4700 1300 ns 1 Figure 6： TWI timing parameters Note: Strong pull is sufficient for I²C on all PIO pads. 6.7. SPI Master/Slave Symbol Description Min. Typ. Max. Units Test level IGPIOTE,IN Run current with 1 or more GPIOTE active channels in Input mode. 22 μA 1 IGPIOTE,OUT Run current with 1 or more GPIOTE active channels in Output mode. 0.1 μA 1 IGPIOTE,IDLE Run current when all channels are in Idle mode. PORT event can be generated with a delay of up to t1V2 0.1 μA 1 Figure 7：SPI specifications
Ehong ® Professional Bluetooth Solutions Provider page 12 of 18 Figure 8：SPI timing diagram, one byte transmission, SPI mode Symbol Description Note Min. Typ. Max. Units Test level tDC Data to SCK setup. 10 ns 1 tDH SCK to data hold. 10 ns 1 tCD SCK to data valid. CLOAD = 10 pF 972 ns 1 tCL SCK low time. 40 ns 1 tCH SCK high time. 40 ns 1 fSCK SCK frequency. 0.125 MHz 1 tR,tF SCK rise and fall time. ns 1 Figure 9： SPI timing parameters 6.8. SPI Debug The two pin Serial Wire Debug (SWD) interface provided as a part of the Debug Access Port (DAP) offers a flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints and single stepping are part of this support.
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 13 of 17 7. Reference Design Figure 10： Reference Design 8. Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 3. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND via as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna will detune the antenna to lower frequencies. Figure 11： Clearance area of antenna
Ehong ® Professional Bluetooth Solutions Provider page 14 of 18 9. Mechanical and PCB Footprint Characteristics Figure 12：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) 10. EH-MEVK-MC30 10.1. EH-MEVK-MC30-PCB Figure 13： EH-MEVK-MC30-PCB
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 15 of 17 A. EH-MEVK-MC30 has two power supplies: LDO_3V3 and cell battery. B. USB RS232 interface, connect to module UART. C. SWD PIN, Button and LED interface. D. Any more information, please document of EH-MEVK-MC30 using guide. 10.2. EH-MEVK-MC30-SCH Figure 14: EH-MEVK-MC30-SCH
Ehong ® Professional Bluetooth Solutions Provider page 16 of 18 11. Packing Figure 15： EH-MC30 Packaging（Pallet） Remark: Packing for the pallet，one packaging quantity is 80 PCS。 12. Soldering Recommendations EH-MC30 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. SMT stencil making requirements  If bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≥ 0.25mm ,so you choose SMT stencil thickness 1.5mm。  If bluetooth module PIN pitch ≥ 0.25mm and other component PIN pitch ≤ 0.25mm ,so you choose SMT Ladder stencil Bluetooth module thickness 1.5mm other component thickness 1.3mm .  Solder pad open via ratio Length 1:1.2, width 1:1.
EH-MC30 Ehong ® Professional Bluetooth Solutions Provider page 17 of 17 13. Contact Information Sales: sales@ehlink.com.cn Technical support: support@ehlink.com.cn Website：http://www.ehlink.com.cn Phone: +86 21 64769993 Fax: +86 21 64765833 Street address: Rom505, Blk 1st ,No.833 South Hong Mei Rd ,Ming hang district Shanghai
FCC/IC Statements Integrator is reminded to assure that these installation instructionswill not be made available to the end-user of the final host device.The final host device, into which this RF Module isintegrated" hasto be labelledwith an auxilliary lable stating the FCC IDofthe RF Module,such as"This device complies with part 15 of the FCC rules. Operation is subject to the following twoconditions:(1)this devicemay not cause harmful interference, and(2)this devicemust accept any interference received, includinginterference thatmay cause undesired operation."approved by the party responsible for compliance could"Contains FCC ID:2ACCRMC30 the Integrator will be responsible to satisfy SAR/ RF Exposure requirements,when the module integrated into the host device.The final host device, into which this RF Module isintegrated" hasto be labelledwith an auxilliary lable stating the IC ofthe RF Module,such as"Contains transmitter module IC:20625-EHMC30 void the user’s authority to operate the equipment." "Changes or modifications to this unit not expresslyThis device complies with Industry Canada licence-exempt RSS standard(s). Operation issubject to the following two conditions:(1) this device may not cause interference, and(2) this device must accept any interference, including interference that may causeundesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareilsradio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :(1) l'appareil ne doit pas produire de brouillage, et(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si lebrouillage est susceptible d'en compromettre le fonctionnement.(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module'sintentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in §15.101.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help This transmitter/module must not be collocated or operating in conjunction with any other antenna or transmitter.
Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements.

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