Ezurio BL600 BL600 Series Bluetooth Low Energy Module User Manual

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Single Mode Bluetooth Low Energy
(BLE) Module
Part # BL600-SA, BL600-SC, BL600-ST
HARDWARE DATA SHEET AND INTEGRATION GUIDE
VERSION 0.5
Americas: +1-800-492-2320 Option 3
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
BL600-Sx
Single Mode BLE Module
www.lairdtech.com/wireless
REVISION HISTORY
Revision
Description
Version
0.1
07/02/2013 – first stage internal release
Version
0.2
07/02/13 – includes Mt comments
Version
0.3
15Feb13 –RK initial updates in blue colour. (need to clear it with Nordic how much of
the data In their chipset specification we can copy over to our module specification. .
Version
0.4
22Mar13 –RK re-write thoroughly. When reviewed, need to clear it with Nordic how
much of the data In their chipset specification we can copy over to our module
specification.
Version
0.5
Modify TCB Review Feedback
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Laird
BL600-Sx
Single Mode BLE Module
CONTENTS
Revision History .......................................................................................................................... 2
Contents ..................................................................................................................................... 3
Overview and Key Features.................................................................................................... 4
Specification summary .......................................................................................................... 5
Hardware Specifications ........................................................................................................ 7
Power Consumption ............................................................................................................ 11
Functional Description ........................................................................................................ 15
5.1
Power management (includes brown-out and power on reset) .....................................15
5.2
Clocks ...........................................................................................................................................15
5.3
Memory for smart BASIC application code ..........................................................................16
5.4
RF ...................................................................................................................................................16
5.5
UART Interface ............................................................................................................................16
5.6
SPI Bus ...........................................................................................................................................17
5.7
I2C Interface ...............................................................................................................................17
5.8
General Purpose I/O and ADC ...............................................................................................18
HW integration guide .......................................................................................................... 20
6.1
Circuit Components Required on Host PCB .........................................................................20
6.2
BL600-Sx General PCB Layout on Host PCB...........................................................................20
6.3
BL600-SA Layout on Host PCB ..................................................................................................20
6.4
BL600-ST Layout on Host PCB ...................................................................................................21
Tools For development of applications ................................................................................ 22
Application Note for Surface Mount Modules ...................................................................... 23
8.1
Introduction .................................................................................................................................23
8.2
Shipping .......................................................................................................................................23
8.3
Reflow Parameters .....................................................................................................................24
FCC and IC Regulatory Statments ........................................................................................ 25
10 Japan (MIC) Regulatory ........................................................................................................ 29
11 CE Regulatory ...................................................................................................................... 29
12 EU DECLARATIONS OF CONFORMITY ................................................................................... 29
13 Mechanical Details .............................................................................................................. 32
14 ORDERING INFORMATION .................................................................................................... 33
15 Bluetooth SIG Approvals ...................................................................................................... 34
15.1
End Product Listings (EPLs) ........................................................................................................34
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Laird
BL600-Sx
Single Mode BLE Module
1 OVERVIEW AND KEY FEATURES
Every BL600 Series module is designed to enable OEMs to add single-mode Bluetooth Low Energy
(BLE) to small, portable, power –conscious devices. The BL600 modules are enabled with Laird’s
smart BASIC, an event-driven programming language that enables OEMs to make their BLE
product development quicker, and simpler, significantly reducing time to market. Smart BASIC
enables customers to develop a complete embedded application inside the compact BL600
hardware, connecting to a wide array of external sensors via its I2C, SPI, UART, ADC or GPIO
interfaces.
Based on the world-leading Nordic Semiconductor nRF51822 chipset, the BL600 modules provide
ultra-low power consumption with outstanding wireless range via 4dBm of transmit power. A
broad range of BLE profiles including Temperature and Heart Rate are available and smart BASIC
provides the ideal mechanism to support any BLE profile development of your choice.
Features & Benefits










Application Areas
Bluetooth v4.0 - Single Mode
External or Internal Antennas
smart BASIC programming language
Full Bluetooth EPL
Compact Footprint
Class 2 output - 4dBm
UART, GPIO, ADC, I2C and SPI interfaces
Fast Time to Market
FCC, CE, IC certified and other regulatory
certifications on request
No external components needed
www.lairdtech.com/wireless







Medical devices
Wellness devices
iOS ‘appcessories’
Fitness sensors
Location Awareness
Home automation
Laird
BL600-Sx
Single Mode BLE Module
2 SPECIFICATION SUMMARY
2.1 Specification summary
Table 1: Detailed specifications
Categories
Wireless Specification
Feature
Implementation
Bluetooth®
V4.0 – Single Mode
Slave (in base FW v1.1.50.0)
Frequency
2.402 - 2.480 GHz
Max Transmit Power
4dBm into integrated antenna
4dBm into IPEX antenna connector
-20dBm (in 4dB steps with smart BASIC
command)
-30dBm (min) with smart BASIC
command
Min Transmit Power
TX Whisper Mode1 Transmit
Power
TX Whisper Mode2 Transmit
Power
Host Interface
Receive Sensitivity
Link Budget
Range
Better than -91 dBm (typical)
95 dB (@ 1 Mbps)
Up to 150 m in free space
TX Whisper Modes
Range reduction (NFC like) feature with
TX Whisper Modes with smart BASIC
command
Raw Data Rates
TOTAL
Up to 1Mbps (over the air)
UART
TX, RX, CTS, RTS
DCD, RI, DTR, DSR, CTS, RTS (Note1)
Default 9600, n,8, 1
From 1,200 to 115,200bps
Up to 28 lines
28 x Multifunction I/O lines
GPIO
Profiles
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-55dBm (min) with smart BASIC
command
ADC
6 lines
Up to 10 bit resolution
I2C
SPI
2 lines
3 lines (Note 2)
Services supported
(base FW v1.1.50.0)
Heart Rate Service
Health Thermometer Service
Battery Alert Service
Blood Pressure Service
Device Information Service
Immediate Alert Service
IOPT (Interoperability)
Link Loss Service
Laird
BL600-Sx
Single Mode BLE Module
Categories
Feature
Implementation
Transmit Power Service
Control Protocols
Any
User defined via smart BASIC
Firmware Upgrade
Base Firmware Upgrade via JTAG
interface on DVK-BL600. In Future FW,
through UART
smart BASIC App Code
upgrade
Via UART
Supply Voltage
Supply
2.1 – 3.6 V – internal DCDC converter
1.8 – 3.6 V – internal LDO
Power Consumption
Active Modes (Tx pwr
4dBm)
Advertising
TBD mA peak
TBD uA Avg
Connected Mode
TBD mA peak
TBD uA Avg
Ultra Low Power Modes
Standby Doze (
3.5 uA
Deep Sleep
400 nA(*1)
(no RAM retention)
(*1),current silicon
1uA.
Antenna Options
Internal
External
Physical
Dimensions
Weight
Operating
Storage
Lead Free
Warranty
Development Kit
Multilayer ceramic – BL600-SA
Connection via IPEX MH4 – BL6000-SC
Trace Pads – BL600-ST
19 mm x 12.5 mm x 3 mm
<1 gram
-25 ˚C to +75 ˚C
-40 ˚C to +85 ˚C
Lead-free and RoHS compliant
1 Year
Development Kit DVK-BL600-Sx and
Free Software Tools
End Product Listing (EPL)
All BL600 Series
Environmental
Miscellaneous
Development Tools
Approvals
Bluetooth®
FCC / IC / CE / MIC
Note1: DSR, DTR, RI, and DCD can be implemented in smart BASIC.
Note 2: SPI CS is controlled from smart BASIC application allowing multi-dropping.
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Laird
BL600-Sx
Single Mode BLE Module
3 HARDWARE SPECIFICATIONS
44 connection pads
UART
GPIO
ADC
I2C
SPI
256K Flash
ARM Cortex M0
(smartBASIC)
16K RAM
BLE Radio
Internal
Antenna
OR
UFL
Figure 3: Functional Block Diagram
3.1 SW Block diagram
TBD
3.2 3.1 Pin Definitions
Table 2: Pin definitions
Pin No
Pin
Designation
Default
Function
Alternate
Function
Default
Direction
Notes
Comment
GND
SIO_1
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling
GND
SIO_2
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling
SIO_3
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling
SIO_4
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
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BL600-Sx
Single Mode BLE Module
Pin No
Pin
Designation
Default
Function
Alternate
Function
Default
Direction
Notes
Comment
scaling
SIO_5
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling
SIO_6
DIO
AIN
IN
1,2,3,4,5
8,9,10 bit resolution, Voltage
scaling
SIO_7
DIO
IN
1,2
10
VCC
11
GND
12
SIO_8
DIO
I2C SDA
IN
1,2,4,5,6
13
SIO_9
DIO
I2C SCL
IN
1,2,4,5,6
14
SIO_10
DIO
SPI MOSI
IN
1,2,4,5,6
15
SIO_11
DIO
SPI MISO
IN
1,2,4,5,6
16
SIO_12
DIO
SPI CLK
IN
1,2,4,5,6
17
GND
18
SIO_13
DIO
IN
1,2
19
SIO_14
DIO
IN
1,2
20
SIO_15
DIO
IN
1,2
Laird Devkit : Buzzer output
21
SIO_16
DIO
IN
1,2
Laird Devkit : Button 0 input
22
nRESET
23
NC
24
SIO_17
DIO
IN
1,2
Laird Devkit : Button 1 input
25
SIO_18
DIO
IN
1,2
Laird Devkit : LED 0
26
SIO_19
DIO
IN
1,2
Laird Devkit : LED 1
27
SIO_20
NC
28
GND
29
GND
30
RF_ANT
31
GND
32
SIO_21
UART TX
DIO
OUT
1,2,4,6,7
33
SIO_22
UART RX
DIO
IN
1,2,4,6,7
34
SIO_23
UART RTS
DIO
OUT
1,2,4,6,7
35
SIO_24
UART CTS
DIO
IN
1,2,4,6,7
36
SIO_25
DIO
IN
1,2
37
GND
38
SIO_26
NC
39
SIO_27
NC
40
SIO_28
nAutoRUN
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IN
I2COPEN() in smart BASIC
selects I2C function
SPIOPEN() in smart BASIC
selects SPI function, MOSI
and CLK will be outputs
when in SPI master mode
System Reset (Active low)
DO NOT CONNECT
Reserved for future use
UARTCLOSE() selects DIO
functionality and
UARTOPEN() selects uart
comms behaviour
Laird Devkit : UART_DTR via
CON12
Reserved for future use. Do
NOT connect.
IN
In ONLY
Laird Devkit: UART_DSR via
CON12
Laird
BL600-Sx
Single Mode BLE Module
Pin No
Pin
Designation
Default
Function
41
SIO_29
42
SIO_30
43
GND
44
SIO_0
Alternate
Function
Default
Direction
Notes
Comment
DIO
IN
1,2
Laird Devkit : UART_DCD
via CON12
DIO
IN
1,2
Laird Devkit : UART_RI via
CON12
DIO
IN
1,2
Notes: 1. Secondary function is selectable in smart BASIC BASIC application
2. DIO = Digital Input or Output
3. AIN = Analog Input
4. DIO or AIN functionality is selected using the GpioSetFunc() function in smart BASIC
5. AIN configuration selected using GpioSetFunc() function
6. I2C, UART, SPI controlled by xxxOPEN() functions in smart BASIC
7. SIO_21 to SIO_24 are DIO by default when $autorun$ app runs on power up.
SIO lines can be configured through smart BASIC to be either inputs or outputs with weak or strong
pull-ups or pull-downs.
At reset, all SIO lines are configured as the defaults shown above. In other words, BL600 module
shipped form production the loaded base FW, all the SIO pins (with “default function” of “DIO”
are inputs).
UART_RX, UART_TX, UART_CTS are all 3.3 v level logic. For example, when RX and TX are idle they
will be sitting at 3.3V. Conversely for handshaking pins CTS and RTS at 0v is treated as an assertion.
Pin 40 (nAutoRUN) is an input, with active low logic. In the development kit (DVK-BL600-sx) it is
connected so that the state is driven by the host’s DTR output line.
3.3 Electrical Specifications
3.3.1 Absolute Maximum ratings
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the
Module are listed below; exceeding these values will cause permanent damage.
Parameter
Min
Max
Unit
Voltage at VCC pin
-0.3
+3.6
Voltage at GND pin
Voltage at SIO pin
-0.3
VCC+0.3
Storage temperature
-40
+85
ºC
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BL600-Sx
Single Mode BLE Module
3.3.2 Recommended Operating Parameters
3.3.2.1
Power Supply
Parameter
Min
Typ
Max
Unit
VCC
1.8
3.6
VCC (with internal DCDC enabled)
2.1
3.6
60
mS
+75
ºC
VCC rise time (0 to 1.8V)
Note1
Operating Temperature Range
Note:
3.3.2.2
-25
25
The on-chip power-on reset circuitry may not work properly for rise times outside the
noted interval.
Signal Levels for Interface, SIO
Parameter
Min
VIH
Max
Unit
0.7VCC
VCC
VIL Input low voltage
VSS
3.6
VOH Output high voltage
(std. drive, 0.5mA)
(high-drive, 5mA)
Note2
VCC-0.3
VCC-0.3
VCC
VCC
VSS
VSS
0.3
0.3
Input high voltage
VOL Output low voltage
(std. drive, 0.5mA)
(high-drive, 5mA)
Note:
3.3.2.3
Typ
Maximum number of pins with 5mA high drive is 3.
ADC specification
Parameter
Min
Typ
Max
Unit
ADC Internal reference voltage
-1.5%
1.2V
+1.5%
ADC pin input
internal selectable scaling
1/1
1/3
2/3
ADC input pin voltage maximum (w.r.t scaling)
1/1
1/3
2/3
Checking
with
scaling
NORDIC
1.2
VCC/3
VCC(2/3)
Time required to convert
10bit mode (see note)
single sample in
68
Us
Time required to convert
mode
single sample in 9bit
36
us
Time required to convert
mode
single sample in 8bit
20
us
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10
Laird
BL600-Sx
Single Mode BLE Module
Note:
Current production FW (v1.1.50.0) allows only 10bit mode.
4 POWER CONSUMPTION
4.1 Power Consumption
Parameter
Min
Active mode (Advertising or Connection)
TX only run peak current @TXpwr= +4dBm
TX only run peak current @TXpwr= 0dBm
TX only run peak current @TXpwr= -4dBm
TX only run peak current @TXpwr= -8dBm
TX only run peak current @TXpwr= -12dBm
TX only run peak current @TXpwr= -16dBm
TX only run peak current @TXpwr= -20dBm
TX Whisper mode 1
TX only run peak current @TXpwr= -30dBm
TX Whisper mode 2
TX only run peak current @TXpwr= -55dBm
Typ
Max
Unit
16
10.5
6.5
5.5
mA
mA
mA
mA
mA
mA
mA
5.5
mA
Need to
measure
Active Mode
RX only current
13
mA
Ultra Low Power Mode1 (note1)
Standby Doze
3.5
uA
Standby Doze (UART on)
1.33mA to
be
measured
again
Ultra Low Power Mode2 Note2
Deep Sleep (no RAM retention)
Deep Sleep (8kB RAM retention)
Deep Sleep (16kB RAM retention)
400
600
800
nA
nA
nA
Note 1:
In Standby Doze, all functional blocks independently are in IDLE or RUN mode
depending on needed functionality. All peripherals that are enabled stay on and
may wake the chip again. Depending on active peripherals, current consumption will
be from ~2-3 µA up to > 1 mA. See individual peripherals current consumption in
Table xx on page.
Note 2:
In Deep Sleep everything is disabled and the only wake-up sources are reset and
change on pins on which sense is enabled. The current consumption is ~1000nA to
1200nA (in current Nordic silicon). Current base FW ((v1.1.50.0) allows coming out of
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Laird
BL600-Sx
Single Mode BLE Module
deep sleep through HW reset only. Future FW release will allow coming out from Deep
Sleep to Standby Doze through GPIO signal or HW reset.
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BL600-Sx
Single Mode BLE Module
4.2 Measured waveforms
TBD
Figure xx
Typical current consumption profile during advertising in slave mode @ Tx pwr +4dBm
Figure X: Typical current consumption profile during advertising in slave mode @ Tx pwr -30dBm (TX Whisper
Mode1)
Figure X: Typical current consumption profile during advertising in slave mode @ Tx pwr -55dBm (TX Whisper
Mode2)
Measured waveform
Figure X: Typical current consumption profile during data connection in slave mode@ Tx pwr +4dBm (TX
Whisper Mode1)
Figure X: Typical current consumption profile during data connection in slave mode@ Tx pwr -30dBm (TX
Whipser Mode1)
Figure X: Typical current consumption profile during data connection in slave mode@ Tx pwr -55dBm (TX
Whipser Mode1)
4.3 Peripheral block current consumption
The values below are calculated for a typical operating voltage of 3 V.
Table 3: UART Power Consumption
Parameter
Min
Typ
Max
Unit
UART Run current @ 115200 bps
220
uA
UART Run current @ 1200 bps
210
uA
UART Baud rate
1.2
115.2
kbps
Max
Unit
Table 4: SPI Power Consumption
Parameter
Min
Typ
SPI Master Run current @ 125 kbps
180
SPI Master Run current @ 8 Mbps
SPI bit rate
uA
220
0.125
uA
Mbps
Max
Unit
Table 5: I2C Power Consumption
Parameter
Min
Typ
I2C Run current @ 100 kbps
380
uA
I2C Run current @ 400 bps
400
uA
I2C Bit rate
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100
400
13
kbps
Laird
BL600-Sx
Single Mode BLE Module
Table 6: ADC
Parameter
Min
Typ
ADC current during conversion
290
Max
Unit
uA
The above current consumption is for the particular peripheral only and to operate that
peripheral requires the 16MHz crystal oscillator (clock tree) and internal low voltage LDO which
consume a fixed amount of base current (~740uA). Current Nordic silicon this fixed current is bit
higher (by ~400uA).
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14
Laird
BL600-Sx
Single Mode BLE Module
5 FUNCTIONAL DESCRIPTION
The BL600 BLE module is a self-contained Bluetooth Low Energy product and requires only power
and a user’s smart BASIC application to implement full BLE functionality. The integrated, high
performance antenna combined with the RF and Base-band circuitry provides the Bluetooth
wireless link, and any of the SIO lines provide the OEM’s chosen interface connection to the
sensors. The user’s smart BASIC application binds the sensors to the BLE wireless functionality.
The variety of hardware interfaces and the smart BASIC programming language allow the BL600
module to serve a wide range of wireless applications, whilst reducing overall time to market and
the learning curve for developing BLE products.
To provide the widest scope for integration a variety of physical host interfaces / sensors are
provided. The major BL600 series module functional blocks described below.
5.1 Power management (includes brown-out and
power on reset)
Power management features:






System Standby Doze / Deep Sleep modes,
Brownout Reset,
Open /Close Peripherals (UART, SPI, I2C, SIO’s and ADC). Peripherals consume current when
Open; each peripheral can be individually closed to save power consumption.
2-region RAM retention in System Deep Sleep mode
Enable DCDC on power-up if VCC is >2.1V
smart BASIC command allows the VCC voltage to be read (through the internal ADC)
Features to be included in future firmware:


Power fail comparator
Pin wake-up system from Deep sleep
Power supply features:




Supervisor HW to manage power on reset, brownout (and power fail)
1.8V to 3.6V supply range using internal LDO regulator
2.1 to 3.6V supply range using internal DCDC convertor
DCDC operation automatically suspended when only the internal low current LDO is
needed.
This feature is useful for applications using battery technologies with higher nominal cell voltages.
The reduction in supply voltage level from a high voltage to a low voltage reduces the peak
power drain from the battery. Used with a 3 V coin-cell battery, the peak current drawn from
the battery is reduced by approximately 30%.
5.2 Clocks
The high accuracy (+/-10ppm) 32.768kHz crystal oscillator provides protocol timing and helps with
Radio power consumption in the System Standby Doze /Deep sleep modes.by reducing the time
that the RX window needs to be open. Standard accuracy clocks tend to have lower accuracy
+/-250 ppm.
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BL600-Sx
Single Mode BLE Module
The high accuracy 16 MHz crystal oscillator helps with Radio operation and also helps reduce
power consumption in the Active modes.
5.3 Memory for smartBASIC application code
User has approximately 5 Kbytes of data memory available for smart BASIC application code.
Please consult Laird FAE for more information.
5.4 RF




TX output power of +4dBm programmable to -20 dBm in steps of 4 dB.
- TX Whisper mode1 -30 dBm
- TX Whisper mode2 -55 dBm
Receiver (with integrated channel filters) to achieve maximum sensitivity -93dBm @ 1Mbps
BLE
RF conducted interface available in 3-ways:
- BL600-SA - RF connected to on-board antenna on BL600-SA
- BL600-SC
-RF connected to on-board IPEX MH4 RF connector on BL600-SC
- BL600-ST
-RF connected to RF pad on BL600-ST
Antenna options
- Integrated antenna on BL600-SA
- External antenna connected with to IPEX MH4 RF connector on BL600-SC
- External antenna connected to RF pads on BL600-ST
5.5 UART Interface
The Universal Asynchronous Receiver/Transmitter offers fast, full-duplex, asynchronous serial
communication with built-in flow control support (UART_CTS, UART_RTS) in HW up to 1 Mbps baud.
Parity checking and generation for the 9th data bit are supported.
UART_TX, UART_RX, UART_RTS, and UART_CTS form a conventional asynchronous serial data port
with handshaking. The interface is designed to operate correctly when connected to other UART
devices such as the 16550A. The signalling levels are nominal 0 V and 3.3 V (tracks VCC) and are
inverted with respect to the signalling on an RS232 cable.
Two-way hardware flow control is implemented by UART_RTS and UART_CTS. UART_RTS is an
output and UART_CTS is an input. Both are active low.
These signals operate according to normal industry convention. UART_RX, UART_TX, UART_CTS,
UART_RTS are all 3.3 V level logic (tracks VCC). For example, when RX and TX are idle they sit at
3.3 V. Conversely for handshaking pins CTS, RTS at 0 V is treated as an assertion.
The module communicates with the customer application using the following signals:


Port /TXD of the application sends data to the module’s UART_RX signal line
Port /RXD of the application receives data from the module’s UART_TX signal line
BL600
Application - Host
UART_TX
/RXD
UART_RX
/TXD
UART_CTS
/RTS
UART_RTS
/CTS
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BL600-Sx
Single Mode BLE Module
Note:
The BL600 serial module output is at 3.3V CMOS logic levels (tracks VCC). Level
conversion must be added to interface with an RS-232 level compliant interface.
Some serial implementations link CTS and RTS to remove the need for handshaking. Laird does
not recommend linking CTS and RTS other than for testing and prototyping. If these pins are linked
and the host sends data at the point that the BL600 deasserts its RTS signal, then there is significant
risk that internal receive buffers will overflow, which could lead to an internal processor crash. This
will drop the connection and may require a power cycle to reset the module. Laird recommends
that the correct CTS/RTS handshaking protocol be adhered to for proper operation.
Table 7: UART Interface
Signal Name
UART_TX
UART_RX
UART_RTS
UART_CTS
Pin No
32
33
34
35
I/O
Comments
The UART interface is used to load smart BASIC application code.
5.6 SPI Bus
The SPI interface is an alternate function on SIO pins, configurable by smart BASIC.
The Module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CSB is
implemented using any spare SIO digital output pins to allow for multi-dropping.
The SPI interface enables full duplex synchronous communication between devices. It supports a
3-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from
multiple slaves. Individual chip select signals will be necessary for each of the slave devices
attached to a bus, but control of these is left to the application through use of SIO signals. I/O
data is double buffered.
The SPI peripheral supports SPI mode 0, 1, 2, and 3.
Signal Name
SPI_MOSI
SPI_MISO
SPI_CLK
Pin No
14
15
16
I/O
Comments
This interface is an alternate function on each pin,
configurable by smart BASIC.
5.7 I2C Interface
The I2C interface is an alternate function on SIO pins, configurable by smart BASIC.
The Two-wire interface can interface a bi-directional wired-AND bus with two lines (SCL, SDA). The
interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported.
Table 8: I2C Interface
Signal Name
I2C_SDA
I2C_SCL
Pin No
12
13
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I/O
I/O
I/O
Comments
This interface is an alternate function on each pin,
configurable by smart BASIC.
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5.8 General Purpose I/O and ADC
5.8.1 GPIO
The 28 SIO pins are configurable by smart BASIC. They can be accessed individually. Each has the
following user configured features:




Input/output direction
Output drive strength (standard drive 0.5mA or high drive 5mA)
Internal pull up and pull down resistors (13K typical) or no pull-up/down
Wake-up from high or low level triggers on all pins
The following feature exists in hardware but cannot be configured in the firmware:

All pins individually can be configured to carry quadrature demodulator signals. This feature
may be for customer designing wireless mouse application.
5.8.2 ADC
The ADC is an alternate function on SIO pins, configurable by smart BASIC.
The BL600 provides access to six-channel 10-bit incremental ADC. This enables sampling up to six
external signals through a front end MUX. The ADC has configurable input and reference
prescaling and sample resolution (8, 9 and 10bit).
Note:
5.8.2.1
Current base FW (v1.1.50.0) provides access to 10-bit mode resolution only.
will provide access to 8 and 9 bit resolution.
Analog Interface (ADC)
Signal Name
AIN –
AIN –
AIN –
AIN –
AIN –
AIN –
Future FW
Analog Input
Analog Input
Analog Input
Analog Input
Analog Input
Analog Input
Pin
No
I/O
Comments
This interface is an alternate function on each pin,
configurable by smart BASIC
Pin
No
22
I/O
Comments
BL600 HW reset (active low)
Lines are 8, 9, 10 bit resolution with voltage scaling.
5.8.3 nRESET pin
Signal Name
nRESET
Add reset signal period after VCC power up.
5.8.4 nAutoRUN pin
Signal Name
nAutoRUN (SIO
www.lairdtech.com/wireless
Pin No
28
I/O
Comments
BL600 HW reset (active low)
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5.8.4.1
Miscellaneous (hidden JTAG)
The BL600 FW consists of 2 pieces:


BL600 base FW (loaded at production, may be upgraded)
BL600 smart BASIC programming (loaded through UART by customer)
To allow customer the capability to upgrade the BL600 base FW, then in current FW (v1.1.49.15)
only allows this via the hidden 2-wire (JTAG) interface.
Signal Name (hidden
name)
Pin No
I/O
nRESET (SWDIO)
22
I/O
NC (SWDCLK)
23
Comments
Connect 12 K resistor to GND (for current silicon
only???).
Laird can supply JTAG programmer for this. Only requirement is that the customer should use the
following JTAG connector on the customers host PCB.
The JTAG connector MPN is as follows:
Reference
Part
Description
JP1
note1
FTSH-105
Header, 1.27mm, SMD, 10-way,
FTSH-105-01-L-DV Samtech
Note 1:
Reference on BL600 development board SCH.
Please refer to the BL600 development board schematic for wiring between BL600 and JTAG
connector.
Note: Future releases of BL600 base FW (Q3 2013) will support upgrading the BL600 firmware
over UART.
5.8.5 BL600-SA On-board Antenna characteristics
The BL600-SA on-board chip antenna radiation performance depends on the host PCB layout.
Please refer to suggested BL600-SA placement (from the BL600 development board) to allow the
on-board antenna to radiate and reduce proximity effects due to nearby host PCB GND copper.
Antenna characteristics are those achieved by the BL600-SA placed on the BL600 development
board.
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6 HW INTEGRATION GUIDE
6.1 Circuit Components Required on Host PCB
The BL600-series module is easy to integrate requiring no external components on the customer’s
board.
Note:
In BL600 modules shipped from production with base firmware, all SIO pins (with “default
function” of “DIO”) are inputs. Remember to change the direction SIO pin (using smart
BASIC) if that particular pin is wired to a device that expects to be driven by the BL600
SIO pin configured as an output.
6.2 BL600-Sx General PCB Layout on Host PCB





Ensure silk screen under module location (refer to land pattern of BL600 development
board)
Use solid GND plane on inner layer (for best EMC and RF performance).
Place GND vias close to module GND pads as possible.
Route traces to avoid noise being picked up on VCC supply and SIO (digital) and AIN
(analogue) traces.
Unused PCB area on surface layer can flood with copper but place GND vias regularly to
connect copper flood to inner GND plane.
6.3 BL600-SA Layout on Host PCB
The BL600-SA has an integrated chip antenna. It is critical to find the best placement of the
BL600-SA on the host PCB to allow the antenna to radiate. The following are a few helpful
guidelines:



Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep
all mounting hardware and metal clear of the area to allow proper antenna radiation.
For best antenna performance, place the module on the edge of the host PCB, preferably
in the corner with the antenna facing the corner.
The antenna keep-out area is defined by the BL600 development board which was used for
module development and antenna performance evaluation. Keep-out area is shown in
Figure 1.
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Figure 1: Antenna keep-out area in red under the BL600-SA module.
6.4 BL600-ST Layout on Host PCB
The below picture shows the RF trace (implemented as GCPW) from the BL600-ST module RF
trace pads (GND, RF_ANT, GND). Notice the regular spaced GND vias.
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7 TOOLS FOR DEVELOPMENT OF APPLICATIONS
The smart BASIC programming language makes BL600 module hardware even easier to integrate.
It allows easy development of a complete BLE enabled sensor application. Laird provides the
below hardware and software tools.
HW
SW
BL600 development board
smart BASIC
JTAG programmer
uWterminal
Refer to the BL600 DVK User’s Manual for list of accesories provided with development board.
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APPLICATION NOTE FOR SURFACE MOUNT MODULES
8.1 Introduction
Laird Technologies surface mount modules are designed to conform to all major manufacturing
guidelines. This application note is intended to provide additional guidance beyond the
information that is presented in the User Manual. This Application Note is considered a living
document and will be updated as new information is presented.
The modules are designed to meet the needs of a number of commercial and industrial
applications. They are easy to manufacture and conform to current automated manufacturing
processes.
8.2 Shipping
Modules are shipped in ESD
(Electrostatic Discharge) safe trays that
can be loaded into most
manufacturers pick and place
machines. Layouts of the trays are
provided in Figure 8-1.
Figure 8-1: BL600 Shipping Tray Details
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8.3 Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured, including
reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the
appropriate solder paste and to ensure oven temperatures during reflow meet the requirements
of the solder paste. Laird Technologies’ surface mount modules conform to J-STD-020D1
standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 8-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 9.
Table 9: Recommended Maximum and minimum temperatures
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
1~3
°C / Sec
Temperature Decrease rate (goal)
2-4
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
70
Sec
Flux Soak Period (Max)
120
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
70
Sec
Time Above Liquidous (min)
50
Sec
Time In Target Reflow Range (goal)
30
Sec
Time At Absolute Peak (max)
Sec
Liquidous Temperature (SAC305)
218
°C
Lower Target Reflow Temperature
240
°C
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Specification
Value
Unit
Upper Target Reflow Temperature
250
°C
Absolute Peak Temperature
260
°C
FCC AND IC REGULATORY STATMENTS
Model
US/FCC
CANADA/IC
BL600-SA
PI4BL600
1931B-BL600
BL600-SC
PI4BL600
1931B-BL600
BL600-ST
PI4BL600T
1931B-BL600T
Important:
The BL600-ST holds a limited
modular approval for the U.S and Canada markets. To ensure regulatory
compliance when integrating the BL600-ST into a host device, it is necessary to
follow the design implementation requirements in this manual so the BL600-ST
modular certification can carry over to the host device. If these requirements
cannot be met, the OEM will need to either seek a new FCC/ IC approval for their
device or seek a Class 2 Permissive Change through Laird Technologies which adds
the new antenna layout to the BL600-St approval. Contact Laird Technologies for
further guidance.
The BL600-SA and BL600-SC hold full modular approvals. The OEM must follow the regulatory
guidelines and warnings listed below to inherit the modular approval.
PART #
FORM FACTOR
TX OUTPUT
ANTENNA
BL600-SA-XX
Surface Mount
4dBm
Ceramic
BL600-SC-XX
Surface Mount
4dBm
IPEX MHF4
BL600-ST-XX
Surface Mount
4dBm
Trace Pad
*Last two slots "XX" in Part # are used for production firmware release changes. Can be values
01-99, aa-zz
The BL600 family has been designed to operate with the antennas listed below with a maximum
gain of 2.21 dBi. The required antenna impedance is 50 ohms.
Item
Part Number
Mfg.
Type
Gain (dBi)
Model
ACX
Ceramic
BL600-SA
AT5020-E3R0HBANT/LF
EDA-8709-2G4C1-B27-CY MAG. Layers
Dipole
2.0
BL600-SC
PCA-4606-2G4C1-A33-CY MAG. Layers
Dipole
2.21
BL600-SC
EDA-8709-2G4R2-A40-CY
Dipole
2.0
BL600-ST
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MAG. Layers
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Note:
The OEM is free to choose another vendor’s antenna of like type and equal or lesser
gain as an antenna appearing in the table and still maintain compliance. Reference
FCC Part 15.204(c)(4) for further information on this topic.
To reduce potential radio interference to other users, the antenna type and gain should
be chosen so that the equivalent isotropically radiated power (EIRP) is not more than
that permitted for successful communication.
9.1 Power Exposure Information
FCC RF Exposure Statement:
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment.
End users must follow the specific operating instructions for satisfying RF exposure compliance.
This transceiver must not be co-located or operating in conjunction with any other antenna,
transmitter, or external amplifiers.
9.2 OEM Responsibilities
WARNING:
The OEM must ensure that FCC
labelling requirements are met. This includes a clearly visible label on the outside of
the OEM enclosure specifying the appropriate Laird Technology FCC identifier for this
product as well as the FCC notice below.
Note: BL600-SA & BL600-SC Contains FCC ID: PI4BL600; Contains transmitter module IC:
1393-BL600
BL600-ST Contains FCC ID: PI4BL600T; Contains transmitter module IC:1931B-BL600T
The enclosed device complies with Part 15 of the FCC Rules and Industry Canada
License Exempt RSS Standard(s). Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) This device must accept any
interference received, including interference that may cause undesired operation
Label and text information should be in a size of type large enough to be readily legible,
consistent with the dimensions of the equipment and the label. However, the type size for the text
is not required to be larger than eight point.
CAUTION: The OEM should have their device which incorporates the BL600 tested by a qualified
test house to verify compliance with FCC Part 15 Subpart B limits for unintentional
radiators.
CAUTION: Any changes or modifications not expressly approved by Laird Technology could void
the user’s authority to operate the equipment.
FCC Warning:
“THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES AND INDUSTRY CANADA
LICENSE-EXEMPT RSS STANDARD(S). OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS:
(1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY
INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION.
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FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
IMPORTANT NOTE:
Federal Communication Commission (FCC) Radiation Exposure Statement
This EUT is compliance with SAR for general population/uncontrolled exposure limits in ANSI/IEEE
C95.1-1999 and had been tested in accordance with the measurement methods and
procedures specified in OET Bulletin 65 Supplement C.
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
compliance requirement of the end product, which integrates this module.
Under such configuration, the FCC radiation exposure limits set forth for an
population/uncontrolled environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
The end user has to be informed that the FCC radio-frequency exposure guidelines for an
uncontrolled environment can be satisfied. The end user has to also be informed that any
changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then
additional FCC part 15.19 statement is required to be available in the users’ manual: This device
complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference and (2) this device must accept any interference
received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " BL600-SA & BL600-SC
Contains FCC ID: PI4BL600; BL600-ST Contains TX FCC ID: PI4BL600 ". If the size of the end product is
larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the
label: This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept
any interference received, including interference that may cause undesired operation.
Industry Canada (IC) Warning:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject
to the following two conditions: (1) this device may not cause interference, and (2) this device
must accept any interference, including interference that may cause undesired operation of the
device.
French equivalent is:
Le pré sent appareil est conforme aux CNR d'Industrie Canada applicable aux appareils radio
exempts de licence. L'exploitation est autorisé e aux deux conditions suivantes : (1) l'appareil ne
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BL600-Sx
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doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioé lectrique subi, mê me si le brouillage est susceptible d'en compromettre le
fonctionnement.
IC Radiation Exposure Statement
This EUT is compliance with SAR for general population/uncontrolled exposure limits in IC RSS-102
and had been tested in accordance with the measurement methods and procedures specified
in IEEE 1528.
REMARQUE IMPORTANTE
Dé claration IC d'exposition aux radiations
Ce EUT est conforme avec SAR pour la population gé né rale / limites d'exposition non contrô lé e à
IC RSS-102 et a é té testé en conformité avec les mé thodes de mesure et procé dures spé cifié es
dans la norme IEEE 1528.
Modular Approval
OEM integrator is still responsible for testing their end product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC
peripheral requirements, etc.).
Approbation modulaire
OEM inté grateur est toujours responsable de tester leur produit final pour les exigences de
conformité supplé mentaires né cessaires à ce module installé (par exemple, les é missions de
pé riphé riques numé riques, les exigences de pé riphé riques PC, etc.)
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or
co-location with another transmitter), then the Canada authorization is no longer considered
valid and the IC ID can not be used on the final product. In these circumstances, the OEM
integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent ê tre satisfaites (par exemple pour certaines
configurations d'ordinateur portable ou de certaines co-localisation avec un autre é metteur),
l'autorisation du Canada n'est plus considé ré comme valide et l'ID IC ne peut pas ê tre utilisé sur le
produit final. Dans ces circonstances, l'inté grateur OEM sera chargé de ré é valuer le produit final
(y compris l'é metteur) et l'obtention d'une autorisation distincte au Canada.
End Product Labeling
The final end product must be labeled in a visible area with the following: “BL600-SA & BL600-SC
Contains transmitter module IC: 1393-BL600”; “BL600-SA Contains transmitter module IC:
1393-BL600T”
Le produit final doit ê tre é tiqueté dans un endroit visible avec l'inscription suivante: " BL600-SA &
BL600-SC Contient des IC: 1393-BL600"; BL600-ST Contient des IC: 1393-BL600T"
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10 Japan (MIC) Regulatory
The BL600 is approved for use in the Japanese market. The part numbers listed below hold WW
type certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities.
Model
Certificate Number
Antenna
BL600-SA
204-320049
Ceramic
BL600-SC
204-320050
IPEX MHF4
BL600-ST
204-320048
Trace Pad
10.1
Antenna Information
Japan does not allow use with any antennas other than those listed below. Contact a Laird
Technologies representative for more information regarding adding antennas.
Item
Part Number
Mfg.
Type
Gain (dBi)
Model
ACX
Ceramic
BL600-SA
AT5020-E3R0HBANT/LF
EDA-8709-2G4C1-B27-CY MAG. Layers
Dipole
2.0
BL600-SC
PCA-4606-2G4C1-A33-CY MAG. Layers
Dipole
2.21
BL600-SC
EDA-8709-2G4R2-A40-CY
Dipole
2.0
BL600-ST
MAG. Layers
11 CE Regulatory
The BL600-SA / BL600-SC / BL600-ST have been tested for compliance with relevant standards for
the EU market. The BL600-SC and BL600-ST modules were tested with a 2.2 dBi antenna. The OEM
can operate the BL600-SC and BL600-ST modules with any other type of antenna but must ensure
that the gain does not exceed 2.2 dBi to maintain the Laird Technologies approval.
The OEM should consult with a qualified test house before entering their device into an EU
member country to make sure all regulatory requirements have been met for their complete
device.
Reference the Declaration of Conformities listed below for a full list of the standards that the
modules were tested to. Test reports are available upon request.
12 EU DECLARATIONS OF CONFORMITY
12.1
BL600-SA / BL600-SC
Manufacturer:
Laird
Product:
BL600-SA
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EU Directive:
RTTE 1995/5/EC
Conformity Assessment:
Annex IV
Reference standards used for presumption of conformity:
Article
Number:
Requirement
Reference standard(s):
3.1a
Health and Safety
EN 60950-1:2006
3.1b
Protection requirements with EN 301 489-1 V1.8.1
respect to electromagnetic EN 301 489-17 V2.1.1
compatibility
Emissions:
EN55022:2006/A1:2000/A2:2006 (Class B)
Immunity:
EN61000-4-2:1995/A1:1998/A2:2001
EN61000-4-3:2002/A1:2002
3.2
Means of the efficient use of
the radio frequency
spectrum
EN 300 328 V1.7.1 (2006-10)
Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been
carried out and that the above product to which this declaration relates is in conformity with all
the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its
intended purpose.
Place of Issue:
Laird
Saturn House, Mercury Park
Wooburn Green
HP100HH,
United Kingdom
tel: +44 (0)1628 858 940
fax: +44 (0)1628 528 382
Date of Issue:
March 2013
Name of Authorized Person:
Andrew Dobbing, Engineering Manager
Signature:
12.2
BL600-ST
Manufacturer:
Laird
Product:
BL600-ST
EU Directive:
RTTE 1995/5/EC
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BL600-Sx
Single Mode BLE Module
Conformity Assessment:
Annex IV
Reference standards used for presumption of conformity:
Article
Number:
Requirement
Reference standard(s):
3.1a
Health and Safety
EN 60950-1:2006
3.1b
Protection requirements with EN 301 489-1 V1.8.1
respect to electromagnetic EN 301 489-17 V2.1.1
compatibility
Emissions:
EN55022:2006/A1:2000/A2:2006(Class
B)
Immunity:
EN61000-4-2:1995/A1:1998/A2:2001
EN61000-4-3:2002/A1:2002
3.2
Means of the efficient use of
the radio frequency
spectrum
EN 300 328 V1.7.1 (2006-10)
Declaration:
We, Laird, declare under our sole responsibility that the essential radio test suites have been
carried out and that the above product to which this declaration relates is in conformity with all
the applicable essential requirements of Article 3 of the EU Directive 1995/5/EC, when used for its
intended purpose.
Place of Issue:
Laird
Saturn House, Mercury Park
Wooburn Green
HP100HH,
United Kingdom
tel: +44 (0)1628 858 940
fax: +44 (0)1628 528 382
Date of Issue:
March 2013
Name of Authorized Person:
Andrew Dobbing, Engineering Manager
Signature:
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13 MECHANICAL DETAILS
13.1
Mechanical Details
Figure 3: BL600 Mechanical drawings
Module Keep-Out Area: An area of 1.5mm around the module should be reserved as a keep-out
area. No other components should be placed in this area.
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APPLICATION NOTES
1.
Ensure there is no copper in the antenna keep out area on any layers of the host PCB. Also
keep all mounting hardware or any metal clear of the area to prevent affecting proper
antenna radiation.
2.
For best antenna performance, the module should be placed on the edge of the host PCB
and preferably in the corner with the antenna facing the corner.
3.
Antenna keep out area definition comes from the module’s DVK board which was used for
module development and antenna performance evaluation
4.
Ensure no exposed copper under module on host PCB to avoid shorting to test points on
underside of the module.
5.
The user may modify the PCB land pattern dimensions based on their experience and / or
process capability.
14 ORDERING INFORMATION
part number
DESCRIPTION
BL600-SA
Single Mode BLE Module featuring smart BASIC – integrated antenna
BT730-SC
Single Mode BLE Module featuring smart BASIC – IPEX MHF4 connector
BL600-ST
Single Mode BLE Module featuring smart BASIC – Trace Pad
DVK – BL600-SA
Development board with BL600-SA module soldered in place
DVK – BL600-SC
Development board with BL600-SC module soldered in place
DVK – BL600-ST
Development board with BL600-ST module soldered in place
14.1 General Comments
This is a preliminary datasheet. Please check with Laird for the latest information before
commencing a design. If in doubt, ask.
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15 BLUETOOTH SIG APPROVALS
15.1
End Product Listings (EPLs)
This section covers the procedure for generating a new EPL (End Product Listing), on the
Bluetooth SIG website. In the instance of a Bluetooth End Product design, a member can create
their own EPL which will have a direct reference to the original Bluetooth End Product QDID.
BL600 Original End Product listing
Design Name
Owner
QDID number
BL600 Module
Laird Technologies
B020700
Link to listing on the SIG website
BL600 Module listing
The BL600 Module incorporates the following Bluetooth components from Nordic Semiconductor ASA;
Design Name
Owner
QDID number
Link to listing on the SIG website
nRF51XXX_RF
Nordic
B020553
nRF51XXX_RF
B020269
nRF51xxx - S110 link layer listing
B020552
nRF51xxx - S110 host listing
Semiconductor ASA
nRF51xxx -
Nordic
S110 link layer
Semiconductor ASA
nRF51xxx -
Nordic
S110 host
Semiconductor ASA
Assumptions
This procedure assumes that the member is using the original Bluetooth End Product design with
no modifications. The original Bluetooth End Product design includes all the mandatory protocol
and profiles layers. You can generate a new EPL (End Product Listing) by using the web
interface on the Bluetooth SIG website. Figure 4 shows the basic concept of how an EPL is
referenced back to a Bluetooth End Product.
Bluetooth End
Product
EPL Listing 1
EPL Listing 2
Figure 4: EPL referenced back to BT end product
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Single Mode BLE Module
The following link provides an overview of the EPL system:
https://www.bluetooth.org/technical/qualification/eploverview.htm
For a detailed procedure of how to make an EPL entry, please refer to the following SIG
document;
https://www.bluetooth.org/docman/handlers/DownloadDoc.ashx?doc_id=71880
Note:
Alternatively the member can choose to have a new QDID for their own End Product
Design if they do not want any reference the original QDID listing. However it should
be noted that this would incur a listing fee, please refer to FAQ 214 below.
Useful FAQ links
https://www.bluetooth.org/ticketing/view_article.cfm?action=article_comment&aid=275
https://www.bluetooth.org/ticketing/view_article.cfm?action=article_comment&aid=214
https://www.bluetooth.org/ticketing/view_article.cfm?action=article_comment&aid=112
Additional Assistance
Please contact your local sales representative for further assistance
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Single Mode BLE Module
Laird is the world leader in the design and manufacture of customized,
performance-critical products for wireless and other advanced electronics
applications.
Laird Technologies partners with its customers to find solutions for applications in
various industries such as:









Network Equipment
Telecommunications
Data Communications
Automotive Electronics
Computers
Aerospace
Military
Medical Equipment
Consumer Electronics
Laird offers its customers unique product solutions, dedication
to research and development, as well as a seamless network of
manufacturing and customer support facilities across the globe.
global solutions: local support
™
USA: +1.800.492.2320
Europe: +44.1628.858.940
Asia: +852.2923-0610
wirelessinfo@lairdtech.com
www.lairdtech.com/wireless
LWS-UM-BL600-Sx
Copyright © 2013 Laird. All rights reserved.
The information contained in this manual and the accompanying software programs are copyrighted and
all rights are reserved by Laird Technologies, Inc. Laird Technologies, Inc. reserves the right to make
periodic modifications of this product without obligation to notify any person or entity of such revision.
Copying, duplicating, selling, or otherwise distributing any part of this product or accompanying
documentation/software without the prior consent of an authorized representative of Laird Technologies,
Inc. is strictly prohibited.
All brands and product names in this publication are registered trademarks or trademarks of their
respective holders.
This material is preliminary
Information furnished by Laird Technologies in this specification is believed to be accurate. Devices sold by
Laird Technologies are covered by the warranty and patent indemnification provisions appearing in its
Terms of Sale only. Laird Technologies makes no warranty, express, statutory, and implied or by description,
regarding the information set forth herein. Laird Technologies reserves the right to change specifications at
any time and without notice. Laird Technologies’ products are intended for use in normal commercial and
industrial applications. Applications requiring unusual environmental requirements such as military, medical
life-support or life-sustaining equipment are specifically not recommended without additional testing for
such application.
Limited Warranty, Disclaimer, Limitation of Liability
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