Factorytech S1 Function Phone User Manual Turbo Mobile

Factorytech S.A. Function Phone Turbo Mobile

Contents

User manual

                                                                                  Maintenance Manual  1       SSeerrvviiccee  MMaannuuaall
                                                                                  Maintenance Manual  2 Contents   1.1 6004 ................................................................................................................................................. 3 1.2 Basic Feature .................................................................................................................................. 3 1.3 Typical Application ......................................................................................................................... 4 2 Main board explored overview ........................................................................................................ 5 3.Detailed Function Circuit ............................................................................................................... 6 3.1 Download Module .......................................................................................................................... 6 3.2 Audio Module .................................................................................................................................. 6 3.2.1 Micphone Circuit ......................................................................................................................... 6 3.2.2 Receiver Circuit ........................................................................................................................... 7 3.2.3 Speaker Circuit ............................................................................................................................ 7 3.3 FM Module ...................................................................................................................................... 8 3.4 BT Module ....................................................................................................................................... 8 3.5 RF Module ....................................................................................................................................... 9 3.6 LCM Module .................................................................................................................................. 10 3.7 CAMERA MODULE ..................................................................................................................... 10 3.8 KEYPAD interface ........................................................................................................................ 11 4.1 RF Part .......................................................................................................................................... 11 4.2 BB Part .......................................................................................................................................... 11
                                                                                  Maintenance Manual  3 1 6004 Module Features 1.1 6004                   Figure 1.1: 6004 Module 1.2 Basic Feature Table 1-1: Feature Platform MTK6261(M/D) Band GSM850/900,/DCS1800/PCS1900 LCM  CAMERA 30w MCP Module Internal Nor Flash BT Module Internal BT Module FM RX Module Internal FM Module Audio PA Internal Audio (CLASS A\B) SIM Dual SIM I/O Micro USB 5PIN Torch Support Keypad 23 Key
                                                                                  Maintenance Manual  4   1.3 Typical Application                            Figure 1.2: Typical Application with MTK6261 Based platform
                                                                                  Maintenance Manual  5 2 Main board explored overview      Figure 2.1: top        Figure 2.2: bottom
                                                                                  Maintenance Manual  6 3.Detailed Function Circuit   3.1 Download Module           Download through USB port, program select download mode, when connect UTXD1(pin D15 U0RTS) to GND.  Figure 3.1: TP107 D/L Interface 3.2 Audio Module 3.2.1 Micphone Circuit     Figure 3.2: Micphone    If MICPHONE useless ,first you should check R307/R315/R321/R312 ok or not,use multimeter measure connect or not ,if not connect that not good.
                                                                                  Maintenance Manual  7  3.2.2 Receiver Circuit             Figure 3.3: Receiver  The receiver is part with audio output,if receiver defet,it caused by B312/B313. should measure these two parts ok or not 3.2.3 Speaker Circuit extraposition AudiO PA(Class K) ,this module built-in AW8733 IC chipset. If speaker volume issue. first check speaker and R403,R404,then check AW8733 IC                  Figure 3.4: Speaker
                                                                                  Maintenance Manual  8 3.3 FM Module Internal FM module ,this module built-in MTK6261-baseband chipset..     Figure 3.5 FM poor performance of the function, not active , next to match the circuit in normal circumstances, poor FM antenna can lead to poor.  3.4 BT Module Internal BT module ,this module built-in MTK6261-baseband chipset.   Figure 3.6 Bluetooth poor performance of the function, not active ,not find Bluetooth, next to match the circuit in normal circumstances, poor bluetooth antenna can lead to poor.
                                                                                  Maintenance Manual  9 3.5 RF Module RF Front-end Module, type HS8269S, item U601.                   Figure 3.7: RF Front-end Module RF PA is the probability of the most original failure, common faults are: no network, no signal, the signal is weak, can dial emergency calls, etc., first replace the PA amplifier, verify failure existence or not , PA front-end RF signal head can lead to bad signal   HS8269S
                                                                                  Maintenance Manual  10 3.6 LCM Module  Figure 3.8 LCM    LCM interface is a channel connecting the motherboard and the screen, generally will not be bad, only when improper welding operation. Note that control iron welding temperature.  3.7 CAMERA MODULE  Figure 3.9 CAMERA CAMERA interface is connected to the motherboard and the camera position when welding OK, then, will not cause camera failure    Note that the temperature control soldering iron.
                                                                                  Maintenance Manual  11 3.8 KEYPAD interface   Figure 3.10 KEYAPD4 Fault Maintenance   4.1 RF Part Refer to function circuit Part 3.6 4.2 BB Part Refer to function circuit.  Operating Frequency Band (RF):   Modulation mode:   Maximum of Antenna’s Gain:

Navigation menu