Fairchild Semiconductor An 7502 Users Manual Power MOSFET Switching Waveforms
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©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
AN-7502
Power MOSFET Switching Waveforms:
A New Insight
The examination of power MOSFET voltage and current
waveforms during switching transitions reveals that the
device characterization now practiced by industry is inade-
quate. In this Note, device waveforms are explained by con-
sidering the interaction of a vertical JFET driven in cascode
from a lateral MOSFET in combination with the interelec-
trode capacitances. Particular attention is given to the
drain-voltage waveform and its dual-slope nature. The
three terminal capacitances now published by the industry
are shown to be valid only for zero drain current. For cases
where the gate drive is a voltage step generator with inter-
nal fixed resistance, the drain voltage characteristics are
inferred from the gate current drive behavior and compared
to observed waveforms. The nature of the “asymmetric
switching times” is explained.
A waveform family is proposed as a more descriptive and
accurate method of characterization. This new format is a
plot of drain voltage and gate voltage versus normalized
time. A family of curves is presented for a constant load
resistance with VDS varied. Gate drive during switching
transitions is a constant current with voltage compliance
limits of 0 and 10 volts. Time is normalized by the value of
gate driving current. The normalization shows excellent
agreement with data over five orders of magnitude, and is
bounded on one extreme by gate propagation effects and
on the other by transition time self-heating (typically tens of
nanoseconds to hundreds of microseconds).
Device Models
The keystone of an understanding of power MOSFET
switching performance is the realization that the active
device is bimodal and must be described using a model that
accounts for the dual nature. Buried in today’s power MOS-
FET devices is the equivalent of a depletion layer JFET that
contributes significantly to switching speed. Figure 1 is a
cross-sectional view of a typical power MOSFET, with MOS-
FET/JFET symbols superimposed on the structure.
Figure 2 is obtained by taking the lateral MOS and vertical
JFET from this conception and adding all the possible node-
to-node capacitances. Computed values of the six capaci-
tances for a typical device structure suggest that device
behavior may be adequately modeled using only three
capacitors in the manner of Figure 3. This is the model to be
employed for analysis and study.
FIGURE 1. CROSS-SECTION VIEW OF MOSFET SHOWING
EQUIVALENT MOS TRANSISTOR AND JFET
FIGURE 2. MOS TRANSISTOR WITH CASCODE-CONNECTED
JFET AND ALL CAPACITORS
FIGURE 3. FIGURE 2 SIMPLIFIED
Gate Drive: Constant Voltage or
Constant Current
Before moving on to the study of the equivalent circuit states
of the model, a gate-drive forcing function which is easy to
represent, relates to reality, and best illustrates device
behavior must be chosen. The choice may be immediately
narrowed to two:
(1) An instantaneous step voltage with internal resistance R,
Figure 5.
(2) An instantaneous step current with infinite internal resis-
tance, Figure 6.
SOURCE METAL
POLY GATE GLASS GATE OXIDE
0
10 VOLTS
DEPLETION EDGE
40 VOLTS
n+ DRAIN
JFET
n-
MOS
n+ SOURCE
p BODY
p+
GATE
C1
C2
C6
C3
C5
C4
SOURCE
DRAIN
GATE
CGS
CDS
SOURCE
DRAIN
Cx
Application Note October 1999
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©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
FIGURE 4. IDEALIZED POWER MOSFET WAVEFORMS
FIGURE 5. STEP-VOLTAGE FORCING FUNCTION
Power MOSFET devices are highly capacitive in nature;
hence, simple capacitor responses to the forcing functions
offer a good vehicle for comparison. The advantageous
choice is immediately obvious: Figure 6. Voltage/time
responses dominated by capacitance are straight lines
(when constant current is used). The slope of these lines is
proportional to current and inversely proportional to capaci-
tance. Analytically, then, constant current is most conve-
nient. It is quite another matter, however, to build a
bidirectional current drive that is accurate across the many
decades of both current and time required to establish
experimental verification.
Six States
To completely characterize power MOSFET switching wave-
forms, the six states that a device assumes, Figure 6, must
be addressed:
†The term saturated is taken to mean a constant low-voltage drain-source
condition.
FIGURE 6. STEP CURRENT FORCING FUNCTION
Equivalent Circuit
The lumped-parameter model of Figure 3, with the cascode-
connected JFET, can now be reduced to the linear equiva-
lent circuit of Figure 7, and the six device states investigated
from full off to full on.
FIGURE 7. POWER MOSFET EQUIVALENT CIRCUIT
State 1: MOS Off, JFET Off
In a power-MOSFET device, no drain current will flow until
the device’s gate threshold voltage, Vgs(TH), is reached. Dur-
ing this time, the gate’s current drive is only charging the
gate source capacitance. More accurately, IG is charging
CISS (CISS = CGS + CGD, CDS shorted), the capacitance
designation published by the industry.
The current generators, gMVG and gMJVX are open circuits
for zero drain current, and RL is presumed to be so low as to
represent a short circuit (generally true for practical applica-
tions). This is academic however since CGS is very much
larger that CX. The time to reach threshold, then, is simply:
STATE MOS JFET
Turn-on 1 Off Off
Turn-on 2 Active Active
Turn-on 3 Active Saturated†
Turn-off 4 Saturated Saturated†
Turn-off 5 Active Saturated
Turn-off 6 Active Active
12 3 4 5 6
STATES
IG = CONSTANT
GATE VOLTAGE
DRAIN
VOLTAGE
VG(SAT)
VD(SAT)
VDD VGS
VOLTAGE
VT
VDK
TIME
-VG
i(t) v(t)
t
t
-IPK = VG/RO
IPK = VG/RO
VG
C
v(t)
i(t)
TURN ON
v(t) = VG (1 - e)
i(t) = VG e
RO
TURN OFF
v(t) = VG e
i(t) = - VG e
RO
-t/ROC
-t/ROC
-t/ROC
-t/ROC
RO
LEGEND
VGS - Gate Voltage CDS - Drain Source Capacitance
VX- JFET Driving Voltage gM- MOSFET Transconductance
VD- Drain Voltage gMJ - JFET Transconductance
CGS - Gate Source
Capacitance
RL- Drain Load Resistance
CX- MOSFET Feedback
Capacitance
IG- Constant Current Amplitude
T1 =
CISS
Vgs(TH)
IG
IG
-IG
i(t)
TT t
t
-IG
IG
i(t) v(t)
v(t)
C
-VG = C
IGT
TURN ON
v(t) = IGt
C
i(t) = IG, 0 < t < T
TURN OFF
v(t) = 2VG-IGt
C
i(t) = IG, T < t < 2T
GATE
CDS
SOURCE
DRAIN
CX
VGS
IG
gMJ VX
RL
CGS gM VG
VD
VX
Application Note 7502
©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
State 2: MOS ActIve, JFET ActIve
This state graphically illustrates the dramatic influence that
the JFET has on the power MOSFET drain-voltage wave-
form. Instead of having to discharge Cx from VDD to ground,
the lateral MOSFET need only swing VX to ground, a much
smaller voltage thanks to the grounded gate JFET. Since the
interaction of RL with the device capacitances has a second-
order effect on the drain voltage, the equivalent circuit of Fig-
ure 7 predicts a drain voltage change of:
dVG/dt = gMRLlG/[CGS + CX(1 + gM/gMJ)]
In all but the smallest power-MOSFET devices, Cx is several
thousand picofarads and gM/gMJ is of the order of 3:1.
Power-MOSFET devices exhibit a high dVD/dt switching rate
because of the cascode-connected JFET, not because
CRSS (CRSS = CGD) is a small value, as zero-drain-current
data sheet capacitance values might lead one to believe. If
CRSS were, in actuality, small, long drain voltage tails would
not exist. The tail response is a direct result of JFET satura-
tion. In order to delineate the transition from state 2 to state
3, a drain voltage at which the transition occurs must be
defined. VDK is the knee voltage at which linear extrapola-
tions of drain-voltage slopes intersect. The time duration of
state 2 is:
t2(t6) = (VDD - VDK)[CGS + CX(1 + gM/gMJ)]/gMRLIG
State 3: MOS Active, JFET Saturated
When the JFET saturates, the gMJVX current generator
becomes a short circuit and the equivalent circuit predicts:
dVD/dt = gMRLIG/[CGS + CX(1 + gMRL)]
This is the Miller effect so often referred to in older texts that
describe the behavior of grounded-cathode vacuum-tube
amplifier circuits. Allowing for the fact that 1 + gMRL is
approximately equal to gMRL and CX(1 + gMRL) is very
much larger than CGS, the expression for drain-voltage tail
time is:
t3(t5) = (VDK - VD(SAT))Cx/lG
State 4: MOS Saturated, JFET Saturated (Turn-Off)
In this state, in addition to gMJVX being shorted, the gMVG cur-
rent generator is shorted, and IG is occupied with charging CX
and CGS, in parallel, from the peak value of VG to VG(SAT). The
time required for this is:
t4 = (VG - VG(SAT))(CGS + Cx)/IG
Since a value for CGS may be measured independently of
switching time, the method described is the simplest way of
determining CX.
On turn-off, the state time equations are equally applicable,
but in reverse order (states 5 and 6); see the idealized wave-
form of Figure 4.
Experimental Verification
The four switching states just analyzed indicate that for a
given device, all four switching state times are inversely pro-
portional to the magnitude of the gate drive current. Figure 8
illustrates the switching performance of a typical power
MOSFET across three decades of gate drive current and
time. In each case the data slope is almost a perfect -1.
A New Device Characterization
Figure 8 could not be a reasonable device data sheet pre-
sentation because it does not give the designer any informa-
tion on a typical value for CX, nor does it convey how VDK,
gM, gM/gMJ, and VG(sat) vary with drain current. What would
be of enormous value to the designer is a plot of VD(t), VG(t)
for selected values of VDD and ID within device ratings.
A reasonable characterization would be as follows:
1. The x axis would be normalized in terms of gate current drive.
2. The y axis would be normalized in terms of percent maximum rated
BVDSS (0 to 100%).
3. RL = BVDSS/ID(max) would define the drain load resistance.
4. Four plots of VD(t), VG(t) at 100%, 75%, 50%, and 25% BVDSS(max)
would be shown.
FIGURE 8. CONSTANT GATE CURRENT SWITCHING TIME
Figure 9 is such a plot for the RFM15N15 power MOSFET.
With such a plot, a designer can estimate device switching
performance under any resistive gate/drain conditions.
10
1
0.1
0.01 1 10 100 1000
RFM15N15
VDD = 75V
ID
RO
VG
= 7.5A
= ∞ Ω
= 10V
(t) - MICROSECONDS
(IG) - MILLIAMPERES
DATA
tD(OFF)
tR
tF
tD(ON)
THEORY
Application Note 7502
©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
FIGURE 9. NORMALIZED RFM15N15 SWITCHING WAVE-
FORMS FOR CANSTANT GATE-CURRENT DRIVE.
Step-Voltage Gate Drive
The majority of power MOSFET applications employ a step
gate-voltage input with a finite source resistance RO. Often
RO for turn-on is not the same as RO for turn-off. How can
switching times for these situations be estimated using the
switching characterization curves just described? The analy-
sis for resistive step voltage inputs, which is complex
because the gate current is no longer constrained to be con-
stant, but is a function of device gate-voltage response, is
covered in Appendix A. (A second, shorter appendix, B, has
been added to illustrate the estimation of RO for some practi-
cal gate drive circuits.) Table 1 summarizes the common
switching equations, and indicates the appropriate 1G to be
used in each state for relating step voltage drives to the char-
acterization curves.
Experimental Verification
Since the switching equations for step currents and voltages
differ only by gate-current magnitudes for the same device
type, one would expect a plot of switching time versus 1/RO
to be of the same form as those obtained for a step current
drive. This is exactly the case, as Figure 10 is merely a vari-
ation of Figure 8. Using the relationships of Table 1, the
observed differences between Figures 7 and 9 can be pin-
pointed. The two sets of experimental curves confirm that,
on the basis of the short-circuit drive current VG/RO equal-
ling the constant IG, tD(on), tR, tD(off), and tF will all be
longer, as predicted by the ratios of the gate drive currents of
Table 1. Notice also that tR, tF switching symmetry is dis-
rupted by the use of a step voltage with source resistance
RO. For states 2 and 6 the time ratio is:
100
75
50
25
0
20IT/IG40IT/IG60IT/IG80IT/IG
RFM15N15
IT = 1mA
VG = 10 VOLTS
RL = VDSS/ID(RMS)
% RATES VDSS
TIME - microseconds
TABLE 1. COMMON SWITCHING EQUATIONS
T
U
R
N
O
N
CONSTANT CURRENT STATE 1: MOS OFF, JFET OFF CONSTANT VOLTAGE
t = CISS VGS(TH) t = RO CISS In [1]
IG[1 - VGS(TH)/VG]
IG = ITSTATE 2: ACTIVE, ACTIVE IG = (VG - VGS(TH))/RO
t = [VDD - VDK] [CGS + Cx (1 + gM/gMJ)]
gMRLIG
IG = ITSTATE 3: ACTIVE, SATURATED IG = (VG - VG(SAT))/RO
t = (VDK - VD(SAT))CX
IG
T
U
R
N
O
F
F
IG = ITSTATE 4: SATURATED, SATURATED IG = -VG/RO
t = (CGS + CX)(VG - VG(SAT))t = RO(CGS + CX) In (VG/VG(SAT))
IG
IG = ITSTATE 5: ACTIVE, SATURATED IG = (VG - VG(SAT))/RO
t = (VDK - VD(SAT))CX
IG
IG = ITSTATE 6: ACTIVE, ACTIVE IG = (VG - VG(SAT))/RO
t = [VDD - VDK] [CGS + CX (1 + gM/gMJ)]
gMRLIG
Application Note 7502
©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
Experimental Verification
Since the switching equations for step currents and voltages
differ only by gate-current magnitudes for the same device
type, one would expect a plot of switching time versus 1/RO
to be of the same form as those obtained for a step current
drive. This is exactly the case, as Figure 10 is merely a vari-
ation of Figure 8. Using the relationships of Table 1, the
observed differences between Figures 7 and 9 can be pin-
pointed. The two sets of experimental curves confirm that,
on the basis of the short-circuit drive current VG/RO equal-
ling the constant IG, tD(on), tR, tD(off), and tF will all be
longer, as predicted by the ratios of the gate drive currents of
Table 1. Notice also that tR, tF switching symmetry is dis-
rupted by the use of a step voltage with source resistance
RO. For states 2 and 6 the time ratio is:
For states 3 and 5 the time ratio is:
Utilization of available maximum gate drive voltage and cur-
rent can be optimized for fastest power MOSFET switching
speed through the use of constant-current gate drive at the
expense of increased gate-drive circuit complexity.
FIGURE 10. CONSTANT GATE VOLTAGE SWITCHING TIME
Using the Characterization Curve,
Figure 9
To estimate the switching times for an RFM15N15 power
MOSFET under the conditions VG = 10V, VDD = 75V, RO =
100 ohms, and RL = 10 ohms, precedes as follows:
State 1: MOS Off, JFET Off
This time can be estimated without recourse to the curves
State 2 & 6: MOS Active, JFET Active
State 3: MOS Active, JFET Saturated
State 4: MOS Saturated, JFET Saturated
State 5: MOS Active, JFET Saturated
Figure 11 shows RFM15N15 waveforms using the conditions
specified in the example.
FIGURE 11. STEP GATE VOLTAGE INPUT TO AN RFM15N15
tTURN-ON =VG(SAT)
tTURN-OFF VG - VGS(TH)
tTURN-ON =VG(SAT)
tTURN-OFF VG - VG(SAT)
10
1
0.1
0.01
10-4 10-3 10-2 10-1
DATA
tD(OFF)
tR
tF
tD(ON)
(t) - MICROSECONDS
THEORY
1/RO
RFM15N15
VDD = 75V
ID
VG
= 7.5A
= 10V
t = 100(1200 x 10-12) ln [1/(1 - 4/10)]
t = 61 ns
IG = (10 - 4)/100 = 60mA
t = (curve divisions) x IT µs=9= 150ns
60 60
IG = (10 - 7)/100 = 30mA
t = (curve divisions) x IT µs=14 = 467ns
30 30
CGS + Cx= (gate voltage slope)(test current)
= (1.5 x 10-6s/5 volts)(10mA)
= 3000pF
t = 100(3000 x 10-12) ln [10/6.6]
t = 125ns
IG = 6.6/100 = 66mA
t = (curve divisions) x IT µs=8= 121ns
66 66
STATE CALCULATED
TIME MEASURED
TIME RATIO
(tC, ns) (tM, ns) (tC/tM)
161 60 1.02
2 + 3 617 670 0.92
4125 137 0.91
5 + 6 271 375 0.72
TIME - MICROSECONDS
DRAIN VOLTAGE - VOLTS
RFM15N15
VDD = 75 VOLTS
RL = 10 OHMS
VG = 10 VOLTS
RO = 100 OHMS
VD
VGS
0
75
01.53
Application Note 7502
©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
For peak gate voltages other than 10 volts, and load resis-
tances other than BVDSS/ID(MAX), the equations of Table 1
may be used in conjunction with slope estimates from the
characterization curves for CX and CGS + CX(1 + gM/gMJ) at
the appropriate drain-current level.
Characterization-Curve Limits
The switching-time range over which the characterization can be
applied is very impressive. For gate currents of the order of
microamperes, device dissipation is the limiting factor. For gate
currents of the order of amperes, the device response will be
slowed by gate propagation delay. This delay, of course,
degrades the linear switching relationship to gate current. How-
ever, as Figure 12 graphically shows, the characterization is valid
across five decades of gate current and switching time, allowing
all but a very few switching applications to be described by the
characterization curves of Figure 9.
FIGURE 12. FIVE DECADES OF LINEAR RESPONSE
Conclusions
The viability of the proposed characterization curves using con-
stant current has been demonstrated and the limits of applica-
tion defined. The existence of a vertical JFET in a power
MOSFET makes data-sheet capacitances of little use for esti-
mating switching times. The classical method of defining
switching time by 10% and 90% is a poor representation for
power MOSFETs because of the dual-slope nature of the drain
waveforms. Switching influences are masked because the 10%
level is controlled by one mechanism and the 90% level by
another. Device comparisons based on the classical switching
definition can be very misleading.
Appendix A - Analysis for Resistive Step
Voltage Inputs
Step Voltage Gate Drive
To obtain the necessary relationships, six device switching
states must be examined using the same device equivalent
circuit as was used for the constant-gate-current case, but
with the forcing function replaced wIth a step voltage with
internal resistance RO, Figure A-1.
FIGURE A-1. POWER MOSFET EQUIVALENT CIRCUIT
State 1: Mos Off, JFET Off
As before, both current generators are open circuits, reducing
the equivalent circuit to simply charging CISS through RO.
State 2: Mos Active, JFET Active
Before proceeding, it is wise to examine an actual device
response and make use of available simplifications. Figure A-2
shows iG(t) and iD(t) for a typical power MOSFET driven by a
step gate voltage. For truly resistive switching, realize that these
waveforms are only mirror images of their voltage counterparts
vG(t) and vD(t). Using Figure A-2, applicable gate currents for
each of the device states may be listed.
FIGURE A-2. iG(t) AND iD(t) FOR A TYPICAL POWER MOSFET
DRIVEN BY A STEP GATE VOLTAGE
104
102
100
10-2
100102104
RFM15N15
tD(OFF)
tR
tF
tD(ON)
GATE CURRENT (IG) - MICROAMPERES
TIME(t) - MICROSECONDS
103
101
10-1
101103105106
LEGEND
VGS - Gate Voltage CDS - Drain Source Capacitance
VX- JFET Driving Voltage gM- MOSFET Transconductance
VD- Drain Voltage gMJ - JFET Transconductance
CGS - Gate Source
Capacitance
RL- Drain Load Resistance
CX- MOSFET Feedback
Capacitance
IG- Constant Current Amplitude
t = ROCISSIn(1/(1 - VGS(TH)/VG)]
GATE
CDS
SOURCE
DRAIN
CX
VGS
VG
gMJ VX
RL
CGS gM VG
VD
VX
RO
IPK1
IPK2
IPK3
IPK4 IPK5
IPK6
CURRENT
TIME
iD(t)
iG(t)
Application Note 7502
©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
Turn-On
State 1: MOS Off, JFET Off
IPK1 = VG/RO
State 2: MOS Active, JFET Active
IPK2 = (VG - VGS(TH))/RO
State 3: MOS Active, JFET Saturated
IPK3 = (VG - VG(SAT))/RO
Turn-Off
State 4: MOS Saturated, JFET Saturated
IPK4 = VG/RO
State 5: MOS Active, JFET Saturated
IPK5 = VG(SAT)/RO
State 6: MOS Active, JFET Active
IPK6 = VG(SAT)/RO
The equivalent circuit of Figure A-1 predicts that:
dVD/dt = (-gMRL(VG - VGS(TH))e-t/T1) /T1
where T1 = ROCGS + (1 + gM/gMJ)ROCX
Note that gMRL(VG - VGS(TH)) is usually an order of magnitude
greater than VDD, indicating that the drain voltage is discharg-
ing toward a very large negative value. The device operation,
then, is on the early, almost linear, portion of the exponential,
where e-t/T1 approximates unity. The drain current of Figure A-
2, and hence the drain voltage, does indeed exhibit a linear
decrease with time.
Thus, for state 2:
where IPK2 = (VG - VGS(TH))/RO
State 3: Mos Active, JFET Saturated
Because of the Miller effect, the gate voltage and, hence, the
gate current, is almost constant during the tail time. The
equivalent circuit then predicts:
State 4: Mos Saturated, JFET Saturated (Turn-off)
Both equivalent-circuit generators are short circuits, and the
gate drive is discharging CX in parallel with CGS through RO.
t = RO(CGS + CX) ln[VG/VG(SAT)]
IPK4 = VG/RO
State 5: Mos Active, JFET Saturated
The JFET current generator VxgmJ, is operative.
IPK5 = VG(SAT)/RO
State 6: Mos Active, JFET Active
The Miller effect is now reduced by the activation of VGgMJ,
and the equivalent circuit predicts:
IPAK6 = VG(SAT)/RO
Appendix B - Estimating RO for Some
Typical Gate-Drive Circuits
Case 1: Typical Pulse-Generator Drive, Figure B-1
FIGURE B-1. TYPICAL PULSE-GENERATOR DRIVE CIRCUIT
Turn-On and Turn-Off
RO = RGENRGS/(RGEN + RGS)
For the typical case where RGEN = 50Ω, and a coaxial-cable
termination of 50 ohms, RO = 25Ω and VG = VGEN/2.
Case 2: Voltage-Follower Gate Drive, Figure B-2
FIGURE B-2. VOLTAGE-FOLLOWER GATE-DRIVE CIRCUIT
Turn-On
RO is approximately equal to 1/gM for RS very much
greater than 1/gM.
gm = transconductance of driving MOSFET transistor.
Turn Off
RO = RS
t = [VDD - VDK][CGS + CX(1 + gM/gMJ)]
gMRL IPK2
dVD=gMRLlG=lG
dt CGS + (1 + gMRL)CXCX
lG = IPK3 = (VG - VG(SAT))/RO
and t = (VDK - VD[SAT])Cx
IPK3
t = [VDK - VD[SAT])CX
IPK5
t = [VDD - VDK][CGS + CX(1 + gM/gMJ)]
gMRL IPAK6
VGEN RGEN VG
VDD
RL
RGS
+
RS
VDD
RL
Application Note 7502
©2002 Fairchild Semiconductor Corporation Application Note 7502 Rev. A1
Case 3 :Common-Source Gate Drive, Figure B-3
FIGURE B-3. COMMON-SOURCE GATE-DRIVE CIRCUIT
Turn-On
RO = RD
(drain-to-ground capacitance of driving device adds to
CGS of driven MOSFET.)
Turn Off
RO = rDS(ON) of driving MOSFET when
RD is very much greater than RDS(ON)
+
RDVDD
RL
10V
0V
Application Note 7502
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user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
MICROWIRE
OPTOLOGIC
OPTOPLANAR
PACMAN
POP
Power247
PowerTrench
QFET
QS
QT Optoelectronics
Quiet Series
FAST
FASTr
FRFET
GlobalOptoisolator
GTO
HiSeC
I2C
ISOPLANAR
LittleFET
MicroFET
MicroPak
Rev. H5
â
ACEx
Bottomless
CoolFET
CROSSVOLT
DenseTrench
DOME
EcoSPARK
E2CMOSTM
EnSignaTM
FACT
FACT Quiet Series
SILENT SWITCHER
SMART START
SPM
STAR*POWER
Stealth
SuperSOT-3
SuperSOT-6
SuperSOT-8
SyncFET
TinyLogic
TruTranslation
ââ
â
STAR*POWER is used under license
UHC
UltraFET
VCX
â