Fibocom Wireless L811 LTE Module User Manual ng

Fibocom Wireless Inc. LTE Module ng

User Manual

L811-EA Series ModuleHardware User ManualVersion：V1.0.2Date：2015.09.08
L811-EA Module Hardware User Manual Page2of43CopyrightCopyright ©2015 Fibocom Wireless Inc . All rights reserved.Without the prior written permission of the copyright holder, any company or individual is prohibited toexcerpt, copy any part of or the entire document, or transmit the document in any form.AttentionThe document is subject to update from time to time owing to the product version upgrade or otherreasons. Unless otherwise specified, the document only serves as the user guide. All the statements,information and suggestions contained in the document do not constitute any explicit or implicitguarantee.TrademarkThe trademark is registered and owned by Fibocom Wireless Inc.VersionsVersionDateRemarksV1.0.02014-10-17Initial Version.V1.0.12015-08-25Update the logo.V1.0.22015-09-08Modify descriptions for power on and RTC timing.
L811-EA Module Hardware User Manual Page3of43Applicable Model ListNo.TypeNote1L811-EAThe supported frequency bands of L811-EA wireless modules as shown in the following tables:Model No.LTE FDDWCDMAGSM/GPRS/EDGEL811-EABand1,2,3,4,5,7,8,13,17,18,19,20Band 1,2,4,5,8850/900/1800/1900 MHz
L811-EA Module Hardware User Manual Page4of43Content1 Foreword.................................................................................................................................................................... 61.1 Introduction.....................................................................................................................................................61.2 Reference Standard......................................................................................................................................62 Product Overview..................................................................................................................................................... 82.1 Description......................................................................................................................................................82.2 Specifications................................................................................................................................................. 82.3 Appearance.................................................................................................................................................. 133 Structure...................................................................................................................................................................143.1 Dimension Diagram of Structure.............................................................................................................. 143.2 Recommended PCB Layout Design........................................................................................................ 154 Hardware Introduction........................................................................................................................................... 174.1 Pin Definition................................................................................................................................................ 174.1.1 Pin Map............................................................................................................................................. 174.1.2 Description of Pins...........................................................................................................................185 Hardware Interface.................................................................................................................................................245.1 Power Interface........................................................................................................................................... 245.1.1 Power Supply................................................................................................................................... 245.1.2 VSD2_1V8........................................................................................................................................ 245.1.3 VRTC................................................................................................................................................. 255.2 Power on/off and Reset Signal................................................................................................................. 265.2.1 Power on /off Signal........................................................................................................................ 265.2.1.1 Power on................................................................................................................................265.2.1.2 Power off................................................................................................................................275.2.1.3 The Recommended Design of Power on/off................................................................... 285.2.2 RESET Signal.................................................................................................................................. 285.3 Status Indicating Signals........................................................................................................................... 295.3.1 CORE DUMP Indicating................................................................................................................. 295.3.2 LPG Signal........................................................................................................................................295.3.3 WAKEUP_HOST Signal................................................................................................................. 305.3.4 PA_BLANKING Signal....................................................................................................................305.4 Interrupt Control Signal.............................................................................................................................. 315.4.1 WAKE_UP Signal............................................................................................................................ 31
L811-EA Module Hardware User Manual Page5of435.4.2 W_DISABLE# Signal.......................................................................................................................315.4.3 Android & Linux / Win8 & Win10 Dual Systems Switch Control Signal................................. 315.5 USB Interface...............................................................................................................................................325.5.1 USB Interface Definition................................................................................................................. 325.5.2 USB Interface Application.............................................................................................................. 335.6 UART Interface............................................................................................................................................335.6.1 UART Interface Description........................................................................................................... 335.6.2 UART Interface Application............................................................................................................345.7 USIM Interface.............................................................................................................................................345.7.1 USIM Pins......................................................................................................................................... 345.7.2 USIM Interface Design....................................................................................................................355.7.2.1 “Normally Closed” SIM Card Circuit Design.................................................................... 355.7.2.2 “Normally Open” SIM Circuit Design.................................................................................355.7.3 Highlights for USIM Design............................................................................................................365.7.4 USIM Hot-Plugging..........................................................................................................................365.7.4.1 Hardware Connection..........................................................................................................365.7.4.2 Software Setup..................................................................................................................... 375.8 Digital Audio................................................................................................................................................. 375.8.1 I2S Interface..................................................................................................................................... 375.8.2 PCM Mode Description...................................................................................................................385.9 I2C Interface.................................................................................................................................................385.10 Clock Interface.......................................................................................................................................... 395.11 Other Interfaces.........................................................................................................................................396 Electrical and Environmental Characteristic...................................................................................................... 406.1 Electrical Characteristic............................................................................................................................. 406.2 Environmental Characteristic.................................................................................................................... 407 RF Interface............................................................................................................................................................. 417.1 RF PCB Design........................................................................................................................................... 417.1.1 Wire Routing Principle.................................................................................................................... 417.1.2 Impedance........................................................................................................................................ 427.2 Antenna Design........................................................................................................................................... 427.2.1 Main Antenna Design Requirements........................................................................................... 42
L811-EA Module Hardware User Manual Page6of431 Foreword1.1 IntroductionThe document describes the electrical characteristics, RF performance, dimensions and applicationenvironment, etc. of L811-EA wireless modules. With the assistance of the document and otherinstructions, developers can quickly understand the performance of L811-EA wireless modules anddevelop products.1.2 Reference StandardThe design of the product complies with the following standards ：3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobileradio interface3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cellreselection in connected mode3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;Stage 23GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 23GPP TS 23.038 -v6.1.0: Alphabets and language - specific information3GPP TS 21.111 -v6.3.0: USIM and IC card requirements3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber IdentityModule - Mobile Equipment (SIM-ME) interface3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformancespecification3GPP TS 22.004 -v6.0.0: General on supplementary services
L811-EA Module Hardware User Manual Page7of433GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 23GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD)3GPP TS 36.101V9.18.0: User Equipment (UE) radio transmission and reception3GPP TS 36.104V9.13.0: Base Station (BS) radio transmission and reception3GPP TS 36.106V9.4.0: FDD Repeater radio transmission and reception3GPP TS 36.113V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC)3GPP TS 36.124V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminalsand ancillary equipment3GPP TS 36.133V9.18.0:Requirements for support of radio resource management3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for theFDD UE3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission andreception; Part 1: Conformance testing3GPP TS 34.122V5.7.0: Technical Specification Group Radio Access Network; Radio transmissionand reception (TDD)3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+);Radio transmissionand reception
L811-EA Module Hardware User Manual Page8of432 Product Overview2.1 DescriptionThe L811-EA modules are highly integrated wireless communication LTE modules, which support threemodes and twelve bands, including the 4G/3G/2G mainstream modes (LTE FDD/WCDMA/GSM) forEurope and North America and cover a wide range of frequency bands. The modules support the cellularcommunication networks of Europe, North America as well as the mobile operators in some regions ofAsia.2.2 SpecificationsSpecificationsOperatingFrequency RangeL811-EALTE FDD: Band 1,2,3,4,5,7,8,13,17,18,19,20WCDMA HSPA+: Band 1,2,4,5,8GSM/GPRS/EDGE: 850/900/1800/1900MHzData RateLTE FDDCategory 4 (150Mbps DL,50Mbps UL)UMTS/HSDPA/HSUPA3GPP Rel.8DC-HSDPA 42Mbps(Cat24)HSUPA 11.5Mbps(Cat7)GSM 3GPP release 7EDGE (E-GPRS) multi-slot class 33(296kbps DL，236.8kbps UL)GPRS multi-slot class 33 (107kbps DL，85.6kbps UL)GPSNot supported.PhysicalCharacteristicsDimension：32 x 26 x 2.0mmInterface：LGAWeight：4 gramsEnvironmentOperating Temperature：-40℃~ +85℃Storage Temperature：-40℃~ +85℃
L811-EA Module Hardware User Manual Page9of43PerformanceOperating VoltageVoltage: 3.3V ~ 4.4V Normal: 3.8VCurrentConsumption(Typical Value)4mA (Sleep Mode)LTE FDD DATA：700mAWCDMA Talk：570mA2G Talk：250mA (GSM PCL5)InterfacesRF InterfaceAntenna：Main x1，Diversity x1Function InterfaceUSB 2.0 x1，Multiple Profiles over USBSIM Support，I2C Support，I2S/PCM SupportGPIO，ClockData FeaturesProtocol StackEmbedded TCP/IP and UDP/IP protocol stackEDGEMulti-slot class 33 (5 Down; 4 Up; 6 Total)Coding Scheme MCS1~9GPRSMulti-slot class 33 (5 Down; 4 Up; 6 Total)Coding Scheme MCS1~4CSDUMTS(14.4kbps)，GSM(9.6kbps)USSDSupportedSMSMO / MT Text and PDU modesCell broadcastAudioDigital AudioVoice Coders: EFR/HR/FR/AMRVoLTE（not supported yet）Audio ControlGain ControlCharacter SetIRA，GSM，UCS2，HEX
L811-EA Module Hardware User Manual Page10of43AT CommandsFIBOCOM proprietary AT commandsGSM 07.05GSM 07.07AccessoriesFirmware Loader Tool over USB/UARTUser ManualDeveloper KitNote:1. Please make sure the temperature for device will not be higher than 85˚C.2. The minimum distance between the user and/or any bystander and the radiating structure of thetransmitter is 20cm.3. Assessment of compliance of the product with the requirements relating to the Radio andTelecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed byPHOENIX TESTLAB (Notified Body No.0700),
L811-EA Module Hardware User Manual Page11of43Note:Federal Communications Commission (FCC) Declaration of ConformityThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and (2) this device must accept any interferencereceived, including interference that may cause undesired operation.This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15of the FCC Rules. These limits are designed to provide reasonable protection against harmfulinterference in a residential installation. This equipment generates, uses and can radiated radio frequencyenergy and, if not installed and used in accordance with the instructions, may cause harmful interferenceto radio communications. However, there is no guarantee that interference will not occur in a particularinstallation If this equipment does cause harmful interference to radio or television reception, which canbe determined by turning the equipment off and on, the user is encouraged to try to correct theinterference by one or more of the following measures:-Reorient or relocate the receiving antenna.-Increase the separation between the equipment and receiver.-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.-Consult the dealer or an experienced radio/TV technician for help.FCC Caution:Changes or modifications not expressly approved by the party responsible for compliance could void theuser‘s authority to operate the equipment.RF Exposure InformationThis device meets the government’s requirements for exposure to radio waves.This device is designed and manufactured not to exceed the emission limits for exposure to radiofrequency (RF) energy set by the Federal Communications Commission of the U.S. Government.This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. Inorder to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity tothe antenna shall not be less than 20cm (8 inches) during normal operation.IMPORTANT NOTE:This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC
L811-EA Module Hardware User Manual Page12of43compliance requirement of the end product, which integrates this module. 20cm minimum distance has tobe able to be maintained between the antenna and the users for the host this module is integrated into.Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolledenvironment can be satisfied.Any changes or modifications not expressly approved by the manufacturer could void the user's authorityto operate this equipment.USERS MANUAL OF THE END PRODUCT:In the users manual of the end product, the end user has to be informed to keep at least 20cm separationwith the antenna while this end product is installed and operated. The end user has to be informed thatthe FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The enduser has to also be informed that any changes or modifications not expressly approved by themanufacturer could void the user's authority to operate this equipment. If the size of the end product issmaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the usersmanual: This device complies with Part 15 of FCC rules. Operation is subject to the following twoconditions: (1) this device may not cause harmful interference and (2) this device must accept anyinterference received, including interference that may cause undesired operation.LABEL OF THE END PRODUCT:The final end product must be labeled in a visible area with the following " Contains TX FCC ID:ZMOL811". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19statement has to also be available on the label: This device complies with Part 15 of FCC rules.Operation is subject to the following two conditions: (1) this device may not cause harmful interferenceand (2) this device must accept any interference received, including interference that may causeundesired operation.
L811-EA Module Hardware User Manual Page13of432.3 AppearanceTop View：Figure 2- 1 Top ViewBottom view:Figure 2- 2 Bottom ViewL811-EA
L811-EA Module Hardware User Manual Page14of433 Structure3.1 Dimension Diagram of StructureFigure 3- 1 Dimension Diagram of Structure
L811-EA Module Hardware User Manual Page15of433.2 Recommended PCB Layout DesignFigure 3- 2 Perspective drawing of top view
L811-EA Module Hardware User Manual Page16of43Figure 3- 3 Structure Diagram of PCB Layout
L811-EA Module Hardware User Manual Page17of434 Hardware Introduction4.1 Pin Definition4.1.1 Pin MapABCDEFGHJKLMN1GNDGNDGNDANT_DIVGNDGNDGNDANT_MAINGNDGNDGND12GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGND23FSYS2_26MRFE_RFFE1_VIOGNDGNDGNDGNDGNDGNDGNDGNDGNDVBATVBAT34CORE_DUMPRFE_RFFE1_SCLKIPC_HOST_WAKEUPGNDGNDGNDVBATVBAT45LPGRFE_RFFE1_SDATAIPC_TRIG_OUTTDOTRST_NVRTC56GNDGNDGNDHW_MON17(TRC_DATA0)TRIG_INVSD2_1V867WAKEUP_HOSTGNDIPC_TRIG_INHW_MON18(TRC_CLK)TMSRESET_N78CLK32KGNDIPC_SLAVE_WAKEUPGNDGNDPWR_ON/OFF#89UART1_TXDGNDGNDHW_MON19(TRC_DATA1)TCKI2S2_WA910UART1_RXDGNDNCHW_MON20(TRC_DATA2)TDII2S2_TX1011VBUSGNDGNDHW_MON21(TRC_DATA3)I2C_SDAI2S2_RX1112USB_DNUSB_HSIC_STRBUSB_HSIC_DATAGNDGNDGNDI2C_SCLI2S2_CLK1213USB_DPNCNCNCNCGNDGNDGNDGNDGNDGNDGNDGND1314NCNCNCNCSIM1_DPSIM1_DNEINT3BODY_SARUART1_RTSUART1_CTSGND1415GNDGNDVSIM1SIM1_RSTSIM1_CLKSIM1_DATASIM1_CDWAKEUPW_DISABLE#PA_BLANKING/TRIG_OUTGND15ABCDEFGHJKLMNFigure 4-2 Pins Definition
L811-EA Module Hardware User Manual Page18of434.1.2 Description of PinsThe logic signal level of L811-EA module is 1.8V.Pin#Pin NameI/OResetValueIdleValueDescriptionPowerN3VBATPIPower inputN4VBATPIPower inputM3VBATPIPower inputM4VBATPIPower inputN5VRTCPOVRTC outputN6VSD2_1V8POVSD2_1V8 outputPOWER_ON/OFF#,RESETN7RESET_NIModule reset input, pull up(100K ohms),1.8VN8POWER_ON/OFF#IModule power on/off signal, pull down (200Kohms),1.8VI2SN9I2S2_WAOPDTI2S LRCK,CMOS 1.8VN10I2S2_TXOPDTI2S data transmit, CMOS 1.8VN11I2S2_RXIPDTI2S data receive, CMOS 1.8VN12I2S2_CLKOPDTI2S serial clock, CMOS 1.8VI2CM11I2C_SDAIOPUPUI2C serial data, pull up(4.7K ohms)CMOS1.8VM12I2C_SCLOPUPUI2C serial clock, pull up(4.7K ohms)CMOS1.8VClockA3FSYS2_26MO26MHz clock output,1.8VA8CLK32KOPDPD32kHz clock output,1.8VSIM1D15VSIM1POSIM1 power supply,1.8V/2.8VE15SIM1_RSTOLSIM1 resetF15SIM1_CLKOLSIM1 clock
L811-EA Module Hardware User Manual Page19of43G15SIM1_DATAIOLSIM1 data, internal 4.7K resistor pull upH15SIM1_CDITSIM1 detect, pull up(390K ohms)CMOS 1.8VF14SIM1_DPIOPDUSB data plus for SIM1 cardG14SIM1_DNIOPDUSB data minus for SIM1 cardUSB2.0A11VBUSPIUSB VBUS SupplyA12USB_DNIOTUSB Data MinusA13USB_DPIOTUSB Data PlusUSB3.0C13NCB13NCC14NCB14NCHSICB12USB_HSIC_STRBIOHigh speed Inter IC clock (not supportednow)C12USB_HSIC_DATAIOHigh speed Inter IC data (not supported now)C4IPC_HOST_WAKEUPOPUHIPC host wakeup (not supported now)C5IPC_TRIG_OUTOPDLIPC trig out (not supported now)C7IPC_TRIG_INIPUPUIPC trig in (not supported now)C8IPC_SLAVE_WAKEUPIPDIPC slave wake up (not supported now)SSICD14NCE14NCD13NCE13NCUART1A9UART1_TXDOPUPPUART1 transmit Data, CMOS 1.8VA10UART1_RXDIPDPUUART1 receive Data, CMOS 1.8VK14UART1_RTSOPUPPUART1 Request To Send, CMOS 1.8V
L811-EA Module Hardware User Manual Page20of43L14UART1_CTSIPUPUUART1 Clear To Send, CMOS 1.8VEINTJ15WAKEUPIPDPUWAKEUP,CMOS 1.8VK15W_DISABLE#IPDPUW_DISABLE#,CMOS 1.8VH14EINT3IPDPUEINT3,CMOS 1.8VJ14BODY_SARIPUPUBODY_SAR,CMOS 1.8VSystem status indicatorA4CORE_DUMPOPDLCore dump indicator, CMOS 1.8VA5LPGOPDLPG,CMOS 1.8VA7WAKEUP_HOSTOPDLWAKEUP_HOST,CMOS 1.8VL15PA_BLANKING/TRIG_OUT(T_OUT1)OPDLPA blanking output/Monitoring Signal Output,CMOS 1.8VADCC10NCJTAGL5TDOOTSerial Data OutM10TDIIPUSerial Data InputM7TMSIPUState machine control signalM9TCKIPDJTAG clock inputM5TRST_NIPDReset/Module enableM6TRIG_INIPDMonitoring Signal Input, CMOS 1.8VMIPI2 TraceL7MIPI2_TRC_CLKOPDPPMIPI2 trace clock, CMOS 1.8VL6MIPI2_TRC_DATA0IOPDPPMIPI2 trace data0,CMOS 1.8VL9MIPI2_TRC_DATA1IOPDPPMIPI2 trace data1,CMOS 1.8VL10MIPI2_TRC_DATA2IOPDPPMIPI2 trace data2,CMOS 1.8VL11MIPI2_TRC_DATA3IOPDPPMIPI2 trace data3,CMOS 1.8VANT TunableB5RFE_RFFE1_SDATAIOPPRFFE1 serial data for tunable ANT,CMOS1.8VB4RFE_RFFE1_SCLKOPPRFFE1 serial clock for tunable ANT,CMOS1.8V
L811-EA Module Hardware User Manual Page21of43B3RFE_RFFE1_VIOPORFFE1 VIO for tunable ANT,1.8VANTJ1ANT_MAINIOMain antennaE1ANT_DIVIDiversity antennaB8GNDGNDB9GNDGNDB10GNDGNDB11GNDGNDC11GNDGNDF13GNDGNDL12GNDGNDM13GNDGNDL13GNDGNDG13GNDGNDH13GNDGNDJ13GNDGNDK13GNDGNDA6GNDGNDB2GNDGNDB6GNDGNDB7GNDGNDC1GNDGNDC2GNDGNDC3GNDGNDC6GNDGNDC9GNDGNDC15GNDGNDD1GNDGNDD2GNDGNDD3GNDGNDD4GNDGND
L811-EA Module Hardware User Manual Page22of43D12GNDGNDE2GNDGNDE3GNDGNDF1GNDGNDF2GNDGNDF3GNDGNDG1GNDGNDG2GNDGNDG3GNDGNDH1GNDGNDH2GNDGNDH3GNDGNDJ2GNDGNDJ3GNDGNDK1GNDGNDK2GNDGNDK3GNDGNDK4GNDGNDK12GNDGNDL1GNDGNDL2GNDGNDL3GNDGNDL4GNDGNDL8GNDGNDM2GNDGNDM8GNDGNDM14GNDGNDN13GNDGNDA1GNDGNDA15GNDGNDN1GNDGND
L811-EA Module Hardware User Manual Page23of43N15GNDGNDTG1GNDGNDTG2GNDGNDTG3GNDGNDTG4GNDGNDTG5GNDGNDTG6GNDGNDTG7GNDGNDTG8GNDGNDTG9GNDGNDTG10GNDGNDTG11GNDGNDTG12GNDGNDTG13GNDGNDTG14GNDGNDTG15GNDGNDTG16GNDGNDH：High Voltage LevelL：Low Voltage LevelPD：Pull-DownPU：Pull-UpT：TristateOD：Open DrainPP：Push-PullNote : The unused pins can be left floating in case of circuit design.
L811-EA Module Hardware User Manual Page24of435 Hardware Interface5.1 Power Interface5.1.1 Power SupplyThe L811-EA module requires a 3.3V - 4.5V DC power supply that capable of supplying maximum GSMemission current which may up to 2A.Input power supply requirements:ParameterMinimum ValueRecommended ValueMaximum ValueUnitVBAT3.33.84.4VImportant notes for the power supply:1. Voltage fluctuation of the power supply should be lower than 200mV.2. VBAT should not lower than 3.3V when the voltage dropping occurs.The filtering capacitors for designing the power supply as shown in the following tables:RecommendedcapacitanceApplicationDescription330uFPower supplyReduce voltage fluctuation during the phone call.For capacitance value, the bigger the better.1uF,100nFDigital signal noiseFilter for the interference caused by clock anddigital signals.39pF,33pF700 /850 /900 MHzFilter for RF interference.18pF,8.2pF,6.8pF1700/1800/1900,2100/2600MHzFilter for RF interference.5.1.2 VSD2_1V8VSD2_1V8 is the power source of the internal digital circuits, it can be also used as the power indicatorand the reference voltage. For circuit design, it can be only used for low current application (<50mA),floating if not used.
L811-EA Module Hardware User Manual Page25of43ParametersMinimum ValueTypical ValueMaximum ValueUnitVSD2_1V81.71351.81.8865VVIH0.7* VSD2_1V81.81.8865VVIL-0.300.3* VSD2_1V8V5.1.3 VRTCVRTC is the power supply for the internal RTC of the module. In order to let RTC work for a certain timewhen lost the VBAT power, as the backup power, it is recommended to add a big capacitor at the VRTCpin.The voltage range of the VRTC as shown in the following tables:ParametersMinimum ValueRecommended ValueMaximum ValueUnitRTC working voltage0.41.81.89VVoltage of VRTCRTC Current Consumption0.4V ~ 1V1 uA1V ~ 1.89V2 uAThe reference design of VRTC circuit shown as follows:Figure 5- 1 VRTC Reference DesignNote:R8 is a current-limiting resistor, used to ensure the VRTC works properly and free from being affectedby peripheral circuits. R8 ≥ 1k Ohm.The current consumption is about 2A when 1.8V VRTC is supplied from the external capacitor.The value of C9 will affect the retaining time of RTC after VBAT is lost. The remaining time of RTCcan be roughly calculated by the following formula:
L811-EA Module Hardware User Manual Page26of43(1.8-1)*C/2 + (1-0.4)*C/1 = 0.4C + 0.6C = 1CEx.When using a 100uF capacitor, the remaining time is 1*100 = 100 Sec.When using a 330uF capacitor, the remaining time is 1*330 = 330 Sec.If the RTC backup power function is not required, the VRTC pin can be left floating.5.2 Power on/off and Reset SignalThe L811-EA module provides two control signals for power on/off and reset functions.Pin definition as shown in the following tables:Pin#Pin NameElectrical LevelDescriptionN8POWER_ON/OFF#CMOS 1.8VPower on/off signalN7RESET_NCMOS 1.8VExternal reset signal input, active low.5.2.1 Power on /off Signal5.2.1.1 Power onAfter the power is applied to the module, pull up the POWER_ON/OFF# signal for at least 20ms then themodule will boot up.The timing sequence diagram as follows:Figure 5- 2 Power on Timing Control DiagramNote :The “>1s” time starts from the external capacitor being charged when the power is applied to the module.If VBAT is already applied to the module then the time can be ignored, and AP(Application Processor)
L811-EA Module Hardware User Manual Page27of43only needs to control the timing of RESET_N and POWER_ON/OFF# signals.5.2.1.2 Power offThe L811-EA module can be turned off by software or hardware control. Software control is preferred fornormal cases, only when software control is not usable, then use the hardware control. By pulling down orfloat the POWER_ON/OFF# signal, the module will be shut down. ①For details as shown in the following tables:Control MethodActionConditionSoftwareAT+CPWROFFNormal control for power off.HardwarePull down or floating thePOWER_ON/OFF#signal.Only used when a hardware exception occurs andthe software control cannot be used.The hardware control description:By pulling down or float the POWER_ON/OFF# signal, the PMU (Power Management Unit) of the modulewill be reset, which results in the state changes from the working state to the shutdown state.The timing sequence diagram as follows:Figure 5- 3 Power off Timing Sequence DiagramNote ①: To safely shut down the module, the RESET_N signal must be pulled down (for at least 100ms)before pulling down the POWER_ON/OFF# signal.
L811-EA Module Hardware User Manual Page28of435.2.1.3 The Recommended Design of Power on/offThe recommended design of POWER_ON/ OFF# signal is as follows:Figure 5- 4 Recommended Design of POWER_ON/OFF# Signal5.2.2 RESET SignalThe L811-EA module supports the external reset function. By controlling the RESET_N signal, the modulewill reset to its initial state. When pulling down the RESET_N signal for 100ms, the module will be resetand restarted. If the module is already turned on and working before the reset, there is no need to controlPOWER_ON/OFF# signal to turn it on. PMU inside the module remains its power during the resetprocedure.Note:The reset signal is very sensitive. It should be kept away from RF interference and well wrapped withground planes in case of PCB layout. It is recommended to add a filter capacitor close to the module. Also,RESET_N signal trace shall neither near the PCB edge nor route on the surface planes to avoid modulefrom reset caused by ESD.The timing sequence requirement as follows:ParameterConditionMinimum ValueTypical ValueMaximum ValueUnitPulse WidthReset71001000msL811-EA
L811-EA Module Hardware User Manual Page29of43Recommended design:Figure 5- 5 Recommended Design of Reset Circuit5.3 Status Indicating SignalsPin#Pin NameI/ODescriptionA4CORE_DUMPOCore Dump IndicatorA5LPGOLPG status IndicatingA7WAKEUP_HOSTOThe module wakes up the host (Application processor).L15PA_BLANKINGOPA Blanking output, external GPS control signal.5.3.1 CORE DUMP IndicatingThe CORE_DUMP signal is used to indicate the mode of the module.StatusModeNormal modeLow levelCore DumpHigh level5.3.2 LPG SignalThe LPG signal timing description as shown in the following tables:Operating ModesLPG signalL811-EA
L811-EA Module Hardware User Manual Page30of43Idle (unregistered)600ms high level and 600ms low levelIdle (registered)75ms high level and 3s low levelVoice communication (Call)Always low levelData communication75ms high level and 75ms low levelSleep (sleep mode)Always high level5.3.3 WAKEUP_HOST SignalThe WAKEUP_HOST signal is used to wake up the host when there are incoming calls, SMS or otherdata requests.StatusWAKEUP_HOST SignalDefaultHigh levelWaking HOST(telephone ringing/SMS/other datarequest)Low level5.3.4 PA_BLANKING SignalThe default is low for the signal. While the module works in GSM frequency band, PA_BLANKING willoutput the pulses that synchronized with the GSM burst timing sequence.Due to the GSM TX may interfere the receiving of the GPS signal, AP can turn off GPS or stop receivingdata from the GPS when it detecting the PA_BLANKING pulses.Operating modesPA_BLANKING SignalDefault modesLow levelGSM TXOutput the pulse signal that synchronize with the GSM burst
L811-EA Module Hardware User Manual Page31of435.4 Interrupt Control SignalThe interrupt control signals as shown in the following tables:Pin#NameI/ODescriptionJ15WAKEUPIWake up the module.K15W_DISABLE#IEnable/Disable RF network.H14EINT3IAndroid & Linux/Win8 & Win10 dualsystems switch.J14BODY_SARIBody SAR detection.5.4.1 WAKE_UP SignalWAKE_UP signal description as shown in the following tables:Module ModeWAKE_UP SignalDescriptionSleepLow levelWake up the module from Sleep to Idle modeHigh levelKeep the module in Sleep modeIdle/CallLow levelKeep the current modeHigh levelThe module will not enter Sleep mode5.4.2 W_DISABLE# SignalThe module provides a hardware signal to enable/disable WWAN RF function, it can be controlled by anAT command also. The module will enter the Airplane mode by disabling RF function.The definition of W_DISABLE# signal as shown in the following tables:5.4.3 Android & Linux / Win8 & Win10 Dual Systems SwitchControl SignalThe L811-EA module supports Android & Linux / Win8 & Win10 dual systems switch by detecting thevoltage level of the interrupt signal EINT3.The function of EINT3 signal as shown in the following tables:No.EINT3FunctionNo.W_DISABLE#Function1LowWWAN disabled, module enters Airplane mode.2HighWWAN enabled, module exits Airplane mode.3FloatingThe WWAN function is defined by the AT command, enabled by default.
L811-EA Module Hardware User Manual Page32of431High/FloatingFor Android or Linux system, the module`s USB ports mapped as 3*ACMports.2LowFor Win8 or Win10 system, the module`s USB port is mapped as a MBIMmode.Description:1. During booting, the implementation of Android & Linux / Win8 & Win10 system change is done bydetecting the level of EINT3 signal. The voltage level of EINT3 should be kept stable during booting.2. After boot up, the implementation of Android & Linux / Win8 & Win10 system change is done bydetecting the rising or falling edge of the EINT3 interrupt with the debounce time of 100ms. If theinterrupt event meets the condition, the module will restart and change over its USB mode for thedesired system.5.5 USB Interface5.5.1 USB Interface DefinitionPin#Pin NameI/ODescriptionA13USB_DPI/OUSB D+ signalA12USB_DNI/OUSB D- signalA11VBUSIUSB power inputThe L811-EA wireless communication module supports USB 2.0 interface. Before connecting it to theWin7 system, it is necessary to install the USB driver (For Android & Linux system, no USB driver neededbut configuring the related kernel settings). After connecting the USB port to a PC, the USB driver residesin the Windows system will map three ACM ports and four NCM ports, as listed below:2 ACM ports used for AT Commands.1 ACM ports used for LOG information captured by the debug software.4 NCM ports are virtual network ports, mainly used for initiating data transmission serves.Note:One of the ACM ports can be used as a Modem COM port to initiate the data services. It is notrecommended to use due to the speed of Modem COM port is insufficient for the 100Mbps downloadspeed of the LTE standard. Only when the NCM ports are not available, the Modem COM port couldinitiate the data service as the temporary solution.
L811-EA Module Hardware User Manual Page33of435.5.2 USB Interface ApplicationReference Circuit Design:Figure 5- 6 USB Interface Reference Circuit DesignThe choice of capacitance for RV101 and RV102 TVS diodes should not greater than 1pF, it isrecommended to use 0.5pF TVS diodes. There is no recommended capacitance value for RV100.VUSB pin supplies the power for USB, the recommended power range is 3.3V ~ 4.5V. VBUS pin shouldnot floated or it will become the unknown device.USB_DP and USB_DM are the high-speed differential signals, and the maximum data rate is 480Mbps.The following requirements should be followed in case of PCB layout.USB_DP and USB_DN signal traces should be parallel and have the equal length, avoid right anglelayout.USB_DP and USB_DN signal traces should be wrapped with GND on both sides.USB2.0 differential signal traces should be routed on the layer nearest to the ground plane.Ensure the match of impedance, which is required to be 90 Ohm.Note:VBUS is the power for USB detection (it’s the low current signal, current value < 100uA). In circuit design,it’s not permitted to apply VBUS power individually when the USB_DN and USB_DP are disconnected, orthe module will not go into the sleep mode.5.6 UART Interface5.6.1 UART Interface DescriptionThe L811-EA module provides one 4-wire UART port. The UART1 port supports AT commands, the userscan receive and transmit AT commands through UART1.L811-EA
L811-EA Module Hardware User Manual Page34of43The definition of UART1 signals as shown in the following tables:Pin#Pin NameI/ODescriptionL14UART1_CTSIClear to sendK14UART1_RTSORequest to sendA9UART1_TXDOData TransmitA10UART1_RXDIDate Receive5.6.2 UART Interface ApplicationThe signal direction when connecting the UART1 of L811-EA module (DCE) and MCU (DTE) as shown inthe following tables:MCU (DTE) applicationSignal directionL811-EA module (DCE)RXDUART1_TXDTXDUART1_RXDNote:The voltage level of UART interface is 1.8V. When connecting to 2.8V or 3.3V I/O, it is necessary toconvert the voltage level. In circuit design, it is recommended to use a SN74LVC2G07 to convert thevoltage level from 1.8V to 3.3V. For connecting to a PC, first convert 1.8V to 3.3V, then use aSPIEX3232EEA to convert it to RS-232 level. The direction of the signals should be properly handled.5.7 USIM InterfaceThe L811-EA module supports USIM and high speed SIM cards (The 8-wire USIM is not supported yet).5.7.1 USIM PinsPin#Pin NameI/OFunction DescriptionD15VSIM1OUSIM power, 1.8V/2.8VE15SIM1_RSTOUSIM resetF15SIM1_CLKOUSIM clockG15SIM1_DATAI/OUSIM dataH15SIM1_CDIUSIM card detection signal, pulled up with a 390kresistor by default.High when SIM card is inserted.Low when SIM card is not inserted.
L811-EA Module Hardware User Manual Page35of435.7.2 USIM Interface Design5.7.2.1 “Normally Closed” SIM Card Circuit DesignReference Circuit Design:：Figure 5- 7 Reference Design of “Normally Closed” SIM Card InterfaceNormally closed SIM Connector:1）When detaching the SIM card, pin 7 and pin 8 shorted together.2）When inserting the SIM card, pin 7 and pin 8 opened.5.7.2.2 “Normally Open” SIM Circuit DesignReferenced Circuit Design:Figure 5- 8 Reference Design of “Normally Open” SIM Card InterfaceNormally open SIM Connector:1）When detaching the SIM card, pin 7 and pin 8 opened .2）When inserting the SIM card, pin 7 and pin 8 shorted.
L811-EA Module Hardware User Manual Page36of43Note:In order to improve the EMC performance, the SIM card slot should be close to the module as muchas possible.The filter capacitors for the SIM card signals should be placed close to the SIM card slot as much aspossible.The ESD devices (e.g. TVS) shall be added to the SIM card signals for ESD protection. They shouldbe placed close to the SIM card slot as much as possible.SIM1_CD signal supports hot-plugging. Active high by default (It can be changed to active low by anAT command). If the module detects the signal with high level, it means a card insertion has detected.5.7.3 Highlights for USIM DesignThe SIM card interface design is very important to have the module and SIM card work normally.The rules should be followed carefully as below:SIM card slot and signal routing must keep away from the EMI interference sources, e.g. RF antennaand digital signals.The trace length between the module and SIM card should not exceed 100mm.To avoid crosstalk, USIM_CLK and USIM_IO signals should keep away in case of layout. It’srecommended to wrap them with ground planes.SIM card signals should be ESD protected. The ESD devices should have low capacitance (e.g.Zener diode). It’s recommended to choose ESD devices with capacitance equal or less than 33pF. Incase of layout, ESD devices should be close to the SIM card interface.5.7.4 USIM Hot-PluggingThe L811-EA module supports the insert detection of the SIM card. With this function, the hot-plugging ofSIM card can be designed.5.7.4.1 Hardware ConnectionThe function of SIM card hot-plugging is done by the SIM_CD signal. The SIM1_CD signal is low whenthe SIM card is detached, high when the SIM card is inserted.Note：For “Normally closed” design, as shown in the figure5-7, the SIM1_CD signal is connected to U2’sPin8 (SW2), and Pin7 (SW1) is connected to the ground. When the SIM card is not inserted, SW2and SW1 are shorted, and SW2 is low. When the SIM card is inserted, SW2 and SW1 are opened,and the SIM1_CD signal will be pulled high.For “Normally open” design, as shown in the figure5-8, the SIM1_CD signal is connected to U2’s Pin8
L811-EA Module Hardware User Manual Page37of43(SW2), and Pin7 (SW1) is pulled up with a 4.7K resistor. When the SIM card is not inserted, SW2 andSW1 are opened, and SW2 is low. When the SIM card is inserted, SW2 and SW1 are shorted, andSIM1_CD signal will be pulled high.5.7.4.2 Software Setup“+MSMPD” command is used for the SIM card detection function:If set AT+MSMPD=0, the SIM card detection function is disabled, and the module will not detect theSIM1_CD signal.If set AT+MSMPD=1, the SIM card detection function is enabled, and the module will detect theinsertion of the SIM card via SIM1_CD Pin.If SIM1_CD is high, which indicates the insertion of a SIM card, and the module will automaticallyregister to the network.If SIM1_CD is low or disconnected, which indicates the SIM card is not inserted, and the module willnot register to the network.Note:The default value of +MSMPD is “1”. The SIM_CD signal is used for SIM card detection. The moduledetects the presence of the SIM card via the SIM1_CD signal during the first booting. After the moduleboots up, it detects the SIM card by the level change of the SIM1_CD signal. In other words, if SIM1_CDis at low level, the module cannot access the SIM card.5.8 Digital AudioThe L811-EA module supports I2S interface for digital audio. The I2S port supports normal I2S mode andPCM mode for data transfer. I2S interface is at 1.8V voltage level.I2S signal description as shown in the following tables:Pin#Pin NameI/ODescriptionN12I2S2_CLKOBit clock, 1.8V signalN9I2S2_WA0OLeft and right channel clock (LRCK), 1.8V signalN10I2S2_TXOSerial data output, 1.8V signalN11I2S2_RXISerial data input, 1.8V signal5.8.1 I2S InterfaceL811-EASignal DirectionAudio CODEC I2S Port
L811-EA Module Hardware User Manual Page38of43I2S2_CLK0I2S_CLKI2S2_WA0I2S_LRCKI2S2_RXI2S_SDOUTI2S2_TXI2S_SDINDescription:I2S interface can be configured as master or slave mode.It supports various audio sampling rates (48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz,11.025KHz and 8KHz).5.8.2 PCM Mode DescriptionL811-EASignal DirectionAudio CODEC PCM PortI2S2_CLK(PCM_CLK ,PCM clock signal)PCM_CLK（PCM clock signal）I2S2_WA(PCM_SYNC , PCM framesynchronization signal)PCM_SYNC（PCM framesynchronization signal）I2S2_RX(PCM_DIN , PCM data input)PCM_DOUT（PCM data output）I2S2_TX(PCM_DOUT , PCM data output)PCM_DIN（PCM data input）Note:PCM port can be configured as master or slave mode.It supports short frame sync for 16, 32, 48, and 64 bit mode.It supports burst and continuous transmission modes.It supports clock length trigger for frame sync signal and rising/falling edge trigger for datatransmission.It supports various audio sampling rates (48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz, 16KHz, 12KHz,11.025KHz and 8KHz).Note:Because of the timing of I2S mode is simpler than PCM mode, it is recommended to use I2S mode foraudio transmission. For PCM mode, the audio quality issues caused by the PCM timing adjusting must beavoided.5.9 I2C InterfaceL811-EA module supports one I2C interface, default configured as I2C master. The I2C master is used fordriving external I2C slave devices, such as audio codecs and so on.
L811-EA Module Hardware User Manual Page39of43Pin#NameI/ODescriptionM11I2C_DATAI/OI2C data signal,1.8V signal levelM12I2C_SCLOI2C clock signal, 1.8V signal levelThe signal connection of L811-EA I2C master and external I2C slave ( such as an audio codec）as shownin the following tables:L811-EASignal DirectionAudio Codec I2C PortI2C_SDAI2C_SDAI2C_SCLI2C_SCL5.10 Clock InterfaceL811-EA module supports one 26MHz clock output and one 32KHz clock output.Pin#Pin NameI/ODescriptionA3FSYS2_26MO26MHz clock output, 1.8V level. (It is recommended to beused for external GPS, and it can also be used for the mainclock of the audio codec)A8CLK32KO32K clock output, 1.8V level.5.11 Other InterfacesThe module does not support the following ports yet: HSIC、ANT Tunable、GPIO.
L811-EA Module Hardware User Manual Page40of436 Electrical and EnvironmentalCharacteristic6.1 Electrical CharacteristicThe table below lists the range of L811-EA’s electrical characteristics:ParametersMinimum ValueMaximum ValueUnitPower supply signal04.4VDigital signal01.9V6.2 Environmental CharacteristicThis table below shows the environmental features of L811-EA.ParametersMinimum ValueMaximum ValueUnitOperating Temperature-40+85°CStorage Temperature-40+85°C
L811-EA Module Hardware User Manual Page41of437 RF Interface7.1 RF PCB Design7.1.1 Wire Routing PrincipleThe L811-EA module supports double RF antennas, the MAIN_ANT is for transmitting and receiving, andthe DIV_ANT is for receiving. Diversity antenna can improve the receiver sensitivity as well as thedownlink speed.The RF connectors or solder joints must be connected to the L811-EA module by the trace lines. It isrecommended to use the microstrip line for RF line. It should be as short as possible with the insertionloss controlled below 0.2dB, and has the impedance of 50 Ohm.For antenna fine tuning, it is recommended to reserve a π circuit (the parallel inductors should connect tothe main ground) between L811-EA module and the antenna connector (or the solder joint).Figure 7- 1 L811-EA π-type CircuitL811-EA
L811-EA Module Hardware User Manual Page42of437.1.2 ImpedanceThe impedance of the RF signal line needs to be controlled at 50 Ohm.7.2 Antenna Design7.2.1 Main Antenna Design Requirements(1) Antenna efficiencyAntenna efficiency is the ratio of the input power and radiant power. Because of the return loss, materialloss and coupling loss of the antenna, the radiant power is always lower than the input power. The ratio isrecommended to be controlled over 40% (–4dB).(2) S11 or VSWRS11 indicates the matching level of the 50 Ohm impedance for the antenna. It affects the antennaefficiency in a certain extent. The VSWR testing method could be used for measuring purposes. Therecommended value for S11 is less than –10dB.(3) PolarizationPolarization refers to the rotation direction of electric field while the antenna is in the direction of maximumradiation. Linear polarization is recommended. It is recommended to use the diversity antenna which hasthe different polarization direction from the main antenna.(4) Radiation patternThe radiation pattern refers to the intensity of the electromagnetic field while the antenna is in everydirection of the far field. Dipole antenna is perfect as the terminal antenna. For built-in antenna, it isrecommended to use PIFA or IFA antennas.Antenna dimension: 6mm * 10mm * 100mm (H*W*L).Antenna radiation direction: Omnidirectional.(5) Gain and directivityAntenna directivity refers to the intensity of the electromagnetic field while the electromagnetic wave is inall directions. Gain is the collection of of the efficiency and directivity of the antenna. It is recommendedthat antenna gain is less than or equal to 3dBi.(6) InterferenceIn addition to antenna performance, some other interference from the PCB will also affect the moduleperformance. To ensure the high performance of the module, the interference must be under control.Suggestions: Keep speaker, LCD, CPU, FPC wire routing, audio circuits, and power supply away from the
L811-EA Module Hardware User Manual Page43of43antenna, and add appropriate filtering and shielding protection, or adding filtering devices on the traces.(7) TRP/TISTRP (Total Radiated Power)：GSM850/900>28dBmGSM DCS1800/PCS1900 >25dBmWCDMA Band 1,2,4,5,8>19dBmLTE FDD Band 1,2,3,4,5,7,8,13,17,18,19,20>19dBmTIS (Total Isotropic Sensitivity)：GSM850/900/DCS1800/PCS1900<-102dBmWCDMA Band 1,2,4,5,8<-102dBmLTE FDD Band 1,2,3,4,5,7,8,13,17,18,19,20<-95dBm (10MHz Bandwidth)

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