Fibocom Wireless L830EB11 LTE module User Manual ng

Fibocom Wireless Inc. LTE module ng

User Manual

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EBHardware User Manual Page1of39L830-EB-11 Hardware User ManualVersion: V1.0.2Update date: 2017.09.21
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 2 of 39Applicability TableNo. Product model Description1 L830-EB-11 NA
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 3 of 39CopyrightCopyright © 2017 Fibocom Wireless Inc. All rights reserved.Without the prior written permission of the copyright holder, any company or individual is prohibited toexcerpt, copy any part of or the entire document, or distribute the document in any form.NoticeThe document is subject to update from time to time owing to the product version upgrade or otherreasons. Unless otherwise specified, the document only serves as the user guide. All the statements,information and suggestions contained in the document do not constitute any explicit or implicitguarantee.Version RecordVersion Update RemarkV1.0.0 2017.04.25 Initial versionV1.0.1 2017-09-211. Update timing of power on/off and reset2. Modify the RF Band3. Modify the packing description
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 4 of 39Contents1 Preface....................................................................................................................................................................61.1 Introduction.....................................................................................................................................................61.2 Reference Standard......................................................................................................................................61.3 Related Documents...................................................................................................................................... 62 Overview.....................................................................................................................................................................72.1 Introduction.....................................................................................................................................................72.2 Specification...................................................................................................................................................72.3 Application Framework................................................................................................................................. 82.4 Hardware Framework................................................................................................................................... 93 Application Interface.................................................................................................................................................93.1 M.2 Interface.................................................................................................................................................. 93.1.1 Pin Map............................................................................................................................................. 103.1.2 Pin Definition.....................................................................................................................................113.2 Power Supply...............................................................................................................................................143.2.1 Power Supply................................................................................................................................... 153.2.2 Logic level......................................................................................................................................... 163.2.3 Power Consumption........................................................................................................................163.3 Control Signal.............................................................................................................................................. 173.3.1 Module Start-Up...............................................................................................................................173.3.1.1 Start-up Circuit................................................................................................................................................173.3.1.2 Start-up Timing Sequence............................................................................................................................ 183.3.2 Module Shutdown............................................................................................................................193.3.3 Module Reset................................................................................................................................... 203.4 USB Interface...............................................................................................................................................213.4.1 USB Interface Definition................................................................................................................. 213.4.2 USB Interface Application.............................................................................................................. 213.5 USIM Interface.............................................................................................................................................223.5.1 USIM Pins......................................................................................................................................... 223.5.2 USIM Interface Circuit.....................................................................................................................233.5.2.1 N.C. SIM Card Slot........................................................................................................................................ 233.5.2.2 N.O. SIM Card Slot........................................................................................................................................ 233.5.3 USIM Hot-Plugging..........................................................................................................................24
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 5 of 393.5.4 USIM Design.................................................................................................................................... 253.6 Status Indicator............................................................................................................................................253.6.1 LED#1 Signal....................................................................................................................................263.6.2 WOWWAN#......................................................................................................................................263.7 Interrupt Control.......................................................................................................................................... 273.7.1 W_DISABLE1#.................................................................................................................................273.7.2 Body SAR..........................................................................................................................................283.8 Digital Audio................................................................................................................................................. 283.8.1 I2S Mode...........................................................................................................................................283.8.2 PCM Mode........................................................................................................................................ 293.9 I2C Interface Description........................................................................................................................... 293.10 Clock Interface.......................................................................................................................................... 303.11 Configuration Interface.............................................................................................................................303.12 Other Interfaces........................................................................................................................................ 314 Radio Frequency.................................................................................................................................................... 314.1 RF Interface................................................................................................................................................. 314.1.1 RF Interface Functionality.............................................................................................................. 314.1.2 RF Connector Characteristic......................................................................................................... 314.1.3 RF Connector Dimension...............................................................................................................324.2 Operating Band........................................................................................................................................... 334.3 Transmitting Power..................................................................................................................................... 334.4 Receiver Sensitivity.................................................................................................................................... 334.5 GNSS............................................................................................................................................................ 344.6 Antenna Design........................................................................................................................................... 345 Structure Specification...........................................................................................................................................355.1 Product Appearance................................................................................................................................... 355.2 Dimension of Structure...............................................................................................................................355.3 M.2 Interface Model....................................................................................................................................365.4 M.2 Connector............................................................................................................................................. 375.5 Storage..........................................................................................................................................................375.5.1 Storage Life...................................................................................................................................... 375.6 Packing......................................................................................................................................................... 375.6.1 Tray Package....................................................................................................................................385.6.2 Tray size............................................................................................................................................ 39
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 6 of 391 Preface1.1 IntroductionThe document describes the electrical characteristics, RF performance, dimensions and applicationenvironment, etc. of L830-EB (hereinafter referred to as L830). With the assistance of the document andother instructions, the developers can quickly understand the hardware functions of L830 modules anddevelop products.1.2 Reference StandardThe design of the product complies with the following standards:3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radiotransmission and reception (FDD);Part 1: Conformance specification3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radiotransmission and reception; Part 1: Conformance testing3GPP TS 21.111 V10.0.0: USIM and IC card requirements3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment(SIM-ME) interface3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)application3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) ApplicationToolkit(USAT)3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobileterminals and ancillary equipment3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)PCI_Express_M.2_Specification_Rev1.11.3 Related DocumentsRF Antenna Application Design SpecificationL8-Family System Driver Integration and Application GuidanceL8-Family AT Commands Manual
EU Regulator Conformance Hereby, We, Fibocom Wireless Inc. declares that the radio equipment type L830-EB-11 is in compliance with the Directive 2014/53/EU. In all cases assessment of the final product must be mass against the Essential requirements of the Directive 2014/53/EU Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2 requirements. External antenna is used with the module during the testing process, the maximum antenna gain for frequency < 1G is 3dBi, for frequency > 1G is 5dBi and the antenna separation distance is 20cm. EU Declaration of Conformity (DoC) Hereby, Name of manufacturer: Fibocom Wireless Inc. Address: 5/F, Tower A, Technology Building II, 1057 Nanhai Blvd, Nanshan, City: Shenzhen, Country: China declares that the DoC is issued under its sole responsibility and that this product: Product description: LTE module Type designation(s): L830-EB-11 Trademark: Fibocom Product Identification Element L830-EB-11 is in conformity with the relevant Union harmonization legislation: Radio Equipment directive: 2014 / 53 / EU. with reference to the following standards applied: 1. Health (Article 3.1(a) of Directive 2014/53/EU)Applied Standard(s):EN 62311 : 2008 2. Safety (Article 3.1(a) of Directive 2014/53/EU)Applied Standard(s):EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013 3. Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)Applied Standard(s):Draft EN 301 489-1 V2.2.0 / -52 V1.1.0 4. Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)Applied Standard(s):EN 301 908-1 V11.1.1 / -2 V11.1.1 / -13 V11.1.1 The Notified Body SIEMIC INC. with Notified Body number 2200 performed: Modules: B+C and issued the EU-type examination certificate. Signed for and on behalf of: Date: September 7, 2017 City: Shenzhen, Name: Alan Yu Title: Test Director Signature:
Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. FCC Caution:  Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.  This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID: The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. ZMOL830EB11External antenna is used with the module during the testing process, the maximum antenna gain forfrequency<1G is 3dBi, for frequency>1G is 5 dBi and the antenna separation distance is 20cm.for frequency>1G is 5 dBi and the antenna separation distance is 20cm.External antenna is used with the module during the testing process, the maximum antenna gain
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 7 of 392 Overview2.1 IntroductionThe L830 is a highly integrated 4G cellular module which uses the standard PCIe M.2 interface.It supportsLTE FDD/WCDMA mode cellular communication.2.2 SpecificationSpecificationOperating BandLTE FDD: Band 1,3,7,8,20,28,32WCDMA/HSPA+: Band I, VIIIGPS/GLONASS: Not SupportCALTE inter-band CA1 +3,7,203 +7,8,20,28,327 +20,28LTE intra-band CA 3,7Data TransmissionLTE FDD 300Mbps DL/50Mbps UL(Cat 6)UMTS/HSPA+UMTS:384 kbps DL/384 kbps ULDC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)Power Supply DC 3.135V～4.4V, Typical 3.3VTemperatureNormal Operating temperature：-10°C ～+55°CExtended Operating temperature：-30°C ～+65°CStorage temperature：-40°C ～+85°CPhysicalcharacteristicsInterface: M.2 Key-BDimension：30 x 42 x 2.3mmWeight: About 5.8 gInterfaceAntenna ConnectorWWAN Main Antenna x 1WWAN Diversity Antenna x 1Function Interface USIM 3V/1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 8 of 39USB 2.0 x 1I2SI2CEINT、System IndicatorClockSoftwareProtocol StackIPV4/IPV6AT commands3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commandsFirmware updateUSBNote：When temperature goes beyond normal operating temperature range of -10°C~+55°C, RFperformance of module may be slightly off 3GPP specifications.2.3 Application FrameworkThe peripheral applications for L830 module are shown in Figure 2-1:Figure2-1 Application Framework
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 9 of 392.4 Hardware FrameworkThe hardware framework in Figure 2-2 shows the main hardware functions of L830 module, includingbaseband and RF functions.Baseband contains the followings:UMTS/LTE FDD controller/Power supplyNAND/internal LPDDR2 RAMApplication interfaceRF contains the followings:RF TransceiverRF Power/PARF Front endRF FilterAntenna ConnectorFigure 2-2 Hardware Framework3 Application Interface3.1 M.2 InterfaceThe L830 module uses standard M.2 Key-B interface, with a total of 75 pins.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 10 of 393.1.1 Pin MapFigure 3-1 Pin MapNote:Pin “Notch” represents the gap of the gold fingers.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 11 of 393.1.2 Pin DefinitionThe pin definition is as follows:PinPin NameI/OResetValuePin DescriptionType1CONFIG_3OLConnected to internal GND, L830M.2 module is configured as theWWAN-SSIC 0 interface type.2+3.3VPIModule main power input.Power Supply3GNDGNDPower Supply4+3.3VPIModule main power input.Power Supply5GNDGNDPower Supply6FULL_CARD_POWER_OFF#IPower on/off control signal,activeHigh.CMOS3.3/1.8V7USB D+I/OUSB 2.0 D+ signal0.3---3V8W_DISABLE1#IPUWWAN Disable, active low.CMOS 3.3V9USB D-I/OUSB 2.0 D- signal0.3---3V10LED1#OODSystem status LED, drain output.CMOS 3.3V11GNDGNDPower Supply12NotchNotch13NotchNotch14NotchNotch15NotchNotch16NotchNotch17NotchNotch18NotchNotch19NotchNotch20I2S_CLKOPDI2S serial clockCMOS 1.8V21CONFIG_0ONCNot connected, L830 M.2 module isconfigured as the WWAN-SSIC 0interface type.22I2S_RXIPDI2S serial data inputCMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 12 of 39PinPin NameI/OResetValuePin DescriptionType23WOWWAN#OPUWake up host signalCMOS 1.8V24I2S_TXOPDI2S serial data outputCMOS 1.8V25DPRIPUBody SAR detectionCMOS 1.8V26W_DISABLE2#IPUGPS Disable signal, active low. (Notsupported yet)CMOS 1.8V27GNDGNDPower Supply28I2S_WAOPDI2S clock for left and right channelsCMOS 1.8V29NCNC30UIM_RESETOPPUSIM reset signal1.8V/3V31NCNC32UIM_CLKOPPUSIM clock signal1.8V/3V33GNDGNDPower Supply34UIM_DATAI/OPUUSIM data signal, internal 4.7KΩpull-up.1.8V/3V35NCNC36UIM_PWROUSIM power supply1.8V/3V37NCNC38NCNC39GNDGNDPower Supply40GNSS_SCLOPUI2C serial clock signal, internal4.7KΩ pull-upCMOS 1.8V41NCNC42GNSS_SDAI/OPUI2C serial data signal, internal 4.7KΩpull-upCMOS 1.8V43NCNC44GNSS_IRQIPUReservedCMOS 1.8V45GNDGNDPower Supply46SYSCLKOL26MHz clock output1.8V47NCNC
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 13 of 39PinPin NameI/OResetValuePin DescriptionType48TX_BLANKINGOLTDMA Timer output, external GPScontrol signal.(not supported)CMOS 1.8V49NCNC50NCNC51GNDGNDPower Supply52NCNC53NCNC54NCNC55NCNC56NCNC57GNDGNDPower Supply58NCNC59ANTCTL0OLTunable antenna control signal, bit0(not supported yet).CMOS 1.8V60COEX3OReserved61ANTCTL1OLTunable antenna control signal, MIPIRFFE SDATA, bit1 (not supportedyet).CMOS 1.8V62COEX2OReserved63ANTCTL2OLTunable antenna control signal, MIPIRFFE SCLK, bit2 (not supportedyet).CMOS 1.8V64COEX1OReserved65ANTCTL3OTunable antenna control signal, MIPIRFFE VIO, bit3 (not supported yet).CMOS 1.8V66SIM_DETECTISIM card detect, external 390KΩpull-up.CMOS 1.8V67RESET#IExternal reset input signal, internal100KΩ pull-up.CMOS 1.8V68NCNC69CONFIG_1OLConnected to internal GND, L830
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 14 of 39PinPin NameI/OResetValuePin DescriptionTypeM.2 module is configured as theWWAN-SSIC 0 interface type.70+3.3VPIModule main power input.Power Supply71GNDGNDPower Supply72+3.3VPIModule main power input.Power Supply73GNDGNDPower Supply74+3.3VPIModule main power input.Power Supply75CONFIG_2OLConnected to internal GND, L830M.2 module is configured as theWWAN-SSIC 0 interface type.Reset Value: The initial status after module reset, not the status when workingH: High Voltage LevelL: Low Voltage LevelPD: Pull-DownPU: Pull-UpT: TristateOD: Open DrainPP: Push-PullPI: Power InputPO: Power OutputNote:The unused pins can be left floating.3.2 Power SupplyThe power interface of L830 module as shown in the following table:PinPin NameI/OPin DescriptionDC Parameter（V）MinimumValueTypicalValueMaximumValue2,4,70,72,74+3.3VPIPower supply input3.1353.34.436UIM_PWRPOUSIM power supply1.8V/3V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 15 of 393.2.1 Power SupplyThe L830 module should be powered through the +3.3V pins, and the power supply design is shown inFigure 3-2:Figure 3-2 Power Supply DesignThe filter capacitor design for power supply as shown in the following table:RecommendedcapacitanceApplicationDescription220uF x 2Voltage-stabilizing capacitorsReduce power fluctuations of the module inoperation, requiring capacitors with low ESR.LDO or DC/DC power supply requires thecapacitor of no less than 220uFThe capacitor for battery power supplycan be reduced to 100uF1uF,100nFDigital signal noiseFilter out the interference generated from theclock and digital signals39pF,33pF700,800,900 MHz frequencybandFilter out low frequency band RF interference18pF,8.2pF,6.8pF1800,2100,2600MHz frequencybandFilter out medium/high frequency band RFinterferenceThe stable power supply can ensure the normal operation of L830 module; and the ripple of the powersupply should be less than 300mV in design. When the module operates with the maximum emissionpower, the maximum operating current can reach 1A, so the power source should be not lower than3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 16 of 39Figure 3-3 Power Supply Limit3.2.2 Logic levelThe L830 module 1.8V logic level definition as shown in the following table:ParametersMinimumTypicalMaximumUnit1.8V logic level1.711.81.89VVIH1.31.81.89VVIL-0.300.3VThe L830 module 3.3V logic level definition as shown in the following table:ParametersMinimumTypicalMaximumUnit3.3V logic level3.1353.33.465VVIH2.33.33.465VVIL-0.300.3V3.2.3 Power ConsumptionIn the condition of 3.3V power supply, the L830 power consumption as shown in the following table:ParameterModeConditionAverageCurrent(mA)IoffPower offPower supply, module power off0.29ISleepWCDMADRX=63.0DRX=81.8DRX=91.5
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 17 of 39ParameterModeConditionAverageCurrent(mA)LTE FDDPaging cycle #64 frames (0.64 sec DRX cycle)3.6Radio OffAT+CFUN=4,Flight mode1.0IWCDMA-RMSWCDMAWCDMA Data transfer Band I @+23.5dBm687WCDMA Data transfer Band VIII @+23.5dBm597ILTE-RMSLTE FDDLTE FDD Data transfer Band 1 @+23dBm713LTE FDD Data transfer Band 3 @+23dBm733LTE FDD Data transfer Band 7 @+23dBm735LTE FDD Data transfer Band 8 @+23dBm675LTE FDD Data transfer Band 20 @+23dBm685LTE FDD Data transfer Band 28 @+23dBm833Note：The data above is an average value obtained by testing some samples.3.3 Control SignalThe L830 module provides two control signals for power on/off and reset operations, the pin defined asshown in the following table:PinPin NameI/OReset ValueFunctionsType6FULL_CARD_POWER_OFF#IPower on/off signalHigh: Power onLow or floating: Power off3.3V/1.8V67RESET#IReset signal, internal 100KΩ pull-up,active low.1.8V3.3.1 Module Start-Up3.3.1.1 Start-up CircuitThe FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. TheVDD(3.3V/1.8V) should be provided from the external circuit. Two methods for module starting up:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 18 of 39AP (Application Processor) controls the module start-up, and the circuit design is shown in Figure3-4:Automatically start-up when powered on, and the circuit design is shown in Figure 3-5:Figure 3-4 Circuit for Module Start-up Controlled by APFigure 3-5 Circuit for Automatic Start-up3.3.1.2 Start-up Timing SequenceAfter powering on, module will start-up by pulling up FULL_CARD_POWER_OFF# signal for more than20ms (100ms is recommended).The internal PMU of the module will output the voltage and start thestart-up process. After about 10s time, the module completes the initialization process. The start-uptiming is shown in Figure 3-6:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 19 of 39Figure 3-6 Timing Control for Start-upIndexMinimumTypicalNotestprThe time for +3.3 V stable output.If + 3.3 V keeps constant supply,the delay time can be ignored.ton20ms100msThe time difference between the RESET # signal and theFULL_CARD_POWER_OFF # signal.3.3.2 Module ShutdownThe module can be shutdown by the following controls:ShutdownControlActionConditionSoftwareSending AT+CFUN=0 commandNormal shutdown.HardwarePull downFULL_CARD_POWER_OFF# pinOnly used when a hardware exception occursand the software control cannot be used.Module can be shut down by sending AT+CFUN=0 command. When module receives the softwareshutdown command, it will start the finalization process (the reverse process of initialization), then it willshut down after tsd time(AP received “OK” from “AT+CFUN=0” command, if AP can’t received “OK” thetime is 5s maxim).In the finalization process, the module will save the network, SIM card and some otherparameters from memory, then clear the memory and PMU will be powered off. The software controltiming is shown in Figure 3-7:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 20 of 39Figure 3-7 Shutdown Timing ControlIndexMinimumTypicalNotestpd10ms100msThe time for+3.3 V delay time of shutdown.If + 3.3 V keepsconstant supply, the delay time can be ignored.toff10ms100msThe time difference between the RESET # signal and theFULL_CARD_POWER_OFF # signal.3.3.3 Module ResetThe L830 module can reset to its initial status by pulling down the RESET# signal for more than 20ms(100ms is recommended), and the module will restart after the RESET# signal is released. When thecustomer executes RESET# function, the PMU remains its power inside the module. The recommendedcircuit design is shown in the Figure 3-8:Figure 3-8 Recommended Design for Reset CircuitThe reset control timing is shown in Figure 3-9:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 21 of 39Figure 3-9 Reset Timing ControlIndexMinimumTypicalNotestres20ms100msRESET# signal to pull down time3.4 USB InterfaceThe L830 module supports USB 2.0 which is compatible with USB High-Speed (480 Mbit/s) and USBFull-Speed (12 Mbit/s). For the USB timing and electrical specification of L830 module, please refer to“Universal Serial Bus Specification 2.0” .3.4.1 USB Interface DefinitionPin#Pin NameI/OReset ValueDescriptionType7USB_D+I/OTUSB Data Plus0.3---3V, USB2.09USB_D-I/OTUSB Data Minus0.3---3V, USB2.03.4.2 USB Interface ApplicationThe reference circuit is shown in Figure 3-10:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 22 of 39Figure 3-10 Reference Circuit for USB 2.0 InterfaceSince the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalentcapacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use0.5pF TVS diodes.USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of 480 Mbit/s,so the following rules shall be followed carefully in the case of PCB layout:USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms.USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right anglerouting should be avoided.USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the groundlayer, and wrapped with GND vertically and horizontally.3.5 USIM InterfaceThe L830 module supports USIM card interface including 1.8V and 3V SIM cards.3.5.1 USIM PinsThe USIM pins description as shown in the following table:PinPin NameI/OReset ValueDescriptionType36UIM_PWRPOUSIM power supply1.8V/3V30UIM_RESETOLUSIM reset1.8V/3V32UIM_CLKOLUSIM clock1.8V/3V34UIM_DATAI/OLUSIM data, internal 4.7K pull-up1.8V/3V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 23 of 39PinPin NameI/OReset ValueDescriptionType66SIM_DETECTIUSIM card detect, internal 390Kpull-up.Active high, and high level indicatesSIM card is inserted; and low levelindicates SIM card is detached.1.8V3.5.2 USIM Interface Circuit3.5.2.1 N.C. SIM Card SlotThe reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-11:Figure 3-11 Reference Circuit for N.C. SIM Card SlotThe principles of the N.C. SIM card slot are described as follows:When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives theSIM_DETECT pin low.When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives theSIM_DETECT pin high.3.5.2.2 N.O. SIM Card SlotThe reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-12:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 24 of 39Figure 3-12 Reference Circuit for N.O. SIM Card SlotThe principles of the N.O. SIM card slot are described as follows:When the SIM card is detached, it connects an open circuit between CD and SW pins, anddrives the SIM_DETECT pin low.When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drivesthe SIM_DETECT pin high.3.5.3 USIM Hot-PluggingThe L830 module supports the SIM card hot-plugging function, which determines whether the SIM card isinserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.The SIM card hot-plugging function can be configured by “AT+MSMPD” command, and the description forAT command as shown in the following table:AT CommandHot-plugging DetectionFunction DescriptionAT+MSMPD=1EnableDefault value, the SIM card hot-plugging detection functionis enabled.The module can detect whether the SIM card is inserted ornot through the SIM_DETECT pin state.AT+MSMPD=0DisableThe SIM card hot-plugging detect function is disabled.The module reads the SIM card when starting up, and theSIM_DETECT status will not be detected.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 25 of 39After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card isinserted when the SIM_DETECT pin is high, then executes the initialization program and finish thenetwork registration after reading the SIM card information. When the SIM_DETECT pin is low, themodule determines that the SIM card is detached and does not read the SIM card.Note:By default, SIM_DETECT is active-high, which can be switched to active-low by the ATcommand. Please refer to the AT Commands Manual for the AT command.The system doesn’t need SIM hot-plug function, please left SIM_DTECT floating.3.5.4 USIM DesignThe SIM card circuit design shall meet the EMC standards and ESD requirements with the improvedcapability to resist interference, to ensure that the SIM card can work stably. The following guidelinesshould be noted in case of design:The SIM card slot placement should near the module as close as possible, and away from theRF antenna, DC/DC power supply, clock signal lines, and other strong interference sources.The SIM card slot with a metal shielding housing can improve the anti-interference ability.The trace length between the SIM card slot and the module should not exceed 100mm, or itcould reduce the signal quality.The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalkinterference. If it is difficult for the layout, the whole SIM signal lines should be wrapped withGND as a group at least.The filter capacitors and ESD devices for SIM card signals should be placed near to the SIMcard slot, and the ESD devices with 22~33pF capacitance should be used.3.6 Status IndicatorThe L830 module provides three signals to indicate the operating status of the module, and the statusindicator pins as shown in the following table:PinPin NameI/OReset ValuePin DescriptionType10LED1#OPDSystem status LED, drainoutput.CMOS 3.3V23WOWWAN#OPUModule wakes up Host (AP).CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 26 of 393.6.1 LED#1 SignalThe LED#1 signal is used to indicate the operating status of the module, and the detailed description asshown in the following table:Module StatusLED1# SignalRF function ONLow level (LED On)RF function OFFHigh level (LED Off)The LED driving circuit is shown in figure 3-13:Figure 3-13 LED Driving CircuitNote:The resistance of LED current-limiting resistor is selected according to the driving voltage andthe driving current.3.6.2 WOWWAN#The WOWWAN# signal is used to wake the Host (AP) when there comes the data request. The definitionof WOWWAN# signal is as follows:Operating ModeWOWWAN# SignalRinging /SMS or data requestsPull low 1s then pull high (pulse signal).Idle/SleepHigh levelThe WOWWAN# timing is shown in Figure 3-14:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 27 of 39Figure 3-14 WOWWAN# Timing3.7 Interrupt ControlThe L830 module provides four interrupt signals, and the pin definition is as follows:PinPin NameI/OReset ValuePin DescriptionType8W_DISABLE1#IPUEnable/Disable RF networkCMOS 3.3V25DPRIPUBody SAR detectionCMOS 1.8V3.7.1 W_DISABLE1#The module provides a hardware pin to enable/disable WWAN RF function, and the function can also becontrolled by the AT command. The module enters the Flight mode after the RF function is disabled. Thedefinition of W_DISABLE1# signal is as follows:W_DISABLE1# signalFunctionHigh/FloatingWWAN function is enabled, the module exits the Flight mode.LowWWAN function is disabled, the module enters Flight mode.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 28 of 393.7.2 Body SARThe L830 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is highby default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down.As the result, the module then lowers down its emission power to its default threshold value, thusreducing the RF radiation on the human body. The threshold of emission power can be set by the ATCommands. The definition of DPR signal as shown in the following table:DPR signalFunctionHigh/FloatingThe module keeps the default emission powerLowLower the maximum emission power to the threshold value of the module.3.8 Digital AudioThe L830 module supports I2S digital audio interface and it supports the ordinary I2S mode and PCMmode. The signal level of the I2S interface is 1.8V. Please refer to “FIBOCOM Digital Voice” descriptionfor detailed application design. The definition of I2S signals is as follows:PinPin NameI/OReset ValuePin DescriptionType20I2S_CLKOPDI2S clockCMOS 1.8V22I2S_RXIPDI2S serial data receiveCMOS 1.8V24I2S_TXOPDI2S serial data transmitCMOS 1.8V26I2S_WAOPDI2S left and right channel clock (LRCK)CMOS 1.8V.3.8.1 I2S ModeThe L830 module is connected to the Audio Codec via I2S interface, and the codec encodes the audiodata to implement the voice call function. For the scenario, the module works as the I2S master, and thecodec works as the I2S slave. I2S signal connection is shown in Figure 3-18:Figure 3-18 I2S Signal Connection
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 29 of 39Description:I2S interface can be configured as master or slave mode.It supports multiple audio sampling rates (44.1KHz,32KHz,24KHz,16KHz,8KHz).It supports 16bit and 32bit mode.3.8.2 PCM ModeIn the case of the Bluetooth (BT) call, the PCM mode is used to transmit digital voice data if the BT chipdoes not support I2S. For the scenario, the module works as the PCM master, and BT works as the PCMslave mode. The signal connection under the PCM mode is shown in Figure 3-19:Figure 3-19 Signal Connection for PCM ModeDescription:The PCM mode interface can be configured as master or slave mode.It supports various audio sampling rates (444.1KHz,32KHz,24KHz,16KHz,8KHz).It supports short frame sync for 16 and 32 bit mode.It supports burst and continuous transmission modes.It supports clock length trigger for frame sync signal and rising/falling edge trigger for datatransmission.Note:The PCM mode timing is relative complicated to adjust, and the audio quality will be reduced if itis not fine tuned. In contrast to PCM mode, I2S mode is easier to adjust, hence it isrecommended to use I2S mode.3.9 I2C Interface DescriptionThe L830 module supports one I2C interface, which is configured as I2C master by default. The I2Cmaster is used for driving external I2C slave devices, such as the Audio Codec.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 30 of 39PinPin NameI/OReset ValuePin DescriptionType40GNSS_SCLOPUI2C serial data, internal 4.7KΩ pull up.CMOS 1.8V42GNSS_SDAI/OPUI2C serial clock, internal 4.7KΩ pull up.CMOS 1.8VThe module is connected to the external I2C slave devices (e.g. Audio Codec), which is as follows:Figure 3-20 I2C Signal ConnectionNote:The I2C interface pins can be left floating if not used.3.10 Clock InterfaceThe L830 module supports a clock interface, it can output 26MHz clock.PinPin NameI/OReset ValuePin DescriptionType46SYSCLKO26MHz clock output, can be used forexternal GPS or Audio Codec.1.8V3.11 Configuration InterfaceThe L830 module provides four config pins for the configuration as the WWAN-SSIC-0 type M.2 module:PinPin NameI/OReset ValuePin DescriptionType1CONFIG_3OLInternally connected to GND21CONFIG_0ONC69CONFIG_1OLInternally connected to GND75CONFIG_2OLInternally connected to GNDThe M.2 module configuration as the following table:Config_0(pin21)Config_1(pin69)Config_2(pin75)Config_3(pin1)Module Type and MainHost InterfacePortConfigurationNCGNDGNDGNDWWAN-SSIC0Please refer to “PCI_Express_M.2_Specification_Rev1.1” for more details.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 31 of 393.12 Other InterfacesThe module does not support ANT Tunable interface yet.4 Radio Frequency4.1 RF Interface4.1.1 RF Interface FunctionalityThe L830 module supports two RF connectors used for external antenna connection. As the Figure 4-1shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,used to receive the diversity RF signals.Figure 4-1 RF connectors4.1.2 RF Connector CharacteristicRated ConditionEnvironment ConditionFrequency RangeDC to 6GHzTemperature RangeCharacteristic Impedance50Ω–40°C to +85°C
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 32 of 394.1.3 RF Connector DimensionThe L830 module adopts standard M.2 module RF connectors, the model name is 818004607 from ETCcompany, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:Figure 4-2 RF connector dimensionsFigure 4-3 0.81mm coaxial antenna dimensionsFigure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 33 of 394.2 Operating BandThe L830 module operating bands of the antennas are as follows:OperatingBandDescriptionModeTx (MHz)Rx (MHz)Band 1IMT 2100MHzLTE FDD/WCDMA1920 - 19802110 - 2170Band 3DCS 1800MHzLTE FDD1710 - 17851805 - 1880Band 7IMT-E 2600MhzLTE FDD2500 - 25702620 - 2690Band 8E-GSM 900MHzLTE FDD/WCDMA880 - 915925 - 960Band 20EUDD 800MHzLTE FDD832 - 862791 - 821Band 28APT700LTE FDD703-748758-803Band 32L-Band1500LTE FDDN/A1452-14964.3 Transmitting PowerThe transmitting power for each band of the L830 module as shown in the following table:ModeBand3GPP RequirementTx Power(dBm)NoteWCDMABand I24+1.7/-3.723.5±1Band VIII24+1.7/-3.723.5±1LTE FDDBand 123±2.723±110MHz Bandwidth, 1 RBBand 323±2.723±110MHz Bandwidth, 1 RBBand 723±2.723±110MHz Bandwidth, 1 RBBand 823±2.723±110MHz Bandwidth, 1 RBBand 2023±2.723±110MHz Bandwidth, 1 RBBand 2823+2.7/-3.223±110MHz Bandwidth, 1 RB4.4 Receiver SensitivityThe receiver sensitivity for each band of the L830 module as shown in the following table:ModeBand3GPP RequirementRx Sensitivity(dBm)TypicalNoteWCDMABand I-106.7-110BER<0.1%
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 34 of 39ModeBand3GPP RequirementRx Sensitivity(dBm)TypicalNoteBand VIII-103.7-110.5BER<0.1%LTE FDDBand 1-96.3-10110MHz BandwidthBand 3-93.3-10110MHz BandwidthBand 7-94.3-101.510MHz BandwidthBand 8-93.3-10110MHz BandwidthBand 20-93.3-10110MHz BandwidthBand 28-94.8-10110MHz BandwidthBand 32-96.5TBD10MHz BandwidthNote:The above values are measured for the dual antennas situation (Main + Diversity). For singlemain antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE.4.5 GNSSL830-EB-11 module not support GNSS.4.6 Antenna DesignThe L830 module provides main and diversity antenna interfaces, and the antenna design requirementsas shown in the following table:L830 module Main antenna requirementsFrequency rangeThe most proper antenna to adapt the frequencies should be used.Bandwidth(WCDMA)WCDMA band I(2100) : 250 MHzWCDMA band VIII(900) : 80 MHzBandwidth(LTE)LTE band 1(2100): 250 MHzLTE Band 3(1800): 170 MHzLTE band 7(2600): 190 MHzLTE Band 8(900): 80 MHzLTE band 20(800): 71 MHzLTE band 28(850): 100 MHzLTE band 32(700): 11 MHzImpedance50 Ohm
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 35 of 39L830 module Main antenna requirementsInput power> 25dBm average power WCDMA & LTERecommendedstanding-wave ratio (SWR)≤ 2:15 Structure Specification5.1 Product AppearanceThe product appearance for L830 module is shown in Figure 5-1:Figure 5-1 Module Appearance5.2 Dimension of StructureThe structural dimension of the L830 module is shown in Figure 5-2:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 36 of 39Figure 5-2 Dimension of Structure5.3 M.2 Interface ModelThe L830 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8pins are notch pins as shown in Figure 3-1. For module dimension, please refer to chapter 5.2. Based onthe M.2 interface definition, L830 module adopts Type 3042-S3-B interface (30x42mm, the componentmaximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 37 of 395.4 M.2 ConnectorThe L830 module connects to AP via M.2 connector, it is recommended to use M.2 connector fromLOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector,please refer to the specification.Figure 5-3 M.2 Dimension of Structure5.5 Storage5.5.1 Storage LifeStorage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is12 months.5.6 PackingThe L830 module uses the tray sealed vacuum packing, combined with the outer packing method usingthe hard cartoon box, so that the storage, transportation and the usage of modules can be protected tothe greatest extent.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 38 of 39Note:The module is a precision electronic product, and may suffer permanent damage if no correctelectrostatic protection measures are taken.5.6.1 Tray PackageThe L830 module uses tray package, 20 pcs are packed in each tray, with 5 trays in each box and 6boxes in each case. Tray packaging process is shown in Figure 5-4:Figure 5-4 Tray Packaging Process
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L830-EB-11 Hardware User Manual Page 39 of 395.6.2 Tray sizeThe pallet size is 330*175*6.0mm, as shown in Figure 5-5:ITEMLWHTA0B0DIM330.0±0.5175.0±0.56.0±0.30.5±0.143±0.333.0±0.3ITEMA1B1CDEFDIM294.0±0.3159.0±0.320.0±0.59.0±0.524.5±0.5187.5±0.2ITEMGJDIM105.0±0.29.0±0.2Figure 5-5 Tray Size (Unit: mm)

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