Fibocom Wireless L850GL LTE module User Manual ng

Fibocom Wireless Inc. LTE module ng

Users Manual

L850-GL Hardware User ManualVersion：V1.0.3Update date：2/25/2017
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page2of51Applicability TableNo.Product modelDescription1L850-GLNA
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page3of51CopyrightCopyright © 2017Fibocom Wireless Inc. All rights reserved.Without the prior written permission of the copyright holder, any company or individual is prohibited toexcerpt, copy any part of or the entire document, or distribute the document in any form.NoticeThe document is subject to update from time to time owing to the product version upgrade or otherreasons. Unless otherwise specified, the document only serves as the user guide. All the statements,information and suggestions contained in the document do not constitute any explicit or implicitguarantee.Version RecordVersionUpdate dateRemarkV1.0.02016-12-08DraftV1.0.12016-12-16Modify the PCIe Interface Application;Update the Pin Definition: change pin65 to NCV1.0.22017-02-09Modify the descriptionUpdate the content of PCIeAdd the power Consumption of 3CAV1.0.32017-02-25Add product certification of warnings
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page4of51Contents1 Foreword.......................................................................................................................................... 71.1 Introduction........................................................................................................................................... 71.2 Reference Standard............................................................................................................................ 71.3 Related Documents............................................................................................................................. 72 Overview...........................................................................................................................................82.1 Introduction........................................................................................................................................... 82.2 Specification..........................................................................................................................................82.3 Warnings............................................................................................................................................... 92.3.1 FCC Statement...................................................................................................................................92.3.2 IC Statement.....................................................................................................................................112.3.3 CE Statement................................................................................................................................... 122.4 CA combinations................................................................................................................................132.5 Application Framework..................................................................................................................... 142.6 Hardware Framework........................................................................................................................153 Application Interface...................................................................................................................153.1 M.2Interface........................................................................................................................................153.1.1 Pin Distribution................................................................................................................................. 163.1.2 Pin Definition.................................................................................................................................... 173.2 Power Supply..................................................................................................................................... 213.2.1 Power Supply................................................................................................................................... 213.2.2 Logic level......................................................................................................................................... 223.2.3 Power Consumption........................................................................................................................233.3 Control Signal.....................................................................................................................................253.3.1 Module Start-Up...............................................................................................................................253.3.1.1 Start-upCircuit.................................................................................................................................................253.3.1.2 Start-upTiming Sequence............................................................................................................................. 253.3.2 Module Shutdown............................................................................................................................263.3.3 Module Reset................................................................................................................................... 273.4 USB Interface..................................................................................................................................... 283.4.1 USB Interface Definition................................................................................................................. 283.4.2 USB2.0 Interface Application.........................................................................................................283.5 PCIe Interface.................................................................................................................................... 293.5.1 PCIe Interface Definition................................................................................................................ 29
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page5of513.5.2 PCIe Interface Application..............................................................................................................293.6 USIMInterface.................................................................................................................................... 313.6.1 USIM Pins......................................................................................................................................... 313.6.2 USIM Interface Circuit.....................................................................................................................323.6.2.1 N.C. SIMCard Slot......................................................................................................................................... 323.6.2.2 N.O. SIM Card Slot........................................................................................................................................ 323.6.3 USIM Hot-Plugging..........................................................................................................................333.6.4 USIM Design.................................................................................................................................... 343.7 Status Indicator.................................................................................................................................. 343.7.1 LED#1Signal.....................................................................................................................................353.7.2 WOWWAN#......................................................................................................................................353.7.3 TX_BLANKING................................................................................................................................ 363.8 Interrupt Control................................................................................................................................. 363.8.1 W_DISABLE1#.................................................................................................................................363.8.2 BODYSAR........................................................................................................................................ 373.9 ClockInterface.................................................................................................................................... 373.10 ANT Tunable Interface....................................................................................................................373.11 Config Interface................................................................................................................................383.12 Other Interfaces............................................................................................................................... 384 Radio Frequency..........................................................................................................................394.1 RF Interface........................................................................................................................................394.1.1 RF Interface Functionality.............................................................................................................. 394.1.2 RFConnector Characteristic.......................................................................................................... 394.1.3 RF Connector Dimension...............................................................................................................394.2 Operating Band.................................................................................................................................. 414.3 Transmitting Power............................................................................................................................424.4 Receiver Sensitivity........................................................................................................................... 434.5 GNSS...................................................................................................................................................444.6 Antenna Design..................................................................................................................................455 Structure Specification.............................................................................................................. 475.1 Product Appearance..........................................................................................................................475.2 Dimension of Structure..................................................................................................................... 475.3 M.2 Interface Model...........................................................................................................................485.4 M.2 Connector....................................................................................................................................48
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page6of515.5 Storage................................................................................................................................................495.5.1 Storage Life...................................................................................................................................... 495.6 Packing................................................................................................................................................495.6.1 Tray Package................................................................................................................................... 505.6.2 Tray size............................................................................................................................................51
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page7of511 Foreword1.1 IntroductionThe document describes the electrical characteristics, RF performance, dimensions and applicationenvironment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document andother instructions, the developers can quickly understand the hardware functions of L850 modules anddevelop products.1.2 Reference StandardThe design of the product complies with the following standards:3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmissionand reception (FDD);Part 1: Conformance specification3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radiotransmission and reception (TDD)3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmissionand reception; Part 1: Conformance testing3GPP TS 21.111 V10.0.0: USIM and IC card requirements3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment(SIM-ME) interface3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)application3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminalsand ancillary equipment3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)PCI Express M.2 Specification Rev1.01.3 Related DocumentsL850 Module Performance Testing ReportRF Antenna Application Design SpecificationL8-Family System Driver Integration and Application GuidanceL8-Family AT CommandsManual
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page8of512 Overview2.1 IntroductionL850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interfaceand supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communicationnetworks of the mobile operator across the world.2.2 SpecificationSpecificationOperating BandLTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66LTE TDD: Band 38, 39, 40, 41WCDMA/HSPA+: Band 1,2,4,5,8GNSS/Beidou: supportData TransmissionLTE FDD450Mbps DL/50Mbps UL(Cat 9)LTE TDD260Mbps DL/30Mbps UL(Cat 9)When LTE TDD achieves maximum DL rate, its UL rate canreach 10Mbps onlyUMTS/HSPA+UMTS:384 kbps DL/384 kbps ULDC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)Power SupplyDC 3.135V～4.4V,Typical 3.3VTemperatureNormal operating temperature:-10°C ～+55°CExpandoperating temperature:-20°C ～+70°CStorage temperature: -40°C ～+85°CPhysicalcharacteristicsInterface: M.2 Key-BDimension：30 x 42 x 2.3mmWeight: About5.8 gInterfaceAntennaWWAN Main Antenna x 1WWAN Diversity Antenna x 1
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page9of51Function InterfaceUSIM 3V/1.8VUSB 2.0（just for debugging）PCIe 1.0 X1W_Disable#BodySarLEDClockTunable antennaI2S(Reserved)I2C(Reserved)USB3.0(not supported yet)SoftwareProtocol StackIPV4/IPV6AT commands3GPP TS 27.007 and 27.005Firmware updatePCIeOther featureMultiple carrierWindows MBIM supportWindows updateAGNSSNote:For normal operating temperature, LTE FDD Band 4 and 13 can support the temperatureranging from -20℃to +60℃.2.3 Warnings2.3.1 FCC StatementFederal Communication Commission Interference StatementThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1) This device may not cause harmful interference, and (2) this device must accept any interferencereceived, including interference that may cause undesired operation.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page10of51This equipment has been tested and found to comply with the limits for a Class B digital device, pursuantto Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmfulinterference in a residential installation. This equipment generates, uses and can radiate radio frequencyenergy and, if not installed and used in accordance with the instructions, may cause harmful interferenceto radio communications. However, there is no guarantee that interference will not occur in a particularinstallation. If this equipment does cause harmful interference to radio or television reception, which canbe determined by turning the equipment off and on, the user is encouraged to try to correct theinterference by one of the following measures:Reorient or relocate the receiving antenna.Increase the separation between the equipment and receiver.Connect the equipment into an outlet on a circuit different from thatto which the receiver is connected.Consult the dealer or an experienced radio/TV technician for help.FCC Caution:Any changes or modifications not expressly approved by the party responsible for compliance couldvoid the user's authority to operate this equipment.This transmitter must not be co-located or operating in conjunction with any other antenna ortransmitter.Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.This equipment should be installed and operated with minimum distance 20cm between the radiator &your body.This device is intended only for OEM integrators under the following conditions:1) The antenna must be installed such that 20 cm is maintained between the antenna andusers, and the maximum antenna gain allowed for use with this device is 5 dBi.2) The transmitter module may not be co-located with any other transmitter or antenna.As long as 2 conditions above are met, further transmitter test will not be required. However, the OEMintegrator is still responsible for testing their end-product for any additional compliance requirementsrequired with this module installed
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page11of51IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptopconfigurations or co-location with another transmitter), then the FCC authorization is no longer consideredvalid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator willbe responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCCauthorization.End Product LabelingThis transmitter module is authorized only for use in device where the antenna may be installed such that20 cm may be maintained between the antenna and users. The final end product must be labeled in avisible area with the following: “Contains FCC ID: ZMOL850GL”. The grantee's FCC ID can be used onlywhen all FCC compliance requirements are met.Manual Information To the End UserThe OEM integrator has to be aware not to provide information to the end user regarding how to install orremove this RF module in the user’s manual of the end product which integrates this module. The enduser manual shall include all required regulatory information/warning as show in this manual.2.3.2 IC StatementIndustry Canada statementThis device complies with Industry Canada license-exempt RSS standard(s). Operation is subject tothe following two conditions:1) this device may not cause interference, and2) this device must accept any interference, including interference that may cause undesiredoperation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée aux deux conditions suivantes:1) l'appareil ne doit pas produire de brouillage, et2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillageest susceptible d'en compromettre le fonctionnement.This Class B digital apparatus complies with Canadian ICES-003.Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that thisdevice does not cause harmful interference.Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à lacondition que cet appareil ne provoque aucune interférence nuisible.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page12of51This device and its antenna(s) must not be co-located or operating in conjunction with any otherantenna or transmitter, except tested built-in radios.Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autreantenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.The County Code Selection feature is disabled for products marketed in the US/ Canada.La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés auxÉtats-Unis et au Canada.Radiation Exposure Statement:This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. Thisequipment should be installed and operated with minimum distance 20cm between the radiator & yourbody.Déclaration d'exposition aux radiations:Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour unenvironnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm dedistance entre la source de rayonnement et votre corps.IC : 21374-L850GL2.3.3 CE Statement► EU Regulatory ConformanceHereby, We, Manufacturer name declares that the radio equipment type L850-GL is in compliance withthe Directive 2014/53/EU.In all cases assessment of the final product must be mass against the Essential requirements of theDirective 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article3.2 requirements.The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm.► Declaration of Conformity(should include manufacturer contact info.)Please added certification standard in your user manual which depended on the test standards yourdevice performed., If the DoC should be a simplified version, please take below as reference, Thefull text of the EU declaration of conformity is available at the following internet address: http//www.fibocom.com
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page13of51L850-GL is in conformity with the relevant Union harmonization legislation: Radio Equipment directive:2014 / 53 / EUwith reference to the following standards applied:Health (Article 3.1(a) of Directive 2014/53/EU)Applied Standard(s):EN 62311 : 2008Safety (Article 3.1(a) of Directive 2014/53/EU)Applied Standard(s):EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)Applied Standard(s):Draft EN 301 489-1 V2.1.1 / -3 V2.1.0 /-52 V1.1.0Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)Applied Standard(s):Draft EN 301 511 V12.1.10EN 301 908-1 V11.1.1 / -2 V11.1.1 /V11.1.12.4 CA combinationsCA Combinations2CAInter-band1+3,5,18,19,20,21,262+4,5,12,13,17,29,30,663+5,7,8,19,20,284+5,12,13,17,29,305+7,30,667+20,2812+3013+6629+30Intra-band2,3,4,7,40,41
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page14of51CA Combinations3CAInter-band1+3+7, 1+3+19, 1+3+20, 1+19+212+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+303+7+20, 3+7+284+5+30, 4+12+30, 4+29+305+66+2, 13+66+22 contiguous plus inter-band2+2+5, 2+2+133+3+7, 3+7+7, 3+3+204+4+5, 4+4+135+66+66, 13+66+66, 66+66+2, 66+66+662.5 Application FrameworkThe peripheralapplicationsfor L850 module are shown in Figure 2-1:Figure2-1 Application Framework
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page15of512.6 Hardware FrameworkThe hardware framework in Figure 2-2 shows the main hardware functions of L850 module, includingbase band and RF functions.Baseband contains the followings:GSM/UMTS/LTE FDD controller/Power supplyNAND/internal LPDDR2 RAMApplication interfaceRF contains the followings:RF TransceiverRF Power/PARF Front endRF FilterAntennaFigure 2-2 Hardware Framework3 Application Interface3.1 M.2InterfaceThe L850 module applies standard M.2 Key-B interface, with a total of 75 pins.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page16of513.1.1 Pin DistributionFigure 3-1 Pin DistributionNote:Pin “Notch” represents the gap of the gold fingers.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page17of513.1.2 Pin DefinitionThe pin definition is as follows:PinPin NameI/OReset ValuePin DescriptionType1CONFIG_3ONCNC,L850 M.2 module is configured asthe WWAN – PCIe,USB3.0 interfacetype2+3.3VPIPower inputPower Supply3GNDGNDPower Supply4+3.3VPIPower inputPower Supply5GNDGNDPower Supply6FUL_CARD_POWER_OFF#IPUPower enable,Module power oninput,internal pull upCMOS3.3/1.8V7USB D+I/OUSB Data Plus0.3---3V8W_DISABLE1#IPDWWAN Disable,active lowCMOS3.3/1.8V9USB D-I/OUSB Data Minus0.3---3V10LED1#OTSystem status LED,Output opendrain,CMOS 3.3VCMOS 3.3V11GNDGNDPower Supply12NotchNotch13NotchNotch14NotchNotch15NotchNotch16NotchNotch17NotchNotch18NotchNotch19NotchNotch20I2S_CLKOPDI2S Serial clock,ReservedCMOS 1.8V21CONFIG_0GNDGND,L850 M.2 module is configured asthe WWAN – PCIe,USB3.0 interfacetype22I2S_RXIPDI2S Serial receive data,CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page18of51PinPin NameI/OReset ValuePin DescriptionTypeReserved23WOWWAN#OPDWake up hostCMOS 1.8V24I2S_TXOPDI2S Serial transmit data,ReservedCMOS 1.8V25DPRIPUBody SAR Detect,active lowCMOS3.3/1.8V26W_DISABLE2#IPUGNSS disable,active low,ReservedCMOS3.3/1.8V27GNDGNDPower Supply28I2S_WAOPDI2S Word alignment/select,ReservedCMOS 1.8V29USB3.0‐Tx‐OUSB3.0 Transmit data minus,Not support now30UIM_RESETOLSIM reset signal1.8V/3V31USB3.0‐Tx+OUSB3.0 Transmit data plus,Not support now32UIM_CLKOLSIM clock Signal1.8V/3V33GNDGNDPower Supply34UIM_DATAI/OLSIM data input/output1.8V/3V35USB3.0‐Rx‐IUSB3.0 receive data minus,Not support now36UIM_PWROSIM power supply,3V/1.8V1.8V/3V37USB3.0‐Rx+IUSB3.0 receive data plus,Not support now38NCNC39GNDGNDPower Supply40GNSS_SCLOPUI2C Serial clock,ReservedCMOS 1.8V41PETn0OPCIe TX Differential signalsNegative42GNSS_SDAI/OPUI2C Serial data input/output,ReservedCMOS 1.8V43PETp0OPCIe TX Differential signals Positive
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page19of51PinPin NameI/OReset ValuePin DescriptionType44GNSS_IRQIPDGNSS Interrupt Request,ReservedCMOS 1.8V45GNDGNDPower Supply46SYSCLKOPD26M clock output1.8V47PERn0IPCIe RX Differential signalsNegative48TX_BLANKINGOPDPA Blanking TimerCMOS 1.8V49PERp0IPCIe RX Differential signals Positive50PERST#ITPE-Reset is a functional reset to theAdd-In card as defined by the PCIe MiniCard CEM specificationCMOS 3.3V51GNDGNDPower Supply52CLKREQ#OTClock Request is a reference clockrequest signal as defined by the PCIeMini Card CEM specification; Also usedby L1 PM SubstatesCMOS 3.3V53REFCLKNIPCIe Reference Clock signalNegative54PEWAKE#OLPCIe PME Wake. Open Drain with pullup on platform,active lowCMOS 3.3V55REFCLKPIPCIe Reference Clock signalPositive56RFE_RFFE2_SCLKOMIPI Interface Tunable ANT,RFFE2 clock,Open Drain outputCMOS3.3/1.8V57GNDGNDPower Supply58RFE_RFFE2_SDATAOMIPI Interface Tunable ANT,RFFE2 data,Open Drain outputCMOS3.3/1.8V59ANTCTL0OTunable ANT CTRL0CMOS 1.8V60COEX3OPDWireless Coexistence between WWANand WiFi/BT modules. IDC_UART_TXD,ReservedCMOS3.3/1.8V61ANTCTL1OTunable ANT CTRL1CMOS 1.8V62COEX2ITWireless Coexistence between WWANand WiFi/BT modules, IDC_UART_RXDCMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page20of51PinPin NameI/OReset ValuePin DescriptionType,Reserved63ANTCTL2OTunable ANT CTRL2CMOS 1.8V64COEX1OTWireless Coexistence between WWANand WiFi/BT modules, GNSS_EXT_FTA,ReservedCMOS 1.8V65NCNC66SIM_DETECTIPDSIM Detect,internal pull up(330KΩ),active highCMOS 1.8V67RESET#IWWAN reset input,internal pullup(10KΩ),active lowCMOS 1.8V68NCNC69CONFIG_1OGNDGND,L850 M.2 module is configured asthe WWAN – PCIe,USB3.0 interfacetype70+3.3VPIPower inputPower Supply71GNDGNDPower Supply72+3.3VPIPower inputPower Supply73GNDGNDPower Supply74+3.3VPIPower inputPower Supply75CONFIG_2OGNDGND,L850 M.2 module is configured asthe WWAN – PCIe,USB3.0 interfacetypeReset Value: The initial status after modulereset, not the status when working.H:High Voltage LevelL: Low Voltage LevelPD:Pull-DownPU:Pull-UpT:TristateOD:Open DrainPP:Push-PullPI: Power InputPO: Power OutputNote:The unused pins can be left floating.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page21of513.2 Power SupplyThe power interface of L850 module as shown in the following table:PinPin NameI/OPin DescriptionDC Parameter（V）MinimumValueTypicalValueMaximumValue2,4,70,72,74+3.3VPIPower supply input3.1353.34.436UIM_PWRPOUSIM power supply1.8V/3VL850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used asthe +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficientas the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used asthe external power cannot control the module status through the PCIe protocol.3.2.1 Power SupplyThe L850 module should be powered through the +3.3V pins, and the power supply design is shown inFigure 3-2:Figure 3-2 Power Supply DesignThe filter capacitor design for power supply as shown in the following table:RecommendedcapacitanceApplicationDescription220uF x 2Voltage-stabilizingcapacitorsReduce power fluctuations of the module inoperation, requiring capacitors with low ESR.LDO or DC/DC power supply requires thecapacitor of no less than 440uFThe capacitor for battery power supply can bereduced to 100~200uF1uF,100nFDigital signal noiseFilter out the interference generated from the clockand digital signals
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page22of51RecommendedcapacitanceApplicationDescription39pF,33pF700/800, 850/900MHzfrequency bandFilter out low frequency band RF interference18pF,8.2pF,6.8pF1500/1700/1800/1900,2100/2300,2500/2600MHzfrequency bandFilter out medium/high frequency band RFinterferenceThe stable power supply can ensure the normal operation of L850 module;and the ripple of the powersupply should be less than 300mV in design. When the module operates with themaximum emissionpower, the maximum operating current can reach 1000mA, so the power source should be not lower than3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:Figure 3-3 Power Supply Limit3.2.2 Logic levelThe L850module 1.8V logic level definitionas shown in the following table:ParametersMinimumTypicalMaximumUnit1.8V logic level1.711.81.89VVIH1.31.81.89VVIL-0.300.5VThe L850module 3.3V logic level definition as shown in the following table:ParametersMinimumTypicalMaximumUnit3.3V logic level3.1353.33.465VVIH2.33.33.465VVIL-0.300.9V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page23of513.2.3 Power ConsumptionIn the condition of 3.3V power supply, the L850 power consumption as shown in the following table:ParameterModeConditionAverageCurrent(mA)IoffPower offPower supply,module power off0.08ISleepWCDMADRX=62.5DRX=81.8DRX=91.6LTE FDDPaging cycle #64 frames (0.64 sec DRx cycle)2.6LTE TDDPaging cycle #64 frames (0.64 sec DRx cycle)2.8Radio OffAT+CFUN=4,Flight mode1.2IWCDMA-RMSWCDMAWCDMA Data transfer Band 1 @+23.5dBm680WCDMA Data transfer Band 2 @+23.5dBm710WCDMA Data transfer Band 4 @+23.5dBm500WCDMA Data transfer Band 5 @+23.5dBm530WCDMA Data transfer Band 8 @+23.5dBm580ILTE-RMSLTE FDDLTE FDD Data transfer Band 1 @+23dBm760LTE FDD Data transfer Band 2 @+23dBm760LTE FDD Data transfer Band 3 @+23dBm770LTE FDD Data transfer Band 4 @+23dBm710LTE FDD Data transfer Band 5 @+23dBm550LTE FDD Data transfer Band 7 @+23dBmTBDLTE FDD Data transfer Band 8 @+23dBm540LTE FDD Data transfer Band 11 @+23dBmTBDLTE FDD Data transfer Band 12 @+23dBm600LTE FDD Data transfer Band 13 @+23dBm560LTE FDD Data transfer Band 17 @+23dBm580LTE FDD Data transfer Band 18 @+23dBm560LTE FDD Data transfer Band 19 @+23dBm520LTE FDD Data transfer Band 20 @+23dBm630
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page24of51ParameterModeConditionAverageCurrent(mA)LTE FDD Data transfer Band 21 @+23dBmTBDLTE FDD Data transfer Band 26 @+23dBm540LTE FDD Data transfer Band 28 @+23dBm530LTE FDD Data transfer Band 30 @+23dBmTBDLTE FDD Data transfer Band 66 @+23dBm700LTE TDDLTE TDD Data transfer Band 38 @+23dBm450LTE TDD Data transfer Band 39 @+23dBm320LTE TDD Data transfer Band 40 @+23dBm420LTE TDD Data transfer Band 41 @+23dBm440The power consumption of L850 in 3CA mode as shown in the following tables:3CA CombinationCondition(LTE FDD 3CA, Full RB)AverageCurrent(mA)1+3+7, 1+3+19, 1+3+20, 1+19+212+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+303+7+20, 3+7+284+5+30, 4+12+30, 4+29+305+66+2, 13+66+22+2+5, 2+2+133+3+7, 3+7+7, 3+3+204+4+5, 4+4+135+66+66, 13+66+66, 66+66+2, 66+66+66Band 1 @+22dBm720Band 2 @+22dBm880Band 3 @+22dBm860Band 4 @+22dBm760Band 5 @+22dBm800Band 7 @+22dBm1110Band 12 @+22dBm790Band 13 @+22dBm630Band 19 @+22dBm760Band 20 @+22dBm750Band 21 @+22dBm950Band 28 @+22dBm720Band 30 @+22dBm1330Band 66 @+22dBm710Note：The data above is an average value obtained by testing some samples.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page25of513.3 Control SignalThe L850 module provides two control signals for power on/off and reset operations, the pin defined asshown in the following table:PinPin NameI/OReset ValueFunctionsType6FUL_CARD_POWER_OFF#IPUPower on/off signal,internalpull-upHigh or floating: Power onLow : Power off3.3/1.8V67RESET#IReset signal, internal 10KΩpull-up,active low1.8V3.3.1 Module Start-Up3.3.1.1 Start-upCircuitThe FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. TheVDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the modulestart-up，and the circuit design is shown in Figure3-4:Figure 3-4 Circuit for Module Start-up Controlled by AP3.3.1.2 Start-upTiming SequenceAfter powering on, the module will start-up by pulling upthe FUL_CARD_POWER_OFF# signal formore than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltage throughVSD2_1V8 pin and start the initialization process. The start-up timing is shown in Figure 3-5:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page26of51Figure 3-5 Timing Control for Start-upNote:The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2interface. The above timing of VSD2_1V8 is only for reference.The RESET# is required to pull high with a ton1 delay after the +3.3V, because it takes some timetocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already stablebefore starting upthe module, the delay time can be ignored.3.3.2 Module ShutdownThe module can be shut down by the following controls:Shutdown ControlActionConditionSoftwareSending AT+CPWROFF commandNormal shutdown(recommend)HardwarePull downFUL_CARD_POWER_OFF# pinOnly used whena hardware exception occursand the software control cannot be used.The module can be shut downby sending AT+CPWROFF command. When the module receives thesoftware shutdown command, the module will start the finalization process (the reverse process ofinitialization), andit will be completed after 3s. In the finalization process, the module will save the network,SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure3-6:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page27of51Figure 3-6 Software Shutdown Timing ControlAfter the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents themodule from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should bepulled low after shutting down.Note:The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2interface. The above timing of VSD2_1V8 is only for reference.3.3.3 Module ResetThe L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms(100msis recommended), and the module will restart after the RESET# signal is released. When thecustomer executes RESET# function, the PMU remains its power inside the module. The recommendedcircuit design is shown in the Figure 3-7:Figure 3-7 Recommended Design for Reset CircuitThe reset control timing is shown in Figure 3-8:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page28of51Figure 3-10 Reset Timing ControlNote:RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. Incase of PCB layout, the RESET# signal lines should keep away from the RF interference andprotected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route onthe surface planes to avoid module from reset caused by ESD problems.3.4 USB InterfaceThe L850 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USBFull-Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module, please referto“Universal Serial Bus Specification 2.0”.USB interface just for debugging.3.4.1 USB Interface DefinitionPin#Pin NameI/OReset ValueDescriptionType7USB_D+I/OUSB Data Plus0.3---3V,USB2.09USB_D-I/OUSB Data Minus0.3---3V,USB2.03.4.2 USB2.0 Interface ApplicationUSB interface is used for debugging only, so it only needs to introduce the USB interface test in hardwaredesign.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page29of513.5 PCIe InterfaceL850 module supports PCIe 1.0 interface and one data transmission channel.After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIMport and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10system and GNSS interface for receiving GNSS data.3.5.1 PCIe Interface DefinitionPin#Pin NameI/OReset ValueDescriptionType41PETn0OPCIe TX Differential signalsNegative43PETP0OPCIe TX Differential signals Positive47PERn0IPCIe RX Differential signalsNegativeBit049PERP0IPCIe RX Differential signals Positive53REFCLKNIPCIe Reference Clock signalNegative55REFCLKPIPCIe Reference Clock signalPositive50PERST#ITPE-Reset is a functional reset to the Add-Incard as defined by the PCIe Mini Card CEMspecificationCMOS 3.3V52CLKREQ#OTClock Request is a reference clock requestsignal as defined by the PCIe Mini Card CEMspecification; Also used by L1 PM SubstatesCMOS 3.3V54PEWAKE#OLPCIe PME Wake. Open Drain with pull up onplatform,active lowCMOS 3.3V3.5.2 PCIe Interface ApplicationThe reference circuit is shown in Figure 3-9:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page30of51Figure 3-9 Reference Circuit for PCIe InterfaceL850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N,receiving pair RXP/N and clock pair CLKP/N.PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below inPCB Layout:The differential signal pair lines shall be parallel and equal in length;The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;The impedance of differential signal pair lines is recommended to be 100 ohm, and can becontrolled to 80～120 ohm in accordance with PCIe protocol;It shall avoid the discontinuous reference ground, such as segment and space;When the differential signal lines go through different layers, the via hole of grounding signal shouldbe in close to that of signal, and generally, each pair of signals require 1-3 grounding signal viaholes and the lines shall never cross the segment of plane;Try to avoid bended lines and avoid introducing common-mode noise in the system, which willinfluence the signal integrity and EMI of difference pair. As shown in Figure 3-10, the bendingangle of all lines should be equal or greater than 135°, the spacing between difference pairlines should be larger than 20mil, and the line caused by bending should be greater than 1.5times line width at least. When a serpentine line is used for length match with another line, thebended length of each segment shall be at least 3 times the line width ( ≥3W). The largestspacing between the bended part of the serpentine line and another one of the differential linesmust be less than 2 times the spacing of normal differential lines (S1<2S);
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page31of51Figure 3-10 Requirement of PCIe LineThe difference in length of two data lines in difference pair should be within 5mil, and the lengthmatch is required for all parts. When the length match is conducted for the differential lines, thedesigned position of correct match should be close to that of incorrect match, as shown in Figure3-11. However, there is no specific requirements for the length match of transmit pair and receivingpair, that is, the length match is only required in the internal differential lines rather than betweendifferent difference pairs. The length match should be close to the signal pin and pass thesmall-angle bending design.Figure 3-11 Length Match Design of PCIe Difference Pair3.6 USIMInterfaceThe L850 module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards.3.6.1 USIM PinsThe USIM pins descriptionas shown in the following table:PinPin NameI/OReset ValueDescriptionType36UIM_PWRPOUSIM power supply1.8V/3V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page32of51PinPin NameI/OReset ValueDescriptionType30UIM_RESETOLUSIM reset1.8V/3V32UIM_CLKOLUSIM clock1.8V/3V34UIM_DATAI/OLUSIM data,internal pull up(4.7KΩ)1.8V/3V66SIM_DETECTIPDUSIM card detect, internal 390Kpull-up.Active high, and high level indicatesSIM card is inserted; and low levelindicates SIM card is detached.1.8V3.6.2 USIM Interface Circuit3.6.2.1 N.C. SIMCard SlotThe reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3-12:Figure 3-12Reference Circuit for N.C. SIM Card SlotThe principlesof theN.C.SIM card slot are described as follows:When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives theSIM_DETECT pin low.When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives theSIM_DETECT pin high.3.6.2.2 N.O. SIM Card SlotThe reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-13:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page33of51Figure 3-13 Reference Circuit for N.O. SIM Card SlotThe principlesof theN.O.SIM card slot are described as follows:When the SIM card is detached, it connects an open circuit between CD and SW pins, and drivesthe SIM_DETECT pin low.When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives theSIM_DETECT pin high.3.6.3 USIM Hot-PluggingThe L850 module supports the SIM card hot-plugging function, which determines whether the SIM card isinserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.The SIM card hot-plugging function can be configuredby “AT+MSMPD” command, and the description forAT command as shown in the following table:AT CommandHot-pluggingDetectionFunction DescriptionAT+MSMPD=1EnableDefault value, the SIM card hot-plugging detection function isenabled.The module can detect whether the SIM card is inserted or notthrough the SIM_DETECT pin state.AT+MSMPD=0DisableThe SIM card hot-plugging detect function is disabled.The module readsthe SIM card when starting up, and theSIM_DETECT status will not be detected.After the SIM card hot-plugging detection functionis enabled, the module detects that the SIM card isinsertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page34of51network registration after reading the SIM card information. When the SIM_DETECT pin is low, themodule determines that the SIM card is detachedand does not read the SIM card.Note:By default, SIM_DETECT is active-high, which can be switched to active-low by the ATcommand. Please refer to the AT CommandsManual for the AT command.3.6.4 USIM DesignThe SIM card circuit design shall meet the EMC standards and ESD requirements with theimprovedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowingguidelines should be noted in case of design:The SIM card slotplacement should near the module as close as possible, and away from the RFantenna, DC/DC power supply, clock signal lines, and other strong interference sources.The SIM card slot with a metal shielding housing can improve the anti-interference ability.The trace length between the SIM card slotand the module should not exceed 100mm, or it couldreduce the signal quality.The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalkinterference. If it is difficult for the layout, the whole SIM signal lines should be wrapped withGND as a group at least.The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM cardslot, and the ESD devices with 22~33pF capacitance should be used.3.7 Status IndicatorThe L850 module providesthree signals to indicate the operating status of the module, and the statusindicator pinsas shown in the following table:PinPin NameI/OReset ValuePin DescriptionType10LED1#OPDSystem status LED, drain output.CMOS 3.3V23WOWWAN#OPUModule wakes upHost (AP).CMOS 1.8V48TX_BLANKINGOPDPA Blanking output, externalGPS controlsignal.CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page35of513.7.1 LED#1SignalThe LED#1 signal is used to indicate the operating status of the module, and the detailed description asshown in the following table:Module StatusLED1# SignalRF function ONLow level (LED On)RF function OFFHigh level (LED Off)The LED driving circuit is as follows:Figure 3-14 LEDDriving CircuitNote:The resistance of LED current-limiting resistor is selected according to the driving voltage andthe driving current.3.7.2 WOWWAN#The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definitionof WOWWAN# signal is as follows:Operating ModeWOWWAN# Signaldata requestsPull low 1s then pull high (pulse signal).Idle/SleepHigh levelThe WOWWAN# timing is shown in Figure 3-15:Figure 3-15 WOWWAN#Timing
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page36of513.7.3 TX_BLANKINGWhen the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronouswith TDD burst TX timing.As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receivingwhen detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.Operating Mode of ModuleTX_BLANKING SignalDefault stateLow levelTDD burst TX(Band38)Output the pulse signal synchronous with TDD burst TXTX_BLANKING timing is shown in Figure 3-16:Figure 3-16 TX_BLANKING Timing3.8 Interrupt ControlThe L850 module provides four interrupt signals, and the pin definition is as follows:PinPin NameI/OReset ValuePin DescriptionType8W_DISABLE1#IPDEnable/Disable RF networkCMOS 3.3V25DPRIPUBody SAR detectionCMOS 1.8V26W_DISABLE2#IPUGNSS Disablesignal,ReservedCMOS 1.8V44GNSS_IRQIPDGNSS Interrupt Request,ReservedCMOS 1.8V3.8.1 W_DISABLE1#The module provides a hardware pin to enable/disable WWAN RF function, and the function can also becontrolled by the AT command. The module enters the Flight mode afterthe RF function is disabled. Thedefinition of W_DISABLE1# signal is as follows:W_DISABLE1# signalFunctionHigh/FloatingWWAN function is enabled, the module exits the Flight mode.LowWWAN function is disabled, the module entersFlight mode.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page37of51Note：The function of W_DISABLE1# can be customized, please refer to the software porting guide.3.8.2 BODYSARThe L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is highby default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down.As the result, the module then lowers down its emission power to its default threshold value, thusreducing theRF radiation onthe human body. The threshold of emission power can be set by the ATCommands. The definition ofDPR signalas shown in the following table:DPR signalFunctionHigh/FloatingThe module keeps the default emission powerLowLower the maximum emission power to the threshold value of the module.3.9 ClockInterfaceThe L850 module supports a clock interface, itcan output 26MHz clock.PinPin NameI/OReset ValuePin DescriptionType46SYSCLKO26M clock output, default disabledcan be used for externalGPS, etc1.8V3.10ANT Tunable InterfaceThe module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bitGPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexiblyconfigure the bands of LTE antenna to improve the antenna’s working efficiency and save space for theantenna.PinPin NameI/OReset ValuePin DescriptionType56RFE_RFFE2_SCLKOTunable ANT control,MIPI Interface,RFFE2 clock,Open Drain outputCMOS3.3/1.8V58RFE_RFFE2_SDATAOTunable ANT control,MIPI Interface,RFFE2 data,Open Drain outputCMOS3.3/1.8V59ANTCTL0OTunable ANT control,GPO interface,CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page38of51PinPin NameI/OReset ValuePin DescriptionTypeBit061ANTCTL1OTunable ANT control,GPO interface,bit1CMOS 1.8V63ANTCTL2OTunable ANT control,GPO interface,Bit2CMOS 1.8V3.11Config InterfaceThe L850 module provides four config pins for the configuration as the WWAN-PCIe, USB3.0 type M.2module:PinPin NameI/OReset ValuePin DescriptionType1CONFIG_3ONC21CONFIG_0OLInternally connected to GND69CONFIG_1OLInternally connected to GND75CONFIG_2OLInternally connected to GNDThe M.2 module configuration as the following table:Config_0(pin21)Config_1(pin69)Config_2(pin75)Config_3(pin1)Module Type and MainHost InterfacePortConfigurationGNDGNDGNDNCWWAN – PCIe,USB3.00Please refer to ”PCI Express M.2 Specification Rev1.0” for more details.3.12Other InterfacesThe module does not support other interfaces yet.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page39of514 Radio Frequency4.1 RF Interface4.1.1 RF Interface FunctionalityThe L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,used to receive the diversity RF signals.Figure 4-1 RF connectors4.1.2 RFConnector CharacteristicRated ConditionEnvironment ConditionFrequency RangeDC to 6GHzTemperature RangeCharacteristic Impedance50Ω–40°C to +85°C4.1.3 RF Connector DimensionThe L850 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECTcompany, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page40of51Figure 4-2 RF connector dimensionsFigure 4-3 0.81mm coaxial antenna dimensionsFigure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page41of514.2 Operating BandThe L850 module operating bands of the antennas are as follows:OperatingBandDescriptionModeTx (MHz)Rx (MHz)Band 1IMT 2100MHzLTE FDD/WCDMA1920 - 19802110 - 2170Band 2PCS 1900MHzLTE FDD/WCDMA1850 - 19101930 - 1990Band 3DCS 1800MHzLTE FDD1710 - 17851805 - 1880Band 4AWS 1700MHzLTE FDD/WCDMA1710 - 17552110 - 2155Band 5CLR 850MHzLTE FDD/WCDMA824 - 849869 - 894Band 7IMT-E 2600MhzLTE FDD2500 - 25702620 - 2690Band 8E-GSM 900MHzLTE FDD/WCDMA880 - 915925 - 960Band 11LPDC 1500MHzLTE FDD1427.9 - 1447.91475.9 - 1495.9Band 12LSMH Blocks A/B/C700MHzLTE FDD699 - 716729 - 746Band 13USMH Block C700MHzLTE FDD777 - 787746 - 756Band 17LSMH Blocks B/C700MHzLTE FDD704 - 716734 - 746Band 18Japan Lower 800MHzLTE FDD815 - 830860 - 875Band 19Japan Upper 800MHzLTE FDD830 - 845875 - 890Band 20EUDD 800MHzLTE FDD832 - 862791 - 821Band 21UPDC 1500MHzLTE FDD1447.9 - 1462.91495.9 - 1510.9Band 26ECLR 850MHzLTE FDD814 - 849859 - 894Band 28APAC 700MHzLTE FDD703 - 748758 - 803Band 29LSMH blocks D/E700MHzLTE FDDN/A716 - 728Band 30WCS blocks A2300MHzLTE FDD2305 - 23152350 - 2360Band 661700MHzLTE FDD1710 - 17802110 - 2200Band 38IMT-E 2600MHzLTE TDD2570 - 2620Band 39TDD 1900MHZLTE TDD1880 - 1920
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page42of51OperatingBandDescriptionModeTx (MHz)Rx (MHz)Band 40IMT 2300MHzLTE TDD2300 - 2400Band 41BRS/EBS 2500MHZLTE TDD2496 - 2690GPS L1N/A1575.42±1.023GLONASSL1N/A1602.5625±4BeiDouN/A1561.098±2.0464.3 Transmitting PowerThe transmitting power foreach band of the L850 moduleas shown in the following table:ModeBandTx Power(dBm)NoteWCDMABand 123.5±1Band 223.5±1Band 423.5±1Band 523.5±1Band 823.5±1LTE FDDBand 123±110MHz Bandwidth, 1 RBBand 223±110MHz Bandwidth, 1 RBBand 323±110MHz Bandwidth, 1 RBBand 423±110MHz Bandwidth, 1 RBBand 523±110MHz Bandwidth, 1 RBBand 723±110MHz Bandwidth, 1 RBBand 823±110MHz Bandwidth, 1 RBBand 1123±110MHz Bandwidth, 1 RBBand 1223±110MHz Bandwidth, 1 RBBand 1323±110MHz Bandwidth, 1 RBBand 1723±110MHz Bandwidth, 1 RBBand 1823±110MHz Bandwidth, 1 RBBand 1923±110MHz Bandwidth, 1 RBBand 2023±110MHz Bandwidth, 1 RB
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page43of51ModeBandTx Power(dBm)NoteBand 2123±110MHz Bandwidth, 1 RBBand 2623±110MHz Bandwidth, 1 RBBand 2823±110MHz Bandwidth, 1 RBBand 3023±110MHz Bandwidth, 1 RBBand 6623±110MHz Bandwidth, 1 RBLTE TDDBand 3823±110MHz Bandwidth, 1 RBBand 3923±110MHz Bandwidth, 1 RBBand 4023±110MHz Bandwidth, 1 RBBand 4123±110MHz Bandwidth, 1 RB4.4 Receiver SensitivityThe receiver sensitivity foreach band of the L850 module as shown in the following table:ModeBandRx Sensitivity(dBm)TypicalNoteWCDMABand 1TBDBER<0.1%Band 2TBDBER<0.1%Band 4TBDBER<0.1%Band 5TBDBER<0.1%Band 8TBDBER<0.1%LTE FDDBand 1TBD10MHz BandwidthBand 2TBD10MHz BandwidthBand 3TBD10MHz BandwidthBand 4TBD10MHz BandwidthBand 5TBD10MHz BandwidthBand 7TBD10MHz BandwidthBand 8TBD10MHz BandwidthBand 11TBD10MHz BandwidthBand 12TBD10MHz BandwidthBand 13TBD10MHz BandwidthBand 17TBD10MHz Bandwidth
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page44of51ModeBandRx Sensitivity(dBm)TypicalNoteBand 18TBD10MHz BandwidthBand 19TBD10MHz BandwidthBand 20TBD10MHz BandwidthBand 21TBD10MHz BandwidthBand 26TBD10MHz BandwidthBand 28TBD10MHz BandwidthBand 29TBD10MHz BandwidthBand 30TBD10MHz BandwidthBand 66TBD10MHz BandwidthLTE TDDBand 38TBD10MHz BandwidthBand 39TBD10MHz BandwidthBand 40TBD10MHz BandwidthBand 41TBD10MHz BandwidthNote:The above values are measuredfor the dual antennas situation(Main+Diversity). For single mainantenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE.4.5 GNSSL850 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidouintegrated antenna.DescriptionConditionTest ResultPowerGPS fixingTBDGPS trackingTBDGLONASS fixingTBDGLONASS trackingTBDBeiDou fixingTBDBeiDou trackingTBDSleepTBD
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page45of51DescriptionConditionTest ResultTTFFGPS/GLONASS/BeiDouCold startTBDWarm startTBDHot StartTBDAGNSSCold startTBDSensitivityGPSOpen SkyTBDGLONASSOpen SkyTBDBeiDouOpen SkyTBDNote:Please note that GPS current is tested with RF disabled.4.6 Antenna DesignThe L850module provides main and diversity antenna interfaces, and the antenna design requirementsas shown in the following table:L850 module Main antenna requirementsFrequency rangeThe most proper antenna to adapt the frequencies should be used.Bandwidth(WCDMA)WCDMA band 1(2100) : 250 MHzWCDMA band 2(1900) : 140 MHzWCDMA band 4(1700) : 445 MHzWCDMA band 5(850) : 70 MHzWCDMA band 8(900) : 80 MHzBandwidth(LTE)LTE band 1(2100): 250 MHzLTE band 2(1900): 140MHzLTE Band 3(1800): 170 MHzLTE band 4(1700): 445MHzLTE band 5(850): 70 MHzLTE band 7(2600): 190 MHzLTE Band 8(900): 80 MHzLTE Band 11(1500): 68 MHzLTE Band 12(700): 47 MHzLTE Band 13(700): 41 MHz
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page46of51L850 module Main antenna requirementsLTE Band 17(700): 42 MHzLTE Band 18(800): 80 MHzLTE Band 19(800): 80 MHzLTE band 20(800): 71 MHzLTE band 21(1500): 63 MHzLTE band 26(850): 80 MHzLTE band 28(700): 100 MHzLTE band 29(700): 12 MHzLTE band 30(2300): 55 MHzLTE band 66(1700): 490MHzLTE band 38(2600): 50 MHzLTE Band 39(1900): 40 MHzLTE band 40(2300): 100 MHzLTE band 41(2500): 194 MHzBandwidth(GNSS/BeiDou)GPS: 2MHzGLONASS: 8MHzBeiDou: 4MHzImpedance50OhmInput power> 26dBmaverage power WCDMA & LTERecommended standing-waveratio (SWR)≤ 2:1
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page47of515 Structure Specification5.1 Product AppearanceThe product appearance for L850 module is shown in Figure5-1:Figure 5-1 Module Appearance5.2 Dimension of StructureThe structuraldimensionof the L850 module is shown in Figure 5-2:Figure 5-2 Dimension of Structure
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page48of515.3 M.2 Interface ModelThe L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8pins are notch pins as shown in Figure 3-1. For module dimension, please refer to chapter 5.2. Based onthe M.2 interface definition, L850 module adopts Type 3042-S3-B interface (30x42mm, the componentmaximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).5.4 M.2 ConnectorThe L850 module connects to AP via M.2 connector, it is recommended to use M.2 connector fromLOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector,please refer to the specification.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page49of51Figure 5-3 M.2 Dimension of Structure5.5 Storage5.5.1 Storage LifeStorage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is12 months.5.6 PackingThe L850 module uses the tray sealed vacuum packing, combined with the outer packing method usingthe hard cartoon box, so that the storage, transportation and the usage of modules can be protected tothe greatest extent.Note：The module is a precision electronic product, and may suffer permanent damage if no correctelectrostatic protection measures are taken.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page50of515.6.1 Tray PackageThe L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxesin each case. Tray packaging process is shown in Figure 5-4:Figure 5-4 Tray Packaging Process
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page51of515.6.2 Tray sizeThe pallet size is 330*175*6.0mm, as shown in Figure 5-5:ITEMLWHTA0B0DIM330.0±0.5175.0±0.56.0±0.30.5±0.143±0.333.0±0.3ITEMA1B1CDEFDIM294.0±0.3159.0±0.320.0±0.59.0±0.524.5±0.5187.5±0.2ITEMGJDIM105.0±0.29.0±0.2Figure 5-5Tray Size (Unit: mm)

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