Fibocom Wireless L850GL LTE module User Manual ng

Fibocom Wireless Inc. LTE module ng

Users Manual

Download: Fibocom Wireless L850GL LTE module User Manual ng
Mirror Download [FCC.gov]Fibocom Wireless L850GL LTE module User Manual ng
Document ID3309590
Application IDKGpB50e3btTctwokAXOkVA==
Document DescriptionUsers Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize211.99kB (2649815 bits)
Date Submitted2017-03-09 00:00:00
Date Available2017-09-06 00:00:00
Creation Date2017-02-25 16:41:03
Document Lastmod2017-02-25 16:41:03
Document Titleng
Document CreatorWPS Office
Document Author: fangs

L850-GL Hardware User Manual
Version：V1.0.3
Update date：2/25/2017
Applicability Table
No.
Product model
Description
L850-GL
NA
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 2 of 51
Copyright
Copyright © 2017Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Version Record
Version
Update date
Remark
V1.0.0
2016-12-08
Draft
V1.0.1
2016-12-16
Modify the PCIe Interface Application;
Update the Pin Definition: change pin65 to NC
Modify the description
V1.0.2
2017-02-09
Update the content of PCIe
Add the power Consumption of 3CA
V1.0.3
2017-02-25
Add product certification of warnings
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 3 of 51
Contents
1 Foreword.......................................................................................................................................... 7
1.1 Introduction........................................................................................................................................... 7
1.2 Reference Standard............................................................................................................................ 7
1.3 Related Documents............................................................................................................................. 7
2 Overview...........................................................................................................................................8
2.1 Introduction........................................................................................................................................... 8
2.2 Specification..........................................................................................................................................8
2.3 Warnings............................................................................................................................................... 9
2.3.1 FCC Statement...................................................................................................................................9
2.3.2 IC Statement.....................................................................................................................................11
2.3.3 CE Statement................................................................................................................................... 12
2.4 CA combinations................................................................................................................................13
2.5 Application Framework..................................................................................................................... 14
2.6 Hardware Framework........................................................................................................................15
3 Application Interface...................................................................................................................15
3.1 M.2Interface........................................................................................................................................15
3.1.1 Pin Distribution................................................................................................................................. 16
3.1.2 Pin Definition.................................................................................................................................... 17
3.2 Power Supply..................................................................................................................................... 21
3.2.1 Power Supply................................................................................................................................... 21
3.2.2 Logic level......................................................................................................................................... 22
3.2.3 Power Consumption........................................................................................................................23
3.3 Control Signal.....................................................................................................................................25
3.3.1 Module Start-Up...............................................................................................................................25
3.3.1.1 Start-upCircuit.................................................................................................................................................25
3.3.1.2 Start-upTiming Sequence............................................................................................................................. 25
3.3.2 Module Shutdown............................................................................................................................26
3.3.3 Module Reset................................................................................................................................... 27
3.4 USB Interface..................................................................................................................................... 28
3.4.1 USB Interface Definition................................................................................................................. 28
3.4.2 USB2.0 Interface Application.........................................................................................................28
3.5 PCIe Interface.................................................................................................................................... 29
3.5.1 PCIe Interface Definition................................................................................................................ 29
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 4 of 51
3.5.2 PCIe Interface Application..............................................................................................................29
3.6 USIMInterface.................................................................................................................................... 31
3.6.1 USIM Pins......................................................................................................................................... 31
3.6.2 USIM Interface Circuit.....................................................................................................................32
3.6.2.1 N.C. SIMCard Slot......................................................................................................................................... 32
3.6.2.2 N.O. SIM Card Slot........................................................................................................................................ 32
3.6.3 USIM Hot-Plugging..........................................................................................................................33
3.6.4 USIM Design.................................................................................................................................... 34
3.7 Status Indicator.................................................................................................................................. 34
3.7.1 LED#1Signal.....................................................................................................................................35
3.7.2 WOWWAN#......................................................................................................................................35
3.7.3 TX_BLANKING................................................................................................................................ 36
3.8 Interrupt Control................................................................................................................................. 36
3.8.1 W_DISABLE1#.................................................................................................................................36
3.8.2 BODYSAR........................................................................................................................................ 37
3.9 ClockInterface.................................................................................................................................... 37
3.10 ANT Tunable Interface....................................................................................................................37
3.11 Config Interface................................................................................................................................38
3.12 Other Interfaces............................................................................................................................... 38
4 Radio Frequency..........................................................................................................................39
4.1 RF Interface........................................................................................................................................ 39
4.1.1 RF Interface Functionality.............................................................................................................. 39
4.1.2 RFConnector Characteristic.......................................................................................................... 39
4.1.3 RF Connector Dimension...............................................................................................................39
4.2 Operating Band.................................................................................................................................. 41
4.3 Transmitting Power............................................................................................................................42
4.4 Receiver Sensitivity........................................................................................................................... 43
4.5 GNSS...................................................................................................................................................44
4.6 Antenna Design..................................................................................................................................45
5 Structure Specification.............................................................................................................. 47
5.1 Product Appearance..........................................................................................................................47
5.2 Dimension of Structure..................................................................................................................... 47
5.3 M.2 Interface Model...........................................................................................................................48
5.4 M.2 Connector....................................................................................................................................48
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 5 of 51
5.5 Storage................................................................................................................................................ 49
5.5.1 Storage Life...................................................................................................................................... 49
5.6 Packing................................................................................................................................................49
5.6.1 Tray Package................................................................................................................................... 50
5.6.2 Tray size............................................................................................................................................51
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 6 of 51
1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and
other instructions, the developers can quickly understand the hardware functions of L850 modules and
develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission
and reception (FDD);Part 1: Conformance specification
3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio
transmission and reception (TDD)
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
PCI Express M.2 Specification Rev1.0
1.3 Related Documents
L850 Module Performance Testing Report
RF Antenna Application Design Specification
L8-Family System Driver Integration and Application Guidance
L8-Family AT CommandsManual
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 7 of 51
2 Overview
2.1 Introduction
L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface
and supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication
networks of the mobile operator across the world.
2.2 Specification
Specification
LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66
LTE TDD: Band 38, 39, 40, 41
Operating Band
WCDMA/HSPA+: Band 1,2,4,5,8
GNSS/Beidou: support
LTE FDD
450Mbps DL/50Mbps UL(Cat 9)
260Mbps DL/30Mbps UL(Cat 9)
Data Transmission
LTE TDD
When LTE TDD achieves maximum DL rate, its UL rate can
reach 10Mbps only
UMTS:384 kbps DL/384 kbps UL
UMTS/HSPA+
Power Supply
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
DC 3.135V～4.4V,Typical 3.3V
Normal operating temperature:-10°C ～+55°C
Temperature
Expandoperating temperature:-20°C ～+70°C
Storage temperature: -40°C ～+85°C
Interface: M.2 Key-B
Physical
characteristics
Dimension：30 x 42 x 2.3mm
Weight: About5.8 g
Interface
WWAN Main Antenna x 1
Antenna
WWAN Diversity Antenna x 1
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 8 of 51
USIM 3V/1.8V
USB 2.0（just for debugging）
PCIe 1.0 X1
W_Disable#
BodySar
Function Interface
LED
Clock
Tunable antenna
I2S(Reserved)
I2C(Reserved)
USB3.0(not supported yet)
Software
Protocol Stack
IPV4/IPV6
AT commands
3GPP TS 27.007 and 27.005
Firmware update
PCIe
Multiple carrier
Other feature
Windows MBIM support
Windows update
AGNSS
Note:
For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature
ranging from -20℃ to +60℃.
2.3 Warnings
2.3.1 FCC Statement
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 9 of 51
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications.
installation.
However, there is no guarantee that interference will not occur in a particular
If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 5 dBi.
2)
The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 10 of 51
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that
20 cm may be maintained between the antenna and users. The final end product must be labeled in a
visible area with the following: “Contains FCC ID: ZMOL850GL”. The grantee's FCC ID can be used only
when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
2.3.2 IC Statement
Industry Canada statement

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions:
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause undesired
operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1) l'appareil ne doit pas produire de brouillage, et
2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.

This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this
device does not cause harmful interference.

Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la
condition que cet appareil ne provoque aucune interférence nuisible.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 11 of 51

This device and its antenna(s) must not be co-located or operating in conjunction with any other
antenna or transmitter, except tested built-in radios.

Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre
antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.

The County Code Selection feature is disabled for products marketed in the US/ Canada.

La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux
États-Unis et au Canada.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your
body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
IC : 21374-L850GL
2.3.3 CE Statement
► EU Regulatory Conformance
Hereby, We, Manufacturer name declares that the radio equipment type L850-GL is in compliance with
the Directive 2014/53/EU.
In all cases assessment of the final product must be mass against the Essential requirements of the
Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article
3.2 requirements.
The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm.
► Declaration of Conformity(should include manufacturer contact info.)
Please added certification standard in your user manual which depended on the test standards your
device performed., If the DoC should be a simplified version, please take below as reference, The
full text of the EU declaration of conformity is available at the following internet address: http//www.
fibocom.com
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 12 of 51
L850-GL is in conformity with the relevant Union harmonization legislation: Radio Equipment directive:
2014 / 53 / EUwith reference to the following standards applied:
Health (Article 3.1(a) of Directive 2014/53/EU)
Applied Standard(s):
EN 62311 : 2008
Safety (Article 3.1(a) of Directive 2014/53/EU)
Applied Standard(s):
EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013
Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)
Applied Standard(s):
Draft EN 301 489-1 V2.1.1 / -3 V2.1.0 /-52 V1.1.0
Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)
Applied Standard(s):
Draft EN 301 511 V12.1.10
EN 301 908-1 V11.1.1 / -2 V11.1.1 /V11.1.1
2.4 CA combinations
CA Combinations
1+3,5,18,19,20,21,26
2+4,5,12,13,17,29,30,66
3+5,7,8,19,20,28
4+5,12,13,17,29,30
2CA
Inter-band
5+7,30,66
7+20,28
12+30
13+66
29+30
Intra-band
2,3,4,7,40,41
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 13 of 51
CA Combinations
1+3+7, 1+3+19, 1+3+20, 1+19+21
2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30
3+7+20, 3+7+28
Inter-band
4+5+30, 4+12+30, 4+29+30
5+66+2, 13+66+2
3CA
2+2+5, 2+2+13
2 contiguous plus inter-band
3+3+7, 3+7+7, 3+3+20
4+4+5, 4+4+13
5+66+66, 13+66+66, 66+66+2, 66+66+66
2.5 Application Framework
The peripheralapplicationsfor L850 module are shown in Figure 2-1:
Figure2-1 Application Framework
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 14 of 51
2.6 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L850 module, including
base band and RF functions.
Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply
NAND/internal LPDDR2 RAM
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front end
RF Filter
Antenna
Figure 2-2 Hardware Framework
3 Application Interface
3.1 M.2Interface
The L850 module applies standard M.2 Key-B interface, with a total of 75 pins.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 15 of 51
3.1.1 Pin Distribution
Figure 3-1 Pin Distribution
Note:
Pin “Notch” represents the gap of the gold fingers.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 16 of 51
3.1.2 Pin Definition
The pin definition is as follows:
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
NC,L850 M.2 module is configured as
CONFIG_3
NC
the WWAN – PCIe,USB3.0 interface
type
+3.3V
GND
+3.3V
GND
FUL_CARD_
POWER_OFF#
PI
PI
PU
Power input
Power Supply
GND
Power Supply
Power input
Power Supply
GND
Power Supply
Power
on CMOS
3.3/1.8V
USB Data Plus
0.3---3V
USB D+
I/O
W_DISABLE1#
USB D-
I/O
10
LED1#
11
GND
GND
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
power
input,internal pull up
PD
enable,Module
CMOS
WWAN Disable,active low
3.3/1.8V
USB Data Minus
PD
System
status
0.3---3V
LED,Output
open
drain,CMOS 3.3V
I2S Serial clock,
Reserved
CMOS 3.3V
Power Supply
CMOS 1.8V
GND,L850 M.2 module is configured as
21
CONFIG_0
GND
the WWAN – PCIe,USB3.0 interface
type
22
I2S_RX
PD
I2S Serial receive data,
CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 17 of 51
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
Reserved
23
WOWWAN#
PD
24
I2S_TX
PD
25
DPR
PU
26
W_DISABLE2#
PU
27
GND
28
I2S_WA
29
USB3.0‐Tx‐
30
UIM_RESET
31
USB3.0‐Tx+
32
UIM_CLK
33
GND
34
UIM_DATA
I/O
35
USB3.0‐Rx‐
36
UIM_PWR
37
USB3.0‐Rx+
38
NC
NC
39
GND
GND
40
GNSS_SCL
41
PETn0
42
GNSS_SDA
I/O
43
PETp0
PD
Wake up host
I2S Serial transmit data,
Reserved
Body SAR Detect,active low
CMOS 1.8V
CMOS 1.8V
CMOS
3.3/1.8V
GNSS disable,active low,
CMOS
Reserved
3.3/1.8V
GND
Power Supply
I2S Word alignment/select,
Reserved
CMOS 1.8V
USB3.0 Transmit data minus,
Not support now
SIM
reset signal
1.8V/3V
USB3.0 Transmit data plus,
Not support now
SIM clock Signal
1.8V/3V
GND
Power Supply
SIM
data input/output
1.8V/3V
USB3.0 receive data minus,
Not support now
SIM power supply,3V/1.8V
1.8V/3V
USB3.0 receive data plus,
Not support now
PU
I2C Serial clock,
Reserved
Power Supply
CMOS 1.8V
PCIe TX Differential signals
Negative
PU
I2C Serial data input/output,
Reserved
CMOS 1.8V
PCIe TX Differential signals Positive
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 18 of 51
Pin
Pin Name
I/O
Reset Value
44
GNSS_IRQ
PD
45
GND
46
SYSCLK
47
PERn0
48
TX_BLANKING
49
PERp0
PD
Pin Description
GNSS Interrupt Request,
Reserved
Type
CMOS 1.8V
GND
Power Supply
26M clock output
1.8V
PCIe RX Differential signals
Negative
PD
PA Blanking Timer
CMOS 1.8V
PCIe RX Differential signals Positive
PE-Reset is a functional reset to the
50
PERST#
Add-In card as defined by the PCIe Mini CMOS 3.3V
Card CEM specification
51
GND
GND
Power Supply
Clock Request is a reference clock
52
CLKREQ#
request signal as defined by the PCIe
Mini Card CEM specification; Also used
CMOS 3.3V
by L1 PM Substates
53
REFCLKN
54
PEWAKE#
55
REFCLKP
56
57
58
59
RFE_RFFE2_
SCLK
PCIe Reference Clock signal
Negative
SDATA
ANTCTL0
up on platform,active low
Positive
MIPI Interface Tunable ANT,
CMOS
RFFE2 clock,Open Drain output
3.3/1.8V
GND
Power Supply
MIPI Interface Tunable ANT,
CMOS
RFFE2 data,Open Drain output
3.3/1.8V
Tunable ANT CTRL0
CMOS 1.8V
Wireless Coexistence between WWAN
60
COEX3
PD
and WiFi/BT modules. IDC_UART_TXD,
Reserved
61
ANTCTL1
62
COEX2
CMOS 3.3V
PCIe Reference Clock signal
GND
RFE_RFFE2_
PCIe PME Wake. Open Drain with pull
Tunable ANT CTRL1
Wireless Coexistence between WWAN
and WiFi/BT modules, IDC_UART_RXD
CMOS
3.3/1.8V
CMOS 1.8V
CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 19 of 51
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
,Reserved
63
ANTCTL2
Tunable ANT CTRL2
CMOS 1.8V
Wireless Coexistence between WWAN
64
COEX1
and WiFi/BT modules, GNSS_EXT_FTA CMOS 1.8V
,Reserved
65
NC
NC
66
SIM_DETECT
67
RESET#
68
NC
PD
SIM Detect,internal pull up(330KΩ),
CMOS 1.8V
active high
WWAN
reset
input,internal
pull
up(10KΩ),active low
CMOS 1.8V
NC
GND,L850 M.2 module is configured as
69
CONFIG_1
GND
the WWAN – PCIe,USB3.0 interface
type
70
+3.3V
71
GND
72
+3.3V
73
GND
74
+3.3V
PI
PI
PI
Power input
Power Supply
GND
Power Supply
Power input
Power Supply
GND
Power Supply
Power input
Power Supply
GND,L850 M.2 module is configured as
75
CONFIG_2
GND
the WWAN – PCIe,USB3.0 interface
type
Reset Value: The initial status after modulereset, not the status when working.
H:High Voltage Level
L: Low Voltage Level
PD:Pull-Down
PU:Pull-Up
T:Tristate
OD:Open Drain
PP:Push-Pull
PI: Power Input
PO: Power Output
Note:
The unused pins can be left floating.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 20 of 51
3.2 Power Supply
The power interface of L850 module as shown in the following table:
DC Parameter（V）
Pin
Pin Name
I/O
Pin Description
2,4,70,72,74
+3.3V
PI
Power supply input
36
UIM_PWR
PO
USIM power supply
Minimum
Typical
Maximum
Value
Value
Value
3.135
3.3
4.4
1.8V/3V
L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as
the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient
as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as
the external power cannot control the module status through the PCIe protocol.
3.2.1 Power Supply
The L850 module should be powered through the +3.3V pins, and the power supply design is shown in
Figure 3-2:
Figure 3-2 Power Supply Design
The filter capacitor design for power supply as shown in the following table:
Recommended
capacitance
Application
Description
Reduce power fluctuations of the module in
operation, requiring capacitors with low ESR.
220uF x 2
Voltage-stabilizing

capacitors
LDO or DC/DC power supply requires the
capacitor of no less than 440uF

The capacitor for battery power supply can be
reduced to 100~200uF
1uF,100nF
Digital signal noise
Filter out the interference generated from the clock
and digital signals
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 21 of 51
Recommended
capacitance
39pF,33pF
Application
Description
700/800,
850/900
MHzfrequency band
1500/1700/1800/1900,2100/
18pF,8.2pF,6.8pF
2300,2500/2600MHzfrequen
cy band
Filter out low frequency band RF interference
Filter
out
medium/high
frequency
band
RF
interference
The stable power supply can ensure the normal operation of L850 module;and the ripple of the power
supply should be less than 300mV in design. When the module operates with themaximum emission
power, the maximum operating current can reach 1000mA, so the power source should be not lower than
3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:
Figure 3-3 Power Supply Limit
3.2.2 Logic level
The L850module 1.8V logic level definitionas shown in the following table:
Parameters
Minimum
Typical
Maximum
Unit
1.8V logic level
1.71
1.8
1.89
VIH
1.3
1.8
1.89
VIL
-0.3
0.5
The L850module 3.3V logic level definition as shown in the following table:
Parameters
Minimum
Typical
Maximum
Unit
3.3V logic level
3.135
3.3
3.465
VIH
2.3
3.3
3.465
VIL
-0.3
0.9
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 22 of 51
3.2.3 Power Consumption
In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:
Average
Parameter
Mode
Condition
Ioff
Power off
Power supply,module power off
0.08
DRX=6
2.5
DRX=8
1.8
DRX=9
1.6
LTE FDD
Paging cycle #64 frames (0.64 sec DRx cycle)
2.6
LTE TDD
Paging cycle #64 frames (0.64 sec DRx cycle)
2.8
Radio Off
AT+CFUN=4,Flight mode
1.2
WCDMA Data transfer Band 1 @+23.5dBm
680
WCDMA Data transfer Band 2 @+23.5dBm
710
WCDMA Data transfer Band 4 @+23.5dBm
500
WCDMA Data transfer Band 5 @+23.5dBm
530
WCDMA Data transfer Band 8 @+23.5dBm
580
LTE FDD Data transfer Band 1 @+23dBm
760
LTE FDD Data transfer Band 2 @+23dBm
760
LTE FDD Data transfer Band 3 @+23dBm
770
LTE FDD Data transfer Band 4 @+23dBm
710
LTE FDD Data transfer Band 5 @+23dBm
550
LTE FDD Data transfer Band 7 @+23dBm
TBD
LTE FDD Data transfer Band 8 @+23dBm
540
LTE FDD Data transfer Band 11 @+23dBm
TBD
LTE FDD Data transfer Band 12 @+23dBm
600
LTE FDD Data transfer Band 13 @+23dBm
560
LTE FDD Data transfer Band 17 @+23dBm
580
LTE FDD Data transfer Band 18 @+23dBm
560
LTE FDD Data transfer Band 19 @+23dBm
520
LTE FDD Data transfer Band 20 @+23dBm
630
WCDMA
ISleep
IWCDMA-RMS
ILTE-RMS
WCDMA
LTE FDD
Current(mA)
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 23 of 51
Parameter
Mode
LTE TDD
Average
Condition
Current(mA)
LTE FDD Data transfer Band 21 @+23dBm
TBD
LTE FDD Data transfer Band 26 @+23dBm
540
LTE FDD Data transfer Band 28 @+23dBm
530
LTE FDD Data transfer Band 30 @+23dBm
TBD
LTE FDD Data transfer Band 66 @+23dBm
700
LTE TDD Data transfer Band 38 @+23dBm
450
LTE TDD Data transfer Band 39 @+23dBm
320
LTE TDD Data transfer Band 40 @+23dBm
420
LTE TDD Data transfer Band 41 @+23dBm
440
The power consumption of L850 in 3CA mode as shown in the following tables:
3CA Combination
Condition
(LTE FDD 3CA, Full RB)
Average
Current(mA)
Band 1 @+22dBm
720
Band 2 @+22dBm
880
Band 3 @+22dBm
860
1+3+7, 1+3+19, 1+3+20, 1+19+21
Band 4 @+22dBm
760
2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30
Band 5 @+22dBm
800
3+7+20, 3+7+28
Band 7 @+22dBm
1110
Band 12 @+22dBm
790
Band 13 @+22dBm
630
Band 19 @+22dBm
760
4+4+5, 4+4+13
Band 20 @+22dBm
750
5+66+66, 13+66+66, 66+66+2, 66+66+66
Band 21 @+22dBm
950
Band 28 @+22dBm
720
Band 30 @+22dBm
1330
Band 66 @+22dBm
710
4+5+30, 4+12+30, 4+29+30
5+66+2, 13+66+2
2+2+5, 2+2+13
3+3+7, 3+7+7, 3+3+20
Note：
The data above is an average value obtained by testing some samples.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 24 of 51
3.3 Control Signal
The L850 module provides two control signals for power on/off and reset operations, the pin defined as
shown in the following table:
Pin
Pin Name
I/O
FUL_CARD_POWER_
OFF#
Reset Value Functions
Type
Power on/off signal,internalpull-up
PU
3.3/1.8V
High or floating: Power on
Low : Power off
67
RESET#
Reset signal, internal 10KΩ
1.8V
pull-up,active low
3.3.1 Module Start-Up
3.3.1.1 Start-upCircuit
The FUL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The
VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module
start-up，and the circuit design is shown in Figure3-4:
Figure 3-4 Circuit for Module Start-up Controlled by AP
3.3.1.2 Start-upTiming Sequence
After powering on, the module will start-up by pulling upthe FUL_CARD_POWER_OFF# signal for
more than 20ms (100msis recommended). Meanwhile, the module will output 1.8V voltage through
VSD2_1V8 pin and start the initialization process. The start-up timing is shown in Figure 3-5:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 25 of 51
Figure 3-5 Timing Control for Start-up
Note:
The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2
interface. The above timing of VSD2_1V8 is only for reference.
The RESET# is required to pull high with a ton1 delay after the +3.3V, because it takes some time
tocharge thecapacitors for +3.3V power supply. If the +3.3V power supply is already stable
before starting upthe module, the delay time can be ignored.
3.3.2 Module Shutdown
The module can be shut down by the following controls:
Shutdown Control Action
Condition
Software
Sending AT+CPWROFF command
Normal shutdown(recommend)
Pull down
Only used whena hardware exception occurs
FUL_CARD_POWER_OFF# pin
and the software control cannot be used.
Hardware
The module can be shut downby sending AT+CPWROFF command. When the module receives the
software shutdown command, the module will start the finalization process (the reverse process of
initialization), andit will be completed after 3s. In the finalization process, the module will save the network,
SIM card and some other parameters from memory, then clear the memory and PMU will be powered off.
After shutdown, the VSD2_1V8 voltage is also shut down. The software control timing isshown in Figure
3-6:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 26 of 51
Figure 3-6 Software Shutdown Timing Control
After the software shutdown, the FUL_CARD_POWER_OFF # pin will remain high which prevents the
module from restarting again. Toenable the next restart, the FUL_CARD_POWER_OFF#pin should be
pulled low after shutting down.
Note:
The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2
interface. The above timing of VSD2_1V8 is only for reference.
3.3.3 Module Reset
The L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms
(100msis recommended), and the module will restart after the RESET# signal is released. When the
customer executes RESET# function, the PMU remains its power inside the module. The recommended
circuit design is shown in the Figure 3-7:
Figure 3-7 Recommended Design for Reset Circuit
The reset control timing is shown in Figure 3-8:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 27 of 51
Figure 3-10 Reset Timing Control
Note:
RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In
case of PCB layout, the RESET# signal lines should keep away from the RF interference and
protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on
the surface planes to avoid module from reset caused by ESD problems.
3.4 USB Interface
The L850 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB
Full-Speed (12 Mbit/s). For the USB timing and electrical specification of L850 module, please refer
to“Universal Serial Bus Specification 2.0”.
USB interface just for debugging.
3.4.1 USB Interface Definition
Pin#
Pin Name
I/O
Reset Value
Description
USB_D+
I/O
USB Data Plus
USB_D-
I/O
USB Data Minus
Type
0.3---3V,
USB2.0
0.3---3V,
USB2.0
3.4.2 USB2.0 Interface Application
USB interface is used for debugging only, so it only needs to introduce the USB interface test in hardware
design.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 28 of 51
3.5 PCIe Interface
L850 module supports PCIe 1.0 interface and one data transmission channel.
After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM
port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10
system and GNSS interface for receiving GNSS data.
3.5.1 PCIe Interface Definition
Pin#
Pin Name
I/O
41
PETn0
43
PETP0
47
PERn0
49
PERP0
53
REFCLKN
55
REFCLKP
Reset Value
Description
Type
PCIe TX Differential signals
Negative
PCIe TX Differential signals Positive
PCIe RX Differential signals
NegativeBit0
PCIe RX Differential signals Positive
PCIe Reference Clock signal
Negative
PCIe Reference Clock signal
Positive
PE-Reset is a functional reset to the Add-In
50
PERST#
card as defined by the PCIe Mini Card CEM CMOS 3.3V
specification
Clock Request is a reference clock request
52
CLKREQ#
signal as defined by the PCIe Mini Card CEM CMOS 3.3V
specification; Also used by L1 PM Substates
54
PEWAKE#
PCIe PME Wake. Open Drain with pull up on
platform,active low
CMOS 3.3V
3.5.2 PCIe Interface Application
The reference circuit is shown in Figure 3-9:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 29 of 51
Figure 3-9 Reference Circuit for PCIe Interface
L850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N,
receiving pair RXP/N and clock pair CLKP/N.
PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in
PCB Layout:
The differential signal pair lines shall be parallel and equal in length;
The differential signal pair lines shall be short if possible and be controlled within 500mm for AP end;
The impedance of differential signal pair lines is recommended to be 100 ohm, and can be
controlled to 80～120 ohm in accordance with PCIe protocol;
It shall avoid the discontinuous reference ground, such as segment and space;
When the differential signal lines go through different layers, the via hole of grounding signal should
be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via
holes and the lines shall never cross the segment of plane;
Try to avoid bended lines and avoid introducing common-mode noise in the system, which will
influence the signal integrity and EMI of difference pair. As shown in Figure 3-10, the bending
angle of all lines should be equal or greater than 135 ° , the spacing between difference pair
lines should be larger than 20mil, and the line caused by bending should be greater than 1.5
times line width at least. When a serpentine line is used for length match with another line, the
bended length of each segment shall be at least 3 times the line width ( ≥ 3W). The largest
spacing between the bended part of the serpentine line and another one of the differential lines
must be less than 2 times the spacing of normal differential lines (S1<2S);
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 30 of 51
Figure 3-10 Requirement of PCIe Line
The difference in length of two data lines in difference pair should be within 5mil, and the length
match is required for all parts. When the length match is conducted for the differential lines, the
designed position of correct match should be close to that of incorrect match, as shown in Figure
3-11. However, there is no specific requirements for the length match of transmit pair and receiving
pair, that is, the length match is only required in the internal differential lines rather than between
different difference pairs. The length match should be close to the signal pin and pass the
small-angle bending design.
Figure 3-11 Length Match Design of PCIe Difference Pair
3.6 USIMInterface
The L850 module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards.
3.6.1 USIM Pins
The USIM pins descriptionas shown in the following table:
Pin
Pin Name
I/O
36
UIM_PWR
PO
Reset Value Description
USIM power supply
Type
1.8V/3V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 31 of 51
Pin
Pin Name
I/O
Reset Value Description
Type
30
UIM_RESET
USIM reset
1.8V/3V
32
UIM_CLK
USIM clock
1.8V/3V
34
UIM_DATA
I/O
USIM data,internal pull up(4.7KΩ)
1.8V/3V
USIM card detect, internal 390K
pull-up.
66
SIM_DETECT
PD
Active high, and high level indicates
1.8V
SIM card is inserted; and low level
indicates SIM card is detached.
3.6.2 USIM Interface Circuit
3.6.2.1 N.C. SIMCard Slot
The reference circuit design for N.C. (Normally Closed)SIM card slot is shown in Figure 3-12:
Figure 3-12Reference Circuit for N.C. SIM Card Slot
The principlesof theN.C.SIM card slot are described as follows:
When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the
SIM_DETECT pin low.
When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the
SIM_DETECT pin high.
3.6.2.2 N.O. SIM Card Slot
The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-13:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 32 of 51
Figure 3-13
Reference Circuit for N.O. SIM Card Slot
The principlesof theN.O.SIM card slot are described as follows:
When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives
the SIM_DETECT pin low.
When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the
SIM_DETECT pin high.
3.6.3 USIM Hot-Plugging
The L850 module supports the SIM card hot-plugging function, which determines whether the SIM card is
inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.
The SIM card hot-plugging function can be configuredby “AT+MSMPD” command, and the description for
AT command as shown in the following table:
AT Command
Hot-plugging
Detection
Function Description
Default value, the SIM card hot-plugging detection function is
AT+MSMPD=1
Enable
enabled.
The module can detect whether the SIM card is inserted or not
through the SIM_DETECT pin state.
The SIM card hot-plugging detect function is disabled.
AT+MSMPD=0
Disable
The module readsthe SIM card when starting up, and the
SIM_DETECT status will not be detected.
After the SIM card hot-plugging detection functionis enabled, the module detects that the SIM card is
insertedwhen the SIM_DETECT pin is high, then executes the initialization program and finish the
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 33 of 51
network registration after reading the SIM card information. When the SIM_DETECT pin is low, the
module determines that the SIM card is detachedand does not read the SIM card.
Note:
By default, SIM_DETECT is active-high, which can be switched to active-low by the AT
command. Please refer to the AT CommandsManual for the AT command.
3.6.4 USIM Design
The SIM card circuit design shall meet the EMC standards and ESD requirements with the
improvedcapability to resist interference, to ensure that the SIM card can work stably. Thefollowing
guidelines should be noted in case of design:
The SIM card slotplacement should near the module as close as possible, and away from the RF
antenna, DC/DC power supply, clock signal lines, and other strong interference sources.
The SIM card slot with a metal shielding housing can improve the anti-interference ability.
The trace length between the SIM card slotand the module should not exceed 100mm, or it could
reduce the signal quality.
The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk
interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with
GND as a group at least.
The filter capacitors and ESDdevices for SIM card signals should be placed near to the SIM card
slot, and the ESD devices with 22~33pF capacitance should be used.
3.7 Status Indicator
The L850 module providesthree signals to indicate the operating status of the module, and the status
indicator pinsas shown in the following table:
Pin
Pin Name
I/O
Reset Value Pin Description
10
LED1#
PD
System status LED, drain output.
CMOS 3.3V
23
WOWWAN#
PU
Module wakes upHost (AP).
CMOS 1.8V
48
TX_BLANKING
PD
PA Blanking output, externalGPS control
signal.
Type
CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 34 of 51
3.7.1 LED#1Signal
The LED#1 signal is used to indicate the operating status of the module, and the detailed description as
shown in the following table:
Module Status
LED1# Signal
RF function ON
Low level (LED On)
RF function OFF
High level (LED Off)
The LED driving circuit is as follows:
Figure 3-14 LEDDriving Circuit
Note:
The resistance of LED current-limiting resistor is selected according to the driving voltage and
the driving current.
3.7.2 WOWWAN#
The WOWWAN# signal is used to wake the Host (AP) when there comes the data request.The definition
of WOWWAN# signal is as follows:
Operating Mode
WOWWAN# Signal
data requests
Pull low 1s then pull high (pulse signal).
Idle/Sleep
High level
The WOWWAN# timing is shown in Figure 3-15:
Figure 3-15 WOWWAN#Timing
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 35 of 51
3.7.3 TX_BLANKING
When the module operates in LTE TDD Band 39, TX_BLANKING outputs the pulse signal synchronous
with TDD burst TX timing.
As TDD TX may interfere the receiving of GPS signal, AP will disable GPS or stop GPS data receiving
when detecting TX_BLANKING pulse signal, so as to avoid abnormal operation of GPS.
Operating Mode of Module
TX_BLANKING Signal
Default state
Low level
TDD burst TX(Band38)
Output the pulse signal synchronous with TDD burst TX
TX_BLANKING timing is shown in Figure 3-16:
Figure 3-16 TX_BLANKING Timing
3.8 Interrupt Control
The L850 module provides four interrupt signals, and the pin definition is as follows:
Pin
Pin Name
I/O
Reset Value Pin Description
Type
W_DISABLE1#
PD
Enable/Disable RF network
CMOS 3.3V
25
DPR
PU
Body SAR detection
CMOS 1.8V
26
W_DISABLE2#
PU
44
GNSS_IRQ
PD
GNSS Disablesignal,
Reserved
GNSS Interrupt Request,
Reserved
CMOS 1.8V
CMOS 1.8V
3.8.1 W_DISABLE1#
The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be
controlled by the AT command. The module enters the Flight mode afterthe RF function is disabled. The
definition of W_DISABLE1# signal is as follows:
W_DISABLE1# signal
Function
High/Floating
WWAN function is enabled, the module exits the Flight mode.
Low
WWAN function is disabled, the module entersFlight mode.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 36 of 51
Note：
The function of W_DISABLE1# can be customized, please refer to the software porting guide.
3.8.2 BODYSAR
The L850 module supportsBody SARfunction by detecting the DPR pin. The voltage level of DPR is high
by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down.
As the result, the module then lowers down its emission power to its default threshold value, thus
reducing theRF radiation onthe human body. The threshold of emission power can be set by the AT
Commands. The definition ofDPR signalas shown in the following table:
DPR signal
Function
High/Floating
The module keeps the default emission power
Low
Lower the maximum emission power to the threshold value of the module.
3.9 ClockInterface
The L850 module supports a clock interface, itcan output 26MHz clock.
Pin
Pin Name
I/O
46
SYSCLK
Reset Value
Pin Description
26M clock output, default disabled
can be used for externalGPS, etc
Type
1.8V
3.10ANT Tunable Interface
The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bit
GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly
configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the
antenna.
Pin
56
58
59
Pin Name
RFE_RFFE2_
SCLK
RFE_RFFE2_
SDATA
ANTCTL0
I/O
Reset Value
Pin Description
Type
Tunable ANT control,MIPI Interface,
CMOS
RFFE2 clock,Open Drain output
3.3/1.8V
Tunable ANT control,MIPI Interface,
CMOS
RFFE2 data,Open Drain output
3.3/1.8V
Tunable ANT control,GPO interface,
CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 37 of 51
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
Bit0
61
ANTCTL1
63
ANTCTL2
Tunable ANT control,GPO interface,
bit1
Tunable ANT control,GPO interface,
Bit2
CMOS 1.8V
CMOS 1.8V
3.11Config Interface
The L850 module provides four config pins for the configuration as the WWAN-PCIe, USB3.0 type M.2
module:
Pin
Pin Name
I/O
Reset Value
Pin Description
CONFIG_3
21
CONFIG_0
Internally connected to GND
69
CONFIG_1
Internally connected to GND
75
CONFIG_2
Internally connected to GND
Type
NC
The M.2 module configuration as the following table:
Config_0
Config_1
Config_2
Config_3
Module Type and Main
Port
(pin21)
(pin69)
(pin75)
(pin1)
Host Interface
Configuration
GND
GND
GND
NC
WWAN – PCIe,USB3.0
Please refer to ”PCI Express M.2 Specification Rev1.0” for more details.
3.12Other Interfaces
The module does not support other interfaces yet.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 38 of 51
4 Radio Frequency
4.1 RF Interface
4.1.1 RF Interface Functionality
The L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1
shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,
used to receive the diversity RF signals.
Figure 4-1 RF connectors
4.1.2 RFConnector Characteristic
Rated Condition
Environment Condition
Frequency Range
DC to 6GHz
Temperature Range
Characteristic Impedance
50Ω
–40°C to +85°C
4.1.3 RF Connector Dimension
The L850 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT
company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 39 of 51
Figure 4-2 RF connector dimensions
Figure 4-3 0.81mm coaxial antenna dimensions
Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 40 of 51
4.2 Operating Band
The L850 module operating bands of the antennas are as follows:
Operating
Description
Mode
Tx (MHz)
Rx (MHz)
Band 1
IMT 2100MHz
LTE FDD/WCDMA
1920 - 1980
2110 - 2170
Band 2
PCS 1900MHz
LTE FDD/WCDMA
1850 - 1910
1930 - 1990
Band 3
DCS 1800MHz
LTE FDD
1710 - 1785
1805 - 1880
Band 4
AWS 1700MHz
LTE FDD/WCDMA
1710 - 1755
2110 - 2155
Band 5
CLR 850MHz
LTE FDD/WCDMA
824 - 849
869 - 894
Band 7
IMT-E 2600Mhz
LTE FDD
2500 - 2570
2620 - 2690
Band 8
E-GSM 900MHz
LTE FDD/WCDMA
880 - 915
925 - 960
Band 11
LPDC 1500MHz
LTE FDD
1427.9 - 1447.9
1475.9 - 1495.9
LTE FDD
699 - 716
729 - 746
LTE FDD
777 - 787
746 - 756
LTE FDD
704 - 716
734 - 746
Band 18
Japan Lower 800MHz LTE FDD
815 - 830
860 - 875
Band 19
Japan Upper 800MHz LTE FDD
830 - 845
875 - 890
Band 20
EUDD 800MHz
LTE FDD
832 - 862
791 - 821
Band 21
UPDC 1500MHz
LTE FDD
1447.9 - 1462.9
1495.9 - 1510.9
Band 26
ECLR 850MHz
LTE FDD
814 - 849
859 - 894
Band 28
APAC 700MHz
LTE FDD
703 - 748
758 - 803
LTE FDD
N/A
716 - 728
LTE FDD
2305 - 2315
2350 - 2360
1710 - 1780
2110 - 2200
Band
Band 12
Band 13
Band 17
Band 29
Band 30
LSMH Blocks A/B/C
700MHz
USMH Block C
700MHz
LSMH Blocks B/C
700MHz
LSMH blocks D/E
700MHz
WCS blocks A
2300MHz
Band 66
1700MHz
LTE FDD
Band 38
IMT-E 2600MHz
LTE TDD
2570 - 2620
Band 39
TDD 1900MHZ
LTE TDD
1880 - 1920
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 41 of 51
Operating
Description
Mode
Band 40
IMT 2300MHz
LTE TDD
2300 - 2400
Band 41
BRS/EBS 2500MHZ
LTE TDD
2496 - 2690
Band
Tx (MHz)
GPS L1
GLONASS
L1
BeiDou
Rx (MHz)
N/A
1575.42±1.023
N/A
1602.5625±4
N/A
1561.098±2.046
4.3 Transmitting Power
The transmitting power foreach band of the L850 moduleas shown in the following table:
Mode
WCDMA
LTE FDD
Band
Tx Power(dBm)
Note
Band 1
23.5±1
Band 2
23.5±1
Band 4
23.5±1
Band 5
23.5±1
Band 8
23.5±1
Band 1
23±1
10MHz Bandwidth, 1 RB
Band 2
23±1
10MHz Bandwidth, 1 RB
Band 3
23±1
10MHz Bandwidth, 1 RB
Band 4
23±1
10MHz Bandwidth, 1 RB
Band 5
23±1
10MHz Bandwidth, 1 RB
Band 7
23±1
10MHz Bandwidth, 1 RB
Band 8
23±1
10MHz Bandwidth, 1 RB
Band 11
23±1
10MHz Bandwidth, 1 RB
Band 12
23±1
10MHz Bandwidth, 1 RB
Band 13
23±1
10MHz Bandwidth, 1 RB
Band 17
23±1
10MHz Bandwidth, 1 RB
Band 18
23±1
10MHz Bandwidth, 1 RB
Band 19
23±1
10MHz Bandwidth, 1 RB
Band 20
23±1
10MHz Bandwidth, 1 RB
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 42 of 51
Mode
LTE TDD
Band
Tx Power(dBm)
Note
Band 21
23±1
10MHz Bandwidth, 1 RB
Band 26
23±1
10MHz Bandwidth, 1 RB
Band 28
23±1
10MHz Bandwidth, 1 RB
Band 30
23±1
10MHz Bandwidth, 1 RB
Band 66
23±1
10MHz Bandwidth, 1 RB
Band 38
23±1
10MHz Bandwidth, 1 RB
Band 39
23±1
10MHz Bandwidth, 1 RB
Band 40
23±1
10MHz Bandwidth, 1 RB
Band 41
23±1
10MHz Bandwidth, 1 RB
4.4 Receiver Sensitivity
The receiver sensitivity foreach band of the L850 module as shown in the following table:
Mode
WCDMA
LTE FDD
Band
Rx Sensitivity(dBm)
Typical
Note
Band 1
TBD
BER<0.1%
Band 2
TBD
BER<0.1%
Band 4
TBD
BER<0.1%
Band 5
TBD
BER<0.1%
Band 8
TBD
BER<0.1%
Band 1
TBD
10MHz Bandwidth
Band 2
TBD
10MHz Bandwidth
Band 3
TBD
10MHz Bandwidth
Band 4
TBD
10MHz Bandwidth
Band 5
TBD
10MHz Bandwidth
Band 7
TBD
10MHz Bandwidth
Band 8
TBD
10MHz Bandwidth
Band 11
TBD
10MHz Bandwidth
Band 12
TBD
10MHz Bandwidth
Band 13
TBD
10MHz Bandwidth
Band 17
TBD
10MHz Bandwidth
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 43 of 51
Mode
Band
LTE TDD
Rx Sensitivity(dBm)
Typical
Note
Band 18
TBD
10MHz Bandwidth
Band 19
TBD
10MHz Bandwidth
Band 20
TBD
10MHz Bandwidth
Band 21
TBD
10MHz Bandwidth
Band 26
TBD
10MHz Bandwidth
Band 28
TBD
10MHz Bandwidth
Band 29
TBD
10MHz Bandwidth
Band 30
TBD
10MHz Bandwidth
Band 66
TBD
10MHz Bandwidth
Band 38
TBD
10MHz Bandwidth
Band 39
TBD
10MHz Bandwidth
Band 40
TBD
10MHz Bandwidth
Band 41
TBD
10MHz Bandwidth
Note:
The above values are measuredfor the dual antennas situation(Main+Diversity). For single main
antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE.
4.5 GNSS
L850 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou
integrated antenna.
Description
Power
Condition
Test Result
GPS fixing
TBD
GPS tracking
TBD
GLONASS fixing
TBD
GLONASS tracking
TBD
BeiDou fixing
TBD
BeiDou tracking
TBD
Sleep
TBD
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 44 of 51
Description
Condition
Cold start
TBD
Warm start
TBD
Hot Start
TBD
AGNSS
Cold start
TBD
GPS
Open Sky
TBD
GLONASS
Open Sky
TBD
BeiDou
Open Sky
TBD
GPS/GLONASS/BeiDou
TTFF
Sensitivity
Test Result
Note:
Please note that GPS current is tested with RF disabled.
4.6 Antenna Design
The L850module provides main and diversity antenna interfaces, and the antenna design requirements
as shown in the following table:
L850 module Main antenna requirements
Frequency range
The most proper antenna to adapt the frequencies should be used.
WCDMA band 1(2100) : 250 MHz
WCDMA band 2(1900) : 140 MHz
Bandwidth(WCDMA)
WCDMA band 4(1700) : 445 MHz
WCDMA band 5(850) : 70 MHz
WCDMA band 8(900) : 80 MHz
Bandwidth(LTE)
LTE band 1(2100):
250 MHz
LTE band 2(1900):
140MHz
LTE Band 3(1800):
170 MHz
LTE band 4(1700):
445MHz
LTE band 5(850):
70 MHz
LTE band 7(2600):
190 MHz
LTE Band 8(900):
80 MHz
LTE Band 11(1500):
68 MHz
LTE Band 12(700):
47 MHz
LTE Band 13(700):
41 MHz
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 45 of 51
L850 module Main antenna requirements
LTE Band 17(700):
42 MHz
LTE Band 18(800):
80 MHz
LTE Band 19(800):
80 MHz
LTE band 20(800):
71 MHz
LTE band 21(1500):
63 MHz
LTE band 26(850):
80 MHz
LTE band 28(700):
100 MHz
LTE band 29(700):
12 MHz
LTE band 30(2300):
55 MHz
LTE band 66(1700):
490MHz
LTE band 38(2600):
50 MHz
LTE Band 39(1900):
40 MHz
LTE band 40(2300):
100 MHz
LTE band 41(2500):
194 MHz
GPS: 2MHz
Bandwidth(GNSS/BeiDou)
GLONASS: 8MHz
BeiDou: 4MHz
Impedance
50Ohm
Input power
> 26dBmaverage power WCDMA & LTE
Recommended standing-wave
ratio (SWR)
≤ 2:1
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 46 of 51
5 Structure Specification
5.1 Product Appearance
The product appearance for L850 module is shown in Figure5-1:
Figure 5-1
Module Appearance
5.2 Dimension of Structure
The structuraldimensionof the L850 module is shown in Figure 5-2:
Figure 5-2 Dimension of Structure
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 47 of 51
5.3 M.2 Interface Model
The L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8
pins are notch pins as shown in Figure 3-1. For module dimension, please refer to chapter 5.2. Based on
the M.2 interface definition, L850 module adopts Type 3042-S3-B interface (30x42mm, the component
maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).
5.4 M.2 Connector
The L850 module connects to AP via M.2 connector, it is recommended to use M.2 connector from
LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector,
please refer to the specification.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 48 of 51
Figure 5-3 M.2 Dimension of Structure
5.5 Storage
5.5.1 Storage Life
Storage Conditions (recommended): Temperature is 23 ± 5 ℃, relative humidity is RH 35-70%.
Storage period (sealed vacuum packing): Under the recommended storage conditions, the storage life is
12 months.
5.6 Packing
The L850 module uses the tray sealed vacuum packing, combined with the outer packing method using
the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to
the greatest extent.
Note：
The module is a precision electronic product, and may suffer permanent damage if no correct
electrostatic protection measures are taken.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 49 of 51
5.6.1 Tray Package
The L850 module uses tray package,20 pcs are packed in each tray, with 5 trays in each box and 6 boxes
in each case. Tray packaging process is shown in Figure 5-4:
Figure 5-4 Tray Packaging Process
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 50 of 51
5.6.2 Tray size
The pallet size is 330*175*6.0mm, as shown in Figure 5-5:
ITEM
A0
B0
DIM
330.0±0.5
175.0±0.5
6.0±0.3
0.5±0.1
43±0.3
33.0±0.3
ITEM
A1
B1
DIM
294.0±0.3
159.0±0.3
20.0±0.5
9.0±0.5
24.5±0.5
187.5±0.2
ITEM
DIM
105.0±0.2
9.0±0.2
Figure 5-5Tray Size (Unit: mm)
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
L850-GL Hardware User Manual
Page 51 of 51
Source Exif Data: 
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.7
Linearized                      : No
Page Count                      : 51
Author                          : fangs
Comments                        : 
Company                         : 
Create Date                     : 2017:02:25 16:41:03+08:41
Creator                         : WPS Office
Modify Date                     : 2017:02:25 16:41:03+08:41
Producer                        : 
Source Modified                 : D:20170225164103+08'41'
Subject                         : 
Title                           : ng
Trapped                         : false
EXIF Metadata provided by EXIF.tools
FCC ID Filing: ZMOL850GL

Navigation menu