Fibocom Wireless L850GLD-D1 LTE module User Manual

Fibocom Wireless Inc. LTE module

User Manual

L850-GL Hardware User Manual Version：1.0.6 Update date：Feb 26th, 2018
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 2 of 54 Copyright Copyright © 2017 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Trademark The trademark is registered and owned by Fibocom Wireless Inc. Version Record Version Update date Remark V1.0.0 2016-12-08 Draft V1.0.1 2016-12-16 Modify the PCIe Interface Application; Update the Pin Definition: change pin65 to NC V1.0.2 2017-02-09 Modify the description Update the content of PCIe Add the power Consumption of 3CA V1.0.3 2017-07-26 1. Update timing of power on/off and reset 2. Update PCIe, add USB support 3. Update power consumption, TX power, RX sensitivity and other data V1.0.4 2017-12-06 Update Storage and packing and PCIe signal description, power consumption, CA combine V1.0.5 2018-1-16 1. Modify CA combinations and TDD data throughput 2. Modify description of power consumption condition 3. Optimize power on/off/reset timing V1.0.6 2018-2-26 1. Modify COEX pin define 2. Del L850-GL-02 product model
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 3 of 54 Applicability Table No. Product model Description 1 L850-GL-00 NA 2 L850-GL-01 NA 3 L850-GL-03 NA 4 L850-GL-05 NA 5 L850-GL-10 NA
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 4 of 54 Contents 1Foreword ............................................................................................................................................ 71.1Introduction .......................................................................................................................... 71.2Reference Standard ............................................................................................................. 71.3Related Documents ............................................................................................................. 72Overview ............................................................................................................................................ 82.1Introduction .......................................................................................................................... 82.2Specification ......................................................................................................................... 82.3Warning ................................................................................................................................ 92.3.1FCC Statement ............................................................................................................. 92.3.2IC Statement ................................................................................................................ 112.3.3CE Statement .............................................................................................................. 122.4CA combinations ................................................................................................................ 132.5Application Framework ...................................................................................................... 142.6Hardware Block Diagram ................................................................................................... 143Application Interface ......................................................................................................................... 163.1M.2 Interface ...................................................................................................................... 163.1.1Pin Map ...................................................................................................................... 163.1.2Pin Definition ............................................................................................................... 173.2Power Supply ..................................................................................................................... 213.2.1Power Supply .............................................................................................................. 213.2.2Logic level ................................................................................................................... 223.2.3Power Consumption ................................................................................................... 233.3Control Signal .................................................................................................................... 253.3.1Module Start-Up .......................................................................................................... 263.3.1.1Start-up Circuit ..................................................................................................... 263.3.1.2Start-up Timing Sequence ................................................................................... 263.3.2Module Shutdown ....................................................................................................... 273.3.3Module Reset .............................................................................................................. 283.3.4PCIe Reset ................................................................................................................. 293.4PCIe & USB ....................................................................................................................... 303.4.1PCIe Interface ............................................................................................................. 303.4.1.1PCIe Interface Definition ...................................................................................... 303.4.1.2PCIe Interface Application ................................................................................... 31
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 5 of 54 3.4.2USB Interface ............................................................................................................. 333.4.2.1USB Interface Definition ...................................................................................... 333.4.2.2USB2.0 Interface Application ............................................................................... 333.4.2.3USB3.0 Interface Application ............................................................................... 343.5USIM Interface ................................................................................................................... 353.5.1USIM Pins ................................................................................................................... 353.5.2USIM Interface Circuit ................................................................................................. 353.5.2.1N.C. SIM Card Slot .............................................................................................. 353.5.2.2N.O. SIM Card Slot .............................................................................................. 363.5.3USIM Hot-Plugging ..................................................................................................... 373.5.4USIM Design ............................................................................................................... 373.6Status Indicator .................................................................................................................. 383.6.1LED#1 Signal .............................................................................................................. 383.7Interrupt Control ................................................................................................................. 393.7.1W_DISABLE1# ........................................................................................................... 393.7.2BODYSAR .................................................................................................................. 393.8Clock Interface ................................................................................................................... 403.9ANT Tunable Interface ....................................................................................................... 403.10Configuration Interface ....................................................................................................... 403.11Other Interfaces ................................................................................................................. 414Radio Frequency .............................................................................................................................. 424.1RF Interface ....................................................................................................................... 424.1.1RF Interface Functionality ........................................................................................... 424.1.2RF Connector Characteristic ....................................................................................... 424.1.3RF Connector Dimension ........................................................................................... 424.2Operating Band .................................................................................................................. 444.3Transmitting Power ............................................................................................................ 454.4Receiver Sensitivity ............................................................................................................ 464.5GNSS ................................................................................................................................. 474.6Antenna Design ................................................................................................................. 485Structure Specification ...................................................................................................................... 505.1Product Appearance .......................................................................................................... 505.2Dimension of Structure ....................................................................................................... 505.3M.2 Interface Model ........................................................................................................... 51
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 6 of 54 5.4M.2 Connector ................................................................................................................... 515.5Storage .............................................................................................................................. 525.5.1Storage Life ................................................................................................................ 525.6Packing .............................................................................................................................. 525.6.1Tray Package .............................................................................................................. 525.6.2Tray size ..................................................................................................................... 53
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 7 of 54 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L850 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards:  3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission and reception (FDD);Part 1: Conformance specification  3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD)  3GPP TS 36.521-1 V11.4.0: User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing  3GPP TS 21.111 V10.0.0: USIM and IC card requirements  3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-ME) interface  3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM) application  3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)  3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment  3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)  3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)  PCI Express M.2 Specification Rev1.1 1.3 Related Documents  RF Antenna Application Design Specification  L8-Family System Driver Integration and Application Guidance  L8-Family AT Commands Manual
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 8 of 54 2 Overview 2.1 Introduction L850 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. 2.2 Specification Specification Operating Band LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20, 21, 26, 28, 29, 30, 66LTE TDD: Band 38, 39, 40, 41 WCDMA/HSPA+: Band 1, 2, 4, 5, 8 GNSS/Beidou: support Data Transmission LTE FDD 450Mbps DL/50Mbps UL(Cat 9) LTE TDD 347Mbps DL/30Mbps UL(Cat 9) When LTE TDD achieves maximum DL rate, its UL rate can reach 10Mbps only UMTS/HSPA+ UMTS: 384 kbps DL/384 kbps UL DC-HSPA+: 42Mbps DL(Cat 24)/5.76Mbps UL(Cat6) Power Supply DC 3.135V～4.4V, Typical 3.3V Temperature Normal operating temperature: -10°C ～+55°C Extended operating temperature: -20°C ～+65°C Storage temperature: -40°C ～+85°C Physical characteristics Interface: M.2 Key-B Dimension：30 x 42 x 2.3mm Weight: About 5.8 g Interface Antenna Connector WWAN Main Antenna x 1 WWAN Diversity Antenna x 1 Function Interface USIM 3V/1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 9 of 54 Specification PCIe 1.0 X1 USB 2.0 USB 3.0(Base on Linux) W_Disable# Body Sar LED Clock Tunable antenna I2S(Reserved) I2C(Reserved) Software Protocol Stack IPV4/IPV6 AT commands 3GPP TS 27.007 and 27.005 Firmware update PCIe Other feature Multiple carrier Windows MBIM support Windows update AGNSS Note: When temperature goes beyond normal operating temperature range of -10°C~+55°C, RF performance of module may be slightly off 3GPP specifications. For normal operating temperature, LTE FDD Band 4 and 13 can support temperature ranging from -20℃ to +60℃. 2.3 Warning 2.3.1 FCC Statement Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 10 of 54 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help.  FCC Caution:  Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.  This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.  Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 5 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.End Product LabelingThis transmitter module is authorized only for use in device where the antenna may be installed such that20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: ZMOL850GLD-D1”. The grantee's FCC ID can be usedonly when all FCC compliance requirements are met.Manual Information To the End UserThe OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The enduser manual shall include all required regulatory information/warning as show in this manual.2.3.2 IC StatementIndustry Canada statementThis device complies with Industry Canada license-exempt RSS standard(s). Operation is subject tothe following two conditions:1) this device may not cause interference, and2) this device must accept any interference, including interference that may cause undesiredoperation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radioexempts de licence. L'exploitation est autorisée aux deux conditions suivantes:1) l'appareil ne doit pas produire de brouillage, et2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillageest susceptible d'en compromettre le fonctionnement.This Class B digital apparatus complies with Canadian ICES-003.Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this device does not cause harmful interference.Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à lacondition que cet appareil ne provoque aucune interférence nuisible.Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.L850-GL Hardware User Manual Page 11 of 54
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 12 of 54 This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter, except tested built-in radios. Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées. The County Code Selection feature is disabled for products marketed in the US/ Canada. La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux États-Unis et au Canada. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. IC : 21374-L850GLD 2.3.3 CE Statement ► EU Regulatory Conformance Hereby, We, Fibocom Wireless Inc. declares that the radio equipment type L850-GL is in compliance with the Directive 2014/53/EU. In all cases assessment of the final product must be mass against the Essential requirements of the Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article3.2 requirements. The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm. ► Declaration of Conformity(should include manufacturer contact info.) Please added certification standard in your user manual which depended on the test standards your device performed., If the DoC should be a simplified version, please take below as reference, The full text of the EU declaration of conformity is available at the following internet address: http//www.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 13 of 54 fibocom.com 2.4 CA combinations CA Combinations 2CA Inter-band 1+3, 5, 8, 11, 18, 19, 20, 21, 26 2+4, 5, 12, 13, 17, 29, 30, 66 3+5, 7, 8, 19, 20, 28 4+5, 12, 13, 17, 29, 30 5+7, 30, 66 7+20, 28 8+11 12+30 13+66 29+30 Intra-band(non-contiguous) 2, 3, 4, 7, 41 Intra-band(contiguous) 2, 3, 7, 40, 41 3CA Inter-band 1+3+7, 1+3+8，1+3+19, 1+3+20, 1+3+28, 1+7+20, 1+7+28, 1+8+11, 1+19+21 2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30, 2+5+66, 2+13+66 3+7+20, 3+7+28 4+5+30, 4+12+30, 4+29+30 2 intra-band(non-contiguous) plus inter-band 2+2+5, 2+2+13 4+4+5, 4+4+13 2 intra-band(contiguous) plus inter-band 2+2+29 3+3+1, 3+3+5, 3+3+7, 3+3+20, 3+3+28 2+66+66, 5+66+66, 13+66+66 7+7+3, 7+7+28 Intra-band(non-contiguous) 41, 66 Intra-band(contiguous) 40, 41, 66
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 14 of 54 2.5 Application Framework The peripheral applications for L850 module are shown in Figure 2-1: ModuleSIM USB2.0Power Supply ON/OFF# RESET#ControlEINT IndicatorHost applicationMain ANT Div ANTSIM CardPCIe USB3.0 Figure2-1 Application Framework 2.6 Hardware Block Diagram The hardware block diagram in Figure 2-2 shows the main hardware functions of L850 module, including base band and RF functions. Baseband contains the followings:  GSM/UMTS/LTE FDD controller/Power supply  NAND/internal LPDDR2 RAM  Application interface RF contains the followings:  RF Transceiver  RF Power/PA  RF Front end  RF Filter  Antenna Connector
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 15 of 54 Figure 2-2 Hardware Block Diagram
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 16 of 54 3 Application Interface 3.1 M.2 Interface The L850 module applies standard M.2 Key-B interface, with a total of 75 pins. 3.1.1 Pin Map Figure 3-1 Pin Map Note:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 17 of 54 Pin “Notch” represents the gap of the gold fingers. 3.1.2 Pin Definition The pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 O NC NC, L850 M.2 module is configured as the WWAN – PCIe, USB3.0 interface type 2 +3.3V PI Power input Power Supply3 GND GND Power Supply4 +3.3V PI Power input Power Supply5 GND GND Power Supply6 FULL_CARD_ POWER_OFF# I PU Power enable, Module power on input, internal pull up CMOS 3.3/1.8V 7 USB D+ I/O USB Data Plus 0.3---3V 8 W_DISABLE1# I PD WWAN Disable, active low CMOS 3.3/1.8V 9 USB D- I/O USB Data Minus 0.3---3V 10 LED1# O T System status LED, Output open drain, CMOS 3.3V CMOS 3.3V 11 GND GND Power Supply12 Notch Notch 13 Notch Notch 14 Notch Notch 15 Notch Notch 16 Notch Notch 17 Notch Notch 18 Notch Notch 19 Notch Notch 20 I2S_CLK O PD I2S Serial clock, Reserved CMOS 1.8V 21 CONFIG_0 GND GND, L850 M.2 module is configured as the WWAN – PCIe, USB3.0 interface type
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 18 of 54 Pin Pin Name I/O Reset Value Pin Description Type 22 I2S_RX I PD I2S Serial receive data, Reserved CMOS 1.8V 23 WOWWAN# O PD Wake up host, Reserved CMOS 1.8V 24 I2S_TX O PD I2S Serial transmit data, Reserved CMOS 1.8V 25 DPR I PU Body SAR Detect, active low CMOS 3.3/1.8V 26 W_DISABLE2# I PU GNSS disable, active low, Reserved CMOS 3.3/1.8V 27 GND GND Power Supply28 I2S_WA O PD I2S Word alignment/select, Reserved CMOS 1.8V 29 USB3.0_TX- O USB3.0 Transmit data minus 30 UIM_RESET O L SIM reset signal 1.8V/3V 31 USB3.0_TX+ O USB3.0 Transmit data plus 32 UIM_CLK O L SIM clock Signal 1.8V/3V 33 GND GND 电源 34 UIM_DATA I/O L SIM data input/output 1.8V/3V 35 USB3.0_RX- I USB3.0 receive data minus 36 UIM_PWR O SIM power supply, 3V/1.8V 1.8V/3V 37 USB3.0_RX+ I USB3.0 receive data plus 38 NC NC 39 GND GND Power Supply40 GNSS_SCL O PU I2C Serial clock, Reserved CMOS 1.8V 41 PETn0 O PCIe TX Differential signals Negative 42 GNSS_SDA I/O PU I2C Serial data input/output, Reserved CMOS 1.8V 43 PETp0 O PCIe TX Differential signals Positive 44 GNSS_IRQ I PD GNSS Interrupt Request, Reserved CMOS 1.8V 45 GND GND Power Supply
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 19 of 54 Pin Pin Name I/O Reset Value Pin Description Type 46 SYSCLK O PD 26M clock output 1.8V 47 PERn0 I PCIe RX Differential signals Negative 48 TX_BLANKING O PD PA Blanking Timer, Reserved CMOS 1.8V 49 PERp0 I PCIe RX Differential signals Positive 50 PERST# I T Asserted to reset module PCIe interface default. If module went into core dump, it will reset whole module, not only PCIe interface. Active low, internal pull up(10KΩ) CMOS 3.3V 51 GND GND Power Supply52 CLKREQ# O T Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It also used by L1 PM Sub states mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up(10KΩ) CMOS 3.3V 53 REFCLKN I PCIe Reference Clock signal Negative 54 PEWAKE# O L Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system whether supports wake up functionality. Active low, open drain output and should add external pull up on platform CMOS 3.3V 55 REFCLKP I PCIe Reference Clock signal Positive 56 RFE_RFFE2_ SCLK O MIPI Interface Tunable ANT, RFFE2 clock, Open Drain output CMOS 3.3/1.8V 57 GND GND Power Supply58 RFE_RFFE2_ SDATA O MIPI Interface Tunable ANT, RFFE2 data, Open Drain output CMOS 3.3/1.8V 59 ANTCTL0 O Tunable ANT CTRL0 CMOS 1.8V 60 COEX3 I/O PD Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG CMOS 1.8V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 20 of 54 Pin Pin Name I/O Reset Value Pin Description Type coexistence protocol. COEX_EXT_FTA, Reserved 61 ANTCTL1 O - Tunable ANT CTRL1 CMOS 1.8V 62 COEX_RXD I T Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. UART receive signal(WWAN module side), Reserved CMOS 1.8V 63 ANTCTL2 O - Tunable ANT CTRL2 CMOS 1.8V 64 COEX_TXD O T Wireless Coexistence between WWAN and WiFi/BT modules, based on BT-SIG coexistence protocol. UART transmit signal(WWAN module side), Reserved CMOS 1.8V 65 NC NC 66 SIM_DETECT I PD SIM Detect, internal pull up(390KΩ), active high CMOS 1.8V 67 RESET# I WWAN reset input, internal pull up(10KΩ), active low CMOS 1.8V 68 NC NC 69 CONFIG_1 O GND GND, L850 M.2 module is configured as the WWAN – PCIe, USB3.0 interface type 70 +3.3V PI Power input Power Supply71 GND GND Power Supply72 +3.3V PI Power input Power Supply73 GND GND Power Supply74 +3.3V PI Power input Power Supply75 CONFIG_2 O GND GND, L850 M.2 module is configured as the WWAN – PCIe, USB3.0 interface type Reset Value: The initial status after module reset, not the status when working. H: High Voltage Level L: Low Voltage Level PD: Pull-Down
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 21 of 54 PU: Pull-Up T: Tristate OD: Open Drain PP: Push-Pull PI: Power Input PO: Power Output Note: The unused pins can be left floating. 3.2 Power Supply The power interface of L850 module as shown in the following table: Pin Pin Name I/O Pin Description DC Parameter（V） Minimum Value Typical Value Maximum Value 2, 4, 70, 72, 74 +3.3V PI Power supply input 3.135 3.3 4.4 36 UIM_PWR PO USIM power supply - 1.8V/3V - L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as the external power cannot control the module status through the PCIe protocol. 3.2.1 Power Supply The L850 module should be powered through the +3.3V pins, and the power supply design is shown in Figure 3-2: Figure 3-2 Power Supply Design
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 22 of 54 The filter capacitor design for power supply as shown in the following table: Recommended capacitance Application Description 220uF x 2 Voltage-stabilizing capacitors Reduce power fluctuations of the module in operation, requiring capacitors with low ESR.  LDO or DC/DC power supply requires the capacitor of no less than 440uF  The capacitor for battery power supply can be reduced to 100~200uF 1uF, 100nF Digital signal noise Filter out the interference generated from the clock and digital signals 39pF, 33pF 700/800, 850/900 MHz frequency band Filter out low frequency band RF interference 18pF, 8.2pF, 6.8pF 1500/1700/1800/1900, 2100/2300, 2500/2600MHzfrequency band Filter out medium/high frequency band RF interference The stable power supply can ensure the normal operation of L850 module; and the ripple of the power supply should be less than 300mV in design. When the module operates with the maximum emission power, the maximum operating current can reach 1000mA, so the power source should be not lower than 3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3: Figure 3-3 Power Supply Limit 3.2.2 Logic level The L850module 1.8V logic level definition as shown in the following table:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 23 of 54 Parameters Minimum Typical Maximum Unit 1.8V logic level 1.71 1.8 1.89 V VIH 1.3 1.8 1.89 V VIL -0.3 0 0.3 V The L850module 3.3V logic level definition as shown in the following table: Parameters Minimum Typical Maximum Unit 3.3V logic level 3.135 3.3 3.465 V VIH 2.3 3.3 3.465 V VIL -0.3 0 0.3 V 3.2.3 Power Consumption In the condition of 3.3V power supply, the L850 power consumption as shown in the following table: Parameter Mode Condition Average Current(mA) Ioff Power off Power supply, module power off 0.08 ISleep WCDMA DRX=6 3.3 DRX=8 2.6 DRX=9 2.4 LTE FDD Paging cycle #64 frames (0.64 sec DRx cycle) 3.8 LTE TDD Paging cycle #64 frames (0.64 sec DRx cycle) 4.2 Radio Off AT+CFUN=4, Flight mode 2.0 IWCDMA-RMS WCDMA WCDMA Data call Band 1 @+23.5dBm 580 WCDMA Data call Band 2 @+23.5dBm 700 WCDMA Data call Band 4 @+23.5dBm 530 WCDMA Data call Band 5 @+23.5dBm 480 WCDMA Data call Band 8 @+23.5dBm 560 ILTE-RMS LTE FDD LTE FDD Data call Band 1 @+23dBm 700 LTE FDD Data call Band 2 @+23dBm 760 LTE FDD Data call Band 3 @+23dBm 790
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 24 of 54 Parameter Mode Condition Average Current(mA) LTE FDD Data call Band 4 @+23dBm 770 LTE FDD Data call Band 5 @+23dBm 600 LTE FDD Data call Band 7 @+23dBm 860 LTE FDD Data call Band 8 @+23dBm 580 LTE FDD Data call Band 11 @+23dBm 850 LTE FDD Data call Band 12 @+23dBm 650 LTE FDD Data call Band 13 @+23dBm 660 LTE FDD Data call Band 17 @+23dBm 670 LTE FDD Data call Band 18 @+23dBm 620 LTE FDD Data call Band 19 @+23dBm 580 LTE FDD Data call Band 20 @+23dBm 650 LTE FDD Data call Band 21 @+23dBm 850 LTE FDD Data call Band 26 @+23dBm 580 LTE FDD Data call Band 28 @+23dBm 600 LTE FDD Data call Band 30 @+22dBm 820 LTE FDD Data call Band 66 @+23dBm 780 LTE TDD LTE TDD Data call Band 38 @+23dBm 450 LTE TDD Data call Band 39 @+23dBm 350 LTE TDD Data call Band 40 @+23dBm 380 LTE TDD Data call Band 41 @+23dBm 460 In 3CA mode, the L850 power consumption as shown in the following table: ： 3CA Combination Condition (LTE FDD 3CA, Full RB) Average Current(mA) 1+3+7, 1+3+8，1+3+19, 1+3+20, 1+3+28, 1+7+20, 1+7+28, 1+8+11, 1+19+21 2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30 Band 1 @+22dBm 920 Band 2 @+22dBm 900 Band 3 @+22dBm 1170
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 25 of 54 3CA Combination Condition (LTE FDD 3CA, Full RB) Average Current(mA) 3+7+20, 3+7+28 4+5+30, 4+12+30, 4+29+30 5+66+2, 13+66+2 2+2+5, 2+2+13 3+3+7, 3+7+7, 3+3+20 4+4+5, 4+4+13 5+66+66, 13+66+66, 66+66+2, 66+66+66 7+7+28, 3+3+28, 3+3+5, 1+3+3 Band 4 @+22dBm 930 Band 5 @+22dBm 710 Band 7 @+22dBm 950 Band 8 @+22dBm 650 Band 11 @+22dBm 1000 Band 12 @+22dBm 790 Band 13 @+22dBm 700 Band 19 @+22dBm 690 Band 20 @+22dBm 730 Band 21 @+22dBm 890 Band 28 @+22dBm 670 Band 30 @+21dBm 910 Band 66 @+22dBm 820 Note： The data above is an average value obtained by testing some samples. 3.3 Control Signal The L850 module provides two control signals for power on/off and reset operations, the pin defined as shown in the following table: Pin Pin Name I/O Reset Value Functions Type 6 FULL_CARD_POWER_OFF# I PU Module power on/off input, internal pull up Power on: High/Floating Power off: Low 3.3/1.8V 67 RESET# I - WWAN reset input, internal pull up(10KΩ), active low 1.8V 50 PERST# I T Asserted to reset module PCIe interface default. If module went into core dump, it will reset whole CMOS 3.3V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 26 of 54 Pin Pin Name I/O Reset Value Functions Type module, not only PCIe interface. Active low, internal pull up(10KΩ) Note： RESET# and PERST# need to be controlled by independent GPIO, and not shared with other devices on the host. 3.3.1 Module Start-Up 3.3.1.1 Start-up Circuit The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module start-up，and the circuit design is shown in Figure3-4: Figure 3-4 Circuit for Module Start-up Controlled by AP 3.3.1.2 Start-up Timing Sequence When power supply is ready, the PMU of module will power on and start initialization process by pulling high FULL_CARD_POWER_OFF# signal. After about 10s, module will complete initialization process. The start-up timing is shown in Figure 3-5: +3.3VPERST#tprRESET#ton1Module StateInitialization Activation(AT Command Ready)FULL_CARD_POWER_OFF#ton2typical 10sOFF Figure 3-5 Timing Control for Start-up
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 27 of 54 Index Minimum Typical Notes tpr - - +3.3V power supply rises time. If power supply always ready, there is no tpr ton1 10ms 30ms If the RESET# has a residual voltage, then 30ms is necessary ton2 10ms 30ms PERST# should de-asserted after FULL_CARD_POWER_OFF# 3.3.2 Module Shutdown The module can be shut down by the following controls: Shutdown Control Action Condition Software Sending AT+CFUN=0 command Normal shutdown(recommend) Hardware Pull down FULL_CARD_POWER_OFF# pin Only used when a hardware exception occurs and the software control cannot be used. The module can be shut down by sending AT+CFUN=0 command. When the module receives the software shutdown command, the module will start the finalization process (the reverse process of initialization), and it will be completed after tsd time(tsd is the time which AP receive OK of “AT+CFUN=0”, if there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM card and some other parameters from memory, then clear the memory and shut down PMU. The software control timing is shown in Figure 3-6: +3.3VPERST#tpdRESET#Module StateFinalizationActivationFULL_CARD_POWER_OFF#toff2tsdOFFAT+CFUN=0toff1 Figure 3-6 Software control power off timing Index Minimum Typical Maxim Notes tpd 10ms 100ms - +3.3V power supply goes down time. If power supply is always on, there is no tpd toff1 10ms 30ms - RESET# should asserted before FULL_CARD_POWER_OFF# toff2 0ms 30ms toff1 PERST# should asserted after RESET#
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 28 of 54 3.3.3 Module Reset The L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms (30msis recommended), and module will restart after RESET# signal is released. When customer executes RESET# function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-7: Figure 3-7 Recommended Design for Reset Circuit There are two reset control timings as below:  Host may keep FULL_CARD_POWER_OFF# high when system restarting, module reset timing is shown in the Figure 3-8;  Host may assert FULL_CARD_POWER_OFF# high when system restarting, module reset timing is shown in the Figure 3-9; +3.3VPERST#RESET#Module StateRestartActivationFULL_CARD_POWER_OFF#typical 10sPMU RESET Activationtres1tres2 Figure 3-8 Reset control timing1st
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 29 of 54 +3.3VPERST#RESET#Module State RestartActiv ationFULL_CARD_POWER_OFF#typical 10sPMU RESE T Activationtres1tres1tres2 Figure 3-9 Reset control timing2nd Index Minimum Typical Notes tres1 10ms 30ms RESET# should asserted time tres2 0ms 30ms PERST# should asserted after RESET#. PERST# is not required for modem restart, thus this pin can be remains high during restart Note: RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In case of PCB layout, the RESET# signal lines should keep away from the RF interference and protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on the surface planes to avoid module from reset caused by ESD problems. 3.3.4 PCIe Reset Module supports PCIe goes in to D3cold L2 state in Win10 system. The D0->D3cold L2@S0/S0ix/S3 ->D0 timing is shown in figure 3-10: Figure 3-10 PCIe reset timing
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 30 of 54 3.4 PCIe & USB L850 module supports PCIe and USB interface for data request. PCIe & USB interface functions are as below table: Interface System Priority Description PCIe Win10 High Priority: PCIe>USB. If PCIe and USB ports connected both with PC, module will initial PCIe first, then disable USB port USB Android/Linux Low It must disconnect PCIe port, only keep USB connecting. If keep PCIe and USB connecting both, it needs disable PCIe by BIOS/UEFI of PC 3.4.1 PCIe Interface L850 module supports PCIe 1.0 interface and one data transmission channel. After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10 system and GNSS interface for receiving GNSS data. 3.4.1.1 PCIe Interface Definition Pin# Pin Name I/O Reset Value Description Type 41 PETn0 O - PCIe TX Differential signals Negative - 43 PETP0 O - PCIe TX Differential signals Positive - 47 PERn0 I - PCIe RX Differential signals NegativeBit0 - 49 PERP0 I - PCIe RX Differential signals Positive - 53 REFCLKN I - PCIe Reference Clock signal Negative - 55 REFCLKP I - PCIe Reference Clock signal Positive - 50 PERST# I T Asserted to reset module PCIe interface default. If module went into coredump, it will reset whole module, not only PCIe interface. Active low, internal pull up(10KΩ) CMOS 3.3V
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 31 of 54 Pin# Pin Name I/O Reset Value Description Type 52 CLKREQ# O T Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It also used by L1 PM Sub states mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up(10KΩ) CMOS 3.3V 54 PEWAKE# O L Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system whether supports wake up functionality. Active low, open drain output and should add external pull up on platform CMOS 3.3V 3.4.1.2 PCIe Interface Application The reference circuit is shown in Figure 3-11: Figure 3-11 Reference Circuit for PCIe Interface L850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in PCB Layout:  The differential signal pair lines shall be parallel and equal in length;  The differential signal pair lines shall be short if possible and be controlled within 15 inch(380 mm) for AP end;  The impedance of differential signal pair lines is recommended to be 100 ohm, and can be controlled to 80～120 ohm in accordance with PCIe protocol;
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 32 of 54  It shall avoid the discontinuous reference ground, such as segment and space;  When the differential signal lines go through different layers, the via hole of grounding signal should be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines shall never cross the segment of plane;  Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair. As shown in Figure 3-12, the bending angle of all lines should be equal or greater than 135°, the spacing between difference pair lines should be larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least. When a serpentine line is used for length match with another line, the bended length of each segment shall be at least 3 times the line width (≥3W). The largest spacing between the bended part of the serpentine line and another one of the differential lines must be less than 2 times the spacing of normal differential lines (S1<2S); Figure 3-12 Requirement of PCIe Line  The difference in length of two data lines in difference pair should be within 5mil, and the length match is required for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in Figure 3-13. However, there is no specific requirements for the length match of transmit pair and receiving pair, that is, the length match is only required in the internal differential lines rather than between different difference pairs. The length match should be close to the signal pin and pass the small-angle bending design.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 33 of 54 Figure 3-13 Length Match Design of PCIe Difference Pair 3.4.2 USB Interface The L850 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB Full-Speed (12 Mbit/s).It supports USB3.0 using for LTE cat9 high speed data throughput at the same time. For the USB timing and electrical specification of L850 module, please refer to Universal Serial Bus Specification 2.0” and “Universal Serial Bus Specification 3.0”. When module inserted PC, USB can enumerate three ACM and three NCM ports in Android/Linux system, the ports can be configured in practical application. 3.4.2.1 USB Interface Definition Pin# Pin Name I/O Description Type 7 USB_D+ I/O USB Data Plus 0.3---3V, USB2.0 9 USB_D- I/O USB Data Minus 0.3---3V, USB2.0 29 USB3.0_TX- O USB3.0 Transmit data minus - 31 USB3.0_TX+ O USB3.0 Transmit data plus - 35 USB3.0_RX- I USB3.0 receive data minus - 37 USB3.0_RX+ I USB3.0 receive data plus - 3.4.2.2 USB2.0 Interface Application The reference circuit is shown in Figure 3-14:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 34 of 54 Figure 3-14 Reference Circuit for USB 2.0 Interface Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use 0.5pF TVS diodes. USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of480 Mbit/s, so the following rules shall be followed carefully in the case of PCB layout:  USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms.  USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right angle routing should be avoided.  USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. 3.4.2.3 USB3.0 Interface Application The reference circuit is shown in Figure 3-15: Figure 3-15 Reference Circuit for USB 3.0 Interface USB 3.0 signals are super speed differential signal lines with the maximum transfer rate of5Gbps.So the following rules shall be followed carefully in the case of PCB layout:  USB3.0_TX-/USB3.0_TX+ and USB3.0_RX-/ USB3.0_RX+ are two pairs differential signal lines, the differential impedance should be controlled as100 ohms.  The two pairs differential signal lines should be parallel and have the equal length, the right
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 35 of 54 angle routing should be avoided.  The two pairs differential signal lines should be routed on the layer that is adjacent to the ground layer, and wrapped with GND vertically and horizontally. 3.5 USIM Interface The L850 module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards. 3.5.1 USIM Pins The USIM pins description as shown in the following table: Pin Pin Name I/O Reset Value Description Type 36 UIM_PWR PO - USIM power supply 1.8V/3V 30 UIM_RESET O L USIM reset 1.8V/3V 32 UIM_CLK O L USIM clock 1.8V/3V 34 UIM_DATA I/O L USIM data, internal pull up(4.7KΩ) 1.8V/3V 66 SIM_DETECT I PD USIM card detect, internal 390K pull-up. Active high, and high level indicates SIM card is inserted; and low level indicates SIM card is detached. 1.8V 3.5.2 USIM Interface Circuit 3.5.2.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-16:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 36 of 54 Figure 3-16Reference Circuit for N.C. SIM Card Slot The principles of the N.C.SIM card slot are described as follows:  When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low.  When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin high. 3.5.2.2 N.O. SIM Card Slot The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-17: Figure 3-17 Reference Circuit for N.O. SIM Card Slot The principles of the N.O.SIM card slot are described as follows:  When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin low.  When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 37 of 54 3.5.3 USIM Hot-Plugging The L850 module supports the SIM card hot-plugging function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot. The SIM card hot-plugging function can be configured by “AT+MSMPD” command, and the description for AT command as shown in the following table: AT Command Hot-plugging Detection Function Description AT+MSMPD=1 Enable Default value, the SIM card hot-plugging detection function is enabled. The module can detect whether the SIM card is inserted or not through the SIM_DETECT pin state. AT+MSMPD=0 Disable The SIM card hot-plugging detect function is disabled. The module reads the SIM card when starting up, and the SIM_DETECT status will not be detected. After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is inserted when the SIM_DETECT pin is high, then executes the initialization program and finish the network registration after reading the SIM card information. When the SIM_DETECT pin is low, the module determines that the SIM card is detached and does not read the SIM card. Note: By default, SIM_DETECT is active-high, which can be switched to active-low by the AT command. Please refer to the AT Commands Manual for the AT command. 3.5.4 USIM Design The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines should be noted in case of design:  The SIM card slot placement should near the module as close as possible, and away from the RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources.  The SIM card slot with a metal shielding housing can improve the anti-interference ability.  The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality.  The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 38 of 54 interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least.  The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22~33pF capacitance should be used. 3.6 Status Indicator The L850 module provides three signals to indicate the operating status of the module, and the status indicator pins as shown in the following table: Pin Pin Name I/O Reset Value Pin Description Type 10 LED1# O PD System status LED, drain output. CMOS 3.3V 23 WOWWAN# O PU Module wakes up Host (AP)，Reserved CMOS 1.8V 48 TX_BLANKING O PD PA Blanking output, external GPS control signal，Reserved CMOS 1.8V 3.6.1 LED#1 Signal The LED#1 signal is used to indicate the operating status of the module, and the detailed description as shown in the following table: Module Status LED1# Signal RF function ON Low level (LED On) RF function OFF High level (LED Off) The LED driving circuit is shown in figure 3-18: Figure 3-18 LED Driving Circuit Note: The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 39 of 54 3.7 Interrupt Control The L850 module provides four interrupt signals, and the pin definition is as follows: Pin Pin Name I/O Reset Value Pin Description Type 8 W_DISABLE1# I PD Enable/Disable RF network CMOS 3.3V 25 DPR I PU Body SAR detection CMOS 1.8V 26 W_DISABLE2# I PU GNSS Disable signal, Reserved CMOS 1.8V 44 GNSS_IRQ I PD GNSS Interrupt Request, Reserved CMOS 1.8V 3.7.1 W_DISABLE1# The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The definition of W_DISABLE1# signal is as follows: W_DISABLE1# signal Function High/Floating WWAN function is enabled, the module exits the Flight mode. Low WWAN function is disabled, the module enters Flight mode. Note： The function of W_DISABLE1# can be customized, please refer to the software porting guide. 3.7.2 BODYSAR The L850 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition of DPR signal as shown in the following table: DPR signal Function High/Floating The module keeps the default emission power Low Lower the maximum emission power to the threshold value of the module.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 40 of 54 3.8 Clock Interface The L850 module supports a clock interface, it can output 26MHz clock. Pin Pin Name I/O Reset Value Pin Description Type 46 SYSCLK O 26M clock output, default disabled can be used for external GPS, etc 1.8V 3.9 ANT Tunable Interface The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bit GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the antenna. Pin Pin Name I/O Pin Description Type 56 RFE_RFFE2_ SCLK O Tunable ANT control, MIPI Interface, RFFE2 clock, Open Drain output CMOS 3.3/1.8V 58 RFE_RFFE2_ SDATA O Tunable ANT control, MIPI Interface, RFFE2 data, Open Drain output CMOS 3.3/1.8V 59 ANTCTL0 O Tunable ANT control, GPO interface, Bit0 CMOS 1.8V 61 ANTCTL1 O Tunable ANT control, GPO interface, bit1 CMOS 1.8V 63 ANTCTL2 O Tunable ANT control, GPO interface, Bit2 CMOS 1.8V 3.10 Configuration Interface The L850 module provides four config pins for the configuration as the WWAN-PCIe, USB3.0 type M.2 module: Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 O - NC 21 CONFIG_0 O L Internally connected to GND
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 41 of 54 Pin Pin Name I/O Reset Value Pin Description Type 69 CONFIG_1 O L Internally connected to GND 75 CONFIG_2 O L Internally connected to GND The M.2 module configuration as the following table: Config_0 (pin21) Config_1 (pin69) Config_2 (pin75) Config_3 (pin1) Module Type and Main Host Interface Port Configuration GND GND GND NC WWAN–USB3.1, PCIe Gen1 0 Please refer to PCI Express M.2 Specification Rev1.1” for more details. 3.11 Other Interfaces The module does not support other interfaces yet.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 42 of 54 4 Radio Frequency 4.1 RF Interface 4.1.1 RF Interface Functionality The L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1 shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna, used to receive the diversity RF signals. Figure 4-1 RF connectors 4.1.2 RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC to 6GHz Temperature Range Characteristic Impedance 50Ω –40°C to +85°C 4.1.3 RF Connector Dimension The L850 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 43 of 54 Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 44 of 54 4.2 Operating Band The L850 module operating bands of the antennas are as follows: Operating Band Description Mode Tx (MHz) Rx (MHz) Band 1 2100MHz LTE FDD/WCDMA 1920 - 1980 2110 - 2170 Band 2 1900MHz LTE FDD/WCDMA 1850 - 1910 1930 - 1990 Band 3 1800MHz LTE FDD 1710 - 1785 1805 - 1880 Band 4 1700MHz LTE FDD/WCDMA 1710 - 1755 2110 - 2155 Band 5 850MHz LTE FDD/WCDMA 824 - 849 869 - 894 Band 7 2600Mhz LTE FDD 2500 - 2570 2620 - 2690 Band 8 900MHz LTE FDD/WCDMA 880 - 915 925 - 960 Band 11 1500MHz LTE FDD 1427.9 - 1447.9 1475.9 - 1495.9 Band 12 700MHz LTE FDD 699 - 716 729 - 746 Band 13 700MHz LTE FDD 777 - 787 746 - 756 Band 17 700MHz LTE FDD 704 - 716 734 - 746 Band 18 800MHz LTE FDD 815 - 830 860 - 875 Band 19 800MHz LTE FDD 830 - 845 875 - 890 Band 20 800MHz LTE FDD 832 - 862 791 - 821 Band 21 1500MHz LTE FDD 1447.9 - 1462.9 1495.9 - 1510.9 Band 26 850MHz LTE FDD 814 - 849 859 - 894 Band 28 700MHz LTE FDD 703 - 748 758 - 803 Band 29 700MHz LTE FDD N/A 716 - 728 Band 30 2300MHz LTE FDD 2305 - 2315 2350 - 2360 Band 66 1700MHz LTE FDD 1710 - 1780 2110 - 2200 Band 38 2600MHz LTE TDD 2570 - 2620 Band 39 1900MHZ LTE TDD 1880 - 1920 Band 40 2300MHz LTE TDD 2300 - 2400 Band 41 2500MHZ LTE TDD 2496 - 2690 GPS L1 - - / 1575.42±1.023 GLONASS L1 - - / 1602.5625±4
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 45 of 54 Operating Band Description Mode Tx (MHz) Rx (MHz) BeiDou - - / 1561.098±2.046 4.3 Transmitting Power The transmitting power for each band of the L850 module as shown in the following table: Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note WCDMA Band 1 24+1.7/-3.7 23.5±1 - Band 2 24+1.7/-3.7 23.5±1 - Band 4 24+1.7/-3.7 23.5±1 - Band 5 24+1.7/-3.7 23.5±1 - Band 8 24+1.7/-3.7 23.5±1 - LTE FDD Band 1 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 2 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 3 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 4 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 5 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 7 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 8 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 11 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 12 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 13 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 17 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 18 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 19 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 20 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 21 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 26 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 28 23+2.7/-3.2 23±1 10MHz Bandwidth, 1 RB Band 30 23±2.7 22±1 10MHz Bandwidth, 1 RB
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 46 of 54 Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note Band 66 23±2.7 23±1 10MHz Bandwidth, 1 RB LTE TDD Band 38 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 39 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 40 23±2.7 23±1 10MHz Bandwidth, 1 RB Band 41 23±2.7 23±1 10MHz Bandwidth, 1 RB 4.4 Receiver Sensitivity The receiver sensitivity for each band of the L850 module as shown in the following table: Mode Band 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note WCDMA Band 1 -106.7 -110 BER<0.1% Band 2 -104.7 -110 BER<0.1% Band 4 -106.7 -110 BER<0.1% Band 5 -104.7 -111 BER<0.1% Band 8 -103.7 -110 BER<0.1% LTE FDD Band 1 -96.3 -101.5 10MHz Bandwidth Band 2 -94.3 -101.5 10MHz Bandwidth Band 3 -93.3 -102 10MHz Bandwidth Band 4 -96.3 -102 10MHz Bandwidth Band 5 -94.3 -103 10MHz Bandwidth Band 7 -94.3 -101 10MHz Bandwidth Band 8 -93.3 -102.5 10MHz Bandwidth Band 11 -96.3 -99 10MHz Bandwidth Band 12 -93.3 -102.5 10MHz Bandwidth Band 13 -93.3 -102.5 10MHz Bandwidth Band 17 -93.3 -102.5 10MHz Bandwidth Band 18 -96.3 -103 10MHz Bandwidth Band 19 -96.3 -103 10MHz Bandwidth
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 47 of 54 Mode Band 3GPP Requirement (dBm) Rx Sensitivity(dBm) Typical Note Band 20 -93.3 -102.5 10MHz Bandwidth Band 21 -96.3 -99 10MHz Bandwidth Band 26 -93.8 -103 10MHz Bandwidth Band 28 -94.8 -103 10MHz Bandwidth Band 29 -93.3 -101 10MHz Bandwidth Band 30 -95.3 -99.5 10MHz Bandwidth Band 66 -95.8 -101.5 10MHz Bandwidth LTE TDD Band 38 -96.3 -101 10MHz Bandwidth Band 39 -96.3 -101.5 10MHz Bandwidth Band 40 -96.3 -100.5 10MHz Bandwidth Band 41 -94.3 -100 10MHz Bandwidth Note: The above values are measured for the dual antennas situation (Main+Diversity). For single main antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE. 4.5 GNSS L850 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou integrated antenna. Description Condition Test Result Power GPS fixing 120mA / -130dbm GPS tracking 120mA / -130dbm GLONASS fixing 120mA / -130dbm GLONASS tracking 125mA / -130dbm BeiDou fixing 120mA / -130dbm BeiDou tracking 120mA / -130dbm GPS Sleep 0.7mA GLONASS Sleep 0.8mA BeiDou Sleep 0.7mA TTFF GPS Cold start 37s / -130dBm
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 48 of 54 Description Condition Test Result Warm start 34s / -130dBm Hot Start 2s / -130dBm GLONASS Cold start 31s / -130dBm Warm start 22s / -130dBm Hot Start 3s / -130dBm BeiDou Cold start 148s / -130dBm Warm start 148s / -130dBm Hot Start 3s / -130dBm AGNSS Cold start TBD Sensitivity GPS Tracking -160dBm Acquisition -149dBm GLONASS Tracking -160dBm Acquisition -146dBm BeiDou Tracking -160dBm Acquisition -141dBm Note: Please note that GPS current is tested with RF disabled. 4.6 Antenna Design The L850module provides main and diversity antenna interfaces, and the antenna design requirements as shown in the following table: L850 module Main antenna requirements Frequency range The most proper antenna to adapt the frequencies should be used. Bandwidth(WCDMA) WCDMA band 1(2100) : 250 MHz WCDMA band 2(1900) : 140 MHz WCDMA band 4(1700) : 445 MHz WCDMA band 5(850) : 70 MHz WCDMA band 8(900) : 80 MHz Bandwidth(LTE) LTE band 1(2100): 250 MHz
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 49 of 54 L850 module Main antenna requirements LTE band 2(1900): 140 MHz LTE Band 3(1800): 170 MHz LTE band 4(1700): 445 MHz LTE band 5(850): 70 MHz LTE band 7(2600): 190 MHz LTE Band 8(900): 80 MHz LTE Band 11(1500): 68 MHz LTE Band 12(700): 47 MHz LTE Band 13(700): 41 MHz LTE Band 17(700): 42 MHz LTE Band 18(800): 80 MHz LTE Band 19(800): 80 MHz LTE band 20(800): 71 MHz LTE band 21(1500): 63 MHz LTE band 26(850): 80 MHz LTE band 28(700): 100 MHz LTE band 29(700): 12 MHz LTE band 30(2300): 55 MHz LTE band 66(1700): 490 MHz LTE band 38(2600): 50 MHz LTE Band 39(1900): 40 MHz LTE band 40(2300): 100 MHz LTE band 41(2500): 194 MHz Bandwidth(GNSS/BeiDou) GPS: 2 MHz GLONASS: 8 MHz BeiDou: 4 MHz Impedance 50Ohm Input power > 26dBm average power WCDMA & LTE Recommended standing-wave ratio (SWR) ≤ 2: 1
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 50 of 54 5 Structure Specification 5.1 Product Appearance The product appearance for L850 module is shown in Figure5-1: Figure 5-1 Module Appearance 5.2 Dimension of Structure The structural dimension of the L850 module is shown in Figure 5-2: Figure 5-2 Dimension of Structure
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 51 of 54 5.3 M.2 Interface Model The L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 5.2 Dimension of Structure. Based on the M.2 interface definition, L850 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). 5.4 M.2 Connector The L850 module connects to AP via M.2 connector, it is recommended to use M.2 connector from LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector, please refer to the specification.
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 52 of 54 Figure 5-3 M.2 Dimension of Structure 5.5 Storage 5.5.1 Storage Life Storage Conditions (recommended): Temperature is 23 ± 5 , relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 5.6 Packing The L850 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent. Note： The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken. 5.6.1 Tray Package The L850 module uses tray package, 20 pcs are packed in each tray, with 5 trays in each box and 6 boxes
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 53 of 54 in each case. Tray packaging process is shown in Figure 5-4: Figure 5-4 Tray Packaging Process 5.6.2 Tray size The pallet size is 330*175*6.0mm, as shown in Figure 5-5:
Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. L850-GL Hardware User Manual Page 54 of 54 Figure 5-5Tray Size (Unit: mm) ITEM DIM(Unit: mm) L 330.0±0.5 W 175.0±0.5 H 6.0±0.3 T 0.5±0.1 A0 43±0.3 B0 33.0±0.3 A1 294.0±0.3 B1 159.0±0.3 C 20.0±0.5 D 9.0±0.5 E 24.5±0.5 F 187.5±0.2 G 105.0±0.2 J 9.0±0.2

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