Fibocom Wireless L850GLD-D1 LTE module User Manual

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User Manual

L850-GL Hardware User Manual

Version：1.0.6

Update date：Feb 26th, 2018

L850-GL Hardware User Manual Page 2 of 54

Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit

guarantee.

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

Version Record

Version Update date Remark

V1.0.0 2016-12-08 Draft

V1.0.1 2016-12-16 Modify the PCIe Interface Application;

Update the Pin Definition: change pin65 to NC

V1.0.2 2017-02-09

Modify the description

Update the content of PCIe

Add the power Consumption of 3CA

V1.0.3 2017-07-26

1. Update timing of power on/off and reset

2. Update PCIe, add USB support

3. Update power consumption, TX power, RX sensitivity and other data

V1.0.4 2017-12-06 Update Storage and packing and PCIe signal description, power

consumption, CA combine

V1.0.5 2018-1-16

1. Modify CA combinations and TDD data throughput

2. Modify description of power consumption condition

3. Optimize power on/off/reset timing

V1.0.6 2018-2-26 1. Modify COEX pin define

2. Del L850-GL-02 product model

L850-GL Hardware User Manual Page 3 of 54

Applicability Table

No. Product model Description

1 L850-GL-00 NA

2 L850-GL-01 NA

3 L850-GL-03 NA

4 L850-GL-05 NA

5 L850-GL-10 NA

L850-GL Hardware User Manual Page 4 of 54

Contents

1Foreword ............................................................................................................................................ 7

1.1Introduction .......................................................................................................................... 7

1.2Reference Standard ............................................................................................................. 7

1.3Related Documents ............................................................................................................. 7

2Overview ............................................................................................................................................ 8

2.1Introduction .......................................................................................................................... 8

2.2Specification ......................................................................................................................... 8

2.3Warning ................................................................................................................................ 9

2.3.1FCC Statement ............................................................................................................. 9

2.3.2IC Statement ................................................................................................................ 11

2.3.3CE Statement .............................................................................................................. 12

2.4CA combinations ................................................................................................................ 13

2.5Application Framework ...................................................................................................... 14

2.6Hardware Block Diagram ................................................................................................... 14

3Application Interface ......................................................................................................................... 16

3.1M.2 Interface ...................................................................................................................... 16

3.1.1Pin Map ...................................................................................................................... 16

3.1.2Pin Definition ............................................................................................................... 17

3.2Power Supply ..................................................................................................................... 21

3.2.1Power Supply .............................................................................................................. 21

3.2.2Logic level ................................................................................................................... 22

3.2.3Power Consumption ................................................................................................... 23

3.3Control Signal .................................................................................................................... 25

3.3.1Module Start-Up .......................................................................................................... 26

3.3.1.1Start-up Circuit ..................................................................................................... 26

3.3.1.2Start-up Timing Sequence ................................................................................... 26

3.3.2Module Shutdown ....................................................................................................... 27

3.3.3Module Reset .............................................................................................................. 28

3.3.4PCIe Reset ................................................................................................................. 29

3.4PCIe & USB ....................................................................................................................... 30

3.4.1PCIe Interface ............................................................................................................. 30

3.4.1.1PCIe Interface Definition ...................................................................................... 30

3.4.1.2PCIe Interface Application ................................................................................... 31

L850-GL Hardware User Manual Page 5 of 54

3.4.2USB Interface ............................................................................................................. 33

3.4.2.1USB Interface Definition ...................................................................................... 33

3.4.2.2USB2.0 Interface Application ............................................................................... 33

3.4.2.3USB3.0 Interface Application ............................................................................... 34

3.5USIM Interface ................................................................................................................... 35

3.5.1USIM Pins ................................................................................................................... 35

3.5.2USIM Interface Circuit ................................................................................................. 35

3.5.2.1N.C. SIM Card Slot .............................................................................................. 35

3.5.2.2N.O. SIM Card Slot .............................................................................................. 36

3.5.3USIM Hot-Plugging ..................................................................................................... 37

3.5.4USIM Design ............................................................................................................... 37

3.6Status Indicator .................................................................................................................. 38

3.6.1LED#1 Signal .............................................................................................................. 38

3.7Interrupt Control ................................................................................................................. 39

3.7.1W_DISABLE1# ........................................................................................................... 39

3.7.2BODYSAR .................................................................................................................. 39

3.8Clock Interface ................................................................................................................... 40

3.9ANT Tunable Interface ....................................................................................................... 40

3.10Configuration Interface ....................................................................................................... 40

3.11Other Interfaces ................................................................................................................. 41

4Radio Frequency .............................................................................................................................. 42

4.1RF Interface ....................................................................................................................... 42

4.1.1RF Interface Functionality ........................................................................................... 42

4.1.2RF Connector Characteristic ....................................................................................... 42

4.1.3RF Connector Dimension ........................................................................................... 42

4.2Operating Band .................................................................................................................. 44

4.3Transmitting Power ............................................................................................................ 45

4.4Receiver Sensitivity ............................................................................................................ 46

4.5GNSS ................................................................................................................................. 47

4.6Antenna Design ................................................................................................................. 48

5Structure Specification ...................................................................................................................... 50

5.1Product Appearance .......................................................................................................... 50

5.2Dimension of Structure ....................................................................................................... 50

5.3M.2 Interface Model ........................................................................................................... 51

L850-GL Hardware User Manual Page 6 of 54

5.4M.2 Connector ................................................................................................................... 51

5.5Storage .............................................................................................................................. 52

5.5.1Storage Life ................................................................................................................ 52

5.6Packing .............................................................................................................................. 52

5.6.1Tray Package .............................................................................................................. 52

5.6.2Tray size ..................................................................................................................... 53

L850-GL Hardware User Manual Page 7 of 54

1 Foreword

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

develop products.

1.2 Reference Standard

The design of the product complies with the following standards:

 3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio

transmission and reception (FDD);Part 1: Conformance specification

 3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio

transmission and reception (TDD)

 3GPP TS 36.521-1 V11.4.0: User Equipment (UE) conformance specification; Radio

transmission and reception; Part 1: Conformance testing

 3GPP TS 21.111 V10.0.0: USIM and IC card requirements

 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

(SIM-ME) interface

 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application

 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application

Toolkit(USAT)

 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile

terminals and ancillary equipment

 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

 PCI Express M.2 Specification Rev1.1

1.3 Related Documents

 RF Antenna Application Design Specification

 L8-Family System Driver Integration and Application Guidance

 L8-Family AT Commands Manual

L850-GL Hardware User Manual Page 8 of 54

2 Overview

2.1 Introduction

L850 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE

FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the

world.

2.2 Specification

Specification

Operating Band

LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18, 19, 20, 21, 26, 28, 29, 30, 66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1, 2, 4, 5, 8

GNSS/Beidou: support

Data Transmission

LTE FDD 450Mbps DL/50Mbps UL(Cat 9)

LTE TDD

347Mbps DL/30Mbps UL(Cat 9)

When LTE TDD achieves maximum DL rate, its UL rate can

reach 10Mbps only

UMTS/HSPA+ UMTS: 384 kbps DL/384 kbps UL

DC-HSPA+: 42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

Power Supply DC 3.135V～4.4V, Typical 3.3V

Temperature

Normal operating temperature: -10°C ～+55°C

Extended operating temperature: -20°C ～+65°C

Storage temperature: -40°C ～+85°C

Physical

characteristics

Interface: M.2 Key-B

Dimension：30 x 42 x 2.3mm

Weight: About 5.8 g

Interface

Antenna Connector WWAN Main Antenna x 1

WWAN Diversity Antenna x 1

Function Interface USIM 3V/1.8V

L850-GL Hardware User Manual Page 9 of 54

Specification

PCIe 1.0 X1

USB 2.0

USB 3.0(Base on Linux)

W_Disable#

Body Sar

LED

Clock

Tunable antenna

I2S(Reserved)

I2C(Reserved)

Software

Protocol Stack IPV4/IPV6

AT commands 3GPP TS 27.007 and 27.005

Firmware update PCIe

Other feature

Multiple carrier

Windows MBIM support

Windows update

AGNSS

Note:

When temperature goes beyond normal operating temperature range of -10°C~+55°C, RF

performance of module may be slightly off 3GPP specifications. For normal operating

temperature, LTE FDD Band 4 and 13 can support temperature ranging from -20℃ to +60℃.

2.3 Warning

2.3.1 FCC Statement

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

L850-GL Hardware User Manual Page 10 of 54

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

 Consult the dealer or an experienced radio/TV technician for help.



FCC Caution:

 Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

 This transmitter must not be co-located or operating in conjunction with any other antenna or

transmitter.



Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator &

your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the

maximum antenna gain allowed for use with this device is 5 dBi.

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements

required with this module installed.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example

certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer considered

valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will

be responsible for re-evaluating the end product (including the

transmitter) and obtaining a separate FCC

authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that

20 cm may be maintained between the antenna and users. The final end product must be labeled in a

visible area with the following:

“Contains FCC ID: ZMOL850GLD-D1”. The grantee's FCC ID can be

used

only when all FCC compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

2.3.2

IC Statement

Industry Canada statement

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to

the following two conditions:

1) this device may not cause interference, and

2) this device must accept any interference, including interference that may cause undesired

operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

1) l'appareil ne doit pas produire de brouillage, et

2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage

est susceptible d'en compromettre le fonctionnement.

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.

This device complies with RSS-310 of Industry Canada. Operation

is subject to the condition that this

device does not cause harmful interference.

Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la

condition que cet appareil ne provoque aucune interférence nuisible.

L850-GL Hardware User Manual

Page 11 of 54

L850-GL Hardware User Manual Page 12 of 54

This device and its antenna(s) must not be co-located or operating in conjunction with any other

antenna or transmitter, except tested built-in radios.

Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre

antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.

The County Code Selection feature is disabled for products marketed in the US/ Canada.

La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux

États-Unis et au Canada.

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your

body.

Déclaration d'exposition aux radiations:

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de

distance entre la source de rayonnement et votre corps.

IC : 21374-L850GLD

2.3.3 CE Statement

► EU Regulatory Conformance

Hereby, We, Fibocom Wireless Inc. declares that the radio equipment type L850-GL is in compliance with

the Directive 2014/53/EU.

In all cases assessment of the final product must be mass against the Essential requirements of the

Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant

Article3.2 requirements.

The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm.

► Declaration of Conformity(should include manufacturer contact info.)

Please added certification standard in your user manual which depended on the test standards your

device performed., If the DoC should be a simplified version, please take below as reference, The

full text of the EU declaration of conformity is available at the following internet address: http//www.

L850-GL Hardware User Manual Page 13 of 54

fibocom.com

2.4 CA combinations

CA Combinations

2CA

Inter-band

1+3, 5, 8, 11, 18, 19, 20, 21, 26

2+4, 5, 12, 13, 17, 29, 30, 66

3+5, 7, 8, 19, 20, 28

4+5, 12, 13, 17, 29, 30

5+7, 30, 66

7+20, 28

8+11

12+30

13+66

29+30

Intra-band(non-contiguous) 2, 3, 4, 7, 41

Intra-band(contiguous) 2, 3, 7, 40, 41

3CA

Inter-band

1+3+7, 1+3+8，

1+3+19, 1+3+20, 1+3+28, 1+7+20, 1+7+28,

1+8+11, 1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30, 2+5+66,

2+13+66

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

2 intra-band(non-contiguous)

plus inter-band

2+2+5, 2+2+13

4+4+5, 4+4+13

2 intra-band(contiguous)

plus inter-band

2+2+29

3+3+1, 3+3+5, 3+3+7, 3+3+20, 3+3+28

2+66+66, 5+66+66, 13+66+66

7+7+3, 7+7+28

Intra-band(non-contiguous) 41, 66

Intra-band(contiguous) 40, 41, 66

L850-GL Hardware User Manual Page 14 of 54

2.5 Application Framework

The peripheral applications for L850 module are shown in Figure 2-1:

Module

SIM USB2.0

Power

Supply ON/OFF# RESET#

Control

EINT Indicator

Host application

Main ANT Div ANT

SIM

Card

PCIe USB3.0

Figure2-1 Application Framework

2.6 Hardware Block Diagram

The hardware block diagram in Figure 2-2 shows the main hardware functions of L850 module, including

base band and RF functions.

Baseband contains the followings:

 GSM/UMTS/LTE FDD controller/Power supply

 NAND/internal LPDDR2 RAM

 Application interface

RF contains the followings:

 RF Transceiver

 RF Power/PA

 RF Front end

 RF Filter

 Antenna Connector

L850-GL Hardware User Manual Page 15 of 54

Figure 2-2 Hardware Block Diagram

L850-GL Hardware User Manual Page 16 of 54

3 Application Interface

3.1 M.2 Interface

The L850 module applies standard M.2 Key-B interface, with a total of 75 pins.

3.1.1 Pin Map

Figure 3-1 Pin Map

Note:

L850-GL Hardware User Manual Page 17 of 54

Pin “Notch” represents the gap of the gold fingers.

3.1.2 Pin Definition

The pin definition is as follows:

Pin Pin Name I/O Reset Value Pin Description Type

1 CONFIG_3 O NC

NC, L850 M.2 module is configured as

the WWAN – PCIe, USB3.0 interface

type

2 +3.3V PI Power input Power Supply

3 GND GND Power Supply

4 +3.3V PI Power input Power Supply

5 GND GND Power Supply

6 FULL_CARD_

POWER_OFF# I PU Power enable, Module power on input,

internal pull up

CMOS

3.3/1.8V

7 USB D+ I/O USB Data Plus 0.3---3V

8 W_DISABLE1# I PD WWAN Disable, active low CMOS

3.3/1.8V

9 USB D- I/O USB Data Minus 0.3---3V

10 LED1# O T System status LED, Output open drain,

CMOS 3.3V CMOS 3.3V

11 GND GND Power Supply

12 Notch Notch

13 Notch Notch

14 Notch Notch

15 Notch Notch

16 Notch Notch

17 Notch Notch

18 Notch Notch

19 Notch Notch

20 I2S_CLK O PD I2S Serial clock,

Reserved CMOS 1.8V

21 CONFIG_0 GND

GND, L850 M.2 module is configured as

the WWAN – PCIe, USB3.0 interface

type

L850-GL Hardware User Manual Page 18 of 54

Pin Pin Name I/O Reset Value Pin Description Type

22 I2S_RX I PD I2S Serial receive data,

Reserved CMOS 1.8V

23 WOWWAN# O PD Wake up host, Reserved CMOS 1.8V

24 I2S_TX O PD I2S Serial transmit data,

Reserved CMOS 1.8V

25 DPR I PU Body SAR Detect, active low CMOS

3.3/1.8V

26 W_DISABLE2# I PU GNSS disable, active low,

Reserved

CMOS

3.3/1.8V

27 GND GND Power Supply

28 I2S_WA O PD I2S Word alignment/select,

Reserved CMOS 1.8V

29 USB3.0_TX- O USB3.0 Transmit data minus

30 UIM_RESET O L SIM reset signal 1.8V/3V

31 USB3.0_TX+ O USB3.0 Transmit data plus

32 UIM_CLK O L SIM clock Signal 1.8V/3V

33 GND GND 电源

34 UIM_DATA I/O L SIM data input/output 1.8V/3V

35 USB3.0_RX- I USB3.0 receive data minus

36 UIM_PWR O SIM power supply, 3V/1.8V 1.8V/3V

37 USB3.0_RX+ I USB3.0 receive data plus

38 NC NC

39 GND GND Power Supply

40 GNSS_SCL O PU I2C Serial clock,

Reserved CMOS 1.8V

41 PETn0 O PCIe TX Differential signals

Negative

42 GNSS_SDA I/O PU I2C Serial data input/output,

Reserved CMOS 1.8V

43 PETp0 O PCIe TX Differential signals Positive

44 GNSS_IRQ I PD GNSS Interrupt Request,

Reserved CMOS 1.8V

45 GND GND Power Supply

L850-GL Hardware User Manual Page 19 of 54

Pin Pin Name I/O Reset Value Pin Description Type

46 SYSCLK O PD 26M clock output 1.8V

47 PERn0 I PCIe RX Differential signals

Negative

48 TX_BLANKING O PD PA Blanking Timer, Reserved CMOS 1.8V

49 PERp0 I PCIe RX Differential signals Positive

50 PERST# I T

Asserted to reset module PCIe interface

default. If module went into core dump, it

will reset whole module, not only PCIe

interface.

Active low, internal pull up(10KΩ)

CMOS 3.3V

51 GND GND Power Supply

52 CLKREQ# O T

Asserted by device to request a PCIe

reference clock be available (active

clock state) in order to transmit data. It

also used by L1 PM Sub states

mechanism, asserted by either host or

device to initiate an L1 exit.

Active low, internal pull up(10KΩ)

CMOS 3.3V

53 REFCLKN I PCIe Reference Clock signal

Negative

54 PEWAKE# O L

Asserted to wake up system and

reactivate PCIe link from L2 to L0, it

depends on system

whether supports wake up functionality.

Active low, open drain output and should

add external pull up on platform

CMOS 3.3V

55 REFCLKP I PCIe Reference Clock signal

Positive

56 RFE_RFFE2_

SCLK O MIPI Interface Tunable ANT,

RFFE2 clock, Open Drain output

CMOS

3.3/1.8V

57 GND GND Power Supply

58 RFE_RFFE2_

SDATA O MIPI Interface Tunable ANT,

RFFE2 data, Open Drain output

CMOS

3.3/1.8V

59 ANTCTL0 O Tunable ANT CTRL0 CMOS 1.8V

60 COEX3 I/O PD Wireless Coexistence between WWAN

and WiFi/BT modules, based on BT-SIG CMOS 1.8V

L850-GL Hardware User Manual Page 20 of 54

Pin Pin Name I/O Reset Value Pin Description Type

coexistence protocol. COEX_EXT_FTA,

Reserved

61 ANTCTL1 O - Tunable ANT CTRL1 CMOS 1.8V

62 COEX_RXD I T

Wireless Coexistence between WWAN

and WiFi/BT modules, based on BT-SIG

coexistence protocol. UART receive

signal(WWAN module side), Reserved

CMOS 1.8V

63 ANTCTL2 O - Tunable ANT CTRL2 CMOS 1.8V

64 COEX_TXD O T

Wireless Coexistence between WWAN

and WiFi/BT modules, based on BT-SIG

coexistence protocol. UART transmit

signal(WWAN module side), Reserved

CMOS 1.8V

65 NC NC

66 SIM_DETECT I PD SIM Detect, internal pull up(390KΩ),

active high CMOS 1.8V

67 RESET# I WWAN reset input, internal pull

up(10KΩ), active low CMOS 1.8V

68 NC NC

69 CONFIG_1 O GND

GND, L850 M.2 module is configured as

the WWAN – PCIe, USB3.0 interface

type

70 +3.3V PI Power input Power Supply

71 GND GND Power Supply

72 +3.3V PI Power input Power Supply

73 GND GND Power Supply

74 +3.3V PI Power input Power Supply

75 CONFIG_2 O GND

GND, L850 M.2 module is configured as

the WWAN – PCIe, USB3.0 interface

type

Reset Value: The initial status after module reset, not the status when working.

H: High Voltage Level

L: Low Voltage Level

PD: Pull-Down

L850-GL Hardware User Manual Page 21 of 54

PU: Pull-Up

T: Tristate

OD: Open Drain

PP: Push-Pull

PI: Power Input

PO: Power Output

Note:

The unused pins can be left floating.

3.2 Power Supply

The power interface of L850 module as shown in the following table:

Pin Pin Name I/O Pin Description

DC Parameter（V）

Minimum

Value

Typical

Value

Maximum

Value

2, 4, 70, 72, 74 +3.3V PI Power supply input 3.135 3.3 4.4

36 UIM_PWR PO USIM power supply - 1.8V/3V -

L850 module uses PCIe interface, according to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the external power cannot control the module status through the PCIe protocol.

3.2.1 Power Supply

The L850 module should be powered through the +3.3V pins, and the power supply design is shown in

Figure 3-2:

Figure 3-2 Power Supply Design

L850-GL Hardware User Manual Page 22 of 54

The filter capacitor design for power supply as shown in the following table:

Recommended

capacitance Application Description

220uF x 2 Voltage-stabilizing

capacitors

Reduce power fluctuations of the module in

operation, requiring capacitors with low ESR.

 LDO or DC/DC power supply requires the

capacitor of no less than 440uF

 The capacitor for battery power supply can be

reduced to 100~200uF

1uF, 100nF Digital signal noise Filter out the interference generated from the clock

and digital signals

39pF, 33pF 700/800, 850/900 MHz

frequency band Filter out low frequency band RF interference

18pF, 8.2pF,

6.8pF

1500/1700/1800/1900,

2100/2300,

2500/2600MHzfrequency

band

Filter out medium/high frequency band RF

interference

The stable power supply can ensure the normal operation of L850 module; and the ripple of the power

supply should be less than 300mV in design. When the module operates with the maximum emission

power, the maximum operating current can reach 1000mA, so the power source should be not lower than

3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:

Figure 3-3 Power Supply Limit

3.2.2 Logic level

The L850module 1.8V logic level definition as shown in the following table:

L850-GL Hardware User Manual Page 23 of 54

Parameters Minimum Typical Maximum Unit

1.8V logic level 1.71 1.8 1.89 V

VIH 1.3 1.8 1.89 V

VIL -0.3 0 0.3 V

The L850module 3.3V logic level definition as shown in the following table:

Parameters Minimum Typical Maximum Unit

3.3V logic level 3.135 3.3 3.465 V

VIH 2.3 3.3 3.465 V

VIL -0.3 0 0.3 V

3.2.3 Power Consumption

In the condition of 3.3V power supply, the L850 power consumption as shown in the following table:

Parameter Mode Condition Average

Current(mA)

Ioff Power off Power supply, module power off 0.08

ISleep

WCDMA

DRX=6 3.3

DRX=8 2.6

DRX=9 2.4

LTE FDD Paging cycle #64 frames (0.64 sec DRx cycle) 3.8

LTE TDD Paging cycle #64 frames (0.64 sec DRx cycle) 4.2

Radio Off AT+CFUN=4, Flight mode 2.0

IWCDMA-RMS WCDMA

WCDMA Data call Band 1 @+23.5dBm 580

WCDMA Data call Band 2 @+23.5dBm 700

WCDMA Data call Band 4 @+23.5dBm 530

WCDMA Data call Band 5 @+23.5dBm 480

WCDMA Data call Band 8 @+23.5dBm 560

ILTE-RMS LTE FDD

LTE FDD Data call Band 1 @+23dBm 700

LTE FDD Data call Band 2 @+23dBm 760

LTE FDD Data call Band 3 @+23dBm 790

L850-GL Hardware User Manual Page 24 of 54

Parameter Mode Condition Average

Current(mA)

LTE FDD Data call Band 4 @+23dBm 770

LTE FDD Data call Band 5 @+23dBm 600

LTE FDD Data call Band 7 @+23dBm 860

LTE FDD Data call Band 8 @+23dBm 580

LTE FDD Data call Band 11 @+23dBm 850

LTE FDD Data call Band 12 @+23dBm 650

LTE FDD Data call Band 13 @+23dBm 660

LTE FDD Data call Band 17 @+23dBm 670

LTE FDD Data call Band 18 @+23dBm 620

LTE FDD Data call Band 19 @+23dBm 580

LTE FDD Data call Band 20 @+23dBm 650

LTE FDD Data call Band 21 @+23dBm 850

LTE FDD Data call Band 26 @+23dBm 580

LTE FDD Data call Band 28 @+23dBm 600

LTE FDD Data call Band 30 @+22dBm 820

LTE FDD Data call Band 66 @+23dBm 780

LTE TDD

LTE TDD Data call Band 38 @+23dBm 450

LTE TDD Data call Band 39 @+23dBm 350

LTE TDD Data call Band 40 @+23dBm 380

LTE TDD Data call Band 41 @+23dBm 460

In 3CA mode, the L850 power consumption as shown in the following table: ：

3CA Combination

Condition

(LTE FDD 3CA, Full RB)

Average

Current(mA)

1+3+7, 1+3+8，1+3+19, 1+3+20, 1+3+28,

1+7+20, 1+7+28, 1+8+11, 1+19+21

2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30

Band 1 @+22dBm 920

Band 2 @+22dBm 900

Band 3 @+22dBm 1170

L850-GL Hardware User Manual Page 25 of 54

3CA Combination

Condition

(LTE FDD 3CA, Full RB)

Average

Current(mA)

3+7+20, 3+7+28

4+5+30, 4+12+30, 4+29+30

5+66+2, 13+66+2

2+2+5, 2+2+13

3+3+7, 3+7+7, 3+3+20

4+4+5, 4+4+13

5+66+66, 13+66+66, 66+66+2, 66+66+66

7+7+28, 3+3+28, 3+3+5, 1+3+3

Band 4 @+22dBm 930

Band 5 @+22dBm 710

Band 7 @+22dBm 950

Band 8 @+22dBm 650

Band 11 @+22dBm 1000

Band 12 @+22dBm 790

Band 13 @+22dBm 700

Band 19 @+22dBm 690

Band 20 @+22dBm 730

Band 21 @+22dBm 890

Band 28 @+22dBm 670

Band 30 @+21dBm 910

Band 66 @+22dBm 820

Note：

The data above is an average value obtained by testing some samples.

3.3 Control Signal

The L850 module provides two control signals for power on/off and reset operations, the pin defined as

shown in the following table:

Pin Pin Name I/O Reset Value Functions Type

6 FULL_CARD_POWER

_OFF# I PU

Module power on/off input,

internal pull up

Power on: High/Floating

Power off: Low

3.3/1.8V

67 RESET# I - WWAN reset input, internal pull

up(10KΩ), active low 1.8V

50 PERST# I T

Asserted to reset module PCIe

interface default. If module went into

core dump, it will reset whole

CMOS

3.3V

L850-GL Hardware User Manual Page 26 of 54

Pin Pin Name I/O Reset Value Functions Type

module, not only PCIe interface.

Active low, internal pull up(10KΩ)

Note：

RESET# and PERST# need to be controlled by independent GPIO, and not shared with other

devices on the host.

3.3.1 Module Start-Up

3.3.1.1 Start-up Circuit

The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The

VDD_1V8 should be provided from the external circuit. AP (Application Processor) controls the module

start-up，and the circuit design is shown in Figure3-4:

Figure 3-4 Circuit for Module Start-up Controlled by AP

3.3.1.2 Start-up Timing Sequence

When power supply is ready, the PMU of module will power on and start initialization process by

pulling high FULL_CARD_POWER_OFF# signal. After about 10s, module will complete initialization

process. The start-up timing is shown in Figure 3-5:

+3.3V

PERST#

RESET#

Module State

Initialization Activation(AT Command Ready)

FULL_CARD_POWER_OFF#

typical 10s

OFF

Figure 3-5 Timing Control for Start-up

L850-GL Hardware User Manual Page 27 of 54

Index Minimum Typical Notes

tpr - - +3.3V power supply rises time. If power supply always ready,

there is no tpr

ton1 10ms 30ms If the RESET# has a residual voltage, then 30ms is necessary

ton2 10ms 30ms PERST# should de-asserted after FULL_CARD_POWER_OFF#

3.3.2 Module Shutdown

The module can be shut down by the following controls:

Shutdown Control Action Condition

Software Sending AT+CFUN=0 command Normal shutdown(recommend)

Hardware Pull down

FULL_CARD_POWER_OFF# pin

Only used when a hardware exception occurs

and the software control cannot be used.

The module can be shut down by sending AT+CFUN=0 command. When the module receives the

software shutdown command, the module will start the finalization process (the reverse process of

initialization), and it will be completed after tsd time(tsd is the time which AP receive OK of “AT+CFUN=0”, if

there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM

card and some other parameters from memory, then clear the memory and shut down PMU. The software

control timing is shown in Figure 3-6:

+3.3V

PERST#

RESET#

Module State

FinalizationActivation

FULL_CARD_POWER_OFF#

off2

OFF

AT+CFUN=0

off1

Figure 3-6 Software control power off timing

Index Minimum Typical Maxim Notes

tpd 10ms 100ms - +3.3V power supply goes down time. If power supply is always

on, there is no tpd

toff1 10ms 30ms - RESET# should asserted before FULL_CARD_POWER_OFF#

toff2 0ms 30ms toff1 PERST# should asserted after RESET#

L850-GL Hardware User Manual Page 28 of 54

3.3.3 Module Reset

The L850 module can reset to its initial status by pulling down the RESET# signal for more than 10ms

(30msis recommended), and module will restart after RESET# signal is released. When customer

executes RESET# function, the PMU remains its power inside the module. The recommended circuit

design is shown in the Figure 3-7:

Figure 3-7 Recommended Design for Reset Circuit

There are two reset control timings as below:

 Host may keep FULL_CARD_POWER_OFF# high when system restarting, module reset timing

is shown in the Figure 3-8;

 Host may assert FULL_CARD_POWER_OFF# high when system restarting, module reset

timing is shown in the Figure 3-9;

+3.3V

PERST#

RESET#

Module State

Restart

Activation

FULL_CARD_POWER_OFF#

typical 10s

PMU RESET Activation

res1

res2

Figure 3-8 Reset control timing1st

L850-GL Hardware User Manual Page 29 of 54

+3.3V

PERST#

RESET#

Module State Restart

Activ ation

FULL_CARD_POWER_OFF#

typical 10s

PMU RESE T Activation

res1

res2

Figure 3-9 Reset control timing2nd

Index Minimum Typical Notes

tres1 10ms 30ms RESET# should asserted time

tres2 0ms 30ms

PERST# should asserted after RESET#.

PERST# is not required for modem restart, thus this pin can be

remains high during restart

Note:

RESET# is a sensitive signal, it’s recommended to add a filter capacitor close to the module. In

case of PCB layout, the RESET# signal lines should keep away from the RF interference and

protected by GND. Also, the RESET# signal lines shall neither near the PCB edge nor route on

the surface planes to avoid module from reset caused by ESD problems.

3.3.4 PCIe Reset

Module supports PCIe goes in to D3cold L2 state in Win10 system. The D0->D3cold L2@S0/S0ix/S3

->D0 timing is shown in figure 3-10:

Figure 3-10 PCIe reset timing

L850-GL Hardware User Manual Page 30 of 54

3.4 PCIe & USB

L850 module supports PCIe and USB interface for data request. PCIe & USB interface functions are as

below table:

Interface System Priority Description

PCIe Win10 High

Priority: PCIe>USB.

If PCIe and USB ports connected both with PC, module will initial

PCIe first, then disable USB port

USB Android/Linux Low

It must disconnect PCIe port, only keep USB connecting.

If keep PCIe and USB connecting both, it needs disable PCIe by

BIOS/UEFI of PC

3.4.1 PCIe Interface

L850 module supports PCIe 1.0 interface and one data transmission channel.

After L850 module is inserted into PC, PCIe interface can, work with the drive program, map an MBIM

port and a GNSS port in Win10 system. While MBIM interface is used for initiating data service in Win10

system and GNSS interface for receiving GNSS data.

3.4.1.1 PCIe Interface Definition

Pin# Pin Name I/O Reset Value Description Type

41 PETn0 O - PCIe TX Differential signals

Negative

43 PETP0 O - PCIe TX Differential signals Positive -

47 PERn0 I - PCIe RX Differential signals

NegativeBit0

49 PERP0 I - PCIe RX Differential signals Positive -

53 REFCLKN I - PCIe Reference Clock signal

Negative

55 REFCLKP I - PCIe Reference Clock signal

Positive

50 PERST# I T

Asserted to reset module PCIe interface

default. If module went into coredump, it will

reset whole module, not only PCIe interface.

Active low, internal pull up(10KΩ)

CMOS 3.3V

L850-GL Hardware User Manual Page 31 of 54

Pin# Pin Name I/O Reset Value Description Type

52 CLKREQ# O T

Asserted by device to request a PCIe

reference clock be available (active clock

state) in order to transmit data. It also used by

L1 PM Sub states mechanism, asserted by

either host or device to initiate an L1 exit.

Active low, internal pull up(10KΩ)

CMOS 3.3V

54 PEWAKE# O L

Asserted to wake up system and reactivate

PCIe link from L2 to L0, it depends on system

whether supports wake up functionality.

Active low, open drain output and should add

external pull up on platform

CMOS 3.3V

3.4.1.2 PCIe Interface Application

The reference circuit is shown in Figure 3-11:

Figure 3-11 Reference Circuit for PCIe Interface

L850 module supports one PCIe 1.0 interface, including three difference pairs: transmit pair TXP/N,

receiving pair RXP/N and clock pair CLKP/N.

PCIe can achieve the maximum transmission rate of 2.5 GT/s, and must strictly follow the rules below in

PCB Layout:

 The differential signal pair lines shall be parallel and equal in length;

 The differential signal pair lines shall be short if possible and be controlled within 15 inch(380

mm) for AP end;

 The impedance of differential signal pair lines is recommended to be 100 ohm, and can be

controlled to 80～120 ohm in accordance with PCIe protocol;

L850-GL Hardware User Manual Page 32 of 54

 It shall avoid the discontinuous reference ground, such as segment and space;

 When the differential signal lines go through different layers, the via hole of grounding signal

should be in close to that of signal, and generally, each pair of signals require 1-3 grounding

signal via holes and the lines shall never cross the segment of plane;

 Try to avoid bended lines and avoid introducing common-mode noise in the system, which will

influence the signal integrity and EMI of difference pair. As shown in Figure 3-12, the bending

angle of all lines should be equal or greater than 135°, the spacing between difference pair

lines should be larger than 20mil, and the line caused by bending should be greater than 1.5

times line width at least. When a serpentine line is used for length match with another line, the

bended length of each segment shall be at least 3 times the line width (≥3W). The largest

spacing between the bended part of the serpentine line and another one of the differential lines

must be less than 2 times the spacing of normal differential lines (S1<2S);

Figure 3-12 Requirement of PCIe Line

 The difference in length of two data lines in difference pair should be within 5mil, and the length

match is required for all parts. When the length match is conducted for the differential lines, the

designed position of correct match should be close to that of incorrect match, as shown in Figure

3-13. However, there is no specific requirements for the length match of transmit pair and receiving

pair, that is, the length match is only required in the internal differential lines rather than between

different difference pairs. The length match should be close to the signal pin and pass the small-angle

bending design.

L850-GL Hardware User Manual Page 33 of 54

Figure 3-13 Length Match Design of PCIe Difference Pair

3.4.2 USB Interface

The L850 module supports USB2.0 which is compatible with USB High-Speed (480 Mbit/s) and USB

Full-Speed (12 Mbit/s).It supports USB3.0 using for LTE cat9 high speed data throughput at the same

time. For the USB timing and electrical specification of L850 module, please refer to Universal Serial Bus

Specification 2.0” and “Universal Serial Bus Specification 3.0”.

When module inserted PC, USB can enumerate three ACM and three NCM ports in Android/Linux system,

the ports can be configured in practical application.

3.4.2.1 USB Interface Definition

Pin# Pin Name I/O Description Type

7 USB_D+ I/O USB Data Plus 0.3---3V,

USB2.0

9 USB_D- I/O USB Data Minus 0.3---3V,

USB2.0

29 USB3.0_TX- O USB3.0 Transmit data minus -

31 USB3.0_TX+ O USB3.0 Transmit data plus -

35 USB3.0_RX- I USB3.0 receive data minus -

37 USB3.0_RX+ I USB3.0 receive data plus -

3.4.2.2 USB2.0 Interface Application

The reference circuit is shown in Figure 3-14:

L850-GL Hardware User Manual Page 34 of 54

Figure 3-14 Reference Circuit for USB 2.0 Interface

Since the module supports USB 2.0 High-Speed, it is required to use TVS diodes with equivalent

capacitance of 1pF or smaller ones on the USB_D-/D+ differential signal lines, it is recommended to use

0.5pF TVS diodes.

USB_D- and USB_D+ are high speed differential signal lines with the maximum transfer rate of480 Mbit/s,

so the following rules shall be followed carefully in the case of PCB layout:

 USB_D- and USB_D+ signal lines should have the differential impedance of 90 ohms.

 USB_D- and USB_D+ signal lines should be parallel and have the equal length, the right angle

routing should be avoided.

 USB_D- and USB_D+ signal lines should be routed on the layer that is adjacent to the ground

layer, and wrapped with GND vertically and horizontally.

3.4.2.3 USB3.0 Interface Application

The reference circuit is shown in Figure 3-15:

Figure 3-15 Reference Circuit for USB 3.0 Interface

USB 3.0 signals are super speed differential signal lines with the maximum transfer rate of5Gbps.So the

following rules shall be followed carefully in the case of PCB layout:

 USB3.0_TX-/USB3.0_TX+ and USB3.0_RX-/ USB3.0_RX+ are two pairs differential signal lines,

the differential impedance should be controlled as100 ohms.

 The two pairs differential signal lines should be parallel and have the equal length, the right

L850-GL Hardware User Manual Page 35 of 54

angle routing should be avoided.

 The two pairs differential signal lines should be routed on the layer that is adjacent to the ground

layer, and wrapped with GND vertically and horizontally.

3.5 USIM Interface

The L850 module has a built-in USIM card interface, which supports 1.8V and 3V SIM cards.

3.5.1 USIM Pins

The USIM pins description as shown in the following table:

Pin Pin Name I/O Reset Value Description Type

36 UIM_PWR PO - USIM power supply 1.8V/3V

30 UIM_RESET O L USIM reset 1.8V/3V

32 UIM_CLK O L USIM clock 1.8V/3V

34 UIM_DATA I/O L USIM data, internal pull up(4.7KΩ) 1.8V/3V

66 SIM_DETECT I PD

USIM card detect, internal 390K

pull-up.

Active high, and high level indicates

SIM card is inserted; and low level

indicates SIM card is detached.

1.8V

3.5.2 USIM Interface Circuit

3.5.2.1 N.C. SIM Card Slot

The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-16:

L850-GL Hardware User Manual Page 36 of 54

Figure 3-16Reference Circuit for N.C. SIM Card Slot

The principles of the N.C.SIM card slot are described as follows:

 When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the

SIM_DETECT pin low.

 When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

SIM_DETECT pin high.

3.5.2.2 N.O. SIM Card Slot

The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-17:

Figure 3-17 Reference Circuit for N.O. SIM Card Slot

The principles of the N.O.SIM card slot are described as follows:

 When the SIM card is detached, it connects an open circuit between CD and SW pins, and

drives the SIM_DETECT pin low.

 When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives

the SIM_DETECT pin high.

L850-GL Hardware User Manual Page 37 of 54

3.5.3 USIM Hot-Plugging

The L850 module supports the SIM card hot-plugging function, which determines whether the SIM card is

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

The SIM card hot-plugging function can be configured by “AT+MSMPD” command, and the description for

AT command as shown in the following table:

AT Command

Hot-plugging

Detection

Function Description

AT+MSMPD=1 Enable

Default value, the SIM card hot-plugging detection function is

enabled.

The module can detect whether the SIM card is inserted or not

through the SIM_DETECT pin state.

AT+MSMPD=0 Disable

The SIM card hot-plugging detect function is disabled.

The module reads the SIM card when starting up, and the

SIM_DETECT status will not be detected.

After the SIM card hot-plugging detection function is enabled, the module detects that the SIM card is

inserted when the SIM_DETECT pin is high, then executes the initialization program and finish the

network registration after reading the SIM card information. When the SIM_DETECT pin is low, the

module determines that the SIM card is detached and does not read the SIM card.

Note:

By default, SIM_DETECT is active-high, which can be switched to active-low by the AT

command. Please refer to the AT Commands Manual for the AT command.

3.5.4 USIM Design

The SIM card circuit design shall meet the EMC standards and ESD requirements with the improved

capability to resist interference, to ensure that the SIM card can work stably. The following guidelines

should be noted in case of design:

 The SIM card slot placement should near the module as close as possible, and away from the

RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources.

 The SIM card slot with a metal shielding housing can improve the anti-interference ability.

 The trace length between the SIM card slot and the module should not exceed 100mm, or it

could reduce the signal quality.

 The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk

L850-GL Hardware User Manual Page 38 of 54

interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with

GND as a group at least.

 The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM

card slot, and the ESD devices with 22~33pF capacitance should be used.

3.6 Status Indicator

The L850 module provides three signals to indicate the operating status of the module, and the status

indicator pins as shown in the following table:

Pin Pin Name I/O Reset Value Pin Description Type

10 LED1# O PD System status LED, drain output. CMOS 3.3V

23 WOWWAN# O PU Module wakes up Host (AP)，Reserved CMOS 1.8V

48 TX_BLANKING O PD PA Blanking output, external GPS

control signal，Reserved

CMOS 1.8V

3.6.1 LED#1 Signal

The LED#1 signal is used to indicate the operating status of the module, and the detailed description as

shown in the following table:

Module Status LED1# Signal

RF function ON Low level (LED On)

RF function OFF High level (LED Off)

The LED driving circuit is shown in figure 3-18:

Figure 3-18 LED Driving Circuit

Note:

The resistance of LED current-limiting resistor is selected according to the driving voltage and

the driving current.

L850-GL Hardware User Manual Page 39 of 54

3.7 Interrupt Control

The L850 module provides four interrupt signals, and the pin definition is as follows:

Pin Pin Name I/O Reset Value Pin Description Type

8 W_DISABLE1# I PD Enable/Disable RF network CMOS 3.3V

25 DPR I PU Body SAR detection CMOS 1.8V

26 W_DISABLE2# I PU GNSS Disable signal,

Reserved CMOS 1.8V

44 GNSS_IRQ I PD GNSS Interrupt Request,

Reserved CMOS 1.8V

3.7.1 W_DISABLE1#

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The module enters the Flight mode after the RF function is disabled. The

definition of W_DISABLE1# signal is as follows:

W_DISABLE1# signal Function

High/Floating WWAN function is enabled, the module exits the Flight mode.

Low WWAN function is disabled, the module enters Flight mode.

Note：

The function of W_DISABLE1# can be customized, please refer to the software porting guide.

3.7.2 BODYSAR

The L850 module supports Body SAR function by detecting the DPR pin. The voltage level of DPR is high

by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down.

As the result, the module then lowers down its emission power to its default threshold value, thus reducing

the RF radiation on the human body. The threshold of emission power can be set by the AT Commands.

The definition of DPR signal as shown in the following table:

DPR signal Function

High/Floating The module keeps the default emission power

Low Lower the maximum emission power to the threshold value of the module.

L850-GL Hardware User Manual Page 40 of 54

3.8 Clock Interface

The L850 module supports a clock interface, it can output 26MHz clock.

Pin Pin Name I/O Reset Value Pin Description Type

46 SYSCLK O 26M clock output, default disabled

can be used for external GPS, etc 1.8V

3.9 ANT Tunable Interface

The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 3bit

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

antenna.

Pin Pin Name I/O Pin Description Type

56 RFE_RFFE2_

SCLK O Tunable ANT control, MIPI Interface,

RFFE2 clock, Open Drain output

CMOS 3.3/1.8V

58 RFE_RFFE2_

SDATA O Tunable ANT control, MIPI Interface,

RFFE2 data, Open Drain output

CMOS 3.3/1.8V

59 ANTCTL0 O Tunable ANT control, GPO interface,

Bit0

CMOS 1.8V

61 ANTCTL1 O Tunable ANT control, GPO interface,

bit1

CMOS 1.8V

63 ANTCTL2 O Tunable ANT control, GPO interface,

Bit2

CMOS 1.8V

3.10 Configuration Interface

The L850 module provides four config pins for the configuration as the WWAN-PCIe, USB3.0 type M.2

module:

Pin Pin Name I/O Reset Value Pin Description Type

1 CONFIG_3 O - NC

21 CONFIG_0 O L Internally connected to GND

L850-GL Hardware User Manual Page 41 of 54

Pin Pin Name I/O Reset Value Pin Description Type

69 CONFIG_1 O L Internally connected to GND

75 CONFIG_2 O L Internally connected to GND

The M.2 module configuration as the following table:

Config_0

(pin21)

Config_1

(pin69)

Config_2

(pin75)

Config_3

(pin1)

Module Type and Main

Host Interface

Port

Configuration

GND GND GND NC WWAN–USB3.1, PCIe

Gen1 0

Please refer to PCI Express M.2 Specification Rev1.1” for more details.

3.11 Other Interfaces

The module does not support other interfaces yet.

L850-GL Hardware User Manual Page 42 of 54

4 Radio Frequency

4.1 RF Interface

4.1.1 RF Interface Functionality

The L850 module supports two RF connectors used for external antenna connection. As the Figure 4-1

shows, “M” is for Main antenna, used to receive and transmit RF signals; “D/G” is for Diversity antenna,

used to receive the diversity RF signals.

Figure 4-1 RF connectors

4.1.2 RF Connector Characteristic

Rated Condition Environment Condition

Frequency Range DC to 6GHz Temperature Range

Characteristic Impedance 50Ω –40°C to +85°C

4.1.3 RF Connector Dimension

The L850 module adopts standard M.2 module RF connectors, the model name is 818004607 from ECT

company, and the connector size is 2*2*0.6m. The connector dimension is shown as following picture:

L850-GL Hardware User Manual Page 43 of 54

Figure 4-2 RF connector dimensions

Figure 4-3 0.81mm coaxial antenna dimensions

Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

L850-GL Hardware User Manual Page 44 of 54

4.2 Operating Band

The L850 module operating bands of the antennas are as follows:

Operating Band Description Mode Tx (MHz) Rx (MHz)

Band 1 2100MHz LTE FDD/WCDMA 1920 - 1980 2110 - 2170

Band 2 1900MHz LTE FDD/WCDMA 1850 - 1910 1930 - 1990

Band 3 1800MHz LTE FDD 1710 - 1785 1805 - 1880

Band 4 1700MHz LTE FDD/WCDMA 1710 - 1755 2110 - 2155

Band 5 850MHz LTE FDD/WCDMA 824 - 849 869 - 894

Band 7 2600Mhz LTE FDD 2500 - 2570 2620 - 2690

Band 8 900MHz LTE FDD/WCDMA 880 - 915 925 - 960

Band 11 1500MHz LTE FDD 1427.9 - 1447.9 1475.9 - 1495.9

Band 12 700MHz LTE FDD 699 - 716 729 - 746

Band 13 700MHz LTE FDD 777 - 787 746 - 756

Band 17 700MHz LTE FDD 704 - 716 734 - 746

Band 18 800MHz LTE FDD 815 - 830 860 - 875

Band 19 800MHz LTE FDD 830 - 845 875 - 890

Band 20 800MHz LTE FDD 832 - 862 791 - 821

Band 21 1500MHz LTE FDD 1447.9 - 1462.9 1495.9 - 1510.9

Band 26 850MHz LTE FDD 814 - 849 859 - 894

Band 28 700MHz LTE FDD 703 - 748 758 - 803

Band 29 700MHz LTE FDD N/A 716 - 728

Band 30 2300MHz LTE FDD 2305 - 2315 2350 - 2360

Band 66 1700MHz LTE FDD 1710 - 1780 2110 - 2200

Band 38 2600MHz LTE TDD 2570 - 2620

Band 39 1900MHZ LTE TDD 1880 - 1920

Band 40 2300MHz LTE TDD 2300 - 2400

Band 41 2500MHZ LTE TDD 2496 - 2690

GPS L1 - - / 1575.42±1.023

GLONASS L1 - - / 1602.5625±4

L850-GL Hardware User Manual Page 45 of 54

Operating Band Description Mode Tx (MHz) Rx (MHz)

BeiDou - - / 1561.098±2.046

4.3 Transmitting Power

The transmitting power for each band of the L850 module as shown in the following table:

Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note

WCDMA

Band 1 24+1.7/-3.7 23.5±1 -

Band 2 24+1.7/-3.7 23.5±1 -

Band 4 24+1.7/-3.7 23.5±1 -

Band 5 24+1.7/-3.7 23.5±1 -

Band 8 24+1.7/-3.7 23.5±1 -

LTE FDD

Band 1 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 2 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 3 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 4 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 5 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 7 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 8 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 11 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 12 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 13 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 17 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 18 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 19 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 20 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 21 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 26 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 28 23+2.7/-3.2 23±1 10MHz Bandwidth, 1 RB

Band 30 23±2.7 22±1 10MHz Bandwidth, 1 RB

L850-GL Hardware User Manual Page 46 of 54

Mode Band 3GPP Requirement(dBm) Tx Power(dBm) Note

Band 66 23±2.7 23±1 10MHz Bandwidth, 1 RB

LTE TDD

Band 38 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 39 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 40 23±2.7 23±1 10MHz Bandwidth, 1 RB

Band 41 23±2.7 23±1 10MHz Bandwidth, 1 RB

4.4 Receiver Sensitivity

The receiver sensitivity for each band of the L850 module as shown in the following table:

Mode Band 3GPP Requirement (dBm) Rx Sensitivity(dBm)

pical Note

WCDMA

Band 1 -106.7 -110 BER<0.1%

Band 2 -104.7 -110 BER<0.1%

Band 4 -106.7 -110 BER<0.1%

Band 5 -104.7 -111 BER<0.1%

Band 8 -103.7 -110 BER<0.1%

LTE FDD

Band 1 -96.3 -101.5 10MHz Bandwidth

Band 2 -94.3 -101.5 10MHz Bandwidth

Band 3 -93.3 -102 10MHz Bandwidth

Band 4 -96.3 -102 10MHz Bandwidth

Band 5 -94.3 -103 10MHz Bandwidth

Band 7 -94.3 -101 10MHz Bandwidth

Band 8 -93.3 -102.5 10MHz Bandwidth

Band 11 -96.3 -99 10MHz Bandwidth

Band 12 -93.3 -102.5 10MHz Bandwidth

Band 13 -93.3 -102.5 10MHz Bandwidth

Band 17 -93.3 -102.5 10MHz Bandwidth

Band 18 -96.3 -103 10MHz Bandwidth

Band 19 -96.3 -103 10MHz Bandwidth

L850-GL Hardware User Manual Page 47 of 54

Mode Band 3GPP Requirement (dBm) Rx Sensitivity(dBm)

Typical Note

Band 20 -93.3 -102.5 10MHz Bandwidth

Band 21 -96.3 -99 10MHz Bandwidth

Band 26 -93.8 -103 10MHz Bandwidth

Band 28 -94.8 -103 10MHz Bandwidth

Band 29 -93.3 -101 10MHz Bandwidth

Band 30 -95.3 -99.5 10MHz Bandwidth

Band 66 -95.8 -101.5 10MHz Bandwidth

LTE TDD

Band 38 -96.3 -101 10MHz Bandwidth

Band 39 -96.3 -101.5 10MHz Bandwidth

Band 40 -96.3 -100.5 10MHz Bandwidth

Band 41 -94.3 -100 10MHz Bandwidth

Note:

The above values are measured for the dual antennas situation (Main+Diversity). For single

main antenna (without Diversity), the sensitivity will drop around 3dBm for each band of LTE.

4.5 GNSS

L850 module supports GNSS/BeiDou and AGNSS functions, and adopts RF Diversity and GNSS/Beidou

integrated antenna.

Description Condition Test Result

Power

GPS fixing 120mA / -130dbm

GPS tracking 120mA / -130dbm

GLONASS fixing 120mA / -130dbm

GLONASS tracking 125mA / -130dbm

BeiDou fixing 120mA / -130dbm

BeiDou tracking 120mA / -130dbm

GPS Sleep 0.7mA

GLONASS Sleep 0.8mA

BeiDou Sleep 0.7mA

TTFF GPS Cold start 37s / -130dBm

L850-GL Hardware User Manual Page 48 of 54

Description Condition Test Result

Warm start 34s / -130dBm

Hot Start 2s / -130dBm

GLONASS

Cold start 31s / -130dBm

Warm start 22s / -130dBm

Hot Start 3s / -130dBm

BeiDou

Cold start 148s / -130dBm

Warm start 148s / -130dBm

Hot Start 3s / -130dBm

AGNSS Cold start TBD

Sensitivity

GPS Tracking -160dBm

Acquisition -149dBm

GLONASS Tracking -160dBm

Acquisition -146dBm

BeiDou Tracking -160dBm

Acquisition -141dBm

Note:

Please note that GPS current is tested with RF disabled.

4.6 Antenna Design

The L850module provides main and diversity antenna interfaces, and the antenna design requirements

as shown in the following table:

L850 module Main antenna requirements

Frequency range The most proper antenna to adapt the frequencies should be used.

Bandwidth(WCDMA)

WCDMA band 1(2100) : 250 MHz

WCDMA band 2(1900) : 140 MHz

WCDMA band 4(1700) : 445 MHz

WCDMA band 5(850) : 70 MHz

WCDMA band 8(900) : 80 MHz

Bandwidth(LTE) LTE band 1(2100): 250 MHz

L850-GL Hardware User Manual Page 49 of 54

L850 module Main antenna requirements

LTE band 2(1900): 140 MHz

LTE Band 3(1800): 170 MHz

LTE band 4(1700): 445 MHz

LTE band 5(850): 70 MHz

LTE band 7(2600): 190 MHz

LTE Band 8(900): 80 MHz

LTE Band 11(1500): 68 MHz

LTE Band 12(700): 47 MHz

LTE Band 13(700): 41 MHz

LTE Band 17(700): 42 MHz

LTE Band 18(800): 80 MHz

LTE Band 19(800): 80 MHz

LTE band 20(800): 71 MHz

LTE band 21(1500): 63 MHz

LTE band 26(850): 80 MHz

LTE band 28(700): 100 MHz

LTE band 29(700): 12 MHz

LTE band 30(2300): 55 MHz

LTE band 66(1700): 490 MHz

LTE band 38(2600): 50 MHz

LTE Band 39(1900): 40 MHz

LTE band 40(2300): 100 MHz

LTE band 41(2500): 194 MHz

Bandwidth(GNSS/BeiDou)

GPS: 2 MHz

GLONASS: 8 MHz

BeiDou: 4 MHz

Impedance 50Ohm

Input power > 26dBm average power WCDMA & LTE

Recommended standing-wave

ratio (SWR) ≤ 2: 1

L850-GL Hardware User Manual Page 50 of 54

5 Structure Specification

5.1 Product Appearance

The product appearance for L850 module is shown in Figure5-1:

Figure 5-1 Module Appearance

5.2 Dimension of Structure

The structural dimension of the L850 module is shown in Figure 5-2:

Figure 5-2 Dimension of Structure

L850-GL Hardware User Manual Page 51 of 54

5.3 M.2 Interface Model

The L850 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8

pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 5.2 Dimension of

Structure. Based on the M.2 interface definition, L850 module adopts Type 3042-S3-B interface

(30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY

ID is B).

5.4 M.2 Connector

The L850 module connects to AP via M.2 connector, it is recommended to use M.2 connector from

LOTES company with the model APCI0026-P001A as shown in Figure 5-3. The package of connector,

please refer to the specification.

L850-GL Hardware User Manual Page 52 of 54

Figure 5-3 M.2 Dimension of Structure

5.5 Storage

5.5.1 Storage Life

Storage Conditions (recommended): Temperature is 23 ± 5 , relative humidity is less than RH 60%.

Storage period: Under the recommended storage conditions, the storage life is 12 months.

5.6 Packing

The L850 module uses the tray sealed packing, combined with the outer packing method using the hard

cartoon box, so that the storage, transportation and the usage of modules can be protected to the

greatest extent.

Note：

The module is a precision electronic product, and may suffer permanent damage if no correct

electrostatic protection measures are taken.

5.6.1 Tray Package

The L850 module uses tray package, 20 pcs are packed in each tray, with 5 trays in each box and 6 boxes

L850-GL Hardware User Manual Page 53 of 54

in each case. Tray packaging process is shown in Figure 5-4:

Figure 5-4 Tray Packaging Process

5.6.2 Tray size

The pallet size is 330*175*6.0mm, as shown in Figure 5-5:

L850-GL Hardware User Manual Page 54 of 54

Figure 5-5Tray Size (Unit: mm)

ITEM DIM(Unit: mm)

L 330.0±0.5

W 175.0±0.5

H 6.0±0.3

T 0.5±0.1

A0 43±0.3

B0 33.0±0.3

A1 294.0±0.3

B1 159.0±0.3

C 20.0±0.5

D 9.0±0.5

E 24.5±0.5

F 187.5±0.2

G 105.0±0.2

J 9.0±0.2

Fibocom Wireless L850GLD-D1 LTE module User Manual

Fibocom Wireless Inc. LTE module

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