Fibocom Wireless M210AM LTE module User Manual

Fibocom Wireless Inc. LTE module

User Manual

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Document DescriptionUser Manual
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Date Submitted2018-03-12 00:00:00
Date Available2018-09-10 00:00:00
Creation Date2017-05-17 12:21:26
Document Lastmod2018-03-12 16:27:52
Document TitleUser Manual

M210-AM Datasheet
Version: 2.0.0
Update date: 05/17/2017
M210-AM Datasheet
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Copyright
Copyright © 2017 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt,
copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other reasons.
Unless otherwise specified, the document only serves as the user guide. All the statements, information and
suggestions contained in the document do not constitute any explicit or implicit guarantee.
Version Record
Version
Update Date
Description
V1.0.0
01/12/2017
First edition.
V2.0.0
05/17/2017
Second edition of M210-AM datasheet
M210-AM Datasheet
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About this Datasheet
Purpose and Scope
The M210-AM are complete Verizon Wireless certified LTE Category M1
modules including base-band, RF and memory, for the design of connected
machine-to-machine devices, and other Internet-of-Things devices with
embedded LTE connectivity. This document provides technical information
about M210-AM LGA module. M210-AM are based on Sequans’ Monarch
platform.
Who Should Read this Datasheet
This document is intended for engineers who are developing User Equipment
(UE) for LTE systems.
References
[1]
• Verizon Wireless Unified Module Process for Compliance Testing and Approval, Version 12.0; Feb
2015
• Verizon Wireless Device Requirements LTE 3GPP Band 13 Network Access, Version 29.00; June
2016
• Verizon Wireless Device Requirements LTE 3GPP Multi-Band Network Access, Version 3.00; June
2016
M210-AM Datasheet
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Page 3 of 38
[2]
Core technology specifications:
• 3GPP E-UTRA 21 series Release 13 (EPS)
• 3GPP E-UTRA 22 series Release 13 (IMEI)
• 3GPP E-UTRA 23 series Release 13 (NAS, SMS)
• 3GPP E-UTRA 24 series Release 13 (NAS)
• 3GPP E-UTRA 31 series Release 13 (UICC)
• 3GPP E-UTRA 33 series Release 13 (security)
• 3GPP E-UTRA 36 series Release 13 (RAN)
• 3GPP2 C.S0015-A v1.0 (SMS)
• IETF, RFC 3261, 4861, 4862, 6434
For more information, see
• ftp://ftp.3gpp.org/Specs/archive/
• http://www.3gpp2.org/public_html/specs/CS0015-0.pdf
• https://tools.ietf.org/html/
[3]
Test specifications:
3GPP E-UTRA 36 series Release 13 (RAN)
ftp://ftp.3gpp.org/Specs/archive/
[4]
Vocabulary reference:
• 3GPP TR 21.905: "Vocabulary for 3GPP Specifications"
For more information, see http://www.3gpp.org/ftp/specs/archive/21_series/21.905/
Changes in this Document
This is the first edition of the document.
M210-AM Datasheet
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Page 4 of 38
Documentation Conventions
This section illustrates the conventions that are used in this document.
General Conventions
Note
Important information requiring the user’s attention.
Caution
A condition or circumstance that may cause damage to the equipment or loss of
data.
Warning
A condition or circumstance that may cause personal injury.
Italics
Italic font style denotes
• emphasis of an important word;
• first use of a new term;
• title of a document.
Screen Name
Sans serif, bold font denotes
• on-screen name of a window, dialog box or field;
• keys on a keyboard;
• labels printed on the equipment.
Software Conventions
Code
Regular Courier font denotes code or text displayed on-screen.
Code
Bold Courier font denotes commands and parameters that you enter exactly as
shown. Multiple parameters are grouped in brackets [ ]. If you are to choose only
one among grouped parameters, the choices are separated with a pipe: [parm1 |
parm2 | parm3] If there is no pipe separator, you must enter each parameter:
[parm1 parm2 parm3]
Code
Italic Courier font denotes parameters that require you to enter a value or
variable. Multiple parameters are grouped in brackets [ ]. If you are to choose
only one among grouped parameters, the choices are separated with a pipe:
[parm1 | parm2 | parm3] If there is no pipe separator, you must enter a value for
each parameter: [parm1 parm2 parm3]
M210-AM Datasheet
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Page 5 of 38
Table of Contents
About this Datasheet............................................................................................................. 3
Purpose and Scope................................................................................................................................... 3
Who Should Read this Datasheet........................................................................................................... 3
References.................................................................................................................................................. 3
Changes in this Document........................................................................................................................4
Documentation Conventions.................................................................................................................... 5
Table of Contents....................................................................................................................6
1 Product Features................................................................................................................ 8
1.1 Features Description................................................................................................................ 8
2 FCC Regulation Warning...............................................................................................13
• Manual Information To the End User....................................................................................13
• Federal Communication Commission Interference Statement......................................... 13
• Radiation Exposure Statement.............................................................................................. 13
• End Product Labeling.............................................................................................................. 14
This device is intended only for OEM integrators under the following conditions:...........14
3 Physical Characteristics............................................................................................... 15
3.1 ECCN and Part Number.......................................................................................................... 15
3.2 Electrical Operating Conditions.............................................................................................. 16
3.2.1 Detailed Information.................................................................................................................... 16
3.2.2 M210-AM Power Tree................................................................................................................. 16
3.2.3 Power Supplies Environment.................................................................................................... 18
3.3 Environmental Operating Conditions..................................................................................... 19
3.3.1 Temperature..................................................................................................................................19
3.3.2 Humidity......................................................................................................................................... 19
3.4 Power Supply Dimensioning................................................................................................... 20
3.5 I/O Characteristics.................................................................................................................... 21
3.6 Performance.............................................................................................................................. 25
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M210-AM Datasheet
Page 6 of 38
3.7 Component Reliability.............................................................................................................. 26
3.8 Package Description.................................................................................................................26
3.8.1 Module Footprint.......................................................................................................................... 26
3.8.2 Marking Information.....................................................................................................................30
3.9 Packing Information..................................................................................................................30
3.10 Storage Conditions................................................................................................................. 30
3.11 Mounting Considerations.......................................................................................................31
4 Signal and Pins................................................................................................................. 32
4.1 M210-AM Pinout....................................................................................................................... 32
4.2 UART Interfaces........................................................................................................................33
4.2.1 High-Speed UARTs................................................................................................................ 33
4.3 Power-up Sequence................................................................................................................. 33
4.4 LTE Low Power Mode..............................................................................................................35
A Acronyms......................................................................................................................... 36
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M210-AM Datasheet
Page 7 of 38
1 Product Features
1.1
Features Description
M210-AM modules include Monarch SQN3330 Cat-M1 baseband, a complete
dual band RF front end, memory and required circuitry to meet 3GPP EUTRA (Long Term Evolution - LTE, Release 13 set of specifications) and
Verizon Wireless LTE Cat-M1 UE specifications.
For more information on the core technology specifications see the section
References on page 3. The terms M210-AM module refer to the hardware
and the associated embedded software.
The architecture block diagram of the M210-AM is presented on Figure 1-1.
M210-AM-00
Figure 1-1: M210-AM-00 Block Diagram
M210-AM Datasheet
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Table 1-1 on page 10 provides detail on general features of the M210AM.
Table 1-2 on page 11 provides detail for the LTE-related
features of the M210-AM.
M210-AM’s ECCN and part number are detailed in the Section 3.1 ECCN and
Part Number on page 15.
Table 1-1: General Features
General interfaces
• JTAG
• I2C (reserved)
• USIM
• SPI (reserved)
• GPIO
• UART (x3, including one reserved)
Supported Frequency Bands
• LTE Band 4
Operation voltages
• Vbat1 (range from 3.1 V to 4.5 V)
Packaging
• LGA module
• LTE Band 13
• 108 pads (21.35 x 20.25 x 1.79 mm)
• RoHS compliant, halogen-free
M210-AM Datasheet
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Operating temperature
• RF compliant -30°C to +60°C (ambient)
• Operational: -40°C to +85°C (board)
See also Section 3.3 Environmental Operating Conditions on page 19.
Humidity
M210-AM Datasheet
• 10% to 85%
See also Section 3.3 Environmental Operating Conditions on page 19.
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Page 10 of 38
Table 1-2: LTE Features
Standard compliance
• 3GPP E-UTRA Release 13 compliant
PHY
• One UL and one DL transceiver
• Support of HD-FDD Duplexing
• Category M1 UE
• Channel 1.4 MHz bandwidth
• Normal and extended cyclic prefix
• Support of MPDCCH
• Modulation
- DL: QPSK, 16QAM
- UL: QPSK, 16QAM
• All coding schemes corresponding to modulations
• All channel coding (turbo-coding with interleaver, tail biting convolutional coding,
block and repetition coding) and CRC lengths
• Sounding (including in special subframes)
• Control and data in special subframes
• All power control schemes and DL power allocation schemes
• HARQ Incremental Redundancy and Chase Combining, with bundling or multiplexing
• Measurements and computations related to CQI (Channel Quality Indicator), PMI
(Pre-coding Matrix Indicator) and RI (Rank Indicator), RSRP, and RSRQ
• UEPCOP (from 3GPP Release 12) Power Saving Mode
MAC
• Random Access procedure in normal and special subframes
• Scheduling Request, Buffer Status Reporting, and Power Headroom Reporting
• Discontinuous reception (DRX, eDRX) with long and short cycles
• Fast scanning
• Hosted configuration
• IPv4, IPv6
• RoHC
• Location based services
• Advanced QoS features
RLC
• ARQ modes: UM, AM, and TM
PDCP
• Ciphering and deciphering: NULL, AES, SNOW 3G
• Integrity and protection: AES, SNOW 3G
RRC
• MIB and new SIB1bis
• Intra and inter-frequency measurements and handover
• Up to 8 Data Radio Bearers supported
• Support of CE (Coverage Extension) Mode
M210-AM Datasheet
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Page 11 of 38
Table 1-2: LTE Features (Continued)
NAS and above
• NAS
• SMS over SG
• LWM2M Client
M210-AM Datasheet
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Page 12 of 38
2
FCC Regulation Warning
•
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end
user regarding how to install or remove this RF module in the user's
manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
•
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio
or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one
of the following measures:
–
–
–
–
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to
which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction
with any other antenna or transmitter.
•
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for
an uncontrolled environment. This equipment should be installed and
operated with minimum distance 20 cm between the radiator & your body.
M210-AM Datasheet
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Page 13 of 38
•
End Product Labeling
When the module is installed in the host device, the FCC ID label must be
visible through a window on the final device or it must be visible when an
access panel, door or cover is easily re-moved. If not, a second label must
be placed on the outside of the final device that contains the following text:
"Contains FCC ID: ZMOM210AM".
The grantee's FCC ID can be used only when all FCC compliance requirements are met.
This device is intended only for OEM integrators under the following
conditions:
1. The antenna must be installed such that 20 cm is maintained between the
antenna and users,
2. The transmitter module may not be co-located with any other transmitter
or antenna.
3. To comply with FCC regulations limiting both maximum RF output power
and human exposure to RF radiation, the maximum antenna gain
including cable loss in a mobile exposure condition must not exceed:
Standalone Condition:
•
10 dBi in 700 MHz Band
•
6 dBi in 1700 MHz Band
Assuming collocated with an ordinary WLAN/WiMax transmitter with 34
dBm average EIRP power
•
6.5 dBi in Cellular band
•
6 dBi in PCS band
Remark: This assumption is not valid if the output power of the collocated
WLAN/ WiMax transmitter is higher than 34 dBm.
In the event that these conditions cannot be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID cannot be used
on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter)
and obtaining a separate FCC authorization.
4. The product using this module must also comply with the maximum
antenna gain to meet FCC EMC and RF exposure related limits. The
modular grant lists those maximum gain values.
5. The OEM integrator needs show that the product hosting this module
needs to be compliant with radiated and conducted emissions limits for
unintentional radiators (digital devices) per 15B testing (limits in part
15.107 and 15.109, respectively).
M210-AM Datasheet
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Page 14 of 38
3
Physical Characteristics
3.1
ECCN and Part Number
The ECCN and orderable part number of the M210-AM modules will be
provided in a future revision of the document.
M210-AM Datasheet
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Page 15 of 38
3.2
Electrical Operating Conditions
3.2.1
Detailed Information
Table 3-1: Electrical Operating Conditions for M210-AM
Direction
Minimum
Typical
Maximum
VBAT1
In
3.1 V
4.5 V
SIM_VCC (1.8 V or 3.0 V)
Out
1.62 V
1.8 V
1.98 V
2.7 V
3.0 V
3.3 V
1V8
See note below.
Out
1.71 V
1.8 V
1.89 V
3V0
Out
2.85 V
3.0 V
3.15 V
VCC1_PA
In
2.85 V
3.0 V
3.3 V
VCC2_PA
In
2.85 V
3.0 V
3.3 V
Note:
3.2.2
1.The maximum current consumption allowed from the 1V8 reference pin is 100 mA.
2.Each output reference voltage (1V8, 3V0) can be either running
or powered off depending on the internal software
configuration. They should not be used to power external IC or
parts that require permanent supply.
M210-AM Power Tree
Figure 3-1 provides a representation of the power tree of the M210-AM.
M210-AM Datasheet
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Figure 3-1: M210-AM Power Tree
M210-AM Datasheet
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Page 17 of 38
3.2.3
Power Supplies Environment
Figure 3-2 illustrates the connections between the RF front-end power
supplies of the M210-AM.
M210-AM
Figure 3-2: M210-AM LTE RF Front-End Power Supplies Diagram
M210-AM Datasheet
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Page 18 of 38
3.3
Environmental Operating Conditions
3.3.1
Temperature
3.3.2
M210-AM Datasheet
•
RF compliant: -30°C to +60°C (ambient)
•
Operational, with additional software to limit TxPower: -40°C to +85°C
(measured on board)
•
Storage: -40°C to +85°C
Humidity
•
Operating: 10% to 85% (non condensing)
•
Storage: 5% to 85% (non condensing)
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3.4
Power Supply Dimensioning
Important: - Information provided here is estimated peak current consumption for the M210-AM Module in various LTE Tx/Rx
configurations, with and without DC/DC losses.
- Average and detailed power consumption figures are provided
in Sequans’ Software Release Notes.
Table 3-2: Estimated Peak Current and Peak Power Consumption
(LTE Band 13)
TX
RX
M210-AM Datasheet
Estimated
Peak Power
Consumption
Estimated Battery Peak
Current (for
VBAT1=4.2 V)
TX Power = 23 dBm
1.8 W
430 mA
TX Power = 20 dBm
1.6 W
380 mA
TX Power = 18 dBm
1.5 W
360 mA
TX Power = 13 dBm
1.3 W
310 mA
1.1 W
260 mA
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3.5
I/O Characteristics
The voltage and current characteristics of the various IO pads of the M210AM versus IO bank supply voltage are illustrated in the tables below.
Caution:
Note that the Voh values in the tables below do not apply to
GPIOs configured in open drain mode. GPIOs can be individually
configured in open drain mode. When in open drain mode they
either drive the line to Vol, or leave it floating, to be pulled up by
an external pullup resistance. The PCB designer must ensure that
the voltage on these pads never exceeds Vih of the IO group to
which they belong.
Refer to M210-AM Pin List to know the type of IO pad used on every
termination.
M210-AM Datasheet
•
The Minimum values for Iol and Ioh should not be exceeded to guarantee
that the logical level are not spoiled for each pad type.
•
The Nominal values for Iol and Ioh represent the nominal values for the pad
type. They are provided for information only.
•
The Maximum values for Iol and Ioh represent the maximal values for the
pad type. They are provided for information only.
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Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V
Parameter
Drive
Strength
VIL
Min.
Nom.
Max.
Unit
-0.3
0.63
1.17
3.6
Input Low Voltage
VIH
Input High Voltage
VT
Threshold Point
0.79
0.87
0.94
VT+
1.12
1.22
0.61
0.71
0.8
0.79
0.86
0.93
0.8
0.87
0.95
VT+ PU
1.12
1.21
VT- PU
0.61
0.7
0.8
VT+ PD
1.01
1.13
1.23
VT- PD
0.62
0.72
0.81
II
Input Leakage Current @ VI=1.8V or 0V
±10
µA
IOZ
±10
µA
Schmitt Trigger Low to High Threshold Point
VTSchmitt Trigger High to Low Threshold Point
VT PU
Threshold Point with Pull-up Resistor Enabled
VT PD
Threshold Point with Pull-down Resistor Enabled
Schmitt Trigger Low to High Threshold Point with
Pull-up Resistor Enabled
Schmitt Trigger High to Low Threshold Point with
Pull-up Resistor Enabled
Schmitt Trigger Low to High Threshold Point with
Pull-down Resistor Enabled
Schmitt Trigger High to Low Threshold Point with
Pull-down Resistor Enabled
Tri-state Output Leakage Current @ VO=1.8V or 0V
Input Capacitance
M210-AM Datasheet
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pF
Page 22 of 38
Table 3-3: DC Characteristics for Digital IOs, Voltage 1.8 V - BIDIR and IN Types
Parameter
Drive
Strength
RPU
Min.
Nom.
Max.
Unit
56
89
148
kOhm
52
90
167
kOhm
0.45
Pull-up Resistor
RPD
Pull-down Resistor
VOL
Output Low Voltage
VOH
1.35
Output High Voltage
IOL
Low Level Output Current at VOL(max)
IOH
High Level Output Current at VOH(max)
2 mA
1.2
2.2
3.6
mA
4 mA
2.3
4.3
7.1
mA
8 mA
4.6
8.6
14.3
mA
2 mA
1.0
2.4
4.6
mA
4 mA
2.0
4.7
9.2
mA
8 mA
4.0
9.4
18.4
mA
Table 3-4: DC Characteristics for IN_PMU Type
Parameter
Drive
Strength
VIL
Min.
Nom.
Max.
Unit
-0.3
0.4
1.1
VBAT1 +
0.3
Input Low Voltage
VIH
Input High Voltage
Table 3-5: DC Characteristics - BIDIR_WAKE Type
Parameter
VIL
Input Low Voltage
M210-AM Datasheet
Min.
Nom.
Max.
0.2
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Unit
Page 23 of 38
PHYSICAL CHARACTERISTICS
PERFORMANCE
Table 3-5: DC Characteristics - BIDIR_WAKE Type (Continued)
Parameter
VIH
Input High Voltage. See note below related to
maximum value.
Min.
0.8
VOL
Output Low Voltage
VOH
Output High Voltage
M210-AM Datasheet
1.6
Nom.
Max.
Unit
3.6
1.8
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Page 24 of 38
3.6
Performance
Table 3-5 and Table 3-6 present the M210-AM module’s performance in LTE
Band 4 and Band 13.
Table 3-5: Output Power
LTE Band
Band 13
Band 4
Frequency(kHz)
TCH
Conducted Power (dBm)
Bandwidth 1.4 MHz, Full
RB
779500
23205
23 +2/-2.7
782000
23230
23 +2/-2.7
784500
23255
23 +2/-2.7
1712500
19975
23 +2/-2.7
1732500
20175
23 +2/-2.7
1752500
20375
23 +2/-2.7
Table 3-6: RF Sensitivity
LTE Band
Band 13
Band 4
M210-AM Datasheet
Frequency(kHz)
TCH
Typ. Sensitivity level
(dBm)
Bandwidth 1.4 MHz
748500
5205
-103
751000
5230
-103
753500
5255
-103
2112500
1975
-103
2132500
2175
-103
2152500
2375
-103
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Page 25 of 38
3.7
Component Reliability
Note:
Information related to component reliability will be provided in a
future edition of this document.
3.8
Package Description
3.8.1
Module Footprint
The dimensions marked in Figure 3-4 are listed in Table 3-7.
Figure 3-4: Top and Side View of the M210-AM
M210-AM Datasheet
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Table 3-7: M210-AM Outline Dimensions
Mark
Minimum (mm)
Nominal (mm)
Maximum (mm)
21.25
21.35
21.45
20.15
20.25
20.35
1.71
1.79
1.94
Not Available
Not Available
0.08
M210-AM Datasheet
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Page 27 of 38
The dimensions marked in Figure 3-5 are listed in Table 3-8.
Figure 3-5: M210-AM Bottom Side View of Pads
Table 3-8: M210-AM Dimensions and Tolerances
Mark
Dimension and tolerance (mm)
21.35 ± 0.1
20.25 ± 0.1
A1
12 ± 1.0
A2
4.125 ± 0.5
A3
10.8 ± 1.0
A4
4.725 ± 0.5
M210-AM Datasheet
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Page 28 of 38
Table 3-8: M210-AM Dimensions and Tolerances (Continued)
Mark
Dimension and tolerance (mm)
A5
0.6 ± 0.05
A6
1.2 ± 0.1
A7
0.6 ± 0.05
B1
0.9 ± 0.1
B2
0.325 ± 0.05
B3
0.6 ± 0.05
B4
19.2 ± 0.2
B5
18 ± 0.2
B6
1.075 ± 0.1
B7
1.675 ± 0.15
C1
6.125 ± 0.5
C2
6.8 ± 0.5
C3
1.2 ± 0.01
C4
0.5 ± 0.05
D1
0.5 ± 0.05
D2
0.9 ± 0.1
D3
7 ± 0.5
D4
6.725 ± 0.5
D5
18.9 ± 0.2
D6
15.9 ± 0.2
M210-AM Datasheet
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Page 29 of 38
3.8.2
Marking Information
Figure 3-6: M210-AM-00 Marking Description
3.9
Packing Information
The module is delivered in Tape-and-Reel.
Note:
3.10
Details about packing of the modules will be provided in a future
revision of this document.
Storage Conditions
Note:
Additional storage conditions impacting the mounting process
are provided in Section 3.11 Mounting Considerations on page 31.
1. Calculated shelf life in sealed bag : 12 months at < 40°C and < 90% RH
2. Peak package body temperature: 250°C
3. After bag is opened, devices that will be subjected to reflow solder or other
high temperature process must be:
M210-AM Datasheet
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Page 30 of 38
a) mounted within 168 hours of factory conditions ≤ 30°C/60%RH, or
b) Stored as per J-STD-033
4. Devices require bake, before mounting, if
a) Humidity Indicator Card reads >10% for level 2a-5a devices or >60% for
level 2 devices when read at 23±5°C
b) 3a or 3b above are not met
5. If baking is required, refer to IPC/FEDEC J-STD-033 for bake procedure.
Note:
3.11
Level and body temperature are defined by IPC/JEDEC
J-STD-020.
Mounting Considerations
This section provides reflow information.
Note:
Details will be provided in a future revision of this document.
The M210-AM can support up to 3 reflows with 250°C maximum.
Table 3-10: Reflow Parameters
Parameter
Setting
Peak package body temperature
To be defined
Liquidous Time
To be defined
Preheat/Soak
To be defined
Ramp-up rate
To be defined
Ramp-down rate
To be defined
M210-AM Datasheet
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Page 31 of 38
4 Signal and Pins
4.1
M210-AM Pinout
The signals and all the related details are listed in the MS-Excel companion
file delivered together with the present document in a PDF portfolio.
The pads listed in Table 4-1 are connected to ground.
Table 4-1: Ground and Thermal Pads
Pad #
Pad
Name
1 20 22 24 26 28 30 31 32 33 34 42 43 45 46
53
55 62 63 64 65 66 68 69 70 71 72 73 74 86 87
GND
All GND pads shall be connected to the
same copper.
T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11
T12 T13 T14 T15 T16 T17 T18 T19 T20
T21 T22 T23 T24 T25 T26 T27 T28 T29
T30
GND
T1 to T30 pads are used as both GND and
thermal drops.
M210-AM Datasheet
Comment
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4.2
UART Interfaces
4.2.1
High-Speed UARTs
Figure 4-1 represents the typical implementation for the hardware flowcontrol
for UART0, UART1 and UART2. TDX and RDX signals are mandatory. RTS
and CTS are strongly recommended.The other signals are optional.
M210-AM are designed for use as DCE (Data Communication Equipment).
Based on the conventions for DCE-DTE connections, the DCE device will
communicate with the customer application (DTE) using the following
signals:
•
Port TXD on Application sends data to the module’s TXD signal line.
•
Port RXD on Application receives data from the module’s RXD signal line.
M210-AM
Figure 4-1: UART0, UART1 and UART2 Signals Convention and Flow
Control
Note:
4.3
M210-AM Datasheet
CLK signals can be input or output.
Power-up Sequence
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Page 33 of 38
The following timing requirement applies to the signals VBAT1,
MODULE_PWR_EN and RESET_N. It must be respected for proper M210AM’s behavior.
Figure 4-3: VBAT1, MODULE_PWR_EN and RESET_N Signals Timing
Requirement for Cold Start
Figure 4-4: VBAT1, MODULE_PWR_EN and RESET_N Signals Timing
Requirement for Warm Start
Figure 4-5: VBAT1, MODULE_PWR_EN and RESET_N Signals Timing
Requirement for Reset Cycle
The timing minimum values are listed in Table 4-3.
Table 4-3: VBAT1, MODULE_PWR_EN and RESET_N Signal Timing Values
Symbol
Description
Minimum Duration
Maximum Duration
ts
VBAT1 setup time
1 ms
ts1
RESET_N setup time
1 ms
th1
RESET_N hold time
1 µs
M210-AM Datasheet
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4.4
LTE Low Power Mode
Important: The M210-AM module is provided with an internal RTC whose
supply is VBAT1. As a consequence, VBAT1 should not be
removed, in order to keep RTC active.
The M210-AM will automatically enter in low-power mode. M210-AM can be
woken from low power mode by external sources through:
•
SIM_DETECT input signal to cope with SIM card insertion into a SIM card
connector with built-in hardware detection. The default configuration to
wake-up the module is a low-to-high transition.
•
The RTS0 input signal whenever data traffic is initiated by the host
connected to the module UART0 with hardware flow control; The default
configuration to wake-up the module is a high-to-low transition.
•
Two dedicated input signal WAKE0 and WAKE1; The default configuration to wake-up the module is on a high-to-low transition. This can be
modified by software. As example, these signals can be used to detect an
alarm from an external IC such as a sensor. Software can disable the
wake-up functionality on these signals.
Important: WAKE inputs are detected on level (configurable by software
to 0 or 1) that must last at least 5 periods of the 32 kHz clock,
that is 156.25 ìs.
•
A subset of GPIO input signals: GPIO2, GPIO3, GPIO25, GPIO27, GPIO42;
they are not configured by default as wake-up source but software can
configure them for future use.
To get the lowest possible power consumption during low-power mode, all
IOs must be stable. At software configuration time, take care of the following,
to prevent them from being in conflict or floating:
•
Pads that are not driven by an external device shall be driven low by software if they have a GPIO or RFDATA mode that allows it.
•
For pads that are known to be driven by an external device:
Configure that external device to hold the signal stable during low-power
mode, and configure M210-AM to treat that pin as an input, without
internal pull-up or pull-down.
•
For pads where, at the time of low-power mode, the signal may or may not
be driven by an external device:
Configure M210-AM to enable the internal pull-up/pull-down on the pad to
guarantee that it will not be floating during low-power mode.
Note:
M210-AM Datasheet
Each signal’s pull (up or down) is determined by register. It can
be modified by software. Please see the default configuration in
the signal’s list.
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A
Acronyms
Acronym
Definition
AFE
Analog Front-End
APC
Automatic Control Power
APT
Average Power Tracking
CE
Coverage Extension
COO
Country of origin
CPU
Central Processing Unit
DC/DC
Direct current converter
DL
Downlink
DPLL
Digital Phase-Locked Loop
ECCN
Export Control Classification Number
EPS
Evolved Packet System
ESD
Electro-static discharge
ETSI
European Telecommunications Standard Institute
GND
Ground
GNSS
Global Navigation Satellite System. Superset for systems such as GPS, Galileo,
Glonass, BeiDou or QZSS among others.
GPIO
General Purpose Input Output
HBM
Human Body Model (ESD)
I/O
Input/Output
I2C
Inter-integrated circuit (bus)
M210-AM Datasheet
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Acronym
Definition
IMEI
International Mobile Equipment Identity
IMS
Instant Messaging Service
IP
Internet Protocol
JTAG
Joint Test Action Group. See IEEE 1149.7 specification
LDO
Low Drop-Out regulator
LGA
Large Grid Array
LNA
Low-Noise Amplifier
LTE
Long Term Evolution, or 4G. Standard is developed by the 3GPP
www.3gpp.org.
MM
Machine Model (ESD)
NAS
Network Access Server
NVM
Non Volatile Memory
OMADM
Open Mobile Alliance Device Management
PCB
Printed Circuit Board
PHY
Physical Layer
PLL
Phase-Locked Loop
PMIC
Power Management Integrated Circuit
pSRAM
Pseudo-Static Random Access Memory
QTY
Quantity
RAM
Random Access Memory
RB
Resource Block
RF
Radio Frequency
RFIC
RF Integrated Circuit
RoHS
Restriction of Hazardous Substances
RTC
Real-Time Clock
Rx
Reception
M210-AM Datasheet
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Acronym
Definition
S/N
or SN: Serial Number
SAW
Surface Acoustic Wave (filters)
SDM
Socketed Device Model (ESD)
SIM
Subscriber Identification Module
SMS
Short Message Service
SPI
Serial Peripheral Interface
TCXO
Temperature-controlled crystal oscillator
Tx
Transmission
UART
Universal asynchronous receiver transmitter.
UE
User Equipment
UICC
Universal integrated circuit card (SIM)
UL
Uplink
XTAL
Crystal
M210-AM Datasheet
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