Flaircomm Microelectronics CBM202 WiFi and BT combo module User Manual FLC BTM401 DS

Fujian Flaircomm Microelectronics,Inc. WiFi and BT combo module FLC BTM401 DS

User Manual

                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -1-      FLC-CBM202 Datasheet           Document Type:    Combo Module Datasheet Document Number:  FLC-CBM202-DS Document Version:  V1.2 Release Date:    Feb.22, 2013   Copyright 2012 ~ 2014 by Flaircomm Microelectronics, Inc.,  All Right Reserved Without written permission from Flaircomm Microelectronics, Inc., reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is prohibited
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -2-   Release Record  Version  Release Date Comments 0.1 June 16, 2011 Preliminary Release 0.2 August 05, 2011 Add Section5.2 1.0 July 3, 2012  1.1 Jan. 11, 2013 Add Section 11 1.2 Feb.22,2013 Modify Frequency Band.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -3- CONTENTS 1. INTRODUCTION .................................................................................................................................................. 6 1.1 BLOCK DIAGRAM .................................................................................................................................................. 6 1.2 FEATURES ............................................................................................................................................................. 6 1.2.1 WiFi Features ............................................................................................................................................... 6 1.2.2 Bluetooth Features ........................................................................................................................................ 7 1.3 FUNCTIONS ........................................................................................................................................................... 7 1.3.1 WiFi Functions ............................................................................................................................................. 7 1.3.2 Bluetooth Functions ..................................................................................................................................... 8 1.4 APPLICATIONS ...................................................................................................................................................... 9 2. GENERAL SPECIFICATION ........................................................................................................................... 10 3. PIN DEFINITION ................................................................................................................................................ 12 3.1 PIN CONFIGURATION ........................................................................................................................................... 12 3.2 PIN DEFINITION ................................................................................................................................................... 12 4. PHYSICAL INTERFACES ................................................................................................................................ 15 4.1 WIFI POWER SUPPLY .......................................................................................................................................... 15 4.1.1 Linear Regulator for Digital Supply ........................................................................................................... 15 4.1.2 Linear Regulator for Analogue Supply ...................................................................................................... 15 4.1.3 RF Front End Power Supply ...................................................................................................................... 15 4.1.4 I/O Power Supply ....................................................................................................................................... 15 4.2 BT POWER SUPPLY ............................................................................................................................................. 15 4.3 RESET ................................................................................................................................................................. 15 4.3.1 WiFi reset ................................................................................................................................................... 16 4.3.2 BT Reset ..................................................................................................................................................... 16 4.4 RF INTERFACE .................................................................................................................................................... 16 4.5 HOST INTERFACE ................................................................................................................................................ 17 4.5.1 WiFi Host Interfaces .................................................................................................................................. 17 4.5.2 Bluetooth UART Host Interfaces ............................................................................................................... 19 4.6 AUDIO INTERFACE .............................................................................................................................................. 19 4.6.1 PCM Interface ............................................................................................................................................ 19 4.6.2 Digital Audio Interface (I²S) ...................................................................................................................... 21 5. ELECTRICAL CHARACTERISTIC ................................................................................................................ 22 5.1 WIFI PERFORMANCE SPECIFICATIONS ................................................................................................................ 22 5.1.1 DSSS and CCK modulations (802.11b) TX Performance Specifications .................................................. 22 5.1.2 OFDM TX Performance Specifications ..................................................................................................... 22 5.1.3 DSSS and CCK modulations (802.11b) RX Performance Specifications .................................................. 23 5.1.4 OFDM RX Performance Specifications ..................................................................................................... 23 5.2 BLUETOOTH PERFORMANCE SPECIFICATIONS ..................................................................................................... 25 5.2.1 Transmitter ................................................................................................................................................. 25 5.2.2 Receiver ...................................................................................................................................................... 26 5.3 DC ELECTRICAL SPECIFICATIONS ....................................................................................................................... 27 5.3.1 Absolute Maximum Ratings ....................................................................................................................... 27 5.3.2 Recommended Operating Conditions ......................................................................................................... 27 5.3.3 Current Consumption ................................................................................................................................. 27 5.3.4 Digital Characteristics ................................................................................................................................ 28 5.3.5 Sleep Clock Characteristics ........................................................................................................................ 28 5.3.6 Power-on Reset Characteristics .................................................................................................................. 29 6. REFERENCE DESIGN ....................................................................................................................................... 30 7. MECHANICAL CHARACTERISTIC .............................................................................................................. 31 8. RECOMMENDED PCB LAYOUT AND MOUNTING PATTERN............................................................... 32
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -4- 8.1 ANTENNA CONNECTION AND GROUNDING PLANE DESIGN ................................................................................. 32 9. RECOMMENDED REFLOW PROFILE ......................................................................................................... 34 10. ORDERING INFORMATION ....................................................................................................................... 35 10.1 PRODUCT PACKAGING INFORMATION ................................................................................................................. 35 10.2 ORDERING INFORMATION .................................................................................................................................... 35 10.2.1 Product Revision ........................................................................................................................................ 35 10.2.2 Shipping Package ....................................................................................................................................... 35 10.2.3 Product Package ......................................................................................................................................... 35 10.2.4 Product Grade ............................................................................................................................................. 36 11. CAUTIONS &WARNINGS ............................................................................................................................ 37 11.1 FCC STATEMENT ................................................................................................................................................ 37 11.2 FCC RADIATION EXPOSURE STATEMENT ........................................................................................................... 37 11.3 FLC-CBM202 LABEL INSTRUCTIONS ................................................................................................................. 37 11.4 FLC-CBM202 ANTENNA STATEMENT ............................................................................................................... 38 11.4.1 Antenna Electrical Specifications............................................................................................................... 38 11.4.2 Radiation Gain and Pattern ......................................................................................................................... 38
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -5-  TABLES AND FIGURES  Table 1: General Specification ....................................................................................................................................... 11 Table 2: Pin Definition ................................................................................................................................................... 14 Table 3: Analog IO Usage .............................................................................................................................................. 17 Table 4: PCM and I2S Digital Audio Interface .............................................................................................................. 21 Table 5: DSSS and CCK modulations (802.11b) TX Performance Specifications ........................................................ 22 Table 6: OFDM TX Performance Specifications ........................................................................................................... 23 Table 7: DSSS and CCK modulations (802.11b) RX Performance Specifications ........................................................ 23 Table 8: OFDM RX Performance Specifications ........................................................................................................... 25 Table 9: Transmitter ....................................................................................................................................................... 26 Table 10: Receiver ......................................................................................................................................................... 26 Table 11: Absolute Maximum Ratings .......................................................................................................................... 27 Table 12: Recommended Operating Conditions ............................................................................................................ 27 Table 13: WiFi Current Consumption ............................................................................................................................ 27 Table 14: BT Current Consumption ............................................................................................................................... 28 Table 15: Digital Characteristics .................................................................................................................................... 28 Table 16: Sleep Clock Characteristics ............................................................................................................................ 28 Table 17: Power-on Reset Characteristics ...................................................................................................................... 29 Table 18: Product Revision ............................................................................................................................................ 35 Table 19: Shipping Package ........................................................................................................................................... 35 Table 20: Product Package ............................................................................................................................................. 35 Table 21: Product Grade ................................................................................................................................................ 36 Table 20: Antenna Electrical Specifications .................................................................................................................. 38 Table 21: Radiation Gain and Pattern ............................................................................................................................ 38  Figure 1: Block Diagram .................................................................................................................................................. 6 Figure 2: Pin Configuration............................................................................................................................................ 12 Figure 3: UART_TX Timing ......................................................................................................................................... 19 Figure 4: PCM Interface Master ..................................................................................................................................... 20 Figure 5: PCM Interface Slave ....................................................................................................................................... 20 Figure 6: Reference Design ............................................................................................................................................ 30 Figure 7: Module Size (Top View and Side View) ........................................................................................................ 31 Figure 8: Footprint (Top View) ...................................................................................................................................... 31 Figure 9: Pin dimensions ................................................................................................................................................ 31 Figure 10: Placement the Module on a System Board ................................................................................................... 32 Figure 11: Leave 5mm Clearance Space from the Antenna ........................................................................................... 32 Figure 12: Recommended Trace Connects Antenna and the Module ............................................................................ 33 Figure 13: Recommended Reflow Profile ...................................................................................................................... 34 Figure 14: Product Packaging Information .................................................................................................................... 35 Figure 15: Ordering Information .................................................................................................................................... 35 Figure 12: ALA931C5 Radiation Pattern : Azimuth@2.45GHz .................................................................................... 39 Figure 13:  ALA931C5 Radiation Pattern : Elevation1@2.45GHz ............................................................................... 40 Figure 14:  ALA931C5 Radiation Pattern : Elevation2@2.45GHz ............................................................................... 41
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -6- 1. Introduction  FLC-CBM202 is a highly integrated module that combines WiFi and BT in a small single package. The module supports SDIO and CSPI host interfaces for WiFi and UART for BT that make it simple to design into fully certified embedded WiFi and BT solutions.  The  module  is  an  appropriate  product  for  designers  who  want  to  add  wireless capability to  their products. 1.1 Block Diagram  FEMCSR6030/126 MHzPower SupplyBPFAntennaSDIOCSPITXRXFEM controlVDD_SDIOVREG_IN_ANAVREG_IN_DIGVDD_RFBT ResetEEPROMCSR8810/1BTWiFi ResetUARTPCMAudioBTWiFiWiFi+BT Coexistence Figure 1: Block Diagram 1.2 Features 1.2.1 WiFi Features  Low cost, low power, highly integrated IEEE 802.11b/g/n,  Support Independent Basic Service Set (IBSS), e.g. ad hoc, BSS and Extended Service Set (ESS) network configurations.  IEEE  802.11n  support,  including  MPDU  and  MSDU  aggregation,  immediate  block acknowledgement, PSMP and STBC for improved rate, range and performance.  Intelligent power control, including IEEE802.11 power saving mode.  SDIO (4-bit and 1-bit) and CSPI will be employed to interface with host device (Android, Linux and WinCE).  Support open system and shared key authentication services.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -7-  Internal WEP  engine allows  64  or  128  bit  Encryption  with  Temporal  Key  Integrity Protocol (TKIP)  Hardware  encryption  support  for  WEP40/64,  WEP  104/128,  TKIP,  CCMP  (AES),  BIP  and CKIP  provides  functionality  for  WPA,  WPA2,  IEEE802.11i,  802.11w  and  CCX  advanced security mechanisms.  Module support WAPI security in China also.  Support  802.11e  Quality  of  Service  (QoS)  with  WMM  Power  Save  ensures  that  mobile solutions can achieve optimal battery life.  Advanced WiFi and BT coexistence schemes provide exceptional performance for WiFi and BT using a single antenna.  RoHS Compliant  Support WiFi direct and soft AP function. 1.2.2 Bluetooth Features  Fully qualified BT 3.0 system  Support BT 4.0 (low energy)  Compliant to BT 3.0 + HS system  Class 1 and Class 2 BT power levels  High-sensitivity BT receiver  Fully-speed BT operation with full piconet and scatternet support  High-speed UART port (up to 4Mbps)  PCM/I2S digital audio interface 1.3 Functions 1.3.1 WiFi Functions  Transmitter  Receiver  Single antenna BT coexistence  Modulations  IEE802.11b modulations;  1Mbps / 2Mbps / 5.5Mbps / 11Mbps  IEEE802.11g OFDM;  6Mbps / 9Mbps / 12Mbps / 18Mbps / 24Mbps / 36Mbps / 48Mbps / 54Mbps   IEEE802.11n HT modulations MCS0-7, 20MHz, 800 and 400 ns guard interval;  6.5Mbps / 7.2Mbps / 13Mbps / 14.4Mbps / 19.5Mbps / 21.7Mbps / 26.0Mbps / 28.9Mbps / 39.0Mbps / 43.3Mbps / 52.0Mbps / 57.8Mbps / 58.5Mbps / 65.0Mbps / 72.2Mbps
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -8-  MAC  Comprehensive MAC functionality according to IEEE 802.11-2007, including QoS traffic scheduling;  Support the following optional IEEE802.11n features;  MPDU aggregation  MSDU aggregation  Immediate Block Acknowledgement  PSMP  MTBA  RIFS  L-SIG TXOP protection  Link adaptation using MCS feedback  Encryption  Hardware encryption according to IEEE 802.11-2007 and IEEE802.11w-2009;  WEP40/64  WEP104/128  CCMP(AES)  TKIP  BIP  Hardware encryption support for SMS4 to support WAPI (China)  Hardware encryption support Cisco CKIP 1.3.2 Bluetooth Functions  Transmitter  Class 1, Class 2 and Class 3 support without need for external power amplifier or TX/RX switch  DQPSK and 8DPSK  Receiver  Integrated channel filters  Digital demodulator for improved sensitivity and co-channel rejection  Real time digitized RSSI available on HCI interface  DQPSK and 8DPSK  Support BT3.0   Support BT4.0
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -9-  Physical Interfaces  UART  BCSP, H4, H4DS and H5 support  PCM/I2S interface  Synchronous serial interface up to 4Mbps for system debugging 1.4 Applications   Cellular phones  Tablet PCs  Handheld devices  Industrial applications
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -10- 2. General Specification  WiFi Specification Standard IEEE 802.11b/g/n Frequency Range FCC : 2.412GHz-2.462GHz       CE  :2.422GHz -2.472GHz  Maximum Data Rate 72.2Mbps RF Input Impedance 50 ohms Interface SDIO / SPI Sensitivity Refer to 5.1 RF TX Power Refer to 5.1 Encryption WEP40/64/104/128, CCMP(AES), TKIP, BIP, WAPI Bluetooth Specification Standard BT 3.0 / BT 4.0 Frequency Band 2.402GHz ~ 2.480GHz Maximum Data Rate 4Mbps  RF Input Impedance 50 ohms Host Interface  UART Audio Interface  PCM/I2S Sensitivity -87dBm RF TX Power 6dBm (class 1.5) Power Supply Voltage 1.8 and 3.3V DC Working Current Refer to 5.3.3 Standby Current Refer to 5.3.3 Operating Environment Temperature -40ºC to +85ºC  for A and I grade -20ºC to +70ºC  for V and C grade Humidity 10%~90% Non-Condensing
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -11- Certifications WiFi Alliance/FCC/CE Environmental RoHS Compliant Dimension and Weight Dimension 9.9mm x 9.9mm x1.4mm Weight TBD Table 1: General Specification
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -12- 3. Pin Definition 3.1 Pin Configuration   Figure 2: Pin Configuration 3.2 Pin Definition Pin Symbol I/O Type Description 1 ANTENNA A Antenna for BT&WIFI 2 GND P Ground 3 BT_VDD_AUX P Power out for BT_AUX Need a 470nF decouple capacitor on this pin 4 BT_VDD_RF P Power out for BT_RADIO/ANA Need a 2.2uF decouple capacitor on this pin 5 BT_VDDIO P Power in for BT IO 6 BT_SLEEP_CLK IO an external 32.768khz clock is required for BT’s sleep mode
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -13- 7 BT_PCM2_OUT IO The PCM data out from BT 8 BT_PCM2_IN IO The PCM data in to BT 9 BT_PCM2_CLK IO The PCM CLK signal 10 BT_PCM2_SYNC IO The PCM SYNC signal 11 BT_SPI_PCM#_SEL IO SPI mode is Active high PCM mode is Active low 12 TCXO1.8V P Power in for internal TCXO 13 BT_WAKEUP IO A wakeup signal from BT to host 14 BT_nRESET IO Reset pin for BT(Active low) 15 BT_1.8V P Power in for BT 16 BT_VDD_DIG P Power out for BT_DIG Need a 2.2uF decouple capacitor on This pin 17 WIFI_VREG_DIG1.8V P Power in for WIFI digital power part 18 WIFI_VDD_SDIO P Power in for WIFI SDIO 19 WIFI_VDD_DIG P Power out for WIFI digital power Need a 2.2uF decouple capacitor on This pin 20 WIFI_VDDIO P Power in for WIFI GPIO0~7 Power level on this pin must be the same as BT_VDDIO 21 WIFI_SPI_CS IO Used for WIFI debug 22 WIFI_SPI_MOSI IO Used for WIFI debug 23 WIFI_SPI_MISO IO Used for WIFI debug 24 WIFI_SPI_CLK IO Used for WIFI debug 25 EEPROM_WP IO Write protect for internal WIFI EEPROM Open for WP enable Ground for WP disable 26 WIFI_GPIO10 IO WIFI GPIO10 27 WIFI_GPIO9 IO WIFI_GPIO9 28 WIFI_VDDAIO3.3V P Power in for WIFI AIO&GPIO9~16 29 WIFI_AIO0 A Analog IO of WIFI 30 WIFI_VREG_IN_ANA1.8V P Power in for WIFI analog power part 31 WIFI_SD_CLK IO WIFI SDIO CLK 32 WIFI_SD_CMD IO WIFI SDIO CMD 33 WIFI_SD_DATA3 IO WIFI SDIO DATA3 34 WIFI_SD_DATA0 IO WIFI SDIO DATA0 35 WIFI_SD_DATA1 IO WIFI SDIO DATA1
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -14- 36 WIFI_SD_DATA2 IO WIFI SDIO DATA2 37 WIFI_VDDRF3.3V P Power in for the PA of WIFI&BT 38 GND P Ground 39 WIFI_nRESET IO Reset pin for WIFI(Active low) 40 BT_UART_TX IO The TX signal of BT’s UART 41 BT_UART_RX IO The RX signal of BT’s UART 42 BT_UART_RTS IO The RTS signal of BT’s UART 43 BT_UART_CTS IO The CTS signal of BT’s UART 44 BT_PCM1_IN/SPI_MOSI IO Used for BT debug 45 BT_PCM1_CLK/SPI_CLK IO Used for BT debug 46 BT_PCM1_SYNC/SPI_CS IO Used for BT debug 47 BT_PCM1_OUT/SPI_MISO IO Used for BT debug 48 GND P Ground 49 GND P Ground 50 GND P Ground 51 GND P Ground 52 GND P Ground Table 2: Pin Definition
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -15- 4. Physical Interfaces 4.1 WiFi Power Supply 4.1.1 Linear Regulator for Digital Supply A 1.2V LDO in CBM202 powers the core digital circuits and WiFi_VREG_IN_DIG1.8V(Pin17) is the input voltage.  The range of this voltage is from 1.45V to 2.0V.  WiFi_VDD_DIG (Pin19) is the output of this LDO.  A low ESR 2.2uF and a 10nF capacitors to ground should be connected to this pin.   4.1.2 Linear Regulator for Analogue Supply Three  1.2V  LDO  are  built  in  CBM202  to  power  WiFi  core  auxiliary,  radio  and  RF  synthesizer. WiFi_VREG_IN_ANA1.8V (Pin30) is the input voltage.  The range of this voltage is from 1.45V to 2.0V.     4.1.3 RF Front End Power Supply WIFI_VDDRF3.3V  (Pin37)  is  the  external  3.3V  input  to  power  WiFi+BT  RF  front  end.  Clean voltage should be used and a 1.0uF bypass cap should connect to this pin.   4.1.4 I/O Power Supply  WIFI_VDDIO (Pin20) is used to power WiFi PIO[0] to WiFi PIO[7].  The typical voltage is 1.8V for this rail.  WIFI_VDDAIO3.3V (Pin28) is used to power WiFi PIO[8] to WiFi PIO[15],  WiFi AIO[0] to WiFi AIO[3]. Typical voltage is 3.3V for this rail. 4.2 BT Power Supply There are three LDOs are used in the CBM202  module for BT circuits.  BT_1.8V (Pin15) is the input voltage for these LDOs.  One LDO is used to power the BT core digital circuits.  BT_VDD_DIG (Pin16) is the output of the LDO.  An external low ESR minimum 1.5F capacitor must be connected to this pin.   One LDO is used to power BT radio circuits.  BT_VDD_RF (Pin4) is the output of the LDO. An external low ESR minimum 1.5F capacitor must be connected to this pin.   One LDO is used to power BT aux circuits.  BT_VDD_AUX (Pin3) is the output of the LDO. An external low ESR minimum 470nF capacitor must be connected to this pin.  BT_VDDIO (Pin5) is external 1.8V power supply to power all BT IO port including all GPIOs, UART and PCM ports. 4.3 Reset WiFi and BT of FLC-CBM202 can be reset individually from several sources.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -16- 4.3.1 WiFi reset  Via the external RST# pin (pin 5)  Via an internal core power supply supervisor  Using software watchdog timers  Via SDIO/CSPI host interface RST# is an active-low reset input that is internally filtered using the internal low frequency clock oscillator to avoid spurious resets.  A reset occurs after the signal has been asserted for between 250 and 375 s.  This pin may be tied to WIFI_VDDIO if unused; otherwise it should be asserted for at least 1 ms to force a reset. The power supply  monitors  WIFI_VDD_DIG to  trigger a power-on-reset.   This  occurs  when the supply falls below 1.05V (typical) in normal operation or 0.785 V (typical) in deep sleep, and ends when the supply exceeds 1.10V (typical).  Glitches of up to 30mV and 2.5s duration, which could be caused by large load steps, will not trigger a reset. Each of the internal processors has its own independent watchdog timer to detect and recover from erroneous software operation.  These are typically configured with a timeout of 1.5s, but this may be increased up to maximum of 64s for reduced power consumption.  The watchdogs are enabled at power-on and continue operating while FLC-CBM202 is in deep sleep. 4.3.2 BT Reset The BT reset function is internally tied to the BT_nRESET pin. The BT may be reset from several sources:  BT_nRESET pin  Power-on reset  A UART break character  Via a software-configured watchdog timer The BT_nRESET pin is an active low reset. To ensure a full reset the reset signal should be asserted for a period greater than 5ms. A warm reset function is also available under software control. After a warm reset the RAM data remains available. 4.4 RF Interface Pin 1 is the RF port used for WiFi and BT to receive and transmit.  A shared antenna algorithm is adopted. A 50  antenna can be directly connected to this port (Pin 1).  However, a пmatching circuit is recommended to match an antenna to this RF port.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -17- 4.5 Host Interface  4.5.1 WiFi Host Interfaces The WiFi of FLC-CBM202 has a single host interface port that can be configured into one of four modes:  SD 1-bit  SD 4-bit  SDIO SPI  CSPI The first three modes operate according to the SD Card specifications.  The fourth mode is a CSR proprietary  variant  designed  to  allow  more  efficient  implementation  on  hosts  without  dedicated SDIO host controller.  Table 3 shows the usage of the host interfaces pins in each mode. Pin Name SD 1-bit SD 4-bit SDIO SPI CSPI SD_CLK CLK: Clock CLK: Clock SCLK: Clock CLK: Clock SD_CMD CMD: Commend line CMD: Command line DI: Data input MOSI: Data input SD_DATA[0] DATA: Data line DAT[0]: Data line 0 DO: Data output MISO: Data output SD_DATA[1] IPQ#:  Interrupt DAT[1]: Data line 1 IRQ#: Interrupt IRQ#: Interrupt SD_DATA[2] RW: Read wait DAT[2]: Date line 2 Not used Not used SD_DATA[3] CD: Card detect DAT[3]: Date line 3 CS#: Card select CS#: Card select Table 3: Analog IO Usage All  four  modes  provide  identical  access  to  on-chip  registers  and  support  clock  speeds  of  up  to 50MHz for a maximum burst rate of 200Mbits/s (in SD 4-bit mode).  At power-on the host interface starts in SD 1-bit mode and may be switched into any of the alternative modes via SDIO commands. 4.5.1.1 SDIO SDIO mode fully support SDIO specification version 2.00. It supports all defined slave modes (SD 1 bit, SD 4-bit and SDIO SPI), but not SD host functionality.   Two functions are supported:  Function 0  is  the  mandatory function  used  for  card  configuration.   This  includes  the  CCCR, FBR and CIS.  Vender-defined registers within the CCCR support sleep and wake-up signaling.  Function 1 provides access to the IEEE 802.11 functionality.  IO_RW_DIRECT (CMD52) reads and writes on-chip registers and memory locations directly.  IO_RW_EXTENDED (CMD53) transfers blocks of data to or from the on-chip MMU buffers. The SDIO interface implements a subset of optional features.  Specifically it supports:  Continuous SPI interrupt (SCSI)  Direct Commands during data transfer (SDC)  Multi-block (SMB)  Read wait (SRW)
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -18- 4.5.1.1.1 SDIO Sleep Signaling FLC-CBM202 supports a variety of mechanisms to enable both itself and the host to efficiently enter and leave low-power modes. 4.5.1.1.1.1 Card Sleep and Wake-up FLC-CBM202  automatically uses  its  sleep  modes  to  minimize  power  consumption.    Registers  in function  0  are  always  directly  accessible  by  the  host,  irrespective  of  the  device’s  sleep  modes.  Attempts to access function 1 while the device is in deep sleep are likely to results in SDIO timeouts. To avoid  the need  for  the  host  to implement  complicated retry mechanisms,  a  simple deep  sleep control scheme is supported via a Vender Unique Register within the CCCR in function 0.  The host uses  this  register  to  tell  FLC-CBM202  when  it  is  allowed  to  use  deep  sleep.    When  the  host subsequently needs to access function 1 it uses the same register to initiated a wake-up and then waits for an SDIO interrupt to indicate that the wake-up is compete. 4.5.1.1.1.2 Host Sleep and Wake-up The  normal  method  for  FLC-CBM202  to  wake  the  host  up  is  via  the  in-band  interrupt  on SDIO_DATA [1].  This is the dame mechanism that is used to notify the host of received data or interesting events, no explicit sleep signaling is required. An alternative out-of-band mechanism is provided for hosts that cannot utilize the SDIO interrupt as a wake-up signal, e.g. where a separate power-management IC needs to restore power to the host processor.  This feature is enabled by masking out SDIO interrupts via the Int Enable register within the CCCR in function 0.  When an SDIO interrupt would have been signaled otherwise, a pulse is instead generated on a configured PIO line. Note:  The  out-of-band  wake-up  signal  is  not  a  replacement  for  the  in-band  SDIO  interrupt.  The standard interrupt signal should be used for data transfer during normal operation. 4.5.1.2 CSPI CSPI is a proprietary alternative to the standard SDIO bus protocols. It has been designed to be more efficient  for  hosts  that  are  capable  of  supporting  SPI  but  that  do  not  incorporate  an  SDIO  host controller. Its principal advantages over SD SPI are as follows:  Burst transfer is continuous rather than being split into blocks with interleaved CRC and status tokens. This reduces the number of clock cycles required to complete the transfer, and allows the host to stream data directly to or from memory buffers in a single operation without copying.  Timings are deterministic (fixed numbers of clock cycles) from the start of commands, so hardware can be programmed to complete data transfers without requiring interaction on a per-octet basis.  Command headers are multiples of 16 bits long, and the endianness of octets within 16-bit words is configurable. These features enable effective support on 16-bit host platforms.  16-bit registers are read or written with a single command instead of requiring two separate  IO_RW_DIRECT (CMD52) operations.   An interrupt can optionally be generated for failed commands. This can be used if the host does not support full-duplex transfers, and avoids the need to check status bits or poll status registers for successful operations.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -19- The same pin assignments are used for both SD SPI and CSPI as summarized in Table 4. Both the SDIO protocols and CSPI provide access to the same functions and registers within the device; the only difference is with the format of the commands used to perform these accesses. 4.5.2 Bluetooth UART Host Interfaces CBM202 BT  UART interface provides  a  simple mechanism  for communicating  with  other serial devices  using  the  RS-232  protocol.  UART_TX  /  UART_RX  /  UART_RTS  /  UART_CTS,  the  4 signals,  implement  the  UART  function.  When  CBM202  is  connected  to  another  digital  device, UART_RX  and  UART_TX  transfer  data  between  the  2  devices.  The  remaining  2  signals, UART_CTS and UART_RTS, implement RS232 hardware flow control where both are active low indicators.  If UART_CTS  and  UART_RTS  are not  required  for hardware flow  control, they are reconfigurable as PIO.  UART configuration parameters, such as baud rate and packet format, are set using CBM202 firmware. Note: To communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port adapter card is required for the PC.  The UART interface resets BT of CBM202 on reception of a break signal. A break is identified by a continuous logic low (0V) on the UART_RX terminal, as the figure below shows. If tBRK is longer than the value, defined by the PSKEY_HOSTIO_UART_RESET_TIMEOUT, a reset occurs. This feature enables a host to initialize the system to a known state. Also, BT of CBM202 can issue a break character for waking the host.  Figure 3: UART_TX Timing  4.5.2.1   UART Configuration While Reset is Active The UART interface is tri-state while the BT is being held in reset. This enables the user to daisy chain  devices  onto  the  physical  UART  bus.  The  constraint  on  this  method  is  that  any  devices connected  to  this  bus  must  tri-state  when  BT  of  CBM202  reset  is  de-asserted  and  the  firmware begins to run. 4.6 Audio Interface CBM202 provides a digital audio interface for BT, which is configurable as wither PCM or I2S port. 4.6.1 PCM Interface The audio PCM interface on the CBM202 supports:  Continuous transmission and reception of PCM encoded audio data over Bluetooth.  Processor overhead reduction through hardware support for continual transmission and reception of PCM data  A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does not pass through the HCI protocol layer.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -20-  Hardware on the CBM202 for sending data to and from a SCO connection.  Up to 3 SCO connections on the PCM interface at any one time.  PCM interface master, generating PCM_SYNC and PCM_CLK.  PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.  Various clock formats including:  Long Frame Sync  Short Frame Sync  GCI timing environments  13-bit or 16-bit linear, 8-bit μ-law or A-law commanded sample formats.  Receives and transmits on any selection of 3 of the first 4 slots following PCM_SYNC. The PCM configuration options are enabled by setting the PS Key PSKEY_PCM_CONFIG32. 4.6.1.1 PCM Interface Master/Slave When  configured  as  the  master  of  the  PCM  interface,  CBM202  generates  PCM_CLK  and PCM_SYNC.   PCM_OUTPCM_CLKPCM_INPCM_SYNC Figure 4: PCM Interface Master  Figure 5: PCM Interface Slave  4.6.1.2 PCM_CLK and PCM_SYNC Generation CBM202 has 2 methods of generating PCM_CLK and PCM_SYNC in master mode:
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -21-  Generating these signals by DDS from CBM202 internal 4MHz clock. Using this mode limits PCM_CLK to 128, 256 or 512 kHz and PCM_SYNC to 8 kHz.  Generating these signals by DDS from an internal 48MHz clock (which enables a greater range of frequencies to be generated with low jitter but consumes more power). To select this second method set bit 48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the length of PCM_SYNC is either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in PSKEY_PCM_CONFIG32. The equation below describes PCM_CLK frequency when generated from the internal 48MHz clock: 24MHzCNT_LIMITCNT_RATEf Set the frequency of PCM_SYNC relative to PCM_CLK using: 8SYNC_LIMITPCM_CLKf CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using SKEY_PCM_LOW_JITTER_CONFIG. As  an  example,  to  generate  PCM_CLK  at  512  kHz  with  PCM_SYNC  at  8  kHz,  set SKEY_PCM_LOW_JITTER_CONFIG to 0x08080177. 4.6.1.3 PCM Configuration Configure  the  PCM  by  using  the  PS  Keys,  PSKEY_PCM_CONFIG32  and SKEY_PCM_LOW_JITTER_CONFIG,  see  your  PS  Key  file.  The  default  for SKEY_PCM_CONFIG32 is 0x00800000, i.e. first slot following sync is active, 13-bit linear voice format, long frame sync and interface master generating 256 kHz PCM_CLK from 4MHz internal clock with no tristate of PCM_OUT. 4.6.2 Digital Audio Interface (I²S) The  digital  audio  interface  supports  the  industry  standard  formats  for  I²S,  left-justified  or  right-justified. The interface shares the same pins as the PCM interface, which means each audio bus is mutually exclusive in its usage. Table below lists these alternative functions.  PCM Interface  I²S Interface PCM_OUT SD_OUT PCM_IN SD_IN PCM_SYNC WS PCM_CLK SCK Table 4: PCM and I2S Digital Audio Interface Configure the digital audio interface using the PSKEY_DIGITAL_AUDIO_CONFIG, see your PS Key file.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -22- 5. Electrical Characteristic 5.1 WiFi Performance Specifications 5.1.1 DSSS and CCK modulations (802.11b) TX Performance Specifications  Characteristics Min Typical Max IEEE Specification Unit Frequency range 2400 - 2500 - MHz RMS transmit power(a) 16 18 20 - dBm RMS EVM 0 -28 -25 -9.1 dB Spectral mask 1st Sidelobe - -39 -33 -30 dBr Spectral mask 2nd Sidelobe - -54 -50 -50 dBr RF carrier suppression - -30 -25 -15 dB Center Frequency Tolerance -20 2 +20 25 ppm Occupied Bandwidth - 22 - - MHz Spurious emissions Frequency(GHz) Min Typical Max Band dBm/Hz 0.076-0.108 - -160 - FM 0.776-0.794 - -145 - CDMA 2000 0.869-0.894 - -145 - GSM850/CDMA850 0.925-0.960 - -143 - GSM900 1.570-1.580 - -135 - GPS 1.805-1.880 - -132 - GSM1800/DCS1800 1.930-1.990 - -130 - GSM1900/CDMA1900 2.110-2.170 - -125 - W-CDMA 2000 Table 5: DSSS and CCK modulations (802.11b) TX Performance Specifications 5.1.2 OFDM TX Performance Specifications  Characteristics Min Typical Max IEEE  Specification Unit Frequency range 2400 - 2500 - MHz RMS transmit power(a) 12 15 18 - dBm RMS EVM, 54Mbps - -28 -25 -25 dB RMS EVM, mcs7 - -29 -28 -28 dB Spectral mask,±11MHz - -35 -30 -20 dBr Spectral mask,±20MHz - -40 -30 -28 dBr Spectral mask±30MHz - -50 -42 -40 dBr Centre frequency leakage - -35 -25 -15 dB Spectral flatness for spectral lines -16 to -1,1 to 16 - - ±2 ±2 dB
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -23- Spectral flatness for spectral lines -26 to -17,17 to 26 - - -4 to 2 -4 to 2 dB Spurious emissions Frequency(GHz) Min Typical     Max dBm/Hz 0.076-0.108 - -160 - 0.776-0.794 - -145 - 0.869-0.894 - -145 - 0.925-0.960 - -143 - 1.570-1.580 - -135 - 1.805-1.880 - -132 - 1.930-1.990 - -130 - 2.110-2.170 - -125 - Table 6: OFDM TX Performance Specifications 5.1.3 DSSS and CCK modulations (802.11b) RX Performance Specifications  Characteristics Min Typical Max IEEE Specification Unit Frequency range 2400 - 2500 - MHz Rx sensitivity,1Mbps DSSS(a) - -98 -90 - dBm Rx sensitivity,2Mbps DSSS(a) - -95 -88 -80 dBm Rx sensitivity,5.5Mbps DSSS(a) - -91 -87 - dBm Rx sensitivity,11Mbps DSSS(a) - -90 -83 -76 dBm Maximum input level, DSSS(a) -4 0 - -4 dBm Maximum input level, CCK(a) -5 -1 - -10 dBm Adjacent channel rejection, DSSS(b) 35 51 - 35 dB Adjacent channel rejection, CCK(b) 35 48 - 35 dB Out-of-band blocking, modulated interferer Frequency (GHz) Min Typical Max Band Unit 0.776-0.794 - 24 - CDMA 2000 dBm 0.824-0.849 - 19 - GSM 850 0.824-0.849 - 16 - CDMA 850 0.880-0.915 - 28 - GSM 900 1.710-1.785 - 7 - GSM1800/DCS1800 1.850-1.910 - 3 - GSM1900/PCS1900 1.920-1.980 - 2 - W-CDMA 2000 Table 7: DSSS and CCK modulations (802.11b) RX Performance Specifications  5.1.4 OFDM RX Performance Specifications Characteristics Min Typical Max IEEE Specification Unit Frequency range 2400 - 2500 - MHz
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -24- Rx sensitivity,6Mbps - -92 -84 -82 dBm Rx sensitivity,9Mbps - -91 -82 -81 dBm Rx sensitivity,12Mbps - -90 -82 -79 dBm Rx sensitivity,18Mbps - -87 -78 -77 dBm Rx sensitivity,24Mbps - -84 -76 -74 dBm Rx sensitivity,36Mbps - -81 -73 -70 dBm Rx sensitivity,48Mbps - -75 -69 -66 dBm Rx sensitivity,54Mbps - -74 -68 -65 dBm Rx sensitivity,MCS0 - -92 -84 -82 dBm Rx sensitivity, MCS1 - -89 -81 -79 dBm Rx sensitivity, MCS2 - -87 -78 -77 dBm Rx sensitivity, MCS3 - -83 -76 -74 dBm Rx sensitivity, MCS4 - -80 -70 -70 dBm Rx sensitivity, MCS5 - -75 -66 -66 dBm Rx sensitivity, MCS6 - -74 -65 -65 dBm Rx sensitivity, MCS7 - -72 -64 -64 dBm Maximum input level -5 -1 - -20 dBm Adjacent channelrejection,6Mbps 16 27 - 16 dB Adjacent channel rejection,9Mbps 15 26 - 15 dB Adjacent channel rejection,12Mbps 13 25 - 13 dB Adjacent channel rejection,18Mbps 11 25 - 11 dB Adjacent channel rejection,24Mbps 8 23 - 8 dB Adjacent channel rejection,36Mbps 4 20 - 4 dB Adjacent channel rejection,48Mbps 0 16 - 0 dB Adjacent channel rejection,54Mbps -1 14 - -1 dB Adjacent channel rejection,MCS0 16 27 - 16 dB Adjacent channel rejection,MCS1 13 25 - 13 dB Adjacent channel rejection,MCS2 11 21 - 11 dB Adjacent channel rejection,MCS3 8 22 - 8 dB Adjacent channel rejection,MCS4 4 16 - 4 dB Adjacent channel rejection,MCS5 0 13 - 0 dB Adjacent channel rejection,MCS6 -1 10 - -1 dB Adjacent channel rejection,MCS7 -2 6 - -2 dB Out-of-band blocking, modulated interferer Frequency(GHz) Min Typ Max Band Unit 0.776-0.794 - 18 - CDMA 2000 dBm 0.824-0.849 - 17 - GSM 850 0.824-0.849 - 14 - CDMA 850 0.880-0.915 - 25 - GSM900
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -25- 1.710-1.785 - 1 - GSM1800/DCS1800 1.850-1.910 - 0 - GSM1900/PCS1900 1.920-1.980 - -3 - W-CDMA 2000 Table 8: OFDM RX Performance Specifications 5.2 Bluetooth Performance Specifications 5.2.1 Transmitter  Condition: VDD=1.8V, Temperature= +20°C .  Characteristics Min Typical Max BT Specification Unit Maximum RF transmit power (a) - 6 7 4 to 20  Class 1 -6 to 4  Class 2 dBm RF control range  25 30 - ≥16 dB 20 dB bandwidth for modulated carrier - 790 1000 ≤1000 kHz Adjacent channel transmit power  F = F0 ± 2MHz  - -35 -20 ≤-20 dBm Adjacent channel transmit power  F = F0 ± 3MHz  - -45 -40 ≤-40 dBm Adjacent channel transmit power  F = F0 ± > 3MHz  - -50 -40 ≤-40 dBm △f1avg  Maximum Modulation  140 163 175 140< f1avg<175 kHz △f2max  Maximum Modulation 115 154 - 115 kHz △f1avg  /△f1avg 0.80 0.98 - ≥0.80 - Initial carrier frequency tolerance -75 5 75 ≤75 kHz Drift Rate  - 7 20 ≤20 kHz/50us Drift (single slot packet) - 8 25 ≤25 kHz Drift (five slot packet) - 9 40 ≤40 kHz 2nd Harmonic Content  - -60 -30 ≤-30 dBm 3nd Harmonic Content - -45 -40 ≤ -30 dBm Emitted power in cellular bands measured at unbalanced port of  the balun. Output power ≤6dBm Frequency(GHz) Min Typ Max CelluBand Unit 0.869-0.894 - -124 - GSM 850 dBm/Hz 0.869-0.894 - -128 - CDMA 850 0.925-0.960 - -128 - GSM 900 1.570-1.58 - -138 - GPS 1.805-1.880 - -133 - GSM 1800/ DCS 1800 1.930-1.990 - -135 - PCS 1900 1.930-1.990 - -134 - GSM 1900 1.930-1.990 - -134 - CDMA 1900
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -26- 2.110-2.170 - -136 - W-CDMA 2000 2.110-2.170 - -136 - W-CDMA 2000 Table 9: Transmitter Note: (a) The firmware can maintain the transmit power to be within the Bluetooth specification limits: class 1 or class 2. 5.2.2 Receiver   Condition: VDD=1.8V, Temperature= +20°C .   Frequency Min Typical Max BT Specification Unit Sensitivity at 0.1% BER for all packet types 2.402 - -86.0 - ≤-70 dBm 2.441 - -86.0 - 2.480 - -86.0 - Maximum received signal at 1.0% BER -20 10 - ≥-20 dBm Continuous power required to block Bluetooth reception (for input power of -67 dBm with 0.1% BER) measured at the unbalanced port of the balun. Frequency Min Typical Max BT Specification Unit 30-2000 -10 0 - ≥-10 dBm 2000-2400 -27 0 - ≥-27 2500-3000 -27 0 - ≥-27 C/I co-channel - 6 11 ≤11 dB Spurious output level      Continuous power in cellular bands required to block Bluetooth reception (for input power of -67dBm with 0.1%BER) measured at unbalanced port of the balun. Frequency Min Typical Max Cellular Band Unit 0.824-0.849 - 0 - GSM 850  dBm 0.824-0.849 - -10 - CDMA 850 0.880-0.915 - -5 - GSM 900 1.710-1.785 - 0 - GSM 1800/DCS 1800 1.850-1.910 - 0 - GSM 1900/PCS 1900 1.850-1.910 - -7 - CDMA 1900 1.920-1.980 - -10 - W-CDMA 1900 Continuous power in cellular bands required to block Bluetooth reception (for input power of -72dBm with 0.1BER) measured at unbalanced port of the balun. 0.824-0.849 - -2 - GSM 850  dBm 0.824-0.849 - -12 - CDMA 850 0.880-0.915 - -7 - GSM 900 1.710-1.785 - 0 - GSM 1800/DCS 1800 1.850-1.910 - 0 - GSM 1900/PCS 1900 1.850-1.910 - -12 - CDMA 1900 1.920-1.980 - -14 - W-CDMA 1900 Table 10: Receiver
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -27- 5.3 DC Electrical Specifications 5.3.1 Absolute Maximum Ratings  Table 11: Absolute Maximum Ratings 5.3.2 Recommended Operating Conditions  Operating Condition Min Typical Max Unit Storage Temperature -40 - +85 °C  Operating Temperature Range for A and  I grade -40 - +85 °C  for V and  C grade -20 - +70 °C  Host interface I/O supply voltage(VDD_SDIO) 1.7 - 3.6 V Other I/O supply voltage(VDD_PADS_PIO_0_7, VDD_AIO_PIO_8_15) 1.7 - 3.3 V Linear regulator supply voltage 1.8V 1.75 - 1.95 V Table 12: Recommended Operating Conditions  5.3.3 Current Consumption 5.3.3.1 WiFi Current Consumption State Min Typical Max Unit TX 3.3V 802.11b / 18dBm - 190 - mA 1.8V  100  3.3V 802.11g / 14dBm  145  1.8V  100  3.3V 802.11n / 14dBm  145  1.8V  100  RX 3.3V 802.11b,g,n - 10 - mA 1.8V  135  Leakage(deep sleep, including internal sleep clock ) - 69 - μA Table 13: WiFi Current Consumption Rating Min Max Unit Storage Temperature -40 +85 °C  Linear regulator voltage 1.8V +1.45 +2.0 V I/O  supply voltage(VDD_SDIO, VDD_PADS_PIO_0_7, VDD_AIO_PIO_8_15) +1.7 +3.6 V Other terminal voltages VSS-0.3 VDD+0.3 V
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -28- 5.3.3.2 BT Current Consumption State Min Typical Max Unit Continuous receive - TBD - mA Continuous transmit - TBD - mA Leakage(deep sleep, including internal sleep clock ) - TBD - μA Table 14: BT Current Consumption 5.3.4 Digital Characteristics Digital Terminals Min Typical Max Unit Input Voltage Levels VIL input logic level low -0.3 - 0.25VDD V VIH input logic level high 0.625VDD - VDD+0.3 V Output Voltage Levels VOL output logic Level low, IOL=8.0mA - - 0.4 V VOH output logic Level high, IOH=-8.0mA 0.75VDD - VDD V Input and Tri-state Currents Strong pull-up -150 -40 -10 μA Strong pull-down 10 40 150 μA Weak pull-up -5 -1.0 -0.33 μA Weak pull-down 0.33 1.0 5.0 μA CI Input Capacitance 1.0 - 5.0 pF Table 15: Digital Characteristics 5.3.5 Sleep Clock Characteristics Sleep clock is an option with external 32.768 KHz clock for deep sleep and other low-power modes.  Following table lists the requirements for the sleep clock. Sleep Clock Min Typical Max Unit Frequency(a) 30 32.768 35 kHz Frequency tolerance(b) - - ±250 ppm Duty cycle 5:95 50:50 95:5 % Jitter Integrated rms jitter 10Hz to 20kHz fref=32.768kHz - - 20 ns rms Phase noise fref=32.768kHz 1kHz offset - - -100 dBc/Hz 10kHz offset - - -120 Table 16: Sleep Clock Characteristics (a) Stability is most important as frequency is calibrated against the system clock. (b) The frequency of the slow clock is periodically calibrated against the system clock, as a result the frequency is more important than the maximum deviation.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -29- 5.3.6 Power-on Reset Characteristics  Power-on Reset Min Typical Max Unit Reset release on VDD_DIG rising(HL) 1.030 - 1.150 V Reset assert on VDD_DIG falling(LO) HL-0.060 - HL-0.045 V Reset assert on VDD_DIG falling(Sleep mode) 0.770 0.785 0.800 V Table 17: Power-on Reset Characteristics
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -30- 6. Reference Design   Figure 6: Reference Design TitleSize Document Number RevDate: Sheet ofCBM202CL ref erence design <Rev Code>CBM202CLB1 1Thursday , September 08, 2011TCXO1.8TCXO1.8VWIFI_VDDIOWIFI_SDIO3.3VBT_1V8BT_VDD_IO1 2L2TBD1 2L1TBD122.4G_ANTALA931C5R5 NCBT_Sleep_CLKL8 and L9 can be replaced by short circuits,if BT1.8V is cleanBT1.8VC9 TBDL3, L4, L5, L6 and L7 can be replaced by short circuits,if WIFI3.3V and WIFI1.8V are cleanC102.2uFBT_PCM2_INBT_PCM2_CLKBT_PCM2_SYNCBT_PCM2_OUTWIFI_SD_CMDWIFI_SD_DATA[0]WIFI_AIO[0]WIFI_GPIO[9]WIFI_SD_DATA[1]WIFI_GPIO[10]WIFI_SD_CLKWIFI_SD_DATA[2]WIFI_SD_DATA[3]matchGND2WIFI_VDDRF3.3V 37WIFI_AIO0 29WIFI_nRESET 39GND1 38ANTENNA1GND2 48BT_VDD_RF4BT_VDD_AUX3BT_SLEEP_CLK6BT_nRESET14BT_PCM2_OUT7BT_WAKEUP13BT_PCM2_CLK9BT_PCM2_IN8BT_SPI_PCM#_SEL11BT_PCM2_SYNC10BT_VDDIO5BT_UART_CTS 43BT_UART_TX 40TCXO1.8V12BT_VDD_DIG16BT_1.8V15BT_UART_RTS 42BT_UART_RX 41WIFI_VDDIO20WIFI_VDD_DIG19WIFI_VREG_IN_DIG1.8V17WIFI_SD_CMD 32WIFI_SD_CLK 31WIFI_SD_DATA3 33WIFI_SD_DATA2 36WIFI_SD_DATA1 35WIFI_SD_DATA0 34WIFI_VREG_IN_ANA1.8V 30WIFI_GPIO9 27WIFI_GPIO10 26WIFI_VDDAIO3.3V 28EEPROM_WP 25WIFI_VDD_SDIO18WIFI_SPI_MOSI22WIFI_SPI_CS21WIFI_SPI_MISO23BT_PCM1_IN/SPI_MOSI 44BT_PCM1_CLK/SPI_CLK 45BT_PCM1_SYNC/SPI_CS 46BT_PCM1_OUT/SPI_MISO 47WIFI_SPI_CLK24GND349GND450GND5 51GND6 52U1CBM202CLC5 100nFC3 2.2uFBT_UART_CTSBT_UART_RTSBT_UART_TXBT_UART_RXWIFI_nRESETC14 470nFL4 BLM15AG121SN1L6 BLM15AG121SN1BT1.8VWIFI_SDIO3.3V must be powered onbefore the initialization of host SDIO busL5 BLM15AG121SN1C8 2.2uFL7 BLM15AG121SN1WIFI1.8VC6 2.2uFL8 BLM15AG121SN1WIFI3.3VC72.2uFC11 1uFC13 330nFBT1.8VC15 2.2uFL9 BLM15AG121SN1C4 470nFR3 NCVREG_IN_ANA_1V8R4 10KC12 1uFL3 BLM15AG121SN1VREG_IN_DIG_1V8C16 1uFVREG_IN_ANA_1V8WIFI_VDDAIO_3V3WIFI_VDDIOWIFI_SDIO3.3VBT_1V8VREG_IN_DIG_1V8TCXO1.8BT_VDD_IOWIFI_VDD_RF_3V3 C12.2uFC22.2uFWIFI_VDD_RF_3V3BT POWERWIFI POWERR210KR110KCLK POWERWIFI_SDIO3.3VWIFI1.8WIFI SDIO InterfaceBT1.8VBT UART InterfaceBT_WAKEUPBT_nRESETWIFI_VDDAIO_3V3BT PCMInterfaceWIFI1.8L11 BLM15AG121SN1
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -31- 7. Mechanical Characteristic  Figure 7: Module Size (Top View and Side View)  Figure 8: Footprint (Top View)  Figure 9: Pin dimensions
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -32- 8. Recommended PCB Layout and Mounting Pattern  Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible to avoid any interference into the transceiver of the module.  The location of the external antenna and RF-IN port of the module should be kept away from any noise sources and digital traces. A matching network might be needed in between the external antenna and Antenna port to better match the impedance to minimize the return loss. As indicated in Figure 10, below, RF critical circuits of the module should be clearly separated from any digital circuits on the system board.  All RF circuits in the module are close to the antenna port.  The module, then, should be placed in this way that module digital part towards your digital section of the system PCB.   Figure 10: Placement the Module on a System Board 8.1 Antenna Connection and Grounding Plane Design   Figure 11: Leave 5mm Clearance Space from the Antenna General design recommendations are:  The length of the trace or connection line should be kept as short as possible.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -33-  Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness.  Routing the RF close to digital sections of the system board should be avoided.  To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing.  Figure 12: Recommended Trace Connects Antenna and the Module   Routing of the RF-connection underneath the module should be avoided.   Use as many vias as possible to connect the ground planes.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -34- 9. Recommended Reflow Profile  The soldering profile depends on various parameters necessitating a set up for each application.  The data here is given only for guidance on solder reflow.  210 217 ℃ 250 A B C D 1 2 0 25 3 4 5 6 min E  Figure 13: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s.  The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C.  This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components.  Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized.  Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide  film  formed  on  the  surface  of  each  solder  particle  and  PCB  board.  The  temperature  is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium  Zone  2  (c)  (optional) —  In  order  to  resolve  the  upright  component  issue,  it  is recommended to keep the temperature in 210 – 217  for about 20 to 30 second.  Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5.  It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C.  The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -35- 10. Ordering Information 10.1 Product Packaging Information TBD Figure 14: Product Packaging Information 10.2 Ordering information  FLC-CBM202CL2AProduct RevisionShipping PackageProduct PackageProduct Grade Figure 15: Ordering Information 10.2.1 Product Revision Product Revision Description Availability A Release A Yes Table 18: Product Revision 10.2.2 Shipping Package Shipping Package Description Quantity Availability 0 Foam Tray — No 1 Plastic Tray — No 2 Tape TBD Yes Table 19: Shipping Package 10.2.3 Product Package Product Package Description Availability Q QFN No L LGA Yes B BGA No C Connector No Table 20: Product Package
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -36- 10.2.4 Product Grade Product Grade Description Availability C Consumer Yes I Industrial Yes V Automobile After-Market Yes A Automobile Before-Market No Table 21: Product Grade
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -37- 11. Cautions &Warnings 11.1 FCC Statement  1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:  (1) This device may not cause harmful interference.  (2)  This  device  must  accept  any  interference  received,  including  interference  that  may  cause undesired operation.  2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.   NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device,  pursuant  to  Part  15  of  the  FCC  Rules.  These  limits  are  designed  to  provide  reasonable protection against harmful interference in a residential installation.  This equipment generates uses and can radiate radio frequency energy and, if not installed and used in  accordance  with  the  instructions,  may  cause  harmful  interference  to  radio  communications. However, there is no guarantee that interference will  not  occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:   Reorient or relocate the receiving antenna.   Increase the separation between the equipment and receiver.   Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.   Consult the dealer or an experienced radio/TV technician for help.  This radio module must not be installed to co-locate and operate simultaneously with other radios in host  system;  additional  testing  and  equipment  authorization  may  be  required  to  operating simultaneously with other radios. 11.2 FCC Radiation Exposure Statement This  equipment  complies  with  FCC  radiation  exposure  limits  set  forth  for  an  uncontrolled environment.  This  equipment  should  be  installed  and  operated  with  minimum  distance  20cm between the radiator & your body. 11.3 FLC-CBM202 Label Instructions  The FLC-CBM202 module is designed to comply with the FCC statements.
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -38- The packaging of host system that uses CBM202 should display a label indicating the information as follows: Contains FCC ID: P4ICBM202  Model: FLC-CBM202CL2A/FLC-CBM202IL2A/FLC-CBM202VL2A            Any similar wording that expresses the same meaning may also be used.   11.4 FLC-CBM202 Antenna Statement  11.4.1 Antenna Electrical Specifications   Part Number  Frequency Range  (GHz)  Temperature Average Gain  VSWR  Impedance   ALA931C5  2.4~ 2.485  21.5°C typ.  -3 dBi min.  2.5:1 max.  50 Ω  Table 22: Antenna Electrical Specifications  11.4.2 Radiation Gain and Pattern  Peak Gain(dBi) Average Gain(dBi) Remark 2.8 1.0 @2.45 GHz Table 23: Radiation Gain and Pattern
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -39-  Figure 16: ALA931C5 Radiation Pattern : Azimuth@2.45GHz
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -40-  Figure 17:  ALA931C5 Radiation Pattern : Elevation1@2.45GHz
                                                                                                                    FLC-CBM202 Datasheet  Flaircomm Microelectronics Confidential        -41-  Figure 18:  ALA931C5 Radiation Pattern : Elevation2@2.45GHz

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