Freescale Semiconductor 1322X-NCB 1322x Network Node User Manual
Freescale Semiconductor, Inc. 1322x Network Node
Users Manual Revised
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| Document Description | Users Manual Revised |
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| Document Type | User Manual |
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| Date Submitted | 2008-08-08 00:00:00 |
| Date Available | 2008-08-08 00:00:00 |
| Creation Date | 2008-07-17 09:39:14 |
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1322x Network Node Reference Manual Document Number: 1322xNNRM Rev. 1.1 07/2008 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. ARM is the registered trademark of ARM Limited. ARM7TDMI-S is the trademark of ARM Limited. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005, 2006, 2007, 2008. All rights reserved. Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 Safety Information 1.1 1.2 1.2.1 1.2.2 1.2.3 1.3 1.4 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec. 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Regulatory Approval For Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-1 1-1 1-2 1-2 1-2 1-2 Chapter 2 1322x Network Node Module Overview and Description 2.1 2.2 2.3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Chapter 3 System Overview and Functional Block Descriptions 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management and Measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Low-cost 2.4 GHz ISM Band radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128x64 Pixel Monochrome Graphic LCD Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Debug/Development Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3-2 3-3 3-4 3-4 3-4 3-5 3-5 3-5 3-6 3-6 Chapter 4 Interface Locations and Pinouts 4.1 4.2 4.2.1 4.2.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . On/Off Switch and Power On Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 4-2 4-2 4-2 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4.2.3 Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4.3 RF Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.4 USB Connector (“B” Receptacle). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 4.5 LEDs, Switch, Buttons and Joystick. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 4.6 LCD Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.7 Debug/Development Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.7.1 ARM JTAG Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 4.7.2 Nexus Mictor Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 4.8 Audio Subsystem Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 4.9 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 4.10 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 4.11 ADC Voltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9 4.12 Jumper Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 Chapter 5 Schematic, Board Layout, and Bill of Material 1322x Network Node Reference Manual, Rev. 1.1 ii Freescale Semiconductor About This Book This manual describes Freescale’s 1322x Network Node evaluation board. The 1322x Network Node contains a Freescale third-generation, low power, 2.4 GHz radio frequency transceiver, with 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE Standard 802.15.4 MAC and AES security, and a full set of MCU peripherals into an 99-pin LGA Platform-in-Package (PiP). Audience This manual is intended for system designers. Organization This document is organized into 5 chapters. Chapter 1 Safety Information — Highlights some of the FCC requirements. Chapter 2 1322x Network Node Module Overview and Description — This chapter introduces 1322x Network Node (NN) which is an IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1322x device. Chapter 3 System Overview and Functional Block Descriptions — This section provides an overview of the Network Node and block diagrams. Interface Locations and Pinouts — This chapter provides a description of the interface locations and pinout of the 1322x Network Node circuit board. Schematic and Bill of Materials — This chapter provides the schematic, board layout, and Bill of Materials (BOM). Chapter 4 Chapter 5 Revision History The following table summarizes revisions to this document since the previous release (Rev 1.0). Revision History Location Chapter 1 Revision Updated FCC information. MC1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor iii Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard ARM Advanced RISC Machine COG Chip on Glass CTS Clear to Send DAC Digital to Analog Converter DMA Direct Memory Access I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.4 GHz radio frequency band JTAG Joint Test Action Group LCD Liquid Crystal Display LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit NEXUS An embedded processor development tool interface that helps design engineers identify software and hardware-level issues. NN Network Node PCB Printed circuit board PiP Platform in Package PWM Pulse-width modulation RTS Request to Send SMA Connector Sub Miniature version “A” connector SPI Serial Peripheral Interface SSI Synchronous Serial Interface TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function. TELCO Telephone Company USB Universal Serial Bus VCP Virtual Com Port MC1322x Network Node Reference Manual, Rev. 1.1 iv Freescale Semiconductor Chapter 1 Safety Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and make operation of the product unlawful. 1.2 FCC Labeling FCC labels are physically located on the back of the board. 1.2.1 47 C.F.R. Sec. 15.21 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 1-1 Safety Information 1.2.2 47 C.F.R. Sec.15.105(b) This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. 3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon. 1.2.3 47 C.F.R. Sec.15.203 An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.3 Regulatory Approval For Canada This Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. 1322x Network Node Reference Manual, Rev. 1.1 1-2 Freescale Semiconductor Chapter 2 1322x Network Node Module Overview and Description 2.1 Introduction The 1322x Network Node (NN) is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1322x device. The heart of the 1322x Network Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The 1322x Network Node provides a platform to evaluate the MC1322x device, develop software and applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The Network Node surrounds the core device with capabilities that provide a complete 802.15.4 radio, user interface, debugging capabilities, connection to personal computers (PCs) and other devices, and portability. Figure 2-1. 1322x Network Node 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 2-1 1322x Network Node Module Overview and Description 2.2 Features The 1322x Network Node provides the following features: • Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack • Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP) • MC1322x provides a highly integrated, low cost RF node — On-board balun and antenna switch in package — Typical -95 dBm sensitivity — Typical 0 dBm output power, with max approximately +2 dBm — SMA connector with external antenna • USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications • 128x64 pixel chip-on-glass monochrome, graphic LCD with LED backlight • Audio subsystem — 2.5mm audio jack for microphone and mono earpiece — Input amplifier and anti-aliasing filter for an electret microphone — Output path to second order analog filter from either 10-bit serial DAC or PWM as output signal sources — I2C controlled 32-position linear nonvolatile volume control for audio circuit — Audio output amplifier for both earpiece or on-board dynamic speaker (switched by headset jack) • Two debug / development interfaces — 20-pin connector for standard JTAG debug interface — 38-pin MICTOR connector for extended NEXUS real-time debug interface • Power management circuit with on-board regulation for multiple power sources — Can be powered from USB interface, DC power jack or two AA batteries — On/Off power switch — Power-on green LED • User interface switches and LEDs — 4-directional TACT switch with center push for application purposes — 4 pushbuttons for application purposes — 4 processor controlled red LEDs for application purposes — Reset switch • 26-pin user header for selected General Purpose Input Output signals and data interfaces • System clock options — Default 24 MHz crystal reference oscillator (13 to 26 MHz crystal optional) 1322x Network Node Reference Manual, Rev. 1.1 2-2 Freescale Semiconductor 1322x Network Node Module Overview and Description — Reference oscillator can be driven from an external source — Optional 32.768 kHz crystal oscillator for accurate real-time delays 2.3 Board Level Specifications Table 2-1. 1322x Network Node Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (Enclosure: X, Y, Z) Size (PCB: X, Y) Layer build (PCB) 135x100x40 mm 125x85 mm 0.8 / 0.032 mm / in Dielectric material (PCB) 4-Layer FR4 Power Voltage supply (DC) 4.4 12 Voltage supply (USB) 4.4 5.25 3.2 100 mA Voltage supply (Batteries) Current consumption USB 2.0/1.1 standard specification Temperature Operating temperature (see note) -20 +25 +85 °C Storage temperature -30 +25 +85 °C USB interface The operating temperature is limited to +70°C with the monochrome-graphic LCD module mounted USB 2.0 and 1.1 full-speed compatible Audio Audio (Input) -40 dB Accepts electret microphone element MHz All 16 channels in the 2450 MHz band Audio (Output) Attenuation RF 802.15.4 Frequency range Range (outdoor / line of sight) 2405 2480 300 Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board) RF Transmitter 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 2-3 1322x Network Node Module Overview and Description Table 2-1. 1322x Network Node Specifications Parameter 802.15.4 Output power -30 Harmonics 2nd harmonics 3rd harmonics Units Notes/Conditions +2 dBm Over range of Pout from IC control in 2 dB steps. Note: On channel 26, output power should not exceed -5 dBm (power setting 0x0E) to meet FCC Part 15 requirements. -30 -30 dBm dBm Harmonics are compliant to ETSI and FCC regulatory approval standards RF Receiver 802.15.4 sensitivity Proprietary high-speed sensitivity -92 -95 dBm <1% PER for 20-byte packets -80 dBm <1% PER for a minimum data payload of 400 packets Regulatory Approval FCC Product is approved accordingly to the FCC part 15 standard CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety UL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 1322x Network Node Reference Manual, Rev. 1.1 2-4 Freescale Semiconductor Chapter 3 System Overview and Functional Block Descriptions This section provides an overview of the Network Node and block diagrams. 3.1 System Block Diagram The following is the 1322x Network Node system level block diagram. SMA Connector Step-Up DC-DC Converter 128x64 Monochrome Graphic LCD Optrex (OPTREX #F-51553) LCD ADC Power Management VCC SSI USB Bus Power JTAG Debug Interface 20-Pin JTAG Conn NEXUS Debug Interface 38-Pin MICTOR Conn Ext Clock Source Audio Output DAC DAC101S101 Audio Output Amp / LP Filter Audio Volume Control MAX5434 MC13224V/225V Advanced ZigBee™- Compliant PiP Power Measurements 13-26MHz Clk Mic TMR3 - PWM DC Adaptor 2xAA Battery Audio Mic Input w/ Amp / LP Filter Audio Amp NCP4896 GPIO GPIO 26-Pin Header User Apps UART USB Interface FT232RQ USB Conn GPIO 4 Push Buttons, Joystick, Reset Switch, On/Off Switch Earphone Speaker JTAG NEXUS Clk GPIO 24 MHz 4 Red LEDs, 1 Green LED 32.768 KHz Figure 3-1. 1322x Network Node Block Diagram 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-1 System Overview and Functional Block Descriptions 3.2 System Overview The heart of the 1322x Network Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4 applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core. 24 MHz (typ) 32.768 KHz (optional) BATTERY DETECT CLOCK & RESET MODULE (CRM) DUAL 12-BIT ADC MODULE RADIO INTERFACE MODULE (RIF) ANALOG TRANSMITTER BALUN RF TX/RX SWITCH DIGITAL MODEM TX MODEM RX MODEM ANALOG RECEIVER JTAG/ Nexus DEBUG 802.15.4 MAC ACCELERATOR (MACA) IEEE 802.15.4 TRANSCEIVER MC13225 Platform-in-Package (PiP) IEEE 802.15.4/ZIGBEE SOLUTION Buck Regulator ANALOG POWER MANAGEMENT VOLTAGE REGULATION ADVANCED SECURITY MODULE (ASM) SPI FLASH MODULE (SPIF) 128KBYTE NON-VOLATILE MEMORY (SERIAL FLASH) ARM7 TDMI-S 32-BIT CPU BUS INTERFACE & MEMORY ARBITRATOR ARM INTERRUPT CONTROLLER (AITC) 96KBYTE SRAM (24K WORDS x 32 BITS) 80KBYTE ROM (20KWORDS x 32 BITS) TIMER MODULE (TMR) (4 Tmr Blocks) UART MODULE (UART0) UART MODULE (UART1) SYNC SERIAL INTERFACE (SSI/i2S) KEYBOARD INTERFACE (KBI) UP TO 64 IO PINS RF OSCILLATOR CLOCK GENERATION INTER-IC BUS MODULE (I2C) SERIAL PERIPHERAL INTERFACE (SPI) GPIO and IO CONTROL Figure 3-2. MC1322x Block Diagram On-board peripherals include • Two dedicated UART modules capable of 2Mbps with CTS/RTS support • SPI port with programmable master and slave operation • Keyboard interface capability. • Two 12-bit analog-to-digital converters (ADCs) with 8 input channels • Four independent 16-bit timers with PWM capability. • Inter-integrated circuit (I2C) interface • Synchronous Serial Interface (SSI) with I2S and SPI capability and FIFO data buffering 1322x Network Node Reference Manual, Rev. 1.1 3-2 Freescale Semiconductor System Overview and Functional Block Descriptions The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +2dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry. All components are integrated into the package except the crystal and antenna. PA BALUN ANALOG TRANSMITTER RF TX/RX SWITCH LNA ANALOG RECEIVER Figure 3-3. MC1322x RF Interface Augmenting the core device on the Network Node are: • Low-cost 2.4 GHz ISM Band radio • 2.0 USB connection • User interface with pushbuttons, LEDs and 128x64 pixel graphic LCD • Versatile power sources and management • Debug / development ports • Audio subsystem • GPIO connector for system expansion Users are encouraged to reference the board schematic for the following sections. 3.3 Power Management and Measurement To allow maximum versatility, the Network Node can be powered via a DC source (typically an AC-DC converter; nominally 5 Vdc), the USB node, or an onboard battery pack with 2 AA alkaline batteries. • The DC source or USB will automatically shutdown the battery supply. • The DC source and the USB power are regulated to 3.3 V, however, the raw battery pack voltage directly supplies the circuitry • All sources are isolated via diodes. • An on/off switch and a power-on LED are provided (see Section 4.2.2, “On/Off Switch and Power On Indicator”). • Zero-ohm resistors are provided to allow isolation and measurement of various system components (see Section 4.2.3, “Power Measurement”) 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-3 System Overview and Functional Block Descriptions 3.4 Low-cost 2.4 GHz ISM Band radio The MC1322x provides an onboard balun, antenna switch, and LNA. The only external component required for the radio is an antenna. The Network Node provides a PCB-mounted SMA that connects to an external antenna for a complete solution. Figure 3-4 shows the RF network external to the MC1322x. • Typical output power is 0 dBm, with +2 dBm max • Typical sensitivity is -95 dBm. • Frequency range is 2405 to 2480 MHz • Typical range (outdoors, line of sight) is 300 meters RF C54 J7 SMA RF_RX_TX 10pF L1 3.9nH Not Mounted C3 1pF Not Mounted RF_GND Figure 3-4. Network Node RF Network Freescale recommends using the provided SMA connector to mount the provided antenna (see Section 4.3, “RF Circuitry”). 3.5 USB Interface For many applications or demonstrations it is desirable to connect the Network Node to a PC or other device. A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232R USB UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the module. The USB interface is configured as a "Bus Powered" device and will therefore draw all required power from the USB interface. The device is USB 2.0 full speed compatible. 3.6 User Interface The Network Node provides multiple means for user interface for both debug and demonstration. • Four individual pushbuttons can be used as input, and a 4-direction tactile joystick switch with center push is wired in parallel with the individual pushbuttons. These pushbuttons have interrupt generation capability. • Four individual LEDs can be used as indicators for debug or status. 1322x Network Node Reference Manual, Rev. 1.1 3-4 Freescale Semiconductor System Overview and Functional Block Descriptions 3.7 128x64 Pixel Monochrome Graphic LCD Display The Network Node supports a 128x64 pixel chip-on-glass (COG) STN transmissive monochrome graphic LCD that provides for alpha-numeric or graphic readout. The LCD module is mounted on top of the main circuit board and connects via a flat flex cable (FFC). • The display is an OPTREX #F-51553GNBJ-LW-AB • Viewing area is 66.8 (W) × 35.5 (H) mm • The LCD operates from 5 Vdc generated from the main operating voltage. The LCD module requires a highly regulated 5 V so that the high voltages generated onboard the display are consistent. • The LCD has white LED backlighting with a typical current of 40 mA when full on. The backlighting is switched by a FET and can be modulated to save current and vary the intensity. • LCD interface to the MCU is via an 8-bit parallel interface • The onboard controller is a member of the Epson S1D15605 Series family with an integrated display data RAM 3.8 Debug/Development Interfaces There are two separate debug ports (for pinouts see Section 4.7, “Debug/Development Connectors”). A 20-pin connector is provided for a standard JTAG debug interface. This a lower cost option that only requires a simple interface cable to connect to the PC and use standard ARM software development tools. A separate 38-pin Mictor connector is uniquely provided on this module to support the extended capability Nexus real-time debug interface for the ARM processor. 3.9 Audio Subsystem The audio subsystem provides means for simple output sounds/tones or for TELCO voice quality audio. • A 2.5mm stereo jack is provided to interface to a typical telephone-type headset with an electret microphone and a single earphone. • Audio input - The audio input is taken from the headset electret microphone (mic). — An onboard 10 k-ohm resistor circuit biases the mic for an ~1 Vdc operating voltage. — The mic AC signal is filtered and amplified through a active low-pass filter with a voltage gain of about 30 (~30 dB). The filter topology is a multiple feedback (MFB) 3-pole, linear phase design. The target cutoff frequency is 3.6 kHz. The filter is intended as an anti-aliasing filter for sampled data. — The input amplifier output is sampled via the onboard MC1322x ADC. The sampling frequency is programmable. • Audio output source - The audio output can be sourced from both a serial 10-bit DAC and a PWM timer output. — The 10-bit serial DAC uses the SSI port to send provide the digital sample data. — The PWM timer output is typically modulated to create a Class-D amplifier. Secondarily, a simple 50% duty cycle signal can provide simple tones. 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-5 System Overview and Functional Block Descriptions • 3.10 — The audio output source is jumper selectable via J10 Audio output processing - The DAC or PWM out signal is filtered through an active 2-pole LPF. From the filter the signal passes through a passive attenuator, and then is amplified and driven to either an on-board speaker or the headset earphone. — The attenuator provides a volume control that is controlled via a software 32 linear tap programmable, non-volatile digital potentiometer. The interface to the potentiometer is the I2C port. — The onboard speaker is automatically disconnected if a headset is plugged-in. GPIO Connector The GPIO connector (J2) provides a number of data interfaces and GPIO for external system expansion, Section 4.9, “GPIO Connector” gives details. • A number of the GPIO are shared with the LCD interface. User should take care to avoid conflict and may have to disable LCD to use some GPIO or ports. • Power supply voltage is provided — Current draw should be limited to 50 mA. — A separate regulated voltage can be enabled. • Provision is made to supply an external reference clock if desired. 3.11 Clocks The 1322x Network Mode provides for two system clock sources. • MC1322x Reference Oscillator - The default frequency for the reference oscillator is 24 MHz and the mounted crystal X1 is a 24 MHz device that meets MC1322x specifications. There are two additional options for the module — X1 can be replaced by 13-26 MHz crystal (it must meet MC1322x specifications), however, the onboard PLL must be used in this case. The PCB provides for PLL filter components, but these are not populated. — An external clock source can be supplied as the reference source (typically 24 MHz). The frequency must accurate to +/-40ppm. The external clock source is supplied through GPIO Connector J2, and crystal X1 must be removed and capacitor C58 mounted (see Chapter 5, “Schematic, Board Layout, and Bill of Material”, Sheet 1). — 32.768 kHz Crystal Oscillator - Provision is also made for an optional secondary 32.768 kHz crystal X2. This oscillator can be used for a low power accurate timebase. The module comes without this crystal and its load capacitors C7 and C12 unmounted (see Chapter 5, “Schematic, Board Layout, and Bill of Material”, Sheet 1). 1322x Network Node Reference Manual, Rev. 1.1 3-6 Freescale Semiconductor Chapter 4 Interface Locations and Pinouts This chapter provides a description of the interface location and pinout of the 1322x Network Node PCB. 4.1 Overview This chapter provides the locations (as shown in Figure 4-1) and descriptions of switches, jumpers, and connectors on the 1322x Network Node PCB. Users should reference the figures in the subsequent sections while moving through this chapter and reference the circuit board schematic in Chapter 5, “Schematic, Board Layout, and Bill of Material”, for additional information. LCD Display GPIO Connector JTAG Connector RF Connector Buzzer Audio Connector USB DC Supply On-Off Switch Tact Switches Joystick Figure 4-1. Network Node PCB Top View 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-1 Interface Locations and Pinouts 4.2 Power Management The module can be powered from the DC power jack, the USB port, or the battery pack. 4.2.1 Supply Sources Table 4-1 lists the supply sources, connectors, and voltages. Board maximum current draw is rated at 100 mA. Table 4-1. Power Supply Sources Source Connector Min (Volts) Typical (Volts) Max (Volts) DC Source J5 4.4 12 USB J6 4.4 5.25 AA Battery Pack BC1 ~2.0 3.2 4.2.2 Notes Use DC only source. The connector is a 2 mm DC power jack; positive center conductor. Two AA cells. Battery pack is automatically disabled by either DC source or USB. Accessible through the door on the bottom of the plastic enclosure. On/Off Switch and Power On Indicator The following are used with the power management: • Switch SW7 - 4-pole slide switch disconnects ALL sources • Green LED D5 - indicates power from any source 4.2.3 Power Measurement It is possible to isolate various circuit blocks to measure current draw via 0-ohm resistors. The resistors are all mounted as default. Below is a list of the supplies. • R68 -> VCC (Output from on-board regulator) • R65 -> VBATT (Supply for 1322x) • R80 -> V_DIS (Supply for display circuit) • R43 -> V_AUD (Supply for audio circuit) • R64 -> 3V (Output from on-board regulator for GPIO customer access), or alternately, R66 (not mounted) can enable separate regulator U12. 1322x Network Node Reference Manual, Rev. 1.1 4-2 Freescale Semiconductor Interface Locations and Pinouts 4.3 RF Circuitry The external antenna is connected via the provided SMA connector (J7). NOTE Only the provided Antenova antenna (model Titanus) should be used with this module. This RF design has been certified with this antenna. ® Figure 4-2. Antenova® Titanus Model Antenna 4.4 USB Connector (“B” Receptacle) The USB connector is designated as J6. Figure 4-3 shows the connector pinout. Figure 4-3. USB Connector Pinout 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-3 Interface Locations and Pinouts 4.5 LEDs, Switch, Buttons and Joystick The Network Node contains a total four red LEDs and one green LED • The four red LEDs are driven by the MCU and controlled by the software application. • As previously stated, the green LED is directly connected to the on-board regulator and acts as a "Power On" indication. As also previously stated, SW7 is an on/off slide switch that connects the power supplies. There are five pushbuttons total. • One pushbutton (SW5) is separate and provides a master hardware Reset. • Four additional pushbuttons are connected to the MCU GPIO for software application. These buttons all have interrupt generation capability A joystick (SW6) is also provided. • The joystick is a 4-direction TACT Switch with Center Push. • The 4-directional TACT switches are connected in parallel with the four user pushbuttons. • The center push switch is separate and does not have interrupt generation capability Table 4-2. Switch and LED Summary Item GPIO Connection Feature PWR (green) VCC ‘Power On’ indication LED1 (red) KBI_1 Application specific LED2 (red) KBI_2 Application specific LED3 (red) KBI_3 Application specific LED4 (red) TX_ON Application specific SW1 (pushbutton) KBI_4 Interrupt functionality. In parallel with SW6 (right). SW2 (pushbutton) KBI_5 Interrupt functionality. In parallel with SW6 (down). SW3 (pushbutton) KBI_6 Interrupt functionality. In parallel with SW6 (left). SW4 (pushbutton) KBI_7 Interrupt functionality. In parallel with SW6 (up). SW5 (RST) RESETB HW reset SW6 (right) KBI_4 Interrupt functionality. In parallel with SW1. SW6 (down) KBI_5 Interrupt functionality. In parallel with SW2. SW6 (left) KBI_6 Interrupt functionality. In parallel with SW3. SW6 (up) KBI_7 Interrupt functionality. In parallel with SW4. SW6 (center) KBI_0_HST_WK Host wake up output functionality. No interrupt functionality 1322x Network Node Reference Manual, Rev. 1.1 4-4 Freescale Semiconductor Interface Locations and Pinouts 4.6 LCD Connector The LCD module is connected to the main circuit board via a 30-conductor flat flex cable (FFC) with 0.5 mm spacing. The main board connector is an FFC, Right Angle Dip, zero insertion force (ZIF), 30 pin connector (J13). NOTE The LCD connector is a ZIF unit. Be sure to release the connector before trying to connect or disconnect the FFC to the LCD. 4.7 4.7.1 Debug/Development Connectors ARM JTAG Interface Connector The MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The 20-pin connector is clearly separated from the GPIO pin header (J2) and located at the rear side of the module. The 20-pin connector has Pin 1 marking for correct plug-in of the development cable. Table shows the device pins that are connected to the associated JTAG header pin outs if the JTAG connector is used. Table 4-3. ARM JTAG 20-Pin Connector Assignments (J1) Name1 Pin # Pin # Name VCC VCC NC2 GND TDI GND TMS GND TCK 10 GND RTCK 11 12 GND 13 14 GND RESET 15 16 GND NC 17 18 GND NC 19 20 GND TDO NC means No Connect. MC1322x does not support separate JATG reset TRST. 3 VCC through a 100k-ohm pullup. 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-5 Interface Locations and Pinouts 4.7.2 Nexus Mictor Interface Connector The MC1322x also supports connection to a subset of the defined Nexus Mictor connector. The hardware interface is a 38-pin Mictor 0.64mm/0.025inch spacing target connector (J11). Table 4-4 shows the device pins that are connected to the associated Mictor pinouts. The 38-pin MICTOR connector has a "plug security" for avoid reverse plug-in. J11 is located on the bottom side of the main board. Table 4-4. Nexus 38-Pin Mictor Connector Assignments (J11) Name1 Pin # Pin # Name NC NC NC NC NC RTCK NC NC VCC (pullup)2 10 EVTI_B TDO 11 12 VCC3 NC 13 14 RDY_B TCK 15 16 MDO07 TMS 17 18 MDO06 TDI 19 20 MDO05 RESET4 21 22 MDO04 NC 23 24 MDO03 NC 25 26 MDO02 NC 27 28 MDO01 NC 29 30 MDO00 NC 31 32 EVTO_B NC 33 34 MCKO NC 35 36 MSEO1_B NC 37 38 MSEO0_B NC means No Connect. VCC through a 100k-ohm pullup. 3 VCC isolated by a 1k-ohm resistor. 4 VCC through a 100k-ohm pullup. 1322x Network Node Reference Manual, Rev. 1.1 4-6 Freescale Semiconductor Interface Locations and Pinouts 4.8 Audio Subsystem Connections The audio subsystem uses the following connections: • 2.5mm stereo jack J12 - for headset mic and earphone • Jumper J10 - selects audio output source. See Figure 4-4 for connections. AUD FILTER INPUT J10 SERIAL DAC PWM TSM-103-01-L-SV Audio Select 1-2 DAC 3-2 PWM Figure 4-4. J10 Audio Output Source Jumper 4.9 GPIO Connector The GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 26-pin header. The connector provides access to MCU GPIO, an external clock source connection, a timer output, ADC inputs, the SSI port, a UART port, the SPI port, the I2C port, and the serial DAC output. Power is also provided on the connector. • VCC is the main supply voltage. Current draw should be limited to 50 mA. • CLKIN can be used to supply an external reference clock (nominally 24 MHz). The onboard crystal must be removed and an ac-coupling capacitor added. • A number of the GPIO are shared with the LCD interface. Best practice is to disable the LCD data interface to used these signals (see Table 4-5 below). • The serial DAC output is available at the connector. The DAC output should not be selected as the output audio source (J10) when used offboard. Table 4-5. GPIO Connector J2 Pinouts Pin Name Function Notes TMR1 Timer I/O or GPIO Hardwired to LCD control output. CLKIN Source for external clock to reference oscillator • 13-26 MHz reference clock with <40 ppm accuracy • Onboard crystal must be removed • Enable signal to MC1322x by adding C58, 10pF; see schematic VCC Voltage supply from module 3V output from on-board regulation GND System ground ADC1 ADC Analog Input Channel or GPIO ADC2 ADC Analog Input Channel or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. ADC3 ADC Analog Input Channel or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. ADC4 ADC Analog Input Channel or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-7 Interface Locations and Pinouts Table 4-5. GPIO Connector J2 Pinouts (continued) ADC5 ADC Analog Input Channel or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. 10 DAC_OUT Serial DAC Output Jumper J10 selects DAC output as audio output source 11 SSI_TX SSI Port or GPIO Hardwired to serial DAC 12 SSI_RX SSI Port or GPIO 13 SSI_FSYN SSI Port or GPIO Hardwired to serial DAC 14 SSI_BITCLK SSI Port or GPIO Hardwired to serial DAC 15 KBI_0_HST_WK Hardwired to “center” on joystick 16 KBI_4 Hardwired to “right” on joystick and SW1 17 UART2_TX UART2 or GPIO 18 UART2_RX UART2 or GPIO 19 UART2_RTS UART2 or GPIO Hardwired to LCD control output. 20 UART2_CTS UART2 or GPIO Hardwired to LCD control output. 21 I2C_SCL I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has I2C address 0x50 22 I2C_SDA I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has I2C address 0x50 23 SPI_SCK SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. 24 SPI_SS SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. 25 SPI_MOSI SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. 26 SPI_MISO SPI Port or GPIO Hardwired to LCD data buffer. Use Jumper J14 to disable. 4.10 FLASH Memory Recovery Jumpers and Erase The MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of doing so: • JTAG Debug Port - Using the JTAG debug port and the ARM debug tools, the FLASH image can be changed. • Load new FLASH image via UART1 port NOTE The 1322x Network Node provides access for UART1 through the USB connection. If users need to use UART1 with Test Tool running on a PC, they must access the UART through the USB port as a virtual COM port. — The Freescale BeeKit IDE download provides a software tool called “Test Tool”. This application runs on a PC and can be used with a client running on the MC1322x to test the platform. — Test Tool also has the capability to load a new image into the FLASH. 1322x Network Node Reference Manual, Rev. 1.1 4-8 Freescale Semiconductor Interface Locations and Pinouts NOTE The FLASH must first be cleared before loading a new image to FLASH. The 1322x Network Node has two jumper sites (J19 and J20, Figure 4-5) that must be used to erase the FLASH: 1. Short Jumper J3 Pin 1 to Pin 2 with a shorting bar. 2. Short Jumper J20 Pin 1 to Pin 2 with another shorting bar. 3. Turn on power, push the reset button, and wait a few seconds. 4. Turn off power. 5. Remove the jumper shorting bars. 6. The board is now ready for boot operation. After the FLASH is erased, the module can be loaded with a new image through the USB port using Test Tool. Refer to the Test Tool User’s Guide as supplied with Test Tool in the BeeKit Wireless Connectivity Toolkit download. VCC C2 100nF R103 10K TP3 ADC2_VREFH J19 VCC TP103 J20 Recovery Mode HDR_2X1 ADC2_VREFH -> "0" ADC2_VREFL -> "1" HDR_2X1 ADC2_VREFL R104 10K Figure 4-5. FLASH Erase Headers 4.11 ADC Voltage References Two ADC reference voltages are provided: • The reference voltage for ADC2_VREFH is tied to VCC which is regulated when the board is supplied from the DC source or the USB port. However, this voltage moves with VCC when power is supplied via the battery source. • A fixed voltage reference for ADC1_VREFH is provided (see Figure 4-6). — The fixed voltage is 1.5 Vdc. — The LM285M (U17) is programmed via R120 and R121 to provide a constant reference — The reference can be enabled via Jumper J18. — This reference is useful for battery operation where a known, fixed high reference voltage for the ADC is required. 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-9 Interface Locations and Pinouts VCC J18 HDR_2X1 R1 10K Not Mounted 1.5V U17 ADC1_VREFH R120 120K 1% LM285M R121 24.9K 1% Figure 4-6. ADC Voltage 1.5 Vdc Voltage Reference 4.12 Jumper Selection Table 4-6 lists all the possible jumper selections for the Network Node. The jumpers available on the board are as follows: • J10 - used to select audio output source • J14 - used to disable LCD data buffer if GPIO used with connector J2 (GPIO Interface) • J18 - Sets fixed ADC reference voltage • J19, J20 - used to clear MC1322x onboard FLASH. See Table 4-6. Table 4-6. Network Node Jumper Selection Pin Header J10 Pin Number Connection Description Default Setting 1-2 Connect to enable audio path from DAC Not mounted 2-3 Connect to enable audio path from PWM Mounted J14 1-2 Connect to disable the LCD data bus buffer Not mounted J18 1-2 Connect to enable ADC 1.5V reference Not mounted Connect both to recover/clear FLASH. See Section 4.10, “FLASH Memory Recovery Jumpers and Erase” Not mounted J19, J20 1-2, 1-2 1322x Network Node Reference Manual, Rev. 1.1 4-10 Freescale Semiconductor A CLKIN 3 4 2 1 R6 390R 90122-26 10 12 14 16 18 20 22 24 26 J2 R83 10K Not Mounted 10 12 14 16 18 20 22 24 26 11 13 15 17 19 21 23 25 11 13 15 17 19 21 23 25 SW2 DTSM63N SWITCH2 GPIO Pin Header 3 4 2 1 Push Buttons R8 390R VCC 3 4 2 1 TP7 D3 LHR974 LED3 VCC 3 4 2 1 Audio V_AUD Audio 0R 0R Recovery Mode JTAG RTCK Disable RTCK JTAG RTCK Enable 1.5V C50 100nF CLKIN LT1129CST-3.3 GND1 GND2 Vout Vin U12 SKRHA Ce Co NC1 NC2 SW6 VCC R103 10K SWITCH3 SWITCH4 C49 1uF X2 32.768kHz Not Mounted 10pF Not Mounted TMR2 TMR1 TMR0 10K C12 22pF Not Mounted X1 24.00MHz SWITCH4 SWITCH3 SWITCH2 SWITCH1 LED3 LED2 LED1 SWITCH5 SPI_SCK SPI_MOSI SPI_MISO SPI_SS 63 64 XTAL_24_IN XTAL_24_OUT KBI_7 KBI_6 KBI_5 KBI_4 KBI_3 KBI_2 KBI_1 KBI_0_HST_WK SSI_TX SSI_RX SSI_BITCK SSI_FSYN SPI_SCK SPI_MOSI SPI_MISO SPI_SS I2C_SDA I2C_SCL UART1_TX UART1_RX UART1_RTS UART1_CTS UART2_TX UART2_RX UART2_RTS UART2_CTS TMR3 TMR2 TMR1 TMR0 ADC1_VREFL ADC2_VREFL ADC1_VREFH ADC2_VREFH ADC0 ADC1 ADC2 ADC3 ADC4 ADC5 ADC6 ADC7_RTCK U1 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 84 85 86 87 88 93 94 95 96 97 104 105 106 115 47 MC13225 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 GND_FLAG_1 GND_FLAG_2 GND_FLAG_3 GND_FLAG_4 GND_FLAG_5 GND_FLAG_6 GND_FLAG_7 GND_FLAG_8 GND_FLAG_9 GND_FLAG_10 GND_FLAG_11 GND_FLAG_12 GND_FLAG_13 GND_FLAG_14 GND_FLAG_15 GND_FLAG_16 GND_FLAG_17 GND_FLAG_18 GND_FLAG_19 XTAL_32_IN TP10 48 XTAL_32_OUT TP9 50 49 TP1 35 36 37 38 39 40 41 42 34 33 31 32 27 28 29 30 21 22 20 19 17 18 16 15 13 14 23 24 25 26 0R 62 61 R104 R105 ADC1 ADC2 ADC3 ADC4 ADC5 UART2_TX UART2_RX UART2_RTS UART2_CTS TP103 TP3 Not Mounted C58 C55 10pF External Clock Source 1K 1K R124 R125 1K 1K R123 R122 C7 22pF Not Mounted R82 1K Not Mounted R81 1K Not Mounted V_MAIN SSI_TX SSI_RX SSI_BITCK SSI_FSYN UART1_CTS UART1_RTS UART1_RX UART1_TX VCC VCC TSM-102-01-L-SV J20 Note: SWITCH 5 does not have interrupt capability Joystick I2C_SDA I2C_SCL DAC_OUT C2 100nF TSM-102-01-L-SV J19 R4 0R Not Mounted R3 0R 1-2 ADC2_VREFH -> "0" 3-4 ADC2_VREFL -> "1" TP11 C48 4.7uF RESET ADC3 SWITCH2 SWITCH5 SWITCH1 SCLK SYNC Din VOL_SDA VOL_SCL DAC_OUT AUDIO_PWM AUDIO_MIC 0R Not Mounted R66 Not Mounted R70 R69 SW5 DTSM63N RESET MBR0520LT1 D12 R64 0R R121 24.9K 1% R120 120K 1% Reset Button SW4 DTSM63N SWITCH4 R14 1K TP46 3 4 2 1 R1 10K D5 LGR971 POWER R11 220R VCC ADC5 SSI_TX SSI_FSYN SWITCH5 UART2_TX UART2_RTS I2C_SCL SPI_SCK SPI_MOSI ADC1 TMR1 R102 10K Power ON TP8 R9 390R VCC LM285M D4 LHR974 LED4 U17 SW3 DTSM63N SWITCH3 TSM-102-01-L-SV Note: SSI_FSYN becomes CLKO under test conditions VCC TP6 D2 LHR974 LED2 R7 390R SW1 DTSM63N SWITCH1 TP5 D1 LHR974 LED1 LEDs TMR2 SPI_SS SPI_MISO SPI_MOSI SPI_SCK ADC2 ADC3 ADC4 ADC5 SPI_SS SPI_MISO SPI_MOSI SPI_SCK ADC2 ADC3 ADC4 ADC5 TMR2 UART2_CTS UART2_RTS TMR1 TMR0 V_DIS UART1_TX UART1_RX UART1_CTS UART1_RTS UART2_CTS UART2_RTS TMR1 TMR0 ADC2 ADC4 DAC_OUT SSI_RX SSI_BITCK SWITCH1 UART2_RX UART2_CTS I2C_SDA SPI_SS SPI_MISO RESET SWITCH4 SWITCH3 SWITCH2 SWITCH1 TP4 LED4 LED3 LED2 LED1 Display Display USB/Power Supply V_AUD V_DIS UART1_TX UART1_RX UART1_CTS UART1_RTS J18 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36 NC37 NC38 NC39 NC40 NC41 NC42 NC43 NC44 NC45 NC46 DIG_REG NVM_REG LREG_BK_FB COIL_BK VBATT RESETB TMS TCK TDI TDO EVTI_B EVTO_B MSEO1_B MSEO0_B MCKO/IO50 RDY_B MDO07 MDO06 MDO05 MDO04 MDO03 MDO02 MDO01 MDO00 RF_PLL_FLT VREG_ANA PA_POS PA_NEG RF_GND ANT_2 ANT_1 TX_ON RX_ON 80 81 82 83 89 90 91 92 98 99 100 101 107 108 109 110 116 117 118 119 125 126 127 128 134 135 136 137 138 139 140 141 142 143 144 145 124 133 44 43 45 51 12 11 10 132 123 113 114 131 122 129 130 120 121 111 112 102 103 46 55 54 53 58 57 56 52 59 RF_RX_TX 60 C8 100pF TMS TCK TDI TDO EVTI_B EVTO_B MSEO1_B MSEO0_B MCKO RDY_B MDO7 MDO6 MDO5 MDO4 MDO3 MDO2 MDO1 MDO0 TP44 0R R65 C4 27nF Not Mounted L1 3.9nH Not Mounted TP45 VCC TCK TMS TDI RESET TDO C3 1pF Not Mounted C10 1uF C9 Not Mounted 10nF Not Mounted C5 180nF Not Mounted R5 240R Not Mounted LED4 RF C11 1nF R12 100K VCC 11 13 15 17 19 21 23 25 27 29 31 33 35 37 11 13 15 17 19 21 23 25 27 29 31 33 35 37 J11 767054-1 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 M3x8.0mm M3x8.0mm ZZ4 ZZ2 RESET R13 1K VCC M3x8.0mm 10 12 14 16 18 20 ZZ1 Label 1322X-NCB JDP7050_3 PCB1 90122-20 11 13 15 17 19 J1 JTAG Debug nTRST 3 11 13 15 DBGRQ 17 DBGACK 19 VCC 10 12 14 16 18 20 TP78 TP80 TP82 TP79 TP81 TP83 M3x8.0mm ZZ5 ZZ3 ANT1 F_Antenna REF3 1Ref REF2 1Ref REF1 1Ref MH4 MH3 MH2 MH1 C6 100nF VCC EVTI_B VTREF RDY_B MDO7 MDO6 MDO5 MDO4 MDO3 MDO2 MDO1 MDO0 EVTO_B MCKO MSEO1_B MSEO0_B RTCK FCP: _X_ Tuesday, May 06, 2008 of Sheet PUBI: --- SOURCE: SCH-23452 PDF: SPF-23452 FIUO: --- Date: Document Number Main Schematic 1322X-NCB Size Page Title: ICAP Classification: Drawing Title: TP71 TP73 TP75 TP77 TP70 TP72 TP74 TP76 J7 SMA TDI TMS TCK RTCK TDO 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 Nexus Debug 10pF Not Mounted C1 10pF C54 GND1 GND2 GND3 GND4 GND5 Freescale Semiconductor 39 40 41 42 43 USB/Power Supply Rev B1 Chapter 5 Schematic, Board Layout, and Bill of Material Figure 5-1. Schematic (1 of 4) 1322x Network Node Reference Manual, Rev. 1.1 5-1 A NC1 NC2 BUZ1 NDT-03C STX-2550-5NTR J12 Mic. Biasing TP25 TP23 TP15 TP50 R24 100K 22uF C19 R57 4.7K R56 4.7K C24 1uF V_AUD R25 1K 11K R85 V_AUD TP20 TP17 10UF C14 R23 TP49 100K V_AUD TP48 R15 10K V_AUD R58 27K R20 200K U2A MC33204DTBG A3 B3 B1 B2 C3 100K NCP4896 VP1 INM NC OUTA SD SE/BTL OUTB GND BYP U6 R26 47pF C20 C25 1uF A2 C2 A1 C1 Audio Amplifier 270pF C46 V_AUD C44 1uF C29 4.7nF Mic. Amplifier/Anti-alias Filter 11 5-2 13K R61 C27 100nF 47K R29 14 100nF C22 27K R59 U2D MC33204DTBG 13 - 12 + 10UF C15 R30 220R TP24 TP22 TP51 C21 100nF Audio Amp Disable 51K R88 V_AUD C30 22nF 10K R87 Audio Amp Enable R34 0R Not Mounted R33 0R V_AUD VCC SDA SCL GND V_AUD Audio Select 1-2 DAC 3-2 PWM TSM-103-01-L-SV J10 1.8K R86 TP19 220nF C45 MAX5434 U13 R32 0R Not Mounted R67 27K C47 3.3nF C28 47nF 8.2K R60 Audio Filter TP18 VDD Din Vout SCLK GND SYNC VCC R106 4.7K VCC DAC101S101 R107 4.7K Audio DAC U4 0R 0R R111 R109 MC33204DTBG U2B 6 - 5 + U2C MC33204DTBG 10 100pF C16 R110 TP16 C13 100nF V_AUD 0R 0R R84 V_AUD VOL_SDA VOL_SCL AUDIO_PWM Din SCLK SYNC DAC_OUT AUDIO_MIC V_AUD of Sheet SOURCE: SCH-23452 PDF: SPF-23452 Tuesday, May 06, 2008 Date: Audio Schematic PUBI: --- Document Number FIUO: --- Size Page Title: FCP: _X_ 1322X-NCB ICAP Classification: Drawing Title: Rev B1 Schematic, Board Layout, and Bill of Material Figure 5-2. Schematic (2 of 4) 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor A SPI_SS SPI_MISO SPI_MOSI SPI_SCK ADC2 ADC3 ADC4 ADC5 TMR0 TMR1 UART2_RTS UART2_CTS V_DIS V_DIS R99 100K 74HCT04A U14A 74HCT04A 14 5V_LCD R100 100K C71 100nF R101 100K 100nF C72 V_DIS 13 10 R98 100K 11 12 22 10 V_DIS GND NC B0 B1 B2 B3 B4 B5 B6 B7 13 23 21 20 19 18 17 16 15 14 24 5V_LCD MC74LVXC3245DT GND GND OE T/R A0 A1 A2 A3 A4 A5 A6 A7 VCCA U16 VCCB 74HCT04A 12 74HCT04A U14C 7.15 OHM R44 U14D 74HCT04A U14E 74HCT04A TSM-102-01-L-SV J14 U14F 11 C75 4.7UF USE MURATA PART V_DIS C73 47uF REF LBI BATT 5V_LCD RDN WRN A0 CSN 22uH C66 1uF 10 C65 4.7uF C67 1uF C68 1uF C69 1uF C70 1uF C60 47uF TP88 4.7uF C64 TP93 C59 100nF 5V_LCD TP90 TP91 TP92 C63 4.7uF OUT CLSEL FB SHDN LBO GND U15 LX MAX1676EUB+ C61 100nF R96 200R L3 U14B Freescale Semiconductor C62 10nF C74 10nF P/S IRS VDD GND VOUT CAP3CAP1+ CAP1CAP2CAP2+ V1 V2 V3 V4 V5 D0 D1 D2 D3 D4 D5 D6 D7 31 32 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 6210_30_smd LCD CONNECTOR 31 32 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 J13 TP89 R91 0R Not Mounted V_DIS Q2 ZVN3320F R90 47 OHM USE VISHAY PART TP95 TP97 TP99 TP101 TP94 TP96 TP98 TP100 RESN R89 10K 5V_LCD TP102 R97 100K TMR2 Date: Size FCP: _X_ FIUO: --- PUBI: --- Tuesday, May 06, 2008 Sheet of SOURCE: SCH-23452 PDF: SPF-23452 Display Schematic 1322X-NCB Document Number Page Title: ICAP Classification: Drawing Title: 04 02 128x64 Monochrome-Graphic Liquid Crystal Display F-51553GNBJ-LW-AB 03 - Cathode + Anode 01 D11 LED_PWM Rev B1 Schematic, Board Layout, and Bill of Material Figure 5-3. Schematic (3 of 4) 1322x Network Node Reference Manual, Rev. 1.1 5-3 A USB-B VUSB DataData+ GND SHIELD1 SHIELD2 J6 15pF 15pF C43 500mA RT2 C42 R50 R51 60OHM L2 0R 0R C34 1uF V_MAIN C56 10nF C40 100nF TP38 C41 C57 4.7uF LT1129CST-3.3 GND1 GND2 Vin Vout U9 100nF V_USB 17 20 26 12 13 23 27 28 18 15 14 16 19 C35 100nF FT232R GND1 GND2 GND3 TEST NC1 NC2 NC3 NC4 OSCI OSCO RESET USBDM USBDP AGND EP NC5 NC6 CBUS4 CBUS3 CBUS2 CBUS1 CBUS0 TxD RxD RTS CTS DTR DSR DCD RI VCCIO 24 33 25 29 11 10 21 22 30 32 31 C38 100nF TP39 TP40 TP41 TP42 TP43 SW7-3 MFP461N-RA Q1 ZXM61P02F RT1 500mA D10 MBR0520LT1 TP29 MBR0520LT1 D9 C36 4.7uF TP28 R42 100K 3V3OUT VCC U10 R40 10K Power Management USB Interface 2462 BC1 2xAA Cells TP26 MBR0520LT1 D8 MBR0520LT1 MBR0520LT1 SW7-1 MFP461N-RA D7 D6 SW7-2 MFP461N-RA SW7-4 MFP461N-RA DJ-005 J5 V_USB 10 11 12 5-4 TP47 UART1_RX UART1_TX UART1_RTS UART1_CTS C37 4.7uF 0R R68 TP32 VCC 0R R43 0R R80 Power Measurement V_AUD V_DIS TP33 TP60 V_AUD V_DIS FCP: _X_ FIUO: --- PUBI: --- of Sheet Tuesday, May 06, 2008 Date: SOURCE: SCH-23452 PDF: SPF-23452 Document Number Size USB/Power Supply Schematic 1322X-NCB ICAP Classification: Drawing Title: Page Title: Rev B1 Schematic, Board Layout, and Bill of Material Figure 5-4. Schematic (4 of 4) 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Figure 5-5. Network Node PCB Component Location (Top View) Figure 5-6. Network Node PCB Test Points (Bottom View) 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-5 Schematic, Board Layout, and Bill of Material Figure 5-7. Network Node PCB Layout (Top View) Figure 5-8. Network Node PCB Layout (Bottom View) 1322x Network Node Reference Manual, Rev. 1.1 5-6 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number ANT1 F_Antenna PCB F Antenna Not A Part NOT A PART BUZ1 SMD Speaker NDT-03C Star Micronics NDT-03C C54 Ceramic Capacitor C0G 10pF 50V 5% Murata GRM1555C1H100JZ01 C1,C55,C58 Ceramic Capacitor C0G 10pF 50V 5% Murata GRM1555C1H100JZ01 C24,C25,C44 Ceramic Capacitor X5R 1uF 6.3V 10% Murata GRM155R60J105KE19B C10 Ceramic Capacitor X5R 1uF 6.3V 10% Murata GRM155R60J105KE19B C11 Ceramic Capacitor X7R 1nF 50V 10% Murata GRM155R71H102KA01D C14,C15 CAP CER 10UF 6.3V 20% X5R 0603 10uF 6.3V 20% Panasonic ECJ1VB0J106M C19 Ceramic Capacitor for smoothing X5R 10uF 10V 10% Murata GRM21BR61J106KE19L 15 C2,C6,C13,C Ceramic Capacitor X5R 21,C22,C27, C35,C38,C40 ,C41,C50,C5 9,C61,C71,C 72 100nF 10V 10% Murata GRM155R61A104KA01D C20 Ceramic Capacitor C0G 47pF 50V 5% Kemet C0402C470J5GAC C28 Ceramic Capacitor X5R 47nF 10V 10% Panasonic-ecg ECJ-0EB1A473K C29 Ceramic Capacitor X7R 4.7nF 25V 10% Murata GRM155R71E472KA01 C30 Ceramic Capacitor X7R 22nF 25V 10% Murata GRM155R71E223KA61D C3 Ceramic Capacitor C0G 1pF 50V 0.25pF Murata GRM1555C1H1R0CZ01D C34,C49 Ceramic Multilayer Capacitor X7R NoPb 1uF 16V 15% Murata GRM21BR71C105 C36,C37,C48 Ceramic Multilayer Capacitor X5R 4.7uF 16V 15% Phycomp 2222 781 13672 C4 Ceramic Multilayer Capacitor X7R 27nF 10V 5% Vishay VJ0402Y273JXQCW1BC C42,C43 Ceramic Capacitor C0G 15pF 50V 5% Murata GRM1555C1H150JZ01J C45 Ceramic Capacitor X7R 220nF 10V 10% Murata GRM188R71A224KA01 C46 Ceramic Capacitor C0G 270pF 50V 5% Murata GRM1555C1H271JA01 C47 Ceramic Capacitor C0G 3.3nF 50V 15% Murata GRM155R71H332KA01 C5 Ceramic Multilayer Capacitor X7R 180nF 16V 5% Vishay VJ0603Y184JXJCW1BC C57 Ceramic Multilayer Capacitor X5R 4.7uF 10V 10% Murata GRM219R61A475KE34D 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-7 Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference C60,C73 Description Low ESR Tantal Capacitor Value Voltage Tolerance 47uF 16V +/-10% C63,C64,C65 Aluminum Electrolytic Capacitor low ESR CV-GX 4.7uF 35V C66,C67,C68 Aluminum Electrolytic ,C69,C70 Capacitor 1uF C7,C12 Ceramic Capacitor C0G C75 C8,16 Manufacturer Manufacturer Part Number Avx TPSD476K016R150 20% Sanyo 35CV4.7GX 50V 20% Nic Components NACE 1R0 M 50V 4x5,5 TR13 22pF 50V 5% Murata GRM1555C1H220JZ01J CAP CER 4.7UF 6.3V 10% X5R 0603 4.7uF 6.3V 10% Venkel Company C0603X5R6R3-475KNE Ceramic Capacitor C0G 100pF 50V 5% Murata GRM1555C1H101JZ01 C56,C62,C74 Ceramic Capacitor X7R 10nF 25V 10% Murata GRM155R71E103KA01D C9 10nF 25V 10% Murata GRM155R71E103KA01D D1,D2,D3,D4 SMD Red topled LHR974 Osram Q62702P5182 D5 LGR971 Osram Q65110P5179 D6,D7,D8,D9, SMD Power Schottky D10,D12 Rectifier MBR0520 LT1 On Semiconductor MBR0520LT1G J10 Single Row Straight Pin Header SMD TSM-10301-L-SV Samtec TSM-103-01-L-SV J11 Mictor, Centerline Matched Impedance Connector 767054-1 Amp 767054-1 J12 2.5mm Audio stereo jack STX-2550 with switch -5NTR Kycon STX-2550-5NTR J13 FFC Right Angle Dip Zif 30 pin Connector 6210_30_ smd Avx 08 6210 030 340 800 J14, J18,J19,J20 Single Row Straight Pin Header SMD TSM-10201-L-SV Samtec TSM-102-01-L-SV J18,J19,J20 HDR 1X2 SMT 78.7MIL SP 235H AU HDR_1X2 Samtec TMM-102-01-S-S-SM L1 HF Chip coil 3.9nH Murata LQG15HS3N9S02D L2 Chip Ferrite Bead 500mA Murata BLM11P600Sxx L3 SMD power inductor 22uH Coilcraft DO1608C-223LC Q1 P-channel MOSFET ZXM61P0 2F 20V Zetex ZXM61P02F Q2 N-Chanel Enhancement MOSFET ZVN3320 200V Zetex ZVN3320FTA Ceramic Capacitor X7R SMD Green topled 20V 5% 20% 1322x Network Node Reference Manual, Rev. 1.1 5-8 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number 15 R3,R33,R43, Fixed resistor RC31 R50,R51,R64 ,R65,R68,R6 9,R80,R84,R 105,R109,R1 10,R111 0R 50V 2% Philips 2322 705 91002 R4,R32,R34, Fixed resistor RC31 R66,R70,R91 0R 50V 2% Philips 2322 705 91002 R11,R30 Fixed resistor RC31 220R 50V 2% Philips 2322 705 50221 10 R12,R23,R24 Fixed resistor RC31 ,R26,R42,R9 7,R98,R99,R 100,R101 100K 50V 2% Philips 2322 705 50104 R13,R14,R25 Fixed resistor RC31 1K 50V 2% Philips 2322 705 50102 R81,R82 1K 50V 2% Philips 2322 705 50102 R56,R57,R10 Fixed resistor RC31 6,R107 4.7K 50V 2% Philips 2322 705 50472 R1,R15,R40, Fixed resistor RC31 R44,R87,R89 ,R102,R103, R104 10K 50V 2% Philips 2322 705 50103 R44 Fixed resistor RC31 7R15 1% Koa Speer RK73H1ETTP7R15F R83 Fixed resistor RC31 10K 50V 2% Philips 2322 705 50103 R20 Fixed resistor RC31 200K 50V 2% Yageo America RC0402JR-07200KL R29 Fixed resistor RC31 47K 50V 2% Philips 2322 705 50473 R5 Fixed resistor RC31 240R 50V 2% Philips 2322 705 50241 R58,R59,R67 Fixed resistor RC31 27K 50V 2% Philips 2322 705 50273 R6,R7,R8,R9 Fixed resistor RC31 390R 50V 2% Philips 2322 705 50391 R60 Fixed resistor RC31 8.2K 50V 2% Philips 2322 705 50822 R61 Fixed resistor RC31 13K 50V 2% Philips 2322 705 50133 R85 Fixed resistor RC32 11K 50V Koa Speer RK73H1ETTP1102F R86 Fixed resistor RC33 1.8K 50V Koa Speer RK73H1ETTP1801F R88 Fixed resistor RC34 51K 200V Koa Speer RK73H1ETTP5102F R96 RESISTOR 200 OHM Vishay/dale CRCW0402200RJNED R90 RES MF 47 OHM 1/4W 5% 1206 47 OHM 5% Bourns CR1206-JW-470ELF R120 RES MF 120K 1/16W 1% 0402 120K 1% Koa Speer RK73H1ETTP1203F Fixed resistor RC31 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-9 Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description RES MF 24.9K 1/16W 1% 0402 Value R121 R122,R123,R RES MF 1.0K 1/16W 5% 1K 124,R125 0402 RT1,RT2 Polyswitch Overcurrent Protection Device 500mA SW1,SW2,S W3,SW4,SW SMD Tact Switch 2.6N (7.0mm) SW6 Voltage Tolerance 24.9K Manufacturer Manufacturer Part Number 1% Koa Speer 5% Vishay CRCW04021K00JNED Intertechnology 13.2V RK73H1ETTP2492F Tyco Electronics microSMD050F DTSM63 Diptronic DTSM-63N-V-B 4-directional TACT switch with center push SMD SKRHA Alps SKRHAAE010 SW7 Miniature Slide Switch 4 pole MFP461N -RA Knitter-switch MFP461N-RA U1 ZigBee Wireless Transceiver and ARM7 processor MC13225 Freescale MC13225 U10 USB UART, PB-free FT232R Ftdi FT232RQ U13 Digitally Controled Potentiometer, 50Kohm MAX5434 Maxim MAX5434LEZT+T U14 Hex inverter 74HCT04 On Semiconductor MC74HCT04ADTR2G U15 Low supply current MAX1676 Step-up DC-DC Converter with shutdown Maxim MAX1676EUB+-ND U16 Low Voltage CMOS Octal 74LCX24 Bidirectional Transceiver 5 On Semiconductor MC74LVXC3245DTG U2 Dual Low voltage Op-Amp MC33202 On Semiconductor MC33204DTBG U4 10-bit Low Power DAC with rail to rail output DAC101S 101 National Semiconductor DAC101S101CIMK-NoPB U6 Audio class AB amplifier, NCP4896 1,0W On Semiconductor NCP4896FCT1G U9,U12 LDO voltage regulator 3V3 Linear Technology LT1129CST-3.3 U17 IC VREG ADJ 1.24-5.3V LM285M 20MA SOIC8 National Semiconductor LM285M/NOPB X1 Crystal SMD Ndk NX3225SA-24MHz (for OA/AV and Blootooth) / S1-3085-1510-9 LT1129CS T-3.3 24.00MHz +-10ppm 1322x Network Node Reference Manual, Rev. 1.1 5-10 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials Qty Part Reference Description Value X2 Crystal SMD 32.768kH D11 128x64 pixel monochrome display w. LED backlight BC1 PCB Battery Holder 2xAA J1 Voltage Tolerance +-20ppm Manufacturer Manufacturer Part Number Abracon ABS25-32.768-12.5-2-T F-51553G NBJ-LW-A Optrex F-51553GNBJ-LW-AEN 2462 Keystone 2462 Dual Row Right Angle pin 90122-20 header 0.38um gold Molex 90122-0770 J2 Dual Row Right Angle pin 90122-26 header 0.38um gold Molex 90122-0773 J5 DC Power Jack PCB, 2mm DJ-005 Taitek 2DC-0005-D100 J6 USB-series "B" receptacle USB-B Amp 292304-1 J7 Straight SMA Receptacle SMA for PCB edge mounting (0.79mm PCB) Johnson Components 142-0701-881 1322x Network Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-11 Schematic, Board Layout, and Bill of Material 1322x Network Node Reference Manual, Rev. 1.1 5-12 Freescale Semiconductor
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