Freescale Semiconductor 1323X-MRB Developer Board User Manual 1323xDHRM

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Document Number: 1323xDHRMRev. 1.004/2011 1323x Development HardwareReference Manual

1323x Development Hardware Reference Manual, Rev. 1.0Freescale Semiconductor i ContentsAbout This BookAudience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiOrganization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iiiChapter 1 Safety Information1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.1 Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.3 Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.1.4 Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11.2 Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.2.1 26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.3 Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2Chapter 2 MC1323x Development Platform Overview and Description2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12.2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22.3 Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-52.4 General System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5Chapter 3 1323x-Modular Reference Board3.1 1323x-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-53.2.1 RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-63.2.2 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-73.3 Reset and BDM Debug Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-83.3.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-93.3.2 IO Connectors J2 and J3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-113.3.3 1323x-MRB Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-133.4 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-153.4.1 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18Chapter 4

1323x Development Hardware Reference Manual, Rev. 1.0ii Freescale Semiconductor 1323x Remote Control Motherboard4.1 1323x-RCM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-44.2.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-54.2.2 GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-74.2.3 1323x-RCM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-104.3 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-144.3.1 1323x-RCM Bill of Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21Chapter 5 1323x Remote Extender Motherboard5.1 1323x-REM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-45.2.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-55.2.2 GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-75.2.3 1323x-REM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-95.2.4 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-105.2.5 IR Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-105.2.6 Pushbutton 2x4 Switch Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-115.2.7 Blue Indicator LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-115.3 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-125.3.1 1323x-REM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16Chapter 6 PCB Manufacturing Specifications6.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4

1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor iii About This BookThis manual describes Freescale’s MC1323x development platform hardware. The MC1323x development platform is an IEEE 802.15.4 compliant evaluation environment based on the Freescale MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip (SoC) for the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer (RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes.AudienceThis manual is intended for system designers.OrganizationThis document is organized into 6 chapters.Chapter 1 Safety Information — Highlights some of the FCC requirements.Chapter 2 HCS08 Development Platform Overview and Description — Provides an overview of the three boards that comprise the MC1323x development platform.Chapter 3 Modular Reference Board — This chapter details the 1323x-MRB which is an IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1323x device.Chapter 4 1323x-Remote Control Module — This chapter details the 1323x-RCM motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and a rich set of interface peripherals. Chapter 5 1323x-Remote Extender Board — This chapter details the 1323x REM motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and set of interface peripherals.Chapter 6 PCB Manufacturing Specifications — This chapter provides the specifications used to manufacture the various MC1323x printed circuit boards (PCBs).Revision HistoryThe following table summarizes revisions to this document since the previous release (Rev 0.0).Revision HistoryLocation RevisionEntire document Edited Chapter 1, Table 3-1, Table 4-1, Table 5-1, Section 4.2.1 and Section 5.2.1.

1323x Development Hardware Reference Manual, Rev. 1.0 iv Freescale Semiconductor Definitions, Acronyms, and AbbreviationsThe following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital ConverterAES Advanced Encryption StandardARM Advanced RISC MachineCTS Clear to SendDAC Digital to Analog ConverterDMA Direct Memory AccessI2C Inter-Integrated Circuit is a multi-master serial computer busISM Industrial Scientific Medical 2.4 GHz radio frequency bandJTAG Joint Test Action GroupLGA Land Grid ArrayMAC Media Access ControllerMCU Microcontroller UnitNEXUS An embedded processor development tool interface that helps design engineers identify software and hardware-level issues. PCB Printed circuit boardPiP Platform in PackagePWM Pulse-width modulation RCM Remote Control ModuleREM Remote Extender BoardRTS Request to SendSMA Connector SubMiniature version “A” connector SPI Serial Peripheral InterfaceSSI Synchronous Serial InterfaceTACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.TELCO Telephone CompanyUSB Universal Serial BusVCP Virtual Com Port

1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 1-1Chapter 1 Safety Information1.1 FCC GuidelinesThis equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization.FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and Industry Canada and make operation of the product unlawful.1.1.1 LabelingFCC labels are physically located on the back of the board.1.1.2 Operating ConditionsThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:• This device may not cause harmful interference.• This device must accept any interference received, including interference that may cause undesired operation.1.1.3 Exposure LimitsThis equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons.1.1.4 Antenna RestrictionsAn intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional

Safety Information1323x Development Hardware Reference Manual, Rev. 1.0 1-2 Freescale Semiconductorradiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.2 Regulatory Approval For Canada (IC RSS 210)This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device.1.2.1 26 PART 5 – AppendixLe présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 1.3 Electrostatic Discharge ConsiderationsAlthough damage from electrostatic discharge (ESD) is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage.All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade Integrated Circuits. During the device qualification ESD stresses were performed for the human body model (HBM), the machine model (MM) and the charge device model (CDM).All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.When operating or handling the development boards or components, Freescale strongly recommends using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:• Flexible fabric, solid fixed size, or disposable ESD wrist straps• Static control workstations, static control monitors and table or floor static control systems• Static control packaging and transportation materials and environmental systems1.4 Disposal InstructionsThis product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal.

1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 2-1Chapter 2 MC1323x Development Platform Overview and Description2.1 IntroductionThe MC1323x development platform is an IEEE 802.15.4 compliant evaluation environment based on the Freescale MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip (SoC) for the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer (RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes.The MC1323x development platform is comprised of three boards:• 1323x-Modular Reference Board (1323x-MRB) - this board contains the MC1323x device with 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The board can be used as a simple standalone evaluation platform or as a daughter card to the other MC1323x development platform boards or to a custom, application specific motherboard. See Chapter 3, “1323x-Modular Reference Board” for detailed information.— Provides compact reference design for device footprint and RF layout— Provides pre-designed MC1323x hardware (device and function)— Provides access to the MC1323x full set of GPIO— Provides MCU BDM debug port— Provides optional local 2 Mbit serial FLASH, 32.768 kHz oscillator crystal, IR “blaster” LED and power management.• 1323x-Remote Control Motherboard (1323x-RCM) - this board accepts the 1323x-MRB as a plug-in module (daughter card) and supplies a variety of peripheral functions to the MC1323x through the IO connectors. The peripheral functions are targeted primarily to a consumer TV or entertainment remote control application. See Chapter 4, “1323x Remote Control Motherboard” for detailed information.— Provides 36-switch matrix for remote control pushbuttons— USB <> serial interface for communication to a PC and provides board power— Touchpad for user interface— Onboard 128 x 32 pixel graphic LCD for menus and host feedback - a unique feature to RF-based remote controls— Accelerometer for motion detection and game play• 1323x-Remote Extender Motherboard (1323x-REM) - this board also accepts the 1323x-MRB plug-in module (daughter card) and supplies a very simple set of peripheral functionality. See

MC1323x Development Platform Overview and Description1323x Development Hardware Reference Manual, Rev. 1.0 2-2 Freescale SemiconductorChapter 5, “1323x Remote Extender Motherboard” for detailed information. A small 8-switch matrix, IR receiver, and USB interface provides means for communication to the MC1323x for:— Simple keypad-only applications— Connection to a PC— Host connection such as for a remote control extender or remote control receiverWhether the 1323x-MRB is used in a simple standalone application or in combination with another host card, Freescale provides a complete software development environment called the Freescale BeeKit Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI) allows users to create, modify, and update various wireless networking implementations. A wide range of software functionality is available to complement the 1323x-MRB and these are provided as codebases within BeeKit.2.2 FeaturesThe MC1323x development platform is built around the concept of having a single daughter card (1323x-MRB) that contains the MC1323x IC and all necessary I/O connections for use as a self-contained module or for connection to an application motherboard. Figure 2-1 shows a simplified block diagram of the more powerful Freescale configuration of the 1323x-MRB combined with the 1323x-RCM.Figure 2-1. Simplified RCM+MRB Block DiagramFigure 2-2 shows a photo of the combined boards with the 1323x-MRB mounted on the 1323x-RCM.32 MHz 32.768KHzPowerManage-mentDC Supply2xAA BatteryVDDMC13233QFNBDMDebugPort3-AxisAcceler-ometerUSBInterfaceFT232RQUARTUSBConn6x6SwitchMatrixPCBF-AntennaUSBIICTouchpadV_LCD2 MbitSerialFLASHGPIO128x32GraphicLCDBuzzer4 LEDIndicatorsIRBlasterSPI

MC1323x Development Platform Overview and Description1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 2-3Figure 2-2. 1323x-MRB Mounted on the 1323x-RCMFeatures of the MC1323x development platform include:• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack• Based on Freescale’s low-cost MC1323x IEEE® 802.15.4 SoC platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin LGA package• Reference design area with small footprint, low cost RF node— Integrated transmit/receive switch— Differential input/output port (typically used with a balun)— Low external component count— Programmable output power with 0 dBm nominal output power, programmable from -30 dBm to +3 dBm typical— Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet, much better than the IEEE 802.15.4 Standard of -85 dBm

MC1323x Development Platform Overview and Description1323x Development Hardware Reference Manual, Rev. 1.0 2-4 Freescale Semiconductor— Onboard printed metal F-Antenna• 32 MHz reference oscillator• BDM serial MCU debug port• Optional secondary 32.768 kHz crystal oscillator for accurate low power timing• IR blaster• 2 Mbit serial FLASH (uses SPI interface)• Master reset switch• Full power regulation and management• 1323x-MRB board provides— Required circuitry for MC13233 - crystals and RF circuitry including F-Antenna and optional SMA connector— Local power supply regulation— Access to all GPIO— Standalone or daughter card use models— Serial FLASH, IR blaster, and BDM functions • 1323x-RCM when used with 1323x-MRB provides— USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications— Power supply source from two AA batteries, USB connector, or DC source— 128x32 pixel graphic LCD— 3-axis Accelerometer (uses IIC interface)— Touch pad interface with interrupt capability (uses IIC interface)— 6x6 Switch matrix— Single tone buzzer— 4 Blue LED indicators• 1323x-REM when used with 1323x-MRB provides— USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications— Power supply source from two AA batteries, USB connector, or DC source— IR receiver— 4x2 Switch matrix— 4 Blue LED indicators

$MC1323x Development Platform Overview and Description1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 2-52.3 Driver ConsiderationsWhen users first connect a 1323x-RCM or 1323x-REM based platform to a PC, they may be prompted to install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and install the drivers. Instead, select manual installation and steer Windows to the following directory:C:\Program Files\Freescale\DriversIf installing the BeeKit software package to another drive or directory, indicate the Drivers directory created by the installer in the custom location where BeeKit was installed.Follow the instructions as they appear on the screen to complete driver installation.If BeeKit is not installed, be aware of the following:• The boards use the FTDI serial to USB converter, Virtual COM Port (VCP) driver for Windows, available at www.ftdichip.com/ftdrivers.htm. (Direct (D2XX) drivers are also available.)• The FTDI web site offers drivers for other platforms including Windows® (98 through Vista x64 and CE), MAC OS (8 through X) and Linux.• Download the appropriate driver and follow the instructions to complete driver installation.2.4 General System SpecificationsTable 2-1. MC1323x Platform SpecificationsParameter Units Notes/ConditionsMIN TYP MAXPowerVoltage supply (DC) 2.5 5 6 V When using REM or RCMVoltage supply (USB) 4.4 5 5.25 V USB 2.0/1.1 standard specificationVoltage supply (Batteries) 2.8 3.2 VTemperatureOperating temperature; non-battery operation (see note)-20 +25 +70 °C Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C.Operating temperature; battery operation (see note)0 +25 +50 °C Operating temperature is limited by battery temperature rangeStorage temperature -30 +25 +70 °CUSB interface USB 2.0 and 1.1 full-speed compatibleRF (1323x-MRB)802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz bandRange (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board)$

MC1323x Development Platform Overview and Description1323x Development Hardware Reference Manual, Rev. 1.0 2-6 Freescale SemiconductorRF Transmitter802.15.4 Output power -30 0 +3 dBm Over range of Pout from IC control in 2 dB steps.Note: On channel 26, output power should not exceed -5 dBm (power setting 0x0E) to meet FCC Part 15 requirements.Harmonics2nd harmonics3rd harmonics-30?-30?dBmdBmHarmonics are compliant to ETSI and FCC regulatory approval standardsRF Receiver802.15.4 sensitivity -93 dBm <1% PER for 20-byte packetsRegulatory ApprovalFCC Not yet certified.CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standardCE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standardsSafetyUL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standardsEnvironmentRoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003Table 2-1. MC1323x Platform SpecificationsParameter Units Notes/Conditions

1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-1Chapter 3 1323x-Modular Reference Board3.1 1323x-MRB OverviewThe 1323x-Modular Reference Board (1323x-MRB) is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1323x device. The 1323x-MRB provides a platform to evaluate the MC1323x device, develop software and applications, and demonstrate IEEE 802.15.4 based networking capabilities. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. This basic board is intended as the core module for MC1323x evaluation and application development and can be used in the following modes:• Simple standalone evaluation platform• Daughtercard to the other MC1323x Development Platform boards (1323x-RCM or 1323x-REM)• Daughtercard to an application specific motherboard.3.1.1 FeaturesThe 1323x-MRB provides the following features:• Small form factor (2 x 2 inches)• 4-Layer metal, 0.034 inch thick FR4 board• MC1323x reference design area— LGA footprint and power supply bypass— 32 MHz reference oscillator crystal— RF components and layout• Low cost RF node— Integrated transmit/receive switch— Differential input/output port (typically used with a balun)— Programmable output power with 0 dBm nominal output power, programmable from -30 dBm to +3 dBm typical— Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet— Printed metal F-Antenna• 32.768 kHz crystal provided for optional timing oscillator• Two connectors provided daughter card mounting— 20-Pin primary connector

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-2 Freescale Semiconductor— 18-Pin secondary connector— Provide main supply voltage to board— Provide access to all MC1323x GPIO• Flexible board power supply— 3.3 V LDO series regulator supplied— Regulator bypass jumper option— Separate external voltage source option— Power-on green LED— Jumpers allow various block current measurements• 6-Pin BDM serial MCU debug port• MC1323x reset switch• Onboard peripheral functions— IR blaster (The MC1323x CMT port is employed as a GPIO to drive large IR blasters. For IR blasters under 20ma, use the CMT port directly.)— 2 Mbit serial FLASH (uses SPI interface)3.1.2 Form FactorFigure 3-1 shows the 1323x-MRB connector and header locations.Figure 3-1. 1323x-Modular Reference Board (1323x-MRB)BDM PortReset SwPrimary 20-Pin IOConnector (J2)J6(J4) J5Secondary 18-Pin IOConnector (J3)J9J8F-AntennaIR Diode D2

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-3Figure 3-2 shows a footprint of the 1323x-MRB with the location of the IO Headers J2 and J3. The user may desire to create a motherboard on which the 1323x-MRB would be mounted, and headers J2 and J3 are used for connection to the motherboard:• Both headers have standard 0.10in / 2.54 mm pin spacing• J2 is 20-pin and J3 is 18-pin• Both are pin headers mounted on the bottom side of the 1323x-MRB and are intended to plug into matching receptacles on the motherboard.• It is recommended that 1323x-MRB be located such that it extends beyond edge of the motherboard (see Figure 3-2) so that the entire F-Antenna is exposed with no motherboard ground or voltage plane beneath it. This is to allow best results transmitting and receiving with the radio.• With the 1323x-MRB oriented as shown in Figure 3-2, the IR blaster transmits to the right. Figure 3-2. 1323x-MRB Top Side (Component Side) Footprint2.01 in2.01 in0.45 in0.10 in0.49 in0.55 in

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-4 Freescale Semiconductor3.1.3 Board Level SpecificationsTable 3-1. 1323x-MRB SpecificationsParameter Units Notes/ConditionsMIN TYP MAXGeneralSize (PCB: X, Y) 51 x 512.01 x 2.01mminchesLayer build (PCB) 0.80.034mminches4-LayerDielectric material (PCB) FR4PowerVoltage supply (DC)With 3.3 V regulator in useNot using regulator with serial FLASH and IRNot using regulator with MC1323x only3.502.71.8163.63.6V Full module useNot regulated - using all featuresLower voltage usable only by MC1323xCurrent consumption TBD mATemperatureOperating temperature (see note) -20 +25 +70 °C • Operating temperature is limited to +70 °C due to switches. Basic circuit is good for a maximum temperature of +85 °C. • Operating temperature may also be further limited when used in conjunction with REM or RCM having a battery supplied voltage source. See Ta b l e 4 - 1 and Table 5-1.Storage temperature -30 +25 +70 °CIR TransmitterCurrent 63 mARange 10 mRF802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz bandRange (outdoor / line of sight) 300 Meter <1% PER for 20-byte packets (point-to-point in communications with 1323x Sensor Reference Board)RF Transmitter802.15.4 Output power -30 0 +3 dBm

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-53.2 Functional DescriptionThe 1323x-MRB is built around Freescale’s MC1323x 48-pin LGA IEEE 802.15.4 platform. Figure 3-2 shows a simple block diagram. This board is intended as a simple evaluation platform and as a building block for application development. The 4-layer board provides the MC1323x with its required RF circuitry, 32 Mhz reference oscillator crystal, and power supply bypassing. The layout for this base level functionality can be used as a reference layout by the user target board.In additional to the base MC1323x functionality, the 1323x-MRB provides features to assist in debug, an IR blaster, a 2 Mbit serial FLASH, reset button, simple power manager, and expansion connectors for the GPIO. In the following sections, refer to:•Figure 3-1 for location of connectors and features•Figure 3-3 for the functional blocks•Figure 3-11 for the board schematicHarmonics2nd harmonics3rd harmonics-38-35dBmdBmHarmonics are compliant to ETSI and FCC regulatory approval standardsRF Receiver802.15.4 sensitivity -93 dBm <1% PER for 20-byte packetsRegulatory ApprovalFCC Product is approved accordingly to the FCC part 15 standardCE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standardCE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standardsSafetyUL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standardsEnvironmentRoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003Table 3-1. 1323x-MRB Specifications (continued)Parameter Units Notes/Conditions

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-6 Freescale SemiconductorFigure 3-3. 1323x-MRB Block Diagram3.2.1 RF Performance and ConsiderationsThe MC1323x transceiver includes a low noise amplifier, 1mW nominal output power, PA with internal voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full spread-spectrum encoding and decoding.• Nominal output power is 0 dBm, with +3 dBm max• Typical sensitivity is -93 dBm• Frequency range is 2405 to 2480 MHz• Typical range (outdoors, line of sight) is 130 metersThe 1323x Modular Reference Board utilizes a minimum number of components while providing good RF performance:• Uses a minimum number of RF matching components and external 50:100 balun• “F” printed metal antenna for a small footprint, low cost designAn external 50 (unbal):100 (bal) balun connects a single-ended 50-Ω port to the differential RF port of the MC1323x radio. The layout has provision for out-of-band signal suppression (components L2 and C7) if required. Also note that control pin CT_Bias switches reference voltage to the balun as required for TX (CT_Bias = 1.5V) or RX (CT_Bias = ground).The default RF mode is use of the “F” antenna coupled through 10 pF C3 to the single-end RF port. An alternative mode is to connect an SMA RF connector (not provided; must be mounted). This is useful for connected measurements to test radio performance.NOTESee the MC1323x Data Sheet and Reference Manual for more RF design information.32 MHz 32.768KHzMC13233QFNBDMDebugPortCMTGPIOSPIIRBlasterLED2 MbitSerialFLASHResetButtonGPIOHeadersJ2 & J3OptionalSMAConnF-AntPowerManage-ment

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-7Figure 3-4. 1323x-MRB RF Circuitry3.2.2 ClocksThe MC1323x provides for two clocks:• 32 MHz Reference Oscillator - Figure 3-5 shows the external 32 MHz external crystal Y2. This mounted crystal must meet the MC1323x specifications. The IEEE 802.15.4 Standard requires that the frequency be accurate to less that +/-40 ppm.— Capacitors C10 and C11 provide the bulk of the crystal load capacitance. Onboard trim capacitors can be programmed to center the frequency. At 25°C, it is desired to have the frequency accurate to +/-10 ppm or less to allow for temperature variation.— To measure the 32 MHz oscillator frequency, signal PTD7/XTAL_32MOUT can optionally be programmed to provide a buffered output clock signal— The 1323x-MRB has provision for injecting an external 32 MHz clock source as an alternative to use of the onboard crystal:– The crystal Y2 should be removed– Resistors R23, R24, R19, and R20 must be mounted– C23 must be mounted– The external 32 MHz source is connected to 2-pin header J8; the frequency accuracy of the external source must meet the +/-40 ppm of the IEEE 802.15.4• Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal X2 (see Figure 3-6). This oscillator can be used for a low power accurate time base.— The module comes provided with this Y1 crystal and its load capacitors C4 and C15.— Load capacitors C4 and C15 provide the entire crystal load capacitance; there is no onboard trim capacitance.— The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R11 and R13 enable use of IO signals PTA0 and PTA1 via the IO connector and are supplied as mounted. These must be unmounted and moved to resistor sites R10 and R12 to enable the 32.768 kHz crystal and disable PTAO and PTA1.

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-8 Freescale SemiconductorFigure 3-5. 1323x-MRB 32 MHz Reference Oscillator CircuitFigure 3-6. 1323x-MRB 32.768 kHz Optional Oscillator Circuit3.3 Reset and BDM Debug PortThe reset circuit and BDM port connector are shown in Figure 3-7. See Figure 3-1 for switch and header locations.• Reset switch RST2 is active low and provides a hardware reset to the MC1323x• The 6-pin BDM 2x3 header J10 is provided to connect the MC1323x serial debug port to a standard HC9S08 debug module.Figure 3-7. 1323x-MRB Reset Switch and BDM Port32MHz XTALV_ICV_ICXTAL_32MEXTAL_32MC1012PFC1012PFC1112PFC1112PFR241KDNPR241KDNPR191KDNPR191KDNPR201KDNPR201KDNPY232MHZY232MHZ1 432C2310PFDNPC2310PFDNPJ8HDR 1X2J8HDR 1X212R231KDNPR231KDNP32kHz XTALMRB-PTA1MRB-PTA0PTA1/EXTAL_32KPTA0/XTAL_32KR13 0R13 0Y132.768KHZY132.768KHZ21C412PFC412PFR100DNPR100DNPR11 0R11 0R120DNPR120DNPC512PFC512PFRESETV_ICMRB-RSTbC11000pFC11000pFRST1SW_MOMRST1SW_MOM1234R115KR115KBDMV_ICBKGDMRB-RSTbBH1125BH1125TL1TL1 BH3125BH3125J4HDR 2X3J4HDR 2X31 23 465BH2125BH2125TL2TL2 BH4125BH4125TL3TL3

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-93.3.1 Power ManagementThe 1323x-MRB power management circuit is shown in Figure 3-8. Figure 3-8. 1323x-MRB Power Management CircuitPower to the 1323x-MRB can be configured in several ways and the circuit has the following features:• Board can be supplied through the IO headers (V_BRD)• Board can be supplied from an external DC supply (J5)— The external supply can be unregulated (V_UNREG) and make use of the onboard 3.3 V LDO regulator— The external supply voltage can be used directly without use of the LDO• 8-Pin 2x4 header J9 provides means to supply current to various board components and also measure current if desired• Green LED D1 is available as a power indicator.Table 3-2 shows the header configuration information for the various power supply modes.NOTE• The Freescale 1323x-RCM and 1323x-REM development boards generate the system power supply on the motherboard and supply the voltage to the 1323x-MRB through the V_BRD pin of Headers J2 and J3. In this mode, the current flows to the 1323x-MRB through the pins.• If an external supply is used via 1323x-MRB header J5, current flows to the motherboard through the V_BRD pin of Headers J2 and J3. THE MOTHERBOARD SUPPLY SHOULD NOT BE USED.• In all modes, the IO voltage supply of peripherals on a motherboard must be the same voltage as V_BRD, which is also the voltage applied to the IC MC1323x.POWER ON3.3V LDO REGULATORJ6:»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V»SHUNT 3->2 ONLY IF V_EXT = 3V»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTEDJ5: EXTERNAL SUPPLYPOWER MANAGEMENTVDDV_LEDV_EXTV_LDOV_UNREGV_LEDV_MEMV_BRDV_ICV_UNREGTP3TP3TP6TP6D1GREEND1GREENACTP13TP13C121UFC121UFTP2TP2TP5TP5C132.2UFC132.2UFTP12TP12J6HDR TH 1X3J6HDR TH 1X3123TP1TP1J9HDR_2X4J9HDR_2X41 23 4657 8TP4TP4R7330R7330D4MBR0520LT1GD4MBR0520LT1G2 1U3LP2985AIM5-3.3U3LP2985AIM5-3.3VIN1GND2ON/OFF3BYP4VOUT 5R4 0R4 0C140.01UFC140.01UFD3MBR0520LT1GD3MBR0520LT1G2 1J5HDR 1X2J5HDR 1X212

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-10 Freescale SemiconductorHeader J9 provides means to disable different sub-circuits or measure current and connections are described in Table 3-3. Current measurements can be made by inserting a current meter in place of a designated jumper.Table 3-2. 1323x-MRB Power ConfigurationsMode VoltageRangeExternal SourceJ5Ext Mode SelectJ6Current EnableJ9 DescriptionSource V_BRD 2.7 - 3.6 V11The MC1323x can run as low as 1.8 V, however, the serial FLASH and IR blaster require 2.7 V or greaterNot used Not used - all pins openShort Pins 3-4 -short other desired suppliesNormal Operation - The 1323x-MRB main supply is supplied by the motherboard through the J2 and J3 HeadersExternal Source - Using LDO3.5 - 16 V Connected - suppliesDC VoltageShort Pins 1-2 Short pins for all desired suppliesExternal voltage w/regulation - • Input range is set by the LDO regulator. • 3.3 V is supplied to 1323x-MRB; do not use motherboard supply • J2 and J3 Headers supply voltage to V_BRD pins when J9, Pins 3-4 are shortedExternal Source - Not Using LDO2.7 - 3.6 V1Connected - suppliesDC VoltageShort Pins 2-3 Short pins for all desired suppliesExternal voltage w/o regulation - • Input range is set by the onboard circuitry • 2.7 - 3.3 V is supplied to 1323x-MRB • J2 and J3 Headers supply voltage to V_BRD pinsTable 3-3. Power Distribution Header J9SupplyDesignationHeaderPins DescriptionV_MEM 1 - 2 Supply voltage to serial FLASH memory - • Jumper pins to supply memory. • If memory is not powered, it can load MC1323x SPI portV_BRD 3 - 4 Supply voltage connected to IO Connectors J2 and J3 - • This supplies J2 and J3 if an external MRB supply is used • This voltage supplies the MRB if the motherboard is the main power • This connection is normally always jumperedV_IC 5 - 6 Supply voltage to MC1323x - • Normally jumpered • Supplies only the MC1323x IC • Normally always same voltage as V_BRDV_LED 7 - 8 Supply voltage to power indicator LED and IR blaster LED - • Jumper to use indicator or IR blaster • Leave open for lowest power

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-113.3.2 IO Connectors J2 and J3The two IO connectors J2 and J3 are standard 100 mil pin headers mounted on the back (non-component side) of the 1323x-MRB. The primary header J2 is 20-pin and the secondary header J3 is 18-pin, and they are mounted physically in such a manner as to prevent reverse insertion of the 1323x-MRB into a motherboard receptacle (see Figure 3-2). When the 1323x-RCM or 1323x-REM or custom motherboard is plugged into these connectors, they allow access to MC1323x MCU GPIO.• V_BRD is the connector supply voltage.— Depending on power supply configuration, this voltage may supply the 1323x-MRB from the motherboard or the 1323x-MRB may supply this voltage to the motherboard. See Section 3.3.1, “Power Management”.— Peripherals IO to the MC1323x and the MC1323x supply should use this same voltageNOTEThe 1323x-RCM and 1323x-REM and 1323x-MRB are supplied configured for the motherboard to supply main power.• Some of the GPIO are shared with onboard devices. Check for the 1323x-MRB schematic and Table 3-4 and Table 3-5 for any conflict.• BDM port signal PTA7/BKGD is NOT connected to the IO headers to prevent possible interference with the debug port.Table 3-4. 20 Pin ConnectorHeader Pin Number MC1323x Pin Name Description1 V_BRD VDD supply to module2 PTC5/SS SPI Bus Slave Select (SS) - shared with serial FLASH3 GND Module ground4 PTC7/MOSI SPI Bus MOSI signal - shared with serial FLASH5 PTD5/RXD UART RXD input to MCU6 PTC6/MISO SPI Bus MISO signal - shared with serial FLASH7 PTD6/TXD UART TXD Output from MCU8 PTC4/SPICLK SPI Clock (SPISCK) - shared with serial FLASH9 PTD0/TPM0 GPIO / Timer IO10 RESET Reset11 PTA5/SDA I2C Bus data signal (SDA)12 PTB7/KBI1P7 UART flow control RTS input into MCU (implemented in Freescale software)13 PTA6/SCL I2C Bus clock signal (SCL)14 PTD2/TPM2 UART flow control CTS output from MCU (implemented in Freescale software)15 GND Module ground16 PTD7/XTAL_32MOUT Port D Bit 7

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-12 Freescale Semiconductor17 PTB0/KBI1P0 Port B Bit 0 / KBI1 Input Bit 018 PTB1/KBI1P1 Port B Bit 1 / KBI1 Input Bit 119 PTB2/KBI1P2 Port B Bit 2 / KBI1 Input Bit 220 PTB3/KBI1P3 Port B Bit 3 / KBI1 Input Bit 3Table 3-5. 18 Pin ConnectorHeader Pin Number MC1323x Pin Name Description1 V_BRD VDD supply to module2 PTA1/EXTAL_32K Port A Bit 1 - signal shared with 32.768 kHz oscillator3 PTA0/XTAL_32K Port A Bit 0 - signal shared with 32.768 kHz oscillator4 GND Module Ground5 PTA2 Port A Bit 2 - MC1323x test mode enable; SPECIAL SIGNAL REFER TO MC1323x Reference Manual6 PTA3/IRQ Port A Bit 3 / IRQ (active low)7 PTA4/XTAL_32KOUT Port A Bit 4 / optional buffered 32.768 kHz clock output8 PTB4/KBI1P4 Port B Bit 4 / KBI1 Input Bit 49 PTB5/KBI1P5 Port B Bit 5 / KBI1 Input Bit 510 PTB6/KBI1P6 Port B Bit 6 / KBI1 Input Bit 611 PTC0/KBI2P0 Port C Bit 0 / KBI2 Input Bit 012 PTC1/KBI2P1 Port C Bit 1 / KBI2 Input Bit 113 PTC2/KBI2P2 Port C Bit 2 / KBI2 Input Bit 214 PTC3/KBI2P3 Port C Bit 3 / KBI2 Input Bit 315 PTD1/TPM1 Port D Bit 1/ TPM116 PTD3/TPM3 Port D Bit 3/ TPM317 PTD4/CMT Port D Bit 4/ CMT output - signal shared with IR blaster18 GND Module ground Table 3-4. 20 Pin ConnectorHeader Pin Number MC1323x Pin Name Description

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-133.3.3 1323x-MRB Onboard Peripheral FunctionsThe 1323x-MRB has two onboard peripheral functions to assist in implementing targeted applications.NOTETo use the peripherals, a minimum power supply voltage of 2.7 V must be maintained.3.3.3.1 2 Mbit Serial FLASH (SPI Interface)Component U2 is an Atmel AT45DB021D 2 Mbit (256 kbyte) serial FLASH memory with SPI interface. The memory is useful for over-the-air programming (OTAP) and for storage of non-volatile system data or parameters. Figure 3-9 shows the memory circuit.• Memory power supply is V_MEM (Header J9, Pin 1-2)• Disabling the memory supply V_MEM may load the MC1323x SPI port through the U2 ESD diodes• Discrete pullup resistors for the SPI port are provided• The SPI can be shared with another peripheral - an additional IO signal would be required as a chip enable (CS or SS) for the peripheral. The normal SPI_SS and the second chip select should NOT be active at the same time.Figure 3-9. AT45DB021D 2 Mbit (256 kbyte) Serial FLASH memory2MBit (256KB) FLASHV_MEMV_MEM V_MEMV_MEMMRB-SPI_MISOMRB-SPI_MOSIMRB-SPI_CLKMRB-SPI_SSR2110KR2110KR1810KR1810KU2AT45DB021DU2AT45DB021DSCK2VCC 6WP 5RESET3GND 7CS4SI1SO 8R1710KR1710KR2210KR2210K

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-14 Freescale Semiconductor3.3.3.2 IR Transmitter (Blaster)An IR transmitter or blaster is provided to control IR legacy components (see Figure 3-10).• The IR power supply is V_LED (Header J9, Pin 7-8)• The IR transmitter has approximately a 10 meter range.• Current draw is approximately 80 mA when active.• To reduce the peak current consumption, it is recommended that the IR transmitter only be active when the MC1323x RF transceiver is in-active. • When using the blaster in an application, observe proper orientation (see Figure 3-2)Figure 3-10. IR Transmitter CircuitINFRARED LEDV_LEDMRB-PTD4/CMTR218.2R218.2TP9TP9D2VSLB3940D2VSLB3940ACR927KR927KR61.5KR61.5KTP8TP8Q1MMBT3904LT1GQ1MMBT3904LT1G2 31TP7TP7

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-15 3.4 Schematic, Board Layout, and Bill of MaterialFigure 3-11. 1323x-MRB Schematic5544332211D DC CB BA ARESET20-PIN GPIOSTANDARD HEADERGPIOPOWER ON3.3V LDO REGULATORINFRARED LED2MBit (256KB) FLASHBDMJ6:»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V»SHUNT 3->2 ONLY IF V_EXT = 3V»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTEDHARMONIC TRAPJ5: EXTERNAL SUPPLYPOWER MANAGEMENT GPIO MAPPING32MHz XTAL32kHz XTALC8 & C28 PLACECLOSE TO U1.39C18 & C26 PLACECLOSE TO U1.47RF_SMARF_NZ_RF_PZ_RF_NRF_ANTRF_PMRB-PTA2/LCD_CTL0RF_50V_ICVDDV_ICV_LEDV_LEDV_ICV_MEMV_EXT V_BRDV_BRDV_LDOV_UNREGV_IC V_ICV_MEMV_ICV_MEMV_ICV_ICV_LEDV_MEMV_BRDV_ICV_MEMV_ICV_UNREGMRB-RSTbXTAL_32MBKGDMRB-RSTbMRB-SPI_MISOMRB-SPI_MOSIMRB-SPI_CLKMRB-SPI_SSMRB-PTA1MRB-PTA0PTA1/EXTAL_32KPTA0/XTAL_32KRF_BIASRF_BIASMRB-KBI2P3MRB-KBI2P2PTA0/XTAL_32KMRB-KBI2P1MRB-KBI2P0BKGDMRB-I2C_SDAMRB-RSTbMRB-PTA4/32K_OUTMRB-SPI_CLKMRB-SPI_MOSIMRB-I2C_SCLMRB-PTA2/LCD_CTL0MRB-SPI_MISOMRB-SPI_SSPTA1/EXTAL_32KMRB-PTA3/IRQbMRB-KBI1P0MRB-KBI1P1MRB-KBI1P2MRB-KBI1P3MRB-KBI1P4MRB-KBI1P5MRB-KBI1P6MRB-UART_RTS/KBI1P7MRB-PTD4/CMTEXTAL_32MXTAL_32MMRB-PTD1/TPM1MRB-UART_CTS/TPM2MRB-PTD7MRB-UART_TXDMRB-UART_RXDMRB-PTD3/TPM3MRB-TPM0EXTAL_32MMRB-I2C_SCLMRB-SPI_MOSIMRB-SPI_SSMRB-I2C_SDAMRB-UART_RXDMRB-UART_TXDMRB-UART_CTS/TPM2MRB-UART_RTS/KBI1P7MRB-KBI1P2MRB-KBI1P0MRB-TPM0 MRB-RSTbMRB-PTD7MRB-SPI_CLKMRB-KBI1P1MRB-KBI1P3MRB-SPI_MISOMRB-PTD4/CMTMRB-KBI1P5MRB-PTA4/32K_OUTMRB-KBI2P0MRB-KBI1P4MRB-KBI1P6MRB-KBI2P1MRB-KBI2P3MRB-PTA3/IRQbMRB-KBI2P2MRB-PTA1MRB-PTD1/TPM1MRB-PTA0MRB-PTA2/LCD_CTL0MRB-PTD3/TPM3MRB-PTD4/CMTDrawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SCH-26115 PDF: SPF-26115 E41323X MODULAR REFERENCE BOARDCThursday, February 10, 2011MAIN SCHEMATIC33X ______Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SCH-26115 PDF: SPF-26115 E41323X MODULAR REFERENCE BOARDCThursday, February 10, 2011MAIN SCHEMATIC33X ______Drawing Title:Size Document Number RevDate: Sheet ofPage Title:ICAP Classification: FCP: FIUO: PUBI:SCH-26115 PDF: SPF-26115 E41323X MODULAR REFERENCE BOARDCThursday, February 10, 2011MAIN SCHEMATIC33X ______C1012PFC1012PFBH1125BH1125TP14TP14C71PFC71PFL10.0033UHL10.0033UH12TL1TL1TP3TP3BH3125BH3125R218.2R218.2C268.2PFC268.2PFC11000pFC11000pFR13 0R13 0C258.2PFC258.2PFC220.22UFC220.22UFC1112PFC1112PFC310PFC310PFY132.768KHZY132.768KHZ21U1MC1323XU1MC1323XPTA0/XTAL_32K1PTA1/EXTAL_32K2RESET3PTA24PTA3/IRQ5PTA4/XTAL_32K_OUT6PTA5/SDA7PTA6/SCL8PTA7/BKGD/MS9PTB0/KBI1P010PTB1/KBI1P111PTB2/KBI1P212PTB3/KBI1P313PTB4/KBI1P414PTB5/KBI1P515PTB6/KBI1P616PTB7/KBI1P717PTC0/KBI2P018PTC1/KBI2P120PTC2/KBI2P221PTC3/KBI2P322PTC4/SPICLK23PTC5/SS24PTC6/MISO25PTC7/MOSI26PTD0/TPM0 27PTD1/TPM1 28PTD2/TPM2 29PTD3/TPM3 30PTD4/CMT 31PTD5/TXD 32PTD6/RXD 33PTD7/XTAL_32M_OUT 34XTAL_32M 35EXTAL_32M 36RF_P 42RF_N 41NC 40NC/TINJ_N 45RF_BIAS/TINJ_P 43PAD 49VBATT_1 48VBATT_2 44VBATT_3 37VBATT_4 19VREG_VCO 38VDD_ANA 39VREG_LO2 46VREG_ANA 47TP10TP10TP6TP6D1GREEND1GREENACR25 0R25 0R2110KR2110KJ4HDR 2X3J4HDR 2X31 23 465C610PFC610PFJ2HDR_10X2J2HDR_10X21 23 4657 891011 1213 1415 1617 1819 20TP13TP13TP9TP9C412PFC412PFC1710PFDNPC1710PFDNPC180.22UFC180.22UFD2VSLB3940D2VSLB3940ACC121UFC121UFTP2TP2 BH2125BH2125RST1SW_MOMRST1SW_MOM1234R1510KR1510KR241KDNPR241KDNPR927KR927KTP16TP16R115KR115KL20.0039UHDNPL20.0039UHDNP12R191KDNPR191KDNPR201KDNPR201KDNPTP5TP5Y232MHZY232MHZ1 432C2310PFDNPC2310PFDNPR100DNPR100DNPR11 0R11 0R61.5KR61.5KR1410KR1410KTL2TL2C80.22UFC80.22UFC132.2UFC132.2UFJ1SMA_EDGEJ1SMA_EDGE1G1 G3G2 G4TP12TP12TP8TP8R1810KR1810KJ6HDR TH 1X3J6HDR TH 1X3123TP1TP1C160.1UFC160.1UFC200.01UFC200.01UFC210PFDNPC210PFDNPR26 0R26 0BH4125BH4125TP15TP15R120DNPR120DNPANT1F_AntennaANT1F_AntennaU2AT45DB021DU2AT45DB021DSCK2VCC 6WP 5RESET3GND 7CS4SI1SO 8Q1MMBT3904LT1GQ1MMBT3904LT1G2 31Z150/100 OHMSZ150/100 OHMS516234R1610KR1610KR1710KR1710KJ9HDR_2X4J9HDR_2X41 23 4657 8TP4TP4C512PFC512PFR7330R7330D4MBR0520LT1GD4MBR0520LT1G2 1C1510UFC1510UFJ8HDR 1X2J8HDR 1X212U3LP2985AIM5-3.3U3LP2985AIM5-3.3VIN1GND2ON/OFF3BYP4VOUT 5TL3TL3TP11TP11TP7TP7C90.22UFC90.22UFJ3HDR 2X9J3HDR 2X91 23 4657 891011 1213 1415 1617 18R4 0R4 0R231KDNPR231KDNPC140.01UFC140.01UFR2210KR2210KD3MBR0520LT1GD3MBR0520LT1G2 1J5HDR 1X2J5HDR 1X212

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-16 Freescale SemiconductorFigure 3-12. Modular Reference Board PCB Component Location (Top View)Figure 3-13. Modular Reference Board PCB Test Points

1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-17Figure 3-14. Modular Reference Board PCB Layout (Top View)Figure 3-15. Modular Reference Board PCB Layout (Bottom View)

$1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 3-18 Freescale Semiconductor3.4.1 Bill of MaterialsTable 3-6. Bill of MaterialsItem Qty Reference Value Description Mfg Name Mfg Part Number1 1 ANT1 F_Antenna PCB F ANTENNA, NO PART ORDERNot A Part NOT A PART2 4 BH1,BH2,BH3,BH4125 NON-PLATED MOUNTING HOLE 125 DRILL / 160 KEEPOUT NO PART TO ORDER3 1 C1 1000pF CAP CER 1000PF 50V 5% C0G 0402Murata GRM1555C1H102JA01D4 3 C2,C17,C23 (No Not {Place)10PF CAP CER 10PF 50V 5% C0G 0402Murata GJM1555C1H100JB015 2 C3,C6 10PF CAP CER 10PF 50V 5% C0G 0402Murata GJM1555C1H100JB016 4 C4,C5,C10,C1112PF CAP CER 12PF 50V 5% C0G 0402Murata GRM1555C1H120JZ01D7 1 C7 1PF CAP CER 1.0PF 50V +/-0.25PF C0G 0402Murata GJM1555C1H1R0CB01D8 4 C8,C9,C18,C220.22UF CAP CER 0.22UF 10V 10% X5R 0402Murata GRM155R61A224KE19B9 1 C12 1UF CAP CER 1.0UF 10V 10% X7R 0603Murata GRM188R71A105KA61D10 1 C13 2.2UF CAP CER 2.2UF 10V 10% X7R 0603Murata GRM188R71A225KE15D11 2 C14,C20 0.01UF CAP CER 0.01UF 50V 10% X7R 0402Murata GCM155R71H103KA55D12 1 C15 10UF CAP CER 10UF 10V 10% X5R 0805Murata GRM21BR61A106KE19_13 1 C16 0.1UF CAP CER 0.1UF 16V 10% X7R 0402Tdk C1005X7R1C104KT14 2 C25,C26 8.2PF CAP CER 8.2PF 50V 0.25PF C0G 0402Avx 04025A8R2CAT2A15 1 D1 GREEN LED GRN SGL 30MA SMT 0805Lite On LTST-C171KGKT16 1 D2 VSLB3940 LED IR SGL 100MA RA TH Vishay IntertechnologyVSLB394017 2 D3,D4 MBR0520LT1G DIODE SCH 0.5A 20V SOD-123On SemiconductorMBR0520LT1G18 1 J1 SMA_EDGE CON 1 SKT SMA EDGE 34MIL BOARD SMT 50 OHM -- 171H AU 104LJohnson Components Inc142-0701-881$

$1323x-Modular Reference Board1323x Development Hardware Reference Manual, Rev. 1.0 Freescale Semiconductor 3-1919 1 J2 HDR_10X2 HDR 2X10 TH 100MIL CTR 330H AU 100LSamtec TSW-110-07-S-D20 1 J3 HDR 2X9 HDR 2X9 TH 100MIL CTR 330H AUSamtec TSW-109-07-S-D21 1 J4 HDR 2X3 HDR 2X3 TH 100MIL CTR 335H AU 95LSamtec TSW-103-07-S-D22 2 J5,J8 HDR 1X2 HDR 1X2 TH 100MIL SP 330H SN 115LSamtec TSW-102-07-T-S23 1 J6 HDR TH 1X3 HDR 1X3 TH 100MIL SP 339H AU 100LSamtec TSW-103-07-G-S24 1 J9 HDR_2X4 HDR 2X4 TH 100MIL CTR 330H AU 100LSamtec TSW-104-07-S-D25 1 L1 0.0033UH IND -- 0.0027UH@100MHZ 300MA +/-0.3NH 0402Murata LQG15HS2N7S02D26 1 L2(No Not {Place)0.0039UH IND -- 0.0039UH@100MHZ 300MA +/-0.3NH 0402Murata LQG15HN3N9S02D27 1 Q1 MMBT3904LT1G TRAN NPN GEN 200MA 40V SOT-23On SemiconductorMMBT3904LT1G28 1 RST1 SW_MOM SW SPST MOM PB 50MA 12V SMTAlps Electric (Usa) Inc.SKQYPDE01029 1 R1 15K RES MF 15K 1/16W 5% 0402 Vishay IntertechnologyCRCW040215K0JNED30 1 R2 18.2 RES MF 18.2 OHM 1/4W 1% 0805Rohm ESR10EZPF18R231 5 R4,R11,R13,R25,R260 RES MF ZERO OHM 1/16W 5% 0402Rohm MCR01MZPJ00032 1 R6 1.5K RES MF 1.5K 1/16W 5% 0402 Vishay IntertechnologyCRCW04021K50JNED33 1 R7 330 RES MF 330 OHM 1/16W 5% 0402Vishay IntertechnologyCRCW0402330RJNED34 1 R9 27K RES MF 27K 1/16W 5% 0402 Vishay IntertechnologyCRCW040227K0JNED35 2 R10,R12(No Not {Place)0 RES MF ZERO OHM 1/16W 5% 0402Rohm MCR01MZPJ00036 7 R14,R15,R16,R17,R18,R21,R2210K RES MF 10K 1/16W 5% 0402 Vishay IntertechnologyCRCW040210K0JNED37 4 R19,R20,R23,R24(No Not {Place)1K RES MF 1.0K 1/16W 5% 0402 Vishay IntertechnologyCRCW04021K00JNED38 3 TL1,TL2,TL3 TESTLOOP TEST POINT PAD SIZE 3.4MM X 1.8MM SMTKeystone Electronics5015Table 3-6. Bill of Materials$

Freescale Semiconductor 1323X-MRB Developer Board User Manual 1323xDHRM

Freescale Semiconductor, Inc. Developer Board 1323xDHRM

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