Freescale Semiconductor 1323X-MRB Developer Board User Manual 1323xDHRM
Freescale Semiconductor, Inc. Developer Board 1323xDHRM
Contents
- 1. User Manual 1
- 2. User Manual 2
User Manual 1
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1323x Development Hardware
Reference Manual
Document Number: 1323xDHRM
Rev. 1.0
04/2011
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Contents
About This Book
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
Chapter 1
Safety Information
1.1
1.1.1
1.1.2
1.1.3
1.1.4
1.2
1.2.1
1.3
1.4
FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-1
1-1
1-1
1-1
1-2
1-2
1-2
1-2
Chapter 2
MC1323x Development Platform Overview and Description
2.1
2.2
2.3
2.4
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Driver Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-2
2-5
2-5
Chapter 3
1323x-Modular Reference Board
3.1
1323x-MRB Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.2
Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.1.3
Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.2.1
RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.2.2
Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.3
Reset and BDM Debug Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.1
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.3.2
IO Connectors J2 and J3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.3.3
1323x-MRB Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
3.4
Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
3.4.1
Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Chapter 4
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
1323x Remote Control Motherboard
4.1
1323x-RCM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1.2
Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.1.3
Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.1
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.2
GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.3
1323x-RCM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
4.3
Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.3.1
1323x-RCM Bill of Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
Chapter 5
1323x Remote Extender Motherboard
5.1
5.1.1
5.1.2
5.1.3
5.2
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.3
5.3.1
1323x-REM Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
GPIO Connection to 1323x-MRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7
1323x-REM Onboard Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
IR Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Pushbutton 2x4 Switch Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
Blue Indicator LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
1323x-REM Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
Chapter 6
PCB Manufacturing Specifications
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6-1
6-3
6-3
6-3
6-4
6-4
6-4
6-4
6-4
1323x Development Hardware Reference Manual, Rev. 1.0
ii
Freescale Semiconductor
About This Book
This manual describes Freescale’s MC1323x development platform hardware. The MC1323x
development platform is an IEEE 802.15.4 compliant evaluation environment based on the Freescale
MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip (SoC) for
the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency
transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin
LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive
applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer
(RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes.
Audience
This manual is intended for system designers.
Organization
This document is organized into 6 chapters.
Chapter 1
Safety Information — Highlights some of the FCC requirements.
Chapter 2
HCS08 Development Platform Overview and Description — Provides an
overview of the three boards that comprise the MC1323x development platform.
Chapter 3
Modular Reference Board — This chapter details the 1323x-MRB which is an
IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1323x
device.
Chapter 4
1323x-Remote Control Module — This chapter details the 1323x-RCM
motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB)
plug-in module (daughter card) and supplies a power supply and a rich set of
interface peripherals.
Chapter 5
1323x-Remote Extender Board — This chapter details the 1323x REM
motherboard that accepts the 1323x-Modular Reference Board (1323x-MRB)
plug-in module (daughter card) and supplies a power supply and set of interface
peripherals.
Chapter 6
PCB Manufacturing Specifications — This chapter provides the specifications
used to manufacture the various MC1323x printed circuit boards (PCBs).
Revision History
The following table summarizes revisions to this document since the previous release (Rev 0.0).
Revision History
Location
Entire document
Revision
Edited Chapter 1, Table 3-1, Table 4-1, Table 5-1, Section 4.2.1 and Section 5.2.1.
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
iii
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document.
ADC
Analog to Digital Converter
AES
Advanced Encryption Standard
ARM
Advanced RISC Machine
CTS
Clear to Send
DAC
Digital to Analog Converter
DMA
Direct Memory Access
I2C
Inter-Integrated Circuit is a multi-master serial computer bus
ISM
Industrial Scientific Medical 2.4 GHz radio frequency band
JTAG
Joint Test Action Group
LGA
Land Grid Array
MAC
Media Access Controller
MCU
Microcontroller Unit
NEXUS
An embedded processor development tool interface that helps design engineers
identify software and hardware-level issues.
PCB
Printed circuit board
PiP
Platform in Package
PWM
Pulse-width modulation
RCM
Remote Control Module
REM
Remote Extender Board
RTS
Request to Send
SMA Connector
SubMiniature version “A” connector
SPI
Serial Peripheral Interface
SSI
Synchronous Serial Interface
TACT Switch
A switch that provides a slight “snap” or “click” to the user to indicate function.
TELCO
Telephone Company
USB
Universal Serial Bus
VCP
Virtual Com Port
1323x Development Hardware Reference Manual, Rev. 1.0
iv
Freescale Semiconductor
Chapter 1
Safety Information
1.1
FCC Guidelines
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
1.1.1
Labeling
FCC labels are physically located on the back of the board.
1.1.2
Operating Conditions
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation.
1.1.3
Exposure Limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20cm) from all persons.
1.1.4
Antenna Restrictions
An intentional radiator shall be designed to ensure that no antenna other than that furnished by the
responsible party shall be used with the device. The use of a permanently attached antenna or of an
antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with
the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be
replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This
requirement does not apply to carrier current devices or to devices operated under the provisions of
Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
1-1
Safety Information
radiators that must be professionally installed, such as perimeter protection systems and some field
disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be
measured at the installation site. However, the installer shall be responsible for ensuring that the proper
antenna is employed so that the limits in this Part are not exceeded.
1.2
Regulatory Approval For Canada (IC RSS 210)
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired
operation of the device.
1.2.1
26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
1.3
Electrostatic Discharge Considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps
• Static control workstations, static control monitors and table or floor static control systems
• Static control packaging and transportation materials and environmental systems
1.4
Disposal Instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
www.freescale.com/productdisposal.
1323x Development Hardware Reference Manual, Rev. 1.0
1-2
Freescale Semiconductor
Chapter 2
MC1323x Development Platform Overview and Description
2.1
Introduction
The MC1323x development platform is an IEEE 802.15.4 compliant evaluation environment based on the
Freescale MC1323x device. The heart of the MC1323x platform is Freescale’s low cost System-on-Chip
(SoC) for the IEEE® 802.15.4 Standard that incorporates a complete, low power, 2.4 GHz radio frequency
transceiver with Tx/Rx switch, an 8-bit HCS08 CPU, and a functional set of MCU peripherals into a 48-pin
LGA package. This family of products is targeted for wireless RF remote control and other cost-sensitive
applications ranging from home TV and entertainment systems such as ZigBee BeeStack Consumer
(RF4CE) to low cost, low power, IEEE 802.15.4 and ZigBee end nodes.
The MC1323x development platform is comprised of three boards:
• 1323x-Modular Reference Board (1323x-MRB) - this board contains the MC1323x device with 32
MHz reference oscillator crystal, RF circuitry including antenna, and supporting circuitry. The
board can be used as a simple standalone evaluation platform or as a daughter card to the other
MC1323x development platform boards or to a custom, application specific motherboard. See
Chapter 3, “1323x-Modular Reference Board” for detailed information.
— Provides compact reference design for device footprint and RF layout
— Provides pre-designed MC1323x hardware (device and function)
— Provides access to the MC1323x full set of GPIO
— Provides MCU BDM debug port
— Provides optional local 2 Mbit serial FLASH, 32.768 kHz oscillator crystal, IR “blaster” LED
and power management.
• 1323x-Remote Control Motherboard (1323x-RCM) - this board accepts the 1323x-MRB as a
plug-in module (daughter card) and supplies a variety of peripheral functions to the MC1323x
through the IO connectors. The peripheral functions are targeted primarily to a consumer TV or
entertainment remote control application. See Chapter 4, “1323x Remote Control Motherboard”
for detailed information.
— Provides 36-switch matrix for remote control pushbuttons
— USB <> serial interface for communication to a PC and provides board power
— Touchpad for user interface
— Onboard 128 x 32 pixel graphic LCD for menus and host feedback - a unique feature to
RF-based remote controls
— Accelerometer for motion detection and game play
• 1323x-Remote Extender Motherboard (1323x-REM) - this board also accepts the 1323x-MRB
plug-in module (daughter card) and supplies a very simple set of peripheral functionality. See
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
2-1
MC1323x Development Platform Overview and Description
Chapter 5, “1323x Remote Extender Motherboard” for detailed information. A small 8-switch
matrix, IR receiver, and USB interface provides means for communication to the MC1323x for:
— Simple keypad-only applications
— Connection to a PC
— Host connection such as for a remote control extender or remote control receiver
Whether the 1323x-MRB is used in a simple standalone application or in combination with another host
card, Freescale provides a complete software development environment called the Freescale BeeKit
Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking
libraries, application templates, and sample applications. The BeeKit Graphical User Interface (GUI)
allows users to create, modify, and update various wireless networking implementations. A wide range of
software functionality is available to complement the 1323x-MRB and these are provided as codebases
within BeeKit.
2.2
Features
The MC1323x development platform is built around the concept of having a single daughter card
(1323x-MRB) that contains the MC1323x IC and all necessary I/O connections for use as a self-contained
module or for connection to an application motherboard. Figure 2-1 shows a simplified block diagram of
the more powerful Freescale configuration of the 1323x-MRB combined with the 1323x-RCM.
DC Supply
2xAA Battery
VDD
Power
ManageV_LCD
ment
BDM
Debug
Port
IR
Blaster
USB
USB
Conn
USB
Interface
FT232RQ
UART
SPI
MC13233
QFN
IIC
PCB
F-Antenna
GPIO
2 Mbit
Serial
FLASH
6x6
Switch
Matrix
32 MHz
3-Axis
Accelerometer
128x32
Graphic
LCD
32.768
KHz
Buzzer
Touchpad
4 LED
Indicators
Figure 2-1. Simplified RCM+MRB Block Diagram
Figure 2-2 shows a photo of the combined boards with the 1323x-MRB mounted on the 1323x-RCM.
1323x Development Hardware Reference Manual, Rev. 1.0
2-2
Freescale Semiconductor
MC1323x Development Platform Overview and Description
Figure 2-2. 1323x-MRB Mounted on the 1323x-RCM
Features of the MC1323x development platform include:
• Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software
stack
• Based on Freescale’s low-cost MC1323x IEEE® 802.15.4 SoC platform which incorporates a
complete, low power, 2.4 GHz radio frequency transceiver with Tx/Rx switch, an 8-bit HCS08
CPU, and a functional set of MCU peripherals into a 48-pin LGA package
• Reference design area with small footprint, low cost RF node
— Integrated transmit/receive switch
— Differential input/output port (typically used with a balun)
— Low external component count
— Programmable output power with 0 dBm nominal output power, programmable from -30 dBm
to +3 dBm typical
— Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet, much better than the IEEE
802.15.4 Standard of -85 dBm
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
2-3
MC1323x Development Platform Overview and Description
•
•
•
•
•
•
•
•
•
•
— Onboard printed metal F-Antenna
32 MHz reference oscillator
BDM serial MCU debug port
Optional secondary 32.768 kHz crystal oscillator for accurate low power timing
IR blaster
2 Mbit serial FLASH (uses SPI interface)
Master reset switch
Full power regulation and management
1323x-MRB board provides
— Required circuitry for MC13233 - crystals and RF circuitry including F-Antenna and optional
SMA connector
— Local power supply regulation
— Access to all GPIO
— Standalone or daughter card use models
— Serial FLASH, IR blaster, and BDM functions
1323x-RCM when used with 1323x-MRB provides
— USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB
2.0 and 1.1 specifications
— Power supply source from two AA batteries, USB connector, or DC source
— 128x32 pixel graphic LCD
— 3-axis Accelerometer (uses IIC interface)
— Touch pad interface with interrupt capability (uses IIC interface)
— 6x6 Switch matrix
— Single tone buzzer
— 4 Blue LED indicators
1323x-REM when used with 1323x-MRB provides
— USB to UART serial interface that is USB bus-powered and full-speed compatible to the USB
2.0 and 1.1 specifications
— Power supply source from two AA batteries, USB connector, or DC source
— IR receiver
— 4x2 Switch matrix
— 4 Blue LED indicators
1323x Development Hardware Reference Manual, Rev. 1.0
2-4
Freescale Semiconductor
MC1323x Development Platform Overview and Description
2.3
Driver Considerations
When users first connect a 1323x-RCM or 1323x-REM based platform to a PC, they may be prompted to
install drivers. If BeeKit is installed and this occurs, do not allow Windows to automatically search for and
install the drivers. Instead, select manual installation and steer Windows to the following directory:
C:\Program Files\Freescale\Drivers
If installing the BeeKit software package to another drive or directory, indicate the Drivers directory
created by the installer in the custom location where BeeKit was installed.
Follow the instructions as they appear on the screen to complete driver installation.
If BeeKit is not installed, be aware of the following:
• The boards use the FTDI serial to USB converter, Virtual COM Port (VCP) driver for Windows,
available at www.ftdichip.com/ftdrivers.htm.
(Direct (D2XX) drivers are also available.)
• The FTDI web site offers drivers for other platforms including Windows® (98 through Vista x64
and CE), MAC OS (8 through X) and Linux.
• Download the appropriate driver and follow the instructions to complete driver installation.
2.4
General System Specifications
Table 2-1. MC1323x Platform Specifications
Parameter
Units
Notes/Conditions
MIN
TYP
MAX
Voltage supply (DC)
2.5
When using REM or RCM
Voltage supply (USB)
4.4
5.25
USB 2.0/1.1 standard specification
2.8
3.2
-20
+25
+70
°C
Operating temperature is limited to +70 °C due to
switches. Basic circuit is good for a maximum
temperature of +85 °C.
+25
+50
°C
Operating temperature is limited by battery
temperature range
-30
+25
+70
°C
Power
Voltage supply (Batteries)
Temperature
Operating temperature; non-battery
operation (see note)
Operating temperature; battery
operation (see note)
Storage temperature
USB interface
USB 2.0 and 1.1 full-speed compatible
RF (1323x-MRB)
802.15.4 Frequency range
Range (outdoor / line of sight)
2405
2480
300
MHz All 16 channels in the 2450 MHz band
Meter <1% PER for 20-byte packets (point-to-point in
communications with 1322X Sensor Reference
Board)
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
2-5
MC1323x Development Platform Overview and Description
Table 2-1. MC1323x Platform Specifications
Parameter
Units
Notes/Conditions
RF Transmitter
802.15.4 Output power
-30
Harmonics
2nd harmonics
3rd harmonics
+3
-30?
-30?
dBm Over range of Pout from IC control in 2 dB steps.
Note: On channel 26, output power should not
exceed -5 dBm (power setting 0x0E) to meet
FCC Part 15 requirements.
Harmonics are compliant to ETSI and FCC
dBm regulatory approval standards
dBm
RF Receiver
802.15.4 sensitivity
-93
dBm <1% PER for 20-byte packets
Regulatory Approval
FCC
Not yet certified.
CE (ETSI)
Product is approved accordingly to the EN 300 328
V1.7.1 (2006-10) standard
CE (EMC)
Product is approved accordingly to the EN 301 489-1
V1.6.1 (2005-09) and EN 301 489-17 V1.2.1
(2002-08) standards
Safety
UL
Product is approved accordingly to the IEC 60950-1
and EN 60950-1, First Edition standards
Environment
RoHS
Product complies with the EU Directive 2002/95/EC
of 27 January 2003
WEEE
Product complies with the EU Directive 2002/95/EC
of 27 January 2003
1323x Development Hardware Reference Manual, Rev. 1.0
2-6
Freescale Semiconductor
Chapter 3
1323x-Modular Reference Board
3.1
1323x-MRB Overview
The 1323x-Modular Reference Board (1323x-MRB) is an IEEE 802.15.4 compliant evaluation board
based on the Freescale MC1323x device. The 1323x-MRB provides a platform to evaluate the MC1323x
device, develop software and applications, and demonstrate IEEE 802.15.4 based networking capabilities.
The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry including
antenna, and supporting circuitry.
This basic board is intended as the core module for MC1323x evaluation and application development and
can be used in the following modes:
• Simple standalone evaluation platform
• Daughtercard to the other MC1323x Development Platform boards (1323x-RCM or 1323x-REM)
• Daughtercard to an application specific motherboard.
3.1.1
Features
The 1323x-MRB provides the following features:
• Small form factor (2 x 2 inches)
• 4-Layer metal, 0.034 inch thick FR4 board
• MC1323x reference design area
— LGA footprint and power supply bypass
— 32 MHz reference oscillator crystal
— RF components and layout
• Low cost RF node
— Integrated transmit/receive switch
— Differential input/output port (typically used with a balun)
— Programmable output power with 0 dBm nominal output power, programmable from -30 dBm
to +3 dBm typical
— Receive sensitivity of -93 dBm (typical) at 1% PER, 20-byte packet
— Printed metal F-Antenna
• 32.768 kHz crystal provided for optional timing oscillator
• Two connectors provided daughter card mounting
— 20-Pin primary connector
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-1
1323x-Modular Reference Board
•
•
•
•
3.1.2
— 18-Pin secondary connector
— Provide main supply voltage to board
— Provide access to all MC1323x GPIO
Flexible board power supply
— 3.3 V LDO series regulator supplied
— Regulator bypass jumper option
— Separate external voltage source option
— Power-on green LED
— Jumpers allow various block current measurements
6-Pin BDM serial MCU debug port
MC1323x reset switch
Onboard peripheral functions
— IR blaster (The MC1323x CMT port is employed as a GPIO to drive large IR blasters. For IR
blasters under 20ma, use the CMT port directly.)
— 2 Mbit serial FLASH (uses SPI interface)
Form Factor
Figure 3-1 shows the 1323x-MRB connector and header locations.
F-Antenna
J8
IR Diode D2
J9
BDM Port
(J4)
J5
Reset Sw
J6
Primary 20-Pin IO
Connector (J2)
Secondary 18-Pin IO
Connector (J3)
Figure 3-1. 1323x-Modular Reference Board (1323x-MRB)
1323x Development Hardware Reference Manual, Rev. 1.0
3-2
Freescale Semiconductor
1323x-Modular Reference Board
Figure 3-2 shows a footprint of the 1323x-MRB with the location of the IO Headers J2 and J3. The user
may desire to create a motherboard on which the 1323x-MRB would be mounted, and headers J2 and J3
are used for connection to the motherboard:
• Both headers have standard 0.10in / 2.54 mm pin spacing
• J2 is 20-pin and J3 is 18-pin
• Both are pin headers mounted on the bottom side of the 1323x-MRB and are intended to plug into
matching receptacles on the motherboard.
• It is recommended that 1323x-MRB be located such that it extends beyond edge of the
motherboard (see Figure 3-2) so that the entire F-Antenna is exposed with no motherboard ground
or voltage plane beneath it. This is to allow best results transmitting and receiving with the radio.
• With the 1323x-MRB oriented as shown in Figure 3-2, the IR blaster transmits to the right.
2.01 in
2.01 in
0.45 in
0.10 in
0.49 in
0.55 in
Figure 3-2. 1323x-MRB Top Side (Component Side) Footprint
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-3
1323x-Modular Reference Board
3.1.3
Board Level Specifications
Table 3-1. 1323x-MRB Specifications
Parameter
Units
MIN
TYP
Notes/Conditions
MAX
General
Size (PCB: X, Y)
51 x 51
2.01 x 2.01
Layer build (PCB)
0.8
0.034
mm
inches
mm 4-Layer
inches
Dielectric material (PCB)
FR4
Power
Voltage supply (DC)
With 3.3 V regulator in use
3.50
16
Not using regulator with serial
FLASH and IR
2.7
3.6
Not regulated - using all features
Not using regulator with
MC1323x only
1.8
3.6
Lower voltage usable only by MC1323x
Current consumption
TBD
mA
Full module use
Temperature
Operating temperature (see note)
-20
+25
+70
°C
Storage temperature
-30
+25
+70
°C
• Operating temperature is limited to +70
°C due to switches. Basic circuit is good
for a maximum temperature of +85 °C.
• Operating temperature may also be
further limited when used in conjunction
with REM or RCM having a battery
supplied voltage source. See Table 4-1
and Table 5-1.
IR Transmitter
Current
63
mA
Range
10
RF
802.15.4 Frequency range
2405
Range (outdoor / line of sight)
2480
300
MHz
All 16 channels in the 2450 MHz band
Meter <1% PER for 20-byte packets (point-to-point
in communications with 1323x Sensor
Reference Board)
RF Transmitter
802.15.4 Output power
-30
+3
dBm
1323x Development Hardware Reference Manual, Rev. 1.0
3-4
Freescale Semiconductor
1323x-Modular Reference Board
Table 3-1. 1323x-MRB Specifications (continued)
Parameter
Units
Harmonics
2nd harmonics
3rd harmonics
-38
-35
dBm
dBm
Notes/Conditions
Harmonics are compliant to ETSI and FCC
regulatory approval standards
RF Receiver
802.15.4 sensitivity
-93
dBm
<1% PER for 20-byte packets
Regulatory Approval
FCC
Product is approved accordingly to the FCC
part 15 standard
CE (ETSI)
Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC)
Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL
Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS
Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE
Product complies with the EU Directive
2002/95/EC of 27 January 2003
3.2
Functional Description
The 1323x-MRB is built around Freescale’s MC1323x 48-pin LGA IEEE 802.15.4 platform. Figure 3-2
shows a simple block diagram. This board is intended as a simple evaluation platform and as a building
block for application development. The 4-layer board provides the MC1323x with its required RF
circuitry, 32 Mhz reference oscillator crystal, and power supply bypassing. The layout for this base level
functionality can be used as a reference layout by the user target board.
In additional to the base MC1323x functionality, the 1323x-MRB provides features to assist in debug, an
IR blaster, a 2 Mbit serial FLASH, reset button, simple power manager, and expansion connectors for the
GPIO. In the following sections, refer to:
• Figure 3-1 for location of connectors and features
• Figure 3-3 for the functional blocks
• Figure 3-11 for the board schematic
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-5
1323x-Modular Reference Board
Power
Management
BDM
Debug
Port
IR
Blaster
LED
CMT
GPIO
Headers
J2 & J3
GPIO
Reset
Button
MC13233
QFN
F-Ant
SPI
2 Mbit
Serial
FLASH
32 MHz
32.768
KHz
Optional
SMA
Conn
Figure 3-3. 1323x-MRB Block Diagram
3.2.1
RF Performance and Considerations
The MC1323x transceiver includes a low noise amplifier, 1mW nominal output power, PA with internal
voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation,
and full spread-spectrum encoding and decoding.
• Nominal output power is 0 dBm, with +3 dBm max
• Typical sensitivity is -93 dBm
• Frequency range is 2405 to 2480 MHz
• Typical range (outdoors, line of sight) is 130 meters
The 1323x Modular Reference Board utilizes a minimum number of components while providing good
RF performance:
• Uses a minimum number of RF matching components and external 50:100 balun
• “F” printed metal antenna for a small footprint, low cost design
An external 50 (unbal):100 (bal) balun connects a single-ended 50-Ω port to the differential RF port of the
MC1323x radio. The layout has provision for out-of-band signal suppression (components L2 and C7) if
required. Also note that control pin CT_Bias switches reference voltage to the balun as required for TX
(CT_Bias = 1.5V) or RX (CT_Bias = ground).
The default RF mode is use of the “F” antenna coupled through 10 pF C3 to the single-end RF port. An
alternative mode is to connect an SMA RF connector (not provided; must be mounted). This is useful for
connected measurements to test radio performance.
NOTE
See the MC1323x Data Sheet and Reference Manual for more RF design
information.
1323x Development Hardware Reference Manual, Rev. 1.0
3-6
Freescale Semiconductor
1323x-Modular Reference Board
Figure 3-4. 1323x-MRB RF Circuitry
3.2.2
Clocks
The MC1323x provides for two clocks:
• 32 MHz Reference Oscillator - Figure 3-5 shows the external 32 MHz external crystal Y2. This
mounted crystal must meet the MC1323x specifications. The IEEE 802.15.4 Standard requires that
the frequency be accurate to less that +/-40 ppm.
— Capacitors C10 and C11 provide the bulk of the crystal load capacitance. Onboard trim
capacitors can be programmed to center the frequency. At 25°C, it is desired to have the
frequency accurate to +/-10 ppm or less to allow for temperature variation.
— To measure the 32 MHz oscillator frequency, signal PTD7/XTAL_32MOUT can optionally be
programmed to provide a buffered output clock signal
— The 1323x-MRB has provision for injecting an external 32 MHz clock source as an alternative
to use of the onboard crystal:
– The crystal Y2 should be removed
– Resistors R23, R24, R19, and R20 must be mounted
– C23 must be mounted
– The external 32 MHz source is connected to 2-pin header J8; the frequency accuracy of the
external source must meet the +/-40 ppm of the IEEE 802.15.4
• Optional 32.768 kHz Crystal Oscillator - Provision is also made for a secondary 32.768 kHz crystal
X2 (see Figure 3-6). This oscillator can be used for a low power accurate time base.
— The module comes provided with this Y1 crystal and its load capacitors C4 and C15.
— Load capacitors C4 and C15 provide the entire crystal load capacitance; there is no onboard
trim capacitance.
— The 32 kHz oscillator components are supplied, but un-enabled. Zero-ohm resistors R11 and
R13 enable use of IO signals PTA0 and PTA1 via the IO connector and are supplied as mounted.
These must be unmounted and moved to resistor sites R10 and R12 to enable the 32.768 kHz
crystal and disable PTAO and PTA1.
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-7
1323x-Modular Reference Board
EXTAL_32M
V_IC
V_IC
R23
1K
DNP
Y2
J8
C23
10PF
DNP
C10
12PF
R24
1K
DNP
R19
1K
DNP
XTAL_32M
32MHZ
C11
12PF
HDR 1X2
R20
1K
DNP
32MHz XTAL
Figure 3-5. 1323x-MRB 32 MHz Reference Oscillator Circuit
PTA0/XTAL_32K
R11
PTA1/EXTAL_32K
R13
MRB-PTA0
MRB-PTA1
R10
DNP
R12
DNP
Y1
32.768KHZ
C4
12PF
C5
12PF
32kHz XTAL
Figure 3-6. 1323x-MRB 32.768 kHz Optional Oscillator Circuit
3.3
Reset and BDM Debug Port
The reset circuit and BDM port connector are shown in Figure 3-7. See Figure 3-1 for switch and header
locations.
• Reset switch RST2 is active low and provides a hardware reset to the MC1323x
• The 6-pin BDM 2x3 header J10 is provided to connect the MC1323x serial debug port to a standard
HC9S08 debug module.
V_IC
V_IC
J4
RESET
BKGD
R1
15K
MRB-RSTb
HDR 2X3
RST1
BDM
SW_MOM
MRB-RSTb
TL1
TL2
TL3
BH1
BH2
BH3
BH4
C1
1000pF
125
125
125
125
Figure 3-7. 1323x-MRB Reset Switch and BDM Port
1323x Development Hardware Reference Manual, Rev. 1.0
3-8
Freescale Semiconductor
1323x-Modular Reference Board
3.3.1
Power Management
The 1323x-MRB power management circuit is shown in Figure 3-8.
V_EXT
J5: EXTERNAL SUPPLY
V_UNREG
J6
J5
D4
TP12
MBR0520LT1G
HDR 1X2
HDR TH 1X3
VDD
TP1
TP2
V_LDO
U3
C12
1UF
C14
0.01UF
VIN
V_MEM
D3
VOUT
R4
MBR0520LT1G
BYP
C13
2.2UF
ON/OFF
J9
V_LED
TP3
POWER ON
V_BRD
TP4
D1
GREEN
HDR_2X4
GND
V_IC
LP2985AIM5-3.3
TP6
V_UNREG
TP5
3.3V LDO REGULATOR
R7
330
V_LED
TP13
J6:
»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V
»SHUNT 3->2 ONLY IF V_EXT = 3V
»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTED
POWER MANAGEMENT
Figure 3-8. 1323x-MRB Power Management Circuit
Power to the 1323x-MRB can be configured in several ways and the circuit has the following features:
• Board can be supplied through the IO headers (V_BRD)
• Board can be supplied from an external DC supply (J5)
— The external supply can be unregulated (V_UNREG) and make use of the onboard 3.3 V LDO
regulator
— The external supply voltage can be used directly without use of the LDO
• 8-Pin 2x4 header J9 provides means to supply current to various board components and also
measure current if desired
• Green LED D1 is available as a power indicator.
Table 3-2 shows the header configuration information for the various power supply modes.
•
•
•
NOTE
The Freescale 1323x-RCM and 1323x-REM development boards
generate the system power supply on the motherboard and supply the
voltage to the 1323x-MRB through the V_BRD pin of Headers J2 and
J3. In this mode, the current flows to the 1323x-MRB through the pins.
If an external supply is used via 1323x-MRB header J5, current flows to
the motherboard through the V_BRD pin of Headers J2 and J3. THE
MOTHERBOARD SUPPLY SHOULD NOT BE USED.
In all modes, the IO voltage supply of peripherals on a motherboard
must be the same voltage as V_BRD, which is also the voltage applied
to the IC MC1323x.
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-9
1323x-Modular Reference Board
Table 3-2. 1323x-MRB Power Configurations
Mode
Voltage
Range
External
Source
J5
Ext Mode
Select
J6
Source V_BRD
2.7 - 3.6 V1
Not used
Not used - all
pins open
External Source
- Using LDO
3.5 - 16 V
Connected supplies
DC Voltage
Short Pins 1-2
Short pins for all
desired supplies
External voltage w/regulation • Input range is set by the LDO
regulator.
• 3.3 V is supplied to 1323x-MRB;
do not use motherboard supply
• J2 and J3 Headers supply
voltage to V_BRD pins when J9,
Pins 3-4 are shorted
Connected supplies
DC Voltage
Short Pins 2-3
Short pins for all
desired supplies
External voltage w/o regulation • Input range is set by the onboard
circuitry
• 2.7 - 3.3 V is supplied to
1323x-MRB
• J2 and J3 Headers supply
voltage to V_BRD pins
External Source 2.7 - 3.6 V1
- Not Using LDO
Current Enable
J9
Description
Short Pins 3-4 - Normal Operation short other desired The 1323x-MRB main supply is
supplies
supplied by the motherboard
through the J2 and J3 Headers
The MC1323x can run as low as 1.8 V, however, the serial FLASH and IR blaster require 2.7 V or greater
Header J9 provides means to disable different sub-circuits or measure current and connections are
described in Table 3-3. Current measurements can be made by inserting a current meter in place of a
designated jumper.
Table 3-3. Power Distribution Header J9
Supply
Designation
Header
Pins
V_MEM
1-2
Supply voltage to serial FLASH memory • Jumper pins to supply memory.
• If memory is not powered, it can load MC1323x SPI port
V_BRD
3-4
Supply voltage connected to IO Connectors J2 and J3 • This supplies J2 and J3 if an external MRB supply is used
• This voltage supplies the MRB if the motherboard is the main power
• This connection is normally always jumpered
V_IC
5-6
Supply voltage to MC1323x • Normally jumpered
• Supplies only the MC1323x IC
• Normally always same voltage as V_BRD
V_LED
7-8
Supply voltage to power indicator LED and IR blaster LED • Jumper to use indicator or IR blaster
• Leave open for lowest power
Description
1323x Development Hardware Reference Manual, Rev. 1.0
3-10
Freescale Semiconductor
1323x-Modular Reference Board
3.3.2
IO Connectors J2 and J3
The two IO connectors J2 and J3 are standard 100 mil pin headers mounted on the back (non-component
side) of the 1323x-MRB. The primary header J2 is 20-pin and the secondary header J3 is 18-pin, and they
are mounted physically in such a manner as to prevent reverse insertion of the 1323x-MRB into a
motherboard receptacle (see Figure 3-2). When the 1323x-RCM or 1323x-REM or custom motherboard
is plugged into these connectors, they allow access to MC1323x MCU GPIO.
• V_BRD is the connector supply voltage.
— Depending on power supply configuration, this voltage may supply the 1323x-MRB from the
motherboard or the 1323x-MRB may supply this voltage to the motherboard. See
Section 3.3.1, “Power Management”.
— Peripherals IO to the MC1323x and the MC1323x supply should use this same voltage
NOTE
The 1323x-RCM and 1323x-REM and 1323x-MRB are supplied configured
for the motherboard to supply main power.
•
Some of the GPIO are shared with onboard devices. Check for the 1323x-MRB schematic and
Table 3-4 and Table 3-5 for any conflict.
BDM port signal PTA7/BKGD is NOT connected to the IO headers to prevent possible interference
with the debug port.
•
Table 3-4. 20 Pin Connector
Header Pin
Number
MC1323x Pin Name
V_BRD
PTC5/SS
GND
PTC7/MOSI
SPI Bus MOSI signal - shared with serial FLASH
PTD5/RXD
UART RXD input to MCU
PTC6/MISO
SPI Bus MISO signal - shared with serial FLASH
PTD6/TXD
UART TXD Output from MCU
PTC4/SPICLK
PTD0/TPM0
10
RESET
11
PTA5/SDA
12
PTB7/KBI1P7
13
PTA6/SCL
14
PTD2/TPM2
15
GND
16
PTD7/XTAL_32MOUT
Description
VDD supply to module
SPI Bus Slave Select (SS) - shared with serial FLASH
Module ground
SPI Clock (SPISCK) - shared with serial FLASH
GPIO / Timer IO
Reset
I2C Bus data signal (SDA)
UART flow control RTS input into MCU (implemented in Freescale software)
I2C Bus clock signal (SCL)
UART flow control CTS output from MCU (implemented in Freescale software)
Module ground
Port D Bit 7
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-11
1323x-Modular Reference Board
Table 3-4. 20 Pin Connector
Header Pin
Number
MC1323x Pin Name
17
PTB0/KBI1P0
Port B Bit 0 / KBI1 Input Bit 0
18
PTB1/KBI1P1
Port B Bit 1 / KBI1 Input Bit 1
19
PTB2/KBI1P2
Port B Bit 2 / KBI1 Input Bit 2
20
PTB3/KBI1P3
Port B Bit 3 / KBI1 Input Bit 3
Description
Table 3-5. 18 Pin Connector
Header Pin
Number
MC1323x Pin Name
V_BRD
PTA1/EXTAL_32K
Port A Bit 1 - signal shared with 32.768 kHz oscillator
PTA0/XTAL_32K
Port A Bit 0 - signal shared with 32.768 kHz oscillator
GND
Module Ground
PTA2
Port A Bit 2 - MC1323x test mode enable; SPECIAL SIGNAL REFER TO
MC1323x Reference Manual
PTA3/IRQ
PTA4/XTAL_32KOUT
PTB4/KBI1P4
Port B Bit 4 / KBI1 Input Bit 4
PTB5/KBI1P5
Port B Bit 5 / KBI1 Input Bit 5
10
PTB6/KBI1P6
Port B Bit 6 / KBI1 Input Bit 6
11
PTC0/KBI2P0
Port C Bit 0 / KBI2 Input Bit 0
12
PTC1/KBI2P1
Port C Bit 1 / KBI2 Input Bit 1
13
PTC2/KBI2P2
Port C Bit 2 / KBI2 Input Bit 2
14
PTC3/KBI2P3
Port C Bit 3 / KBI2 Input Bit 3
15
PTD1/TPM1
Port D Bit 1/ TPM1
16
PTD3/TPM3
Port D Bit 3/ TPM3
17
PTD4/CMT
Port D Bit 4/ CMT output - signal shared with IR blaster
18
GND
Description
VDD supply to module
Port A Bit 3 / IRQ (active low)
Port A Bit 4 / optional buffered 32.768 kHz clock output
Module ground
1323x Development Hardware Reference Manual, Rev. 1.0
3-12
Freescale Semiconductor
1323x-Modular Reference Board
3.3.3
1323x-MRB Onboard Peripheral Functions
The 1323x-MRB has two onboard peripheral functions to assist in implementing targeted applications.
NOTE
To use the peripherals, a minimum power supply voltage of 2.7 V must be
maintained.
3.3.3.1
2 Mbit Serial FLASH (SPI Interface)
Component U2 is an Atmel AT45DB021D 2 Mbit (256 kbyte) serial FLASH memory with SPI interface.
The memory is useful for over-the-air programming (OTAP) and for storage of non-volatile system data
or parameters. Figure 3-9 shows the memory circuit.
• Memory power supply is V_MEM (Header J9, Pin 1-2)
• Disabling the memory supply V_MEM may load the MC1323x SPI port through the U2 ESD
diodes
• Discrete pullup resistors for the SPI port are provided
• The SPI can be shared with another peripheral - an additional IO signal would be required as a chip
enable (CS or SS) for the peripheral. The normal SPI_SS and the second chip select should NOT
be active at the same time.
V_MEM
R21
10K
V_MEM
R18
10K
V_MEM
V_MEM
R22
10K
U2
MRB-SPI_MOSI
MRB-SPI_CLK
MRB-SPI_SS
SI
SCK
SO
GND
RESET
CS
VCC
WP
MRB-SPI_MISO
R17
AT45DB021D
10K
2MBit (256KB) FLASH
Figure 3-9. AT45DB021D 2 Mbit (256 kbyte) Serial FLASH memory
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-13
1323x-Modular Reference Board
3.3.3.2
IR Transmitter (Blaster)
An IR transmitter or blaster is provided to control IR legacy components (see Figure 3-10).
• The IR power supply is V_LED (Header J9, Pin 7-8)
• The IR transmitter has approximately a 10 meter range.
• Current draw is approximately 80 mA when active.
• To reduce the peak current consumption, it is recommended that the IR transmitter only be active
when the MC1323x RF transceiver is in-active.
• When using the blaster in an application, observe proper orientation (see Figure 3-2)
V_LED
R2
18.2
TP7
MRB-PTD4/CMT
D2
VSLB3940
TP9
TP8
R6
1.5K
R9
27K
Q1
MMBT3904LT1G
INFRARED LED
Figure 3-10. IR Transmitter Circuit
1323x Development Hardware Reference Manual, Rev. 1.0
3-14
Freescale Semiconductor
Freescale Semiconductor
3.4
Schematic, Board Layout, and Bill of Material
G1
J1
SMA_EDGE
G3
G2
G4
RESET
V_IC
R1
15K
U1
RST1
V_IC
SW_MOM
R14
10K
R15
10K
MRB-RSTb
MRB-PTA2/LCD_CTL0
MRB-PTA3/IRQb
MRB-PTA4/32K_OUT
BKGD
MRB-KBI1P0
MRB-KBI1P1
MRB-KBI1P2
MRB-KBI1P3
MRB-KBI1P4
MRB-KBI1P5
MRB-KBI1P6
MRB-UART_RTS/KBI1P7
10
11
12
13
14
15
16
17
MRB-KBI2P0
MRB-KBI2P1
MRB-KBI2P2
MRB-KBI2P3
18
20
21
22
MRB-SPI_CLK
MRB-SPI_SS
MRB-SPI_MISO
MRB-SPI_MOSI
23
24
25
26
PTA1/EXTAL_32K
R13
MRB-PTA0
MRB-PTA1
R10
DNP
R12
DNP
PTA0/XTAL_32K
PTD0/TPM0
PTD1/TPM1
PTD2/TPM2
PTD3/TPM3
PTA1/EXTAL_32K
RESET
PTD4/CMT
PTA2
PTA3/IRQ
PTA4/XTAL_32K_OUT
PTA5/SDA
PTA6/SCL
PTD5/TXD
PTD6/RXD
PTD7/XTAL_32M_OUT
XTAL_32M
EXTAL_32M
PTA7/BKGD/MS
RF_P
PTB0/KBI1P0
PTB1/KBI1P1
PTB2/KBI1P2
PTB3/KBI1P3
PTB4/KBI1P4
PTB5/KBI1P5
PTB6/KBI1P6
PTB7/KBI1P7
RF_BIAS/TINJ_P
NC/TINJ_N
PTC0/KBI2P0
PTC1/KBI2P1
PTC2/KBI2P2
PTC3/KBI2P3
VBATT_4
VBATT_3
VBATT_2
VBATT_1
PTC4/SPICLK
PTC5/SS
PTC6/MISO
PTC7/MOSI
VREG_LO2
VREG_VCO
VDD_ANA
VREG_ANA
RF_N
NC
PAD
27
28
29
30
MRB-TPM0
MRB-PTD1/TPM1
MRB-UART_CTS/TPM2
MRB-PTD3/TPM3
31
MRB-PTD4/CMT
32
33
MRB-UART_TXD
MRB-UART_RXD
34
35
36
MRB-PTD7
XTAL_32M
EXTAL_32M
C2
10PF
DNP
41
R26
Z1
RF_N
TP16
C3
Z_RF_P
RF_BIAS
Z_RF_N
50/100 OHMS
RF_BIAS
43
45
C6
10PF
C17
10PF
DNP
V_IC
RF_50
RF_ANT
10PF
L2
0.0039UH
DNP
C7
1PF
ANT1
F_Antenna
V_IC
V_IC
TP15
19
37
44
48
HARMONIC TRAP
46
38
39
47
TP14
C16
0.1UF
TP10
C15
10UF
C20
0.01UF
TP11
MC1323X
MRB-PTA2/LCD_CTL0
C8
0.22UF
32.768KHZ
C4
12PF
L1
0.0033UH
Y1
R25
RF_P
42
40
49
RF_SMA
C25
8.2PF
C26
8.2PF
C18
0.22UF
C9
0.22UF
C22
0.22UF
C5
12PF
R16
10K
C8 & C28 PLACE
CLOSE TO U1.39
C18 & C26 PLACE
CLOSE TO U1.47
32kHz XTAL
V_LED
R2
18.2
EXTAL_32M
V_IC
TP7
V_IC
R23
1K
DNP
V_MEM
V_MEM
V_MEM
MRB-PTD4/CMT
D2
VSLB3940
C23
10PF
DNP
C10
12PF
R24
1K
DNP
R19
1K
DNP
R21
10K
R18
10K
V_MEM
R22
10K
TP9
XTAL_32M
MRB-SPI_MOSI
MRB-SPI_CLK
32MHZ
C11
12PF
HDR 1X2
R20
1K
DNP
MRB-SPI_SS
SI
SCK
SO
GND
RESET
CS
VCC
WP
MRB-SPI_MISO
Q1
MMBT3904LT1G
R17
R9
27K
AT45DB021D
10K
2MBit (256KB) FLASH
32MHz XTAL
V_EXT
J5: EXTERNAL SUPPLY
V_UNREG
MRB-UART_RXD
MRB-UART_TXD
MRB-TPM0
MRB-I2C_SDA
MRB-I2C_SCL
HDR TH 1X3
TP2
V_LDO
C14
0.01UF
V_MEM
D3
VOUT
R4
J9
MBR0520LT1G
BYP
C13
2.2UF
ON/OFF
TP3
V_LED
TP4
HDR_2X4
V_IC
POWER ON
BDM
TL1
TL2
TL3
BH1
BH2
125
BH3
125
BH4
125
125
V_BRD
TP6
J3
MRB-PTA0
MRB-PTA2/LCD_CTL0
MRB-PTA4/32K_OUT
MRB-KBI1P5
MRB-KBI2P0
MRB-KBI2P2
MRB-PTD1/TPM1
MRB-PTD4/CMT
R7
330
V_LED
TP13
J6:
»SHUNT 2->1 UNREGULATED EXTERNAL SUPPLY V_EXT > 3.3V
»SHUNT 3->2 ONLY IF V_EXT = 3V
»NO-SHUNT WHEN V_BRD USED AS SUPPLY THROUGH J9, PINS 3 & 4 SHUNTED
11
13
15
17
10
12
14
16
18
MRB-PTA1
MRB-PTA3/IRQb
MRB-KBI1P4
MRB-KBI1P6
MRB-KBI2P1
MRB-KBI2P3
MRB-PTD3/TPM3
ICAP Classification:
Drawing Title:
FCP:
FIUO: ___
PUBI: ___
1323X MODULAR REFERENCE BOARD
HDR 2X9
Page Title:
GPIO
POWER MANAGEMENT
MRB-RSTb
HDR 2X3
20-PIN GPIO
STANDARD HEADER
TP5
3.3V LDO REGULATOR
BKGD
D1
GREEN
GND
LP2985AIM5-3.3
V_BRD
C12
1UF
VIN
MRB-SPI_SS
MRB-SPI_MOSI
MRB-SPI_MISO
MRB-SPI_CLK
MRB-RSTb
MRB-UART_RTS/KBI1P7
MRB-UART_CTS/TPM2
MRB-PTD7
MRB-KBI1P1
MRB-KBI1P3
HDR_10X2
U3
J4
10
12
14
16
18
20
MAIN SCHEMATIC
GPIO MAPPING
3-15
Figure 3-11. 1323x-MRB Schematic
Size
Document Number
Date:
Thursday, February 10, 2011
Rev
E4
SCH-26115 PDF: SPF-26115
Sheet
of
1323x-Modular Reference Board
MRB-KBI1P0
MRB-KBI1P2
VDD
TP1
V_UNREG
11
13
15
17
19
TP12
MBR0520LT1G
HDR 1X2
V_IC
J2
D4
INFRARED LED
V_BRD
J6
J5
TP8
R6
1.5K
U2
J8
Y2
1323x Development Hardware Reference Manual, Rev. 1.0
R11
MRB-I2C_SDA
MRB-I2C_SCL
PTA0/XTAL_32K
PTA1/EXTAL_32K
V_IC
MRB-RSTb
C1
1000pF
PTA0/XTAL_32K
1323x-Modular Reference Board
Figure 3-12. Modular Reference Board PCB Component Location (Top View)
Figure 3-13. Modular Reference Board PCB Test Points
1323x Development Hardware Reference Manual, Rev. 1.0
3-16
Freescale Semiconductor
1323x-Modular Reference Board
Figure 3-14. Modular Reference Board PCB Layout (Top View)
Figure 3-15. Modular Reference Board PCB Layout (Bottom View)
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-17
1323x-Modular Reference Board
3.4.1
Bill of Materials
Table 3-6. Bill of Materials
Item Qty
Reference
Value
F_Antenna
Description
ANT1
BH1,BH2,BH3, 125
BH4
NON-PLATED MOUNTING
HOLE 125 DRILL / 160
KEEPOUT NO PART TO
ORDER
C1
CAP CER 1000PF 50V 5%
C0G 0402
Mfg Part Number
Not A Part
NOT A PART
Murata
GRM1555C1H102JA01
C2,C17,C23
10PF
(No Not {Place)
CAP CER 10PF 50V 5% C0G Murata
0402
GJM1555C1H100JB01
C3,C6
10PF
CAP CER 10PF 50V 5% C0G Murata
0402
GJM1555C1H100JB01
C4,C5,C10,C1
12PF
CAP CER 12PF 50V 5% C0G Murata
0402
GRM1555C1H120JZ01
C7
1PF
CAP CER 1.0PF 50V
+/-0.25PF C0G 0402
Murata
GJM1555C1H1R0CB01
C8,C9,C18,C2
0.22UF
CAP CER 0.22UF 10V 10%
X5R 0402
Murata
GRM155R61A224KE19
C12
1UF
CAP CER 1.0UF 10V 10%
X7R 0603
Murata
GRM188R71A105KA61
10
C13
2.2UF
CAP CER 2.2UF 10V 10%
X7R 0603
Murata
GRM188R71A225KE15
11
C14,C20
0.01UF
CAP CER 0.01UF 50V 10%
X7R 0402
Murata
GCM155R71H103KA55
12
C15
10UF
CAP CER 10UF 10V 10% X5R Murata
0805
GRM21BR61A106KE19
13
C16
0.1UF
CAP CER 0.1UF 16V 10%
X7R 0402
Tdk
C1005X7R1C104KT
14
C25,C26
8.2PF
CAP CER 8.2PF 50V 0.25PF
C0G 0402
Avx
04025A8R2CAT2A
15
D1
GREEN
LED GRN SGL 30MA SMT
0805
Lite On
LTST-C171KGKT
16
D2
VSLB3940
LED IR SGL 100MA RA TH
Vishay
Intertechnology
VSLB3940
17
D3,D4
MBR0520LT1G
DIODE SCH 0.5A 20V
SOD-123
On
Semiconductor
MBR0520LT1G
18
J1
SMA_EDGE
CON 1 SKT SMA EDGE 34MIL Johnson
142-0701-881
BOARD SMT 50 OHM -- 171H Components Inc
AU 104L
1000pF
PCB F ANTENNA, NO PART
ORDER
Mfg Name
1323x Development Hardware Reference Manual, Rev. 1.0
3-18
Freescale Semiconductor
1323x-Modular Reference Board
Table 3-6. Bill of Materials
19
J2
HDR_10X2
HDR 2X10 TH 100MIL CTR
330H AU 100L
Samtec
TSW-110-07-S-D
20
J3
HDR 2X9
HDR 2X9 TH 100MIL CTR
330H AU
Samtec
TSW-109-07-S-D
21
J4
HDR 2X3
HDR 2X3 TH 100MIL CTR
335H AU 95L
Samtec
TSW-103-07-S-D
22
J5,J8
HDR 1X2
HDR 1X2 TH 100MIL SP 330H Samtec
SN 115L
TSW-102-07-T-S
23
J6
HDR TH 1X3
HDR 1X3 TH 100MIL SP 339H Samtec
AU 100L
TSW-103-07-G-S
24
J9
HDR_2X4
HDR 2X4 TH 100MIL CTR
330H AU 100L
Samtec
TSW-104-07-S-D
25
L1
0.0033UH
IND -- 0.0027UH@100MHZ
300MA +/-0.3NH 0402
Murata
LQG15HS2N7S02D
26
L2
0.0039UH
(No Not {Place)
IND -- 0.0039UH@100MHZ
300MA +/-0.3NH 0402
Murata
LQG15HN3N9S02D
27
Q1
MMBT3904LT1G
TRAN NPN GEN 200MA 40V
SOT-23
On
Semiconductor
MMBT3904LT1G
28
RST1
SW_MOM
SW SPST MOM PB 50MA 12V Alps Electric
SMT
(Usa) Inc.
SKQYPDE010
29
R1
15K
RES MF 15K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040215K0JNED
30
R2
18.2
RES MF 18.2 OHM 1/4W 1%
0805
Rohm
ESR10EZPF18R2
31
R4,R11,R13,R
25,R26
RES MF ZERO OHM 1/16W
5% 0402
Rohm
MCR01MZPJ000
32
R6
1.5K
RES MF 1.5K 1/16W 5% 0402 Vishay
Intertechnology
CRCW04021K50JNED
33
R7
330
RES MF 330 OHM 1/16W 5% Vishay
0402
Intertechnology
CRCW0402330RJNED
34
R9
27K
RES MF 27K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040227K0JNED
35
R10,R12
(No Not {Place)
RES MF ZERO OHM 1/16W
5% 0402
MCR01MZPJ000
36
R14,R15,R16,
R17,R18,R21,
R22
RES MF 10K 1/16W 5% 0402 Vishay
Intertechnology
CRCW040210K0JNED
37
R19,R20,R23, 1K
R24
(No Not {Place)
RES MF 1.0K 1/16W 5% 0402 Vishay
Intertechnology
CRCW04021K00JNED
38
TL1,TL2,TL3
TEST POINT PAD SIZE
3.4MM X 1.8MM SMT
5015
10K
TESTLOOP
Rohm
Keystone
Electronics
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
3-19
1323x-Modular Reference Board
Table 3-6. Bill of Materials
39
16
TP1,TP2,TP3,T TPAD_040
P4,TP5,TP6,T
P7,TP8,TP9,T
P10,TP11,TP1
2,TP13,TP14,T
P15,TP16
TEST POINT PAD 40MIL DIA
SMT, NO PART TO ORDER
Notacomponent NOTACOMPONENT
40
U1
MC1323X
IC MCU+XCVR 8BITS 2.4GHZ Freescale
1.8-3.6V LGA48
Semiconductor
PC13233C
41
U2
AT45DB021D
IC MEM FLASH 256KX8
66MHz 2.7-3.6V 8S1
Atmel
AT45DB021D-SSH-T
42
U3
LP2985AIM5-3.3
IC VREG LDO 3.3V 150MA
3.8-16V SOT-23-5
National
Semiconductor
LP2985AIM5-3.3/NOPB
43
Y1
32.768KHZ
XTAL 32.768KHZ SMT ROHS Epson
COMPLIANT
Electronics
FC-135 32.7680KA-A3
44
Y2
32MHZ
XTAL 32MHZ 9PF -- SMT
3.2X2.5MM
Ndk
EXS00A-CS02368
45
Z1
50/100 OHMS
XFMR BALUN 2.45GHZ
+/-50MHZ 50/100OHM 3W
SMT
Johanson
Technology
2450BL15B100_
1323x Development Hardware Reference Manual, Rev. 1.0
3-20
Freescale Semiconductor
Chapter 4
1323x Remote Control Motherboard
4.1
1323x-RCM Overview
The Remote Control Motherboard (1323x-RCM) is a motherboard that accepts the 1323x-Modular
Reference Board (1323x-MRB) plug-in module (daughter card) and supplies a power supply and a rich set
of interface peripherals. The two boards in combination provide a complete platform to evaluate the
MC1323x, write software, and develop a full featured IEEE 802.15.4 based wireless remote control.
4.1.1
Features
The 1323x-RCM provides the following features:
• 4-Layer metal, 0.034 inch thick FR4 board
• Two connectors provide daughter card mounting
— 20-Pin primary connector
— 18-Pin secondary connector
— Provide main supply voltage to board
— Provide access to all MC13233 GPIO
• Handheld battery operation
• Flexible power supply
— Sources include USB port, two AA batteries, or DC source
— Power-On green LED
— On-Off switch
• Used in conjunction with 1323x-MRB where MRB provides — 2.4 GHz IEEE 802.15.4 wireless node
— 2 Mbit serial FLASH for over-the-air programming (OTAP)
— IR blaster
• USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications
• 36 Pushbutton 6x6 switch matrix
• 128x32 pixel monochrome graphic/alphanumeric LCD - uses SPI serial interface
• Synaptics® Touchpad™ - capacitive touch sensor
• 3-Axis accelerometer with IIC serial interface
• Four application-controlled blue indicator LEDs
• Single tone buzzer
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
4-1
1323x Remote Control Motherboard
4.1.2
Form Factor
Figure 4-1 shows a photo of the 1323x-RCM with the location of connectors and headers designated.
Primary 20-Pin IO
Connector (J8)
Power-On
LED
1323x-MRB Outline
(When mounted)
Secondary 18-Pin IO
Connector (J9)
Buzzer
(Mounted on
back side)
GPIO Enable
Pin Header
P1
Accelerometer
GPIO Enable
Pin Header
P2
128x32
Graphic LCD
LCD J10
Touchpad
7.0 Inches
178 mm
Pushbutton
Matrix
4 Blue LEDs
External
Supply
J14
On / Off
Switch
SL1
USB
Connector
J15
3.4 Inches
86 mm
Figure 4-1. 1323x-RCM (1323x-MRB)
The1323x-Modular Reference Board (1323x-MRB) mounts on the 1323x-RCM via receptacles J8 and J9.
Figure 4-1 shows an outline of the 1323x-MRB placement when mounted.
1323x Development Hardware Reference Manual, Rev. 1.0
4-2
Freescale Semiconductor
1323x Remote Control Motherboard
4.1.3
Board Level Specifications
NOTE
Temperature range specifications apply to RCM used in combination with
MRB.
Table 4-1. 1323x-RCM Specifications
Parameter
Units
MIN
TYP
Notes/Conditions
MAX
General
Size (PCB: X, Y)
86 x 178
3.40 x 7.00
Layer build (PCB)
0.8
0.034
mm
inches
mm 4-Layer
inches
Dielectric material (PCB)
FR4
Power
Voltage supply (DC)
2.3
Voltage supply (USB)
4.4
5.25
2.8
3.2
100
mA
Voltage supply (Batteries)
Current consumption
USB 2.0/1.1 standard specification
Temperature
Operating temperature; non-battery
operation (see note)
Operating temperature; battery
operation (see note)
Storage temperature
USB interface
-20
+25
+70
°C
Operating temperature is limited to +70 °C
due to switches. Basic circuit is good for a
maximum temperature of +85 °C.
+25
+50
°C
Operating temperature is limited by battery
temperature range
-30
+25
+70
°C
USB 2.0 and 1.1 full-speed compatible
Buzzer
CUI #CMI-1240
See data sheet
Touchpad
Synaptics
Semi-custom
Tri-axis Low-g Accelerometer
MMA7660FC (Freescale Semi)
See data sheet
LCD
CRYSTALFONZ
#CFAG12832A-YGH-N
See data sheet
Regulatory Approval
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
4-3
1323x Remote Control Motherboard
Table 4-1. 1323x-RCM Specifications (continued)
Parameter
Units
Notes/Conditions
CE (ETSI)
Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC)
Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL
Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS
Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE
Product complies with the EU Directive
2002/95/EC of 27 January 2003
4.2
Functional Description
The 1323x-RCM is a host motherboard for the 1323x-MRB. The two-board combination provides a
powerful evaluation and development platform for the MC13233. Figure 4-2 shows a simple block
diagram. The 4-layer board provides a flexible power supply, 36 pushbutton matrix, 128x32 LCD,
Touchpad sensor, 3-axis accelerometer, four indicator LEDs, buzzer, and a USB <> UART serial port.
As the board name implies this platform is useful to develop an RF remote control application for a DTV,
entertainment console, or similar function. The 1323x-MRB provides the RF node and an IR transmitter
is available to support legacy IR protocol remote controls. The rich set of peripherals of the 1323x-RCM
allows a user to develop a remote control ranging from a simple input device to a higher end unit with
display.
In the following sections, refer to:
• Figure 4-1 for location of connectors and features
• Figure 4-2 for the functional blocks
• Figure 4-10 for the board schematic
1323x Development Hardware Reference Manual, Rev. 1.0
4-4
Freescale Semiconductor
1323x Remote Control Motherboard
1323x-MRB
GPIO Header
Receptacles
On/Off
Switch
External DC
4 Blue
Indicator
LEDs
Power
Management
GPIO
Pin Headers
VCC
2 AA
Battery
Buzzer
On
LED
USB
Type-B
Conn
USB
2.0
USB <> UART
Serial IC
6x6 Switch
Matrix
2 PB
Switches
128x32
Graphic/
Alphanumeric
LCD
SPI
IIC
Synaptic
Touchpad
Figure 4-2. 1323x-RCM Block Diagram
4.2.1
Power Management
The 1323x-RCM can be powered from two AA batteries, the USB connector 5 V supply, or an external
DC supply and is also intended to power the 1323x-MRB. Figure 4-3 shows the power management
circuit.
TP19
3.3uH
D9
D10
MBR0520LT1G
MBR0520LT1G
D11
MBR0520LT1G
C32
10UF
R45
D8
R38
R41
10K
4.7K
V_LED
L2
VIN
VOUT
VINA
EN
PS/SYNC
GND
V_LED
D13
MBR0520LT1G
FB
PGND
PPAD
10
R35
R36
Q3
SI2305
C33
0.1UF
TP21
V_3V3
R47
C42
10UF
POWER ON
VCC
TP20
L1
LED
LED5
RED
C43
10UF
V_TPD
R37
11
TP22
TOUCHPAD
TP23
TPS63001
V_DC
MBR0520LT1G
U8
V_MAIN
L3
V_USB
R39
330
V_ACC
R46
200K
DNP
R40
TP24
ACCELEROMETER
V_BUZ
TP25
R42
TP26
V_BAT
BUZZER
V_MRB
D12
MBR0520LT1G
R43
TP27
MODULAR REFERENCE BOARD
Figure 4-3. 1323x-RCM Power Management Circuit
A boost-buck voltage regulator U8 is used in this design to allow operation over a relatively wide, low
voltage input range, i.e., the TPS63001 regulator has an input voltage range from 1.8 V to 5.5V. This
allows a broad range of power supply sources. The regulated output voltage of the TPS63001 is 3.3 V
which delivers about 3.05 V to the board due to the drop across the isolation Schottky diodes.
Attributes of the power management circuit include:
• Switch SL1 provides an ON/OFF function for all input voltage sources
• Red LED5 provides a POWER-ON indicator for all sources
• The 1323x-RCM can derive power from three different sources 1. USB port Type-B connector J15 - power can be supplied from an actual USB port connection
or from an AC to DC converter that uses the USB connector to supply power.
1323x Development Hardware Reference Manual, Rev. 1.0
Freescale Semiconductor
4-5
1323x Remote Control Motherboard
2. External DC source via header J14 - a standard 0.1 in. spacing 1x2 pin header allows for
connection of an external DC supply.
3. Battery Operation - a battery holder that accommodates two AA batteries is mounted on the
non-component (back) side of the board and provides for battery operation.
– If either the USB or external DC source is present, the battery source is disabled by
MOSFET transistor Q3
– The sources are all isolated and protected by Schottky diodes
– The minimum effective battery operating voltage is controlled by the use the FTDI
FT232RQ USB <> UART device - leakage current back through the FT232RQ UART
connections to the MC13233 on the MRB can cause the Q3 MOSFET to partially turnoff at
battery voltage below approximately 2.7-2.8 Vdc.
NOTE
To avoid current leakage through the USB device and to have lowest
minimum battery operating voltage for battery-only operation, remove the
following jumpers:
•
•
•
•
P1, Pins 7-8
P1, Pins 11-12
P1, Pins 17-18
P1, Pins 21-22
NOTE
When battery operation is used, the temperature range of the two board
system should be limited to within the specified temperature range of the
battery technology. Table 4-1 limits temperature range from 0 °C to +50 °C
when battery operation is applied.
Table 4-2 lists the voltage source attributes.
Table 4-2. 1323x-RCM Voltage Sources
Source
Connector
Input Voltage
Range
USB Port
USB Type-B J15
4.4 V - 5.25 V
Description
• The input voltage range is set the USB Spec
• The voltage can be supplied by either a standard USB
cable connection or an AC to DC power adaptor that uses
the USB connector J15
• If a power adaptor is in use, the USB serial port cannot be
used
1323x Development Hardware Reference Manual, Rev. 1.0
4-6
Freescale Semiconductor
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