Freescale Semiconductor USBKW24D USB Dongle User Manual USB KW2x Hardware Reference Manual

Freescale Semiconductor, Inc. USB Dongle USB KW2x Hardware Reference Manual

Contents

Reference Manual

Document Number: USB-KW2XHWRM
Rev. 0.1
03/2014
USB-KW2X Hardware
Reference Manual
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USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor iii
About This Book
Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
Chapter 1
Safety Information
1.1 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.1 Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.2 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.3 Exposure Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1.4 Antenna Restrictions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Regulatory Approval For Canada (IC RSS 210) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.2.1 26 PART 5 – Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3 Electrostatic Discharge Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.4 Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Chapter 2
USB-KW24D512 Development Platform Overview and Description
2.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2.1 USB-KW24D512 Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.3 Software and Driver Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Chapter 3
USB-KW24D512
3.1 USB-KW24D512 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.1 PCB Board Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.2 Form Factor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.3 Board Level Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.2.1 RF Performance and Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.2.2 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.2.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.2.4 USB-KW24D512 Peripheral Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.3 Schematic, Board Layout, and Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.3.1 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Chapter 4
PCB Manufacturing Specifications
4.1 Single PCB Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.2 Panelization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
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iv Freescale Semiconductor
4.3 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.4 Solder Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.5 Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.6 Electrical PCB Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.7 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.8 Hole Specification/Tool Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.9 File Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor v
About This Book
This manual describes Freescale’s MKW2xDxxx development platform hardware. The MKW2xDxxx is
an IEEE® 802.15.4 compliant evaluation environment based on the Freescale MKW2xDxxx device. The
MKW2xDxxx family is Freescale's latest generation ZigBee™ platform, which incorporates a complete
low power 2.4 GHz radio frequency transceiver and a Kinetis family low power, mixed-signal ARMR
eCortex™- M4 MCU into a single package. This family of products is targeted to meet the higher
performance requirements of ZigBee Pro and ZigBee IP based applications, especially Smart Energy and
Commercial Building Automation. This product is a cost-effective solution that matches or exceeds
competitive solutions.
Audience
This manual is intended for system designers.
Organization
This document is organized into the following chapters.
Chapter 1 Safety Information — Highlights some of the FCC requirements.
Chapter 2 MKW2xDxxx Development Platform Overview and Description — Provides an
overview of the boards that comprise the MKW2xDxxx development platform.
Chapter 3 USB-KW24D512 — This chapter details the USB-KW24D512 evaluation board.
Chapter 4 PCB Manufacturing Specifications — This chapter provides the specifications
used to manufacture the various MKW2xDxxx printed circuit boards (PCBs).
Revision History
The following table summarizes revisions to this document since the previous release (Rev. 0.0).
Revision History
Location Revision
Entire document First public release
Entire document Rev. 0.1, Rename KW24512-USB to USB-KW24D512 development board.
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vi Freescale Semiconductor
Definitions, Acronyms, and Abbreviations
The following list defines the acronyms and abbreviations used in this document.
ADC Analog to Digital Converter
AES Advanced Encryption Standard
CTS Clear to Send
DAC Digital to Analog Converter
I2C Inter-Integrated Circuit is a multi-master serial computer bus
ISM Industrial Scientific Medical 2.4 GHz radio frequency band
JTAG Joint Test Action Group
LGA Land Grid Array
MAC Media Access Controller
MCU Microcontroller Unit
PCB Printed circuit board
PiP Platform in Package
PWM Pulse-width modulation
RCM Remote Control Module
REM Remote Extender Board
RTS Request to Send
SMA Connector SubMiniature version “A” connector
SoC System on Chip
SPI Serial Peripheral Interface
SSI Synchronous Serial Interface
TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function.
TELCO Telephone Company
TWR Tower System
USB Universal Serial Bus
VCP Virtual Com Port
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 1-1
Chapter 1
Safety Information
1.1 FCC Guidelines
This equipment is for use by developers for evaluation purposes only and must not be incorporated into
any other device or system. This device may not be sold to the general public. Integrators will be
responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
FCC approval of this device only covers the original configuration of this device as supplied. Any
modifications to this product, including changes shown in this manual, may violate the rules of the Federal
Communications Commission and Industry Canada and make operation of the product unlawful.
1.1.1 Labeling
FCC labels are physically located on the back of the board.
1.1.2 Operating Conditions
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
operation.
1.1.3 Exposure Limits
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8
inches (20cm) from all persons.
1.1.4 Antenna Restrictions
An intentional radiator is designed to ensure that no antenna other than that furnished by the responsible
party is used with the device. The use of a permanently attached antenna or of an antenna that uses a unique
coupling to the intentional radiator is considered sufficient to comply with the provisions of this Section.
The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of
a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier
current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or
15.221. Further, this requirement does not apply to intentional radiators that must be professionally
Safety Information
USB-KW2x Hardware Reference Manual, Rev. 0.1
1-2 Freescale Semiconductor
installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional
radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However,
the installer is responsible for ensuring that the proper antenna is employed so that the limits in this Part
are not exceeded.
1.2 Regulatory Approval For Canada (IC RSS 210)
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired
operation of the device.
1.2.1 26 PART 5 – Appendix
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
1.3 Electrostatic Discharge Considerations
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with the JESD22 Stress Test Qualification for Commercial Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the human body
model (HBM), the machine model (MM) and the charge device model (CDM).
All latch-up test testing is in conformity with the JESD78 IC Latch-Up Test.
When operating or handling the development boards or components, Freescale strongly recommends
using at least the grounding wrist straps plus any or all of the following ESD dissipation methods:
• Flexible fabric, solid fixed size, or disposable ESD wrist straps
• Static control workstations, static control monitors and table or floor static control systems
• Static control packaging and transportation materials and environmental systems
1.4 Disposal Instructions
This product may be subject to special disposal requirements. For product disposal instructions, refer to
www.freescale.com/productdisposal.
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Chapter 2
USB-KW24D512 Development Platform Overview and
Description
2.1 Introduction
The USB-KW24D512 development platform is an evaluation environment based on the Freescale
MKW24D512 SIP device (MKW2x).
The MKW2x device family is Freescale's latest generation ZigBee™ platform which incorporates a
complete low power IEEE® 802.15.4 Standard 2.4 GHz radio frequency transceiver and a Kinetis family
low power, mixed-signal ARM Cortex™- M4 MCU into a single package.
Freescale supplements the MKW2x with tools and software that include hardware evaluation and
development boards, software development IDE and applications, drivers, custom PHY usable with
Freescale’s IEEE 802.15.4 compatible MAC.
The USB-KW24D512 development platform contains the MKW24D512 device with 32 MHz reference
oscillator crystal, RF circuitry including antenna, and supporting circuitry in a USB stick hardware format.
The board is a standalone and can be used for application development or as a packet sniffer.
Whether the USB-KW24D512 is used in a simple standalone application or in combination with another
boards, Freescale provides a complete software development environment called the Freescale BeeKit
Wireless Connectivity Toolkit (BeeKit). BeeKit is a comprehensive codebase of wireless networking
libraries, application templates, and sample applications. A wide range of software functionality are
available to complement the USB-KW24D512 platform and these are provided as codebases within
BeeKit.
2.2 Board Features
2.2.1 USB-KW24D512 Board
The USB-KW24D512 development platform contains the MKW24D512 device and is one of the simplest
reference designs utilizing the on chip USB block for power and communication. The USB-KW24D512
is a small form factor self-contained board for evaluation of wireless applications and can be used as packet
sniffer. The USB Type A connection is used with USB enabled hardware such as a computer.
Figure 2-1 shows the USB-KW24D512 development platform.
USB-KW24D512 Development Platform Overview and Description
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2-2 Freescale Semiconductor
Figure 2-1. USB-KW24D512
The USB-KW24D512 development platform includes the following Features:
• Freescale’s low-power MKW24D512 SIP ZigBee™ platform
• Fully compliant IEEE 802.15.4 Standard 2006 transceiver supports 250 kbps O-QPSK data in 5.0
MHz channels and full spread-spectrum encode and decode.
• USB form factor for reference design and small footprint, low cost RF node
— Differential input/output port used with external balun for single port operation
— Low external component count
— Programmable output power from –32 dBm to +8 dBm feed to the Antenna
— Receiver sensitivity: –101 dBm, typical (@1% PER for 20 byte payload packet) feed to the
antenna
• Integrated PCB Folded F-type antenna
• 32 MHz reference oscillator
• 2.4 GHz frequency operation (ISM)
• Programmable frequency clock output (CLK_OUT)
• Full speed USB 2.0
• Cortex 10-pin (0.05”) JTAG debug port for target MCU
• 2 blue LED indicators
• 1 push button switch
• 1 Reset push button
Figure 2-2 shows a simplified block diagram of the Freescale USB-KW24D512 board.
Figure 2-2. Simplified USB-KW24D512 Block Diagram
USB-KW24D512 Development Platform Overview and Description
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Freescale Semiconductor 2-3
2.3 Software and Driver Considerations
Install the BeeKit Wireless Connectivity Toolkit package found under Software and Tools at the following
URL before proceeding to use the boards:
• www.freescale.com\zigbee
When users first connect a KW2x based platform to a PC, they may be prompted to install drivers.
Platform drivers can be found under the installation Beekit folder as denoted below. Once BeeKit is
installed, do not allow Windows to automatically search for and install the drivers. Instead, select manual
installation and steer Windows to the following directory:
• C:\Program Files\Freescale\Drivers
Follow the instructions as they appear on the screen to complete driver installation.
NOTE
If the BeeKit software package is installed in another drive or directory,
indicate the Drivers proper folder location where BeeKit was installed.
If BeeKit is not installed, consider the following:
• When prompted, download the appropriate Windows driver and follow the instructions to complete
the driver installation.
• The required drivers to be installed will depend on the reference design platform.
— The KW2x boards come imaged with MSD OpenSDA firmware for board to PC connectivity.
The target in pre-loaded with the SMAC Connectivity Test application.
— Use the OpenSDA USB port (J15) to connect via Virtual COM Port (VCP) using P&E’s
OpenSDA Windows driver (See the TWR-OSDAUG.pdf guide).
For additional information about our 2.4 GHz Kinetis family ZigBee™ platforms, refer to the following:
• www.freescale.com\KW2x
• TWR-OSDAUG - OpenSDA User’s Guide
• SMACDAUG - SMAC User’s Guide
USB-KW24D512 Development Platform Overview and Description
USB-KW2x Hardware Reference Manual, Rev. 0.1
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Chapter 3
USB-KW24D512
3.1 USB-KW24D512 Overview
The USB-KW24D512 is an evaluation board based on the Freescale MKW24D512 device. The
USB-KW24D512 provides a platform to evaluate the USB-KW24D512 SIP IC, develop software and
applications. The core device is accompanied by the 32 MHz reference oscillator crystal, RF circuitry
including a printed board antenna, and supporting circuitry.
This basic board is intended as the core PCB for USB-KW24D512 evaluation and application
development and can be used as a simple standalone evaluation solution or use a packet sniffer.
3.1.1 PCB Board Features
The USB-KW24D512 provides the following features:
• USB small form factor
• 4-Layer metal, 0.062 inch thick FR4 board
• LGA footprint and power supply bypass
• Printed metal folded F-Antenna
• 32 MHz reference oscillator crystal
3.1.2 Form Factor
Figure 3-1 shows the USB-KW24D512 connector and header locations.
Figure 3-1. USB-KW24D512
Figure 3-2 shows a footprint of the USB-KW24D512 with the location of the header and connectors
USB-KW24D512
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3-2 Freescale Semiconductor
Figure 3-2. USB-KW24D512 Top Side (Component Side) Footprint
3.1.3 Board Level Specifications
Table 3-1. USB-KW24D512 Specifications
Parameter Min Typ Max Units Notes/Conditions
General
Size (PCB: X, Y) 61.4 x 18.5
2.42 x 0.73
mm
inches
Layer build (PCB) 1.57
0.062
mm
inches
4-Layer
Dielectric material (PCB) FR4
Power
Current consumption mA Refer to datasheet
Temperature
Operating temperature (see note) -40 +25 +70 °C • Operating temperature is limited to +70
°C due to switches. Basic circuit is good
for a maximum temperature of +85 °C.
Storage temperature -30 +25 +70 °C
RF
802.15.4 Frequency range 2405 2480 MHz
All 16 channels in the2450 MHz band
RF Receiver
Saturation (maximum input level) +10 dBm Datasheet
Sensitivity for 1% packet error rate (PER)
(+25 °C) -102 dBm Datasheet
RF Transmitter
USB-KW24D512
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3.2 Functional Description
The USB-KW24D512 is built around Freescale’s MKW24D512 63-pin (56-pin usable) LGA platform.
This board is intended as a simple evaluation platform and as a building block for application development.
The 4-layer board provides the MKW24D512 with its required RF circuitry, 32 MHz reference oscillator
crystal, and power supply bypassing. The layout for this base level functionality can be used as a reference
layout by the user target board. Figure 3-3 shows a simple block diagram.
RF Power Output -32 +8 dBm Programmable in 2dB steps.
At the antenna feed with no trap. 1.
2nd harmonic <-50 <-40 dBm Datasheet
3rd harmonic <-50 <-40 dBm Datasheet
Regulatory Approval
FCC Product is approved accordingly to the FCC
part 15 standard
CE (ETSI) Product is approved accordingly to the EN
300 328 V1.7.1 (2006-10) standard
CE (EMC) Product is approved accordingly to the EN
301 489-1 V1.6.1 (2005-09) and EN 301
489-17 V1.2.1 (2002-08) standards
Safety
UL Product is approved accordingly to the IEC
60950-1 and EN 60950-1, First Edition
standards
Environment
RoHS Product complies with the EU Directive
2002/95/EC of 27 January 2003
WEEE Product complies with the EU Directive
2002/95/EC of 27 January 2003
1Trap will add 1 to 2 dB of loss.
Table 3-1. USB-KW24D512 Specifications (continued)
Parameter Min Typ Max Units Notes/Conditions
USB-KW24D512
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3-4 Freescale Semiconductor
Figure 3-3. USB-KW24D512 Block Diagram
3.2.1 RF Performance and Considerations
USB-KW24D512 transceiver includes a 1mW nominal output power, PA with internal voltage controlled
oscillator (VCO), integrated transmit/receive switch, on-board power supply regulation, and full
spread-spectrum encoding and decoding. The USB-KW24D512 utilizes a minimum number of
components while providing good RF performance. Key specifications for USB-KW24D512 are:
• Nominal output power is set to 0 dBm
• Programmable output power from –32 dBm to +8 dBm measured at the antenna feed
• Typical sensitivity is -101 dBm (@1% PER for 25 °C) measured at the antenna feed
• Frequency range is 2360 to 2480 MHz
• Folded “F” printed metal antenna for a small footprint, low cost design
• Uses a minimum number of RF marching components and external 50:50 balun
An external 50 (unbal): 50(bal) balun connects a single-ended 50-ohm port to the differential RF port of
the MKW24D512 radio. The layout has provision for out-of-band signal suppression (components L5 and
C19) if required. Figure 3-4 shows the typical topology for the RF circuitry. The RF switch J4 has been
designed in for measurement purposes and is left as DNP.
Figure 3-4. USB-KW24D512 RF Circuitry
USB-KW24D512
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Freescale Semiconductor 3-5
3.2.2 Clocks
The USB-KW24D512 provides one clock:
• 32 MHz Reference Oscillator — Figure 3-5 shows the external 32 MHz external crystal Y1. This
mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE
802.15.4 Standard requires that the frequency be accurate to less that +/-40 ppm.
— Capacitors C10 and C11 provide the bulk of the crystal load capacitance. Onboard trim
capacitors can be programmed to center the frequency. At 25°C, it is desired to have the
frequency accurate to +/-10 ppm or less to allow for temperature variation.
— To measure the 32 MHz oscillator frequency, signal CLK_OUT (TP5) can optionally be
programmed to provide a buffered output clock signal.
Figure 3-5. USB-KW24D512 32 MHz Reference Oscillator Circuit
3.2.3 Power Management
The USB-KW24D512 power management circuit is shown in Figure 3-6.
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
3-6 Freescale Semiconductor
Figure 3-6. USB-KW24D512 Power Management Circuit
The USB-KW24D512 is powered via the USB type A connector as shown in Figure 3-6.,
“USB-KW24D512 Power Management Circuit”; the MKW24D512 device has an on-board USB port
which is configured to provide both power and serial communication with the target MCU.
3.2.4 USB-KW24D512 Peripheral Functions
The USB-KW24D512 includes two switch buttons; one for general purpose peripheral function to assist
in implementing targeted applications and the other is for board hardware Reset.
In the same situation the USB-KW24D512 includes two LEDs for general purpose peripheral function to
assist on applications.
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 3-7
3.3 Schematic, Board Layout, and Bill of Material
Figure 3-7. USB-KW24D512 Schematic
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
HARMONIC TRAP
32MHz XTAL
LED VOLTAGE
MCU VOLTAGE
RF VOLTAGE
PIN FUNCTIONS USED NET NAMES
JTAG / SWD CONNECTOR
POWER MANAGEMENT
POWER ON
RESET
IN CIRCUIT
TEST GND
PROBING
CLK_OUT
PTC4_R
PTD4
PTD5
PTA1
PTA2
PTA3
PTA0
TAMPER0
RST_TGTMCU_B
XTAL_32M
VREFL
EXTAL_32M
Z_RF_N
Z_RF_P
RF_OUTN
RF_OUTP
RF_50
VREFH
PTC4
TP_ANT_A
TP_ANT_B
VDD_PA
VDD_IF
VDD_RF
VDD_REGD
VDD_REGD
BAL_C
KW24_USB_DP
KW24_USB_DN
KW24_USB_DP
KW24_USB_DN
XTAL_32M
EXTAL_32M
USB_DP
V_USB_CONN V_USB_CONN_IND
USB_DN
RST_TGTMCU_B
PTD4_LED
PTD5_LED
PTD4
PTD5
PTC4
PTA1
JTAG_TDI/EZP_DI
PTA2
JTAG_TDO/TRACE_SWO/EZP_DO
PTA0JTAG_TCLK/SWD_CLK/EZP_CLK
PTA3
JTAG_TMS/SWD_DIO
K24_USB_SHLD
TP_RX_SWITCH
TP_TX_SWITCH
LED_PWR_R
VDD_IFVDD_RF VDD_PA
RF_ANT
RST_TGTMCU_B
V_MCU
V_MCU
V_MCU
V_RF
V_MCU
V_MCU
V_LED
V_LED
V_MCU
V_RF
V_MCU
V_USB
V_USB3V3
3V3
V_LED
V_MCU
GND
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
A
X-KW24D512-USB
C
Friday, August 30, 2013
MAIN SCHEMATIC
33
___ ___
X
SCH-28057 PDF: SPF-28057
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
A
X-KW24D512-USB
C
Friday, August 30, 2013
MAIN SCHEMATIC
33
___ ___
X
SCH-28057 PDF: SPF-28057
Drawing Title:
Size Document Number Rev
Date: Sheet of
Page Title:
ICAP Classification: FCP: FIUO: PUBI:
A
X-KW24D512-USB
C
Friday, August 30, 2013
MAIN SCHEMATIC
33
___ ___
X
SCH-28057 PDF: SPF-28057
TP18
TP7
L5
330 OHM
1 2
U1
MKW24D512V
VDD_MCU 20
VDDA 25
VREFH 26
VREFL 27
VSSA 28
VBAT_MCU 32
VDD_MCU 38
VBAT2_RF 42
VDD_REGD 43
VDD_PA 52
VDD_IF 53
VDD_RF 54
GND_PA3
63
GND_PA1
48
GND_PA2
51
EXTAL_32M
1
TAMPER0/RT C_W AKEUP
29
XTAL32
30
EXTAL32
31
RESET
41
RX_SWITCH
46
TX_SWITCH
47
RF_OUTP 49
RF_OUTN 50
XTAL_32M
56
GPIO1
2
GPIO2
3
PTA0/JTAG_TCLK/SWD_CLK/EZP_CLK/UART0_CTS/UART0_COL/FTM0_CH5
33
PTA1/JTAG_T DI/EZP_DI/UART 0_RX/FT M0_CH6
34
PTA2/JTAG_T DO/TRACE_SW O/EZP_DO/UART0_TX/FT M0_CH7
35
PTA3/JTAG_TMS/SWD_DIO/UART0_RTS/FTM0_CH0
36
PTA4/LLWU_P3/NMI/EZP_CS/FTM0_CH1
37
PTA18/EXTAL0/FTM0_FLT2/FTM_CLKIN0
39
PTA19/XTAL0/FT M1_FLT0/FTM_CLKIN1/LPTMR0_ALT1
40
PTC4/LLW U_P8/SPI0_PCS0/UART1_TX/FTM0_CH3/CMP1_OUT
4
PTC5/LLW U_P9/SPI0_SCK/LPTMR0_ALT2/I2S0_RXD0/CMP0_OUT
5
PTC6/LLW U_P10/CMP0_IN0/SPI0_SOUT/PDB0_EXTRG/I2S0_RX_BCLK/I2S0_MCLK
6
PTC7/CMP0_IN1/SPI0_SIN/USB_SOF_OUT/I2S0_RX_FS
7
PTD1/ADC0_SE5B/SPI0_SCK/UART2_CTS 8
PTD2/LLW U_P13/SPI0_SOUT/UART2_RX/I2C_SCL/GPIO4_BSM_DATA 9
PTD3/SPI0_SIN/UART2_T X/I2C_SDA/GPIO5_BSM_CLK 10
PTD4/LLW U_P14/MADC0_SE21/SPI0_PCS1/UART0_RTS/FTM0_CH4/EW M_IN/GPIO_BSM_FRAME 11
PTD5/ADC0_SE6B/SPI0_PCS2/UART0_CTS/UART0_COL/FTM0_CH5/EWM_OUT 12
PTD6/LLW U_P15/ADC0_SE7B/SPI0_PCS3/UART0_RX/FTM0_CH6/FTM0_FLT0 13
PTD7/MADC0_SE22/CMT_IRO/UART0_TX/FTM0_CH7/FTM0_FLT1 14
PTE0/MADC0_SE10/SPI1_PCS1/UART1_TX/MTRACE_CLKOUT/I2C1_SDA/RTC_CLKOUT 15
PTE1/LLWU_P0/MADC0_SE11/SPI1_SOUT/UART1_RX/MTRACE_D3/I2C1_SCL/SPI1_SIN 16
USB0_DP 21
USB0_DM 22
VOUT33 23
VREGIN 24
PTE2/LLWU_P1/MADC0_DP1/SPI1_SCK/UART1_CTS/MTRACE_D2 17
PTE3/MADC0_DM1/SPI1_SIN/UART1_RTS/MTRACE_D1/SPI1_SOUT 18
PTE4/LLWU_P2/SPI1_PCS0/MTRACE_D0 19
EP_GND1
64
EP_GND2
65
NC_57 57
NC_58 58
NC_59 59
NC_60 60
NC_61 61
NC_62 62
VBAT_RF 55
ANT_A 44
ANT_B 45
TP14
R14
330
C10
11pF TP8
C11
11pF
L3
2.2nH
12
TP3
MH1
MH_50mil
1
1
C4
5pF C12
33PF
C9
0.1UF
C29
2.2UF
TP15
C20
1.8pF
TP6
D3
BLUE
AC
C19
10PF
C13
0.33UF
SH2
0
TP16
TP10
R2
0
VD-D+G
J5
USB_TYPE_A
S1
A1
A2
A3
A4
S2
TP4
C24
1000pF
Z1
2400MHz 50OHM
5
1
6
2
3
4
TP1
TP9
TP19
C26
5pF
R13
10K
DNP
R12
0
ANT1
MEANDER_ANT_HORZ
2
1
C28
0.1UF
TP2
R1
1.0M
C18
10PF
TP17
C8
0.1UF
MH2
MH_50mil
1
1
R11 0
R3
0
TP11
C27
47PF
DNP
C1
5pF
Y1
32MHZ
1 4
32
C3
0.33UF
MH3
MH_50mil
1
1
OUTIN
PROBE
J4
MM8030-2600B
DNP
1
4
3
2
SH3
0
L4
60OHM
1 2
TP12
SH1
0
R7 33 C21
1.0UF
TP13
C2
1000pF
C25
47PF
DNP
C7
0.1UF
DNP
D2
BLUE
AC
MH4
MH_50mil
1
1
R8 33
TP28
DNP
C15
0.33UF
SW1
SKQYAFE010
DNP
12
C5
1000pF
R9
390
TP5
C17
1PF
RT1
MINISMDC050F-2
1 2
SW2
SKQYAFE010
12
J1
HDR 2X5
1 2
3 4
65
7 8
910
C16
33PF
R10
390
R6
10K
D1
GREEN
AC
C6
0.1UF
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
3-8 Freescale Semiconductor
Figure 3-8. USB-KW24D512 Reference Board PCB Component Location (Top View)
Figure 3-9. USB-KW24D512 Reference Board PCB Test Points
Figure 3-10. USB-KW24D512 Reference Board PCB Layout (Top View)
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 3-9
Figure 3-11. USB-KW24D512 Reference Board PCB Layout (Bottom View)
3.3.1 Bill of Materials
Table 3-2. Bill of Materials (Common parts for all frequency bands) (Sheet 1 of 3)
Item Qty Reference Value Description Mfg. Name Mfg. Part Number
1 1 ANT1 MEANDER_
ANT_HORZ
PCB MEANDER ANTENNA
HORIZONTAL, NO PART ORDER
2 3 C1,C4,C26 5pF CAP CER 5pF 50V 5% C0G 0402 MURATA GJM1555C1H5R0CB0
1D
3 3 C2,C5,C24 1000pF CAP CER 1000PF 50V 5% C0G
0402
MURATA GRM1555C1H102JA0
1D
43C3,C13,C1
5
0.33UF CAP CER 0.33UF 6.3V 10% X5R
0402
MURATA GRM155R60J334KE0
1D
54C6,C8,C9,
C28
0.1UF CAP CER 0.1UF 16V 10% X7R
0402
KEMET C0402C104K4RAC
6 1 C7 DNP 0.1UF CAP CER 0.1UF 16V 10% X7R
0402
KEMET C0402C104K4RAC
7 2 C10,C11 11pF CAP CER 11pF 50V 5% C0G 0402 TDK C1005C0G1H110J
8 2 C12,C16 33PF CAP CER 33PF 50V 5% C0G 0402 VENKEL COMPANY C0402C0G500-330JN
E
9 1 C17 1PF CAP CER 1PF 50V 5% C0G 0402 MURATA GRM1555C1H1R0CA
01B
10 2 C18,C19 10PF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A
11 1 C20 1.8pF CAP CER 1.8PF 50V 0.25PF C0G
0402
MURATA GRM1555C1H1R8CA
01D
12 1 C21 1.0UF CAP CER 1.0UF 10V 10% X5R
0402
YAGEO AMERICA CC0402KRX5R6BB10
5
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
3-10 Freescale Semiconductor
13 2 C25,C27
DNP
47PF CAP CER 47PF 16V 5% C0G 0402 AVX 0402YA470JAT2A
14 1 C29 2.2UF CAP CER 2.2UF 10V 10% X7R
0603
TAIYO YUDEN LMK107B7225KA-T
15 1 D1 GREEN LED GRN SGL 30MA SMT 0805 LITE ON LTST-C171KGKT
16 2 D2,D3 BLUE LED BLUE SGL 20MA SMT 0805 LITE ON LTST-C171TBKT
17 1 J1 HDR 2X5 CONN,HEAD,2X5,STR,50/50
CON-2RH-10-50
SAMTEC FTS-105-01-F-D
18 1 J4 DNP MM8030-26
00B
CON COAX SMT 1.9MM SP 40H
AU
MURATA MM8030-2610B
19 1 J5 USB_TYPE
_A
CON 1X4 USB_TYPE_A_MALE
RA SMT -- 178H AU
SAMTEC USB-AM-S-S-B-SM1
20 1 L3 2.2nH IND -- 2.2NH@500MHZ 220mA
4% 0402
MURATA LQP15MN2N2B02
21 1 L4 60OHM IND FER BEAD 60OHM@100MHZ
500MA -- 0603
MURATA BLM18PG600SN1D
22 1 L5 330 OHM IND FER BEAD
330OHM@100MHZ 2.5A -- SMT
TDK MPZ2012S331A
23 4 MH1,MH2,
MH3,MH4
MH_50mil Rework Hole Non-Plated 50mil
Drill size 65mil Soldermask TH, NO
PART TO ORDER
24 1 RT1 MINISMDC
050F-2
FUSE PLYSW 0.5A 24V SMT TYCO ELECTRONICS MINISMDC050F-2
25 1 R1 1.0M RES MF 1.0M 1/10W 5% 0603 BOURNS CR0603-JW-105ELF
26 4 R2,R3,R11,
R12
0 RES MF ZERO OHM 1/16W 5%
0402
ROHM MCR01MZPJ000
27 1 R6 10K RES MF 10K 1/10W 5% 0603 KOA SPEER RK73B1JTTD103J
28 2 R7,R8 33 RES MF 33 OHM 1/10W 5% 0603 VISHAY
INTERTECHNOLOGY
CRCW060333R0JNE
A
29 2 R9,R10 390 RES MF 390 OHM 1/16W 5% 0402 VISHAY
INTERTECHNOLOGY
CRCW0402390RJNE
D
30 1 R13 DNP 10K RES MF 10K 1/10W 5% 0603 KOA SPEER RK73B1JTTD103J
31 1 R14 330 RES MF 330 OHM 1/16W 5% 0402 VISHAY
INTERTECHNOLOGY
CRCW0402330RJNE
D
32 3 SH1,SH2,S
H3
0 ZERO OHM CUT TRACE 0402
PADS; NO PART TO ORDER
33 1 SW1 DNP SKQYAFE0
10
SW SPST MOM PB 50MA 12V
SMT
ALPS ELECTRIC
(USA) INC.
SKQYAFE010
34 1 SW2 SKQYAFE0
10
SW SPST MOM PB 50MA 12V
SMT
ALPS ELECTRIC
(USA) INC.
SKQYAFE010
Table 3-2. Bill of Materials (Common parts for all frequency bands) (Sheet 2 of 3)
Item Qty Reference Value Description Mfg. Name Mfg. Part Number
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 3-11
35 18 TP1,TP2,TP3,
TP4,TP5,TP6,
TP7,TP8,TP9,
TP10,TP11,TP
12,TP13,TP14
,TP15,TP16,T
P17,TP18
TPAD_040 TEST POINT PAD 40MIL DIA SMT,
NO PART TO ORDER
36 1 TP19 TPAD_030 TEST POINT PAD 30MIL DIA SMT,
NO PART TO ORDER
37 1 TP28 DNP TEST
POINT
WHITE
TEST POINT WHITE 40 MIL
DRILL 180 MIL TH 109L
COMPONENTS
CORPORATION
TP-105-01-09
38 1 U1 MKW24D51
2V
IC MCU XCVR 2.4GHZ 64KB RAM
512KB FLASH - USB 1.8-3.6V
LGA63
Freescale
Semiconductor
MKW24D512VHA5
39 1 Y1 32MHZ XTAL 32MHZ 9PF -- SMT
3.2X2.5MM
NDK EXS00A-CS02368
40 1 Z1 2400MHz
50OHM
XFMR BALUN 2400 +/-100MHZ
SMT
MURATA LDB212G4005C-001
Table 3-2. Bill of Materials (Common parts for all frequency bands) (Sheet 3 of 3)
Item Qty Reference Value Description Mfg. Name Mfg. Part Number
USB-KW24D512
USB-KW2x Hardware Reference Manual, Rev. 0.1
3-12 Freescale Semiconductor
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 4-1
Chapter 4
PCB Manufacturing Specifications
This chapter provides the specifications used to manufacture the KW2x Development hardware printed
circuit board (PCB) described in this manual.
The KW2x Development hardware PCBs must comply with the following:
• The PCB must comply with Perfag1D/3C (http://www.perfag.dk/Uk/ukindex.htm)
• The PCB manufacturer’s logo is required
• The PCB production week and year code is required
— The manufacturer’s logo and week/year code must be stamped on the back of the PCB solder
mask
— The PCB manufacturer can not insert text on the PCB either in copper or in silkscreen without
written permission from Freescale Semiconductor, Inc.
• The required Underwriter’s Laboratory (UL) Flammability Rating
— The level is 94V-0 (http://www.ul.com/plastics/flame.html)
— The UL information must be stamped on the back of the PCB solder mask
NOTE
• A complete set of design files is available for the KW2x Development
hardware at the Freescale web site (http:www.freescale.com/KW2x)
under the “Software and Tools” tab. This design or one of a number of
other reference designs should be used as a starting point for a custom
application.
• The Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout
Considerations Reference Manual, (ZHDCRM) is also available at the
same web site to provide additional design guidance.
4.1 Single PCB Construction
This section describes individual PCB construction details.
• The USB-KW24D512 PCB is four-layer, multi layer design
• The PCBs contains no blind, buried, or micro vias
• PCB data:
— USB-KW24D512 Size: Approximately 61.4 x 18.5mm (2.42 x 0.73 inches)
— USB-KW24D512 Final thickness (Cu/Cu): 1.57 mm (0.62 inches) +/- 10% (excluding solder
mask)
PCB Manufacturing Specifications
USB-KW2x Hardware Reference Manual, Rev. 0.1
4-2 Freescale Semiconductor
The following table defines some of the layers of the completed PCB. The artwork identification refers to
the name of the layer in commonly used terms.
NOTE
The USB-KW24D512 contains high frequency 2.4 GHz RF circuitry. As a
result, RF component placement, line geometries and layout, and spacing to
the ground plane are critical parameters. As a result, BOARD STACKUP
GEOMETRY IS CRITICAL. Dielectric and copper thicknesses and spacing
must not be changed; follow the stackup (see Figure 4-1) information is
provided with the reference design.
Figure 4-1. USB-KW24D512 PCB Stackup Cross-Section (Four Layer)
• Solder mask is required
• Silk screen is required
4.2 Panelization
The panel size can be negotiated depending on production volume.
4.3 Materials
The PCB composite materials must meet the following requirements:
Table 4-1. USB-KW24D512 Layer by Layer Overview
Layer Artwork Identification File Name
1 Silkscreen Top SILK_TOP.art
2 Top Layer Metal TOP.art
3 Ground Layer GND.art
4 Power Layer PWR.art
5 Bottom Layer Metal BOTTOM.art
6 Silkscreen Bottom SILK_BOTTOM.art
PCB Manufacturing Specifications
USB-KW2x Hardware Reference Manual, Rev. 0.1
Freescale Semiconductor 4-3
• Laminate - The base laminate material (laminate) must be FR4. If the laminate material were
changed the RF electrical characteristics may change and degrade RF performance.
• Copper Foil -
— Top and Bottom copper layers must be 1 oz. copper
— Interior layers must be 1oz. copper
• Plating - All pad plating must be Hot Air Levelling (HAL)
4.4 Solder Mask
The solder mask must meet the following requirements:
• Solder mask type: Liquid Film Electra EMP110 or equivalent
• Solder mask thickness: 10 – 30 µm
4.5 Silk Screen
The silk screen must meet the following requirements:
• Silkscreen color: White
• Silkscreen must be applied after application of solder mask if solder mask is required
• The silkscreen ink must not extend into any plated-thru-holes
• The silk screen must be clipped back to the line of resistance
4.6 Electrical PCB Testing
• All PCBs must be 100 percent tested for opens and shorts
• Impedance Measurement - An impedance measurement report is not mandatory
4.7 Packaging
Packaging for the PCBs must be the following requirements:
• Finished PCBs must remain in panel
• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials.
These materials can degrade solderability.
4.8 Hole Specification/Tool Table
See the ncdrill-1-4.tap file included with the Gerber files and the FAB-28057.pdf file.
PCB Manufacturing Specifications
USB-KW2x Hardware Reference Manual, Rev. 0.1
4-4 Freescale Semiconductor
4.9 File Description
Files included with the download include Design, Gerber and PDF files.
Gerber files are RS-274x format. Not all files included with the Gerber files are for PCB manufacturing.
PDF files included are:
• FAB-28057.pdf — USB - Board fabrication drawing
• GRB-28057.zip — USB - Metal layers, solder mask, solder paste and silk screen
• SPF-28057.pdf — USB - Schematic
Design files are in Allegro format with OrCAD schematic capture.

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