Fujitsu AD81 00001 14E IC Package A810000114e

User Manual: Fujitsu IC Package Packaging ation - Fujitsu United States

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2011.1

FUJITSU SEMICONDUCTOR

Package

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2011.1

FUJITSU S

For further information please contact:

North and South America

FUJITSU SEMICONDUCTOR AMERICA, INC.

1250 E. Arques Avenue, M/S 333

Sunnyvale, CA 94085-5401, U.S.A.

Tel: +1-408-737-5600 Fax: +1-408-737-5999

http://us.fujitsu.com/micro/

Europe

FUJITSU SEMICONDUCTOR EUROPE GmbH

Pittlerstrasse 47, 63225 Langen, Germany

Tel: +49-6103-690-0 Fax: +49-6103-690-122

http://emea.fujitsu.com/semiconductor/

Korea

FUJITSU SEMICONDUCTOR KOREA LTD.

206 Kosmo Tower Building, 1002 Daechi-Dong,

Gangnam-Gu, Seoul 135-280, Republic of Korea

Tel: +82-2-3484-7100 Fax: +82-2-3484-7111

http://kr.fujitsu.com/fmk/

Asia Pacific

FUJITSU SEMICONDUCTOR ASIA PTE. LTD.

151 Lorong Chuan,

#05-08 New Tech Park 556741 Singapore

Tel : +65-6281-0770 Fax : +65-6281-0220

http://www.fujitsu.com/sg/services/micro/semiconductor/

FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD.

Rm. 3102, Bund Center, No.222 Yan An Road (E),

Shanghai 200002, China

Tel : +86-21-6146-3688 Fax : +86-21-6335-1605

http://cn.fujitsu.com/fss/

FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD.

10/F., World Commerce Centre, 11 Canton Road,

Tsimshatsui, Kowloon, Hong Kong

Tel : +852-2377-0226 Fax : +852-2376-3269

http://cn.fujitsu.com/fsp/

Specifications are subject to change without notice. For further information please contact each office.

The contents of this document are subject to change without notice.

Customers are advised to consult with sales representatives before ordering.

The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose

of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU SEMICONDUCTOR does

not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating

the device based on such information, you must assume any responsibility arising out of such use of the information.

FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information.

Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use

or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any

third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right

by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or

other rights of third parties which would result from the use of information contained herein.

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured

as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect

to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in

nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in

weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).

Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages

arising in connection with above-mentioned uses of the products.

Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures

by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of

overcurrent levels and other abnormal operating conditions.

Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations

of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.

The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

FUJITSU SEMICONDUCTOR LIMITED

Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome,

Kohoku-ku Yokohama Kanagawa 222-0033, Japan

Tel: +81-45-415-5858

http://jp.fujitsu.com/fsl/en/

AD81-00001-14E January, 2011

Edited: Sales Promotion Department

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System in P

Providing New Technologies for the NearProviding New Technologies for the Near

Electronic products have been in growing demand, such as personal computers, mobile phones

and PDAs, and its technology innovation has constantly come along. The IC technology is

supporting customers to meet market demands today and in the future.

Packaging solutions enable to reduce size and space requirements as a key technology. The

packages such as CSP (Chip Size Package or Chip Scale Package) and BGA (Ball Grid Array)

have supported high-density wiring technology and widely used in the market.

Miniaturization forced the use of new approaches in die packaging in order to achieve the

smallest possible solutions. Leading the van of CSP, Fujitsu Semiconductor has launched the

mass-production packages of SON which was impressed as the world's smallest level.

Fujitsu Semiconductor has a mass-production lineup of super compact packages such as FBGA

(Fine Pitch BGA) and WL-CSP (Wafer Level CSP) and beyond. The high pin count packages,

PBGA (Plastic BGA) and TEBGA (Thermal Enhanced BGA) have been mass-produced in order

to fulfill the size and weight limitations, for example portable equipment.