Fujitsu Stacked/Multi Devices (Stacked MCP) Stackedmcp
User Manual: Fujitsu Stacked/Multi-Devices (Stacked MCP) Packaging ation - Fujitsu United States
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Stacked MCP
Stacked Multi-Chip Package (Stacked MCP) is one of the most suitable chip scale packages for wireless
applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM
configuration, the pin layout can accomodate a 128 MB combination.Typical package construction
consists of two die back lapped down to 100µm and total package height is only 1.2 mm. Different
combinations of Flash and SRAM can be mounted in this package up to package size 10.4 x 10.8mm.
Stacked MCP supports packaging solutions up to 8 die stacked using flip-chip interconnection and
stacked wire bonded die. Additional logic-memory and logic-logic combinations are available.
• Saves board space
• Ideal for integrating technologies or functions in one
single package
• Ideal for combining logic and memory at low cost
• Low profile
25µm Thin Wafer
Advanced Packaging Services
10
Stacked MCP
5-chip stacked
The new module combines advances in wafer thinning technology, which reduces the thickness of existing chips
by about 16% , with chip stacking and re-distribution technologies. Compared to SiPs with similar
functionalities, the prototype chip boasts a 30% reduced board area and 65% thinner profile, making it the ideal
system LSI solution for miniaturized digital equipment.
8-chip stacked
Chip thickness:
50 µm (WB)
{
4 metal-layer interposer
2.0 mm max
{
100 µm (FC)
2 metal-layer interposer
3-chip stacked, wire bonding
Resin
Die
Au Wire
Adhesive
Substrate
Solder Ball
Flip-chip bonding and wire bonding
Resin
Flip-chip bonding
Die
Au Wire
Adhesive
Solder Ball
11
Fujitsu Microelectronics America, Inc.
Substrate
Stacked MCP
Standard Package Line-up
Package Type Package Code
Body Size
(mm)
Pitch
(mm)
Configuration
FBGA61
BGA-61P-M02
9 x 9 x 1.4
0.8
16M Flash + 2M SRAM
FBGA69
FBGA77
BGA-69P-M02
8 x 11 x 1.4
0.8
16M Flash + 4M SRAM
BGA-77P-M01
9 x 14 x 1.4
0.8
32M Flash + 4M SRAM
FBGA73
BGA-73P-M01
8 x 11.6 x 1.4
0.8
32M Flash + 2M SRAM
32M Flash + 4M SRAM
FBGA56
BGA-56P-M01
7 x 7.2 x 1.2
0.8
16M Flash + 2M SRAM
16M Flash + 4M SRAM
FBGA71
BGA-71P-M01
7 x 12 x 1.2
0.8
32M Flash + 8M SRAM
FBGA71
BGA-71P-M02
7 x 11 x 1.2
0.8
32M Flash + 16M SRAM
32M Flash + 4M SRAM
FBGA101
BGA-101P-M01
11 x 12 x 1.4
0.8
64M Flash + 8M SRAM
64M Flash + 16M FCRAM
FBGA123
BGA-123P-M01
11 x 12 x 1.4
0.8
64M Flash (NAND) + 16M FCRAM
FBGA81
BGA-81P-M03
10.4 x 10.8 x 1.2
0.8
64M Flash + 32M FCRAM
FBGA85
BGA-85P-M02
10.4 x 10.8 x 1.3
0.8
64M Flash + 16M FCRAM+ 4M SRAM
64M Flash (NAND) + 32M FCRAM+ 32 FCRAM
FBGA111
BGA-111P-M01
10.4 x 10.8 x 1.4
0.8
64M Flash (NAND) + 32M FCRAM
Custom configurations including non-memory applications are available.
Package Reliability (FBGA69)
Test Item
Condition
Criteria
Result
Temperature Cycle*
-65°C ~ 150°C
200 cycles
Pass
150°C
1008 hours
Pass
Thermal Shock
0°C ~ 100°C
200 cycles
Pass
PTHS*
121°C, 85%
504 hours
Pass
PTHB
121°C, 85%
96 hours
Pass
HTS
* Preconditioning: Baking 125°C, 24 hours, +85°C ~ 85%, 20 hours + IR 250°C max.
Moisture Sensitivity (FBGA69)
Condition
Result
85°C/85%RH, 24 hours + IR250°C
Pass
30°C/80%RH, 240 hours + IR250°C
Pass
Thermal Performance (FBGA69)
θ-ja (°C/W)
0m/sec
45
θ-jc (°C/W)
1m/sec
3m/sec
40
35
10
Advanced Packaging Services
12
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