Gainspan GS780MIZ Bluetooth Smart Module User Manual GS780MIZ Module

Download:
Mirror Download [FCC.gov]
Document ID	3191637
Application ID	4gkMDJA82GvFbIYMvGD0Yw==
Document Description	Users Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	115.73kB (1446676 bits)
Date Submitted	2016-11-09 00:00:00
Date Available	2016-11-10 00:00:00
Creation Date	2017-12-17 13:25:06
Producing Software	GPL Ghostscript 9.18
Document Lastmod	2017-12-17 13:25:06
Document Title	GS780MIZ Module
Document Creator	Writer
Document Author:	GainSpan

GS780MIZ Module
OEM / Integrator Installation Manual
Data Sheet
GS780M-DS-00001
GainSpan® 802.15 Bluetooth® BLE Module
Release 1.03, May 26, 2016
Copyright © 2016 GainSpan. All rights reserved.
GS780MIZ Module
Data Sheet
Table of Contents
Introduction.......................................................................................................................................................... 3
Features.......................................................................................................................................................... 4
References..................................................................................................................................................... 4
Specifications................................................................................................................................................. 5
Pin Assignments................................................................................................................................................ 6
Device Pin-out ............................................................................................................................................... 6
Module Pin Descriptions............................................................................................................................. 7
Port Functions .............................................................................................................................................. 10
Electrical Characteristics............................................................................................................................... 11
Recommended Operating Conditions................................................................................................... 11
Absolute Maximum Specifications [TBD]............................................................................................. 11
Digital I/O Pin Specifications [TBD]....................................................................................................... 11
RL78/G1D..................................................................................................................................................... 12
Packaging and Layout Guidelines.............................................................................................................. 13
Recommended PCB Footprint and Dimensions ............................................................................... 13
Surface Mount Assembly.......................................................................................................................... 16
Moisture Conditions................................................................................................................................... 18
GS780M-DS-00001
Release 1.03
Page 2
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Introduction
The low-power GS780MIZ module adds low-power Bluetooth
connectivity to devices intended for portable applications.
®
low energy technology (BLE), version 4.2,
The module offers extended communication range in single-mode BLE operation with reduced power
consumption for extended battery life. You can operate the GS780MIZin either standalone mode with application
software running on the module, or connected to a microcontroller running the application software and
communicating through a UART or SPI interface. The module operates in the 2.4 to 2.485 GHz frequency range
using spread-spectrum, frequency-hopping, full-duplex modes, and will meet FCC/IC (US/Canada),
CE/ETSI(Europe), and TELEC(Japan) regulatory certification requirements.
The GS780MIZmodule reduces RF design and certification times to facilitate quick time-to-market. The small
form factor and adaptable RF technology, trading off sensitivity, interference and power, permit you to build
products customized to your application requirements. At the GS780MIZcore are,
•
Renesas RL78/G1D
•
program and data flash and SRAM memory
•
Bluetooth low energy technology v4.2 single-mode master/slave RF with on-chip oscillator
•
flexible MCU/RF power management modes
•
real-time clock, watchdog and interval timers
•
A/D converter
•
3-wire serial I/O (CSI), UART, and I2C communication interfaces
NOTE: The module is Bluetooth low energy technology v4.2-qualified by Bluetooth SIG but does not
support long data packets and the latest privacy encryption, which are optional features of the
standard.
GS780M-DS-00001
Release 1.03
Page 3
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Features
16-bit RL78 CPU Core
32 MHz CPU with 1MB
address space.
A/D converter
8-channel, 8/10-bit
resolution
On-Chip RF
Transceiver
Bluetooth low energy
technology v4.2 with 2.4
GHz ISM band, GFSK
modulation, TDMA/TDD
frequency hopping.
I/O Interfaces
• 2x 7/8-bit CSI/SPI
• 2x 7/8/9-BIT UART
• 2x I2C master
• 1x I2C multi-master
• GPIO: 23 ports
Program Flash Memory 256KB ROM, approx.
110KB stack
Power functions
• Power-on reset
• Selectable low voltage
detector
Data Flash Memory
8KB
Package Type, Pin
Count
30-pin
RAM
20KB, approx. 8KB stack
Certifications and
Compliance
FCC, IC, TELEC, CE/ETSI
(planned)
DMA Controller
4 programmable channels,
8/16-bit
Standby function
Reduced current: HALT,
STOP, SNOOZE modes.
Real-time clock
99-year calendar, alarm
and constant period
interrupt.
Low Power Technology Automatically optimizes
power consumption based
on range.
Extended-Function
Timers
Eight 16-bit independent
timers, with two highaccuracy timers.
Eight 12-bit interval timers
with interrupt.
Safety Functions
Watchdog timer
Detect infinite program
loop.
IEC60730- and IEC61508compliant:
• Flash memory CRC
• RAM parity error
• RAM guard
• SFR guard
• Invalid memory access
• Frequency detection
• A/D test
References
•
Renesas RL78/G1D microcontroller documentation
•
Bluetooth SIG
GS780M-DS-00001
Release 1.03
Page 4
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Specifications
Pin Count
30 pins
Package
solder down module; edge pins
RF Output Power (typical)
GS780MIZ:
Rx Sensitivity
GS780MIZ: -91 dBm
RF
0 dBm
Operating Frequency
2.4 GHz
Protocol
IEEE 802.15.1, Bluetooth low energy technology v4.2
Antenna
Ceramic
Operating Temperature
-40to +85C
Encryption
AES128
Certifications and Compliance
planned: FCC, IC, TELEC, CE/ETSI
Safety functions
WDT, TRAP instruction, Flash memory CRC, RAM parity error detection,
Invalid memory access detection, Frequency detection, RAM and SFR guard,
A/DC test
MCU Core
Renesas RL78, 16-bit
Frequency
32 MHz
Internal Flash
256KB program flash (approximately 110KB used for stack)
8KB data flash
RAM
20KB (8KB approximately used for stack)
Memory
External interrupt
3 channels
DMA
4 channels
I/O Interfaces
SPI, UART, simple I2C, multi-master I2C, GPIO, PWM, 10-bit A/D
Host Connections
SPI, UART
Timers
8 16-bit channels
4 channel PWM output, 7 channel multi PWM output
Real-time clock
1 channel
Outline Dimensions
GS780MIZ:
Operating Voltage
1.8-3.6V
GS780M-DS-00001
Release 1.03
12.5mm x 17mm x 2.2mm
Page 5
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Pin Assignments
Device Pin-out
GS780M-DS-00001
Release 1.03
Page 6
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Module Pin Descriptions
Pin no. Pin name Port On Reset
Description
GND
̶
̶
Ground
VDD_RF
̶
̶
Supply for RF
P30
INTP3
I/O
RTC1HZ
P16
Input port External Interupt Input 3
Real-time clock: correction clock (1 Hz) output
Input port I/O
TI01
External count clock/capture 01
TO01
Timer Output 01
INTP5
External Interrupt Input 5
P15
I/O
SCK20
Clock I/O of SPI CSI20
SCL20
Clock Output SPI CSI20
TI02
External count clock/capture 02
TO02
Timer Output 02
P14
I/O
SI20
Data Input SPI CSI20
SDA20
Data I/O I2C20
SCLA0
Data Output I2CA0
TI03
External count clock/capture 03
TO03
Timer Output 03
P13
I/O
SO20
Data Output SPI CSI20
DSAA0
Data I/O I2CA0
TI04
External count clock/capture 04
TO04
Timer Output 04
P12
I/O
SO00
Data Output SPI CSI00
TxD0
Data Output UART0
TOOLTxD
Output UART Flash Memory Programming
TI05
External count clock/capture 05
TO05
Timer Output 05
GS780M-DS-00001
Release 1.03
Page 7
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Pin no. Pin name Port On Reset
10
11
12
13
14
P11
I/O
SI00
Data Input SPI CSI00
RxD0
Data Input UART0
TOOLRxD
Input UART Flash Memory Programming
SDA00
Data I/O IIC00
TI06
External count clock/capture 06
TO06
Timer Output 06
P10
I/O
SCK00
Clock I/O of SPI CSI00
SCL00
Clock Output SPI CSI00
TI07
External count clock/capture 07
TO07
Timer Output 07
GND
P147
ANI18
16
17
̶
̶
14
ANI3
A/D converter analog input
P22
I/O
ANI2
A/D converter analog input
ANI1
Analog Reference Minus
P20
I/O
ANI0
A/D converter analog input
AVREFP
Analog Reference Plus
P03
I/O
ANI16
A/D converter analog input
ANI17
TxD1
20
21
Analog I/O
input port A/D converter analog input
AVREFM
Analog Data Input UART1
input port I/O
P02
19
Analog I/O
input port A/D converter analog input
I/O
RxD1
18
Ground
P23
P21
15
Description
A/D converter analog input
Data Output UART1
P01
TO00
I/O
P00
Input port
TI00
GND
GS780M-DS-00001
Release 1.03
Timer Output 00
I/O
̶
External count clock/capture 00
̶
Ground
Page 8
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Pin no. Pin name Port On Reset
22
23
24
25
26
27
28
29
30
VDDIO
P120
ANI19
P40
TOOL0
̶
̶
INTP0
P121
X1
Supply for Digital IO
12
Analog I/O
input port A/D converter analog input
Input port
̶
̶
13
Input port
12
Input port
nRESET
P137
P61
GS780M-DS-00001
Release 1.03
Programming Pin
Input
External Interrupt Input 0
I/O
General Purpose Input
I/O
Input port
SDAA0
GND
I/O
Active-low system reset input
P60
SCLA0
Description
Data Output I2CA0
I/O
̶
Data Input I2CA0
̶
Ground
Page 9
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Port Functions
GS780M-DS-00001
Release 1.03
Port
Function
4-bit I/O port.
Input/output can be specified in 1-bit units.
Use of an on-chip pull-up resistor can be specified by a
software setting at input port.
Input of P01 and P03 can be set to TTL input buffer.
Output of P00, P02, and P03 can be set to N-ch opendrain output (VDD tolerance).
P02 and P03 can be set to analog input.
7-bit I/O port.
Input/output can be specified in 1-bit units.
Use of an on-chip pull-up resistor can be specified by a
software setting at input port.
Input of P10, P11, and P13 to P16 can be set to TTL
input buffer.
Output of P10 to P15 can be set to N-ch open drain
output (VDD tolerance).
4-bit I/O port.
Input/output can be specified in 1-bit units.
Can be set to analog input.
Input/output can be specified in 1-bit units.
Use of an on-chip pull-up resistor can be specified by a
software setting at input port.
Input/output can be specified in 1-bit units.
Use of an on-chip pull-up resistor can be specified by a
software setting at input port.
2-bit I/O port.
Input/output can be specified in 1-bit units.
N-ch open-drain output (6V tolerance).
12
For only P120, input/output can be specified.
For only P120, use of an on-chip pull-up resistor
can be specified by a software setting at input port.
P120 can be set to analog input.
P121 is input-only.
13
P137 1-bit input-only port.
14
2-bit I/O port.
Input/output can be specified in 1-bit units.
Use of an on-chip pull-up resistor can be specified by a
software setting at input port.
P147 can be set to analog input.
Page 10
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Electrical Characteristics
Recommended Operating Conditions
Characteristic
Value
Supply voltage
Maximum voltage rating
Power consumption
Maximum 3.3V output current draw
Absolute Maximum Specifications [TBD]
Characteristic
Value
Digital I/O Pin Specifications [TBD]
Characteristic
Value
[TBD: POWER CONSUMPTION SPEC, RADIO CHARACTERISTICS SPEC]
GS780M-DS-00001
Release 1.03
Page 11
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
RL78/G1D
Refer to Renesas RL78/G1D Datasheet for details about the electrical characteristics listed in the following table.
Section
Characteristic/Title
Renesas Datasheet
Page Number
2.1
Absolute Maximum Ratings
11
2.2
Operating Voltage
13
2.3
Oscillator Characteristics
14
2.4
DC Characteristics
15
2.5
Current Consumption
19
2.6
AC Characteristics
25
2.7
Peripheral Functions Characteristics
29
2.7.1
Serial array unit
29
2.7.2
Serial interface IICA
54
2.8
Analog Characteristics
58
2.9
RF Transceiver Characteristics
65
2.10
RAM Data Retention Characteristics
72
2.11
Flash Memory Programming Characteristics
72
2.12
Special Flash Memory Programming Communication (UART)
72
2.13
Timing of Entry to Flash Memory Programming Modes
73
NOTE: Document section, title, and page number refer to Renesas document R01DS0258EJ0110
Rev.1.10, dated Sep 25, 2015.
GS780M-DS-00001
Release 1.03
Page 12
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Packaging and Layout Guidelines
Recommended PCB Footprint and Dimensions
The following figures show the module dimensions and recommended footprint. The first figure shows the
recommended PCB antenna keep-out area. The second figure shows the GS780MIZ package dimensions.
(Refer to the notes following the figures for additional mechanical recommendations.)
GS780M-DS-00001
Release 1.03
Page 13
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
GS780M-DS-00001
Release 1.03
Data Sheet
Page 14
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
NOTES:
1. All Dimensions are in millimeters (mm).
2. For Boards using Ceramic Antenna, we recommend:
◦ Have Only Air on BOTH sides of antenna.
◦ Hang Antenna over edge of base board (best);
◦ Or, cut notch in base board under antenna area:
◦ 5mm beyond module edge on each side is good.
◦ full module width is minimum.
◦ No metal or FR4 encircling antenna area.
◦ Antenna at edge of base board, not interior of base board.
◦ Nothing conductive near antenna (e.g. battery, display, wire).
3. Module solder pads on footprint should be the same size as the pads on the module. The
three RF shield mounting holes have exposed metal. These areas must not have metal on the
customer board.
4. For best RF performance, we recommend:
◦ Using power (PWR) or GND planes from module back to power supply.
◦ Isolating PWR/GND from high frequency or high current components. For example, a
notch in GND plane to isolate from host uC.
◦ Using at least three vias when either power or GND changes layers. This applies
particularly at the module GND pins and at the VDD_RF pin.
◦ Providing a 10 uF capacitor at the VDD_RF pin and using three vias both sides of the
capacitor.
◦ Keep high speed signals away from RF areas of module.
5. For area under module, other than the antenna area, we recommend two options:
◦ No metal of any kind under module “not on any layer.”
◦ Having full GND plane under module (layer 1 or layer 2) with no “HOT” vias under
module (over 100KHz), and may route signals below GND plane. Also, no metal traces
are to be present in the circle, around shield and alignment holes. This option is best for
2-layer boards. If GND is on layer 1, use thermal relief pads for the GND pins of the
module footprint.
6. If any metal is present on layer 1, extra thick solder mask under the module is required.
7. In performing SMT or manual soldering of the module to the base board, first align the row
of pins from #11 through #20 onto the base board, then match the other two rows.
1.
2.
3.
4.
5.
GS780M-DS-00001
Release 1.03
In addition to the guidelines, note the following suggestions:
External bypass capacitors for all module supplies should be as close as possible to the
module pins.
Never place the antenna very close to metallic objects.
External monopole antennas need a reasonable ground plane area for antenna efficiency.
Do not use a metallic or metalized plastic for the end product enclosure when using onboard antenna.
If the module is enclosed in a plastic case, have reasonable clearance from plastic case to onboard antenna.
Page 15
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Surface Mount Assembly
The figure shows the reflow profile, and the recommended reflow parameters are summarized in the following
table.
Preheat
Temperature Ramp up rate for (A)2
1.5~3.5 oC/s
Pre-heat time (B)3
80 to 130 seconds
Pre-heat starting temperature (C1)
125 to 135 oC
Pre-heat ending temperature (C2)
180 to 200 oC
Heating
Peak Temperature range (D)
240 to 250 oC
Melting time4 that is the time over 220 oC (E)
50 to 75 seconds
Cool Down Ramp (F)
>2 oC/s
GS780M-DS-00001
Release 1.03
Page 16
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
NOTES:
1. Perform adequate test in advance as the reflow temperature profile varies according to the
conditions of the parts and boards, and the specifications of the reflow furnace.
2. Max number of reflow supported is two.
3. Temperature uniformity inside the IR reflow oven must be tightly controlled and multiple
thermocouples should be used. The locations should also include multiple points INSIDE the
module RF shield. The temperature profile of all thermocouples must meet the requirements
of the above table.
4. Pay close attention to “Melting Time over 220oC”. Sufficient time is needed to completely
melt all solder.
5. Be careful about rapid temperature rise in preheat zone because it can cause excessive
slumping of the solder paste.
6. If the preheat is insufficient, large solder balls tend to be generated. Conversely, if
performed excessively, fine balls and large balls will generate in clusters at a time.
7. If the temperature is too low, non-melting tends to be caused in the area with large heat
capacity after reflow.
8. Be careful about sudden rise in temperature because it may increase the slump of solder
paste.
9. Be careful about slow cooling because it can cause the positional shift of parts and a decline
in joining at times.
10. A no clean flux should be used during the SMT process.
GS780M-DS-00001
Release 1.03
Page 17
Confidential
Preliminary
May 26, 2016
GS780MIZ Module
Data Sheet
Moisture Conditions
The modules are shipped in sealed trays with the following conditions indicated on the label:
GS780M-DS-00001
Release 1.03
Page 18
Confidential
Preliminary
May 26, 2016
FCC Statement:
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:
● Reorient or relocate the receiving antenna.
● Increase the separation between the equipment and receiver.
● Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
● Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
IMPORTANT NOTE:
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator
& your body.
The module is limited to OEM installation only.
OEM Integrators shall be responsible for ensuring that the end-user has no manual / instructions to
remove or install the module.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to
all the rules that apply to the product into which this certified RF module is integrated.
Additional testing and certification may be necessary when multiple modules are used.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm
separation with the antenna while this end product is installed and operated. The end user has to be
informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be
satisfied.
The end user has to also be informed that any changes or modifications not expressly approved by
the manufacturer could void the user's authority to operate this equipment.
If the labelling area is small than the palm of the hand, then additional FCC part 15.19 statement is
required to be available in the users manual: This device complies with Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference
and (2) this device must accept any interference received, including interference that may cause
undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
YOPGS780MIZ ".
If the labelling area is larger than the palm of the hand, then the following FCC part 15.19 statement
has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is
subject to the following two conditions: (1) this device may not cause harmful interference and (2) this
device must accept any interference received, including interference that may cause undesired
operation.
The installation is limited to mobile installation only.
A separate approval is required for all other operating modes not covered in this filing.
IC Statement:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must
accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
IMPORTANT NOTE:
IC Radiation Exposure Statement:
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé.
Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre
corps.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to
all the rules that apply to the product into which this certified RF module is integrated.
Additional testing and certification may be necessary when multiple modules are used.
Any changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm
separation with the antenna while this end product is installed and operated. The end user has to be
informed that the IC radio-frequency exposure guidelines for an uncontrolled environment can be
satisfied.
The end user has to also be informed that any changes or modifications not expressly approved by
the manufacturer could void the user's authority to operate this equipment. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference and (2) this device must
accept any interference received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains IC:
9154A-GS780MIZ ".
The Host Model Number (HMN) must be indicated at any location on the exterior of the end product or
product packaging or product literature which shall be available with the end product or online.

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 1
XMP Toolkit                     : XMP toolkit 2.9.1-13, framework 1.6
About                           : uuid:ae110368-a77d-11f2-0000-02c7314339d4
Producer                        : GPL Ghostscript 9.18
Modify Date                     : 2017:07:23 04:41:02Z
Create Date                     : 2017:07:23 04:41:02Z
Creator Tool                    : UnknownApplication
Document ID                     : uuid:ae110368-a77d-11f2-0000-02c7314339d4
Format                          : application/pdf
Title                           : Untitled

EXIF Metadata provided by EXIF.tools