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GE

Inspection Technologies

SOLDER JOINT INSPECTION AND ANALYSIS

with GE’s phoenix|x-ray microfocus and nanofocus X-ray systems

FAQs about X-ray

X-ray starts with a sample being irradiated by an X-ray source and projected onto a

detector. The geometric magnification M of the image is the ratio of focus-detector

distance (FDD), Focus-object distance (FOD): M=FDD/FOD. The smaller the focal spot,

the greater the resolution. With the nanofocus technology an unique detail detec-

tability down to 0.2 microns can be achieved. phoenix|x-ray systems reach geometric

magnifications over 2,000x resulting in total magnifications beyond 24,000x.

• High power nanofocus X-ray tubes up

to 180 kV and unipolar microfocus X-ray

tubes up to 300 kV maximum voltage.

• Down to 200 nm (0.2 microns) detail

detectability.

• Anti-arcing: dedicated surface treatment

during fabrication and automated warm-

up procedures prevent discharges.

• Self adjustment: all tube adjustments are

performed automatically during warm-up

to achieve optimum results.

• Plug-in cathodes: pre-adjusted spare ca-

thodes prevent malfunction due to wrong

filament adjustment and minimize down-

time to less than 20 min.

• long-life|filament: ensuring high emission

current CT with up to 10 times increased

filament lifetime of directional target

tubes.

• diamond|window: high output of up to

max. 20 W power with high-resolution.

• Target check: target condition is checked

automatically; automatic target wear is

indicated.

One of phoenix|x-ray’s key technology com-

petencies are tube and generator design and

manufacturing ensuring reliable results and

highest up-time.

source

detector

high magnification

object

low magnification

FDD

small FOD large FOD

How X-ray inspection

works

What makes an excellent

X-ray?

The heart of the X-ray machine is an elec-

trodepairconsistingofacathode,thela-

ment, and an anode, that is located inside a

vacuum tube. Current is passed through the

lamentheatingitup,causingthelament

to emit electrons. The positively charged

anode draws the electrons across the tube.

Unlike with conventional X-ray tubes, the

electrons pass through the anode into a spe-

cicallydesignedset-upofelectromagnetic

lenses, where they are bundled and directed

ontoasmallspotonthetarget,aatmetal

disc covered by a layer of tungsten. When

the electrons collide with the target, they in-

teract with the ions in the tungsten, causing

X-rays to be emitted. Key to sharp, crisp

X-ray images at micron or even submicron

resolutions is the size of the focal spot,

meaning the ability to focus the electron

beam in such way that the area on the target

where the electrons hit be as small as pos-

sible – an obstacle yet to be overcome by

conventional X-ray machines.

However, phoenix|x-ray has mastered this

challenge with its unique nanofocus tube

providing detail detectabilities as low as 200

nanometers (0.2 microns).

For ultimate protection of your sample, all

phoenix|x-ray systems come standard with

a password-protected anti-collision fea-

ture. But when inspecting certain samples,

it might become necessary to deactivate

the collision protection, as for example with

25µmbondwires,which,evenformagni-

cations of just 500x, need to be as close as

4 mm to the tube head. phoenix|x-ray has

come up with a solution to give the user

maximumexibilitywhendealingwithvery

small samples: Unlike with conventional

systems, the X-ray tube is located

above the sample tray

allowing the user to

move the sample as

close to the tube head

as needed.

insulator

cathode

(filament)

grid

anode

deflection

unit

magnetic

lens

target

X-ray beam

UGUACC

UH

electron beam

FOD‑=‑4 mm: 500 x Sample touching the tube:

Maximum magnification

How X-ray tubes

work

Why can the collision

protection be deactivated?

GE’s unique 180 kV high power nanofocus X‑ray tube

The View Inside

Why to inspect solder joints with X-ray?

The reliability of electronic assemblies strongly depends on solder joint quality. Acceptability criteria are mainly based on shape

and dimension of the solder joints. As quality demands and technology for assembly process for new package types increase,

many solder joints are no longer directly visible. Fortunately, they can easily be inspected by advanced microfocus and nanofo-

cusX-raysystems.phoenix|x-rayoersdedicatedanalysisandautomaticinspectionsolutionsforanytypeofsolderjoint:

BGA: voiding

BGA: solder bridge

BGA: insufficient reflow

BGA

PCB

Scheme of a BGA solder joint , X‑ray image of a BGA solder joint

(top‑down view)

BGA: warpage

All dimensions and features of the solder joint are imaged: diameter,

thickness (grey value), lands and contact areas (darker and brighter

circles), voids (bright spots). All defects that have any influence on the

solder joint's shape are detectable:

Bridges, opens, missing joints, warpage, popcorning, component tilt,

voids, diameter deviations, roundness, shape deviations (roundness),

fuzzy edges (insufficient reflow), misregistration.

BGA type solder joints such as PBGA, CBGA, CGA, etc.

SMD: crack

SOT: defective paste print

MLF: two open joints

Lead

PCB

Scheme of a Gull Wing (QFP) solder joint, X‑ray image of a QFP

solder joint (top‑down view)

QFP: weak heel fillet

In addition to toe and side fillets the X-ray image reveals hidden fea-

tures of the interconnection: the heel fillet which is most important for

the reliability of the solder joint and voids.

Detectable defects: Bridges (in particular under the component),

opens, defective paste print, insufficient co-planarity, incomplete fil-

lets, de-wetting, insufficient reflow, mis-registration, cracks.

Gull Wing and flat ribbon solder joints such as

QFP, SOT, PLCC, Chip devices etc.

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The Third Dimension

Some acceptability criteria refer to a side view and many

defects can be seen best from the side, in other words, some

information about the vertical dimension is required.

phoenix|x-ray systems provide this information by oblique view

– up to 70 degrees – at highest magnification. As an

example, this enables the user to see open BGA solder joints

directly instead of interpreting signatures.

Just look from the side

ovhm ‑ oblique views at highest magnification

X-ray tube

0 - 70°

detector

Conventional tilting vs. ovhm

Technology

ovhm: Oblique views at highest

magnications

Conventional tilt techniques generate

oblique views by simply tilting the sample

to the side, which involves moving one part

of the sample further away from the X-ray

tuberesultinginadecreaseinmagnica-

tion.Theovhm|modulewasspecically

designed to enable oblique views of up to

70 degrees and 0 to 360 degree rota-

tionswithoutadecreaseinmagnication.

Magnicationremainsthesamebecause

the distance between focus and sample

does not change while the detector is be-

ing tilted.

BGA

PCB

Scheme of non‑wetted BGA land and its detection by

ovhm: the land is empty

BGA

PCB

Scheme of non‑wetted BGA ball and its detection by ovhm:

paste solder and ball are separated

Leads

PCB

Scheme of THT solder joints and their inspection by ovhm: one

through-hole is not lled and the hole plating is not wetted by

the solder

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ovhm: oblique views give excellent information in the vertical direction. At 70 degrees

the prole of these CSP solder joints is fully displayed and even the void position can

be clearly determined. In contrast to 45 degrees, at 70 degrees the component and

board pads are completely separated and can be inspected without any interference.

70°

45°

0°

>

Automated Inspection

Ecientsolderingprocesscontrolrequirestheacquisitionofstatisticaldataonthesolderjointsofalargernumberofsamples.

phoenix|x-rayoersarangeofplug-insoftwaremodulesfortheautomatedevaluationofstandardsolderjointslikeBGA,QFP,

QFN,orPTH.Fornon-typicalinterconnections,appropriatemodulescanquicklybecustomisedwiththeXE²(X-rayimageEvalu-

ationEnvironment)software.TogetherwiththehighprecisionCNCmanipulationwhichcomesstandardwithphoenix|x-ray

systems these modules enable the automated X-ray inspection (AXI) of solder joints at minimum set-up time, due to teach-in

programming and auto-setup routines. An additional software package – quality|review – is the perfect connection to rework.

phoenix|x-ray's inspection modules can also easily be activated during manual inspection as a quick inspection aid.

The efficient way of process control and rework

• Import of CAD-data

• Easypad-basedoineprogramming

• Optimized inspection strategies for

dierentpadtypes

• Fully automated generation of inspection

program even in oblique view and multiple

angular positions per component

• Full program portability for all compatible

phoenix|x-ray inspection systems with

x|act

Automated measurement and compensation

ofheightdierencesanddistortions:

• phoenix|x-ray inspection systems equip-

ped with x|act operator or pro come stan-

dardwithhighprecisionCNCmanipulation

• Local 3D height and distortion referencing

by X-ray

• Highest precision through use of multiple

ducials

• Automated correction of image chain

distortion

• Extremely high positioning accuracy even

at oblique viewing and rotation

• Perfect orientation through live overlay of

CAD-data and test results even in rotated

oblieque views

• Pad ID available at any time

• Inspection results and images include

correct pad numbering for easy rework

• Easypadidenticationeveninmanual

inspection

Visualization of board distortion

Live CAD overlay in ovhm with inspection results

Fast and easy programming: just assign the inspec‑

tion strategies and let x|act generate the automated

inspection program

As a solution for µAXI with high magnification and repeatability, GE provides calibrated high precision offline µAXI systems including the unique

phoenix x|act software package for fast and easy offline CAD programming. Small views with a resolution of up to a few micrometers, 360° rota-

tionandobliqueviewingupto70°ensuretomeethighestqualitystandards.BesidestheautomatedX-rayinspection,theμAXIsystemcanbe

used for manual failure analysis or 3D computed tomography as well.

phoenix x|act µAXI

Fully automated CAD based high-resolution X-ray inspection for extremely high defect coverage

Technology

Inline or oine inspection?

With common inline AXI, the inspection depth is normally determined by the

throughput of the SMT line. Principally, X-ray inspection takes much more time

than AOI. The higher the defect coverage, the more inspection time is required.

For zero defect production inspection with small fields of view with micrometer

resolution, 360° rotation and oblique viewing up to 70° is essential. To ensure

thesehigherdefectcoveragerequirements,μAXIhastobeperformedbeside

the production line.

3D auto-referencing

optimized positioning accuracy

Efficient CAD programming

minimized setup time

Live 3D CAD overlay

highest magnification in oblique view

Anticipating the Future

Technology

What is the difference between

nanofocus and microfocus tubes?

Although the

focal spot of

microfocus tubes

is as small as 3

microns, it is still

large enough

to cause a half

shadow, known

as the penumbra

microfocus system nanofocus system

effect. This results in a residual unsharp-

ness and can be avoided by using nanofo-

custechnology.Nanofocusprovidesfocal

spots well below one micron while main-

taining the highest intensity needed.

source

object

detector

Miniaturization and new assembly tech-

niques demand resolution in the sub-

micron range and also highest contrast

resolution. With the nanofocus tube tech-

nology together with digital image chains

or fully digital detector arrays,

phoenix|x-ray provides proven detail

detectability down to 200 nm (0.2 microns)

combined with superior contrast reso-

lution. In this way fine details and slight

variations in thickness, such as those

caused by tiny voids in microscopic Flip

Chip solder joints are detected.

The combination of phoenix|x-ray's high-power nanofocus

X-ray tube and optimized reconstruction software enables

unprecedented nanoCT® image resolution and quality. This

technology allows the inspection and 3-dimensional visualiza-

tion of the internal details of smaller specimens with submi-

crometer voxel resolution.

The image quality is essential for an optimal defect coverage of all

2D and 3D inspection tasks. Due to its high dynamic, the new active

temperature stabilized GE DXR digital detector arrays ensure a very

low noise fast and detailed live inspection with up to 30 frames per

second at full resolution. This makes it possible to run a 3D CT scan

within only 10 seconds.

nanoCT® of a BGA ball with cracks of 1‑8 µm

Open BGA with head‑in‑pillow‑effect;

metallic dendrites visible in the eutectic matrix

Inspecting the smallest and finest

nanofocus and digital imaging

High dynamic digital detectors

Active temperature stabilization

High-resolution 3D-imaging

nanoCT®

Technology

phoenix|x-ray systems help you

meet the standards

The phoenix|x-ray solder joint inspection

software modules include all X-ray acces-

sible criteria mentioned in the commonly

applied standards for acceptability of PCB

assemblies, namely:

• IPC-A-610 Revision E

• IPC 7095

The modules are continuously updated to

adapt them to revisions of the standards.

40 micron solder bumps at

nanofocus resolution

40 micron solder bumps at

microfocus resolution

Systems

Technology

Closed tube or open tube?

Closed tubes: All tube components are con-

tained in a sealed vacuum vessel container.

Closed tubes are maintenance-free and are

completely replaced at the end of their lifetime.

Open tubes: All components and wear-out parts

are accessible and replaceable, the tube is con-

tinuously evacuated by a turbomolecular pump.

Open tubes yield higher resolution and magnifi-

cation and are not limited in lifetime.

GE’sphoenix|x-raybusinessoersawiderangeofsystemsandsystemcongurationsdedicatedtovarious2Dand3Dinspection

tasks in printed circuit board assembly:

This automated X-ray system with superior

specifications satisfies even the highest

demands: The 180 kV / 15 W high-power

nanofocus tube (4-in-1) covers the full range

from submicron resolution to high intensity

applications. Due to the easy view configu-

ration the X-ray image displays the sample

exactly as the operator sees it through the

radiation protection window. The digital

realtime image chain with 4 MPixel camera

provides an excellent contrast resolution

and enables oblique views up to 70 degrees

and magnifications well above 24,000 x. For

samples of poor contrast the system may be

equipped with a high dynamic fully digital

DXR detector array – as supplement to the

image chain, offering unique performance

and versatility as well as live imaging with up

to 30 fps. Optionally, the nanome|x may be

equipped with nanoCT® capability.

phoenix nanome|x

the ultimate nanofocus X-ray solution

phoenix x|aminer

strong entry-level inspection system

With it’s 160 kV / 20 W microfocus X-ray tube,

GE’s phoenix x|aminer meets the require-

ments for high-resolution X-ray inspection

of electronic assemblies, components and

PCBA. The phoenix x|act base software pack-

age offers ease of use allowing manual as

well as automated solder joint inspection.

Both versions of the nanotom come stan-

dard with a 180 kV / 15 W ultra high-perfor-

mance nanofocus X-ray tube and precision

mechanics for extremely high stability.

With voxel resolution as low as < 500 (s) or

even <300 (m) nanometer and below, the nanotom is the inspection solution of choice for 3D

nanoCT® applications in a wide range of fields. Equipped with its unique high dynamic tem-

perature stabilized 3,072 x 2,400 pixels GE DXR detector, the nanotom m scans samples up

to 240 mm in diameter. With its small footprint, the nanotom is suitable for even the smallest

labs. For many research applications, the nanotom offers even a viable alternative to syn-

chrotron-based computed tomography.

What does “easy and intuitive use“ mean?

• Due to the “Easy View Configuration“ the X-ray image shows the

object exactly as the operator sees it through the radiation

protection window

• Precise and easy operation by using the mouse, joystick or key

board

• phoenix|x-ray systems can be operated in either sitting or standing

position

• Programming is possible in different layers of complexity, each of

them supported by an intuitive graphically oriented or CAD based

user interface

phoenix nanotom s and m

outstanding spatial and contrast

resolution on a wide sample range

phoenix microme|x

automated solder joint inspection

The phoenix microme|x is a high-resolution

automated X-ray inspection (AXI) system

that is suitable for failure analysis in the

semiconductor and electronics industry.

The microme|x combines proven high-

resolution 2D and 3D X-ray technology in

one system. This system comes standard

with an ultra high-performance 180 kV / 20 W

X-ray tube for sub-micron feature recognition

> 0.5 µm and a high-resolution 2 MPixel digital

image chain. The microme|x provides a total

optical magnification of up to 23,320 x and

oblique angle views of up to 70 degrees.

Optionally, it may be equipped with GE’s

DXR digital detector array for brilliant live

imaging and the capability for high-resolu-

tion CT for advanced 3D failure analysis.

The tube makes the difference:

phoenix nanome|x / microme|x

©2011GeneralElectricCompany.AllRightsReserved.Specicationssubjecttochangewithoutpriornotice. nanotom and nanoCT are registered trademarks of General Electric Company. Other company or product

namesmentionedinthisdocumentmaybetrademarksorregisteredtrademarksoftheirrespectivecompanies,whicharenotaliatedwithGE.

GEIT-31101EN (11/11)

Regional Contact Information

Europe, Asia, Africa, South America

GE Sensing & Inspection Technologies

Niels-Bohr-Str.7

31515 Wunstorf

P.O. Box 6241

31510 Wunstorf

Germany

Tel.: +49 5031 172 0

Fax: +49 5031 172 299

E-mail: phoenix-info@ge.com

phoenix-asia@ge.com

Americas

GE Inspection Technologies, LP

50 Industrial Park Rd

Lewistown, PA 17044

USA

Tel.: +1 (717) 242 0327

Fax: +1 (717) 717 242 2606

E-mail: phoenix-usa@ge.com

www.ge-mcs.com/phoenix