GemTek Technology WMDS-203 LPWAN Module User Manual Revised
Gemtek Technology Co., Ltd. LPWAN Module Revised
User manual Revised
Low-Power WAN Module GL6509 General Features General Purpose LoRa module for sensor integration Different versions to support AT commands, ModBus, and generic GPIO and I²C and UART interfaces Compact form factor: 15 x 39 x 2.75 mm Castellation SMT edge for easy PCB mounting Optional version with pin header for quick prototyping High receiver sensitivity: down to -137.5 dBm Industrial grade Operational Single operating voltage at 3.3V Temperature range: -40°C to +85°C Low-power consumption This LPWAN Module GL6509 is a general purpose SMT module for sensor integration. Sensor vendors can speed up their LPWAN integration by embedding this module in their designs. This module will take care of the LPWAN communication with our LPWAN AP and cloud services. There are different integration options: the sensor design can integrate this SMT module via AT command set treating this module as a LPWAN modem; the interface can be via Modbus interface; and the entire sensor be controlled by the MCU of the module through GPIO or I²C or UART. This GL6509 Module complies with the LoRaWAN Class A protocol specifications. It integrates RF, a Low-Power Long Range transceiver and an application MCU. Together with the integration to our LPWAN gateway and back-end cloud service, making this a total IOT network solution. Table of Content 1.0 MODULE OVERVIEW ....................................................................................... 3 2.0 GENERAL SPECIFICATIONS ........................................................................... 6 3.0 TYPICAL HARDWARE CONNECTIONS .......................................................... 9 3.1 INTERFACE TO HOST MCU ................................................................................................... 9 3.2 GPIO AND INTERRUPT PINS ............................................................................................... 10 3.3 ANTENNA CONNECTIONS ................................................................................................... 10 3.4 POWER PIN ........................................................................................................................... 10 3.5 BOOT PIN .............................................................................................................................. 10 3.6 RESET PIN ............................................................................................................................ 10 4.0 PHYSICAL DIMENSIONS ............................................................................... 11 5.0 APPLICATION INFORMATION ......................................... 錯誤! 尚未定義書籤。 6.0 REGULATORY FORMATION..........................…………………………………..14 PRODUCT IDENTIFICATION SYSTEM ................................................................. 16 1 MODULE OVERVIEW The GL6509 module is based on LoRa technology to provide low power long range communication using spread spectrum. This provides very high receive sensitivity enabling communication with high interference immunity. Using LoRa modulation, depending on the spreading factor (SF), GL6509 can achieve system receiver sensitivity of -137.5 dBm. TABLE 1-1: RECEIVER SENSITIVITY OF SYSTEM WITH 125 KHz MODE(UPLINK WITH SX1257) SF Data rate (bit/sec) Sensitivity (dBm) 5469 -130.0 3125 -132.5 1758 -135.0 10 977 -137.5 TABLE 1-2: RECEIVER SENSITIVITY OF MODULE WITH 125 KHz MODE(DOWNLINK) SF Data rate (bit/sec) Sensitivity (dBm) 5469 -125.0 3125 -128.0 1758 -131.0 10 977 -134.0 FIGURE 1-1: GL6509 SMT PIN DIAGRAM(Top View) FIGURE 1-2: GL6509 PIN HEADER PIN DIAGRAM(Top View) TABLE 1-2: SMT PIN DESCRIPTION Pin Name Type Description GND Power System Ground N.C. --- Not Connected PB8 Input/Output GPIO_1 GND Power System Ground GND Power System Ground GND Power System Ground BOOT0 Input Reserved for debug. Not Connected. GND Power System Ground PA3 Input/Output GPIO_2 10 PA2 Input/Output GPIO_3 11 PB6 Input/Output GPIO_4 12 PB7 Input/Output GPIO_5 13 GND Power System Ground 14 PA4 Input/Output GPIO_6 15 PA5 Input/Output GPIO_7 16 PA6 Input/Output GPIO_8 17 PA7 Input/Output GPIO_9 18 GND Power System Ground 19 PA13 Input / Output SWDIO (Debug Port) 20 PA14 Input SWCLK (Debug Port) 21 VDD Power Positive supply 22 PA8 Input/Output GPIO_10 23 GND Power System Ground 24 PA10 Input Communication USART1 Transmit (RX) 25 PA9 Output Communication USART1 Receive (TX) 26 PA11 Input/Output GPIO_11 27 PA12 Input/Output GPIO_12 28 GND Power Supply Ground 29 PB0 Input/Output GPIO_13 30 PB1 Input/Output GPIO_14 31 GND Power System Ground 32 NRST Input MCU Reset 33 N.C. --- Not Connected 34 GND Power Supply Ground 35 GND Power Supply Ground 36 GND Power Supply Ground 37 RF RF Analog RF RX/TX pin 38 GND Power Supply Ground 39 GND Power Supply Ground 2 GENERAL SPECIFICATIONS Table 2-1 provides the general specifications for the module. Table 2-2, Table 2-3 and Table 2-4 provide the electrical characteristics, current consumption and output power of Tx power setting. TABLE 2-1: GENERAL SPECIFICATIONS Specifications Modulation Method LoRa® Technology modulation Maximum Over-the-Air Data Rate 5469 bps RF connection UFL Connector Interface UART (reserve for UART*1, I2C*1, SPI*1) Sensitivity at 10 % BER -137.5 dBm @ Lora Modulation, BW = 125K, SF = 10 Temperature -40°C to + 85°C(Operating) 40°C to + 125°C(Storage) Humidity 10% ~ 90% non-condensing TABLE 2-2: ELECTRICAL CHARACTERISTICS Parameter Min. Typ. Max. Units Supply Voltage, VDD 2.5 --- 3.6 Voltage on any pin with respect to VSS (except VDD) -0.3 --- VDD + 0.3 Output current sunk by any I/O and control pin --- --- 25 mA Output current sourced by any I/O and control pin --- --- -25 mA Input low level voltage, VIL --- --- 0.3VDD Input high level voltage, VIH 0.7VDD --- --- Output low level voltage for an I/O pin, VOL --- --- 1.3 Output high level voltage for an I/O pin, VOH VDD-1.3 --- --- RF Input Level --- --- +10 dBm TABLE 2-3: CURRENT CONSUMPTION Mode Typical current at 3V (mA) Standby 20 Receive 30 Deep Sleep 0.0043 TABLE 2-4: OUTPUT POWER OF TX POWER SETTING (BW=125KHZ) Band 915 MHz TX Power index Output Power(dBm) Current Consumption @ VDD = 3.3V(mA) 2.3 48 3.27 50 4.4 52 5.41 54 6.52 56 7.65 58 8.63 60 9.65 62 10 10.76 66 11 11.73 69 12 12.76 73 13 13.75 77 14 14.74 81 15 15.65 87 16 16.51 95 17 17.29 105 18 17.83 113 19 18.54 123 20 19.15 135 3 TYPICAL HARDWARE CONNECTIONS Figure 3-1 shows the typical hardware connections where GL6509 is connected as a modem. FIGURE 3-1: HARDWARE CONNECTIONS 3.1 INTERFACE TO HOST MCU A typical application of GL6509 is to use the UART connection to communicate with a host controller. In this application, the GL6509 is treated as a LoRa modem. TABLE 3-1: DEFAULT UART SETTINGS Specification Description Baud Rate 9600 bps Data Length 8 bits Parity Bit No Stop Bits 1 bit Hardware Flow Control No 3.2 GPIO AND INTERRUPT PINS The GL6509 has 14 GPIO pins. 3.3 ANTENNA CONNECTIONS There are two versions of antenna connectivity: one via the U.FL connector and the other via the SMT pin (RF Pin 37). 3.4 POWER PIN It is recommended that all the power related pins are connected. 3.5 BOOT PIN This general purpose input pin is used to boot the GL6509 module. This is reserved for debug purpose. Not Connected. 3.6 RESET PIN This input pin is for reset of the module’s MCU. Low active. 4 PHYSICAL DIMENSIONS Figures 4-1 and 4-2 show the physical dimensions for both the SMT and the PIN Header mounted versions. Figure 4-3 shows the module PCB footprint, Figure 4-4 shows the module PIN Header type Pin Number. FIGURE 4-1: GL6509 SMT DIMENSIONS FIGURE 4-2: GL6509 PIN HEADER VERSION DIMENSIONS FIGURE 4-3: GL6509 SMT Type Recommend PCB Footprint. FIGURE 4-4: GL6509 PIN Header Type Pin Number (Bottom view). 5 REGULATORY INFORMATION 5.1 NCC 第十二條→經型式認證合格之低 率或變更原設計之特性及 第十四條→低 改善至無 率射頻電機,非經許 ,公司,商號或使用者均不得擅自變更頻率 大 能 率射頻電機之使用不得影響飛航安 及 擾合法通信;經發現有 低 率射頻電機須忍 擾現象時,應立即停用,並 擾時方得繼續使用 前項合法通信,指依電信法規定作業之無線電通信 電波輻射性電機設備之 1. 本模組於 合法通信或工業 科學及醫療用 擾 得認證後將依規定於模組本體標示審驗合格標籤 2. 系統廠商應於 上標示 本產品 含射頻模組: CCAFXXLPXXXXTX) 字樣 5.2 FCC Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. IMPORTANT NOTE: Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Country Code selection feature to be disabled for products marketed to the US/CANADA Operation of this device is restricted to indoor use only This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna, As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: MXF-WMDS-203”. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. PRODUCT IDENTIFICATION SYSTEM GL6509_A_M_U GL6509: for Gemtek LoRa module model name A: for AT Commands; M: for ModBus; P: Programming M: SMT; P: Pin Header A: Antenna; T: Trace; U: U.FL
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