General Dynamics Broand PEMAAU2 Wireless Broadband Modem User Manual Integration Guide

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Document ID	2091434
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Document Description	Integration Guide
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Date Submitted	2013-10-17 00:00:00
Date Available	2013-10-17 00:00:00
Creation Date	2013-09-30 16:22:32
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Document Lastmod	2013-09-30 16:22:32
Document Title	Integration Guide
Document Creator	Microsoft® Office Word 2007
Document Author:	pwarburg

OEM TD-CDMA PCI Express Module Integration
OEM TD-CDMA PCI Express Mini Module
Integration Guide
V01.01
May 2013
General Dynamics Broadband Proprietary and Confidential
Subject to Non Disclosure Agreement
Page 1 of 20
OEM TD-CDMA PCI Express Module Integration
Contents
General ................................................................................................................ 4
1.1
Approvals and Dates ............................................................................................................... 4
1.2
Change Record ....................................................................................................................... 4
1.3
Acronyms ................................................................................................................................ 5
1.4
External References ................................................................................................................ 5
Introduction .......................................................................................................... 6
2.1
Scope of Document ................................................................................................................. 6
2.2
Overview of Module ................................................................................................................. 6
Module Connections ............................................................................................ 7
3.1
PCI Express Mini Interface (J1) .............................................................................................. 7
3.1.1
Universal Serial Bus ........................................................................................................ 7
3.1.2
SIM Interface ................................................................................................................... 7
3.1.3
Co-existence Pins ........................................................................................................... 7
3.2
RF Connections ....................................................................................................................... 7
3.3
DC Power ................................................................................................................................ 7
3.4
Management of Radio Receiver Self-Interference .................................................................. 8
3.4.1
PCB Level........................................................................................................................ 8
3.4.2
Unit Level......................................................................................................................... 9
3.4.3
Connecting Cables .......................................................................................................... 9
3.4.4
System Level ................................................................................................................... 9
3.4.5
Provision for “Production Modifications” of Host Equipment ......................................... 10
Mechanical ........................................................................................................ 11
4.1
Thermal Management ........................................................................................................... 12
4.1.1
PEM Thermal Specification ........................................................................................... 12
4.1.2
PEM and TD-CDMA Adaptor Thermal Specification ..................................................... 13
4.1.3
Physical Thermal Arrangement – PEM and Adaptor..................................................... 15
4.1.4
PEM and Adaptor Simulated Environment within theoretical enclosure ....................... 16
4.1.5
Recommendations for thermal cooling schemes .......................................................... 17
4.1.6
PEM and Adaptor .......................................................................................................... 17
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OEM TD-CDMA PCI Express Module Integration
4.1.7
Regulatory Information – Model AAU 2.5GHz Band. ......................................... 18
5.1
PEM in Laptop ............................................................................................................... 17
FCC Requirements for North America .................................................................................. 18
5.1.1
Compliance with FCC Rules and Regulations .............................................................. 18
5.1.2
FCC Labelling Requirements ........................................................................................ 18
5.1.3
Exposure to Radio Frequency Signals .......................................................................... 18
5.1.4
Antenna Gains for Standalone Operation ..................................................................... 19
Annex 1: PCI Express Mini Edge Connector Pinout .......................................... 20
Figures
Figure 1: TD-CDMA PEM ........................................................................................................................ 6
Figure 2: TD-CDMA PEM RF Connections ............................................................................................. 7
Figure 3: TD-CDMA PEM Module - detail ............................................................................................. 11
Figure 4: PEM Unit Assembly - Top ...................................................................................................... 12
Figure 5: PEM Unit Assembly Bottom ................................................................................................... 13
Figure 6: PEM and Adapter Assembly - Top ......................................................................................... 14
Figure 7: PEM and Adaptor Assembly - Bottom.................................................................................... 14
Figure 8: PEM and Adapter Thermal Assembly Structure Section ....................................................... 16
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OEM TD-CDMA PCI Express Module Integration
1.1
General
Approvals and Dates
Approval Date
W. J. Jones
1.2
Change Record
Date
Version
Author
30/08/2013
01.00
PFW
New Document.
30/09/2013
01.01
PFW
Updated RF Exposure information
May 2013
Reason For Change Issue
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OEM TD-CDMA PCI Express Module Integration
1.3
Acronyms
Term
Definition
TD-CDMA
Time Division – Code Division Multiple Access
MPE
Maximum Permissible Exposure
OEM
Original Equipment Manufacturer
PCIe
PCI Express
PCI SIG
PCI Special Interest Group
PEM
PCI Express Mini
SIM
Subscriber Identity Module
USB
Universal Serial Bus
1.4
External References
Ref
()
Number
Title
FCC Part 15
Radio Frequency Devices
FCC Part 22
Public Mobile Services
FCC Part 24
Personal Communication Services
FCC Part 27
Miscellaneous Wireless Communications Services
FCC Part 90
Private Land Mobile Radio Services
PCI SIG
PCI Express Base Specification Revision 2.0
PCI SIG
Card Electromechanical Specification Revision 2.0
IPWireless
PEM + Adapter Thermal Specification Revision 1.0
Note:
Where a reference is undated, the latest version applies unless a specific revision is defined.
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OEM TD-CDMA PCI Express Module Integration
Introduction
This document describes the method of integrating the General Dynamics Broadband TD-CDMA PCI
Express Mini module into an OEM product.
2.1
Scope of Document
This document applies to the following General Dynamics Broadband TD-CDMA PCI Express Mini
modules.

2.2
Model: AAU.
Overview of Module
The General Dynamics Broadband TD-CDMA PCI Express Mini module provides a complete TDCDMA wireless modem solution and only requires the module to be inserted in a PCI Express Mini
compliant interface and connection of external antennas. The module is designed to minimise the time
and resource required to integrate TD-CDMA into an end-user product.
Figure 1: TD-CDMA PEM
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OEM TD-CDMA PCI Express Module Integration
Module Connections
3.1
PCI Express Mini Interface (J1)
The General Dynamics Broadband TD-CDMA PCI Express Mini module is provided with a 52 pin edge
connector for connection to the external application. This connection supports the following interface
types and these are described below. The pinout is shown in Annex 1.
3.1.1
Universal Serial Bus
The PCI Express edge connector provides a USB 2.0 interface, this interface supports low speed
(1.5Mbps), full speed (12Mbps) and High speed (480Mbps) operation.
3.1.2
SIM Interface
The PCI Express edge connector provides a 4 line SIM interface to allow use with Subscriber Identity
Modules if required, this interface supports both 1.8V and 3.0V SIM’s. The SIM interface does not
provide ESD protection and this should be provided by the host device.
3.1.3
Co-existence Pins
The co-existence pins COEX1,2 are currently not supported by the TD-CDMA PEM.
3.2
RF Connections
The General Dynamics Broadband TD-CDMA PCI Express Mini module provides two RF connections
for external antennas. The main port must be connected, the diversity port may or may not be
connected depending upon application. The connector type is the Hirose U.FL series.
Diversity Port
Main Port
Figure 2: TD-CDMA PEM RF Connections
3.3
DC Power
The module requires a DC supply of between 3.0V to 3.6VDC with the nominal voltage being 3.3VDC,
maximum input current is 950mA at 3.3VDC (3.1Watts). DC power is applied to the module via the
PCI Express Mini edge connector.
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OEM TD-CDMA PCI Express Module Integration
3.4
Management of Radio Receiver Self-Interference
The General Dynamics Broadband TD-CDMA PEM is supplied as a stand-alone PCI Express Card, or
can be mounted on an General Dynamics Broadband TD-CDMA Adaptor card. It is the customer who
then has to integrate the PEM - either on a Host Circuit Board, or mounted within their own Host
Equipment, at which point, the location of the antennas which connect to the PEM are outside of
General Dynamics Broadband control.
Any radio receiver is susceptible to in-band RF interference in its receive band and it is of paramount
importance that the PEM Host Equipment Integration Design team are aware of and take
countermeasures to prevent all Host Equipment, in-band RF interference from reaching the PEM’s
Antennas.
The PEM as a unit is fully shielded by design, external RF Interference from the Host Equipment is
extremely unlikely to get into the TD-CDMA Radio receiver on the PCB and will be coupled to the
receiver by other means. Any Interference from the Host Equipment in the TD-CDMA receive band(s)
will degrade the TD-CDMA receiver performance if present at the antennas. Any such receiver
interference is a called an RF “Blocking signal”. The closer the TD-CDMA PEM’s antenna system is
relative to the source of any blocking signals, the worse will be the degradation in Rx Sensitivity
suffered by the TD-CDMA PEM and subsequent customer-perceived Host Equipment performance.
Due to the extremely high performance of the TD-CDMA PEM RF Receivers, tiny levels of in-band
interference may cause major loss of performance. To put this in perspective, the Class B EMC limit is
approximately 70dB higher than the smallest signal that the TD-CDMA Receiver can receive (receiver
sensitivity is approximately -123dBm (-16dBµV).
Therefore host equipment which is compliant with relevant EMC emission regulations is likely to cause
interference and performance degradation to the TD-CDMA PEM receivers.
However, all of the EMC design countermeasures must be applied when designing the Host
Equipment, to prevent RF Blocking signals – they are the first line of suppression and are good design
practice. Each engineering discipline: Digital, Power, RF, Mechanical and Thermal must be involved
from the outset, to provide the suppression performance required.
3.4.1
PCB Level
Any PCB with high-clock rate digital signals, imperfect supply rails and any signals with fast edges
must be carefully designed during layout to produce a low emission profile PCB.
By listing the speeds of all clocks, processors and busses, then computing their harmonics up to
2690MHz, it is simple to see which parts of the circuitry are most likely to generate RF Blocking
signals. Believing that any of those harmonics will destroy RF Receiver performance if they are not
suppressed by design and then being meticulous attention during layout are the key to suppressing
them at source.
a. Top and bottom surfaces should be flood-filled with a copper ground plane and tracking on the
outer layers should be avoided.
b. The perimeter of the PCB should have ground copper on each layer and all layers should be
stitched with ground vias.
c.
There must be no slots in the surface ground planes or apertures above fast-moving signals
on inner layers – particularly digital buses.
d. Care should be taken to provide ground current return paths for all power circuitry, for the
digital ICs and particularly the clock ICs.
e. Provision should be made for shielding all components on the PCB.
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OEM TD-CDMA PCI Express Module Integration
f.
3.4.2
Designers must be aware that PCB connectors contain exposed metal which will radiate and
design and shield accordingly. Provision should be provided for options to link connector
shields to PCB ground if the best way is not clear, or is not known.
Unit Level
The ideal way to suppress RF interferers is to enclose all of the active circuitry in a metal can without
holes or joins. Unit level shielding, either SMT or PTH aims go get as close to an ideally shielded metal
box as possible within the constraints of reality – i.e. functionality and cost.
a. SMT shielding should be used to cover all components on each side of any PCB that might
radiate into the Antenna System.
b. The shielding system should be fully integrated with the PCB surface flood fill ground planes
with small distances between connection points.
c.
The shielding system should be un-lidded or have many mechanical connection points around
the perimeter of the lids used.
d. Special attention should be paid to signals that must travel outside of the metal shield to
suppress/filter high speed edges – e.g. R/C filters on LED driving signals.
e. Shielded PCB sockets must be chosen for all interconnect signals and the shield metal must
correctly routed and grounded, separate to any circuit ground or power signals carried within
the connection bus.
f.
Wherever possible, always, filter every interconnect signal, inside the metal shields, with the
appropriate filtering components, including the power signals.
g. Whilst instances are much rarer, it should be noted that the UE Transmit signal is capable of
inducing false edges onto unshielded digital signals when they are operating in close proximity
to antennas carrying pulsed, maximum power Tx signals (notably GSM).
3.4.3
Connecting Cables
Choosing the unshielded version of an interconnect but connector system is a false economy if a high
sensitivity RF receiver antenna is nearby. Always use the shielded system from the outset and design
it in correctly as detailed above. The socket and connector shields are as much part of the shielding as
the flood-fill PCB ground planes.
a. If a cable end-connector does not encompass all of the cable cores with a shield then it will
radiate. Ensure the connector is fully shielded.
b. If the drain wire/foil/sheath of a shielded cable is not correctly connected to the metal shield
within the cable-end connector then it will radiate.
c.
3.4.4
If both ends of a shielded cable cannot be shielded (e.g. 100m Ethernet) then ensure that it is
at the far end of the cable that the shield is not connected, not the TD-CDMA PEM Antenna
end.
System Level
Some choices made at the system level can directly affect the Receive performance on the TD-CDMA
PEM, as follows.
a. If possible, ensure that the main lobes of the PEM’s antenna system (particularly if it is
directional) are not pointing at either the Host Equipment electronics. Assume that all active
electronics radiate RF Blockers until proven otherwise. E.g. If the User Equipment is placed in
the trunk of a vehicle and the antennas are cabled onto the roof of a car, that’s good.
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OEM TD-CDMA PCI Express Module Integration
b. If possible, specify a metal enclosure for the Host Equipment if the PEM’s antennas have to
be, or might be mounted in close proximity.
c.
Provide an RF connection point on the Host Equipment to which the customer can connect an
alternative remote antenna and make the remote antenna available as an approved
accessory.
d. Provide an extension cable with the Host Equipment which will allow the customer to move it
away from interfering equipment and make the extension cable available as an accessory E.g.
a USB cable to allow the Host Equipment to be moved away from a PC.
e. Processor clocks often determine core clocking speeds and bus switching speeds, both of
which use significant power. If possible, select a clock rate which has no in-band harmonics,
ensure the clock rate can be varied or change to a processor that provides this flexibility.
3.4.5
Provision for “Production Modifications” of Host Equipment
Caution: This section only applies to the host equipment, changes to the TD-CDMA PEM are
prohibited.
Sometimes it is not possible to guarantee that the PCB or Unit design will generate RF interference, or
not. In these instances, it is preferable – at least on the initial spin of a PCB to provide features to allow
st
correction of problems without delaying deliveries of 1 Pass or prototype Host Equipment.
1. Kapton tape covered by self-adhesive copper foil can effectively prevent unshielded PTH pins,
SMT Test-points, Debug points or core vias from radiating. Design apertures into the solder
resist to expose bare copper to allow insulative Kapton tape to be applied over the radiators,
then conductive adhesive copper tape over the kapton, which can be stuck to the exposed
copper, if required.
2. RF suppressor material can sometimes suppress RF blocking signals effectively enough to
allow a sub-optimal card to perform adequately whilst a solution is engineered on a following
revision of PCB. It is useful to have a sample stock of various materials, along with space in
the design (in the likely places) to apply RF suppressor materials, if needed.
3. Conductive paint can be retrospectively applied to the inside of plastic enclosures to provide a
level of shielding. The level achieved depends on the design of the enclosure, particularly it’s
split line design and the sizes of vents and holes within it. It is good practice to design to allow
inner paint shielding at the outset, if required.
4. A simple and effective way to determine if a product is being desensitised by RF Blocking from
the Host Electronics is to measure receiver performance, then wrap the entire unit up in an
EMC bag (with just the antennas outside), then re-measure and compare the receiver
performance.
5. Be aware that most consumer electronics (especially PCs) are designed to just pass EMC
Class B limits and are huge sources of RF Blockers/interference for 3G and 4G wireless
systems. When the Host Equipment performs as specified, placing it in close proximity to a
PC, Tablet, TV or even a Phone may destroy TD-CDMA receive performance. The endcustomer must be made tactically aware of this.
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OEM TD-CDMA PCI Express Module Integration
Mechanical
The General Dynamics Broadband TD-CDMA PCI Express Mini module is designed to be installed in
a PCI Express compliant slot capable of holding an F1 full size mini card.
Figure 3: TD-CDMA PEM Module - detail
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OEM TD-CDMA PCI Express Module Integration
4.1
Thermal Management
The General Dynamics Broadband TD-CDMA PCI Express Mini module integration shall be in
accordance with the PCISIG thermal requirements.
This section describes the thermal specifications for the General Dynamics Broadband TD-CDMA PCI
Express Mini Card plus Adaptor and provides recommendations for thermal cooling schemes within
the two configurations and covers the following:
4.1.1
PEM Thermal Specification
Parameter
Rating
Comments
Power Dissipation:
3.1 Watts
@ 3.3VDC
Ambient Air Specification:
-30°C to +70°C
PCI Standard 1.2 -30C to +65C
Maximum Temperature Rise
+25°C
PEM PCB Construction
10 Layer ½ oz copper
Table 1: PEM Thermal Specification
Figure 4: PEM Unit Assembly - Top
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OEM TD-CDMA PCI Express Module Integration
Figure 5: PEM Unit Assembly Bottom
4.1.2
PEM and TD-CDMA Adaptor Thermal Specification
Parameter
Rating
Comments
Power Dissipation:
8.0 Watts
@ 24.0VDC
Ambient Air Specification:
-30°C to +70°C
PCI Standard 1.2 -30C to +65C
Maximum Temperature Rise
+25°C
PEM PCB Construction
10 Layer ½ oz copper
No components fitted to bottom.
Table 2: PEM and Adapter Thermal Specification
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OEM TD-CDMA PCI Express Module Integration
Figure 6: PEM and Adapter Assembly - Top
Figure 7: PEM and Adaptor Assembly - Bottom
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OEM TD-CDMA PCI Express Module Integration
4.1.3
Physical Thermal Arrangement – PEM and Adaptor
This section describes the thermal arrangement of the PEM and Adaptor assembly.
The arrangement is architected to maximize the heat transfer from the PEM to the Adaptor Card by
creating a low thermal resistance between the PEM and the Adapter board. A similar scheme will be
described for laptop installations.
a) The layer structure of PCB – PEM see section 3.1 above, to spread heat to use the full
surface area of the PCB.
b) The layer structure of PCB – PEM Adaptor see section 3.2 above, to spread heat to use the
full surface area of the PCB and to provide a thermal conduction path through the base of the
enclosure.
c) Use of a graphite thermal spreader material on top of top shielding can.
d) Use of an aluminium foil unit label covers top of unit and facilitates conduction and spreader
on the top surface of the PEM unit assembly.
e) graphite spreader/interface material on bottom of bottom snapshot shield to interface between
bottom snapshot and adaptor board.
f)
gaps between components and shielding cans are filled with thermal gasket in the short term,
longer term the shielding can shall be contoured in contact with the components.
g) thermal conduction through the 52way connector has also provided significant thermal
conduction path to the adaptor board.
h) thermal conduction through the SMT threaded mounting bosses on the TD-CDMA PEM
Adaptor PCB.
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OEM TD-CDMA PCI Express Module Integration
4.1.4
PEM and Adaptor Simulated Environment within theoretical enclosure
The PEM and Adaptor has been thermally simulated with the following sectioned enclosure to maintain
a maximum 20°C temperature rise above ambient, i.e. max 90°C ambient.
Enclosure Wall
- aluminium
Thermal Interface gasket material
between top of PEM unit and
enclosure top wall
– top
Thermal Interface gasket material
between bottom of Adaptor PCBA
and enclosure bottom wall
Enclosure Wall
- aluminium
Figure 8: PEM and Adapter
Thermal Assembly Structure Section
– bottom
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OEM TD-CDMA PCI Express Module Integration
4.1.5
Recommendations for thermal cooling schemes
This section specifies the recommendations for the installations for the two configurations below.
4.1.6
PEM and Adaptor Configurations.
PEM in laptop Configurations.
PEM and Adaptor
This configuration is planned to be within a die-cast enclosure and the following features are
recommended to add to the construction.
bottom of TD-CDMA PEM Adaptor to casing small as possible gap filled with an thermal
interface material typically 1mm thermal gasket. Examples of interface material.
T-Global L37-3 or L37-5, thermal conductivity gasket.

http://www.tglobal.com.tw/en/index.php
WL Gore CP6000 or CP8000, thermal conductivity gasket.

http://www.wlgore.com
Top of PEM Assembly cover add thermal gasket to contact interface to enclosure top cover.
Orientation of the enclosure vertical.
Finned externals of the enclosure orientated vertically.
Mounting of the enclosure in an orientation to encourage convective airflow over fins.
Mounting to make use of mounting structure.
Airflow to be encouraged over the surface of the fin as much as possible.
4.1.7
PEM in Laptop
The TD-CDMA PEM has been integrated into two laptops and this has shown that additional thermal
pads are required to be placed between the TD-CDMA PEM and the laptop motherboard to assist the
heat spreading in these host units.
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OEM TD-CDMA PCI Express Module Integration
Regulatory Information – Model AAU 2.5GHz Band.
NOTE: This module is not suitable for installation in products that are required to meet ATEX or other
Hazardous Location requirements.
5.1
FCC Requirements for North America
5.1.1
Compliance with FCC Rules and Regulations
The General Dynamics Broadband PCI Express Mini module AAU, is certified as a module for mobile
applications against FCC Parts 15 & 27 for operation in the EBS/BRS frequency allocation defined as
2496-2690MHz operating as a Time Division Duplex device.
Band
Uplink (Transmit)
Downlink (Receive)
2.5GHz EBS/BRS
2496 – 2690MHz
2496 – 2690MHz
IMPORTANT: Manufacturers of devices containing the General Dynamics Broadband TD-CDMA PCI
Express Mini module Model AAU are advised to.
1. Clarify any regulatory questions, particularly if the host device contains other radio
transceivers.
2. Have their final product tested and approved for compliance with FCC rules.
3. Include instructions with the final product regarding meeting the RF Exposure requirements of
the FCC rules.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
Caution: Changes or modifications not covered in this document must be approved in writing by the
General Dynamics Broadband. Changes or modifications made without written approval may void the
user’s authority to operate this equipment.
5.1.2
FCC Labelling Requirements
This module is certified under FCC ID: PKTPEMAAU2, if the FCC ID on the module label is not visible
from the outside of the host device then an additional label is required on the outside of the host
device.
This label is required to state ‘Contains FCC ID: PKTPEMAAU2’.
5.1.3
Exposure to Radio Frequency Signals
The RF exposure evaluation/compliance of the module is for use in mobile host equipment and the
module should be installed and operated with a minimum separation distance of 20cm between the
antenna and the user, otherwise the host product requires re-approval.
The host equipment manufacturer must supply a user RF exposure warning statement that states a
minimum 20cm usage distance is required from the antenna in order to comply with RF exposure
rules.
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OEM TD-CDMA PCI Express Module Integration
5.1.4
Antenna Gains for Standalone Operation
To comply with FCC rules relating to maximum RF power and RF Exposure, the maximum antenna
gain including cable loss for mobile operation when not co-located with other transmitters must not
exceed the following limits..
Band
Antenna Gain
2.5GHz EBS/BRS
8.5dBi
Please refer to the FCC Grant of Certification.
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OEM TD-CDMA PCI Express Module Integration
Annex 1: PCI Express Mini Edge Connector Pinout
Pin
Name
Pin
Name
51
Reserved
52
+3.3Vaux
49
PCIe - Reserved, rMII - ETH_MDC
50
GND
47
PCIe - Reserved, rMII - ETH_MDIO
48
+1.5V
45
PCIe - Reserved, rMII - ETH_Tx_EN
46
LED_WPAN#
43
GND
44
PCIe - LED_WLAN#, rMII - ADAPTOR_SENSE_2
41
+3.3Vaux
42
LED_WWAN#
39
+3.3Vaux
40
GND
37
GND
38
USB_D+
35
GND
36
USB_D-
33
PCIe - PETp0, rMII - ETH_TXD0
34
GND
31
PCIe - PETn0, rMII - ETH_TXD1
32
SMB_DATA
29
GND
30
SMB_CLK
27
GND
28
+1.5V
25
PCIe - PERp0, rMII - ETH_RXD0
26
GND
23
PCIe - PERn0, rMII - ETH_RXD1
24
+3.3Vaux
21
GND
22
PERST#
19
PCIe - Reserved, rMII - ETH_CLK
20
W_DISABLE#
17
PCIe - Reserved, rMII - ETH_CRS_DIV
18
GND
Mechanical Key
15
GND
16
PCIe - UIM_VPP, rMII - ADAPTER_SENSE_1
13
REFCLK+
14
UIM_RESET
11
REFCLK-
12
UIM_CLK
GND
10
UIM_DATA
CLKREQ#
UIM_PWR
COEX2
+1.5V
COEX1
GND
WAKE#
+3.3Vaux
Key
PCIe, Used by PEM
PCIe Unused/PEM ‘For future Use’
Unused
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