HON HAI PRECISION IND T77H462 802.11abgn+BT4.0 module User Manual

HON HAI Precision Ind. Co., Ltd. 802.11abgn+BT4.0 module

User Manual.pdf

COMPANY CONFIDENTIAL
1
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Prepared by Reviewed by Approved by
Jason Hu Gary Su Chang-fu Lin
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TotalPages ProductRev. Date Sales
39 01S1 20130725 EagleWei
PartName 802.11a/g/n+BT4.0Module
RevisionNoteRev. 3.2
FoxconnPartNo. T77H462.02
LenovoPartNo.
HONHAIPRECISIONIND.CO.,LTD.
5F1,5HsinAnRoad,Hsinchu,
ScienceBasedIndustrialPark
300,Taiwan
Tel:+88635784975 
Revision Note
(
S
p
ecification Sheet
)
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Index
1. REVISION HISTORY ................................................................................................................................................... 3
2. INTRODUCTION .......................................................................................................................................................... 4
2.1 SCOPE ...................................................................................................................................................................... 4
2.2 FUNCTION ................................................................................................................................................................. 4
3. PRODUCT SPECIFICATION ..................................................................................................................................... 5
3.1 HARDWARE CHARACTERISTIC ................................................................................................................................. 5
3.2 HARDWARE ARCHITECTURE .................................................................................................................................... 5
3.3 ELECTRICAL SPECIFICATION .................................................................................................................................... 6
3.4 WLAN RF CHARACTERISTICS ................................................................................................................................. 7
3.4.1 IEEE802.11b .................................................................................................................................................. 7
3.4.2 IEEE802.11g .................................................................................................................................................. 8
3.4.4 IEEE802.11a ................................................................................................................................................ 12
3.5 BLUETOOTH RF SPECIFICATIONS .......................................................................................................................... 18
3.6 INTERFACE TIMING .................................................................................................................................................. 23
3.6.1 SDIO INTERFACE TIMING .................................................................................................................................... 23
3.6.2 UART INTERFACE TIMING ................................................................................................................................... 25
3.7 LGA PIN DEFINITION .............................................................................................................................................. 26
4. MECHANICAL DRAWING ....................................................................................................................................... 30
5. SCHEMATIC REFERENCE DESIGN ..................................................................................................................... 33
6. PCB STACK ............................................................................................................................................................... 34
7. SOFTWARE SUPPORT ............................................................................................................................................ 35
8. REGULATORY ........................................................................................................................................................... 36
9. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ....................................................................... 37
9.1 TEMPERATURE ....................................................................................................................................................... 37
9.2 PCB BENDING ........................................................................................................................................................ 37
9.3 HANDLING ENVIRONMENT ....................................................................................................................................... 37
9.4 STORAGE CONDITION ............................................................................................................................................. 37
9.5 BAKING CONDITION ................................................................................................................................................ 37
9.6 SOLDERING AND REFLOW CONDITION .................................................................................................................... 38
10 PACKAGE INFORMATION ..................................................................................................................................... 39
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1. Revision History
Date Change Note Rev.
2012-12-26 Initial release 1.0
2013-01-18 Modify the Pin definition to PCIeM.2_Rev0.7a and RF connector
information 1.1
2013-04-08
Modify
Section 3.2: Hardware Architecture
Section 3.4: WLAN RF Characteristics
Section 3.6: LGA Pin Definition: add note to some pins
Chapter 4: add note to the mechanical drawing
2.0
2013-04-12
Modify
Section 3.2: Hardware Architecture
Section 3.4: WLAN RF Characteristics
Section 3.6: LGA Pin Definition
Section 5: Schematics reference design
2.1
2013-04-26
Add
Section 3.6: signal level voltage
Modify
Section 3.6: UART_WAKE from platform signal Output to Signal
Input
2.2
2013-06-28
Modify
Section 3.4: WLAN RF Characteristics
Section 3.5: BT RF Characteristics
Add 3.6 interface timing
Section 3.7: Pin definition
Section 4: Mechanical drawing
Section 5: schematics reference design
Section 7: Software support
Section 8: Regulatory
Section 9: environment specification
Section 10:
p
acka
g
e information
3.0
2013-07-02 Modify
Section 3.7: Pin definition, The I/O type of UART pin 54-58 3.1
2013-07-25 Add FCC power table 3.2
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2. Introduction
Project Name: 802.11abgn (2X2) + BT4.0 combo module
This documentation describes the product specification of the WLAN+BT combo Module. WLAN is
Compliant with IEEE 802.11 a/b/g and 2x2 IEEE 802.11n MAC/ baseband/radio, Bluetooth is compliant with
Bluetooth 4.0+HS. This module takes advantage of the high throughput and extended range of Broadcom
second-generation MIMO solution. It is a confidential document of Foxconn.
* For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and
driver to enable or disable 5GHz
2.1 Scope
This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz
and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow
user to switch to different vendors’ Access Points through the wireless networks and to prevent from
eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data rate
provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS15(HT40) with PHY data
rate to 300Mbps by dual stream. Bluetooth is compliant to Core Specification version 4.0.
2.2 Function
¾ Single stream 802.11n support for 20MHz channels provide PHY Layer rates up to 72Mbps.
¾ Dual stream 802.11n support for 20MHz/40MHz channels provide PHY Layer rates up to 300Mbps.
¾ Bluetooth supports Class 1 and Class 2 output power.
¾ Provides a small form factor solution and ultra low power consumption to support low cost
requirement.
¾ Host interface supports:
WLAN: SDIO
BT data: UART
BT digital audio: PCM
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3. Product Specification
3.1 Hardware Characteristic
Form factor 12mmx16mmx1.5mm
Host Interface WLAN: SDIO
BT: UART for data, PCM for Audio
PCB 6-layer HDI design
RF connector Two MHF4 RF connectors on module
3.2 Hardware Architecture
The WLAN+BT combo module is designed base on BROADCOM BCM43241 chip, the Broadcom
BCM43241 is a highly integrated single chip solution for single and dual stream dual-band WLAN and
BT4.0. Single and dual Antenna support, a 37.4MHz crystal is used for reference clock generation, see
the block diagram as below:
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3.3 Electrical Specification
Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the device can occur. Functional
operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended
can adversely affect long-term reliability of the device.
Recommended Operating Condition
Element Symbol Value Unit
Minimum Typical Maximum
DC supply voltage for the device 3.3V 3.0 3.3 3.6 V
Power-Up Sequence Timing
Current Consumption
TBD
Rating Symbol Value Unit
DC supply voltage for the device 3.3V 2.3 to 4.8 V
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3.4 WLAN RF Characteristics
3.4.1 IEEE802.11b
Parameter Condition Min. Type Max. Units
Target Power CH1~CH13, 1~11Mbps 14.5 16.5 17.5 dBm
Spectrum Mask
fc-22MHz<f< fc-11MHz
fc+11MHz<f<fc+22MHz -30
dBr
f<fc-22MHz
f>fc+22MHz -50
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -125
dBm/Hz
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
1,574.4~1,576.4MHz -145
OBW -- 26
MHz
Spread Bandwidth -- 7
RF Carrier Suppression Data=0101 and DQPSK
modulation 15 dB
Transmit power –on ramp 10% to 90% of max power 2 us
Transmit power –down
ramp 90% to 10% of max power 2 us
Center Frequency
Tolerance -20 20 ppm
EVM (peak)
1Mbps 35
%
2Mbps 35
5.5Mbps 35
11Mbps 35
Receiver Minimum Input
Level Sensitivity at Antenna
1 Mbps -95.5 -93
dBm
2 Mbps -93 -90
5.5 Mbps -91 -88
11 Mbps -87.5 -85
Adjacent Channel
Rejection 11Mbps 35 dB
Receiver Maximum
Input Level ALL -6 dBm
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3.4.2 IEEE802.11g
Parameter Min. Type Max. Units
Target Power
CH1~CH13,6~24Mbps 13.5 15.5 16.5
dBm
CH1~CH13, 36~54Mbps 12.5 14.5 15.5
Spectrum Mask
+/- 11MHz -20
dBr +/- 20MHz -28
+/- 30MHz -40
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -125
dBm/
Hz
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -15 dB
Output Spectrum Flatness
In-band -2 2
dB
Out-band -4 2
EVM
6 Mbps -5
dB
9 Mbps -8
12 Mbps -10
18 Mbps -13
24 Mbps -16
36 Mbps -19
48 Mbps -22
54 Mbps -25
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Parameter Min. Type Max. Units
Receiver Minimum Input
Level Sensitivity at the
Antenna
6 Mbps -91.5 -89
dBm
9 Mbps -89 -86
12 Mbps -87.5 -85
18 Mbps -85.5 -83
24 Mbps -81.5 -79
36 Mbps -79 -76
48 Mbps -75.5 -73
54 Mbps -73 -70
Adjacent Channel Rejection
6 Mbps 16
dB
9 Mbps 15
12 Mbps 13
18 Mbps 11
24 Mbps 8
36 Mbps 4
48 Mbps 0
54 Mbps -1
Receiver Maximum Input
Level ALL -16 dBm
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
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3.4.3 IEEE802.11gn HT20 Single chain
Parameter Min. Type Max. Units
Target Power
CH1~CH13,MCS0~MCS4 12.5 14.5 15.5
dBm
CH1~CH13,MCS5~MCS7 11.5 13.5 14.5
Spectrum Mask
+/- 11MHz -20
dBr +/- 20MHz -28
+/- 30MHz -45
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -125
dBm/
Hz
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -20 dB
Output Spectrum Flatness
Inband -2 2
dB
Outband -4 2
EVM
MCS0 Mbps -5
dB
MCS1 Mbps -10
MCS2 Mbps -13
MCS3 Mbps -16
MCS4 Mbps -19
MCS5 Mbps -22
MCS6 Mbps -25
MCS7 Mbps -28
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Parameter Min. Type Max. Units
Receiver Minimum Input
Level Sensitivity at the
Antenna
MCS0 Mbps -89.5 -87
dBm
MCS1 Mbps -86.5 -84
MCS2 Mbps -84 -81
MCS3 Mbps -80.5 -78
MCS4 Mbps -77.5 -75
MCS5 Mbps -73 70
MCS6 Mbps -72 -69
MCS7 Mbps -71 -68
Adjacent Channel Rejection
MCS0 Mbps 16
dB
MCS1 Mbps 13
MCS2 Mbps 11
MCS3 Mbps 8
MCS4 Mbps 4
MCS5 Mbps 0
MCS6 Mbps -1
MCS7 Mbps -2
Receiver Maximum Input
Level ALL -16 dBm
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
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3.4.4 IEEE802.11a
Parameter Min. Type Max. Units
Target Power
B1,B2,B3,B4,6~24Mbps 13.5 15.5 16.5
dBm
B1,B2,B3,B4, 36~54Mbps 12.5 14.5 15.5
Spectrum Mask
+/- 11MHz -20
dBr +/- 20MHz -28
+/- 30MHz -40
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -125
dBm/
Hz
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -15 dB
Output Spectrum Flatness
In-band -2 2
dB
Out-band -4 2
EVM
6 Mbps -5
dB
9 Mbps -8
12 Mbps -10
18 Mbps -13
24 Mbps -16
36 Mbps -19
48 Mbps -22
54 Mbps -25
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Parameter Min. Type Max. Units
Receiver Minimum Input
Level Sensitivity at the
Antenna
6 Mbps -92 -89
dBm
9 Mbps -88.5 -86
12 Mbps -86.5 -84
18 Mbps -84.5 -82
24 Mbps -81.5 -79
36 Mbps -78.5 -76
48 Mbps -74.5 -72
54 Mbps -73 -70
Adjacent Channel Rejection
6 Mbps 16
dB
9 Mbps 15
12 Mbps 13
18 Mbps 11
24 Mbps 8
36 Mbps 4
48 Mbps 0
54 Mbps -1
Receiver Maximum Input
Level ALL -26 dBm
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
B1:5180~5240MHz; B2: 5260~5320MHz; B3:5500~5700MHz; B4:5745~5825MHz
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3.4.5 IEEE802.11an HT20 Single chain
Parameter Min. Type Max. Units
Target Power
B1,B2,B3,B4;MCS0~MCS4 12.5 14.5 15.5
dBm
B1,B2,B3,B4;MCS5~MCS7 11.5 13.5 14.5
Spectrum Mask
+/- 11MHz -20
dBr +/- 20MHz -28
+/- 30MHz -45
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -125
dBm/
Hz
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -20 dB
Output Spectrum Flatness
In-band -2 2
dB
Out-band -4 2
EVM
MCS0 Mbps -5
dB
MCS1 Mbps -10
MCS2 Mbps -13
MCS3 Mbps -16
MCS4 Mbps -19
MCS5 Mbps -22
MCS6 Mbps -25
MCS7 Mbps -28
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Parameter Min. Type Max. Units
Receiver Minimum Input
Level Sensitivity at the
Antenna
MCS0 Mbps -90 -87
dBm
MCS1 Mbps -87.5 -85
MCS2 Mbps -84.5 -82
MCS3 Mbps -81.5 -79
MCS4 Mbps -78.5 -76
MCS5 Mbps -74 -71
MCS6 Mbps -72.5 -70
MCS7 Mbps -71 -68
Adjacent Channel Rejection
MCS0 Mbps 16
dB
MCS1 Mbps 13
MCS2 Mbps 11
MCS3 Mbps 8
MCS4 Mbps 4
MCS5 Mbps 0
MCS6 Mbps -1
MCS7 Mbps -2
Receiver Maximum Input
Level ALL -26 dBm
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
B1:5180~5240MHz; B2:5260~5320MHz; B3:5500~5700MHz; B4:5745~5825MHz
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3.4.6 IEEE802.11an HT40 Single chain
Parameter Min. Type Max. Units
Target Power
B1,B2,B3,B4;MCS0~MCS4 12.5 14.5 15.5
dBm
B1,B2,B3,B4;MCS5~MCS7 11.5 13.5 14.5
Spectrum Mask
+/- 11MHz -20
dBr +/- 20MHz -28
+/- 30MHz -45
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -125
dBm/
Hz
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -20 dB
Output Spectrum Flatness
In-band -2 2
dB
Out-band -4 2
EVM
MCS0 Mbps -5
dB
MCS1 Mbps -10
MCS2 Mbps -13
MCS3 Mbps -16
MCS4 Mbps -19
MCS5 Mbps -22
MCS6 Mbps -25
MCS7 Mbps -28
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Parameter Min. Type Max. Units
Receiver Minimum Input
Level Sensitivity at the
Antenna
MCS0 Mbps -87.5 -85
dBm
MCS1 Mbps -84.5 -82
MCS2 Mbps -82.5 -80
MCS3 Mbps -78.5 -76
MCS4 Mbps -75.5 -73
MCS5 Mbps -71 -68
MCS6 Mbps -69.5 -67
MCS7 Mbps -68 -65
Adjacent Channel Rejection
MCS0 Mbps
dB
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
Receiver Maximum Input
Level ALL -26 dBm
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
B1:5190~5230MHz; B2:5270~5310MHz; B3:5510~5670MHz; B4:5755~5795MHz
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3.5 Bluetooth RF Specifications
¾ Bluetooth Core Specification version 4.0:
¾ Host interface: UART, baud rates up to 4Mbps
¾ Support all Bluetooth 4.0+HS packet types.
¾ Operating frequency range: 2400MHz ~2483.5MHz
¾ Modulation type:
Basic rate 1Mbps: GFSK,
Enhanced data rate 2Mbps: QPSK
Enhanced data rate 3Mbps: 8PSK
Parameter Condition Specification Units
Min Typ Max
Basic Data Rate – Transmit Performance
RF Transmit Power at the Antenna +5 8 +11 dBm
Tx Output Spectrum
-20 dB Bandwidth 1
MHz
Frequency range 83.5
Initial Carrier Frequency Tolerance  ±75 KHz
Carrier Frequency Drift
DH1/3/5 Drift rate  ±20 kHz/50 s
DH1 <±20
KHz
DH3  ±40
DH5 <±40
Modulation Characteristics
F1avg 140<f1avg<175
kHz
F2max  115
F2avg/F1avg 80 %
Adjacent Channel Transmit
Power
+/-500KHz -27 dBc
|M-N|=2 -20
dBm
|M-N|3 -40
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -130
dBm/
Hz
869~894MHz -135
925~960MHz -135
1,805~1,880MHz -135
1,930~1,990MHz -135
2,110~2,170MHz -135
1,574.4~1,576.4MHz -150
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Parameter Condition Specification Units
Min Typ Max
Enhanced Data Rate – Transmit Performance
RF Transmit Power
/4 DQPSK +3 6 +9
dBm
8DPSK +3 6 +9
Relative Transmit Power Pdpsk (PGFSK-4 dB)<PDPSK<(PGFSK+1 dB)
Carrier Frequency Stability
i -75 75
kHz
0 -10 10
i +Ԁ0 -75 75
Modulation Accuracy – RMS
DEVM
/4 DQPSK  20
%
8DPSK  13
Modulation Accuracy – Peak
DEVM
/4 DQPSK  35
8DPSK  25
Modulation Accuracy – 99%
DEVM
/4 DQPSK  30
8DPSK  20
In-band Spurious Emissions
f>f0+3 MHz  -40
dBm
f<f0-3 MHz  -40
f=f0-3 MHz  -40
f=f0-2 MHz  -20
f=f0-1 MHz  -26
dBr
f=f0+1 MHz  -26
f=f0+2 MHz  -20
dBm
f=f0+3 MHz  -40
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Parameter Condition Specification Units
Min Typ Max
EDR Differential Phase Coding
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -130
dBm/
Hz
869~894MHz -135
925~960MHz -135
1,805~1,880MHz -135
1,930~1,990MHz -135
2,110~2,170MHz -135
1,574.4~1,576.4MHz -150
Basic Data Rate – Receiver Performance at the Antenna
Sensitivity (DH1) at 0.1% BER Nominal -90 -88 dBm
C/I Performance at BER0.1%
Co-ch interface C/Ico <11
dB
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz < 0
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz <-30
Adjacent Chanel Sensitivity C/I
ff0±3 MHz < -40
Image Ch interference C/Iimage < -9
Image Ch interference C/Iimage
1MHz < -20
Blocking Performance at
BER0.1%
30MHz~2GHz -10
dBm
2GHz~2.4GHz -27
2.5GHz~3GHz -27
3GHz~12.75GHz -10
Intermodulation Performance at
BER0.1% Carrier Level:-64dBm -39 dBm
Max input Level -20 dBm
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
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Parameter Condition Specification Units
Min Typ Max
Enhanced Data Rate – Receiver Performance at the Antenna
Sensitivity at
BER0.01% Nominal
/4 DQPSK(ch0~78) -92 -90
dBm
8DPSK(ch0~78) -86 -84
Max input Level
/4 DQPSK -20
dBm
8DPSK -20
C/I Performance at
BER0.1%(/4 DQPSK)
Co-ch interface C/Ico <13
dB
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz < 0
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz <-30
Adjacent Chanel Sensitivity C/I
ff0±3 MHz < -40
Image Ch interference C/Iimage < -7
Image Ch interference C/Iimage
1MHz < -20
C/I Performance at
BER0.1%(8DPSK)
Co-ch interface C/Ico <21
dB
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz < 5
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz <-25
Adjacent Chanel Sensitivity C/I
ff0±3 MHz < -33
Image Ch interference C/Iimage < -0
Image Ch interference C/Iimage
1MHz < -13
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
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BLE RF specification:
Parameter Condition Specification Units
Min Typ Max
BLE RF specification:
Sensitivity at
BER0.01% Nominal GFSK 0.1%, 1M -91.5 -89.5 dBm
RF Transmit Power GFSK 2 5 8 dBm
Mod char:delta f1 average 225 275 kHz
Mod char:delta f2 max 99.9 %
Receiver Spurious
<1GHz -54
dBm 1~10GHz -54
10GHz~ -54
Transmission Spurious
Emission-1
f<2.387GHz -26
dBm
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
f>2.4965 GHz -26
Transmission Spurious
Emission-2
470~805MHz -130
dBm/
Hz
869~894MHz -135
925~960MHz -135
1,805~1,880MHz -135
1,930~1,990MHz -135
2,110~2,170MHz -135
1,574.4~1,576.4MHz -150
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3.6 Interface timing
3.6.1 SDIO Interface timing
SDIO Default Mode Timing
SDIO Bus Timing Parameters (Default Mode)
Parameter Symbol Minimum Typical Maximum Unit
SDIO CLK (All values are referred to minimum VIH and maximum VILb)
Frequency – Data Transfer mode fPP 0 - 25 MHz
Frequency – Identification mode fOD 0 - 400 kHz
Clock low time tWL 10 - - ns
Clock high time tWH 10 - - ns
Clock rise time tTLH - - 10 ns
Clock low time tTHL - - 10 ns
Inputs: CMD DAT (referenced to CLK)
Input setup time tISU 5 - - ns
Input hold time tIH 5 - - ns
Outputs: CMD, DAT (referenced to CLK)
Output delay time – Data Transfer mode tODLY 0 - 14 ns
Output delay time – Identification mode tODLY 0 - 50 ns
a. TimingisbasedonCL Љ 40pFloadonCMDandData.
b. min(Vih)=0.7xVDDIOandmax(ViL)=0.2xVDDIO.
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SDIO High-Speed Mode Timing
SDIO Bus Timing Parameters (High-Speed Mode)
Parameter Symbol Minimum Typical Maximum Unit
SDIO CLK (All values are referred to minimum VIH and maximum VILb)
Frequency – Data Transfer mode fPP 0 - 50 MHz
Frequency – Identification mode fOD 0 - 400 kHz
Clock low time tWL 7 - - ns
Clock high time tWH 7 - - ns
Clock rise time tTLH - - 3 ns
Clock low time tTHL - - 3 ns
Inputs: CMD DAT (referenced to CLK)
Input setup time tISU 6 - - ns
Input hold time tIH 2 - - ns
Outputs: CMD, DAT (referenced to CLK)
Output delay time – Data Transfer mode tODLY - - 14 ns
Output hold time tOH 2.5 - - ns
Total system capacitance (each line) CL - - 40 pF
a. TimingisbasedonCL Љ 40pFloadonCMDandData.
b. min(Vih)=0.7xVDDIOandmax(ViL)=0.2xVDDIO.
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3.6.2 UART Interface timing
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3.7 LGA Pin Definition
- Module pin-out definition:
- Platform pin-out definition:
ToP View
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- Pin definition (module point of view):
Pin No. Pin Name Type Description Voltage
1-3
UIM_power_in/GPIO1
UIM_power_out
UIM_SWP
I/O No connection -
4-5 3.3V Power Power voltage input pin 3.3V
6 GND GND Ground -
7 Reserved I/O Reserved LGA pin -
8*(a) ALERT - No connection -
9*(a) I2C CLK - No connection -
10*(a) I2C DATA - No connection -
11*(a) COEX1 - No connection -
12*(a) COEX2 - No connection -
13*(a) COEX3 - No connection -
14-15 SYSCLK/GNSS0
TX_Blanking/GNSS1 -Reserved LGA pin, No connection
16 Reserved I/O Reserved LGA pin, No connection
17 GND GND Ground
18-19 Reserved - Reserved LGA pin, No connection
20 GND GND Ground
21-22 Reserved - Reserved LGA pin, No connection
23 GND GND Ground
24-25 Reserved - Reserved LGA pin, No connection
26 GND GND Ground
27 SUSCLK (32KHz) I
32.768 kHz clock supply input that is provided by
PCH to reduce power and cost for the module.
SUSCLK will have a duty cycle that can be as low
as 30% or as high as 70%. 200ppm.
3.3V
28 W_DISABLE#1 I No connection
29*(a) PEWAKE# - No connection -
30*(a) CLKREQ# - No connection -
31*(a) PERST# - No connection -
32 GND GND Ground
33*(a) REFCLKN0
-No connection -
34*(a) REFCLKP0
35 GND GND Ground
36*(a) PETn0 - No connection -
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37*(a) PETp0
38 GND GND Ground
39*(a) PERn0
-No connection -
40*(a) PERp0
41 GND GND Ground
42-44 Reserved - Reserved LGA pin, No connection
45 SDIO Reset I
SDIO sideband GPIO pin to enable/disable (reset)
the WiFi function. Platform firmware is required to
assert/de-assert this pin on every boot (warm and
cold). The WiFi device may use 0.5 to 1 mW in
reset, Active Low
1.8V
46 SDIO Wake O
SDIO Host Wake. Note in band SDIO wake is not
used for non-active modes, Active Low. Require
pull up on the host side ( recommended 15K to
100K )
1.8V
47 SDIO DATA3 I/O 4 lines for SDIO data exchange 1.8V
48 SDIO DATA2 I/O 4 lines for SDIO data exchange 1.8V
49 SDIO DATA1 I/O 4 lines for SDIO data exchange 1.8V
50 SDIO DATA0 I/O 4 lines for SDIO data exchange 1.8V
51 SDIO CMD I/O SDIO Command Interface 1.8V
52 SDIO CLK I SDIO 3.0 Clock 1.8V
53 UART WAKE O Bluetooth host Wake. Active Low 3.3V
54 UART CTS IUART Clear To Send, Active low, connected to
UART RTS on the platform. 1.8V
55 UART TX OUART Transmit Data, connected to UART RX on
the platform. 1.8V
56 UART RX IUART Receive Data, connected to UART TX on
the platform. 1.8V
58 UART RTS OUART Request To Send, Active low, connected to
UART CTS on the platform. 1.8V
58 PCM FR1 I/O PCM Synchronous data sync/ I2S Word Select 1.8V
59 PCMIN I PCM Synchronous data input/ I2S Serial Data IN 1.8V
60 PCMOUT O
PCM Synchronous data output/ I2S Serial Data
OUT 1.8V
61 PCMCLK I/O PCM Clock/ I2S Continuous Serial Clock (SCK) 1.8V
62 GND GND Ground
63 W_DISABLE#2 I Active low, debounced signal when applied by the
platform it will disable BT radio operation 3.3V
64 LED#2 - No connection -
65 LED#1 - No connection -
66-67 Reserved - Reserved LGA pin
68 GND GND Ground
69*(a) USB_D-
-No connection -
70*(a) USB _D+
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71 GND GND Ground
72-73 3.3V Power Power voltage input pin 3.3V
74-76,
others GND GND Ground
The pin-out definition is following NGFF1216, but removed some functions such as PCIE, BT_USB.
*(a) FOXCONN remove the function according to BCM43241function.
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4. Mechanical Drawing
4.1 NGFF Type 1216 specification from PCI-e M.2_Rev0.7a
- The on board RF connector and plug mating height would be 1.2 mm max.
- Only Ant1 and Ant3 on this module.
4.2 T77H462.02 module drawing
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4.3 RF connector:
- New RF connector is needed, for lower z-height and smaller footprint
- Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable
- Cable diameter determines mated height: 1.2mm mated height with 0.81mm cable
4.4 Example of IPEX RF connector
IPEX P/N: 20449-001E (MHF4)
IPEX P/N: 20448-001R-081
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5. Schematic Reference Design
z Module pin-out & 32.768kHz
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z Audio PCM interface:
6. PCB Stack
6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.3+/-0.03mm
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7. Software Support
- Operating System Support
Windows 8
Windows Blue or later Android 4.3 and above
- WLAN Feature Support
WiFi Direct
WiFi Display
Wi-Fi Miracast (Intel will support WiDi with Miracast interoperability)
- WLAN Security Support
WPA/WPA2 Enterprise
CCX Lite or higher
WMM/AES/TKIP/CKIP
- WLAN Transmit Power Reduction
Software control to meet FCC SAR requirement
Capability to disable 5GHz operation
- Bluetooth Profile Support
A2DP-Sink
A2DP-Source
AV R C P - Ta r g e t
DUN-DT
FTP-Client
FTP-Server
HCRP-Client
HID-Host
MCAP
OPP-Client
OPP-Server
PAN-User
SDP
Serial-DevA
Serial-DevB
- BLE (Bluetooth Low Energy) Support
Windows 8
Windows Blue or later
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8. Regulatory
¾ USA : FCC P15B / FCC P15C / FCC P15E
¾ Canada : IC RSS-210
¾ Japan : TELEC
¾ EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd
BCM43241 module 5GHz power table :
˧̌̃˼˶˴˿ʳ̃̂̊˸̅ʳʻ˿˼̀˼̇ʳ˼̆ʳʾ˄˂ˀ˅˷˕ʼʳʻ̈́˼̇ˍ˷˕̀ʼ
˛˧˅˃ ˖˛ˆˉ ˖˛ˇˋ ˖˛ˈ˅ ˖˛ˉˇ ˖˛˄˃˃ ˖˛˄˅˃ ˖˛˄ˇ˃ ˖˛˄ˇˌ ˖˛˄ˉˈ
ˉ̑˅ˇˠ˵̃̆ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˇ ˄ˈˁˈ ˄ˈˁˈ ˄ˆˁˈ ˄ˈˁˈ ˄ˈˁˈ
ˆˉ̑ˈˇˠ˵̃̆ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇ ˄ˇˁˈ ˄ˇˁˈ ˄ˆˁˈ ˄ˇˁˈ ˄ˇˁˈ
ˠ˖˦˃̑ˠ˖˦ˇ ˄ˆ ˄ˆ ˄ˇˁˈ ˄ˆˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄˅ˁˈ ˄ˇˁˈ ˄ˇˁˈ
ˠ˖˦ˈ̑ˠ˖˦ˊ ˄ˆ ˄ˆ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄˅ˁˈ ˄ˆˁˈ ˄ˆˁˈ
ˠ˖˦ˋ̑ˠ˖˦˄˅ ˄ˉ ˄ˉ ˄ˊˁˈ ˄ˉˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˈˁˈ ˄ˊˁˈ ˄ˊˁˈ
ˠ˖˦˄ˆ̑ˠ˖˦˄ˈ ˄ˉ ˄ˉ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˈˁˈ ˄ˉˁˈ ˄ˉˁˈ
ˡ̂̇˸ˍ˹̂̅ʳ˙˖˖ʿ̇˻˸ʳ̃̂̊˸̅ʳ˿˼̀˼̇ʳ˼̆ʳ˄ˊ˷˕̀ʳ˹̂̅ʳ˕˔ˡ˗˜ʳʻˈ˄ˋ˃̑ˈ˅ˇ˃ˠ˛̍ʼ
˛˧ˇ˃ ˖˛ˆˋ ˖˛ˇˉ ˖˛ˈˇ ˖˛ˉ˅ ˖˛˄˃˅ ˖˛˄ˆˇ ˖˛˄ˈ˄ ˖˛˄ˈˌ
ˠ˖˦˃̑ˠ˖˦ˇ ˄˄ˁˈ ˄ˆ ˄ˇˁˈ ˄˄ˁˈ ˄ˆˁˈ ˄ˆ ˄ˇˁˈ ˄ˇˁˈ
ˠ˖˦ˈ̑ˠ˖˦ˊ ˄˄ˁˈ ˄ˆ ˄ˆˁˈ ˄˄ˁˈ ˄ˆˁˈ ˄ˆ ˄ˆˁˈ ˄ˆˁˈ
ˠ˖˦ˋ̑ˠ˖˦˄˅ ˄ˇˁˈ ˄ˉ ˄ˊˁˈ ˄ˇˁˈ ˄ˉˁˈ ˄ˉ ˄ˊˁˈ ˄ˊˁˈ
ˠ˖˦˄ˆ̑ˠ˖˦˄ˈ ˄ˇˁˈ ˄ˉ ˄ˉˁˈ ˄ˇˁˈ ˄ˉˁˈ ˄ˉ ˄ˉˁˈ ˄ˉˁˈ
BCM43241 module 2.4GHz power table
˧̌̃˼˶˴˿ʳ̃̂̊˸̅ʳʻ˿˼̀˼̇ʳ˼̆ʳʾ˄˂ˀ˅˷˕ʼʳʻ̈́˼̇ˍ˷˕̀ʼ
˛˧˅˃ ˖˛˄ ˖˛˅ ˖˛ˆ ˖˛ˇ ˖˛ˈ ˖˛ˉ ˖˛ˊ ˖˛ˋ ˖˛ˌ ˖˛˄˃ ˖˛˄˄
˄̑˄˄ˠ˵̃̆ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉ
ˉ̑˅ˇˠ˵̃̆ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˆ
ˆˉ̑ˈˇˠ˵̃̆ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˆ
ˠ˖˦˃̑ˠ˖˦ˇ ˄ˇ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˆˁˈ
ˠ˖˦ˈ̑ˠ˖˦ˊ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ
ˠ˖˦ˋ̑ˠ˖˦˄˅ ˄ˊ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˉˁˈ
ˠ˖˦˄ˆ̑ˠ˖˦˄ˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ
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9. Environmental Requirements and Specifications
9.1 Temperature
9.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating in ambient temperature of
0 °C to +70°C.
9.1.2 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored
to the operating temperature when exposed to storage temperature in the range of -10°C to +85°C.
9.2 PCB bending
The PCB bending spec limits plainness under 0.1mm for both Foxconn and end assembly customer.
9.3 Handling environment
ESD:
There are semiconductors on the module, please handle the module under ESD protected and
well-controlled environment (<100V).
Terminals Handling Notice
The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.
Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and
real for packaging materials have no heat resistance, please bake the components moved into another
container such as heat resistance trays.
Others:
1. Please make sure to avoid mechanical shock and vibration for this module.
2. Please do not drop the module.
3. Please do not clean the module.
9.4 Storage Condition
1. Moisture barrier bag must be stored under 40 к, humidity under 90% RH, when the moisture barrier bag
is sealed by Foxconn.
2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.
3. If Moisture barrier bag is open, the component must be stored in an environment of <25 5 /10%RH
4. Please keep the module at 30к/70% RH.
9.5 Baking Condition
The module would be required for baking if:
1. Humidity indicator cards read >30%
2. Temp < 30 к, Humidity <70%RH, moisture barrier bag open over 96 hours
The baking criteria would be:
1. Baking condition: 90 к, 12-22 hours
2. Baking times: Max. 2 times
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9.6 Soldering and reflow condition
1. Heating method:
Conventional Convection or IR/convection
2. Temperature measurement:
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.
3. Solder paste composition:
Sn/3.0Ag/0.5Cu
4. Allowable reflow soldering times: 2 times, based on the below reflow soldering profile
5. Temperature profile:
Reflow soldering shall be done according to the below temperature profile.
6. Peak temp: 245 degree C
Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)
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10 Package information
TBD
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 o
f
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
A
s long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-
location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID: MCLT77H462”. The grantee's FCC ID can be used only when all FCC compliance requirements are
met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.

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