HON HAI PRECISION IND T77H462 802.11abgn+BT4.0 module User Manual

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Document Description	User Manual.pdf
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Date Submitted	2013-09-09 00:00:00
Date Available	2013-10-15 00:00:00
Creation Date	2013-09-02 17:51:15
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Document Lastmod	2013-09-05 18:11:46
Document Title	Microsoft Word - Revision Note_T77H462.02 _BCM43241_ rev.3.2
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COMPANY CONFIDENTIAL
HONHAIPRECISIONIND.CO.,LTD.
5F1,5HsinAnRoad,Hsinchu,
ScienceBasedIndustrialPark
300,Taiwan
Tel:+88635784975 
Revision Note
(Specification Sheet)
PartName
RevisionNoteRev.
FoxconnPartNo.
LenovoPartNo.
802.11a/g/n+BT4.0Module
3.2
T77H462.02
Prepared by
Reviewed by
Approved by
Jason Hu
Gary Su
Chang-fu Lin
TotalPages
ProductRev.
Date
Sales
39
01S1
20130725
EagleWei
COMPANY CONFIDENTIAL
Index
1. REVISION HISTORY ................................................................................................................................................... 3
2. INTRODUCTION .......................................................................................................................................................... 4
2.1 SCOPE ...................................................................................................................................................................... 4
2.2 FUNCTION ................................................................................................................................................................. 4
3. PRODUCT SPECIFICATION ..................................................................................................................................... 5
3.1 HARDWARE CHARACTERISTIC ................................................................................................................................. 5
3.2 HARDWARE ARCHITECTURE .................................................................................................................................... 5
3.3 ELECTRICAL SPECIFICATION .................................................................................................................................... 6
3.4 WLAN RF CHARACTERISTICS ................................................................................................................................. 7
3.4.1 IEEE802.11b .................................................................................................................................................. 7
3.4.2 IEEE802.11g .................................................................................................................................................. 8
3.4.4 IEEE802.11a ................................................................................................................................................ 12
3.5 BLUETOOTH RF SPECIFICATIONS .......................................................................................................................... 18
3.6 INTERFACE TIMING .................................................................................................................................................. 23
3.6.1 SDIO INTERFACE TIMING .................................................................................................................................... 23
3.6.2 UART INTERFACE TIMING ................................................................................................................................... 25
3.7 LGA PIN DEFINITION .............................................................................................................................................. 26
4. MECHANICAL DRAWING ....................................................................................................................................... 30
5. SCHEMATIC REFERENCE DESIGN ..................................................................................................................... 33
6. PCB STACK ............................................................................................................................................................... 34
7. SOFTWARE SUPPORT............................................................................................................................................ 35
8. REGULATORY ........................................................................................................................................................... 36
9. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ....................................................................... 37
9.1 TEMPERATURE ....................................................................................................................................................... 37
9.2 PCB BENDING ........................................................................................................................................................ 37
9.3 HANDLING ENVIRONMENT....................................................................................................................................... 37
9.4 STORAGE CONDITION............................................................................................................................................. 37
9.5 BAKING CONDITION ................................................................................................................................................ 37
9.6 SOLDERING AND REFLOW CONDITION .................................................................................................................... 38
10 PACKAGE INFORMATION..................................................................................................................................... 39
COMPANY CONFIDENTIAL
1. Revision History
Date
Change Note
Rev.
2012-12-26
Initial release
1.0
2013-01-18
Modify the Pin definition to PCIeM.2_Rev0.7a and RF connector
1.1
information
2013-04-08
Modify
Section 3.2: Hardware Architecture
Section 3.4: WLAN RF Characteristics
Section 3.6: LGA Pin Definition: add note to some pins
Chapter 4: add note to the mechanical drawing
2.0
2013-04-12
Modify
Section 3.2: Hardware Architecture
Section 3.4: WLAN RF Characteristics
Section 3.6: LGA Pin Definition
Section 5: Schematics reference design
2.1
2013-04-26
2013-06-28
Add
Section 3.6: signal level voltage
Modify
Section 3.6: UART_WAKE from platform signal Output to Signal
Input
Modify
Section 3.4: WLAN RF Characteristics
Section 3.5: BT RF Characteristics
Add 3.6 interface timing
Section 3.7: Pin definition
Section 4: Mechanical drawing
Section 5: schematics reference design
Section 7: Software support
Section 8: Regulatory
Section 9: environment specification
Section 10: package information
3.0
2013-07-02
Modify
Section 3.7: Pin definition, The I/O type of UART pin 54-58
3.1
2013-07-25
Add FCC power table
3.2
2.2
COMPANY CONFIDENTIAL
2. Introduction
Project Name: 802.11abgn (2X2) + BT4.0 combo module
This documentation describes the product specification of the WLAN+BT combo Module. WLAN is
Compliant with IEEE 802.11 a/b/g and 2x2 IEEE 802.11n MAC/ baseband/radio, Bluetooth is compliant with
Bluetooth 4.0+HS. This module takes advantage of the high throughput and extended range of Broadcom
second-generation MIMO solution. It is a confidential document of Foxconn.
* For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and
driver to enable or disable 5GHz
2.1 Scope
This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz
and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow
user to switch to different vendors’ Access Points through the wireless networks and to prevent from
eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data rate
provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS15(HT40) with PHY data
rate to 300Mbps by dual stream. Bluetooth is compliant to Core Specification version 4.0.
2.2 Function
¾
¾
¾
¾
Single stream 802.11n support for 20MHz channels provide PHY Layer rates up to 72Mbps.
Dual stream 802.11n support for 20MHz/40MHz channels provide PHY Layer rates up to 300Mbps.
Bluetooth supports Class 1 and Class 2 output power.
Provides a small form factor solution and ultra low power consumption to support low cost
requirement.
¾ Host interface supports:
„ WLAN: SDIO
„ BT data: UART
„ BT digital audio: PCM
COMPANY CONFIDENTIAL
3. Product Specification
3.1 Hardware Characteristic
Form factor
Host Interface
PCB
RF connector
12mmx16mmx1.5mm
WLAN: SDIO
BT: UART for data, PCM for Audio
6-layer HDI design
Two MHF4 RF connectors on module
3.2 Hardware Architecture
The WLAN+BT combo module is designed base on BROADCOM BCM43241 chip, the Broadcom
BCM43241 is a highly integrated single chip solution for single and dual stream dual-band WLAN and
BT4.0. Single and dual Antenna support, a 37.4MHz crystal is used for reference clock generation, see
the block diagram as below:
COMPANY CONFIDENTIAL
3.3 Electrical Specification
Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the device can occur. Functional
operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended
can adversely affect long-term reliability of the device.
Rating
DC supply voltage for the device
Symbol
3.3V
Value
2.3 to 4.8
Unit
Recommended Operating Condition
Element
Symbol
Value
Minimum
DC supply voltage for the device
3.3V
3.0
Power-Up Sequence Timing
Current Consumption
TBD
Typical
3.3
Unit
Maximum
3.6
COMPANY CONFIDENTIAL
3.4 WLAN RF Characteristics
3.4.1 IEEE802.11b
Parameter
Condition
Min.
Type
Max.
Units
Target Power
CH1~CH13, 1~11Mbps
14.5
16.5
17.5
dBm
Spectrum Mask
fc-22MHzfc+22MHz
-30
dBr
-50
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-125
869~894MHz
-130
925~960MHz
-130
1,805~1,880MHz
-130
1,930~1,990MHz
-130
2,110~2,170MHz
-130
1,574.4~1,576.4MHz
-145
OBW
--
26
Spread Bandwidth
--
RF Carrier Suppression
Data=0101 and DQPSK
modulation
15
Transmit power –on ramp
10% to 90% of max power
us
90% to 10% of max power
us
20
ppm
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
dBm
dBm/Hz
MHz
Transmit power –down
ramp
Center Frequency
Tolerance
dB
-20
1Mbps
35
2Mbps
35
5.5Mbps
35
11Mbps
35
EVM (peak)
Receiver Minimum Input
Level Sensitivity at Antenna
Adjacent Channel
Rejection
Receiver Maximum
Input Level
1 Mbps
-95.5
-93
2 Mbps
-93
-90
5.5 Mbps
-91
-88
11 Mbps
-87.5
-85
dBm
11Mbps
35
dB
ALL
-6
dBm
COMPANY CONFIDENTIAL
3.4.2 IEEE802.11g
Parameter
Min.
Type
Max.
CH1~CH13,6~24Mbps
13.5
15.5
16.5
CH1~CH13, 36~54Mbps
12.5
14.5
15.5
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
dBm
+/- 11MHz
-20
+/- 20MHz
-28
+/- 30MHz
-40
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-125
869~894MHz
-130
925~960MHz
-130
1,805~1,880MHz
-130
1,930~1,990MHz
-130
2,110~2,170MHz
-130
1,574.4~1,576.4MHz
-145
Output Center
Frequency Tolerance
Overall
OBW
Output Center
Frequency Leakage
-20
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-15
dB
In-band
-2
Out-band
-4
Output Spectrum Flatness
dB
6 Mbps
-5
9 Mbps
-8
12 Mbps
-10
18 Mbps
-13
24 Mbps
-16
36 Mbps
-19
48 Mbps
-22
54 Mbps
-25
EVM
dB
Units
COMPANY CONFIDENTIAL
Parameter
Receiver Minimum Input
Level Sensitivity at the
Antenna
Min.
Type
Max.
6 Mbps
-91.5
-89
9 Mbps
-89
-86
12 Mbps
-87.5
-85
18 Mbps
-85.5
-83
24 Mbps
-81.5
-79
36 Mbps
-79
-76
48 Mbps
-75.5
-73
54 Mbps
-73
-70
dBm
6 Mbps
16
9 Mbps
15
12 Mbps
13
18 Mbps
11
24 Mbps
36 Mbps
48 Mbps
54 Mbps
-1
ALL
-16
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
dB
dBm
<1GHz
-54
1~10GHz
-54
10GHz~
-54
Units
dBm
COMPANY CONFIDENTIAL
3.4.3 IEEE802.11gn HT20 Single chain
Parameter
Min.
Type
Max.
CH1~CH13,MCS0~MCS4
12.5
14.5
15.5
CH1~CH13,MCS5~MCS7
11.5
13.5
14.5
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
dBm
+/- 11MHz
-20
+/- 20MHz
-28
+/- 30MHz
-45
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-125
869~894MHz
-130
925~960MHz
-130
1,805~1,880MHz
-130
1,930~1,990MHz
-130
2,110~2,170MHz
-130
1,574.4~1,576.4MHz
-145
Output Center
Frequency Tolerance
Overall
OBW
Output Center
Frequency Leakage
-20
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-20
dB
Inband
-2
Outband
-4
Output Spectrum Flatness
dB
MCS0 Mbps
-5
MCS1 Mbps
-10
MCS2 Mbps
-13
MCS3 Mbps
-16
MCS4 Mbps
-19
MCS5 Mbps
-22
MCS6 Mbps
-25
MCS7 Mbps
-28
dB
EVM
10
Units
COMPANY CONFIDENTIAL
Parameter
Receiver Minimum Input
Level Sensitivity at the
Antenna
Min.
Type
Max.
MCS0 Mbps
-89.5
-87
MCS1 Mbps
-86.5
-84
MCS2 Mbps
-84
-81
MCS3 Mbps
-80.5
-78
MCS4 Mbps
-77.5
-75
MCS5 Mbps
-73
70
MCS6 Mbps
-72
-69
MCS7 Mbps
-71
-68
dBm
MCS0 Mbps
16
MCS1 Mbps
13
MCS2 Mbps
11
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
-1
MCS7 Mbps
-2
ALL
-16
dB
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
dBm
<1GHz
-54
1~10GHz
-54
10GHz~
-54
11
Units
dBm
COMPANY CONFIDENTIAL
3.4.4 IEEE802.11a
Parameter
Min.
Type
Max.
B1,B2,B3,B4,6~24Mbps
13.5
15.5
16.5
B1,B2,B3,B4, 36~54Mbps
12.5
14.5
15.5
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
dBm
+/- 11MHz
-20
+/- 20MHz
-28
+/- 30MHz
-40
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-125
869~894MHz
-130
925~960MHz
-130
1,805~1,880MHz
-130
1,930~1,990MHz
-130
2,110~2,170MHz
-130
1,574.4~1,576.4MHz
-145
Output Center
Frequency Tolerance
Overall
OBW
Output Center
Frequency Leakage
-20
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-15
dB
In-band
-2
Out-band
-4
Output Spectrum Flatness
dB
6 Mbps
-5
9 Mbps
-8
12 Mbps
-10
18 Mbps
-13
24 Mbps
-16
36 Mbps
-19
48 Mbps
-22
54 Mbps
-25
EVM
dB
12
Units
COMPANY CONFIDENTIAL
Parameter
Receiver Minimum Input
Level Sensitivity at the
Antenna
Min.
Type
Max.
6 Mbps
-92
-89
9 Mbps
-88.5
-86
12 Mbps
-86.5
-84
18 Mbps
-84.5
-82
24 Mbps
-81.5
-79
36 Mbps
-78.5
-76
48 Mbps
-74.5
-72
54 Mbps
-73
-70
dBm
6 Mbps
16
9 Mbps
15
12 Mbps
13
18 Mbps
11
24 Mbps
36 Mbps
48 Mbps
54 Mbps
-1
ALL
-26
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
dB
dBm
<1GHz
-54
1~10GHz
-54
10GHz~
-54
B1:5180~5240MHz; B2: 5260~5320MHz; B3:5500~5700MHz; B4:5745~5825MHz
13
Units
dBm
COMPANY CONFIDENTIAL
3.4.5 IEEE802.11an HT20 Single chain
Parameter
Min.
Type
Max.
B1,B2,B3,B4;MCS0~MCS4
12.5
14.5
15.5
B1,B2,B3,B4;MCS5~MCS7
11.5
13.5
14.5
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
dBm
+/- 11MHz
-20
+/- 20MHz
-28
+/- 30MHz
-45
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-125
869~894MHz
-130
925~960MHz
-130
1,805~1,880MHz
-130
1,930~1,990MHz
-130
2,110~2,170MHz
-130
1,574.4~1,576.4MHz
-145
Output Center
Frequency Tolerance
Overall
OBW
Output Center
Frequency Leakage
-20
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-20
dB
In-band
-2
Out-band
-4
Output Spectrum Flatness
dB
MCS0 Mbps
-5
MCS1 Mbps
-10
MCS2 Mbps
-13
MCS3 Mbps
-16
MCS4 Mbps
-19
MCS5 Mbps
-22
MCS6 Mbps
-25
MCS7 Mbps
-28
dB
EVM
14
Units
COMPANY CONFIDENTIAL
Parameter
Receiver Minimum Input
Level Sensitivity at the
Antenna
Min.
Type
Max.
MCS0 Mbps
-90
-87
MCS1 Mbps
-87.5
-85
MCS2 Mbps
-84.5
-82
MCS3 Mbps
-81.5
-79
MCS4 Mbps
-78.5
-76
MCS5 Mbps
-74
-71
MCS6 Mbps
-72.5
-70
MCS7 Mbps
-71
-68
dBm
MCS0 Mbps
16
MCS1 Mbps
13
MCS2 Mbps
11
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
-1
MCS7 Mbps
-2
ALL
-26
dB
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
dBm
<1GHz
-54
1~10GHz
-54
10GHz~
-54
B1:5180~5240MHz; B2:5260~5320MHz; B3:5500~5700MHz; B4:5745~5825MHz
15
Units
dBm
COMPANY CONFIDENTIAL
3.4.6 IEEE802.11an HT40 Single chain
Parameter
Min.
Type
Max.
B1,B2,B3,B4;MCS0~MCS4
12.5
14.5
15.5
B1,B2,B3,B4;MCS5~MCS7
11.5
13.5
14.5
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
dBm
+/- 11MHz
-20
+/- 20MHz
-28
+/- 30MHz
-45
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-125
869~894MHz
-130
925~960MHz
-130
1,805~1,880MHz
-130
1,930~1,990MHz
-130
2,110~2,170MHz
-130
1,574.4~1,576.4MHz
-145
Output Center
Frequency Tolerance
Overall
OBW
Output Center
Frequency Leakage
-20
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-20
dB
In-band
-2
Out-band
-4
Output Spectrum Flatness
dB
MCS0 Mbps
-5
MCS1 Mbps
-10
MCS2 Mbps
-13
MCS3 Mbps
-16
MCS4 Mbps
-19
MCS5 Mbps
-22
MCS6 Mbps
-25
MCS7 Mbps
-28
dB
EVM
16
Units
COMPANY CONFIDENTIAL
Parameter
Receiver Minimum Input
Level Sensitivity at the
Antenna
Min.
Type
Max.
MCS0 Mbps
-87.5
-85
MCS1 Mbps
-84.5
-82
MCS2 Mbps
-82.5
-80
MCS3 Mbps
-78.5
-76
MCS4 Mbps
-75.5
-73
MCS5 Mbps
-71
-68
MCS6 Mbps
-69.5
-67
MCS7 Mbps
-68
-65
Units
dBm
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
dB
Adjacent Channel Rejection
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
Receiver Maximum Input
Level
Receiver Spurious
ALL
-26
dBm
<1GHz
-54
1~10GHz
-54
10GHz~
-54
B1:5190~5230MHz; B2:5270~5310MHz; B3:5510~5670MHz; B4:5755~5795MHz
17
dBm
COMPANY CONFIDENTIAL
3.5 Bluetooth RF Specifications
¾
¾
¾
¾
¾
Bluetooth Core Specification version 4.0:
Host interface: UART, baud rates up to 4Mbps
Support all Bluetooth 4.0+HS packet types.
Operating frequency range: 2400MHz ~2483.5MHz
Modulation type:
„ Basic rate 1Mbps: GFSK,
„ Enhanced data rate 2Mbps: QPSK
„ Enhanced data rate 3Mbps: 8PSK
Parameter
Condition
Min
Specification
Typ
Max
Units
Basic Data Rate – Transmit Performance
RF Transmit Power at the Antenna
+5
+11
-20 dB Bandwidth
Frequency range
83.5
Tx Output Spectrum
dBm
MHz
Initial Carrier Frequency Tolerance
 ±75
KHz
DH1/3/5 Drift rate
 ±20
kHz/50 s
DH1
<±20
DH3
 ±40
DH5
<±40
Carrier Frequency Drift
KHz
F1avg
140<f1avg<175
F2max
 115
kHz
Modulation Characteristics
F2avg/F1avg
80
+/-500KHz
Adjacent Channel Transmit
Power
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
-27
dBc
|M-N|=2
-20
|M-N|3
-40
dBm
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-130
869~894MHz
-135
925~960MHz
-135
1,805~1,880MHz
-135
1,930~1,990MHz
-135
2,110~2,170MHz
-135
1,574.4~1,576.4MHz
-150
18
dBm
dBm/
Hz
COMPANY CONFIDENTIAL
Parameter
Condition
Min
Specification
Typ
Max
Units
Enhanced Data Rate – Transmit Performance
/4 DQPSK
+3
+9
8DPSK
+3
+9
Pdpsk
(PGFSK-4 dB)f0+3 MHz
 -40
f2.4965 GHz
-26
470~805MHz
-130
869~894MHz
-135
925~960MHz
-135
1,805~1,880MHz
-135
1,930~1,990MHz
-135
2,110~2,170MHz
-135
1,574.4~1,576.4MHz
-150
dBm
dBm/
Hz
Basic Data Rate – Receiver Performance at the Antenna
Sensitivity (DH1) at 0.1% BER
C/I Performance at BER0.1%
Nominal
-90
Co-ch interface C/Ico
<11
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz
Adjacent Chanel Sensitivity C/I
ff0±3 MHz
-88
dBm
<0
<-30
dB
< -40
Image Ch interference C/Iimage
< -9
Image Ch interference C/Iimage
< -20
1MHz
Blocking Performance at
BER0.1%
Intermodulation Performance at
BER0.1%
30MHz~2GHz
-10
2GHz~2.4GHz
-27
2.5GHz~3GHz
-27
3GHz~12.75GHz
-10
Carrier Level:-64dBm
-39
dBm
-20
dBm
dBm
Max input Level
Receiver Spurious
<1GHz
-54
1~10GHz
-54
10GHz~
-54
20
dBm
COMPANY CONFIDENTIAL
Parameter
Condition
Min
Specification
Typ
Max
Units
Enhanced Data Rate – Receiver Performance at the Antenna
Sensitivity at
BER0.01%
/4 DQPSK(ch0~78)
-92
-90
8DPSK(ch0~78)
-86
-84
Nominal
dBm
/4 DQPSK
-20
8DPSK
-20
Max input Level
dBm
<13
Co-ch interface C/Ico
C/I Performance at
BER0.1%(/4 DQPSK)
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz
Adjacent Chanel Sensitivity C/I
ff0±3 MHz
Image Ch interference C/Iimage
Image Ch interference C/Iimage
<0
<-30
dB
< -40
< -7
< -20
1MHz
<21
Co-ch interface C/Ico
C/I Performance at
BER0.1%(8DPSK)
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz
Adjacent Chanel Sensitivity C/I
ff0±3 MHz
Image Ch interference C/Iimage
Image Ch interference C/Iimage
<5
<-25
dB
< -33
< -0
< -13
1MHz
Receiver Spurious
<1GHz
-54
1~10GHz
-54
10GHz~
-54
21
dBm
COMPANY CONFIDENTIAL
BLE RF specification:
Parameter
Condition
Min
Specification
Typ
Max
Units
BLE RF specification:
Sensitivity at
BER0.01%
Nominal
RF Transmit Power
GFSK 0.1%, 1M
GFSK
Mod char:delta f1 average
225
Mod char:delta f2 max
99.9
Receiver Spurious
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
-89.5
dBm
dBm
275
kHz
<1GHz
-54
1~10GHz
-54
10GHz~
-54
f<2.387GHz
-26
2.387 GHz< f<2.400 GHz
-16
2.4835 GHz2.4965 GHz
-26
470~805MHz
-130
869~894MHz
-135
925~960MHz
-135
1,805~1,880MHz
-135
1,930~1,990MHz
-135
2,110~2,170MHz
-135
1,574.4~1,576.4MHz
-150
22
-91.5
dBm
dBm
dBm/
Hz
COMPANY CONFIDENTIAL
3.6 Interface timing
3.6.1 SDIO Interface timing
SDIO Default Mode Timing
SDIO Bus Timing Parameters (Default Mode)
Parameter
Symbol
Minimum
Typical
Maximum
Unit
SDIO CLK (All values are referred to minimum VIH and maximum VIL )
Frequency – Data Transfer mode
fPP
25
MHz
Frequency – Identification mode
fOD
400
kHz
Clock low time
tWL
10
ns
Clock high time
tWH
10
ns
Clock rise time
tTLH
10
ns
Clock low time
tTHL
10
ns
Inputs: CMD DAT (referenced to CLK)
Input setup time
tISU
ns
Input hold time
tIH
ns
Output delay time – Data Transfer mode
tODLY
14
ns
Output delay time – Identification mode
tODLY
50
ns
Outputs: CMD, DAT (referenced to CLK)
a. TimingisbasedonCL Љ 40pFloadonCMDandData.
b. min(Vih)=0.7xVDDIOandmax(ViL)=0.2xVDDIO.
23
COMPANY CONFIDENTIAL
SDIO High-Speed Mode Timing
SDIO Bus Timing Parameters (High-Speed Mode)
Parameter
Symbol
Minimum
Typical
Maximum
Unit
50
MHz
SDIO CLK (All values are referred to minimum VIH and maximum VIL )
Frequency – Data Transfer mode
fPP
Frequency – Identification mode
fOD
400
kHz
Clock low time
tWL
ns
Clock high time
tWH
ns
Clock rise time
tTLH
ns
Clock low time
tTHL
ns
Input setup time
tISU
ns
Input hold time
tIH
ns
Inputs: CMD DAT (referenced to CLK)
Outputs: CMD, DAT (referenced to CLK)
Output delay time – Data Transfer mode
tODLY
14
ns
Output hold time
tOH
2.5
ns
Total system capacitance (each line)
CL
40
pF
a. TimingisbasedonCL Љ 40pFloadonCMDandData.
b. min(Vih)=0.7xVDDIOandmax(ViL)=0.2xVDDIO.
24
COMPANY CONFIDENTIAL
3.6.2 UART Interface timing
25
COMPANY CONFIDENTIAL
3.7 LGA Pin Definition
- Module pin-out definition:
- Platform pin-out definition:
ToP View
26
COMPANY CONFIDENTIAL
- Pin definition (module point of view):
Pin No.
Pin Name
Type
Description
Voltage
1-3
UIM_power_in/GPIO1
UIM_power_out
UIM_SWP
I/O
No connection
4-5
3.3V
Power
Power voltage input pin
3.3V
GND
GND
Ground
Reserved
I/O
Reserved LGA pin
8*(a)
ALERT
No connection
9*(a)
I2C CLK
No connection
10*(a)
I2C DATA
No connection
11*(a)
COEX1
No connection
12*(a)
COEX2
No connection
13*(a)
COEX3
No connection
14-15
SYSCLK/GNSS0
TX_Blanking/GNSS1
16
Reserved
I/O
Reserved LGA pin, No connection
17
GND
GND
Ground
18-19
Reserved
Reserved LGA pin, No connection
20
GND
GND
Ground
21-22
Reserved
Reserved LGA pin, No connection
23
GND
GND
Ground
24-25
Reserved
Reserved LGA pin, No connection
26
GND
GND
Ground
Reserved LGA pin, No connection
27
SUSCLK (32KHz)
32.768 kHz clock supply input that is provided by
PCH to reduce power and cost for the module.
3.3V
SUSCLK will have a duty cycle that can be as low
as 30% or as high as 70%. 200ppm.
28
W_DISABLE#1
No connection
29*(a)
PEWAKE#
No connection
30*(a)
CLKREQ#
No connection
31*(a)
PERST#
No connection
32
GND
GND
Ground
33*(a)
REFCLKN0
No connection
34*(a)
REFCLKP0
35
GND
GND
Ground
36*(a)
PETn0
No connection
27
COMPANY CONFIDENTIAL
37*(a)
PETp0
38
GND
39*(a)
PERn0
40*(a)
PERp0
41
42-44
GND
Ground
No connection
GND
GND
Ground
Reserved
Reserved LGA pin, No connection
SDIO sideband GPIO pin to enable/disable (reset)
the WiFi function. Platform firmware is required to
assert/de-assert this pin on every boot (warm and 1.8V
cold). The WiFi device may use 0.5 to 1 mW in
reset, Active Low
SDIO Host Wake. Note in band SDIO wake is not
used for non-active modes, Active Low. Require
1.8V
pull up on the host side ( recommended 15K to
100K )
45
SDIO Reset
46
SDIO Wake
47
SDIO DATA3
I/O
4 lines for SDIO data exchange
1.8V
48
SDIO DATA2
I/O
4 lines for SDIO data exchange
1.8V
49
SDIO DATA1
I/O
4 lines for SDIO data exchange
1.8V
50
SDIO DATA0
I/O
4 lines for SDIO data exchange
1.8V
51
SDIO CMD
I/O
SDIO Command Interface
1.8V
52
SDIO CLK
SDIO 3.0 Clock
1.8V
53
UART WAKE
Bluetooth host Wake. Active Low
3.3V
54
UART CTS
55
UART TX
56
UART RX
58
UART RTS
58
PCM FR1
I/O
PCM Synchronous data sync/ I2S Word Select
1.8V
59
PCMIN
PCM Synchronous data input/ I2S Serial Data IN
1.8V
60
PCMOUT
PCM Synchronous data output/ I2S Serial Data
OUT
1.8V
61
PCMCLK
I/O
PCM Clock/ I2S Continuous Serial Clock (SCK)
1.8V
62
GND
GND
Ground
63
W_DISABLE#2
Active low, debounced signal when applied by the
3.3V
platform it will disable BT radio operation
64
LED#2
No connection
65
LED#1
No connection
66-67
Reserved
Reserved LGA pin
68
GND
GND
Ground
69*(a)
USB_D-
No connection
70*(a)
USB _D+
UART Clear To Send, Active low, connected to
UART RTS on the platform.
UART Transmit Data, connected to UART RX on
the platform.
UART Receive Data, connected to UART TX on
the platform.
UART Request To Send, Active low, connected to
UART CTS on the platform.
28
1.8V
1.8V
1.8V
1.8V
COMPANY CONFIDENTIAL
71
GND
GND
Ground
72-73
3.3V
Power
Power voltage input pin
74-76,
others
GND
GND
Ground
The pin-out definition is following NGFF1216, but removed some functions such as PCIE, BT_USB.
*(a) FOXCONN remove the function according to BCM43241function.
29
3.3V
COMPANY CONFIDENTIAL
4. Mechanical Drawing
4.1 NGFF Type 1216 specification from PCI-e M.2_Rev0.7a
- The on board RF connector and plug mating height would be 1.2 mm max.
- Only Ant1 and Ant3 on this module.
4.2 T77H462.02 module drawing
30
COMPANY CONFIDENTIAL
4.3 RF connector:
- New RF connector is needed, for lower z-height and smaller footprint
- Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable
- Cable diameter determines mated height: 1.2mm mated height with 0.81mm cable
4.4 Example of IPEX RF connector
IPEX P/N: 20449-001E (MHF4)
IPEX P/N: 20448-001R-081
31
COMPANY CONFIDENTIAL
32
COMPANY CONFIDENTIAL
5. Schematic Reference Design
Module pin-out & 32.768kHz
33
COMPANY CONFIDENTIAL
Audio PCM interface:
6. PCB Stack
6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.3+/-0.03mm
34
COMPANY CONFIDENTIAL
7. Software Support
Operating System Support
„ Windows 8
„
Windows Blue or later Android 4.3 and above
WLAN Feature Support
„ WiFi Direct
„ WiFi Display
„
Wi-Fi Miracast (Intel will support WiDi with Miracast interoperability)
WLAN Security Support
„ WPA/WPA2 Enterprise
„ CCX Lite or higher
„ WMM/AES/TKIP/CKIP
WLAN Transmit Power Reduction
„ Software control to meet FCC SAR requirement
„ Capability to disable 5GHz operation
Bluetooth Profile Support
„ A2DP-Sink
„ A2DP-Source
„ AVRCP-Target
„ DUN-DT
„ FTP-Client
„ FTP-Server
„ HCRP-Client
„ HID-Host
„ MCAP
„ OPP-Client
„ OPP-Server
„ PAN-User
„ SDP
„ Serial-DevA
„ Serial-DevB
BLE (Bluetooth Low Energy) Support
„ Windows 8
„
Windows Blue or later
35
COMPANY CONFIDENTIAL
8. Regulatory
¾
¾
¾
¾
USA : FCC P15B / FCC P15C / FCC P15E
Canada : IC RSS-210
Japan : TELEC
EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd
BCM43241 module 5GHz power table :
˧̌̃˼˶˴˿ʳ̃̂̊˸̅ʳʻ˿˼̀˼̇ʳ˼̆ʳʾ˄˂ˀ˅˷˕ʼʳʻ̈́˼̇ˍ˷˕̀ʼ
˛˧˅˃
˖˛ˆˉ
˖˛ˇˋ
˖˛ˈ˅
˖˛ˉˇ
˖˛˄˃˃ ˖˛˄˅˃ ˖˛˄ˇ˃ ˖˛˄ˇˌ ˖˛˄ˉˈ
ˉ̑˅ˇˠ˵̃̆
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˇ
˄ˈˁˈ
˄ˈˁˈ
˄ˆˁˈ
˄ˈˁˈ
˄ˈˁˈ
ˆˉ̑ˈˇˠ˵̃̆
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇ
˄ˇˁˈ
˄ˇˁˈ
˄ˆˁˈ
˄ˇˁˈ
˄ˇˁˈ
ˠ˖˦˃̑ˠ˖˦ˇ
˄ˆ
˄ˆ
˄ˇˁˈ
˄ˆˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄˅ˁˈ
˄ˇˁˈ
˄ˇˁˈ
ˠ˖˦ˈ̑ˠ˖˦ˊ
˄ˆ
˄ˆ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄˅ˁˈ
˄ˆˁˈ
˄ˆˁˈ
ˠ˖˦ˋ̑ˠ˖˦˄˅
˄ˉ
˄ˉ
˄ˊˁˈ
˄ˉˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˈˁˈ
˄ˊˁˈ
˄ˊˁˈ
ˠ˖˦˄ˆ̑ˠ˖˦˄ˈ
˄ˉ
˄ˉ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˈˁˈ
˄ˉˁˈ
˄ˉˁˈ
ˡ̂̇˸ˍ˹̂̅ʳ˙˖˖ʿ̇˻˸ʳ̃̂̊˸̅ʳ˿˼̀˼̇ʳ˼̆ʳ˄ˊ˷˕̀ʳ˹̂̅ʳ˕˔ˡ˗˜ʳʻˈ˄ˋ˃̑ˈ˅ˇ˃ˠ˛̍ʼ
˛˧ˇ˃
ˠ˖˦˃̑ˠ˖˦ˇ
ˠ˖˦ˈ̑ˠ˖˦ˊ
ˠ˖˦ˋ̑ˠ˖˦˄˅
ˠ˖˦˄ˆ̑ˠ˖˦˄ˈ
˖˛ˆˋ
˖˛ˇˉ
˖˛ˈˇ
˖˛ˉ˅
˖˛˄˃˅ ˖˛˄ˆˇ ˖˛˄ˈ˄ ˖˛˄ˈˌ
˄˄ˁˈ
˄ˆ
˄ˇˁˈ
˄˄ˁˈ
˄ˆˁˈ
˄ˆ
˄ˇˁˈ
˄ˇˁˈ
˄˄ˁˈ
˄ˆ
˄ˆˁˈ
˄˄ˁˈ
˄ˆˁˈ
˄ˆ
˄ˆˁˈ
˄ˆˁˈ
˄ˇˁˈ
˄ˉ
˄ˊˁˈ
˄ˇˁˈ
˄ˉˁˈ
˄ˉ
˄ˊˁˈ
˄ˊˁˈ
˄ˇˁˈ
˄ˉ
˄ˉˁˈ
˄ˇˁˈ
˄ˉˁˈ
˄ˉ
˄ˉˁˈ
˄ˉˁˈ
BCM43241 module 2.4GHz power table
˧̌̃˼˶˴˿ʳ̃̂̊˸̅ʳʻ˿˼̀˼̇ʳ˼̆ʳʾ˄˂ˀ˅˷˕ʼʳʻ̈́˼̇ˍ˷˕̀ʼ
˛˧˅˃
˖˛˄
˖˛˅
˖˛ˆ
˖˛ˇ
˖˛ˈ
˖˛ˉ
˖˛ˊ
˖˛ˋ
˖˛ˌ
˖˛˄˃
˖˛˄˄
˄̑˄˄ˠ˵̃̆
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉ
ˉ̑˅ˇˠ˵̃̆
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˈˁˈ
˄ˆ
ˆˉ̑ˈˇˠ˵̃̆
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˆ
ˠ˖˦˃̑ˠ˖˦ˇ
˄ˇ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˇˁˈ
˄ˆˁˈ
ˠ˖˦ˈ̑ˠ˖˦ˊ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
˄ˆˁˈ
ˠ˖˦ˋ̑ˠ˖˦˄˅
˄ˊ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˊˁˈ
˄ˉˁˈ
ˠ˖˦˄ˆ̑ˠ˖˦˄ˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
˄ˉˁˈ
36
COMPANY CONFIDENTIAL
9. Environmental Requirements and Specifications
9.1 Temperature
9.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating in ambient temperature of
0 °C to +70°C.
9.1.2 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored
to the operating temperature when exposed to storage temperature in the range of -10°C to +85°C.
9.2 PCB bending
The PCB bending spec limits plainness under 0.1mm for both Foxconn and end assembly customer.
9.3 Handling environment
ESD:
There are semiconductors on the module, please handle the module under ESD protected and
well-controlled environment (<100V).
Terminals Handling Notice
The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.
Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and
real for packaging materials have no heat resistance, please bake the components moved into another
container such as heat resistance trays.
Others:
1. Please make sure to avoid mechanical shock and vibration for this module.
2. Please do not drop the module.
3. Please do not clean the module.
9.4 Storage Condition
1. Moisture barrier bag must be stored under 40 к, humidity under 90% RH, when the moisture barrier bag
is sealed by Foxconn.
2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.
3. If Moisture barrier bag is open, the component must be stored in an environment of <25 5 /10%RH
4. Please keep the module at 30к/70% RH.
9.5 Baking Condition
The module would be required for baking if:
1. Humidity indicator cards read >30%
2. Temp < 30 к, Humidity <70%RH, moisture barrier bag open over 96 hours
The baking criteria would be:
1. Baking condition: 90 к, 12-22 hours
2. Baking times: Max. 2 times
37
COMPANY CONFIDENTIAL
9.6 Soldering and reflow condition
1. Heating method:
Conventional Convection or IR/convection
2. Temperature measurement:
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.
3. Solder paste composition:
Sn/3.0Ag/0.5Cu
4. Allowable reflow soldering times: 2 times, based on the below reflow soldering profile
5. Temperature profile:
Reflow soldering shall be done according to the below temperature profile.
6. Peak temp: 245 degree C
Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)
38
COMPANY CONFIDENTIAL
Federal Communication Commission Interference Statement
10 Package information
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may TBD
not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID: MCLT77H462”. The grantee's FCC ID can be used only when all FCC compliance requirements are
met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
39

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