HON HAI PRECISION IND T77H506 802.11abgn+BT4.0 module User Manual

HON HAI Precision Ind. Co., Ltd. 802.11abgn+BT4.0 module

User Manual.pdf

COMPANY CONFIDENTIAL
Preliminary Datasheet
1
BCM4324 WLAN +BT Combo Module
(Foxconn T77H506.00 035)
Product Specification
Rev 0.7
Prepared by Reviewed by Approved by
Wilmer Gary Su Chang Fu
COMPANY CONFIDENTIAL
Preliminary Datasheet
2
Index
1
.
REVISION HISTORY...................................................................................................................................................3
2. INTRODUCTION ..........................................................................................................................................................4
2.1
S
COPE
......................................................................................................................................................................4
2.2
F
UNCTION
.................................................................................................................................................................4
3. PRODUCT SPECIFICATION .....................................................................................................................................5
3.1
H
ARDWARE
C
HARACTERISTIC
.................................................................................................................................5
3.2
H
ARDWARE
A
RCHITECTURE
....................................................................................................................................5
3.3
E
LECTRICAL
S
PECIFICATION
....................................................................................................................................6
3.4
WLAN
RF
C
HARACTERISTICS
.................................................................................................................................7
3.4.1 IEEE802.11b ..................................................................................................................................................7
3.4.2 IEEE802.11g (SISO).....................................................................................................................................7
3.4.3 IEEE802.11gn HT20 Single chain ............................................................................................................9
3.4.4 IEEE802.11a ................................................................................................................................................10
3.4.5 IEEE802.11an HT20 Single chain ..........................................................................................................11
3.4.6 IEEE802.11an HT40 Single chain ..........................................................................................................12
3.5
B
LUETOOTH
S
TANDARD
S
PECIFICATIONS
.............................................................................................................13
3.6
I
NTERFACE TIMING
..................................................................................................................................................16
3.6.1
SDIO
I
NTERFACE TIMING
....................................................................................................................................16
3.6.2
UART
I
NTERFACE TIMING
...................................................................................................................................18
3.6.3
PCM
I
NTERFACE TIMING
.....................................................................................................................................18
4. MECHANICAL DRAWING .......................................................................................................................................25
5. SCHEMATIC REFERENCE DESIGN .....................................................................................................................28
6. PCB LAYOUT.............................................................................................................................................................30
7. SOFTWARE REQUIREMENT..................................................................................................................................30
8. REGULATORY...........................................................................................................................................................32
9. PACKAGE RELIABILITY TEST CONDITIONS ....................................................................................................33
10. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS.....................................................................33
10.1
T
EMPERATURE
.....................................................................................................................................................33
10.2
PCB
BENDING
......................................................................................................................................................33
10.3
H
ANDLING ENVIRONMENT
....................................................................................................................................33
10.4
S
TORAGE
C
ONDITION
..........................................................................................................................................33
10.5
B
AKING
C
ONDITION
..............................................................................................................................................34
10.6
S
OLDERING AND REFLOW CONDITION
..................................................................................................................34
11 PACKAGE INFORMATION.....................................................................................................................................34
COMPANY CONFIDENTIAL
Preliminary Datasheet
3
1 Revision History
Date Change Note Author REV Note
2013-05-07 Initial release Wilmer 0.1
2013-05-20 Modify the RX performance result Wilmer 0.2
2013-05-23
1. Update the TX and RX performance result
2. Modify some pin description.
3. Add Shielding case drawing
Wilmer 0.3
2013-07-02
1. Update the TX and RX SPC in section 3.4 and 3.5.
3. Add interface timing in section 3.6
4. Update the Mechanical drawing in section 4
5. Add the schematics reference design in section 5
6. Add the software support in section 7
7. Add Regulatory in section 8
8. Add environment specification in section 9
9. Add package information
Wilmer 0.4
2013-07-09 1. Update the module mechanical drawing in section 4 Wilmer 0.5
2013-07-27 1. Replace mechanics drawing adding four corners’
footprint
dimension in Section 4 Wilmer 0.6
2013-08-02 Add FCC Power Table Wilmer 0.7
COMPANY CONFIDENTIAL
Preliminary Datasheet
4
2. Introduction
Project Name: 802.11abgn (2X2) + BT4.0 combo module
This documentation describes the product specification of the WLAN+BT combo Module. WLAN is
Compliant with IEEE 802.11 a/b/g and 2x2 IEEE 802.11n MAC/ baseband/radio, Bluetooth is compliant with
Bluetooth 4.0+HS. This module takes advantage of the high throughput and extended range of Broadcom
second-generation MIMO solution. It is a confidential document of Foxconn.
* For b/g/n and a/b/g/n module, Foxconn HW/FW is the same, platform use different firmware and driver
to enable or disable 5GHz
2.1 Scope
This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz
and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow
user to switch to different vendors’ Access Points through the wireless networks and to prevent from
eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data
rate provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS15(HT40) with
PHY data rate to 300Mbps by dual stream. Bluetooth is compliant to Core Specification version 4.0.
2.2 Function
Single stream 802.11n support for 20MHz channels provide PHY Layer rates up to 72Mbps.
Dual stream 802.11n support for 20MHz/40MHz channels provide PHY Layer rates up to 300Mbps.
Bluetooth supports Class 1 and Class 2 output power.
Diplexer (which reject 2170MHz) integrated
Provides a small form factor solution and ultra low power consumption to support low cost requirement.
Host interface supports:
WLAN: SDIO;
BT data: UART
BT digital audio: PCM
COMPANY CONFIDENTIAL
Preliminary Datasheet
5
3. Product Specification
3.1 Hardware Characteristic
Form factor 13mmx17mmx1.5mm LGA
Host Interface WLAN: SDIO
BT: UART for data, PCM for Audio
PCB 6-layer HDI design
RF connector Two MHF4 RF connector on module
3.2 Hardware Architecture
The WLAN+BT combo module is designed base on BROADCOM BCM4324 chip, the Broadcom
BCM4324 is a highly integrated single chip solution for single and dual stream dual-band WLAN and
BT4.0. Single and dual Antenna support, a 37.4MHz crystal is used for reference clock generation, see
the block diagram as below:
COMPANY CONFIDENTIAL
Preliminary Datasheet
6
3.3 Electrical Specification
Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the device can occur. Functional
operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended
can adversely affect long-term reliability of the device.
Recommended Operating Condition
Value Element Symbol
Minimum Typical Maximum
Unit
DC supply voltage for the device 3.3V 3.0 3.3 3.6 V
Function operation is not guaranteed outside this limit, and operation outside this limit for extended
periods can adversely affect long-term reliability of the device.
Power-Up Sequence Timing
Rating Symbol Value Unit
DC supply voltage for the device 3.3V 2.3 to 4.8 V
COMPANY CONFIDENTIAL
Preliminary Datasheet
7
Current Consumption
* Note: it would be updated after EDVT testing.
3.4 WLAN RF Characteristics
3.4.1 IEEE802.11b
Parameter Condition Min. Type Max. Units
Target Power CH1~CH13, 1~11Mbps 16.5 18.5 19.5 dBm
fc-22MHz<f< fc-11MHz
fc+11MHz<f<fc+22MHz -30
Spectrum Mask f<fc-22MHz
f>fc+22MHz -50
dBr
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
Transmission Spurious
Emission-1
f>2.4965 GHz -26
dBm
470~805MHz -125
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -145
dBm/Hz
OBW -- 26
Spread Bandwidth -- 7 MHz
RF Carrier Suppression Data=0101 and DQPSK
modulation 15 dB
Transmit power –on ramp 10% to 90% of max power 2 us
Transmit power –down
ramp 90% to 10% of max power 2 us
Center Frequency
Tolerance -20 20 ppm
1Mbps 35
2Mbps 35
5.5Mbps 35
EVM (peak)
11Mbps 35
%
1 Mbps -97 -94
2 Mbps -94.5 -92
5.5 Mbps -92.5 -90
Receiver Minimum Input
Level Sensitivity at Antenna
11 Mbps -89 -86
dBm
Adjacent Channel
Rejection 11Mbps 35 dB
Receiver Maximum
Input Level ALL 0 dBm
3.4.2 IEEE802.11g (SISO)
Parameter Min. Type Max. Units
CH1~CH13,6~24Mbps 15 17
18
Target Power CH1~CH13, 36~54Mbps 14 16 17 dBm
Spectrum Mask +/- 11MHz -20 dBr
COMPANY CONFIDENTIAL
Preliminary Datasheet
8
+/- 20MHz -28
+/- 30MHz -40
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -125
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -145
dBm/
Hz
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -15 dB
In-band -2 2
Output Spectrum Flatness Out-band -4 2 dB
6 Mbps -5
9 Mbps -8
12 Mbps -10
18 Mbps -13
24 Mbps -16
36 Mbps -19
48 Mbps -22
EVM
54 Mbps -25
dB
6 Mbps -93 -90
9 Mbps -91 -88
12 Mbps -89.5 -87
18 Mbps -87.5 -85
24 Mbps -83.5 -81
36 Mbps -81 -78
48 Mbps -75.5 -73
Receiver Minimum Input
Level Sensitivity at the
Antenna
54 Mbps -74.5 -72
dBm
6 Mbps 16
9 Mbps 15
12 Mbps 13
18 Mbps 11
24 Mbps 8
36 Mbps 4
48 Mbps 0
Adjacent Channel Rejection
54 Mbps -1
dB
Receiver Maximum Input
Level ALL -10 dBm
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
COMPANY CONFIDENTIAL
Preliminary Datasheet
9
3.4.3 IEEE802.11gn HT20 Single chain
Parameter Min. Type Max. Units
CH1~CH13,MCS0~MCS4 14.5 16.5
17.5
Target Power CH1~CH13,MCS5~MCS7 13.5 15.5
16.5 dBm
+/- 11MHz -20
+/- 20MHz -28
Spectrum Mask
+/- 30MHz -45
dBr
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -125
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
dBm/
Hz
2,110~2,170MHz -130
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -20 dB
Inband -2 2
Output Spectrum Flatness Outband -4 2 dB
MCS0 Mbps
-5
MCS1 Mbps
-10
MCS2 Mbps
-13
MCS3 Mbps
-16
MCS4 Mbps
-19
MCS5 Mbps
-22
MCS6 Mbps
-25
EVM
MCS7 Mbps
-28
dB
MCS0 Mbps
-91 -88
MCS1 Mbps
-88.5 -86
MCS2 Mbps
-86 -83
MCS3 Mbps
-82.5 -80
MCS4 Mbps
-79.5 -77
MCS5 Mbps
-75 -72
MCS6 Mbps
-73.5 -71
Receiver Minimum Input
Level Sensitivity at the
Antenna
MCS7 Mbps
-72.5 -70
dBm
MCS0 Mbps
16
MCS1 Mbps
13
MCS2 Mbps
11
MCS3 Mbps
8
MCS4 Mbps
4
MCS5 Mbps
0
MCS6 Mbps
-1
Adjacent Channel Rejection
MCS7 Mbps
-2
dB
Receiver Maximum Input
Level ALL -10 dBm
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
COMPANY CONFIDENTIAL
Preliminary Datasheet
10
3.4.4 IEEE802.11a
Parameter Min. Type Max. Units
B1,B2,B3,B4,6~24Mbps 15.5 17.5 18.5
Target Power B1,B2,B3,B4, 36~54Mbps 15.5 16.5 17.5 dBm
+/- 11MHz -20
+/- 20MHz -28
Spectrum Mask
+/- 30MHz -40
dBr
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -125
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
2,110~2,170MHz -130
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -145
dBm/
Hz
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -15 dB
In-band -2 2
Output Spectrum Flatness Out-band -4 2 dB
6 Mbps -5
9 Mbps -8
12 Mbps -10
18 Mbps -13
24 Mbps -16
36 Mbps -19
48 Mbps -22
EVM
54 Mbps -25
dB
6 Mbps -92 -89
9 Mbps -88.5 -86
12 Mbps -86.5 -84
18 Mbps -84.5 -82
24 Mbps -81.5 -79
36 Mbps -78.5 -76
48 Mbps -74.5 -72
Receiver Minimum Input
Level Sensitivity at the
Antenna
54 Mbps -73 -70
dBm
6 Mbps 16
9 Mbps 15
12 Mbps 13
18 Mbps 11
24 Mbps 8
36 Mbps 4
48 Mbps 0
Adjacent Channel Rejection
54 Mbps -1
dB
Receiver Maximum Input
Level ALL -15 dBm
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
B1:5180~5240MHz;B2:5260~5320MHz;B3:5500~5700MHz;B4:5745~5825MHz
COMPANY CONFIDENTIAL
Preliminary Datasheet
11
3.4.5 IEEE802.11an HT20 Single chain
Parameter Min. Type Max. Units
B1,B2,B3,B4;MCS0~MCS4 14.5 16.5 17.5
Target Power B1,B2,B3,B4;MCS5~MCS7 13.5 15.5 16.5 dBm
+/- 11MHz -20
+/- 20MHz -28
Spectrum Mask
+/- 30MHz -45
dBr
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -125
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
dBm/
Hz
2,110~2,170MHz -130
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -20 dB
In-band -2 2
Output Spectrum Flatness Out-band -4 2 dB
MCS0 Mbps
-5
MCS1 Mbps
-10
MCS2 Mbps
-13
MCS3 Mbps
-16
MCS4 Mbps
-19
MCS5 Mbps
-22
MCS6 Mbps
-25
EVM
MCS7 Mbps
-28
dB
MCS0 Mbps
-91.5 -89
MCS1 Mbps
-88.5 -86
MCS2 Mbps
-86.5 -84
MCS3 Mbps
-82.5 -80
MCS4 Mbps
-79.5 -77
MCS5 Mbps
-76 -73
MCS6 Mbps
-74 -71
Receiver Minimum Input
Level Sensitivity at the
Antenna
MCS7 Mbps
-72.5 -70
dBm
MCS0 Mbps
16
MCS1 Mbps
13
MCS2 Mbps
11
MCS3 Mbps
8
MCS4 Mbps
4
MCS5 Mbps
0
MCS6 Mbps
-1
Adjacent Channel Rejection
MCS7 Mbps
-2
dB
Receiver Maximum Input
Level ALL -15 dBm
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
B1:5180~5240MHz;B2:5260~5320MHz;B3:5500~5700MHz;B4:5745~5825MHz
COMPANY CONFIDENTIAL
Preliminary Datasheet
12
3.4.6 IEEE802.11an HT40 Single chain
Parameter Min. Type Max. Units
B1,B2,B3,B4;MCS0~MCS4 14.5 16.5 17.5
Target Power B1,B2,B3,B4;MCS5~MCS7 13.5 15.5 16.5 dBm
+/- 11MHz -20
+/- 20MHz -28
Spectrum Mask
+/- 30MHz -45
dBr
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -125
869~894MHz -130
925~960MHz -130
1,805~1,880MHz -130
1,930~1,990MHz -130
dBm/
Hz
2,110~2,170MHz -130
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -145
Output Center
Frequency Tolerance Overall -20 +20 ppm
OBW -- 26 MHz
Output Center
Frequency Leakage -- -20 dB
In-band -2 2
Output Spectrum Flatness Out-band -4 2 dB
MCS0 Mbps
-5
MCS1 Mbps
-10
MCS2 Mbps
-13
MCS3 Mbps
-16
MCS4 Mbps
-19
MCS5 Mbps
-22
MCS6 Mbps
-25
EVM
MCS7 Mbps
-28
dB
MCS0 Mbps
-89 -86
MCS1 Mbps
-85 -82
MCS2 Mbps
-81 -78
MCS3 Mbps
-77 -74
MCS4 Mbps
-76 -73
MCS5 Mbps
-74 -71
MCS6 Mbps
-71 -68
Receiver Minimum Input
Level Sensitivity at the
Antenna
MCS7 Mbps
-69.5 -67
dBm
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
Adjacent Channel Rejection
MCS7 Mbps
dB
Receiver Maximum Input
Level ALL -15 dBm
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
B1:5190~5230MHz;B2:5270~5310MHz;B3:5510~5670MHz;B4:5755~5795MHz
* The performance will be updated after EDVT testing.
COMPANY CONFIDENTIAL
Preliminary Datasheet
13
3.5 Bluetooth Standard Specifications
Bluetooth Core Specification version 4.0:
Host interface: UART, baud rates up to 4Mbps
Support all Bluetooth 4.0+HS packet types.
Operating frequency range: 2400MHz ~2483.5MHz
Modulation type:
Basic rate 1Mbps: GFSK,
Enhanced data rate 2Mbps: QPSK
Enhanced data rate 3Mbps: 8PSK
Specification Parameter Condition
Min Typ Max
Units
Basic Data Rate – Transmit Performance
RF Transmit Power at the Antenna +5 +8 +11 dBm
-20 dB Bandwidth
1
Tx Output Spectrum Frequency range 83.5 MHz
Initial Carrier Frequency Tolerance ≤ ±75 KHz
DH1/3/5 Drift rate ≤ ±20 kHz/50 µs
DH1 <±20
DH3 ≤ ±40
Carrier Frequency Drift
DH5 <±40
KHz
F1avg 140<∆f1avg<175
F2max ≥ 115
kHz
Modulation Characteristics
F2avg/F1avg 80 %
+/-500KHz -27 dBc
|M-N|=2 -20
Adjacent Channel Transmit
Power |M-N|≥3 -40 dBm
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -130
869~894MHz -135
925~960MHz -135
1,805~1,880MHz -135
1,930~1,990MHz -135
dBm/
Hz
2,110~2,170MHz -135
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -150
Enhanced Data Rate – Transmit Performance
π/4 DQPSK +3 +6 +9
RF Transmit Power
8DPSK +3 +6 +9
dBm
Relative Transmit Power Pdpsk (P
GFSK
-4 dB)<P
DPSK
<(P
GFSK
+1 dB)
i -75 75
0 -10 10
Carrier Frequency Stability
i + 0 -75 75
kHz
π/4 DQPSK ≤ 20
Modulation Accuracy – RMS
DEVM 8DPSK ≤ 13
π/4 DQPSK ≤ 35
Modulation Accuracy – Peak
DEVM
8DPSK ≤ 25
Modulation Accuracy – 99% π/4 DQPSK ≤ 30
%
COMPANY CONFIDENTIAL
Preliminary Datasheet
14
DEVM 8DPSK ≤ 20
f>f
0
+3 MHz ≤ -40
f<f
0
-3 MHz ≤ -40
f=f
0
-3 MHz ≤ -40
f=f
0
-2 MHz ≤ -20
dBm
f=f
0
-1 MHz ≤ -26
f=f
0
+1 MHz ≤ -26
dBr
f=f
0
+2 MHz ≤ -20
In-band Spurious Emissions
f=f
0
+3 MHz ≤ -40
dBm
EDR Differential Phase Coding 99 %
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -130
869~894MHz -135
925~960MHz -135
1,805~1,880MHz -135
1,930~1,990MHz -135
dBm/
Hz
2,110~2,170MHz -135
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -150
Basic Data Rate – Receiver Performance at the Antenna
Sensitivity (DH1) at 0.1% BER Nominal -86 dBm
Co-ch interface C/I
co
<11
Adjacent Chanel Sensitivity C/I
f=f
0
±1 MHz < 0
Adjacent Chanel Sensitivity C/I
f=f
0
±2 MHz <-30
Adjacent Chanel Sensitivity C/I
f≥f
0
±3 MHz < -40
Image Ch interference C/I
image
< -9
C/I Performance at BER≤0.1%
Image Ch interference C/I
image
1MHz
< -20
dB
30MHz~2GHz -10
2GHz~2.4GHz -27
2.5GHz~3GHz -27
Blocking Performance at
BER≤0.1%
3GHz~12.75GHz -10
dBm
Intermodulation Performance at
BER≤0.1% Carrier Level:-64dBm -39 dBm
Max input Level -20 dBm
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
Enhanced Data Rate – Receiver Performance at the Antenna
Sensitivity at Nominal
π/4 DQPSK(ch0~78) -88 dBm
COMPANY CONFIDENTIAL
Preliminary Datasheet
15
8DPSK(ch0~78) -85
BER≤0.01%
π/4 DQPSK -20
Max input Level
8DPSK -20
dBm
Co-ch interface C/I
co
<13
Adjacent Chanel Sensitivity C/I
f=f
0
±1 MHz < 0
Adjacent Chanel Sensitivity C/I
f=f
0
±2 MHz <-30
Adjacent Chanel Sensitivity C/I
f≥f
0
±3 MHz < -40
Image Ch interference C/I
image
< -7
C/I Performance at
BER≤0.1%(π/4 DQPSK)
Image Ch interference C/I
image
1MHz
< -20
dB
Co-ch interface C/I
co
<21
Adjacent Chanel Sensitivity C/I
f=f
0
±1 MHz < 5
Adjacent Chanel Sensitivity C/I
f=f
0
±2 MHz <-25
Adjacent Chanel Sensitivity C/I
f≥f
0
±3 MHz < -33
Image Ch interference C/I
image
< -0
C/I Performance at
BER≤0.1%(8DPSK)
Image Ch interference C/I
image
1MHz
< -13
dB
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
BLE RF specification:
BLE RF specification:
Sensitivity at
BER≤0.01% Nominal
GFSK 0.1%, 1M TBD
-85.5
dBm
RF Transmit Power GFSK 1 TBD
8 dBm
Mod char:delta f1 average 225
275 kHz
Mod char:delta f2 max 99.9
%
<1GHz -54
1~10GHz -54
Receiver Spurious
10GHz~ -54
dBm
f<2.387GHz -26
2.387 GHz< f<2.400 GHz -16
2.4835 GHz<f<2.4965 GHz -16
dBm
Transmission Spurious
Emission-1
f>2.4965 GHz -26
470~805MHz -130
869~894MHz -135
925~960MHz -135
1,805~1,880MHz -135
1,930~1,990MHz -135
dBm/
Hz
2,110~2,170MHz -135
Transmission Spurious
Emission-2
1,574.4~1,576.4MHz -150
COMPANY CONFIDENTIAL
Preliminary Datasheet
16
3.6 Interface timing
3.6.1 SDIO Interface timing
SDIO Default Mode timing
COMPANY CONFIDENTIAL
Preliminary Datasheet
17
SDIO High-Speed Mode Timing
COMPANY CONFIDENTIAL
Preliminary Datasheet
18
3.6.2 UART Interface timing
3.6.3 PCM Interface timing
Short Frame Sync, Master Mode
PCM Timing Diagram (Short Frame Sync, Master Mode)
COMPANY CONFIDENTIAL
Preliminary Datasheet
19
PCM Interface Timing Specifications (Short Frame Sync, Master Mode)
Short Frame Sync, Slave Mode
PCM Timing Diagram (Short Frame Sync, Slave Mode)
PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)
COMPANY CONFIDENTIAL
Preliminary Datasheet
20
Long Frame Sync, Master Mode
PCM Timing Diagram (Long Frame Sync, Master Mode)
PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
PCM Timing Diagram (Long Frame Sync, Slave Mode)
COMPANY CONFIDENTIAL
Preliminary Datasheet
21
PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
COMPANY CONFIDENTIAL
Preliminary Datasheet
22
3.7 LGA Pin Definition
- Module pin-out definition:
- Platform pin-out definition:
COMPANY CONFIDENTIAL
Preliminary Datasheet
23
- Pin definition (Module point of view):
Pin No.
Pin Name Type Description Voltage
1-3 UIM_power_in/GPIO1
UIM_power_out
UIM_SWP
I/O No connection -
4-5 3.3V Power Power voltage input pin 3.3V
6 GND GND Ground -
7 Reserved I/O Reserved LGA pin -
8
*(a)
ALERT - No connection -
9
*(a)
I2C CLK - No connection -
10
*(a)
I2C DATA - No connection -
11
*(a)
COEX1 - No connection -
12
*(a)
COEX2 - No connection -
13
*(a)
COEX3 - No connection -
14-15 SYSCLK/GNSS0
TX_Blanking/GNSS1
- Reserved LGA pin, No connection
16 Reserved I/O Reserved LGA pin, No connection
17 GND GND Ground
18-19 Reserved - Reserved LGA pin, No connection
20 GND GND Ground
21-22 Reserved - Reserved LGA pin, No connection
23 GND GND Ground
24-25 Reserved - Reserved LGA pin, No connection
26 GND GND Ground
27 SUSCLK (32KHz) I 32.768 kHz clock supply input that is provided by
PCH to reduce power and cost for the module.
SUSCLK will have a duty cycle that can be as low as
30% or as high as 70%. 200ppm.
3.3V
28 W_DISABLE#1 I No connection
29
*(a)
PEWAKE# - No connection -
30
*(a)
CLKREQ# - No connection -
31
*(a)
PERST# - No connection -
32 GND GND Ground
33
*(a)
REFCLKN0
34
*(a)
REFCLKP0
- No connection -
35 GND GND Ground
36
*(a)
PETn0
37
*(a)
PETp0
- No connection -
38 GND GND Ground
39
*(a)
PERn0
40
*(a)
PERp0
- No connection -
41 GND GND Ground
42-44 Reserved - Reserved LGA pin, No connection
45 SDIO Reset I
SDIO sideband GPIO pin to enable/disable (reset) the
WiFi function. Platform firmware is required to
assert/de-assert this pin on every boot (warm and
cold). The WiFi device may use 0.5 to 1 mW in reset,
Active Low
1.8V
46 SDIO Wake O SDIO Host Wake. Note in band SDIO wake is not
used for non-active modes, Active Low. Require pull
up on the host side ( recommended 15K to 100K )
1.8V
47 SDIO DATA3 I/O 4 lines for SDIO data exchange 1.8V
48 SDIO DATA2 I/O 4 lines for SDIO data exchange 1.8V
COMPANY CONFIDENTIAL
Preliminary Datasheet
24
49 SDIO DATA1 I/O 4 lines for SDIO data exchange 1.8V
50 SDIO DATA0 I/O 4 lines for SDIO data exchange 1.8V
51 SDIO CMD I/O SDIO Command Interface 1.8V
52 SDIO CLK I SDIO 3.0 Clock 1.8V
53 UART WAKE O Bluetooth host Wake. Active Low 3.3V
54 UART CTS I UART Clear To Send, Active low, connected to
UART RTS on the platform.
1.8V
55 UART TX O UART Transmit Data, connected to UART RX on the
platform.
1.8V
56 UART RX I UART Receive Data, connected to UART TX on the
platform.
1.8V
58 UART RTS O UART Request To Send, Active low, connected to
UART CTS on the platform.
1.8V
58 PCM FR1 I/O PCM Synchronous data sync/ I2S Word Select 1.8V
59 PCMIN I PCM Synchronous data input/ I2S Serial Data IN 1.8V
60 PCMOUT O PCM Synchronous data output/ I2S Serial Data OUT
1.8V
61 PCMCLK I/O PCM Clock/ I2S Continuous Serial Clock (SCK) 1.8V
62 GND GND Ground
63 W_DISABLE#2 I Active low, debounced signal when applied by the
platform it will disable BT radio operation
3.3V
64 LED#2 - No connection -
65 LED#1 - No connection -
66-67 Reserved - Reserved LGA pin
68 GND GND Ground
69
*(a)
USB_D-
70
*(a)
USB _D+
- No connection -
71 GND GND Ground
72-73 3.3V Power Power voltage input pin 3.3V
74-76,
others
GND GND Ground
The pin-out definition is following NGFF1216 standard, but removed partial functions such as PCIE, BT_USB.
All of function used is following the BCM4324 application.
*(a) FOXCONN remove the function according to BCM4324 function.
COMPANY CONFIDENTIAL
Preliminary Datasheet
25
4. Mechanical Drawing
Foxconn can provide the DXF file for detail dimension as following drawing.
(Dimension Tolerance is +-0.15 mm)
Footprint (Top view)
COMPANY CONFIDENTIAL
Preliminary Datasheet
26
T77H506.00 035 Shielding Cover
Antenna port location as following drawing ((Dimension Tolerance is +-0.15 mm))
COMPANY CONFIDENTIAL
Preliminary Datasheet
27
RF connector:
- New RF connector is needed, for lower z-height and smaller footprint
- Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable
- Cable diameter determines mated height: 1.2mm mated height with 0.81mm cable
4.3 Example of IPEX RF connector
IPEX P/N: 20449-001E (MHF4)
IPEX P/N: 20448-001R-081
COMPANY CONFIDENTIAL
Preliminary Datasheet
28
5. Schematic Reference Design
Following is the Evaluation board schematics for reference.
Module pinout & 32.768kHz
BT_UART_CTS_N
BT_UART_RTS_N
BT_UART_RXD
BT_UART_TXD
BT_PCM_IN
BT_PCM_OUT
BT_REG_ON
IRQ line to host processor
VBAT 3.3V
C18
10uF
C-0805
1
2
C17
0.1uF
C-0603S0
1
2
C2
10uF
C-0805
1
2
R1
0ohm
R-0603S0
12
C3
1uF
C-0603S0
1
2
C4
10nF
C-0402S0
1
2
GPIO0_WL_HOST_WAKE
WL_REG_ON
3.3V
Y1
XTAL-7B25000001
1
2
3
4
C1
NL
C-0402S0
1
2
R2
221ohm
R-0402S0
12
SDIO Trace impedance is 50ohm
R39
10Kohm
R-0603S0
1
2
3.3V
3.3V
R41
10Kohm
R-0603S0
1
2
SDIO_D2
SDIO_D3
SDIO_CMD
SDIO_D0
SDIO_D1
SDIO_CLK
BT_PCM_SYNC
T77H506.00
Reserv ed15 43
Reserved9
19
Reserv ed14 42
SDIO_DAT3 47
GND6
6
3.3V1
4
3.3V2
5
Reserved1
1
Reserved2
2
Reserved3
3
I2C_DATA
10
COEX1
11
ALERT
8
Reserved7
16
GND17
17
Reserved8
18
GND23
23
Reserved12
24
Reserv ed16 44
W_DISABLE#1
28
CLKREQ# 30
PERST# 31
REFCLKP0 34
PEWAKE# 29
SDIO_Reset 45
Reserved4
7
GND32 32
SDIO_Wake 46
SDIO_DAT2 48
SDIO_DAT1 49
SDIO_CMD 51
SDIO_CLK 52
I2C_CLK
9
GND20
20
Reserved10
21
Reserved11
22
GND35 35
PETn0 36
PETp0 37
SDIO_DAT0 50
REFCLKN0 33
SUSCLK(32kHz)
27
GND26
26
Reserved13
25
COEX2
12
COEX3
13
Reserved5
14
Reserved6
15
GND38 38
PERn0 39
PERp0 40
GND41 41
UART_WAKE 53
UART_CTS 54
UART_Tx 55
UART_Rx 56
UART_RTS 57
PCMFR1 58
BT_PCMIN 59
PCMOUT 60
PCMCLK 61
GND62 62
W_DISABLE#2 63
LED#2 64
LED#1 65
Reserved17 66
Reserved18 67
GND68 68
USB_D- 69
USB_D+ 70
GND71 71
3.3V3 72
3.3V4 73
GND74 74
GND75 75
GND76 76
GND77
77
GNDG1
G1
GND78
78
GND79
79
GND80
80
GND81
81
GND82
82
GND83
83
GND84
84
GND85
85
GND86
86
GND87
87
GND88
88
GND89
89
GND90
90
GND91
91
GND92
92
GND93
93
GND94
94
GND95
95
GND96
96
GNDG2
G2
GNDG3
G3
GNDG4
G4
GNDG5
G5
GNDG6
G6
GNDG7
G7
GNDG8
G8
GNDG9
G9
GNDG10
G10
GNDG11
G11
GNDG12
G12
BT_PCM_CLK
VBAT 3.3V
C23
10uF
C-0805
1
2
C24
0.1uF
C-0603S0
1
2
BT_HOST_WAKE
5-1 Low Power Clock
The T77H506 module uses a secondary low frequency clock for low power mode timing. A precision external
32.768 KHz clock that meets the specifications listed in Table 3 is required by BCM4324.
Table 3: External 32.768K Low Power Oscillator Specifications
Specification
Paramete
r
Conditions/
Notes Min Typ Max
Units
Frequency
32748 32768 32788 Hz
Input
signal
amplitude
25 200 1800 mV, p-p
Duty
cycle
Square
waveor 30 - 70 %
COMPANY CONFIDENTIAL
Preliminary Datasheet
29
Specification
sine- wave
Clock
jitter
300Hz-15K
Hz - 5 ns
Clock
jitter
During
initial
start-up
10,000 ppm
C2
10uF
C-0805
1
2
R1
0ohm
R-0603S0
12
C3
1uF
C-0603S0
1
2
C4
10nF
C-0402S0
1
2
3.3V
Y1
XTAL-7B25000001
1
2
3
4
C1
NL
C-0402S0
1
2
R2
221ohm
R-0402S0
12 CLK32K (Pin27)
5-2 Audio PCM interface:
COMPANY CONFIDENTIAL
Preliminary Datasheet
30
6. PCB Layout
6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.3+/-0.03mm
7. Software Requirement
- Operating System Support
Windows 8
Windows Blue or later Android 4.3 and above
- WLAN Feature Support
WiFi Direct
WiFi Display
Wi-Fi Miracast (Intel will support WiDi with Miracast interoperability)
- WLAN Security Support
WPA/WPA2 Enterprise
CCX Lite or higher
WMM/AES/TKIP/CKIP
- WLAN Transmit Power Reduction
Software control to meet FCC SAR requirement
Capability to disable 5GHz operation
- Bluetooth Profile Support
A2DP-Sink
A2DP-Source
AVRCP-Target
DUN-DT
FTP-Client
FTP-Server
HCRP-Client
HID-Host
MCAP
OPP-Client
OPP-Server
PAN-User
COMPANY CONFIDENTIAL
Preliminary Datasheet
31
SDP
Serial-DevA
Serial-DevB
- BLE (Bluetooth Low Energy) Support
Windows 8
Windows Blue or later
COMPANY CONFIDENTIAL
Preliminary Datasheet
32
8. Regulatory
USA : FCC P15B / FCC P15C / FCC P15E
Canada : IC RSS-210
Japan : TELEC
EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd
BCM4324 module 5GHz power table
Typical power (limit is +1/-2dB) (unit:dBm)
HT20 CH36 CH48 CH52 CH64 CH100 CH120 CH140 CH149 CH165
ANT0 16
16
17.5
17.5
17.5
17.5
17
17.5
17.5
6Mbps
ANT1 16
16
17.5
17.5
17.5
17.5
17
17.5
17.5
MCS8
2Tx 16
16
19.5
19.5
19.5
19.5
19.5
19.5
19.5
HT40 CH38 CH64 CH54 CH62 CH102 CH134 CH151 CH159
MCS8
2Tx 16
16
19.5
18
19
19.5
19.5
19.5
BCM4324 module 2.4GHz power table
Typical power (limit is +1/-2dB) (unit:dBm)
HT20 CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 CH10 CH11
ANT0
15.5
15.5
15.5
15.5
15.5
15.5
15.5
15.5
15.5
15.5
15.5
1Mbps
ANT1
18
18
18
18
18
18
18
18
18
18
18
ANT0
17
17
17
17
17
17
17
17
17
17
17
6Mbps
ANT1
17
17
17
17
17
17
17
17
17
17
17
MCS8
2Tx 18.5
19.5
19.5
19.5
19.5
19.5
19.5
19.5
19.5
19.5
17.5
COMPANY CONFIDENTIAL
Preliminary Datasheet
33
9. Package reliability test conditions
Sine Vibration
1.Frequency = 5 ~ 500 ~ 5 HZ
2.Acceleration = 2 Grms
3.Each of x, y, z axis/ 30 min
Shock Test
1.Sine wave ,230G , 3msec
2.Test +/- x, y, z axes
10. Environmental Requirements and Specifications
10.1 Temperature
9.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating in ambient temperature of
0 °C to +70°C.
10.1.2 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational performance be degraded when
restored to the operating temperature when exposed to storage temperature in the range of -10°C to +85°C.
10.2 PCB bending
The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly
customer.
10.3 Handling environment
ESD
There are semiconductors on the module, please handle the module under ESD protected and
well-controlled environment (<100V).
Terminals Handling Notice
The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.
Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and
real for packaging materials have no heat resistance, please bake the components moved into another
container such as heat resistance trays.
Others
1.
Please make sure to avoid mechanical shock and vibration for this module.
2.
Please do not drop the module.
3.
Please do not clean the module.
10.4 Storage Condition
1.
Moisture barrier bag must be stored under 40 , humidity under 90% RH, when the moisture
barrier bag is sealed by Foxconn.
2.
The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.
3.
If Moisture barrier bag is open, the component must be stored in an environment of <25 5
/10%RH
4.
Please keep the module at 30
/70% RH.
COMPANY CONFIDENTIAL
Preliminary Datasheet
34
10.5 Baking Condition
If below two conditions happens:
a) Humidity indicator cards read >30%
b) Temp < 30 , Humidity <70%RH, moisture barrier bag open over 96 hours
Products require baking before mounting
Baking condition: 90 , 12-22 hours
Baking times: Max. 2 times
10.6 Soldering and reflow condition
1) Heating method
Conventional Convection or IR/convection
2) Temperature measurement
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.
3) Solder paste composition
Sn/3.0Ag/0.5Cu
4) Allowable reflow soldering times: 2 times, based on the below reflow soldering profile
5) Temperature profile
Reflow soldering shall be done according to the below temperature profile.
6) Peak temp: 245 degree C
11 Package information
TBD
Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)
COMPANY CONFIDENTIAL
39
10 Package information
TBD
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-
location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID: MCLT77H506”. The grantee's FCC ID can be used only when all FCC compliance requirements are
met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.

Navigation menu