HON HAI PRECISION IND T77H506 802.11abgn+BT4.0 module User Manual

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COMPANY CONFIDENTIAL
Preliminary Datasheet
BCM4324 WLAN +BT Combo Module
(Foxconn T77H506.00 035)
Product Specification
Rev 0.7
Prepared by
Wilmer
Reviewed by
Gary Su
Approved by
Chang Fu
COMPANY CONFIDENTIAL
Preliminary Datasheet
Index
1. REVISION HISTORY...................................................................................................................................................3
2. INTRODUCTION ..........................................................................................................................................................4
2.1 SCOPE ......................................................................................................................................................................4
2.2 FUNCTION .................................................................................................................................................................4
3. PRODUCT SPECIFICATION .....................................................................................................................................5
3.1 HARDWARE CHARACTERISTIC .................................................................................................................................5
3.2 HARDWARE ARCHITECTURE ....................................................................................................................................5
3.3 ELECTRICAL SPECIFICATION ....................................................................................................................................6
3.4 WLAN RF CHARACTERISTICS .................................................................................................................................7
3.4.1 IEEE802.11b ..................................................................................................................................................7
3.4.2 IEEE802.11g (SISO).....................................................................................................................................7
3.4.3 IEEE802.11gn HT20 Single chain ............................................................................................................9
3.4.4 IEEE802.11a ................................................................................................................................................10
3.4.5 IEEE802.11an HT20 Single chain ..........................................................................................................11
3.4.6 IEEE802.11an HT40 Single chain ..........................................................................................................12
3.5 BLUETOOTH STANDARD SPECIFICATIONS .............................................................................................................13
3.6 INTERFACE TIMING..................................................................................................................................................16
3.6.1 SDIO INTERFACE TIMING ....................................................................................................................................16
3.6.2 UART INTERFACE TIMING ...................................................................................................................................18
3.6.3 PCM INTERFACE TIMING .....................................................................................................................................18
4. MECHANICAL DRAWING .......................................................................................................................................25
5. SCHEMATIC REFERENCE DESIGN .....................................................................................................................28
6. PCB LAYOUT .............................................................................................................................................................30
7. SOFTWARE REQUIREMENT..................................................................................................................................30
8. REGULATORY ...........................................................................................................................................................32
9. PACKAGE RELIABILITY TEST CONDITIONS ....................................................................................................33
10. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS.....................................................................33
10.1 TEMPERATURE .....................................................................................................................................................33
10.2 PCB BENDING ......................................................................................................................................................33
10.3 HANDLING ENVIRONMENT ....................................................................................................................................33
10.4 STORAGE CONDITION ..........................................................................................................................................33
10.5 BAKING CONDITION ..............................................................................................................................................34
10.6 SOLDERING AND REFLOW CONDITION ..................................................................................................................34
11 PACKAGE INFORMATION.....................................................................................................................................34
COMPANY CONFIDENTIAL
Preliminary Datasheet
1 Revision History
Date
Change Note
Author
REV Note
2013-05-07
Initial release
Wilmer
0.1
2013-05-20
Modify the RX performance result
Wilmer
0.2
2013-05-23
1. Update the TX and RX performance result
2. Modify some pin description.
3. Add Shielding case drawing
Wilmer
0.3
Wilmer
0.4
2013-07-02
1. Update the TX and RX SPC in section 3.4 and 3.5.
3. Add interface timing in section 3.6
4. Update the Mechanical drawing in section 4
5. Add the schematics reference design in section 5
6. Add the software support in section 7
7. Add Regulatory in section 8
8. Add environment specification in section 9
9. Add package information
2013-07-09
1. Update the module mechanical drawing in section 4
Wilmer
0.5
2013-07-27
1. Replace mechanics drawing adding four corners’ footprint
Wilmer
dimension in Section 4
0.6
2013-08-02
Add FCC Power Table
0.7
Wilmer
COMPANY CONFIDENTIAL
Preliminary Datasheet
2. Introduction
Project Name: 802.11abgn (2X2) + BT4.0 combo module
This documentation describes the product specification of the WLAN+BT combo Module. WLAN is
Compliant with IEEE 802.11 a/b/g and 2x2 IEEE 802.11n MAC/ baseband/radio, Bluetooth is compliant with
Bluetooth 4.0+HS. This module takes advantage of the high throughput and extended range of Broadcom
second-generation MIMO solution. It is a confidential document of Foxconn.
* For b/g/n and a/b/g/n module, Foxconn HW/FW is the same, platform use different firmware and driver
to enable or disable 5GHz
2.1 Scope
This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz
and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow
user to switch to different vendors’ Access Points through the wireless networks and to prevent from
eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data
rate provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS15(HT40) with
PHY data rate to 300Mbps by dual stream. Bluetooth is compliant to Core Specification version 4.0.
2.2 Function
Single stream 802.11n support for 20MHz channels provide PHY Layer rates up to 72Mbps.
Dual stream 802.11n support for 20MHz/40MHz channels provide PHY Layer rates up to 300Mbps.
Bluetooth supports Class 1 and Class 2 output power.
Diplexer (which reject 2170MHz) integrated
Provides a small form factor solution and ultra low power consumption to support low cost requirement.
Host interface supports:
WLAN: SDIO;
BT data: UART
BT digital audio: PCM
COMPANY CONFIDENTIAL
Preliminary Datasheet
3. Product Specification
3.1 Hardware Characteristic
Form factor
Host Interface
PCB
RF connector
13mmx17mmx1.5mm LGA
WLAN: SDIO
BT: UART for data, PCM for Audio
6-layer HDI design
Two MHF4 RF connector on module
3.2 Hardware Architecture
The WLAN+BT combo module is designed base on BROADCOM BCM4324 chip, the Broadcom
BCM4324 is a highly integrated single chip solution for single and dual stream dual-band WLAN and
BT4.0. Single and dual Antenna support, a 37.4MHz crystal is used for reference clock generation, see
the block diagram as below:
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.3 Electrical Specification
Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the device can occur. Functional
operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended
can adversely affect long-term reliability of the device.
Rating
Symbol
Value
Unit
DC supply voltage for the device
3.3V
2.3 to 4.8
Recommended Operating Condition
Element
Symbol
Value
Minimum
DC supply voltage for the device
3.3V
3.0
Typical
3.3
Unit
Maximum
3.6
Function operation is not guaranteed outside this limit, and operation outside this limit for extended
periods can adversely affect long-term reliability of the device.
Power-Up Sequence Timing
COMPANY CONFIDENTIAL
Preliminary Datasheet
Current Consumption
* Note: it would be updated after EDVT testing.
3.4 WLAN RF Characteristics
3.4.1 IEEE802.11b
Parameter
Condition
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
OBW
Spread Bandwidth
RF Carrier Suppression
Transmit power –on ramp
Transmit power –down
ramp
Center Frequency
Tolerance
Min.
CH1~CH13, 1~11Mbps
Type
16.5
18.5
fc-22MHzfc+22MHz
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
--Data=0101 and DQPSK
modulation
10% to 90% of max power
dBr
-26
-16
-16
-26
-125
-130
-130
-130
-130
-130
-145
26
dBm
dBm/Hz
MHz
dB
15
1Mbps
2Mbps
5.5Mbps
11Mbps
1 Mbps
2 Mbps
5.5 Mbps
11 Mbps
Adjacent Channel
Rejection
Receiver Maximum
Input Level
dBm
-50
-20
Receiver Minimum Input
Level Sensitivity at Antenna
19.5
Units
-30
90% to 10% of max power
EVM (peak)
Max.
-97
-94.5
-92.5
-89
us
us
20
ppm
35
35
35
35
-94
-92
-90
-86
dBm
11Mbps
35
dB
ALL
dBm
3.4.2 IEEE802.11g (SISO)
Parameter
Target Power
Spectrum Mask
CH1~CH13,6~24Mbps
CH1~CH13, 36~54Mbps
+/- 11MHz
Min.
15
14
Type
17
16
Max.
18
17
-20
Units
dBm
dBr
COMPANY CONFIDENTIAL
Preliminary Datasheet
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
Output Center
Frequency Tolerance
OBW
Output Center
Frequency Leakage
Output Spectrum Flatness
EVM
Receiver Minimum Input
Level Sensitivity at the
Antenna
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
+/- 20MHz
+/- 30MHz
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
Overall
-28
-40
-26
-16
-16
-26
-125
-130
-130
-130
-130
-130
-145
-20
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-15
dB
In-band
Out-band
6 Mbps
9 Mbps
12 Mbps
18 Mbps
24 Mbps
36 Mbps
48 Mbps
54 Mbps
6 Mbps
9 Mbps
12 Mbps
18 Mbps
24 Mbps
36 Mbps
48 Mbps
54 Mbps
6 Mbps
9 Mbps
12 Mbps
18 Mbps
24 Mbps
36 Mbps
48 Mbps
54 Mbps
-2
-4
16
15
13
11
-1
dB
ALL
-10
dBm
-93
-91
-89.5
-87.5
-83.5
-81
-75.5
-74.5
-5
-8
-10
-13
-16
-19
-22
-25
-90
-88
-87
-85
-81
-78
-73
-72
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dB
dB
dBm
dBm
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.4.3 IEEE802.11gn HT20 Single chain
Parameter
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
Output Center
Frequency Tolerance
OBW
Output Center
Frequency Leakage
Output Spectrum Flatness
EVM
Receiver Minimum Input
Level Sensitivity at the
Antenna
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
CH1~CH13,MCS0~MCS4
CH1~CH13,MCS5~MCS7
+/- 11MHz
+/- 20MHz
+/- 30MHz
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
Overall
Min.
14.5
13.5
Type
16.5
15.5
-20
Max.
17.5
16.5
-20
-28
-45
-26
-16
-16
-26
-125
-130
-130
-130
-130
-130
-145
Units
dBm
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-20
dB
Inband
Outband
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
-2
-4
16
13
11
-1
-2
dB
ALL
-10
dBm
-91
-88.5
-86
-82.5
-79.5
-75
-73.5
-72.5
-5
-10
-13
-16
-19
-22
-25
-28
-88
-86
-83
-80
-77
-72
-71
-70
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dB
dB
dBm
dBm
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.4.4 IEEE802.11a
Parameter
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
Output Center
Frequency Tolerance
OBW
Output Center
Frequency Leakage
Output Spectrum Flatness
EVM
Receiver Minimum Input
Level Sensitivity at the
Antenna
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
B1,B2,B3,B4,6~24Mbps
B1,B2,B3,B4, 36~54Mbps
+/- 11MHz
+/- 20MHz
+/- 30MHz
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
Overall
Min.
15.5
15.5
Type
17.5
16.5
-20
Max.
18.5
17.5
-20
-28
-40
-26
-16
-16
-26
-125
-130
-130
-130
-130
-130
-145
Units
dBm
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-15
dB
In-band
Out-band
6 Mbps
9 Mbps
12 Mbps
18 Mbps
24 Mbps
36 Mbps
48 Mbps
54 Mbps
6 Mbps
9 Mbps
12 Mbps
18 Mbps
24 Mbps
36 Mbps
48 Mbps
54 Mbps
6 Mbps
9 Mbps
12 Mbps
18 Mbps
24 Mbps
36 Mbps
48 Mbps
54 Mbps
-2
-4
16
15
13
11
-1
dB
ALL
-15
dBm
-92
-88.5
-86.5
-84.5
-81.5
-78.5
-74.5
-73
-5
-8
-10
-13
-16
-19
-22
-25
-89
-86
-84
-82
-79
-76
-72
-70
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dB
dB
dBm
dBm
B1:5180~5240MHz;B2:5260~5320MHz;B3:5500~5700MHz;B4:5745~5825MHz
10
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.4.5 IEEE802.11an HT20 Single chain
Parameter
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
Output Center
Frequency Tolerance
OBW
Output Center
Frequency Leakage
Output Spectrum Flatness
EVM
Receiver Minimum Input
Level Sensitivity at the
Antenna
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
B1,B2,B3,B4;MCS0~MCS4
B1,B2,B3,B4;MCS5~MCS7
+/- 11MHz
+/- 20MHz
+/- 30MHz
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
Overall
Min.
14.5
13.5
Type
16.5
15.5
-20
Max.
17.5
16.5
-20
-28
-45
-26
-16
-16
-26
-125
-130
-130
-130
-130
-130
-145
Units
dBm
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-20
dB
In-band
Out-band
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
-2
-4
16
13
11
-1
-2
dB
ALL
-15
dBm
-91.5
-88.5
-86.5
-82.5
-79.5
-76
-74
-72.5
-5
-10
-13
-16
-19
-22
-25
-28
-89
-86
-84
-80
-77
-73
-71
-70
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dB
dB
dBm
dBm
B1:5180~5240MHz;B2:5260~5320MHz;B3:5500~5700MHz;B4:5745~5825MHz
11
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.4.6 IEEE802.11an HT40 Single chain
Parameter
Target Power
Spectrum Mask
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
Output Center
Frequency Tolerance
OBW
Output Center
Frequency Leakage
Output Spectrum Flatness
EVM
Receiver Minimum Input
Level Sensitivity at the
Antenna
Adjacent Channel Rejection
Receiver Maximum Input
Level
Receiver Spurious
B1,B2,B3,B4;MCS0~MCS4
B1,B2,B3,B4;MCS5~MCS7
+/- 11MHz
+/- 20MHz
+/- 30MHz
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
Overall
Min.
14.5
13.5
Type
16.5
15.5
-20
Max.
17.5
16.5
-20
-28
-45
-26
-16
-16
-26
-125
-130
-130
-130
-130
-130
-145
Units
dBm
dBr
dBm
dBm/
Hz
+20
ppm
--
26
MHz
--
-20
dB
In-band
Out-band
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
MCS0 Mbps
MCS1 Mbps
MCS2 Mbps
MCS3 Mbps
MCS4 Mbps
MCS5 Mbps
MCS6 Mbps
MCS7 Mbps
-2
-4
ALL
-15
-89
-85
-81
-77
-76
-74
-71
-69.5
-5
-10
-13
-16
-19
-22
-25
-28
-86
-82
-78
-74
-73
-71
-68
-67
dB
dB
dBm
dB
dBm
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dBm
B1:5190~5230MHz;B2:5270~5310MHz;B3:5510~5670MHz;B4:5755~5795MHz
* The performance will be updated after EDVT testing.
12
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.5 Bluetooth Standard Specifications
Bluetooth Core Specification version 4.0:
Host interface: UART, baud rates up to 4Mbps
Support all Bluetooth 4.0+HS packet types.
Operating frequency range: 2400MHz ~2483.5MHz
Modulation type:
Basic rate 1Mbps: GFSK,
Enhanced data rate 2Mbps: QPSK
Enhanced data rate 3Mbps: 8PSK
Parameter
Condition
Min
Basic Data Rate – Transmit Performance
RF Transmit Power at the Antenna
-20 dB Bandwidth
Tx Output Spectrum
Frequency range
Initial Carrier Frequency Tolerance
DH1/3/5 Drift rate
DH1
Carrier Frequency Drift
DH3
DH5
Specification
Typ
Max
+5
+8
+11
83.5
≤ ±75
≤ ±20
<±20
≤ ±40
<±40
Units
dBm
MHz
KHz
kHz/50 µs
KHz
F1avg
140<∆f1avg<175
F2max
≥ 115
F2avg/F1avg
80
kHz
Modulation Characteristics
Adjacent Channel Transmit
Power
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
+/-500KHz
|M-N|=2
|M-N|≥3
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
-27
dBc
-20
-40
-26
-16
-16
-26
-130
-135
-135
-135
-135
-135
-150
dBm
dBm
dBm/
Hz
Enhanced Data Rate – Transmit Performance
π/4 DQPSK
+3
+6
+9
8DPSK
+3
+6
+9
RF Transmit Power
dBm
Relative Transmit Power
Pdpsk
Carrier Frequency Stability
ωi
ω0
ωi + ω0
Modulation Accuracy – RMS
DEVM
Modulation Accuracy – Peak
DEVM
Modulation Accuracy – 99%
(PGFSK-4 dB)f0+3 MHz
≤ -40
f2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
-26
-16
-16
-26
-130
-135
-135
-135
-135
-135
-150
dBm
dBm/
Hz
Basic Data Rate – Receiver Performance at the Antenna
Sensitivity (DH1) at 0.1% BER
Nominal
-86
Co-ch interface C/Ico
C/I Performance at BER≤0.1%
dBm
<11
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz
Adjacent Chanel Sensitivity C/I
f≥f0±3 MHz
<0
<-30
dB
< -40
Image Ch interference C/Iimage
< -9
Image Ch interference C/Iimage±
< -20
1MHz
Blocking Performance at
BER≤0.1%
Intermodulation Performance at
BER≤0.1%
30MHz~2GHz
-10
2GHz~2.4GHz
-27
2.5GHz~3GHz
-27
3GHz~12.75GHz
-10
Carrier Level:-64dBm
-39
dBm
-20
dBm
dBm
Max input Level
Receiver Spurious
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dBm
Enhanced Data Rate – Receiver Performance at the Antenna
Sensitivity at
Nominal
π/4 DQPSK(ch0~78)
-88
dBm
14
COMPANY CONFIDENTIAL
Preliminary Datasheet
BER≤0.01%
8DPSK(ch0~78)
-85
π/4 DQPSK
-20
8DPSK
-20
Max input Level
dBm
Co-ch interface C/Ico
C/I Performance at
BER≤0.1%(π/4 DQPSK)
<13
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz
Adjacent Chanel Sensitivity C/I
f≥f0±3 MHz
<0
<-30
dB
< -40
Image Ch interference C/Iimage
< -7
Image Ch interference C/Iimage±
< -20
1MHz
Co-ch interface C/Ico
C/I Performance at
BER≤0.1%(8DPSK)
<21
Adjacent Chanel Sensitivity C/I
f=f0±1 MHz
Adjacent Chanel Sensitivity C/I
f=f0±2 MHz
Adjacent Chanel Sensitivity C/I
f≥f0±3 MHz
<5
<-25
dB
< -33
Image Ch interference C/Iimage
< -0
Image Ch interference C/Iimage±
< -13
1MHz
Receiver Spurious
<1GHz
-54
1~10GHz
-54
10GHz~
-54
dBm
BLE RF specification:
BLE RF specification:
Sensitivity at
BER≤0.01%
Nominal
RF Transmit Power
GFSK 0.1%, 1M
GFSK
Mod char:delta f1 average
225
Mod char:delta f2 max
99.9
Receiver Spurious
Transmission Spurious
Emission-1
Transmission Spurious
Emission-2
TBD
-85.5
dBm
TBD
dBm
275
kHz
<1GHz
-54
1~10GHz
-54
10GHz~
-54
f<2.387GHz
2.387 GHz< f<2.400 GHz
2.4835 GHz2.4965 GHz
470~805MHz
869~894MHz
925~960MHz
1,805~1,880MHz
1,930~1,990MHz
2,110~2,170MHz
1,574.4~1,576.4MHz
-26
-16
-16
-26
-130
-135
-135
-135
-135
-135
-150
dBm
dBm
dBm/
Hz
15
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.6 Interface timing
3.6.1 SDIO Interface timing
SDIO Default Mode timing
16
COMPANY CONFIDENTIAL
Preliminary Datasheet
SDIO High-Speed Mode Timing
17
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.6.2 UART Interface timing
3.6.3 PCM Interface timing
Short Frame Sync, Master Mode
PCM Timing Diagram (Short Frame Sync, Master Mode)
18
COMPANY CONFIDENTIAL
Preliminary Datasheet
PCM Interface Timing Specifications (Short Frame Sync, Master Mode)
 Short Frame Sync, Slave Mode
PCM Timing Diagram (Short Frame Sync, Slave Mode)
PCM Interface Timing Specifications (Short Frame Sync, Slave Mode)
19
COMPANY CONFIDENTIAL
Preliminary Datasheet
Long Frame Sync, Master Mode
PCM Timing Diagram (Long Frame Sync, Master Mode)
PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
PCM Timing Diagram (Long Frame Sync, Slave Mode)
20
COMPANY CONFIDENTIAL
Preliminary Datasheet
PCM Interface Timing Specifications (Long Frame Sync, Master Mode)
21
COMPANY CONFIDENTIAL
Preliminary Datasheet
3.7 LGA Pin Definition
- Module pin-out definition:
- Platform pin-out definition:
22
COMPANY CONFIDENTIAL
Preliminary Datasheet
Pin definition (Module point of view):
Pin No. Pin Name
1-3
Type Description
Voltage
I/O
No connection
4-5
8*(a)
UIM_power_in/GPIO1
UIM_power_out
UIM_SWP
3.3V
GND
Reserved
ALERT
Power
GND
I/O
Power voltage input pin
Ground
Reserved LGA pin
No connection
3.3V
9*(a)
I2C CLK
No connection
10*(a)
11*(a)
12*(a)
13*(a)
14-15
No connection
No connection
No connection
No connection
Reserved LGA pin, No connection
16
17
18-19
20
21-22
23
24-25
26
27
I2C DATA
COEX1
COEX2
COEX3
SYSCLK/GNSS0
TX_Blanking/GNSS1
Reserved
GND
Reserved
GND
Reserved
GND
Reserved
GND
SUSCLK (32KHz)
I/O
GND
GND
GND
GND
28
29*(a)
30*(a)
31*(a)
32
33*(a)
34*(a)
35
36*(a)
37*(a)
38
39*(a)
40*(a)
41
42-44
45
W_DISABLE#1
PEWAKE#
CLKREQ#
PERST#
GND
REFCLKN0
REFCLKP0
GND
PETn0
PETp0
GND
PERn0
PERp0
GND
Reserved
SDIO Reset
GND
Reserved LGA pin, No connection
Ground
Reserved LGA pin, No connection
Ground
Reserved LGA pin, No connection
Ground
Reserved LGA pin, No connection
Ground
32.768 kHz clock supply input that is provided by
PCH to reduce power and cost for the module.
SUSCLK will have a duty cycle that can be as low as
30% or as high as 70%. 200ppm.
No connection
No connection
No connection
No connection
Ground
No connection
GND
Ground
No connection
GND
Ground
No connection
GND
46
SDIO Wake
47
48
SDIO DATA3
SDIO DATA2
I/O
I/O
Ground
Reserved LGA pin, No connection
SDIO sideband GPIO pin to enable/disable (reset) the 1.8V
WiFi function. Platform firmware is required to
assert/de-assert this pin on every boot (warm and
cold). The WiFi device may use 0.5 to 1 mW in reset,
Active Low
SDIO Host Wake. Note in band SDIO wake is not
1.8V
used for non-active modes, Active Low. Require pull
up on the host side ( recommended 15K to 100K )
4 lines for SDIO data exchange
1.8V
4 lines for SDIO data exchange
1.8V
3.3V
23
COMPANY CONFIDENTIAL
Preliminary Datasheet
49
50
51
52
53
54
SDIO DATA1
SDIO DATA0
SDIO CMD
SDIO CLK
UART WAKE
UART CTS
I/O
I/O
I/O
55
UART TX
56
UART RX
58
UART RTS
58
59
60
61
62
63
PCM FR1
PCMIN
PCMOUT
PCMCLK
GND
W_DISABLE#2
I/O
I/O
GND
64
65
66-67
68
69*(a)
70*(a)
71
72-73
74-76,
others
LED#2
LED#1
Reserved
GND
USB_DUSB _D+
GND
3.3V
GND
GND
4 lines for SDIO data exchange
4 lines for SDIO data exchange
SDIO Command Interface
SDIO 3.0 Clock
Bluetooth host Wake. Active Low
UART Clear To Send, Active low, connected to
UART RTS on the platform.
UART Transmit Data, connected to UART RX on the
platform.
UART Receive Data, connected to UART TX on the
platform.
UART Request To Send, Active low, connected to
UART CTS on the platform.
PCM Synchronous data sync/ I2S Word Select
PCM Synchronous data input/ I2S Serial Data IN
PCM Synchronous data output/ I2S Serial Data OUT
PCM Clock/ I2S Continuous Serial Clock (SCK)
Ground
Active low, debounced signal when applied by the
platform it will disable BT radio operation
No connection
No connection
Reserved LGA pin
Ground
No connection
GND
Power
GND
Ground
Power voltage input pin
Ground
1.8V
1.8V
1.8V
1.8V
3.3V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
3.3V
3.3V
The pin-out definition is following NGFF1216 standard, but removed partial functions such as PCIE, BT_USB.
All of function used is following the BCM4324 application.
*(a) FOXCONN remove the function according to BCM4324 function.
24
COMPANY CONFIDENTIAL
Preliminary Datasheet
4. Mechanical Drawing
Foxconn can provide the DXF file for detail dimension as following drawing.
(Dimension Tolerance is +-0.15 mm)
Footprint (Top view)
25
COMPANY CONFIDENTIAL
Preliminary Datasheet
T77H506.00 035 Shielding Cover
Antenna port location as following drawing ((Dimension Tolerance is +-0.15 mm))
26
COMPANY CONFIDENTIAL
Preliminary Datasheet
RF connector:
- New RF connector is needed, for lower z-height and smaller footprint
- Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable
- Cable diameter determines mated height: 1.2mm mated height with 0.81mm cable
4.3 Example of IPEX RF connector
IPEX P/N: 20449-001E (MHF4)
IPEX P/N: 20448-001R-081
27
COMPANY CONFIDENTIAL
Preliminary Datasheet
5. Schematic Reference Design
Following is the Evaluation board schematics for reference.
BT_HOST_WAKE
Module pinout & 32.768kHz
VBAT 3.3V
3.3V
R41
10Kohm
R-0603S0
SDIO_D1
49
SDIO_DAT1
SDIO_CMD
SDIO_D0
50
51
SDIO_CMD
SDIO_DAT0
SDIO_CLK
53
52
SDIO_CLK
UART_WAKE
BT_UART_TXD
BT_UART_RXD
BT_UART_CTS_N
UART_CTS
54
55
UART_Tx
UART_Rx
BT_PCM_SYNC
BT_UART_RTS_N
56
57
UART_RTS
PCMFR1
58
BT_PCM_IN
BT_PCM_OUT
59
BT_PCMIN
61
PCMCLK
63
64
65
66
67
68
69
70
71
72
73
74
75
62
GND62
W_DISABLE#2
LED#2
LED#1
Reserved17
Reserved18
GND68
USB_D-
USB_D+
GND71
3.3V3
3.3V4
GND74
Reserv ed16
Reserv ed15
Reserv ed14
GND87
GND88
GND89
GND90
GND91
T77H506.00
GND41
PERp0
PERn0
GND92
GND93
GND94
GND95
GND96
GND38
PETp0
PETn0
GNDG1
GNDG2
GNDG3
GNDG4
GNDG5
GNDG6
GNDG7
GNDG8
GNDG9
GNDG10
GNDG11
GNDG12
GND35
REFCLKP0
REFCLKN0
GND32
W_DISABLE#1
CLKREQ#
PEWAKE#
48
47
3.3V
SDIO_D2
R39
10Kohm
R-0603S0
SDIO_D3
46
45
GPIO0_WL_HOST_WAKE
WL_REG_ON
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
SUSCLK(32kHz)
27
26
GND26
Reserved13
Reserved12
25
24
GND23
Reserved11
Reserved10
22
23
21
20
GND20
Reserved9
19
Reserved8
18
GND17
Reserved7
17
16
Reserved6
15
Reserved5
14
COEX3
13
COEX2
12
11
COEX1
I2C_DATA
10
I2C_CLK
ALERT
Reserved4
3.3V1
GND6
3.3V2
PERST#
Reserved1
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
G12
SDIO_Wake
92
93
94
95
96
SDIO_DAT2
SDIO_Reset
Reserved3
87
88
89
90
91
SDIO Trace impedance is 50ohm
SDIO_DAT3
GND82
GND83
GND84
GND85
GND86
82
83
84
85
86
GND77
GND78
GND79
GND80
GND81
Reserved2
77
78
79
80
81
GND75
GND76
76
BT_PCM_CLK
C17
C18
0.1uF
10uF
C-0603S0 C-0805
60
PCMOUT
BT_REG_ON
VBAT 3.3V
3.3V
C24
C23
IRQ line
to host processor
0.1uF
10uF
C-0603S0 C-0805
R1
0ohm
R-0603S0
1 1
R2
221ohm
R-0402S0
Y1
C1
NL
C-0402S0
XTAL-7B25000001
C2
10uF
C-0805
C3
1uF
C-0603S0
C4
10nF
C-0402S0
5-1 Low Power Clock
The T77H506 module uses a secondary low frequency clock for low power mode timing. A precision external
32.768 KHz clock that meets the specifications listed in Table 3 is required by BCM4324.
Table 3: External 32.768K Low Power Oscillator Specifications
Paramete
Conditions/
Notes
Frequency
Input
signal
amplitude
Duty
cycle
25
℃
Square
waveor
Specification
Units
Min
Typ
Max
32748
32768
32788
Hz
1800
mV, p-p
70
200
30
28
COMPANY CONFIDENTIAL
Preliminary Datasheet
Specification
Clock
jitter
Clock
jitter
sine- wave
300Hz-15K
Hz
During
initial
start-up
ns
10,000
ppm
3.3V
R1
0ohm
R-0603S0
1 1
R2
221ohm
R-0402S0
Y1
XTAL-7B25000001
C2
10uF
C-0805
C3
1uF
C-0603S0
CLK32K (Pin27)
C1
NL
C-0402S0
C4
10nF
C-0402S0
5-2 Audio PCM interface:
29
COMPANY CONFIDENTIAL
Preliminary Datasheet
6. PCB Layout
6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.3+/-0.03mm
7. Software Requirement
Operating System Support
 Windows 8
Windows Blue or later Android 4.3 and above
WLAN Feature Support
 WiFi Direct
 WiFi Display
Wi-Fi Miracast (Intel will support WiDi with Miracast interoperability)
WLAN Security Support
 WPA/WPA2 Enterprise
 CCX Lite or higher
 WMM/AES/TKIP/CKIP
WLAN Transmit Power Reduction
 Software control to meet FCC SAR requirement
 Capability to disable 5GHz operation
Bluetooth Profile Support
 A2DP-Sink
 A2DP-Source
 AVRCP-Target
 DUN-DT
 FTP-Client
 FTP-Server
 HCRP-Client
 HID-Host
 MCAP
 OPP-Client
 OPP-Server
 PAN-User
30
COMPANY CONFIDENTIAL
Preliminary Datasheet
SDP
Serial-DevA
Serial-DevB
BLE (Bluetooth Low Energy) Support
 Windows 8
Windows Blue or later
31
COMPANY CONFIDENTIAL
Preliminary Datasheet
8. Regulatory
USA : FCC P15B / FCC P15C / FCC P15E
Canada : IC RSS-210
Japan : TELEC
EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd
BCM4324 module 5GHz power table
Typical power (limit is +1/-2dB) (unit:dBm)
CH36
HT20
6Mbps
CH48
CH52
CH64
CH100
CH120
CH140
CH149
CH165
ANT0
16
16
17.5
17.5
17.5
17.5
17
17.5
17.5
ANT1
16
16
17.5
17.5
17.5
17.5
17
17.5
17.5
16
16
19.5
19.5
19.5
19.5
19.5
19.5
19.5
MCS8 2Tx
CH38
HT40
MCS8 2Tx
CH64
16
CH54
16
CH62
19.5
CH102
18
CH134
19
CH151
19.5
CH159
19.5
19.5
BCM4324 module 2.4GHz power table
Typical power (limit is +1/-2dB) (unit:dBm)
CH1
HT20
1Mbps
ANT0
ANT1
ANT0
6Mbps
ANT1
MCS8 2Tx
CH2
CH3
CH4
CH5
15.5 15.5 15.5 15.5 15.5
18
17
17
18
17
17
18
17
17
18
17
17
18
17
17
18.5 19.5 19.5 19.5 19.5
CH6
CH7
CH8
CH9
CH10
15.5 15.5 15.5 15.5
CH11
15.5
15.5
18
17
17
18
17
17
18
17
17
19.5 19.5 19.5 19.5
19.5
17.5
18
17
17
18
17
17
18
17
17
32
COMPANY CONFIDENTIAL
Preliminary Datasheet
9. Package reliability test conditions
Sine Vibration
Shock Test
1.Frequency = 5 ~ 500 ~ 5 HZ
2.Acceleration = 2 Grms
3.Each of x, y, z axis/ 30 min
1.Sine wave ,230G , 3msec
2.Test +/- x, y, z axes
：
10. Environmental Requirements and Specifications
10.1 Temperature
9.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating in ambient temperature of
0 °C to +70°C.
10.1.2 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational performance be degraded when
restored to the operating temperature when exposed to storage temperature in the range of -10°C to +85°C.
10.2 PCB bending
The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly
customer.
10.3 Handling environment
ESD
There are semiconductors on the module, please handle the module under ESD protected and
well-controlled environment (<100V).
Terminals Handling Notice
The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.
Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and
real for packaging materials have no heat resistance, please bake the components moved into another
container such as heat resistance trays.
Others
1. Please make sure to avoid mechanical shock and vibration for this module.
2. Please do not drop the module.
3. Please do not clean the module.
10.4 Storage Condition
℃
1.
Moisture barrier bag must be stored under 40 , humidity under 90% RH, when the moisture
barrier bag is sealed by Foxconn.
2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.
3. If Moisture barrier bag is open, the component must be stored in an environment of <25 5
/10%RH
4. Please keep the module at 30 /70% RH.
℃
±℃
33
COMPANY CONFIDENTIAL
Preliminary Datasheet
10.5 Baking Condition
If below two conditions happens:
a) Humidity indicator cards read >30%
b) Temp < 30 , Humidity <70%RH, moisture barrier bag open over 96 hours
Products require baking before mounting
Baking condition: 90 , 12-22 hours
Baking times: Max. 2 times
℃
℃
10.6 Soldering and reflow condition
1) Heating method
Conventional Convection or IR/convection
2) Temperature measurement
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.
3) Solder paste composition
Sn/3.0Ag/0.5Cu
4) Allowable reflow soldering times: 2 times, based on the below reflow soldering profile
5) Temperature profile
Reflow soldering shall be done according to the below temperature profile.
6) Peak temp: 245 degree C
Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)
11 Package information
TBD
34
COMPANY CONFIDENTIAL
Federal Communication Commission Interference Statement
10 Package information
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may TBD
not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or colocation with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID: MCLT77H506”. The grantee's FCC ID can be used only when all FCC compliance requirements are
met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
39

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
XMP Toolkit                     : Adobe XMP Core 4.0-c316 44.253921, Sun Oct 01 2006 17:14:39
Create Date                     : 2013:08:02 18:54:56Z
Creator Tool                    : PScript5.dll Version 5.2
Modify Date                     : 2013:09:02 19:29:41+08:00
Metadata Date                   : 2013:09:02 19:29:41+08:00
Format                          : application/pdf
Creator                         : 829623
Title                           : Microsoft Word - Revision Note_TT77H506.00_BCM4324EPA_ rev0.7.doc
Producer                        : GPL Ghostscript 8.15
Document ID                     : uuid:f77d2875-6941-4ad8-a7fc-0f6e865ad421
Instance ID                     : uuid:f460ed8b-4346-408d-bf10-88a4a2cd1a7c
Has XFA                         : No
Page Count                      : 35
Author                          : 829623

EXIF Metadata provided by EXIF.tools