HUNAN FN LINK TECHNOLOGY F23BDSM23 WiFi+BT Module User Manual 15 F23BDSM23 W2 UserMan r3

FN-LINK TECHNOLOGY LIMITED WiFi+BT Module 15 F23BDSM23 W2 UserMan r3

15_F23BDSM23-W2 UserMan,r3

FN-LINK TECHNOLOGY LIMITED IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth v2.1+EDR/Bluetooth 3.0/4.0 Specification Project Name WIFI+BT Module Model NO. F23BDSM23-W2 Approved: William Tan Checked: Jim Hu Drafted: Neal Yu
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page2/13 CONTENTS 0 REVESION HISTORY.................................................................................................................... 3 0.1 MODEL NO DEFINITION ............................................................................................................ 3 1 INTRODUCTIONS ......................................................................................................................... 4 1.1 OVERVEIW............................................................................................................................. 4 1.2 PRODUCT FEATURES........................................................................................................... 4 2 GENERAL SPECIFICATION .......................................................................................................... 5 2.1 WIFI RF SPECIFICATION.......................................................................................................5 2.2 POWER CONSUMPTION....................................................................................................... 6 3 MECHANICAL SPECIFICATION.................................................................................................... 6 3.1 OUTLINE DRAWING .............................................................................................................. 6 3.2 PCB LAYOUT REFERENCE................................................................................................... 7 3.3 PIN DEFINITION ....................................................................................................................... 7 3.4 SMD .......................................................................................................................................... 9 4 ENVIRONMENTAL REQUIREMENTS ........................................................................................... 9 4.1 OPERATING TEMPRETURE.................................................................................................... 9 4.2 RECOMMENDED REFLOW PROFILE................................................................................... 10 4.3 NOTICE................................................................................................................................... 10 5 PACKING INFORMATION.............................................................................................................11
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page3/13 0. Revision History REV NO Date Modifications Draft Approved Rev0.1 2014-12-10 First Released Neal Yu Symen Song Rev0.2 2014-12-24 Update the Outline Drawing Neal Yu William Tan Rev0.3 2015-04-03 Modify the description of Pin24 Neal Yu William Tan 0.1. Model No Definition Example: F23BDSM23-W2 F 23B D S M 2 3-W 2 IC Part NO: RTL8723BS IC Version: VD Interface: S SDIO, U USB, E PCI-E Product Type: M Module, D Dongle Voltage: 3 3.3Vdc, 5 5Vdc Antenna: W External, B Print ANT Product NO: 1, 2, 3…. Control NO:0,1,2…Manufacturer: FN-LINK
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page4/13 1. Introduction 1.1 Over view F23BDSM23-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module thickness of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0. F23BDSM23-W2 uses Realtek RTL8723BS, a highly integrated WiFi/BT single chip based on advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. The general block diagram for the module is shown in Figure 1 Figure 1 1.2 Product Features  Operate at ISM frequency bands (2.4GHz) 　  SDIO for WiFi and UART for Bluetooth  IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i 　  Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation mode 　  Fully qualified for Bluetooth 3.0 　  Fully qualified for Bluetooth 4.0 Dual mode 　  Full–speed Bluetooth operation with Piconet and Scatternet support  Enterprise level security which can apply WPA/WPA2 certification for WiFi. 　  WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates Note: The EUT does not support the technology MIMO .
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page5/13 2. GENERAL SPECIFICATION 2.1 RF Specifications Main Chipset Realtek RTL8723BS-VD Operating Frequency 2.400～2.4835GHz Standards WiFi: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i BT: V2.1+EDR/BT v3.0/BT v4.0 Modulation WiFi: 802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps), 802.11 g/n: OFDM BT: 8DPSK, π/4 DQPSK, GFSK　 PHY Data rates WiFi: 802.11b: 11,5.5,2,1 Mbps 802.11g: 54,48,36,24,18,12,9,6 Mbps 802.11n: up to 150Mbps BT: 1 Mbps for Basic Rate 2,3 Mbps for Enhanced Data Rate 6,9,12,18,24,36,48,54 Mbps for High Speed Transmit Output Power WiFi: 802.11b@11Mbps <10dBm 802.11g@6Mbps <10dBm 802.11g@54Mbps <10dBm 802.11n@65Mbps <10dBm (MCS 0_HT20) <10dBm (MCS 7_HT20) <10dBm (MCS 0_HT40) <10dBm (MCS 7_HT40) BT: <5dBm EVM 802.11b /11Mbps : EVM≦-9dB 802.11g /54Mbps : EVM≦-25dB 802.11n /65Mbps : EVM≦-28dB 802.11b@8% PER 1Mbps -88dBm 2Mbps -87dBm 5.5Mbps -85dBm 11Mbps -82dBm 802.11g@10% PER 6Mbps -86dBm 9Mbps -85dBm 12Mbps -84dBm 18Mbps -82dBm 24Mbps -80dBm 36Mbps -77dBm 48Mbps -73dBm 54Mbps -71dBm Receiver Sensitivity (WiFi) 802.11n@10% PER MCS 0 -83dBm MCS 1 -82dBm MCS 2 -80dBm MCS 3 -78dBm MCS 4 -75dBm MCS 5 -71dBm MCS 6 -69dBm MCS 7 -67dBm Receiver Sensitivity (BT) -89dBm @ 1Mbps -86dBm @ 2Mbps -83dBm @ 3Mbps
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page6/13 Operating Channel WiFi 2.4GHz: 11: (Ch. 1-11) – United States 13: (Ch. 1-13) – Europe 14: (Ch. 1-14) – Japan BT 2.4GHz: Ch. 0 ~78 Media Access Control WiFi: CSMA/CA with ACK BT: AFH, Time Division Antenna External Antenna Antenna Gain 3.9dBi Max Network Architecture WiFi: Ad-hoc mode (Peer-to-Peer ) Infrastructure mode Software AP WiFi Direct BT: Pico Net, Scatter Net Security WiFi: WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE 802.11x, IEEE 802.11i BT: Simple Paring OS Supported Android /Linux/ Win CE /iOS /XP/WIN7 Host Interface WiFi: SDIO BT: UART Operating Voltage 3.3±10% Vdc I/O supply voltage Dimension Typical L12.0*W12.0*H1.6mm 2.2 Power Consumption Power Consumption (Typical by using SWR) WiFi only: TX Mode: (Throughput mode) 170mA (MCS7/BW40/13dBm) RX Mode: (Throughput mode) 130mA (MCS7/BW40/-60dBm) Associated Idle power saving with DTIM=3 2.1mA Unassociated Idle: 0.1mA RF disable Mode: 0.1mA BT: Inquiry & Page Scan: 0.9 mA ACL no traffic: 7.5mA SCO HV3: 15.0mA 3. Mechanical Specification 3.1 Outline Drawing (Unit: ±0.15mm)
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page7/13 3.2 PCB LAYOUT Reference 3.3 Pin Definition NC 35SDIO_DATA_CLK17GND 33SDIO_DATA_315PCM_SYNC 28SDIO_DATA_CMD16NC 32SDIO_DATA_214GND 31PCM_OUT 25TCXO_IN 30BT_HOST_WAKE7WL_VDD_TXCO 29WL_REG_ON12BT_WAKE6WL_XTAL_OUT11GND20SDIO_DATA_119WL_XTAL_IN10NC5GND3NC8WL_HOST_WAKE13SDIO_DATA_018PCM_IN 27PCM_CLK 26WL_BT_ANT2VIN_LDO_OUT21VIN_LDO 23GND 36NC 40NC 39BT_XTAL_OUT 38BT_XTAL_IN 37UART_TXD 42TP2(NC) 46UART_RXD 43UART_CTS_N 44TP1(NC) 45GND1VBAT9VDDIO22UART_RTS_N 41BT_RST_N 34LPO 24NC4TP3(NC) 47CON18723BS_TFBGA
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page8/13 PIN Assignment Pin # Name Description 1 GND Ground connection 2 WL_BT_ANT RF I/O port 3 GND Ground connection 4 NC Floating (NC) 5 NC Floating (NC) 6 BT_WAKE Wake-up BT 7 BT_HOST_WAKE BT wake-up BT 8 NC Floating (NC) 9 VBAT 3.3±10% V Main power voltage source input 10 WL_XTAL_IN Floating (NC) 11 WL_XTAL_OUT Floating (NC) 12 WL_REG_ON Internal regulators power enable/disable 13 WL_HOST_WAKE WLAN wake-up HOST 14 SDIO_DATA_2 SDIO data line 2 15 SDIO_DATA_3 SDIO data line 3 16 SDIO_DATA_CMD SDIO command line 17 SDIO_DATA_CLK SDIO clock line 18 SDIO_DATA_0 SDIO data line 0 19 SDIO_DATA_1 SDIO data line 1 20 GND Ground 21 VIN_LDO_OUT Floating(NC) 22 VDDIO I/O Voltage supply input 23 VIN_LDO Floating (NC) 24 LPO External Clock input(32.768kHz), need to be reserved25 PCM_OUT PCM Output 26 PCM_CLK PCM Clock 27 PCM_IN PCM Input 28 PCM_SYNC PCM Sync 29 WL_VDD_TXCO Floating (NC) 30 TCXO_IN Floating (NC) 31 GND Ground 32 NC Floating (NC) 33 GND Ground 34 BT_RST_N BT Reset IN 35 NC Floating (NC) 36 GND Ground 37 BT_XTAL_IN Floating (NC) 38 BT_XTAL_OUT Floating (NC) 39 NC Floating (NC) 40 NC Floating (NC) 41 UART_RTS_N UART RTS 42 UART_TXD UART Output
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page9/13 43 UART_RXD UART Input 44 UART_CTS_N UART CTS 45~47 TP1~TP3 Test point1~3 Floating (NC) Total 47PINS 12.0*12.0*1.8mm LGA Package 3.4 SMD 4. Environmental Requirements 4.1 Conditions Temperature:0°C to +70°C Operating Relative Humidity: 10-90% (non-condensing) Temperature: -40°C to +80°C (non-operating) Storage Relative Humidity: 5-90% (non-condensing) MTBF (Mean Time Between Failures) Over 150,000hours
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page10/13 4.2 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times 4.3 Patch WIFI modules installed before the notice: WIFI module installed note: 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows: 1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h. 2. The module vacuum packing once opened, time limit of the assembly: Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2.) factory environmental temperature humidity control: ≦ 30% ℃, ≦ 60% r.h.. 3). Once opened, the workshop the preservation of life for 168 hours. 3. Once opened, such as when not used up within 168 hours: 1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 ℃, 8 hours. 3.) After baking, put the right amount of desiccant to seal packages.
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page11/13 5. Package the take-up package Size of black tape:24mm*32.6m Color of plastic disc:blue A roll of 2000pcs
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page12/13 FCC Statement: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ---Reorient or relocate the receiving antenna. ---Increase the separation between the equipment and receiver. ---Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ---Consult the dealer or an experienced radio/TV technician for help. WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. LABEL OF THE END PRODUCT: The final end product must be labelled in a visible area with the following "Contains TX FCC ID: 2AATL-F23BDSM23". If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. RF Exposure This device has been evaluated and shown compliant with the FCC RF Exposure limits under fixed exposure conditions (antennas are greater than 20cm from a person's body) when installed in certain specific OEM configurations. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to missing shielding the module is strictly limited to integration by the Grantee himself or his dedicated OEM integrator under control of the Grantee. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
FN-LINK TECHNOLOGY LIMITED http://www.fn-link.com Page13/13 IMPORTANT NOTE: This device is intended only for OEM integrators under the following conditions: (1) According to FCC Part 15 Subpart C Section 15.212, the radio elements of the modular transmitter must have their own shielding. However, due to there is no shielding for this WIFI/BT module, this module is granted as a Limited Modular Approval. (2) This module has been designed to operate with External antenna（I-PEX connector） having a maximum gain of 3.9dBi. The module is only certified with the installed antenna. Any change of the antenna will void the certification. (3) Integration is typically strictly restricted to Grantee himself or dedicated OEM integrators under control of the Grantee. This module is intended for OEM integrator only and the OEM integrators and instructed to ensure that the end user has no manual instructions to remove or install the device. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. The module has no shielding and tested stand alone. This module is tested and approved as Limited modular approval with stand alone configuration, any OEM incorporated this radio module into any system are require additional testing and FCC Certification. EU Regulatory Conformance Hereby, we (FN-Link Technology Limited) declared that this device is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. NCC 警語 本模組設計之目的僅用於系統廠商組裝，不針對公眾出售。 本模組之外接發射天線(I-PEX 連接頭)最大增值增益值不可超過 3.9dBi, 任何對產品或天線的修改都會造成產品認證的影響。 系統廠家安裝本模組後，需重新對系統作附加測試或認證評估。 經型式認證合格之低功率射頻電機，非經許可，公司、商號或使用者均不得擅自變更頻率、加大功 率或變更原設計之特性及功能。 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並 改善至無干擾時方得繼續使用。前項合法通信，指依電信法規定作業之無線電通信。低功率射頻電 機須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。 本模組於取得認證後將依規定於模組本體標示審合格籤。 系統廠商應於平台上標示「本產品內含射頻模組： XXXyyyLPDzzzz-x (NCC ID) 」字樣。 The module Integrator will be responsible to satisfy SAR/RF exposure requirements, when the module integrated into any (portable, mobile, fixed) host device.

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